JP7001056B2 - 蓄電デバイス用外装材、及び蓄電デバイス用外装材の製造方法 - Google Patents
蓄電デバイス用外装材、及び蓄電デバイス用外装材の製造方法 Download PDFInfo
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- JP7001056B2 JP7001056B2 JP2018531957A JP2018531957A JP7001056B2 JP 7001056 B2 JP7001056 B2 JP 7001056B2 JP 2018531957 A JP2018531957 A JP 2018531957A JP 2018531957 A JP2018531957 A JP 2018531957A JP 7001056 B2 JP7001056 B2 JP 7001056B2
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Description
図1は、本発明の蓄電デバイス用外装材の一実施形態を模式的に表す断面図である。図1に示すように、本実施形態の外装材(蓄電デバイス用外装材)10は、基材層11と、該基材層11の一方の面側に設けられた基材保護層12と、該基材層11の基材保護層12とは反対側に設けられた接着層13と、該接着層13の基材層11とは反対側に設けられた、両面に腐食防止処理層15a,15bを有する金属箔層14と、該金属箔層14の接着層13とは反対側に設けられたシーラント接着層16と、該シーラント接着層16の金属箔層14とは反対側に設けられたシーラント層17と、が積層された積層体である。ここで、腐食防止処理層15aは金属箔層14の接着層13側の面に、腐食防止処理層15bは金属箔層14のシーラント接着層16側の面に、それぞれ設けられている。外装材10は、基材保護層12が最外層、シーラント層17が最内層である。すなわち、外装材10は、基材保護層12を蓄電デバイスの外部側、シーラント層17を蓄電デバイスの内部側に向けて使用される。以下、各層について説明する。
基材層11は、蓄電デバイスを製造する際のシール工程における耐熱性を付与し、成型加工や流通の際に起こりうるピンホールの発生を抑制する役割を果たす。特に大型用途の蓄電デバイスの外装材の場合等は、耐擦傷性、耐薬品性、絶縁性等も付与できる。
基材保護層12は、基材層11の一方の面側に設けられる層であって、ポリエステル樹脂と、ポリイソシアネート化合物(硬化剤)とを用いて形成される層である。すなわち、基材保護層12は、ポリエステル樹脂及びポリイソシアネート化合物を含む原料の硬化物である。
接着層13は、基材層11と金属箔層14とを接着する層である。接着層13は、基材層11と金属箔層14とを強固に接着するために必要な密着力を有すると共に、冷間成型する際において、基材層11によって金属箔層14が破断されることを抑制するための追随性(部材が変形・伸縮したとしても、剥離することなく部材上に接着層13を確実に形成するための性能)も有する。
黄色:イソインドリノン、イソインドリン、キノフタロン、アントラキノン(フラバトロン)、アゾメチン、キサンテン等。
橙色:ジケトピロロピロール、ペリレン、アントラキノン、ペリノン、キナクリドン等。
赤色:アントラキノン、キナクリドン、ジケトピロロピロール、ペリレン、インジゴイド等。
紫色:オキサジン(ジオキサジン)、キナクリドン、ペリレン、インジゴイド、アントラキノン、キサンテン、ベンツイミダゾロン、ビオランスロン等。
青色:フタロシアニン、アントラキノン、インジゴイド等。
緑色:フタロシアニン、ペリレン、アゾメチン等。
白色:亜鉛華、鉛白、リトポン、二酸化チタン、沈降性硫酸バリウム、バライト粉等。
赤色:鉛丹、酸化鉄赤等。
黄色:黄鉛、亜鉛黄(亜鉛黄1種、亜鉛黄2種)等。
青色:ウルトラマリン青、プロシア青(フェロシアン化鉄カリウム)等。
黒色:カーボンブラック等。
金属箔層14としては、アルミニウム及びステンレス鋼等の各種金属箔が挙げられ、防湿性及び延展性等の加工性、並びにコストの面から、金属箔層14はアルミニウム箔であることが好ましい。アルミニウム箔は耐ピンホール性及び成形時の延展性に優れる点から、鉄を含むアルミニウム箔であることが好ましい。
腐食防止処理層15a,15bは、電解液、又は、電解液と水分の反応により発生するフッ酸による金属箔層14の腐食を抑制する役割を果たす。また、腐食防止処理層15aは、金属箔層14と接着層13との密着力を高める役割を果たす。また、腐食防止処理層15bは、金属箔層14とシーラント接着層16との密着力を高める役割を果たす。腐食防止処理層15a及び腐食防止処理層15bは、同一の構成の層であってもよく、異なる構成の層であってもよい。
シーラント接着層16は、腐食防止処理層15bが形成された金属箔層14とシーラント層17を接着する層である。外装材10は、シーラント接着層16を形成する接着成分によって、熱ラミネート構成とドライラミネート構成に大きく分けられる。
シーラント層17は、外装材10に対し、ヒートシールによる封止性を付与する層であり、蓄電デバイスの組み立て時に内側に配置されて熱融着される層である。シーラント層17としては、ポリオレフィン系樹脂、又はポリオレフィン系樹脂に無水マレイン酸等の酸をグラフト変性させた酸変性ポリオレフィン系樹脂からなる樹脂フィルムが挙げられる。ポリオレフィン系樹脂としては、例えば、低密度、中密度及び高密度のポリエチレン;エチレン-αオレフィン共重合体;ポリプロピレン;並びに、プロピレン-αオレフィン共重合体等が挙げられる。共重合体である場合のポリオレフィン樹脂は、ブロック共重合体であってもよく、ランダム共重合体であってもよい。これらポリオレフィン系樹脂は、1種を単独で使用してもよく、2種以上を併用してもよい。
次に、外装材10の製造方法について説明する。なお、外装材10の製造方法は以下の方法に限定されない。
工程S11:金属箔層14の一方の面上に腐食防止処理層15aを形成し、金属箔層14の他方の面上に腐食防止処理層15bを形成する工程。
工程S12:腐食防止処理層15aの金属箔層14とは反対側の面と、基材層11とを、接着層13を介して貼り合わせる工程。
工程S13:基材層11の接着層13とは反対側の面に基材保護層12を形成する工程。
工程S14:腐食防止処理層15bの金属箔層14とは反対側の面上に、シーラント接着層16を介してシーラント層17を形成する工程。
工程S11では、金属箔層14の一方の面上に腐食防止処理層15aを形成し、金属箔層14の他方の面上に腐食防止処理層15bを形成する。腐食防止処理層15a及び15bは、それぞれ別々に形成されてもよく、両方が一度に形成されてもよい。具体的には、例えば、金属箔層14の両方の面に腐食防止処理剤(腐食防止処理層の母材)を塗布し、その後、乾燥、硬化、焼付けを順次行うことで、腐食防止処理層15a及び15bを一度に形成する。また、金属箔層14の一方の面に腐食防止処理剤を塗布し、乾燥、硬化、焼き付けを順次行って腐食防止処理層15aを形成した後、金属箔層14の他方の面に同様にして腐食防止処理層15bを形成してもよい。腐食防止処理層15a及び15bの形成順序は特に制限されない。また、腐食防止処理剤は、腐食防止処理層15aと腐食防止処理層15bとで異なるものを用いてもよく、同じのものを用いてもよい。上記腐食防止処理剤としては、例えば、塗布型クロメート処理用の腐食防止処理剤等を用いることができる。腐食防止処理剤の塗布方法は、特に限定されないが、例えば、グラビアコート法、グラビアリバースコート法、ロールコート法、リバースロールコート法、ダイコート法、バーコート法、キスコート法、コンマコート法等の方法を用いることができる。なお、金属箔層14として、未処理の金属箔層を用いてもよいし、ウェットタイプの脱脂処理又はドライタイプの脱脂処理により、脱脂処理を施した金属箔層を用いてもよい。
工程S12では、腐食防止処理層15aの金属箔層14とは反対側の面と、基材層11とが、接着層13を形成する接着剤を用いてドライラミネーションで貼り合わせられる。工程S13では、接着性の促進のため、室温~100℃の範囲でエージング(養生)処理を行ってもよい。エージング時間は、例えば、1~10日である。
工程S13では、基材層11の接着層13とは反対側の面に基材保護層12を形成する。まず、基材保護層12を形成するための原料(塗液:溶剤にて希釈したポリエステル樹脂に対しポリイソシアネート化合物を配合したもの)を準備する。この時、塗工安定性を付与させるため、当該原料にレベリング剤、消泡剤などの各種安定剤を配合しても構わない。また塗工後のブロッキングを防止し、塗液の反応化を促進するため、各種触媒を配合しても構わない。その際、塗液のポットライフ制御のため、反応遅延剤を配合しても構わない。この時好適に使われるのはアセチルアセトン等である。次いでこの塗液を、公知の手法を用いて基材層11上に塗工し、加熱乾燥する。このような塗工手法としては、グラビアダイレクト、グラビアリバース(ダイレクト、キス)、バーコーター等が挙げられる。なお、上記記載のフィラーを配合する場合は、予めフィラーが溶媒中に分散したスラリーをワニス化した樹脂に混ぜてもよく、あるいはすでにワニス化された樹脂塗液中にフィラーを直接分散させてもよい。これらのフィラー配合液に、硬化剤等のその他の添加剤を配合させることも可能である。なお、基材保護層12を形成するタイミングは、本実施の形態に限定されない。
工程S13後、基材保護層12、基材層11、接着層13、腐食防止処理層15a、金属箔層14及び腐食防止処理層15bがこの順に積層された積層体の腐食防止処理層15bの金属箔層14とは反対側の面上に、シーラント接着層16を介してシーラント層17が形成される。シーラント層17は、ドライラミネーション及びサンドイッチラミネーション等によって積層されてもよく、シーラント接着層16とともに共押出し法によって積層されてもよい。シーラント層17は、接着性向上の点から、例えばサンドイッチラミネーションによって積層される、又は、シーラント接着層16とともに共押出し法によって積層されることが好ましく、サンドイッチラミネーションによって積層されることがより好ましい。
次に、外装材10を容器として備える蓄電デバイスについて説明する。蓄電デバイスは、電極を含む電池要素と、上記電極から延在するリードと、電池要素を収容する容器とを備え、上記容器は蓄電デバイス用外装材10から、シーラント層17が内側となるように形成される。上記容器は、2つの外装材をシーラント層17同士を対向させて重ね合わせ、重ねられた外装材10の周縁部を熱融着して得られてもよく、また、1つの外装材を折り返して重ね合わせ、同様に外装材10の周縁部を熱融着して得られてもよい。本実施形態の外装材は、様々な蓄電デバイスにおいて使用可能である。そのような蓄電デバイスとしては、例えば、リチウムイオン電池、ニッケル水素電池、及び鉛蓄電池等の二次電池、並びに電気二重層キャパシタ等の電気化学キャパシタが挙げられる。
金属箔層14として、厚さ35μmの軟質アルミニウム箔8079材(東洋アルミニウム株式会社製)を準備した。次いで、金属箔層14の片面に、グラビアコートにより、溶媒として蒸留水を使用し、かつ固形分濃度10質量%に調整したポリリン酸ナトリウム安定化酸化セリウムゾル(腐食防止処理剤)を塗布した。このとき、酸化セリウム100質量部に対して、リン酸は10質量部とした。次いで、腐食防止処理剤を乾燥、焼付け処理を行うことで腐食防止処理層15aを形成した。
基材層11及び基材保護層12の構成を表1に記載のとおりとしたこと以外は、実施例1と同様にして蓄電デバイス用外装材10を作製した。なお、比較例7及び8以外は、ポリエステル樹脂とポリイソシアネートとの混合割合を変えてTgを調整した。比較例7及び8については、Tg60℃の芳香族ポリエステルポリオールに代えて、Tg20℃の芳香族ポリエステルポリオールを用いてTgを調整した。
(実施例8~11)
基材保護層形成用塗布液に、形成される基材保護層12の全質量に対する含有量が10質量%となるように下記のシリカフィラー又はアクリルフィラーを含有させたこと、そして基材層11及び基材保護層12の構成を表1に記載のとおりとしたこと以外は、実施例1と同様にして蓄電デバイス用外装材10を作製した。
シリカフィラー:平均粒子径3μm(表面に疎水性処理を施したもの)
アクリルフィラー:平均粒子径3μm
各例で得られた外装材の基材保護層12上に、微量の水(1500ppm)を添加した電解液(エチレンカーボネート/ジメチルカーボネート/ジエチルカーボネート=1:1:1wt%、LiPF6、1M)を滴下し、10分間経過後にイソプロピルアルコールで拭き取った。その後、滴下箇所の外観を以下の基準に従って評価した。結果を表2に示す。
○:電解液を滴下した痕跡が認識できなかった。
△:電解液を滴下した痕跡が認識できた。
×:電解液が基材層に達し、基材層が溶解した。
各例で得られた外装材について、深絞り成型が可能な成型深度を以下の方法で評価した。まず、蓄電デバイス用外装材10を、シーラント層17が上方を向くように成型装置内に配置した。成型装置の成型深さを0.25mmごとに1.0~3.5mmに設定し、室温23℃、露点温度-35℃の環境下で冷間成型した。なお、パンチ金型には、70mm×80mmの長方形の横断面を有し、底面に1.00mmのパンチラジアス(RP)を有し、側面に1.00mmのパンチコーナーラジアス(RCP)を有するものを使用した。また、ダイ金型には、開口部上面に1.00mmのダイラジアス(RD)を有するものを使用した。冷間成型を行った部分の破断及びピンホールの有無を、外装材にライトを照射しながら目視にて確認し、破断及びピンホールのいずれも生じることなく深絞り成型できた成型深度の最大値を求めた。また、成型深度について以下の基準に従って評価した。結果を表2に示す。
○:成型深度が3.0mm以上であった。
△:成型深度が2.5mm以上3.0mm未満であった。
×:成型深度が2.5mm未満であった。
各例で得られた外装材について、成型装置の成型深さを3.5mmで固定したこと以外は、成型深度の評価と同様にして冷間成型した。このような冷間成型体を各例について30サンプル準備し、10サンプルずつ高温環境(110℃)、高温高湿環境(60℃95%RH)、及び高温水環境(50℃温水)に一週間放置した。そして、各環境毎に、基材層11及び金属箔層間においてデラミネーションが発生したサンプル数をカウントし、以下の基準に従って評価した。結果を表2に示す。
○:0サンプル。
△:1~3サンプル。
×:4~10サンプル。
Claims (6)
- 少なくとも基材保護層、基材層、接着層、金属箔層、シーラント接着層、及びシーラント層をこの順に備え、
前記基材保護層が、ポリエステル樹脂及びポリイソシアネート化合物を含む原料の硬化物であり、
前記基材保護層のガラス転移温度(Tg)が100~140℃であり、
前記基材保護層の厚さが1~5μmであり、
前記基材層の厚さに対する前記基材保護層の厚さの割合が35%以下である、
蓄電デバイス用外装材。 - 前記金属箔層の一方又は両方の面に腐食防止処理層をさらに備える、請求項1に記載の蓄電デバイス用外装材。
- 前記基材層の厚さに対する前記基材保護層の厚さの割合が3.5%以上である、請求項1又は2に記載の蓄電デバイス用外装材。
- 前記原料がさらにフィラーを含む、請求項1~3のいずれか一項に記載の蓄電デバイス用外装材。
- 前記基材層がポリアミドフィルムである、請求項1~4のいずれか一項に記載の蓄電デバイス用外装材。
- 金属箔層の一方の面に、接着層を介して基材層を貼り合わせる工程、
前記基材層の前記接着層とは反対側の面に基材保護層を形成する工程、及び
前記金属箔層の前記接着層とは反対側の面に、シーラント接着層を介してシーラント層を形成する工程、を備え、
前記基材保護層が、ポリエステル樹脂及びポリイソシアネート化合物を含む原料の硬化物であり、
前記基材保護層のガラス転移温度(Tg)が100~140℃であり、
前記基材保護層の厚さが1~5μmであり、
前記基材層の厚さに対する前記基材保護層の厚さの割合が35%以下である、
蓄電デバイス用外装材の製造方法。
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