JP7060997B2 - 温度制御装置、及び遺伝子検査装置 - Google Patents
温度制御装置、及び遺伝子検査装置 Download PDFInfo
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- JP7060997B2 JP7060997B2 JP2018070627A JP2018070627A JP7060997B2 JP 7060997 B2 JP7060997 B2 JP 7060997B2 JP 2018070627 A JP2018070627 A JP 2018070627A JP 2018070627 A JP2018070627 A JP 2018070627A JP 7060997 B2 JP7060997 B2 JP 7060997B2
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- C12M1/00—Apparatus for enzymology or microbiology
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- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
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- G01N35/00—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N35/00—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor
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- B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
- B01L2200/14—Process control and prevention of errors
- B01L2200/143—Quality control, feedback systems
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
- B01L2200/14—Process control and prevention of errors
- B01L2200/143—Quality control, feedback systems
- B01L2200/147—Employing temperature sensors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/18—Means for temperature control
- B01L2300/1805—Conductive heating, heat from thermostatted solids is conducted to receptacles, e.g. heating plates, blocks
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/18—Means for temperature control
- B01L2300/1805—Conductive heating, heat from thermostatted solids is conducted to receptacles, e.g. heating plates, blocks
- B01L2300/1822—Conductive heating, heat from thermostatted solids is conducted to receptacles, e.g. heating plates, blocks using Peltier elements
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N35/00—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor
- G01N2035/00346—Heating or cooling arrangements
- G01N2035/00445—Other cooling arrangements
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- Apparatus Associated With Microorganisms And Enzymes (AREA)
- Automatic Analysis And Handling Materials Therefor (AREA)
Description
Claims (9)
- 温度制御される対象であるDNAを含む溶液を内部に保持する温調対象部を備える温度制御装置であって、
所定の温度に調整される単一の温調部と、
前記温調部及び前記温調対象部に接触し前記温調部と前記温調対象部との間で伝熱する第一伝熱部と、
前記第一伝熱部及び前記温調対象部に接触し前記第一伝熱部と前記温調対象部との間で伝熱する、又は 前記温調部及び前記温調対象部に接触し前記温調部と前記温調対象部との間で伝熱する第二伝熱部と、をさらに備え、
前記温調対象部は前記第一伝熱部と前記第二伝熱部に挟まれ、
前記第二伝熱部を押圧する押圧部材をさらに備えることを特徴とする温度制御装置。 - 請求項1に記載の温度制御装置であって、
前記押圧部材によって前記第二伝熱部が押圧される方向は、前記温調対象部が前記第一伝熱部と前記第二伝熱部に挟まれる方向であることを特徴とする温度制御装置。 - 請求項2に記載の温度制御装置であって、
前記第一伝熱部または前記第二伝熱部は、押圧によって変形する変形部を有することを特徴とする温度制御装置。 - 請求項3に記載の温度制御装置であって、
前記変形部は、熱伝導シートまたは熱伝導グリースであることを特徴とする温度制御装置。 - 請求項1に記載の温度制御装置であって、
前記第二伝熱部は前記第一伝熱部及び前記温調対象部に接触し、
前記第二伝熱部が前記温調対象部を押圧する方向と、前記第二伝熱部が前記第一伝熱部を押圧する方向とは異なることを特徴とする温度制御装置。 - 請求項5に記載の温度制御装置であって、
前記第二伝熱部が前記温調対象部を押圧する方向と、前記第二伝熱部が前記第一伝熱部を押圧する方向とは直交することを特徴とする温度制御装置。 - 請求項6に記載の温度制御装置であって、
前記第一伝熱部は、前記第二伝熱部によって押圧される方向に対して前記温調部に拘束されることを特徴とする温度制御装置。 - 請求項5に記載の温度制御装置であって、
前記第二伝熱部は、L字型の断面形状を有するとともに、前記押圧部材によって押圧される斜面を有することを特徴とする温度制御装置。 - DNAを含む溶液を検査する遺伝子検査装置であって、
請求項1乃至8のいずれか一項に記載の温度制御装置を備えることを特徴とする遺伝子検査装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018070627A JP7060997B2 (ja) | 2018-04-02 | 2018-04-02 | 温度制御装置、及び遺伝子検査装置 |
CN201980018562.XA CN111836882A (zh) | 2018-04-02 | 2019-01-15 | 温度控制装置及基因检查装置 |
DE112019001002.6T DE112019001002T5 (de) | 2018-04-02 | 2019-01-15 | Temperatursteuervorrichtung und gentestvorrichtung |
GB2014414.3A GB2585786A (en) | 2018-04-02 | 2019-01-15 | Temperature control device and genetic testing device |
PCT/JP2019/000923 WO2019193806A1 (ja) | 2018-04-02 | 2019-01-15 | 温度制御装置、及び遺伝子検査装置 |
US16/977,792 US20200398282A1 (en) | 2018-04-02 | 2019-01-15 | Temperature control device and genetic testing device |
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JP2018070627A JP7060997B2 (ja) | 2018-04-02 | 2018-04-02 | 温度制御装置、及び遺伝子検査装置 |
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JP2019180245A JP2019180245A (ja) | 2019-10-24 |
JP7060997B2 true JP7060997B2 (ja) | 2022-04-27 |
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JP2018070627A Active JP7060997B2 (ja) | 2018-04-02 | 2018-04-02 | 温度制御装置、及び遺伝子検査装置 |
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US (1) | US20200398282A1 (ja) |
JP (1) | JP7060997B2 (ja) |
CN (1) | CN111836882A (ja) |
DE (1) | DE112019001002T5 (ja) |
GB (1) | GB2585786A (ja) |
WO (1) | WO2019193806A1 (ja) |
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KR20230028493A (ko) * | 2020-09-02 | 2023-02-28 | 주식회사 히타치하이테크 | 온도 제어 장치 |
WO2024111116A1 (ja) * | 2022-11-25 | 2024-05-30 | 株式会社日立ハイテク | 温度制御装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007132841A (ja) | 2005-11-11 | 2007-05-31 | Tosoh Corp | 液体加温装置 |
JP2008157932A (ja) | 2006-12-01 | 2008-07-10 | Ebara Corp | マイクロ流体デバイス、および、マイクロ流体デバイスの温度制御システム |
JP2018023334A (ja) | 2016-08-12 | 2018-02-15 | セイコーエプソン株式会社 | 熱サイクル装置、反応容器、および核酸増幅方法 |
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JPH0696688B2 (ja) | 1987-12-25 | 1994-11-30 | 日本化学塗料株式会社 | 水膨張性塗料組成物 |
JP5447655B2 (ja) | 2010-03-31 | 2014-03-19 | 日本ポリウレタン工業株式会社 | ポリウレタン樹脂形成性組成物及び鋼矢板用水膨張性止水材 |
JP5737215B2 (ja) * | 2012-03-13 | 2015-06-17 | 株式会社島津製作所 | 試料冷却装置及びサンプリング装置 |
JP6213667B2 (ja) * | 2014-04-22 | 2017-10-18 | 株式会社島津製作所 | 加熱温調用サンプルラック及びその加熱温調用サンプルラックを用いる試料温度調節装置 |
JP6685965B2 (ja) * | 2017-03-29 | 2020-04-22 | 株式会社日立ハイテク | キャピラリ電気泳動装置および恒温槽 |
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2018
- 2018-04-02 JP JP2018070627A patent/JP7060997B2/ja active Active
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2019
- 2019-01-15 DE DE112019001002.6T patent/DE112019001002T5/de not_active Withdrawn
- 2019-01-15 US US16/977,792 patent/US20200398282A1/en not_active Abandoned
- 2019-01-15 GB GB2014414.3A patent/GB2585786A/en not_active Withdrawn
- 2019-01-15 CN CN201980018562.XA patent/CN111836882A/zh active Pending
- 2019-01-15 WO PCT/JP2019/000923 patent/WO2019193806A1/ja active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007132841A (ja) | 2005-11-11 | 2007-05-31 | Tosoh Corp | 液体加温装置 |
JP2008157932A (ja) | 2006-12-01 | 2008-07-10 | Ebara Corp | マイクロ流体デバイス、および、マイクロ流体デバイスの温度制御システム |
JP2018023334A (ja) | 2016-08-12 | 2018-02-15 | セイコーエプソン株式会社 | 熱サイクル装置、反応容器、および核酸増幅方法 |
Also Published As
Publication number | Publication date |
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JP2019180245A (ja) | 2019-10-24 |
GB202014414D0 (en) | 2020-10-28 |
US20200398282A1 (en) | 2020-12-24 |
GB2585786A (en) | 2021-01-20 |
WO2019193806A1 (ja) | 2019-10-10 |
DE112019001002T5 (de) | 2020-12-10 |
CN111836882A (zh) | 2020-10-27 |
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