JP7014695B2 - Conductive materials, molded products and electronic components - Google Patents

Description

The present invention relates to conductive materials, molded products and electronic components.

In recent years, there has been an increasing demand for improving the adhesion between metal and resin. For example, in order to protect metal electronic components such as lead frames and buzz bar modules from factors such as impact, temperature, and humidity, resin molding, resin encapsulation, or molding is performed by solidifying the surface of the electronic components with resin. It may be molded. In such a case, it is necessary that the metal surface of the electronic component and the resin are in close contact with each other with excellent adhesion so that the resin does not peel off during use. In particular, for in-vehicle use, further improvement in adhesion is required due to the progress of digitization around the engine room in a harsh environment.

As a known technique for improving the adhesion between the metal and the resin, Patent Documents 1 to 3 describe the plated surface of the lead frame in order to improve the adhesion between the lead frame and the mold resin in the resin-sealed semiconductor device. A roughening technique has been proposed.

Further, as a recently known technique, Patent Document 4 proposes a technique focusing on the specific surface area and the oxide film thickness of the surface layer in order to improve the adhesion between the metal and the resin.

Japanese Unexamined Patent Publication No. 6-29439 Japanese Unexamined Patent Publication No. 10-27873 Japanese Unexamined Patent Publication No. 2006-93559 International Publication No. 2017/179447

Conventionally, it has been required to clear, for example, JEDEC-LEVEL1 in a high temperature and high humidity test, but in recent years, due to the digitization of automobiles, it is possible to have durability in a harsher environment such as a heat cycle test. There are some situations where the characteristics are not always sufficient with the conventional technology.

The present invention has been made to solve the above problems, and provides a conductive material that exhibits excellent resin adhesion even in a harsh environment.

As a result of diligent studies, the present inventors have found a conductive material that can solve the problem by forming the surface of the resin to be molded or sealed with the metal with a metal and controlling the surface to a predetermined form. I found that I could get it.

The present invention completed based on the above findings is, in one embodiment, a conductive material in which a resin is molded on the surface or the surface is sealed with the resin.
The surface is made of metal and is a conductive material satisfying the following conditions (1) and (2).
(1) Arithmetic mean surface roughness height Sa is 0.25 to 0.4 μm,
(2) The peak density Spd of the mountain is 2.5 million or more per 1 mm ² .

In still another embodiment, the conductive material of the present invention has a maximum surface roughness height Sz of 3.5 to 6.5 μm.

In still another embodiment, the conductive material of the present invention includes a base material and a plating layer formed on the base material, and the surface thereof is the plating layer.

In still another embodiment of the conductive material of the present invention, the base material is made of any one of copper, a copper alloy, aluminum, an aluminum alloy, iron and an iron alloy.

In still another embodiment, the conductive material of the present invention is composed of one or more types of plating layers.

In still another embodiment, the conductive material of the present invention has a first plating layer formed on the substrate, and the first plating layer is a copper, copper alloy, nickel and nickel alloy. It is composed of any of.

In still another embodiment, the conductive material of the present invention has a second plating layer formed on the first plating layer, and the second plating layer is palladium, a palladium alloy, gold and the like. It is composed of any of the gold alloys.

In still another embodiment, the conductive material of the present invention has a total thickness of 1 to 7 μm of the plating layer composed of the one or more types of plating layers.

In still another embodiment, the conductive material of the present invention partially has a surface satisfying the above conditions (1) and (2).

In still another embodiment, the present invention is a molded product provided with the conductive material of the present invention, wherein the surface is molded with a resin or the surface is sealed with a resin.

The present invention is, in yet another embodiment, an electronic component comprising the conductive material of the present invention.

According to the present invention, it is possible to provide a conductive material that exhibits excellent resin adhesion even in a harsh environment.

It is sectional drawing which shows the structure of the conductive material which concerns on Embodiment 1. FIG. It is sectional drawing which shows the structure of the conductive material which concerns on Embodiment 2. It is sectional drawing which shows the structure of the conductive material which concerns on Embodiment 3. FIG.

<Conductive material>
The conductive material according to the embodiment of the present invention is a conductive material in which a resin is molded on the surface or the surface is sealed with a resin, the surface of which is made of metal, and the following (1) and (2). Satisfy the conditions.
(1) Arithmetic mean surface roughness height Sa is 0.25 to 0.4 μm,
(2) The peak density Spd of the mountain is 2.5 million or more per 1 mm ² .

Conventionally, regarding the adhesion between metal and resin, the line roughness (Rz, Ra) of the metal was controlled, but the parameter that controls the adhesion with resin in electronic parts used in more harsh environments. Is not enough. On the other hand, although the details will be described later, in the present invention, by introducing Sa and Spd specified in the International Organization for Standardization ISO25178-2: 2012 as the roughness on the surface, the adhesion to the resin is better than before. Can now be controlled.

Since the conductive material according to the embodiment of the present invention may be formed of one kind of metal material, the details may be described later because at least the surface thereof may be made of metal. It may be formed separately into.

The arithmetic mean surface roughness height Sa of the surface of the conductive material according to the embodiment of the present invention is controlled to 0.25 to 0.4 μm. If the Sa of the surface of the conductive material is less than 0.25 μm, the anchor effect becomes insufficient due to insufficient roughening of the surface, and the adhesion to the resin is lowered. When Sa on the surface of the conductive material is more than 0.4 μm, the tip portion formed by roughening the surface of the conductive material is likely to break. The Sa on the surface of the conductive material is preferably 0.27 to 0.38 μm, more preferably 0.3 to 0.35 μm.

When the metal surface of the conductive material according to the embodiment of the present invention is in close contact with the resin, the coefficient of thermal expansion of the resin is larger than that of the metal, so that it is necessary to suppress the thermal expansion of the resin by a metal anchor. In the present invention, the peak density Spd of the surface of the conductive material is controlled to 2.5 million or more per 1 mm ² to solve the problem of the difference in the coefficient of thermal expansion from the resin. If the Spd on the surface of the conductive material is less than 2.5 million pieces per 1 mm ² , the anchor effect becomes insufficient, and the difference in the coefficient of thermal expansion may be lost and peeling from the resin may occur. Further, if the Spd on the surface of the conductive material is too large, the anchor density becomes too high, and it becomes difficult for the resin to enter the gap between the anchors, which may lead to a decrease in the adhesion strength. From such a viewpoint, the Spd on the surface of the conductive material is not particularly limited because it exerts an effect in combination with the Sa, but it is preferably 5.5 million or less per 1 mm ² . Further, the Spd on the surface of the conductive material is preferably 2.6 to 6 million pieces per 1 mm ² , and more preferably 3 to 5.5 million pieces per 1 mm ² .

The maximum surface roughness height Sz (ISO25178-2: 2012) of the surface of the conductive material according to the embodiment of the present invention is preferably 3.5 to 6.5 μm. If the Sz on the surface of the conductive material is less than 3.5 μm, the anchor effect becomes insufficient due to insufficient roughening of the surface, and the adhesion to the resin is lowered. If the Sz on the surface of the conductive material is more than 6.5 μm, it may be difficult for the resin to enter the gap between the heights of the surface of the conductive material. The Sa on the surface of the conductive material is preferably 3.7 to 6.0 μm, more preferably 4.5 to 5.0 μm.

The conductive material according to the embodiment of the present invention is not particularly limited as long as the surface is at least metal, and includes the following three patterns (embodiments 1 to 3).

Embodiment 1 relating to the composition of a conductive material
FIG. 1 is a schematic cross-sectional view showing the structure of the conductive material 10 according to the first embodiment of the present invention. The conductive material 10 is made of a metal material and has a surface 11 that satisfies the above conditions (1) and (2). An enlarged view of the dotted frame 12 portion of FIG. 1 is shown in the right figure. The right figure of FIG. 1 shows an example of the roughened surface of the conductive material 10, and is not limited to the roughened surface having such a shape. According to such a configuration, since the material constituting the conductive material is one kind of metal material, the manufacturing efficiency or the manufacturing cost is good. The metal material of the conductive material 10 can be made of, for example, copper, copper alloy, aluminum, aluminum alloy, iron, iron alloy, nickel, nickel alloy, palladium, palladium alloy, gold or gold alloy. Further, among the metal and the resin, the resin has a larger coefficient of thermal expansion. At this time, if the thermal conductivity of the metal (metal material of the conductive material 10) that adheres to the resin is high, the heat trapped in the resin can be efficiently dissipated. As a result, the thermal expansion of the resin can be suppressed. From this point of view, the conductivity proportional to the thermal conductivity of the metallic material of the conductive material 10 is preferably 10% IACS or more.

For the conductive material 10, a predetermined metal material is prepared, and the surface of the metal material is subjected to an etching treatment, a blast treatment, or a transfer treatment using a rolling roll having an uneven surface, whereby (1) and (2) above. ) Satisfy the condition of). As the etching treatment, for example, an etching solution commercially available from each company such as CZ8101 (product name) manufactured by MEC Co., Ltd., CPE900 (product name) manufactured by Mitsubishi Gas Chemical Company Ltd., and NR1870 (product name) manufactured by MEC COMPANY Ltd. is used. It can be used to control a predetermined shape. As the etching method, various methods such as an immersion type, a spray type, and an electrolytic type can be adopted.

Embodiment 2 relating to the composition of a conductive material
FIG. 2 is a schematic cross-sectional view showing the structure of the conductive material 20 according to the second embodiment of the present invention. The conductive material 20 includes a base material 22 and a plating layer 23 formed on the base material 22, and the surface 21 satisfying the above conditions (1) and (2) is the plating layer 23. An enlarged view of the dotted frame 24 portion of FIG. 2 is shown in the right figure. The right figure of FIG. 2 shows an example of the roughened surface of the conductive material 20, and is not limited to the roughened surface having such a shape. According to such a configuration, the surface satisfying the above conditions (1) and (2) can be controlled by the plating layer, and the thickness of the surface (surface layer, that is, the plating layer) can be easily controlled. ..

The base material 22 may be made of a resin, or may be made of any metal such as copper, a copper alloy, aluminum, an aluminum alloy, iron and an iron alloy. Further, the base material 22 may be made of the same type of metal as the metal of the plating layer 23. The plating layer 23 may be made of any one of copper, a copper alloy, nickel and a nickel alloy. Further, if the thermal conductivity of the metal (base material 22 of the conductive material 20) that indirectly adheres to the resin is high, the heat trapped in the resin can be efficiently dissipated. As a result, the thermal expansion of the resin can be suppressed. From such a viewpoint, the conductivity proportional to the thermal conductivity of the base material 22 of the conductive material 20 is preferably 10% IACS or more.

As the conductive material 20, a base material 22 made of a predetermined material is prepared, and a plating layer 23 is formed on the base material 22 under predetermined plating conditions. At this time, by controlling the plating conditions such as the composition of the plating bath, the plating temperature, the current density, and the plating thickness, the surface 21 satisfying the above conditions (1) and (2) can be formed.

Embodiment 3 relating to the composition of a conductive material
FIG. 3 is a schematic cross-sectional view showing the configuration of the conductive material 30 according to the third embodiment of the present invention. The conductive material 30 is composed of a base material 32 and two types of plating layers (first plating layer 33 and second plating layer 34). The first plating layer 33 is formed on the base material 32, the second plating layer 34 is formed on the first plating layer 33, and the surface 31 satisfying the above conditions (1) and (2) is the second plating. Layer 34. An enlarged view of the dotted frame 35 portion of FIG. 3 is shown in the right figure. The right figure of FIG. 3 shows an example of the roughened surface of the conductive material 30, and is not limited to the roughened surface having such a shape. According to such a configuration, the surface satisfying the above conditions (1) and (2) can be controlled by the plating layer, and the thickness of the surface (surface layer, that is, the plating layer) can be easily controlled. .. Further, the multi-layered plating layer can be manufactured at a good cost and efficiency.

The base material 32 may be made of a resin, or may be made of any metal such as copper, a copper alloy, aluminum, an aluminum alloy, iron and an iron alloy. Further, the base material 32 may be made of the same type of metal as the metal of the first plating layer 33. The first plating layer 33 may be made of any one of copper, a copper alloy, nickel and a nickel alloy. The second plating layer may be composed of any of palladium, a palladium alloy, gold and a gold alloy. When the conductive material 30 is, for example, a lead frame, the surface of the second plating layer (the outermost surface of the conductive material 30) is plated with a noble metal in this way to improve solderability and realize low contact resistance. can. Further, if the thermal conductivity of the metal (base material 32 of the conductive material 30) that indirectly adheres to the resin is high, the heat trapped in the resin can be efficiently dissipated. As a result, the thermal expansion of the resin can be suppressed. From such a viewpoint, the conductivity proportional to the thermal conductivity of the base material 32 of the conductive material 30 is preferably 10% IACS or more.

As the conductive material 30, a base material 32 formed of a predetermined material is prepared, a first plating layer 33 is formed on the base material 32 under predetermined plating conditions, and then a second plating layer 34 is formed. .. At this time, by controlling the plating conditions such as the composition of the plating bath, the plating temperature, the current density, and the plating thickness, the surface 31 satisfying the above conditions (1) and (2) can be formed. For example, by controlling the plating conditions such as the composition of the plating bath, the plating temperature, the current density, and the plating thickness, the first plating layer 33 satisfying the above conditions (1) and (2) is formed, and such a first plating layer 33 is formed. A thin second plating layer 34 is formed on the plating layer 33. As a result, the surface profile of the second plating layer 34 becomes substantially equal to the surface profile of the first plating layer 33. In this way, the surface 31 satisfying the above conditions (1) and (2) may be formed.

The plating layer may be formed of one layer or two layers as in the second or third embodiment, or may be formed of three layers or four or more layers. Further, the outermost surfaces of the conductive materials 10, 20 and 30 of the first to third embodiments shall be treated with a phosphoric acid ester-based treatment liquid or the like as long as the above conditions (1) and (2) are satisfied. Then, the function related to the antioxidant of the plating may be imparted. Further, if necessary, a sealing treatment for suppressing corrosion due to plating pinholes may be applied.

In the conductive material according to the embodiment of the present invention, the total thickness of the plating layers composed of one or more types of plating layers is preferably 1 to 7 μm. If the total thickness of the plating layers is less than 1 μm, the surface roughened shape may not be sufficiently formed, and the diffusion of the base material components may easily proceed. If the total thickness of the plating layers is more than 7 μm, cracks may easily occur in the plating layer of the conductive material during press working or bending.

The conductive material according to the embodiment of the present invention may partially have a surface satisfying the above conditions (1) and (2). When the entire surface of the conductive material satisfies the above conditions (1) and (2), the resin is easily removed from the portion where the resin does not need to be adhered because the surface is partially provided. can do. As an example, since the surface is partially provided, the resin (burr) leaked from the target location can be easily removed. Further, since a surface having a roughened shape that satisfies the above conditions (1) and (2) has a characteristic that the wire bonding property is deteriorated, the wire bonding property can be improved by partially providing the surface. Deterioration can be suppressed. The partially provided surface may be striped, spot-shaped, or even ring-shaped.

<Use of conductive materials>
The use of the conductive material according to the embodiment of the present invention is not particularly limited, but it can be used as a material for electronic parts that require good adhesion to a resin, and is particularly protected from factors such as impact, temperature, and humidity. Therefore, it can be used as a material for electronic parts to be subjected to resin molding, resin encapsulation, mold molding, etc., in which the surface is hardened with a resin. Examples of the electronic component include metal electronic components such as lead frames and buzz bar modules. The conductive material according to the embodiment of the present invention has a very high adhesion between the surface of the conductive material and the resin even if it is a molded product in which the surface is resin-molded, resin-sealed, or molded. Therefore, good durability can be expected even when used as a material for electronic parts used in a harsh environment such as around an in-vehicle engine room.

Hereinafter, both examples and comparative examples of the present invention will be shown, but these are provided for a better understanding of the present invention, and are not intended to limit the present invention.

<Manufacturing of conductive material>
As Examples 1 to 14, 17 to 21, Conventional Example 1 and Comparative Examples 1 to 2, surface plating was formed on the surface of the base material as shown in Table 1. Further, as Examples 15 to 16 and Conventional Example 2, as shown in Table 1, base plating and surface plating were formed on the surface of the base material to prepare a test piece of a conductive material. The area of each base material was 50 mm × 50 mm, and the plate thickness was 0.4 mm. The types of base materials shown in Table 1 are as follows.
C11000: 99.9% Cu
C10200: 99.9% Cu
C19400: Cu-2.2% Fe-0.15% Zn-0.03% P
C70250: Cu-3% Ni-0.65% Si-0.15% Mg
A5052: Al-2.5Mg-0.4% Fe-0.25% Si-0.25% Cr-0.1% Cu-0.1% Mn-0.1% Zn
42 Alloy: Fe-42% Ni

As a pretreatment condition before each plating, for each substrate other than A5052, after performing cathode electrolytic degreasing at 5 A / dm ² for 60 seconds in an alkaline degreasing bath containing 50 g / L of sodium hydroxide, 10%. It was pickled with a pickling solution of sulfuric acid and ammonium fluoride 50 g / L for 30 seconds, and the process proceeded to each plating step.

In A5052, cathode electrolytic degreasing was carried out at 5 A / dm ² for 10 seconds in the alkaline degreasing bath, then pickled with a pickling solution of 10% sulfuric acid and 50 g / L of ammonium fluoride for 10 seconds, and then water. In a zinc replacement bath containing 50 g / L of sodium oxide, 5 g / L of zinc oxide, 2 g / L of ferric chloride, and 50 g / L of Rochelle salt, the bath temperature was 25 ° C. and the treatment time was 10 seconds. Zinc substitution was carried out, and the above-mentioned pickling and zinc substitution were repeated once again to move to each plating step.

Each plating treatment was performed by electroplating by adjusting the composition of the plating bath, the temperature of the plating solution, the current density and the plating time. Table 2 shows the electroplating conditions used in Examples 1 to 5, respectively. The plating bath components had a Ni metal content of 130 g / L, boric acid of 25 g / L, and a pH of 3.3. Here, the Ni metal component is composed of nickel sulfamate tetrahydrate and Ni chloride as Ni salts. More specifically, nickel sulfamate tetrahydrate: Ni (NH ₂ SO ₃ ) _{2.4H 2 O} = 294 g / L (about 300 g / L), Ni amount 53.5 g / L, nickel chloride hexahydrate Japanese product: NiCl _{2.6H 2 O} = about 310 g / L, and the amount of Ni is 76.5 g / L.

The surface plating of Examples 6 to 14 and 17 to 20, Conventional Example 1 and Comparative Examples 1 to 2, and the base plating and surface plating of Examples 15 to 16 were used in Table 2 of Examples 1 to 5. It was formed by adjusting the composition of the plating bath, the temperature of the plating solution, the current density and the plating time, and the degree of stirring based on the plating conditions. At this time, the plating conditions used in Table 2 of Examples 1 to 5 and the evaluation results described later were referred to so that Sa, Spd, and Sz on the surface of the test piece of the conductive material had desired values. In addition, the adjustment of each plating condition was performed based on the following findings.
Film thickness: As the film thickness increases, the crystal grains grow preferentially in the film thickness direction (the growth rate in the film thickness direction is faster than in the horizontal direction), so that Sa and Sz increase. On the other hand, with respect to Spd, since adjacent crystals are likely to coalesce, a maximum value of about 5 μm is taken, and the film thickness beyond that tends to decrease.
Plating solution type: By increasing the chlorine concentration in the plating solution, that is, the Ni chloride concentration, the crystals tend to be sharpened and the surface irregularities become large, so that Sa, Sz, and Spd increase, respectively.
Plating liquid temperature: When the liquid temperature of the plating bath is high, the crystals grow isotropically and the crystal grains tend to become large, so that Sa, Sz, and Spd increase respectively. On the other hand, when the temperature exceeds 60 ° C, grain grain coarsening progresses, and the maximum value is eventually lowered at around 55 ° C.
Current density: As the current density increases, the number of nucleations increases, so it is possible to consider the case where the film thickness is thin and the case where the film thickness is thick. There is a difference at about 3 μm, and if the current density is 3 μm or less, Sa and Sz tend to be smaller due to the priority of fine precipitation, and Spd becomes larger because the number of each generation increases and the number of protrusions increases. There is a tendency. On the other hand, when the film thickness is thick, Sa and Sz tend to increase due to the same factor as the above-mentioned film thickness increase, and on the other hand, adjacent crystals tend to coalesce and Spd decreases.
In Conventional Example 2, a test piece of a conductive material was produced under the following conditions based on the examples of Patent Document 3. Specifically, in the Ni plating of Conventional Example 2, nickel sulfate is 260 g / L, nickel chloride is 50 g / L, boric acid is 35 g / L, pH 4.5, bath temperature is 50 ° C., and current density is 5 A / dm ² . It was manufactured under the condition that the plating time was 200 seconds.
Further, for Au plating described in Examples 15 and 16 and Conventional Example 2, predetermined gold potassium cyanide is 20 g / L, potassium citrate is 50 g / L, pH 5, bath temperature is 60 ° C., and current density is 1 A / dm ² . In Pd plating, 20 g / L of diamminedichloropalladium as a Pd component, 75 g / L of ammonium chloride, pH 9, bath temperature 40 ° C., current density 1.5 A / It was produced by adjusting the plating time so as to have a predetermined film thickness at dm ² . The plating thickness of Conventional Example 2 was 1 μm.
To check the plating thickness, use a fluorescent X-ray film thickness meter (SFT9500 manufactured by Hitachi High-Tech) for any 5 points, and calculate the average value at a collimator diameter of 0.2 mm and each film thickness measurement time of 30 seconds. did.

For Example 21, 6 μm of Ni plating was performed under the same conditions as in Example 1, and then etching was performed under the following conditions until the Ni plating thickness became 5 μm.
・ Etching conditions Etching liquid: NR1870 manufactured by MEC, etching liquid temperature: 25 ° C, etching time: 30 seconds

<Evaluation>
-Sa, Spd, Sz on the surface
The Sa, Spd, and Sz on the surface of the test piece of the conductive material were measured using a laser microscope (VK-X150) manufactured by KEYENCE Corporation with an observation magnification of 1000 times, a spot diameter of φ0.8 mm, and a measurement area of 100 μm × 100 μm. The average value of the five measurements (N5) was calculated and used as the Sa, Spd, and Sz values on the surface of the test piece of the conductive material.

・ Share strength (initial)
The shear strength was measured by a pudding cup mold test using a resin-molded sample on the surface of a test piece of a conductive material as a sample. The test conditions were resin: GE-7470LA resin manufactured by Hitachi Kasei Co., Ltd., area of the bottom of the pudding cup: 10 mm ² , resin molding time: 120 seconds, mold cure: 175 ° C. for 8 hours, and 10 shear force measurements (N10). The average value of was calculated and used as the share strength (initial). The share was measured with a bond tester (Series 4000) manufactured by Daige Co., Ltd. at a share speed of 100 μm / sec. The evaluation criteria are as follows.
◎: 20 kg or more 〇: 15 kg or more and less than 20 kg ×: less than 15 kg

・ Share strength (high temperature and high humidity test)
Further, the sample prepared as described above was left to stand in an environment of a temperature of 85 ° C. and a humidity of 85% for 168 hours, and then the share strength was measured in the same manner. The evaluation criteria are as follows.
◎: No peeling 〇: Peeling rate less than 20% ×: Peeling rate 20% or more The peeling rate is the ratio of the surface of the conductive material and the resin peeling from the image obtained by ultrasonic flaw detection. Calculated and evaluated.

・ Share strength (heat cycle test)
Further, the sample prepared as described above was held at 125 ° C. for 30 minutes and then held at −40 ° C. for 30 minutes as one cycle, and this was repeated for 500 consecutive cycles. Then, the share strength was measured in the same manner. The evaluation criteria are as follows.
⊚: No peeling 〇: Peeling rate less than 10% △: Peeling rate 10% or more and less than 20% ×: Peeling rate 20% or more From the image obtained by ultrasonic flaw detection, which is the surface of the conductive material and the resin? It was calculated and evaluated whether it was peeled off at such a rate.
The above test conditions and evaluation results are shown in Tables 1 and 2.

In Examples 1 to 21, since the surface of the conductive material satisfied the following conditions (1) and (2), the share strengths of both the initial and high temperature and high humidity tests were very good, and the heat cycle test was performed. It was found that the share strength of No. 1 had an evaluation standard of △, 〇, or ◎, and showed excellent resin adhesion even in a harsh environment.
(1) Arithmetic mean surface roughness height Sa is 0.25 to 0.4 μm,
(2) The peak density Spd of the mountain is 2.5 million or more per 1 mm ^2. In both Conventional Examples 1 and 2 and Comparative Examples 1 and 2, the surface of the conductive material is at least one of the conditions (1) and (2) above. At least the share strength of the heat cycle test was poor because it did not meet the above requirements.

10, 20, 30 Conductive material 11, 21, 31 Surface 12, 24, 35 Dotted line frame 22, 32 Base material 23 Plating layer 33 First plating layer 34 Second plating layer

Claims (11)

A conductive material that forms a resin on the surface or seals the surface with a resin.
A conductive material whose surface is made of metal and which satisfies the following conditions (1) and (2).
(1) Arithmetic mean surface roughness height Sa is 0.25 to 0.4 μm,
(2) The peak density Spd of the mountain is 2.5 million or more per 1 mm ² . The conductive material according to claim 1, wherein the maximum surface roughness height Sz of the surface is 3.5 to 6.5 μm. The conductive material comprises a substrate and a plating layer formed on the substrate.
The conductive material according to claim 1 or 2, wherein the surface is the plating layer. The conductive material according to claim 3, wherein the base material is made of any one of copper, a copper alloy, aluminum, an aluminum alloy, iron and an iron alloy. The conductive material according to claim 3 or 4, wherein the plating layer is composed of one or more types of plating layers. The conductivity according to claim 5, wherein the plating layer has a first plating layer formed on the substrate, and the first plating layer is made of any one of copper, a copper alloy, nickel and a nickel alloy. material. The sixth aspect of claim 6, wherein the plating layer has a second plating layer formed on the first plating layer, and the second plating layer is made of any of palladium, a palladium alloy, gold, and a gold alloy. Conductive material. The conductive material according to any one of claims 5 to 7, wherein the total thickness of the plating layers composed of the one or more types of plating layers is 1 to 7 μm. The conductive material according to any one of claims 1 to 8, which partially has a surface satisfying the conditions of (1) and (2). The molded product provided with the conductive material according to any one of claims 1 to 9, wherein a resin is molded on the surface or the surface is sealed with the resin. An electronic component comprising the conductive material according to any one of claims 1 to 9.

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