JP7042179B2 - Lead frame inspection device - Google Patents

Description

The present invention relates to a lead frame inspection device.

With the increasing demand for integrated circuit boards, automation in lead mounting and lead frame inspection is required. In the inspection device, various techniques for discriminating between a defective product and a non-defective product after determining the non-defective product of the lead by a camera have been proposed.

For example, Patent Document 1 mainly includes a camera for detecting bending of a lead, a laser for detecting floating of the lead, and a marker for applying a mark to a lead determined to be defective by the camera and the laser. A method of mounting an electronic component is disclosed. In the configuration of Patent Document 1, it is possible to determine at which position there is an abnormality of lead bending or lead floating by changing the position of the marker and the number of markers to be applied.

Further, Patent Document 2 discloses a configuration in which a lead frame inspection device on which a plurality of electronic components are mounted is provided with a drilling means for drilling a hole in a lead determined to be defective. Leads destroyed by the drilling means are electrically determined to be defective in the electrical test in the subsequent process, so it is said that the entire inspection process can be automated.

Japanese Patent No. 3279216 Japanese Unexamined Patent Publication No. 9-17830

However, in the technique described in Patent Document 1, since correction work by visual inspection or camera inspection is required in another step after inspection, the number of steps and labor may increase.

In the technique described in Patent Document 2, when the lead of a defective electronic component is broken, the non-defective electronic component located around the defective electronic component may be deformed. In the technique described in Patent Document 2, it is necessary to provide a chip suction means and a substrate clamping means with the addition of the drilling means, which may increase the size of the apparatus.

Therefore, an object of the present invention is to provide a lead frame inspection device that suppresses the influence on non-defective electronic components located around defective electronic components in the lead frame inspection and reduces the labor required for the inspection. And.

In order to solve the above problems, in the lead frame inspection device of one embodiment of the present invention, a lead in which a plurality of electronic components having chips mounted between the first terminal and the second terminal are connected via the frame is formed. A frame inspection device that inspects the presence or absence of conductive defects in a plurality of the electronic components based on the appearance of the lead frame, and among the electronic components, defects determined to be conductive defects by the inspection unit. A dispenser for applying a conductive member to an electronic component is provided, the first terminal and the second terminal are formed with a gap, and the dispenser is formed with the first terminal of the defective electronic component and the first terminal. It is characterized in that the conductive member is applied between the second terminal and the first terminal and the second terminal are short-circuited.

According to this configuration, the dispenser applies a conductive member between the first terminal and the second terminal of the defective electronic component to short-circuit the terminals, so that the defective electronic component coated with the conductive member can be used. It is determined to be defective in the electrical test of the subsequent process. Therefore, it is not necessary to perform the visual identification work after the inspection process, and the inspection process can be automated.
Further, since the terminals can be short-circuited only by applying a conductive member, the non-defective electronic component 9a located around the defective electronic component 9b is deformed as compared with the case where a hole is made with a drill or the like to short-circuit the electronic component. There is nothing to do. In addition, there is no vibration or scattering of chips, and the influence on non-defective electronic components located around defective electronic components can be suppressed. Further, since it is not necessary to provide a dust collector or the like, the inspection device can be miniaturized.
Therefore, it is possible to provide a lead frame inspection device that suppresses the influence on the surrounding non-defective products and reduces the labor required for inspection.

Further, the dispenser is characterized in that the conductive member is applied so as to protrude to the outside of the mold region of the chip in the electronic component.

According to this configuration, since the conductive member is applied so as to protrude to the outside of the mold region, even if the chip of each electronic component is molded after the inspection process, whether it is a defective electronic component or not is determined by the appearance. Can be identified. Therefore, the certainty of the inspection can be increased.

Further, the lead frame inspection device of one embodiment of the present invention is a lead frame inspection device in which a plurality of electronic components having chips mounted between the first terminal and the second terminal are connected via a frame. Therefore, based on the appearance of the lead frame, an inspection unit for inspecting the presence or absence of conduction defects in a plurality of the electronic components, and among the electronic components, for defective electronic components determined to be conduction defects by the inspection unit. A dispenser for applying the conductive member is provided, and the dispenser applies the conductive member to the mounting portion of the chip at at least one of the first terminal and the second terminal among the defective electronic components. It is characterized by conducting conduction between the mounting portion and the chip.

According to this configuration, the dispenser applies a conductive member to the mounting portion of the chip at at least one of the first terminal and the second terminal among the defective electronic components to conduct conduction between the terminal and the chip, for example. Defective electronic components that have been determined to be defective due to solder defects or the like can be corrected to non-defective products by applying a conductive member to the mounting portion. Further, by adding a conductive member to the portion where the amount of solder is small, it is possible to prevent the chip from coming off after the inspection.
In addition, since corrections are automatically made after the inspection by the inspection unit, human error such as forgetting to make corrections can be suppressed.
Therefore, it is possible to provide a lead frame inspection device that reduces the labor required for inspection.

Further, the conductive member is characterized by containing a resin material.

According to this configuration, it becomes easy to set conditions such as the melting point and viscosity of the conductive member. Therefore, workability can be improved. Further, since the resistivity of the conductive member can be set, it is possible to easily identify defective electronic components by the resistance value when combined with the electrical test in the subsequent process.
Therefore, it is possible to provide a lead frame inspection device having excellent workability and capable of reliably identifying defective electronic components.

Further, a transport mechanism for transporting the lead frame between the inspection unit and the dispenser is provided, and the scanning direction of the dispenser is characterized by intersecting the transport direction of the lead frame.

According to this configuration, since the dispenser is installed so as to intersect the transport direction of the lead frame, the distance in the transport direction of the lead frame is shortened when the inspection unit and the dispenser are arranged along the transport direction of the lead frame. can do. Therefore, the lead frame inspection device can be miniaturized.
Further, by scanning the dispenser in a direction intersecting the transport direction of the lead frame as the lead frame passes, the conductive member can be applied to the defective electronic component with a simple operation. This makes it possible to improve workability.

INDUSTRIAL APPLICABILITY According to the present invention, it is possible to provide a lead frame inspection device that suppresses the influence on surrounding non-defective products and reduces the labor required for inspection in the inspection of lead frames on which electronic components are mounted.

The schematic block diagram of the inspection apparatus of the lead frame which concerns on 1st Embodiment. The enlarged perspective view of the lead frame which concerns on 1st Embodiment. The perspective view of the dispenser which concerns on 1st Embodiment. Explanatory drawing which shows the short circuit processing process. The schematic block diagram of the inspection apparatus of the lead frame which concerns on 2nd Embodiment.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description, the same reference numerals are given to configurations having the same or similar functions. Then, the duplicate description of those configurations may be omitted.

(First Embodiment)
(Inspection equipment)
FIG. 1 is a schematic configuration diagram of an inspection device 1 (a lead frame inspection device according to a claim).
The inspection device 1 includes a transport mechanism 2, an inspection unit 3, and a short-circuit processing unit 4. In the following description, the transport direction of the transport mechanism 2 in FIG. 1 is defined as the X axis, the direction orthogonal to the X axis is defined as the Y axis, and the directions orthogonal to the X axis and the Y axis are defined as the Z axis. In the present embodiment, the Z-axis direction coincides with the vertical direction (+ Z-axis direction is upward).

(Transport mechanism)
The transport mechanism 2 includes a product supply unit 13, a product storage unit 14, and a transfer rail 15.
The product supply unit 13, the product storage unit 14, and the transfer rail 15 are arranged side by side in the X-axis direction.

The product supply unit 13 includes a supply magazine 31 and a supply magazine Z-axis 33 that changes the height of the supply magazine 31.
A plurality of lead frames 5 are housed inside the supply magazine 31.

FIG. 2 is a perspective view of the lead frame 5.
The lead frame 5 includes a frame 26 and an electronic component 9.
The frame 26 is a plate-shaped substrate (see also FIG. 3). A plurality of rectangular holes 21 are formed in the frame 26. A gap hole 22 (a gap according to a claim) is formed between adjacent rectangular holes 21. The frame 26 has an electronic component 9 at a portion where the frame 26 faces each other with the gap hole 22 interposed therebetween.
The electronic component 9 includes a first terminal 35, a second terminal 36, a chip 27, and a connection terminal 28. The first terminal 35 is integrally formed with the frame 26 on one side of the frame 26 facing the gap hole 22. The second terminal 36 is integrally formed with the frame 26 on the other side of the frame 26 facing the gap hole 22. The chip 27 is mounted on the first terminal 35 of the frame 26, for example, by soldering. The connection terminal 28 has a first end connected to the chip 27 and a second end connected to the second terminal 36. As a result, the first terminal 35 and the second terminal 36 are electrically connected to each other via the chip 27 and the connection terminal 28.
As described above, the lead frame 5 is formed with a plurality of electronic components 9 connected to each other via the frame 26.

The connection terminal 28 has a configuration in which the first terminal 35 side of the electronic component 9 has a predetermined space in the + Z axis direction with respect to the second terminal 36 side, and the connection terminal 28 is viewed from the + Z axis direction. The end portion of the first terminal 35 side has a predetermined space with respect to the second terminal 36 side and overlaps with the first terminal 35. In other words, the first terminal 35 and the second terminal 36 are electrically connected to each other via a connection terminal 28 and a chip 27 having a predetermined space in the Z-axis direction.

The alternate long and short dash line in FIG. 2 indicates the mold region R covered with the mold material 29 after the inspection.
After the inspection step by the inspection device 1, the chip 27 is covered with the mold material 29. The electronic component 9 is separated from the lead frame 5 as one electronic component 9 by cutting the root portion 37 of the first terminal 35 and the root portion 38 of the second terminal 36 from the frame 26, and various electronic devices ( Not shown).

Returning to FIG. 1, the product storage unit 14 is arranged side by side in the X direction with a space from the product supply unit 13. The product storage unit 14 includes a storage magazine 41 and a storage magazine Z-axis 43 that changes the height of the storage magazine 41.
The lead frame 5 can be accommodated inside the storage magazine 41.

The transport rail 15 is arranged between the product supply unit 13 and the product storage unit 14 and extends along the X-axis direction. The work surface 15f of the transport rail 15 is horizontally movable from the product supply unit 13 side to the product storage unit 14 side by a motor (not shown). A lead frame 5 is placed on the work surface 15f of the transport rail 15, and the lead frame 5 is configured to be horizontally movable from the product supply unit 13 side to the product storage unit 14 side as the work surface 15f moves. At this time, the lead frame 5 is arranged on the work surface 15f so that the moving direction of the transport rail 15 and the straight line connecting the first terminal 35 and the second terminal 36 of the lead frame 5 are orthogonal to each other. In other words, the straight line connecting the first terminal 35 and the second terminal 36 of the lead frame 5 is arranged along the Y-axis direction.

(Inspection unit)
The inspection unit 3 is provided in the middle of the transport rail 15. The inspection unit 3 includes a photographing unit 6 and a control unit 7.
The photographing unit 6 mainly includes a 3D camera 11 and a lighting 12 for photographing. The 3D camera 11 is arranged above the transport rail 15 and photographs the lead frame 5 from the Z-axis direction. The 3D camera 11 is capable of three-dimensionally photographing the lead frame 5. Instead of the 3D camera 11, a 2D camera, a laser, or the like may be used to acquire three-dimensional information. Further, the one-time photographing range of the photographing unit 6 may be a part of the lead frame 5 as long as it is an area including the entire electronic component 9.

The control unit 7 mainly includes a determination unit 17, a storage unit 18, and a short-circuit processing drive unit 19.
The determination unit 17 identifies the presence or absence of defects in each of the electronic components 9 based on the image information of the lead frame 5 obtained by the photographing unit 6. Here, the defects in the electronic component 9 are, for example, solder defects, misalignment of the chip 27, bending of leads in the chip 27, defects in the chip 27, and the like. All the electronic components 9 are identified by the determination unit 17 as either a non-defective electronic component 9a or a defective electronic component 9b (see FIG. 2).
The storage unit 18 records the position information on the lead frame 5 of the defective electronic component 9b determined by the determination unit 17 to be defective.
In the short-circuit processing drive unit 19, a command signal for causing the defective electronic component 9b to perform short-circuit processing is output to the short-circuit processing unit 4 based on the information of the determination unit 17 and the storage unit 18.

Further, the control unit 7 cannot detect the position of the transfer rail 15 (more specifically, the position of the lead frame 5) by the output of the motor (not shown) of the transfer rail 15, a position sensor (not shown), or the like. The illustrated position detection unit is provided.

(Short circuit processing unit)
The short-circuit processing unit 4 is provided in the middle of the transfer rail 15 and on the downstream side of the transfer rail 15 with respect to the inspection unit 3. The short-circuit processing unit 4 includes a dispenser 8, a scanning Y-axis stage 23, and a scanning Z-axis stage 24.
The dispenser 8 is arranged above the transport rail 15. The dispenser 8 can be scanned in the Y-axis direction and the Z-axis direction by the scanning Y-axis stage 23 and the scanning Z-axis stage 24.

FIG. 3 is a perspective view of the dispenser 8.
The dispenser 8 has a main body portion 8a that houses the conductive member 10 inside, and a nozzle portion 8b that is provided at the lower end of the main body portion 8a and whose tip is directed toward the lead frame 5. The conductive member 10 can be ejected from the tip of the nozzle portion 8b. The conductive member 10 contains a resin material. The resin material is, for example, epoxy, silicone, polyurethane or the like.

(Action, effect)
Next, the operation (inspection step) and effect of the above-mentioned inspection device 1 will be described.
As shown in FIG. 1, the lead frame 5 on which the electronic component 9 is mounted is supplied from the supply magazine 31 and then conveyed to directly under the 3D camera 11 by the transfer rail 15. Next, a three-dimensional image of the lead frame 5 is captured by the 3D camera 11, and the captured image is sent to the control unit 7. In the control unit 7, first, the determination unit 17 performs defect determination for each electronic component 9 mounted on the lead frame 5 based on the presence or absence of solder defects, misalignment, component defects, and the like. The position, type, and the like of the electronic component 9 found to be defective by the determination unit 17 are recorded in the storage unit 18 as the defective electronic component 9b. Further, based on the information of the determination unit 17 and the storage unit 18, the short-circuit processing drive unit 19 outputs a command signal for performing short-circuit processing on the defective electronic component 9b.

The short-circuit processing unit 4 applies the conductive member 10 to the defective electronic component 9b of the lead frame 5 by the signal from the short-circuit processing drive unit 19, and short-circuits the defective electronic component 9b. FIG. 4 is an explanatory diagram showing a short circuit processing process. The dispenser 8 is scanned by the scanning Y-axis stage 23 and the scanning Z-axis stage 24, and the conductive member 10 is applied to the defective electronic component 9b. Specifically, the dispenser 8 passes through the chip 27 from the portion of the first terminal 35 of the defective electronic component 9b located outside the mold region R (see FIG. 2) covered with the mold material 29 in the subsequent process. The conductive member 10 is applied so as to be continuous to the connection terminal 28. Here, via may mean that it is electrically connected, or it may simply mean that it is physically connected via the end face of the outer shape. As a result, the first terminal 35 and the second terminal 36 are electrically conductive via the connection terminal 28, and the first terminal 35 and the second terminal 36 are short-circuited. The conductive member 10 may be applied so as to fit within the mold region R as long as at least the terminals 35 and 36 are short-circuited.

The lead frame 5 that has passed through the inspection unit 3 is sequentially housed inside the storage magazine 41. As a result, the inspection process by the inspection device 1 is completed.

The lead frame 5 is finally judged to be non-defective by an electric test carried out through a molding step and an individualization step after the above-mentioned inspection step. In the electric test, each electronic component 9 is energized to the electronic component 9 via, for example, the first terminal 35 and the second terminal 36. In the electric test, a product whose resistance value of the electronic component 9 is within a predetermined range is judged as a non-defective product. That is, in the electric test, the resistance value of the defective electronic component 9b in which the first terminal 35 and the second terminal 36 are short-circuited is out of the predetermined range. As a result, the defective electronic component 9b coated with the conductive member 10 is determined to be a defective product even in the electrical test in the subsequent process. The electronic component 9 finally determined to be defective in the electric test is discarded without being mounted on the electronic device.

In this way, the dispenser 8 applies the conductive member 10 between the first terminal 35 and the second terminal 36 in the defective electronic component 9b to short-circuit the terminals, so that the defective electronic component 10 is coated. The electronic component 9b is determined to be defective in the electrical test in the subsequent process. Therefore, it is not necessary to perform the visual identification work after the inspection process, and the inspection process can be automated.
Further, since the terminals 35 and 36 can be short-circuited only by applying the conductive member 10, a good product located around the defective electronic component 9b is compared with the case where the electronic component 9 is short-circuited by making a hole with a drill or the like. The electronic component 9a is not deformed. In addition, there is no vibration or scattering of chips, and the influence on the non-defective electronic component 9a located around the defective electronic component 9b can be suppressed. Further, since it is not necessary to provide a dust collector or the like, the inspection device 1 can be miniaturized.
Therefore, it is possible to provide a lead frame inspection device 1 that suppresses the influence on the surrounding non-defective electronic components 9a and reduces the labor required for inspection.

Further, since the conductive member 10 is applied so as to protrude to the outside of the mold region R, even if the chip 27 of each electronic component 9 is molded after the inspection step, whether it is a defective electronic component 9b or not depending on the appearance. Can be identified. Therefore, the certainty of the inspection can be increased.

Here, since the conductive member 10 contains a resin material, it becomes easy to set conditions such as the melting point and viscosity of the conductive member 10. Therefore, workability can be improved. Further, since the resistivity of the conductive member 10 can be set, it is possible to easily identify the defective electronic component 9b by the resistance value when combined with the electric test in the subsequent process.
Therefore, it is possible to use the lead frame inspection device 1 which is excellent in workability and can reliably identify defective electronic components 9b.

Further, since the dispenser 8 is installed so as to intersect the transport direction of the lead frame 5, the distance in the transport direction of the lead frame 5 when the inspection unit 3 and the dispenser 8 are arranged along the transport direction of the lead frame 5. Can be shortened. Therefore, the lead frame inspection device 1 can be miniaturized.
Further, by scanning the dispenser 8 in a direction intersecting the transport direction of the lead frame 5 with the passage of the lead frame 5, the conductive member 10 can be applied to the defective electronic component 9b with a simple operation. This makes it possible to improve workability.

In this embodiment, the chip 27 is mounted on the first terminal 35, but the chip 27 may be mounted on the second terminal 36.

The conductive member 10 may be a metal such as solder that does not contain a resin material. Further, the conductive member 10 may be configured to be ejected downward from the dispenser 8. In this case, since it is not necessary to scan the dispenser 8 in the Z direction, the configuration of the dispenser 8 can be simplified.

Further, a plurality of cameras may be provided in the photographing unit 6, and an image may be acquired only by a laser instead of the cameras. Further, the camera may be equipped with a Z-axis stage.

(Second Embodiment)
A second embodiment according to the present invention will be described. FIG. 5 is a schematic configuration diagram of the lead frame inspection device 1 according to the second embodiment. This embodiment differs from the above-described embodiment in that the correction processing unit 40 is provided next to the short-circuit processing unit 4.

In the present embodiment, the correction processing unit 40 is installed on the downstream side of the transport rail 15 with respect to the short-circuit processing unit 4 side by side with the short-circuit processing unit 4 in the X direction. The correction processing unit 40 includes a dispenser 48, a scanning Y-axis stage 45, and a scanning Z-axis stage 46.

The dispenser 48 is arranged above the transport rail 15. The dispenser 48 is capable of scanning in the Y-axis direction and the Z-axis direction via the scanning Y-axis stage 45 and the scanning Z-axis stage 46. The dispenser 48 has a main body portion 48a for accommodating the correction member 50 (the conductive member according to the claim), and a nozzle portion 48b provided at the lower end of the main body portion 48a and having the tip end toward the lead frame 5. The correction member 50 can be discharged from the tip of the nozzle portion 48b. The correction member 50 contains, for example, solder. The correction member 50 may be made of the same material as the conductive member 10 described above.

The control unit 7 mainly includes a determination unit 17, a storage unit 18, a short-circuit processing drive unit 19, and a correction processing drive unit 49.
The determination unit 17 identifies the presence or absence of defects such as solder defects, misalignments, and component defects with respect to the electronic component 9, and determines whether the defective electronic component 9b determined to be defective can be corrected or cannot be corrected. do. As a result, all the electronic components 9 are identified as either a non-defective electronic component 9a, a correctable defective electronic component 9b, or an uncorrectable defective electronic component 9b. Here, the defective electronic component 9b that can be corrected has a solder defective portion such as an insufficient amount of solder or a dissociation between the solder and the chip 27, and the defect is eliminated by adding solder to the solder defective portion. Refers to the defective electronic component 9b.
The short-circuit processing drive unit 19 outputs a command signal for performing short-circuit processing on the defective electronic component 9b determined to be uncorrectable based on the information of the determination unit 17 and the storage unit 18. ..
The correction processing driving unit 49 outputs a command signal for performing correction processing on the defective electronic component 9b determined to be correctable, based on the information of the determination unit 17 and the storage unit 18.

The operation of the inspection device 1 in the second embodiment will be described.
From the image taken by the 3D camera 11, the determination unit 17 makes a defect determination for each electronic component 9 mounted on the lead frame 5. At this time, the determination unit 17 also determines whether the defective electronic component 9b in which the defect is found can be corrected or cannot be corrected. The position, the type of defect, the possibility of correction, and the like of the electronic component 9 determined to be defective are recorded in the storage unit 18 as the defective electronic component 9b. When the defective electronic component 9b that can be corrected is detected, the correction processing drive unit 49 receives a command signal for performing correction processing on the defective electronic component 9b based on the information of the determination unit 17 and the storage unit 18. It is output to 40. When an uncorrectable defective electronic component 9b is detected, in the short-circuit processing drive unit 19, the command signal for performing the short-circuit processing on the defective electronic component 9b is short-circuited based on the information of the determination unit 17 and the storage unit 18. It is output to the part 4.

When an uncorrectable defective electronic component 9b is detected, the short-circuit processing unit 4 sends a signal from the short-circuit processing drive unit 19 to the defective electronic component 9b of the lead frame 5 to provide a conductive member, as in the first embodiment. 10 is applied and a short circuit treatment is performed. As a result, the first terminal 35 and the second terminal 36 (see FIG. 2) are short-circuited.
On the other hand, when the defective electronic component 9b that can be corrected is detected, the correction processing unit 40 applies the correction member 50 to the defective electronic component 9b of the lead frame 5 by the signal from the correction processing driving unit 49 to perform the correction process. conduct. Specifically, the dispenser 48 is scanned by the scanning Y-axis stage 45 and the scanning Z-axis stage 46, and the correction member 50 is applied to the solder defective portion in the defective electronic component 9b. As a result, the solder defect of the defective electronic component 9b is eliminated.

According to the configuration of the second embodiment, in addition to the same actions and effects as those of the first embodiment, the following actions and effects are obtained. That is, the dispenser 48 applies the correction member 50 to the mounting portion of the chip 27 in at least one of the first terminal 35 and the second terminal 36 of the defective electronic components 9b that can be corrected, and the terminals 35 and 36 and the chip 27 are connected to each other. Conduct between. Thereby, for example, a defective electronic component 9b determined to be defective due to a solder defect or the like can be modified into a non-defective electronic component 9a by applying the modifying member 50 to the mounting portion. Further, by adding the correction member 50 to the portion where the amount of solder is small, it is possible to prevent the chip 27 from coming off after the inspection.
Further, since the correction is automatically performed after the inspection by the inspection unit 3, human error such as forgetting to correct can be suppressed.
Therefore, it is possible to provide the lead frame inspection device 1 that reduces the labor required for inspection.

The order of the short-circuit processing unit 4 and the correction processing unit 40 may be reversed. That is, the correction processing unit 40 may be provided on the upstream side of the transport rail 15 with respect to the short-circuit processing unit 4.
Further, one dispenser may also serve as the short-circuit processing unit 4 and the correction processing unit 40. That is, the inspection device 1 may have one dispenser and may be configured to perform short-circuit processing and correction processing by one dispenser.

In the present embodiment, the connection terminal 28 has a predetermined space in the + Z axis direction on the first terminal 35 side of the electronic component 9 with respect to the second terminal 36 side, and is a connection terminal when viewed from the + Z axis direction. The configuration in which the end portion of the 28 on the first terminal 35 side has a predetermined space in the Z-axis direction with respect to the second terminal 36 side and overlaps with the first terminal 35 has been described as an example. Not limited to. The end of the connection terminal 28 on the first terminal 35 side has a predetermined space in the Z-axis direction with respect to the second terminal 36 side when viewed from the + Z-axis direction, and does not overlap with the first terminal 35. It may be configured. Further, the configuration may be such that it does not have a predetermined interval in the Z-axis direction and does not overlap with the first terminal 35 when viewed from the + Z-axis direction. Further, the connection terminal 28 may not be provided. That is, the conductive member 10 may be configured so that the conductive member 10 can be applied so that the first terminal 35 and the second terminal 36 arranged with a gap via the chip 27 are short-circuited.

Although preferable examples of the present invention have been described above, the present invention is not limited to these examples. It is possible to add, omit, replace, and make other changes to the configuration without departing from the spirit of the present invention. The present invention is not limited by the above description, but only by the appended claims.
Further, it is possible to appropriately replace the constituent elements in the above-described embodiments with well-known constituent elements without departing from the spirit of the present invention, and the above-mentioned modifications may be appropriately combined.

1 Inspection device (lead frame inspection device)
2 Transport mechanism 3 Inspection unit 5 Lead frame 8,48 Dispenser 9 Electronic component 9b Defective electronic component 10 Conductive member 22 Pore hole (gap)
26 Frame 27 Chip 35 First terminal 36 Second terminal 50 Corrective member (conductive member)
R mold area

Claims (5)

A lead frame inspection device in which a plurality of electronic components having a chip mounted between the first terminal and the second terminal are connected via a frame.
Based on the appearance of the lead frame, an inspection unit that inspects the presence or absence of conductive defects in the plurality of electronic components, and an inspection unit.
Among the electronic components, a dispenser for applying a conductive member to a defective electronic component determined to be conductively defective by the inspection unit is provided.
The first terminal and the second terminal are formed with a gap.
The dispenser is characterized in that the conductive member is applied between the first terminal and the second terminal of the defective electronic component to short-circuit between the first terminal and the second terminal. Lead frame inspection device. The lead frame inspection device according to claim 1, wherein the dispenser is coated with the conductive member so as to protrude outside the mold region of the chip in the electronic component. A lead frame inspection device in which a plurality of electronic components having a chip mounted between the first terminal and the second terminal are connected via a frame.
Based on the appearance of the lead frame, an inspection unit that inspects the presence or absence of conductive defects in the plurality of electronic components, and an inspection unit.
Among the electronic components, a dispenser for applying a conductive member to a defective electronic component determined to be conductively defective by the inspection unit is provided.
The dispenser applies the conductive member to the mounting portion of the chip at at least one of the first terminal and the second terminal of the defective electronic components to conduct conduction between the mounting portion and the chip. A lead frame inspection device characterized by. The lead frame inspection device according to any one of claims 1 to 3, wherein the conductive member contains a resin material. A transport mechanism for transporting the lead frame between the inspection unit and the dispenser is provided.
The lead frame inspection device according to any one of claims 1 to 4, wherein the scanning direction of the dispenser intersects with the transport direction of the lead frame.

Images