JP7046346B2 - Laminates and their use - Google Patents
Laminates and their use Download PDFInfo
- Publication number
- JP7046346B2 JP7046346B2 JP2017157399A JP2017157399A JP7046346B2 JP 7046346 B2 JP7046346 B2 JP 7046346B2 JP 2017157399 A JP2017157399 A JP 2017157399A JP 2017157399 A JP2017157399 A JP 2017157399A JP 7046346 B2 JP7046346 B2 JP 7046346B2
- Authority
- JP
- Japan
- Prior art keywords
- pai
- foil
- electrolytic solution
- titanate
- laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229920002312 polyamide-imide Polymers 0.000 claims description 48
- 239000004962 Polyamide-imide Substances 0.000 claims description 46
- 239000011888 foil Substances 0.000 claims description 28
- 239000002253 acid Substances 0.000 claims description 15
- 239000000539 dimer Substances 0.000 claims description 12
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 claims description 2
- 238000007334 copolymerization reaction Methods 0.000 claims description 2
- 229910001416 lithium ion Inorganic materials 0.000 claims description 2
- 239000008151 electrolyte solution Substances 0.000 description 26
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 17
- 239000000243 solution Substances 0.000 description 14
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- -1 polytetrafluoroethylene Polymers 0.000 description 8
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 229920000642 polymer Polymers 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 229910052719 titanium Inorganic materials 0.000 description 7
- 239000010936 titanium Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 238000006116 polymerization reaction Methods 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 5
- 239000007822 coupling agent Substances 0.000 description 5
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 125000005442 diisocyanate group Chemical group 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000011256 inorganic filler Substances 0.000 description 3
- 229910003475 inorganic filler Inorganic materials 0.000 description 3
- 239000012766 organic filler Substances 0.000 description 3
- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical compound C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 description 2
- OISVCGZHLKNMSJ-UHFFFAOYSA-N 2,6-dimethylpyridine Chemical compound CC1=CC=CC(C)=N1 OISVCGZHLKNMSJ-UHFFFAOYSA-N 0.000 description 2
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 2
- KNTKCYKJRSMRMZ-UHFFFAOYSA-N 3-chloropropyl-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)CCCCl KNTKCYKJRSMRMZ-UHFFFAOYSA-N 0.000 description 2
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 2
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 2
- KLQSRTKDOLFPQJ-UHFFFAOYSA-M CCCCO[Ti+](OCCCC)OCCCC.CCCCCCCCCCCCCCCCCC([O-])=O Chemical compound CCCCO[Ti+](OCCCC)OCCCC.CCCCCCCCCCCCCCCCCC([O-])=O KLQSRTKDOLFPQJ-UHFFFAOYSA-M 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 229920001661 Chitosan Polymers 0.000 description 2
- 229910013870 LiPF 6 Inorganic materials 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- WQDUMFSSJAZKTM-UHFFFAOYSA-N Sodium methoxide Chemical compound [Na+].[O-]C WQDUMFSSJAZKTM-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 2
- UMHKOAYRTRADAT-UHFFFAOYSA-N [hydroxy(octoxy)phosphoryl] octyl hydrogen phosphate Chemical compound CCCCCCCCOP(O)(=O)OP(O)(=O)OCCCCCCCC UMHKOAYRTRADAT-UHFFFAOYSA-N 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- FPCJKVGGYOAWIZ-UHFFFAOYSA-N butan-1-ol;titanium Chemical compound [Ti].CCCCO.CCCCO.CCCCO.CCCCO FPCJKVGGYOAWIZ-UHFFFAOYSA-N 0.000 description 2
- 239000004202 carbamide Substances 0.000 description 2
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 150000001991 dicarboxylic acids Chemical class 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 2
- NROKBHXJSPEDAR-UHFFFAOYSA-M potassium fluoride Chemical compound [F-].[K+] NROKBHXJSPEDAR-UHFFFAOYSA-M 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- PUZPDOWCWNUUKD-UHFFFAOYSA-M sodium fluoride Chemical compound [F-].[Na+] PUZPDOWCWNUUKD-UHFFFAOYSA-M 0.000 description 2
- JMXKSZRRTHPKDL-UHFFFAOYSA-N titanium ethoxide Chemical compound [Ti+4].CC[O-].CC[O-].CC[O-].CC[O-] JMXKSZRRTHPKDL-UHFFFAOYSA-N 0.000 description 2
- VXUYXOFXAQZZMF-UHFFFAOYSA-N titanium(IV) isopropoxide Chemical compound CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- RYSXWUYLAWPLES-MTOQALJVSA-N (Z)-4-hydroxypent-3-en-2-one titanium Chemical compound [Ti].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O RYSXWUYLAWPLES-MTOQALJVSA-N 0.000 description 1
- YOBOXHGSEJBUPB-MTOQALJVSA-N (z)-4-hydroxypent-3-en-2-one;zirconium Chemical compound [Zr].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O YOBOXHGSEJBUPB-MTOQALJVSA-N 0.000 description 1
- UWHSPZZUAYSGTB-UHFFFAOYSA-N 1,1,3,3-tetraethylurea Chemical compound CCN(CC)C(=O)N(CC)CC UWHSPZZUAYSGTB-UHFFFAOYSA-N 0.000 description 1
- AVQQQNCBBIEMEU-UHFFFAOYSA-N 1,1,3,3-tetramethylurea Chemical compound CN(C)C(=O)N(C)C AVQQQNCBBIEMEU-UHFFFAOYSA-N 0.000 description 1
- CYSGHNMQYZDMIA-UHFFFAOYSA-N 1,3-Dimethyl-2-imidazolidinon Chemical compound CN1CCN(C)C1=O CYSGHNMQYZDMIA-UHFFFAOYSA-N 0.000 description 1
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical group CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 1
- HIQAWCBKWSQMRQ-UHFFFAOYSA-N 16-methylheptadecanoic acid;2-methylprop-2-enoic acid;propan-2-ol;titanium Chemical compound [Ti].CC(C)O.CC(=C)C(O)=O.CC(=C)C(O)=O.CC(C)CCCCCCCCCCCCCCC(O)=O HIQAWCBKWSQMRQ-UHFFFAOYSA-N 0.000 description 1
- RWLALWYNXFYRGW-UHFFFAOYSA-N 2-Ethyl-1,3-hexanediol Chemical compound CCCC(O)C(CC)CO RWLALWYNXFYRGW-UHFFFAOYSA-N 0.000 description 1
- CLYUOMVYYFJUBR-UHFFFAOYSA-N 2-[methyl-bis[2-(2-methylprop-2-enoyloxy)ethoxy]silyl]oxyethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCO[Si](C)(OCCOC(=O)C(C)=C)OCCOC(=O)C(C)=C CLYUOMVYYFJUBR-UHFFFAOYSA-N 0.000 description 1
- KKOHCQAVIJDYAF-UHFFFAOYSA-N 2-dodecylbenzenesulfonic acid;propan-2-ol;titanium Chemical compound [Ti].CC(C)O.CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O.CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O.CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O KKOHCQAVIJDYAF-UHFFFAOYSA-N 0.000 description 1
- AIFLGMNWQFPTAJ-UHFFFAOYSA-J 2-hydroxypropanoate;titanium(4+) Chemical compound [Ti+4].CC(O)C([O-])=O.CC(O)C([O-])=O.CC(O)C([O-])=O.CC(O)C([O-])=O AIFLGMNWQFPTAJ-UHFFFAOYSA-J 0.000 description 1
- LYPJRFIBDHNQLY-UHFFFAOYSA-J 2-hydroxypropanoate;zirconium(4+) Chemical compound [Zr+4].CC(O)C([O-])=O.CC(O)C([O-])=O.CC(O)C([O-])=O.CC(O)C([O-])=O LYPJRFIBDHNQLY-UHFFFAOYSA-J 0.000 description 1
- YTOQRQCHVNXEFB-UHFFFAOYSA-N 2-methylpropan-1-ol;titanium Chemical compound [Ti].CC(C)CO YTOQRQCHVNXEFB-UHFFFAOYSA-N 0.000 description 1
- BSKHPKMHTQYZBB-UHFFFAOYSA-N 2-methylpyridine Chemical compound CC1=CC=CC=N1 BSKHPKMHTQYZBB-UHFFFAOYSA-N 0.000 description 1
- GHWPPBZDJQYMDI-UHFFFAOYSA-N 3-[3-[benzyl(ethenyl)amino]propoxy-dimethoxysilyl]propan-1-amine Chemical compound NCCC[Si](OC)(OC)OCCCN(C=C)CC1=CC=CC=C1 GHWPPBZDJQYMDI-UHFFFAOYSA-N 0.000 description 1
- HXLAEGYMDGUSBD-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propan-1-amine Chemical compound CCO[Si](C)(OCC)CCCN HXLAEGYMDGUSBD-UHFFFAOYSA-N 0.000 description 1
- ZYAASQNKCWTPKI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propan-1-amine Chemical compound CO[Si](C)(OC)CCCN ZYAASQNKCWTPKI-UHFFFAOYSA-N 0.000 description 1
- IKYAJDOSWUATPI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propane-1-thiol Chemical compound CO[Si](C)(OC)CCCS IKYAJDOSWUATPI-UHFFFAOYSA-N 0.000 description 1
- LZMNXXQIQIHFGC-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C(C)=C LZMNXXQIQIHFGC-UHFFFAOYSA-N 0.000 description 1
- PJURIXUDYDHOMA-UHFFFAOYSA-N 3-[tris[2-(2-methoxyethoxy)ethoxy]silyl]propan-1-amine Chemical compound COCCOCCO[Si](CCCN)(OCCOCCOC)OCCOCCOC PJURIXUDYDHOMA-UHFFFAOYSA-N 0.000 description 1
- KEZMLECYELSZDC-UHFFFAOYSA-N 3-chloropropyl-diethoxy-methylsilane Chemical compound CCO[Si](C)(OCC)CCCCl KEZMLECYELSZDC-UHFFFAOYSA-N 0.000 description 1
- DCQBZYNUSLHVJC-UHFFFAOYSA-N 3-triethoxysilylpropane-1-thiol Chemical compound CCO[Si](OCC)(OCC)CCCS DCQBZYNUSLHVJC-UHFFFAOYSA-N 0.000 description 1
- LVNLBBGBASVLLI-UHFFFAOYSA-N 3-triethoxysilylpropylurea Chemical compound CCO[Si](OCC)(OCC)CCCNC(N)=O LVNLBBGBASVLLI-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- LVACOMKKELLCHJ-UHFFFAOYSA-N 3-trimethoxysilylpropylurea Chemical compound CO[Si](OC)(OC)CCCNC(N)=O LVACOMKKELLCHJ-UHFFFAOYSA-N 0.000 description 1
- UITKHKNFVCYWNG-UHFFFAOYSA-N 4-(3,4-dicarboxybenzoyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 UITKHKNFVCYWNG-UHFFFAOYSA-N 0.000 description 1
- AIVVXPSKEVWKMY-UHFFFAOYSA-N 4-(3,4-dicarboxyphenoxy)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1OC1=CC=C(C(O)=O)C(C(O)=O)=C1 AIVVXPSKEVWKMY-UHFFFAOYSA-N 0.000 description 1
- AVCOFPOLGHKJQB-UHFFFAOYSA-N 4-(3,4-dicarboxyphenyl)sulfonylphthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1S(=O)(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 AVCOFPOLGHKJQB-UHFFFAOYSA-N 0.000 description 1
- VGIURMCNTDVGJM-UHFFFAOYSA-N 4-triethoxysilylbutanenitrile Chemical compound CCO[Si](OCC)(OCC)CCCC#N VGIURMCNTDVGJM-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- FERIUCNNQQJTOY-UHFFFAOYSA-M Butyrate Chemical compound CCCC([O-])=O FERIUCNNQQJTOY-UHFFFAOYSA-M 0.000 description 1
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Natural products CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 1
- KYXHKHDZJSDWEF-LHLOQNFPSA-N CCCCCCC1=C(CCCCCC)C(\C=C\CCCCCCCC(O)=O)C(CCCCCCCC(O)=O)CC1 Chemical compound CCCCCCC1=C(CCCCCC)C(\C=C\CCCCCCCC(O)=O)C(CCCCCCCC(O)=O)CC1 KYXHKHDZJSDWEF-LHLOQNFPSA-N 0.000 description 1
- DEKKRYGGQQQYSA-UHFFFAOYSA-N CCO[SiH3].N=C=O Chemical compound CCO[SiH3].N=C=O DEKKRYGGQQQYSA-UHFFFAOYSA-N 0.000 description 1
- 235000002568 Capsicum frutescens Nutrition 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- OIFBSDVPJOWBCH-UHFFFAOYSA-N Diethyl carbonate Chemical compound CCOC(=O)OCC OIFBSDVPJOWBCH-UHFFFAOYSA-N 0.000 description 1
- KMTRUDSVKNLOMY-UHFFFAOYSA-N Ethylene carbonate Chemical compound O=C1OCCO1 KMTRUDSVKNLOMY-UHFFFAOYSA-N 0.000 description 1
- AEMRFAOFKBGASW-UHFFFAOYSA-M Glycolate Chemical compound OCC([O-])=O AEMRFAOFKBGASW-UHFFFAOYSA-M 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- DRNPGEPMHMPIQU-UHFFFAOYSA-N O.[Ti].[Ti].CCCCO.CCCCO.CCCCO.CCCCO.CCCCO.CCCCO Chemical compound O.[Ti].[Ti].CCCCO.CCCCO.CCCCO.CCCCO.CCCCO.CCCCO DRNPGEPMHMPIQU-UHFFFAOYSA-N 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- KXADJRSJQJTTNM-UHFFFAOYSA-N [Ti+4].C(CCCCCCC)P([O-])([O-])([O-])CCCCCCCC.C(CCCCCCC)P([O-])([O-])([O-])CCCCCCCC.C(CCCCCCC)P([O-])([O-])([O-])CCCCCCCC.C(CCCCCCC)P([O-])([O-])([O-])CCCCCCCC.[Ti+4].[Ti+4] Chemical compound [Ti+4].C(CCCCCCC)P([O-])([O-])([O-])CCCCCCCC.C(CCCCCCC)P([O-])([O-])([O-])CCCCCCCC.C(CCCCCCC)P([O-])([O-])([O-])CCCCCCCC.C(CCCCCCC)P([O-])([O-])([O-])CCCCCCCC.[Ti+4].[Ti+4] KXADJRSJQJTTNM-UHFFFAOYSA-N 0.000 description 1
- GENDSIUNIUOKGX-UHFFFAOYSA-N [Ti+4].C(CCCCCCCCCCCC)P([O-])([O-])([O-])CCCCCCCCCCCCC.C(CCCCCCCCCCCC)P([O-])([O-])([O-])CCCCCCCCCCCCC.C(CCCCCCCCCCCC)P([O-])([O-])([O-])CCCCCCCCCCCCC.C(CCCCCCCCCCCC)P([O-])([O-])([O-])CCCCCCCCCCCCC.[Ti+4].[Ti+4] Chemical compound [Ti+4].C(CCCCCCCCCCCC)P([O-])([O-])([O-])CCCCCCCCCCCCC.C(CCCCCCCCCCCC)P([O-])([O-])([O-])CCCCCCCCCCCCC.C(CCCCCCCCCCCC)P([O-])([O-])([O-])CCCCCCCCCCCCC.C(CCCCCCCCCCCC)P([O-])([O-])([O-])CCCCCCCCCCCCC.[Ti+4].[Ti+4] GENDSIUNIUOKGX-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- UGAPHEBNTGUMBB-UHFFFAOYSA-N acetic acid;ethyl acetate Chemical compound CC(O)=O.CCOC(C)=O UGAPHEBNTGUMBB-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- 150000004645 aluminates Chemical class 0.000 description 1
- SMZOGRDCAXLAAR-UHFFFAOYSA-N aluminium isopropoxide Chemical compound [Al+3].CC(C)[O-].CC(C)[O-].CC(C)[O-] SMZOGRDCAXLAAR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- JPUHCPXFQIXLMW-UHFFFAOYSA-N aluminium triethoxide Chemical compound CCO[Al](OCC)OCC JPUHCPXFQIXLMW-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- XRASGLNHKOPXQL-UHFFFAOYSA-L azane 2-oxidopropanoate titanium(4+) dihydrate Chemical compound N.N.O.O.[Ti+4].CC([O-])C([O-])=O.CC([O-])C([O-])=O XRASGLNHKOPXQL-UHFFFAOYSA-L 0.000 description 1
- HZCPJQFMTINPNP-GCNXSBQASA-K bis[[4-[(Z)-octadec-9-enoxy]-2-propan-2-yloxybutanoyl]oxy]alumanyl 4-[(Z)-octadec-9-enoxy]-2-propan-2-yloxybutanoate Chemical compound CCCCCCCC/C=C\CCCCCCCCOCCC(OC(C)C)C(=O)O[Al](OC(=O)C(OC(C)C)CCOCCCCCCCC/C=C\CCCCCCCC)OC(=O)C(OC(C)C)CCOCCCCCCCC/C=C\CCCCCCCC HZCPJQFMTINPNP-GCNXSBQASA-K 0.000 description 1
- BSDOQSMQCZQLDV-UHFFFAOYSA-N butan-1-olate;zirconium(4+) Chemical compound [Zr+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] BSDOQSMQCZQLDV-UHFFFAOYSA-N 0.000 description 1
- HSVPRYWNEODRGU-UHFFFAOYSA-J butanoate;zirconium(4+) Chemical compound [Zr+4].CCCC([O-])=O.CCCC([O-])=O.CCCC([O-])=O.CCCC([O-])=O HSVPRYWNEODRGU-UHFFFAOYSA-J 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- UCJHMXXKIKBHQP-UHFFFAOYSA-N dichloro-(3-chloropropyl)-methylsilane Chemical compound C[Si](Cl)(Cl)CCCCl UCJHMXXKIKBHQP-UHFFFAOYSA-N 0.000 description 1
- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 description 1
- KHEMNHQQEMAABL-UHFFFAOYSA-J dihydroxy(dioxo)chromium Chemical compound O[Cr](O)(=O)=O.O[Cr](O)(=O)=O KHEMNHQQEMAABL-UHFFFAOYSA-J 0.000 description 1
- WMYWOWFOOVUPFY-UHFFFAOYSA-L dihydroxy(dioxo)chromium;phosphoric acid Chemical compound OP(O)(O)=O.O[Cr](O)(=O)=O WMYWOWFOOVUPFY-UHFFFAOYSA-L 0.000 description 1
- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 description 1
- IEJIGPNLZYLLBP-UHFFFAOYSA-N dimethyl carbonate Chemical compound COC(=O)OC IEJIGPNLZYLLBP-UHFFFAOYSA-N 0.000 description 1
- WSFMFXQNYPNYGG-UHFFFAOYSA-M dimethyl-octadecyl-(3-trimethoxysilylpropyl)azanium;chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCCCC[N+](C)(C)CCC[Si](OC)(OC)OC WSFMFXQNYPNYGG-UHFFFAOYSA-M 0.000 description 1
- HPYNZHMRTTWQTB-UHFFFAOYSA-N dimethylpyridine Natural products CC1=CC=CN=C1C HPYNZHMRTTWQTB-UHFFFAOYSA-N 0.000 description 1
- HTDKEJXHILZNPP-UHFFFAOYSA-N dioctyl hydrogen phosphate Chemical compound CCCCCCCCOP(O)(=O)OCCCCCCCC HTDKEJXHILZNPP-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- VTIXMGZYGRZMAW-UHFFFAOYSA-N ditridecyl hydrogen phosphite Chemical compound CCCCCCCCCCCCCOP(O)OCCCCCCCCCCCCC VTIXMGZYGRZMAW-UHFFFAOYSA-N 0.000 description 1
- GUVUOGQBMYCBQP-UHFFFAOYSA-N dmpu Chemical compound CN1CCCN(C)C1=O GUVUOGQBMYCBQP-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- BEGAGPQQLCVASI-UHFFFAOYSA-N ethyl 2-hydroxypropanoate;titanium Chemical compound [Ti].CCOC(=O)C(C)O BEGAGPQQLCVASI-UHFFFAOYSA-N 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- XYIBRDXRRQCHLP-UHFFFAOYSA-N ethyl acetoacetate Chemical compound CCOC(=O)CC(C)=O XYIBRDXRRQCHLP-UHFFFAOYSA-N 0.000 description 1
- 229940093858 ethyl acetoacetate Drugs 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 229960005082 etohexadiol Drugs 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- FUCCZFISQTYRNK-UHFFFAOYSA-N isocyanato(dimethyl)silane Chemical compound C[SiH](C)N=C=O FUCCZFISQTYRNK-UHFFFAOYSA-N 0.000 description 1
- NIZHERJWXFHGGU-UHFFFAOYSA-N isocyanato(trimethyl)silane Chemical compound C[Si](C)(C)N=C=O NIZHERJWXFHGGU-UHFFFAOYSA-N 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 238000007561 laser diffraction method Methods 0.000 description 1
- JILPJDVXYVTZDQ-UHFFFAOYSA-N lithium methoxide Chemical compound [Li+].[O-]C JILPJDVXYVTZDQ-UHFFFAOYSA-N 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- KOXQZISAMDUXGH-UHFFFAOYSA-N methyl-tris(oxiran-2-ylmethoxy)silane Chemical compound C1OC1CO[Si](OCC1OC1)(C)OCC1CO1 KOXQZISAMDUXGH-UHFFFAOYSA-N 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- DVYVMJLSUSGYMH-UHFFFAOYSA-N n-methyl-3-trimethoxysilylpropan-1-amine Chemical compound CNCCC[Si](OC)(OC)OC DVYVMJLSUSGYMH-UHFFFAOYSA-N 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- KQJBQMSCFSJABN-UHFFFAOYSA-N octadecan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCCCCCCCCCCCCCCCC[O-].CCCCCCCCCCCCCCCCCC[O-].CCCCCCCCCCCCCCCCCC[O-].CCCCCCCCCCCCCCCCCC[O-] KQJBQMSCFSJABN-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- MSRJTTSHWYDFIU-UHFFFAOYSA-N octyltriethoxysilane Chemical compound CCCCCCCC[Si](OCC)(OCC)OCC MSRJTTSHWYDFIU-UHFFFAOYSA-N 0.000 description 1
- 229960003493 octyltriethoxysilane Drugs 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- UCUUFSAXZMGPGH-UHFFFAOYSA-N penta-1,4-dien-3-one Chemical compound C=CC(=O)C=C UCUUFSAXZMGPGH-UHFFFAOYSA-N 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 239000011698 potassium fluoride Substances 0.000 description 1
- 235000003270 potassium fluoride Nutrition 0.000 description 1
- CUQOHAYJWVTKDE-UHFFFAOYSA-N potassium;butan-1-olate Chemical compound [K+].CCCC[O-] CUQOHAYJWVTKDE-UHFFFAOYSA-N 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- HKJYVRJHDIPMQB-UHFFFAOYSA-N propan-1-olate;titanium(4+) Chemical compound CCCO[Ti](OCCC)(OCCC)OCCC HKJYVRJHDIPMQB-UHFFFAOYSA-N 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000000790 scattering method Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000011775 sodium fluoride Substances 0.000 description 1
- 235000013024 sodium fluoride Nutrition 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 125000003698 tetramethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- ZOYFEXPFPVDYIS-UHFFFAOYSA-N trichloro(ethyl)silane Chemical compound CC[Si](Cl)(Cl)Cl ZOYFEXPFPVDYIS-UHFFFAOYSA-N 0.000 description 1
- KWDQAHIRKOXFAV-UHFFFAOYSA-N trichloro(pentyl)silane Chemical compound CCCCC[Si](Cl)(Cl)Cl KWDQAHIRKOXFAV-UHFFFAOYSA-N 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- XYJRNCYWTVGEEG-UHFFFAOYSA-N trimethoxy(2-methylpropyl)silane Chemical compound CO[Si](OC)(OC)CC(C)C XYJRNCYWTVGEEG-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- SIOVKLKJSOKLIF-HJWRWDBZSA-N trimethylsilyl (1z)-n-trimethylsilylethanimidate Chemical compound C[Si](C)(C)OC(/C)=N\[Si](C)(C)C SIOVKLKJSOKLIF-HJWRWDBZSA-N 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
- LRXTYHSAJDENHV-UHFFFAOYSA-H zinc phosphate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LRXTYHSAJDENHV-UHFFFAOYSA-H 0.000 description 1
- 229910000165 zinc phosphate Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Laminated Bodies (AREA)
- Sealing Battery Cases Or Jackets (AREA)
Description
本発明は、リチウムイオン二次電池(LiB)の外装用部材等に好適に使用される積層体に関する。 The present invention relates to a laminate preferably used for an exterior member or the like of a lithium ion secondary battery (LiB).
LiBは、例えば、携帯電話、ノート型パソコン、ビデオカメラ、衛星、電気自動車等の分野で広く用いられている。LiBは、電極(正極および負極)、電解液、セパレータからなるLiBセル本体と、これらを包装するタブ端子、セル収納部材等の外装用部材とから構成されている。 LiB is widely used in the fields of mobile phones, notebook computers, video cameras, satellites, electric vehicles and the like, for example. The LiB is composed of a LiB cell main body composed of an electrode (positive electrode and a negative electrode), an electrolytic solution, and a separator, and an exterior member such as a tab terminal for packaging the electrode and a cell storage member.
これらLiB用外装部にはアルミニウム(Al)箔が多用されている。 このAl箔には、耐電解液性、耐HF性等の厳しい信頼性が要求される。ここで、HFは、吸湿等により電解液中に微量残留している水により、LiPF6等の電解質が加水分解して生じるものである。そのため、Al箔表面にこれを腐食等から保護するための樹脂被膜を設ける方法が提案されている。例えば、特許文献1にはキトサンからなる被膜をAl箔表面に設けた積層体が提案されている。また、特許文献2には、変性PVAからなる被膜をAl箔表面に設けたAl積層体が提案されている。 Aluminum (Al) foil is often used for these LiB exterior parts. This Al foil is required to have strict reliability such as electrolytic solution resistance and HF resistance. Here, HF is generated by hydrolyzing an electrolyte such as LiPF 6 with water remaining in a trace amount in the electrolytic solution due to moisture absorption or the like. Therefore, a method of providing a resin film on the surface of the Al foil to protect it from corrosion and the like has been proposed. For example, Patent Document 1 proposes a laminate in which a film made of chitosan is provided on the surface of an Al foil. Further, Patent Document 2 proposes an Al laminate in which a film made of modified PVA is provided on the surface of an Al foil.
これらキトサンや変性PVAからなる被膜は、耐熱性に乏しいという問題があった。そこで、特許文献3,4には、耐熱性に優れたポリアミドイミド(PAI)からなる被膜をAl箔表面に設けたPAl積層体が提案されている。 The film made of chitosan or modified PVA has a problem of poor heat resistance. Therefore, Patent Documents 3 and 4 propose a PAl laminate in which a film made of polyamide-imide (PAI) having excellent heat resistance is provided on the surface of an Al foil.
しかしながら、前記文献に開示されたPAI被膜が形成されたAl積層体は、Al箔に対する接着性に乏しく、例えば、LiBの外装用部材等として使用された際の接着信頼性に欠けるという問題があった。 However, the Al laminate on which the PAI film is formed disclosed in the above document has a problem of poor adhesiveness to the Al foil, and lacks adhesive reliability when used as, for example, an exterior member of LiB. rice field.
そこで本発明は、前記課題を解決するものであって、Al箔に対する接着強度が高く、接着信頼性に優れた積層体の提供を目的とする。 Therefore, the present invention solves the above-mentioned problems, and an object of the present invention is to provide a laminate having high adhesive strength to Al foil and excellent adhesive reliability.
本発明者らは、PAIの化学構造を特定のものとすることで、前記課題が解決されることを見出し、本発明の完成に至った。 The present inventors have found that the above-mentioned problems can be solved by specifying the chemical structure of PAI, and have completed the present invention.
本発明は下記を趣旨とするものである。
(1) Al箔の表面にPAI被膜が形成された積層体であって、PAIは、カルボン酸成分としてダイマー酸を用いた共重合PAIであることを特徴とする積層体。
(2) 前記積層体のLiB外装用部材への使用。
The present invention has the following object.
(1) A laminate in which a PAI film is formed on the surface of an Al foil, wherein the PAI is a copolymerized PAI using dimer acid as a carboxylic acid component.
(2) Use of the laminated body as a LiB exterior member.
本発明のAl箔上にPAI被膜が積層された本発明の積層体は、接着信頼性に優れ、良好な耐電解液性を有するので、LiB外装用部材等として好適に使用することができる。 The laminate of the present invention in which the PAI film is laminated on the Al foil of the present invention has excellent adhesive reliability and good electrolytic solution resistance, and therefore can be suitably used as a LiB exterior member or the like.
以下、本発明について詳細に説明する。 Hereinafter, the present invention will be described in detail.
PAIは、主鎖にイミド結合とアミド結合の両方を有する高分子であり、固有粘度が0.5dl/g以上であり、かつガラス転移温度(Tg)が150℃以上であるものが、耐熱性や強度の点で好ましい。 PAI is a polymer having both an imide bond and an amide bond in the main chain, and a polymer having an intrinsic viscosity of 0.5 dl / g or more and a glass transition temperature (Tg) of 150 ° C. or more is heat resistant. And strength are preferable.
本発明のPAI被膜で用いられるPAIは、カルボン酸成分としてダイマー酸を用いた共重合PAIである。このようなPAIは、公知のPAIであり、例えば、特開平11-21454号公報に記載されている方法により得ることができる。すなわち、カルボン酸成分であるトリメリット酸無水物(TMA)およびダイマー酸と、ジイソシアネートとを重合溶媒に溶解して加熱撹拌して重合反応を進めることにより得ることができる。カルボン酸成分とジイソシアネートとは、通常、等モルを用いることにより重合反応するが、必要に応じ、一方の成分を多少増減させてもよい。重合温度は、通常50℃~220℃であり、80℃~200℃が好ましい。 The PAI used in the PAI coating of the present invention is a copolymerized PAI using dimer acid as a carboxylic acid component. Such a PAI is a known PAI and can be obtained, for example, by the method described in JP-A-11-21454. That is, it can be obtained by dissolving trimellitic acid anhydride (TMA), which is a carboxylic acid component, dimer acid, and diisocyanate in a polymerization solvent and heating and stirring to proceed with the polymerization reaction. The carboxylic acid component and the diisocyanate are usually polymerized by using equimolar, but one component may be slightly increased or decreased as necessary. The polymerization temperature is usually 50 ° C. to 220 ° C., preferably 80 ° C. to 200 ° C.
PAIの重合に際しては、例えば、トリエチルアミン、ルチジン、ピコリン、トリエチレンジアミン等のアミン類、リチウムメトキサイド、ナトリウムメトキサイド、カリウムブトキサイド、フッ化カリウム、フッ化ナトリウムなどのアルカリ金属、アルカリ土類金属化合物等、触媒の存在下に行ってもよい。 In the polymerization of PAI, for example, amines such as triethylamine, lutidine, picolin and triethylenediamine, alkali metals such as lithium methoxide, sodium methoxide, potassium butoxide, potassium fluoride and sodium fluoride, and alkaline earth metals. It may be carried out in the presence of a catalyst such as a compound.
PAIの重合に用いられるカルボン酸成分としては、TMAおよびダイマー酸が用いられるが、TMAは、その一部を他の多価カルボン酸無水物に置換えることができる。多価カルボン酸無水物の具体例としては、ピロメリット酸無水物、ベンゾフェノンテトラカルボン酸無水物、3,3′,4,4′-ジフェニルスルホンテトラカルボン酸無水物、3,3′,4,4′-ジフェニルテトラカルボン酸無水物、4,4′-オキシジフタル酸無水物等を挙げることができる。これらは、単独で用いてもよく、2種以上を組み合わせて用いてもよい。 As the carboxylic acid component used for the polymerization of PAI, TMA and dimer acid are used, and TMA can partially replace a part thereof with another polyvalent carboxylic acid anhydride. Specific examples of the polyvalent carboxylic acid anhydride include pyromellitic acid anhydride, benzophenone tetracarboxylic acid anhydride, 3,3', 4,4'-diphenylsulfone tetracarboxylic acid anhydride, 3,3', 4, Examples thereof include 4'-diphenyltetracarboxylic acid anhydride and 4,4'-oxydiphthalic acid anhydride. These may be used alone or in combination of two or more.
ダイマー酸は、炭素数が36の飽和または不飽和のジカルボン酸を主として含むジカルボン酸の混合物であり、市販品を用いることができる。市販品の具体例としては、クローダジャパン社製の「PRIPOL」、ハリマ化成株式会社製の「ハリダイマー」、BASFジャパン社製の「EMPOL」、築野食品化学工業社製の「ツノダイム」等を挙げることができる。これらは、単独で用いてもよく、2種以上を組み合わせて用いてもよい。 Dimeric acid is a mixture of dicarboxylic acids mainly containing saturated or unsaturated dicarboxylic acids having 36 carbon atoms, and commercially available products can be used. Specific examples of commercially available products include "PRIPOL" manufactured by Croda Japan, "Haridimer" manufactured by Harima Chemicals, "EMPOL" manufactured by BASF Japan, and "Tsunodaime" manufactured by Tsukino Food Chemicals Co., Ltd. be able to. These may be used alone or in combination of two or more.
ダイマー酸の共重合比率は、全カルボン酸成分に対し、0.1モル%以上、30モル%以下とすることが好ましく、0.5モル%以上、20モル%以下とすることがより好ましい。このようにダイマー酸を共重合することにより、Al箔との強固な接着性を確保することができる。 The copolymerization ratio of dimer acid is preferably 0.1 mol% or more and 30 mol% or less, and more preferably 0.5 mol% or more and 20 mol% or less with respect to the total carboxylic acid component. By copolymerizing the dimer acid in this way, strong adhesiveness to the Al foil can be ensured.
ジイソシアネートの具体例としては、4,4′-ジフェニルメタンジイソシアネート(MDI)、4,4′-ジアミノジシクロヘキシルメタンジイソシアネート、イソホロンジイソシアネート等を挙げることができ、MDIが好ましい。これらは、単独で用いてもよく、2種以上を組み合わせて用いてもよい。 Specific examples of the diisocyanate include 4,4'-diphenylmethane diisocyanate (MDI), 4,4'-diaminodicyclohexylmethane diisocyanate, isophorone diisocyanate and the like, and MDI is preferable. These may be used alone or in combination of two or more.
PAIの重合は、アミド系溶媒、尿素系溶媒中で行うことが好ましい。アミド系溶媒の具体例としては、N-メチル-2-ピロリドン(NMP)、N,N-ジメチルホルムアミド、N,N-ジメチルアセトアミド(DMAc)等を挙げることができる。また、尿素系溶媒の具体例としては、テトラメチル尿素、テトラエチル尿素、ジメチルエチレン尿素、ジメチルプロピレン尿素等を挙げることができる。これらの中で、NMPおよびDMAcが好ましい。これらは単独で用いてもよく、2種以上を組み合わせて用いてもよい。 The polymerization of PAI is preferably carried out in an amide-based solvent or a urea-based solvent. Specific examples of the amide-based solvent include N-methyl-2-pyrrolidone (NMP), N, N-dimethylformamide, N, N-dimethylacetamide (DMAc) and the like. Specific examples of the urea-based solvent include tetramethylurea, tetraethylurea, dimethylethyleneurea, and dimethylpropyleneurea. Of these, NMP and DMAc are preferred. These may be used alone or in combination of two or more.
前記のようにして得られたPAI溶液には、フィラを配合することができる。フィラの種類に制限は無く、有機フィラ、無機フィラおよびその混合物等を用いることができる。有機フィラの具体例としては、スチレン、ビニルケトン、アクリロニトリル、メタクリル酸メチル、メタクリル酸エチル、グリシジルメタクリレート、グリシジルアクリレート、アクリル酸メチル等の単独重合体または2種類以上の共重合体、ポリテトラフルオロエチレン、4フッ化エチレン-6フッ化プロピレン共重合体、4フッ化エチレン-エチレン共重合体、ポリビニリデンフルオライド等の重合体からなる粒子を挙げることができる。有機フィラは、単独または2種以上を混合して用いることができる。無機フィラの具体例としては、金属酸化物、金属窒化物、金属炭化物、金属水酸化物、炭酸塩、硫酸塩等の無機物からなる粒子を挙げることができる。具体例としては、アルミナ、シリカ、二酸化チタン、硫酸バリウムまたは炭酸カルシウム等からなる粉体を挙げることができる。無機フィラは、単独または2種以上を混合して用いることができる。フィラの平均粒子径に制限はないが、0.01μm以上、2μm以下であることが好ましい。平均粒子径はレーザ回折散乱法に基づく測定装置により測定することができる。 Fila can be added to the PAI solution obtained as described above. The type of filler is not limited, and organic fillers, inorganic fillers and mixtures thereof can be used. Specific examples of the organic filler include homopolymers such as styrene, vinyl ketone, acrylonitrile, methyl methacrylate, ethyl methacrylate, glycidyl methacrylate, glycidyl acrylate, and methyl acrylate, or two or more copolymers, polytetrafluoroethylene, and the like. Examples thereof include particles made of a polymer such as tetrafluoroethylene-6 fluoride propylene copolymer, tetrafluoride ethylene-ethylene copolymer, and polyvinylidene fluoride. The organic filler can be used alone or in combination of two or more. Specific examples of the inorganic filler include particles made of an inorganic substance such as a metal oxide, a metal nitride, a metal carbide, a metal hydroxide, a carbonate, and a sulfate. Specific examples include powders made of alumina, silica, titanium dioxide, barium sulfate, calcium carbonate and the like. The inorganic filler can be used alone or in combination of two or more. The average particle size of the filler is not limited, but is preferably 0.01 μm or more and 2 μm or less. The average particle size can be measured by a measuring device based on the laser diffraction / scattering method.
PAI溶液には、各種カップリング剤(シラン系、アルミネート系、チタネート系、ジルコネート系等)を配合して接着性を向上させることができる。 Various coupling agents (silane type, aluminum type, titanate type, zirconate type, etc.) can be blended in the PAI solution to improve the adhesiveness.
シラン系カップリング剤の具体例としては、ビニルトリクロルシラン、ビニルトリス(β-メトキシエトキシ)シラン、ビニルトリエトキシシラン、ビニルトリメトキシシラン、ビニルトリエトキシシラン、γ-メタクリロキシプロピルトリメトキシシラン、γ-メタクリロキシプロピルメチルジメトキシシラン、β-(3,4-エポキシシクロヘキシル)エチルトリメトキシシラン、γ-グリシドキシプロピルトリメトキシシラン、γ-グリシドキシプロピルメチルジメトキシシラン、γ-グリシドキシプロピルメチルジエトキシシラン、N-β(アミノエチル)γ-アミノプロピルトリメトキシシラン、n-β(アミノエチル)γ-アミノプロピルメチルジメトキシシラン、γ-アミノプロピルトリエトキシシラン、N-フェニル-γ-アミノプロピルトリメトキシシラン、γ-メルカプトプロピルトリメトキシシラン、γ-メルカプトプロピルトリエトキシシラン、3-アミノプロピル-メチル-ジエトキシシラン、3-ウレイドプロピルトリエトキシシラン、3-ウレイドプロピルトリメトキシシラン、3-アミノプロピルトリメトキシシラン、3-アミノプロピル-トリス(2-メトキシ-エトキシ-エトキシ)シラン、N-メチル-3-アミノプロピルトリメトキシシラン、トリアミノプロピル-トリメトキシシラン、3-4,5-ジヒドロイミダゾールプロピルトリメトキシシラン、3ーメタクリロキシプロピル-トリメトキシシラン、3-メルカプトプロピル-メチルジメトキシシラン、3-クロロプロピル-メチル-ジメトキシシラン、3-シアノプロピル-トリエトキシシラン、ヘキサメチルジシラザン、N,O-ビス(トリメチルシリル)アセトアミド、メチルトリメトキシシラン、メチルトリエトキシシラン、エチルトリクロロシラン、n-プロピルトリメトキシシラン、イソブチルトリメトキシシラン、アミルトリクロロシラン、オクチルトリエトキシシラン、フェニルトリメトキシシラン、フェニロトリエトキシシラン、メチルトリ(メタクリロイルオキエトキシ)シラン、メチルトリ(グリシジルオキシ)シラン、N-β(N-ビニルベンジルアミノエチル)-γ-アミノプロピルトリメトキシシラン、オクタデシルジメチル〔3-(トリメトキシシリル)プロピル〕アンモニウムクロライド、γ-クロロプロピルメチルジクロロシラン、γ-クロロプロピルメチルジメトキシシラン、γ-クロロプロピルメチルジエトキシシラン、トリメチルシリルイソシアネート、ジメチルシリルイソシアネート、メチルシリルトリイソシアネート、ビニルシリルトリイソシアネート、フェニルシリルトリイソシアネート、テトライソシアネートシラン、エトキシシランイソシアネート等を挙げることができる。単独または2種以上を混合して用いることができる。 Specific examples of the silane coupling agent include vinyl trichlorosilane, vinyltris (β-methoxyethoxy) silane, vinyltriethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, γ-methacryloxypropyltrimethoxysilane, and γ-. Methacryloxypropylmethyldimethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldimethoxysilane, γ-glycidoxypropylmethyldi Ethoxysilane, N-β (aminoethyl) γ-aminopropyltrimethoxysilane, n-β (aminoethyl) γ-aminopropylmethyldimethoxysilane, γ-aminopropyltriethoxysilane, N-phenyl-γ-aminopropyltri Methoxysilane, γ-mercaptopropyltrimethoxysilane, γ-mercaptopropyltriethoxysilane, 3-aminopropyl-methyl-diethoxysilane, 3-ureidopropyltriethoxysilane, 3-ureidopropyltrimethoxysilane, 3-aminopropyl Trimethoxysilane, 3-aminopropyl-tris (2-methoxy-ethoxy-ethoxy) silane, N-methyl-3-aminopropyltrimethoxysilane, triaminopropyl-trimethoxysilane, 3-4,5-dihydroimidazolepropyl Trimethoxysilane, 3-methacryloxypropyl-trimethoxysilane, 3-mercaptopropyl-methyldimethoxysilane, 3-chloropropyl-methyl-dimethoxysilane, 3-cyanopropyl-triethoxysilane, hexamethyldisilazane, N, O -Bis (trimethylsilyl) acetamide, methyltrimethoxysilane, methyltriethoxysilane, ethyltrichlorosilane, n-propyltrimethoxysilane, isobutyltrimethoxysilane, amyltrichlorosilane, octyltriethoxysilane, phenyltrimethoxysilane, phenylotriethoxy Silane, Methyltri (methacryloyloxyethoxy) silane, Methyltri (glycidyloxy) silane, N-β (N-vinylbenzylaminoethyl) -γ-aminopropyltrimethoxysilane, Octadecyldimethyl [3- (trimethoxysilyl) propyl] ammonium Chloride, γ-chloropropylmethyldichlorosilane, γ-chloropropylmethyldimethoxysilane, γ- Examples thereof include chloropropylmethyldiethoxysilane, trimethylsilylisocyanate, dimethylsilylisocyanate, methylsilyltriisocyanate, vinylsilyltriisocyanate, phenylsilyltriisocyanate, tetraisocyanatesilane, and ethoxysilaneisocyanate. It can be used alone or in combination of two or more.
アルミネート系カップリング剤の具体例としては、例えば、アルミニウムキレート化合物(エチルアセトアセテートアルミニウム-ジイソプロピレート等のアルキルアセトアセテートアルミニウム-ジイソプロピレート、アルミニウム-トリス(エチルアセトアセテート)、アルミニウム-モノアセチルアセトネート-ビス(エチルアセトアセテート)、アルミニウム-トリス(アセチルアセトネート)、アルミニウム-モノイソプロポキシ-モノオレオキシエチルアセトアセテート、アルミニウム-ジ-n-ブトキシド-モノエチルアセトアセテート、アルミニウム-ジ-イソプロポキシド-モノエチルアセトアセテート等)、アルミニウムアルコレート(アルミニウムイソプロピレート、モノ-sec-ブトキシアルミニウムジイソプロピレート、アルミニウム-sec-ブチレート、アルミニウムエチレート等)等を挙げることができる。これらは単独または2種以上を混合して用いることができる。 Specific examples of the aluminate-based coupling agent include, for example, aluminum chelate compounds (aluminum ethylacetate acetate-alkylacetoacetate aluminum-diisopropyrate such as ethylacetoacetate aluminum-diisopropyrate, aluminum-tris (ethylacetate acetate), aluminum-monoacetyl. Acetate-bis (ethylacetacetate), aluminum-tris (acetylacetonate), aluminum-monoisopropoxy-monooleoxyethylacetate, aluminum-di-n-butoxide-monoethylacetoacetate, aluminum-di-iso (Propoxide-monoethylacetacetate, etc.), aluminum alcoholate (aluminum isopropylate, mono-sec-butoxyaluminum diisopropyrate, aluminum-sec-butyrate, aluminum ethylate, etc.) and the like can be mentioned. These can be used alone or in admixture of two or more.
チタネート系カップリング剤の具体例としては、イソプロピルトリオクタノイルチタネート、イソプロピルジメタクリルイソステアロイルチタネート、イソプロピルトリドデシルベンゼンスルホニルチタネート、イソプロピルイソステアロイルジアクリルチタネート、イソプロピルトリ(ジオクチルホスフェート)チタネート、イソプロピルトリクミルフェニルチタネート、イソプロピルトリス(ジオクチルパイロホスフェート)チタネート、イソプロピルトリ(n-アミノエチル-アミノエチル)チタネート、テトライソプロピルビス(ジオクチルホスファイト)チタネート、テトラオクチルビス(ジトリデシルホスファイト)チタネート、テトラ(2,2-ジアリルオキシメチル-1-ブチル)ビス(ジトリデシル)ホスファイトチタネート、ジクミルフェニルオキシアセテートチタネート、ビス(ジオクチルパイロホスフェート)オキシアセテートチタネート、テトライソプロピルチタネート、テトラノルマルブチルチタネート、ブチルチタネートダイマー、テトラ(2-エチルヘキシル)チタネート、チタンアセチルアセトネート、ポリチタンアセチルアセトネート、チタンオクチレングリコレート、チタンラクテートアンモニウム塩、チタンラクテート、チタンラクテートエチルエステル、チタンチリエタノールアミネート、ポリヒドロキシチタンステアレート、テトラメチルオルソチタネート、テトラエチルオルソチタネート、テトラプロピルオルソチタネート、テトライソブチルオルソチタネート、ステアリルチタネート、クレシルチタネートモノマー、クレシルチタネートポリマー、ジ-イソプロポキシ-ビス-(2,4-ペンタジオネート)-チタニウム(IV)、ジ-イソプロピル-ビス-トリエタノールアミノ-チタネート、オクチレングリコールチタネートHV、テトラ-n-ブトキシチタンポリマー、トリ-n-ブトキシチタンモノステアレートポリマー、トリ-n-ブトキシチタンモノステアレート等を挙げることができる。単独または2種以上を混合して用いることができる。 Specific examples of the titanate-based coupling agent include isopropyltrioctanoyl titanate, isopropyldimethacrylisostearoyl titanate, isopropyltridodecylbenzenesulfonyl titanate, isopropylisostearoyl dialicyl titanate, isopropyltri (dioctyl phosphate) titanate, and isopropyltricylphenyl. Titanium, Isopropyltris (Dioctylpyrophosphate) Titanium, Isopropyltri (n-aminoethyl-Aminoethyl) Titanium, Tetraisopropylbis (Dioctylphosphite) Titanium, Tetraoctylbis (Ditridecylphosphite) Titanium, Tetra (2,2) -Diallyloxymethyl-1-butyl) bis (ditridecyl) phosphite titanate, dicumylphenyloxyacetate titanate, bis (dioctylpyrophosphate) oxyacetate titanate, tetraisopropyl titanate, tetranormal butyl titanate, butyl titanate dimer, tetra (2) -Ethylhexyl) titanate, titanium acetylacetonate, polytitanium acetylacetonate, titanium octylene glycolate, titanium lactate ammonium salt, titanium lactate, titanium lactate ethyl ester, titanium chili ethanolaminate, polyhydroxytitanium stearate, tetramethyl ortho Titanium, Tetraethyl Orthotitanate, Tetrapropyl Orthotitanate, Tetraisobutyl Orthotitanate, Stearyl Titanate, Cresyl Titanate Monomer, Cresyl Titanate Polymer, Di-Isopropoxy-bis- (2,4-Pentadionate) -Titanium (IV) , Di-isopropyl-bis-triethanolamino-titanate, octylene glycol titanate HV, tetra-n-butoxytitanium polymer, tri-n-butoxytitanium monostearate polymer, tri-n-butoxytitanium monostearate, etc. be able to. It can be used alone or in combination of two or more.
ジルコネート系カップリング剤の具体例としては、テトラプロピルジルコアルミネート、テトラブチルジルコネート、テトラ(トリエタノールアミン)ジルコネート、テタライソプロピルジルコネート、ジルコニウムアセチルアセトネート、アセチルアセトンジルコニウムブチレート、ジルコニウムラクテート、ステアリン酸ジルコニウムブチレート等を挙げることができる。これらは単独または2種以上を混合して用いることができる。 Specific examples of the zirconate-based coupling agent include tetrapropylzircoaluminate, tetrabutylzirconate, tetra (triethanolamine) zirconate, tetaraisopropylzirconate, zirconiumacetylacetonate, acetylacetonezirconium butyrate, zirconium lactate, and stearic acid. Zirconium butyrate and the like can be mentioned. These can be used alone or in admixture of two or more.
前記カップリング剤の配合量は、PAI質量に対し、0.01~5重量%とすることが好ましい。 The blending amount of the coupling agent is preferably 0.01 to 5% by weight with respect to the mass of PAI.
PAI溶液には、必要に応じて、界面活性剤、レベリング剤等を、本発明の効果を損なわない範囲で配合してもよい。 If necessary, a surfactant, a leveling agent, or the like may be added to the PAI solution as long as the effects of the present invention are not impaired.
PAI溶液には、必要に応じて、PAI以外のポリマーを、本発明の効果を損なわない範囲で配合してもよい。 If necessary, a polymer other than PAI may be added to the PAI solution as long as the effects of the present invention are not impaired.
PAI溶液を、Al箔の表面に塗布後、乾燥してPAI被膜を形成することにより本発明の積層体とすることができる。PAI溶液のAl箔への塗布方法としては、ディップコータ、バーコータ、スピンコータ、ダイコータ、スプレーコータ等を用い、連続式またはバッチ式で塗布することができる。乾燥工程における乾燥温度の上限値に制限は無いが、200℃以下とすることが好ましく、180℃以下とすることがより好ましい。また、PAI被膜は、耐熱性に優れるので、乾燥後、200℃以上の温度、例えば、250℃程度で熱処理を行ってもよい。 The PAI solution is applied to the surface of the Al foil and then dried to form a PAI film, whereby the laminate of the present invention can be obtained. As a method of applying the PAI solution to the Al foil, a dip coater, a bar coater, a spin coater, a die coater, a spray coater or the like can be used, and the PAI solution can be applied continuously or in a batch manner. The upper limit of the drying temperature in the drying step is not limited, but is preferably 200 ° C. or lower, and more preferably 180 ° C. or lower. Further, since the PAI film has excellent heat resistance, heat treatment may be performed at a temperature of 200 ° C. or higher, for example, about 250 ° C. after drying.
Al箔は、一般の軟質Al箔を用いることができる。Al箔の厚みに制限はないが、通常9~200μm程度であり、15~50μmが好ましい。 As the Al foil, a general soft Al foil can be used. The thickness of the Al foil is not limited, but is usually about 9 to 200 μm, preferably 15 to 50 μm.
Al箔は、公知の化成処理、脱脂処理が行われたものも用いることもできる。化成処理としては、例えば、クロム酸クロメート処理、リン酸クロメート処理、塗布型クロメート処理等のクロム系化成処理、ジルコニウム、チタン、リン酸亜鉛等の非クロム系(塗布型)化成処理等を挙げることができる。脱脂処理としては、アルカリ浸漬法、電解洗浄法、酸洗浄法、電解酸洗浄法、酸活性化法等を挙げることができる。 As the Al foil, a known chemical conversion treatment and degreasing treatment can also be used. Examples of the chemical conversion treatment include chromic acid chromate treatment, phosphoric acid chromate treatment, chromium-based chemical conversion treatment such as coating type chromate treatment, and non-chromic acid-based (coating type) chemical conversion treatment such as zirconium, titanium, and zinc phosphate. Can be done. Examples of the degreasing treatment include an alkaline dipping method, an electrolytic cleaning method, an acid cleaning method, an electrolytic acid cleaning method, and an acid activation method.
PAI被膜の厚みに制限はないが、通常、0.5~50μm程度であり、1~20μmが好ましい。 The thickness of the PAI coating is not limited, but is usually about 0.5 to 50 μm, preferably 1 to 20 μm.
以下に、実施例を挙げて、本発明をさらに詳細に説明する。なお本発明は実施例により限定されるものではない。 Hereinafter, the present invention will be described in more detail with reference to examples. The present invention is not limited to the examples.
<実施例1>
特開平11-21454号公報、実施例の記載に準拠して、ダイマー酸を含む共重合PAI溶液を調製した。すなわち、ガラス製反応容器に、窒素雰囲気下、TMA:0.97モル、ダイマー酸(クローダジャパン社製、商品名:PRIPOL1009):0.03モル、 MDI:1.0モル、NMPを投入して攪拌した。得られた溶液を、120℃で2時間反応させた後、180℃に昇温して6時間反応させることにより固形分濃度が15質量%のPAI溶液(A-1)を得た。L-1を、脱脂処理した軟質Al箔(東洋アルミ社製、厚み30μm)上に、ドクターブレードを用いて塗布し、150℃で30分乾燥することにより、Al箔上に積層された厚み5μmのPAI皮膜が形成された積層体(L-1)を得た。L-1の接着性をJIS K5600-5-6(第5部第6節クロスカット法)に準拠して測定した。すなわち、被膜面に、縦方向、横方向に1mmの間隔で6本、カッターナイフで切り込みを入れ、格子が25個の格子パターンを10箇所(格子の目の総数は250)作成した。 次に、これらの格子パターン各々について、セロテープ(登録商標)を用いて剥離試験を行い、格子の目の剥がれ箇所、塗膜の剥がれ箇所を目視で検査し、剥がれ箇所の数(n箇所)/格子の目の総数(250)の割合で評価した。L-1の剥がれ箇所は0/250であり、良好な接着性が確認された。また、L-1を折り曲げた所、ひび割れ等は発生しなかった。次に、PAI被膜の耐電解液性の評価を行った。すなわち、PAI被膜表面に、微量の水(100ppm)を添加した電解液(溶媒:エチレンカーボネート/ジメチルカーボネート/ジエチルカーボネート=1:1:1(質量比)、電解質:1MのLiPF6)を滴下し、24時間放置後イソプロピルアルコールで拭き取った。その後、滴下箇所の外観を観察した結果、電解液を滴下した箇所は認識できず、L-1は良好な耐電解液性を有していることが判った。
<Example 1>
A copolymerized PAI solution containing dimer acid was prepared in accordance with JP-A-11-21454 and the description of Examples. That is, TMA: 0.97 mol, dimer acid (manufactured by Croda Japan, trade name: PRIPOL1009): 0.03 mol, MDI: 1.0 mol, and NMP were put into a glass reaction vessel under a nitrogen atmosphere. Stirred. The obtained solution was reacted at 120 ° C. for 2 hours, then heated to 180 ° C. and reacted for 6 hours to obtain a PAI solution (A-1) having a solid content concentration of 15% by mass. L-1 was applied on a degreased soft Al foil (manufactured by Toyo Aluminum Co., Ltd., thickness 30 μm) using a doctor blade and dried at 150 ° C. for 30 minutes to have a thickness of 5 μm laminated on the Al foil. A laminated body (L-1) on which the PAI film of No. 1 was formed was obtained. The adhesiveness of L-1 was measured according to JIS K5600-5-6 (Part 5, Section 6, Crosscut Method). That is, six cuts were made in the coating surface at intervals of 1 mm in the vertical and horizontal directions with a cutter knife, and 10 grid patterns with 25 grids were created (the total number of grids was 250). Next, for each of these lattice patterns, a peeling test was performed using cellophane tape (registered trademark), and the peeling points of the grid and the peeling points of the coating film were visually inspected, and the number of peeling points (n points) / It was evaluated by the ratio of the total number of grid stitches (250). The peeling point of L-1 was 0/250, and good adhesiveness was confirmed. Further, no cracks or the like occurred when L-1 was bent. Next, the electrolytic solution resistance of the PAI coating was evaluated. That is, an electrolytic solution (solvent: ethylene carbonate / dimethyl carbonate / diethyl carbonate = 1: 1: 1 (mass ratio), electrolyte: 1 M LiPF 6 ) to which a small amount of water (100 ppm) was added was dropped onto the surface of the PAI film. After leaving for 24 hours, it was wiped off with isopropyl alcohol. After that, as a result of observing the appearance of the dropped portion, the portion where the electrolytic solution was dropped could not be recognized, and it was found that L-1 had good electrolytic solution resistance.
<実施例2>
TMA:0.95モルと、ダイマー酸:0.05モルとを用いたこと以外は、実施例1と同様にして、PAI溶液(A-2)を得た。A-2を用い、実施例1と同様にして、Al箔上に積層された厚み5μmのPAI皮膜が形成された積層体(L-2)を得た。L-2の接着性を実施例1と同様して評価した所、L-2の剥がれ箇所は0/250であり、良好な接着性が確認された。また、L-2を折り曲げた所、ひび割れ等は発生しなかった。
さらに、実施例1と同様にして、耐電解液性を評価した所、電解液を滴下した箇所は認識できず、L-2は良好な耐電解液性を有していることが判った。
<Example 2>
A PAI solution (A-2) was obtained in the same manner as in Example 1 except that TMA: 0.95 mol and dimer acid: 0.05 mol were used. Using A-2, a laminated body (L-2) having a PAI film having a thickness of 5 μm laminated on the Al foil was obtained in the same manner as in Example 1. When the adhesiveness of L-2 was evaluated in the same manner as in Example 1, the peeled portion of L-2 was 0/250, and good adhesiveness was confirmed. In addition, no cracks or the like occurred when L-2 was bent.
Further, when the electrolytic solution resistance was evaluated in the same manner as in Example 1, it was found that the portion where the electrolytic solution was dropped could not be recognized, and that L-2 had good electrolytic solution resistance.
<実施例3>
TMA:0.93モルと、ダイマー酸:0.07モルとを用いたこと以外は、実施例1と同様にして、PAI溶液(A-3)を得た。A-3を用い、実施例1と同様にして、Al箔上に積層された厚み5μmのPAI皮膜が形成された積層体(L-3)を得た。L-3の接着性を実施例1と同様して評価した所、L-3の剥がれ箇所は0/250であり、良好な接着性が確認された。また、L-3を折り曲げた所、ひび割れ等は発生しなかった。
さらに、実施例1と同様にして、耐電解液性を評価した所、電解液を滴下した箇所は認識できず、L-3は良好な耐電解液性を有していることが判った。
<Example 3>
A PAI solution (A-3) was obtained in the same manner as in Example 1 except that TMA: 0.93 mol and dimer acid: 0.07 mol were used. Using A-3, a laminated body (L-3) having a PAI film having a thickness of 5 μm laminated on the Al foil was obtained in the same manner as in Example 1. When the adhesiveness of L-3 was evaluated in the same manner as in Example 1, the peeled portion of L-3 was 0/250, and good adhesiveness was confirmed. In addition, no cracks or the like occurred when L-3 was bent.
Further, when the electrolytic solution resistance was evaluated in the same manner as in Example 1, it was found that the portion where the electrolytic solution was dropped could not be recognized, and that L-3 had good electrolytic solution resistance.
<実施例4>
Al箔上に積層されたPAI皮膜の厚みを3μmとしたこと以外は、実施例1と同様にして、Al箔上にPAI皮膜が形成された積層体(L-4)を得た。L-4の接着性を実施例1と同様して評価した所、L-4の剥がれ箇所は0/250であり、良好な接着性が確認された。また、L-4を折り曲げた所、ひび割れ等は発生しなかった。さらに、実施例1と同様にして、耐電解液性を評価した所、電解液を滴下した箇所は認識できず、L-4は良好な耐電解液性を有していることが判った。
<Example 4>
A laminated body (L-4) having a PAI film formed on the Al foil was obtained in the same manner as in Example 1 except that the thickness of the PAI film laminated on the Al foil was 3 μm. When the adhesiveness of L-4 was evaluated in the same manner as in Example 1, the peeled portion of L-4 was 0/250, and good adhesiveness was confirmed. In addition, no cracks or the like occurred when L-4 was bent. Further, when the electrolytic solution resistance was evaluated in the same manner as in Example 1, it was found that the portion where the electrolytic solution was dropped could not be recognized, and that L-4 had good electrolytic solution resistance.
<比較例1>
カルボン酸成分としてTMAのみを1.0モル用いたこと以外は、実施例1と同様にして、PAI溶液(B-1)を得た。B-1を用い、実施例1と同様にして、Al箔上に積層された厚み5μmのPAI皮膜が形成された積層体(R-1)を得た。R-1の接着性を実施例1と同様して評価した所、R-1の剥がれ箇所は16/250であり、接着性としては不十分であった。また、R-1を折り曲げた所、ひび割れが発生した。さらに、実施例1と同様にして、耐電解液性を評価した所、電解液を滴下した箇所に輪郭が発生し、R-1の耐電解液性は不十分であった。
<Comparative Example 1>
A PAI solution (B-1) was obtained in the same manner as in Example 1 except that 1.0 mol of TMA was used as the carboxylic acid component. Using B-1, a laminated body (R-1) having a 5 μm-thick PAI film laminated on the Al foil was obtained in the same manner as in Example 1. When the adhesiveness of R-1 was evaluated in the same manner as in Example 1, the peeled portion of R-1 was 16/250, which was insufficient in terms of adhesiveness. In addition, cracks occurred when R-1 was bent. Further, when the electrolytic solution resistance was evaluated in the same manner as in Example 1, contours were generated at the points where the electrolytic solution was dropped, and the electrolytic solution resistance of R-1 was insufficient.
<比較例2>
PAI溶液としてB-1を用い、Al箔上に積層されたPAI皮膜の厚みを3μmとしたこと以外は、実施例1と同様にして、Al箔上にPAI皮膜が形成された積層体(R-2)を得た。R-2の接着性を実施例1と同様して評価した所、R-2の剥がれ箇所は7/250であり、接着性としては不十分であった。また、R-2を折り曲げた所、ひび割れが発生した。さらに、実施例1と同様にして、耐電解液性を評価した所、電解液を滴下した箇所は認識できず、電解液を滴下した箇所に輪郭が発生し、R-2の耐電解液性は不十分であった。
<Comparative Example 2>
A laminate (R) in which the PAI film was formed on the Al foil in the same manner as in Example 1 except that B-1 was used as the PAI solution and the thickness of the PAI film laminated on the Al foil was 3 μm. -2) was obtained. When the adhesiveness of R-2 was evaluated in the same manner as in Example 1, the peeled portion of R-2 was 7/250, which was insufficient in terms of adhesiveness. In addition, cracks occurred when R-2 was bent. Further, in the same manner as in Example 1, when the electrolytic solution resistance was evaluated, the place where the electrolytic solution was dropped could not be recognized, and a contour was generated at the place where the electrolytic solution was dropped, and the electrolytic solution resistance of R-2 was generated. Was inadequate.
実施例、比較例で示したように、本発明の積層体は、接着信頼性に優れるので、良好な耐電解液性を有していることが判る。 As shown in Examples and Comparative Examples, the laminate of the present invention is excellent in adhesive reliability, and thus it can be seen that it has good electrolytic solution resistance.
Al箔上にPAI被膜が積層された本発明の積層体は、接着信頼性に優れ、良好な耐電解液性を有しているので、LiB外装用部材等として好適に使用することができる。
The laminate of the present invention in which the PAI film is laminated on the Al foil has excellent adhesive reliability and good electrolytic solution resistance, and therefore can be suitably used as a LiB exterior member or the like.
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JP2005171125A (en) | 2003-12-12 | 2005-06-30 | Toyobo Co Ltd | Adhesive sheet, and display and electromagnetic wave-shielding formation using the same |
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JP2005297448A (en) | 2004-04-14 | 2005-10-27 | Toray Ind Inc | Laminate |
JP2007246680A (en) | 2006-03-16 | 2007-09-27 | Toray Ind Inc | Polyamideimide resin, method for producing the same and polyamideimide resin varnish |
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JP2000067823A (en) | 1998-08-21 | 2000-03-03 | Nippon Foil Mfg Co Ltd | Manufacture of secondary battery case material |
JP2005171125A (en) | 2003-12-12 | 2005-06-30 | Toyobo Co Ltd | Adhesive sheet, and display and electromagnetic wave-shielding formation using the same |
JP2005213397A (en) | 2004-01-30 | 2005-08-11 | Toyobo Co Ltd | Aqueous dispersion of polyimide-based resin and method for producing the same |
JP2005297448A (en) | 2004-04-14 | 2005-10-27 | Toray Ind Inc | Laminate |
JP2007246680A (en) | 2006-03-16 | 2007-09-27 | Toray Ind Inc | Polyamideimide resin, method for producing the same and polyamideimide resin varnish |
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