JP7044187B2 - Board with bulkhead and display device - Google Patents

Description

The present invention relates to a partition walled substrate having a patterned partition wall and a display device.

A liquid crystal display device, which is a kind of image display device, generally performs color display by using a white light source such as an LED and a color filter that selectively passes red, green, and blue. However, the color display using such a color filter has poor light utilization efficiency and has a problem in color reproducibility.

Therefore, as a color display device having high light utilization efficiency, a color display device including a wavelength conversion unit composed of a wavelength conversion phosphor and a polarization separation means and a polarization conversion means has been proposed (see, for example, Patent Document 1). ). For example, a wavelength having a blue light source, a liquid crystal element, a phosphor excited by blue light to emit red fluorescence, a phosphor excited by blue light to emit green fluorescence, and a light scattering layer that scatters blue light. A color display device including a conversion unit has been proposed (see, for example, Patent Document 2).
However, a color filter containing a color conversion phosphor as described in Patent Documents 1 and 2 has low light extraction efficiency and insufficient brightness because fluorescence is generated in all directions. In particular, in high-definition display devices such as 4K and 8K, since the pixel size becomes small, the problem of luminance becomes remarkable, so that higher luminance is required.

Japanese Unexamined Patent Publication No. 2000-131683 Japanese Unexamined Patent Publication No. 2009-244383 Japanese Unexamined Patent Publication No. 2000-347394 Japanese Unexamined Patent Publication No. 2006-259421

In order to improve the brightness of the display device, it is effective to increase the reflectance of the partition wall separating the color conversion phosphors. Further, in order to prevent color mixing of light between adjacent pixels, it is necessary to improve the light-shielding property of the partition wall. From the above, there is a demand for a partition material that has both high reflectance and light-shielding properties.

In order to form a partition wall having both high reflectance and light-shielding property, the inventors first examined a method of using a material in which a black pigment is added to a white partition wall material having high reflectance. However, in this method, it has become clear that light is absorbed by the white pigment and the black pigment at the time of exposure, the light does not reach the bottom of the film, and the pattern processability is poor.

On the other hand, as described in Patent Documents 3 and 4, a technique has been proposed in which a specific metal compound is added to cause blackening by firing after pattern formation. However, these blackening techniques require firing at 400 ° C. or higher, and have a problem that the light-shielding property is not improved by heating at 250 ° C. or lower.

Therefore, an object of the present invention is to provide a resin composition capable of forming a partition wall having both high reflectance and light-shielding property even under heating conditions of 250 ° C. or lower.

The present invention is a substrate with a partition wall having a partition wall having a (A-1) pattern formed on a base substrate, wherein the partition wall having the (A-1) pattern formed is a resin, a white pigment, palladium oxide, and the like. It contains at least one metal oxide selected from the group consisting of platinum oxide, gold oxide, silver oxide, palladium, platinum, gold and silver, or particles made of metal, and has a reflectance of 20 per 10 μm thickness at a wavelength of 550 nm. A substrate with a partition wall having an OD value of 1.0 to 60% and an OD value of 1.0 to 3.0 per 10 μm thickness.

The resin composition of the present invention allows light to pass through during the step of pattern exposure after film formation, but since the light-shielding property is improved after heating the exposed film at a temperature of 120 ° C. or higher and 250 ° C. or lower, the light-shielding property is improved, so that the heating conditions are 250 ° C. or lower. However, it is possible to form a fine thick film partition pattern having high reflectance and high light-shielding property.

It is sectional drawing which shows one aspect of the substrate with a partition wall of this invention which has a partition wall formed with a pattern. It is sectional drawing which shows one aspect of the substrate with a partition wall of this invention which has the partition wall which formed the pattern and the pixel which contains the color conversion light emitting material. It is sectional drawing which shows one aspect of the substrate with a partition wall of this invention which has a low refractive index layer. It is sectional drawing which shows one aspect of the substrate with a partition wall of this invention which has a low refractive index layer and an inorganic protective layer I. It is sectional drawing which shows one aspect of the substrate with a partition wall of this invention which has a low refractive index layer and an inorganic protective layer II. It is sectional drawing which shows one aspect of the substrate with a partition wall of this invention which has a color filter. It is sectional drawing which shows one aspect of the substrate with a partition wall of this invention which has a color filter and an inorganic protective layer III and / or a yellow organic protective layer. It is sectional drawing which shows one aspect of the substrate with a partition wall of this invention which has a color filter and an inorganic protective layer IV and / or a yellow organic protective layer. It is sectional drawing which shows one aspect of the substrate with a partition wall of this invention which has a light-shielding partition wall. It is sectional drawing which shows the structure of the display device used for the color mixing evaluation in an Example.

Hereinafter, a suitable embodiment of the resin composition according to the present invention, a light-shielding film formed from the resin composition, a method for producing the light-shielding film, and a substrate with a partition wall will be specifically described. The form is not limited to the above, and various changes can be made according to the purpose and use.

The resin composition of the present invention can be suitably used as a material for forming a partition wall separating the color conversion phosphors. The resin composition of the present invention contains an organometallic compound containing a resin and at least one metal selected from the group consisting of silver, gold, platinum and palladium (hereinafter, may be referred to as "organic metal compound"). , A photopolymerization initiator or a quinonediazide compound, and a solvent are preferably contained.

The resin has a function of improving the crack resistance and light resistance of the partition wall. The content of the resin in the solid content of the resin composition is preferably 10% by weight or more, more preferably 20% by weight or more, from the viewpoint of improving the crack resistance of the partition wall in the heat treatment. On the other hand, from the viewpoint of improving the light resistance, the content of the resin in the solid content of the resin composition is preferably 60% by weight or less, more preferably 50% by weight or less. Here, the solid content means all the components contained in the resin composition excluding the volatile components such as the solvent. The amount of solid content can be determined by heating the resin composition and measuring the residue obtained by evaporating the volatile components.

Examples of the resin include polysiloxane, polyimide, polyimide precursor, polybenzoxazole, polybenzoxazole precursor, (meth) acrylic polymer and the like. Here, the (meth) acrylic polymer means a polymer of a methacrylic acid ester and / or an acrylic acid ester. Two or more of these may be contained. Among these, polysiloxane is preferable because it is excellent in transparency, heat resistance and light resistance.

Polysiloxane is a hydrolyzed / dehydrated condensate of organosilane. When the resin composition of the present invention has a negative photosensitive property, the polysiloxane preferably contains at least a repeating unit represented by the following general formula (2). Further, other repeating units may be included. By containing the repeating unit derived from the bifunctional alkoxysilane compound represented by the general formula (2), excessive thermal polymerization (condensation) of polysiloxane due to heating can be suppressed, and crack resistance of the partition wall can be improved. It is preferable that 10 to 80 mol% of the repeating unit represented by the general formula (2) is contained in all the repeating units in the polysiloxane. By containing 10 mol% or more of the repeating unit represented by the general formula (2), the crack resistance can be further improved. The content of the repeating unit represented by the general formula (2) is more preferably 15 mol% or more, further preferably 20 mol% or more. On the other hand, by containing 80 mol% or less of the repeating unit represented by the general formula (2), the molecular weight of the polysiloxane at the time of polymerization can be sufficiently increased and the coatability can be improved. The content of the repeating unit represented by the general formula (2) is more preferably 70 mol% or less.

In the above general formula (2), R ¹ and R ² may be the same or different, respectively, and represent a monovalent organic group having 1 to 20 carbon atoms. R ¹ and R ² are preferably a group selected from an alkyl group having 1 to 6 carbon atoms and an aryl group having 6 to 12 carbon atoms from the viewpoint of facilitating the adjustment of the molecular weight of the polysiloxane during polymerization. However, the alkyl group and the aryl group may have at least a part of hydrogen substituted with a radically polymerizable group. In this case, the radically polymerizable group may be radically polymerized in the cured product of the negative photosensitive resin composition.

When the resin composition of the present invention has a negative photosensitive property, the polysiloxane is further selected from a repeating unit represented by the following general formula (3) and a repeating unit represented by the following general formula (4). It is preferable to include repeating units. By containing a repeating unit derived from a fluorine-containing alkoxysilane compound represented by the general formula (3) or the general formula (4), the refractive index of the polysiloxane is reduced, and when a white pigment described later is contained, the color is white. It is possible to increase the difference in refractive index with the pigment to further improve the interfacial reflection and further improve the reflectance. It is more preferable that the polysiloxane contains a total of 20 to 80 mol% of the repeating unit selected from the repeating unit represented by the general formula (3) and the repeating unit represented by the general formula (4). By containing a total of 20 mol% or more of the repeating unit represented by the general formula (3) and the repeating unit represented by the general formula (4), the interface between the polysiloxane and the white pigment is contained when the white pigment described later is contained. The reflection can be further improved and the reflectance can be further improved. The total content of the repeating unit represented by the general formula (3) and the repeating unit represented by the general formula (4) is more preferably 40 mol% or more. On the other hand, by containing a total of 80 mol% or less of the repeating unit represented by the general formula (3) and the repeating unit represented by the general formula (4), excessive hydrophobization of the polysiloxane is suppressed and the composition is contained. The compatibility with other components can be improved and the resolution can be improved. The total content of the repeating unit represented by the general formula (3) and the repeating unit represented by the general formula (4) is more preferably 70 mol% or less. Further, other repeating units may be included.

In the above general formulas (3) and (4), R ³ represents an alkyl group having 1 to 10 carbon atoms, an alkenyl group, an aryl group or an arylalkyl group in which all or part of hydrogen is substituted with fluorine. ^R4 represents a single bond, -O-, -CH ₂ -CO-, -CO- or -O-CO-. R ⁵ represents a monovalent organic group having 1 to 20 carbon atoms. From the viewpoint of further reducing the refractive index of the polysiloxane, R ³ is preferably an alkyl group having 1 to 6 carbon atoms in which all or part of hydrogen is substituted with fluorine. The alkenyl group may be radically polymerized in the photocured product of the negative photosensitive resin composition.

The repeating units represented by the general formulas (2) to (4) are derived from the alkoxysilane compounds represented by the following general formulas (5) to (7), respectively. That is, the polysiloxane containing the repeating units represented by the general formulas (2) to (4) hydrolyzes and hydrolyzes the alkoxysilane compound containing the alkoxysilane compound represented by the following general formulas (5) to (7). It can be obtained by polycondensation. Further, other alkoxysilane compounds may be used.

In the above general formulas (5) to (7), R ¹ to R ⁵ represent the same groups as R ¹ to R ⁵ in the general formulas (2) to (4), respectively. R ⁶ may be the same or different, and represents a monovalent organic group having 1 to 20 carbon atoms, and an alkyl group having 1 to 6 carbon atoms is preferable.

Examples of the alkoxysilane compound represented by the general formula (5) include dimethyldimethoxysilane, dimethyldiethoxysilane, ethylmethyldimethoxysilane, ethylmethyldimethoxysilane, methylpropyldimethoxysilane, methylpropyldiethoxysilane, and diphenyldimethoxysilane. , Diphenyldiethoxysilane, cyclohexylmethyldimethoxysilane, cyclohexylmethyldiethoxysilane, vinylmethyldimethoxysilane, vinylmethyldiethoxysilane, allylmethyldimethoxysilane, allylmethyldiethoxysilane, styrylmethyldimethoxysilane, styrylmethyldiethoxysilane, γ-methacryloylpropylmethyldimethoxysilane, γ-methacryloylpropylmethyldiethoxysilane, γ-acryloylpropylmethyldimethoxysilane, γ-acryloylpropylmethyldiethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropyl Methyldiethoxysilane, 2- (3,4-epoxycyclohexyl) ethylmethyldimethoxysilane, 2- (3,4-epoxycyclohexyl) ethylethyldimethoxysilane, diphenyldimethoxysilane, diphenyldiethoxysilane, 3-dimethylmethoxysilylpropyl Succinic acid anhydride, 3-dimethylethoxysilylpropyl succinic acid anhydride, 3-dimethylmethoxysilylpropionic acid, 3-dimethylethoxysilylpropionic acid, 3-dimethylmethoxysilylpropylcyclohexyldicarboxylic acid anhydride, 3-dimethylethoxysilylpropyl Cyclohexyldicarboxylic acid anhydride, 5-dimethylmethoxysilyl valeric acid, 5-dimethylethoxysilyl valeric acid, 3-dimethylmethoxysilylpropyl phthalic acid anhydride, 3-dimethylethoxysilylpropyl phthalic acid anhydride, 3-dimethylmethoxysilylpropyl Examples thereof include phthalic acid anhydride, 3-dimethylethoxysilylpropyl phthalic acid anhydride, 4-dimethylmethoxysilyl butyric acid, 4-dimethylethoxysilyl butyric acid and the like. Two or more of these may be used.

Examples of the alkoxysilane compound represented by the general formula (6) include trifluoropropyltrimethoxysilane, trifluoropropyltriethoxysilane, perfluoropentyltrimethoxysilane, perfluoropentyltiltriethoxysilane, and tridecafluorooctylsilane. Examples thereof include methoxysilane, tridecafluorooctyl triethoxysilane, tridecafluorooctyl repropoxysilane, tridecafluorooctyl triisopropoxysilane, heptadecafluorodecyltrimethoxysilane, and heptadecafluorodecyltriethoxysilane. Two or more of these may be used.

Examples of the alkoxysilane compound represented by the general formula (7) include bis (trifluoromethyl) dimethoxysilane, bis (trifluoropropyl) dimethoxysilane, bis (trifluoropropyl) diethoxysilane, and trifluoropropylmethyldimethoxysilane. Examples thereof include trifluoropropylmethyldiethoxysilane, trifluoropropylethyldimethoxysilane, trifluoropropylethyldiethoxysilane, and heptadecafluorodecylmethyldimethoxysilane. Two or more of these may be used.

Examples of other alkoxysilane compounds include methyltrimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, propyltrimethoxysilane, propyltriethoxysilane, isobutyltrimethoxysilane, and isobutyltriethoxysilane. Cyclohexyltrimethoxysilane, cyclohexyltriethoxysilane, 3-Isoxidepropyltrimethoxysilane, 3-Ixoxidepropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-ureidopropyltrimethoxysilane, Trifunctional alkoxysilane compound such as 3-ureidopropyltriethoxysilane; tetrafunctional alkoxysilane compound such as tetramethoxysilane, tetraethoxysilane and silicate 51 (tetraethoxysilane oligomer); simple such as trimethylmethoxysilane and triphenylmethoxysilane. Functional alkoxysilane compound; 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 2- (3,4-epoxycyclohexyl) Epoxy groups such as ethyltriethoxysilane, 3-ethyl-3-{[3- (trimethoxysilyl) propoxy] methyl} oxetane, 3-ethyl-3-{[3- (triethoxysilyl) propoxy] methyl} oxetane Or an oxetane group-containing alkoxysilane compound: phenyltrimethoxysilane, phenyltriethoxysilane, 1-naphthyltrimethoxysilane, 2-naphthyltrimethoxysilane, 2-naphthyltrimethoxysilane, 2-naphthyltrimethoxysilane, triltrimethoxysilane , Triltriethoxysilane, 1-phenylethyltrimethoxysilane, 1-phenylethyltriethoxysilane, 2-phenylethyltrimethoxysilane, 2-phenylethyltriethoxysilane, 3-trimethoxysilylpropylphthalic acid anhydride, 3 -Aromatic ring-containing alkoxysilane compound such as triethoxysilylpropylphthalic acid anhydride; styryltrimethoxysilane, styryltriethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, allyltrimethoxysilane, allyltriethoxysilane, γ- Acryloylpropyltrimethoxysilane, γ-acrylo Radical polymerizable group-containing alkoxysilane compounds such as ylpropyltriethoxysilane, γ-methacryloylpropyltrimethoxysilane, γ-methacryloylpropyltriethoxysilane; 3-trimethoxysilylpropionic acid, 3-triethoxysilylpropionic acid, 4- Trimethoxysilyl butyric acid, 4-triethoxysilylbutyric acid, 5-trimethoxysilylvaleric acid, 5-triethoxysilylvaleric acid, 3-trimethoxysilylpropyl succinic acid anhydride, 3-triethoxysilylpropyl succinic acid anhydride , 3-Trimethoxysilylpropylcyclohexyldicarboxylic acid anhydride, 3-triethoxysilylpropylcyclohexyldicarboxylic acid anhydride, 3-trimethoxysilylpropylphthalic acid anhydride, 3-triethoxysilylpropylphthalic acid anhydride and other carboxyl groups. Examples thereof include a contained alkoxysilane compound.

The content of the alkoxysilane compound represented by the general formula (5) in the alkoxysilane compound which is the raw material of the polysiloxane is the content of the repeating unit represented by the general formula (2) in all the repeating units of the polysiloxane. From the viewpoint of keeping the amount in the above range, 10 mol% or more is preferable, 15 mol% or more is more preferable, and 20 mol% or more is further preferable. On the other hand, the content of the alkoxysilane compound represented by the general formula (5) is preferably 80 mol% or less, more preferably 70 mol% or less, from the same viewpoint. Further, regarding the total content of the alkoxysilane compound represented by the general formula (6) and the general formula (7), the total content of the repeating units represented by the general formula (3) and the general formula (4) is described above. From the viewpoint of the above range, 20 mol% or more is preferable, and 40 mol% or more is more preferable. On the other hand, the total content of the alkoxysilane compounds represented by the general formula (6) and the general formula (7) is preferably 80 mol% or less, more preferably 70 mol% or less, from the same viewpoint.

The weight average molecular weight (Mw) of the polysiloxane is preferably 1,000 or more, more preferably 2,000 or more, from the viewpoint of coatability. On the other hand, from the viewpoint of developability, the Mw of the polysiloxane is preferably 50,000 or less, more preferably 20,000 or less. Here, Mw of polysiloxane in the present invention means a polystyrene-equivalent value measured by gel permeation chromatography (GPC).

The polysiloxane can be obtained by hydrolyzing the above-mentioned organosilane compound and then subjecting the hydrolyzate to a dehydration condensation reaction in the presence of a solvent or in the absence of a solvent.

Various conditions for hydrolysis can be set according to the physical characteristics suitable for the intended use in consideration of the reaction scale, the size and shape of the reaction vessel, and the like. Examples of various conditions include acid concentration, reaction temperature, reaction time and the like.

For the hydrolysis reaction, an acid catalyst such as hydrochloric acid, acetic acid, formic acid, nitric acid, oxalic acid, hydrochloric acid, sulfuric acid, phosphoric acid, polyphosphoric acid, polyvalent carboxylic acid and its anhydride, and an ion exchange resin can be used. Among these, an acidic aqueous solution containing an acid selected from formic acid, acetic acid and phosphoric acid is preferable.

When an acid catalyst is used for the hydrolysis reaction, the amount of the acid catalyst added is 0.05 weight based on 100 parts by weight of the total alkoxysilane compound used in the hydrolysis reaction from the viewpoint of allowing the hydrolysis to proceed more quickly. The amount is preferably 0.1 parts by weight or more, and more preferably 0.1 part by weight or more. On the other hand, from the viewpoint of appropriately adjusting the progress of the hydrolysis reaction, the amount of the acid catalyst added is preferably 20 parts by weight or less, more preferably 10 parts by weight or less, based on 100 parts by weight of the total alkoxysilane compound. Here, the total amount of the alkoxysilane compound means an amount containing all of the alkoxysilane compound, its hydrolyzate and its condensate. The same shall apply hereinafter.

The hydrolysis reaction can be carried out in a solvent. The solvent can be appropriately selected in consideration of the stability, wettability, volatility and the like of the resin composition.

When a solvent is produced by the hydrolysis reaction, it is also possible to carry out the hydrolysis without a solvent. When used in a resin composition, it is also preferable to adjust the resin composition to an appropriate concentration by further adding a solvent after the completion of the hydrolysis reaction. It is also possible to distill and remove all or part of the produced alcohol or the like by heating and / or under reduced pressure after hydrolysis, and then add a suitable solvent.

When a solvent is used for the hydrolysis reaction, the amount of the solvent added is preferably 50 parts by weight or more, more preferably 80 parts by weight or more, based on 100 parts by weight of the total alkoxysilane compound from the viewpoint of suppressing gel formation. .. On the other hand, the amount of the solvent added is preferably 500 parts by weight or less, more preferably 200 parts by weight or less, based on 100 parts by weight of the total alkoxysilane compound, from the viewpoint of allowing the hydrolysis to proceed more rapidly.

Further, as the water used for the hydrolysis reaction, ion-exchanged water is preferable. The amount of water can be set arbitrarily, but is preferably 1.0 to 4.0 mol with respect to 1 mol of the total alkoxysilane compound.

Examples of the method of the dehydration condensation reaction include a method of heating the silanol compound solution obtained by the hydrolysis reaction of the organosilane compound as it is. The heating temperature is preferably 50 ° C. or higher and lower than the boiling point of the solvent, and the heating time is preferably 1 to 100 hours. Further, in order to increase the degree of polymerization of the polysiloxane, reheating or addition of a base catalyst may be performed. Further, depending on the purpose, after the dehydration condensation reaction, an appropriate amount of the produced alcohol or the like may be distilled off and removed under heating and / or reduced pressure, and then a suitable solvent may be added.

From the viewpoint of storage stability of the resin composition, it is preferable that the siloxane resin solution after hydrolysis and dehydration condensation does not contain the catalyst, and the catalyst can be removed if necessary. As the catalyst removing method, water washing, treatment with an ion exchange resin, or the like is preferable from the viewpoint of ease of operation and removability. The water washing is a method of diluting a polysiloxane solution with an appropriate hydrophobic solvent, washing with water several times, and then concentrating the obtained organic layer with an evaporator or the like. The treatment with an ion exchange resin is a method of contacting a polysiloxane solution with an appropriate ion exchange resin.

The organometallic compound becomes black particles or yellow particles by being decomposed and aggregated in the exposure step and / or the heating step in the pattern formation of the partition wall (A-1) described later, and becomes OD of the partition wall (A-1) described later. It has a function to improve the value. Since the OD value is low before exposure and increases after pattern formation, in the exposure step, the exposed light can be sufficiently transmitted to the bottom and photocured or photodecomposed. For example, in the case of a resin composition having negative photosensitive, when a pattern is formed in advance using a resin composition containing a large amount of black pigment in order to form a partition wall (A-1) having a high OD value, a pattern is formed at the bottom. Photocuring tends to be insufficient. As a result, the shape of the obtained partition wall (A-1) tends to be a reverse taper type. When the pattern is formed by using the resin composition of the present invention containing the above-mentioned organometallic compound, the taper angle can be easily set to the preferable range described later because the photocuring is sufficiently to the bottom.

Examples of the organic metal compound include silver-containing organic metal compounds such as silver neodecanoate, silver octylate, and silver salicylate; gold such as chloro (triphenylphosphine) gold and tetrachlorogold acid tetrahydrate. Organic metal compounds; Organic metal compounds containing platinum such as bis (acetylacetonato) platinum, dichlorobis (triphenylphosphine) platinum, dichlorobis (benzonitrile) platinum; bis (acetylacetonato) palladium, dichlorobis (triphenylphosphine) Examples thereof include organic metal compounds containing palladium such as palladium, dichlorobis (benzonitrile) palladium, tetrakis (triphenylphosphine) palladium, and dibenzylidene acetone palladium. Two or more of these may be contained.

Of these, when an organic metal compound containing silver such as silver neodecanoate, silver octylate, and silver salicylate is contained, it decomposes and aggregates in the exposure process to cause blackening, and further decomposes and aggregates in the subsequent heating process. It turns yellow.

On the other hand, organic metal compounds containing platinum such as bis (acetylacetonato) platinum, dichlorobis (triphenylphosphine) platinum, and dichlorobis (benzonitrile) platinum; bis (acetylacetonato) palladium, dichlorobis (triphenylphosphine) palladium, When an organic metal compound selected from palladium such as dichlorobis (benzonitrile) palladium, tetrakis (triphenylphosphine) palladium, and dibenzylideneacetone palladium is contained, it becomes black due to decomposition and aggregation in the exposure step and / or the heating step. do.

Among these, organometallic compounds selected from bis (acetylacetonato) palladium, dichlorobis (triphenylphosphine) palladium, dichlorobis (benzonitrile) palladium and tetrakis (triphenylphosphine) palladium from the viewpoint of further improving the OD value. Is preferable.

In the resin composition of the present invention, the content of the organometallic compound in the solid content is preferably 0.2 to 5% by weight. By setting the content of the organometallic compound to 0.2% by weight or more, the OD value of the obtained partition wall can be further improved. The content of the organometallic compound is more preferably 1.5% by weight or more. On the other hand, by setting the content of the organometallic compound to 5% by weight or less, the reflectance can be further improved.

When the resin composition of the present invention is used for pattern formation of the partition wall (A-1) described later, it is preferable that the resin composition has negative or positive photosensitivity. When negative photosensitivity is imparted, it is preferable to contain a photopolymerization initiator, and a partition wall having a high-definition pattern shape can be formed. The negative photosensitive resin composition preferably further contains a photopolymerizable compound. On the other hand, when imparting positive photosensitivity, it is preferable to contain a quinonediazide compound.

The photopolymerization initiator may be any one as long as it decomposes and / or reacts with light (including ultraviolet rays and electron beams) to generate radicals. For example, 2-methyl- [4- (methylthio) phenyl] -2-morpholinopropane-1-one, 2-dimethylamino-2- (4-methylbenzyl) -1- (4-morpholin-4-yl). Α-Aminoalkylphenone compounds such as -phenyl) -butane-1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1; 2,4,6-trimethylbenzoylphenyl Acylphosphine oxide compounds such as phosphine oxide, bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide, bis (2,6-dimethoxybenzoyl)-(2,4,4-trimethylpentyl) -phosphine oxide 1-Phenyl-1,2-propanedione-2- (O-ethoxycarbonyl) oxime, 1,2-octanedione-1- [4- (phenylthio) -2- (O-benzoyloxime)], 1- Phenyl-1,2-butadion-2- (O-methoxycarbonyl) oxime, 1,3-diphenylpropanthrion-2- (O-ethoxycarbonyl) oxime, etanone-1- [9-ethyl-6- (2-ethyl-6-) Oxyme ester compounds such as methylbenzoyl) -9H-carbazole-3-yl] -1- (O-acetyloxime); benzyl ketal compounds such as benzyl dimethyl ketal; 2-hydroxy-2-methyl-1-phenylpropan-1 -On, 1- (4-isopropylphenyl) -2-hydroxy-2-methylpropan-1-one, 4- (2-hydroxyethoxy) phenyl- (2-hydroxy-2-propyl) ketone, 1-hydroxycyclohexyl -Α-Hydroxyketone compounds such as phenylketone; benzophenone, 4,4-bis (dimethylamino) benzophenone, 4,4-bis (diethylamino) benzophenone, o-methyl benzoylbenzoate, 4-phenylbenzophenone, 4,4- Benzophenone compounds such as dichlorobenzophenone, hydroxybenzophenone, 4-benzoyl-4'-methyl-diphenylsulfide, alkylated benzophenone, 3,3', 4,4'-tetra (t-butylperoxycarbonyl) benzophenone; 2,2 -Acetophenone compounds such as diethoxyacetophenone, 2,3-diethoxyacetophenone, 4-t-butyldichloroacetophenone, benzalacetophenone, 4-azidobenzalacetophenone Aromatic ketoester compounds such as 2-phenyl-2-methyl oxyacetate; ethyl 4-dimethylaminobenzoate, 4-dimethylaminobenzoic acid (2-ethyl) hexyl, ethyl 4-diethylaminobenzoate, 2-benzoylbenzoic acid Examples thereof include benzoic acid ester compounds such as methyl. Two or more of these may be contained.

The content of the photopolymerization initiator in the resin composition of the present invention is preferably 0.01% by weight or more, more preferably 1% by weight or more, based on the solid content, from the viewpoint of effectively advancing radical curing. On the other hand, from the viewpoint of suppressing elution of the residual photopolymerization initiator and further improving yellowing, the content of the photopolymerization initiator is preferably 20% by weight or less, more preferably 10% by weight or less in the solid content. preferable.

The photopolymerizable compound in the present invention refers to a compound having two or more ethylenically unsaturated double bonds in the molecule. Considering the ease of radical polymerization, the photopolymerizable compound preferably has a (meth) acrylic group.

Examples of the photopolymerizable compound include diethylene glycol diacrylate, triethylene glycol diacrylate, tetraethylene glycol diacrylate, diethylene glycol dimethacrylate, triethylene glycol dimethacrylate, tetraethylene glycol dimethacrylate, trimethylolpropane diacrylate, and trimethylolpropane. Triacrylate, Trimethylol Propane Dimethacrylate, Trimethylol Propane Trimethacrylate, 1,3-Butanediol Diacrylate, 1,3-Butanediol Dimethacrylate, Neopentyl glycol Diacrylate, 1,4-Butanediol Diacrylate, 1, 4-Butandiol dimethacrylate, 1,6-hexanediol diacrylate, 1,9-nonanediol dimethacrylate, 1,10-decanediol dimethacrylate, dimethylol-tricyclodecanediacrylate, pentaerythritol triacrylate, pentaerythritol tetra Acrylate, pentaerythritol trimethacrylate, pentaerythritol tetramethacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, tripentaerythritol heptaacrylate, tripentaerythritol octaacrylate, tetrapentaerythritol nonaacrylate, tetrapentaerythritol decaacrylate, pentapenta Erislithol Undecaacrylate, Pentapentaerythritoleddecaacrylate, Trypentaerythritol heptamethacrylate, Tripentaerythritol octamethacrylate, Tetrapentaerythritol nonamethacrylate, Tetrapentaerythritol decamethacrylate, Pentapentaerythritol undecamethacrylate, Pentapentaerythritol dodecamethacrylate, Dimethyrole- Examples thereof include tricyclodecanediacrylate. Two or more of these may be contained.

The content of the photopolymerizable compound in the resin composition of the present invention is preferably 1% by weight or more in the solid content from the viewpoint of effectively advancing radical curing. On the other hand, from the viewpoint of suppressing the excessive reaction of radicals and improving the resolution, the content of the photopolymerizable compound is preferably 40% by weight or less in the solid content.

As the quinone diazide compound, a compound in which a sulfonic acid of naphthoquinone diazide is bonded to a compound having a phenolic hydroxyl group with an ester is preferable. Examples of the compound having a phenolic hydroxyl group used here include BIs-Z, TekP-4HBPA (Tetrakiss P-DO-BPA), TrisP-HAP, TrisP-PA, BIsRS-2P, and BIsRS-3P (hereinafter, commercial products). Name, manufactured by Honshu Chemical Industry Co., Ltd., BIR-PC, BIR-PTBP, BIR-BIPC-F (above, trade name, manufactured by Asahi Organic Materials Industry Co., Ltd.), 4,4'-sulfonyldiphenol, BPFL (Product name, manufactured by JFE Chemical Co., Ltd.) and the like. As the quinone diazide compound, a compound in which 4-naphthoquinone diazide sulfonic acid or 5-naphthoquinone diazido sulfonic acid is introduced into these compounds having a phenolic hydroxyl group by an ester bond is preferable, and for example, THP-17 and TDF-517 (trade name, TDF-517) are preferable. Examples thereof include Toyo Synthetic Industry Co., Ltd.) and SBF-525 (trade name, manufactured by AZ Electronic Materials Co., Ltd.).

The content of the quinonediazide compound in the resin composition of the present invention is preferably 0.5% by weight or more, more preferably 1% by weight or more, based on the solid content, from the viewpoint of improving the sensitivity. On the other hand, the content of the quinone diazide compound is preferably 25% by weight or less, and more preferably 20% by weight or less in the solid content from the viewpoint of improving the resolution.

The solvent has a function of adjusting the viscosity of the resin composition to a range suitable for coating and improving the uniformity of the partition wall. As the solvent, it is preferable to combine a solvent having a boiling point of more than 150 ° C. and 250 ° C. or lower under atmospheric pressure and a solvent having a boiling point of 150 ° C. or lower.

Examples of the solvent include alcohols such as ethanol, propanol, isopropanol and diacetone alcohol; glycols such as ethylene glycol and propylene glycol; ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, propylene glycol monomethyl ether and propylene glycol monoethyl. Ethers such as ether, propylene glycol monopropyl ether, propylene glycol monobutyl ether; ketones such as methyl ethyl ketone, acetyl acetone, methyl propyl ketone, methyl butyl ketone, methyl isobutyl ketone, diisobutyl ketone, cyclopentanone; dimethylformamide, dimethylacetamide, etc. Amids; ethyl acetate, propyl acetate, butyl acetate, isobutyl acetate, ethylene glycol monoethyl ether acetate, propylene glycol monomethyl ether acetate, 3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, methyl lactate, ethyl lactate , Acetates such as butyl lactate; aromatic or aliphatic hydrocarbons such as toluene, xylene, hexane, cyclohexane, γ-butyrolactone, N-methyl-2-pyrrolidone, dimethylsulfoxide and the like. Two or more of these may be contained. Among these, from the viewpoint of coatability, it is preferable to combine diacetone alcohol as a solvent having a boiling point of more than 150 ° C. and 250 ° C. or lower under atmospheric pressure, and propylene glycol monomethyl ether as a solvent having a boiling point of 150 ° C. or lower.

The content of the solvent can be arbitrarily set according to the coating method and the like. For example, when the film is formed by spin coating, the content of the solvent is generally 50% by weight or more and 95% by weight or less in the resin composition.

The resin composition of the present invention preferably further contains a coordinating compound having a phosphorus atom (hereinafter, may be referred to as "coordinating compound"). The coordinating compound coordinates with the organometallic compound in the resin composition, improves the solubility of the organometallic compound in the solvent, promotes the decomposition of the organometallic compound, and further improves the OD value of the obtained partition wall. Can be made to. Examples of the coordinating compound include triphenylphosphine, tri-t-butylphosphine, trimethylphosphine, tricyclohexylphosphine, tri-t-butylphosphine tetrafluoroborate, tri (2-furyl) phosphine, and tris (1-frill). Examples thereof include adamantyl) phosphine, tris (diethylamino) phosphine, tris (4-methoxyphenyl) phosphine, and tris (O-tolyl) phosphine. Two or more of these may be contained. The content of the coordinating compound in the resin composition of the present invention is preferably 0.5 to 3.0 molar equivalent with respect to the organometallic compound.

The resin composition of the present invention preferably further contains a white pigment and / or a black pigment. The white pigment has a function of further improving the reflectance of the partition wall. The black pigment has a function of adjusting the OD value.

Examples of the white pigment include titanium dioxide, zirconium oxide, zinc oxide, barium sulfate, and composite compounds thereof. Two or more of these may be contained. Among these, titanium dioxide having high reflectance and easy industrial use is preferable.

The crystal structure of titanium dioxide is classified into anatase type, rutile type and brookite type. Among these, rutile-type titanium oxide is preferable because of its low photocatalytic activity.

The white pigment may be surface-treated. Surface treatment with a metal selected from Al, Si and Zr is preferable, and the light resistance and heat resistance of the formed partition wall can be improved.

The median diameter of the white pigment is preferably 100 to 500 nm from the viewpoint of further improving the reflectance of the partition wall. Here, the median diameter of the white pigment can be calculated from the particle size distribution measured by a laser diffraction method using a particle size distribution measuring device (N4-PLUS; manufactured by Beckman Coulter Co., Ltd.) or the like.

Titanium dioxide pigments preferably used as white pigments include, for example, R960; manufactured by DuPont Co., Ltd. (rutile type, SiO ₂ / Al ₂ O3 treatment, _average primary particle size 210 nm), CR-97; Ishihara Sangyo Co., Ltd. Made by (rutile type, Al ₂ O ₃ / ZrO ₂ treatment, average primary particle diameter 250 nm), JR-301; manufactured by Teika Co., Ltd. (rutile type, Al ₂ O ₃ treatment, average primary particle diameter 300 nm), JR-405 Made by Teika Co., Ltd. (rutile type, Al ₂ O ₃ treatment, average primary particle diameter 210 nm), JR-600A; Teika Co., Ltd. (rutile type, Al ₂ O ₃ treatment, average primary particle diameter 250 nm), JR- 603; Teika Co., Ltd. (rutile type _{, Al2O3} / ZrO2 treatment, average primary particle size ₂₈₀ nm) and the like can be mentioned. Two or more of these may be contained.

The content of the white pigment in the resin composition is preferably 20% by weight or more, and more preferably 30% by weight or more in the solid content from the viewpoint of further improving the reflectance. On the other hand, from the viewpoint of improving the surface smoothness of the partition wall, the content of the white pigment is preferably 60% by weight or less, more preferably 55% by weight or less in the solid content.

Examples of the black pigment include black organic pigments, mixed color organic pigments, black inorganic pigments and the like.

Examples of the black organic pigment include carbon black, perylene black, aniline black, and benzofuranone pigments. These may be coated with a resin.

Examples of the mixed color organic pigment include those obtained by mixing two or more kinds of pigments selected from red, blue, green, purple, yellow, magenta, cyan and the like to make a pseudo-black color. Among these, a mixed pigment of a red pigment and a blue pigment is preferable from the viewpoint of achieving both a moderately high OD value and pattern processability. The weight ratio of the red pigment to the blue pigment in the mixed pigment is preferably 20/80 to 80/20, more preferably 30/70 to 70/30. Specific examples of typical pigments by color index (CI) number include the following. Examples of the red pigment include Pigment Red (hereinafter abbreviated as PR) 9, PR48, PR97, PR122, PR123, PR144, PR149, PR166, PR168, PR177, PR179, PR180, PR192, PR209, PR215, PR216, PR217, PR220. , PR223, PR224, PR226, PR227, PR228, PR240, PR254 and the like. Two or more of these may be contained. Examples of the blue pigment include Pigment Blue (hereinafter abbreviated as PB) 15, PB15: 3, PB15: 4, PB15: 6, PB22, PB60, PB64. Two or more of these may be contained.

Examples of the black inorganic pigment include graphite; fine particles of metals such as titanium, copper, iron, manganese, cobalt, chromium, nickel, zinc, calcium, silver, gold, platinum and palladium; metal oxides; metal composite oxides; Examples thereof include metal sulfides; metal nitrides; metal oxynitrides; and metal carbides. Two or more of these may be contained.

Among the above black pigments, titanium nitride, zirconium nitride, carbon black, and a pigment selected from a mixed pigment having a weight ratio of a red pigment and a blue pigment of 20/80 to 80/20 are selected because they have high light-shielding properties. preferable. Further, from the viewpoint of easily adjusting the taper angle of the partition wall (A-1) to a preferable range described later, titanium nitride, zirconium nitride, and a mixed pigment having a weight ratio of a red pigment and a blue pigment of 20/80 to 80/20 are used. The selected pigment is more preferred.

The content of the black pigment in the resin composition is preferably 0.01% by weight or more in the solid content, preferably 0, from the viewpoint of adjusting the reflectance and OD to the above-mentioned ranges and further suppressing the color mixing of light in the adjacent pixels. More preferably, it is 0.05% by weight or more. On the other hand, from the viewpoint of adjusting the reflectance and OD within the above-mentioned ranges, the content of the black pigment is preferably 5% by weight or less, and more preferably 3% by weight or less in the solid content.

The resin composition of the present invention preferably further contains a photobase generator. By containing a photobase generator, a base is generated in the exposure process to promote decomposition and aggregation of the organometallic compound in the resin composition, so that the organometallic compound can be more efficiently converted into black particles or yellow particles. It can be converted and the OD value of the obtained partition wall can be further improved.

The photobase generator may be any agent as long as it decomposes and / or reacts with light (including ultraviolet rays and electron beams) to generate a base. For example, 2- (9-oxoxanthen-2-yl) propionic acid 1,5,7-triazacyclo [4,4,0] deca-5-ene, N-cyclohexylcarbamic acid 1- (anthraquinone-2-yl). Ethyl, N, N-diethylcarbamate 9-anthrylmethyl, N-cyclohexylcarbamate 9-anthrylmethyl, 1-carboxylic acid 9-anthrylmethylpiperidin, N, N-dicyclohexylcarbamate 9-anthrylmethyl, N, N-dicyclohexylcarbamic acid 1- (anthraquinone-2-yl) ethyl, cyclohexylammonium 2- (3-benzoylphenyl) propionate, butyltriphenylboronic acid 1,2-dicyclohexyl-4,4,5,5, -Tetramethylbiguanidinium, 2- (3-benzoylphenyl) propionic acid 1,2-diisopropyl-3- [bis (dimethylamino) methylene] guanidinium, (2-nitrophenyl) methyl 4-hydroxypiperidine-1- Examples thereof include carboxylic acids and guanidinium 2- (3-benzoylphenyl) propionate. Two or more of these may be used.

The content of the photobase generator in the resin composition of the present invention is preferably 0.5% by weight or more in the solid content from the viewpoint of further improving the OD value. On the other hand, the content of the photobase generator is preferably 2.0% by weight or less in the solid content from the viewpoint of improving the resolution.

The resin composition of the present invention may contain a liquid repellent compound. The liquid-repellent compound is a compound that imparts the property of repelling water or an organic solvent (liquid-repellent performance) to the resin composition. The compound having such properties is not particularly limited, but specifically, a compound having a fluoroalkyl group is preferably used. By containing the liquid-repellent compound, the liquid-repellent performance can be imparted to the top of the partition wall after the partition wall (A-1) is formed. Thereby, for example, when forming the pixels containing the color conversion light emitting material (B) described later, the color conversion light emitting materials having different compositions can be easily applied to each pixel.

Examples of the liquid repellent compound include 1,1,2,2-tetrafluorooctyl (1,1,2,2-tetrafluoropropyl) ether, 1,1,2,2-tetrafluorooctylhexyl ether, and octaethylene. Glycoldi (1,1,2,2-tetrafluorobutyl) ether, hexaethylene glycol (1,1,2,2,3,3-hexafluoropentyl) ether, octapropylene glycol di (1,1,2, 2-Tetrafluorobutyl) ether, hexapropylene glycol di (1,1,2,2,3,3-hexafluoropentyl) ether, sodium perfluorododecylsulfonate, 1,1,2,2,8,8, 9,9,10,10-decafluorodecane, 1,1,2,2,3,3-hexafluorodecane, N- [3- (perfluorooctane sulfonamide) propyl] -N, N'-dimethyl- N-carboxymethyleneammonium betaine, perfluoroalkylsulfonamide propyltrimethylammonium salt, perfluoroalkyl-N-ethylsulfonylglycine salt, bis phosphate (N-perfluorooctylsulfonyl-N-ethylaminoethyl), monoperfluoroalkyl Examples thereof include compounds having a fluoroalkyl or fluoroalkylene group at the terminal, main chain and / or side chain such as ethyl phosphate ester. Commercially available liquid repellent compounds include "Megafuck" (registered trademark) F142D, F172, F173, F183, F444, F477 (all manufactured by Dainippon Ink and Chemicals Co., Ltd.), Ftop EF301, 303, 352. (Manufactured by Shin-Akita Kasei Co., Ltd.), Florard FC-430, FC-431 (manufactured by Sumitomo 3M Co., Ltd.), "Asahi Guard" (registered trademark) AG710, "Surflon" (registered trademark) S-382, SC -101, SC-102, SC-103, SC-104, SC-105, SC-106 (manufactured by Asahi Glass Co., Ltd.), BM-1000, BM-1100 (manufactured by Yusho Co., Ltd.), NBX-15, Examples include FTX-218 and DFX-18 (manufactured by Neos Co., Ltd.). Two or more of these may be contained. Among these, those having a photopolymerizable group are more preferable because they have high reactivity and can form a strong bond with the resin. Examples of the liquid repellent compound having a fluorine atom and a photopolymerizable group include "Megafuck" (registered trademark) RS-76-E, RS-56, RS-72-k, RS-75, RS-76-E. , RS-76-NS, RS-76, RS-90 (above, trade name, manufactured by DIC Co., Ltd.) and the like. In this case, the photopolymerizable group may be photopolymerized in the partition wall (A-1) made of a photocured product of the negative photosensitive resin composition.

From the viewpoint of improving the liquid-repellent performance of the partition wall and improving the inkjet coatability, the content of the liquid-repellent compound in the resin composition is preferably 0.01% by weight or more, preferably 0.1% by weight or more in the solid content. More preferred. On the other hand, from the viewpoint of improving the compatibility with the resin and the white pigment, the content of the liquid-repellent compound is preferably 10% by weight or less, more preferably 5% by weight or less in the solid content.

Further, the resin composition of the present invention may contain an ultraviolet absorber, a polymerization inhibitor, a surfactant, an adhesion improver and the like, if necessary.

By containing the ultraviolet absorber in the resin composition of the present invention, the light resistance can be improved and the resolution can be further improved. Examples of the ultraviolet absorber include 2- (2H-benzotriazole-2-yl) phenol and 2- (2H-benzotriazole-2-yl) -4,6-tert-pentyl from the viewpoint of transparency and non-coloring property. Phenol, 2- (2H-benzotriazole-2-yl) -4- (1,1,3,3-tetramethylbutyl) phenol, 2 (2H-benzotriazole-2-yl) -6-dodecyl-4- Benzotriazole-based compounds such as methylphenol, 2- (2'-hydroxy-5'-methacryloxyethylphenyl) -2H-benzotriazole; benzophenone-based compounds such as 2-hydroxy-4-methoxybenzophenone; 2- (4, 6-Diphenyl-1,3,5-triazine-2-yl) -5-[(hexyl) oxy] -triazole compounds such as phenol are preferably used.

By containing a polymerization inhibitor in the resin composition of the present invention, the resolution can be further improved. Examples of the polymerization inhibitor include di-t-butylhydroxytoluene, butylhydroxyanisole, hydroquinone, 4-methoxyphenol, 1,4-benzoquinone, and t-butylcatechol. In addition, as a commercially available polymerization inhibitor, "IRGANOX" (registered trademark) 1010, 1035, 1076, 1098, 1135, 1330, 1726, 1425, 1520, 245, 259, 3114, 565, 295 (above, trade name, trade name, BASF Japan Co., Ltd.) and the like. Two or more of these may be contained.

By containing a surfactant in the resin composition of the present invention, the flowability at the time of coating can be improved. Examples of the surfactant include "Megafuck" (registered trademark) F142D, F172, F173, F183, F445, F470, F475, F477 (trade name, manufactured by Dainippon Ink and Chemicals Co., Ltd.), NBX-. 15. Fluorosurfactants such as FTX-218 (trade name, manufactured by Neos Co., Ltd.); "BYK" (registered trademark) -333, 301, 331, 345, 307 (trade name, Big Chemie. Silicone-based surfactants such as (manufactured by Japan Co., Ltd.); polyalkylene oxide-based surfactants; poly (meth) acrylate-based surfactants and the like can be mentioned. Two or more of these may be contained.

By containing the adhesion improving agent in the resin composition of the present invention, the adhesion with the underlying substrate is improved, and a highly reliable partition wall can be obtained. Examples of the adhesion improving agent include an alicyclic epoxy compound and a silane coupling agent. Among these, the alicyclic epoxy compound has high heat resistance, so that the color change after heating can be further suppressed.

Examples of the alicyclic epoxy compound include 3', 4'-epoxycycloheximethyl-3,4-epoxycyclohexanecarboxylate and 1,2-epoxy of 2,2-bis (hydroxymethyl) -1-butanol. 4- (2-oxylanyl) cyclohexane adduct, ε-caprolactone modified 3', 4'-epoxycyclohexylmethyl 3', 4'-epoxycyclohexanecarboxylate, 1,2-epoxy-4-vinylcyclohexane, butanetetracarboxylic acid Tetra (3,4-epoxycyclohexylmethyl) modified ε-caprolactone, 3,4-epoxycyclohexylmethylmethacrylate, hydrogenated bisphenol A diglycidyl ether, hydrogenated bisphenol F diglycidyl ether, hydrogenated bisphenol E diglycidyl ether, water Examples thereof include bisphenol A bis (propylene glycol glycidyl ether) ether, hydrogenated bisphenol A bis (ethylene glycol glycidyl ether) ether, diglycidyl 1,4-cyclohexanedicarboxylate, and 1,4-cyclohexanedimethanol diglycidyl ether. Two or more of these may be contained.

The content of the adhesion improver in the resin composition of the present invention is preferably 0.1% by weight or more, more preferably 1% by weight or more in the solid content from the viewpoint of further improving the adhesion to the underlying substrate. .. On the other hand, the content of the adhesion improving agent is preferably 20% by weight or less, and more preferably 10% by weight or less in the solid content from the viewpoint of further suppressing the color change due to heating.

The resin composition of the present invention can be produced, for example, by mixing the above-mentioned resin, organometallic compound, photopolymerization initiator or quinonediazide compound, solvent and, if necessary, other components.

Next, the light-shielding film of the present invention will be described. The light-shielding film of the present invention is obtained by curing the above-mentioned resin composition of the present invention. The light-shielding film of the present invention can be suitably used as a light-shielding pattern in an OGS type touch panel such as a decorative pattern for a cover base material, in addition to the partition wall (A-1) described later. The film thickness of the light-shielding film is preferably 10 μm or more.

Next, the method for producing the light-shielding film of the present invention will be described with reference to an example. The method for producing a light-shielding film of the present invention includes a film-forming step of applying the resin composition of the present invention on a base substrate and drying to obtain a dry film, an exposure step of pattern-exposing the obtained dry film, and post-exposure. It is preferable to have a developing step of dissolving and removing a portion of the dried film that is soluble in the developing solution and a heating step of heating the developed dried film to cure it.

In the method for producing a light-shielding film of the present invention, the OD value per 10 μm film thickness is increased by 0.3 or more by heating the developed film at a temperature of 120 ° C. or higher and 250 ° C. or lower in the heating step. It is a feature. The heating temperature during the heating step is preferably 150 ° C. or higher, more preferably 180 ° C. or higher, from the viewpoint of further improving the OD value. The heating temperature during the heating step is preferably 250 ° C. or lower, more preferably 240 ° C. or lower, from the viewpoint of suppressing the generation of cracks in the film to be heated. The heating time is preferably 15 minutes to 2 hours. The film formed from the resin composition of the present invention has a low OD value at the time of exposure and an OD value increases after pattern formation. It is possible to obtain a partition wall having an angle. In addition, since the OD value is high after pattern formation, it is possible to obtain a partition wall having both high reflectance and light-shielding property.

Examples of the method for applying the resin composition in the film forming step include a slit coating method and a spin coating method. Examples of the drying device include a hot air oven and a hot plate. The drying time is preferably 80 to 120 ° C., and the drying time is preferably 1 to 15 minutes.

The exposure step is a step of photocuring a necessary part of the dry film by exposure or photodecomposing an unnecessary part of the dry film to make any part of the dry film soluble in a developing solution. .. In the exposure step, exposure may be performed through a photomask having a predetermined opening, or an arbitrary pattern may be directly drawn using a laser beam or the like without using a photomask.

Examples of the exposure apparatus include a proximity exposure machine. Examples of the active light beam to be irradiated in the exposure step include near infrared rays, visible light rays, and ultraviolet rays, and ultraviolet rays are preferable. Examples of the light source include a low-pressure mercury lamp, a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a halogen lamp, a germicidal lamp, and the like, and an ultra-high pressure mercury lamp is preferable.

The exposure conditions can be appropriately selected depending on the thickness of the dry film to be exposed. Generally, it is preferable to use an ultrahigh pressure mercury lamp having an output of 1 to 100 mW / cm ² and expose with an exposure amount of 1 to 10,000 mJ / cm ² .

In the developing step, the portion of the dried film after exposure that is soluble in the developing solution is dissolved and removed with the developing solution, and only the portion that is insoluble in the developing solution remains. , Called a pre-heating pattern). Examples of the pattern shape include a grid shape and a striped shape.

Examples of the developing method include a dipping method, a spraying method, and a brushing method.

As the developing solution, a solvent capable of dissolving an unnecessary portion of the dried film after exposure can be appropriately selected, and an aqueous solution containing water as a main component is preferable. For example, when the resin composition contains a polymer having a carboxyl group, an alkaline aqueous solution is preferable as the developing solution. Examples of the alkaline aqueous solution include inorganic alkaline aqueous solutions such as sodium hydroxide, potassium hydroxide, sodium carbonate and calcium hydroxide; and organic alkaline aqueous solutions such as tetramethylammonium hydroxide, trimethylbenzylammonium hydrogenoxide, monoethanolamine and diethanolamine. Can be mentioned. Among these, an aqueous solution of potassium hydroxide or an aqueous solution of tetramethylammonium hydroxide is preferable from the viewpoint of improving the resolution. The concentration of the alkaline aqueous solution is preferably 0.05% by weight or more, more preferably 0.1% by weight or more, from the viewpoint of improving developability. On the other hand, the concentration of the alkaline aqueous solution is preferably 5% by weight or less, more preferably 1% by weight or less, from the viewpoint of suppressing peeling and corrosion of the pattern before heating. The development temperature is preferably 20 to 50 ° C. for facilitating process control.

The heating step is a step of heating and curing the preheating pattern formed in the developing step. Examples of the heating device include a hot plate, an oven, and the like. The preferred heating temperature and heating time are as described above.

Next, the substrate with a partition wall of the present invention will be described. The substrate with a partition wall of the present invention has a partition wall (hereinafter, may be referred to as “partition wall (A-1)”) in which a (A-1) pattern is formed on a base substrate. The base substrate has a function as a support in a substrate with a partition wall. When the partition wall has pixels containing a color conversion light emitting material described later, it has a function of suppressing color mixing of light between adjacent pixels.

In the substrate with a partition wall of the present invention, the partition wall (A-1) has a reflectance of 20% to 60% per 10 μm thickness and an OD value of 1.0 to 3.0 per 10 μm thickness at a wavelength of 550 nm. It is a feature. By setting the reflectance to 20% or more and the OD value to 3.0 or less, the brightness of the display device can be improved by utilizing the reflection on the side surface of the (A-1) partition wall. On the other hand, by setting the reflectance to 60% or less and the OD value to 1.0 or more, it is possible to suppress the light transmitted through the partition wall (A-1) and suppress the color mixing of the light between adjacent pixels.

FIG. 1 shows a cross-sectional view of one aspect of the substrate with a partition wall of the present invention having a pattern-formed partition wall. A patterned partition wall 2 is provided on the base substrate 1.

<Base substrate>
Examples of the base substrate include a glass plate, a resin plate, a resin film, and the like. As the material of the glass plate, non-alkali glass is preferable. As the material of the resin plate and the resin film, polyester, (meth) acrylic polymer, transparent polyimide, polyether sulfone and the like are preferable. The thickness of the glass plate and the resin plate is preferably 1 mm or less, preferably 0.8 mm or less. The thickness of the resin film is preferably 100 μm or less.

<Septum (A-1)>
The partition wall (A-1) is characterized by having a reflectance of 20 to 60% and an OD value of 1.0 to 3.0 per 10 μm thickness at a wavelength of 550 nm. Here, the thickness of the partition wall (A-1) refers to the length in the direction (height direction) perpendicular to the base substrate of the partition wall (A-1). In the case of the substrate with a partition wall shown in FIG. 1, the thickness of the partition wall 2 is represented by the reference numeral H. The length of the partition wall (A-1) in the horizontal direction with the base substrate is the width of the partition wall (A-1). In the case of the substrate with a partition wall shown in FIG. 1, the width of the partition wall 2 is represented by the reference numeral L.

In the present invention, it is considered that the reflectance on the side surface of the partition wall contributes to the improvement of the brightness of the display device, and the light-shielding property of the partition wall contributes to the suppression of color mixing. On the other hand, since the reflectance and OD value per thickness are considered to be the same regardless of the thickness direction and the width direction, the present invention focuses on the reflectance and OD value per thickness of the partition wall. As will be described later, the thickness of the partition wall (A-1) is preferably 0.5 to 50 μm, and the width is preferably 5 to 40 μm. Therefore, in the present invention, 10 μm was selected as a representative value for the thickness of the partition wall (A-1), and attention was paid to the reflectance and the OD value per 10 μm thickness.

If the reflectance per 10 μm thickness is less than 20%, the reflection on the side surface of the partition wall becomes small, and the brightness of the display device becomes insufficient. The reflectance per 10 μm thickness is preferably 30% or more, more preferably 35% or more. The higher the reflectance, the greater the reflection on the side surface of the partition wall, so that the brightness of the display device can be improved. However, when the reflectance exceeds 60%, color mixing of light occurs between adjacent pixels. The reflectance per 10 μm thickness is more preferably 44% or less.

Further, when the OD value per 10 μm thickness is less than 1.0, color mixing of light occurs between adjacent pixels. The OD value per 10 μm thickness is preferably 1.5 or more, more preferably 2.0 or more. On the other hand, when the OD value per 10 μm thickness exceeds 3.0, the reflection on the side surface of the partition wall becomes small, and the brightness of the display device becomes insufficient. The OD value per 10 μm thickness is more preferably 2.5 or less.

For the reflectance of the partition wall (A-1) at a wavelength of 550 nm per 10 μm thickness, a spectrocolorimeter (for example, CM-2600d manufactured by Konica Minolta Co., Ltd.) was used from the upper surface of the partition wall (A-1) having a thickness of 10 μm. It can be measured by the SCI mode. However, if a sufficient area for measurement cannot be secured or a measurement sample with a thickness of 10 μm cannot be collected and the composition of the partition wall (A-1) is known, the composition is the same as that of the partition wall (A-1). The reflectance per 10 μm thickness may be obtained by preparing a solid film having a thickness of 10 μm and measuring the reflectance of the solid film in the same manner instead of the partition wall (A-1). For example, using a material on which the partition wall (A-1) is formed, a solid film is produced under the same processing conditions as the partition wall (A-1) except that the thickness is 10 μm and no pattern is formed, and the solid film is obtained. The reflectance of the film may be measured from the upper surface in the same manner.

The OD value per 10 μm thickness of the partition wall (A-1) is determined by using an optical densitometer (for example, 361T (visual) manufactured by X-rite) from the upper surface of the partition wall (A-1) having a thickness of 10 μm. The intensity of transmitted light can be measured and calculated by the following formula (1). However, if a sufficient area for measurement cannot be secured, or if a measurement sample with a thickness of 10 μm cannot be collected and the composition of the partition wall (A-1) is known, the partition wall (as in the measurement of reflectance) A solid film having the same composition as A-1) and having a thickness of 10 μm may be prepared, and the OD value per 10 μm thickness may be obtained by measuring the OD value of the solid film in the same manner instead of the partition wall (A-1). ..
OD value = log10 (I ₀ / I) ... (1)
I ₀ : Incident light intensity I: Transmitted light intensity.

As a means for setting the reflectance and the OD value in the above range, for example, the partition wall (A-1) may have a preferable composition described later.

The taper angle of the partition wall (A-1) is preferably 45 ° to 110 °. The taper angle of the partition wall (A-1) refers to the angle formed by the side surface and the bottom surface of the partition wall cross section. In the case of the substrate with a partition wall shown in FIG. 1, the taper angle of the partition wall 2 is represented by the reference numeral θ. By setting the taper angle to 45 ° or more, the difference in width between the top and bottom of the partition wall (A-1) becomes small, and the width of the partition wall (A-1) can be easily formed in a preferable range described later. .. The taper angle is more preferably 70 ° or more. On the other hand, by setting the taper angle to 110 ° or less, when the pixels containing the color conversion light emitting material (B) described later are formed by inkjet coating, the ink breakage is suppressed and the inkjet coating property is improved. Can be done. Here, the ink breakage refers to a phenomenon in which the ink gets over the partition wall and mixes with the adjacent pixel portion. The taper angle is more preferably 95 ° or less. The taper angle of the partition wall (A-1) is an acceleration voltage 3 using an optical microscope (FE-SEM (for example, S-4800 manufactured by Hitachi, Ltd.)) for any cross section of the partition wall (A-1). It can be obtained by observing at 0.0 kV and a magnification of 2,500 and measuring the angle between the side and the bottom of the cross section of the partition wall (A-1).

As a means for setting the taper angle of the partition wall (A-1) in the above range, for example, the partition wall (A-1) has a preferable composition described later, and the above-mentioned resin composition of the present invention is used. For example, forming.

When the substrate with a partition wall has pixels containing the color conversion light emitting material (B) described later, the thickness of the partition wall (A-1) is preferably larger than the thickness of the pixels. Specifically, the thickness of the partition wall (A-1) is preferably 0.5 μm or more, more preferably 10 μm or more. On the other hand, from the viewpoint of more efficiently extracting light emitted from the bottom of the pixel, the thickness of the partition wall (A-1) is preferably 50 μm or less, more preferably 20 μm or less. Further, it is preferable that the width of the partition wall (A-1) is sufficient to further improve the brightness by utilizing the light reflection on the side surface of the partition wall and further suppress the color mixing of light in the adjacent pixels due to light leakage. Specifically, the width of the partition wall is preferably 5 μm or more, more preferably 15 μm or more. On the other hand, the width of the partition wall (A-1) is preferably 50 μm or less, more preferably 40 μm or less, from the viewpoint of securing a large light emitting region of the pixel and further improving the brightness.

The partition wall (A-1) has a repeating pattern for a predetermined number of pixels according to the screen size of the image display device. Examples of the number of pixels of the image display device include 4000 in the horizontal direction and 2000 in the vertical direction. The number of pixels affects the resolution (fineness) of the displayed image. Therefore, it is necessary to form a number of pixels according to the required image resolution and the screen size of the image display device, and it is preferable to determine the pattern formation dimension of the partition wall accordingly.

The partition wall (A-1) is made of a resin, a white pigment, and at least one metal oxide or metal selected from the group consisting of palladium oxide, platinum oxide, gold oxide, silver oxide, palladium, platinum, gold and silver. (Hereinafter, it may be referred to as "metal oxide particles or metal particles"). The resin has a function of improving the crack resistance and light resistance of the partition wall. The white pigment has a function of further improving the reflectance of the partition wall. The metal oxide particles or metal particles have a function of adjusting the OD value and suppressing color mixing of light in adjacent pixels.

The resin and the white pigment are as described above as the materials constituting the resin composition. The content of the resin in the partition wall (A-1) is preferably 10% by weight or more, more preferably 20% by weight or more, from the viewpoint of improving the crack resistance of the partition wall in the heat treatment. On the other hand, from the viewpoint of improving the light resistance, the content of the resin in the partition wall (A-1) is preferably 60% by weight or less, more preferably 50% by weight or less.

The content of the white pigment in the partition wall (A-1) is preferably 20% by weight or more, more preferably 30% by weight or more, from the viewpoint of further improving the reflectance. On the other hand, from the viewpoint of improving the surface smoothness of the partition wall, the content of the white pigment in the partition wall (A-1) is preferably 60% by weight or less, more preferably 55% by weight or less.

The metal oxide particles or metal particles refer to black particles or yellow particles generated by decomposition and aggregation of the organic metal compound in the resin composition described above in the exposure step and / or the heating step. The content of the metal oxide particles or the metal particles in the partition wall (A-1) is 0.2% by weight from the viewpoint of adjusting the reflectance and OD to the above-mentioned ranges and further suppressing the color mixing of light in the adjacent pixels. The above is preferable, and 0.5% by weight or more is more preferable. On the other hand, from the viewpoint of adjusting the reflectance and OD within the above-mentioned ranges, the content of the metal oxide particles or the metal particles in the partition wall (A-1) is preferably 5% by weight or less, more preferably 3% by weight or less. ..

The partition wall (A-1) preferably further contains a liquid repellent compound. By containing the liquid-repellent compound, the partition wall (A-1) can be imparted with liquid-repellent performance. For example, when forming a pixel containing the color conversion light emitting material (B) described later, each pixel is formed. In addition, color-converting light-emitting materials having different compositions can be easily applied separately. The liquid-repellent compound is as described above as a material constituting the resin composition.

From the viewpoint of improving the liquid-repellent performance of the partition wall and improving the inkjet coating property, the content of the liquid-repellent compound in the partition wall (A-1) is preferably 0.01% by weight or more, preferably 0.1% by weight or more. More preferred. On the other hand, from the viewpoint of improving the compatibility with the resin and the white pigment, the content of the liquid-repellent compound in the partition wall (A-1) is preferably 10% by weight or less, more preferably 5% by weight or less.

The surface contact angle of the partition wall (A-1) with respect to propylene glycol monomethyl ether acetate is preferably 10 ° or more, preferably 20 ° or more, from the viewpoint of improving the inkjet coatability and facilitating the separation of color conversion light emitting materials. More preferably, 40 ° or more is further preferable. On the other hand, from the viewpoint of improving the adhesion between the partition wall and the base substrate, the surface contact angle of the partition wall (A-1) is preferably 70 ° or less, more preferably 60 ° or less. Here, the surface contact angle of the partition wall (A-1) conforms to the wettability test method of the substrate glass surface specified in JIS R3257 (establishment date = 1999/04/20) with respect to the upper part of the partition wall. Can be measured. As a method for setting the surface contact angle of the partition wall (A-1) in the above range, for example, a method using the above-mentioned liquid repellent compound and the like can be mentioned.

As a method for forming the partition wall (A-1) on the base substrate in a pattern, the photosensitive paste method is preferable because the pattern shape can be easily adjusted. As a method for forming a pattern of the partition wall by the photosensitive paste method, for example, a coating step of applying the above-mentioned resin composition on a base substrate and drying to obtain a dry film, and a desired pattern of the obtained dry film. A method having an exposure step of pattern exposure according to the shape, a development step of dissolving and removing a portion soluble in a developer in the dried film after exposure, and a heating step of curing the partition wall after development is preferable. The resin composition preferably has positive or negative photosensitive properties. The pattern exposure may be performed through a photomask having a predetermined opening, or an arbitrary pattern may be directly drawn using a laser beam or the like without using a photomask. When the substrate with a partition wall has a light-shielding partition wall (A-2) described later, the partition wall (A-1) can be similarly patterned on the light-shielding partition wall (A-2). Each step is as described above as a method for manufacturing a light-shielding film.

<Shading partition (A-2)>
The substrate with a partition wall of the present invention has an OD value of 0.5 or more per (A-2) thickness of 1.0 μm between the base substrate and the partition wall on which the pattern is formed (A-1). It is preferable to have a certain patterned partition wall (hereinafter, may be referred to as "light-shielding partition wall (A-2)"). By having the light-shielding partition wall (A-2), it is possible to improve the light-shielding property, suppress the light leakage of the backlight in the display device, and obtain a high-contrast and clear image.

FIG. 6 shows a cross-sectional view showing an aspect of the substrate with a partition wall of the present invention having a light-shielding partition wall. A patterned partition wall 2 and a light-shielding partition wall 7 are provided on the base substrate 1, and pixels 3 are arranged in a region separated by the partition wall 2 and the light-shielding partition wall 7.

The light-shielding partition wall (A-2) has an OD value of 0.5 or more per 1.0 μm in thickness. Here, the thickness of the light-shielding partition wall (A-2) is preferably 0.5 to 10 μm as described later. Therefore, in the present invention, 1.0 μm was selected as the representative value of the thickness of the partition wall (A-2), and attention was paid to the OD value per 1.0 μm thickness. By setting the OD value per 1.0 μm thickness to 0.5 or more, the light-shielding property can be further improved and a clear image with higher contrast can be obtained. The OD value per 1.0 μm thickness is more preferably 1.0 or more. On the other hand, the OD value per 1.0 μm thickness is preferably 4.0 or less, and the pattern processability can be improved. The OD value per 1.0 μm thickness is more preferably 3.0 or less. The OD value of the light-shielding partition wall (A-2) can be measured in the same manner as the OD value of the partition wall (A-1) described above. As a means for setting the OD value in the above range, for example, the light-shielding partition wall (A-2) may have a preferable composition described later.

The thickness of the light-shielding partition wall (A-2) is preferably 0.5 μm or more, more preferably 1.0 μm or more, from the viewpoint of improving the light-shielding property. On the other hand, from the viewpoint of improving the flatness, the thickness of the light-shielding partition wall (A-2) is preferably 10 μm or less, more preferably 5 μm or less. Further, the width of the light-shielding partition wall (A-2) is preferably about the same as that of the above-mentioned partition wall (A-1).

The light-shielding partition wall (A-2) preferably contains a resin and a black pigment. The resin has a function of improving the crack resistance and light resistance of the partition wall. The black pigment has a function of absorbing incident light and reducing emitted light.

Examples of the resin include epoxy resins, (meth) acrylic polymers, polyurethanes, polyesters, polyimides, polyolefins, polysiloxanes, and the like. Two or more of these may be contained. Among these, polyimide is preferable because it has excellent heat resistance and solvent resistance.

Examples of the black pigment include those exemplified as the black pigment in the above-mentioned resin composition, palladium oxide, platinum oxide, gold oxide, silver oxide and the like. A black pigment selected from titanium nitride, zirconium nitride, carbon black, palladium oxide, platinum oxide, gold oxide and silver oxide is preferable because of its high light-shielding property.

As a method for forming a pattern of the light-shielding partition wall (A-2) on the base substrate, for example, a photosensitive material described in JP-A-2015-1654 is used, and the light-shielding partition wall (A-1) is exposed to light in the same manner as the above-mentioned partition wall (A-1). A method of forming a pattern by the sex paste method is preferable.

The substrate with a partition wall of the present invention further includes pixels (hereinafter, may be referred to as “pixels (B)”) containing (B) color conversion light emitting materials arranged separated by the partition wall (A-1). It is preferable to have. The pixel (B) has a function of converting at least a part of the wavelength region of the incident light and emitting the emitted light in the wavelength region different from the incident light to enable color display.

FIG. 2 shows a cross-sectional view of one aspect of the substrate with a partition wall of the present invention having a pattern-formed partition wall (A-1) and a pixel (B) containing a color conversion light emitting material. A pattern-formed partition wall 2 is provided on the base substrate 1, and pixels 3 are arranged in a region separated by the partition wall 2.

The color conversion material preferably contains a fluorescent substance selected from an inorganic fluorescent substance and an organic fluorescent substance.

The substrate with a partition wall of the present invention can be used as a display device by combining, for example, a backlight that emits blue light, a liquid crystal crystal formed on the TFT, and a pixel (B). In this case, it is preferable that the region corresponding to the red pixel contains a red phosphor that is excited by the blue excitation light and emits red fluorescence. Similarly, the region corresponding to the green pixel preferably contains a green phosphor that is excited by the blue excitation light and emits green fluorescence. It is preferable that the region corresponding to the blue pixel does not contain a phosphor.

The substrate with a partition wall of the present invention can also be used for a display device of a system in which a large number of blue LEDs corresponding to each pixel are arranged on a substrate separated by a white partition wall and a blue micro LED is used as a backlight. Each pixel can be turned on / off by turning on / off the blue micro LED, and no liquid crystal display is required. The substrate with a partition wall of the present invention can be used for both a partition wall for separating each pixel and a partition wall for separating a blue micro LED in a backlight.

As the inorganic phosphor, one that emits each color such as green or red by the excitation light of blue, that is, one that is excited by the excitation light having a wavelength of 400 to 500 nm and has a peak in the emission spectrum in the region of 500 to 700 nm is preferable. .. Examples of such inorganic phosphors include YAG-based phosphors, TAG-based phosphors, sialon-based phosphors, Mn ⁴⁺ activated fluoride complex phosphors, and inorganic semiconductors called quantum dots. Two or more of these may be used. Among these, quantum dots are preferable. Since quantum dots have a smaller average particle size than other phosphors, (B) the surface of the pixel can be smoothed and light scattering on the surface can be suppressed, so that the light extraction efficiency can be further improved. The brightness can be further improved.

Examples of the quantum dots include particles made of group II-IV, group III-V, group IV-VI, and group IV semiconductors. Examples of these inorganic semiconductors include Si, Ge, Sn, Se, Te, B, C (including diamond), P, BN, BP, BAs, AlN, AlP, AlAs, AlSb, GaN, GaP, GaAs, and the like. GaSb, InN, InP, InAs, InSb, ZnO, ZnS, ZnSe, ZnTe, CdS, CdSe, CdSeZn, CdTe, HgS, HgSe, HgTe, BeS, BeSe, BeTe, MgS, MgSe, GeS, GeS Examples thereof include SnSe, SnTe, PbO, PbS, PbSe, PbTe, CuF, CuCl, CuBr, CuI, Si ₃ N ₄ , Ge ₃ N ₄ , and Al ₂ O ₃ . Two or more of these may be used.

The quantum dots may contain a p-type dopant or an n-type dopant. Further, the quantum dots may have a core-shell structure. In the core-shell structure, any suitable functional layer (single layer or multiple layers) may be formed around the shell depending on the purpose, and the shell surface may be surface-treated and / or chemically modified. ..

Examples of the shape of the quantum dot include a spherical shape, a columnar shape, a flaky shape, a plate shape, an amorphous shape, and the like. The average particle size of the quantum dots can be arbitrarily selected according to the desired emission wavelength, and is preferably 1 to 30 nm. When the average particle size of the quantum dots is 1 to 10 nm, the peak in the emission spectrum can be sharpened in each of blue, green and red. The average particle size of the quantum dots is preferably 2 nm or more, and preferably 8 nm or less. For example, when the average particle size of the quantum dots is about 2 nm, blue light is emitted, when it is about 3 nm, green light is emitted, and when it is about 6 nm, red light is emitted. The average particle size of the quantum dots can be measured by a dynamic light scattering method. Examples of the device for measuring the average particle size include a dynamic light scattering photometer DLS-8000 (manufactured by Otsuka Electronics Co., Ltd.).

As the organic phosphor, one that emits each color such as green or red by the excitation light of blue is preferable. As a phosphor that emits red fluorescence, a pyrromethene derivative having a basic skeleton represented by the following structural formula (8), and as a phosphor that emits green fluorescence, pyrromethene having a basic skeleton represented by the following structural formula (9). Examples include derivatives. Other examples include perylene-based derivatives, porphyrin-based derivatives, oxazine-based derivatives, and pyrazine-based derivatives that emit red or green fluorescence depending on the selection of the substituent. Two or more of these may be contained. Among these, a pyrromethene derivative is preferable because of its high quantum yield. The pyrromethene derivative can be obtained, for example, by the method described in JP-A-2011-241160.

Since the organic phosphor is soluble in a solvent, pixels (B) having a desired thickness can be easily formed.

The thickness of the pixel (B) is preferably 0.5 μm or more, more preferably 1 μm or more, from the viewpoint of improving the color characteristics. On the other hand, the thickness of the pixel (B) is preferably 30 μm or less, more preferably 20 μm or less, from the viewpoint of thinning the display device and workability of curved surfaces.

The size of each pixel (B) is generally about 20 to 200 μm.

The pixels (B) are preferably arranged separated by a partition wall (A-1). By providing a partition wall between the pixels, it is possible to further suppress the diffusion and color mixing of the emitted light.

Examples of the method for forming the pixels (B) include a method of filling a space separated by a partition wall (A-1) with a coating liquid containing a color conversion light emitting material (hereinafter referred to as a color conversion light emitting material coating liquid). Be done. The color conversion light emitting material coating liquid may further contain a resin or a solvent.

As a method for filling the color-converting light-emitting material coating liquid, an inkjet coating method or the like is preferable from the viewpoint of easily applying different types of color-converting light-emitting materials to each pixel.

The obtained coating film may be dried under reduced pressure and / or dried by heating. In the case of vacuum drying, the vacuum drying temperature is preferably 80 ° C. or lower in order to prevent the drying solvent from recondensing on the inner wall of the vacuum chamber. The pressure for drying under reduced pressure is preferably equal to or lower than the vapor pressure of the solvent contained in the coating film, and is preferably 1 to 1000 Pa. The vacuum drying time is preferably 10 to 600 seconds. In the case of heat drying, examples of the heat drying device include an oven and a hot plate. The heating and drying temperature is preferably 60 to 200 ° C. The heating and drying time is preferably 1 to 60 minutes.

In the substrate with a partition wall of the present invention, a low refractive index layer having a refractive index of 1.20 to 1.35 at a wavelength of (C) 550 nm is further placed on the pixel (B) (hereinafter, “low refractive index layer (C)). It may be described as). By having the low refractive index layer (C), it is possible to further improve the light extraction efficiency and further improve the brightness of the display device.

FIG. 3 shows a cross-sectional view of one aspect of the substrate with a partition wall of the present invention having a low refractive index layer. It has a pattern-formed partition wall 2 and pixels 3 on the base substrate 1, and further has a low refractive index layer 4 on these.

In the display device, the refractive index of the low refractive index layer (C) is preferably 1.20 or more from the viewpoint of appropriately suppressing the reflection of the light of the backlight and efficiently incident the light on the pixel (B). 23 or more is more preferable. On the other hand, from the viewpoint of improving the brightness, the refractive index of the low refractive index layer (C) is preferably 1.35 or less, more preferably 1.30 or less. Here, the refractive index of the low refractive index layer (C) is measured by irradiating the cured film surface with light having a wavelength of 550 nm from the direction perpendicular to the cured film surface under the condition of 20 ° C. under atmospheric pressure using a prism coupler. Can be done.

The low refractive index layer (C) preferably contains polysiloxane and silica particles having no hollow structure. Polysiloxane has high compatibility with inorganic particles such as silica particles and functions as a binder capable of forming a transparent layer. Further, by containing silica particles, it is possible to efficiently form minute voids in the low refractive index layer (C) to reduce the refractive index, and the refractive index can be easily adjusted to the above-mentioned range. Can be done. Furthermore, by using silica particles that do not have a hollow structure, cracks can be suppressed because they do not have a hollow structure that easily causes cracks during curing shrinkage. In the low refractive index layer (C), the polysiloxane and the silica particles having no hollow structure may be contained independently, or the polysiloxane and the silica particles having no hollow structure are bonded to each other. It may be contained in. From the viewpoint of the uniformity of the low refractive index layer (C), it is preferable that the polysiloxane and silica particles having no hollow structure are contained in a bonded state.

The polysiloxane contained in the low refractive index layer (C) preferably contains fluorine. By containing fluorine, the refractive index of the low refractive index layer (C) can be easily adjusted to 1.20 to 1.35. The fluorine-containing polysiloxane can be obtained by hydrolyzing and polycondensing a plurality of alkoxysilane compounds including at least the fluorine-containing alkoxysilane compound represented by the following general formula (10). Further, other alkoxysilane compounds may be used.

In the above general formula (10), R ⁷ represents a fluoroalkyl group having 3 to 17 fluorines. R ⁶ represents the same group as R ⁶ in the general formulas (5) to (7). m represents 1 or 2. The ⁴ -m R6 and m ^R7 may be the same or different, respectively.

Examples of the fluorine-containing alkoxysilane compound represented by the general formula (10) include trifluoroethyltrimethoxysilane, trifluoroethyltriethoxysilane, trifluoroethyltriisopropoxysilane, trifluoropropyltrimethoxysilane, and trifluoro. Propyltriethoxysilane, trifluoropropyltriisopropoxysilane, heptadecafluorodecyltrimethoxysilane, heptadecafluorodecyltriethoxysilane, heptadecafluorodecyltriisopropoxysilane, tridecafluorooctyltriethoxysilane, tridecafluorooctyl Trimethoxysilane, Tridecafluorooctyltriopropoxysilane, Trifluoroethylmethyldimethoxysilane, Trifluoroethylmethyldiethoxysilane, Trifluoroethylmethyldiisopropoxysilane, Trifluoropropylmethyldimethoxysilane, Trifluoropropylmethyldiethoxy Silane, Trifluoropropylmethyldiisopropoxysilane, Heptadecafluorodecylmethyldimethoxysilane, Heptadecafluorodecylmethyldiethoxysilane, Heptadecafluorodecylmethyldiisopropoxysilane, Tridecafluorooctylmethyldimethoxysilane, Tridecafluorooctyl Methyldiethoxysilane, tridecafluorooctylmethyldiisopropoxysilane, trifluoroethylethyldimethoxysilane, trifluoroethylethyldiethoxysilane, trifluoroethylethyldiisopropoxysilane, trifluoropropylethyldimethoxysilane, trifluoropropylethyl Diethoxysilane, trifluoropropylethyldiisopropoxysilane, heptadecafluorodecylethyldimethoxysilane, heptadecafluorodecylethyldiethoxysilane, heptadecafluorodecylethyldiisopropoxysilane, tridecafluorooctylethyldiethoxysilane, tri Examples thereof include decafluorooctylethyldimethoxysilane and tridecafluorooctylethyldiisopropoxysilane. Two or more of these may be used.

The content of polysiloxane in the low refractive index layer (C) is preferably 4% by weight or more from the viewpoint of suppressing cracks. On the other hand, the content of polysiloxane is 32% by weight or less from the viewpoint of ensuring the thixo property due to the network between the silica particles, maintaining an appropriate air layer in the low refractive index layer (C), and further reducing the refractive index. Is preferable.

Examples of silica particles having no hollow structure in the low refractive index layer (C) include "Snowtex" (registered trademark) and "organosilica sol" (registered trademark) series (isopropyl alcohol dispersion) manufactured by Nissan Chemical Industry Co., Ltd. , Ethylglycol dispersion, methylethylketone dispersion, dimethylacetamide dispersion, methylisobutylketone dispersion, propylene glycol monomethylacetate dispersion, propylene glycol monomethylether dispersion, methanol dispersion, ethyl acetate dispersion, butylacetate dispersion, xylene -N-Butanol dispersion, toluene dispersion, etc. Examples thereof include product numbers PGM-ST, PMA-ST, IPA-ST, IPA-ST-L, IPA-ST-ZL, IPA-ST-UP, etc.). Two or more of these may be contained.

The content of the silica particles having no hollow structure in the low refractive index layer (C) ensures the thixo property due to the network between the silica particles, keeps an appropriate air layer in the low refractive index layer (C), and refracts. From the viewpoint of further reducing the rate, 68% by weight or more is preferable. On the other hand, the content of silica particles having no hollow structure is preferably 96% by weight or less from the viewpoint of suppressing cracks.

The thickness of the low refractive index layer (C) is preferably 0.1 μm or more, and more preferably 0.5 μm or more, from the viewpoint of covering the step of the pixel (B) and suppressing the occurrence of defects. On the other hand, the thickness of the low refractive index layer (C) is preferably 20 μm or less, more preferably 10 μm or less, from the viewpoint of reducing stress that causes cracks in the low refractive index layer (C).

As a method for forming the low refractive index layer (C), a coating method is preferable because the forming method is easy. For example, the low refractive index layer (C) can be formed by applying a low refractive index resin composition containing polysiloxane and silica particles on the pixel (B), drying it, and then heating it.

Further, it is preferable that the substrate with a partition wall of the present invention further has an inorganic protective layer I having a thickness of 50 to 1,000 nm on the low refractive index layer (C). Since the presence of the inorganic protective layer I makes it difficult for moisture in the atmosphere to reach the low refractive index layer (C), it is possible to suppress fluctuations in the refractive index of the low refractive index layer (C) and suppress luminance deterioration. can.

FIG. 4 shows a cross-sectional view of one aspect of the substrate with a partition wall of the present invention having the low refractive index layer and the inorganic protective layer I. A patterned partition wall 2 and pixels 3 are provided on the base substrate 1, and a low refractive index layer 4 and an inorganic protective layer I5 are further provided on the partition walls 2 and pixels 3.

Further, the substrate with a partition wall of the present invention preferably further has an inorganic protective layer II having a thickness of 50 to 1,000 nm between the pixel (B) and the low refractive index layer (C). By having the inorganic protective layer II, it becomes difficult for the raw material forming the pixel (B) to move from the pixel (B) to the low refractive index layer, so that the refractive index fluctuation of the low refractive index layer (C) is suppressed. , Brightness deterioration can be suppressed.

FIG. 5 shows a cross-sectional view of one aspect of the substrate with a partition wall of the present invention having the low refractive index layer and the inorganic protective layer II. A patterned partition wall 2 and pixels 3 are provided on the base substrate 1, and an inorganic protective layer II6 and a low refractive index layer 4 are further provided on the partition walls 2 and pixels 3.

Further, it is preferable that the substrate with a partition wall of the present invention further has a color filter having a thickness of 1 to 5 μm (hereinafter, may be referred to as “color filter”) between the base substrate and the pixel (B). .. The color filter has a function of transmitting visible light in a specific wavelength range and making the transmitted light a desired hue. By having a color filter, the color purity of the display device can be improved. By setting the thickness of the color filter to 1 μm or more, the color purity can be further improved. On the other hand, by setting the thickness of the color filter to 5 μm or less, the brightness can be further improved.

FIG. 6 shows a cross-sectional view of one aspect of the substrate with a partition wall of the present invention having a color filter. The pattern-formed partition wall 2 and the color filter 7 are provided on the base substrate 1, and the pixels 3 are provided on the color filter 7.

Examples of the color filter include a color filter using a pigment-dispersed material in which a pigment is dispersed in a photoresist, which is used for a flat panel display such as a liquid crystal display. More specifically, a blue color filter that selectively transmits a wavelength of 400 nm to 550 nm, a green color filter that selectively transmits a wavelength of 500 nm to 600 nm, and a yellow color filter that selectively transmits a wavelength of 500 nm or more. Examples thereof include a red color filter that selectively transmits a wavelength of 600 nm or more. Further, the color filter may be laminated apart from the pixel (B) containing the color conversion light emitting material, or may be integrally laminated.

Further, the substrate with a partition wall of the present invention preferably further has an inorganic protective layer III and / or a yellow organic protective layer having a thickness of 50 to 1,000 nm between the color filter and the pixel (B). Since the inclusion of the inorganic protective layer III makes it difficult for the material for forming the color filter to reach the pixel (B) containing the color conversion light emitting material from the color filter, the pixel (B) containing the color conversion light emitting material Brightness deterioration can be suppressed. Further, by having the yellow organic protective layer, it is possible to cut the blue leakage light that could not be completely converted by the pixel (B) containing the color conversion light emitting material, and to improve the color reproducibility.

FIG. 7 shows a cross-sectional view of an aspect of the substrate with a partition wall of the present invention having a color filter and an inorganic protective layer III and / or a yellow organic protective layer. A patterned partition wall 2 and a color filter 7 are provided on the base substrate 1, an inorganic protective layer III and / or a yellow organic protective layer 8 is provided on these, and an inorganic protective layer III and / or a yellow organic layer is provided. It has pixels 3 arranged separated by a partition wall 2 covered with a protective layer 8.

Further, the substrate with a partition wall of the present invention preferably further has an inorganic protective layer IV and / or a yellow organic protective layer having a thickness of 50 to 1,000 nm on the base substrate. The inorganic protective layer IV and / or the yellow organic protective layer acts as a refractive index adjusting layer, and can more efficiently extract the light emitted from the pixel (B) and further improve the brightness of the display device. Further, the yellow organic protective layer can cut the blue leakage light that could not be completely converted by the pixel (B) containing the color conversion light emitting material, and can improve the color reproducibility. It is more preferable that the inorganic protective layer IV and / or the yellow organic protective layer is provided between the base substrate and the partition wall (A) and the pixel (B).

FIG. 8 shows a cross-sectional view of one aspect of the substrate with a partition wall of the present invention having the inorganic protective layer IV and / or the yellow organic protective layer. An inorganic protective layer IV and / or a yellow organic protective layer 9 is provided on the base substrate 1, a partition wall 2 and a color filter 7 are patterned on these, and a partition wall on which a pattern is formed is formed. It has 2 and 3 pixels.

Examples of the material constituting the inorganic protective layers I to IV include metal oxides such as silicon oxide, indium tin oxide, and zinc gallium oxide; metal nitrides such as silicon nitride; and fluorides such as magnesium fluoride. .. Two or more of these may be contained. Among these, silicon nitride or silicon oxide is more preferable because it has low water vapor permeability and high permeability.

The thickness of the inorganic protective layers I to IV is preferably 50 nm or more, more preferably 100 nm or more, from the viewpoint of sufficiently suppressing the permeation of substances such as water vapor. On the other hand, from the viewpoint of suppressing the decrease in transmittance, the thickness of the inorganic protective layers I to IV is preferably 800 nm or less, more preferably 500 nm or less.

For the thickness of the inorganic protective layers I to IV, use a polishing device such as a cross section polisher to expose a cross section perpendicular to the base substrate, and magnify the cross section using a scanning electron microscope or a transmission electron microscope. This can be measured.

Examples of the method for forming the inorganic protective layers I to IV include a sputtering method. The inorganic protective layer is preferably colorless and transparent or yellow transparent.

The yellow organic protective layer is obtained, for example, by pattern-processing the resin composition of the present invention containing an organometallic compound containing silver as an organometallic compound. As described above, the silver-containing organometallic compound has a function of yellowing the protective layer by decomposing and aggregating in the heating step during pattern formation to form yellow particles. Examples of the silver-containing organic metal compound include silver neodecanoate, silver octylate, and silver salicylate. Among these, silver neodecanoate is preferable from the viewpoint of yellowing. In the resin composition for a yellow organic protective layer, the content of the organic metal compound containing silver is preferably 0.2 to 5% by weight in the solid content. By setting the content of the organometallic compound containing silver to 0.2% by weight or more, more yellowing can be achieved. The content of the silver-containing organometallic compound is more preferably 1.5% by weight or more in the solid content. On the other hand, by setting the content of the organometallic compound containing silver to 5% by weight or less of the solid content, the transmittance can be further improved.

The resin composition forming the yellow organic protective layer may contain a yellow pigment. Examples of the yellow pigment include pigment yellow (hereinafter abbreviated as PY) PY12, PY13, PY17, PY20, PY24, PY83, PY86, PY93, PY95, PY109, PY110, PY117, PY125, PY129, PY137, PY138, PY139, PY14. , PY148, PY150, PY153, PY154, PY166, PY168, PY185 and the like. Among them, a yellow pigment selected from PY139, PY147, PY148 and PY150 is preferable from the viewpoint of selectively blocking blue light.
As a method for forming a pattern of the yellow organic protective layer, a method of forming a pattern by a photosensitive paste method is preferable as in the above-mentioned partition wall (A-1).

When the yellow organic protective layer 8 is formed on the color filter 7 as shown in FIG. 7, the yellow organic protective layer 8 may serve as an overcoat layer for flattening each pixel of the color filter.

The thickness of the yellow organic protective layer is preferably 100 nm or more, more preferably 500 nm or more, from the viewpoint of sufficiently blocking blue leakage light. On the other hand, from the viewpoint of suppressing a decrease in light extraction efficiency, the thickness of the yellow organic protective layer is preferably 3000 nm or less, more preferably 2000 nm or less.

Next, the display device of the present invention will be described. The display device of the present invention has the substrate with a partition wall and a light emitting light source. As the light emitting light source, a light emitting light source selected from a liquid crystal cell, an organic EL cell, a mini LED cell and a micro LED cell is preferable. An organic EL cell is more preferable as the light emitting light source because of its excellent light emitting characteristics. Here, the mini LED cell refers to a cell in which a large number of LEDs having a vertical and horizontal length of about 100 μm to 10 mm are arranged. The micro LED cell refers to a cell in which a large number of LEDs having a length and width of less than 100 μm are arranged.

The manufacturing method of the display device of the present invention will be described with reference to an example of the display device having the substrate with a partition wall and the organic EL cell of the present invention. A photosensitive polyimide resin is applied onto a glass substrate, and an insulating film having an opening is formed by using a photolithography method. After spattering aluminum on it, patterning of aluminum is performed by a photolithography method to form a back electrode layer made of aluminum in an opening without an insulating film. Subsequently, tris (8-quinolinolat) aluminum (hereinafter abbreviated as Alq3) was formed on it as an electron transport layer by a vacuum vapor deposition method, and then dicyanomethylenepyran, quinacridone and 4,4'are formed on Alq3 as a light emitting layer. -Forms a white light emitting layer doped with bis (2,2-diphenylvinyl) biphenyl. Next, N, N'-diphenyl-N, N'-bis (α-naphthyl) -1,1'-biphenyl-4,4'-diamine is formed as a hole transport layer by a vacuum vapor deposition method. Finally, ITO is formed into a film by sputtering as a transparent electrode to produce an organic EL cell having a white light emitting layer. A display device can be manufactured by adhering the above-mentioned substrate with a partition wall and the organic EL cell thus obtained to face each other with a sealing agent.

Hereinafter, the present invention will be described in more detail with reference to Examples and Comparative Examples, but the present invention is not limited to these scopes. The names of the compounds used that use abbreviations are shown below.
PGMEA: Propylene glycol monomethyl ether acetate DAA: Diacetone alcohol BHT: Dibutylhydroxytoluene.

The solid content concentration of the polysiloxane solution in Synthesis Examples 1 to 4 was determined by the following method. 1.5 g of the polysiloxane solution was weighed in an aluminum cup and heated at 250 ° C. for 30 minutes using a hot plate to evaporate the liquid. The weight of the solid content remaining in the aluminum cup after heating was weighed, and the solid content concentration of the polysiloxane solution was determined from the ratio to the weight before heating.

The weight average molecular weight of the polysiloxane in Synthesis Examples 1 to 4 was determined by the following method. GPC analysis was performed based on "JIS K7252-3 (establishment date = 2008/03/20)" using a GPC analyzer (HLC-8220; manufactured by Tosoh Corporation) and tetrahydrofuran as a mobile phase. The polystyrene-equivalent weight average molecular weight was measured.

The content ratio of each repeating unit in the polysiloxane in Synthesis Examples 1 to 4 was determined by the following method. A polysiloxane solution is injected into an NMR sample tube made of "Teflon" (registered trademark) with a diameter of 10 mm, and ²⁹ Si-NMR measurement is performed. Si derived from a specific organosilane with respect to the integrated value of the entire Si derived from organosilane. The content ratio of each repeating unit was calculated from the ratio of the integrated values of. ²⁹ Si-NMR measurement conditions are shown below.
Device: Nuclear magnetic resonance device (JNM-GX270; manufactured by JEOL Ltd.)
Measurement method: Gated decoupling method Measurement nuclear frequency: 53.6693 MHz ( ²⁹ Si nucleus)
Spectral width: 20000Hz
Pulse width: 12 μs (45 ° pulse)
Pulse repetition time: 30.0 seconds Solvent: Acetone-d6
Reference substance: Tetramethylsilane Measurement temperature: 23 ° C
Sample rotation speed: 0.0 Hz.

Synthesis Example 1 147.32 g (0.675 mol) of trifluoropropyltrimethoxysilane and 40.66 g (0.175 mol) of 3-methacryloxypropylmethyldimethoxysilane in a three-necked flask containing a 1000 ml polysiloxane (PSL-1) solution. , 3-Trimethoxysilylpropyl succinate anhydride 26.23 g (0.10 mol), 3- (3,4-epoxycyclohexyl) propyltrimethoxysilane 12.32 g (0.05 mol), BHT 0.808 g , And PGMEA were charged in 171.62 g, and an aqueous phosphoric acid solution prepared by dissolving 2.265 g of phosphoric acid (1.0% by weight based on the charged monomer) in 52.65 g of water was added over 30 minutes while stirring at room temperature. Then, the flask was immersed in an oil bath at 70 ° C. and stirred for 90 minutes, and then the temperature of the oil bath was raised to 115 ° C. over 30 minutes. One hour after the start of temperature rise, the solution temperature (internal temperature) reached 100 ° C., and the mixture was heated and stirred for 2 hours (internal temperature was 100 to 110 ° C.) to obtain a polysiloxane solution. During the temperature rise and heating and stirring, a mixed gas of 95% by volume of nitrogen and 5% by volume of oxygen was flowed at 0.05 liter / fraction. A total of 131.35 g of by-products methanol and water were distilled off during the reaction. PGMEA was added to the obtained polysiloxane solution so that the solid content concentration was 40% by weight to obtain a polysiloxane (PSL-1) solution. The weight average molecular weight of the obtained polysiloxane (PSL-1) was 4,000. Also, in polysiloxane (PSL-1), trifluoropropyltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-trimethoxysilylpropylsuccinic anhydride, and 3- (3,4-epoxycyclohexyl) propyl. The molar ratio of each repeating unit derived from trimethoxysilane was 67.5 mol%, 17.5 mol%, 10 mol% and 5 mol%, respectively.

Synthesis Example 2 Polysiloxane (PSL-2) solution In a 1000 ml three-necked flask, 116.07 g (0.475 mol) of diphenyldimethoxysilane, dimethyldimethoxysilane (0.20 mol), and 3-methacryloxypropyltrimethoxysilane were placed in 43. 46 g (0.175 mol), 26.23 g (0.10 mol) of 3-trimethoxysilylpropyl succinate anhydride, 12.32 g (0.05 mol) of 3- (3,4-epoxycyclohexyl) propyltrimethoxysilane , BHT 0.843 g, and PGMEA 176.26 g, and phosphoric acid aqueous solution prepared by dissolving 2.221 g of phosphoric acid (1.0% by weight with respect to the charged monomer) in 43.65 g of water while stirring at room temperature. It was added over a minute. Then, a polysiloxane solution was obtained in the same manner as in Synthesis Example 1. A total of 136.90 g of by-products methanol and water were distilled off during the reaction. PGMEA was added to the obtained polysiloxane solution so that the solid content concentration was 40% by weight to obtain a polysiloxane (PSL-2) solution. The weight average molecular weight of the obtained polysiloxane (PSL-2) was 2,800. Further, in polysiloxane (PSL-2), diphenyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-trimethoxysilylpropylsuccinic anhydride and 3- (3,4-epoxycyclohexyl) propyltrimethoxysilane The molar ratios of each derived repeat unit were 47.5 mol%, 20 mol%, 17.5 mol%, 10 mol% and 5 mol%, respectively.

Synthesis Example 3 Polysiloxane (PSL-3) solution In a 1000 ml three-necked flask, 147.32 g (0.675 mol) of trifluoropropyltrimethoxysilane and 43.46 g (0.175 mol) of 3-methacryloxypropyltrimethoxycisilane. ), 2-323 g (0.10 mol) of 3-trimethoxysilylpropyl succinic anhydride, 12.32 g (0.05 mol) of 3- (3,4-epoxycyclohexyl) propyltrimethoxysilane, and 0. 810 g and 172.59 g of PGMEA were charged, and an aqueous phosphoric acid solution prepared by dissolving 2.293 g of phosphoric acid (1.0% by weight based on the charged monomer) in 54.45 g of water was added over 30 minutes while stirring at room temperature. .. Then, a polysiloxane solution was obtained in the same manner as in Synthesis Example 1. A total of 140.05 g of by-products methanol and water were distilled off during the reaction. PGMEA was added to the obtained polysiloxane solution so that the solid content concentration was 40% by weight to obtain a polysiloxane (PSL-3) solution. The weight average molecular weight of the obtained polysiloxane (PSL-3) was 4,100. In addition, trifluoropropyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-trimethoxysilylpropylsuccinic anhydride and 3- (3,4-epoxycyclohexyl) propyltri in polysiloxane (PSL-3). The molar ratio of each repeating unit derived from methoxysilane was 67.5 mol%, 17.5 mol%, 10 mol% and 5 mol%, respectively.

Synthesis Example 4 Polysiloxane (PSL-4) solution In a 1000 ml three-necked flask, 34.05 g (0.250 mol) of methyltrimethoxysilane, 99.15 g (0.500 mol) of phenyltrimethoxysilane, and 31 of tetraethoxysilane. Add 24.64 g (0.100 mol) of .25 g (0.150 mol), 3- (3,4-epoxycyclohexyl) propyltrimethoxysilane, and 174.95 g of PGMEA to 56.70 g of water with stirring at room temperature. An aqueous phosphate solution in which 0.945 g of silane (0.50% by weight based on the charged monomer) was dissolved was added over 30 minutes. Then, a polysiloxane solution was obtained in the same manner as in Synthesis Example 1. A total of 129.15 g of by-products methanol and water were distilled off during the reaction. PGMEA was added to the obtained polysiloxane solution so that the solid content concentration was 40% by weight to obtain a polysiloxane (PSL-4) solution. The weight average molecular weight of the obtained polysiloxane (PSL-4) was 4,200. In addition, the molar ratio of each repeating unit derived from methyltrimethoxysilane, phenyltrimethoxysilane, tetraethoxysilane, and 3- (3,4-epoxycyclohexyl) propyltrimethoxysilane in polysiloxane (PSL-4) is , 25 mol%, 50 mol%, 15 mol% and 10 mol%, respectively.

The compositions of Synthesis Examples 1 to 4 are summarized in Table 1.

Synthesis Example 5 Green organic phosphor 3,5-dibromobenzaldehyde (3.0 g), 4-t-butylphenylboronic acid (5.3 g), tetrakis (triphenylphosphine) palladium (0) (0.4 g), and Potassium carbonate (2.0 g) was placed in a flask and replaced with nitrogen. Degassed toluene (30 mL) and degassed water (10 mL) were added thereto, and the mixture was refluxed for 4 hours. The reaction solution was cooled to room temperature, separated, and then the organic layer was washed with saturated brine. The organic layer was dried over magnesium sulfate, filtered, and then the solvent was distilled off. The obtained reaction product was purified by silica gel column chromatography to obtain a white solid of 3,5-bis (4-t-butylphenyl) benzaldehyde (3.5 g). Next, put 3,5-bis (4-t-butylphenyl) benzaldehyde (1.5 g) and 2,4-dimethylpyrrole (0.7 g) in a flask, dehydrated dichloromethane (200 mL) and trifluoroacetic acid (1). Drops) were added, and the mixture was stirred for 4 hours under a nitrogen atmosphere. A dehydrated dichloromethane solution of 2,3-dichloro-5,6-dicyano-1,4-benzoquinone (0.85 g) was added to this reaction mixture, and the mixture was further stirred for 1 hour. After completion of the reaction, boron trifluorinated diethyl ether complex (7.0 mL) and diisopropylethylamine (7.0 mL) were added and stirred for 4 hours, then water (100 mL) was further added and stirred to separate the organic layer. did. The organic layer was dried over magnesium sulfate, filtered, and then the solvent was distilled off. The obtained reaction product was purified by silica gel column chromatography to obtain 0.4 g of green powder (yield 17%). The ¹ H-NMR analysis result of the obtained green powder is as follows, and it was confirmed that the green powder obtained above is [G-1] represented by the following structural formula.
^{1 1} H-NMR (CDCl ₃ (d = ppm)): 7.95 (s, 1H), 7.63-7.48 (m, 10H), 6.00 (s, 2H), 2.58 (s) , 6H), 1.50 (s, 6H), 1.37 (s, 18H).

Synthesis Example 6 A mixed solution of red organic phosphor 4- (4-t-butylphenyl) -2- (4-methoxyphenyl) pyrrole 300 mg, 2-methoxybenzoyl chloride 201 mg and toluene 10 ml at 120 ° C. under a nitrogen stream. It was heated for 6 hours. After cooling to room temperature, the solvent was evaporated. The obtained residue was washed with 20 ml of ethanol and vacuum dried to obtain 260 mg of 2- (2-methoxybenzoyl) -3- (4-t-butylphenyl) -5- (4-methoxyphenyl) pyrrole. rice field. Next, 2- (2-methoxybenzoyl) -3- (4-t-butylphenyl) -5- (4-methoxyphenyl) pyrrole 260 mg, 4- (4-t-butylphenyl) -2- (4-) A mixed solution of 180 mg of methoxyphenyl) pyrrole, 206 mg of methanesulfonic acid anhydride and 10 ml of degassed toluene was heated at 125 ° C. for 7 hours under a nitrogen stream. After cooling the reaction mixture to room temperature, 20 ml of water was injected and the mixture was extracted with 30 ml of dichloromethane. The organic layer was washed twice with 20 ml of water, then evaporated and vacuum dried to obtain a pyrromethene as a residue. Next, 305 mg of diisopropylethylamine and 670 mg of boron trifluoride diethyl ether complex were added to the obtained mixed solution of pyrromethene and 10 ml of toluene under a nitrogen stream, and the mixture was stirred at room temperature for 3 hours. 20 ml of water was poured into this reaction mixture and extracted with 30 ml of dichloromethane. The organic layer was washed twice with 20 ml of water, dried over magnesium sulfate, and then evaporated. After purification by silica gel column chromatography and vacuum drying, 0.27 g of reddish purple powder was obtained (yield 70%). The ¹ H-NMR analysis result of the obtained reddish purple powder is as follows, and it was confirmed that the reddish purple powder obtained above is [R-1] represented by the following structural formula.
^{1 1} H-NMR (CDCl ₃ (d = ppm)): 1.19 (s, 18H), 3.42 (s, 3H), 3.85 (s, 6H), 5.72 (d, 1H), 6.20 (t, 1H), 6.42-6.97 (m, 16H), 7.89 (d, 4H).

Synthesis Example 7 Silica particle-containing polysiloxane solution (LS-1)
In a 500 ml three-necked flask, 0.05 g (0.4 mmol) of methyltrimethoxysilane, 0.66 g (3.0 mmol) of trifluoropropyltrimethoxysilane, and 0.10 g (0) of trimethoxysilylpropylsuccinic acid anhydride. .4 mmol), 7.97 g (34 mmol) of γ-acryloxypropyltrimethoxysilane, and 15.6 wt% isopropyl alcohol dispersion of silica particles (IPA-ST-UP: manufactured by Nissan Chemical Industry Co., Ltd.). 224.37 g was added, and 163.93 g of ethylene glycol mono-t-butyl ether was added. While stirring at room temperature, an aqueous phosphoric acid solution prepared by dissolving 0.088 g of phosphoric acid in 4.09 g of water was added over 3 minutes. Then, the flask was immersed in an oil bath at 40 ° C. and stirred for 60 minutes, and then the temperature of the oil bath was raised to 115 ° C. over 30 minutes. The internal temperature of the solution reached 100 ° C. 1 hour after the start of temperature rise, and the mixture was further heated and stirred for 2 hours (internal temperature was 100 to 110 ° C.) to obtain a silica particle-containing polysiloxane solution (LS-1). rice field. During the temperature rise and heating and stirring, 0.05 liter (liter) / fraction of nitrogen was flowed. A total of 194.01 g of by-products methanol and water were distilled off during the reaction. The solid content concentration of the obtained silica particle-containing polysiloxane solution (LS-1) was 24.3% by weight, and the contents of the polysiloxane and silica particles in the solid content were 15% by weight and 85% by weight, respectively. .. Methyltrimethoxysilane, trifluoropropyltrimethoxysilane, 3-trimethoxysilylpropylsuccinate anhydride, and γ-acryloxypropyltrimethoxysilane of the polysiloxane in the obtained silica particle-containing polysiloxane (LS-1). The molar ratio of each repeating unit derived from was 1.0 mol%, 8.0 mol%, 1.0 mol% and 90.0 mol%, respectively.

Example 1 Resin composition for partition wall (P-1)
As a white pigment, 5.00 g of a titanium dioxide pigment (R-960; manufactured by BASF Japan Ltd. (hereinafter, “R-960”)) and as a resin, a polysiloxane (PSL-1) solution obtained in Synthesis Example 1 5.00 g was mixed and dispersed using a mill-type disperser filled with zirconia beads to obtain a pigment dispersion (MW-1). Further, as an organometallic compound, 1.00 g of bis (acetylacetonato) palladium and 0.861 g of triphenylphosphine as a coordinating compound having a phosphorus atom (equal molar amount with respect to the organometallic compound) are DAA8. It was dissolved in 139 g to obtain an organometallic compound solution (OM-1).

Next, 9.98 g of the pigment dispersion liquid (MW-1), 1.86 g of the organic metal compound solution (OM-1), 0.98 g of a polysiloxane (PSL-1) solution, and etanone as a photopolymerization initiator. 1- [9-ethyl-6- (2-methylbenzoyl) -9H-carbazole-3-yl]-, 1- (О-acetyloxime) ("Irgacure" (registered trademark) OXE-02, BASF Japan Co., Ltd. (Hereinafter "OXE-02")) 0.050 g, bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide ("Irgacure" 819, manufactured by BASF Japan Co., Ltd. (hereinafter "IC-819") )) 0.400 g, as a photobase generator, 2- (3-benzoylphenyl) propionic acid 1,2-diisopropyl-3- [bis (dimethylamino) methylene] guanidinium (WPBG-266 (trade name), Fujifilm) Wako Junyaku Co., Ltd. (hereinafter referred to as "WPBG-266")) 0.100 g, as a photopolymerizable compound, dipentaerythritol hexaacrylate ("KAYARAD" (registered trademark) DPHA, manufactured by Shin Nihon Yakuhin Co., Ltd. ( 1.20 g of (hereinafter "DPHA")), as a liquid-repellent compound, a photopolymerizable fluorine-containing compound ("Megafuck" (registered trademark) RS-76-E, manufactured by DIC Co., Ltd. (hereinafter "RS-76-E"") )) 40 wt% PGMEA diluted solution 1.00 g, 3', 4'-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate ("Selokiside" (registered trademark) 2021P, manufactured by Daicel Co., Ltd. (hereinafter "Selokiside") (Registered Trademark) 2021P ")) 0.100 g, ethylene bis (oxyethylene) bis [3- (5-tert-butyl-4-hydroxy-m-tolyl) propionate] ("Irganox" (registered trademark) 1010, Made by BASF Japan Co., Ltd. (hereinafter "IRGANOX (registered trademark) 1010") 0.030 g, acrylic solvent ("BYK" (registered trademark) 352, manufactured by Big Chemie Japan Co., Ltd. (hereinafter "BYK-") 0.100 g (corresponding to a concentration of 500 ppm) of a 10 wt% diluted solution of PGMEA of 352 ”)) was dissolved in 4.20 g of the solvent PGMEA and stirred. The obtained mixture was filtered through a 5.0 μm filter to obtain a resin composition for partition walls (P-1).

Examples 2 to 3 Resin compositions for partition walls (P-2) to (P-3)
Resin composition for partition wall (P-2) in the same manner as in Example 1 except that the polysiloxane (PSL-2) or (PSL-3) solution was used instead of the polysiloxane (PSL-1) solution, respectively. ) And (P-3).

Example 4 Resin composition for partition wall (P-4)
Examples except that "Megafuck" (registered trademark) F477 (manufactured by Dainippon Ink and Chemicals Co., Ltd.) 40% by weight PGMEA diluted solution was used instead of the 40% by weight PGMEA diluted solution of RS-76-E. A resin composition for partition walls (P-4) was obtained in the same manner as in 1.

Example 5 Resin composition for partition wall (P-5)
5.00 g of R-960 as a white pigment and 5.00 g of a polysiloxane (PSL-4) solution as a resin were mixed and dispersed using a mill-type disperser filled with zirconia beads, and the pigment dispersion liquid (MW) was used. -4) was obtained. 9.98 g of the pigment dispersion (MW-4), 1.86 g of the organic metal compound solution (OM-1), 1.16 g of the polysiloxane (PSL-4) solution, WPBG- as a photobase generator. 0.10 g of 266, 1.00 g of a 40 wt% PGMEA diluted solution of F477 as a liquid repellent compound, 0.100 g of celoxide (registered trademark) 2021P, and THP-17 as a quinonediazide compound (trade name, Toyo Synthetic Industry Co., Ltd.) 1.60 g of PGMEA, 0.100 g of a 10 wt% diluted solution of PGMEA of the surfactant BYK-352, and 4.10 g of PGMEA were mixed and stirred. The obtained mixture was filtered through a 5.0 μm filter to obtain a resin composition for partition walls (P-5).

Example 6 Resin composition for partition wall (P-6)
An organic metal compound solution (OM-2) was prepared in the same manner as the organic metal compound solution (OM-1) except that silver neodecanoate was used instead of bis (acetylacetonato) palladium as the organic metal compound. did. A resin composition for partition walls (P-6) was obtained in the same manner as in Example 1 except that the organometallic compound solution (OM-2) was used instead of the organometallic compound solution (OM-1).

Example 7 Resin composition for partition wall (P-7)
The organometallic compound solution (OM-3) is the same as the organometallic compound solution (OM-1) except that chlorotriphenylphosphine gold is used instead of bis (acetylacetonato) palladium as the organometallic compound. Was prepared. A resin composition for partition walls (P-7) was obtained in the same manner as in Example 1 except that the organometallic compound solution (OM-3) was used instead of the organometallic compound solution (OM-1).

Example 8 Resin composition for partition wall (P-8)
The organic metal compound solution (OM-1) is the same as that of the organic metal compound solution (OM-1) except that bis (acetylacetonato) platinum is used instead of bis (acetylacetonato) palladium as the organic metal compound. 4) was prepared. A resin composition for partition walls (P-8) was obtained in the same manner as in Example 1 except that the organometallic compound solution (OM-4) was used instead of the organometallic compound solution (OM-1).

Example 9 Resin composition for partition wall (P-9)
Except for changing the addition amount of the organometallic compound solution (OM-1) to 0.929 g, the addition amount of the polysiloxane (PSL-1) solution to 1.41 g, and changing PGMEA 4.20 g to PGMEA 4.70 g as the solvent. , A resin composition for partition walls (P-9) was obtained in the same manner as in Example 1.

Example 10 Resin composition for partition wall (P-10)
Except for changing the addition amount of the organometallic compound solution (OM-1) to 0.400 g, the addition amount of the polysiloxane (PSL-1) solution to 1.940 g, and changing PGMEA 4.20 g to PGMEA 6.27 g as a solvent. , A resin composition for partition walls (P-10) was obtained in the same manner as in Example 1.

Example 11 Resin composition for partition wall (P-11)
Except that the addition amount of the organometallic compound solution (OM-1) was changed to 4.595 g, the addition amount of the polysiloxane (PSL-1) solution was changed to 0.010 g, and 4.20 g of PGMEA as a solvent was changed to 2.92 g of PGMEA. , A resin composition for partition wall (P-11) was obtained in the same manner as in Example 1.

Example 12 Resin composition for partition wall (P-12)
A mill-type disperser filled with zirconia beads by mixing 5.00 g of R-960 as a white pigment, 5.00 g of a polysiloxane (PSL-1) solution as a resin, and 0.01 g of titanium nitride as a black pigment. The pigment dispersion liquid (MW-2) was obtained. Instead of the pigment dispersion (MW-1), 9.99 g of the pigment dispersion (MW-2) was added, the amount of the polysiloxane (PSL-1) solution added was changed to 1.38 g, and PGMEA 4. A resin composition for partition walls (P-12) was obtained in the same manner as in Example 9 except that 72 g was used.

Example 13 Resin composition for partition wall (P-13)
10.0 g of a polysiloxane (PSL-1) solution as a resin and 0.15 g of titanium nitride as a black pigment were mixed and dispersed using a mill-type disperser filled with zirconia beads, and a pigment dispersion (MW-) was used. 3) was obtained. Instead of the pigment dispersion liquid (MW-1), 9.99 g of the pigment dispersion liquid (MW-3) was added, the amount of the polysiloxane (PSL-1) solution added was changed to 15.16 g, and the amount of PGMEA added. A resin composition for partition walls (P-13) was obtained in the same manner as in Example 1 except that the amount was changed from 4.20 g to 0.11 g.

Example 14 Resin composition for partition wall (P-14)
Instead of the organometallic compound solution (OM-1), 1.85 g of a 10% DAA solution of bis (acetylacetonato) palladium was used as the organometallic compound, and the amount of the polysiloxane (PSL-1) solution added was 1. A resin composition for partition walls (P-14) was obtained in the same manner as in Example 1 except that the amount was changed to .34 g and 4.20 g of PGMEA was changed to 3.85 g of PGMEA as a solvent.

Example 15 Resin composition for partition wall (P-15)
Example 1 and Example 1 except that the photobase generator WPBG-266 was not added, the amount of the polysiloxane (PSL-1) solution added was changed to 1.21 g, and 4.20 g of PGMEA as a solvent was changed to 4.07 g of PGMEA. Similarly, a resin composition for partition walls (P-15) was obtained.

Example 16 Resin composition for partition wall (P-16)
Without adding the 40 wt% PGMEA diluted solution of the liquid repellent compound RS-76-E, the amount of the polysiloxane (PSL-1) solution added was changed to 2.01 g, and 4.20 g of PGMEA as the solvent was changed to 4.17 g of PGMEA. A resin composition for partition walls (P-16) was obtained in the same manner as in Example 1.

Comparative Example 1 Resin composition for partition wall (P-17)
Instead of the organometallic compound solution (OM-1), the organometallic compound solution (OM-5) obtained by using 1.861 g of triphenylphosphine and 8.139 g of DAA as a coordinating compound having a phosphorus atom was 0. The partition wall was the same as in Example 1 except that .867 g was added, the amount of the polysiloxane (PSL-1) solution added was changed to 1.41 g, and the amount of PGMEA added was changed from 4.20 g to 4.76 g. A resin composition for use (P-17) was obtained.

Comparative Example 2 Resin composition for partition wall (P-18)
A mill-type disperser filled with zirconia beads by mixing 5.00 g of R-960 as a white pigment, 5.00 g of a polysiloxane (PSL-1) solution as a resin, and 0.10 g of titanium nitride as a black pigment. To obtain a pigment dispersion liquid (MW-4). Next, 10.02 g of the pigment dispersion liquid (MW-4), 1.73 g of the polysiloxane (PSL-1) solution, 0.050 g of OXE-02 as a photopolymerization initiator, and 0. 400 g, 0.10 g of WPBG-266 as a photobase generator, 1.20 g of DPHA as a photopolymerizable compound, 1.00 g of a 40 wt% PGMEA diluted solution of RS-76-E as a liquid repellent compound, celoxide (registered). The mixture was mixed with 0.100 g of 2021P, 0.030 g of IRGANOX®, 0.100 g of PGMEA 10 wt% diluted solution of BYK-352 as a surfactant, and 5.31 g of PGMEA as a solvent, and stirred. .. The obtained mixture was filtered through a 5.0 μm filter to obtain a resin composition for partition walls (P-18).

Comparative Example 3 Resin composition for partition wall (P-19)
A mill-type disperser filled with zirconia beads by mixing 5.00 g of R-960 as a white pigment, 5.00 g of a polysiloxane (PSL-1) solution as a resin, and 0.10 g of zirconium nitride as a black pigment. To obtain a pigment dispersion liquid (MW-5). A resin composition for partition walls (P-19) was obtained in the same manner as in Comparative Example 2 except that the pigment dispersion liquid (MW-5) was used instead of the pigment dispersion liquid (MW-4).

Comparative Example 4 Resin composition for partition wall (P-20)
5.00 g of R-960 as a white pigment, 5.00 g of a polysiloxane (PSL-1) solution as a resin, and 0 as a black pigment, a mixed pigment having a weight ratio of 60/40 of the red pigment PR254 and the blue pigment PB64. A mixture of 0.05 g was dispersed using a mill-type disperser filled with zirconia beads to obtain a pigment dispersion (MW-6). A resin composition for partition walls (P-20) was obtained in the same manner as in Comparative Example 2 except that the pigment dispersion liquid (MW-6) was used instead of the pigment dispersion liquid (MW-4).

Comparative Example 5 Resin composition for partition wall (P-21)
The organic metal compound solution (OM-1) is the same as that of the organic metal compound solution (OM-1) except that tris (acetylacetonato) iron is used instead of bis (acetylacetonato) palladium as the organic metal compound. 5) was prepared. A resin composition for partition walls (P-21) was obtained in the same manner as in Example 1 except that the organometallic compound solution (OM-5) was used instead of the organometallic compound solution (OM-1).

Comparative Example 6 Resin composition for partition wall (P-22)
The organic metal compound solution (OM-1) is the same as that of the organic metal compound solution (OM-1) except that bis (acetylacetonato) nickel is used instead of bis (acetylacetonato) palladium as the organic metal compound. 5) was prepared. A resin composition for partition walls (P-22) was obtained in the same manner as in Example 1 except that the organometallic compound solution (OM-6) was used instead of the organometallic compound solution (OM-1).

The compositions of Examples 1 to 16 and Comparative Examples 1 to 6 are collectively shown in Tables 2 to 3.

Preparation Example 1 Color conversion light emitting material composition (CL-1)
20 parts by weight of 0.5 wt% toluene solution of green quantum dot material (Lumidot 640 CdSe / ZnS, average particle diameter 6.3 nm: manufactured by Aldrich), 45 parts by weight of DPHA, "Irgacure" (registered trademark) 907 (registered trademark). Mix 5 parts by weight of BASF Japan Co., Ltd., 166 parts by weight of 30% by weight PGMEA solution of acrylic resin (SPCR-18 (trade name), manufactured by Showa Denko Corporation) and 97 parts by weight of toluene and stir. And dissolved uniformly. The obtained mixture was filtered through a 0.45 μm syringe filter to prepare a color-converting luminescent material composition (CL-1). Preparation Example 2 Color-converting luminescent material composition (CL-2)
The color was the same as in Preparation Example 1 except that 0.4 parts by weight of the green phosphor G-1 obtained in Synthesis Example 5 was used instead of the green quantum dot material and the amount of toluene added was changed to 117 parts by weight. Preparation Example 3 for which the conversion light emitting material composition (CL-2) was prepared 3 color conversion light emitting material composition (CL-3)
The color was the same as in Preparation Example 1 except that 0.4 parts by weight of the red phosphor R-1 obtained in Synthesis Example 6 was used instead of the green quantum dot material and the amount of toluene added was changed to 117 parts by weight. Preparation Example 4 for which the conversion light emitting material composition (CL-3) was prepared Preparation example 4 Color filter forming material (CF-1)
C. I. Pigment Green 59 90g, C.I. I. Pigment Yellow 150 60 g, polymer dispersant (“BYK” (registered trademark) -6919 (trade name) manufactured by Big Chemie (hereinafter “BYK-6919”)) 75 g, binder resin (“ADEKA ARCULDS” (registered trademark)) ) 100 g of WR301 (trade name) manufactured by ADEKA CORPORATION and 675 g of PGMEA were mixed to prepare a slurry. A beaker containing the slurry was connected to a dyno mill with a tube, and zirconia beads having a diameter of 0.5 mm were used as a medium for dispersion treatment at a peripheral speed of 14 m / s for 8 hours. Pigment Green 59 dispersion liquid (GD-1). Was produced.

Pigment Green 59 Dispersion (GD-1) 56.54g, Acrylic Resin ("Cyclomer" (registered trademark) P (ACA) Z250 (trade name) manufactured by Daicel Ornex Co., Ltd. (hereinafter "P (ACA) Z250"" )) 3.14 g, DPHA 2.64 g, photopolymerization initiator (“Optomer” (registered trademark) NCI-831 (trade name) manufactured by ADEKA Co., Ltd. (hereinafter “NCI-831”)) 0.330 g, 0.04 g of a surfactant (BYK (registered trademark) -333 (trade name) manufactured by Big Chemie (hereinafter referred to as “BYK-333”)), 0.01 g of BHT as a polymerization inhibitor, and 37. PGMEA as a solvent. 30 g was mixed to prepare a color filter forming material (CF-1).

Preparation Example 5 Resin composition for light-shielding partition carbon black (MA100 (trade name) manufactured by Mitsubishi Chemical Corporation) 150 g, polymer dispersant BYK-6919 (75 g), P (ACA) Z250 (100 g), and PGMEA (675 g) are mixed. To prepare a slurry. A beaker containing the slurry was connected to a dyno mill with a tube, and zirconia beads having a diameter of 0.5 mm were used as a medium for dispersion treatment at a peripheral speed of 14 m / s for 8 hours to prepare a pigment dispersion liquid (MB-1). did.

Pigment dispersion (MB-1) 56.54 g, P (ACA) Z250 3.14 g, DPHA 2.64 g, NCI-831 0.330 g, BYK-333 0.04 g, as a polymerization inhibitor. 0.01 g of butylcatechol and 37.30 g of PGMEA were mixed to prepare a resin composition for a light-shielding partition wall.

Preparation Example 6 Low Refractive Index Layer Forming Material 5.350 g of silica particle-containing polysiloxane solution (LS-1) obtained in Synthesis Example 6, 1.170 g of ethylene glycol mono-t-butyl ether, and 3.48 g of DAA. After mixing, filtration was performed with a 0.45 μm syringe filter to prepare a low refractive index layer forming material.
Preparation Example 7 Yellow Organic Protective Layer Forming Material (YL-1)
C. I. Pigment Yellow 150 g, polymer dispersant (“BYK” (registered trademark) -6919 (trade name) manufactured by Big Chemie (hereinafter “BYK-6919”)) 75 g, binder resin (“ADEKA ARCULDS” (registered trademark)) ) 100 g of WR301 (trade name) manufactured by ADEKA CORPORATION and 675 g of PGMEA were mixed to prepare a slurry. A beaker containing the slurry was connected to a dyno mill with a tube, and zirconia beads having a diameter of 0.5 mm were used as a medium for dispersion treatment at a peripheral speed of 14 m / s for 8 hours. Pigment Yellow 150 dispersion liquid (YD-1). Was produced.

Pigment Yellow 150 dispersion (YD-1) 3.09 g, polysiloxane (PSL-1) solution 23.54 g as resin, DPHA 6.02 g as photopolymerizable compound, and silver neodecanoate as organic metal compound. 6.02 g of the prepared organic metal compound solution (OM-2), 0.20 g of OXE-02 as a photopolymerization initiator, 0.40 g of IC-819, 0.060 g of IRGANOX® 1010, and BYK. 0.050 g of a 10 wt% diluted solution of PGMEA of -352 (corresponding to a concentration of 500 ppm) was dissolved in 61.15 g of the solvent PGMEA and stirred. The obtained mixture was filtered through a 5.0 μm filter to obtain a yellow organic protective layer forming material (YL-1).

(Examples 17 to 20, Examples 22 to 28, Examples 38 to 45, Comparative Examples 7 to 9)
A 10 cm square non-alkali glass substrate (manufactured by AGC Technoglass Co., Ltd., thickness 0.7 mm) was used as the base substrate. The resin composition for partition walls shown in Tables 4 to 5 is spin-coated on the resin composition and dried at a temperature of 90 ° C. for 2 minutes using a hot plate (trade name SCW-636, manufactured by Dainippon Screen Mfg. Co., Ltd.). , A dry film was prepared. The prepared dry film was subjected to a parallel light mask aligner (trade name PLA-501F, manufactured by Canon Inc.) using an ultrahigh pressure mercury lamp as a light source, and an exposure amount of 200 mJ / cm ² (i-line) via a photomask. Exposed with. Then, using an automatic developing device (“AD-2000 (trade name)” manufactured by Takizawa Sangyo Co., Ltd.), shower-development was performed for 100 seconds using a 0.045 wt% potassium hydroxide aqueous solution, and then 30 using water. Rinse for a second. Further, using an oven (trade name IHPS-222, manufactured by ESPEC CORPORATION), the partition is heated in air at a temperature of 230 ° C. for 30 minutes, and a partition wall having a height of 10 μm and a width of 20 μm is formed on a glass substrate with a short side of 30 μm. , A partition wall formed in a grid pattern with a pitch interval of 150 μm on the long side was formed.

The color conversion luminescent material composition shown in Tables 4 to 5 was applied to the region separated by the partition wall of the obtained substrate with partition wall under a nitrogen atmosphere by an inkjet method, dried at 100 ° C. for 30 minutes, and thickened. A 5.0 μm pixel was formed, and a substrate with a partition wall having the configuration shown in FIG. 2 was obtained.

(Example 21)
A 10 cm square non-alkali glass substrate (manufactured by AGC Technoglass Co., Ltd., thickness 0.7 mm) was used as the base substrate. The resin composition for a partition wall shown in Table 4 is spin-coated on the resin composition, and dried using a hot plate (trade name SCW-636, manufactured by Dainippon Screen Mfg. Co., Ltd.) at a temperature of 90 ° C. for 2 minutes. A membrane was prepared. The prepared dry film was subjected to a parallel light mask aligner (trade name PLA-501F, manufactured by Canon Inc.) using an ultrahigh pressure mercury lamp as a light source, and an exposure amount of 200 mJ / cm ² (i-line) via a photomask. Exposed with. Then, using an automatic developing device (“AD-2000 (trade name)” manufactured by Takizawa Sangyo Co., Ltd.), shower develop with 2.38 wt% tetramethylammonium hydroxide aqueous solution for 90 seconds, and then rinse with water for 30 seconds. did. Then, in the same manner as before, exposure was performed with an exposure amount of 500 mJ / cm ² (i-line) without using a photomask, and bleaching was performed. Further, using an oven (trade name IHPS-222, manufactured by ESPEC CORPORATION), the partition is heated in air at a temperature of 230 ° C. for 30 minutes, and a partition wall having a height of 10 μm and a width of 20 μm is formed on a glass substrate with a short side of 30 μm. , A partition wall formed in a grid pattern with a pitch interval of 150 μm on the long side was formed.

The color conversion luminescent material composition shown in Tables 4 to 5 was applied to the region separated by the partition wall of the obtained substrate with partition wall under a nitrogen atmosphere by an inkjet method, dried at 100 ° C. for 30 minutes, and thickened. A 5.0 μm pixel was formed, and a substrate with a partition wall having the configuration shown in FIG. 2 was obtained.

(Example 29)
A low refractive index layer forming material is spin-coated on a substrate with a partition wall after pixels are formed by the same method as in Example 18, and a hot plate (trade name SCW-636, manufactured by Dainippon Screen Mfg. Co., Ltd.) is used. Then, it was dried at a temperature of 90 ° C. for 2 minutes to prepare a dry film. Further, using an oven (trade name IHPS-222, manufactured by ESPEC CORPORATION), the substrate with a partition wall having the configuration shown in FIG. 3 is formed by heating in air at a temperature of 90 ° C. for 30 minutes to form a low refractive index layer. Obtained.

(Example 30)
An inorganic protective layer having a thickness of 50 to 1,000 nm was used on a low refractive index layer of a substrate with a partition wall having a low refractive index layer obtained in Example 29 using a plasma CVD apparatus (PD-220NL, manufactured by SAMCO). A silicon nitride film having a thickness of 300 nm corresponding to I was formed, and a substrate with a partition wall having the configuration shown in FIG. 4 was obtained.

(Example 31)
On the substrate with a partition wall obtained in Example 18, a plasma CVD apparatus (PD-220NL, manufactured by SAMCO Corporation) was used to make silicon nitride having a thickness of 300 nm, which corresponds to an inorganic protective layer II having a thickness of 50 to 1,000 nm. A film was formed on the upper layer of the pixel. Then, on the inorganic protective layer II, a low refractive index layer having a thickness of 1.0 μm was formed by the same method as in Example 29 using the low rate layer forming material obtained in Preparation Example 6, and is shown in FIG. A substrate with a partition wall having a configuration was obtained.

(Example 32)
The color obtained by Preparation Example 4 so that the film thickness after curing is 2.5 μm in the region separated by the partition wall of the substrate with the partition wall before pixel formation, which was obtained by the same method as in Example 17. A filter forming material (CF-1) was applied and vacuum dried. Exposure was performed at an exposure rate of 40 mJ / cm ² (i-line) through a photomask designed to be exposed to the area of the opening of the substrate with a partition wall. After developing for 50 seconds with a 0.3 wt% tetramethylammonium aqueous solution, heat curing was performed at 230 ° C. for 30 minutes to form a color filter having a thickness of 2.5 μm and a width of 50 μm in a region separated by a partition wall. Then, the color conversion light emitting material composition (CL-2) obtained in Preparation Example 2 was applied onto the color filter under a nitrogen atmosphere using an inkjet method, dried at 100 ° C. for 30 minutes, and the thickness was 5. A 0 μm pixel was formed, and a substrate with a partition wall having the configuration shown in FIG. 6 was obtained.

(Example 33)
A plasma CVD apparatus (PD-220NL, SAMCO) was obtained on a color filter of a substrate with a partition wall before pixel formation, in which a color filter having a thickness of 2.5 μm and a width of 50 μm was formed, which was obtained by the same method as in Example 32. A silicon nitride film having a thickness of 300 nm, which corresponds to an inorganic protective layer III having a thickness of 50 to 1,000 nm, was formed. Further, the color conversion light emitting material composition (CL-2) obtained in Preparation Example 2 was applied onto the inorganic protective layer III under a nitrogen atmosphere using an inkjet method, dried at 100 ° C. for 30 minutes, and thickened. A 5.0 μm pixel was formed, and a substrate with a partition wall having the configuration shown in FIG. 7 was obtained.

(Example 34)
A 10 cm square non-alkali glass substrate (manufactured by AGC Technoglass Co., Ltd., thickness 0.7 mm) was used as the base substrate. On it, a plasma CVD apparatus (PD-220NL, manufactured by SAMCO Corporation) was used to form a silicon nitride film having a film thickness of 300 nm, which corresponds to an inorganic protective layer IV having a thickness of 50 to 1,000 nm. A substrate with a partition wall having the configuration shown in FIG. 8 was obtained by the same method as in Example 31 except that the substrate was used instead of the 10 cm square non-alkali glass substrate.
(Example 35)
The yellow organic protection obtained by Preparation Example 7 was placed on the color filter of the substrate with a partition wall before pixel formation, in which a color filter having a thickness of 2.5 μm and a width of 50 μm was formed, which was obtained by the same method as in Example 32. The layer forming material (YL-1) was applied and vacuum dried. Exposure was performed at an exposure rate of 40 mJ / cm ² (i-line) through a photomask designed to be exposed to the area of the opening of the substrate with a partition wall. After developing with a 0.3 wt% tetramethylammonium aqueous solution for 50 seconds, it was heat-cured at 230 ° C. for 30 minutes to form a yellow organic protective layer having a thickness of 1.0 μm and a width of 50 μm. Further, the color conversion light emitting material composition (CL-2) obtained in Preparation Example 2 was applied onto the yellow organic protective layer under a nitrogen atmosphere using an inkjet method, dried at 100 ° C. for 30 minutes, and thickened. A 5.0 μm pixel was formed, and a substrate with a partition wall having the configuration shown in FIG. 7 was obtained.

(Example 36)
A 10 cm square non-alkali glass substrate (manufactured by AGC Technoglass Co., Ltd., thickness 0.7 mm) was used as the base substrate. The yellow organic protective layer forming material (YL-1) obtained in Preparation Example 7 was applied thereto, and the mixture was vacuum dried. The dried film is exposed to an exposure amount of 40 mJ / cm ² (i-line) without using a photomask, then developed with a 0.3 wt% tetramethylammonium aqueous solution for 50 seconds, and heat-cured at 230 ° C. for 30 minutes. As a result, a yellow organic protective layer having a thickness of 1.0 μm was formed. A substrate with a partition wall having the configuration shown in FIG. 8 was obtained by the same method as in Example 31 except that the substrate was used instead of the 10 cm square non-alkali glass substrate.

(Example 37)
A 10 cm square non-alkali glass substrate (manufactured by AGC Technoglass Co., Ltd., thickness 0.7 mm) was used as the base substrate. On it, the light-shielding partition wall forming material obtained in Preparation Example 5 was spin-coated and dried at a temperature of 90 ° C. for 2 minutes using a hot plate (trade name SCW-636, manufactured by Dainippon Screen Mfg. Co., Ltd.). , A dry film was prepared. The prepared dry film was subjected to a parallel light mask aligner (trade name PLA-501F, manufactured by Canon Inc.) using an ultrahigh pressure mercury lamp as a light source, and an exposure amount of 40 mJ / cm ² (i-line) via a photomask. Exposed with. Then, using an automatic developing device (“AD-2000 (trade name)” manufactured by Takizawa Sangyo Co., Ltd.), develop with a 0.3 wt% tetramethylammonium aqueous solution for 50 seconds, and then rinse with water for 30 seconds. did. Further, using an oven (trade name IHPS-222, manufactured by ESPEC CORPORATION), the mixture is heated in air at a temperature of 230 ° C. for 30 minutes, and is placed on a glass substrate with a height of 2.0 μm, a width of 20 μm, and a thickness of 1.0 μm. A substrate with a light-shielding partition was obtained in which the partition wall having an OD value of 2.0 was formed in a grid pattern with a pitch interval of 30 μm on the short side and 150 μm on the long side. Then, by the same method as in Example 17, a partition wall having a height of 10 μm and a width of 20 μm is formed on the light-shielding partition wall in a grid pattern similar to that of the light-shielding partition wall having a pitch interval of 30 μm on the short side and 150 μm on the long side. Obtained a substrate with. The color conversion light emitting material composition (CL-2) obtained in Preparation Example 22 was applied to the region of the obtained substrate with a partition wall separated by the partition wall in a nitrogen atmosphere by an inkjet method, and at 100 ° C. After drying for 30 minutes, pixels having a thickness of 5.0 μm were formed, and a substrate with a partition wall having the configuration shown in FIG. 9 was obtained.

The configurations of each Example and Comparative Example are shown in Tables 4 to 5.

The evaluation methods in each Example and Comparative Example are shown below.

<Refractive index of white pigment>
For the white pigments used in each Example and Comparative Example, among the methods for measuring the refractive index of plastics specified in JIS K7142-2014 (establishment date = 2014/04/20), the B method (immersion using a microscope) The refractive index was measured by the method (Becke line method). The measurement wavelength was 550 nm. However, instead of the immersion liquid used in JIS K712-2014, "contact liquid" manufactured by Shimadzu Device Co., Ltd. was used, and the measurement was performed under the condition of immersion liquid temperature: 20 ° C. As a microscope, a polarizing microscope "Optiphoto" (manufactured by Nikon Corporation) was used. Thirty samples of white pigment were prepared, the refractive index of each was measured, and the average value was taken as the refractive index.

<Refractive index of polysiloxane and low refractive index layer>
The polysiloxane as a raw material for the partition wall forming resin composition used in each Example and Comparative Example and the low refractive index layer forming material obtained in Preparation Example 26 were each applied on a silicon wafer with a spinner, and a hot plate ( Using the product name SCW-636, manufactured by Dainippon Screen Mfg. Co., Ltd., the product was dried at a temperature of 90 ° C. for 2 minutes. Then, using an oven (IHPS-222; manufactured by ESPEC CORPORATION), the film was heated in air at 230 ° C. for 30 minutes to prepare a cured film. Using a prism coupler (PC-2000 (manufactured by Metricon Co., Ltd.)), the cured film surface is irradiated with light having a wavelength of 550 nm from the direction perpendicular to the cured film surface under atmospheric pressure and at 20 ° C., and the refractive index is measured. , Rounded to the third decimal place.

<Resolution>
Using a spin coater (trade name 1H-360S, manufactured by Mikasa Co., Ltd.), the resin composition for partition walls used in each Example and Comparative Example was placed on a 10 cm square non-alkali glass substrate with a film thickness after heating. Was spin-coated to a thickness of 10 μm and dried using a hot plate (trade name SCW-636, manufactured by Dainippon Screen Mfg. Co., Ltd.) at a temperature of 90 ° C. for 2 minutes to prepare a dry film having a film thickness of 10 μm. ..

The prepared dry film is used with a parallel light mask aligner (trade name PLA-501F, manufactured by Canon Inc.) and an ultra-high pressure mercury lamp as a light source, and has widths of 100 μm, 80 μm, 60 μm, 50 μm, 40 μm, 30 μm and 20 μm. Exposure was performed with a gap of 100 μm at an exposure rate of 200 mJ / cm ² (i-line) through a mask having the line & space pattern of. Then, using an automatic developing device (“AD-2000 (trade name)” manufactured by Takizawa Sangyo Co., Ltd.), shower-development was performed for 100 seconds using a 0.045 wt% potassium hydroxide aqueous solution, and then 30 using water. Rinse for a second.

The pattern after development was magnified and observed using a microscope adjusted to a magnification of 100 times, and the narrowest line width was used as the resolution among the patterns in which no residue was observed in the unexposed area. However, if there is a residue in the unexposed portion near the pattern having a width of 100 μm, it is set to “> 100 μm”.

<Reflectance>
The partition wall-forming resin composition used in each Example and Comparative Example was processed under the same conditions as in each Example and Comparative Example except that the entire partition-forming resin composition was exposed without using a photomask at the time of exposure, and was solid on a glass substrate. A membrane was made. Using the obtained solid film as a model of the partition wall of the substrate with a partition wall obtained in each Example and Comparative Example, a spectrocolorimeter (trade name CM-2600d, manufactured by Konica Minolta Co., Ltd.) was used for a glass substrate having a solid film. ) Was used to measure the reflectance at a wavelength of 550 nm from the solid film side in the SCI mode. However, when a crack occurred in the solid film, the reflectance was not measured because an accurate value could not be obtained due to the crack or the like.

<Crack resistance>
The partition wall-forming resin compositions used in each Example and Comparative Example were spin-coated so that the film thickness after heating was 5 μm, 10 μm, 15 μm, and 20 μm, respectively. In the subsequent steps, a solid film was produced on a glass substrate by processing under the same conditions as in each Example and Comparative Example except that the entire surface was exposed without using a photomask at the time of exposure. The obtained solid film was used as a model of the partition wall of the substrate with a partition wall obtained in each Example and Comparative Example, and the glass substrate having the solid film was visually observed and the presence or absence of cracks in the solid film was evaluated. If even one crack was confirmed, it was judged that there was no crack resistance at that film thickness. For example, when there were no cracks when the film thickness was 15 μm and there were cracks when the film thickness was 20 μm, the crack resistance film thickness was determined to be “≧ 15 μm”. Further, the crack-resistant film thickness when there was no crack even at 20 μm was determined as “≧ 20 μm”, and the crack-resistant film thickness when there was a crack even at 5 μm was determined as “<5 μm”, respectively, and the crack resistance was determined.

<OD value>
As a model of the partition wall of the substrate with a partition wall obtained in each Example and Comparative Example, a solid film was prepared on the glass substrate in the same manner as the evaluation of the reflectance. With respect to the obtained glass substrate having a solid film, the intensities of incident light and transmitted light were measured using an optical densitometer (361T (visual); manufactured by X-rite), and the OD value was determined by the above formula (1). Calculated. Regarding the OD value, the solid film before the heating step and the OD value after the heating step were measured, and the differences are shown in Tables 6 to 7.

Further, for Example 37, a solid film was similarly produced on a glass substrate as a model of the light-shielding partition wall (A-2). With respect to the obtained glass substrate having a solid film, the intensities of incident light and transmitted light were measured using an optical densitometer (361T (visual); manufactured by X-Rite Co., Ltd.) and calculated by the above formula (1).

<Taper angle>
In each Example and Comparative Example, an arbitrary cross section of the substrate with a partition wall before pixel formation was measured with an optical microscope (FE-SEM (S-4800); manufactured by Hitachi, Ltd.) at an acceleration voltage of 3.0 kV. It was observed and the taper angle was measured.

<Surface contact angle>
As a model of the partition wall in the partition walled substrate obtained in each Example and Comparative Example, a solid film was prepared on the glass substrate in the same manner as the evaluation of the reflectance. For the surface of the obtained solid film, DM-700 manufactured by Kyowa Interface Science Co., Ltd., Microsyringer: Teflon (registered trademark) coated needle 22G for contact angle meter manufactured by Kyowa Interface Science Co., Ltd. was used at 25 ° C. for the atmosphere. Among them, the surface contact angle was measured in accordance with the wettability test method for the surface of the substrate glass specified in JIS R3257 (establishment date = 1999/04/20). However, propylene glycol monomethyl ether acetate was used instead of water, and the contact angle between the surface of the solid film and propylene glycol monomethyl ether acetate was measured.

<Inkjet applicability>
In the substrate with a partition wall before forming the pixels obtained in each Example and Comparative Example, an inkjet coating device (InkjetLabo, Cluster Technology) using PGMEA as an ink for the pixel portion surrounded by the grid-like partition walls. Inkjet coating was performed using (manufactured by Co., Ltd.). 160 pL of PGMEA was applied to one grid pattern, and the presence or absence of breakage (a phenomenon in which the ink got over the partition wall and mixed into the adjacent pixel portion) was observed, and the inkjet coatability was evaluated according to the following criteria. The smaller the number of breaks, the higher the liquid repellency and the better the inkjet coating property.
A: The ink did not overflow from the inside of the pixel.
B: Ink overflowed from the inside of the pixel to the upper surface of the partition wall in a part.
C: Ink overflowed from the inside of the pixel to the upper surface of the partition wall on the entire surface.

<Thickness>
For the substrates with partition walls obtained in each example and comparative example, the height of the structure before and after the formation of the pixel (B) was measured using a surfcom stylus type film thickness measuring device, and the difference was calculated. , The thickness of the pixel (B) was measured. For Examples 29 to 31, the film thickness of the low refractive index layer (C) is further set, for Examples 32 to 36, the film thickness of the color filter is further set, and for Example 37, the thickness (height) of the light-shielding partition wall is further set. , Each was measured in the same manner.

Further, in Examples 30 to 31 and 33 to 34, a cross section perpendicular to the base substrate is exposed by using a polishing device such as a cross section polisher, and the cross section is enlarged by a scanning electron microscope or a transmission electron microscope. By observing, the thicknesses of the inorganic protective layers I to IV were measured.

<Brightness>
Using a planar light emitting device equipped with a commercially available LED backlight (peak wavelength 465 nm) as a light source, a substrate with a partition wall obtained by each Example and Comparative Example was installed so that the pixel portion was on the light source side. A current of 30 mA is passed through this planar light emitting device to light the LED element, and a spectral radiance meter (CS-1000, manufactured by Konica Minolta) is used to measure the brightness (unit: cd / m ² ) based on the CIE 1931 standard. It was measured and used as the initial brightness. However, the evaluation of the luminance was performed by a relative value with the initial luminance of Example 45 as the standard 100.

Further, after the LED element was turned on for 48 hours at room temperature (23 ° C.), the brightness was measured in the same manner to evaluate the change with time of the brightness. However, the evaluation of the luminance was performed by a relative value with the initial luminance of Example 45 as the standard 100.

<Color characteristics>
On a commercially available white reflector, the substrates with partition walls obtained in each Example and Comparative Example were installed so that the pixels were arranged on the white reflector side. Using a spectrophotometer (CM-2600d, manufactured by Konica Minolta, measurement diameter φ8 mm), light was irradiated from the base substrate side of the substrate with a partition wall, and the spectrum including specular reflected light was measured.

Color standard BT that can almost reproduce the colors of the natural world. The color gamut defined by 2020 defines red, green, and blue as the three primary colors on the spectral trajectory shown in the chromaticity diagram, and the wavelengths of red, green, and blue correspond to 630 nm, 532 nm, and 467 nm, respectively. From the reflectances (R) of the three wavelengths of 470 nm, 530 nm and 630 nm of the obtained reflection spectrum, the emission color of the pixel was evaluated according to the following criteria.
A: R ₅₃₀ / (R ₆₃₀ + R ₅₃₀ + R ₄₇₀ ) ≧ 0.55
B: R ₅₃₀ / (R ₆₃₀ + R ₅₃₀ + R ₄₇₀ ) <0.55.

<Display characteristics>
The display characteristics of the display device manufactured by combining the substrate with a partition wall and the organic EL element obtained in each Example and Comparative Example were evaluated based on the following criteria.
A: The green display is very colorful, and it is a clear and high-contrast display device.
B: It is a display device that has no problem, although the colors are slightly unnatural.

<Mixing color>
In the substrate with a partition wall before forming the pixels obtained in each Example and Comparative Example, a color-converted light-emitting material composition (a color-converted light-emitting material composition) was used on a part of the pixel portion surrounded by the lattice-shaped partition walls by using an inkjet method. CL-2) was applied and dried at 100 ° C. for 30 minutes to form pixels having a thickness of 5.0 μm. Then, in the pixel portion surrounded by the lattice-shaped partition wall, the area adjacent to the area to which the color-converting light-emitting material composition (CL-2) is applied is subjected to the color-converting light-emitting material composition (CL) by using the inkjet method. -3) was applied and dried at 100 ° C. for 30 minutes to form pixels having a thickness of 5.0 μm.

On the other hand, a blue organic EL cell having the same width as the pixel portion surrounded by the grid-shaped partition wall is produced, and the above-mentioned substrate with partition wall and the blue organic EL cell are opposed to each other and bonded with a sealing agent, and are shown in FIG. Obtained a configuration display device.

Of the blue organic EL cells 11 in FIG. 10, only the blue organic EL cells bonded directly under the pixel 3 (CL-2) formed of the color conversion light emitting material composition (CL-2) are lit. , The absorption intensity of the pixel 3 (CL-3) portion formed of the color conversion light emitting material composition (CL-3) at a wavelength of 630 nm using a microspectrophotometer LVmicro-V (manufactured by Lambda Vision Co., Ltd.). A (630 nm) was measured. The smaller the value of the absorption intensity A (630 nm), the less likely it is that color mixing will occur. Color mixing was determined according to the following criteria.
A: A (630 nm) <0.01
B: 0.01 ≤ A (630 nm) ≤ 0.5
C: 0.5 <A (630 nm).

The evaluation results of each example and comparative example are shown in Tables 6 to 7.

1: Base substrate 2: Partition 3: Pixel 3 (CL-2): Pixel 3 (CL-3) formed of the color conversion light emitting material composition (CL-2): Color conversion light emitting material composition (CL-3) ): Pixel 4: Low refractive index layer 5: Inorganic protective layer I
6: Inorganic protective layer II
7: Color filter 8: Inorganic protective layer III and / or yellow Organic protective layer 9: Inorganic protective layer IV and / or yellow Organic protective layer 10: Light-shielding partition 11: Blue organic EL cell H: Thickness of partition L: Width of partition θ: Taper angle

Claims (10)

A substrate with a partition wall having a partition wall having a (A-1) pattern formed on the base substrate, and the partition wall having the (A-1) pattern formed is a resin, a white pigment, palladium oxide, platinum oxide, and oxidation. It contains at least one metal oxide selected from the group consisting of gold, silver oxide, palladium, platinum, gold and silver, or particles made of metal, and has a reflectance of 20% to 60% per 10 μm thickness at a wavelength of 550 nm. , A substrate with a partition wall having an OD value of 1.0 to 3.0 per 10 μm thickness. The (A-1) patterned partition wall further contains a liquid-repellent compound, and the content of the liquid-repellent compound in the (A-1) patterned partition wall is 0.01% by weight to 10% by weight. The substrate with a partition wall according to claim 1 . The substrate with a partition wall according to claim 1 or 2 , wherein the partition wall having the pattern (A-1) has a surface contact angle of 10 ° to 70 ° with respect to propylene glycol monomethyl ether acetate. The substrate with a partition wall according to any one of claims 1 to 3 , wherein the pattern-formed partition wall has a taper angle of 45 ° to 110 °. A patterned light-shielding partition wall having an OD value of 0.5 or more per (A-2) thickness of 1.0 μm is further provided between the base substrate and the (A-1) patterned partition wall. , The substrate with a partition wall according to any one of claims 1 to 4 . The substrate with a partition wall according to any one of claims 1 to 5 , further comprising pixels containing (B) a color-converting light-emitting material arranged separated by a partition wall formed with the (A-1) pattern. The substrate with a partition wall according to claim 6 , wherein the color conversion light emitting material contains a phosphor selected from quantum dots and a pyrromethene derivative. The substrate with a partition wall according to claim 6 or 7 , further comprising a color filter having a thickness of 1 to 5 μm between the substrate and the pixel containing the (B) color conversion light emitting material. On the substrate or between the color filter having a thickness of 1 to 5 μm and the pixel layer containing the (B) color conversion light emitting material, an inorganic protective layer having a thickness of 50 to 1,000 nm and / or yellow organic protection is further provided. The substrate with a partition wall according to claim 8 , which has a layer. A display device comprising the substrate with a partition wall according to any one of claims 1 to 9 , and a light emitting light source selected from a liquid crystal cell, an organic EL cell, a mini LED cell, and a micro LED cell.

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