JP6990121B2 - Board processing equipment - Google Patents

Description

The present invention relates to a semiconductor wafer, a liquid crystal display substrate, a plasma display substrate, an organic EL substrate, a FED (Field Emission Display) substrate, an optical display substrate, a magnetic disk substrate, an optical magnetic disk substrate, and a photomask. The present invention relates to a substrate processing apparatus that heat-treats various substrates (hereinafter, simply referred to as substrates) such as substrates and substrates for solar cells.

Conventionally, as this kind of device, a heat treatment plate that heats a mounted substrate, a cover member that surrounds the upper part of the heat treatment plate and is configured to be able to move up and down with respect to the heat treatment plate and forms a heat treatment atmosphere by the heat treatment plate. A position for adjusting the distance between the housing surrounding the heat treatment plate and the cover member, the top plate provided between the ceiling surface of the cover member and the upper surface of the heat treatment plate, and the lower surface of the top plate and the upper surface of the heat treatment plate. Some are provided with an adjusting member (see, for example, Patent Document 1).

In such a substrate processing apparatus, the gas in the housing is discharged. Specifically, an exhaust pipe for exhausting gas from the inside of the housing and a pressure sensor for detecting the pressure in the exhaust pipe are provided, and exhaust control is performed based on the pressure measured by the pressure sensor. The pressure sensor measures the pressure through a sampling port provided in the exhaust pipe. Specifically, one end side of the sampling tube is attached to the opening communicating with the exhaust pipe, and the pressure sensor is attached to the other end side. The opening formed in the exhaust pipe is in a state where the opening is exposed when the opening is viewed from the gas flow direction in the exhaust pipe.

Japanese Unexamined Patent Publication No. 2000-3843

However, in the case of the conventional example having such a configuration, there are the following problems.
That is, recently, due to the microfabrication process, an underlayer film called a coated carbon film may be formed. The formation of this underlayer film is performed by high-temperature heat treatment, and at that time, a gas containing a sublimation substance is generated from the underlayer film. In a substrate processing device configured like a conventional device, sublimation substances adhere to the periphery of the opening, and the sublimation substances gradually accumulate so as to close the opening, which hinders pressure detection. .. Therefore, there is a problem that the exhaust pressure in the exhaust pipe cannot be measured accurately.

The present invention has been made in view of such circumstances, and an object of the present invention is to provide a substrate processing apparatus capable of accurately measuring the exhaust pressure in an exhaust pipe even if the gas contains a sublimated substance.

The present invention has the following configuration in order to achieve such an object.
That is, according to the first aspect of the present invention, in a substrate processing apparatus that heats a substrate, a heat treatment plate on which the substrate is placed and the substrate is heated, and a heat treatment plate covering the upper part of the heat treatment plate is used for heat treatment. A housing that forms an atmosphere, an exhaust pipe that exhausts gas in the housing, an exhaust pipe opening that is formed in the exhaust pipe and communicates with the inside of the exhaust pipe, and an exhaust pipe opening that is provided in the exhaust pipe opening. A sampling port for detecting the exhaust pressure in the exhaust pipe and a pressure sensor for measuring the exhaust pressure through the sampling port are provided, and the sampling port is inside the exhaust pipe at the exhaust pipe opening. When the opening is viewed from the intersection of the opening communicating with the opening, the gas flow direction in the exhaust pipe, and the extension line of the central axis of the opening, the opening is opened so that the opening cannot be seen. The inside of the exhaust pipe is covered and at least one of the directions orthogonal to both the gas flow direction in the exhaust pipe and the central axis of the opening and the downstream side of the opening in the gas flow direction of the exhaust pipe. It is characterized by having a rectifying plate provided so as to communicate with the opening.

[Action / Effect] According to the invention according to claim 1, the sampling port is provided in the exhaust pipe opening of the exhaust pipe for exhausting the gas from the housing covering the upper part of the heat treatment plate, and the exhaust in the exhaust pipe is exhausted. The pressure is measured by a pressure sensor installed via the sampling port. This sampling port is provided with a rectifying plate that covers the opening so that the opening cannot be seen when the opening is viewed from the intersection of the gas flow direction in the exhaust pipe and the extension line of the central axis of the opening. .. This rectifying plate is further inside the exhaust pipe at least one of the directions orthogonal to both the gas flow direction in the exhaust pipe and the central axis of the opening, and downstream of the opening in the gas flow direction of the exhaust pipe. Since the openings are provided so as to communicate with each other, the exhaust pressure can be measured by the pressure sensor. Therefore, although the sublimated material contained in the gas adheres to and accumulates on the upstream side of the straightening vane, it can be prevented from accumulating on the opening and closing the opening. As a result, the exhaust pressure in the exhaust pipe can be accurately measured even if the gas contains a sublimated substance.

Further, in the present invention, the rectifying plate is moved from the upstream side to the downstream side of the exhaust pipe when viewed from a direction orthogonal to both the gas flow direction in the exhaust pipe and the central axis of the opening. It is preferable to have an inclined surface in which the distance from the opening gradually increases toward the direction (claim 2).

In the pipe facing the opening, a straightening vane having an inclined surface whose distance from the opening gradually increases from the upstream side to the downstream side is arranged, so that the sublimated material contained in the exhaust is mainly the sublimated material. It adheres to the inclined surface and accumulates. Further, since the opening communicates with the exhaust pipe in the direction orthogonal to the gas flow direction or on the downstream side in the gas flow direction, the pressure amount sensor can accurately measure the exhaust pressure via the sampling port.

Further, in the present invention, the rectifying plate has a triangular cross section when viewed from a direction orthogonal to both the gas flow direction in the exhaust pipe and the central axis of the opening, and the apex thereof is an internal angle thereof. It is preferable that the side is attached so as to face the opening (claim 3).

In the exhaust pipe facing the opening, a straightening vane is arranged like a triangular roof, and the inclined surface thereof faces the gas flow direction. Therefore, the sublimated material contained in the exhaust mainly adheres to and deposits on the inclined surface facing upstream and downstream thereof. Further, since the opening communicates with the exhaust pipe in a direction orthogonal to both the gas flow direction and the central axis of the opening, the pressure sensor can accurately measure the exhaust pressure through the sampling port.

Further, in the present invention, the block body having the opening formed therein and the attachment tool for attaching and detaching the block body to the exhaust pipe so that the opening faces the exhaust pipe opening are provided. The rectifying plate is preferably attached to the exhaust pipe opening side of the block body (claim 4).

Since the block body can be removed from the exhaust pipe by removing the fixture, even if the sublimated material adheres to the opening, it can be easily removed by maintenance. Therefore, by performing regular maintenance, the accuracy of the exhaust pressure can be maintained for a long period of time.

Further, in the present invention, the block body is formed with a measuring tube mounting portion communicating with the opening on the opposite surface of the opening, and one end side is arranged on the measuring tube mounting portion of the block body. It is preferable to provide a measuring tube in which the pressure sensor is arranged on the other end side, and a measuring tube mounting tool for detachably attaching one end side of the measuring tube to the measuring tube mounting portion (claim 5). ).

When the measuring tube attachment is removed, the measuring tube can be removed from the block body, so that even if the sublimated material adheres to the inside of the measuring tube, it can be easily removed by maintenance. Therefore, by performing regular maintenance, the accuracy of the exhaust pressure can be maintained for a long period of time.

According to the substrate processing apparatus according to the present invention, the sampling port is provided at the exhaust pipe opening of the exhaust pipe that exhausts the gas from the housing that covers the upper part of the heat treatment plate, and the exhaust pressure in the exhaust pipe is the sampling port. It is measured by a pressure sensor attached via. This sampling port is provided with a rectifying plate that covers the opening so that the opening cannot be seen when the opening is viewed from the intersection of the gas flow direction in the exhaust pipe and the extension line of the central axis of the opening. .. This rectifying plate is further inside the exhaust pipe at least one of the directions orthogonal to both the gas flow direction in the exhaust pipe and the central axis of the opening, and downstream of the opening in the gas flow direction of the exhaust pipe. Since the openings are provided so as to communicate with each other, the exhaust pressure can be measured by the pressure sensor. Therefore, although the sublimated material contained in the gas adheres to and accumulates on the upstream side of the straightening vane, it can be prevented from accumulating on the opening and closing the opening. As a result, the exhaust pressure in the exhaust pipe can be accurately measured even if the gas contains a sublimated substance.

It is a schematic block diagram which shows the whole structure of the substrate processing apparatus which concerns on Example. It is a top view of a movable top plate. It is a vertical cross-sectional view which shows the vicinity of the tip of the elevating pin. It is a vertical sectional view which shows the pressure detection unit. It is the figure which looked at the pressure detection unit from the inside of an exhaust pipe. It is the figure which looked at the pressure detection unit from the outside of the exhaust pipe. It is a vertical cross-sectional view which shows the state which carries out and carries out a substrate. It is a vertical sectional view which shows the state which heats a substrate. It is a vertical sectional view which shows the 1st modification of a straightening vane. It is a vertical sectional view which shows the 2nd modification of a straightening vane.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a schematic configuration diagram showing an overall configuration of a substrate processing apparatus according to an embodiment, FIG. 2 is a plan view of a movable top plate, and FIG. 3 is a vertical cross-sectional view showing the vicinity of the tip of an elevating pin. Is.

The substrate processing apparatus 1 according to the embodiment heat-treats the substrate W. Specifically, for the microfabrication process, for example, heat treatment is performed when forming an underlayer film called a coated carbon film. In order to form this underlayer film, heat treatment is performed at a high temperature of about 300 to 500 ° C.

The substrate processing device 1 includes a lower base plate 3, a water-cooled base plate 5, a heat treatment plate 7, a movable top plate unit 9, an elevating pin unit 11, a housing 13, and a shutter unit 15.

In this substrate processing device 1, the substrate W is carried in from an adjacently arranged transfer arm 17, and after being heat-treated, the processed substrate W is carried out by the transfer arm 17.

In the lower base plate 3, a support column 19 is erected on the upper surface thereof, and a water-cooled base plate 5 is arranged on the upper surface thereof. The water-cooled base plate 5 suppresses the heat transfer of the heat treatment plate 7 downward. Specifically, in the water-cooled base plate 5, for example, a refrigerant flow path 21 through which a refrigerant can flow is formed therein. For example, cooling water is circulated as a refrigerant in the refrigerant flow path 21. The cooling water is, for example, temperature-controlled to 20 ° C.

The heat treatment plate 7 has a circular shape in a plan view. Its diameter is slightly larger than the diameter of the substrate W. The heat treatment plate 7 has a built-in heating means such as a heater (not shown), and is heated so that the surface temperature becomes 400 ° C., for example. The heat treatment plate 7 is arranged in a state of being separated upward from the water-cooled base plate 5 by a support column 23 provided between the lower surface thereof and the upper surface of the water-cooled base plate 5. In the heat treatment plate 7, a through hole 25 is formed at a position corresponding to each apex of an equilateral triangle in a plan view.

A movable top plate unit 9 is attached to the heat treatment plate 7. The movable top plate unit 9 includes an elevating base plate 27, an elevating mechanism 29, a support column 31, and a movable top plate 33.

The elevating base plate 27 is provided with an opening for avoiding interference with the support column 23 and the elevating pin 41 described later. The elevating mechanism 29 is composed of, for example, an air cylinder. The elevating mechanism 29 is attached in close contact with the water-cooled base plate 5 in a posture in which the portion having the operating shaft is directed upward. The elevating mechanism 29 can fix the height of the tip of the operating shaft at an arbitrary position. The elevating mechanism 29 has its operating shaft connected to the bottom surface of the elevating base plate 27. By raising and lowering the operating shaft of the raising and lowering mechanism 29, the height position of the raising and lowering base plate 27 can be changed. For example, four columns 31 are erected on the upper surface of the elevating base plate 27. A movable top plate 33 is attached to the upper ends of the four columns 31.

As shown in FIG. 2, the movable top plate 33 has an opening 35 formed in the central portion in a plan view. The opening 35 is formed to be smaller than the diameter of the substrate W in a plan view. The movable top plate 33 moves up and down together with the elevating base plate 27 by operating the elevating mechanism 29. The elevating position of the movable top plate 33 is moved over a descending position when the substrate W is heat-treated and an ascending position when the substrate W is carried in. As for the descending position, it is preferable that the distance between the upper surface of the substrate W and the lower surface of the movable top plate 33 is about 10 mm. This is because experiments by the inventors have found that this distance is preferable in order to improve the in-plane uniformity of the temperature distribution on the surface of the substrate W.

The movable top plate 33 has a rectangular shape whose diagonal length is longer than the diameter of the heat treatment plate 7. The upper ends of the four columns 31 are connected to the four corners on the lower surface of the movable top plate 33. The four corners of the movable top plate 33 correspond to positions far from the heat treatment plate 7 having a circular shape in a plan view, which is a heat source. Therefore, even if the movable top plate 33 is heated by the radiant heat of the heat treatment plate 7, the heat cannot be easily transferred to the support column 31. Therefore, the elevating mechanism 29 is not easily affected by heat, and the occurrence of failure can be suppressed.

The movable top plate 33 described above is preferably made of ceramic or an alloy of metal and ceramic. As a result, even if high-temperature heat treatment is performed, deformation due to heat can be prevented.

The elevating pin unit 11 includes a drive mechanism 37, an elevating ring 39, and three elevating pins 41. It should be noted that only two elevating pins 41 are drawn due to the relationship shown in the figure.

The drive mechanism 37 is composed of, for example, an air cylinder. The drive mechanism 37 is attached in a state where the portion having the operating shaft thereof is directed downward and the opposite side is in close contact with the lower surface of the water-cooled base plate 5. An elevating ring 39 is connected to the lower part of the operating shaft. Three elevating pins 41 are erected on the upper surface of the elevating ring 39. The drive mechanism 39 has the height position of the operating shaft, the transfer position (two-dot chain line in FIG. 1) in which the three elevating pins 41 project upward from the upper surface of the heat treatment plate 7, and the three elevating pins 41. Is adjustable over two locations from the top surface of the heat treatment plate 7 to the treatment position (solid line in FIG. 1) immersed downward. The three elevating pins 41 are inserted into the three through openings 25 formed in the heat treatment plate 7.

The elevating pin 41 is preferably configured as shown in FIG. The elevating pin 41 includes a core portion 41a, an outer cylinder 41b, and a quartz ball 41c. In the core portion 41a, the tip portion 41e corresponding to the upper portion of the body portion 41d is formed to have a smaller diameter than the body portion 41d. The outer cylinder 41b is formed to have an inner diameter slightly larger than the outer diameter of the quartz ball 41c except for the tip portion. The tip of the outer cylinder 41b is formed to have an inner diameter smaller than the diameter of the quartz ball 41c. The quartz ball 41c is formed so that its diameter is slightly smaller than that of the tip portion 41e. Therefore, when the quartz ball 41c is placed on the upper surface of the tip portion 41e and covered with the outer cylinder 41b, about 1/3 of the quartz ball 41c is in a state of protruding from the outer cylinder 41b. In this state, by press-fitting the engaging pin 41g into the through port 41f penetrating the core portion 41d and the outer cylinder 41b, the outer cylinder 41b is fixed to the core portion 41a together with the quartz ball 41c to form the elevating pin 41. To. The members other than the quartz ball 41c are made of metal.

Quartz is suitable as a material that can withstand a high temperature environment, but it is difficult to make the entire elevating pin 41 made of quartz in consideration of strength and cost. Therefore, as described above, the cost can be suppressed by making only the quartz ball 41c at the tip portion made of quartz. Further, since quartz has a slightly lower altitude than the single crystal silicon which is the material of the substrate W, there is less risk of damaging the lower surface of the substrate W, and since it is spherical, the contact area can be minimized. ..

The housing 13 covers the upper part of the heat treatment plate 7 to form a heat treatment atmosphere by the heat treatment plate 7. The housing 13 is formed with a carry-in outlet 43 on one side thereof. The carry-in outlet 43 is opened upward from a height position near the upper surface of the heat treatment plate 7. The transport arm 17 carries in and out the substrate W through the carry-in / out port 43.

A shutter unit 15 is attached to the carry-in outlet 43. The shutter unit 15 includes a drive mechanism 45 and a shutter body 47. A part of the drive mechanism 45 is attached to the water-cooled base plate 5 in a posture in which a portion of the operating shaft thereof is directed upward. A shutter body 47 is connected to the upper part of the operating shaft. When the drive mechanism 45 extends the operating shaft, the shutter body 47 is raised and the carry-in outlet 43 is closed (solid line shown in FIG. 1), and when the drive mechanism 45 contracts the operating shaft, the shutter body 47 is lowered. The carry-in outlet 43 is opened (two-dot chain line shown in FIG. 1).

The housing 13 has an exhaust port 49 formed on the ceiling surface thereof. The exhaust port 49 is communicated with the exhaust pipe 51. The distance between the exhaust port 49 of the housing 13 and the upper surface of the heat treatment plate 7 is, for example, about 30 mm. The exhaust pipe 51 is communicated with the exhaust equipment 52. The exhaust equipment 52 is configured so that the exhaust flow rate can be adjusted by an instruction from the outside. A pressure detection unit 53 is arranged in a part of the exhaust pipe 51. The pressure detection unit 53 detects the exhaust pressure in the exhaust pipe 51. The detailed configuration of the pressure detection unit 53 will be described later.

The housing 13 is provided with a sheathed heater 55 along the upper surface of the exhaust pipe 51. The sheathed heater 55 heats the housing 13 and the exhaust pipe 51, and when the gas containing the sublimated material touches the housing 13, the gas is cooled and the sublimated material adheres to the inner wall of the housing 13. To prevent.

The control unit 61 is composed of a CPU and a memory (not shown). The control unit 61 controls the temperature of the heat treatment plate 7, elevating control of the movable top plate unit 9, driving control of the elevating pin unit 11, opening / closing control of the shutter unit 15, temperature control of the sheathed heater 55, and exhaust based on the pressure detection unit 53. Exhaust control of equipment 52 is performed. Further, the control unit 61 can variously operate the lowering position in the raising / lowering control of the movable top plate unit 9 according to the substrate W. For example, a recipe that defines processing conditions and procedures for each substrate W is set to specify the lowering position of the movable top plate 33, and an instruction unit (not shown) is operated to control the movable top plate 33 from the surface of the substrate W. Instruct the recipe in advance of the parameters corresponding to the distance. For example, when processing the substrate W, the control unit 61 operates the elevating mechanism 29 according to the parameter with reference to the recipe corresponding to the substrate W instructed by the device operator. Thereby, the lowering position of the movable top plate 33 can be adjusted for each substrate W.

Here, a detailed configuration of the pressure detection unit 53 will be described with reference to FIGS. 4 to 6. 4 is a vertical cross-sectional view showing the pressure detection unit, FIG. 5 is a view of the pressure detection unit from the inside of the exhaust pipe, and FIG. 6 is a view of the pressure detection unit from the outside of the exhaust pipe. Is.

The pressure detection unit 53 includes a sampling port 71, a measuring tube 73, and a pressure sensor 75.

The sampling port 71 communicates and connects the inside of the exhaust pipe 51 with the measuring pipe 73 and the pressure sensor 75. Specifically, the sampling port 71 is configured as follows.

The sampling port 71 is formed in the exhaust pipe 51 and is attached to the exhaust pipe opening 77 communicated with the inside of the exhaust pipe 51. The sampling port 71 includes a block body 79, an opening 81, a fixture 83, and a straightening vane 85.

The block body 79 is formed with an opening 81. The block body 79 has a plate-like appearance, and an opening 81 is formed near the center. The opening 81 penetrates the front and back surfaces (left and right surfaces of FIG. 4) of the block body 79. The opening 81 is formed with a measuring tube mounting portion 87 having an inner diameter on the right side in FIG. 4 slightly larger than the inner diameter on the left side. A recess 89 for the attachment 83 is formed at the upper and lower ends of the surface (right side) of the block body 79 near the center. A fixture 83 is attached to the recess 89, and the block body 79 is attached to the exhaust pipe 51 so that the opening 81 faces the exhaust pipe opening 77 and the block body 79 covers the exhaust pipe opening 77. ing. The fixture 83 is exemplified by, for example, a hexagon screw.

In the block body 79, a straightening vane 85 is attached so as to straddle the opening 81 from the upstream side to the downstream side of the opening 81 in the gas flow direction (indicated by an arrow in FIGS. 4 to 6) in the exhaust pipe 51. There is. When the opening 81 is viewed from the intersection of the gas flow direction in the exhaust pipe 51 and the extension line of the central axis of the opening 81, the rectifying plate 85 cannot see the opening 81 as shown in FIG. It is arranged so as to cover the opening 81 so as to cover the opening 81. Further, the straightening vane 85 is provided so that the opening 81 communicates with the inside of the exhaust pipe 51 in the direction orthogonal to both the gas flow direction in the exhaust pipe 51 and the central axis of the opening 81 (FIG. 4). Has been done.

More specifically, the cross section seen from the direction orthogonal to both the gas flow direction in the exhaust pipe 51 and the central axis of the opening 81 (FIG. 4) has a triangular shape. Then, the apex is attached so that the inner angle side thereof faces the opening 81. That is, the straightening vane 85 prevents the opening 81 from being seen when the sampling port 71 side is viewed from the viewpoint on the axis on which the gas flows from the upstream side to the downstream side with respect to the opening 81 in the exhaust pipe 51. It has become. In other words, when viewed from the direction orthogonal to both the gas flow direction in the exhaust pipe 51 and the central axis of the opening 81 shown in FIG. 4, a communication space 91 communicating with the opening 81 is formed. .. In this case, the communication space 91 has a triangular vertical cross section, and when viewed from the direction shown in FIG. 4, the communication space 91 opens from the upstream side to the downstream side in the gas flow direction up to the central axis of the opening 81. The distance from the section 81 to the rectifying plate 85 gradually increases.

One end side of the measuring tube 73 is inserted into the measuring tube mounting portion 87 of the block body 79. The measuring tube 73 is fixed by a tube clamp 93 attached to a surface of the block body 79 on the opposite side of the exhaust pipe 51. As shown in FIG. 6, the tube clamp 93 includes bifurcated clamp pieces 93a and 93b, and a clamp hole 93c formed between the clamp pieces 93a and 93b. By screwing the clamp screw 95 screwed into only one of the clamp pieces 93a and 93b, the clamp pieces 93a and 93b approach each other and measure by sandwiching the outer peripheral surface of the measuring tube 73 inserted into the clamp hole 93c. Fix the tube 73. Further, by loosening the clamp screw 95, the clamp pieces 93a and 93b are separated from each other, the outer peripheral surface of the measuring tube 73 is opened from the clamp hole 93c, and the measuring tube 73 can be removed.

A pressure sensor 75 is attached to the other end side of the measuring tube 73. The pressure sensor 75 measures the exhaust pressure of gas in the exhaust pipe 51 via the measuring pipe 73, the opening 81, and the communication space 91. The exhaust pressure measured by the pressure sensor 75 is given to the control unit 61.

The tube clamp described above corresponds to the "measurement tube mounting tool" in the present invention.

Next, the processing of the substrate W by the substrate processing apparatus having the above-described configuration will be described with reference to FIGS. 7 and 8. 7 is a vertical cross-sectional view showing a state in which the substrate is carried in and out, and FIG. 8 is a vertical cross-sectional view showing a state in which the substrate is heated.

First, as shown in FIG. 7, the control unit 61 operates the movable top plate unit 9 to move the movable top plate 33 to the ascending position. Further, the control unit 61 operates the elevating pin unit 11 to raise the three elevating pins 41 to the delivery position. Along with these operations, the control unit 61 operates the shutter unit 15 to open the carry-in / outlet 43.

Then, the control unit 61 enters the transfer arm 17 from the carry-in outlet 43 in a state where the transfer arm 17 is higher than the transfer position and lower than the lower surface of the movable top plate in the ascending position, and the transfer arm 61 is placed above the heat treatment plate 7. 17 is lowered. As a result, the substrate W is passed to the elevating pin 41 at the delivery position. Then, the transport arm 17 is retracted from the carry-in / exit 43, and the shutter unit 15 is operated to close the carry-in / out port 43.

Next, as shown in FIG. 8, the control unit 61 operates the elevating pin unit 11 to lower the three elevating pins 41 to the processing position. As a result, the substrate W is heat-treated at 400 ° C. The control unit 61 refers to the recipe and causes the heat treatment to be performed over a specified heating time.

After a predetermined heating time elapses, the control unit 61 operates the movable top plate unit 9 and the elevating pin unit 11 to raise the movable top plate 33 to the ascending position and raise the elevating pin 41 to the delivery position. Next, the control unit 61 operates the shutter unit 15 to open the carry-in / outlet 43. Further, the control unit 61 causes the transfer arm 17 to enter the carry-in / outlet 43 from a height below the delivery position and above the upper surface of the heat treatment plate 7. Then, by raising the transfer arm 17 to a position higher than the transfer position and lower than the lower surface of the movable top plate 33, the transfer arm 17 receives the processed substrate W from the elevating pin 41. Next, the processed substrate W is carried out by moving the transport arm 17 out of the carry-in / out 43. The control unit 61 operates the exhaust equipment 52 based on the exhaust pressure in the exhaust pipe 51 detected by the pressure detection unit 53 during the above-mentioned processing, and the exhaust flow rate in the exhaust pipe 51 according to the processing status. Is controlled to be a predetermined value.

The heat treatment for one substrate W is completed by the above series of operations, but when processing the new substrate W, the control unit 61 refers to, for example, the recipe instructed by the device operator, and the movable top plate unit. It is possible that the ascending position of the movable top plate 33 according to 9 is instructed in the recipe.

According to this embodiment, the sampling port 71 is provided in the exhaust pipe opening 77 of the exhaust pipe 51, and the exhaust pressure in the exhaust pipe 51 is measured by the pressure sensor 75 attached via the sampling port 71. .. The sampling port 71 has a straightening vane 85 that covers the opening so that the opening cannot be seen when the opening is viewed from the intersection of the gas flow direction in the exhaust pipe 51 and the extension line of the central axis of the opening 81. It is equipped with. The rectifying plate 85 is further provided so that the opening 81 communicates with the inside of the exhaust pipe 51 in a direction orthogonal to both the gas flow direction in the exhaust pipe 51 and the central axis of the opening 81. , Exhaust pressure can be measured by the pressure sensor 75. Therefore, although the sublimated material contained in the gas adheres to and accumulates on the upstream side of the straightening vane 85, it can be prevented from accumulating on the opening 81 and closing the opening 81. As a result, the exhaust pressure in the exhaust pipe 51 can be accurately measured even if the gas contains a sublimated substance.

Further, the straightening vane 85 according to this embodiment has the following effects.

That is, in the exhaust pipe 51 facing the opening 81, the straightening vane 85 is arranged like a triangular roof, and the inclined surface thereof faces the gas flow direction. Therefore, the sublimated material contained in the exhaust mainly adheres to and deposits on the inclined surfaces facing upstream and downstream thereof. Further, since the opening 81 communicates with the exhaust pipe 51 in a direction orthogonal to both the gas flow direction and the central axis of the opening 81, the pressure sensor 75 accurately measures the exhaust pressure via the sampling port 71. can.

Further, since the block body 79 can be removed from the exhaust pipe 51 together with the straightening vane 85 by removing the mounting tool 83, even if the sublimation material adheres to the straightening vane 85 or the opening 81, it can be easily removed by maintenance. Therefore, by performing regular maintenance, the accuracy of the exhaust pressure can be maintained for a long period of time. Further, since the measuring tube 73 can be removed from the block body 79 by loosening the tube clamp 93, even if the sublimated material adheres to the inside of the measuring tube 73, it can be easily removed by maintenance. Therefore, by performing regular maintenance, the accuracy of the exhaust pressure can be maintained for a long period of time.

<First modification>

Here, another embodiment of the above-mentioned straightening vane 85 will be described with reference to FIG. 9. Note that FIG. 9 is a vertical sectional view showing a first modification of the straightening vane.

The rectifying plate 85A covers the opening 81 so that the opening 81 cannot be seen when the opening 81 is viewed from the intersection of the gas flow direction in the exhaust pipe 51 and the extension line of the central axis of the opening 81. .. Further, the rectifying plate 85A is provided not only in the direction orthogonal to both the gas flow direction in the exhaust pipe 51 and the central axis of the opening 81, but also in the downstream side of the opening 81 in the gas flow direction of the exhaust pipe 51. An opening 81 is provided so as to communicate with the inside of the exhaust pipe 51. In other words, the straightening vane 85A is formed so that the inclined surface gradually separates from the wall surface of the exhaust pipe 51 toward the center side of the exhaust pipe 51. The downstream end thereof extends downstream from the downstream peripheral edge of the opening 81. Although such a straightening vane 85A can have a simpler configuration than the above-mentioned straightening vane 85, the sublimation material is deposited on the opening 81 to close the opening 81, as in the above-described embodiment. Can be suppressed.

<Second modification>

Here, another embodiment of the above-mentioned straightening vanes 85 and 85A will be described with reference to FIG. 10. Note that FIG. 10 is a vertical sectional view showing a second modification of the straightening vane.

The straightening vane 85B is provided so that the opening 81 communicates with the inside of the exhaust pipe 51 only on the downstream side of the opening 81 in the gas flow direction of the exhaust pipe 51. The straightening vane 85B is formed in a hood shape that opens only on the downstream side of the exhaust gas. Such a straightening vane 85B can prevent the sublimation material from accumulating in the opening 81 and closing the opening 81, as in the above-described embodiment. Moreover, since the inclined surface is supported by the plate-shaped member on the side surface, the mechanical strength can be increased.

The present invention is not limited to the above embodiment, and can be modified as follows.

(1) In the above-described embodiment, the movable top plate 33 is provided, but the present invention does not need to have this configuration. That is, the present invention can be applied to any substrate processing apparatus that includes an exhaust pipe 51 for exhausting the gas in the housing 13 that forms a heat treatment atmosphere and detects the exhaust pressure.

(2) In the above-described embodiment, the block body 79 is detachably attached to the exhaust pipe 51 by the attachment 83, but the present invention is not limited to such a configuration. For example, the block body 79 and the exhaust pipe 51 may be detachably configured with a snap lock (draw latch). Further, the sampling port 71 may be fixedly attached to a part of the exhaust pipe 51, and a part of the exhaust pipe 51 may be detachably attached to the exhaust pipe 51.

(3) In the above-described embodiment, the measuring tube 73 is detachably attached to the block body 79 by the tube clamp 93. However, the present invention does not require the tube clamp 93. For example, the measuring tube 73 may be attached to the block body 79 so as not to be removable.

1,1A ... Board processing device W ... Board 3 ... Lower base plate 5 ... Water-cooled base plate 7 ... Heat-treated plate 9 ... Movable top plate unit 11 ... Elevating pin unit 13 ... Housing 15 ... Shutter unit 29 ... Elevating mechanism 33 ... Movable ceiling Plate 35 ... Opening 37 ... Drive mechanism 41 ... Lifting pin 43 ... Carry-in / exit 47 ... Shutter body 51 ... Exhaust pipe 53 ... Pressure detection unit 61 ... Control unit 71 ... Sampling port 73 ... Measuring tube 75 ... Pressure sensor 77 ... Exhaust pipe opening Part 79 ... Block body 81 ... Opening 83 ... Mounting tool 85, 85A, 85B ... Straightening plate 87 ... Measuring tube mounting part 93 ... Tube clamp

Claims (5)

In a substrate processing device that heat-treats a substrate
A heat treatment plate on which the substrate is placed and the substrate is heated,
A housing that covers the upper part of the heat-treated plate to form a heat-treated atmosphere by the heat-treated plate,
The exhaust pipe that exhausts the gas in the housing and
An exhaust pipe opening formed in the exhaust pipe and communicating with the inside of the exhaust pipe,
A sampling port provided at the exhaust pipe opening for detecting the exhaust pressure in the exhaust pipe, and
A pressure sensor that measures the exhaust pressure through the sampling port,
Equipped with
The sampling port is
An opening that communicates with the inside of the exhaust pipe at the exhaust pipe opening, and an opening that communicates with the inside of the exhaust pipe.
When the opening is viewed from the intersection of the gas flow direction in the exhaust pipe and the extension line of the central axis of the opening, the opening is covered so that the opening cannot be seen, and the exhaust pipe covers the opening. The opening communicates inside the exhaust pipe at least on one side downstream of the opening in the direction orthogonal to both the gas flow direction and the central axis of the opening and the gas flow direction of the exhaust pipe. With the rectifying plate provided as
A substrate processing apparatus characterized by being equipped with. In the substrate processing apparatus according to claim 1,
The straightening vane gradually opens from the upstream side to the downstream side of the exhaust pipe when viewed from a direction orthogonal to both the gas flow direction in the exhaust pipe and the central axis of the opening. A substrate processing apparatus characterized by having an inclined surface that increases the distance from the portion. In the substrate processing apparatus according to claim 1 or 2,
The straightening vane has a triangular cross section when viewed from a direction orthogonal to both the gas flow direction in the exhaust pipe and the central axis of the opening, and its apex has an internal angle side thereof as the opening. A board processing device characterized in that it is mounted facing each other. In the substrate processing apparatus according to any one of claims 1 to 3,
The block body on which the opening is formed and the block body
A mounting tool for detachably attaching the block body to the exhaust pipe so that the opening faces the exhaust pipe opening.
Equipped with
The substrate processing apparatus, wherein the straightening vane is attached to the exhaust pipe opening side of the block body. In the substrate processing apparatus according to claim 4,
In the block body, a measuring tube mounting portion communicating with the opening is formed on the opposite surface of the opening, and the block body is formed.
A measuring tube having one end arranged on the measuring tube mounting portion of the block body and the pressure sensor arranged on the other end side.
A measuring tube mounting tool that detachably attaches one end side of the measuring tube to the measuring tube mounting portion,
A substrate processing apparatus characterized by being equipped with.

Images