JP7126054B2 - Part mounting method - Google Patents

Description

The present invention relates to a component mounting method using a component mounting apparatus that picks up a component with a suction nozzle and mounts it on a board.

Conventionally, there has been known a component mounting apparatus that picks up a component from a component supply section with a suction nozzle provided in a mounting head and mounts it at a predetermined mounting position on a substrate. When picking up a component in a component mounting apparatus, the suction nozzle may pick up the component in an inclined position or may not be able to pick up the component.

Therefore, a side image of the component sucked by the suction nozzle is acquired by a component recognition camera integrally provided in the mounting head, and the quality of the posture, etc., and thickness of the sucked component are judged by recognizing the image. (For example, Patent Document 1). Moreover, it is also performed to determine the presence/absence of a component in the suction nozzle from a side image (for example, Patent Document 2). For the recognition of these side images, the image data captured by the component recognition camera is sent to the control unit for image recognition, where the image is processed. It is

Japanese Patent No. 4331054 WO2014/147806

By the way, if the component cannot be picked up when the component is picked up, the suction nozzle is in a state of vacuum leak, and it is not preferable that this state is prolonged. In particular, when one vacuum source is shared by a plurality of suction nozzles, if the number of suction nozzles with vacuum leaks increases, the suction force of the suction nozzles that are picking up the components will decrease. Problems such as falling may occur. Therefore, in order to prevent such a phenomenon and perform efficient production, it is necessary to quickly determine the presence or absence of a component in the suction nozzle and take appropriate measures such as stopping the vacuum leak.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a component mounting method using a component mounting apparatus that enables efficient production.

A component mounting method according to the present invention is a component mounting method using a component mounting apparatus having a rotary type mounting head in which a plurality of nozzle shafts having suction nozzles for sucking components are arranged, wherein the suction is obtained by an imaging camera. In parallel with determination of the presence or absence of the component based on an image including the tip of the nozzle or the component, a component different from the component is mounted by a suction nozzle different from the suction nozzle, and an image is captured by the imaging camera. The presence or absence of the component is determined based on the primary image data, and the thickness of the component is calculated based on the secondary image data to which the primary image data is transferred and stored .

According to the present invention, efficient production is possible.

1 is a perspective view of a component mounting apparatus according to one embodiment of the present invention; FIG. 1 is a configuration diagram of a mounting head provided in a component mounting apparatus according to an embodiment of the present invention; FIG. 1 is a cross-sectional view of a mounting head included in a component mounting apparatus according to an embodiment of the present invention; FIG. 1 is a partial cross-sectional view along a horizontal plane of a mounting head provided in a component mounting apparatus according to an embodiment of the present invention; FIG. 1 is a block diagram showing the configuration of a control system of a component mounting apparatus according to one embodiment of the present invention; FIG. (a) and (b) diagrams for explaining determination of presence/absence of a component based on an average luminance value in the component mounting apparatus according to the embodiment of the present invention. (a) and (b) are diagrams for explaining determination of presence/absence of a component based on a contrast value in the component mounting apparatus according to the embodiment of the present invention. FIG. 4 is a diagram for explaining the thickness of a component calculated by the component mounting apparatus according to the embodiment of the present invention; (a) and (b) are diagrams for explaining a determination range used in component suction processing in the component mounting apparatus according to the embodiment of the present invention. FIG. 1 is a flowchart of a component mounting method in a component mounting apparatus according to an embodiment of the present invention; FIG. 2 is a flowchart of component pick-up processing in the component mounting apparatus according to one embodiment of the present invention; Schematic diagram of a nozzle shaft holder for explaining a component mounting method in a component mounting apparatus according to an embodiment of the present invention. FIG. 2 is a process explanatory diagram of a component mounting method in a component mounting apparatus according to an embodiment of the present invention;

An embodiment of the present invention will be described in detail below with reference to the drawings. The configuration, shape, etc. described below are examples for explanation, and can be changed as appropriate according to the specifications of the component mounting apparatus. In the following, the same reference numerals are given to the corresponding elements in all the drawings, and redundant explanations are omitted. In FIG. 1 and a part described later, the two axial directions perpendicular to each other in the horizontal plane are the X direction of the substrate transfer direction (direction perpendicular to the paper surface in FIG. 2) and the Y direction perpendicular to the substrate transfer direction (in FIG. 2). left-right direction) are shown. In FIG. 1 and a part described later, the Z direction (vertical direction in FIG. 2) is shown as the height direction orthogonal to the horizontal plane, and the θ direction is shown as the direction in the horizontal plane rotating around the Z direction. The Z direction is the vertical direction or the orthogonal direction when the component mounting apparatus is installed on a horizontal plane.

First, the structure of the component mounting apparatus 1 will be described with reference to FIG. The component mounting apparatus 1 has a function of mounting components on a substrate. A substrate transfer mechanism 2 having a pair of transfer conveyors extending in the X direction is provided in the central portion of the base 1a. The substrate transport mechanism 2 receives the substrate 3 on which components are to be mounted from the upstream device, transports it, and positions and holds it at a mounting work position by the component mounting mechanism described below.

A component supply unit 4 is arranged on both sides of the board transfer mechanism 2 . The component supply unit 4 is configured by arranging a plurality of tape feeders 5 side by side on a feeder table 4a. The tape feeder 5 pitch-feeds the carrier tape containing the component P (see FIG. 2) to be mounted on the substrate 3, thereby supplying the component P to a pickup position by the mounting head 8 of the component mounting mechanism.

Next, the component mounting mechanism will be described. A Y-axis beam 6 having a linear driving mechanism is arranged along the Y direction at the end of the base 1a in the X direction. An X-axis beam 7 having a linear driving mechanism is attached to the Y-axis beam 6 so as to be movable in the Y direction. The X-axis beam 7 is arranged along the X direction. A plate member 9 is attached to the X-axis beam 7 so as to be movable in the X direction, and a mounting head 8 is attached to the plate member 9 via a holding frame 10 .

The mounting head 8 has a function of picking up the component P to be mounted on the substrate 3 from the component supply section 4 and holding it. The mounting head 8 moves horizontally in the X and Y directions by driving the Y-axis beam 6 and the X-axis beam 7, and mounts the held component P on the substrate 3 positioned and held by the substrate transport mechanism 2. configure the mechanism. The Y-axis beam 6 and the X-axis beam 7 constitute a head moving mechanism 11 for moving the mounting head 8 in the horizontal plane.

Next, the structure of the mounting head 8 will be described with reference to FIGS. In FIG. 2, the mounting head 8 has a structure in which the side surface and the upper surface are covered with a holding frame 10 and a cover 8a fixed to the holding frame 10. As shown in FIG. A rotor holding portion 12 is provided in the lower portion of the holding frame 10 so as to extend in the horizontal direction. A cylindrical nozzle shaft holder 13, which is a rotor, is held by the rotor holder 12 so as to be rotatable about a rotation axis CL in the Z direction via a bearing 12a (see FIG. 3). A retainer driven gear 14 is fixed to the upper surface of the nozzle shaft retainer 13 and has the rotary shaft CL as its axis.

An index drive motor 15 is arranged above the rotor holding portion 12 . The index drive motor 15 is equipped with an index drive gear 15 a that meshes with the holder driven gear 14 . The holder driven gear 14 is index-rotated via an index drive gear 15a by being driven by an index drive motor 15 (arrow a). As a result, the nozzle shaft holder 13 is also index-rotated together with the holder driven gear 14 .

FIG. 4 schematically shows a cross section along the horizontal plane of the nozzle shaft holder 13. As shown in FIG. 3 and 4, a plurality of (here, 12) through-holes 16 penetrating vertically through the nozzle shaft holder 13 are provided at positions on the circumference of the nozzle shaft holder 13 about the rotation axis CL. It is A cylindrical nozzle shaft 17 is inserted into each through hole 16 so as to be vertically movable with respect to the nozzle shaft holder 13 .

In FIG. 3 , bearings 18 for guiding the nozzle shaft 17 in the vertical direction are arranged at two vertically spaced locations on the inner peripheral surface 16 a of the through hole 16 . A nozzle holder 19 is provided below each nozzle shaft 17 , and a suction nozzle 20 is detachably attached to the nozzle holder 19 . That is, the mounting head 8 has a plurality of (12 here) suction nozzles 20 . A substantially L-shaped attachment 21a is attached to the upper end of the nozzle shaft 17 so as to be rotatable in the θ direction. The cam follower 21 is attached to the mounting fixture 21a with the rotation axis of the cam follower 21 facing outward.

In FIG. 2, a cam holding portion 22 for fixing a cylindrical cam 23 is provided on the upper portion of the holding frame 10 so as to extend in the horizontal direction. A groove 23 a is provided on the outer peripheral surface of the cylindrical cam 23 . The groove 23 a is provided so that the side opposite to the holding frame 10 is high and gradually becomes lower as it approaches the holding frame 10 . A cam follower 21 attached to each nozzle shaft 17 is mounted on a cylindrical cam 23 so as to move along a groove 23a.

Each nozzle shaft 17 is urged upward by an elastic body 24 such as a spring provided above the nozzle shaft holder 13 . When the nozzle shaft holder 13 is index-rotated, the nozzle shaft 17 moves up and down along the groove 23a of the cylindrical cam 23 while rotating in the horizontal direction. A portion of the cylindrical cam 23 is cut at a portion where the groove 23a is the lowest, and the groove 23a is interrupted at the cut portion.

A component suction nozzle elevating mechanism 25 is arranged between the holding frame 10 and the cylindrical cam 23 . The component suction nozzle elevating mechanism 25 includes a screw shaft 25a extending in the Z direction, an elevating motor 25b that rotationally drives the screw shaft 25a, and a nut 25c that screws onto the screw shaft 25a. The nut 25c is provided with a cam follower holder 25d that can move up and down along the cut portion of the cylindrical cam 23. As shown in FIG. The cam follower holder 25d is moved up and down together with the nut 25c by driving the lifting motor 25b. The cam follower holder 25d has a shape that complements the groove 23a interrupted at the cut portion. Therefore, the cam follower 21 moving along the groove 23a can smoothly transfer to the cam follower holder 25d.

The cam follower 21 that has moved along the groove 23a is separated from the groove 23a at this position, and transferred to and held by the cam follower holder 25d standing by at the same height position as the groove 23a. When the lift motor 25b is driven in this state, the nozzle shaft 17 and the suction nozzle 20 move up and down together with the cam follower 21 with respect to the nozzle shaft holder 13 (arrow b). The component suction nozzle elevating mechanism 25 is not limited to the structure described above, and may have a structure using a linear motor or a structure using an air cylinder as long as it moves the nozzle shaft 17 up and down.

Thus, the position of the nozzle shaft 17 where the cam follower holder 25d holds the cam follower 21 is the first station S1 where the nozzle shaft 17 moves up and down. In FIG. 4, 12 positions where the nozzle shaft holder 13 stops after being index-rotated (rotated by 30 degrees in this case) are sequentially rotated clockwise from the first station S1 to the nth station Sn (n=1, 2, n=1, 2, n=1). , 12). That is, the 12 suction nozzles 20 attached to the lower part of the nozzle shaft 17 inserted into the nozzle shaft holder 13 move from the n-th station Sn to the adjacent (n+1)-th station each time the nozzle shaft holder 13 performs index rotation. It moves to Sn+1 and returns to the first station S1 after the twelfth station S12.

In FIG. 3, the upper surface of the nozzle shaft holder 13 is provided with a mounting hole 13a around the rotation axis CL of the nozzle shaft holder 13. As shown in FIG. A cylindrical rotating body 26 vertically penetrating the cylindrical cam 23 is rotatably disposed with respect to the nozzle shaft holder 13 by fitting a tip portion 26a thereof into the mounting hole 13a via a bearing 26b. .

A θ-rotation driven gear 27 centered on the rotation axis CL is fixed near the upper end of the rotor 26 . Above the cylindrical cam 23, a .theta.-rotation motor 28 having a .theta.-rotation driving gear 28a meshing with a .theta. The θ rotation driven gear 27 is driven by the θ rotation motor 28 to rotate in the θ direction via the θ rotation drive gear 28a. As a result, the rotor 26 rotates in the θ direction together with the θ rotation driven gear 27 (arrow c).

Between the nozzle shaft holder 13 and the cylindrical cam 23 on the rotating body 26, a nozzle driving gear 29 is fixed that extends vertically in correspondence with the vertical stroke of the nozzle shaft 17. As shown in FIG. A nozzle rotation gear 30 is fixed to each nozzle shaft 17 at a position where it meshes with the nozzle drive gear 29 . The nozzle shafts 17 are driven by the nozzle drive gear 29 to rotate all at once in the .theta. direction via the nozzle rotating gear 30 (arrow d).

In FIG. 2, the rotor holding unit 12 is provided with a side imaging camera 31 that takes an image of the periphery including the tip 20a of the suction nozzle 20 that is index-rotated and stopped at the third station S3 from the side. When the component P is sucked by the tip 20a of the suction nozzle 20, the side imaging camera 31 takes an image of the periphery of the tip 20a of the suction nozzle 20 and the sucked component P from the side at the same time. The side imaging camera 31 sequentially takes an image of the tip 20a of the suction nozzle 20 that relatively moves and stops at the third station S3 every time the nozzle shaft holder 13 performs index rotation.

That is, the side imaging camera 31 is provided integrally with the mounting head 8, and moves relative to the plurality of suction nozzles 20 to sequentially image the surroundings of the tips 20a of the plurality of suction nozzles 20 from the side. do. The side imaging camera 31 includes a camera 31a that images the suction nozzle 20 and a mirror 31b that guides the image of the suction nozzle 20 to the camera 31a. When the component is mounted on the substrate 3, the mounting height for correcting the lowering position of the nozzle shaft 17 (mounting height of the component P) in consideration of the recognition result of the component P sucked by the suction nozzle 20 by the side imaging camera 31. A correction is made.

Next, the air flow path of the mounting head 8 will be described with reference to FIGS. In FIG. 3, inside the nozzle shaft holder 13, a common flow path 13b is provided in the vertical direction along the rotation axis CL, opening to the upper surface of a mounting hole 13a provided in the upper center of the nozzle shaft holder 13. ing. The common flow path 13b communicates with a rotating body hole 26c provided inside a rotating body 26 fitted in the mounting hole 13a. The rotor hole 26c communicates with a negative pressure source (not shown) via a pipe 32 connected to the upper end of the rotor 26 (arrow e).

In FIG. 4 , valve units 33 (twelve units in this case) are arranged between the common flow path 13 b and the through holes 16 inside the nozzle shaft holder 13 . Each valve unit 33 communicates with the common flow path 13b through a retainer lateral hole 13c formed inside the nozzle shaft retainer 13 . Each valve unit 33 includes a connection hole 13d formed inside the nozzle shaft holder 13, a communication gap 16b of each through hole 16, an opening 17c penetrating through the outer peripheral surface 17a of the nozzle shaft 17, and a nozzle. The shaft inner hole 17 b inside the shaft 17 and the nozzle inner hole provided inside the suction nozzle 20 communicate with the tip 20 a of the suction nozzle 20 .

In addition, each valve unit 33 is connected to the bottom surface of the nozzle shaft holder 13 via an upper connection pipeline 13e, a lower connection pipeline 13f, and a positive pressure connection pipeline 13g formed inside the nozzle shaft holder 13, respectively. It communicates with an upper connection port 34a, a lower connection port 34b, and a positive pressure connection port 34c formed in the . Air supply units 35A and 35B are provided below the nozzle shaft holders 13 of the first station S1 and the fourth station S4, respectively. When the nozzle shaft holder 13 is index-rotated and stopped at the first station S1, the upper connection port 34a, the lower connection port 34b, and the positive pressure connection port 34c of the nozzle shaft 17 are connected to the upper supply passage 35Aa of the air supply portion 35A. They are connected to the lower supply path 35Ab and the positive pressure supply path 35Ac through pads 36, respectively.

The upper connection port 34a, the lower connection port 34b, and the positive pressure connection port 34c of the nozzle shaft 17 stopped at the fourth station S4 are connected to the upper supply passage 35Ba, the lower supply passage 35Bb, and the positive pressure supply passage 35Bc of the air supply section 35B. , respectively via pads 36 . The upper supply passages 35Aa, 35Ba and the lower supply passages 35Ab, 35Bb each communicate with a positive pressure generation source (not shown) via an on-off valve V (see FIG. 5). By controlling the on-off valve V, positive pressure is individually supplied to the upper supply passages 35Aa and 35Ba and the lower supply passages 35Ab and 35Bb at predetermined timings. Atmospheric pressure is always supplied to the positive pressure supply paths 35Ac and 35Bc.

In FIG. 4, each valve unit 33 switches the internal path according to the positive pressure supplied from the upper connection port 34a and the lower connection port 34b, and supplies the negative pressure supplied from the common flow path 13b to the connection hole 13d. It has a function of switching between a "negative pressure supply state" and an "atmospheric pressure supply state" in which the atmospheric pressure supplied from the positive pressure supply passages 35Ac and 35Bc is supplied to the connection hole 13d. In the "negative pressure supply state", negative pressure is supplied to the tip 20a of the suction nozzle 20, and the component P can be sucked to the tip 20a. That is, the valve unit 33 serves as a vacuum valve that opens and closes the supply of vacuum to the tip 20 a of the suction nozzle 20 .

In the "atmospheric pressure supply state", the tip 20a of the suction nozzle 20 is supplied with atmospheric pressure. In addition, in the "atmospheric pressure supply state", since the path between the common channel 13b and the connection hole 13d is cut off, the air does not flow into the common channel 13b from the tip 20a of the suction nozzle 20 (vacuum leak). The valve unit 33 maintains the "negative pressure supply state" or the "atmospheric pressure supply state" when the positive pressure supply to the lower port 33b or the upper port 33a is stopped.

For example, at the first station S1, the valve unit 33 is set to the "negative pressure supply state" and the nozzle shaft 17, which has picked up the part P by the suction nozzle 20, is rotated from the first station S1 by the index rotation of the nozzle shaft holder 13. Even if it comes off, the part P can be held continuously. Further, for example, the nozzle shaft 17 whose valve unit 33 is set to the "atmospheric pressure supply state" at the fourth station S4 is a source of negative pressure even if the nozzle shaft holder 13 is index-rotated and detached from the fourth station S4. The state in which the route leading to the is blocked is maintained.

Next, the configuration of the control system of the component mounting apparatus 1 will be described with reference to FIG. A control device 40 provided in the component mounting apparatus 1 is an arithmetic processing device having a CPU function. The control device 40 includes a mechanism control section 41, a device storage section 42, a camera instruction section 43, a thickness calculation section 44, a processing range setting section 45, a component suction processing section 46, a component mounting processing section 47, and a display processing section 48. there is The apparatus storage unit 42 stores judgment result data 42a, secondary image data 42b, thickness data 42c, and the like, in addition to mounting work parameters required for control of each unit by the mechanism control unit 41. FIG. The mechanism control unit 41 controls the operation of the board transport mechanism 2 to transport the board 3 and position and hold it at the mounting position, and controls the operation of the tape feeder 5 to supply the component P to the component pick-up position.

The mechanism control unit 41 also controls the operation of the head moving mechanism 11 to move the mounting head 8 within the horizontal plane. Further, the mechanism control unit 41 controls the operation of the index drive motor 15, the elevation motor 25b, and the θ rotation motor 28 to index-rotate the nozzle shaft holder 13 and raise and lower the nozzle shaft 17 positioned at the first station S1. , the nozzle shafts 17 are simultaneously rotated by θ. The mechanism control unit 41 also controls the operation of the on-off valve V to set the valve units 33 located at the first station S1 and the fourth station S4 to the "negative pressure supply state" or the "atmospheric pressure supply state."

In FIG. 5, the camera instruction unit 43 instructs the side imaging camera 31 to perform various processes. The side imaging camera 31 includes a camera 31a that captures an image, a camera operation control section 50, a camera storage section 51, and a component presence/absence determination section 52. As shown in FIG. The camera operation control unit 50 receives an instruction from the camera instruction unit 43 and uses the camera 31a to capture an image of the tip 20a of the suction nozzle 20 positioned at the third station S3. The camera storage unit 51 stores processing range data 51a and primary image data 51b.

After the image captured by the camera 31a is temporarily stored in the camera storage unit 51 as the primary image data 51b, it is transmitted to the control device 40, linked to the captured suction nozzle 20, and stored in the device storage unit 42 as secondary data. It is stored as image data 42b. The component presence/absence determination unit 52 executes a component presence/absence determination process for determining whether or not the component P sucked by the tip 20a of the suction nozzle 20 is present based on the image data captured by the camera 31a. The determination result is transmitted to the control device 40, linked to the determined suction nozzle 20, and stored in the device storage unit 42 as determination result data 42a. That is, the component presence/absence determination unit 52 serves as a determination unit that determines whether or not the component P sucked by the tip 20 a of the suction nozzle 20 is present based on the image data obtained by the side imaging camera 31 .

The component presence/absence determination unit 52 is provided in the side imaging camera 31 or the mounting head 8 . That is, the component presence/absence determination unit 52 (determination unit) is a control unit provided in the mounting head 8 or the side imaging camera 31 . Then, the component presence/absence determination unit 52 determines whether or not the component P is present based on the image data while the camera 31a is capturing the image that becomes the primary image data 51b. That is, since the presence/absence determination of the component P by the component presence/absence determination unit 52 is completed before the acquired primary image data 51b is transmitted to the control device 40, the control device 40 performs the same determination. can be determined quickly.

Here, the component presence/absence determination processing will be described with reference to FIGS. The component presence/absence determination processing includes determination based on the average luminance value of the image and determination based on the contrast value. First, referring to FIG. 7, the component presence/absence determination processing based on the average luminance value will be described. FIG. 6(a) shows an image of the image pickup field VF of the pick-up nozzle 20 with a component picking up the part P, which is picked up by the side image pickup camera 31. FIG. FIG. 6(b) shows an image of the imaging field VF of the pick-up nozzle 20 without a component, which does not pick up the part P, captured by the side imaging camera 31. FIG. A rectangular processing range R indicated by a dotted line is set in the image of the imaging field of view VF. The processing range R is stored in the processing range data 51a, for example, as coordinates of four vertices of a rectangle within the imaging field of view VF.

In the image of the side imaging camera 31, the area where the component P is present has high brightness due to the light reflected by the component P. FIG. Therefore, when there is a component as shown in FIG. 6A, the average luminance value of the processing range R is high (bright). On the other hand, in the case of no parts shown in FIG. 6B, the average luminance value of the processing range R is low (dark). When all the image data within the processing range R is obtained while the camera 31a is capturing an image to be the primary image data 51b, the component presence/absence determination section 52 calculates the average luminance value within the processing range R, If it is higher (brighter) than the predetermined value, it is determined that there is a component, and if it is lower (darker) than the predetermined value, it is determined that there is no component. In this manner, the component presence/absence determination unit 52 (determination unit) determines the presence/absence of the component P based on the average luminance value within the preset processing range R in the image data.

The above description is for the case of recognition by the reflection method, but in the case of recognition by the transmission method illumination, the average luminance value of the processing range R is low (dark) when there is a part, and when there is no part. , the average luminance value of the processing range R becomes high (bright). Also in this case, the component presence/absence determination unit 52 (determination unit) determines the presence/absence of the component P based on the average luminance value within the preset processing range R in the image data.

Next, with reference to FIG. 7, component presence/absence determination processing based on the contrast value will be described. FIG. 7A shows an image of the pickup field VF with the component, and FIG. 7B shows an image of the pickup nozzle 20 with the side imaging camera 31 without the component. As in FIG. 7, a rectangular processing range R indicated by a dotted line is set in the image of the imaging field of view VF. The camera 31a scans the uppermost stage from left to right, and sequentially lowers one stage at a time while scanning from left to right to capture an image. The pixels IE in the processing range R have high luminance (bright) where the part P exists, and low luminance (dark) where the part P does not exist.

In the case where there is a component shown in FIG. 7A, a predetermined number of pixels IE with high brightness appear continuously on the component P. In FIG. In the case of no component shown in FIG. 7B, pixels IE with high brightness do not appear continuously. That is, when the component P is present, a brightness difference (contrast) occurs on the scanning line SL, and when the component P is absent, no brightness brightness difference occurs. The component presence/absence determination unit 52 measures the brightness of the pixels IE on the scanning line SL within the processing range R while the camera 31a is capturing the image that becomes the primary image data 51b, and determines whether the contrast ( If a difference in brightness occurs, it is determined that there is a component, and if a contrast greater than a predetermined value does not occur, it is determined that there is no component. In this manner, the component presence/absence determination unit 52 (determination unit) determines whether the component P is present based on the contrast value within the preset processing range R in the image data.

As described above, when recognized by transmission illumination, the luminance value is low (dark) when there is a component, and high (bright) when there is no component. Also in this case, the component presence/absence determination unit 52 (determination unit) determines the presence/absence of the component P based on the contrast value within the preset processing range R in the image data.

In FIG. 5, the thickness calculator 44 performs image processing on the secondary image data 42b to which the primary image data 51b is transferred and stored in the device storage unit 42, and calculates the component P sucked by the tip 20a of the suction nozzle 20. A thickness calculation process for calculating the thickness T of is executed. That is, the thickness calculator 44 serves as a calculator that calculates the thickness T of the component P sucked by the tip 20a of the suction nozzle 20 based on the secondary image data 42b (image data) obtained by the side imaging camera 31. . Here, the thickness T of the component will be described with reference to the secondary image data 42b shown in FIG. The thickness calculator 44 recognizes the position of the tip 20a of the suction nozzle 20 and the position of the bottom surface Pa of the sucked component P by image processing, and calculates the difference between the two positions as the thickness T of the component P. FIG.

The calculated thickness T of the component P is stored in the device storage unit 42 as thickness data 42c in association with the imaged suction nozzle 20 . As described above, the thickness calculator 44 (calculator) is a control unit provided in the main body of the component mounting apparatus 1, and determines the presence or absence of the component P in the component presence/absence determination unit 52 (determination unit). The calculation of the thickness T of the component P in the (calculation unit) is performed based on the same image data (primary image data 51b, secondary image data 42b).

The processing range setting unit 45 executes a processing range setting process of determining a processing range R used in the component presence/absence determination process for each of the plurality (here, 12) of the suction nozzles 20 of the mounting head 8 . The processing range setting unit 45 index-rotates the nozzle shaft holder 13 to sequentially position the suction nozzles 20 that are not picking up the component P at the third station S3, and the side imaging camera 31 detects the tips 20a of the suction nozzles 20. Take an image containing FIGS. 9A and 9B show examples of captured image data. The processing range setting unit 45 performs image processing on the obtained image data, recognizes the position of the tip 20a of the suction nozzle 20, and sets a predetermined range including the recognized tip 20a of the suction nozzle 20 as a processing range R. .

As shown in FIGS. 9A and 9B, the position of the tip 20a of the suction nozzle 20 varies depending on various factors such as manufacturing error of the suction nozzle 20 itself and mounting error of the suction nozzle 20 to the nozzle holder 19. , differ for each suction nozzle 20 . 9A shows an example in which the tip 20a of the suction nozzle 20 is positioned at a higher position in the imaging field VF, and FIG. 9B shows an example in which the tip 20a of the suction nozzle 20 is positioned at a lower position in the imaging field VF. shows an example. The processing range setting unit 45 sets the processing range R for all the suction nozzles 20 attached to the mounting head 8 and stores the processing range data 51 a linked to the suction nozzles 20 in the camera storage unit 51 . That is, the preset processing range R in the image data is set for each of the plurality of suction nozzles 20 based on the image data in a state where the suction nozzles 20 do not have the component P.

In FIG. 5, the component pickup processing unit 46 controls the tape feeder 5, the head moving mechanism 11, the index drive motor 15, the lifting motor 25b, the θ rotation motor 28, and the opening/closing valve V to supply the components to the take-out position of the tape feeder 5. Then, the parts P are picked up by the suction nozzles 20 positioned at the first station S1 in order.

The component mounting processing unit 47 controls the head moving mechanism 11, the index drive motor 15, the lifting motor 25b, and the θ rotation motor 28 to sequentially position and hold the component P picked up by the suction nozzle 20 at the component mounting work position. It controls component mounting processing for mounting at a predetermined mounting position on the printed circuit board 3 . In the component mounting process, the component mounting processing unit 47 mounts the component P by correcting the lowering amount of the suction nozzle 20 (mounting height of the component P) based on the thickness data 42c stored in the device storage unit 42. . The display processing unit 48 causes an image display device 49 such as a monitor connected to the control device 40 to display information necessary for operating the component mounting apparatus 1 , secondary image data 42 b captured by the side imaging camera 31 , and the like.

Next, a component mounting method in the component mounting apparatus 1 will be described with reference to FIGS. 10 to 13. FIG. In FIG. 10 , the processing range setting unit 45 sequentially positions the suction nozzles 20 not picking up the component P at the third station S3, and captures an image including the tips 20a of the suction nozzles 20 using the side imaging camera 31 . Then, the processing range setting unit 45 executes processing range setting processing for setting the processing range R for each suction nozzle 20 based on the captured image data (ST1: processing range determination step). The set processing range R is stored in the camera storage unit 51 as processing range data 51a.

Next, the component suction processing unit 46 index-rotates the nozzle shaft holder 13 (rotor) by 30 degrees (ST2: first index rotation step). The state at this time is shown in FIG. In FIG. 12, the suction nozzle 20 positioned at the first station S1 is defined as the first suction nozzle 20(1), and hereinafter, the second suction nozzle 20(2) to the twelfth suction nozzle 20(12) are defined counterclockwise. . The nozzle shaft holder 13 rotates clockwise by 30 degrees every index rotation (arrow f). 12 is defined as rotor index I0 in FIG. 13, and for convenience, the first suction nozzle 20(1) is represented as N1 in FIG.

In FIG. 10, the component suction processing unit 46 then executes component suction processing (ST3: component suction processing step). Next, with reference to FIG. 11, the component suction processing step (ST13) will be described in detail. In FIG. 11, first, the component suction processing unit 46 causes the first suction nozzle 20(1) positioned at the first station S1 to suction the component P supplied by the tape feeder 5 (ST11: component suction step). At this point, the valve unit 33 of the first suction nozzle 20(1) is set to the "negative pressure supply state", and a vacuum is supplied to the tip 20a of the first suction nozzle 20(1). In FIG. 13, the suction nozzles 20 in the "negative pressure supply state" are hatched.

Next, the component suction processing unit 46 index-rotates the nozzle shaft holder 13 (ST2). 13, the first suction nozzle 20(1) moves to the second station S2, and the second suction nozzle 20(2) is positioned at the first station S1. Next, the component suction processing unit 46 causes the second suction nozzle 20(2) to suction the component P (ST11). Thereby, a vacuum is supplied to the tip 20a of the second suction nozzle 20(2).

Next, the component suction processing unit 46 index-rotates the nozzle shaft holder 13 (ST2). 13, the first suction nozzle 20(1) moves to the third station S3, the second suction nozzle 20(2) moves to the second station S2, and the third suction nozzle 20 (3) is located at the first station S1. Next, the component suction processing unit 46 causes the third suction nozzle 20(3) to suction the component P (ST11). Thereby, a vacuum is supplied to the tip 20a of the third suction nozzle 20(3).

In FIG. 11, in parallel with the component suction step (ST11), the component presence/absence determination section 52 images the first suction nozzle 20(1) with the side imaging camera 31 (ST12), and the first suction nozzle 20(1) is picking up the part P (ST13: component presence/absence determination step). When it is determined that the first suction nozzle 20(1) is picking up the component P (Yes in ST13), the thickness calculator 44 determines whether the first suction nozzle 20(1) is picking up the part P based on the secondary image data 42b. A thickness calculation process is executed to calculate the thickness T of the part P that is being processed (ST14: thickness calculation step).

That is, after the component mounting apparatus 1 performs the suction operation of the component P by the first suction nozzle 20(1) (ST11), the component presence/absence determination unit 52 (determination unit) detects the tip of the first suction nozzle 20(1). When it is determined that there is a part P in 20a (Yes in ST13), the thickness T of the part P to be picked up by the first suction nozzle 20(1) is calculated by the thickness calculator 44 (ST14). . In this manner, the imaging by the side imaging camera 31 (ST12), the component presence/absence determination step (ST13), and the thickness calculation step (ST14) constitute the component presence/absence determination method by the component mounting apparatus 1. FIG.

When the primary image data 51b is acquired by the side imaging camera 31, the component suction processing unit 46 can execute the next first index rotation step (ST2) even before the completion of the thickness calculation processing (ST14). If so, the first index rotation step (ST2) is executed. That is, the thickness calculation step (ST14), the first index rotation step (ST2), the component suction step (ST11), and the imaging by the side imaging camera 31 (ST12) are executed in parallel.

After that, while the component adsorption processing is not completed by all the adsorption nozzles 20 (No in ST4), the first index rotation step (ST2) and the component adsorption processing step (ST3) are repeatedly performed. That is, in FIG. 13, at rotor index I3, component suction processing section 46 causes fourth suction nozzle 20(4) to pick up component P (ST11), and component presence/absence determination section 52 causes second suction nozzle 20(2) to pick up component P (ST11). It is determined whether or not P is being sucked (ST13).

In FIG. 13, at rotor index I4, it is determined in the component presence/absence determination process that the third suction nozzle 20(3) is not picking up the component P (No in ST13). In this case, at the rotor index I5 at which the third suction nozzle 20(3) moves to the fourth station S4, the component suction processing section 46 puts the valve unit 33 of the third suction nozzle 20(3) in the "negative pressure supply state." to "atmospheric pressure supply state". That is, the component suction processing unit 46 closes the vacuum valve (valve unit 33) that supplies vacuum to the tip 20a of the third suction nozzle 20(3) (ST15: vacuum valve closing step).

That is, after the component P is sucked by the third suction nozzle 20(3) (ST11), the component presence/absence determination unit 52 (determination unit) determines that there is no component P at the tip 20a of the third suction nozzle 20(3). (No in ST13), the vacuum valve (valve unit 33) that supplies vacuum to the tip 20a of the third suction nozzle 20(3) is closed (ST15). As a result, the vacuum leaks (the air flows in) from the tip 20a of the third suction nozzle 20(3) that is not picking up the component P, and the pressure in the common flow path 13b rises. It is possible to prevent the problem that the suction nozzle 20(1) or the like drops the component P due to a decrease in the suction force.

Further, when it is determined that the third suction nozzle 20(3) is not picking up the component P in the component presence/absence determination process (No in ST13), the thickness calculation section 44 calculates the thickness of the third suction nozzle 20(3). No action is taken. That is, after the component P is sucked by the third suction nozzle 20(3) (ST11), the component presence/absence determination unit 52 (determination unit) determines that there is no component P at the tip 20a of the third suction nozzle 20(3). (No in ST13), the thickness T of the component P at the third suction nozzle 20 (3) is calculated by the thickness calculator 44 (calculator) in parallel with closing the vacuum valve (valve unit 33) is stopped (thickness calculation processing is not executed).

As a result, the thickness calculation unit 44 can cancel the thickness calculation processing for the third suction nozzle 20(3) and advance and start the thickness calculation processing for the fourth suction nozzle 20(4). In the example of FIG. 13, it is determined that the sixth suction nozzle 20(6) and the tenth suction nozzle 20(10) are not picking up the component P (No in ST13). The vacuum valve (bubble unit 33) is closed (ST15). Then, the thickness calculation processing for the sixth suction nozzle 20(6) and the tenth suction nozzle 20(10) is canceled, and the thickness calculation processing for the seventh suction nozzle 20(7) and the eleventh suction nozzle 20(11) is performed. It is carried forward.

It should be noted that the suction nozzle 20 (for example, the first suction nozzle 20 (1), etc.) determined to be picking up the component P (Yes) in the component presence/absence determination process (ST13) is the vacuum valve at the fourth station S4. The "negative pressure supply state" is maintained without changing the operation of (the valve unit 33).

In FIG. 10, when the component suction processing for all the suction nozzles 20 is completed with the component suction processing for the twelfth suction nozzle 20 (12) at the rotor index I11 (No in ST4), the component mounting processing unit 47 holds the nozzle shaft. The body 13 (rotor) is index-rotated by 30 degrees (ST5: second index rotation step). As a result, the first suction nozzle 20(1) goes around and is positioned at the first station S1 (rotor index I12).

Next, the component mounting processing unit 47 executes component mounting processing for mounting the component P to be picked up by the first suction nozzle 20(1) at a predetermined mounting position on the substrate 3 (ST6: component mounting processing step). In the component mounting process, mounting height correction of each suction nozzle 20 is performed based on the thickness T (thickness data 42c) of the component P obtained in the thickness calculation step (ST14). Note that the component presence/absence determination process (ST13) at the third station S3 and the process (ST15) for closing the vacuum valve (valve unit 33) at the fourth station S4 are performed for all the suction nozzles 20 (the twelfth suction nozzle 20 (12)). ) is completed in parallel with the component mounting process at the first station S1.

After that, while the component mounting process is not completed for all the suction nozzles 20 (No in ST7), the second index rotation step (ST5) and the component mounting processing step (ST6) are repeatedly performed. That is, the components P sucked by the suction nozzles 20 are sequentially mounted at predetermined mounting positions on the board 3 . At this time, in the third suction nozzle 20(3), the sixth suction nozzle 20(6), and the tenth suction nozzle 20(10), which have not picked up the component P, the component mounting processing step (ST6) is skipped. , the second index rotation step (ST5) is executed.

In FIG. 10, when the component mounting process is completed for all the suction nozzles 20 (up to the 12th suction nozzle 20 (12)) (Yes in ST7), the process returns to the first index rotation step (ST2) and the component suction process is executed. be done.

As described above, the component mounting apparatus 1 of the present embodiment is provided integrally with the mounting head 8 having the plurality of suction nozzles 20 , and moves relative to the plurality of suction nozzles 20 to move the suction nozzles. A side imaging camera 31 is provided for sequentially imaging the periphery of the distal end 20a of 20 from the side. Then, based on the primary image data 51b obtained by the side imaging camera 31, the component presence/absence determination unit 52 (determination unit) determines the presence or absence of the component P sucked at the tip 20a of the suction nozzle 20, and the thickness calculation unit 44 calculates the thickness T of the component P sucked by the tip 20 a of the suction nozzle 20 based on the secondary image data 42 b obtained by the side imaging camera 31 .

In this way, the presence/absence of the component P is determined by the control unit (component presence/absence determination unit 52) separate from the control unit (thickness calculation unit 44) that calculates the thickness T of the component P. The presence or absence of the part P can be determined at high speed.

In the embodiment, the so-called rotary type mounting head 8 in which the suction nozzles 20 are arranged on the circumference is described as an example, but the present invention is not limited to this, and a plurality of suction nozzles 20 are arranged linearly. The present invention may also be applied to the mounted head of the above type. In that case, for example, a side imaging camera 31 movable with respect to the linearly arranged suction nozzles 20 may be provided integrally with the mounting head.

It should be noted that the component presence/absence determination processing described in the embodiment is used to determine whether or not the component P is present at the tip 20a of the suction nozzle 20 after the component P suction operation at the first station S1, that is, to determine component suction failure. Used, but not limited to. For example, after the mounting operation of the component P in the first station S1, the phenomenon that the suction nozzle 20 takes away the component P without mounting it, that is, it may be used to judge whether the component is to be brought back.

INDUSTRIAL APPLICABILITY The component mounting method of the present invention has the effect of enabling efficient production, and is useful in the field of component mounting where components are mounted on substrates.

Reference Signs List 1 component mounting device 8 mounting head 17 nozzle shaft 20 suction nozzle 20a tip 31 side imaging camera 33 valve unit (vacuum valve)
P Part R Processing range (range)
Thickness

Claims (6)

A component mounting method using a component mounting apparatus having a rotary type mounting head in which a plurality of nozzle shafts having suction nozzles for sucking components are arranged,
In parallel with determination of the presence or absence of the component based on an image including the tip of the suction nozzle or the component obtained by an imaging camera, a component different from the component is mounted by a suction nozzle different from the suction nozzle. ,
A method of mounting a component, wherein the presence or absence of the component is determined based on the primary image data captured by the imaging camera, and the thickness of the component is calculated based on the secondary image data stored after the primary image data is transferred. . 2. A vacuum valve for supplying a vacuum to the tip of the suction nozzle is closed when it is determined that the component is not present at the tip of the suction nozzle after the suction operation of the component is performed by the suction nozzle. Mounting method described in . 3. The component mounting method according to claim 1, wherein when it is determined that the component does not exist at the tip of the suction nozzle, calculation of the thickness of the component at the suction nozzle is stopped. 4. The component mounting method according to any one of claims 1 to 3 , wherein determination of presence/absence of said component and calculation of thickness of said component are executed as mutually independent processes. 5. The component mounting method according to claim 1 , wherein the presence or absence of said component is determined by a control unit provided in said mounting head or said imaging camera. 6. The component mounting method according to claim 1 , wherein the thickness of said component is calculated by a controller provided in a body of said component mounting apparatus.

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