JP7186559B2 - Lighting assembly board, light source module and lighting device - Google Patents

Description

TECHNICAL FIELD The present invention relates to an illumination collective board, a light source module, and an illumination device having a printed circuit board used for illumination.

A printed circuit board for illumination on which light emitting elements and the like are mounted is formed by separating an assembly board for illumination on which a plurality of printed circuit boards are formed into individual printed circuit boards. For example, Japanese Patent Laid-Open No. 2002-100000 discloses a technique related to this type of aggregate substrate. The collective board of Patent Document 1 has a configuration in which a plurality of printed boards and a discarded board that is separated and discarded during the manufacturing process are connected.

JP-A-2018-81958

Japanese Patent Laid-Open No. 2004-100003 does not discuss the stress applied to the periphery of the divided portion when the waste substrate is separated from the collective substrate. Therefore, when the collective board of Patent Document 1 is used as a collective board for lighting on which light emitting elements are mounted, stress is generated in the light emitting elements arranged around the divided portion, and the possibility of adversely affecting the performance is denied. I had a problem that I couldn't. Such an adverse effect is not limited to when a waste board is separated from a collective board, but in a configuration in which a plurality of printed board groups are arranged in the board longitudinal direction, for example, two groups are formed on the collective board. There is a possibility that it will extend similarly at the time of splitting to separate.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a collective substrate for lighting, a light source module, and a lighting apparatus capable of reducing the stress applied to the light emitting elements during division at the dividing portion.

A collective substrate for illumination according to the present invention includes a light emitting element, a long first substrate on which the light emitting element is mounted, and an end portion of the first substrate in the longitudinal direction of the substrate. a second substrate to be separated; and a dividing portion positioned at the boundary between the first substrate and the second substrate and divided when the second substrate is separated, wherein the dividing portion includes the first substrate elongated holes extending in the lateral direction of the substrate are formed at positions aligned in the longitudinal direction of the substrate with respect to the light emitting element, and the first substrate and the second substrate are connected at the connecting portions on both sides of the elongated holes in the lateral direction of the substrate. A connector for supplying power to the light emitting element is mounted on the end of the first substrate in the substrate longitudinal direction. It is mounted at a position distant from the first light emitting element .

According to the present invention, the long hole extending in the lateral direction of the substrate is formed in the divided portion located at the boundary between the first substrate and the second substrate and divided when the second substrate is separated. . The elongated holes are arranged in the longitudinal direction of the substrate with respect to the light emitting element, and are close to the light emitting element. Since stress is less likely to be applied to the periphery of the elongated hole during division of the division portion, it is possible to reduce stress applied to the light emitting element during division of the division portion.

1 is a front view of an illumination collective substrate according to Embodiment 1 of the present invention; FIG. FIG. 2 is a front view of an individual base material cut out from the collective substrate for illumination according to Embodiment 1 of the present invention; FIG. 3 is a cross-sectional view taken along the line AA of FIG. 2; FIG. 3 is an enlarged view of a portion surrounded by a dotted line in FIG. 2; FIG. 3 is a front view showing a state in which the individual base material of FIG. 2 is cut at a dividing portion; FIG. 6 is an enlarged view of a portion surrounded by a dotted line in FIG. 5; FIG. 10 is a front view of a collective substrate for illumination according to Embodiment 2 of the present invention; FIG. 10 is a front view of an individual base material cut out from the collective substrate for illumination according to Embodiment 2 of the present invention; FIG. 9 is a cross-sectional view taken along the line BB of FIG. 8; FIG. 9 is a front view showing a state in which the individual base material of FIG. 8 is cut at the dividing portion; FIG. 10 is a perspective view of a lighting device according to Embodiment 3 of the present invention; FIG. 12 is an exploded perspective view of the lighting device of FIG. 11; FIG. 12 is an exploded perspective view of a light source unit of the lighting device of FIG. 11;

Illumination collective substrates according to embodiments of the present invention will be described below with reference to the drawings. The same reference numerals are given to the same or corresponding components in each figure. Here, the present invention is not limited by the embodiments described below. Also, in the following drawings, the size relationship of each component may differ from the actual size. Also, in the description of the embodiments, directions or positions such as up, down, left, and right may be indicated. These notations are for the convenience of explanation, and do not limit the arrangement, direction, and orientation of devices, instruments, parts, and the like.

Embodiment 1.
FIG. 1 is a front view of an illumination collective substrate according to Embodiment 1 of the present invention.
The collective substrate 1 for illumination has a configuration in which a plurality of long and narrow printed circuit boards 10 are formed. In this example, eight printed boards 10 (first boards) are formed, but the number of boards to be formed is not particularly limited. The collective board 1 for illumination is divided into individual printed boards 10 by cut lines 2 extending in the longitudinal direction of the board (horizontal direction in FIG. 1). On each printed board 10, one or more lines of light emitting elements 11 are arranged and mounted along the longitudinal direction of the board. This example shows a configuration in which the light emitting elements 11 are arranged in one row. Also, on each printed circuit board 10, lands (not shown) to which the light emitting elements 11 are soldered and wiring patterns 12 connected to the lands are formed. A connector 13 for supplying power to the light emitting element 11 is mounted on the printed circuit board 10 .

Moreover, the collective board for lighting 1 has a second board that is separated when the individual printed boards 10 that are the first boards are cut out from the collective board for lighting 1 . Here, the description will be made assuming that the second board is a discarded board that is discarded when individual printed boards 10 are cut out from the collective board 1 for illumination. The discarded substrates include the discarded substrate 20 extending from the right end to the left end in the longitudinal direction at both ends in the board short direction of the collective board 1 for illumination, and one end in the longitudinal direction of the plurality of printed boards 10 (in the example of FIG. 1, and a discarded substrate 21 provided at the left end). At the boundary between the waste board 21 and the plurality of printed circuit boards 10, a dividing portion 30 that is cut when the waste board 21 is separated is provided. Since the length of the printed circuit board 10 in the longitudinal direction is determined in terms of product design, the end of the printed circuit board 10 in the longitudinal direction serves as a boundary line with the discarded circuit board 21, and the dividing portion 30 is provided on the boundary line. be done. Details of the dividing unit 30 will be described later.

When individual printed circuit boards 10 are cut out from the collective circuit board 1 for illumination, first, they are cut along the cut lines 2 using a slicer. By this cutting, an individual base material 40 (see FIG. 3 described later) having a configuration in which one printed circuit board 10 and one discarded circuit board 21 are connected by a dividing portion 30 is formed. At the same time, the waste substrate 20 is separated. Next, the printed board 10 and the waste board 21 are separated by bending the individual base material 40 at the dividing portion 30 , and the waste board 21 is separated from the printed board 10 at the same time as the cutting of the printed board 10 is completed.

FIG. 2 is a front view of an individual base material cut out from the collective substrate for illumination according to Embodiment 1 of the present invention. FIG. 3 is a cross-sectional view taken along line AA of FIG. FIG. 4 is an enlarged view of the portion enclosed by the dotted line in FIG. FIG. 5 is a front view showing a state in which the individual base material of FIG. 2 is cut at the dividing portion. FIG. 6 is an enlarged view of a portion enclosed by a dotted line in FIG.

As described above, a plurality of light emitting elements 11 are arranged along the longitudinal direction of the board, and the positions of the light emitting elements 11 at both ends of the board in the longitudinal direction correspond to both sides 10a of the printed board 10 in the longitudinal direction (see FIG. 5). The position is such that an insulation distance can be secured from the Note that the "position where an insulation distance can be secured" specifically means a position about 6.0 mm from the edge 10a, a position about half the width of the substrate in the lateral direction from the edge 10a, or at the time of division. This corresponds to a position where the stress applied to the soldered portion of the light emitting element 11 does not exceed 100 μST. In this way, since the light emitting elements 11 are arranged up to the vicinity of the edge 10a, a structure capable of reducing the stress applied to the light emitting elements 11 when dividing at the dividing portion 30 is required.

As shown in FIG. 4, the divided portion 30 is formed with long holes 31 extending in the widthwise direction of the substrate of the individual base material 40, and connecting portions 32 formed on both sides of the lengthwise holes 31 in the widthwise direction of the substrate. , the printed circuit board 10 and the discarded circuit board 21 are connected. The long holes 31 are arranged in the individual base material 40 at positions aligned with the light emitting elements 11 in the longitudinal direction of the substrate. The connection part 32 is a portion between the long hole 31 and both edges of the individual base material 40 in the short direction of the board in the individual base material 40, and is a part that connects the waste board 21 and the printed board 10. be. A hole 33 is formed in each connecting portion 32 . In addition, cutouts 34 are formed at both edges of the divided portion 30 in the lateral direction of the substrate.

Dotted portions in FIG. 6 indicate areas where stress is likely to be applied when the dividing portion 30 is divided. As is clear from FIG. 6 , stress is likely to be applied around the connecting portion 32 , and stress is less likely to be applied around the long hole 31 . Since the long hole 31 is provided at a position aligned with the light emitting element 11 in the longitudinal direction of the substrate as described above, the distance L1 between the long hole 31 and the light emitting element 11 is is shorter than the distance L2 between . Furthermore, the elongated hole 31 is located at the position where the distance to the light emitting element 11 is the shortest among the divided portions 30 provided in the lateral direction of the substrate. By arranging the elongated hole 31 near the light emitting element 11 in which stress is not likely to be applied to the periphery in this way, the stress applied to the light emitting element 11 when the dividing portion 30 is divided can be reduced. Further, in Embodiment 1, the hole 33 is provided in the connecting portion 32, and the rigidity of the connecting portion 32 is weakened. It has become.

When designing the dividing portion 30, first, the position of the connecting portion 32 is determined in the boundary line between the printed board 10 and the waste board 21, and the long hole 31 is formed by determining the position of the connecting portion 32. It becomes a flow whose length is inevitably determined. The length of the long hole 31 is longer than at least the length of the light emitting element 11 in the lateral direction of the substrate. When determining the position of the connecting portion 32 on the boundary line between the printed board 10 and the waste board 21, a simulation or the like is performed by shifting the position of the connecting portion 32 on the boundary line. The position of the connecting portion 32 is determined as the position where the stress of 1 is less likely to apply to the light emitting element 11 .

As described above, the long holes 31 extending in the lateral direction of the board are formed in the divided portion 30 of the collective board for lighting according to the first embodiment. The elongated holes 31 are provided at positions aligned with the light emitting elements 11 in the longitudinal direction of the substrate. That is, the elongated hole 31 is positioned closest to the light emitting element 11 in the divided portion 30 . From a different point of view, the position of the connecting portion 32 to which stress is likely to be applied at the time of division becomes a position far from the light emitting element 11 . Therefore, it is possible to reduce the stress that is applied to the light emitting element 11 when the dividing portion 30 is divided. Moreover, the stress applied to the land connected to the light emitting element 11 and the wiring pattern 12 can be reduced.

Further, since the connecting portion 32 is provided with the hole 33, the stress applied to the light emitting element 11 can be further reduced.

It should be noted that the separation of the plurality of printed circuit boards 10 may be performed by a slicer as described above, or by forming perforations or V-cuts on the cut line 2 and bending at the perforations or V-cuts. You can also separate it. However, when perforations are formed, the same problem as in the present application is encountered, so it is necessary to design so that mounting parts such as the light emitting element 11 or the wiring pattern 12 do not come close to the connection between the perforations. .

Embodiment 2.
In the second embodiment, waste substrates are provided at both ends of the printed circuit board 10 in the longitudinal direction. In the following, the second embodiment will be described with a focus on the differences from the first embodiment.

FIG. 7 is a front view of an illumination collective substrate according to Embodiment 2 of the present invention. FIG. 8 is a front view of an individual base material cut out from the collective board for illumination according to Embodiment 2 of the present invention. 9 is a cross-sectional view taken along the line BB of FIG. 8. FIG. FIG. 10 is a front view showing a state in which the individual base material of FIG. 8 is cut at the dividing portion.

In the first embodiment, the discarded board 21 is provided at one end of the printed circuit board 10 in the board longitudinal direction. is provided. Each discarded substrate 21 has the same length in the substrate longitudinal direction. Further, a dividing portion 30 is also provided between the printed board 10 and a discarded board 21 provided at the other end in the longitudinal direction of the printed board 10 .

Illumination assembly board 1 is heated when electronic components such as printed circuit board 10 and light-emitting elements 11 are soldered by, for example, a reflow process or a flow process. It may warp and bend in a V shape. When the waste board 21 is provided only on one end side of the printed board 10 in the board longitudinal direction, the printed board 10 is bent with respect to the installation surface by being bent in a V shape at the dividing portion 30 . Even if the waste substrates 21 are provided on both sides of the printed circuit board 10 in the longitudinal direction as in the second embodiment, warping occurs at the dividing portions 30 itself. However, by making the lengths of the waste substrates 21 on both sides in the longitudinal direction substantially the same, the balance of warping when viewed as a whole of the collective substrate 1 for illumination is improved, and even if warping occurs after soldering, It is possible to suppress the inclination of the printed circuit board 10 with respect to the installation surface.

The connector 13 is formed on the printed circuit board 10 as described above, and the connector 13 is formed at the other end (the right end in FIG. 8) of the printed circuit board 10 in the board longitudinal direction. In the second embodiment, since the waste board 21 is also provided on the other end side of the printed board 10 in the board longitudinal direction, a configuration is required in which stress is not applied to the connector 13 at the time of division at the dividing portion 30 on the side closer to the connector 13 . be done. Therefore, the connector 13 is arranged at a position farther in the longitudinal direction of the substrate from the division portion 30 on the side closer to the connector 13 than the light emitting element 11 positioned first. With such an arrangement, it is possible to suppress the stress generated at the time of division from acting on the connector 13 .

The connector 13 is arranged closer to the side 10b (see FIG. 8) of the printed circuit board 10 in the short direction of the printed circuit board 10 than the light emitting element 11 is. If the connector 13 is sandwiched between the adjacent light emitting elements 11 , a wiring (not shown) connected to the connector 13 blocks the light from the light emitting element 11 . Moreover, there is a possibility that the wiring may be shadowed and reflected on the cover 230 (see FIG. 13 described later) of the lighting device to which the printed circuit board 10 is applied. On the other hand, by arranging the connector 13 closer to the edge 10b side of the printed board 10 in the short-side direction than the light emitting element 11, these inconveniences can be avoided.

As described above, according to the second embodiment, the same effects as those of the first embodiment can be obtained. It is possible to improve the balance of the warpage of the collective board for lighting 1 in .

In addition, since the connector 13 is arranged at a position farther from the split portion 30 in the longitudinal direction than the light emitting element 11, the stress generated when the split portion 30 is split is applied to the connector 13. 11 can be suppressed.

Further, the connector 13 is arranged closer to the edge side 10b side of the printed circuit board 10 in the board short direction than the light emitting element 11 is. Therefore, the wiring (not shown) connected to the connector 13 blocks the light from the light emitting element 11, and the wiring is shadowed by the cover 230 (see FIG. 11 described later) of the lighting device to which the printed circuit board 10 is applied. You can avoid the inconvenience of being caught in the photo.

In Embodiments 1 and 2 above, it has been described that the "second substrate" that is cut off when individual printed circuit boards 10 are cut out from collective substrate 1 for lighting is a discarded substrate. ” is not limited to discarded substrates. For example, when a plurality of printed circuit board groups are arranged side by side in the longitudinal direction of the board 1 in the collective board 1 for illumination, for example, two groups are formed. The printed circuit board group becomes the "second board".

Embodiment 3.
Embodiment 3 relates to an illumination device mounted with a printed circuit board 10 cut out from the lighting assembly board 1 of Embodiment 1 or Embodiment 2. FIG.

FIG. 11 is a perspective view of a lighting device according to Embodiment 3 of the present invention. 12 is an exploded perspective view of the lighting device of FIG. 11. FIG. FIG. 13 is an exploded perspective view of a light source unit of the illumination device of FIG. 11;
A lighting device 300 according to Embodiment 3 has a lighting fixture 100 attached to a mounting portion such as a ceiling or a wall, and a light source unit 200 attached to the lighting fixture 100 . 11 to 13, the illumination device 300 is shown in an upside-down orientation, which is different from the orientation in which it is attached to the ceiling, for example.

The light source unit 200 is partially housed in the fixture body 110 of the lighting fixture 100 and is detachably attached to the fixture body 110 . The light source unit 200 has a light source module 210, a frame 220, a cover 230, an end cap 240, and the like.

The light source module 210 has a printed circuit board 10 cut out from the lighting assembly board 1 of the first or second embodiment, and the light emitting element 11 is mounted on the printed circuit board 10 .

The light source unit 200 has a structure in which a light source module 210 is attached to a frame 220 and housed in a cover 230 , and both longitudinal ends of the cover 230 are closed with end caps 240 .

According to the third embodiment, the printed circuit board 10 cut out from the lighting assembly board 1 of the first or second embodiment is used as the printed circuit board 10 of the light source module 210 . Therefore, it is possible to obtain the illumination device 300 in which the stress applied to the components mounted on the printed circuit board 10 is reduced.

In Embodiments 1 and 2, a plurality of light emitting elements 11 are provided in one row, but even one light emitting element is applicable. Moreover, although the number of columns of the light emitting elements 11 is one in the first and second embodiments, the present invention can be applied to a plurality of columns. In the case of multiple rows, a long hole may be formed for each row, or a long hole may be formed so as to straddle each row.

Reference Signs List 1 collective board for illumination 2 cut line 10 printed circuit board 10a edge 10b edge 11 light emitting element 12 wiring pattern 13 connector 20 discarded substrate 21 discarded substrate 30 dividing portion 31 long hole 32 Connection Part 33 Hole 34 Notch 40 Individual Base Material 100 Lighting Fixture 110 Fixture Main Body 200 Light Source Unit 210 Light Source Module 220 Frame 230 Cover 240 End Cap 300 Lighting Device L1 Distance L2 Distance .

Claims (7)

a light emitting element;
an elongated first substrate on which the light emitting element is mounted;
a second substrate coupled to the end of the first substrate in the substrate longitudinal direction and separated from the first substrate;
a dividing portion positioned at the boundary between the first substrate and the second substrate and divided when the second substrate is separated;
Long holes extending in the substrate width direction of the first substrate are formed in the dividing portion at positions aligned in the substrate length direction with respect to the light emitting elements, and both sides of the substrate width direction of the long holes are formed. The first substrate and the second substrate are connected at a connecting portion of
A connector for supplying power to the light-emitting element is mounted on the end portion of the first substrate in the substrate longitudinal direction, and the connector extends from the split portion closer to the connector in the substrate longitudinal direction. A collective board for illumination mounted at a position further away than the first light emitting element . 2. The collective substrate for illumination according to claim 1, wherein a hole is formed in said connecting portion. The second substrate is provided at each of both ends of the first substrate in the longitudinal direction, and the dividing portion is provided at the boundary between each of the second substrates and the first substrate. 3. The collective substrate for illumination according to claim 1, wherein 4. The collective board for lighting according to claim 1, wherein the connector is arranged closer to the end side of the first board in the short direction of the board than the light emitting element. . 5. The collective substrate for illumination according to claim 1, wherein a wiring pattern connected to said light emitting elements is mounted on said first substrate. A light source module comprising the first substrate cut out from the illumination collective substrate according to any one of claims 1 to 5 . An illumination device comprising the light source module according to claim 6 and a frame to which the light source module is attached.

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