JP7078681B2 - Creep feed grinding method and grinding equipment - Google Patents

Description

The present invention relates to a creep feed grinding method and a grinding device.

As disclosed in Patent Document 1, a predetermined number of workpieces are held on the holding surface of the chuck table so that the lower surface of the grinding wheel is above the holding surface and below the upper surface of the workpiece held on the holding surface. By moving the grinding wheel and the chuck table relatively in the direction parallel to the holding surface after positioning at the height, the upper surface of the workpiece held on the holding surface is creep-fed by the lower surface and the side surface of the grinding wheel. There is an invention of grinding.

In creep feed grinding, the upper surface of the workpiece is ground when the workpiece held on the holding surface moves in one direction parallel to the holding surface. In order to grind a predetermined amount of grinding, it is necessary to reciprocate the workpiece in a direction parallel to the holding surface, and in that reciprocating movement, the grinding time is due to grinding only when moving in one direction. There is a problem that it takes.

Japanese Unexamined Patent Publication No. 2020-89930

Therefore, the grinding device and the creep grinding method for creep-feed grinding the workpiece held on the chuck table have a problem of shortening the grinding time.

In the present invention, a holding means provided with a holding surface for holding the workpiece and an annular grinding wheel having a diameter larger than that of the workpiece attached to the tip of the spindle are relative to the grinding feed direction parallel to the holding surface. A creep-feed grinding method for creep-feed grinding of a workpiece by moving the spindle to one of the grinding feed directions, that is, a first tilting step in which the spindle is slightly tilted toward one direction in the grinding feed direction, and a cover held on the holding surface. The grinding grind whose lower surface is positioned outside the workpiece and lower than the upper surface of the workpiece and the holding means are relatively moved in one direction of the grinding feed direction to creep feed the upper surface of the workpiece. A first grinding step for grinding and a second tilting step for slightly tilting the spindle toward the other direction of the grinding feed direction after the workpiece moved in one direction has passed the grinding wheel. The grinding grind having its lower surface positioned outside the workpiece and lower than the upper surface of the workpiece and the holding means are relatively moved in the other direction to creep the upper surface of the workpiece. It is a creep feed grinding method including a second grinding step of feed grinding.
The present invention comprises a holding means having a plurality of holding surfaces on the upper surface for holding a plurality of workpieces, and an annular grinding wheel having a diameter larger than the long side or the diameter of the workpiece mounted on the tip of the spindle. It is a creep feed grinding method in which the workpiece is creep feed ground on the lower surface and the side surface of the grinding wheel by moving relatively in the grinding feed direction parallel to the holding surface, and the plurality of holding surfaces are in the grinding feed direction. The first tilting step of tilting the spindle slightly toward one direction in the grinding feed direction, and the upper surface of the workpiece held in the center of the upper surface and on the holding surface. The first grinding that creep-feed grinds the workpiece on the one direction side from the center of the upper surface by relatively moving the grinding grind with the lower surface positioned at a lower position and the holding means in one direction. The step, the second tilting step of moving in one direction and slightly tilting the spindle toward the other direction of the grinding feed direction when the grinding wheel comes to the center of the upper surface, and the center of the holding means. The grinding grind whose lower surface is positioned lower than the upper surface of the workpiece held on the holding surface and the holding means are relatively moved in the other direction and ground in the first grinding step. It is a creep feed grinding method including a second grinding step of creep feed grinding a work piece that has not been used.
It is desirable that the creep feed grinding method includes a repeating step of repeating the first tilting step, the first grinding step, the second tilting step, and the second grinding step.

In the present invention, by tilting the spindle, creep feed grinding can be performed in both the outward path and the return path in the grinding feed direction. Further, when a plurality of workpieces are held on the holding surface, grinding is started from the center of the holding surface, so that the amount of movement of the workpiece in the grinding feed direction is shorter than before. Therefore, the grinding time can be shortened.

It is a perspective view which shows the whole of a grinding apparatus. It is sectional drawing which shows the holding means and the grinding means at the start of the 1st grinding process. It is a top view which shows the relationship of the horizontal position of the workpiece held on the holding surface at the start of a 1st grinding process, and a grinding wheel. It is sectional drawing which shows the holding means and the grinding means at the end of a 1st grinding process. It is a top view which shows the relationship of the horizontal position of the workpiece held on the holding surface at the end of a 1st grinding process, and a grinding wheel. It is sectional drawing which shows the holding means and the grinding means at the start of the 2nd grinding process. 2 is a plan view showing the relationship between the horizontal position of the workpiece held on the holding surface at the start of the second grinding process and the grinding wheel. It is sectional drawing which shows the holding means and the grinding means at the end of the 2nd grinding process. 2 is a plan view showing the relationship between the horizontal position of the workpiece held on the holding surface at the end of the second grinding process and the grinding wheel. It is sectional drawing which shows the 2nd holding means and the grinding means at the start of the 1st grinding process. It is sectional drawing which shows the 2nd holding means and the grinding means at the end of the 1st grinding process. It is sectional drawing which shows the 2nd holding means and the grinding means at the start of the 2nd grinding process. It is sectional drawing which shows the 2nd holding means and the grinding means at the end of a 2nd grinding process. It is sectional drawing of the grinding apparatus when the grinding apparatus is seen from the side.

1 Grinding device The grinding device 1 shown in FIG. 1 is a grinding device that grinds the workpiece 14 held on the holding surface 210. Hereinafter, the grinding device 1 will be described.
As shown in FIG. 1, the grinding device 1 includes a base 10 and a column 11 erected on the + Y direction side of the base 10.

The holding means 2 is arranged on the base 10. The holding means 2 is, for example, a chuck table having a substantially disk-shaped base 20, and four substantially rectangular holding portions 21 are formed on the upper surface 200 of the base 20. For example, the holding portions 21 are all arranged in the X-axis direction so as to be parallel to the Y-axis direction, and are located near the central portion 201 of the upper surface 200 of the base 20 among the four holding portions 21. A relatively large gap is provided between the two positioned holding portions 21. The upper surface of the holding portion 21 is a holding surface 210 on which the plate-shaped workpiece 14 is held. The holding surface 210 is connected to a suction source (not shown), and the suction force generated by operating the suction source is transmitted to the holding surface 210. For example, the workpiece 14 can be held on the holding surface 210 by operating the suction source in a state where the workpiece 14 is placed on the holding surface 210.

On the side surface of the column 11 on the −Y direction side, a vertical moving means 4 for moving the grinding means 3 in the Z-axis direction is arranged.
The grinding means 3 includes a spindle 30 having a rotating shaft 35 in the Z-axis direction, a housing 31 that rotatably supports the spindle 30, a spindle motor 32 that rotationally drives the spindle 30 around the rotating shaft 35, and a spindle 30. A mount 33 connected to the lower end of the mount 33 and a grinding wheel 34 detachably mounted on the lower surface of the mount 33 are provided.
The grinding wheel 34 includes a wheel base 341 and a plurality of substantially rectangular parallelepiped grinding wheels 340 arranged in an annular shape on the lower surface of the wheel base 341. The ring formed by the plurality of grinding wheels 340 has a diameter longer than the long side of the upper surface 140 of the workpiece 14.
When the plurality of holding portions 21 are circular, the ring formed by the grinding wheel 340 has a diameter larger than the diameter of the circular workpiece held by the holding portions 21.

By rotating the spindle 30 around the rotation shaft 35 using the spindle motor 32, the mount 33 connected to the spindle 30 and the grinding wheel 34 mounted on the mount 33 are integrally centered on the rotation shaft 35. Will rotate.

The vertical moving means 4 has a ball screw 40 having a rotating shaft 45 in the Z-axis direction, a pair of guide rails 41 arranged parallel to the ball screw 40, and a Z that rotates the ball screw 40 around the rotating shaft 45. It includes a shaft motor 42, an elevating plate 43 in which an internal nut is screwed into a ball screw 40 and a side portion is in sliding contact with a guide rail 41, and a holder 44 for supporting the grinding means 3. The holder 44 is supported by a support member 83 provided on the upper portion of the side surface of the elevating plate 43 on the −Y direction side.

When the ball screw 40 is driven by the Z-axis motor 42 and the ball screw 40 rotates about the rotation shaft 45, the elevating plate 43 is guided by the guide rail 41 and moves up and down in the Z-axis direction. The grinding means 3 held in the holder 44 moves in the Z-axis direction.

An internal base 12 is disposed inside the base 10. On the internal base 12, a grinding feed means 5 for moving the holding means 2 and the grinding means 3 relatively in the grinding feed direction (X-axis direction) which is a direction parallel to the holding surface 210 is arranged. ..
The grinding feed means 5 includes a ball screw 50 having a rotation axis 55 in the X-axis direction, an X-axis motor 52 that rotates the ball screw 50 about the rotation axis 55, and a pair of balls arranged in parallel with the ball screw 50. It includes a guide rail 51 and a movable plate 53 whose inner nut is screwed into a ball screw 50 and whose bottom is in sliding contact with the guide rail 51.

A support plate 26 is supported on the movable plate 53, and a casing 23 is supported on the support plate 26. Further, the base 20 of the holding means 2 is supported on the casing 23.

By driving the ball screw 50 using the X-axis motor 52, when the ball screw 50 rotates about the rotating shaft 55, the movable plate 53 moves horizontally in the X-axis direction while being guided by the guide rail 51, and the movable plate 53 moves. The holding means 2 and the grinding means 3 supported by the above move relative to each other in the grinding feed direction.

A cover 27 and a bellows 28 stretchably connected to the cover 27 are arranged around the holding means 2. For example, when the holding means 2 moves in the X-axis direction, the cover 27 moves in the X-axis direction together with the holding means 2, and the bellows 28 expands and contracts.

The grinding device 1 includes a tilting means 8 for tilting the spindle 30. The tilting means 8 includes a ball screw 80 provided on the −X direction side of the holder 44, and a tilt adjusting motor 82 that rotates the ball screw 80 about the axis 85 of the ball screw 80.
By rotating the ball screw 80 using the tilt adjusting motor 82, the holder 44 substantially pendulums in the X-axis direction with the support member 83 as a fulcrum, and the spindle 30 tilts in one direction or the other direction in the grinding feed direction. It is configured to be.

The grinding device 1 includes a control means 9 for controlling various operations of the grinding device 1.

2 Creep feed grinding method (first tilting process)
The operation of the grinding device 1 when the creep feed grinding of the workpiece 14 is performed by using the grinding device 1 will be described. When creep-feed grinding the workpiece 14 using the grinding device 1, various operations of the grinding device 1 are controlled by the control means 9.
When creep-feed grinding the workpiece 14 using the grinding device 1, first, the plate-shaped workpiece 14 is placed on the holding surface 210 of each of the four holding portions 21 shown in FIG. Then, by operating a suction source (not shown) connected to the holding surface 210 and transmitting the suction force generated to the holding surface 210, the workpiece 14 is sucked and held on the holding surface 210.
Then, the spindle 30 is slightly tilted toward the + X direction, which is one direction in the grinding feed direction, using the tilting means 8. As a result, as shown in FIG. 2, the portion of the grinding wheel 340 on the + X direction side is positioned at a lower height position than the portion on the −X direction side.

(1st grinding process)
Next, the holding means 2 is moved in the + X direction by using the grinding feed means 5, and the grinding wheel 340 is positioned in the vicinity of the central portion 201 of the upper surface 200 of the holding means 2 as shown in FIG. FIG. 3 shows a plan view showing the positional relationship between the grinding wheel 340 and the workpiece 14 at that time. In FIG. 3, the + X direction side of the grinding wheel 340 is positioned near the central portion 201 of the upper surface 200 of the holding means 2.
Then, the grinding wheel 340 is moved in the −Z direction by using the vertical moving means 4. As a result, the lower surface 342 of the grinding wheel 340 located on the + X direction side is positioned at a height lower than the upper surface 140 of the workpiece 14 held on the holding surface 210.

Further, the grinding wheel 340 is rotated around the rotating shaft 35 by using the spindle motor 32 shown in FIG. 1.
While the grinding wheel 340 is rotating, the workpiece 14 held on the holding surface 210 is horizontally moved in the −X direction by using the grinding feed means 5. As a result, as shown in FIG. 2, the lower surface 342 and the side surface 343 of the grinding wheel 340 located on the + X direction side come into contact with the workpiece 14 located on the + X direction side of the central portion 201 of the upper surface 200 of the holding means 2. Then, the workpiece 14 located on the + X direction side of the central portion 201 of the upper surface 200 of the holding means 2 is creep-fed ground.

As shown in FIG. 4, when the + X direction side of the grinding wheel 340 completely passes above the workpiece 14 located on the + X direction side of the central portion 201 of the upper surface 200 of the holding means 2, the upper surface of the holding means 2 is used. The creep feed grinding of the workpiece 14 located on the + X direction side of the central portion 201 of 200 is completed. FIG. 5 shows a plan view showing the positional relationship between the grinding wheel 340 and the workpiece 14 at that time. At the end of creep feed grinding of the workpiece 14 located on the + X direction side of the central portion 201 of the upper surface 200 of the holding means 2, the −X direction side, which is the other direction side of the grinding wheel 340 in the grinding feed direction, is held. It is positioned above the central portion 201 of the upper surface 200 of the means 2.

(Second tilting process)
Then, as shown in FIG. 6, the tilting means 8 is used to tilt the spindle 30 in the −X direction, which is the other direction of the grinding feed direction. As a result, the portion of the grinding wheel 340 on the −X direction side is positioned at a lower height position than the portion on the + X direction side. At this time, as shown in FIG. 7, the horizontal position of the grinding wheel 340 is slightly moved to the −X direction side.

(Second grinding process)
Then, as shown in FIG. 7, the lower surface 342 of the grinding wheel 340 is located at a horizontal position near the central portion 201 of the upper surface 200 of the holding means 2 and at a height lower than the upper surface 140 of the workpiece 14 held on the holding surface 210. With the portion on the −X direction side of the above positioned, the workpiece 14 held by the holding means 2 is moved in the + X direction by using the grinding feed means 5. As a result, the grinding wheel 340 and the holding means 2 relatively move in the other direction of the grinding feed direction, and the workpiece located on the −X direction side of the central portion 201 of the upper surface 200 of the holding means 2. 14 comes into contact with the lower surface 342 and the side surface 343 of the grinding wheel 340 to perform creep feed grinding.

As shown in FIG. 8, when the −X direction side of the grinding wheel 340 completely passes above the workpiece 14 located on the −X direction side of the central portion 201 of the upper surface 200 of the holding means 2, the holding means 2 The creep feed grinding of the workpiece 14 located on the −X direction side of the central portion 201 of the upper surface 200 of the upper surface 200 is completed. At this time, as shown in FIG. 9, the + X direction side of the grinding wheel 340 is positioned at the central portion 201 of the upper surface 200 of the holding means 2, for example.

(Repeat process)
Then, after performing the first tilting step, which is a step of tilting the + X direction side of the central portion 201 of the upper surface 200 of the holding means 2 again by using the tilting means 8, the + X direction of the central portion 201 of the upper surface 200 of the holding means 2 is performed. The first grinding step, which is a step of grinding the workpiece 14 located on the side, is performed. Then, after the completion of the first grinding step, the tilting means 8 is used again to perform the second tilting step, which is the step of tilting the −X direction side of the central portion 201 of the upper surface 200 of the holding means 2, and the holding means 2 is subjected to the second tilting step. The second grinding step, which is a step of grinding the workpiece 14 located on the −X direction side of the central portion 201 of the upper surface 200, is performed. By repeating the first tilting step, the first grinding step, the second tilting step, and the second grinding step in this way, the four workpieces 14 held on the holding surface 210 can be determined in a short time. It can be ground to a thickness.
Further, according to the creep feed grinding using the grinding device 1, it is possible to form grinding marks in the same direction on the upper surface 140 of the workpiece 14 that has been creep-ground.

The grinding device 1 may be provided with the second holding means 29 shown in FIG. 10 instead of the holding means 2. The second holding means 29 is formed in a disk shape, and its upper surface is a second holding surface 290 that holds one second workpiece 15. Further, the second holding means 29 is connected to a suction source (not shown). The suction force generated by operating the suction source in a state where one piece of the second workpiece 15 is placed on the second holding surface 290 of the second holding means 29 is transmitted to the second holding surface 290. The second workpiece 15 can be sucked and held on the second holding surface 290.

When grinding the second workpiece 15 using the grinding device 1 having this configuration, the second workpiece 15 is first held on the second holding surface 290 as shown in FIG. 10, and the second workpiece 15 is ground. With the grindstone 340 positioned on the outside (-X direction side) of the upper surface 150 of the second workpiece 15, the spindle 30 is tilted toward the + X direction using the tilting means 8. As a result, the portion of the grinding wheel 340 on the + X direction side is positioned at a height lower than the upper surface 150 of the second workpiece 15 held on the second holding surface 290.

Further, the grinding wheel 340 is rotated by rotating the spindle 30 about the rotating shaft 35 by using the spindle motor 32 shown in FIG. 1.

Then, as shown in FIG. 10, the second workpiece 15 held on the second holding surface 290 is moved in the −X direction by using the grinding feed means 5. As a result, the lower surface 342 and the side surface 343 of the grinding wheel 340 located on the + X direction side come into contact with the upper surface 150 of the second workpiece 15, and the second workpiece 15 is creep-fed ground.
FIG. 11 shows a state in which the + X direction side of the grinding wheel 340 passes through the upper surface 150 of the second workpiece 15, and the entire surface of the upper surface 150 of the second workpiece 15 is ground.

After that, the second workpiece 15 held on the second holding surface 290 is further moved in the −X direction by using the grinding feed means 5, and the grinding wheel 340 is moved to the outside (+ X) of the upper surface 150 of the second workpiece 15. Evacuate to the direction side). Then, as shown in FIG. 12, the spindle 30 is tilted toward the −X direction by using the tilting means 8, and the lower surface 342 of the grinding wheel 340 is positioned at a height lower than the upper surface 150 of the second workpiece 15.

Next, the second workpiece 15 held on the second holding surface 290 is moved in the + X direction by using the grinding feed means 5. As a result, the lower surface 342 and the side surface 343 of the grinding wheel 340 located on the −X direction side come into contact with the upper surface 150 of the second workpiece 15, and the second workpiece 15 is creep-fed ground.
FIG. 13 shows a state in which the −X direction side of the grinding wheel 340 passes through the upper surface 150 of the second workpiece 15, and the entire surface of the upper surface 150 of the second workpiece 15 is ground.

Further, the grinding device 1 may include a second tilting means 7 having a piezoelectric actuator 70 as shown in FIG. 14 instead of the tilting means 8 shown in FIG. In this configuration, the spindle 30 is supported by a support member 71, and two piezoelectric actuators 70 are connected to the support member 71 by screwing the upper portion thereof with a screw 72. Further, the lower portions of the two piezoelectric actuators 70 are screwed to the holder 44 by screws 72 and connected to each other. That is, the spindle 30 is connected to the holder 44 via the support member 71 and the piezoelectric actuator 70.

Further, the holding means 2 may have a base 20 screwed to the casing 23 by a screw 24, and the casing 23 may be supported by a support plate 26 by a support column 260.

In the above configuration, by applying a voltage to either one of the two piezoelectric actuators 70 to extend the piezoelectric actuator 70, either the + X direction side or the −X direction side of the spindle 30 can be tilted.
For example, by applying a voltage to the piezoelectric actuator 70 arranged on the −X direction side in FIG. 14 to extend the piezoelectric actuator 70, the spindle 30 is tilted toward the −X direction and the grinding wheel 340 is oriented in the −X direction. The side portion can be positioned at a lower height position than the portion on the + X direction side.

1: Grinding device 10: Base 11: Column 12: Internal base 16: Thickness measuring means 2: Holding means 20: Base 200: Top surface 201: Central part 21: Holding member 210: Holding surface 23: Casing 24: Screw 26: Support plate 260: Support pillar 27: Cover 28: Bellows 3: Grinding means 30: Spindle 31: Housing 32: Spindle motor 33: Mount 34: Grinding wheel 340: Grinding grindstone 341: Wheel base 342: Bottom surface 343: Side surface 35: Rotating shaft 4: Vertical movement means 40: Ball screw 41: Guide rail 42: Z-axis motor 43: Elevating plate 44: Holder 45: Rotating shaft 5: Grinding feed means 50: Ball screw 51: Guide rail 52: X-axis motor 53: Movable Plate 55: Rotating shaft 8: Tilt means 80: Ball screw 82: Tilt adjustment motor 83: Support member 9: Control means 29: Second holding means 290: Second holding surface 15: Second workpiece 150: Top surface 7: No. 2 Tilt means 70: Piezoelectric actuator 71: Support member 72: Screw

Claims (3)

A holding means having a holding surface for holding the workpiece and an annular grinding wheel having a diameter larger than that of the workpiece attached to the tip of the spindle are moved relatively in the grinding feed direction parallel to the holding surface to be covered. It is a creep feed grinding method that grinds a workpiece by creep feed.
The first tilting step of slightly tilting the spindle toward one direction of the grinding feed direction, and
The grinding wheel whose lower surface is positioned outside the workpiece held on the holding surface and lower than the upper surface of the workpiece and the holding means are relatively moved in one direction of the grinding feed direction. The first grinding process, which creep-feed grinds the upper surface of the workpiece,
A second tilting step of slightly tilting the spindle toward the other direction of the grinding feed direction after the workpiece moved in one direction has passed the grinding wheel.
The grinding wheel whose lower surface is positioned outside the workpiece and lower than the upper surface of the workpiece and the holding means are relatively moved in the other direction to creep feed the upper surface of the workpiece. A creep feed grinding method consisting of a second grinding process for grinding. A holding means having a plurality of holding surfaces for holding a plurality of workpieces on the upper surface, and an annular grinding wheel having a diameter larger than the long side or the diameter of the workpiece mounted on the tip of the spindle are parallel to the holding surfaces. This is a creep feed grinding method in which the workpiece is creep feed ground on the lower surface and the side surface of the grinding wheel by relatively moving in the grinding feed direction.
The plurality of holding surfaces are arranged side by side in the grinding feed direction.
The first tilting step of slightly tilting the spindle toward one direction of the grinding feed direction, and
The grinding wheel whose lower surface is positioned at the center of the upper surface and lower than the upper surface of the workpiece held on the holding surface and the holding means are relatively moved in one direction to the center of the upper surface. In the first grinding step of creep-feed grinding the workpiece on the one side from the above,
A second tilting step of moving the grinding wheel in one direction and slightly tilting the spindle toward the other direction in the grinding feed direction when the grinding wheel comes to the center of the upper surface.
The grinding wheel whose lower surface is positioned at the center of the holding means and lower than the upper surface of the workpiece held on the holding surface and the holding means are relatively moved in the other direction. A creep feed grinding method consisting of a second grinding step of creep feed grinding an workpiece that has not been ground in the grinding step. The creep feed grinding method according to claim 1 or 2, which comprises a repeating step of repeating the first tilting step, the first grinding step, the second tilting step, and the second grinding step.

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