JP6911399B2 - Connecting devices, electronic components, and manufacturing methods for electronic components - Google Patents

Description

The present invention relates to a connecting device, an electronic component, and a method for manufacturing the electronic component.

In recent years, the performance, miniaturization, and price reduction of mobile communication devices have been rapidly advancing, and instead of connecting a plurality of boards with a cable, the boards may be directly fitted with a connector. As a connector used for this purpose, for example, there is a connector described in Patent Document 1.
The connector described in Patent Document 1 uses a pin penetrating through holes of two printed boards. This connector uses a slit formed on the head of the pin to elastically deform the pin and allow it to penetrate through the through hole, and the pin is connected to the two substrate through holes by the bias of the coil spring. It has become.
Further, the connector described in Patent Document 2 has a configuration in which a spring-deformable conductor is inserted into a substrate to connect the connector.

Japanese Unexamined Patent Publication No. 4-342194 Japanese Unexamined Patent Publication No. 2006-172986

However, in the connector described in Patent Document 1, when trying to correspond to various distances between the boards to be connected, the degree of freedom of the fitting distance is insufficient, or the positions of both boards to be fitted are restricted. There is a problem that it cannot be mounted suitable for miniaturization due to restrictions such as. Further, since the structure is such that a pin deformed by a minute amount corresponding to the width of the split of the head is penetrated through the substrate and is prevented from coming off by an umbrella-shaped portion, a through hole or a pin is formed at a predetermined dimensional intersection. This requires high-precision machining, and there is a problem that manufacturing becomes difficult especially when the through hole has a small diameter.

Further, although the connector described in Patent Document 2 can be attached to a through hole of a substrate with a simple configuration, it cannot be applied as it is when a plurality of substrates are to be connected to each other.

The present invention has been proposed to solve the above problems, and an object of the present invention is to provide a technique for easily connecting a plurality of circuit boards arranged in various arrangements.

In order to solve the above problems, the present invention proposes the following means.
The connecting device according to the first aspect of the present invention is provided by penetrating one object to be connected in the thickness direction, is elastically deformable in the direction intersecting the penetrating direction, and at least the surface is made of a conductive material. Another connected object provided at a thickness direction between the formed one penetrating member and the one object to be connected is provided so as to penetrate in the thickness direction, and the penetrating direction and the other object to be connected are provided. Elastically deformable in the intersecting direction, at least another penetrating member whose surface is formed of a conductive material, and one of these members and the other member are electrically connected to each other so that they can be elastically deformed in the penetrating direction. It is characterized by having a formed connecting member. Further, the connection device according to the first aspect is characterized in that one substrate and another substrate are connected to each other to form an electronic component.

The manufacturing method according to the second aspect of the present invention includes a step of arranging one connected object having a through hole and another connected object at predetermined relative positions, and elasticity in the through hole of the one connected object. One penetrating member configured to be insertable in a deformed state, another penetrating member configured to be insertable into the through hole of the other object to be connected in an elastically deformed state, and one penetrating member and another penetrating member. The step of passing the connecting member elastically deformably connected to and through the through hole of the one object to be connected and the other object to be connected, and the one penetrating member, the other penetrating member, and the connection. The step of passing the member through the through hole of the one object to be connected and the other object to be connected while elastically deforming the member, and the step of aligning the one penetrating member with the one object to be connected and passing the other through member to the other It is characterized in that an electronic component is manufactured by a step of aligning with the object to be connected and a step of aligning the one object to be connected with another object to be connected while elastically deforming the connecting member.

According to the present invention, it is possible to easily connect a plurality of electronic boards arranged in various ways.

It is a side view which shows the outline of 1st Embodiment of this invention. It is a vertical cross-sectional view when connecting circuit boards having a large mutual spacing by using the connection device which concerns on 2nd Embodiment of this invention. It is a vertical cross-sectional view at the time of connecting circuit boards having a small mutual spacing by using the connection device which concerns on 2nd Embodiment of this invention. It is a vertical cross-sectional view at the time of connecting circuit boards deviated in the plane direction by using the connection device which concerns on 2nd Embodiment of this invention. It is an enlarged sectional view of the contact of the connection device which concerns on 2nd Embodiment of this invention. It is a vertical cross-sectional view when connecting circuit boards having a large mutual spacing by using the connection device which concerns on 3rd Embodiment of this invention. It is a vertical cross-sectional view when connecting circuit boards having a large mutual spacing by using the connection device which concerns on 3rd Embodiment of this invention.

A first embodiment showing the minimum configuration of the present invention will be described with reference to FIG. Reference numeral 1 is a first penetrating member, which is provided so as to penetrate one object to be connected in the thickness direction and expands and contracts in the direction intersecting the penetrating direction, that is, in the left-right direction of FIG. 1 indicated by arrows A and B. It is configured to be elastically deformable. Further, at least the surface of the first penetrating member 1 is formed of a conductive material. Reference numeral 2 is a second penetrating member, which is provided through the other connected object provided at intervals in the thickness direction of the one object to be connected, and is provided in a direction intersecting the penetrating direction, that is, , A and B are elastically deformable so as to expand and contract in the left-right direction of FIG. Further, at least the surface of the second penetrating member 2 is formed of a conductive material.

Reference numeral 3 is a connecting member that electrically and mechanically connects the first penetrating member 1 and the second penetrating member 2. The connecting member 3 is elastically deformable so as to expand and contract in the penetrating direction, that is, in the vertical direction indicated by arrows C and D in FIG.

In the connecting device of the first embodiment, the first penetrating member 1 and the second penetrating member 2 are elastically deformed so as to contract in the directions of arrows A and B, so that an object to be connected such as a circuit board is formed. It can pass through the through hole. After passing through the through hole, it is restored to be larger than the inner diameter of the through hole and is prevented from coming off from the through hole. The connecting member 3 is elastically deformed in the directions indicated by arrows C and D, so that the distance between the first penetrating member 1 and the second penetrating member 2 is the distance between the circuit boards as the objects to be connected (upper and lower in FIG. 1). It can be adjusted according to the distance in the direction).

Next, the second embodiment will be described with reference to FIGS. 2 to 5.
In the second embodiment, the contact 11 corresponding to the first penetrating member 1 and the contact 21 corresponding to the second penetrating member 2, which have springiness at both ends as shown in FIG. 2, have the same springiness. A metal terminal having a contact 31 corresponding to the connecting member 3 is used to connect the first circuit board 4 and the second circuit board 5.

A through hole penetrating in the thickness direction is formed in the first circuit board 4 and the second circuit board 5, and a metal grommet 6 is fitted in the through hole. In the case of the second embodiment, the inner diameter portions of the grommet 6 penetrate through the first circuit board 4 and the second circuit board 5 through holes 41 and 51 (in the case of illustration, through holes having the same inner diameter and the same length). ).

The contact 11 and the contact 31 and the contact 21 and the contact 31 are connected by a straight line portion 7, respectively. The connecting device according to the second embodiment is formed by, for example, forming a conductor plate narrower than the inner diameter of the grommet 6 into a side shape as shown in FIG. 2 by bending or the like to form contacts 11, 21, 31 and straight lines. The portions 7 are integrally formed so that they can be elastically deformed in the left-right direction or the up-down direction of FIG.

In the connecting device having the above configuration, since the contact 11 is elastically deformed as a spring and the width (dimension in the left-right direction in FIG. 2) is variable, the contact 11 is formed through the acute-angled corner of the diamond. By pushing it into the hole 41, it is pushed into the through hole 41 along the inclination of the contact 11, and can pass through while elastically deforming in the shrinking direction in a vertically elongated shape. Then, after being inserted into the through hole 41, as shown in FIG. 3, the circuit board 4 or the circuit board 4 or the circuit board 4 or by elastically restoring and expanding the diameter larger than the diameter of the through hole 41 by protruding upward from the through hole 41. It serves as a stopper to prevent it from easily coming off from 5.

That is, as shown in FIG. 2, when the distance l between the circuit boards 4 and 5 is large, the contact 11 comes into contact with the inner surface of the grommet 6 in an elastically deformed state, and as shown in FIG. 3, the circuit boards 4 and 5 When the distance l from the contact is small, the contact 11 is elastically restored at a position above the grommet 6 to be larger than the diameter of the through hole 41.

The contact 31 can also be expanded and contracted in the same manner as the contacts 11 and 21, but the direction in which the contact 11 and 21 are easily elastically deformed is different, and as shown in FIG. 3, the contact 31 is crushed in the vertical direction to form a horizontally long rhombus. It is a spring that is easily elastically deformed. By combining the contacts 11 and 21 that are easily elastically deformed in the left-right direction (the radial direction of the through hole 41) and the contacts 31 that are easily elastically deformed in the vertical direction (the penetrating direction of the through hole 41), between the substrates. Even if the distance and the positional relationship in the horizontal direction change, the electrical coupling between the substrates can be maintained. Further, when the through holes 41 and 51 are displaced in the left-right direction of FIG. 4 along the surfaces of the circuit boards 4 and 5, as shown in FIG. 4, for example, due to the elastic deformation of the contacts 11 and 21. Even if the connection device is elastically deformed, the contacts 11, 21, 31, and a part or all of the straight portion 7 can come into contact with the grommet 6 and be electrically connected.

Further, as shown in FIG. 5, the contact 31 is not deformed vertically like the contacts 11 and 21 and enters the through hole 41 (51) when pushed into the through hole 41 (51). The protrusion 32 is provided. This makes it possible to control the expansion and contraction directions of the two types of contacts, the contacts 11 and 21, and the contact 31. The contacts 11 and 21 penetrate the through hole and serve as a spring that expands and contracts in the horizontal direction so as to serve as a stopper after the penetration, and the contact 31 is a distance between the two printed circuit boards 4 and 5. It plays a role as a spring that expands and contracts in the vertical direction according to l. The contacts 11, 21, and 31 can be manufactured by a simple manufacturing process by molding a metal plate, and can function as metal terminals that electrically connect the circuit board 4 and the circuit board 5 to each other. can.

Next, a step of manufacturing an electronic component by connecting a plurality of circuit boards using the connecting device of the second embodiment will be described.
As shown in FIG. 2, for the upper and lower circuit boards 4 and 5, the contact 11 of the metal terminal having the contacts 11 and 21 is passed through the through holes 41 and 51 of the respective circuit boards 4 and 5. .. As a result, the upper and lower circuit boards 41 and 51 are electrically coupled via the metal terminals (connecting devices composed of conductors) integrally formed by the contacts 11, 21, 31 and the straight line portion 7. ..

In the second embodiment, the following can be applied to the change in the distance between the circuit boards. That is, when the distance l between the circuit boards 4 and 5 is long, the through hole 41 and the contact 11 come into contact with each other at the contact 8 as shown in FIG. Further, even when the distance l between the circuit boards 4 and 5 is longer than that in FIG. 2, the contact 8 can come into contact with the through hole 41 by extending the intermediate contact 31 in the vertical direction, and the distance l Can accommodate long arrangements.

Further, when it is desired to separate the upper and lower circuit boards 4 and 5, the contact 7 is reduced in the horizontal direction by continuously pulling in the direction in which the distance l between these circuit boards becomes longer, and the contact 7 is allowed to pass through the through holes 41 and 51. Therefore, the contact between the contacts 11, 21, or 31 and the circuit boards 4, 5 may be eliminated. The distance between the circuit boards 4 and 5 is increased until the contacts 11 and 21 pass through the through holes 41 and 51 and the connections with the circuit boards 4 and 5 are separated. be able to.

On the other hand, when the distance l between the substrates is short, the through hole 41 and the contact 31 come into contact with each other at the contact 9 as shown in FIG. Since the distance l between the substrates is shortened, the portion of the contact 9 is pushed by the through holes 41 and 51, but the contact 31 is vertically deformed due to the elastic deformation of the contact 31 and the presence of the protrusion 32 as shown in FIG. By being crushed, the contact of the contact 8 in FIG. 2 cannot be maintained, but the contact 9 can maintain the contact. That is, the contact 31 cannot enter the grommet 6 because the protrusion 32 abuts on the edge of the grommet 6 as shown in FIG. 5 (A), whereas the contact 31 cannot enter the grommet 6 as shown in FIG. 5 (B). By sliding the protrusion 32 along the surface of the grommet 6, it can be elastically deformed in the vertical direction (penetration direction). The contacts 11 and 21 may be formed in a vertically long diamond shape to facilitate deformation in the width direction, and the contacts 31 may be formed in a horizontally long diamond shape to facilitate deformation in the vertical direction.

Further, since the contacts 11 and 21 are provided as shown in FIG. 4, these contacts 11 and 21 are formed even when the positions of the circuit boards 4 and 5 in the lateral direction (direction along the surface) are changed. Due to the elasticity of and, the upper and lower circuit boards 4 and 5 can continue to be electrically coupled. As a result, even if the circuit boards 4 and 5 have a structure that does not involve fixing to a case or the like that accommodates them by screwing or the like, the contacts 11 and 21 do not come out of the through holes 41 and 51. If there is, the contact can be maintained. Further, when the horizontal positional relationship between the substrates is not fixed, such as when mounting the substrate in a floating structure, the electrical connection between the substrates can be maintained even in a structure in which the distance l between the substrates differs depending on the location.

Further, in FIGS. 2 to 4, the contacts 11 to 31 and the contacts 21 to 21 are simply connected by the straight line portion 7, but may be changed as in the third embodiment shown in FIGS. 6 and 7. good.
Specifically, instead of the straight portion 7 of the second embodiment, a spring structure portion 7A having a shape formed in an elastically deformable bent shape and deformable in a direction intersecting the wiring board may be used. It is valid.

That is, by providing the elastically deformable spring structure portion 7A, the limitation due to the positional relationship (displacement in the surface direction and the distance in the direction intersecting the surface) of the circuit boards 4 and 5 to be fitted is minimized as much as possible. Stable contact can be ensured at both the contact 8 and the contact 9 regardless of the deviation, and the impedance change due to the fluctuation of the contact resistance between the upper and lower wiring boards 4 and 5 is reduced. It is possible to pass a high-speed signal.

As shown in FIG. 6, when the distance l between the substrates is relatively large, the contact 8 and the contact 9 can be brought into contact with each other by contracting the spring structure 7A. When the distance l between the substrates is small, the contact 31 is crushed and is in contact with the contact 9, and the contact 9 can be maintained by the spring structure 7A pulling the contact 31.

In the third embodiment, the spring structure 7A provided at the terminal is deformed in the thickness direction of the circuit board (penetration direction of the contact), so that the spring structure portion 7A can be easily expanded and contracted according to the fitting distance of the circuit board. Further, since the spring structure portion 7A can be deformed in the surface direction of the circuit board, it is possible to give a certain degree of freedom to the positional relationship of the circuit boards 4 and 5 in the horizontal direction. For example, the circuit board 4 It is possible to connect even if 5 is a floating structure that can be moved (or is relatively movable) with respect to the housing.

In each of the above embodiments, a case where two circuit boards are connected by using a connecting device has been described, but a number of contacts elastically deformable in the width direction are provided according to the number of circuit boards, and between them. A structure may be adopted in which the two are connected by elastically deformable contacts in the penetrating direction to the through hole.

The specific structure of the contact is not limited to a structure that utilizes elastic deformation of a member formed by bending and molding a plate-shaped metal as in the above embodiment, and for example, a rigid body-shaped conductor that comes into contact with a grommet. The structure may be connected by a spring and can be displaced in a predetermined direction by elastic deformation of the spring.
The material constituting the contact is not limited to a conductor such as metal, and for example, a conductor coating is applied to the surface of an elastically deformable plastic material (for example, a contact surface with a circuit board such as a grommet) by metal plating or the like. It may be provided.

Although the embodiments of the present invention have been described in detail with reference to the drawings, the specific configuration is not limited to this embodiment, and design changes and the like within a range not deviating from the gist of the present invention are also included.

The present invention relates to a connecting device used for electrical connection of an electronic component, an electronic component connected by the connecting device, and a method for manufacturing the same.

1 1st through member 2 2nd through member 3 Connecting member 4 1st circuit board 5 2nd circuit board 6 Grommet 7 Straight part 7A Spring structure part 8 Contact 9 Contact 11 Contact 21 Contact 31 Contact 32 Protrusion 41 Through Hall 51 Through hole

Claims (3)

Provided through the one of the conjugate in the thickness direction through the grommet provided on one of the coupled product, a resiliently deformable in a direction crossing the extending direction, at least the surface of the conductive A single penetrating member made of material,
It is provided so as to penetrate the one object to be connected in the thickness direction through a grommet provided in another object to be connected provided at a distance in the thickness direction from the one object to be connected. , an elastically deformable in a direction crossing the extending direction, and the other penetrating member at least the surface is formed of a conductive material,
A connecting member formed by electrically connecting one of the penetrating members and the other penetrating member to each other so as to be elastically deformable in the penetrating direction.
Have,
The one penetrating member has a first contact that is arranged to face each other and is composed of a plurality of metal members that are elastically deformably connected to each other in the opposite directions.
The other penetrating member has a second contact that is arranged to face each other and is composed of a plurality of metal members that are elastically deformably connected to each other in the opposite direction.
The connecting member has a third contact made of a metal member that connects the first contact and the second contact to each other.
The first contact, the second contact, and the third contact have a plate shape,
The first contact, the second contact, and the third contact are formed by molding a part of an integral strip-shaped metal plate into a predetermined shape.
The first contact, the second contact, and the third contact form a rhombus whose penetrating direction is diagonal and form a rhombus.
The first contact, the second contact, and the third contact are formed so as to be contactable with the peripheral edge of the grommet, and the connecting member between the first contact, the second contact, and the third contact penetrates. The member is a connecting device characterized in that it is formed so as to be movable with respect to the inner surface of the grommet. An electronic component having the connecting device according to claim 1, one circuit board through which one penetrating member of the connecting device penetrates, and another circuit board through which another penetrating member penetrates. A method for manufacturing an electronic component that connects one connected object and another connected object by the connecting device according to claim 1.
A step of arranging one connected object having a through hole and another connected object at predetermined relative positions, and
A step of aligning the one through member with a through hole of one object to be connected and aligning the other through member with a through hole of another object to be connected.
One penetrating member configured to be inserted into the through hole of the one object to be connected in an elastically deformed state, another penetrating member configured to be insertable into the through hole of the other object to be connected in an elastically deformed state, And the step of passing the connecting member that elastically deformably connects between the one penetrating member and the other penetrating member through the through hole of the one connected object and the other connected object while elastically deforming the connecting member.
A step of aligning the one object to be connected with the other object to be connected while elastically deforming the connecting member.
A method of manufacturing an electronic component having.

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