JP7183940B2 - Cable connection structure with mold - Google Patents

Description

The present invention relates to a connection structure for a cable with a mold, and more particularly to a connection structure for molding a highly heat-resistant cable and an electronic component.

2. Description of the Related Art Cables are connected to electronic components such as sensors, semiconductor integrated circuits (hereinafter referred to as ICs) or substrates, and the electronic components and cables are molded in order to ensure airtightness. In this case, for example, nylon is used as the material of the mold, and as the cable, a cable of urethane having good adhesion to the mold material is used. This allows a nylon mold to be formed over the electronic components and cables.

When not only airtightness but also high heat resistance are required, a cable with a fluorine-based outer sheath is used. Fluorine-based cables do not adhere well to molding materials such as nylon, so even if electronic components and fluorine-based cables are molded with nylon, airtightness is impaired. Therefore, a fluorine-based cable is attached to a molded electronic component using a waterproof connector. For example, a connector housing is formed of PPS (Poly Phenylene Sulfide Resin), and electronic components are attached to the connector housing so as to connect the electronic components to terminals in the connector housing and molded with epoxy to airtight the electronic components. On the other hand, a waterproof connector is attached to the fluorine-based cable, and the waterproof connector is inserted into a molded connector housing to connect the fluorine-based cable and the electronic component.

A waterproof connector to which a cable is attached is described, for example, in US Pat.

JP 2015-207373 A

In order to maintain airtightness while using a highly heat-resistant cable, as described above, a connector housing, a waterproof connector, and the like are required, which raises the problem of an increase in price and an increase in size. .

SUMMARY OF THE INVENTION It is an object of the present invention to provide a connection structure for a cable with a mold capable of suppressing an increase in price and/or miniaturizing the cable.

A brief outline of typical inventions disclosed in the present application is as follows.

That is, a cable connection structure with a mold according to one embodiment is a cable connection structure with a mold in which an electronic component and a cable connected to the electronic component are molded, and the cable includes a conductor and a conductor covering the conductor. A fluorine-based cable having a fluororesin layer made of a fluororesin, which is made of a material having good adhesion to a mold, and is provided on the fluorine-based cable so as to cover the fluorine-based cable; A heat-shrinkable tube is provided so as to cover a part of the cable, and heat-shrinks the extra-insertion member so that the fluorine-based cable is brought into close contact with the fluorine-based cable. ing.

Among the inventions disclosed in the present application, the effects obtained by representative ones are briefly described below.

That is, it is possible to provide a cable connection structure with a mold capable of ensuring airtightness even when using a highly heat-resistant cable while suppressing an increase in price.

4A and 4B are side views showing the structure of the cable with mold according to the first embodiment; FIG. 1 is a cross-sectional view showing an example of a fluorine-based cable; FIG. 1 is a cross-sectional view showing an example of a cable including a multicore stranded wire; FIG. FIG. 3 is a plan view showing the structure of a cable with a mold when using a multi-core stranded wire; (A) and (B) are side views showing the structure of a cable with a mold according to Embodiment 2. FIG. (A) and (B) are side views showing the structure of a cable with a mold according to Embodiment 3. FIG. (A) and (B) are side views showing the structure of a cable with a mold according to Embodiment 4. FIG.

Hereinafter, each embodiment of the present invention will be described with reference to the drawings. It should be noted that the disclosure is merely an example, and those skilled in the art can easily conceive appropriate modifications while keeping the gist of the invention are naturally included in the scope of the present invention. In addition, in order to make the description clearer, the drawings may schematically show the width, thickness, shape, etc. of each part compared to the actual embodiment, but this is only an example, and the interpretation of the present invention is not intended. It is not limited.

In addition, in this specification and each figure, the same reference numerals may be given to the same elements as those described above with respect to the existing figures, and detailed description thereof may be omitted as appropriate.

(Embodiment 1)
1(A) and 1(B) are side views showing the structure of a cable with a mold according to Embodiment 1. FIG. Here, FIG. 1(A) shows a side view before molding, and FIG. 1(B) shows a side view after molding. FIG. 2 is a cross-sectional view showing an example of a fluorine-based cable.

In FIG. 1, 11 indicates a fluorine-based cable. This fluorocarbon cable, as shown in FIG. 2, has a fluororesin layer 17 made of a fluororesin. Here, as the fluorocarbon cable 11, a cable in which the fluororesin layer 17 is made of polytetrafluoroethylene (hereinafter also referred to as PTFE) called Teflon (registered trademark) will be described as an example. In the PTFE cable, the fluororesin layer 17 surrounds the conductor 15 so as to cover the conductor 15, and the fluororesin layer 17 serves as the sheath of the cable. Another insulator layer may be provided between the conductor 15 and the fluororesin layer 17. In this case, the fluororesin layer 17 and the other insulator layer are collectively referred to as the outer skin.

2 is a tubular external insertion member, which is made of urethane in the first embodiment. The fluorine-based cable 11 is fitted in the hollow portion of the urethane fitting member 2 . 3 is a cylindrical heat-shrinkable tube. As shown in FIG. 1, a portion of the external insertion member 2 and a portion of the fluorine-based cable 11 protruding from the external insertion member 2 are arranged in the hollow portion of the heat-shrinkable tube 3 . Furthermore, in Embodiment 1, the adhesive layer 4 is interposed between the hollow portion of the heat-shrinkable tube 3 and the external insertion member 2 and the fluorine-based cable 11 arranged in the hollow portion.

By applying heat to the heat-shrinkable tube 3, the heat-shrinkable tube 3 is shrunk such that its hollow portion is shrunk. The external insertion member 2 is formed with a thickness such that the hollow portion of the urethane external insertion member 2 is pressed against the fluororesin layer 17 of the fluorine-based cable 11 by this contraction, as shown in FIG. 1(A). It is As a result, the airtightness between the urethane external insertion member 2 and the fluorine-based cable 11 is ensured. Since the adhesive layer 4 is interposed between the external insertion member 2 and the hollow portion of the heat-shrinkable tube 3 and between the fluororesin layer 17 of the fluorine-based cable 11 and the hollow portion of the heat-shrinkable tube 3, heat When the shrinkable tube 3 shrinks, the adhesive layer 4 is pushed into the gap between the heat shrinkable tube 3 and the extraneous member 2 and between the heat shrinkable tube 3 and the fluorine-based cable 11 to further improve the airtightness. It is possible to As a method for providing the adhesive layer 4 in the hollow portion of the heat-shrinkable tube 3, there are a method of applying an adhesive to the inner surface of the hollow portion of the heat-shrinkable tube 3 in advance, a method of injecting the adhesive, and the like. It is not limited. FIG. 1A shows the state after the heat-shrinkable tube 3 has been shrunk. The adhesive layer 4 may be omitted if the heat-shrinkable tube 3 ensures sufficient airtightness.

In the fluorocarbon cable 11 , the outer covering including the fluororesin layer 17 is removed from the portion to be connected to the substrate 6 , exposing the conductor 15 . The exposed conductors 15 are electrically connected to electrodes (not shown) on the substrate 6 . Although a plurality of ICs and the like are mounted on the substrate 6 in order to achieve predetermined functions, they are omitted in FIG.

In FIG. 1B, 7 indicates a mold. As the material of the mold 7, a material having good adhesion (fusion bonding) to urethane, which is the material of the external insertion member 2, is used. In Embodiment 1, the material of the mold 7 is nylon. During molding, nylon is formed so as to cover the substrate 6, the heat-shrinkable tube 3, and the portion of the fluorine-based cable 11 protruding from the heat-shrinkable tube 3, as shown in FIG. 1(B). At this time, the molding is performed so that the portion of the external insertion member 2 that is not covered with the heat-shrinkable tube 3 is also covered with nylon. As a result, in the region 7-2 indicated by hatching in FIG. 1(B), the urethane forming the external insertion member 2 and the nylon forming the mold 7 are fused and adhered to each other. In other words, urethane and nylon, which have good adhesion, come into planar contact with each other to ensure airtightness.

In the connection structure according to Embodiment 1, airtightness of the entire mold is ensured in two stages. That is, in the first stage, the airtightness between the external insertion member 2 and the fluorine-based cable 11 is ensured by the physical force generated by the contraction of the heat-shrinkable tube 3 . In the second step, the external inserting member 2 and the mold 7, which are in close contact with each other, are brought into close contact with each other in the region 7-2, thereby ensuring airtightness between the mold and the external inserting member 2. FIG. By ensuring the airtightness at the first stage, it is possible to prevent, for example, moisture from entering between the fluorine-based cable 11 and the extraneous member 2 . On the other hand, it is possible to prevent moisture from entering between the external insertion member 2 and the mold 7 by ensuring the airtightness at the second stage. Moisture can be prevented from entering the mold 7 by ensuring airtightness in these two stages.

The heat-shrinkable tube 3 is made of polyolefin, although not particularly limited. Further, although urethane has been described as an example of the material forming the external insertion member 2, the material is not limited to this. That is, the extrapolation member 2 may be made of a material having good adhesion to the material of the mold 7 . For example, if nylon is used as the material of the mold 7 in the same manner as in the first embodiment, PBT (Polybutylene Terephthalate) is applied, for example, by coating or the like on the surface of the extrapolation member 2 that contacts the nylon. Just do it. Alternatively, an extrapolation member 2 made of PBT can also be used.

In FIG. 1, as shown in FIG. 1A, an example is shown in which the heat-shrinkable tube 3 is shrunk before molding to ensure airtightness between the external insertion member 2 and the fluorine-based cable 11. , but not limited to. That is, in a state in which the fluorine-based cable 11 and the extraneous member 2 are inserted into the heat-shrinkable tube 3, the substrate 6 may also be molded. In this case, the heat generated during molding causes the heat-shrinkable tube 3 to shrink, ensuring the airtightness between the external insertion member 2 and the fluorine-based cable 11, thereby reducing the number of processes. It is possible.

According to Embodiment 1, since it is not necessary to use a connector housing and a waterproof connector, it is possible to suppress an increase in price, and it is possible to reduce the size of the cable with the mold.

<When a multi-core stranded wire is used>
Next, the case of using a cable including a multifilamentary twisted wire in which a plurality of fluorine-based cables 11 are twisted together will be described. FIG. 3 is a cross-sectional view showing an example of a cable including a multicore stranded wire. The cable 21 includes a multicore stranded wire 25 obtained by twisting two fluorine-based cables 11 together, and a sheath 27 covering the multicore stranded wire 25 . Note that the multi-core twisted wire 25 may be configured by twisting three or more fluorine-based cables 11 together. As a material for the sheath 27, for example, thermoplastic polyurethane, polyolefin material, or the like is used. The material of the sheath 27 may be crosslinked to improve heat resistance.

FIG. 4 is a plan view showing the structure of a cable with a mold when using a multicore stranded wire. FIG. 4 shows the configuration when viewed from the main surface 6a side of the substrate 6. As shown in FIG. As shown in FIG. 4, each fluorine-based cable 11 included in the multifilamentary stranded wire 25 is connected to the corresponding electrode 6b of the substrate 6, respectively.

Further, each fluorine-based cable 11 of the multicore stranded wire 25 is provided with an external insertion member 2, a heat-shrinkable tube 3, and an adhesive layer 4, as in FIG. 1(B). During molding, the heat-shrinkable tube 3 and the portion of the fluorine-based cable 11 protruding from the heat-shrinkable tube 3 are covered with the mold 7 in each fluorine-based cable 11, as shown in FIG. As a result, the airtightness between the external insertion member 2 and the fluorine-based cable 11 is ensured even in the multifilamentary stranded wire 21 .

When the surface of the sheath 27 is made of fluororesin, the sheath 27 may also have a sealing structure similar to that of the fluorocarbon cable 11 . This makes it possible to further improve the airtightness between the external insertion member 2 and the fluorine-based cable 11 .

Note that the cable 21 including a multi-core twisted wire may also be used in each embodiment described later.

(Embodiment 2)
5A and 5B are side views showing the structure of a cable with a mold according to Embodiment 2. FIG. FIG. 5A shows a side view before molding, and FIG. 5B shows a side view after molding.

5A and 5B are similar to FIGS. 1A and 1B, so differences will be mainly described. Embodiment 1 shows the case of molding a substrate, but Embodiment 2 shows the case of molding an IC.

The IC includes a package portion 8 formed by molding a semiconductor chip, and lead portions 9 connected to the semiconductor chip and protruding from the package portion 8 . Also in the second embodiment, by heating the heat-shrinkable tube 3 and shrinking the heat-shrinkable tube 3, airtightness between the urethane that is the external insertion member 2 and the fluorine-based cable 11 is ensured. In the fluorine cable 11 to which the heat shrinkable tube 3 and the extraneous member 2 are attached in this manner, IC leads are attached to the end of the fluorine cable 11 on the side where the extraneous member 2 does not protrude from the heat shrinkable tube 3 . Part 9 is connected. That is, the fluororesin layer 17 is removed from the end of the fluorocarbon cable 11 on the side where the external insertion member 2 is not exposed, and the exposed conductor 15 is electrically connected to the lead portion 9 of the IC.

After connecting the lead portion 9 of the IC to the end portion of the fluorine-based cable 11, as shown in FIG. The tube 3 is molded with nylon. Also in this case, in the same manner as in the first embodiment, the region 7-2 protruding from the heat-shrinkable tube 3 in the extraneous member 2 made of urethane is also molded with nylon.

Thus, as in the first embodiment, it is possible to ensure the airtightness between the external insertion member 2 and the fluorine-based cable 11 and the airtightness between the external insertion member 2 and the mold 7 .

FIG. 5 shows an example in which, as shown in FIG. 5A, the heat-shrinkable tube 3 is shrunk before molding to ensure airtightness between the external insertion member 2 and the fluorine-based cable 11. , but not limited to. That is, as in the first embodiment, the heat-shrinkable tube 3 may be molded with the fluorine-based cable 11 and the extraneous member 2 inserted therein, including the IC. In this case, the heat generated during molding causes the heat-shrinkable tube 3 to shrink, ensuring the airtightness between the external insertion member 2 and the fluorine-based cable 11, thereby reducing the number of processes. It is possible.

Embodiment 1 described the case where the mold connected to the fluorine-based cable 11 included the substrate, and Embodiment 2 described the case where the mold connected to the fluorine-based cable 11 included the IC. Even when the module connected to the fluorine-based cable 11 includes a sensor, it can be implemented in the same manner as in the first or second embodiment. For example, when the sensor is mounted on the substrate, the same as in the first embodiment may be performed, and when not mounted on the substrate, the same as in the second embodiment may be performed.

(Embodiment 3)
FIG. 6 is a side view showing the structure of a cable with a mold according to Embodiment 3. FIG. Here, FIG. 6A shows a side view before molding, and FIG. 6B shows a side view after molding. FIG. 6 is similar to FIG. 1, so differences will be mainly described. In Embodiment 1, as described with reference to FIG. On the other hand, in the connection structure according to the third embodiment, the material of the external insertion member is changed to melt with the mold.

In FIG. 6, 10 indicates an extrapolation member modified in the third embodiment. Fluorine-based cable 11, heat-shrinkable tube 3, conductor 15, substrate 6, and mold 7 shown in FIG. 6 are the same as in FIG. Also in Embodiment 3, as in Embodiment 1, the adhesive layer 4 is provided between the heat-shrinkable tube 3 and the externally inserted member 10 and between the heat-shrinkable tube 3 and the fluorine-based cable 11. intervening. As the heat-shrinkable tube 3 is shrunk by heating, the adhesive layer 4 fills the gap between the heat-shrinkable tube 3 and the externally inserted member 10 and the gap between the heat-shrinkable tube 3 and the fluorine-based cable 11 . acts on

As the material of the externally inserting member 10, a resin or hot-melt that melts with the material of the mold 7 by heating during molding is used. For example, the external insertion member 10 and the mold 7 can be made of the same material (nylon, etc.). In addition, a material having a lower melting point than the material of the mold 7 and containing the material of the mold 7 (if the material of the mold 7 is nylon, the material has a lower melting point than nylon and contains nylon, and if it is PBT, it contains PBT) Hytrel (registered trademark), etc.).

In Embodiment 3, a fluorine-based cable 11 is fitted around a tubular fitting member 10 made of resin or hot melt. Further, a portion of the externally inserting member 10 and the fluorine-based cable 11 are inserted into the hollow portion of the cylindrical heat-shrinkable tube 3, as shown in FIG. At this time, also in Embodiment 3, the outer insertion member 10 and the heat shrink tube 3 are aligned so that the outer insertion member 10 protrudes from one side (the right side of the paper surface) of the heat shrink tube 3 .

After that, by heating the heat-shrinkable tube 3, as in the first embodiment, the extra-insertion member 10 and the fluorine-based cable 11 are brought into close contact with each other by the physical force due to the shrinkage of the heat-shrinkable tube 3, and the extra-insertion member Airtightness between 10 and fluorine-based cable 11 is ensured. The state at this time is shown in FIG.

Molding is then done with nylon. That is, the substrate 6, the heat-shrinkable tube 3, the external insertion member 10 exposed on one side of the heat-shrinkable tube 3, the fluorine-based cable 11 and the conductor 15 exposed on the other side (left side of the paper) of the heat-shrinkable tube 3 is covered with nylon. During molding, the sealing material nylon is heated. The heated nylon and the extraneous member 10 made of nylon are brought into contact with each other at the shaded area 7-10 in FIG. Here, nylon was used as the external insertion member 10 . Thereby, airtightness between the mold 7 and the externally inserting member 10 is ensured. Of course, the external insertion member 10 may also be heated during molding. Thus, also in the third embodiment, as in the first embodiment, airtightness is ensured in two steps.

Also in Embodiment 3, as in Embodiment 1, molding may be performed in a state in which the external insertion member 10 and the fluorine-based cable 11 are arranged in the hollow portion of the heat-shrinkable tube 3 . As a result, airtightness between the external insertion member 10 and the fluorine-based cable 11 is ensured by the heat during molding, and the external insertion member 10 and the mold 7 are melted to each other. Airtightness between the As a result, airtightness between the fluorine-based cable 11 and the mold 7 can be ensured with a small number of steps.

(Embodiment 4)
FIG. 7 is a side view showing the structure of a cable with a mold according to Embodiment 4. FIG. Here, FIG. 7A shows a side view before molding, and FIG. 7B shows a side view after molding. FIG. 7 is similar to FIG. 5, so differences will be mainly described. In the fourth embodiment, the external inserting member is changed to be the external inserting member 10 as in the third embodiment. In FIG. 7, the IC package portion 8, the lead portion 9, the adhesive layer 4, the conductor 15, the fluorine-based cable 11, the heat-shrinkable tube 3 and the mold 7 are the same as in FIG.

In the fourth embodiment, as in the third embodiment, the extraneous member 10 is made of a material that melts with the mold, such as resin or hot melt. For example, the external insertion member 10 and the mold 7 can be made of the same material. In addition, a material having a lower melting point than the material of the mold 7 and containing the material of the mold 7 (if the material of the mold 7 is nylon, the material has a lower melting point than nylon and contains nylon, and if it is PBT, it contains PBT) Hytrel (registered trademark), etc.).

By heating the heat-shrinkable tube 3, airtightness is ensured between the external insertion member 10 formed of resin or hot melt and the fluorine-based cable 11. As shown in FIG. At this time, also in Embodiment 4, the outer insertion member 10 and the heat shrink tube 3 are aligned so that the outer insertion member 10 is exposed on one side (the right side of the paper surface) of the heat shrink tube 3 . As a result, the state of the connection structure portion before molding becomes the state shown in FIG. 7(A).

After that, molding is performed so as to cover the package portion 8, the lead portion 9, the conductor 15, the fluorine-based cable 11, and the heat-shrinkable tube 3 with nylon. Due to the heat generated at this time, the resin or hot-melt forming the external insertion member 10 exposed on one side of the heat-shrinkable tube 3 and the nylon forming the mold 7 melt together. As a result, the external insertion member 10 and the mold 7 are brought into close contact with each other in the region 7-10 indicated by hatching in FIG. 7(B). As a result, airtightness is ensured in two stages also in the fourth embodiment.

Also in the fourth embodiment, as in the second embodiment, molding may be performed in a state in which the external insertion member 10 and the fluorine-based cable 11 are arranged in the hollow portion of the heat-shrinkable tube 3 . This makes it possible to ensure airtightness between the fluorine-based cable 11 and the mold 7 with a small number of steps.

In Embodiments 1 to 4, the exposed region of the heat-shrinkable tube 3 on one side of the externally fitting member 2 or 10 is brought into close contact with or melted with the mold, thereby forming a gap between the mold and the externally fitting member 2 or 10. I was trying to maintain confidentiality. However, it is not limited to this. For example, on both sides (one side and the other side) of the heat-shrinkable tube 3, the regions of the extraneous member 2 or 10 may be exposed. This makes it possible to increase the area that is in close contact or melts with the mold.

The invention made by the present inventor has been specifically described above based on the embodiment, but the present invention is not limited to the above embodiment, and can be variously modified without departing from the scope of the invention. Needless to say.

2, 10 Externally inserted member 3 Heat-shrinkable tube 4 Adhesive layer 6 Substrate 7 Mold 8 Package section 9 Lead section 11 Fluorine-based cable 15 Conductor

Claims (5)

A molded cable connection structure in which an electronic component and a cable connected to the electronic component are molded,
The cable comprises a fluorine - based cable having a conductor and a fluororesin layer made of a fluororesin covering the conductor, and a sheath covering the fluorine-based cable,
an external insertion member made of a material having good adhesion to the mold and provided on the outer periphery of the fluorine-based cable at a position spaced apart from the sheath so as to cover the fluorine-based cable;
a heat-shrinkable tube provided at a position spaced apart from the sheath so as to cover a portion of the extrapolation member, and heat-shrinking to bring the extrapolation member into close contact with the fluorine-based cable;
with
A connection structure for a cable with a mold, wherein a portion of the external insertion member not covered by the heat-shrinkable tube is in close contact with the mold at a position spaced apart from the sheath. In the cable connection structure with the mold according to claim 1,
A connection structure for a cable with a mold, wherein an adhesive layer is interposed between the external insertion member and the heat-shrinkable tube. In the cable connection structure with the mold according to claim 2,
A connection structure for a cable with a mold, wherein the external insertion member is in close contact with the mold so as to fuse with the mold. In the cable connection structure with the mold according to claim 2 or 3,
A cable connection structure with a mold, wherein the electronic component includes a substrate or a semiconductor integrated circuit connected to the conductor of the fluorine-based cable. In the cable connection structure with the mold according to claim 4,
The fluorine-based cable is a polytetrafluoroethylene cable in which the conductor is covered with polytetrafluoroethylene,
The external insertion member is urethane covering the polytetrafluoroethylene cable,
A cable connection structure with a mold, wherein the material of the mold is nylon or polybutylene terephthalate.

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