JP7180345B2 - Plating barrel, plating equipment and method for manufacturing electronic components - Google Patents

Description

The present invention relates to a plating barrel, a plating apparatus, and a method for manufacturing electronic parts.

Patent Literature 1 listed below discloses a plating apparatus that includes a barrel that accommodates a work such as an electronic component and that is rotatably supported. In such a plating apparatus, the rotation of the barrel agitates the workpiece and the plating solution in the barrel, thereby suppressing variations in plating between workpieces.

JP 2009-127120 A

The inventors have found that if the workpieces and the plating solution are not sufficiently agitated in the barrel, the workpieces may adhere to each other, resulting in plating variations among the workpieces. Therefore, after intensive research, the inventors have newly discovered a technique capable of sufficiently agitating the inside of the barrel and thereby suppressing variations in plating between works.

SUMMARY OF THE INVENTION An object of the present invention is to provide a plating barrel, a plating apparatus, and a method of manufacturing an electronic component in which variations in plating are suppressed.

A plating barrel according to one aspect of the present invention is a plating barrel that has an internal space that accommodates a plurality of electronic components to be plated and that is rotatable around a predetermined axis. and a cylindrical side plate extending from one side of the bottom plate and defining an internal space with the bottom plate, the first side plate being provided on one side of the bottom plate and extending in a direction not intersecting the axis when viewed from the axial direction. and a second baffle plate provided on the inner surface of the side plate and extending in the direction intersecting the axis when viewed from the direction orthogonal to the axial direction.

In the plating barrel, by providing at least one of the first baffle plate and the second baffle plate, the agitation property in the barrel is improved, and the electronic components accommodated in the barrel are mutually connected. It is possible to effectively suppress the sticking situation. Therefore, according to the above-described plating barrel, it is possible to suppress variations in plating between electronic components.

In a plating barrel according to another embodiment, a first baffle plate is provided on one side of a bottom plate, and the bottom plate has a shape rotationally symmetrical with respect to the axis when viewed from the axial direction. The center position of the first baffle plate is located on the outer edge side of the bottom plate.

In the plating barrel according to another embodiment, the ratio of the distance from the shaft to the center position of the first baffle plate with respect to the distance from the shaft to the outer edge of the bottom plate when viewed in the axial direction is in the range of 60% to 90%. is.

A plating barrel according to another embodiment is provided with a pair of first baffle plates on one side of a bottom plate across an axis, and the pair of first baffle plates are parallel when viewed from the axial direction.

In the plating barrel according to another embodiment, the central positions of the pair of first baffle plates are point symmetrical with respect to the axis when viewed from the axial direction.

In the plating barrel according to another embodiment, the second baffle plate is provided on the inner surface of the side plate, and the second baffle plate is located on the far side from the bottom plate and has a lower height with respect to the inner surface. Has details.

A plating barrel according to another embodiment is provided with a plurality of second baffle plates on the inner surface of the side plate, and each of the plurality of second baffle plates has a tapered portion at the end near the bottom plate. On the other hand, it is biased toward the barrel rotation direction.

In a plating barrel according to another embodiment, a pair of first baffle plates are provided on one side of the bottom plate with the shaft interposed therebetween, and a pair of second baffle plates are provided on the inner surface of the side plate with the shaft interposed therebetween. is provided, and when viewed from the axial direction, the facing direction of the pair of first baffle plates and the facing direction of the pair of second baffle plates intersect.

A method for manufacturing an electronic component according to one aspect of the present invention uses a plating barrel that has an internal space for housing a plurality of electronic components to be plated and is rotatable around a predetermined axis. In the method, a plating barrel is provided on one side of the bottom plate, comprising a bottom plate orthogonal to the axis and a cylindrical side plate extending from one side of the bottom plate and defining an inner space with the bottom plate. A first baffle plate extending in a direction not intersecting the axis when viewed from the axial direction, and a second baffle plate provided on the inner surface of the side plate and extending in a direction intersecting the axis when viewed from a direction orthogonal to the axial direction A step of housing the electronic component in the internal space of the plating barrel, and a step of rotating the plating barrel with the axis tilted with respect to the vertical direction to plate the electronic component. including.

In the method for manufacturing an electronic component described above, the plating barrel is provided with at least one of the first baffle plate and the second baffle plate, so that the agitation in the barrel is improved, and the It is possible to effectively suppress the situation where the electronic components attached to each other adhere to each other. Therefore, according to the method for manufacturing an electronic component, variations in plating between electronic components can be suppressed.

A plating apparatus according to one aspect of the present invention is a plating apparatus that has an internal space for accommodating a plurality of electronic components to be plated and includes a plating barrel that is rotatable around a predetermined axis. A barrel includes a bottom plate orthogonal to the axis and a cylindrical side plate extending from one side of the bottom plate to define an inner space with the bottom plate, and a plating barrel is provided on one side of the bottom plate and on the axis. At least a first baffle plate extending in a direction not intersecting the axis when viewed from the direction, and a second baffle plate provided on the inner surface of the side plate and extending in a direction intersecting the axis when viewed from a direction orthogonal to the axial direction Have one or the other.

In the above plating apparatus, the plating barrel is provided with at least one of the first baffle plate and the second baffle plate, so that the agitation in the barrel is improved, and the electronic component accommodated in the barrel It is possible to effectively suppress the situation in which they adhere to each other. Therefore, according to the above-described plating apparatus, it is possible to suppress variations in plating between electronic components.

ADVANTAGE OF THE INVENTION According to this invention, the barrel for plating, the plating apparatus, and the manufacturing method of an electronic component which are intended to suppress plating variation are provided.

1 is a schematic perspective view showing a plating apparatus according to one embodiment; FIG. FIG. 2 is a cross-sectional view of the barrel shown in FIG. 1 taken along line II-II; 2 is an axial view of the bottom plate of the barrel shown in FIG. 1; FIG. 2 is a view of the barrel shown in FIG. 1 as seen from the opening; FIG. It is the figure which showed the 2nd baffle plate seen from the opening. It is a flow chart which showed the manufacturing method of the electronic component concerning one embodiment.

Various embodiments and examples are described below with reference to the drawings. In each drawing, the same or corresponding parts are denoted by the same reference numerals, and overlapping descriptions are omitted.

As shown in FIG. 1, a plating apparatus 1 according to one embodiment includes a plating solution bath 5, a barrel 10 (plating barrel) disposed in the plating solution bath 5, and electrode terminals 7 inserted into the barrel 10. and

A plating solution is injected into the plating solution tank 5 . Various plating solutions can be used as the plating solution, for example, Sn plating solution and Ni plating solution can be used. The amount of the plating solution should be at least enough to immerse all of the plurality of electronic components housed in the barrel 10 .

A barrel 10 is rotatable about a rotation axis Z by a shaft 12 driven by a motor M to rotate. The barrel 10 is a so-called tilted barrel, in which the axis of rotation Z is tilted both vertically and horizontally. Barrel 10 can be made of, for example, a resin material.
As shown in FIG. 2, the barrel 10 includes a bottom plate 14 located below and a cylindrical side plate 16 extending upward from the bottom plate 14 . The cylindrical side plate 16 has a lower end closed by the bottom plate 14 and an upper end open to form an opening 10a. The barrel 10 has an internal space C defined by a bottom plate 14 and side plates 16 .

As shown in FIG. 3, the bottom plate 14 has an octagonal plate shape and is arranged so as to be perpendicular to the rotation axis Z and have its center positioned on the rotation axis Z. As shown in FIG. Therefore, the bottom plate 14 has a shape that is rotationally symmetrical with respect to the rotation axis Z when viewed from the rotation axis Z direction. An upper surface 14a (one surface) of the bottom plate 14 is provided with a pair of bottom surface fins 22 (first baffle plate), which will be described later. A shaft 12 having the same axis as the rotation axis Z and extending parallel to the rotation axis Z is provided on the lower surface 14b of the bottom plate 14 . Shaft 12 may be integral with barrel 10 or may be separate. When the shaft 12 is driven to rotate by the motor M, as shown in FIG. 1, the shaft 12 and the barrel 10 are rotated around the rotation axis Z in the direction of rotation (barrel rotation direction) R (counterclockwise in this embodiment). direction).

The side plate 16 has a substantially octagonal tubular shape and includes a lower plate portion 17 and an upper plate portion 18 . In this embodiment, the bottom plate 14 and the lower plate portion 17 and the upper plate portion 18 of the side plate 16 are integrally molded.

The lower plate portion 17 is an octagonal cylindrical portion that extends from the octagonal outer edge of the bottom plate 14 along the rotation axis Z in a direction away from the bottom plate 14 , and the dimension (the dimension of the octagonal annular cross section) increases as the distance from the bottom plate 14 increases. ) is expanding.

The upper plate portion 18 is an octagonal cylindrical portion that continuously extends from the lower plate portion 17 along the rotation axis Z in a direction away from the bottom plate 14, and the dimensions (the dimensions of the octagonal annular cross section) increase as the distance from the bottom plate 14 increases. ) is shrinking. An inner side surface 16a of the upper plate portion 18 is provided with a pair of side fins 24 (second baffle plates), which will be described later.

The side plate 16 is provided with a plurality of through holes (not shown). The plating solution in the plating solution bath 5 can flow into the internal space C of the barrel 10 through the through-holes provided in the side plate 16, and can also flow out of the internal space C of the barrel 10 through the through-holes. can flow out. The through-hole can be designed to have dimensions such that electronic components and other members (dummy balls, etc.) housed in the internal space C do not protrude outside the barrel 10 .

The electrode terminal 7 is a rod-shaped member made of a conductive material, and is inserted into the internal space C from the upper side of the barrel 10 through the opening 10a. The tip portion 7a of the electrode terminal 7 positioned within the internal space C of the barrel 10 is a current-carrying portion and can be arranged in the vicinity of the bottom plate 14 . In this embodiment, the electrode terminal 7 is a cathode terminal, and when a voltage is applied between the electrode terminal 7 and the anode terminal 9 arranged outside the barrel 10 in the plating solution bath 5 , the voltage inside the barrel 10 via the electrode terminal 7 is applied. are energized and their surfaces are plated.

Next, the pair of bottom fins 22 provided on the bottom plate 14 and the pair of side fins 24 provided on the side plate 16 will be described with reference to FIGS.

The pair of bottom fins 22 have substantially the same shape, for example, a rectangular plate shape. The bottom fins 22 stand vertically on the top surface 14 a of the bottom plate 14 . Bottom fins 22 can be made of, for example, a resin material. The pair of bottom fins 22 face each other with the rotation axis Z interposed therebetween when viewed from the direction of the rotation axis Z, as shown in FIG. Also, the pair of bottom fins 22 are oriented in the same direction when viewed from the direction of the rotation axis Z, and have a parallel positional relationship. Further, the center G (the center of gravity or the geometric center) of the pair of bottom fins 22 has a point-symmetrical (two-fold symmetrical in this embodiment) relationship when viewed from the direction of the rotation axis Z. As shown in FIG.

The center G (center of gravity or geometric center) of each pair of bottom fins 22 is positioned not on the rotation axis Z side but on the outer edge side of the bottom plate 14 when viewed from the rotation axis Z direction. More specifically, the position of the center G is such that the ratio (L2/L1) of the distance L2 from the rotation axis Z to the center G of each bottom fin 22 to the distance L1 from the rotation axis Z to the outer edge of the bottom plate 14 is 60. It is designed to be in the range of % to 90%.

The pair of side fins 24 have substantially the same shape, for example, a triangular plate shape. The side fins 24 stand vertically on the inner surface 16 a of the upper plate portion 18 of the side plate 16 . The side fins 24 can be made of, for example, a resin material. The pair of side fins 24 face each other with the rotation axis Z interposed therebetween when viewed from the direction of the rotation axis Z, as shown in FIG. The facing direction X of the pair of side fins 24 is a direction intersecting with the facing direction Y of the pair of bottom fins 22 (in this embodiment, the direction perpendicular to the facing direction).

As shown in FIG. 5, the side fins 24 have a tapered portion 24a at the end remote from the bottom plate 14 . The tapered portion 24a is a portion in which the height h based on the inner surface 16a of the side plate 16 is lower than that of the end portion 24b closer to the bottom plate 14 . In this embodiment, the height h of the side fins 24 relative to the inner surface 16a of the side plate 16 gradually decreases from the end 24b closer to the bottom plate 14 toward the end farther from the bottom plate 14. . Both the pair of side fins 24 extend obliquely with respect to the direction of the rotation axis Z, as shown in FIG. In this embodiment, each of the pair of side fins 24 is inclined such that the tapered portion 24a on the far side from the bottom plate 14 is biased toward the winding direction R side with respect to the end portion 24b on the side close to the bottom plate 14 .

Next, a manufacturing method for manufacturing an electronic component using the plating apparatus 1 described above will be described with reference to the flow chart of FIG.

When manufacturing electronic components, a plurality of electronic components to be plated are accommodated in the internal space C through the opening 10a of the barrel 10 (step S1). At this time, dummy balls are also accommodated in the internal space C of the barrel 10 as required. Then, with the rotation axis Z of the barrel 10 tilted with respect to the vertical direction, the lower part or the whole of the barrel 10 is immersed in the plating solution bath 5 containing the plating solution. Also, the electrode terminal 7 is inserted into the internal space C from the upper side of the barrel 10 through the opening 10a.

Next, while applying a predetermined voltage between the electrode terminal 7 and the anode terminal 9, the barrel 10 is rotated to plate the electronic component (step S2). As a result, plating is formed on predetermined portions of the electronic component, and the electronic component is completed.

In the plating process using the plating apparatus 1, the plurality of electronic components and the plating solution in the internal space C are sufficiently stirred by the bottom fins 22 and the side fins 24 when the barrel 10 rotates. In other words, the bottom fins 22 and the side fins 24 enhance the agitation of the barrel 10 . Further, due to the high stirability of the barrel 10, the electronic components are less likely to adhere to each other, and clumps of electronic components adhering to each other are easily separated into individual electronic components. Therefore, the individual electronic components can be uniformly plated, and variations in plating among a plurality of electronic components can be suppressed.

The bottom fins 22 promote the movement of the electronic components and the plating solution stagnating near the bottom plate 14 of the barrel 10 to improve agitation. In particular, since the bottom fins 22 have the above-described shape and positional relationship, it is possible to further improve the stirring performance. The side fins 24 promote the movement of the electronic components floating in the plating solution within the internal space C of the barrel 10, thereby enhancing agitation. In particular, since the side fins 24 have the shape and positional relationship described above, it is possible to further improve agitation, thereby promoting the prevention of electronic components from adhering to each other and the separation of the electronic components.

It should be noted that the present invention is not limited to the above embodiments, and various modifications can be made.

For example, the barrel may not have both bottom fins and side fins, but may have only bottom fins or only side fins. Also, the number of bottom fins and the number of side fins can be increased or decreased as appropriate. The shape of the bottom fins is not limited to a rectangular plate shape, and may be conical or the like. The shape of the side fins is not limited to a triangular plate shape, and may be a cylindrical shape or the like.

Further, the shape of the barrel, the bottom plate, the side plates and the shape of the opening may be polygonal (for example, hexagonal, decagonal, etc.) other than octagonal, or may be circular.

DESCRIPTION OF SYMBOLS 1... Plating apparatus, 10... Barrel, 10a... Opening, 14... Bottom plate, 14a... Upper surface, 16... Side plate, 16a... Inner surface, 22... Bottom fin, 24... Side fin, 24a... Taper, C... Internal space , G... center, R... rotation direction, Z... rotation axis.

Claims (9)

A plating barrel having an internal space for housing a plurality of electronic components to be plated and rotatable around a predetermined axis,
a bottom plate orthogonal to the axis;
a cylindrical side plate extending from one side of the bottom plate and defining the bottom plate and the internal space;
A first baffle plate provided on one surface of the bottom plate and extending in a direction not intersecting the axis when viewed from the axial direction, and a first baffle plate provided on the inner surface of the side plate and viewed from a direction orthogonal to the axial direction A second baffle plate extending in a direction intersecting the axis is provided, a pair of the first baffle plates are provided on one surface of the bottom plate with the axis interposed therebetween, and inner surfaces of the side plates are provided with the A pair of the second baffle plates are provided on both sides of an axis, and when viewed from the axial direction, a direction in which the pair of first baffle plates oppose and a direction in which the pair of second baffle plates oppose each other. crossed and
A barrel for plating, wherein the bottom plate, the side plates, the first baffle plate, and the second baffle plate are made of a resin material . the bottom plate has a shape that is rotationally symmetrical with respect to the axis when viewed from the axial direction;
2. The plating barrel according to claim 1, wherein the center position of said first baffle plate is located on the outer edge side of said bottom plate when viewed from said axial direction. The ratio of the distance from the axis to the center position of the first baffle plate to the distance from the axis to the outer edge of the bottom plate when viewed from the axial direction is in the range of 60% to 90%. 2. The plating barrel according to 2. The plating barrel according to any one of claims 1 to 3, wherein the pair of first baffle plates are parallel when viewed from the axial direction. 5. The plating barrel according to claim 4, wherein center positions of said pair of first baffle plates are point symmetrical with respect to said axis when viewed from said axial direction. The plating barrel according to any one of claims 1 to 5, wherein the second baffle plate has a tapered portion having a low height with respect to the inner surface on the side remote from the bottom plate. 7. The plating barrel according to claim 6, wherein the tapered portion of each of the pair of second baffle plates is biased in the direction of rotation of the barrel with respect to the end closer to the bottom plate. A method for manufacturing an electronic component using a plating barrel that has an internal space for housing a plurality of electronic components to be plated and is rotatable around a predetermined axis,
The plating barrel includes a bottom plate orthogonal to the axis, and a cylindrical side plate extending from one side of the bottom plate and defining the inner space with the bottom plate, and provided on one side of the bottom plate. a first baffle plate provided on the inner surface of the side plate and extending in a direction not intersecting the axis when viewed from the axial direction; a pair of first baffle plates are provided on one surface of the bottom plate with the shaft interposed therebetween; the second baffle plate is provided, and when viewed from the axial direction, the facing direction of the pair of first baffle plates and the facing direction of the pair of second baffle plates intersect;
The bottom plate, the side plates, the first baffle plate and the second baffle plate are made of a resin material,
housing the electronic component in the internal space of the plating barrel;
and a step of plating the electronic component by rotating the plating barrel with the axis tilted with respect to a vertical direction. A plating apparatus having an internal space for housing a plurality of electronic components to be plated and comprising a plating barrel rotatable around a predetermined axis,
The plating barrel comprises a bottom plate orthogonal to the axis, and a cylindrical side plate extending from one side of the bottom plate and defining the bottom plate and the inner space,
The plating barrel includes a first baffle plate provided on one side of the bottom plate and extending in a direction not intersecting the axis when viewed from the axial direction, and a first baffle plate provided on the inner surface of the side plate and extending in the axial direction. A second baffle plate extending in a direction intersecting with the axis when viewed from an orthogonal direction is provided, a pair of the first baffle plates are provided on one side of the bottom plate with the axis interposed therebetween, and the side plate A pair of the second baffle plates are provided on the inner side surface of the two with the shaft interposed therebetween. crosses the opposing direction of the baffle plate,
A plating apparatus, wherein the bottom plate, the side plates, the first baffle plate, and the second baffle plate are made of a resin material .

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