JP6943774B2 - Holding device - Google Patents

Description

The techniques disclosed herein relate to holding devices that hold objects.

For example, an electrostatic chuck is used as a holding device for holding a wafer when manufacturing a semiconductor. The electrostatic chuck is provided in a ceramic member having a substantially flat surface (hereinafter referred to as “adsorption surface”) substantially perpendicular to a predetermined direction (hereinafter referred to as “first direction”) and inside the ceramic member. The wafer is provided with a chuck electrode, and the wafer is attracted and held on the suction surface of the ceramic member by utilizing the electrostatic attraction generated by applying a voltage to the chuck electrode.

If the temperature of the wafer held on the suction surface of the electrostatic chuck does not reach the desired temperature, the accuracy of each process (deposition, etching, etc.) on the wafer may decrease. Therefore, the temperature of the wafer is applied to the electrostatic chuck. Performance to control the distribution is required. Therefore, for example, a plurality of heater electrodes are provided inside the ceramic member. When a voltage is applied to each heater electrode, each heater electrode generates heat to heat the ceramic member, thereby controlling the temperature distribution of the suction surface of the ceramic member (and thus the temperature of the wafer held on the suction surface). Distribution control) is realized.

Each heater electrode has a heater line portion which is a linear resistance heating element, and a heater pad portion connected to each end of the heater line portion. Further, a driver electrode having a conductive region may be provided inside the ceramic member, and a configuration in which a plurality of heater electrodes are connected in parallel to the driver electrode may be adopted (see, for example, Patent Document 1). .. The conductive region of the driver electrode is electrically connected to the heater pad portion of each heater electrode via the via on the heater side, and is also electrically connected to the power supply terminal via the via on the power supply side. In such a configuration, the heater pad portion of each heater electrode is connected to the power supply via the heater side via, the conductive region of the driver electrode, the feeding side via, and the feeding terminal.

International Publication No. 2017/115758

In the conventional electrostatic chuck, depending on the positional relationship between the power feeding terminal and the heater pad portion of each heater electrode in the first directional view, the feeding terminal and one heater pad portion in the conductive region of the driver electrode A part of the current path (a part of the current path located on the conductive region of the driver electrode, the same applies hereinafter) and a part of the current path between the power feeding terminal and another heater pad portion may overlap. .. When a part of a plurality of current paths overlaps in the conductive region of the driver electrode, heat generation due to the current flowing at a specific portion in the conductive region of the driver electrode is concentrated, and the portion tends to become a high temperature singular point. Therefore, in the conventional electrostatic chuck, there is room for improvement in terms of controllability of the temperature distribution of the suction surface of the ceramic member (and thus controllability of the temperature distribution of the wafer).

It should be noted that such a problem is not limited to the electrostatic chuck that holds the wafer by utilizing the electrostatic attraction, but is a common problem in general for a holding device provided with a ceramic member and holding an object on the surface of the ceramic member. ..

This specification discloses a technique capable of solving the above-mentioned problems.

The techniques disclosed herein can be realized, for example, in the following forms.

(1) The holding device disclosed in the present specification includes a ceramic member having a substantially flat first surface substantially perpendicular to the first direction, and a plurality of heater electrodes arranged inside the ceramic member. They are connected to the heater line portion, which is a linear resistance heating element in the first direction view, and the end portion of the heater line portion, respectively, and from the heater line portion in the first direction view. A plurality of heater electrodes having a wide heater pad portion, a driver electrode arranged inside the ceramics member and including a conductive region, a feeding terminal, and the feeding terminal and the conductive region of the driver electrode are provided. The first via of the ceramics member is provided with a power feeding side via that is electrically connected and a heater side via that electrically connects the heater pad portion of each heater electrode and the conductive region of the driver electrode. In the holding device for holding the object on the surface, in the first directional view, the driver electrode is connected to the conductive region of the same driver electrode as the conductive region of the driver electrode connected to the heater pad portion. At a position that does not overlap with the virtual line connecting the center point of the other heater pad portion, which is farther from the power supply terminal than the one heater pad portion, and the center point of the power supply terminal. The heater pad section is arranged. In this holding device, in the first directional view, it is connected to the same conductive region of the driver electrode as the conductive region of the driver electrode connected to the one heater pad portion, and is connected to the conductive region of the same driver electrode from the one heater pad portion. The above-mentioned one heater pad portion is arranged at a position that does not overlap with the virtual line segment connecting the center point of another heater pad portion that is far away and the center point of the power feeding terminal. Therefore, a part of the current path between the power feeding terminal and the above-mentioned one heater pad portion in the conductive region of the driver electrode (the portion of the current path located on the conductive region of the driver electrode, the same applies hereinafter) and the said. It is possible to prevent a part of the current path between the power feeding terminal and the other heater pad portion from being close to each other. Therefore, according to this holding device, it is possible to prevent heat generation due to the flow of an electric current at a specific location in the conductive region of the driver electrode from being concentrated and becoming a high-temperature temperature singularity at that location. The controllability of the temperature distribution of the first surface (and thus the controllability of the temperature distribution of the object held by the holding device) can be improved.

(2) In the holding device, the one heater pad portion is arranged at a position that does not overlap with the region sandwiched between the other heater pad portion and the power feeding terminal in the first directional view. May be. According to this holding device, a part of the current path between the power feeding terminal and the one heater pad portion and the current path between the feeding terminal and the other heater pad portion in the conductive region of the driver electrode. It is possible to effectively suppress the proximity to a part. Therefore, according to this holding device, it is possible to effectively suppress the concentration of heat generated by the current flowing at a specific location in the conductive region of the driver electrode, which becomes a high-temperature temperature singularity. The controllability of the temperature distribution on the first surface of the ceramic member (and thus the controllability of the temperature distribution of the object held by the holding device) can be effectively improved.

(3) In the holding device, among the four regions separated by the first and second virtual straight lines passing through the center point of the feeding terminal and orthogonal to each other in the first directional view, the other heater The one heater pad portion may be arranged in another region that faces the region where the pad portion is located with the center point of the power feeding terminal interposed therebetween. According to this holding device, a part of the current path between the power feeding terminal and the one heater pad portion and the current path between the feeding terminal and the other heater pad portion in the conductive region of the driver electrode. It is possible to more effectively suppress the proximity to a part. Therefore, according to this holding device, it is possible to more effectively suppress the concentration of heat generated by the current flowing at a specific location in the conductive region of the driver electrode, which becomes a high-temperature temperature singularity. , The controllability of the temperature distribution on the first surface of the ceramic member (and thus the controllability of the temperature distribution of the object held by the holding device) can be further effectively improved.

(4) In the holding device, among the four regions separated by the first and second virtual straight lines that pass through the center point of the feeding terminal and are orthogonal to each other in the first directional view, the first or the first The one heater pad portion may be arranged in the other region adjacent to the region where the other heater pad portion is located with the second virtual straight line interposed therebetween. According to this holding device, heat generation due to the flow of an electric current at a specific location in the conductive region of the driver electrode is suppressed from becoming a high-temperature temperature singularity, and the first surface of the ceramic member is prevented from becoming a temperature singularity. While improving the controllability of the temperature distribution (and thus the controllability of the temperature distribution of the object held by the holding device), it is possible to reduce the size and simplification of the conductive region of the driver electrode.

(5) In the holding device, of the three heater pad portions, the heater pad portion having the shortest distance from the power feeding terminal has recently been designated as the heater pad portion, and the heater pad portion having the longest distance from the feeding terminal has been used. When the farthest heater pad portion is used and the remaining one heater pad portion is used as an intermediate heater pad portion, the center point of the recent heater pad portion and the center point of the power feeding terminal are connected in the first direction view. The virtual line segment, the virtual line segment connecting the center point of the farthest heater pad portion and the center point of the power feeding terminal, and the center point of the recent heater pad portion and the center point of the farthest heater pad portion are connected. The virtual line segment and the virtual triangle defined by the above may be configured so as not to overlap with the virtual line segment connecting the center point of the intermediate heater pad portion and the center point of the power feeding terminal. According to this holding device, a part of the current path between the power feeding terminal and each heater pad portion in the conductive region of the driver electrode can be more dispersed. Therefore, according to this holding device, it is possible to more effectively suppress the concentration of heat generated by the current flowing at a specific location in the conductive region of the driver electrode, which becomes a high-temperature temperature singularity. , The controllability of the temperature distribution on the first surface of the ceramic member (and thus the controllability of the temperature distribution of the object held by the holding device) can be further effectively improved.

The technique disclosed in the present specification can be realized in various forms, for example, a holding device, an electrostatic chuck, a heater device such as a CVD heater, a vacuum chuck, a method for manufacturing the same, and the like. It is possible to realize with.

It is a perspective view which shows schematic appearance structure of the electrostatic chuck 100 in 1st Embodiment. It is explanatory drawing which shows typically the XZ cross-sectional structure of the electrostatic chuck 100 in 1st Embodiment. It is explanatory drawing which shows typically the XY cross-sectional structure of the electrostatic chuck 100 in 1st Embodiment. It is explanatory drawing which shows typically the XY cross section structure of the electrostatic chuck 100 in 1st Embodiment. It is explanatory drawing which shows the positional relationship between the feeding terminal in the electrostatic chuck 100 of this embodiment, and the heater pad portion of a heater electrode. It is explanatory drawing which shows the positional relationship between the feeding terminal in the electrostatic chuck 100 of the comparative example, and the heater pad portion of a heater electrode. It is explanatory drawing which shows the positional relationship between the feeding terminal in the electrostatic chuck 100 of 2nd Embodiment, and the heater pad portion of a heater electrode. It is explanatory drawing which shows the positional relationship between the feeding terminal in the electrostatic chuck 100 of 3rd Embodiment, and the heater pad portion of a heater electrode. It is explanatory drawing which shows the positional relationship between the feeding terminal in the electrostatic chuck 100 of 4th Embodiment, and the heater pad portion of a heater electrode.

A. First Embodiment:
A-1. Configuration of electrostatic chuck 100:
FIG. 1 is a perspective view schematically showing an external configuration of the electrostatic chuck 100 according to the first embodiment, and FIG. 2 is an explanatory view schematically showing an XZ cross-sectional configuration of the electrostatic chuck 100 according to the first embodiment. 3 and 4 are explanatory views schematically showing the XY cross-sectional configuration of the electrostatic chuck 100 according to the first embodiment. FIG. 3 shows the XY cross-sectional configuration of the electrostatic chuck 100 at the position III-III of FIG. 2, and FIG. 4 shows the XY cross-sectional configuration of the electrostatic chuck 100 at the position IV-IV of FIG. It is shown. Each figure shows XYZ axes that are orthogonal to each other to identify the direction. In the present specification, for convenience, the Z-axis positive direction is referred to as an upward direction, and the Z-axis negative direction is referred to as a downward direction, but the electrostatic chuck 100 is actually installed in a direction different from such a direction. May be done.

The electrostatic chuck 100 is a device that attracts and holds an object (for example, a wafer W) by electrostatic attraction, and is used, for example, for fixing a wafer W in a vacuum chamber of a semiconductor manufacturing apparatus. The electrostatic chuck 100 includes a ceramic member 10 and a base member 20 arranged side by side in a predetermined arrangement direction (in the present embodiment, the vertical direction (Z-axis direction)). The ceramic member 10 and the base member 20 are arranged so that the lower surface S2 (see FIG. 2) of the ceramic member 10 and the upper surface S3 of the base member 20 face each other in the above-mentioned arrangement direction.

The ceramic member 10 is a plate-shaped member having a substantially circular planar upper surface (hereinafter, referred to as “adsorption surface”) S1 substantially orthogonal to the above-mentioned arrangement direction (Z-axis direction), and is a ceramic (for example, alumina or aluminum nitride). Etc.). The diameter of the ceramic member 10 is, for example, about 50 mm to 500 mm (usually about 200 mm to 350 mm), and the thickness of the ceramic member 10 is, for example, about 1 mm to 10 mm. The suction surface S1 of the ceramic member 10 corresponds to the first surface in the claims, and the Z-axis direction corresponds to the first direction in the claims. Further, in the present specification, the direction orthogonal to the Z-axis direction is referred to as "plane direction".

As shown in FIG. 2, a chuck electrode 40 formed of a conductive material (for example, tungsten, molybdenum, platinum, etc.) is arranged inside the ceramic member 10. The shape of the chuck electrode 40 in the Z-axis direction is, for example, substantially circular. When a voltage is applied to the chuck electrode 40 from a power source (not shown), an electrostatic attraction is generated, and the wafer W is attracted and fixed to the suction surface S1 of the ceramic member 10 by this electrostatic attraction.

Inside the ceramic member 10, there is also a heater electrode layer 50 for controlling the temperature distribution of the suction surface S1 of the ceramic member 10 (that is, controlling the temperature distribution of the wafer W held on the suction surface S1), and a heater. A configuration for supplying power to the electrode layer 50 is arranged. These configurations will be described in detail later. For the ceramic member 10 having such a configuration, for example, a plurality of ceramic green sheets are produced, and a predetermined ceramic green sheet is processed by forming via holes, filling metallized paste, printing, or the like, and these ceramic green sheets. The sheet can be produced by thermocompression bonding, processing such as cutting, and then firing.

The base member 20 is, for example, a plate-shaped member having the same diameter as the ceramic member 10 or a larger diameter than the ceramic member 10 and is formed of, for example, a metal (aluminum, an aluminum alloy, or the like). The diameter of the base member 20 is, for example, about 220 mm to 550 mm (usually 220 mm to 350 mm), and the thickness of the base member 20 is, for example, about 20 mm to 40 mm.

The base member 20 is joined to the ceramic member 10 by an adhesive layer 30 arranged between the lower surface S2 of the ceramic member 10 and the upper surface S3 of the base member 20. The adhesive layer 30 is made of an adhesive material such as a silicone resin, an acrylic resin, or an epoxy resin. The thickness of the adhesive layer 30 is, for example, about 0.1 mm to 1 mm.

A refrigerant flow path 21 is formed inside the base member 20. When a refrigerant (for example, a fluorine-based inert liquid, water, etc.) is flowed through the refrigerant flow path 21, the base member 20 is cooled, and heat transfer (heat transfer between the base member 20 and the ceramic member 10 via the adhesive layer 30). The ceramic member 10 is cooled by heat transfer), and the wafer W held on the suction surface S1 of the ceramic member 10 is cooled. As a result, the temperature distribution of the wafer W can be controlled.

A-2. Configuration of heater electrode layer 50, etc .:
Next, the configuration of the heater electrode layer 50 and the configuration for supplying power to the heater electrode layer 50 will be described in detail. As described above, the electrostatic chuck 100 includes a heater electrode layer 50 (see FIG. 2). The heater electrode layer 50 is made of a conductive material (for example, tungsten, molybdenum, platinum, etc.). In this embodiment, the heater electrode layer 50 is arranged below the chuck electrode 40.

As shown in FIG. 4, the heater electrode layer 50 includes a plurality of heater electrodes 500. Note that, in FIG. 4, only a part of the plurality of heater electrodes 500 included in the electrostatic chuck 100 is shown, and the other heater electrodes 500 are not shown.

Each heater electrode 500 has a heater line portion 510 which is a linear resistance heating element in the Z-axis direction, and a heater pad portion (first heater pad portion 521 and second heater pad portion 521) connected to both ends of the heater line portion 510. It has a heater pad portion 522) and. Hereinafter, the first heater pad portion 521 and the second heater pad portion 522 are also collectively referred to as heater pad portions 521 and 522. In the Z-axis direction, the width of the heater pad portions 521 and 522 is larger than the width of the heater line portion 510.

Further, as shown in FIG. 2, the electrostatic chuck 100 has a configuration for supplying power to each heater electrode 500 constituting the heater electrode layer 50. Specifically, the electrostatic chuck 100 includes a driver electrode 60. The driver electrode 60 is made of a conductive material (for example, tungsten, molybdenum, platinum, etc.). As shown in FIG. 3, the driver electrode 60 has a pair of conductive regions (first conductive region 61 and second conductive region 62) which are patterns having predetermined regions parallel to the plane direction. The electrostatic chuck 100 of this embodiment includes four driver electrodes 60. Further, in the present embodiment, the driver electrode 60 is arranged below the heater electrode layer 50. Hereinafter, the first conductive region 61 and the second conductive region 62 of the driver electrode 60 are also collectively referred to as conductive regions 61 and 62. The driver electrode 60 is different from the heater electrode 500 in that it satisfies at least one of the following (1) and (2).
(1) The cross-sectional area of the driver electrode 60 is 10 times or more the cross-sectional area of the heater electrode 500.
(2) In the plane direction, the driver electrode 60 has a larger area than one segment SE.

The pair of heater pad portions 521 and 522 of one heater electrode 500 are electrically connected to the pair of conductive regions 61 and 62 of one driver electrode 60, respectively. Specifically, as shown in FIG. 2, the first heater pad portion 521 of one heater electrode 500 is connected to the driver electrode 60 via the first heater side via 721 formed of a conductive material. Conducting to the conductive region 61 of 1, the second heater pad portion 522 of the heater electrode 500 is the second heater electrode 60 via the second heater side via 722 formed of the conductive material. It is conductive to the conductive region 62 of. Hereinafter, the first heater-side via 721 and the second heater-side via 722 are also collectively referred to as heater-side vias 721 and 722.

In this embodiment, a plurality of heater electrodes 500 are connected in parallel to one driver electrode 60. For example, the three heater electrodes 500 shown in FIG. 4 are connected in parallel to the particular driver electrode 60 (60x) shown in FIG.

Further, as shown in FIG. 2, the electrostatic chuck 100 is formed with a pair of terminal holes 110 and 120 extending from the lower surface S4 of the base member 20 to the inside of the ceramic member 10. The terminal holes 110 and 120 have a through hole 22 that penetrates the base member 20 in the vertical direction, a through hole 32 that penetrates the adhesive layer 30 in the vertical direction, and a recess 12 formed on the lower surface S2 side of the ceramic member 10. Is an integral hole formed by communicating with each other.

A columnar first power feeding terminal 741 is housed in the first terminal hole 110, which is one of the pair of terminal holes 110, 120. Further, a first electrode pad 731 is provided on the bottom surface of the recess 12 of the ceramic member 10 constituting the first terminal hole 110. The first power feeding terminal 741 is joined to the first electrode pad 731 by, for example, brazing or the like. Further, the first electrode pad 731 is conductive to the first conductive region 61 in the driver electrode 60 via the first feeding side via 711. Similarly, the second terminal hole 120, which is the other of the pair of terminal holes 110, 120, accommodates a columnar second power feeding terminal 742. Further, a second electrode pad 732 is provided on the bottom surface of the recess 12 of the ceramic member 10 constituting the second terminal hole 120. The second power feeding terminal 742 is joined to the second electrode pad 732 by, for example, brazing. Further, the second electrode pad 732 is conducted to the second conductive region 62 in the driver electrode 60 via the second feeding side via 712. In the following, the first power supply terminal 741 and the second power supply terminal 742 are also collectively referred to as power supply terminals 741 and 742, and the first electrode pad 731 and the second electrode pad 732 are collectively referred to as the electrode pad 731. , 732, and the first feeding side via 711 and the second feeding side via 712 are also collectively referred to as feeding side vias 711 and 712. The feeding terminals 741,742, the electrode pads 731,732, and the feeding side vias 711,712 are all made of a conductive material.

The pair of power supply terminals 741 and 742 are connected to a power source (not shown). The voltage from the power supply is supplied to the pair of conductive regions 61 and 62 of the driver electrode 60 via the pair of feeding terminals 741,742, the pair of electrode pads 731 and 732, and the pair of feeding side vias 711 and 712. Further, it is applied to the heater electrode 500 via a pair of heater side vias 721 and 722 provided for each heater electrode 500. When a voltage is applied to each heater electrode 500, each heater electrode 500 generates heat to heat the ceramic member 10, thereby controlling the temperature distribution of the suction surface S1 of the ceramic member 10 (that is, holding the temperature distribution on the suction surface S1). Control of the temperature distribution of the wafer W) is realized.

A-3. Positional relationship between the power supply terminal and the heater pad of the heater electrode:
FIG. 5 is an explanatory diagram showing the positional relationship between the power feeding terminal and the heater pad portion of the heater electrode in the electrostatic chuck 100 of the present embodiment. FIG. 5 shows one first power feeding terminal 741 electrically connected to the first conductive region 61 of one driver electrode 60, and three electrically connected to the first conductive region 61. The positional relationship of the heater electrode 500 with the first heater pad portion 521 (521a, 521b, 521c) in the Z-axis direction is shown.

Comparing the linear distances from each of the three first heater pad portions 521a, 521b, and 521c shown in FIG. 5 to the first power supply terminal 741, the first heater pad portion 521a (hereinafter, "recent heater pad") The distance from the first power supply terminal 741 is the shortest, and the distance from the first heater pad portion 521b (hereinafter referred to as the "farthest heater pad portion 521b") to the first power supply terminal 741 is the shortest. The longest distance from the first heater pad portion 521c (hereinafter referred to as "intermediate heater pad portion 521c") to the first power supply terminal 741 is an intermediate value between the two.

In the electrostatic chuck 100 of the present embodiment, the electrostatic chuck 100 is connected to the conductive region 61 of the same driver electrode 60 as the conductive region 61 of the driver electrode 60 connected to one heater pad portion 521 in the Z-axis direction, and is connected to the above-mentioned one. The one heater pad unit is located at a position that does not overlap with the virtual line segment connecting the center point of the other heater pad unit 521 and the center point of the power supply terminal 741 that are farther from the power supply terminal 741 than the heater pad unit 521. 521 is arranged. For example, paying attention to the two heater pad portions 521, which are the heater pad portion 521a and the farthest heater pad portion 521b, recently, in the Z-axis direction, the center point Pb of the farthest heater pad portion 521b and the first power supply terminal 741 Recently, the heater pad portion 521a is arranged at a position that does not overlap with the virtual line segment VLSb connecting the center point P0. In the conductive region 61 of the driver electrode 60, the current between the farthest heater pad portion 521b and the first power feeding terminal 741 flows in a region centered on the virtual line segment VLSb. Therefore, if the heater pad portion 521a is recently arranged as described above (that is, is arranged at a position that does not overlap with the virtual line segment VLSb), the current path between the heater pad portion 521a and the first power supply terminal 741 is recently made. (A part of the current path located on the conductive region 61 of the driver electrode 60, the same applies hereinafter) and a part of the current path between the farthest heater pad portion 521b and the first power feeding terminal 741. It is possible to suppress the proximity. Recently, the relationship between the heater pad portion 521a and the intermediate heater pad portion 521c and the relationship between the farthest heater pad portion 521b and the intermediate heater pad portion 521c are the same.

Further, in the electrostatic chuck 100 of the present embodiment, the electrostatic chuck 100 is sandwiched between the other heater pad portion 521 (heater pad portion 521 farther from the power supply terminal 741) and the power supply terminal 741 in the Z-axis direction. The above-mentioned one heater pad portion 521 (heater pad portion 521 closer to the power supply terminal 741) is arranged at a position that does not overlap with the area. For example, paying attention to the two heater pad portions 521, which are the heater pad portion 521a and the farthest heater pad portion 521b, recently, in the Z-axis direction, the region Rb sandwiched between the farthest heater pad portion 521b and the power supply terminal 741 Recently, the heater pad portion 521a is arranged at a position where it does not overlap. The region sandwiched between the heater pad portion 521 and the power supply terminal 741 is the following region. For example, taking the region Rb sandwiched between the farthest heater pad portion 521b and the power supply terminal 741 as an example, the region Rb is the farthest heater pad portion 521b on each side of the above-mentioned virtual line segment VLSb. When the tangent TL for both the outer peripheral wire and the outer peripheral wire of the power feeding terminal 741 is defined, it is an area surrounded by the two tangent wire TL, the outer peripheral wire of the farthest heater pad portion 521b, and the outer peripheral wire of the feeding terminal 741. The same applies to the region Ra recently sandwiched between the heater pad portion 521a and the power feeding terminal 741 and the region Rc sandwiched between the intermediate heater pad portion 521c and the feeding terminal 741. When the heater pad portion 521a has recently been arranged as described above (that is, it is arranged at a position where it does not overlap with the region Rb sandwiched between the farthest heater pad portion 521b and the power supply terminal 741), the heater pad portion 521a and the second heater pad portion 521a have recently been arranged. It is possible to effectively prevent a part of the current path between the power supply terminal 741 of 1 and a part of the current path between the farthest heater pad portion 521b and the first power supply terminal 741 from being close to each other. .. Recently, the relationship between the heater pad portion 521a and the intermediate heater pad portion 521c and the relationship between the farthest heater pad portion 521b and the intermediate heater pad portion 521c are the same.

Further, in the electrostatic chuck 100 of the present embodiment, the virtual line segment VLSa connecting the center point Pa of the heater pad portion 521a and the center point P0 of the power supply terminal 741 and the farthest heater pad portion 521b have recently been viewed in the Z-axis direction. The virtual line segment VLSb connecting the center point Pb of the power supply terminal 741 and the center point P0 of the power feeding terminal 741, and the virtual line segment VLSab connecting the center point Pa of the heater pad portion 521a and the center point Pb of the farthest heater pad portion 521b recently. The virtual triangle VT defined by the above is configured so as not to overlap with the virtual line segment VLSc connecting the center point Pc of the intermediate heater pad portion 521c and the center point P0 of the power feeding terminal 741. In such a configuration, a part of the current path between each heater pad portion 521 and the first power feeding terminal 741 is more dispersed as compared with the configuration in which the virtual triangle VT overlaps the virtual line segment VLSc (see FIG. 7). Can be made to.

Although the positional relationship between the power supply terminal electrically connected to the first conductive region 61 of one driver electrode 60 and each heater pad portion has been described here, in the present embodiment, the first driver electrode 60 is the first. For both the conductive region 61 of 1 and the second conductive region 62, the positional relationship between the power supply terminal electrically connected to the conductive regions 61 and 62 and each heater pad portion has the same positional relationship.

A-4. Effect of this embodiment:
As described above, the electrostatic chuck 100 of the first embodiment includes a ceramic member 10 having a substantially planar suction surface S1 substantially perpendicular to the Z-axis direction, and an object is placed on the suction surface S1 of the ceramic member 10. A holding device for holding (for example, a wafer W). The electrostatic chuck 100 includes a plurality of heater electrodes 500 arranged inside the ceramic member 10. Each heater electrode 500 is connected to a heater line portion 510, which is a linear resistance heating element in the Z-axis direction, and an end portion of the heater line portion 510, and is wider than the heater line portion 510 in the Z-axis direction. It has large heater pad portions 521 and 522. Further, the electrostatic chuck 100 is arranged inside the ceramics member 10, and includes a driver electrode 60 including conductive regions 61 and 62, a feeding terminal 741,742, and a conductive region 61 of the feeding terminals 741 and 742 and the driver electrode 60. Heat-feeding side vias 711 and 712 that electrically connect 62, and heater-side vias 721 and 722 that electrically connect the heater pad portions 521 and 522 of each heater electrode 500 and the conductive regions 61 and 62 of the driver electrode 60. And. Further, in the electrostatic chuck 100 of the present embodiment, in the Z-axis direction view, the conductive regions 61 and 62 of the same driver electrode 60 as the conductive regions 61 and 62 of the driver electrodes 60 connected to one heater pad portion 521 and 522. The center points of the other heater pads 521 and 522, which are connected to the above and are farther from the power supply terminals 741 and 742 than the one heater pad 521 and 522, and the center points of the power supply terminals 741 and 742. The above-mentioned heater pad portions 521 and 522 are arranged at positions that do not overlap with the connecting virtual line segments. Since the electrostatic chuck 100 of the present embodiment has such a configuration, as will be described below, the controllability of the temperature distribution of the suction surface S1 of the ceramic member 10 (and by extension, the temperature distribution of the wafer W). Controllability) can be improved.

FIG. 6 is an explanatory diagram showing the positional relationship between the power feeding terminal and the heater pad portion of the heater electrode in the electrostatic chuck 100 of the comparative example. In the electrostatic chuck 100 of the comparative example shown in FIG. 6, for example, when two heater pad portions 521, the heater pad portion 521a and the farthest heater pad portion 521b, are recently focused on, the farthest heater pad portion is viewed in the Z-axis direction. Recently, the heater pad portion 521a is arranged at a position overlapping the virtual line segment VLSb connecting the center point Pb of the 521b and the center point P0 of the first power feeding terminal 741. Recently, the relationship between the heater pad portion 521a and the intermediate heater pad portion 521c and the relationship between the farthest heater pad portion 521b and the intermediate heater pad portion 521c are the same. As described above, in the electrostatic chuck 100 of the comparative example shown in FIG. 6, the condition regarding the positional relationship between the power supply terminal and the heater pad portion satisfied by the electrostatic chuck 100 of the first embodiment described above (in the Z-axis direction). , Which is connected to the same conductive region 61 of the driver electrode 60 as the conductive region 61 of the driver electrode 60 connected to the one heater pad portion 521, and is farther from the power supply terminal 741 than the one heater pad portion 521. The condition that the above-mentioned one heater pad portion 521 is arranged at a position that does not overlap with the virtual line segment connecting the center point of the heater pad portion 521 and the center point of the power feeding terminal 741) is not satisfied.

Since the electrostatic chuck 100 of the comparative example shown in FIG. 6 has the above configuration, the heater pad portion (for example, the farthest heater pad portion 521b) that is one with the power supply terminal 741 in the conductive region 61 of the driver electrode 60 A part of the current path between them and a part of the current path between the power feeding terminal 741 and another heater pad portion (for example, the first heater pad portion 521a) are close to each other. Therefore, heat generated by the current flowing in a specific portion of the conductive region 61 of the driver electrode 60 is concentrated, and the portion tends to become a high temperature singularity. Therefore, in the electrostatic chuck 100 of the comparative example shown in FIG. 6, the controllability of the temperature distribution of the suction surface S1 of the ceramic member 10 (and by extension, the controllability of the temperature distribution of the wafer W) is lowered.

On the other hand, as described above, since the electrostatic chuck 100 of the present embodiment satisfies the condition regarding the positional relationship between the power feeding terminal and the heater pad portion described above (see FIG. 5), the conductive regions 61 and 62 of the driver electrode 60 are satisfied. In, a part of the current path between the power feeding terminals 741,742 and one heater pad portion (for example, recently heater pad portion 521a), and the feeding terminals 741,742 and another heater pad portion (for example, the farthest heater). It is possible to suppress the proximity of a part of the current path to the pad portion 521b). Therefore, it is possible to prevent the heat generated by the current flowing from the conductive regions 61 and 62 of the driver electrode 60 from being concentrated and becoming a high-temperature temperature singularity. Therefore, according to the electrostatic chuck 100 of the present embodiment, the controllability of the temperature distribution of the suction surface S1 of the ceramic member 10 (and by extension, the controllability of the temperature distribution of the wafer W) can be improved. The high controllability of the temperature distribution of the suction surface S1 of the ceramic member 10 means that the temperature distribution of the entire suction surface S1 is close to uniform and that the temperature distribution of the suction surface S1 is close to uniform for each segment SE. Includes at least one meaning of.

Further, as described above, in the electrostatic chuck 100 of the present embodiment, in the Z-axis direction view, the other heater pad portions 521 and 522 (heater pad portions 521 that are farther from the power supply terminals 741, 742). , 522) and the heater pad portion 521, 522 (the heater pad portion 521, 522 closer to the power supply terminal 741, 742) at a position not overlapping the region sandwiched between the power supply terminals 741, 742. ) Is arranged (see FIG. 5). Therefore, in the electrostatic chuck 100 of the present embodiment, a part of the current path between the power supply terminals 741 and 742 and one heater pad portion 521 and 522 in the conductive regions 61 and 62 of the driver electrode 60 and the power supply terminal. It is possible to effectively suppress the proximity of a part of the current path between the 741,742 and the other heater pad portions 521 and 522. Therefore, according to the electrostatic chuck 100 of the present embodiment, the heat generated by the current flowing in the conductive regions 61 and 62 of the driver electrode 60 is concentrated, and that portion becomes a high temperature singular point. It can be effectively suppressed, and the controllability of the temperature distribution of the suction surface S1 of the ceramic member 10 (and thus the controllability of the temperature distribution of the wafer W) can be effectively improved.

Further, as described above, in the electrostatic chuck 100 of the present embodiment, the virtual line segment VLSa connecting the center point Pa of the heater pad portion 521a and the center point P0 of the power supply terminal 741 is the most recently seen in the Z-axis direction. A virtual line segment VLSb connecting the center point Pb of the far heater pad portion 521b and the center point P0 of the power supply terminal 741 and a virtual line segment Pb connecting the center point Pa of the heater pad portion 521a and the center point Pb of the farthest heater pad portion 521b recently. The line segment VLSab and the virtual triangle VT defined by the above are configured so as not to overlap with the virtual line segment VLSc connecting the center point Pc of the intermediate heater pad portion 521c and the center point P0 of the power supply terminal 741. Therefore, in the electrostatic chuck 100 of the present embodiment, as compared with the configuration in which the virtual triangle VT overlaps the virtual line segment VLSc (see FIG. 7), the heater pad portions 521 and the second heater pad portions 521 in the conductive regions 61 and 62 of the driver electrode 60 A part of the current path between the power supply terminal 741 and 1 can be more dispersed. Therefore, according to the electrostatic chuck 100 of the present embodiment, the heat generated by the current flowing in the conductive regions 61 and 62 of the driver electrode 60 is concentrated, and that portion becomes a high temperature singular point. It can be suppressed more effectively, and the controllability of the temperature distribution of the suction surface S1 of the ceramic member 10 (and thus the controllability of the temperature distribution of the wafer W) can be further effectively improved.

B. Second embodiment:
FIG. 7 is an explanatory diagram showing the positional relationship between the power feeding terminal and the heater pad portion of the heater electrode in the electrostatic chuck 100 of the second embodiment. In the following, among the configurations of the electrostatic chuck 100 of the second embodiment, the same configurations as the configurations of the electrostatic chuck 100 of the first embodiment described above will be appropriately omitted by adding the same reference numerals. ..

As shown in FIG. 7, in the electrostatic chuck 100 of the second embodiment, the driver electrode 60 connected to one heater pad portion 521 in the Z-axis direction as in the electrostatic chuck 100 of the first embodiment. The center point of another heater pad portion 521, which is connected to the conductive region 61 of the same driver electrode 60 as the conductive region 61 of the above and is farther from the feeding terminal 741 than the one heater pad portion 521, and the feeding terminal 741. The above-mentioned heater pad portion 521 is arranged at a position that does not overlap with the virtual line segment connecting the center point. For example, paying attention to the two heater pad portions 521, which are the heater pad portion 521a and the farthest heater pad portion 521b, recently, in the Z-axis direction, the center point Pb of the farthest heater pad portion 521b and the first power supply terminal 741 Recently, the heater pad portion 521a is arranged at a position that does not overlap with the virtual line segment VLSb connecting the center point P0. Recently, the relationship between the heater pad portion 521a and the intermediate heater pad portion 521c and the relationship between the farthest heater pad portion 521b and the intermediate heater pad portion 521c are the same.

Further, in the electrostatic chuck 100 of the second embodiment, similarly to the electrostatic chuck 100 of the first embodiment, the distance from the other heater pad portion 521 (the distance from the power supply terminal 741 is farther) in the Z-axis direction. The heater pad portion 521 (the heater pad portion 521 closer to the power supply terminal 741) is arranged at a position that does not overlap with the area sandwiched between the heater pad portion 521) and the power supply terminal 741. There is. For example, paying attention to the two heater pad portions 521, which are the heater pad portion 521a and the farthest heater pad portion 521b, recently, in the Z-axis direction, the region Rb sandwiched between the farthest heater pad portion 521b and the power supply terminal 741 Recently, the heater pad portion 521a is arranged at a position where it does not overlap. Recently, the relationship between the heater pad portion 521a and the intermediate heater pad portion 521c and the relationship between the farthest heater pad portion 521b and the intermediate heater pad portion 521c are the same.

However, in the electrostatic chuck 100 of the second embodiment, unlike the electrostatic chuck 100 of the first embodiment, the center point Pa of the heater pad portion 521a and the center point P0 of the power feeding terminal 741 are recently set in the Z-axis direction. The virtual line segment VLSb that connects the virtual line segment VLSa that connects, the center point Pb of the farthest heater pad portion 521b, and the center point P0 of the power supply terminal 741, and the center point Pa of the heater pad portion 521a and the farthest heater pad portion 521b recently. The virtual line segment VLSab connecting the center point Pb of the above and the virtual triangle VT defined by the above overlap with the virtual line segment VLSc connecting the center point Pc of the intermediate heater pad portion 521c and the center point P0 of the power supply terminal 741. ..

Although the positional relationship between the power supply terminal electrically connected to the first conductive region 61 of one driver electrode 60 and each heater pad portion has been described here, in the present embodiment, the first driver electrode 60 is the first. For both the conductive region 61 of 1 and the second conductive region 62, the positional relationship between the power supply terminal electrically connected to the conductive regions 61 and 62 and each heater pad portion has the same positional relationship.

As described above, in the electrostatic chuck 100 of the second embodiment, similarly to the electrostatic chuck 100 of the first embodiment, the driver electrodes connected to one heater pad portion 521,522 in the Z-axis direction view. Another heater pad portion 521 that is connected to the conductive regions 61 and 62 of the same driver electrode 60 as the conductive regions 61 and 62 of 60 and is farther from the feeding terminals 741 and 742 than the one heater pad portion 521 and 522. The heater pad portions 521 and 522 are arranged at positions that do not overlap with the virtual line segment connecting the center points of the power supply terminals 741 and 742 and the center points of the power supply terminals 741 and 742. Therefore, in the electrostatic chuck 100 of the second embodiment, a part of the current path between the feeding terminals 741 and 742 and the heater pad portions 521 and 522 in the conductive regions 61 and 62 of the driver electrode 60 and the feeding. It is possible to suppress the proximity of a part of the current path between the terminals 741 and 742 and the other heater pad portions 521 and 522, and the current flows at specific points in the conductive regions 61 and 62 of the driver electrode 60. As a result, it is possible to prevent the location from becoming a high-temperature temperature singular point due to the concentration of heat generated, and the controllability of the temperature distribution of the suction surface S1 of the ceramic member 10 (and thus the controllability of the temperature distribution of the wafer W). Can be improved.

Further, in the electrostatic chuck 100 of the second embodiment, similarly to the electrostatic chuck 100 of the first embodiment, the electrostatic chuck 100 is sandwiched between the other heater pad portions 521 and 522 and the power supply terminals 741, 742 in the Z-axis direction. The above-mentioned heater pad portions 521 and 522 are arranged at positions that do not overlap with the above-mentioned regions. Therefore, in the electrostatic chuck 100 of the second embodiment, a part of the current path between the feeding terminals 741 and 742 and the heater pad portions 521 and 522 in the conductive regions 61 and 62 of the driver electrode 60 and the feeding. It is possible to effectively suppress the proximity of a part of the current path between the terminals 741 and 742 and the other heater pads 521 and 522, and at specific points in the conductive regions 61 and 62 of the driver electrode 60. It is possible to effectively suppress the concentration of heat generated by the flow of electric current and the location becoming a high temperature singular point, and the controllability of the temperature distribution of the suction surface S1 of the ceramic member 10 (and by extension, the wafer W). The controllability of the temperature distribution) can be effectively improved.

C. Third Embodiment:
FIG. 8 is an explanatory diagram showing the positional relationship between the power feeding terminal and the heater pad portion of the heater electrode in the electrostatic chuck 100 of the third embodiment. In the following, among the configurations of the electrostatic chuck 100 of the third embodiment, the same configurations as the configurations of the electrostatic chuck 100 of the first embodiment described above will be appropriately omitted by adding the same reference numerals. ..

As shown in FIG. 8, in the electrostatic chuck 100 of the third embodiment, the driver electrode 60 connected to one heater pad portion 521 in the Z-axis direction as in the electrostatic chuck 100 of the first embodiment. The center point of another heater pad portion 521, which is connected to the conductive region 61 of the same driver electrode 60 as the conductive region 61 of the above and is farther from the feeding terminal 741 than the one heater pad portion 521, and the feeding terminal 741. The above-mentioned heater pad portion 521 is arranged at a position that does not overlap with the virtual line segment connecting the center point. That is, the heater pad portion 521a is recently arranged at a position that does not overlap with the virtual line segment VLSb connecting the center point Pb of the farthest heater pad portion 521b and the center point P0 of the first power feeding terminal 741 in the Z-axis direction. ing.

Further, in the electrostatic chuck 100 of the third embodiment, similarly to the electrostatic chuck 100 of the first embodiment, when viewed in the Z-axis direction, the other heater pad portion 521 (distance from the power feeding terminal 741 is farther). The heater pad portion 521 (the heater pad portion 521 closer to the power supply terminal 741) is arranged at a position that does not overlap with the area sandwiched between the heater pad portion 521) and the power supply terminal 741. There is. That is, the heater pad portion 521a is recently arranged at a position that does not overlap with the region Rb sandwiched between the farthest heater pad portion 521b and the power supply terminal 741 in the Z-axis direction.

Further, in the electrostatic chuck 100 of the third embodiment, the electrostatic chuck 100 is separated by a first virtual straight line VL1 and a second virtual straight line VL2 that pass through the center point P0 of the power feeding terminal 741 and are orthogonal to each other in the Z-axis direction. Of the two regions, the other heater pad portion 521 (heater pad portion 521 farther from the power supply terminal 741) is located so as to face the region of the power supply terminal 741 with the center point P0 in between. The above-mentioned one heater pad portion 521 (heater pad portion 521 closer to the power supply terminal 741) is arranged in the region. In such an arrangement of the heater pad portion 521, a part of the current path between one heater pad portion 521 and the first power supply terminal 741 and between the other heater pad portion 521 and the first power supply terminal 741. It is possible to extremely effectively suppress the proximity of a part of the current path of the above.

Although the positional relationship between the power supply terminal electrically connected to the first conductive region 61 of one driver electrode 60 and each heater pad portion has been described here, in the present embodiment, the first driver electrode 60 is the first. For both the conductive region 61 of 1 and the second conductive region 62, the positional relationship between the power supply terminal electrically connected to the conductive regions 61 and 62 and each heater pad portion has the same positional relationship.

As described above, in the electrostatic chuck 100 of the third embodiment, similarly to the electrostatic chuck 100 of the first embodiment, the driver electrodes connected to one heater pad portion 521,522 in the Z-axis direction view. Another heater pad portion 521 that is connected to the conductive regions 61 and 62 of the same driver electrode 60 as the conductive regions 61 and 62 of 60 and is farther from the feeding terminals 741 and 742 than the one heater pad portion 521 and 522. The heater pad portions 521 and 522 are arranged at positions that do not overlap with the virtual line segment connecting the center points of the power supply terminals 741 and 742 and the center points of the power supply terminals 741 and 742. Therefore, in the electrostatic chuck 100 of the third embodiment, a part of the current path between the feeding terminals 741 and 742 and the heater pad portions 521 and 522 in the conductive regions 61 and 62 of the driver electrode 60 and the feeding. It is possible to suppress the proximity of a part of the current path between the terminals 741 and 742 and the other heater pad portions 521 and 522, and the current flows at specific points in the conductive regions 61 and 62 of the driver electrode 60. As a result, it is possible to prevent the location from becoming a high-temperature temperature singular point due to the concentration of heat generated, and the controllability of the temperature distribution of the suction surface S1 of the ceramic member 10 (and thus the controllability of the temperature distribution of the wafer W). Can be improved.

Further, in the electrostatic chuck 100 of the third embodiment, similarly to the electrostatic chuck 100 of the first embodiment, the electrostatic chuck 100 is sandwiched between the other heater pad portions 521 and 522 and the power supply terminals 741, 742 in the Z-axis direction. The above-mentioned heater pad portions 521 and 522 are arranged at positions that do not overlap with the above-mentioned regions. Therefore, in the electrostatic chuck 100 of the third embodiment, a part of the current path between the feeding terminals 741 and 742 and the heater pad portions 521 and 522 in the conductive regions 61 and 62 of the driver electrode 60 and the feeding. It is possible to effectively suppress the proximity of a part of the current path between the terminals 741 and 742 and the other heater pads 521 and 522, and at specific points in the conductive regions 61 and 62 of the driver electrode 60. It is possible to effectively suppress the concentration of heat generated by the flow of electric current and the location becoming a high temperature singular point, and the controllability of the temperature distribution of the suction surface S1 of the ceramic member 10 (and by extension, the wafer W). The controllability of the temperature distribution) can be effectively improved.

Further, in the electrostatic chuck 100 of the third embodiment, the electrostatic chuck 100 is separated by a first virtual straight line VL1 and a second virtual straight line VL2 that pass through the center points of the feeding terminals 741 and 742 and are orthogonal to each other in the Z-axis direction. Among the four regions, the one heater pad portion 521, 522 is located in another region facing the region where the other heater pad portions 521, 522 are located with the center point of the power supply terminals 741, 742 interposed therebetween. Have been placed. Therefore, in the electrostatic chuck 100 of the third embodiment, a part of the current path between the feeding terminals 741 and 742 and the heater pad portions 521 and 522 in the conductive regions 61 and 62 of the driver electrode 60 and the feeding. It is possible to extremely effectively suppress the proximity of a part of the current path between the terminals 741 and 742 and the other heater pad portions 521 and 522, and a specific location in the conductive regions 61 and 62 of the driver electrode 60. It is possible to extremely effectively suppress the concentration of heat generated by the current flowing in the area and the temperature singularity at a high temperature, and the controllability of the temperature distribution of the suction surface S1 of the ceramic member 10 (and by extension, the wafer). The controllability of the temperature distribution of W) can be improved extremely effectively.

D. Fourth Embodiment:
FIG. 9 is an explanatory diagram showing the positional relationship between the power feeding terminal and the heater pad portion of the heater electrode in the electrostatic chuck 100 of the fourth embodiment. In the following, among the configurations of the electrostatic chuck 100 of the fourth embodiment, the same configurations as the configurations of the electrostatic chuck 100 of the first embodiment described above will be appropriately omitted by adding the same reference numerals. ..

As shown in FIG. 9, in the electrostatic chuck 100 of the fourth embodiment, the driver electrode 60 connected to one heater pad portion 521 in the Z-axis direction as in the electrostatic chuck 100 of the first embodiment. The center point of another heater pad portion 521, which is connected to the conductive region 61 of the same driver electrode 60 as the conductive region 61 of the above and is farther from the feeding terminal 741 than the one heater pad portion 521, and the feeding terminal 741. The above-mentioned heater pad portion 521 is arranged at a position that does not overlap with the virtual line segment connecting the center point. That is, the heater pad portion 521a is recently arranged at a position that does not overlap with the virtual line segment VLSb connecting the center point Pb of the farthest heater pad portion 521b and the center point P0 of the first power feeding terminal 741 in the Z-axis direction. ing.

Further, in the electrostatic chuck 100 of the fourth embodiment, similarly to the electrostatic chuck 100 of the first embodiment, when viewed in the Z-axis direction, the other heater pad portion 521 (distance from the power feeding terminal 741 is farther). The heater pad portion 521 (the heater pad portion 521 closer to the power supply terminal 741) is arranged at a position that does not overlap with the area sandwiched between the heater pad portion 521) and the power supply terminal 741. There is. That is, the heater pad portion 521a is recently arranged at a position that does not overlap with the region Rb sandwiched between the farthest heater pad portion 521b and the power supply terminal 741 in the Z-axis direction.

Further, in the electrostatic chuck 100 of the fourth embodiment, the electrostatic chuck 100 is separated by a first virtual straight line VL1 and a second virtual straight line VL2 that pass through the center point P0 of the power feeding terminal 741 and are orthogonal to each other in the Z-axis direction. Within one region, the region where the other heater pad portion 521 (heater pad portion 521 farther from the power supply terminal 741) is located with the second virtual straight line VL2 (or the first virtual straight line VL1) sandwiched between them. One heater pad portion 521 (heater pad portion 521 closer to the power supply terminal 741) is arranged in another region adjacent to the above. In such an arrangement of the heater pad portion 521, a part of the current path between the one heater pad portion 521 and the first power supply terminal 741 and between the other heater pad portion 521 and the first power supply terminal 741. It is possible to reduce the size and simplification of the conductive region 61 of the driver electrode 60 while suppressing the proximity of a part of the current path of the driver electrode 60.

Although the positional relationship between the power supply terminal electrically connected to the first conductive region 61 of one driver electrode 60 and each heater pad portion has been described here, in the present embodiment, the first driver electrode 60 is the first. For both the conductive region 61 of 1 and the second conductive region 62, the positional relationship between the power supply terminal electrically connected to the conductive regions 61 and 62 and each heater pad portion has the same positional relationship.

As described above, in the electrostatic chuck 100 of the fourth embodiment, similarly to the electrostatic chuck 100 of the first embodiment, the driver electrodes connected to one heater pad portion 521,522 in the Z-axis direction view. Another heater pad portion 521 that is connected to the conductive regions 61 and 62 of the same driver electrode 60 as the conductive regions 61 and 62 of 60 and is farther from the feeding terminals 741 and 742 than the one heater pad portion 521 and 522. The heater pad portions 521 and 522 are arranged at positions that do not overlap with the virtual line segment connecting the center points of the power supply terminals 741 and 742 and the center points of the power supply terminals 741 and 742. Therefore, in the electrostatic chuck 100 of the fourth embodiment, a part of the current path between the feeding terminals 741 and 742 and the heater pad portions 521 and 522 in the conductive regions 61 and 62 of the driver electrode 60 and the feeding. It is possible to suppress the proximity of a part of the current path between the terminals 741 and 742 and the other heater pad portions 521 and 522, and the current flows at specific points in the conductive regions 61 and 62 of the driver electrode 60. As a result, it is possible to prevent the location from becoming a high-temperature temperature singular point due to the concentration of heat generated, and the controllability of the temperature distribution of the suction surface S1 of the ceramic member 10 (and thus the controllability of the temperature distribution of the wafer W). Can be improved.

Further, in the electrostatic chuck 100 of the fourth embodiment, similarly to the electrostatic chuck 100 of the first embodiment, the electrostatic chuck 100 is sandwiched between the other heater pad portions 521 and 522 and the power supply terminals 741, 742 in the Z-axis direction. The above-mentioned heater pad portions 521 and 522 are arranged at positions that do not overlap with the above-mentioned regions. Therefore, in the electrostatic chuck 100 of the fourth embodiment, a part of the current path between the feeding terminals 741 and 742 and the heater pad portions 521 and 522 in the conductive regions 61 and 62 of the driver electrode 60 and the feeding. It is possible to effectively suppress the proximity of a part of the current path between the terminals 741 and 742 and the other heater pads 521 and 522, and at specific points in the conductive regions 61 and 62 of the driver electrode 60. It is possible to effectively suppress the concentration of heat generated by the flow of electric current and the location becoming a high temperature singular point, and the controllability of the temperature distribution of the suction surface S1 of the ceramic member 10 (and by extension, the wafer W). The controllability of the temperature distribution) can be effectively improved.

Further, in the electrostatic chuck 100 of the fourth embodiment, the electrostatic chuck 100 is separated by a first virtual straight line VL1 and a second virtual straight line VL2 that pass through the center points of the feeding terminals 741 and 742 and are orthogonal to each other in the Z-axis direction. Of the four regions, one heater pad portion is arranged in another region adjacent to the region where the other heater pad portion 521 is located with the first virtual straight line VL1 or the second virtual straight line VL2 interposed therebetween. .. Therefore, in the electrostatic chuck 100 of the fourth embodiment, a part of the current path between the feeding terminals 741 and 742 and the heater pad portions 521 and 522 in the conductive regions 61 and 62 of the driver electrode 60 and the feeding. The controllability of the temperature distribution of the suction surface S1 of the ceramic member 10 (and by extension, the wafer W) is suppressed by suppressing the proximity of a part of the current path between the terminals 741 and 742 and the other heater pad portions 521 and 522. The controllability of the temperature distribution) can be improved, and the conductive regions 61 and 62 of the driver electrode 60 can be miniaturized and simplified.

E. Modification example:
The technique disclosed in the present specification is not limited to the above-described embodiment, and can be transformed into various forms without departing from the gist thereof. For example, the following modifications are also possible.

The configuration of the electrostatic chuck 100 in the above embodiment is merely an example and can be variously deformed. For example, the electrostatic chuck 100 of the above embodiment is
(1) When viewed in the Z-axis direction, the driver electrode 60 is connected to the same conductive regions 61 and 62 of the driver electrode 60 connected to the heater pad portions 521 and 522, and is connected to the conductive regions 61 and 62 of the same driver electrode 60. At a position that does not overlap with the virtual line segment connecting the center points of the other heater pads 521 and 522, which are farther from the power supply terminals 741 and 742 than the heater pads 521 and 522, and the center points of the power supply terminals 741 and 742. , The condition that the above-mentioned one heater pad portions 521 and 522 are arranged, and
(2) The one heater pad portion 521, 522 is arranged at a position that does not overlap with the region sandwiched between the other heater pad portions 521 and 522 and the power supply terminals 741, 742 in the Z-axis direction. And the condition
However, if at least the condition (1) is satisfied among the above two conditions, the condition (2) may not be satisfied. Even with such a configuration, a part of the current path between the feeding terminals 741,742 and one heater pad portion 521,522 in the conductive regions 61 and 62 of the driver electrode 60, and the feeding terminals 741,742. It is possible to prevent a part of the current path between the heater pad portion 521 and 522 from being close to each other, and heat is generated due to the current flowing at specific points in the conductive regions 61 and 62 of the driver electrode 60. Concentration can prevent the location from becoming a high-temperature temperature singular point, and improve the controllability of the temperature distribution of the suction surface S1 of the ceramic member 10 (and thus the controllability of the temperature distribution of the wafer W). Can be done.

In the electrostatic chuck 100 of the above embodiment, for both the first conductive region 61 and the second conductive region 62 of each driver electrode 60, the power supply terminal and each heater pad electrically connected to the conductive regions 61 and 62. Although the positional relationship with the portion satisfies the above conditions (remaining 1) and (2), at least one of the first conductive region 61 and the second conductive region 62 in at least one driver electrode 60 is described above. It suffices that the conditions (1) and (2) (or at least the condition (1)) are satisfied. In such a configuration, a part of the current path between the feeding terminals 741,742 and one heater pad portion 521,522 in the conductive regions 61 and 62 satisfying the above conditions, and the feeding terminals 741 and 742 It is possible to suppress the proximity of a part of the current path between the other heater pad portions 521 and 522, and the heat generated by the current flowing at specific points in the conductive regions 61 and 62 of the driver electrode 60 is concentrated. However, it is possible to prevent the location from becoming a high-temperature temperature singularity, and improve the controllability of the temperature distribution of the suction surface S1 of the ceramic member 10 (and thus the controllability of the temperature distribution of the wafer W). can.

Further, in the above embodiment, each via may be composed of a single via or a group of a plurality of vias. Further, in the above embodiment, each via may have a single-layer structure consisting of only a via portion, or may have a multi-layer structure (for example, a structure in which a via portion, a pad portion, and a via portion are laminated). May be good.

Further, in the above embodiment, a unipolar method in which one chuck electrode 40 is provided inside the ceramic member 10 is adopted, but a bipolar method in which a pair of chuck electrodes 40 are provided inside the ceramic member 10 is adopted. It may be adopted. Further, the material forming each member in the electrostatic chuck 100 of the above embodiment is merely an example, and each member may be formed of another material.

Further, the present invention is not limited to the electrostatic chuck 100 which includes the ceramic member 10 and the base member 20 and holds the wafer W by utilizing electrostatic attraction, but also includes the ceramic member and an object on the surface of the ceramic member. It can also be applied to other holding devices (for example, a heater device such as a CVD heater, a vacuum chuck, etc.).

10: Ceramics member 12: Recessed portion 20: Base member 21: Refrigerant flow path 22: Through hole 30: Adhesive layer 32: Through hole 40: Chuck electrode 50: Heater electrode layer 60: Driver electrode 61: First conductive region 62: Second conductive region 100: Electrostatic chuck 110: Hole for first terminal 120: Hole for second terminal 500: Heater electrode 510: Heater line part 521: First heater pad part 522: Second heater pad Part 711: First feeding side via 712: Second feeding side via 721: First heater side via 722: Second heater side via 731: First electrode pad 732: Second electrode pad 741: First 1 power supply terminal 742: 2nd power supply terminal

Claims (4)

A ceramic member having a substantially flat first surface substantially perpendicular to the first direction,
A plurality of heater electrodes arranged inside the ceramic member, each of which is connected to a heater line portion which is a linear resistance heating element in the first directional view and an end portion of the heater line portion. In addition, a plurality of heater electrodes having a heater pad portion having a width larger than that of the heater line portion in the first directional view, and a plurality of heater electrodes.
A driver electrode arranged inside the ceramic member and including a conductive region,
Power supply terminal and
A feeding side via that electrically connects the feeding terminal and the conductive region of the driver electrode,
A heater-side via that electrically connects the heater pad portion of each heater electrode and the conductive region of the driver electrode, and
In a holding device for holding an object on the first surface of the ceramic member.
In the first directional view, the power supply terminal is connected to the conductive region of the driver electrode, which is the same as the conductive region of the driver electrode connected to the heater pad portion, and is connected to the conductive region of the driver electrode. The one heater pad portion is arranged at a position that does not overlap with the virtual line segment connecting the center point of the other heater pad portion and the center point of the power feeding terminal, which are far from the center point .
Of the three heater pads, the heater pad that is closest to the power supply terminal is the latest heater pad, and the heater pad that is the farthest from the power supply terminal is the farthest heater pad. When the remaining one heater pad portion is used as an intermediate heater pad portion, the virtual line segment connecting the center point of the recent heater pad portion and the center point of the power feeding terminal in the first directional view and the farthest It is defined by a virtual line segment connecting the center point of the heater pad portion and the center point of the power feeding terminal, and a virtual line segment connecting the center point of the recent heater pad portion and the center point of the farthest heater pad portion. The virtual triangle is a holding device that does not overlap with a virtual line segment connecting the center point of the intermediate heater pad portion and the center point of the power feeding terminal. In the holding device according to claim 1,
The holding device, characterized in that, in the first directional view, the one heater pad portion is arranged at a position that does not overlap with the region sandwiched between the other heater pad portion and the power feeding terminal. In the holding device according to claim 1 or 2.
In the first directional view, among the four regions that pass through the center point of the power feeding terminal and are separated by the first and second virtual straight lines that are orthogonal to each other, the region where the other heater pad portion is located. On the other hand, the holding device is characterized in that the one heater pad portion is arranged in the other region facing the center point of the power feeding terminal. In the holding device according to claim 1 or 2.
In the first directional view, the first or second virtual straight line is sandwiched between the four regions that pass through the center point of the power feeding terminal and are separated by the first and second virtual straight lines that are orthogonal to each other. A holding device, characterized in that the one heater pad portion is arranged in another region adjacent to the region in which the other heater pad portion is located.

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