[go: up one dir, main page]

JP7156677B2 - Laminated plate material structure manufacturing method - Google Patents

Laminated plate material structure manufacturing method Download PDF

Info

Publication number
JP7156677B2
JP7156677B2 JP2018177107A JP2018177107A JP7156677B2 JP 7156677 B2 JP7156677 B2 JP 7156677B2 JP 2018177107 A JP2018177107 A JP 2018177107A JP 2018177107 A JP2018177107 A JP 2018177107A JP 7156677 B2 JP7156677 B2 JP 7156677B2
Authority
JP
Japan
Prior art keywords
plate
plate material
dowel
small hole
laminated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018177107A
Other languages
Japanese (ja)
Other versions
JP2020044570A (en
Inventor
英治 望月
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Misuzu Industries Corp
Original Assignee
Misuzu Industries Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Misuzu Industries Corp filed Critical Misuzu Industries Corp
Priority to JP2018177107A priority Critical patent/JP7156677B2/en
Publication of JP2020044570A publication Critical patent/JP2020044570A/en
Application granted granted Critical
Publication of JP7156677B2 publication Critical patent/JP7156677B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Punching Or Piercing (AREA)
  • Iron Core Of Rotating Electric Machines (AREA)
  • Manufacture Of Motors, Generators (AREA)

Description

本発明は、積層板材構造体の製造方法に関する。
The present invention relates to a method for manufacturing a laminated plate material structure.

従来から、電動機や発電機などの回転電機に用いられるロータコアやステータコアは複数枚の電磁鋼板等の金属板を積層して一体化することにより得られる。このような金属板の複数枚を積層して一体化するのには、一般的には、積層方向で隣接する金属板同士をカシメにより結合する。例えば、まず、金属板の一方の面側が凸部、他方の面側が凹部となるカシメ部を形成する。次に、金属板のカシメ部の凸部側の面と、積層方向で隣接する金属板のカシメ部の凹部側の面とを対面させ、その凸部を凹部に嵌め込みつつ積層する。 2. Description of the Related Art Conventionally, rotor cores and stator cores used in rotary electric machines such as electric motors and generators are obtained by laminating and integrating a plurality of metal plates such as electromagnetic steel plates. In order to stack and integrate a plurality of such metal plates, generally, metal plates adjacent in the stacking direction are joined by caulking. For example, first, a crimped portion is formed in which one surface side of the metal plate is a convex portion and the other surface side is a concave portion. Next, the surface of the crimped portion of the metal plate on the convex side and the surface of the crimped portion of the adjacent metal plate on the concave side in the stacking direction face each other, and the metal plates are laminated while fitting the convex portion into the concave portion.

特許文献1には、電動モータのロータ(回転子)に使用される積層鉄心とその製造方法が開示されている。特許文献1に開示された積層鉄心(積層板材構造体)1000を図13(2)に示し、積層鉄心1000を構成する金属板(板材)としての鉄心片1010を図13(1)に示す。
鉄心片1010は、所定平面視位置においてその裏面からパンチの押し上げにより、裏面1010aに凹部1010cが形成され、同時に表面1010bに凸部(突出部)1010dが形成される。
積層鉄心1000は、2枚の鉄心片1010を積層し、下側の鉄心片1010の表面に形成された凸部1010dを上側の鉄心片1010の裏面に形成された凹部1010cに嵌め込み、両鉄心片1010、1010を固定する。この様に次々と鉄心片1010が積層され、各々の凸部1010dが凹部1010cに嵌め込まれることにより、積層接心1000が形成される。なお、最上層の鉄心片1010には、開口1010eが形成されており、その下層の鉄心片1010の凸部1010dが開口1010eに嵌入されている。
Patent Literature 1 discloses a laminated core used for a rotor of an electric motor and a manufacturing method thereof. FIG. 13B shows a laminated core (laminated plate material structure) 1000 disclosed in Patent Document 1, and FIG.
The iron core piece 1010 is punched up from its back surface at a predetermined planar view position to form a concave portion 1010c on a back surface 1010a and simultaneously form a convex portion (protrusion) 1010d on a front surface 1010b.
Laminated core 1000 is obtained by laminating two core pieces 1010, and fitting convex portion 1010d formed on the surface of lower core piece 1010 into concave portion 1010c formed on the back surface of upper core piece 1010 to 1010, 1010 are fixed. In this manner, the core pieces 1010 are stacked one after another, and the respective protrusions 1010d are fitted into the recesses 1010c, thereby forming the laminated engagment 1000. As shown in FIG. An opening 1010e is formed in the core piece 1010 of the uppermost layer, and the protrusion 1010d of the core piece 1010 of the lower layer is fitted into the opening 1010e.

特開2006-345657号公報JP 2006-345657 A

しかしながら、特許文献1では、鉄心片1010毎に凹部1010cと凸部1010dを形成するため、各々の凹部1010cと凸部1010dの形成位置、大きさ及び形状にはバラツキが生じる。それは、凹部と凸部の製造誤差、温湿度等の環境誤差及び金属片の材料特性誤差などによるものと考えられる。
このため、鉄心片1010を積層して、鉄心片1010の凸部1010dを積層方向に隣接する鉄心片1010の凹部1010cに嵌め込もうとする際に、凸部を凹部にスムースに嵌め込めないケースがあり得る。また、凸部と凹部を無理やりに嵌め込むと、両者の嵌め込みによる固定力が低下し、固定力にバラツキが生じる。さらに、無理やり凸部を凹部に嵌め込むと、鉄心片が変形し、内部応力を高めてしまい、長期信頼性を損ねてしまう。こうして、積層鉄心1000の初期及び長期信頼性を低下させてしまう。
さらに、各金属片の凹部と凸部の形成工程と、当該金属片の凸部を隣接する金属片の凹部に嵌め込む嵌め込み工程と、を別々に行うため、製造コストが高くなる。
However, in Patent Document 1, since the concave portion 1010c and the convex portion 1010d are formed for each core piece 1010, the forming positions, sizes and shapes of the concave portions 1010c and the convex portions 1010d vary. It is believed that this is due to manufacturing errors in the recesses and protrusions, environmental errors such as temperature and humidity, and material property errors of the metal pieces.
Therefore, when the core pieces 1010 are stacked and the protrusion 1010d of the core piece 1010 is to be fitted into the recess 1010c of the core piece 1010 adjacent in the stacking direction, the protrusion cannot be smoothly fitted into the recess. can be. In addition, if the protrusion and the recess are forcibly fitted, the fixing force due to the fitting of the two is reduced, resulting in variations in the fixing force. Furthermore, if the projection is forcibly fitted into the recess, the core piece will be deformed, increasing the internal stress and impairing long-term reliability. Thus, the initial and long-term reliability of the laminated core 1000 is degraded.
Furthermore, since the step of forming the concave portion and the convex portion of each metal piece and the step of fitting the convex portion of the metal piece into the concave portion of the adjacent metal piece are performed separately, the manufacturing cost increases.

本発明は、上記課題を解消するものであり、積層された板材同士を無理なく強固に固定可能とし、その製造を容易可能とする積層板材構造体の製造方法を提供することを目的とする。
SUMMARY OF THE INVENTION It is an object of the present invention to solve the above-described problems, and to provide a method for manufacturing a laminated plate material structure that enables the laminated plate members to be firmly fixed to each other without difficulty, and that facilitates the production thereof.

(1)本発明の積層板材構造体の製造方法は、第1板材に第2板材が積層し互いに結合している積層板材構造体の製造方法であって、前記第1板材の所定箇所に小孔を穿孔する小孔穿孔工程と、前記第1板材に前記第2板材を積層する第2板材積層工程と、前記第1板材における前記小孔の平面視位置に対応する前記第2板材の表面位置で、半抜き用パンチを前記第2板材の表面内に圧入して前記第2板材に半抜きダボを形成する半抜きダボ形成工程と、をこの順で行い、前記半抜きダボ形成工程では、前記半抜きダボの先端を前記第2板材の裏面から突出させ、この突出した部分である突出部を前記第1板材の前記小孔の内部に圧入することにより前記第1板材と前記第2板材を結合することを特徴とする。 (1) A method for manufacturing a laminated plate structure according to the present invention is a method for manufacturing a laminated plate structure in which a second plate is laminated on a first plate and bonded to each other, and a small plate is attached to a predetermined portion of the first plate. A small hole punching step of punching a hole, a second plate stacking step of stacking the second plate on the first plate, and a surface of the second plate corresponding to a planar view position of the small hole in the first plate a half-blanking dowel forming step of press-fitting a half-blanking punch into the surface of the second plate member to form a half-blanking dowel in the second plate member at a position; , the tip of the half-punched dowel is protruded from the back surface of the second plate member, and the protruding portion, which is the protruding portion, is press-fitted into the small hole of the first plate member, thereby It is characterized by joining plate materials.

本発明によれば、第1板材の所定箇所に小孔を穿孔する小孔穿孔工程及び第1板材に第2板材を積層する第2板材積層工程の後に、半抜きダボ形成工程を行う。この半抜きダボ形成工程では、前記第1板材における前記小孔の平面視位置に対応する前記第2板材の表面位置において半抜き用パンチを前記第2板材の表面内に圧入することにより前記第2板材に半抜きダボを形成する。半抜きダボはその先端が前記第2板材の裏面から突出しており、この突出した部分である突出部を前記第1板材の前記小孔の内部に圧入することにより前記第1板材と前記第2板材を互いに結合させる。このため、第1板材の小孔に半抜きダボの突出部を確実に圧入することができる。したがって、積層された板材同士の固定力を安定化することが可能となる。
第13図(従来例)の場合では、各鉄心片1010の凹部1010cと凸部1010dの形成位置、大きさ及び形状にバラツキが生じ、凸部と凹部を無理やり嵌め込むと、鉄心片が変形し、内部応力を高めてしまい、初期及び長期信頼性を損ねてしまう。これに対し、本発明によれば、第1板材の小孔の平面視位置と半抜き用パンチの平面視位置とが多少ずれたとしても、半抜き用パンチは圧入力により第2板材の裏面から突出する突出部を小孔の内部に確実に圧入させることができる。このため、積層された板材同士の固定力を安定化することができる。しかも、両板材が歪み、変形することがなく、したがって、内部応力の蓄積もないため、初期及び長期信頼性の確保を可能とする。
According to the present invention, the half-blanked dowel forming step is performed after the small hole punching step of punching a small hole at a predetermined location in the first plate material and the second plate stacking step of stacking the second plate material on the first plate material. In this half-blanking dowel forming step, a half-blanking punch is press-fitted into the surface of the second plate member at a surface position of the second plate member corresponding to the position of the small hole in the first plate member in a plan view, thereby forming the second plate member. 2 Form a half punched dowel on the board. The tip of the half-blanked dowel protrudes from the back surface of the second plate member. Join the boards together. Therefore, the projecting portion of the half-blanked dowel can be reliably press-fitted into the small hole of the first plate member. Therefore, it is possible to stabilize the fixing force between the stacked plate materials.
In the case of FIG. 13 (conventional example), the formation position, size and shape of the concave portion 1010c and the convex portion 1010d of each core piece 1010 are varied, and if the convex portion and the concave portion are forcibly fitted, the core piece is deformed. , the internal stress is increased and the initial and long-term reliability is impaired. In contrast, according to the present invention, even if the position of the small hole in the first plate material and the position of the half-blanking punch in plan view deviate slightly, the half-blanking punch presses the back surface of the second plate material by pressing force. It is possible to reliably press-fit the protruding part protruding from the hole into the small hole. Therefore, the fixing force between the stacked plate materials can be stabilized. Moreover, both plate materials are not distorted or deformed, and therefore internal stress is not accumulated, so that initial and long-term reliability can be ensured.

加えて、従来例では、各板材に凹部と凸部を形成する凹凸部形成工程と、他方の板材を積層して一方の板材の凹部に他方の板材の凸部を嵌合する嵌合工程との2工程を行う。これに対して、本発明では、半抜きダボ形成工程の中に、第2板材の裏面から半抜きダボを突出させる工程と、第1板材及び第2板材を固定する工程とを含ませている。このため、製造工程を短縮化し、製造コストを低下することが可能となる。 In addition, in the conventional example, a concave-convex portion forming step of forming concave portions and convex portions on each plate member, and a fitting step of stacking the other plate member and fitting the convex portion of the other plate member into the concave portion of the other plate member. 2 steps are performed. In contrast, in the present invention, the half-blanked dowel forming step includes the step of projecting the half-blanked dowel from the back surface of the second plate member and the step of fixing the first plate member and the second plate member. . Therefore, it is possible to shorten the manufacturing process and reduce the manufacturing cost.

なお、本発明の第2板材は、第1板材を用いて構成してもよく、第1板材とは別部材を用いて構成してもよい。前者の場合、第2板材は、第1板材の小孔の穿孔箇所を含む所定領域のうち小孔の穿孔箇所を含まない先端領域を用いて構成される。この第1板材の先端領域は、板厚方向に180°折り曲げられて、第1板材の所定領域の表面に積層される。この第1板材の所定領域の表面に積層される先端領域が第2板材となる。
また、半抜きダボとは、半抜き用パンチを第2板材の表面からその板厚の途中まで圧入することにより第2板材の裏面から突出する突出部を含むダボを指す。当該半抜きダボは、第2板材の板厚内では第2板材に保持されている。
The second plate of the present invention may be configured using the first plate, or may be configured using a member separate from the first plate. In the former case, the second plate member is configured using a tip region that does not include the perforated portion of the small hole in the predetermined region that includes the perforated portion of the small hole of the first plate member. The tip region of the first plate member is bent 180° in the plate thickness direction and laminated on the surface of the predetermined region of the first plate member. The tip region laminated on the surface of the predetermined region of the first plate becomes the second plate.
Further, the half-blanking dowel refers to a dowel that includes a projecting portion that protrudes from the back surface of the second plate member by press-fitting a half-blanking punch from the front surface of the second plate member to the middle of the plate thickness. The half-punched dowel is held by the second plate within the thickness of the second plate.

(2)本発明の積層板材構造体の製造方法は、(1)に記載された積層板材構造体の製造方法であって、前記小孔穿孔工程では、前記小孔の穿孔は小孔用パンチとダイスを用いて行い、当該小孔用パンチの先端の平面視径は、前記第1板材の板厚より小さいことが好ましい。 (2) A method for manufacturing a laminated plate material structure of the present invention is the method for manufacturing a laminated plate material structure described in (1), wherein in the small hole punching step, the small hole is punched using a small hole punch. and a die, and the diameter of the tip of the small hole punch in plan view is preferably smaller than the thickness of the first plate.

本発明によれば、小孔穿孔工程において、小孔用パンチの先端の平面視径は、第1板材の板厚より小さいので、小孔用パンチにより穿孔される小孔の内壁には、滑らかで硬質の剪断面が長く形成され、粗く脆い破断面が短く形成される。しかも、上記剪断面は、小孔の表面側(小孔用パンチの挿入側)の内壁に形成される。
このため、半抜きダボ形成工程において、半抜き用パンチを第2板材の表面の内部に圧入する際に、小孔周辺の第1板材はダイの機能を効果的に発揮することができる。すなわち、小孔の内壁における表面側部分は滑らかで硬質の剪断面が長く形成されているため、半抜き用パンチの上記圧入の時に半抜きダボの突出部が小孔周辺の第1板材を強圧しても当該第1板材が潰れることがなく、半抜きダボの突出部を小孔の内部にスムースに導入することが可能となる。
According to the present invention, in the small hole punching step, the diameter of the tip of the small hole punch in plan view is smaller than the thickness of the first plate material, so that the inner wall of the small hole punched by the small hole punch is smooth. A long hard sheared surface is formed, and a short rough and brittle fractured surface is formed. Moreover, the sheared surface is formed on the inner wall of the small hole on the surface side (the side on which the small hole punch is inserted).
Therefore, in the half-blanking dowel forming step, when the half-blanking punch is pressed into the surface of the second plate, the first plate around the small hole can effectively function as a die. That is, since the surface side portion of the inner wall of the small hole is smooth and has a long hard sheared surface, the protruding portion of the half-blanking dowel strongly presses the first plate material around the small hole when the half-blanking punch is press-fitted. However, the first plate is not crushed, and the projecting portion of the half-punched dowel can be smoothly introduced into the small hole.

(3)本発明の積層板材構造体の製造方法は、(1)または(2)に記載された積層板材構造体の製造方法であって、前記半抜きダボ形成工程では、前記半抜きダボの前記突出部が前記第1板材の前記小孔の内部に圧入する圧入深さは、前記小孔の内壁長の0.2~0.8の範囲であることが好ましい。 (3) A method for manufacturing a laminated plate structure according to the present invention is the method for manufacturing a laminated plate structure according to (1) or (2), wherein in the half-blanked dowel forming step, the half-blanked dowel is formed. It is preferable that the press-fitting depth of the protrusion into the small hole of the first plate is in the range of 0.2 to 0.8 of the inner wall length of the small hole.

本発明によれば、半抜きダボ形成工程において、半抜きダボの突出部が第1板材の小孔の内部に圧入する圧入深さは、小孔の内壁長(第1板材の板厚と同等)の0.2~0.8の範囲が好ましい。このため、半抜きダボが第2板材に充分な保持力で保持され、同時に、半抜きダボの突出部が第1板材を充分な保持力で保持することが可能となる。ここで、前記圧入深さが小孔の内壁長の0.2を下回ると、突出部と小孔の内壁との嵌合長さが短くなり、突出部が第1板材を充分な保持力で保持することができなくなる。また、前記圧入深さが小孔の内壁長の0.8を上回ると、半抜きダボが第2板材に充分な保持力で保持されなくなる。このため、前記圧入深さは、小孔の内壁長の0.2~0.8の範囲が好ましい。
なお、前記圧入深さは、より好ましくは、小孔の内壁長の0.4~0.6であり、さらに好ましくは0.5である。
According to the present invention, in the half-blanked dowel forming step, the press-fitting depth of the protruding portion of the half-blanked dowel into the small hole of the first plate member is the inner wall length of the small hole (equivalent to the plate thickness of the first plate member). ) is preferably in the range of 0.2 to 0.8. Therefore, the half-blanked dowel is held by the second plate member with a sufficient holding force, and at the same time, the projecting portion of the half-blanked dowel can hold the first plate member with a sufficient holding force. Here, when the press-fitting depth is less than 0.2 of the inner wall length of the small hole, the fitting length between the protrusion and the inner wall of the small hole becomes short, and the protrusion retains the first plate member with a sufficient force. unable to hold. Further, if the press-fitting depth exceeds 0.8 of the inner wall length of the small hole, the half-blanked dowel will not be held by the second plate member with a sufficient holding force. Therefore, the press-fitting depth is preferably in the range of 0.2 to 0.8 of the inner wall length of the small hole.
The press-fitting depth is more preferably 0.4 to 0.6 of the inner wall length of the small hole, more preferably 0.5.

(4)本発明の積層板材構造体の製造方法は、(1)~(3)のいずれかに記載された積層板材構造体の製造方法であって、前記半抜きダボ形成工程では、前記半抜き用パンチの先端の平面視形状及び平面視面積は、前記第1板材に穿孔された前記小孔の平面視形状及び平面視面積と同一であることが好ましい。 (4) A method for manufacturing a laminated plate structure according to the present invention is the method for manufacturing a laminated plate structure according to any one of (1) to (3), wherein the half punch dowel forming step comprises the half It is preferable that the planar view shape and planar view area of the tip of the punch for punching are the same as the planar view shape and planar view area of the small hole punched in the first plate member.

本発明によれば、半抜き用パンチの先端の平面視形状及び平面視面積は、第1板材に穿孔された小孔の平面視形状及び平面視面積と同一であるので、第1板材の小孔と向き合う第2板材部分だけを半抜き用パンチで押圧することができる。このため、半抜き用パンチの押圧により半抜きダボの突出部を小孔の内部にスムースに突出させることが可能となる。しかも、半抜きダボの突出部は、小孔の平面視形状及び平面視面積と同一であるため、小孔の内部に無理なく圧入され、第1板材と第2板材の結合を強固とすることができる。 According to the present invention, the tip of the punch for half-blanking has the same plane view shape and plane view area as the plane view shape and plane view area of the small hole punched in the first plate. Only the portion of the second plate facing the hole can be pressed by the punch for half blanking. Therefore, it is possible to smoothly project the projecting portion of the half-blanking dowel into the small hole by pressing the half-blanking punch. Moreover, since the protruding portion of the half-blanked dowel has the same shape and area as the plan view of the small hole, it can be press-fitted into the small hole without difficulty, thereby strengthening the connection between the first plate member and the second plate member. can be done.

(5)本発明の積層板材構造体の製造方法は、(1)~(4)のいずれかに記載された積層板材構造体の製造方法であって、前記半抜きダボ形成工程では、前記第1板材の裏面側から前記小孔の内部に半抜きダボ受を挿入配置した上で前記半抜き用パンチを前記第2板材の表面内に圧入することにより、前記第1板材の板厚方向に圧縮された半抜きダボを形成することが好ましい。 (5) A method for manufacturing a laminated plate structure according to the present invention is the method for manufacturing a laminated plate structure according to any one of (1) to (4), wherein in the half-blanked dowel forming step, the first A half-blanking dowel holder is inserted into the small hole from the back side of one plate, and the half-blanking punch is press-fitted into the surface of the second plate. It is preferred to form compressed half-blanked dowels.

本発明によれば、半抜きダボ形成工程では、第1板材の裏面側から小孔の内部に半抜きダボ受を挿入し配置した上で半抜き用パンチを第2板材の表面内に圧入する。このため、半抜きダボは半抜き用パンチと半抜きダボ受とにより第1板材の板厚方向に圧縮される。この圧縮の反作用として半抜きダボは径方向に拡張しようとするため、半抜きダボと第1板材の小孔の内壁との接触力、及び、半抜きダボと第2板材の半抜きダボの形成内壁との接触力が高まる。このため、半抜きダボにより、第1板材と第2板材との結合はより強固となる。 According to the present invention, in the half-blanking dowel forming step, the half-blanking dowel receiver is inserted into the small hole from the back side of the first plate, and the half-blanking punch is press-fitted into the surface of the second plate. . Therefore, the half-blanking dowel is compressed in the thickness direction of the first plate by the half-blanking punch and the half-blanking dowel receiver. As a reaction to this compression, the half-blanked dowel tends to expand in the radial direction, so the contact force between the half-blanked dowel and the inner wall of the small hole of the first plate member and the formation of the half-blanked dowel and the half-blanked dowel of the second plate member The contact force with the inner wall increases. For this reason, the half-punched dowels make the connection between the first plate member and the second plate member stronger.

(6)本発明の積層板材構造体の製造方法は、(1)~(5)のいずれかに記載された積層板材構造体の製造方法であって、前記半抜きダボ形成工程は、前記第1板材に穿孔される前記小孔の内壁が、前記小孔における裏面側孔幅寸法が表面側孔幅寸法より大きくなるように逆テーパ面に形成されている状態で行われることが好ましい。 (6) A method for manufacturing a laminated plate structure according to the present invention is the method for manufacturing a laminated plate structure according to any one of (1) to (5), wherein the half-blanked dowel forming step comprises the first It is preferable that the inner wall of the small hole drilled in one plate is formed in a reverse tapered surface so that the width of the hole on the back side of the small hole is larger than the width of the hole on the front side.

本発明によれば、半抜きダボ形成工程において、半抜き用パンチが第2板材の表面を押圧すると、半抜きダボが形成され、その突出部が小孔の内部に突出する。この突出部は、半抜き用パンチにより押圧され圧縮された状態で小孔の内部に突出するため、小孔の内壁の逆テーパ面に沿って拡張する。したがって、突出部は、小孔の逆テーパ面にロックされ、確実に保持されることとなる。このため、第2板材は、第1板材により強固に結合される。 According to the present invention, in the half-blanking dowel forming step, when the half-blanking punch presses the surface of the second plate member, the half-blanking dowel is formed, and the projecting portion of the half-blanking dowel protrudes into the small hole. The protruding portion protrudes into the small hole while being pressed and compressed by the half-punching punch, and thus expands along the reverse tapered surface of the inner wall of the small hole. Therefore, the projecting portion is locked to the reverse tapered surface of the small hole and is securely held. For this reason, the second plate member is strongly bonded to the first plate member.

(7)本発明の積層板材構造体の製造方法は、(1)~(6)のいずれかに記載された積層板材構造体の製造方法であって、前記第1板材と前記第2板材は一体の板材からなり、前記第2板材積層工程は、前記第1板材の小孔が穿設された所定箇所を含む所定領域の先端領域を折り曲げる折り曲げ工程であり、前記折り曲げ工程では、前記先端領域を前記所定領域の表面側に180度折り曲げ、当該180度折り曲げられた前記先端領域を前記第2板材として前記第1板材の前記所定領域に積層することが好ましい。 (7) A method for manufacturing a laminated plate structure according to the present invention is the method for manufacturing a laminated plate structure according to any one of (1) to (6), wherein the first plate and the second plate are The second plate material stacking step is a step of bending a tip region of a predetermined region including a predetermined portion in which a small hole is formed in the first plate member, and the bending step includes bending the tip region. is bent 180 degrees toward the surface side of the predetermined region, and the tip region bent 180 degrees is laminated as the second plate on the predetermined region of the first plate.

本発明によれば、第1板材と第2板材は、一方では、180°折り曲げ箇所において連結(結合)しており、他方では、半抜きダボ箇所において結合している。このため、両板材同士を強力に結合することが可能となる。さらに、180°折り曲げ箇所と半抜きダボ箇所とにおいて両板材を結合するので、両板材の広い領域を密着状態とすることが可能となる。 According to the invention, the first plate and the second plate are connected (bonded) at the 180° bend on the one hand and at the half-blanked dowel on the other hand. Therefore, it is possible to strongly bond the two plate members together. Furthermore, since the two plate members are joined at the 180° bent portion and the half-blanked dowel portion, it is possible to bring the two plate members into close contact with each other over a wide area.

(8)本発明の積層板材構造体の製造方法は、(1)~(6)のいずれかに記載された積層板材構造体の製造方法であって、前記第1板材と前記第2板材は別個の板材から構成されることが好ましい。 (8) A method for manufacturing a laminated plate structure according to the present invention is the method for manufacturing a laminated plate structure according to any one of (1) to (6), wherein the first plate and the second plate are It is preferably constructed from separate plates.

本発明によれば、第1板材と第2板材は別個の板材から構成されることから、両板材の材質、板厚、硬度、及び、熱処理等の処理状態等を用途に応じて任意に選択することが可能となる。さらに、第3板材を第2板材に積層させて本発明の製造方法によって両板材同士を半抜きダボで結合すること、さらに、第4板材以降の板材を順次積層して、下層の板材と上層の板材とを本発明の製造方法により互いに半抜きダボで結合することも容易となる。 According to the present invention, since the first plate material and the second plate material are composed of separate plate materials, the material, plate thickness, hardness, and treatment state such as heat treatment of both plate materials can be arbitrarily selected according to the application. It becomes possible to Further, the third plate is laminated on the second plate, and the two plates are joined together with half-punched dowels by the manufacturing method of the present invention. It is also easy to join the plate materials to each other with half-punched dowels by the manufacturing method of the present invention.

(9)本発明の積層板材構造体の製造方法は、(8)に記載された積層板材構造体の製造方法であって、前記第1板材の硬度は、前記第2板材の硬度と同一若しくは前記第2板材の硬度より高いことが好ましい。 (9) The method for manufacturing a laminated plate structure of the present invention is the method for manufacturing a laminated plate structure described in (8), wherein the hardness of the first plate is the same as or the hardness of the second plate. It is preferable that the hardness is higher than that of the second plate.

本発明によれば、第1板材の硬度は、第2板材の硬度と同一若しくは第2板材の硬度より高いため、半抜きダボ形成工程において、半抜き用パンチが第2板材を押圧する際に、第1板材が押し潰されることがなく、第1板材がプレス金型のダイの機能を、小孔がダイ孔の機能を十分に発揮することが可能となる。このため、半抜きダボの突出部を小孔の内部に確実に圧入することができる。 According to the present invention, since the hardness of the first plate is the same as or higher than the hardness of the second plate, in the half-blanking dowel forming step, when the half-blanking punch presses the second plate, , the first plate is not crushed, and the first plate can function as a die of the press mold, and the small hole can function as a die hole. Therefore, the projecting portion of the half-blanked dowel can be reliably press-fitted into the small hole.

(10)本発明の積層板材構造体の製造方法は、(8)または(9)に記載された積層板材構造体の製造方法であって、前記第1板材の板厚は、前記第2板材の板厚と同一若しくは前記第2板材の板厚より厚いことが好ましい。 (10) A method for manufacturing a laminated plate structure according to the present invention is the method for manufacturing a laminated plate structure according to (8) or (9), wherein the thickness of the first plate is equal to that of the second plate. It is preferable that the plate thickness is the same as or thicker than the plate thickness of the second plate material.

本発明によれば、第1板材の板厚は、前記第2板材の板厚と同一若しくは前記第2板材の板厚より厚いため、半抜きダボ形成工程において、半抜き用パンチが第2板材を押圧する際に、第1板材が押し潰されることがなく、第1板材がプレス金型のダイの機能を、小孔がダイ孔の機能を十分に発揮することが可能となる。このため、半抜きダボの突出部を第1板材の小孔の内部に確実に圧入することができる。 According to the present invention, since the thickness of the first plate material is the same as or thicker than the thickness of the second plate material, in the half-blanking dowel forming step, the half-blanking punch is used to press the second plate material. When pressing, the first plate is not crushed, and the first plate can function as a die of the press mold, and the small hole can function as a die hole. Therefore, the projecting portion of the half-blanked dowel can be reliably press-fitted into the small hole of the first plate member.

(11)本発明の積層板材構造体の製造方法は、(1)~(10)のいずれかに記載された積層板材構造体の製造方法であって、前記第1板材はテープ状板材からなり、前記テープ状板材の搬送に伴って、前記小孔穿孔工程、前記第2板材積層工程、前記半抜きダボ形成工程を行い、さらに、前記テープ状板材から積層板材構造体を分離する積層板材構造体分離工程を行うことが好ましい。 (11) A method for manufacturing a laminated plate structure according to the present invention is the method for manufacturing a laminated plate structure according to any one of (1) to (10), wherein the first plate is made of a tape-shaped plate. , the step of punching the small holes, the step of laminating the second plate material, and the step of forming the half-punched dowels are performed as the tape-like plate material is conveyed, and furthermore, a laminated plate structure is separated from the tape-like plate material. It is preferred to carry out a body separation step.

本発明によれば、第1板材はテープ状板材からなり、テープ状板材の搬送に伴って、小孔穿孔工程、第2板材積層工程、半抜きダボ形成工程を行い、さらに、テープ状板材から積層板材構造体を分離する積層板材構造体分離工程を行うから、各工程を連続して行うことができる。このため、積層板材構造体を低コストで、高品質で製造することが可能となる。 According to the present invention, the first plate is made of a tape-shaped plate, and as the tape-shaped plate is conveyed, the step of punching small holes, the step of laminating the second plate, and the step of forming half-punched dowels are performed. Since the laminated plate structure separation step for separating the laminated plate structure is performed, each step can be performed continuously. Therefore, it is possible to manufacture the laminated plate structure at low cost and with high quality.

本発明の実施形態1の積層板材構造体1の断面図である。1 is a cross-sectional view of a laminated plate structure 1 according to Embodiment 1 of the present invention; FIG. 本発明の実施形態1の積層板材構造体1の製造方法を説明する工程図である。It is process drawing explaining the manufacturing method of the laminated board material structure 1 of Embodiment 1 of this invention. 本発明の実施形態1の積層板材構造体1の製造方法を説明する説明図である。It is explanatory drawing explaining the manufacturing method of the laminated plate material structure 1 of Embodiment 1 of this invention. 本発明の実施形態2の積層板材構造体101の断面図である。FIG. 3 is a cross-sectional view of a laminated plate material structure 101 according to Embodiment 2 of the present invention; 本発明の実施形態2の積層板材構造体101の製造方法を説明する工程図である。It is process drawing explaining the manufacturing method of the laminated board material structure 101 of Embodiment 2 of this invention. 本発明の実施形態2の積層板材構造体101の製造方法を説明する説明図である。It is explanatory drawing explaining the manufacturing method of the laminated board material structure 101 of Embodiment 2 of this invention. 本発明の変形例1の半抜きダボ形成工程40を説明する説明図である。FIG. 10 is an explanatory diagram for explaining a half-blanked dowel forming step 40 of Modification 1 of the present invention; 本発明の変形例2の半抜きダボ形成工程40を説明する説明図である。FIG. 11 is an explanatory diagram for explaining a half-blanked dowel forming step 40 of Modification 2 of the present invention; 本発明の変形例3の半抜きダボ形成工程40を説明する説明図である。FIG. 11 is an explanatory diagram for explaining a half-blanked dowel forming step 40 of Modification 3 of the present invention; 本発明の変形例4の半抜きダボ形成工程40を説明する説明図である。FIG. 11 is an explanatory diagram for explaining a half-blanked dowel forming step 40 of Modification 4 of the present invention; 本発明の変形例5の半抜きダボ形成工程40を説明する説明図である。FIG. 11 is an explanatory diagram for explaining a half-blanked dowel forming step 40 of Modification 5 of the present invention; 本発明の変形例6の半抜きダボ形成工程40を説明する説明図である。FIG. 11 is an explanatory diagram for explaining a half-blanked dowel forming step 40 of Modification 6 of the present invention; 従来の鉄心片1010及び積層鉄心1000の断面図である。FIG. 10 is a cross-sectional view of a conventional core piece 1010 and a laminated core 1000;

以下、本発明を実施形態に基づいて具体的に説明する。 BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be specifically described based on embodiments.

〔実施形態1〕
本発明の実施形態1は、半導体モジュールMの放熱板に本発明の積層板材構造体を適用した積層板材構造体1の製造方法である。
図1は、実施形態1の積層板材構造体1の断面図、図2は実施形態1の積層板材構造体1の製造方法を説明する工程図、図3は実施形態1の積層板材構造体1の製造方法を説明する説明図である。図3(1)は実施形態1の各工程に対応するテープ状板材Wの平面視図、図3(2)は図3(1)のA-A断面図であり、テープ状板材を加工する加工装置も図示しており、図3(3)は図3(2)の一部を拡大した拡大図である。
[Embodiment 1]
Embodiment 1 of the present invention is a method of manufacturing a laminated plate material structure 1 in which the laminated plate material structure of the present invention is applied to a radiator plate of a semiconductor module M. FIG.
1 is a cross-sectional view of the laminated plate material structure 1 of Embodiment 1, FIG. 2 is a process diagram for explaining a manufacturing method of the laminated plate material structure 1 of Embodiment 1, and FIG. 3 is the laminated plate material structure 1 of Embodiment 1. It is an explanatory view explaining a manufacturing method of. FIG. 3(1) is a plan view of the tape-shaped plate material W corresponding to each step of the first embodiment, and FIG. 3(2) is a cross-sectional view taken along the line AA of FIG. 3(1). A processing device is also illustrated, and FIG. 3(3) is an enlarged view of a part of FIG. 3(2).

本発明の実施形態1の製造方法により得られる積層板材構造体1は、図1に図示されているように、第1板材2を折り曲げて第2板材とし、第1板材2の表面に第2板材3を積層し、両板材2、3を互いに結合して構成される。この両板材2、3の結合箇所においては、第1板材2の所定箇所に穿孔された小孔2aに第2板材3に形成された半抜きダボ3aの突出部3bが圧入されている。
実施形態1の積層板材構造体1は、図1のように、半導体モジュールMの底面に配置されて半導体モジュールMの放熱板として使用される。実施形態1の積層板材構造体1は、第1板材と第2板材が積層されるので厚く形成でき、半導体モジュールMの放熱性を良好とすることが可能となる。
The laminated plate structure 1 obtained by the manufacturing method of Embodiment 1 of the present invention, as shown in FIG. The plate members 3 are laminated and the plate members 2 and 3 are joined to each other. At the connection point between the two plate members 2 and 3, a protruding portion 3b of a half-blanked dowel 3a formed in the second plate member 3 is press-fitted into a small hole 2a drilled at a predetermined location in the first plate member 2. As shown in FIG.
The laminated plate material structure 1 of Embodiment 1 is arranged on the bottom surface of the semiconductor module M and used as a heat sink for the semiconductor module M, as shown in FIG. Since the first plate material and the second plate material are laminated, the laminated plate material structure 1 of Embodiment 1 can be formed thickly, and the heat dissipation property of the semiconductor module M can be improved.

実施形態1の積層板材構造体1の製造方法は、テープ状板材Wを用いて、図2のように、所定領域形成工程10、小孔穿孔工程20、第2板材積層工程30、半抜きダボ形成工程40、積層板材構造体分離工程50を、この順に行う。なお、第2板材積層工程30では、直角折り曲げ工程31、135°折り曲げ工程34、及び、180°折り曲げ工程36をこの順で行う。
実施形態1の積層板材構造体1の製造方法に用いるテープ状板材Wは、ステンレススチール(SUS304等)、黄銅、ベリリウム銅、アルミニウムなどの展性に富み、比較的高硬度の金属が使用される。テープ状板材Wは、図3(1)の搬送方向Pに沿って間欠搬送され、各搬送停止中に各工程が行われる。テープ状板材Wの幅方向の両端部には、搬送用のスプロケット穴Whが搬送方向Pに沿って等間隔に形成されている。図3(2)において、Wjはテープ状板材Wの表面、Weはテープ状板材Wの裏面である。
以下、各工程を詳細に説明する。
In the method for manufacturing the laminated plate material structure 1 of Embodiment 1, a tape-shaped plate material W is used, as shown in FIG. A forming step 40 and a laminated plate material structure separating step 50 are performed in this order. In the second plate material stacking step 30, a right angle bending step 31, a 135° bending step 34, and a 180° bending step 36 are performed in this order.
The tape-shaped plate material W used in the method for manufacturing the laminated plate material structure 1 of Embodiment 1 is made of highly malleable and relatively high-hardness metal such as stainless steel (SUS304, etc.), brass, beryllium copper, and aluminum. . The tape-shaped plate material W is intermittently transported along the transport direction P in FIG. 3(1), and each step is performed during each transport stop. Sprocket holes Wh for transport are formed at equal intervals along the transport direction P at both ends of the tape-shaped plate material W in the width direction. In FIG. 3B, Wj is the front surface of the tape-shaped plate material W, and We is the back surface of the tape-shaped plate material W. As shown in FIG.
Each step will be described in detail below.

[所定領域形成工程]
所定領域形成工程10は、テープ状板材Wに、積層板材構造体1を構成するための所定領域Waを形成する工程である。所定領域Waは、図3(1)の様に、片持ち片部分であり、テープ状板材Wに平面視コの字状の切り欠き部Wbを打ち抜きすることにより形成される。この切り欠き部Wbは、図3(2)の様に、上型11と下型12とによりテープ状板材Wをプレス抜きすることにより形成される。
[Predetermined Area Forming Step]
The predetermined region forming step 10 is a step of forming a predetermined region Wa for forming the laminated plate structure 1 in the tape-shaped plate material W. As shown in FIG. As shown in FIG. 3(1), the predetermined area Wa is a cantilever portion, and is formed by punching out a notch Wb having a U-shape in plan view in the tape-like plate material W. As shown in FIG. The notch portion Wb is formed by pressing the tape-shaped plate material W with an upper die 11 and a lower die 12, as shown in FIG. 3(2).

なお、次に述べる小孔穿孔工程20から後述する積層板材構造体分離工程50までにおいて、所定領域Waの中で、直角、135°及び180°に折り曲げられない平坦な領域(平坦領域Wd)は、積層板材構造体分離工程50によりテープ状板材Wから分離された積層板材構造体1においては第1板材2となる。このため、以後、平坦領域Wdを第1板材2(Wd)と表記して説明する。同様に、小孔穿孔工程20から後述する積層板材構造体分離工程50までにおいて、直角、135°及び180°に折り曲げられた先端領域Wcは、積層板材構造体分離工程50によりテープ状板材Wから分離された積層板材構造体1においては第2板材3となる。このため、以後、先端領域Wcを第2板材3(Wc)と表記して説明する。 In addition, from the small hole punching step 20 described below to the laminated plate material structure separating step 50 described later, a flat region (flat region Wd) that is not bent at right angles, 135° and 180° in the predetermined region Wa is , the first plate material 2 in the laminated plate material structure 1 separated from the tape-shaped plate material W in the laminated plate material structure separating step 50 . Therefore, the flat region Wd will be referred to as the first plate member 2 (Wd) in the following description. Similarly, from the small hole punching step 20 to the laminated plate material structure separation step 50 described later, the leading end region Wc bent at right angles, 135° and 180° is separated from the tape-shaped plate material W by the laminated plate structure separation step 50. The separated laminated plate material structure 1 becomes the second plate material 3 . Therefore, the tip end region Wc will be described as the second plate member 3 (Wc) hereinafter.

[小孔穿孔工程]
小孔穿孔工程20は、所定領域形成工程10で形成されたテープ状板材Wの第1板材2(Wd)に小孔2aを穿孔する工程である。小孔2aは、図3(2)の様に、テープ状板材Wの上側に配置された小孔用パンチ21を、テープ状板材Wの表面に押し当てテープ状板材Wの下側に配置された小孔用ダイス22内まで降下させることにより形成される。
小孔用パンチ21の先端の平面視径(外径)21dは、小孔用ダイスの孔径22dよりクリアランス分だけ小径に形成されている。
[Small hole drilling process]
The small hole punching step 20 is a step of punching small holes 2a in the first plate member 2 (Wd) of the tape-like plate member W formed in the predetermined area forming step 10 . As shown in FIG. 3(2), the small holes 2a are formed by pressing a small hole punch 21 arranged above the tape-shaped plate material W against the surface of the tape-shaped plate material W, and arranged below the tape-shaped plate material W. It is formed by lowering it into the die 22 for small holes.
A planar view diameter (outer diameter) 21d of the tip of the small hole punch 21 is smaller than the hole diameter 22d of the small hole die by the clearance.

また、小孔用パンチ21の先端の平面視径21dは、テープ状板材Wの板厚Wtより小さい。このため、後工程の半抜きダボ形成工程40において、半抜き用パンチ41を第2板材3(Wc)の表面3c(We)より内方に圧入する際に、小孔2a周辺の第1板材2(Wd)は半抜き用ダイスの機能を効果的に発揮することができる。すなわち、小孔2aの内壁における表面2c(Wj)側部分は硬質の剪断面が長く形成されるため、半抜き用パンチ41の押圧により第2板材3(Wc)の裏面3e(Wj)から下方に突出する突出部3bが形成されても、突出部3bが小孔2aを潰し、或いは、変形することを防止することが可能となる。加えて、剪断面は表面が滑らかであるので、突出部3bを小孔2a内にスムースに導入することが可能となる。
なお、小孔用パンチ21の先端の平面視径21dは、テープ状板材Wの板厚Wtと同一、または、テープ状板材Wの板厚Wtより大きくしてもよい。
Further, the diameter 21d of the tip of the small hole punch 21 in plan view is smaller than the thickness Wt of the tape-shaped plate material W. As shown in FIG. Therefore, in the subsequent half-blanking dowel forming step 40, when the half-blanking punch 41 is pressed inward from the surface 3c (We) of the second plate 3 (Wc), the first plate around the small hole 2a 2 (Wd) can effectively exhibit the function of the half-blanking die. That is, since the inner wall of the small hole 2a on the side of the surface 2c (Wj) has a long hard sheared surface, the pressing of the half-punching punch 41 pushes the second plate 3 (Wc) downward from the back surface 3e (Wj). Even if the protruding portion 3b is formed, it is possible to prevent the protruding portion 3b from crushing or deforming the small hole 2a. In addition, since the sheared surface has a smooth surface, it is possible to smoothly introduce the protrusion 3b into the small hole 2a.
The planar view diameter 21d of the tip of the small hole punch 21 may be the same as the thickness Wt of the tape-shaped plate material W or may be larger than the thickness Wt of the tape-shaped plate material W. FIG.

所定領域形成工程10と小孔穿孔工程20とは、上記順で行われることに限定されるものではなく、適宜順を入れ換えてもよい。例えば、先に小孔穿孔工程20を行い、その後に所定領域形成工程10を行ってもよく、或いは、所定領域形成工程10と小孔穿孔工程20とを同時に行なってもよい。 The predetermined region forming step 10 and the small hole punching step 20 are not limited to being performed in the above order, and the order may be changed as appropriate. For example, the small hole punching step 20 may be performed first, and then the predetermined area forming step 10 may be performed, or the predetermined area forming step 10 and the small hole punching step 20 may be performed simultaneously.

[直角折り曲げ工程]
直角折り曲げ工程31は、小孔穿孔工程20で小孔2aが形成されたテープ状板材Wの第2板材3(Wc)をその表面Wj側(図3(2)の上側)に向けてほぼ直角に折り曲げる工程である。第2板材3(Wc)を直角に折り曲げる工程は、図3(2)の様に、テープ状板材Wの下側に配置された直角折り曲げ用パンチ32とテープ状板材Wの上側に配置された直角折り曲げ用ダイス33とを用いて行う。テープ状板材Wの所定領域Waの中央部を直角折り曲げ用パンチ32で押し上げると、第2板材3(Wc)が上方向に向けて直角に折り曲がる。
[Right angle bending process]
In the right angle bending process 31, the second plate material 3 (Wc) of the tape-shaped plate material W in which the small holes 2a are formed in the small hole punching process 20 is turned to the surface Wj side (the upper side in FIG. 3(2)) at a substantially right angle. This is the step of folding In the process of bending the second plate 3 (Wc) at right angles, as shown in FIG. A die 33 for right angle bending is used. When the central portion of the predetermined area Wa of the tape-shaped plate material W is pushed up by the punch 32 for bending at right angles, the second plate material 3 (Wc) is bent upward at right angles.

[135°折り曲げ工程]
135°折り曲げ工程34は、直角折り曲げ工程31で直角に折り曲げられた第2板材3(Wc)をほぼ135°に折り曲げる工程である。第2板材3(Wc)を135°に折り曲げる工程は、図3(2)の様に、テープ状板材Wの上側に配置された135°折り曲げ用パンチ35を用いて行う。テープ状板材Wの第2板材3(Wc)を135°折り曲げ用パンチ35で押し下げると、第2板材3(Wc)が135°に折り曲がる。
[135° bending process]
The 135° bending step 34 is a step of bending the second plate member 3 (Wc), which has been bent at right angles in the right angle bending step 31, to approximately 135°. The step of bending the second plate material 3 (Wc) to 135° is performed using a 135° bending punch 35 arranged above the tape-like plate material W, as shown in FIG. 3(2). When the second plate member 3 (Wc) of the tape-shaped plate member W is pushed down by the 135° bending punch 35, the second plate member 3 (Wc) is bent at 135°.

[180°折り曲げ工程]
180°折り曲げ工程36は、135°折り曲げ工程34で135°に折り曲げられた第2板材3(Wc)をほぼ180°折り曲げる工程である。第2板材3(Wc)を180°に折り曲げる工程は、図3(2)の様に、テープ状板材Wの上側に配置された180°折り曲げ用パンチ37を用いて行う。テープ状板材Wの第2板材3(Wc)を180°折り曲げ用パンチ37が押し下げると、第2板材3(Wc)が180°に折り曲がる。
このため、第2板材3(Wc)は、所定領域Waのなかで折り曲げられていない第1板材2(Wd)に積層されることになる。
[180° bending process]
The 180° bending step 36 is a step of bending the second plate member 3 (Wc) that has been bent to 135° in the 135° bending step 34 by approximately 180°. The step of bending the second plate material 3 (Wc) to 180° is performed using a 180° bending punch 37 arranged above the tape-like plate material W as shown in FIG. 3(2). When the punch 37 for 180° bending pushes down the second plate 3 (Wc) of the tape-shaped plate W, the second plate 3 (Wc) is bent at 180°.
Therefore, the second plate member 3 (Wc) is laminated on the first plate member 2 (Wd) that is not bent in the predetermined area Wa.

[半抜きダボ形成工程]
第2板材3(Wc)に対する半抜きダボ形成工程40は、180°折り曲げ工程36により第1板材2(Wd)に積層された第2板材3(Wc)に、半抜きダボ3aを形成する工程である。この半抜きダボ形成工程40は、図3(2)、(3)のように、第1板材2(Wd)に穿孔された小孔2aの平面視位置に対応する第2板材3(Wc)の表面位置にて半抜き用パンチ41を第2板材3(Wc)の表面3c(We)内(第2板材3(Wc)の板厚Wsの途中位置まで)に圧入して半抜きダボ3aを形成し、半抜きダボ3aの先端を第2板材3(Wc)の裏面3e(Wj)から突出させ、突出した突出部3bを第1板材2(Wd)の小孔2a内に圧入して、第1板材2(Wd)と第2板材3(Wc)を互いに結合させる工程である。
[Half punch dowel forming process]
The half-blanked dowel forming step 40 for the second plate 3 (Wc) is a step of forming the half-blanked dowel 3a in the second plate 3 (Wc) laminated on the first plate 2 (Wd) by the 180° bending step 36. is. 3(2) and 3(3), the half-blanked dowel forming step 40 is carried out on the second plate member 3 (Wc) corresponding to the position in plan view of the small hole 2a drilled in the first plate member 2 (Wd). The half-blanking punch 41 is press-fitted into the surface 3c (We) of the second plate 3 (Wc) (up to the halfway position of the plate thickness Ws of the second plate 3 (Wc)) to form the half-blanking dowel 3a. is formed, the tip of the half-blanked dowel 3a protrudes from the back surface 3e (Wj) of the second plate 3 (Wc), and the protruding portion 3b is press-fitted into the small hole 2a of the first plate 2 (Wd). , the step of joining the first plate member 2 (Wd) and the second plate member 3 (Wc) to each other.

半抜きダボ形成工程40において、図3(2)の当該半抜きダボ形成工程40を示す断面図を拡大図示した図3(3)のように、半抜き用パンチ41をテープ状板材Wの上側から第2板材3(Wc)の表面3c(We)より内部に圧入すると、小孔2aの周囲の第1板材2(Wd)がダイの役割を果たし(小孔2aがダイ孔となり)、第2板材3(Wc)の裏面3e(Wj)から第1板材2(Wd)に向けて半抜きダボ3aが突出する。
半抜き用パンチ41の外径41dは、小孔2aの内径2adと同一に形成されている。すなわち、半抜きダボ形成工程40において、半抜き用パンチ41の先端の平面視形状及び平面視面積は、第1板材2(Wd)に穿孔された小孔2aの平面視形状及び平面視面積と同一である。したがって、半抜きダボ3aの平面視形状及び平面視面積は、第1板材2(Wd)に穿孔された小孔2aの平面視形状及び平面視面積と同一である。このため、半抜きダボ3aの突出部3bはスムースに小孔2a内に圧入する。この際、突出部3bが小孔2a内に圧入しても第1板材2(Wd)が変形することはない。したがって、半抜きダボ3aと第2板材3(Wc)との結合力を高めることができる。以上のように、半抜きダボ3aにより、第1板材2(Wd)と第2板材3(Wc)とは、互いに強固に結合することが可能となる。
なお、半抜きダボ3aの外周壁には、剪断面と破断面が形成されている。
In the half-blanking dowel forming step 40, as shown in FIG. When the surface 3c (We) of the second plate member 3 (Wc) is pressed into the inside from the surface 3c (We), the first plate member 2 (Wd) around the small hole 2a plays the role of a die (the small hole 2a becomes a die hole), A half-blanked dowel 3a protrudes from the back surface 3e (Wj) of the second plate 3 (Wc) toward the first plate 2 (Wd).
The outer diameter 41d of the half-blanking punch 41 is formed to be the same as the inner diameter 2ad of the small hole 2a. That is, in the half-blanking dowel forming step 40, the plan view shape and plan view area of the tip of the half-punch punch 41 are the same as the plan view shape and plan view area of the small hole 2a punched in the first plate 2 (Wd). are identical. Therefore, the plan view shape and plan view area of the half-blanked dowel 3a are the same as the plan view shape and plan view area of the small hole 2a drilled in the first plate member 2 (Wd). Therefore, the projecting portion 3b of the half-blanked dowel 3a is smoothly press-fitted into the small hole 2a. At this time, the first plate member 2 (Wd) is not deformed even if the projecting portion 3b is press-fitted into the small hole 2a. Therefore, the bonding strength between the half-punched dowel 3a and the second plate member 3 (Wc) can be enhanced. As described above, the half-blanked dowels 3a enable the first plate member 2 (Wd) and the second plate member 3 (Wc) to be firmly connected to each other.
A sheared surface and a fractured surface are formed on the outer peripheral wall of the half-blanked dowel 3a.

なお、半抜きダボ形成工程40において、半抜きダボ3aの突出部3bが第1板材2(Wd)の小孔2a内に圧入する際の圧入深さ3aaは、小孔2aの内壁長(第1板材2(Wd)、即ちテープ状板材Wの板厚Wt)の0.2~0.8の範囲が好ましい。このため、半抜きダボ3aが第2板材3(Wc)に十分な保持長さで保持され、半抜きダボ3aの突出部3bが第1板材2(Wd)を充分な保持力で保持することが可能となる。ここで、半抜きダボ3aの突出部3bが第1板材2(Wd)の小孔2a内に圧入する圧入深さ3aaが小孔2aの内壁長(Wt)の0.2を下回ると、突出部3bと小孔2aの内壁との嵌合長さが短くなり、突出部3bが第1板材2(Wd)を充分な保持力で保持することができなくなる。また、半抜きダボ3aの突出部3bが第1板材2(Wd)の小孔2a内に圧入する圧入深さ3aaが小孔2aの内壁長の0.8を上回ると、半抜きダボ3aが第2板材3(Wc)に充分な保持力で保持されなくなる。
半抜きダボ3aの突出部3bが第1板材2(Wd)の小孔2a内に圧入する圧入深さ3aaは、好ましくは、小孔2aの内壁長Wtの0.4~0.6であり、より好ましくは0.5である。
In the half-blanked dowel forming step 40, the press-fitting depth 3aa when the projecting portion 3b of the half-blanked dowel 3a is press-fitted into the small hole 2a of the first plate 2 (Wd) is the length of the inner wall of the small hole 2a (the first 1 plate 2 (Wd), that is, the plate thickness Wt of the tape-shaped plate W is preferably in the range of 0.2 to 0.8. Therefore, the half-punched dowel 3a is held by the second plate 3 (Wc) with a sufficient holding length, and the projecting portion 3b of the half-punched dowel 3a holds the first plate 2 (Wd) with a sufficient holding force. becomes possible. Here, when the press-fit depth 3aa at which the projecting portion 3b of the half-blanked dowel 3a is press-fit into the small hole 2a of the first plate 2 (Wd) is less than 0.2 of the inner wall length (Wt) of the small hole 2a, the projection The fitting length between the portion 3b and the inner wall of the small hole 2a is shortened, and the projecting portion 3b cannot hold the first plate member 2 (Wd) with a sufficient holding force. Further, when the press-fitting depth 3aa at which the projecting portion 3b of the half-blanked dowel 3a is press-fitted into the small hole 2a of the first plate 2 (Wd) exceeds 0.8 of the inner wall length of the small hole 2a, the half-blanked dowel 3a is It is no longer held by the second plate member 3 (Wc) with a sufficient holding force.
The press-fitting depth 3aa at which the projecting portion 3b of the half-blanked dowel 3a is press-fitted into the small hole 2a of the first plate 2 (Wd) is preferably 0.4 to 0.6 of the inner wall length Wt of the small hole 2a. , more preferably 0.5.

[積層板材構造体分離工程]
積層板材構造体分離工程50は、半抜きダボ形成工程40により、第1板材2(Wd)と第2板材3(Wc)とが互いに結合した積層構造体Wf(分離後は積層板材構造体1)を、テープ状板材Wから分離する工程である。
積層板材構造体分離工程50は、図3(2)に図示するように、テープ状板材Wの上側に配置された積層板材構造体分離用上型51をテープ状板材Wの下側に配置された積層板材構造体分離用下型52に向けて降下し、積層構造体Wfがテープ状板材Wに接続している接続領域Wiを切断し、積層構造体Wfをテープ状板材Wから分離する工程である。この積層板材構造体分離工程50により、テープ状板材Wから分離された積層構造体Wfは、図1の積層板材構造体1である。
[Laminate plate material structure separation process]
The laminated plate structure separation step 50 is a laminated structure Wf (laminated plate structure 1 ) from the tape-shaped plate W.
In the laminated plate material structure separation step 50, as shown in FIG. A step of descending toward the laminated plate structure separating lower mold 52, cutting the connection region Wi where the laminated structure Wf is connected to the tape-like plate material W, and separating the laminated structure Wf from the tape-like plate material W. is. The laminated structure Wf separated from the tape-shaped plate material W by this laminated plate structure separation step 50 is the laminated plate structure 1 of FIG.

〔実施形態1の効果〕
実施形態1の効果は、次の通りである。
[Effect of Embodiment 1]
The effects of the first embodiment are as follows.

(イ)実施形態1によれば、テープ状板材Wに所定領域Waを形成する所定領域形成工程10、所定領域Waの所定箇所に小孔2aを穿孔する小孔穿孔工程20及び第1板材2(Wd)に第2板材3(Wc)を積層する第2板材積層工程30を行った後に、半抜きダボ形成工程40を行う。この半抜きダボ形成工程40では、第1板材2(Wd)における小孔2aの平面視位置に対応する第2板材3(Wc)の表面位置において半抜き用パンチ41を第2板材3(Wc)の表面3c(We)内に圧入することにより第2板材3(Wc)に半抜きダボ3aを形成する。半抜きダボ3aはその先端が第2板材3(Wc)の裏面3e(Wj)から突出しており、この突出した部分である突出部3bを第1板材2(Wd)の小孔2a内に圧入することにより第1板材2(Wd)と第2板材3(Wc)を互いに結合する。このため、第1板材2(Wd)の小孔2aに半抜きダボ3aの突出部3bを確実に圧入することができる。したがって、積層された板材同士の固定力を安定化することが可能となる。 (a) According to the first embodiment, the predetermined area forming step 10 for forming the predetermined area Wa in the tape-shaped plate material W, the small hole punching step 20 for punching the small holes 2a at predetermined locations in the predetermined area Wa, and the first plate material 2 After performing the second plate material stacking step 30 of stacking the second plate material 3 (Wc) on (Wd), the half-blanked dowel forming step 40 is performed. In this half-blanking dowel forming step 40, the half-blanking punch 41 is applied to the second plate 3 (Wc) at the surface position of the second plate 3 (Wc) corresponding to the position of the small hole 2a in the first plate 2 (Wd) in plan view. ) to form half-blanked dowels 3a in the second plate 3 (Wc). The tip of the half-blanked dowel 3a protrudes from the back surface 3e (Wj) of the second plate 3 (Wc), and the protruding portion 3b is press-fitted into the small hole 2a of the first plate 2 (Wd). By doing so, the first plate member 2 (Wd) and the second plate member 3 (Wc) are joined together. Therefore, the projecting portion 3b of the half-blanked dowel 3a can be reliably press-fitted into the small hole 2a of the first plate member 2 (Wd). Therefore, it is possible to stabilize the fixing force between the stacked plate materials.

(ロ)また、実施形態1によれば、第1板材2(Wd)の小孔2aの平面視位置と半抜き用パンチ41の平面視位置とが多少ずれたとしても、半抜き用パンチ41は圧入力により第2板材3(Wc)の裏面3e(Wj)から突出する突出部3bを小孔2aの内部に確実に圧入させることができる。このため、積層された板材同士の固定力を安定化することができる。しかも、両板材が歪み、変形することがなく、したがって、内部応力の蓄積もないため、初期及び長期信頼性の確保を可能とする。 (b) According to the first embodiment, even if the position of the small hole 2a of the first plate 2 (Wd) and the position of the half-blanking punch 41 are slightly deviated from each other, the half-blanking punch 41 can reliably press-fit the protruding portion 3b protruding from the back surface 3e (Wj) of the second plate member 3 (Wc) into the small hole 2a. Therefore, the fixing force between the stacked plate materials can be stabilized. Moreover, both plate materials are not distorted or deformed, and therefore internal stress is not accumulated, so that initial and long-term reliability can be ensured.

(ハ)加えて、従来例では、各板材に凹部と凸部を形成する凹凸部形成工程と、他方の板材を積層して一方の板材の凹部に他方の板材の凸部を嵌合する嵌合工程との2工程を行う。これに対し、実施形態1では、半抜きダボ形成工程40の中に、第2板材3(Wc)の裏面3e(Wj)から半抜きダボ3aを突出させる工程と、第1板材2(Wd)及び第2板材3(Wc)を固定する工程とを含ませている。このため、製造工程を短縮化し、製造コストを低下することが可能となる。 (c) In addition, in the conventional example, there is a step of forming recesses and projections in each of the plate members, and a fitting step of stacking the other plate member and fitting the protrusion of the other plate member into the recess of the other plate member. 2 processes are performed. On the other hand, in the first embodiment, the half-blanked dowel forming step 40 includes a step of projecting the half-blanked dowel 3a from the back surface 3e (Wj) of the second plate 3 (Wc) and the first plate 2 (Wd). and a step of fixing the second plate member 3 (Wc). Therefore, it is possible to shorten the manufacturing process and reduce the manufacturing cost.

(ニ)実施形態1によれば、小孔穿孔工程20において、小孔用パンチ21の先端の平面視径21dは、第1板材2(Wd)の板厚Wtより小さくした場合、小孔用パンチ21により穿孔される小孔2aの内壁には、滑らかで硬質の剪断面が長く形成され、粗く脆い破断面が短く形成される。しかも、上記剪断面は、小孔2aの表面側(小孔用パンチ21の挿入側)の内壁に形成される。
このため、半抜きダボ形成工程40において、半抜き用パンチ41を第2板材3(Wc)の表面3c(We)内に圧入する際に、小孔2a周辺の第1板材2(Wd)はダイの機能を効果的に発揮することができる。すなわち、小孔2aの内壁における表面側部分は滑らかで硬質の剪断面が長く形成されているため、半抜き用パンチ41の上記圧入の時に半抜きダボ3aの突出部3bが小孔2a周辺の第1板材2(Wd)を強圧しても当該第1板材2(Wd)が潰されることがなく、半抜きダボ3aの突出部3bを小孔2a内にスムースに導入することが可能となる。
(d) According to the first embodiment, in the small hole punching step 20, when the planar view diameter 21d of the tip of the small hole punch 21 is smaller than the plate thickness Wt of the first plate 2 (Wd), The inner wall of the small hole 2a punched by the punch 21 has a long smooth and hard sheared surface and a short rough and brittle fractured surface. Moreover, the sheared surface is formed on the inner wall of the small hole 2a on the surface side (the side on which the small hole punch 21 is inserted).
Therefore, in the half-blanking dowel forming step 40, when the half-blanking punch 41 is pressed into the surface 3c (We) of the second plate 3 (Wc), the first plate 2 (Wd) around the small hole 2a is The function of the die can be effectively exhibited. That is, since the surface side portion of the inner wall of the small hole 2a is smooth and the hard sheared surface is formed long, when the half-blanking punch 41 is press-fitted, the protruding portion 3b of the half-blanking dowel 3a is pushed around the small hole 2a. Even if the first plate member 2 (Wd) is strongly pressed, the first plate member 2 (Wd) is not crushed, and the projecting portion 3b of the half-blanked dowel 3a can be smoothly introduced into the small hole 2a. .

(ホ)実施形態1によれば、半抜きダボ形成工程40において、半抜きダボ3aの突出部3bが第1板材2(Wd)の小孔2a内に圧入する圧入深さ3aaは、小孔2aの内壁長(第1板材2(Wd)の板厚Wtと同等。)の0.2~0.8の範囲である。このため、半抜きダボ3aが第2板材3(Wc)に充分な保持力で保持され、同時に、半抜きダボ3aの突出部3bが第1板材2(Wd)を充分な保持力で保持することが可能となる。ここで、圧入深さ3aaが小孔2aの内壁長Wtの0.2を下回ると、突出部3bと小孔2aの内壁との嵌合長さが短くなり、突出部3bが第1板材2(Wd)を充分な保持力で保持することができなくなる。また、圧入深さ3aaが小孔2aの内壁長Wdの0.8を上回ると、半抜きダボ3aが第2板材3(Wc)に充分な保持力で保持されなくなる。 (e) According to the first embodiment, in the half-blanked dowel forming step 40, the press-fitting depth 3aa at which the projecting portion 3b of the half-blanked dowel 3a is press-fitted into the small hole 2a of the first plate 2 (Wd) It is in the range of 0.2 to 0.8 of the inner wall length of 2a (equivalent to the plate thickness Wt of the first plate member 2 (Wd)). Therefore, the half-blanked dowel 3a is held by the second plate 3 (Wc) with a sufficient holding force, and at the same time, the projecting portion 3b of the half-blanked dowel 3a holds the first plate 2 (Wd) by a sufficient holding force. becomes possible. Here, if the press-fitting depth 3aa is less than 0.2 of the inner wall length Wt of the small hole 2a, the fitting length between the protrusion 3b and the inner wall of the small hole 2a will be shortened, and the protrusion 3b will become the first plate member 2. (Wd) cannot be held with a sufficient holding force. If the press-fitting depth 3aa exceeds 0.8 of the inner wall length Wd of the small hole 2a, the half-blanked dowel 3a will not be held by the second plate member 3 (Wc) with sufficient holding force.

(ヘ)実施形態1によれば、半抜き用パンチ41の先端の平面視形状及び平面視面積は、第1板材2(Wd)に穿孔された小孔2aの平面視形状及び平面視面積と同一であるので、第1板材2(Wd)の小孔2aと向き合う第2板材3(Wc)部分だけを半抜き用パンチ41で押圧することができる。このため、半抜き用パンチ41の押圧により半抜きダボ3aの突出部3bを小孔2a内にスムースに突出させることが可能となる。しかも、半抜きダボ3aの突出部3bは、小孔2aの平面視形状及び平面視面積と同一であるため、小孔2a内に無理なく圧入されるので、第1板材2(Wd)と第2板材3(Wc)の結合をより強固とすることができる。 (f) According to the first embodiment, the plan view shape and plan view area of the tip of the half-punching punch 41 are the same as the plan view shape and plan view area of the small hole 2a punched in the first plate 2 (Wd). Since they are the same, only the portion of the second plate member 3 (Wc) that faces the small hole 2a of the first plate member 2 (Wd) can be pressed by the punch 41 for half-punching. Therefore, it is possible to smoothly project the projecting portion 3b of the half-blanking dowel 3a into the small hole 2a by pressing the half-blanking punch 41. As shown in FIG. Moreover, since the protruding portion 3b of the half-blanked dowel 3a has the same plane view shape and plane view area as the small hole 2a, it can be press-fitted into the small hole 2a without difficulty. The connection between the two plate members 3 (Wc) can be made stronger.

(ト)実施形態1によれば、第1板材2(Wd)と第2板材3(Wc)は、一方では、180°折り曲げ箇所において連結(結合)しており、他方では、半抜きダボ3a箇所において結合している。このため、両板材同士を強力に結合することが可能となる。さらに、180°折り曲げ箇所と半抜きダボ3a箇所とにおいて両板材を結合するので、両板材の広い領域を密着状態とすることが可能となる。 (g) According to Embodiment 1, the first plate member 2 (Wd) and the second plate member 3 (Wc) are connected (joined) at the 180° bending point on one side, and the half-blanked dowels 3a on the other side. are connected at points. Therefore, it is possible to strongly bond the two plate members together. Furthermore, since the two plate members are joined at the 180° bent portion and the half-blanked dowel 3a portion, it is possible to bring the two plate members into close contact with each other over a wide area.

(チ)実施形態1によれば、第1板材2(Wd)はテープ状材Wからなり、テープ状板材Wの搬送に伴って、所定領域形成工程10、小孔穿孔工程20、第2板材積層工程30、半抜きダボ形成工程40を行い、さらに、テープ状板材Wから積層板材構造体1を分離する積層板材構造体分離工程50を行うから、各工程を連続して行うことができる。このため、積層板材構造体1を低コストで、高品質で製造することが可能となる。 (h) According to Embodiment 1, the first plate member 2 (Wd) is made of the tape-shaped member W, and as the tape-shaped member W is conveyed, the predetermined region forming step 10, the small hole punching step 20, and the second plate member are carried out. Since the stacking step 30, the half-blanked dowel forming step 40, and the laminated plate structure separating step 50 for separating the laminated plate structure 1 from the tape-like plate W are performed, each step can be performed continuously. Therefore, the laminated plate material structure 1 can be manufactured at low cost and with high quality.

(リ)実施形態1によれば、(イ)、(ロ)、(ニ)~(ト)に記載された積層板材構造体1に関する効果を有する積層板材構造体1を得ることが可能となる。 (i) According to Embodiment 1, it is possible to obtain the laminated plate material structure 1 having the effects related to the laminated plate material structure 1 described in (a), (b), (d) to (g). .

〔実施形態2〕
実施形態1の製造方法で得られる積層板材構造体1は、第1板材2と第2板材3とが一体の板材から形成されるものであった。実施形態2の製造方法で得られる積層板材構造体101は、第1板材102と第2板材103とが別個の板材から構成され、この点が実施形態1と異なる。それ以外は、実施形態1と同様である。
このため、実施形態2の積層板材構造体101の製造方法は、実施形態1の小孔穿孔工程20に代えて小孔穿孔工程120を行い、さらに、実施形態1の第2板材積層工程30に代えて第2板材積層工程130を採用する。なお、実施形態2の小孔穿孔工程120の中で案内ダボ形成工程122を行う。また、実施形態1の第2板材積層工程30は、直角折り曲げ工程31、135°折り曲げ工程34及び180°折り曲げ工程36をこの順で行うものであったが、実施形態2の第2板材積層工程130では各折り曲げ工程は行わない。
[Embodiment 2]
The laminated plate material structure 1 obtained by the manufacturing method of Embodiment 1 is formed from a plate material in which the first plate material 2 and the second plate material 3 are integrated. The laminated plate material structure 101 obtained by the manufacturing method of the second embodiment differs from the first embodiment in that the first plate material 102 and the second plate material 103 are made of separate plate materials. Other than that, it is the same as the first embodiment.
Therefore, in the method for manufacturing the laminated plate material structure 101 of the second embodiment, the small hole punching step 120 is performed instead of the small hole punching step 20 of the first embodiment, and the second plate material laminating step 30 of the first embodiment is performed. Instead, a second plate stacking step 130 is adopted. A guide dowel formation step 122 is performed in the small hole punching step 120 of the second embodiment. In the second plate material stacking step 30 of the first embodiment, the right angle bending step 31, the 135° bending step 34, and the 180° bending step 36 are performed in this order. At 130, the respective folding steps are not performed.

図4は、実施形態2の製造方法で得られる積層板材構造体101の断面図、図5は実施形態2の積層板材構造体101の製造方法を説明する工程図、図6は実施形態2の積層板材構造体101の製造方法を説明する説明図である。図6(1)は実施形態2の各工程に対応するテープ状板材W及び第2板材103の平面視図、並びに、図6(2)は図6(1)のB-B断面図、図6(3)は図6(1)のC-C断面図及びD-D断面図である。なお、図6(2)及び(3)には、テープ状板材を加工する加工装置も図示されている。 4 is a cross-sectional view of a laminated plate material structure 101 obtained by the manufacturing method of Embodiment 2, FIG. 5 is a process diagram for explaining the method of manufacturing the laminated plate material structure 101 of Embodiment 2, and FIG. FIG. 4 is an explanatory diagram illustrating a method for manufacturing the laminated plate material structure 101; FIG. 6(1) is a plan view of the tape-shaped plate material W and the second plate material 103 corresponding to each step of the second embodiment, and FIG. 6(2) is a BB cross-sectional view of FIG. 6(1). 6(3) is a CC sectional view and a DD sectional view of FIG. 6(1). In addition, FIGS. 6(2) and 6(3) also show a processing device for processing a tape-shaped plate material.

本発明の実施形態2の製造方法により得られる積層板材構造体101は、図4のように、第1板材102の表面102cに別体からなる第2板材103を積層し、両板材102、103を半抜きダボ103aにより互いに結合して構成される。第2板材103の半抜きダボ103a箇所においては、第1板材102の所定箇所に穿孔された小孔102aに第2板材103に形成された半抜きダボ103aの突出部103bが圧入されている。
実施形態2の積層板材構造体101は、図4のように、半導体モジュールMの底面に配置されて半導体モジュールMの放熱板として使用される。実施形態2の積層板材構造体101は、第1板材と第2板材が積層されるので、厚く形成でき、半導体モジュールMの放熱性を良好とすることが可能となる。
As shown in FIG. 4, the laminated plate structure 101 obtained by the manufacturing method of Embodiment 2 of the present invention is obtained by laminating the second plate member 103 separately on the surface 102c of the first plate member 102, are connected to each other by a half-punched dowel 103a. At the half-blanked dowel 103a of the second plate member 103, the projecting portion 103b of the half-blanked dowel 103a formed on the second plate member 103 is press-fitted into a small hole 102a drilled at a predetermined location of the first plate member 102.
The laminated plate material structure 101 of Embodiment 2 is arranged on the bottom surface of the semiconductor module M and used as a heat sink for the semiconductor module M, as shown in FIG. Since the first plate material and the second plate material are laminated, the laminated plate material structure 101 of the second embodiment can be formed thickly, and the heat dissipation property of the semiconductor module M can be improved.

実施形態2の積層板材構造体101の製造方法は、実施形態1と同様のテープ状板材Wを用いて、図5のように、所定領域形成工程110、小孔穿孔工程120、第2板材積層工程130、半抜きダボ形成工程140、積層板材構造体分離工程150を、この順に行う。なお、小孔穿孔工程120では案内ダボ形成工程122を行う。
実施形態2の積層板材構造体101の製造方法に用いるテープ状板材Wは、実施形態1と同様の金属が使用される。テープ状板材Wは、図6(1)の搬送方向Pに沿って間欠搬送され、各搬送停止中に各工程が行われる。テープ状板材Wの幅方向の両端部には、搬送用のスプロケット穴Whが搬送方向Pに沿って等間隔に形成されている。
以下、各工程を詳細に説明する。
In the method of manufacturing the laminated plate material structure 101 of the second embodiment, the same tape-shaped plate material W as that of the first embodiment is used, and as shown in FIG. Step 130, half-blanked dowel forming step 140, and laminated plate material structure separating step 150 are performed in this order. In addition, in the small hole punching step 120, a guide dowel forming step 122 is performed.
The same metal as in the first embodiment is used for the tape-like plate material W used in the method for manufacturing the laminated plate material structure 101 of the second embodiment. The tape-shaped plate material W is intermittently transported along the transport direction P in FIG. 6(1), and each step is performed during each transport stop. Sprocket holes Wh for transport are formed at equal intervals along the transport direction P at both ends of the tape-shaped plate material W in the width direction.
Each step will be described in detail below.

[所定領域形成工程]
所定領域形成工程110は、テープ状板材Wに、積層板材構造体101を構成するための所定領域Waを形成する工程であり、実施形態1と同様に実施される。所定領域Waは、図6(1)の様に、片持ち片部分であり、テープ状板材Wに平面視コの字状の切り欠き部Wbを打ち抜きすることにより形成される。この切り欠き部Wbは、図6(2)の様に、上型11と下型12とによりテープ状板材Wをプレス抜きすることにより形成される。
[Predetermined Area Forming Step]
The predetermined region forming step 110 is a step of forming a predetermined region Wa for forming the laminated plate structure 101 in the tape-shaped plate material W, and is performed in the same manner as in the first embodiment. As shown in FIG. 6(1), the predetermined area Wa is a cantilever portion, and is formed by punching out a notch Wb having a U-shape in plan view in the tape-like plate material W. As shown in FIG. The notch portion Wb is formed by pressing the tape-shaped plate material W with an upper die 11 and a lower die 12, as shown in FIG. 6(2).

なお、次に述べる小孔穿孔工程120から後述する積層板材構造体分離工程150までにおいて、所定領域Waは、積層板材構造体分離工程150によりテープ状板材Wから分離された積層板材構造体101においては第1板材102となる。このため、以後、所定領域Waを第1板材102(Wa)と表記して説明する。 From the small hole punching step 120 to be described below to the laminated plate structure separation step 150 to be described later, the predetermined region Wa is formed in the laminated plate structure 101 separated from the tape-like plate W by the laminated plate structure separation step 150. becomes the first plate member 102 . For this reason, the predetermined area Wa will be referred to as the first plate member 102 (Wa) in the following description.

[小孔穿孔工程]
小孔穿孔工程120は、所定領域形成工程110で形成されたテープ状板材Wの第1板材102(Wa)に小孔102aを2か所(複数個所)穿孔する工程であり、実施形態1と同様に実施される。小孔102aは、図6(2)の様に、テープ状板材Wの上側に配置された小孔用パンチ21を、テープ状板材Wの表面Wjに押し当て、テープ状板材Wの下側に配置された小孔用ダイス22内まで降下することにより形成される。
小孔用パンチ21の先端の平面視径(外径)21dは、小孔用ダイス22の孔径22dよりクリアランス分だけ小径に形成されている。
[Small hole drilling process]
The small hole punching step 120 is a step of punching small holes 102a at two locations (multiple locations) in the first plate member 102 (Wa) of the tape-shaped plate member W formed in the predetermined area forming step 110. similarly implemented. As shown in FIG. 6(2), the small hole 102a is formed by pressing the small hole punch 21 arranged on the upper side of the tape-shaped plate material W against the surface Wj of the tape-shaped plate material W, and forming the small hole 102a on the lower side of the tape-shaped plate material W. It is formed by dropping into a small hole die 22 in place.
A planar view diameter (outer diameter) 21d of the tip of the small hole punch 21 is smaller than the hole diameter 22d of the small hole die 22 by the clearance.

また、小孔用パンチ21の先端の平面視径21dは、実施形態1と同様にテープ状板材Wの板厚Wtより小さい。なお、小孔用パンチ21の先端の平面視径21dは、テープ状板材Wの板厚Wtと同一、または、テープ状板材Wの板厚Wtより大きくてもよい。 Further, the planar view diameter 21d of the tip of the small hole punch 21 is smaller than the plate thickness Wt of the tape-like plate material W, as in the first embodiment. The planar view diameter 21d of the tip of the small hole punch 21 may be the same as the thickness Wt of the tape-shaped plate material W, or may be larger than the thickness Wt of the tape-shaped plate material W.

また、小孔穿孔工程120では、案内ダボ形成工程122も同時に実施される。小孔穿孔工程120においては、第1板材102(Wa)に小孔102aを形成すると同時に、図6(3)のように、第1板材102(Wa)の表面102c(Wj)から上向きに半抜き突出する案内ダボ102dを2か所(複数個所)形成する。この案内ダボ102dは、第1板材102(Wa)に積層される第2板材103の平面視位置を定める。
案内ダボ102dは、図6(3)のように、テープ状板材Wの下側に配置した案内ダボ用パンチ60をテープ状板材Wの裏面Weからテープ状板材Wの板厚の約半分に相当する高さだけ押し上げて形成される。このようにして案内ダボ102dが形成されると、第1板材102(Wa)の表面102c(Wj)から当該案内ダボ102dの突出部102daが突出する。この突出部102daが形成されると、突出部102daがテープ状板材Wの上側に配置した案内ダボ用ダイスのダイ孔61に挿入される。
Further, in the small hole drilling step 120, a guide dowel forming step 122 is also performed at the same time. In the small hole punching step 120, the small holes 102a are formed in the first plate member 102 (Wa), and at the same time, as shown in FIG. Two (plurality of) guide dowels 102d are formed to protrude. The guide dowel 102d determines the position of the second plate member 103 laminated on the first plate member 102 (Wa) in plan view.
As shown in FIG. 6C, the guide dowel 102d is formed by inserting the guide dowel punch 60 disposed below the tape-like plate W from the rear surface We of the tape-like plate W to about half the thickness of the tape-like plate W. It is formed by pushing up to the desired height. When the guide dowel 102d is formed in this manner, the projecting portion 102da of the guide dowel 102d protrudes from the surface 102c (Wj) of the first plate member 102 (Wa). After the projecting portion 102da is formed, the projecting portion 102da is inserted into the die hole 61 of the guide dowel die arranged on the upper side of the tape-shaped plate material W. As shown in FIG.

なお、所定領域形成工程110と小孔穿孔工程120とは、上記順に限定されるものではなく、前後に順を入れ換えてもよく、同時に実施してよい。また、小孔穿孔工程120においても、小孔102aの形成工程と案内ダボ102dの形成工程を別々の工程として実施してもよい。さらに、案内ダボ102dの形成工程を、所定領域形成工程110の前、または同時に行ってもよい。 Note that the predetermined region forming step 110 and the small hole punching step 120 are not limited to the order described above, and may be reversed in order or performed simultaneously. Also in the small hole punching step 120, the step of forming the small holes 102a and the step of forming the guide dowels 102d may be performed as separate steps. Furthermore, the step of forming the guide dowels 102d may be performed before or at the same time as the predetermined area forming step 110. FIG.

[第2板材積層工程]
第2板材積層工程130は、小孔穿孔工程120により小孔102aが穿孔され、且つ、案内ダボ102dが表面から突出形成された第1板材102(Wa)の表面102c(Wj)に、別途準備された第2板材103を積層する工程である。
第2板材103には、予め複数の案内孔103dが形成されている。第2板材103は、第1板材102(Wa)に積層される際に、第2板材103の案内孔103dが第1板材102(Wa)の案内ダボ102dに嵌合し、両者の平面視位置が定められる。
[Second plate laminating step]
In the second plate material stacking step 130, a small hole 102a is bored in the small hole punching step 120, and the surface 102c (Wj) of the first plate material 102 (Wa) formed with the guide dowel 102d projecting from the surface is separately prepared. This is a step of laminating the second plate material 103 that has been formed.
A plurality of guide holes 103d are formed in the second plate member 103 in advance. When the second plate member 103 is stacked on the first plate member 102 (Wa), the guide holes 103d of the second plate member 103 are fitted into the guide dowels 102d of the first plate member 102 (Wa), and the positions of the two in plan view are aligned. is determined.

第2板材103は、第1板材102(Wa)を構成するテープ状板材Wと同じ金属からなり、例えば、ステンレススチール(SUS304等)、黄銅、ベリリウム銅、アルミニウムなどの展性に富み、比較的高硬度の金属が使用される。第2板材103は、第1板材102(Wa)と異なる金属であってもよい。
また、第1板材102(Wa)の硬度は、第2板材103の硬度と同一若しくは第2板材103の硬度より高い。第1板材102(Wa)の硬度が第2板材103の硬度と同一若しくは第2板材103の硬度より高い場合には、後述する半抜きダボ形成工程140において、第2板材103に半抜きダボ103aを形成するにあたり、半抜き用パンチ41が第2板材103を押圧する際に、第1板材102(Wa)が押し潰されることがない。このため、第1板材102(Wa)がプレス金型のダイの機能を、小孔102aがダイ孔の機能を十分に発揮することが可能となり、半抜きダボ103aの突出部103bを小孔102a内に確実に圧入することができる。第1板材102(Wa)の硬度が第2板材103の硬度より高い組み合わせの具体例は、第1板材がステンレススチール(SUS304等)で第2板材がベリリウム銅、第1板材がベリリウム銅で第2板材が黄銅、第1板材が黄銅で第2板材がアルミニウムである。
なお、第1板材102(Wa)の硬度は、所定値以上であれば、第2板材103の硬度より低くてもよい。
The second plate material 103 is made of the same metal as the tape-shaped plate material W that constitutes the first plate material 102 (Wa). Metals with high hardness are used. The second plate member 103 may be a different metal from the first plate member 102 (Wa).
Further, the hardness of the first plate member 102 (Wa) is the same as or higher than the hardness of the second plate member 103 . When the hardness of the first plate member 102 (Wa) is the same as or higher than the hardness of the second plate member 103, half-blanked dowels 103a are formed on the second plate member 103 in a half-blanked dowel forming step 140, which will be described later. , the first plate member 102 (Wa) is not crushed when the half-punching punch 41 presses the second plate member 103 . For this reason, the first plate member 102 (Wa) can sufficiently exhibit the function of the die of the press die, and the small hole 102a can sufficiently exhibit the function of the die hole, and the protruding portion 103b of the half-blanked dowel 103a can be replaced by the small hole 102a. can be securely pressed into the A specific example of a combination in which the hardness of the first plate material 102 (Wa) is higher than the hardness of the second plate material 103 is as follows: the first plate material is stainless steel (SUS304 or the like); The second plate is brass, the first plate is brass and the second plate is aluminum.
Note that the hardness of the first plate member 102 (Wa) may be lower than the hardness of the second plate member 103 as long as it is equal to or greater than a predetermined value.

また、第1板材102(Wa)の板厚Wtは、第2板材103の板厚Wsと同一若しくは第2板材103の板厚Wsより厚い。
第1板材102(Wa)の板厚Wtが、第2板材103の板厚Wsと同一若しくは第2板材103の板厚Wsより厚い場合には、後述する半抜きダボ形成工程140において、第2板材103に半抜きダボ103aを形成するにあたり、半抜き用パンチ41が第2板材103を押圧する際に、第1板材102(Wa)が押し潰されることがない。このため、第1板材102(Wa)がプレス金型のダイの機能を、小孔102aがダイ孔の機能を十分に発揮することが可能となり、半抜きダボ103aの突出部103bを小孔102a内に確実に圧入することができる。
なお、第1板材102(Wa)の板厚は、第1板材102(Wa)の強度が所定値以上であれば、第2板材103の板厚Wsより薄くてもよい。
Also, the plate thickness Wt of the first plate member 102 (Wa) is the same as the plate thickness Ws of the second plate member 103 or thicker than the plate thickness Ws of the second plate member 103 .
When the plate thickness Wt of the first plate member 102 (Wa) is the same as or thicker than the plate thickness Ws of the second plate member 103, in the half-blanked dowel forming step 140 described later, the second plate member 102 (Wa) When the half-punching dowel 103a is formed on the plate 103, the first plate 102 (Wa) is not crushed when the half-punching punch 41 presses the second plate 103. For this reason, the first plate member 102 (Wa) can sufficiently exhibit the function of the die of the press die, and the small hole 102a can sufficiently exhibit the function of the die hole, and the protruding portion 103b of the half-blanked dowel 103a can be replaced by the small hole 102a. can be press-fitted inside.
The plate thickness of the first plate member 102 (Wa) may be thinner than the plate thickness Ws of the second plate member 103 as long as the strength of the first plate member 102 (Wa) is equal to or greater than a predetermined value.

[半抜きダボ形成工程]
第2板材103に対する半抜きダボ形成工程140は、第2板材積層工程130により第1板材102(Wa)の表面102c(Wj)に積層された第2板材103に半抜きダボ103aを形成し、この半抜きダボ103aにより第1板材102(Wa)と第2板材103とを互いに結合させる工程である。
半抜きダボ形成工程140は、実施形態1の半抜きダボ形成工程40に対し、第2板材3(Wc)に代えて第2板材103を用いた点が異なる。それ以外は、実施形態1の半抜きダボ形成工程40と同様である。
なお、実施形態2の半抜きダボ形成工程140では、第1板材102(Wa)とは別体の第2板材103を用いることから、半抜き用パンチ41、41を2か所(複数個所)配置する。この半抜き用パンチ41、41及び半抜きダボ103a、103aは、図6(1)に図示されているように、第1板材102(Wa)の案内ダボ102dと第2板材103の案内孔103dの平面視位置とは異なった平面視位置に配置されている。
[Half punch dowel forming process]
In the half-blanked dowel forming step 140 for the second plate material 103, the half-blanked dowel 103a is formed in the second plate material 103 laminated on the surface 102c (Wj) of the first plate material 102 (Wa) in the second plate laminating step 130, This is a step of joining the first plate member 102 (Wa) and the second plate member 103 with the half-punched dowels 103a.
The half-blanked dowel forming step 140 differs from the half-blanked dowel forming step 40 of the first embodiment in that the second plate member 103 is used instead of the second plate member 3 (Wc). The rest is the same as the half-blanked dowel formation step 40 of the first embodiment.
In the half-blanking dowel forming step 140 of the second embodiment, since the second plate member 103 separate from the first plate member 102 (Wa) is used, the half-blanking punches 41, 41 are provided at two locations (a plurality of locations). Deploy. The half-blanking punches 41, 41 and the half-blanking dowels 103a, 103a are, as shown in FIG. is arranged at a planar view position different from the planar view position of .

なお、半抜きダボ形成工程140において、半抜きダボ103aの突出部103bが第1板材102(Wa)の小孔102a内に圧入する際の圧入深さ103aa(図4参照。)は、小孔102aの内壁長(第1板材2(Wa)、即ちテープ状板材Wの板厚Wt)の0.2~0.8の範囲が好ましい。より好ましくは、小孔2aの内壁長Wtの0.4~0.6であり、さらにより好ましくは0.5である。 In the half-blanked dowel forming step 140, the press-fitting depth 103aa (see FIG. 4) when the projecting portion 103b of the half-blanked dowel 103a is press-fitted into the small hole 102a of the first plate member 102 (Wa) is The inner wall length of 102a (the thickness Wt of the first plate member 2 (Wa), ie, the tape-shaped plate member W) is preferably in the range of 0.2 to 0.8. More preferably, it is 0.4 to 0.6 of the inner wall length Wt of the small hole 2a, and still more preferably 0.5.

[積層板材構造体分離工程]
積層板材構造体分離工程150は、半抜きダボ形成工程140により、第1板材102(Wa)と第2板材103が互いに結合している積層構造体Wg(分離後は積層板材構造体101)を、テープ状板材Wから分離する工程である。
積層板材構造体分離工程150は、図6(2)に図示されているように、テープ状板材Wの上側に配置された積層板材構造体分離用上型51をテープ状板材Wの下側に配置された積層板材構造体分離用下型52に向けて降下し、積層構造体Wgがテープ状板材Wに接続している接続領域Wiを切断し、積層構造体Wgをテープ状板材Wから分離する工程である。この積層板材構造体分離工程150により、テープ状板材Wから分離された積層構造体Wgは、図4の積層板材構造体101である。
[Laminate plate material structure separation process]
In the laminated plate structure separating step 150, the laminated structure Wg (the laminated plate structure 101 after separation) in which the first plate member 102 (Wa) and the second plate member 103 are joined to each other by the half-blanking dowel forming step 140 is separated. , is a step of separating from the tape-shaped plate material W. FIG.
In the laminated plate structure separation step 150, as shown in FIG. 6(2), the laminated plate structure separating upper die 51 arranged above the tape-shaped plate W is placed under the tape-shaped plate W. It descends toward the disposed laminated plate material structure separating lower die 52, cuts the connection region Wi where the laminated structure Wg is connected to the tape-like plate material W, and separates the laminated structure Wg from the tape-like plate material W. It is a process to do. The laminated structure Wg separated from the tape-like plate material W by this laminated plate structure separation step 150 is the laminated plate structure 101 in FIG.

〔実施形態2の効果〕
実施形態2は、実施形態1の(イ)~(ヘ)、(チ)及び(リ)の効果を有するが、さらに次の効果も有する。
[Effect of Embodiment 2]
Embodiment 2 has the effects (a) to (f), (h) and (li) of embodiment 1, and also has the following effects.

(ヌ)実施形態2によれば、第1板材102(Wa)と第2板材103は別個の板材からなることから、両板材の材質、板厚、硬度、及び、熱処理等の処理状態等を用途に応じて任意に選択することが可能となる。さらに、第3板材を第2板材103に積層させて実施形態2の製造方法によって両板材同士を半抜きダボで結合すること、さらに、第4板材以降の板材を順次積層して、下層の板材と上層の板材とを実施形態2の製造方法により互いに結合することも容易となる。 (J) According to the second embodiment, since the first plate member 102 (Wa) and the second plate member 103 are made of separate plate members, the material, plate thickness, hardness, and treatment state such as heat treatment of both plate members are determined. Any selection can be made according to the application. Furthermore, the third plate material is laminated on the second plate material 103, and the two plate materials are joined together with half-punched dowels by the manufacturing method of the second embodiment. It also becomes easy to bond the upper layer plate material to each other by the manufacturing method of the second embodiment.

(ル)実施形態2によれば、第1板材102(Wa)の硬度が、第2板材103の硬度と同一若しくは第2板材103の硬度より高い場合には、半抜きダボ形成工程140において、半抜き用パンチ41が第2板材103を押圧する際に、第1板材102(Wa)が圧し潰されることがなく、第1板材102(Wa)がプレス金型のダイの機能を、第1板材102(Wa)の小孔102aがダイ孔の機能を十分に発揮することが可能となる。このため、半抜きダボ103aの突出部103bを小孔102a内に確実に圧入することができる。 (k) According to the second embodiment, when the hardness of the first plate member 102 (Wa) is the same as or higher than the hardness of the second plate member 103, in the half-blanked dowel forming step 140, When the half-punching punch 41 presses the second plate 103, the first plate 102 (Wa) is not crushed, and the first plate 102 (Wa) functions as a die of the press die. It becomes possible for the small holes 102a of the plate material 102 (Wa) to fully exhibit the function of the die holes. Therefore, the projecting portion 103b of the half-blanked dowel 103a can be reliably press-fitted into the small hole 102a.

(ヲ)実施形態2によれば、第1板材102(Wa)の板厚Wtが、第2板材103の板厚Wsと同一若しくは第2板材103の板厚Wsより厚い場合には、半抜きダボ形成工程140において、半抜き用パンチ41が第2板材103を押圧する際に、第1板材102(Wa)が圧し潰されることがなく、第1板材102(Wa)がプレス金型のダイの機能を、第1板材102(Wa)の小孔102aがダイ孔の機能を十分に発揮することが可能となる。このため、半抜きダボ103aの突出部103bを小孔102a内に確実に圧入することができる。 (l) According to the second embodiment, when the plate thickness Wt of the first plate member 102 (Wa) is the same as or thicker than the plate thickness Ws of the second plate member 103, the half-blanking is performed. In the dowel forming step 140, when the half-punching punch 41 presses the second plate 103, the first plate 102 (Wa) is not crushed, and the first plate 102 (Wa) is pressed against the die of the press die. It is possible for the small holes 102a of the first plate member 102 (Wa) to fully exhibit the function of a die hole. Therefore, the projecting portion 103b of the half-blanked dowel 103a can be reliably press-fitted into the small hole 102a.

(ワ)実施形態2によれば、(イ)、(ロ)、(ニ)~(ト)及び(ヌ)~(ヲ)に記載された積層板材構造体101に関する効果を有する積層板材構造体101を得ることが可能となる。 (i) According to the second embodiment, the laminated plate structure having the effects of the laminated plate structure 101 described in (a), (b), (d) to (g), and (j) to (wo). 101 can be obtained.

本発明は、各実施形態以外にも本発明の趣旨に反しない限り種々の変形形態を含むものであり、例えば次の様な変形例も含む。 The present invention includes various modifications other than each embodiment as long as they do not contradict the gist of the present invention. For example, the following modifications are also included.

〔変形例1〕
各実施形態の半抜きダボ形成工程40では、半抜き用パンチ41の先端の平面視形状及び平面視面積は、第1板材2(Wd)、102(Wa)に穿設される小孔2a、102aの平面視形状及び平面視面積と同一であった。
変形例1の半抜きダボ形成工程では、第2板材内に圧入する半抜き用パンチの先端の平面視領域は、第1板材に穿孔された小孔の平面視領域の内側に配置されている点で各実施形態と異なり、それ以外は、各実施形態と同様である。
[Modification 1]
In the half-blanking dowel forming step 40 of each embodiment, the plan view shape and plan view area of the tip of the half-blanking punch 41 are the small holes 2a formed in the first plate members 2 (Wd) and 102 (Wa), It was the same as the planar view shape and planar view area of 102a.
In the half-blanking dowel forming step of Modification 1, the planar view area of the tip of the half-blanking punch press-fitted into the second plate material is arranged inside the planar view area of the small hole punched in the first plate material. It is different from each embodiment in that respect, and is otherwise the same as each embodiment.

図7は、変形例1における半抜きダボ形成工程40を説明する説明図であり、実施形態1に相当する第1板材2(Wd)に第2板材3(Wc)が積層された状態で、半抜きダボ形成工程40が行われ、第2板材3(Wc)の表面3c(We)に半抜き用パンチ41が圧入した状態を表している。図7において、半抜き用パンチ41及び第1板材2(Wd)の小孔2aの平面視形状は真円で、半抜き用パンチ41の外径41dは小孔2aの内径2adよりも小さい。なお、半抜き用パンチ41及び小孔2aの平面視形状は、真円以外のどのような形状でもよく、例えば、多角形、楕円形でもよい。半抜き用パンチ41及び小孔2aの平面視形状がどのような形状であるにしても、第2板材3(Wc)内に圧入する半抜き用パンチ41の先端の平面視領域は、第1板材2(Wd)の小孔2aの平面視領域の内側に配置されている。 FIG. 7 is an explanatory diagram for explaining the half-blanked dowel forming step 40 in the first modification. A half-blanking dowel forming step 40 is performed, and a half-blanking punch 41 is pressed into the surface 3c (We) of the second plate 3 (Wc). In FIG. 7, the half-blanking punch 41 and the small hole 2a of the first plate 2 (Wd) are perfectly circular in plan view, and the outer diameter 41d of the half-blanking punch 41 is smaller than the inner diameter 2ad of the small hole 2a. In addition, the plan view shape of the punch 41 for half-blanking and the small hole 2a may be any shape other than a perfect circle, and may be, for example, a polygonal shape or an elliptical shape. Regardless of the shape of the half-punching punch 41 and the small hole 2a in plan view, the area of the tip of the half-punching punch 41 press-fitted into the second plate 3 (Wc) is the first It is arranged inside the planar view area of the small hole 2a of the plate member 2 (Wd).

変形例1によれば、第2板材3(Wc)の表面3c(We)内に圧入する半抜き用パンチ41の先端の平面視領域は、第1板材2(Wd)に穿孔された小孔2aの平面視領域の内側に配置されている。このため、半抜き用パンチ41は、小孔2aの平面視領域の内側に相当する第2板材3(Wc)の領域を小孔2a内に容易に圧入する(押し出す)ことができる。このため、半抜きダボ3aの突出部3bを板厚方向に長く形成でき、突出部3bと小孔2aの内壁(板厚方向)との接触長さを長く確保することができ、第1板材2(Wd)と第2板材3(Wc)の結合力をより高めることが可能となる。
なお、変形例1の半抜きダボ3aは、第2板材3(Wc)における小孔2a相当領域が半抜きパンチ41により押し出されて形成される。このため、半抜きダボ3aの外周壁は、剪断面及び破断面が殆ど見られず押し出し面が形成される。
According to Modification 1, the planar view area of the tip of the half-punching punch 41 that is press-fitted into the surface 3c (We) of the second plate 3 (Wc) is a small hole drilled in the first plate 2 (Wd). It is arranged inside the planar view area of 2a. Therefore, the half-punching punch 41 can easily press-fit (extrude) the area of the second plate member 3 (Wc) corresponding to the inner side of the planar view area of the small hole 2a into the small hole 2a. Therefore, the protruding portion 3b of the half-blanked dowel 3a can be formed long in the plate thickness direction, and a long contact length between the protruding portion 3b and the inner wall (in the plate thickness direction) of the small hole 2a can be ensured. 2 (Wd) and the second plate member 3 (Wc) can be further enhanced.
The half-punched dowels 3a of Modification 1 are formed by pushing out the areas corresponding to the small holes 2a in the second plate 3 (Wc) with the half-punched punch 41. As shown in FIG. For this reason, the outer peripheral wall of the half-punched dowel 3a forms an extruded surface with almost no sheared surface or broken surface.

なお、変形例1における半抜きダボ形成工程40は、実施形態1の第1板材2(Wd)に第2板材3(Wc)が積層された状態で半抜きダボ形成工程40が行われる場合に限定されるものではなく、実施形態2の第1板材102(Wa)に第2板材103が積層された状態で半抜きダボ形成工程140が行われる場合にも適用され、変形例1の場合と同様の効果を有する。 The half-blanked dowel forming step 40 in Modification 1 is performed when the half-blanked dowel forming step 40 is performed in a state in which the second plate 3 (Wc) is laminated on the first plate 2 (Wd) of the first embodiment. The present invention is not limited to this, but can be applied to the case where the half-blanked dowel forming step 140 is performed in a state in which the second plate member 103 is laminated on the first plate member 102 (Wa) of the second embodiment. have a similar effect.

〔変形例2〕
各実施形態の半抜きダボ形成工程40、140では、半抜き用パンチ41の先端の平面視形状及び平面視面積は、第1板材2(Wd)、102(Wa)に穿設される小孔2a、102aの平面視形状及び平面視面積と同一であった。変形例1の半抜きダボ形成工程では、第2板材3(Wc)内に圧入する半抜き用パンチ41の先端の平面視領域は、第1板材2(Wd)に穿孔された小孔2aの平面視領域の内側に配置されるものであった。
変形例2の半抜きダボ形成工程では、第2板材内に圧入する半抜き用パンチの先端の平面視領域は、第1板材に穿孔された小孔の平面視領域の外側まで存在している点で各実施形態及び変形例1と異なり、それ以外は、各実施形態及び変形例1と同様である。
[Modification 2]
In the half-blanking dowel forming steps 40 and 140 of each embodiment, the plan view shape and plan view area of the tip of the half-blanking punch 41 correspond to the small holes drilled in the first plate members 2 (Wd) and 102 (Wa). 2a and 102a in plan view and the same plan view area. In the half-blanking dowel forming step of Modification 1, the planar view region of the tip of the half-blanking punch 41 press-fitted into the second plate 3 (Wc) is the small hole 2a drilled in the first plate 2 (Wd). It was arranged inside the planar view area.
In the half-blanking dowel forming process of Modified Example 2, the planar view area of the tip of the half-blanking punch press-fitted into the second plate extends outside the planar view area of the small hole punched in the first plate. It is different from each embodiment and Modification 1 in one point, and is otherwise the same as each embodiment and Modification 1.

図8は、変形例2における半抜きダボ形成工程40を説明する説明図であり、実施形態1に相当する第1板材2(Wd)に第2板材3(Wc)が積層された状態で、半抜きダボ形成工程40が行われ、第2板材3(Wc)の表面3c(We)に半抜き用パンチ41が圧入する状態を表している。図8において、半抜き用パンチ41及び第1板材2(Wd)の小孔2aの平面視形状は真円で、半抜き用パンチ41の外径41dは小孔2aの内径2adよりも大きい。なお、半抜き用パンチ41及びの小孔2aの平面視形状は、真円以外のどのような形状でもよく、例えば、多角形、楕円形でもよい。半抜き用パンチ41及びの小孔2aの平面視形状がどのような形状であるにしても、第2板材3(Wc)内に圧入する半抜き用パンチ41の先端の平面視領域(少なくともその一部)は、第1板材2(Wd)の小孔2aの平面視領域の外側に配置されている。 FIG. 8 is an explanatory diagram for explaining the half-blanked dowel forming step 40 in Modification 2. In a state in which the second plate 3 (Wc) is laminated on the first plate 2 (Wd) corresponding to Embodiment 1, A half-blanking dowel forming step 40 is performed, and a half-blanking punch 41 is pressed into the surface 3c (We) of the second plate 3 (Wc). In FIG. 8, the half-blanking punch 41 and the small hole 2a of the first plate 2 (Wd) are perfectly circular in plan view, and the outer diameter 41d of the half-blanking punch 41 is larger than the inner diameter 2ad of the small hole 2a. The shape of the half-blanking punch 41 and the small hole 2a in plan view may be any shape other than a perfect circle, such as a polygonal shape or an elliptical shape. Regardless of the shape of the half-punching punch 41 and the small hole 2a in plan view, the top end of the half-punching punch 41 press-fitted into the second plate 3 (Wc) (at least the part) is arranged outside the planar view area of the small hole 2a of the first plate member 2 (Wd).

変形例2によれば、第2板材3(Wc)の表面3c(We)内に圧入する半抜き用パンチ41の先端の平面視領域は、第1板材2(Wd)に穿孔された小孔2aの平面視領域の外側まで存在している。このため、半抜き用パンチ41は、小孔2aの平面視領域の外側に相当する第2板材3(Wc)の領域を押圧して突出部3bを強制的に形成し、この突出部3bを強力に小孔2a内に圧入する(押し出す)こととなる。このため、第1板材2(Wd)と第2板材3(Wc)の結合力をより高めることが可能となる。
なお、変形例2の半抜きダボ3aは、第2板材3(Wc)における小孔2a相当領域が半抜きパンチ41により押し出されて形成される。このため、半抜きダボ3aの外周壁は、剪断面及び破断面が殆ど見られず押し出し面が形成される。
According to Modification 2, the planar view area of the tip of the half-punching punch 41 that is press-fitted into the surface 3c (We) of the second plate 3 (Wc) is a small hole drilled in the first plate 2 (Wd). It exists up to the outside of the planar view area of 2a. Therefore, the half-punching punch 41 presses the area of the second plate 3 (Wc) corresponding to the outside of the area of the small hole 2a in plan view to forcibly form the projecting portion 3b. It is forced into (pushed out) into the small hole 2a. Therefore, it is possible to further increase the bonding strength between the first plate member 2 (Wd) and the second plate member 3 (Wc).
The half-punched dowels 3 a of Modification 2 are formed by pushing out the areas corresponding to the small holes 2 a in the second plate 3 (Wc) by the half-punched punch 41 . For this reason, the outer peripheral wall of the half-punched dowel 3a forms an extruded surface with almost no sheared surface or broken surface.

なお、変形例2における半抜きダボ形成工程40は、実施形態1の第1板材2(Wd)に第2板材3(Wc)が積層された状態で半抜きダボ形成工程40が行われる場合に限定されるものではなく、実施形態2の第1板材102(Wa)に第2板材103が積層された状態で半抜きダボ形成工程140が行われる場合にも適用され、前述した変形例2と同様の効果を有する。 The half-blanked dowel forming step 40 in Modification 2 is performed when the half-blanked dowel forming step 40 is performed in a state in which the second plate 3 (Wc) is laminated on the first plate 2 (Wd) of the first embodiment. The present invention is not limited to this, but can be applied to the case where the half-blanked dowel forming step 140 is performed in a state in which the second plate member 103 is laminated on the first plate member 102 (Wa) of the second embodiment, and is similar to the modification 2 described above. have a similar effect.

〔変形例3〕
図9は、変形例3における半抜きダボ形成工程40を説明する説明図である。
変形例3の半抜きダボ形成工程40は、各実施形態及び各変形例の第1板材2(Wd)、102(Wa)の小孔2a、102aの裏面2e、102e(We)側に半抜きダボ受70を挿入配置した状態で半抜きダボ3a、103aを形成する点で、各実施形態及び各変形例と異なる。その他の点では、各実施形態及び各変形例と同様である。
[Modification 3]
FIG. 9 is an explanatory diagram for explaining the half-blanked dowel forming step 40 in Modification 3. As shown in FIG.
In the half-blanked dowel forming step 40 of Modification 3, half-blanking is performed on the back surfaces 2e and 102e (We) of the small holes 2a and 102a of the first plate members 2 (Wd) and 102 (Wa) of each embodiment and each modification. It differs from each embodiment and each modification in that the half-blanked dowels 3a and 103a are formed with the dowel receivers 70 inserted therein. Other points are the same as each embodiment and each modification.

図9のように、変形例3の半抜きダボ形成工程40では、第1板材2(Wd)の裏面2e(We)側から小孔2aの内部に半抜きダボ受70を挿入配置した上で半抜き用パンチ41を第2板材3(Wc)の表面3c(We)内に圧入する。このため、半抜きダボ3aは半抜き用パンチ41と半抜きダボ受70とにより第1板材2(Wd)の板厚方向mに圧縮される。この圧縮の反作用として半抜きダボ3aは径方向に拡張しようとするため、半抜きダボ3aと第1板材2(Wd)の小孔2aの内壁との接触力、及び、半抜きダボ3aと第2板材3(Wc)の半抜きダボ3aの形成内壁との接触力が高まる。このため、半抜きダボ3aにより、第1板材2(Wd)と第2板材3(Wc)との結合はより強固となる。
なお、第1板材2(Wd)の裏面2e(We)とは、第1板材2(Wd)において第2板材3(Wc)が積層する側である表面2c(Wj)に対して反対側の面を指す。
As shown in FIG. 9, in the half-blanked dowel forming step 40 of Modified Example 3, a half-blanked dowel holder 70 is inserted into the small hole 2a from the back surface 2e (We) side of the first plate 2 (Wd), and then A half blanking punch 41 is pressed into the surface 3c (We) of the second plate 3 (Wc). Therefore, the half-blanking dowel 3a is compressed in the plate thickness direction m of the first plate 2 (Wd) by the half-blanking punch 41 and the half-blanking dowel receiver 70 . As a reaction to this compression, the half-blanked dowels 3a try to expand in the radial direction. 2. Formation of the half-blanked dowel 3a of the plate material 3 (Wc) increases the contact force with the inner wall. Therefore, the half-blanked dowels 3a strengthen the connection between the first plate member 2 (Wd) and the second plate member 3 (Wc).
The back surface 2e (We) of the first plate member 2 (Wd) is the opposite side of the front surface 2c (Wj) on which the second plate member 3 (Wc) is laminated in the first plate member 2 (Wd). point to the face

また、半抜き用パンチ41が第2板材3(Wc)の表面3c(We)内に圧入している際に、半抜きダボ受70は、小孔2a内の所定位置で停止して半抜きダボ受70の先端面が半抜きダボ3aの下端面を受けていてもよく、或は、小孔2a内で半抜きダボ受70の先端面が半抜きダボ3aの下端面を第2板材3(Wc)側(図9の上側)に押圧し続けていてもよい。半抜きダボ3aの形成が終了した段階(半抜き用パンチ41による第2板材3(Wc)の表面3c(We)内への圧入の停止状態、及び、半抜きダボ受70による上側押圧の停止状態)では、半抜きダボ高さlは、第2板材3(Wc)の板厚Wsより小さい。 Further, when the half-blanking punch 41 is press-fitted into the surface 3c (We) of the second plate 3 (Wc), the half-blanking dowel holder 70 stops at a predetermined position in the small hole 2a and is half-blanked. The tip surface of the half-blanked dowel 3a may be received by the tip surface of the half-blanket dowel 3a. You may continue pressing to the (Wc) side (upper side of FIG. 9). When the formation of the half-blanking dowels 3a is completed (the half-blanking punch 41 stops press-fitting into the surface 3c (We) of the second plate 3 (Wc), and the half-blanking dowel receiver 70 stops pressing the upper side. state), the half-blanked dowel height l is smaller than the plate thickness Ws of the second plate 3 (Wc).

なお、半抜きダボ受70は、変形例1(図7)、変形例2(図8)、及び、後述の変形例4(図10)においては、第1板材2(Wd)の裏面2e(We)側から小孔2a内に挿入配置し、実施形態2においては第1板材102(Wa)の裏面102e(We)側から小孔102a内に挿入配置する。 It should be noted that the half-blanked dowel support 70 is the back surface 2e ( It is inserted into the small hole 2a from the We) side, and in the second embodiment, it is inserted into the small hole 102a from the rear surface 102e (We) side of the first plate member 102 (Wa).

〔変形例4〕
図10は、変形例4における半抜きダボ形成工程40を説明する説明図である。
変形例4の半抜きダボ形成工程40は、実施形態1の第1板材2(Wd)に穿孔される小孔2aの内壁が、小孔2aにおける裏面側孔幅寸法2afが表面側孔幅寸法2aeより大きくなるように逆テーパ面2fに形成されている状態で行われる点で、実施形態1及び変形例1~変形例3と異なる。その他の点では、実施形態1及び変形例1~変形例3と同様である。
[Modification 4]
10A and 10B are explanatory diagrams for explaining the half-blanked dowel forming step 40 in Modification 4. FIG.
In the half-blanked dowel formation step 40 of Modification 4, the inner wall of the small hole 2a drilled in the first plate 2 (Wd) of Embodiment 1 is such that the back side hole width 2af of the small hole 2a is the front side hole width. It differs from Embodiment 1 and Modifications 1 to 3 in that it is formed in a state in which the reverse tapered surface 2f is formed to be larger than 2ae. Other points are the same as those of the first embodiment and the first to third modifications.

第1板材2(Wd)の小孔2aの内壁は、図10に図示されているように、小孔穿孔工程20において、小孔2aにおける裏面側孔幅寸法2afが表面側孔幅寸法2aeより大きくなるように逆テーパ面2fに形成される。この逆テーパ面2fは、第1板材2(Wd)の表面2c(Wj)から裏面2e(We)に向けて所定角度θを有する。
なお、第1板材2(Wd)の裏面2e(We)とは、第1板材2(Wd)において第2板材3(Wc)が積層する側である表面2c(Wj)に対して反対側の面を指す。
また、小孔2aの内壁の逆テーパ面2fは、直線状でもよく、階段状でもよく、第1板材2(Wd)の表面2c(Wj)から裏面2e(We)に向けて小孔2aの幅寸法が大きく形成されればどのような面形状でもよい。また、逆テーパ面2fは、小孔2aの外周全域に設けてもよく、あるいは、小孔2aの外周の一部に設けてもよい。なお、図10図では、半抜き用パンチ41の外径41dは、小孔2aの表面側孔幅寸法2aeと同径である。
As shown in FIG. 10, the inner wall of the small hole 2a of the first plate 2 (Wd) is formed such that, in the small hole punching step 20, the rear surface side hole width 2af of the small hole 2a is larger than the front side hole width 2ae. It is formed on the reverse tapered surface 2f so as to be large. This reverse tapered surface 2f has a predetermined angle θ from the front surface 2c (Wj) of the first plate member 2 (Wd) toward the rear surface 2e (We).
The back surface 2e (We) of the first plate member 2 (Wd) is the opposite side of the front surface 2c (Wj) on which the second plate member 3 (Wc) is laminated in the first plate member 2 (Wd). point to the face
In addition, the reverse tapered surface 2f of the inner wall of the small hole 2a may be linear or stepped, and the small hole 2a is tapered from the front surface 2c (Wj) of the first plate member 2 (Wd) toward the rear surface 2e (We). Any surface shape may be used as long as the width dimension is formed large. Also, the reverse tapered surface 2f may be provided on the entire outer circumference of the small hole 2a, or may be provided on a part of the outer circumference of the small hole 2a. In FIG. 10, the outer diameter 41d of the half-blanking punch 41 is the same diameter as the surface-side hole width dimension 2ae of the small hole 2a.

第1板材2(Wd)の小孔2aの内壁において、第1板材2(Wd)の表面2c(Wj)から裏面2e(We)にかけて逆テーパ面2fを形成するには、まず、実施形態1と同様に小孔用パンチ21(図3(2)参照。)を用いて第1板材2(Wd)に小孔2aを穿孔する。次に、先端側側面がテーパ面に形成された逆テーパ面形成用パンチ(図示せず。)を第1板材2(Wd)の裏面2e(We)側から小孔2a内に圧入し、逆テーパ面形成用パンチの先端側のテーパ面が小孔2aの内壁を押し付けることにより、小孔2aの内壁に逆テーパ面2fを形成する。
なお、小孔2aの内壁に逆テーパ面2fを形成する方法は、上記以外であってもよい。例えば、第1板材の裏面側から逆テーパ面形成用ドリルを挿入する、あるいは、第1板材の裏面側からレーザ光線を照射する、または、第1板材の裏面側から腐食液を晒すことにより、小孔の内壁に逆テーパ面を形成してもよい。
In order to form the reverse tapered surface 2f from the front surface 2c (Wj) to the back surface 2e (We) of the first plate member 2 (Wd) on the inner wall of the small hole 2a of the first plate member 2 (Wd), first, the first embodiment is performed. Similarly, a small hole 2a is punched in the first plate member 2 (Wd) using a small hole punch 21 (see FIG. 3(2)). Next, a reverse tapered surface forming punch (not shown) having a tapered surface on the tip side surface is press-fitted into the small hole 2a from the back surface 2e (We) of the first plate 2 (Wd). A tapered surface on the tip side of the tapered surface forming punch presses against the inner wall of the small hole 2a to form a reverse tapered surface 2f on the inner wall of the small hole 2a.
The method of forming the reverse tapered surface 2f on the inner wall of the small hole 2a may be other than the method described above. For example, by inserting a drill for forming a reverse tapered surface from the back side of the first plate, irradiating a laser beam from the back side of the first plate, or exposing the corrosive liquid from the back side of the first plate, A reverse tapered surface may be formed on the inner wall of the small hole.

変形例4によれば、半抜きダボ形成工程40において、半抜き用パンチ41が第2板材3(Wc)の表面3c(We)を押圧すると、半抜きダボ3aが形成され、その突出部3bが小孔2a内に突出する。この突出部3bは、半抜き用パンチ41により押圧され圧縮された状態で小孔2a内に突出するため、小孔2aの内壁の逆テーパ面2fに沿って拡張する。したがって、突出部3bは、小孔2aの逆テーパ面2fにロックされ、確実に保持されることとなる。このため、第2板材3(Wc)は、第1板材2(Wd)により強固に結合される。 According to Modified Example 4, in the half-blanking dowel forming step 40, when the half-blanking punch 41 presses the surface 3c (We) of the second plate 3 (Wc), the half-blanking dowel 3a is formed, and the projecting portion 3b thereof is formed. protrudes into the small hole 2a. The protruding portion 3b protrudes into the small hole 2a while being pressed and compressed by the half-punching punch 41, and thus expands along the reverse tapered surface 2f of the inner wall of the small hole 2a. Therefore, the projecting portion 3b is locked to the reverse tapered surface 2f of the small hole 2a and is securely held. Therefore, the second plate member 3 (Wc) is strongly bonded to the first plate member 2 (Wd).

なお、変形例4における半抜きダボ形成工程40は、実施形態1及び変形例1~変形例3の第1板材2(Wd)に第2板材3(Wc)が積層された状態で半抜きダボ形成工程40を行う場合に限定されるものではなく、実施形態2の第1板材102(Wa)に第2板材103が積層された状態で半抜きダボ形成工程140を行う場合にも適用可能であり、前述した変形例4と同様の効果を有する。
また、変形例4における半抜きダボ形成工程40は、変形例3の半抜きダボ形成工程40と併用してもよい。具体的には、半抜きダボ形成工程40では、図9のように第1板材2(Wd)の裏面2e(We)側から小孔2aの内部に半抜きダボ受70を挿入配置し、半抜きダボ受70の上面を図10の半抜きダボ3aの底面よりやや上方(半抜き用パンチ41の配置方向)の所定位置に配置した上で半抜き用パンチ41を第2板材3(Wc)の表面3c(We)内に圧入する。この場合は、変形例3の効果と変形例4の効果をもたらす。
In the half-blanked dowel forming step 40 in Modification 4, the half-blanked dowels are formed in a state in which the second plate 3 (Wc) is laminated on the first plate 2 (Wd) of Embodiment 1 and Modifications 1 to 3. It is not limited to the case where the formation step 40 is performed, but can be applied to the case where the half-blanked dowel formation step 140 is performed in a state in which the second plate member 103 is laminated on the first plate member 102 (Wa) of the second embodiment. There is, and it has the same effect as modification 4 mentioned above.
Further, the half-blanked dowel forming step 40 in Modified Example 4 may be used together with the half-blanked dowel forming step 40 in Modified Example 3. Specifically, in the half-blanked dowel forming step 40, as shown in FIG. After the top surface of the blanking dowel holder 70 is placed at a predetermined position slightly above the bottom surface of the half blanking dowel 3a in FIG. is press-fitted into the surface 3c (We) of the . In this case, the effects of Modification 3 and Modification 4 are obtained.

〔変形例5〕
図11は、変形例5における半抜きダボ形成工程40を説明する説明図である。
実施形態1の半抜きダボ形成工程40は、第1板材2(Wd)に第2板材3(Wc)を積層した状態で半抜きダボ工程40を行っている。
変形例5の半抜きダボ形成工程は、実施形態1の半抜きダボ工程40を行った後、第2板材3(Wc)の先端を180°折り曲げ、この折り曲げた部分である第3板材4(Wc)を第2板材3(Wc)の表面に積層させ、第3板材4(Wc)に第2回半抜きダボ形成工程42を行うものである。
[Modification 5]
11A and 11B are explanatory diagrams for explaining the half-blanked dowel forming step 40 in Modification 5. FIG.
In the half-blanked dowel forming step 40 of Embodiment 1, the half-blanked dowel step 40 is performed in a state in which the second plate member 3 (Wc) is laminated on the first plate member 2 (Wd).
In the half-blanked dowel forming step of Modification 5, after performing the half-blanked dowel step 40 of Embodiment 1, the tip of the second plate 3 (Wc) is bent 180°, and the bent portion, the third plate 4 ( Wc) is laminated on the surface of the second plate member 3 (Wc), and the second half-blanking dowel forming step 42 is performed on the third plate member 4 (Wc).

図11には、第1板材2(Wd)と第2板材3(Wc)とが、実施形態1の半抜きダボ形成工程40によって形成された半抜きダボ3aにより互いに結合されている状態が示されている。
第2回半抜きダボ形成工程42では、第2板材3(Wc)において予め小孔3fが穿孔された平面視位置に対応する第3板材4(Wc)の表面位置で半抜き用パンチ41を第3板材4(Wc)の表面4c(Wc)内に圧入して半抜きダボ4aを形成し、第3板材4(Wc)の裏面から突出する半抜きダボ4aの突出部4bを第2板材3(Wc)の小孔3f内に圧入し、第2板材3(Wc)と第3板材4(Wc)を互いに結合させる。
FIG. 11 shows a state in which the first plate member 2 (Wd) and the second plate member 3 (Wc) are joined together by the half-blanked dowels 3a formed by the half-blanked dowel forming step 40 of the first embodiment. It is
In the second half-blanking dowel forming step 42, a half-blanking punch 41 is applied at a surface position of the third plate 4 (Wc) corresponding to a position in plan view where the small hole 3f is previously bored in the second plate 3 (Wc). A half-blanked dowel 4a is formed by press-fitting into the surface 4c (Wc) of the third plate 4 (Wc), and the protruding portion 4b of the half-blanked dowel 4a protruding from the back surface of the third plate 4 (Wc) is attached to the second plate. The second plate member 3 (Wc) and the third plate member 4 (Wc) are joined together by press-fitting into the small hole 3f of 3 (Wc).

なお、第2板材3(Wc)に予め小孔3fを穿孔するタイミングは、実施形態1の小孔穿孔工程20とするが、穿孔可能な時期ならば、当該小孔穿孔工程20以外のタイミングでもよい。
また、第2板材3(Wc)の小孔3fと第3板材4(Wc)の半抜きダボ4aの平面視位置は、第1板材2(Wd)の小孔2aと第2板材3(Wc)の半抜きダボ3aの平面視位置とは、異なる位置に設定する。
The timing for drilling the small holes 3f in advance in the second plate member 3 (Wc) is the small hole punching step 20 of the first embodiment, but if it is possible to punch, the timing other than the small hole punching step 20 can be used. good.
Further, the positions of the small hole 3f of the second plate member 3 (Wc) and the half-blanked dowel 4a of the third plate member 4 (Wc) in a plan view are the same as the small hole 2a of the first plate member 2 (Wd) and the second plate member 3 (Wc) ) is set at a position different from the plan view position of the half-blanked dowel 3a.

なお、変形例5において、第2板材3(Wc)が実施形態1の第1板材2(Wd)に相当し、第3板材4(Wc)が実施形態1の第2板材3(Wc)に相当することから、実施形態1の半抜きダボ形成工程40を2回実施すると見なすことができる。また、第3板材4(Wc)の表面側に第4板材を積層させ、第4板材に第3回半抜きダボ形成工程を実施してもよく、同様に第4回以降の半抜きダボ形成工程を繰り返してもよい。 In Modification 5, the second plate 3 (Wc) corresponds to the first plate 2 (Wd) of Embodiment 1, and the third plate 4 (Wc) corresponds to the second plate 3 (Wc) of Embodiment 1. Since it corresponds, it can be considered that the half-blanked dowel forming step 40 of Embodiment 1 is performed twice. Alternatively, a fourth plate member may be laminated on the surface side of the third plate member 4 (Wc), and the fourth plate member may be subjected to the third half-blanking dowel forming process. The steps may be repeated.

変形例5によれば、積層される板材を増やすことができ、積層板材構造体401の厚さを厚く構成することが可能となる。このため、例えば、積層板材構造体を半導体モジュールMの放熱板に使用する場合には、放熱性能をより高めることが可能となる。
また、第3板材以降の板材を次々に積層しても、各板材間は折り曲げ部により一体化しているため、半抜きダボによる互いの板材の結合力を著しく高める必要がない。このため、半抜きダボの形成箇所を少なくすることが可能となり、低コストで積層板材構造体を製造することができる。
According to Modification 5, the number of laminated plate members can be increased, and the thickness of the laminated plate member structure 401 can be increased. Therefore, for example, when the laminated plate material structure is used for the heat sink of the semiconductor module M, the heat dissipation performance can be further improved.
Also, even if the third and subsequent plate members are stacked one after another, since the plate members are integrated by the bent portions, there is no need to remarkably increase the binding force between the plate members by the half-blanked dowels. Therefore, it is possible to reduce the number of locations where the half-blanked dowels are formed, and to manufacture the laminated plate material structure at low cost.

〔変形例6〕
図12は、変形例6における半抜きダボ形成工程40を説明する説明図である。
実施形態2の半抜きダボ形成工程40は、第1板材102(Wa)に第2板材103を積層した状態で半抜きダボ工程40を行っている。
変形例6の半抜きダボ形成工程は、実施形態2の半抜きダボ工程40を行った後、第2板材103の表面に第3板材104を積層させ、第3板材104に第2回半抜きダボ形成工程42を行うものである。
[Modification 6]
12A and 12B are explanatory diagrams for explaining the half-blanked dowel forming step 40 in Modification 6. FIG.
In the half-blanked dowel forming step 40 of the second embodiment, the half-blanked dowel step 40 is performed while the second plate member 103 is laminated on the first plate member 102 (Wa).
In the half-blanked dowel forming step of Modification Example 6, after performing the half-blanked dowel step 40 of Embodiment 2, the third plate member 104 is laminated on the surface of the second plate member 103, and the third plate member 104 is subjected to the second half-blanking. A dowel forming step 42 is performed.

図12には、第1板材102(Wa)と第2板材103とが、実施形態2の半抜きダボ形成工程40によって形成された半抜きダボ103aにより互いに結合されている状態が示されている。
第2回半抜きダボ形成工程42では、第2板材103に予め穿孔された小孔103fの平面視位置に対応する第3板材104の表面位置で半抜き用パンチ41を第3板材104の表面104c内に圧入して半抜きダボ104aを形成し、第3板材104の裏面から突出する半抜きダボ104aの突出部104bを第2板材103の小孔103f内に圧入し、第2板材103と第3板材104を互いに結合させる。
FIG. 12 shows a state in which the first plate member 102 (Wa) and the second plate member 103 are joined together by the half-blanked dowels 103a formed by the half-blanked dowel forming step 40 of the second embodiment. .
In the second half-blanking dowel forming step 42, the half-blanking punch 41 is applied to the surface of the third plate member 104 at a surface position corresponding to the position of the small hole 103f pre-drilled in the second plate member 103 in plan view. 104c to form a half-blanked dowel 104a, and the projecting portion 104b of the half-blanked dowel 104a protruding from the back surface of the third plate member 104 is press-fitted into the small hole 103f of the second plate member 103, and the second plate member 103 and the second plate member 103 are formed. The third plate members 104 are combined with each other.

なお、第2板材103に予め小孔103fを穿孔するタイミングは、実施形態2の小孔穿孔工程20とするが、穿孔可能な時期ならば、当該小孔穿孔工程20以外のタイミングでもよい。
また、第2板材103の小孔103fと第3板材104の半抜きダボ104aの平面視位置は、第1板材102(Wa)の小孔102aと第2板材103の半抜きダボ103aの平面視位置とは、異なる位置である。
第1板材102(Wa)と第2板材103との平面視位置の位置合わせは、実施形態2のように第1板材102(Wa)に形成した案内ダボ102dを第2板材103の案内孔103dに挿入して行う(図3(3)参照。)。また、第2板材103と第3板材104との平面視位置の位置合わせは、第2板材103に予め形成した案内ダボを第3板材104に予め穿孔した案内孔に挿入して行う(図示せず。)。なお、各板材同士の平面視位置の位置合わせは、それ以外の位置合わせ構造であってもよく、例えば、基台に設置した案内ピンに、各板材に形成した案内孔を挿入してもよい。
The timing for drilling the small holes 103f in advance in the second plate member 103 is the small hole punching step 20 of the second embodiment, but the timing other than the small hole punching step 20 may be used as long as it is possible to punch holes.
Further, the planar view positions of the small hole 103f of the second plate member 103 and the half-blanked dowel 104a of the third plate member 104 are A position is a different position.
Alignment of the planar view positions of the first plate member 102 (Wa) and the second plate member 103 is performed by inserting the guide dowels 102d formed in the first plate member 102 (Wa) into the guide holes 103d of the second plate member 103 as in the second embodiment. (See FIG. 3 (3).). Alignment of the planar view positions of the second plate member 103 and the third plate member 104 is performed by inserting guide dowels previously formed in the second plate member 103 into guide holes previously drilled in the third plate member 104 (not shown). figure.). It should be noted that the alignment of the plan view positions of the respective plate members may be performed by other alignment structures. For example, guide holes formed in the respective plate members may be inserted into guide pins installed on the base. .

なお、変形例6において、第2板材103が実施形態2の第1板材102(Wa)に相当し、第3板材104が実施形態2の第2板材103に相当することから、実施形態2の半抜きダボ形成工程140を2回実施したと見なすことができる。また、第3板材104の表面側に第4板材を積層させ、第4板材に第3回半抜きダボ形成工程を実施してもよく、同様に第4回以降の半抜きダボ形成工程を繰り返してもよい。
第1板材102(Wa)の板厚Wtは第2板材103の板厚Wsより厚く、第2板材103の板厚Wsは第3板材104の板厚Wuより厚い。但し、各板の板厚は、その関係に定まるものではなく、必要に応じて適宜選定すればよく、例えば同じ板厚でもよい。
In Modified Example 6, the second plate member 103 corresponds to the first plate member 102 (Wa) of the second embodiment, and the third plate member 104 corresponds to the second plate member 103 of the second embodiment. It can be considered that the half-blanked dowel forming step 140 has been performed twice. Alternatively, the fourth plate member may be laminated on the surface side of the third plate member 104, and the third half-blanked dowel forming step may be performed on the fourth plate member, and similarly, the fourth and subsequent half-blanked dowel forming steps are repeated. may
The plate thickness Wt of the first plate member 102 (Wa) is thicker than the plate thickness Ws of the second plate member 103 , and the plate thickness Ws of the second plate member 103 is thicker than the plate thickness Wu of the third plate member 104 . However, the plate thickness of each plate is not determined by the relationship, and may be appropriately selected as necessary, for example, the same plate thickness may be used.

変形例6によれば、積層される板材を増やすことができ、積層板材構造体501の厚さを厚く構成することが可能となる。このため、例えば、積層板材構造体を半導体モジュールMの放熱板に使用する場合には、放熱性能をより高めることが可能となる。また、各板材の平面視形状を整えて、モータ、及び、発電機などの積層電磁コアに適用することも可能となる。
また、各板材の板厚、材質を、使用目的に応じて適宜変更することも可能である。
According to Modification 6, the number of laminated plate members can be increased, and the thickness of the laminated plate member structure 501 can be increased. Therefore, for example, when the laminated plate material structure is used for the heat sink of the semiconductor module M, the heat dissipation performance can be further improved. Moreover, it is also possible to adjust the plan view shape of each plate material and apply it to laminated electromagnetic cores such as motors and generators.
It is also possible to appropriately change the plate thickness and material of each plate according to the purpose of use.

〔その他の変形例〕
本発明は、次のような変形例も含む。
[Other Modifications]
The present invention also includes the following modifications.

(1)実施形態1では、テープ状板材Wを用いて第1板材2(Wd)及び第2板材3(Wc)を形成(テープ状板材Wの所定領域Waを折り曲げて第2板材3(Wc)を形成)し、テープ状板材Wを間欠的に搬送しながら、所定領域形成工程10、小孔穿孔工程20、第2板材積層工程30(直角折り曲げ工程31、135°折り曲げ工程34及び180°折り曲げ工程36を含む)、半抜きダボ形成工程40及び積層板材構造体分離工程50を連続的に行うものであった。
本変形例は、テープ状板材Wに代えて短冊状板材を用い、当該短冊状板材を間欠搬送装置に搭載して、所定領域形成工程10、小孔穿孔工程20、第2板材積層工程30(直角折り曲げ工程31、135°折り曲げ工程34及び180°折り曲げ工程36を含む)、半抜きダボ形成工程40及び積層板材構造体分離工程50を連続的に行うようにしてもよい。
(1) In the first embodiment, the tape-shaped plate W is used to form the first plate 2 (Wd) and the second plate 3 (Wc) (the second plate 3 (Wc) is formed by bending the predetermined region Wa of the tape-shaped plate W). )), and while intermittently conveying the tape-shaped plate material W, the predetermined area forming step 10, the small hole punching step 20, the second plate material stacking step 30 (right angle bending step 31, 135° bending step 34 and 180° (including the bending step 36), the half-blanking dowel forming step 40, and the laminated plate material structure separating step 50 were performed continuously.
In this modification, a strip-shaped plate material is used instead of the tape-shaped plate material W, the strip-shaped plate material is mounted on an intermittent conveying device, and a predetermined area forming step 10, a small hole punching step 20, and a second plate material stacking step 30 ( (including right angle bending step 31, 135° bending step 34, and 180° bending step 36), half-blanking dowel forming step 40, and laminated plate material structure separating step 50 may be performed continuously.

また、前述のように、短冊状板材を用いて第1板材2(Wd)及び第2板材3(Wc)を形成するが、上記各工程を(搬送装置に搭載せずに)独立して行ってもよい。この場合は、短冊状板材の平面視形状を適宜設定することにより、実施形態1の積層板材構造体分離工程50を必要としてもよく、前記積層板材構造体分離工程50を不要としてもよい。 Further, as described above, the first plate member 2 (Wd) and the second plate member 3 (Wc) are formed using strip-shaped plate members, but each of the above steps is performed independently (without being mounted on a conveying device). may In this case, by appropriately setting the plan view shape of the strip-shaped plate material, the laminated plate material structure separation step 50 of the first embodiment may be required, or the laminated plate structure separation step 50 may be omitted.

また、上記各工程を(搬送装置に搭載せずに)独立して行う場合には、小孔穿孔工程で第1板材に小孔を穿孔する小孔用パンチ21を、半抜きダボ形成工程で用いる半抜き用パンチ41と兼用してもよい。 In addition, when each of the above steps is performed independently (without being mounted on a conveying device), the small hole punch 21 for punching small holes in the first plate material in the small hole punching step is replaced in the half-blanking dowel forming step. The half-punching punch 41 may also be used.

(2)実施形態2では、小孔穿孔工程120で案内ダボ形成工程122を行い、第2板材積層工程130で第2板材103を第1板材102(Wa)に積層しており、その際に、第1板材102(Wa)の案内ダボ102dを第2板材103の案内孔103dに挿入し両板材の平面視位置を定めていた。しかし、両板材の平面視位置はその他の構造を用いて定めてもよい。例えば、小孔穿孔工程120では、第1板材102(Wa)に小孔102aを穿孔するとともに、案内ダボ形成工程122を行わず、第1板材102(Wa)に案内孔を所定箇所(例えば、図6(1)の案内ダボ102dの平面視位置2箇所)に穿孔する。第2板材積層工程130では、第1板材102(Wa)の下側から案内ピンを移動させ、第1板材102(Wa)の案内孔を突き抜けて突出させた案内ピンを積層された第2板材103の予め穿孔しておいた案内孔に挿入する。こうして、両板材の平面視位置を定める。 (2) In the second embodiment, the guide dowel forming step 122 is performed in the small hole punching step 120, and the second plate material 103 is laminated on the first plate material 102 (Wa) in the second plate material laminating step 130. , the guide dowel 102d of the first plate member 102 (Wa) is inserted into the guide hole 103d of the second plate member 103 to determine the plan view positions of both plate members. However, the planar view positions of both plate members may be determined using other structures. For example, in the small hole punching step 120, the first plate member 102 (Wa) is punched with the small hole 102a, and the guide dowel forming step 122 is not performed, and the guide hole is formed in the first plate member 102 (Wa) at a predetermined location (for example, Two positions of the guide dowel 102d in FIG. 6(1) in plan view) are bored. In the second plate material stacking step 130, guide pins are moved from the lower side of the first plate material 102 (Wa), and the guide pins protruding through the guide holes of the first plate material 102 (Wa) are stacked on the second plate material. It is inserted into the pre-drilled guide hole 103 . In this way, the planar view positions of both plate members are determined.

(3)実施形態2では、テープ状板材Wを用いて第1板材102(Wa)を形成し、テープ状板材Wを間欠的に搬送しながら、所定領域形成工程110、小孔穿孔工程120、第2板材積層工程130(第2板材103はテープ状板材Wから形成せずに別途に準備されたもの。)、半抜きダボ形成工程140及び積層板材構造体分離工程150を連続的に行うものであった。
本変形例は、テープ状板材Wに代えて、短冊状板材を用いて第1板材102(Wa)を形成し、短冊状板材を間欠搬送装置に搭載して、所定領域形成工程110、小孔穿孔工程120、第2板材積層工程130(第2板材103は短冊状板材から形成せずに別途に準備されたもの。)、半抜きダボ形成工程140及び積層板材構造体分離工程150を連続的に行うようにしてもよい。
(3) In the second embodiment, the tape-shaped plate W is used to form the first plate 102 (Wa). The second plate material stacking step 130 (the second plate material 103 is prepared separately without being formed from the tape-shaped plate material W), the half-blanked dowel forming step 140, and the laminated plate material structure separating step 150 are continuously performed. Met.
In this modification, instead of the tape-shaped plate W, a strip-shaped plate is used to form the first plate 102 (Wa), and the strip-shaped plate is mounted on an intermittent conveying device. The punching step 120, the second plate material stacking step 130 (the second plate material 103 is not formed from strip-shaped plate material but prepared separately), the half punching dowel forming step 140, and the laminated plate material structure separating step 150 are continuously performed. You may make it go to

また、前述のように、短冊状板材を用いて第1板材102(Wa)及び第2板材103を形成するが、上記各工程を(搬送装置に搭載せずに)独立して行ってもよい。この場合は、短冊状板材の平面視形状を適宜設定することにより、実施形態2の積層板材構造体分離工程150を必要としてもよく、前記積層板材構造体分離工程150を不要としてもよい。 Further, as described above, the first plate member 102 (Wa) and the second plate member 103 are formed using strip-shaped plate members, but each of the above steps may be performed independently (without being mounted on a conveying device). . In this case, the laminated plate material structure separation step 150 of the second embodiment may be required or the laminated plate structure separation step 150 may be omitted by appropriately setting the plan view shape of the strip-shaped plate material.

また、上記各工程を(搬送装置に搭載せずに)独立して行う場合には、小孔穿孔工程で第1板材に小孔を穿孔する小孔用パンチ21を、半抜きダボ形成工程で用いる半抜き用パンチ41に兼用してもよい。 In addition, when each of the above steps is performed independently (without being mounted on a conveying device), the small hole punch 21 for punching small holes in the first plate material in the small hole punching step is replaced in the half-blanking dowel forming step. The half-punching punch 41 may also be used.

(4)各実施形態及び各変形例において、小孔穿孔工程20、120では、小孔用パンチ21を用いて第1板材2(Wd)、102(Wa)に小孔2a、102aを穿孔したが、その他の方法により小孔を穿孔してもよい。たとえば、ドリル、レーザ光、または、化学薬品による溶解により、第1板材に小孔を穿孔してもよい。 (4) In each embodiment and each modified example, in the small hole punching steps 20 and 120, the small holes 2a and 102a were punched in the first plate members 2 (Wd) and 102 (Wa) using the small hole punch 21. However, other methods may be used to perforate the stoma. For example, small holes may be drilled in the first plate by drilling, laser light, or chemical dissolution.

(5)各実施形態及び各変形例において、半抜きダボ形成工程40、140では、半抜き用パンチ41を用いて第2板材3(Wc)、103に半抜きダボ3a、103aを形成していたが、その他の方法により第2板材に半抜きダボを形成してもよい。例えば、半抜きダボの直径(平面視大きさ)と同等の内径(平面視大きさ)を有したパイプから圧縮流体を第2板材の表面に噴射し、第2板材に半抜きダボを形成してもよい。あるいは、半抜きダボの直径(平面視大きさ)と同等の内径(平面視大きさ)を有したパイプを第1板材の裏面の小孔付近に押し当て、パイプを用いて真空引きすることにより、第2板材に半抜きダボを形成してもよい。上記の場合、両パイプ内の圧縮流体流路及び真空経路が本発明の半抜き用パンチとなる。 (5) In each of the embodiments and modifications, half-blanking dowel forming steps 40 and 140 use a half-blanking punch 41 to form half-blanking dowels 3a and 103a on the second plate 3 (Wc) and 103. However, the half-punched dowels may be formed in the second plate material by other methods. For example, a half-blanked dowel is formed in the second plate by injecting a compressed fluid from a pipe having an inner diameter (size in plan view) equivalent to the diameter (size in plan view) of the half-blanked dowel onto the surface of the second plate. may Alternatively, a pipe having an inner diameter (planar view size) equivalent to the diameter of the half-punched dowel (planar view size) is pressed against the vicinity of the small hole on the back surface of the first plate, and the pipe is used to evacuate. , a half-blanked dowel may be formed on the second plate. In the above case, the compressed fluid passage and the vacuum passage in both pipes serve as the half-blanking punch of the present invention.

(6)各実施形態及び各変形例においては第1板材には硬化処理がほどこされていなかった。本発明はこれに限定させるものではなく、小孔が穿孔される第1板材に硬化処理を施こしてもよい。硬化処理は、第1板材に熱処理を施して硬化してもよい。また、硬化処理は、小孔周辺の第1板材を板厚方向にプレスして板厚方向に圧縮し、加工硬化させてもよい。小孔周辺の第1板材を硬化させると、半抜きダボを形成する際に、第1板材がダイの役割を充分に発揮でき、半抜きダボを良好に形成することが可能となる。 (6) In each of the embodiments and modifications, the first plate was not subjected to hardening treatment. The present invention is not limited to this, and a hardening treatment may be applied to the first plate in which the small holes are to be drilled. As the hardening treatment, the first plate material may be hardened by heat treatment. Further, the hardening treatment may be performed by pressing the first plate around the small hole in the plate thickness direction to compress it in the plate thickness direction and work harden it. By hardening the first plate material around the small hole, the first plate material can fully function as a die when forming the half-blanked dowels, and the half-blanked dowels can be formed satisfactorily.

(7)その他、本発明の趣旨を変えない範囲ならば、上記以外の変形例も本発明に含まれる。 (7) Modifications other than the above are also included in the present invention as long as they do not change the gist of the present invention.

1、101、401、501・・・積層板材構造体
2、102・・・第1板材
2a、102a・・・(第1板材の)小孔
2f・・・逆テーパ面
3、103・・・第2板材
3a、103a・・・(第2板材の)半抜きダボ
3b、103b・・・(半抜きダボの)突出部
3f、103f・・・(第2板材の)小孔
4、104・・・第3板材
4a、104a・・・(第3板材の)半抜きダボ
4b、104b・・・(半抜きダボの)突出部
10、110・・・所定領域形成工程
20、120・・・小孔穿孔工程
21・・・・・・・小孔用パンチ
30、130・・・第2板材積層工程
31・・・直角折り曲げ工程
34・・・135°折り曲げ工程
36・・・180°折り曲げ工程
40、140・・・半抜きダボ形成工程
41・・・半抜き用パンチ
42・・・第2回半抜きダボ形成工程
50、150・・・積層板材積層体分離工程
70・・・半抜きダボ受
122・・・案内ダボ形成工程
1000・・・積層鉄心(積層板材構造体)
1010・・・鉄心片(板材)
1010a・・・鉄心片の裏面
1010b・・・鉄心片の表面
1010c・・・鉄心片の凹部
1010d・・・鉄心片の凸部
1010e・・・鉄心片の開口
M・・・半導体モジュール
P・・・搬送方向
W・・・テープ状板材
Wa・・・(テープ状板材の)所定領域
Wb・・・(テープ状板材の)切り欠き部
Wc・・・(テープ状板材の)先端領域
Wd・・・(テープ状板材の)平坦領域
We・・・(テープ状板材の)裏面
Wf、Wg・・・積層構造体
Wh・・・(テープ状板材の)スプロケット穴
Wi・・・(テープ状板材の)接続領域
Wj・・・(テープ状板材の)表面
Wt・・・(テープ状板材の)板厚
Reference Signs List 1, 101, 401, 501 Laminated plate structure 2, 102 First plate 2a, 102a Small hole (of first plate) 2f Reverse tapered surface
3, 103 Second plate 3a, 103a Half-blanked dowel (of second plate) 3b, 103b Protruding portion (half-blanked dowel) 3f, 103f (Second plate) Small holes 4, 104 Third plate 4a, 104a Half-blanked dowels (of third plate) 4b, 104b Protruding portions (half-blanked dowels) 10, 110 Predetermined region forming process 20, 120 Small hole punching step 21 Punch for small hole 30, 130 Second plate material stacking step 31 Right angle bending step 34 135° bending step 36. 180° bending steps 40, 140 Half-blanking dowel forming step 41 Half-blanking punch 42 Second half-blanking dowel forming step 50, 150 Laminated plate material laminate separating step 70 ... Half-blanked dowel receiving 122 ... Guide dowel forming process 1000 ... Laminated core (laminated plate material structure)
1010... Core piece (plate material)
1010a Back surface of core piece 1010b Front surface of core piece 1010c Concave portion of core piece 1010d Convex portion of core piece 1010e Opening of core piece M Semiconductor module P Conveyance direction W Tape-shaped plate material Wa Predetermined region Wb Notch portion Wc Tip region Wd (of tape-shaped plate material)・Flat area (of tape-like plate) We... Back surface (of tape-like plate) Wf, Wg... Laminated structure Wh... Sprocket hole (of tape-like plate) Wi... (of tape-like plate) ) Connection area Wj (of tape-shaped plate) Surface (of tape-shaped plate) Wt (of tape-shaped plate) Thickness

Claims (10)

第1板材に第2板材が積層し互いに結合している積層板材構造体の製造方法であって、
前記第1板材の所定箇所に小孔を穿孔する小孔穿孔工程と、
前記第1板材の裏面から案内ダボ用パンチを押し上げて、前記第1板材の表面から上向きに半抜き突出する案内ダボを形成する案内ダボ形成工程と、
前記小孔穿孔工程及び前記案内ダボ形成工程の後工程であって、前記第1板材の前記案内ダボに前記第2板材に予め形成された案内孔が嵌合して両者の平面視位置が定められるように前記第1板材に前記第2板材を積層する第2板材積層工程と、
前記第2板材積層工程の後工程であって、前記第1板材における前記小孔の平面視位置に対応する前記第2板材の表面位置で、半抜き用パンチを上側から前記第2板材の表面内に圧入して前記第2板材に半抜きダボを形成する半抜きダボ形成工程と、
含み
前記半抜きダボ形成工程では、前記半抜きダボの先端を前記第2板材の裏面から突出させ、この突出した部分である突出部を前記第1板材の前記小孔の内部に圧入することにより前記第1板材と前記第2板材を結合することを特徴とする積層板材構造体の製造方法。
A method for manufacturing a laminated plate structure in which a second plate is laminated on a first plate and bonded to each other,
a small hole drilling step of drilling a small hole at a predetermined location of the first plate;
a guide dowel forming step of pushing up a guide dowel punch from the back surface of the first plate member to form a guide dowel projecting upward from the front surface of the first plate member by half-blanking;
In a step subsequent to the small hole drilling step and the guide dowel forming step, the guide dowel of the first plate member is fitted with a guide hole previously formed in the second plate member to determine the position of the two in plan view. a second plate laminating step of laminating the second plate on the first plate so that the
In a step after the step of stacking the second plate material, a half-blanking punch is applied from above to the surface of the second plate material at a surface position of the second plate material corresponding to the position of the small hole in the first plate material in plan view. a half-blanked dowel forming step of forming a half-blanked dowel in the second plate member by press-fitting into the second plate;
including
In the half-blanked dowel forming step, the tip of the half-blanked dowel is protruded from the back surface of the second plate member, and the projecting portion, which is the protruded portion, is press-fitted into the small hole of the first plate member. A method for manufacturing a laminated plate material structure, comprising joining a first plate member and the second plate member.
請求項1に記載された積層板材構造体の製造方法であって、
前記小孔穿孔工程では、
前記小孔の穿孔は小孔用パンチとダイスを用いて行い、当該小孔用パンチの先端の平面視径は、前記第1板材の板厚より小さいことを特徴とする積層板材構造体の製造方法。
A method for manufacturing a laminated plate material structure according to claim 1,
In the small hole drilling step,
Manufacture of a laminated plate material structure, wherein the small holes are punched using a small hole punch and a die, and the diameter of the tip of the small hole punch in plan view is smaller than the plate thickness of the first plate material. Method.
請求項1または2に記載された積層板材構造体の製造方法であって、
前記半抜きダボ形成工程では、
前記半抜きダボの前記突出部が前記第1板材の前記小孔の内部に圧入する圧入深さは、前記小孔の内壁長の0.2~0.8の範囲であることを特徴とする積層板材構造体の製造方法。
A method for manufacturing a laminated plate material structure according to claim 1 or 2,
In the half-blanked dowel forming step,
The press-fitting depth of the protruding portion of the half-blanked dowel into the small hole of the first plate is in the range of 0.2 to 0.8 of the inner wall length of the small hole. A method for manufacturing a laminated plate material structure.
請求項1~3のいずれかに記載された積層板材構造体の製造方法であって、
前記半抜きダボ形成工程では、
前記半抜き用パンチの先端の平面視形状及び平面視面積は、前記第1板材に穿孔された前記小孔の平面視形状及び平面視面積と同一であることを特徴とする積層板材構造体の製造方法。
A method for manufacturing a laminated plate material structure according to any one of claims 1 to 3,
In the half-blanked dowel forming step,
A laminated plate material structure, wherein a plan view shape and a plan view area of a tip end of the half-punching punch are the same as a plan view shape and a plan view area of the small hole punched in the first plate material. Production method.
請求項1~4のいずれかに記載された積層板材構造体の製造方法であって、
前記半抜きダボ形成工程では、前記第1板材の裏面側から前記小孔の内部に半抜きダボ受を挿入配置した上で前記半抜き用パンチを前記第2板材の表面内に圧入することにより、前記第1板材の板厚方向に圧縮された半抜きダボを形成することを特徴とする積層板材構造体の製造方法。
A method for manufacturing a laminated plate structure according to any one of claims 1 to 4,
In the half-blanking dowel forming step, a half-blanking dowel holder is inserted into the small hole from the back side of the first plate, and then the half-blanking punch is press-fitted into the surface of the second plate. 1. A method for manufacturing a laminated plate material structure, characterized by forming a half-punched dowel that is compressed in the plate thickness direction of the first plate material.
請求項1~5のいずれかに記載された積層板材構造体の製造方法であって、
前記半抜きダボ形成工程は、前記第1板材に穿孔される前記小孔の内壁が、前記小孔における裏面側孔幅寸法が表面側孔幅寸法より大きくなるように逆テーパ面に形成されている状態で行われることを特徴とする積層板材構造体の製造方法。
A method for manufacturing a laminated plate material structure according to any one of claims 1 to 5,
In the half-blanked dowel forming step, the inner wall of the small hole drilled in the first plate member is formed to have a reverse tapered surface such that the width of the small hole on the back side is larger than the width of the hole on the front side. A method for manufacturing a laminated plate material structure, characterized in that it is carried out in a state where
請求項1~6のいずれかに記載された積層板材構造体の製造方法であって、
前記第1板材と前記第2板材は別個の板材から構成されることを特徴とする積層板材構造体の製造方法。
A method for manufacturing a laminated plate material structure according to any one of claims 1 to 6,
A method for manufacturing a laminated plate material structure, wherein the first plate material and the second plate material are composed of separate plate materials.
請求項7に記載された積層板材構造体の製造方法であって、
前記第1板材の硬度は、前記第2板材の硬度と同一若しくは前記第2板材の硬度より高いことを特徴とする積層板材構造体の製造方法。
A method for manufacturing a laminated plate material structure according to claim 7 ,
A method for manufacturing a laminated plate material structure, wherein the hardness of the first plate material is the same as or higher than the hardness of the second plate material.
請求項7または8に記載された積層板材構造体の製造方法であって、
前記第1板材の板厚は、前記第2板材の板厚と同一若しくは前記第2板材の板厚より厚いことを特徴とする積層板材構造体の製造方法。
A method for manufacturing a laminated plate material structure according to claim 7 or 8 ,
A method for manufacturing a laminated plate material structure, wherein the plate thickness of the first plate material is the same as or thicker than the plate thickness of the second plate material.
請求項1~9のいずれかに記載された積層板材構造体の製造方法であって、
前記第1板材はテープ状板材からなり、前記テープ状板材の搬送に伴って、前記小孔穿孔工程、前記案内ダボ形成工程、前記第2板材積層工程、前記半抜きダボ形成工程を行い、さらに、前記テープ状板材から積層板材構造体を分離する積層板材構造体分離工程を行うことを特徴とする積層板材構造体の製造方法。
A method for manufacturing a laminated plate material structure according to any one of claims 1 to 9 ,
The first plate material is a tape-like plate material, and as the tape-like plate material is conveyed, the step of punching small holes, the step of forming guide dowels, the step of laminating the second plate material, and the step of forming half-punched dowels are performed, and 1. A method for producing a laminated plate material structure, characterized by performing a laminated plate material structure separation step of separating the laminated plate material structure from the tape-shaped plate material.
JP2018177107A 2018-09-21 2018-09-21 Laminated plate material structure manufacturing method Active JP7156677B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2018177107A JP7156677B2 (en) 2018-09-21 2018-09-21 Laminated plate material structure manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018177107A JP7156677B2 (en) 2018-09-21 2018-09-21 Laminated plate material structure manufacturing method

Publications (2)

Publication Number Publication Date
JP2020044570A JP2020044570A (en) 2020-03-26
JP7156677B2 true JP7156677B2 (en) 2022-10-19

Family

ID=69900517

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018177107A Active JP7156677B2 (en) 2018-09-21 2018-09-21 Laminated plate material structure manufacturing method

Country Status (1)

Country Link
JP (1) JP7156677B2 (en)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002001450A (en) 2000-06-15 2002-01-08 Mitsubishi Electric Corp Preparatory processing tool for metal plate and stamping method for metal plate
JP2006345657A (en) 2005-06-09 2006-12-21 Mitsui High Tec Inc Method for manufacturing laminated iron core and laminated iron core
DE102009012807A1 (en) 2009-03-12 2009-10-29 Daimler Ag Sheet i.e. body sheet, folding method for motor vehicle, involves producing fold by bending edge area of sheet around edge of another sheet, and pressing bent edge area of former sheet into passage during form joining by forming punch
JP2013059790A (en) 2011-09-13 2013-04-04 Hitachi Automotive Systems Ltd Joining structure and joining method of metal plate
JP2014009699A (en) 2012-06-27 2014-01-20 Canon Inc Assembling structure, female screw member, and image formation device
JP2014123530A (en) 2012-12-21 2014-07-03 Nissan Motor Co Ltd Molding method and molding apparatus
JP2014176127A (en) 2013-03-06 2014-09-22 Mitsui High Tec Inc Laminated core and manufacturing method thereof
WO2014167687A1 (en) 2013-04-11 2014-10-16 株式会社ヨロズ Press molding and manufacturing method therefor
WO2017144286A1 (en) 2016-02-23 2017-08-31 Koninklijke Philips N.V. Method of folding metal blank made of high-strenght material without cracks

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002001450A (en) 2000-06-15 2002-01-08 Mitsubishi Electric Corp Preparatory processing tool for metal plate and stamping method for metal plate
JP2006345657A (en) 2005-06-09 2006-12-21 Mitsui High Tec Inc Method for manufacturing laminated iron core and laminated iron core
DE102009012807A1 (en) 2009-03-12 2009-10-29 Daimler Ag Sheet i.e. body sheet, folding method for motor vehicle, involves producing fold by bending edge area of sheet around edge of another sheet, and pressing bent edge area of former sheet into passage during form joining by forming punch
JP2013059790A (en) 2011-09-13 2013-04-04 Hitachi Automotive Systems Ltd Joining structure and joining method of metal plate
JP2014009699A (en) 2012-06-27 2014-01-20 Canon Inc Assembling structure, female screw member, and image formation device
JP2014123530A (en) 2012-12-21 2014-07-03 Nissan Motor Co Ltd Molding method and molding apparatus
JP2014176127A (en) 2013-03-06 2014-09-22 Mitsui High Tec Inc Laminated core and manufacturing method thereof
WO2014167687A1 (en) 2013-04-11 2014-10-16 株式会社ヨロズ Press molding and manufacturing method therefor
WO2017144286A1 (en) 2016-02-23 2017-08-31 Koninklijke Philips N.V. Method of folding metal blank made of high-strenght material without cracks

Also Published As

Publication number Publication date
JP2020044570A (en) 2020-03-26

Similar Documents

Publication Publication Date Title
JP6003232B2 (en) Fastening body for plate member, fastening method for plate member, and image forming apparatus
US8234775B2 (en) Method for manufacturing laminated rotor core
US11472169B2 (en) Metal laminate and manufacturing method of metal laminate
JP4054682B2 (en) work
JP2022515265A (en) Multi-layer precision punching process for manufacturing metal parts and precision punching equipment for performing such processes
US7103961B2 (en) Production method of amorphous laminate core and amorphous laminate core
JP7156677B2 (en) Laminated plate material structure manufacturing method
JP2006345657A (en) Method for manufacturing laminated iron core and laminated iron core
CN104668434B (en) The method for manufacturing installation unit
EP1022074B1 (en) Joining of a body to a support structure
JP2019010675A (en) Joining method of plate member
JP6248965B2 (en) Manufacturing method of core of rotating electrical machine
JP2013220463A (en) Fastening structure of metal plate, fastening method, fastener, and metal plate fastening body
JP2010110123A (en) Laminate core and manufacturing method thereof
JP4654012B2 (en) Manufacturing method of laminated iron core
JP5039499B2 (en) Laminated bonded product and manufacturing method of laminated bonded product
JP2001121227A (en) Laminated binding part
JP2003259610A (en) Method and device of manufacturing laminated core
JP3242355B2 (en) Fastening method and fastening structure
TW432411B (en) Thin metal plate stack assembly and method of making the same
JP5461853B2 (en) Metal bonded body, metal bonding method, and metal bonding apparatus
JP2003326422A (en) Attaching and coupling method in sequential die
JPH09234528A (en) Caulking method
KR20190072710A (en) Sliding clincging device
JP3187103B2 (en) Fastening method and fastening structure

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20210617

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20220425

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20220621

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220801

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20220927

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20220929

R150 Certificate of patent or registration of utility model

Ref document number: 7156677

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150