JP7025499B1 - Laminate molding system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laminated molding system and a laminated molding method capable of satisfactorily performing laminating molding of various laminated molded products.
A laminating molding system 1 is provided in a vacuum laminating device 2 that performs laminating molding in a vacuum chamber C and a post-process of the vacuum laminating device 2, and is provided in a pressure block 317, 318 with a heat-resistant elastomer 322,326. A first press device 3 provided with pressure surfaces 322a and 326a comprising the first press device 3 and a thin metal plate provided on the pressure blocks 417 and 418 via cushioning materials 421 and 424. A second press device 4 provided with pressure surfaces 422a and 425a composed of 422 and 425 is provided.
[Selection diagram] Fig. 1

Description

The present invention relates to a laminating molding system including a vacuum laminating device and a pressing device.

As a laminating molding system equipped with a vacuum laminating device and a pressing device, there are one equipped with one pressing device and one equipped with two pressing devices in the post-process of the vacuum laminating device. Those described in Patent Document 1 and Patent Document 2 are known as those provided with two press devices in the post-process of the vacuum laminating device. Although the names of the members are different between Patent Document 1 and Patent Document 2, both are flexible metals that can be elastically deformed by two press devices in the post-process of the vacuum laminating device via a cushioning material layer on the facing surface of the hot platen. It is provided with a board. The effect of being able to produce a laminate having a smoothed surface at a higher level is described by providing the two press devices.

Japanese Patent Application Laid-Open No. 2002-120100 Japanese Unexamined Patent Publication No. 2020-028980

However, the conventional laminating molding system in which the flexible metal plate is provided on the facing surface of the hot plate on the facing surface of the two presses in the post-process of the vacuum laminating device is capable of laminating and molding all the laminated molded products. There was a problem that it could not be covered well. That is, as an example, when the height of the convex portions of the substrate to be laminated is high or the distance between the convex portions is small, the second pressing device is a pressing device provided with the cushioning material and the flexible metal plate. In some cases, the pressure applied to the resin material of the laminated film embedded in the concave portion between the convex portion and the convex portion of the substrate during pressurization could not be sufficiently applied.

Further, even when the laminated film is a material having poor fluidity at the time of melting, if the second press device is the press device, the laminated film is embedded in the concave portion between the convex portions of the substrate at the time of pressurization. In some cases, it was not possible to sufficiently apply pressure to the resin material. Further, when the convex portion of the substrate to be laminated has brittleness, if the second press device is the press device, an excessive pressing force is applied only to the convex portion of the substrate during pressurization, and the above-mentioned In some cases, problems occurred in the convex parts.

Therefore, an object of the present invention is to provide a laminated molding system and a laminated molding method capable of satisfactorily laminating various laminated molded products.

The laminating molding system of the present invention is a laminating molding system provided with a vacuum laminating device and a pressing device, which is provided in a vacuum laminating device that performs laminating molding in a vacuum chamber and a post-process of the vacuum laminating device, and is provided in a pressure block. A first press device provided with a pressure surface made of a heat-resistant elastomer and a pressure surface made of a thin metal plate provided in a post-process of the first press device, the pressure block via a cushioning material. It is characterized by being equipped with a second press device. Therefore, it is possible to satisfactorily perform laminating molding of various laminated molded products.

The laminated molding system according to claim 2 of the present invention is characterized in that, in claim 1, the first press device and the second press device are pressure controlled at the time of pressurization, respectively. Therefore, the first press device and the second press device can be laminated and molded at an accurate pressure.

The laminated molding system according to claim 3 of the present invention has, in claim 1, that the first press device is pressure-controlled at the time of pressurization, and the second press device is at least an element of position control at the time of pressurization. It is characterized in that control including is performed.

The laminating molding method of the present invention is a laminating molding method using a vacuum laminating device and a pressing device, in which a primary laminating molded product is molded by a vacuum laminating device that performs laminating molding in a vacuum chamber, and the primary laminated molded product is formed. Was sent to a first press device provided with a pressure surface made of a heat-resistant elastomer in the pressure block to be laminated and molded into a secondary laminated molded product, and the secondary laminated molded product was buffered in the pressure block. It is characterized in that it is sent to a second press device provided with a pressure surface made of a thin metal plate via a material to be laminated and molded into a tertiary laminated molded product. Therefore, it is possible to satisfactorily perform laminating molding of various laminated molded products.

The laminating molding method according to claim 5 of the present invention is the laminating molding method according to claim 4, wherein in the vacuum laminating apparatus, a diaphragm is pressed against one surface of the laminated molded product to perform laminating molding, and in the first pressing apparatus. , A pressure surface made of a heat-resistant elastomer is pressed on both sides of the primary laminated molded product to perform laminating molding, and in the second press device, both sides of the secondary laminated molded product are made of elastic metal plates. It is characterized in that laminating molding is performed by pressing the pressure surface.

Therefore, it is possible to satisfactorily perform laminating molding of various laminated molded products in which films are laminated on both sides such as a built-up substrate.

The laminating molding system of the present invention is a laminating molding system provided with a vacuum laminating device and a pressing device, which is provided in a vacuum laminating device that performs laminating molding in a vacuum chamber and a post-process of the vacuum laminating device, and is provided in a pressure block. A first press device provided with a pressure surface made of a heat-resistant elastomer, and a pressure surface provided in a post-process of the first press device, the pressure block provided with a pressure surface made of a thin metal plate via a cushioning material. Since the second press device is provided, it is possible to satisfactorily perform laminating molding of various laminated molded products.

It is a schematic explanatory drawing of the laminated molding system of 1st Embodiment. It is an enlarged view of the main part of the 1st press apparatus of 1st Embodiment. It is an enlarged view of the main part of the 2nd press apparatus of 1st Embodiment. It is the schematic explanatory drawing of the laminated molding system of 2nd Embodiment.

The laminated molding system 1 of the first embodiment of the present invention will be described with reference to FIG. 1 in which the vacuum laminating device 2, the first pressing device 3 and the second pressing device 4 are cross-sectionally displayed. The laminating molding system 1 is provided with two press devices 3 and 4 of a first press device 3 and a second press device 4 in a post-process of the vacuum laminating device 2. Further, the laminating molding system 1 includes a carrier film feeding device 5 in the pre-process of the vacuum laminating device 2, and a carrier film winding device 6 in the post-process of the second press device 4. Further, the laminated molding system 1 includes a control device 7. The control device 7 is connected to a vacuum laminating device 2, a first press device 3, a second press device 4, a carrier film delivery device 5, and a carrier film winding device 6. The control device 7 may be distributed to each device and have a control function.

First, the carrier film delivery device 5 will be described in order from the previous step. The carrier film delivery device 5, which also serves as a transfer device and a tension device for the substrate A1 and the laminated film A2, includes a lower unwinding roll 511 and a driven roll 512. The lower carrier film F1 unwound from the unwinding roll 511 is oriented horizontally at the portion of the driven roll 512. A mounting stage portion 513 on which the substrate A1 and the laminated film A2, which are the materials to be molded, which are stacked and sent from the previous process, are mounted is provided on the portion where the lower carrier film F1 is in the horizontal state. Further, the carrier film delivery device 5 includes an upper unwinding roll 514 and a driven roll 515, and the upper carrier film F2 unwound from the unwinding roll 514 is a portion of the driven roll 515 and is a substrate A1 and a laminated film A2. It is laminated on the laminated molded product A3 made of. The substrate A1 and the laminated film A2 are transferred between the carrier films F1 and F2, and laminated molding is performed via the carrier films F1 and F2 in the vacuum laminating device 2, the first pressing device 3, and the second pressing device 4. By doing so, it is possible to prevent the laminated film A2 from melting and adhering to the device portion, and particularly in the first press device 3 and the second press device 4, the primary laminated molded product A4 and the secondary laminated molding are performed. There is also an advantage that a certain buffering action is imparted when the product A5 is pressurized.

Next, the vacuum laminating device 2 arranged in the subsequent process of the carrier film delivery device 5 will be described. The vacuum laminating device 2 pressurizes the laminated molded product A3 composed of the substrate A1 and the laminated film A2 with a pressurized body such as a diaphragm 211 in the chamber C in a vacuum state (decompressed state), and laminates the laminated molded product A4 on the primary laminated molded product A4. It is to be molded. In the vacuum laminating device 2, the lower plate 213 is provided so as to be able to move up and down with respect to the fixedly provided upper plate 212 by the elevating mechanism 214, and the lower plate 213 including the outer frame rises and comes into contact with the upper plate 212. At the same time, the chamber C can be formed inside. The chamber C is connected to a vacuum pump (not shown) so that the vacuum chamber C can be formed. A hot plate 215 is attached to the lower surface of the center of the upper plate 212, and an elastic sheet 216 such as a heat-resistant rubber film (not shown) is attached to the surface of the hot plate 215. On the other hand, a hot plate 217 is also attached to the upper surface of the center of the lower plate 213. Further, a diaphragm 211 made of a heat-resistant rubber film which is a pressurizing body is attached to a portion of the lower plate 213 around the hot plate 217 so as to cover the upper surface of the hot plate 217. Then, when pressurized air is sent to the back surface side of the diaphragm 211 by a compressor (not shown), the diaphragm 211 swells in the chamber C and pressurizes the substrate A1 and the laminated film A2 between the hot plate 217 and the hot plate 217. The diaphragm 211 of the vacuum stacking device 2 may be mounted on the upper board.

Next, the first press device 3 arranged in the series direction in the subsequent process of the vacuum laminating device 2 will be described. The first press device 3 is a primary laminated molded product in which the laminated material A1 and the laminated film A2, which are pressure-molded by the vacuum laminating device 2 and have uneven portions, and the unevenness remains on the side of the laminated film A2. A4 is further pressurized to be pressure-molded into a flatter secondary laminated molded product A5. The first press device 3 is erected between the substantially rectangular base plate 311 provided below and the vicinity of the four corners of the upper plate 312 which is a substantially rectangular fixed plate located above the base plate 311. It is equipped with a rectangle 313. In the first press device 3, the lower plate 314, which is a substantially rectangular movable plate, can be moved up and down between the base plate 311 and the upper plate 312. Further, the base plate 311 is provided with a pressure cylinder 315 which is a pressure means and is operated by hydraulic pressure, and the ram 316 of the pressure cylinder 315 is fixed to the back surface of the lower plate 314.

The pressurizing cylinder 315 is connected to a hydraulic device (not shown) including a switching valve such as a servo valve and a pump. Further, the pressure cylinder 315 can detect the operating pressure by the pressure sensor. The hydraulic device including the pressure sensor is connected to the control device 7. The pressurizing means of the first press device 3 of the first embodiment may be another type such as a combination of an electric motor and a toggle device. In that case, the pressing force is detected by the force sensor. Further, the first press device 3 may be one in which the upper plate is lowered with respect to the lower plate. Furthermore, the first press device 3 of the first embodiment does not have a chamber that can be evacuated, but has a chamber that can be evacuated and pressurizes in the vacuum chamber. It may be what you do.

Pressurized blocks 317 and 318 are attached to the facing surfaces of the upper plate 312 and the lower plate 314 of the first press device 3, respectively. Next, the pressure block 318 and the like on the lower board 314 side will be described in detail with reference to FIG. In FIG. 2, the thickness with respect to the length of the elastic plate 323 including the elastic sheet 322 is drawn in a deformed shape thicker than the actual one. A heat insulating material 319 is arranged between the lower plate 314 of the first press device 3 and the pressure block 318. Further, a plurality of cartridge heaters 320, which are heating means, are arranged in parallel in the pressurizing block 318. The pressure block 318 or the like, which is also a hot plate, may be provided with a polishing plate or a plate-shaped heater as in Patent Document 1, and is not limited to that of FIG.

The pressure block 318 is provided with a pressure surface 322a made of a heat-resistant elastomer. More specifically, the elastic plate 323 is attached to the smooth surface 318a of the pressure block 318. The elastic plate 323 is formed by attaching an elastic sheet 322 made of fluororubber to the surface 321a of a metal plate 321 made of a thin stainless steel plate. The smooth surface of the elastic sheet 322 of the elastic plate 323 is the pressurized surface 322a. However, the pressurized surface 322a of the elastic sheet 322 may have a predetermined surface roughness. The elastic sheet 322 is attached to the metal plate 321 in the elastic plate 323 by adhesion or baking with a heat-resistant adhesive.

The thickness of the elastic sheet 322 such as the fluororubber sheet in the elastic plate 323 is in the range of 0.2 mm to 6.00 mm, more preferably 0.5 mm to 3.0 mm. Further, the metal plate 321 does not have a great influence on the laminating molding of the primary laminated molded product A4, but an elastically deformable metal plate having a plate thickness of 0.2 mm to 6.00 mm is used. The material of the metal plate 321 may be a metal other than stainless steel.

The elastic plate 323 made of the metal plate 321 and the elastic sheet 322 is provided with holes for bolts (4, 6, 8 and the like) around the elastic plate 323 other than the pressure surface 322a, which are not shown. The elastic plate 323 is attached to the pressure block 318 by inserting a bolt into the hole and engaging the bolt in the bolt hole of the pressure block 318. An adjusting portion for allowing thermal expansion of the elastic plate 323 may be provided in a peripheral portion through which the bolt is inserted.

The elastic sheet 322 attached to the surface of the pressure block 318 or the like of the first press device 3 is preferably as follows. A heat-resistant elastomer is used for the elastic sheet 322, and rubber, which is a thermosetting elastomer, is particularly preferably used. As the rubber, in addition to fluorine rubber (heat resistant temperature 300 ° C), silicon rubber (heat resistant temperature 280 ° C), ethylene vinyl acetate rubber (heat resistant temperature 200 ° C), epichlorohydrin rubber (heat resistant temperature 180 ° C), butyl rubber (heat resistant temperature 150 ° C). And those with a heat resistant temperature of 150 ° C or higher, such as the above-mentioned rubber composite, are used. Therefore, the heat-resistant elastomer of the present invention refers to a heat-resistant elastomer having a heat-resistant temperature of 150 ° C. or higher. In particular, heat-resistant elastomers such as fluororubber and silicon rubber that can handle high temperatures of 250 ° C. or higher are more preferably used. Further, the heat-resistant elastomer may be another thermoplastic elastomer having excellent heat resistance or a thermosetting elastomer. An example is an elastomer containing polyimide.

The elastic sheet 322 is not limited to this, but 30 to 80, more preferably 40 to 70, is used as an example. The elastic sheet 322 may be made of a plurality of heat-resistant elastomer sheets of the same type or different types as long as they have the hardness.

Further, the attachment of the elastic sheet 322 to the pressure block 318 is not limited to the above, and the elastic sheet may be directly attached to the pressure block. Further, as in the second press device 4 described later, a cushioning material made of rubber or resin is attached to the surface of the pressure block, a thin metal plate is attached to the upper surface thereof, and the elastic sheet is attached to the upper surface thereof. It may be worn. In the above case, it is desirable that the thin metal plate has a thickness of 0.2 mm to 3.0 mm and is elastically deformed when pressed.

In the first press device 3 of the first embodiment, the upper plate 312 also has the elasticity of the metal plate 325 and the elastic sheet 326 such as the fluororubber sheet on the upper surface of the pressure block 317 like the lower plate 314. A plate 327 is attached. The surface of the elastic sheet 326 is a pressurized surface 326a. However, in the present invention, at least one of the pressure block 317 on the upper board 312 side and the pressure block 318 on the lower board 314 side has the above structure, or the upper board 312 and the lower board 314 are elastic sheets. The materials and thicknesses of 322 and 326 may be different. Specifically, the uneven portion A1a is provided only on one side of the substrate A1, and when the laminated film A2 is attached only to the side having the uneven portion A1a, the side facing the side having the uneven portion A1a of the substrate A1. A pressure block provided with an elastic sheet may be provided only on the board. However, unlike the build-up board, the board A1 is provided with uneven portions on both sides, and when the laminated film A2 is attached to both sides, the upper board 312 and the lower board of the first press device 3 are attached as shown in FIG. It is desirable that the pressure blocks 317 and 318 of the 314 are provided with elastic sheets 322 and 326 of a heat-resistant elastomer such as a fluororubber sheet.

Next, the second press device 4 arranged in the series direction in the post-process of the first press device 3 will be described. The second press device 4 further pressurizes the secondary laminated molded product A5 laminated and molded by the first press device to press-mold it into a completely flat tertiary laminated molded product A6. The structure of the second press device 4 such as the pressurizing device is substantially the same as that of the first press device 3. That is, it is provided with a tie bar 413 erected between the substantially rectangular base plate 411 provided below and the vicinity of the four corners of the upper plate 412 which is a substantially rectangular fixed plate located above the base plate 411. .. In the second press device 4, the lower plate 414, which is a substantially rectangular movable plate, can be moved up and down between the base plate 411 and the upper plate 412. Further, the base plate 411 is provided with a pressurizing cylinder 415 which is a pressurizing means and is operated by hydraulic pressure, and a ram 416 of the pressurizing cylinder 415 is fixed to the back surface of the lower plate 414.

The pressurizing cylinder 415 is connected to a hydraulic device (not shown) including a switching valve such as a servo valve and a pump. Further, the pressure cylinder 415 can detect the operating pressure by the pressure sensor. Further, a position sensor 423 for measuring the distance between the upper board 412 and the lower board 414, or between the pressure block 417 on the upper board side and the pressure block 418 on the lower board side is provided. The hydraulic device, pressure sensor, position sensor 423, and the like are connected to the control device 7. The pressurizing means of the second press device 4 of the first embodiment may also be of another type such as a combination of an electric motor and a toggle device. In that case, the pressing force is detected by the force sensor. In that case, the rotary encoder attached to the servomotor of the pressurizing means may be a position sensor. Furthermore, the second press device 4 may be one in which the upper plate is lowered with respect to the lower plate.

Pressurized blocks 417 and 418 are attached to the facing surfaces of the upper plate 412 and the lower plate 414 of the second press device 4, respectively. Next, the pressure block 418 and the like on the lower board 414 side will be described in detail with reference to FIG. A heat insulating material 419 is arranged between the lower plate 414 of the second press device 4 and the pressure block 418. Further, a plurality of cartridge heaters 420, which are heating means, are arranged in parallel in the pressurizing block 418.

A sheet-shaped cushioning material 421 is superposed on the smooth surface 418a of the pressure block 418. Examples of the material of the cushioning material 421 include an engineered plastic such as a polyimide film, a resin film of a thermosetting resin, and a rubber sheet such as fluororubber and silicon rubber. A metal thin plate 422 such as a stainless steel thin plate is laminated on the surface of the cushioning material 421. When the cushioning material 421 is a resin film, a material having a hardness (Rockwell R hardness) (ISO 2039-2) of 30 to 140 is also preferably used. When the cushioning material 421 is a rubber sheet, a hardness (shore A hardness) of 40 to 90 is preferably used.

Further, in the first embodiment, only one polyimide film is used as the cushioning material 421, but two or more resin fat films or rubber sheets of the same type or different types may be simply stacked or bonded. The thickness of these cushioning materials 421 is 0.02 mm to 4.00 mm, more preferably 0.05 mm to 2.00 mm.

A thin metal plate 422 is laminated on the surface 421a of the cushioning material 421. In the present embodiment, the metal plate 321 is a thin plate made of stainless steel, and is a mirror surface plate having a smooth surface, which is a pressurized surface 422a. The thickness of the thin metal plate 422 is 0.3 mm to 5.0 mm, more preferably 0.8 mm to 3.0 mm. The material of the thin metal plate 422 is not limited to stainless steel, and may be iron, aluminum, nickel, or an alloy thereof. Further, depending on the molded product, the surface that is the pressurized surface may have a predetermined surface roughness. The cushioning material 421 and the thin metal plate 422 are fixed to the pressure block 418 by bolts or the like (not shown). Further, the cushioning material 421 and the metal thin plate 422 may be detachably provided so that the cushioning material 421 and the metal thin plate 422 can be changed and attached / detached according to the laminated molded product A3 to be laminated.

In the second press device 4 of the first embodiment, the upper plate 412 also includes the same pressure block 417, cushioning material 424, metal thin plate 425, and the pressure surface 425a thereof as the lower plate 414. However, in the present invention, at least one of the pressure block 417 on the upper board 412 side and the pressure block 418 on the lower board 414 side has the above structure, or the cushioning material 421 in the upper board 412 and the lower board 414. The material and thickness of the metal thin plate may be different, or the material and thickness of the thin metal plate may be different. Specifically, the uneven portion A1a is provided only on one side of the substrate A1, and when the laminated film A2 is attached only to the side having the uneven portion A1a, the side corresponding to the side having the uneven portion A1a of the substrate A1. A pressure block provided with a cushioning material and a thin plate made of stainless steel may be provided only on the board. However, the substrate A1 is provided with uneven portions on both sides, and when the laminated film A2 is attached to both sides, the pressure block 417 of the upper plate 412 and the lower plate 414 of the second press device 4 as shown in FIG. It is desirable that 418 is provided with cushioning materials 424 and 421 and thin metal plates 425 and 422.

Next, the carrier film winding device 6 provided in the subsequent process of the second press device 4 will be described. The carrier film winding device 6 also serves as a transfer device and a tension device for the carrier films F1 and F2. The carrier film winding device 6 includes a lower winding roll 611 and a driven roll 612, and the lower carrier film F1 is wound by the winding roll 611. Further, the carrier film winding device 6 includes an upper winding roll 613 and a driven roll 614, and the upper carrier film F2 is peeled off from the tertiary laminated molded product A6 at the portion of the driven roll 614, and the upper carrier film F2 is provided. Is wound on the upper winding roll 613. A take-out stage portion 615 of the tertiary laminated molded product A6 is provided at a portion where only the lower carrier film F1 is fed in a horizontal state. As the transfer device for the carrier films F1 and F2, a transfer device that grips both sides of the carrier films F1 and F2 and pulls them toward a subsequent process may be provided. Further, the transfer device for the laminated molded product A3, the primary laminated molded product A4, the secondary laminated molded product A5, and the tertiary laminated molded product A6 of the laminated molding system 1 is not limited to the above, and may be a transfer device using a multi-axis robot or the like. good. In the laminated molding system 1 of the first embodiment, when further another device such as a cooling press device is provided in the post-process of the second press device 4, the carrier film winding device 6 is after the other device. Provided in the process.

Next, a method for laminating and molding the material to be laminated A1 and the laminated film A2 using the laminating molding system 1 of the first embodiment will be described. In the laminating molding system 1 at the time of continuous molding, laminating molding is simultaneously performed in batch processing by sequence control by the control device 7 in the diaphragm type vacuum laminating device 2, the first pressing device 3, and the second pressing device 4. .. However, here, the molding order of the laminated molded product A3 of the substrate A1 and the laminated film A2, which are the laminated materials for one batch, will be described. Upper and lower carrier films F1 that are unwound from the carrier film delivery device 5 and wound up by the carrier film winding device 6. F2 is not limited to this, but is often made of polyethylene terephthalate (PET) and has a thickness of 0.02 mm to 0.20 mm.

The laminated material A1 mounted on the mounting stage portion 513 of the carrier film delivery device 5 has an uneven portion A1a composed of a convex portion A1b of a copper foil portion adhered to the substrate surface and a concave portion A1c of a portion without copper foil. It is a circuit board for build-up. The thickness of the copper foil (height with respect to the substrate portion) is not limited to this, but is about several um to several tens of um, and is 0.1 mm or less in most cases. Laminated films A2 are laminated on top and bottom of the circuit board A1 to form a laminated molded product A3 for build-up molding. Although one laminated molded product A3 is shown in FIG. 1, a plurality of laminated molded products A3 may be laminated and molded at the same time.

The laminated film A2 in the first embodiment is an insulating film, and the PET film laminated on both sides is peeled off from the original storage state before use. The thickness of the laminated film A2 is not limited to this, but 0.01 mm to 0.1 mm is commercially available and is widely used. Further, the laminated film A2 may be one in which copper foil layers are laminated, and these resin films are also used for laminated molding by the laminated molding system 1 of the present invention.

The laminated molded product A3 mounted on the mounting stage portion 513 is moved together with the upper and lower carrier films F1 and F2 together with the rotational drive of the take-up rolls 611 and 613, and is moved into the chamber C of the vacuum laminating device 2 in the open state. It is sent and positioned. Next, in the vacuum stacking device 2, the chamber C is closed and the pressure is reduced by a vacuum pump (not shown) to form the vacuum chamber C. Then, pressurized air was sent to the back surface side of the diaphragm 211 to inflate the diaphragm 211 into the chamber C, and the laminated molded product A3 composed of the substrate A1 and the laminated film A2 was attached to the hot plate 215 on the upper plate 212 side. Pressurize with the elastic sheet 216. At this time, the pressure applied by the diaphragm 211 (pressure per area applied to the laminated molded product A3) is 1.0 MPa or less as an example, and the laminated film A2 is embedded in the recess A1c of the substrate A1 to form the substrate A1 and the laminated film. A2 is bonded, and the primary laminated molded product A4 is laminated and molded. However, the surface of the laminated film A2 of the primary laminated molded product A4 laminated and molded by the vacuum laminating device is still in a state where unevenness remains following the shape of the uneven portion A1a of the substrate A1. Further, at this time, when the laminated film used has a high content of the inorganic material, the fluidity of the molten resin is low, so that unevenness is more likely to remain.

In the vacuum laminating apparatus 2, the chamber C is opened when the primary laminated molded product A4 composed of the laminated lumber A1 having the uneven portion A1a and the laminated film A2 and to which both are bonded is laminated. Then, the primary laminated molded product A4 is conveyed between the upper plate 312 and the lower plate 314 of the first press device 3 by the feeding of the next carrier films F1 and F2 by the carrier film winding device 6, and a predetermined addition is performed. It is stopped at the compression position. Next, the pressure cylinder 315 of the first press device 3 is operated, and the lower plate 314 and the pressure block 318 are raised. As described above, the elastic sheet 322 such as the fluororubber sheet is attached to the pressure block 318, but the pressure surface 322a of the elastic sheet 322 comes into contact with the lower carrier film F1 and then further lower carrier. The primary laminated molded product A4 is pushed up through the film F1. Then, the primary laminated molded product A4 is brought into contact with the pressure surface 326a of the elastic sheet 326 of the pressure block 317 of the upper plate 312 via the upper carrier film F2.

It is detected by a sensor (not shown) that the lower plate 314 or the like has risen to the contact position, and the pressure control by the pressure cylinder 315 is started in the first press device 3 by the signal sent from the control device 7. At the time of pressure control, the control device 7 performs closed-loop control of a valve such as a servo valve or a pump capable of controlling the rotation speed so that a detection value of a hydraulic sensor (not shown) becomes a set value. As a result, a predetermined pressing force can be applied to the primary laminated molded product A4. Further, the pressure per area applied to the primary laminated molded product A4 varies depending on the material of the substrate A1 and the laminated film A2 and is not limited to this, but is 1.0 MPa to 3.0 MPa, more preferably 1.5 MPa. The set pressure (hydraulic pressure) of the pressurizing cylinder 315 is controlled by the control device 7 so as to be 2.5 MPa.

It is desirable that the set pressure at the time of press molding is gradually increased from the start of pressurization, maintained at a constant pressure, and then lowered in the latter half, but may be changed in multiple stages. If the pressing force during press molding is too strong, the molten resin material constituting the laminated film A2 flows out from the end portion of the primary laminated molded product A4, and pressure molding cannot be performed as well as the temperature condition. Further, if the pressing force is too weak, the laminated film A2 cannot be sufficiently embedded in the substrate A1, and the surface of the secondary laminated molded product A5 may not have sufficient flatness.

Further, the temperature of the pressure blocks 317 and 318 (hot plates) of the first press device 3 at this time is not limited to this because it differs depending on the material of the substrate A1 and the laminated film A2, but is not limited to 80 ° C. to 140. The temperature is controlled to ° C, more preferably 90 ° C to 130 ° C. If the temperature at this time is too high, the viscosity when the resin material constituting the laminated film is melted becomes low and the fluidity becomes too high, and the resin material constituting the laminated film A2 is formed from the end portion of the primary laminated molded product A4. Will flow out and the desired plate thickness and insulating layer thickness of the laminated molded product cannot be obtained. Further, if the temperatures of the pressure blocks 317 and 318 are too high, there are problems that the resin material is deteriorated and the molding cycle time including cooling in the subsequent process is required to be longer. On the other hand, if the temperature of the pressure blocks 317 and 318 during pressurization is too low, the viscosity of the resin material is too high to obtain the desired fluidity, and the laminated film A2 can be sufficiently embedded in the substrate A1. There is a problem that the surface of the secondary laminated molded product A5 is not sufficiently flat.

By laminating and molding the primary laminated molded product A4 by the first press device 3 using the pressurized surfaces 322a and 326a as elastic sheets in this way, for example, the height of the convex portion A1b of the substrate A1 to be laminated. Even when the pressure is high or the distance between the convex portions A1b is small, sufficient pressure is applied to the resin material of the laminated film embedded in the concave portion A1c between the convex portions A1b and the convex portions A1b of the substrate A1. You can. Further, even when the laminated film A2 is a material having poor fluidity at the time of melting, sufficient pressure is applied to the resin material of the laminated film A2 embedded in the portion of the concave portion A1c between the convex portion A1b and the convex portion A1b of the substrate A1. Can be done. Further, even when the convex portion A1b of the substrate A1 has brittleness, it is possible to prevent the convex portion A1b from being defective due to an excessive pressing force applied only to the convex portion A1b. can. Therefore, by using the first press device 3, it is possible to satisfactorily perform laminating molding (secondary molding) of various laminated molded products.

When the secondary laminated molded product A5 is laminated and molded in the first press device 3, the lower plate 314 is lowered. Then, by feeding the next carrier films F1 and F2 by the carrier film winding device 6, the secondary laminated molded product A5 is conveyed between the upper plate 412 and the lower plate 414 of the second press device 4, and a predetermined addition is performed. It is stopped at the compression position. Next, the pressure cylinder 415 of the second press device 4 is operated, and the lower plate 414 and the pressure block 418 are raised. As described above, the metal thin plate 422 is attached to the pressure block 418 via the cushioning material 421. However, after the pressure surface 422a of the metal thin plate 422 comes into contact with the lower carrier film F1, the lower carrier film is further attached. The primary laminated molded product A4 is pushed up via F1. Then, the secondary laminated molded product A5 is brought into contact with the pressure surface 425a of the metal thin plate 425 of the pressure block 417 of the upper plate 312 via the upper carrier film F2.

It is detected by a sensor (not shown) that the lower plate 414 or the like has risen to the contact position, and the position control by the pressure cylinder 315 is started in the first press device 3. At the time of position control, the control device 7 performs closed-loop control of a valve such as a servo valve or a pump capable of controlling the rotation speed so that the detected value of the position sensor 423 becomes a set value. It should be noted that the position control of this embodiment also includes an element of speed control. As a result, the secondary laminated molded product A5 can be pressurized to have a predetermined thickness.

The press control at the time of laminating molding by the second press device 4 may include at least an element of position control. Specifically, the pressure control and the position control may be combined, and in that case, the pressure control may be a feed forward control and the position control may be a closed loop control. Further, the pressure control may be a closed loop control and the position control (speed control) may be a feed forward control.

In the first embodiment, the deformation of the metal thin plates 422 and 425 during pressurization of the second press device 4 is smaller than the elastic deformation of the elastic sheet 322 during pressurization of the first press device 3. Then, when the second press device 4 is pressurized, control including at least a position control element is performed. As a result, the tertiary laminated molded product A6 (finished product) laminated and molded in the second press device 4 has excellent thickness accuracy and surface flatness. Then, when the predetermined pressurizing time ends, the pressurizing cylinder 415 of the second press device 4 operates again and the lower plate 414 descends. Next, the upper and lower take-up rolls 611 and 613 of the carrier film take-up device 6 are rotationally operated, and the tertiary laminated molded product A6 (finished product) is transferred to the take-out stage portion 615, and is transferred to a subsequent process by a transfer device (not shown). It is carried out.

In any case, in the first embodiment, the vacuum laminating device, the first pressing device provided in the post-process of the vacuum laminating device and the pressure block having a pressure surface made of a heat-resistant elastomer, and the above-mentioned Laminating molding of the laminated molded product A3 is performed in three stages of the second pressing device, which is provided in a post-process of the first pressing device and is provided with a pressure surface made of a thin metal plate in a pressure block via a cushioning material. The following effects can be expected. That is, first, it is a primary laminated molded product A4 in which the molten resin is introduced in a form in which air is removed when the resin film A2 is embedded in the recess A1c of the substrate A by the vacuum laminating device. Next, the first press device 3 makes the embedding of the molten resin in the recesses A1c of the substrate A1 of the primary laminated molded product A4 more completely uniform and reduces the unevenness of the surface of the primary laminated molded product A4. It is referred to as a secondary laminated molded product A5. Next, the second press device 4 completely eliminates the unevenness of the surface of the secondary laminated molded product A5 to make it flat, and controls the position so that the plate thickness accuracy is as set.

Depending on the materials such as the elastic sheet 322 and the cushioning material 421 of the first press device 3 and the second press device 4 and the type of the laminated molded product A3, the first press device 3 and the second press device 4 Both may perform pressure control (including only pressure control).

Next, the laminated molding system 8 of the second embodiment shown in FIG. 4 will be described with reference numerals centering on the differences from the laminated molding system 1 of the first embodiment. The pressurizing mechanism of the vacuum laminating device 9 of the laminating molding system 8 of the second embodiment does not use a diaphragm. The pressurizing mechanism of the vacuum laminating device 9 is the same as that of the first press device 3 of the first embodiment, and has a structure including a pressurizing cylinder 915 and the like. The vacuum laminating device 9 has an elastic plate 918 on which a metal plate 916 made of a thin stainless steel plate and an elastic sheet 917 made of fluororubber are integrally attached to the surface of the pressure block 913 attached to the lower plate 912. It is attached. The surface of the elastic sheet 917 is a pressurized surface 917a. Similarly, in the lower plate 912, an elastic plate 921 to which a metal plate 919 made of a thin stainless steel plate and an elastic sheet 920 made of fluororubber are integrally attached is attached to the surface of the pressure block 914. .. The surface of the elastic sheet 920 is a pressurized surface 920a. It is also the same that the lower plate 912 is raised by the operation of the pressure cylinder 915 to perform pressure molding between the pressure surfaces 917a and 920a. Further, the elastic plates 918 and 921 may be interchangeable depending on the type of the laminated molded product A3.

The structural difference between the first press device 3 of the laminating molding system 1 of the first embodiment and the vacuum laminating device 9 of the laminating molding system 8 of the second embodiment is that the vacuum laminating device 9 is the upper plate 911. A side wall portion 922, 923, which is a chamber forming member, is formed on at least one of the lower board 912 and the lower board 912, and a vacuum is formed when the relative distance between the upper board 911 and the lower board 912 approaches due to the rise of the lower board 912 or the like. It is a point that the chamber C is formed. The vacuum stacking device 9 is provided with a vacuum pump (not shown) for creating a vacuum inside the chamber C.

Further, in the post-process of the vacuum laminating device 9, the first pressing device 3 used for the same secondary forming as the laminating forming system 1 of the first embodiment and the second pressing device 4 used for the tertiary forming are arranged in series. It is prepared. Since the structure and variation of the first press device 3 and the second press device 4 used for the tertiary molding are the same as those of the laminated molding system 1 of the first embodiment, the above description of the first embodiment is incorporated. do.

Regarding the laminating molding method using the laminating molding system 8 of the second embodiment, the laminating molding composed of the substrate A1 to be laminated and the laminated film A2 by the vacuum laminating apparatus 9 using the pressure cylinder 915 from the primary molding. Pressurize the object A3. The temperature of the pressure blocks 913 and 914 at this time may be the same as that of the first press device 3, but is higher than that of the first press device 3 in order to improve the fluidity of the laminated film A2 at the time of melting. You may. When raising the temperature of the pressure blocks 913 and 914, it is desirable to raise the temperature within the range of 20 ° C. Then, in the vacuum laminating apparatus 9, the pressure cylinder 915 pressurizes the laminated molded product A3 via the pressure blocks 913, 914 and the elastic sheets 917, 920 such as the fluororubber sheet, and therefore, according to the first embodiment. Primary molding can be performed with a larger pressing force than the vacuum laminating device 2 using the diaphragm 211. Therefore, even when the fluidity of the laminated film A2 at the time of melting is poor, the laminated molding can be performed satisfactorily.

The primary laminated molded product A4 laminated and molded by the vacuum laminating device 9 is sent to the first press device 3 and laminated and molded on the secondary laminated molded product A5 in the same manner as the laminated molding system 1 of the first embodiment. , Is sent to the second press device 4, and is laminated and molded on the tertiary laminated molded product A6. The laminating molding method in the first pressing device 3 and the second pressing device 4 in the laminating molding system 8 of the second embodiment is the same as the laminating molding method of the laminating molding system 1 of the first embodiment. The description of the first embodiment of the above is incorporated.

The first press device 3 and the second press device 4 of the first embodiment and the second embodiment include elastic plates 323,327 including elastic sheet 322,326 such as a fluororubber sheet and cushioning at the time of shipment. Metal thin plates 422,425 such as materials 421,424 and stainless steel thin plates are shipped without being attached, and elastic plates 323,327, cushioning materials 421,424, metal thin plates 422,425, etc. are used at molding factories. It is also expected to be installed. Further, it is assumed that various elastic plates 323,327, cushioning materials 421,424, and metal thin plates 422,425 are replaced for laminating molding, and these forms are also included in the present invention.

Although the present invention is not listed one by one, it is not limited to those of the first embodiment and the second embodiment described above, and those skilled in the art have been modified in view of the gist of the present invention or the first embodiment. Needless to say, it is also applied to the product of the description of the embodiment and the second embodiment. The laminated molded product to be laminated and molded by the laminated molding systems 1 and 8 may be a semiconductor wafer or another plate-like body in addition to the circuit board, and is not limited thereto.

1,8 Laminate molding system 2,9 Vacuum laminating device 3 First press device 4 Second press device 212,312,421,911 Upper board 213,314,414,912 Lower board
317,318,417,418,913,914 Pressurized block 322,326,917,920 Elastic sheet (heat resistant elastomer)
322a, 326a, 422a, 425a, 917a, 920a Pressurized surface 422,425 Metal thin plate A4 Primary laminated molded product A5 Secondary laminated molded product A6 Tertiary laminated molded product

Claims (3)

In a laminating molding system equipped with a vacuum laminating device and a pressing device,
A vacuum laminating device that performs laminating molding in a vacuum chamber,
A first press device provided in a subsequent step of the vacuum laminating device and provided with a pressured surface composed of a thin metal plate and a heat-resistant elastomer laminated in this order toward a direction away from the surface of the pressure block.
It is provided with a second press device provided in a subsequent step of the first press device and provided with a pressure surface in which a cushioning material and a thin metal plate are laminated in this order toward a direction away from the surface of the pressure block. A featured laminated molding system. The laminated molding system according to claim 1, wherein the first press device and the second press device each perform pressure control at the time of pressurization. The laminated molding according to claim 1, wherein the first press device is pressure-controlled at the time of pressurization, and the second press device is controlled to include at least a position control element at the time of pressurization. system.

Images