JP6908043B2 - Sensors and electronics - Google Patents

Description

The present technology relates to a sensor capable of detecting a touch operation and a pressing operation, and an electronic device including the sensor.

As a pressure detection type capacitive sensor, a sensor layer including intersecting transmitting electrodes and receiving electrodes, a first grounding electrode provided on one surface side of the sensor layer via a deformation layer, and deformation on the other surface side of the sensor. A device including a second ground electrode provided via a layer has been proposed (see, for example, Patent Document 1). In this sensor, when the operation surface is pressed, the mutual capacitance of the intersection of the transmitting electrode and the receiving electrode changes due to the influence of the ground electrodes arranged above and below. By detecting this change in mutual capacitance with the controller IC, it is possible to detect the pressing operation on the operation surface.

Japanese Unexamined Patent Publication No. 2014-179602

In the sensor having the above configuration, it is possible to detect both the touch operation and the pressing operation by removing the electrode provided on the operation surface side of the first ground electrode and the second ground electrode. However, in the sensor having the configuration in which one of the electrodes is removed as described above, the operation sensitivity is low when the operation surface is pressed by a non-conductor such as a stylus pen.

An object of the present technology is to provide a sensor capable of detecting a touch operation and a pressing operation, a sensor capable of improving the sensitivity of the pressing operation by a non-conductor, and an electronic device including the sensor.

In order to solve the above-mentioned problems, the first technique is
It is a sensor that can detect touch operation and pressing operation.
Ground electrode and
A plurality of first electrodes provided on the ground electrode and
It is provided with a plurality of second electrodes provided on the first electrode.
An operation surface is provided on the second electrode,
A sensing unit is configured at the first intersection of the first electrode and the second electrode.
Each first electrode is composed of a plurality of first sub-electrodes.
Each second electrode is composed of a plurality of second sub-electrodes.
The second intersection is composed of the first sub-electrode and the second sub-electrode.
The length of the second intersection of the boundary line that looks when the ground electrode and the second cross-section in plan view L1 is a boundary line of the second intersecting portion looks when the operation surface side and the second cross-section in plan view It is a sensor longer than the length L2 of.

The second technology is
A sensor that can detect pressing operations
With the first ground electrode
A plurality of first electrodes provided on the first ground electrode and
A plurality of second electrodes provided on the first electrode and
A second ground electrode provided on the second electrode is provided.
An operation surface is provided on the second ground electrode,
A sensing unit is configured at the first intersection of the first electrode and the second electrode.
Each first electrode is composed of a plurality of first sub-electrodes.
Each second electrode is composed of a plurality of second sub-electrodes.
The second intersection is composed of the first sub-electrode and the second sub-electrode.
The length L1 of the second intersection of the boundary line that looks when the first ground electrode and the second cross-section in plan view, the second cross section looks when the operation surface side and the second cross-section in plan view It is a sensor having a different boundary line length L2.

A third technique is an electronic device comprising a sensor of the first or second technique.

According to the present technology, in a sensor capable of detecting a touch operation and a pressing operation, the sensitivity of the pressing operation by a non-conductor can be improved.

FIG. 1A is a schematic view showing a touch operation by a conductor. FIG. 1B is a schematic view showing a pressing operation by a conductor. FIG. 1C is a schematic view showing a pressing operation by a non-conductor. FIG. 2 is a block diagram showing a configuration of an electronic device according to a first embodiment of the present technology. FIG. 3A is a cross-sectional view showing the configuration of the sensor. FIG. 3B is a plan view showing the configuration of the sensor layer. FIG. 4 is a plan view showing the configuration of the sensing unit. FIG. 5A is a cross-sectional view taken along the line VA-VA of FIG. FIG. 5B is an enlarged cross-sectional view showing a part of FIG. 5A. FIG. 6A is a cross-sectional view taken along the line VIA-VIA of FIG. FIG. 6B is an enlarged cross-sectional view showing a part of FIG. 6A. FIG. 7A is a plan view showing the intersection viewed in plan from the operation surface side. FIG. 7B is a cross-sectional view taken along the line VIIB-VIIB of FIG. 7A. FIG. 8A is a plan view showing the intersection viewed in plan from the ground electrode side. FIG. 8B is a cross-sectional view taken along the line VIIB-VIIIIB of FIG. 8A. FIG. 9A is a plan view showing a portion where leakage of electric lines of force is large at an intersection viewed from the operation surface side in a plan view. FIG. 9B is a plan view showing a portion where the leakage of electric lines of force is large at the intersection viewed in plan from the ground electrode side. FIG. 10A is a schematic view showing a configuration in which the distance D between the electrodes is very small as compared with the length L of the side of the electrodes. FIG. 10B is a schematic view showing a configuration in which the distance D between the electrodes is substantially equal to the length L of the side of the electrodes. FIG. 11 is a graph showing sensor output during operation by conductors and non-conductors. 12A, 12B, and 12C are cross-sectional views for explaining the operation of the sensor, respectively. FIG. 13 is a graph showing the sensor output during operation by the conductor. FIG. 14A is a graph showing sensor output during operation by conductors and non-conductors. FIG. 14B is a graph showing the sensor output when FD> BD. FIG. 14C is a graph showing the output of the sensor when FD> BD and L1> L2. FIG. 15A is a plan view showing the configuration of the intersection viewed in plan from the operation surface side. FIG. 15B is a plan view showing the configuration of the intersection viewed in plan from the ground electrode side. FIG. 16A is a plan view showing the configuration of the intersection viewed in plan from the operation surface side. FIG. 16B is a plan view showing the configuration of the intersection viewed in plan from the ground electrode side. FIG. 17A is a plan view showing the configuration of the intersection viewed in plan from the operation surface side. FIG. 17B is a plan view showing the configuration of the intersection viewed in plan from the ground electrode side. 18A and 18B are plan views for explaining the orientation of the intersection, respectively. FIG. 19 is a cross-sectional view showing a configuration of a sensor according to a modified example of the first embodiment of the present technology. FIG. 20 is a cross-sectional view showing the configuration of the sensor according to the second embodiment of the present technology. 21A, 21B, and 21C are cross-sectional views for explaining the operation of the sensor according to the second embodiment of the present technology, respectively. FIG. 22 is a cross-sectional view showing the configuration of the sensor according to the third embodiment of the present technology. 23A, 23B, and 23C are cross-sectional views for explaining the operation of the sensor according to the third embodiment of the present technology, respectively.

Embodiments of the present technology will be described in the following order.
1 First embodiment (sensor capable of detecting touch operation and pressing operation)
1.1 Electronic device configuration 1.2 Sensor configuration 1.3 Sensor output signal during operation 1.4 Sensor operation 1.5 Effect 1.6 Modification example 2 Second embodiment (touch operation and pressing operation) Sensor that can detect)
2.1 Sensor configuration 2.2 Sensor operation 2.3 Effect 2.4 Modification 3 Third embodiment (sensor capable of detecting pressing operation)
3.1 Sensor configuration 3.2 Sensor operation 3.3 Effect 3.4 Modification example

<1 First Embodiment>
The sensor 20 according to the first embodiment of the present technology can detect the touch position coordinates and the moving state of a plurality of or a single finger (conductor) (see FIG. 1A), and presses the operation surface with the finger. The load position coordinates at the time of this can also be detected (see FIG. 1B). Therefore, the sensor 20 can also be operated using the information on the degree of pressing of the finger.

With a general touch pad or touch panel, it is possible to detect the position coordinates of an object with a certain degree of conductivity, but it is difficult to detect the position coordinates of a non-conductive object such as a non-conductive stylus pen. .. On the other hand, in the sensor 20 according to the first embodiment, it is possible to detect the load position even when the operation surface is operated by the non-conductor (see FIG. 1C). Therefore, the sensor 20 can also be operated by using the information on the pressing amount of the non-conductor.

[1.1 Configuration of electronic devices]
The electronic device 10 according to the first embodiment of the present technology is a so-called tablet computer, and as shown in FIG. 2, a sensor 20, a controller IC 11 as a control unit, and a host device which is a main body of the electronic device 10. 12 and a display device 13. The sensor 20 may include the controller IC 11.

(Sensor)
The sensor 20 can detect two types of input operations, a touch operation and a pressing operation on the operation surface. The sensor 20 detects a change in capacitance according to an input operation, and outputs an output signal corresponding to the change to the controller IC 11. Here, the touch operation refers to an operation in which a conductor (grounded object) such as a finger approaches the operation surface or comes into contact with the operation surface. Further, the pressing operation refers to an operation of pressing the operation surface with a conductor such as a finger or a non-conductor such as a stylus.

(Controller IC)
The controller IC 11 determines whether a touch operation or a pressing operation has been performed on the operation surface of the sensor 20 based on the output signal supplied from the sensor 20 according to the change in capacitance, and determines that determination. Information according to the result is output to the host device 12. Specifically, for example, the controller IC 11 has two threshold values A and B, and makes the above determination based on these threshold values A and B. When it is determined that the touch operation has been performed, the controller IC 11 notifies the host device 12 that the touch operation has been performed, and outputs information on the position coordinates of the touch operation to the host device 12. On the other hand, when the controller IC 11 determines that the pressing operation has been performed, the controller IC 11 notifies the host device 12 that the pressing operation has been performed, and outputs information on the position coordinates of the pressing operation to the host device 12. Further, the controller IC 11 may output information regarding the pressing force (load) to the host device 12.

(Host device)
The host device 12 executes various processes based on the information supplied from the controller IC 11. For example, processing such as displaying character information and image information on the display device 13, moving the cursor displayed on the display device 13, and scrolling the screen is executed.

(Display device)
The display device 13 displays a video (screen) based on a video signal, a control signal, or the like supplied from the host device 12. Examples of the display device 13 include, but are not limited to, a liquid crystal display, an electroluminescence (EL) display, and electronic paper.

[1.2 Sensor configuration]
As shown in FIG. 3A, the sensor 20 includes a ground electrode 21, a deformed layer 22 provided on the ground electrode 21, a capacitive coupling type sensor layer 30 provided on the deformed layer 22, and a sensor layer 30. The surface layer 23 provided in the above is provided. The ground electrode 21, the deformed layer 22, the sensor layer 30, and the surface layer 23 are transparent to visible light.

The deformable layer 22 and the sensor layer 30 are bonded by a bonding layer (not shown). Further, the sensor layer 30 and the surface layer 23 are also bonded by a bonding layer (not shown). The ground electrode 21 may be provided directly on the back surface of the deformed layer 22, or may be bonded via a bonding layer.

One of both sides of the sensor 20 is a flat operation surface 20SA. In the following, of the two main surfaces of the sensor 20, the main surface opposite to the operation surface 20SA is referred to as a back surface 20SB. Of both main surfaces of the sensor layer 30, the surface on the operation surface 20SA side is referred to as the upper surface, and the surface on the back surface 20SB side may be referred to as the lower surface. Further, the axes orthogonal to each other in the operation surface 20SA are referred to as X-axis and Y-axis, respectively, and the axes perpendicular to the operation surface 20SA are referred to as Z-axis. The Z-axis direction is referred to as upward, and the -Z-axis direction may be referred to as downward.

The sensor 20 is provided on the display surface of the display device 13. The sensor 20 and the display device 13 are bonded by a bonding layer 24. The bonding layer 24 is made of an adhesive. As the adhesive, for example, one or more selected from the group consisting of acrylic adhesives, silicone adhesives, urethane adhesives and the like can be used. As used herein, pressure sensitive adhesion is defined as a type of adhesion. The bonding layer provided between the deformation layer 22 and the sensor layer 30 and between the sensor layer 30 and the surface layer 23 is also made of the same adhesive as the bonding layer 24.

While the ground electrode is not provided facing the upper surface of the sensor layer 30, the ground electrode 21 is provided facing the lower surface of the sensor layer 30. That is, in the sensor 20, the sensor layer 30 is not electrically cut off from the outside on the operation surface 20SA side, whereas the sensor layer 30 is electrically cut off from the outside on the back surface 20SB side. Has a configuration that Further, the sensor 20 has a configuration in which the distance between the ground electrode 21 and the sensor layer 30 can be changed by pressing the operation surface 20SA.

Since the sensor 20 has the above configuration, when a conductor or a grounded object approaches the operation surface 20SA on the side that is not electrically cut off, the sensor layer 30 detects a capacitance change. Further, when the operation surface 20SA is pressed by the conductor or the non-conductor, the distance between the ground electrode 21 and the sensor layer 30 changes, so that the sensor layer 30 detects the change in capacitance.

(Ground electrode)
The ground electrode 21 constitutes the back surface 20SB of the sensor 20, and is arranged so as to face the sensor layer 30 in the thickness direction of the sensor 20. The ground electrode 21 has a higher bending rigidity than the sensor layer 30 and the like, and may function as a support plate for the sensor 20. In the present specification, the grounding in the grounding electrode 21 has a meaning corresponding to the GND (ground) of the driving IC. The grounded object does not necessarily have to be grounded, and may be a conductor having a predetermined volume such as a human body.

The ground electrode 21 is a grounded transparent conductive layer. As the material of the ground electrode 21, for example, one or more selected from the group consisting of a metal oxide material having electrical conductivity, a metal material, a carbon material, a conductive polymer, and the like can be used. Examples of the metal oxide material include indium tin oxide (ITO), zinc oxide, indium oxide, antimony-added tin oxide, fluorine-added tin oxide, aluminum-added zinc oxide, gallium-added zinc oxide, silicon-added zinc oxide, and zinc oxide. -Tin oxide type, indium oxide-tin oxide type, zinc oxide-indium oxide-magnesium oxide type and the like can be mentioned. As the metal material, for example, metal nanoparticles, metal wire, and the like can be used. Specific materials thereof include, for example, copper, silver, gold, platinum, palladium, nickel, tin, cobalt, rhodium, iridium, iron, ruthenium, osmium, manganese, molybdenum, tungsten, niobium, tantel, titanium, bismuth, etc. Examples include metals such as antimony and lead, or alloys thereof. Examples of carbon materials include carbon black, carbon fiber, fullerenes, graphene, carbon nanotubes, carbon microcoils and nanohorns. As the conductive polymer, for example, substituted or unsubstituted polyaniline, polypyrrole, polythiophene, and a (co) polymer composed of one or two selected from these can be used.

Examples of the shape of the ground electrode 21 include, but are not limited to, a plate shape, a foil shape, a thin film shape, and a mesh shape. The ground electrode 21 may be provided on the base material. In this case, the base material is transparent to visible light and flexible. The shape of the base material may be a film shape or a plate shape. Here, it is assumed that the film also includes a sheet.

Since the ground electrode 21 is provided on the back surface 20SB of the sensor 20, it is possible to prevent external noise (external electric field) from the display device 13 or the like from entering the sensor layer 30 from the back surface 20SB side.

(Deformed layer)
The deformable layer 22 separates the ground electrode 21 and the sensor layer 30 at predetermined intervals. The deformable layer 22 is configured to be elastically deformable by pressing the operation surface 20SA. The deformable layer 22 is an elastic layer made of an elastic body. As the elastic body, for example, one having flexibility such as foamed rubber is preferable. The deformable layer 22 has a film-like shape or a plate-like shape.

(Sensor layer)
The sensor layer 30 can detect a touch operation and a pressing operation on the operation surface 20SA. The sensor layer 30 includes a plurality of sensing units 30A. The sensing unit 30A detects a change in capacitance due to a touch operation and a pressing operation, and outputs the change to the controller IC 11.

As shown in FIGS. 3A and 3B, the sensor layer 30 is provided on the base material 31, a plurality of transmission electrodes (second electrodes) 32 provided on the upper surface of the base material 31, and the lower surface of the base material 31. A plurality of receiving electrodes (first electrodes) 33 are provided. The plurality of transmitting electrodes 32 have a striped shape as a whole. Specifically, the plurality of transmission electrodes 32 are extended in the Y-axis direction and are arranged in isolation in the X-axis direction for a certain period of time. The plurality of receiving electrodes 33 have a striped shape as a whole. Specifically, the plurality of receiving electrodes 33 are extended in the X-axis direction and are arranged in isolation in the Y-axis direction for a certain period of time.

When viewed from the operation surface 20SA side, the transmission electrode 32 is provided on the front side of the reception electrode 33. The transmitting electrode 32 and the receiving electrode 33 are arranged so as to intersect at right angles, and a sensing unit 30A is configured at the intersecting portion. When the plurality of sensing units 30A are viewed in a plan view from the Z-axis direction, the plurality of sensing units 30A are arranged two-dimensionally in a matrix.

A wiring 34 is pulled out from one end of a transmission electrode 32, is drawn around a peripheral edge of a base material 31, and is connected to a flexible printed circuit board (FPC) (not shown). The wiring 35 is also pulled out from one end of the receiving electrode 33, is drawn around the peripheral edge of the base material 31, and is connected to an FPC (not shown).

(Base material)
The base material 31 has flexibility. The base material 31 has, for example, a film shape or a plate shape. As the material of the base material 31, either an inorganic material or an organic material can be used, and it is preferable to use an organic material. As the organic material, for example, a known polymer material can be used. Specific examples of known polymer materials include triacetyl cellulose (TAC), polyester (TPEE), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimide (PI), polyamide (PA), and aramid. , Polyethylene (PE), Polyacrylate, Polyether sulphon, Polysulphon, Polypropylene (PP), Diacetyl cellulose, Polyvinyl chloride, Acrylic resin (PMMA), Polycarbonate (PC), Epoxy resin, Urea resin, Urethane resin, Melamine resin , Cycloolefin polymer (COP), cycloolefin copolymer (COC) and the like.

(Transmission electrode, reception electrode)
Hereinafter, the configurations of the transmitting electrode 32 and the receiving electrode 33 will be described with reference to FIGS. 4 and 5A to 10B. As shown in FIG. 4, the transmission electrode 32 is composed of a plurality of linear sub-electrodes (second sub-electrodes) 32a. The plurality of sub-electrodes 32a are extended in the Y-axis direction and are arranged apart from each other in the X-axis direction. The distance between the sub-electrodes 32a adjacent to each other in the X-axis direction may be constant or different.

As shown in FIG. 4, the receiving electrode 33 is composed of a plurality of linear sub-electrodes (first sub-electrodes) 33a. The plurality of sub-electrodes 33a are extended in the X-axis direction and are arranged apart from each other in the Y-axis direction. The distance between the sub-electrodes 33a adjacent to each other in the Y-axis direction may be constant or different.

The intersection 30B is formed by the sub electrodes 32a and 33a. The sub-electrode 32a is provided on the front side of the sub-electrode 33a when viewed from the operation surface 20SA side. When the controller IC 11 applies a voltage between the sub electrodes 32a and 33a, the intersection 30B of the sub electrodes 32a and 33a forms a capacitive coupling (line of electric force). The sensing unit 30A detects the total value of the capacitance changes of the plurality of intersections 30B included in the intersection 30B and outputs the total value to the controller IC.

The widths W1 and W2 of the sub-electrodes 32a and 33a are different, and the width W1 of the sub-electrode 32a is wider than the width W2 of the sub-electrode 33a. Therefore, the intersection 30B is flat from the direction perpendicular to the operation surface 20SA (hereinafter referred to as "Z-axis direction") or the direction perpendicular to the back surface 20SB on the opposite side (hereinafter referred to as "-Z-axis direction"). When viewed, the intersection 30B has a rectangular shape having a long side having a length W1 and a short side having a length W2.

When the intersection 30B is viewed in a plan view from the Z-axis direction, as shown in FIG. 7A, the short side of the intersection 30B can be seen as the boundary lines C1 and C2 of the intersection 30B. On the other hand, when the intersection is viewed in a plan view from the −Z axis direction, the long side of the intersection 30B can be seen as the boundary lines D1 and D2 of the intersection 30B as shown in FIG. 8A. Therefore, the lengths L1 (see FIG. 8A) of the boundary lines D1 and D2 of the intersection 30B that can be seen when the intersection 30B is viewed in a plan view from the −Z axis direction are the cases where the intersection 30B is viewed in a plan view from the −Z axis direction. It is longer than the length L2 (see FIG. 7A) of the boundary lines C1 and C2 of the intersection 30B that can be seen.

Here, the principle of improving the sensitivity of the sensing unit 50A will be described. As shown in FIG. 10A, the length L of the electrodes 41 and 42 arranged opposite to each other is larger than the distance D between the electrodes 41 and 42 (hereinafter referred to as “electrode configuration A”), and as shown in FIG. 10B. It is assumed that the length L of the electrodes 41 and 42 arranged opposite to each other is substantially equal to the distance D between the electrodes 41 and 42 (hereinafter referred to as “electrode configuration B”).

The lines of electric force leaking from the periphery of the electrodes 41 and 42 arranged to face each other are affected by the approach of the conductor. As can be seen from FIGS. 10A and 10B, the ratio of the number of electric lines of force 43 leaking from the periphery between the electrodes 41 and 42 to the total number of electric lines of force 43 between the electrodes 41 and 42 is higher than that of the electrode configuration A. B is larger. Therefore, the electrode configuration B is more susceptible to the influence of the approach of the conductor than the electrode configuration A. That is, the capacitance of the electrode configuration B is more likely to change than that of the electrode configuration A due to the approach of the conductor. Considering the above characteristics, it can be seen that the intersection 30B is more susceptible to the approach of the conductor in the lower part than in the upper part (see FIGS. 7B and 8B).

In the sensor 20 according to the first embodiment, the distance D between the sub-electrodes 32a and 33a and the side lengths L1 and L2 of the rectangular intersection 30B (that is, the widths W1 and W2 of the sub-electrodes 32a and 33a) are three. One parameter is the main parameter of sensitivity adjustment (influence factor of sensitivity adjustment). In addition to this, the permittivity of the materials constituting the base material 31, the deformed layer 22, and the surface layer 23, the thickness BD of the deformed layer 22, the thickness FD of the surface layer, and the like may be used as parameters for adjusting the sensitivity.

The capacitance between the sub-electrodes 32a and 33a arranged in parallel is such that the dielectric constant between the sub-electrodes 32a and 33a is ε, the area of the intersection 30B is S (= L1 × L2), and the sub-electrodes 32a and 33a are located. Assuming that the distance is D, the capacitance C is calculated by the following formula.
C = εS / D = ε (L1 × L2) / D

When the distance D between the sub-electrodes 32a and 33a is very small with respect to the side lengths L1 and L2 (in the case of the configuration as shown in the schematic diagram of FIG. 10A), the electric force from the peripheral edges of the sub-electrodes 32a and 33a. Since the effect of wire leakage can be ignored, the capacitance can be calculated accurately by the above formula. On the other hand, when the distance D between the sub-electrodes 32a and 33a and the side lengths L1 and L2 are substantially equal (in the case of the configuration as shown in the schematic diagram of FIG. 10B), from the peripheral edge of the sub-electrodes 32a and 33a. The influence of the leakage of the electric lines of force is large, and a difference occurs between the capacitance obtained by the above formula and the actual capacitance.

In the sensor 20 according to the first embodiment, as shown in FIGS. 7A and 7B, when the capacitive coupling portion is viewed in a plan view from the Z-axis direction, the sub-electrode (upper electrode) 32a and the sub-electrode (upper electrode) constituting the capacitive coupling portion ( The lengths L1 and M1 of the lower electrode) 33a are (the length L1 of the sub-electrode 32a constituting the capacitive coupling portion) <(the length M1 of the sub-electrode 33a constituting the capacitive coupling portion).

On the other hand, as shown in FIGS. 8A and 8B, when the capacitive coupling portion is viewed in a plan view from the −Z axis direction, the length L2 of the sub-electrode (upper electrode) 32a and the sub-electrode (lower electrode) 33a constituting the capacitive coupling portion. , M2 is (length L2 of the sub-electrode 33a constituting the capacitive coupling portion) <(length M2 of the sub-electrode 32a constituting the capacitive coupling portion).

Therefore, in the sensor 20 according to the first embodiment, the sensor 20 is capacitively coupled on a surface 30C larger than the area S (L1 × L2) of the intersection 30B, as shown in FIGS. 7A, 7B, 8A, and 8B. In addition, the facing area S1 of the intersection 30B and the effective area (area of the surface 30C) S2 in which the capacitance is coupled are S1 <S2.

Between the capacitively coupled sub-electrodes 32a and 33a, an electric signal having a predetermined frequency is transmitted and received by the capacitive coupling. When the ground electrode 21 approaches the intersection 30B in such a state, a part of the signal flows to the ground electrode 21, and the signal exchange between the sub electrodes 32a and 33a is reduced (a part of the energy is the ground electrode 21). In other words, the coupling capacity is reduced.

As described above, the width W1 (= L1) of the sub-electrode 32a and the width W2 (= L2) of the sub-electrode 33a are made different so that the shape of the intersection 30B is rectangular. As shown in the above, the conductors (for example, fingers) approaching the operation surface 20SA and the ground electrode 21 provided on the back surface 20SB side of the sensor 20 have the lengths L1 and L2 of the sides where the lines of electric force leak. Is different.

As shown in FIG. 9A, when the intersection 30B is viewed in a plan view from the Z-axis direction, electric lines of force are largely leaked at the portions 36 on both short sides of the intersection 30B. On the other hand, as shown in FIG. 9B, when the intersection 30B is viewed in a plan view from the −Z axis direction, the electric lines of force are largely leaked at the portions 37 on both long sides of the intersection 30B.

As can be seen from FIGS. 9A and 9B, in the intersection 30B having the above-described configuration, the electric lines of force are more likely to flow to the back surface 20SB side than the operation surface 20SA side. Therefore, the lines of electric force at the intersection 30B are more likely to flow to the ground electrode 21 than the conductors that approach or come into contact with the operating surface 20SA. That is, in the intersection 30B having the above-described configuration, the sensitivity below the sensing unit 30A is improved, while the sensitivity above the sensing unit 30A is decreased. By changing the widths W1 and W2 of the sub electrodes 32a and 33a in this way, the sensitivity of the sensing unit 30A to the ground electrode 21 and the sensitivity of the sensing unit 30A to the conductor approaching or in contact with the operation surface 20SA can be changed. Becomes possible.

In the sensor 20 according to the first embodiment, when the relationship between the distance D between the sub-electrodes 32a and 33a and the length L1 of the long side of the intersection 30B satisfies the relationship L1 <2 × D, the above is described. The effect of adjusting the sensitivity of is particularly remarkable. For example, when the distance D between the sub-electrodes 32a and 33a is 250 μm, the width L1 <500 μm of the sub-electrodes 32a is preferable.

Further, it is preferable that the distance D between the sub-electrodes 32a and 33a and the lengths L1 and L2 of the long sides of the intersection 30B satisfy the relationship of D> L1 and L2. For example, when D = 250 μm, it is preferable that L1 = 150 μm.

The ratio of L1 and L2 may be set according to the sensitivity of the target sensing unit 30A, and is not particularly limited. As an example, L1≈0.5 × L2. Specifically, when L2 = 200 μm, L1 ≈100 μm.

The sub-electrodes 32a and 33a are transparent electrodes having transparency to visible light. Examples of the materials of the sub-electrodes 32a and 33a include the same materials as those of the above-mentioned ground electrode 21.
As a method for forming the sub-electrodes 32a and 33a, for example, a printing method such as screen printing, gravure printing, gravure offset printing, flexographic printing, inkjet printing, or a patterning method using a photolithographic technique can be used.

(Surface layer)
The surface layer 23 has an operation surface 20SA, and is configured to be able to maintain a substantially constant thickness even when the operation surface 20SA is pressed by a pressing operation. The surface layer 23 is a base material that is transparent to visible light and has flexibility. The shape of the base material may be a film shape or a plate shape. Examples of the material of the base material include the same materials as those of the above base material 31. The surface layer 23 may be a coating layer.

[1.3 Sensor output signal during operation]
Hereinafter, the output signal from the sensor 20 during operation will be described with reference to FIG. Here, the output signal corresponds to the change in capacitance detected by each sensing unit 30A.

As shown in FIG. 11, when the operation surface 20SA is operated by a conductor such as a finger (curve (A)) and when the operation surface 20SA is operated by a non-conductor such as a stylus. The output signal from the sensor 20 is different from that of (curve (B)).

The output signal increases as the conductor approaches the operation surface 20SA, and the output signal sharply increases as the conductor approaches the operation surface 20SA. When the operating surface 20SA is pressed by the conductor after the conductor comes into contact with the operating surface 20SA, the output signal increases as the pressing force increases.

The output signal does not change even when the non-conductor approaches the operation surface 20SA, and when the non-conductor comes into contact with the operation surface 20SA and the operation surface 20SA is pressed by the non-conductor, the output is accompanied by an increase in pressing force. The signal increases.

The controller IC 11 has a threshold value A and a threshold value B with respect to the output signal from the sensor 20. The threshold value A is set in a range in which the output signal rapidly increases due to the approach of the conductor, for example. The threshold value B is set, for example, in a range that is larger than the output signal value when the conductor comes into contact with the operation surface 20SA and that the pressing of the operation surface 20SA by the non-conductor can be detected. The controller IC may have a plurality of threshold values B, and the strength of the pressing force may be detected stepwise by these threshold values B.

When the output signal from the sensor 20 exceeds the threshold value A and is equal to or less than the threshold value B, the controller IC 11 determines that the touch operation has been performed on the operation surface 20SA. On the other hand, when the output signal from the sensor 20 exceeds the threshold value B, the controller IC 11 determines that the pressing operation has been performed on the operation surface 20SA.

[1. 4 Sensor operation]
Hereinafter, the operation of the sensor 20 during the touch operation and the pressing operation will be described with reference to FIGS. 12A to 12C. Note that FIGS. 12A and 12B show an XZ cross section, whereas FIG. 12C shows a YZ cross section.

When the controller IC 11 applies a voltage between the sub electrodes 32a and 33a, the sub electrodes 32a and 33a form electric lines of force (capacitive coupling) at each intersection 30B, as shown in FIG. 12A.

As shown in FIG. 12B, when a conductor 51 such as a finger approaches or comes into contact with the operation surface 20SA, electric lines of force leaking from the short side of the intersection 30B flow to the conductor 51, and the capacitance of the intersection 30B is increased. Changes. The total value of the capacitance changes of the plurality of intersections 30B constituting the sensing unit 30A is supplied from the sensor 20 to the controller IC 11 as an output signal. The controller IC 11 determines that the touch operation has been performed based on the output signal supplied from the sensor 20, detects the position where the touch operation has been performed, and notifies the host device 12 of the result.

As shown in FIG. 12C, when the operation surface 20SA is pressed by a non-conductor 52 such as a stylus, the surface layer 23 and the sensor layer 30 bend toward the ground electrode 21, and the deformed layer 22 is deformed. As a result, the sensor layer 30 approaches the ground electrode 21, and the lines of electric force leaking from the long side of the intersection 30B flow to the ground electrode 21, and the capacitance of the intersection 30B changes. The total value of the capacitance changes of the plurality of intersections 30B constituting the sensing unit 30A is supplied from the sensor 20 to the controller IC 11 as an output signal. The controller IC 11 determines that the pressing operation has been performed based on the output signal supplied from the sensor 20, detects the position where the pressing operation has been performed, and notifies the host device 12 of the result.

When the operation surface 20SA is pressed by the conductor 51, the lines of electric force leaking from the short side of the intersection 30B flow to the conductor 51, and the lines of electric force leaking from the long side of the intersection 30B flow. It will flow to the ground electrode 21.

[1.5 effect]
The sensor 20 according to the first embodiment is a sensor capable of detecting a touch operation and a pressing operation, and is a receiving electrode 33 provided on the ground electrode 21 and a plurality of sub electrodes 33a. And a transmitting electrode 32 provided on the receiving electrode 33 and composed of a plurality of sub electrodes 32a. The operation surface 20SA is provided on the transmission electrode 32, and the intersection 30B is formed by the sub electrodes 32a and 33a. The length L1 of the boundary line of the intersection 30B seen when the intersection 30B is viewed in a plan view from the ground electrode 21 side is the length of the boundary line of the intersection 30B seen when the intersection 30B is viewed in a plan view from the operation surface 20SA side. It is longer than L2. As a result, the sensitivity of the pressing operation by the non-conductor can be improved, and the sensitivity of the pressing operation by the conductor can be reduced. Therefore, it is possible to adjust the sensitivity balance between the pressing operation by the non-conductor and the pressing operation by the conductor. In addition, the sensitivity of touch operation by the conductor can be reduced. Therefore, it is possible to adjust the sensitivity balance between the pressing operation by the non-conductor and the touch operation by the conductor.

Further, in the sensor 20 according to the first embodiment, the sensitivity in the vertical direction of the sensor layer 30 is increased by the side lengths L1 and L2 of the rectangular intersection 30B, that is, the widths W1 and W2 of the sub electrodes 32a and 33b. Can be changed. Therefore, the sensitivity in the vertical direction of the sensor layer 30 can be adjusted without being subject to many design restrictions such as dimensional restrictions and process restrictions. That is, the sensitivity of the sensor layer 30 in the vertical direction can be adjusted without impairing the degree of freedom in designing the sensor 20.

Further, the sensor 20 according to the first embodiment can detect a touch operation by a conductor (grounded object) such as a finger like a general touch panel or a touch pad. In addition, the pressing operation can be detected by the conductor or the non-conductive band. Further, while a general touch panel or touch pad is not good at detecting dry fingers, toes, etc., the sensor 20 according to the first embodiment can detect a change in capacitance due to pressing pressure. Therefore, it is possible to detect dry fingers, toes, and the like.

[1.6 Deformation example]
(Modification example 1)
In the first embodiment described above, the case where the sub-electrodes 32a and 33a have different widths W1 and W2, that is, the shape of the intersection 30B is rectangular to change the operation sensitivity has been described. , The operation sensitivity may be changed according to other configurations. For example, by changing the distance between the upper surface of the sensor layer 30 and the operation surface 20SA and the distance between the lower surface of the sensor layer 30 and the upper surface of the ground electrode 21, the operation sensitivity between the touch operation and the pressing operation is changed. You may do so.

Hereinafter, the adjustment of the operation sensitivity by changing the thickness BD of the deformable layer 22 and the thickness FD of the surface layer 23 will be described. Here, as shown in FIG. 3A, the total thickness of the sensor 20 is assumed to be FD + D + BD. Note that D is the thickness of the sensor layer 30. Further, in the following description, the sensor of the reference example has the same configuration as the sensor 20 according to the first embodiment except that it satisfies the relationship of W1 = W2 (L1 = L2) and FD = BD. To say.

In order to improve the touch operation sensitivity, it is preferable that the FD is small and the BD is large. For example, it is preferable that FD and BD satisfy the relationship of FD <BD. On the other hand, in order to improve the sensitivity of the pressing operation, it is preferable that the FD is large and the BD is small. For example, it is preferable that FD and BD satisfy the relationship of FD> BD. However, in the case of the sensitivity of the pressing operation, the rate of change of the BD with respect to the pressing pressure (operating load) affects the sensitivity, so it is preferable to consider the bending rigidity of the deformed layer 22, the sensor layer 30, and the surface layer 23. ..

In a general touch sensor, the sensor output during operation by the conductor changes as shown in the curve (a) shown in FIG. 13 with respect to the operating load. That is, in a general touch sensor, when the conductor approaches the operation surface, the sensor output gradually increases due to leakage of electric lines of force (electric field) through the operation surface and the air layer of the conductor, and the air layer. When the thickness of the sensor is almost zero, that is, when the conductor approaches the operation surface, the sensor output increases at once. After the contact, a part of the conductor (for example, a fingertip) is deformed by the operating load of the conductor to increase the contact area, so that the sensor output is slightly increased.

On the other hand, in the sensor of the reference example, since the BD changes depending on the load after contact, the sensor output at the time of operation by the conductor changes greatly with respect to the operation load as shown in the curve (b) shown in FIG. Further, the sensor of the reference example can also detect the pressing operation by the non-conductor, and the sensor output during the operation by the non-conductor changes as shown in the curve (c) shown in FIG. 14A with respect to the operation load. ..

As is clear from FIG. 14A, in the sensor of the reference example, in principle, (sensor output for the conductor)> (sensor output for the non-conductor), and the difference in operating sensitivity between the conductor and the non-conductor is large. .. Therefore, in the sensor of the reference example, it is desirable to suppress this difference in operating sensitivity.

In order to suppress the above difference in operating sensitivity, it is preferable that FD and BD satisfy the relationship of FD> BD. A sensor satisfying this relationship can improve the operation sensitivity by the non-conductor as compared with the sensor of the reference example, and can reduce the operation sensitivity by the conductor as compared with the sensor of the reference example. As a result, the sensor output during operation by the conductor and the non-conductor can be changed as shown in the curves (b') and (c') of FIG. 14B. Therefore, it is possible to suppress the difference in operating sensitivity between the conductor and the non-conductor.

Assuming that the total thickness of the sensor layer (= FD + D + BD) is 100, the thickness of the BD is preferably (0.1 × D) or more and (0.5 × D) or less. Further, the thickness of the FD is preferably (1.1 × BD) or more and (2 × BD) or less.

Further, as in the sensor 20 according to the first embodiment described above, the widths W1 and W2 of the sub-electrodes 32a and 33a satisfy the relationship of W1> W2, so that the conductor and the non-conductor can be operated. The sensor output can be varied as shown in the curves (b ″) and (c ″) of FIG. 14C. Therefore, the difference in operating sensitivity between the conductor and the non-conductor can be further suppressed.

Further, by setting the dielectric constant ε _{D of the material constituting the base material 31, the dielectric constant ε FD of the} material constituting the surface layer 23 _{, and the dielectric constant ε BD} of the material constituting the deformable layer 22, the operation sensitivity can be adjusted. You may try to adjust. In order to improve the sensitivity of touch operation, it is preferable that _{ε D} and ε _FD satisfy the relationship of ε _D <ε _FD. On the other hand, in order to improve the sensitivity of the pressing operation, it is preferable that _{ε D} and ε _BD satisfy the relationship of ε _D <ε _BD.

(Modification 2)
In the first embodiment, the case where the shape of the intersection 30B viewed in a plane from the Z-axis direction is rectangular has been described, but the shape of the intersection 30B viewed in a plane from the Z-axis direction is limited to this. Any shape may be used as long as the lengths L1 and L2 satisfy the relationship of L1> L2. If such a relationship is satisfied, the sensitivity of the pressing operation by the non-conductor can be improved and the sensitivity of the pressing operation by the conductor can be reduced as in the first embodiment.

When the intersection 30B is viewed in a plan view from the Z-axis direction, the boundary lines C1 and C2 of the intersection 30B can be seen as shown in FIGS. 15A and 16A. On the other hand, when the intersection 30B is viewed in a plan view from the direction perpendicular to the back surface 20SB, the boundary lines D1 and D2 of the intersection 30B can be seen as shown in FIGS. 15B and 16B. The length L1 of the boundary lines D1 and D2 of the intersection 30B is longer than the length L2 of the boundary lines C1 and C2 of the intersection 30B. Here, the intersection 30B is a portion surrounded by the boundary lines C1, C2, D1 and D2.

15A and 15B show an example in which the boundary lines D1 and D2 of the intersection 30B have an arc shape. 16A and 16B show an example in which the boundary lines D1 and D2 of the intersection 30B have a rectangular shape. In this case, it is preferable to suppress the positional deviation of the sub-electrodes 32a and 33a at the time of electrode formation. As shown in FIGS. 17A and 17B, if the positional deviation of the sub electrodes 32a and 33a becomes large, the shape of the intersection 30B will be different from the target shape. For this reason, there is a possibility that the desired characteristics cannot be obtained due to variations in the coupling capacitance and the sensitivity in the vertical direction.

(Modification example 3)
The orientation of the rectangular intersection 30B may be set so that the long side of the length L1 is parallel to the X-axis as shown in FIG. 18A, or the length as shown in FIG. 18B. The long side of L1 may be set to be parallel to the Y axis. Specifically, as shown in FIG. 18A, the sub-electrode 32a is provided on the front side of the sub-electrode 33a when viewed from the operation surface 20SA side, and the width W1 of the sub-electrode 32a is larger than the width W2 of the sub-electrode 33a. It may be made wider. Alternatively, as shown in FIG. 18B, the sub-electrode 33a is provided on the front side of the sub-electrode 32a when viewed from the operation surface 20SA side, and the width W2 of the sub-electrode 33a is wider than the width W1 of the sub-electrode 32a. It may be.

The shape of the contact surface or load surface of the operating object is not always substantially circular. For example, as shown in FIGS. 18A and 18B, the shape of the contact / load surface A1 of the operating object may be substantially elliptical. Even if the direction of the long side of the intersection 30B is set to the X-axis direction or the Y-axis direction according to the shape of the contact / load surface A1 of the target operating object, the detection accuracy of the coordinate position can be improved. good.

(Modification example 4)
As shown in FIG. 19, instead of the deformed layer 22, a deformed layer 22a including a plurality of columnar bodies 22b may be adopted. In this case, the ground electrode 21 may be provided on the base material 21a to form the electrode base material. The deformed layer 22a may further include a frame portion 22c provided continuously or intermittently between the peripheral portions of the ground electrode 21 and the sensor layer 30. As the arrangement form of the columnar body 22b, for example, the arrangement form described in Patent Document 1 can be adopted.

(Modification 5)
The operation surface 20SA is not limited to a flat surface, but may be a curved surface or a bent surface. In this case, the overall shape of the sensor 20 may be curved or bent.

(Modification 6)
The transmitting electrode 32 and the receiving electrode 33 include a plurality of unit electrode bodies composed of sub-electrodes and a plurality of connecting members for connecting adjacent unit electrode bodies, and the unit electrodes of the transmitting electrode 32 and the receiving electrode 33. The sensing unit 30A may be configured by overlapping the bodies. In this case, the unit electrode body composed of the sub-electrodes may have, for example, a comb-shaped shape, a mesh-shaped shape, a concentric shape, a spiral shape, or the like.

(Modification 7)
A configuration may be adopted in which the receiving electrode 33 is provided on the front side of the transmitting electrode 32 when viewed from the operation surface 20SA side. In this case, the width W2 of the receiving electrode 33 may be wider than the width W1 of the transmitting electrode 32.

(Modification 8)
In the first embodiment described above, the case where the electronic device 10 is a tablet computer has been described, but the present technology is not limited to this example. For example, the present technology may be applied to electronic devices such as mobile phones such as personal computers and smartphones, televisions, cameras, portable game devices, car navigation systems, and wearable devices.

<2 Second embodiment>
[2.1 Sensor configuration]
As shown in FIG. 20, the sensor 120 according to the second embodiment of the present technology further includes a deformed layer 25 provided between the sensor layer 30 and the surface layer 23, and the first embodiment is provided. It is different from the sensor 20 according to the form. In the second embodiment, the same reference numerals are given to the same parts as those in the first embodiment, and the description thereof will be omitted.

The deformable layer 25 separates the sensor layer 30 and the surface layer 23 at predetermined intervals. The deformable layer 25 has a film-like shape or a plate-like shape. The deformable layer 25 is an elastic layer made of an elastic body, and is configured to be elastically deformable by a pressing operation of the operation surface 20SA. As the elastic body, the same elastic body as the deformed layer 22 can be used. The Young's modulus of the deformed layers 22 and 25 may be the same or different. The Young's modulus of the deformed layer 22 may be larger than the Young's modulus of the deformed layer 25, or the Young's modulus of the deformed layer 25 may be larger than the Young's modulus of the deformed layer 22. That is, the deformable layer 25 may be more easily deformed than the deformable layer 22 with respect to the load applied to the operation surface 20SA, and the deformable layer 22 may be more easily deformed with respect to the load applied to the operation surface 20SA than the deformable layer 25. It may be easily deformed.

[2.2 Sensor operation]
Hereinafter, the operation of the sensor 120 during the touch operation and the pressing operation will be described with reference to FIGS. 21A to 21C. Here, a case where the deformable layer 25 is more easily deformed than the deformable layer 22 with respect to the load applied to the operation surface 20SA will be described. 21A and 21B show an XZ cross section, whereas FIG. 21C shows a YZ cross section.

As shown in FIG. 21A, when a conductor 51 such as a finger approaches or comes into contact with the operation surface 20SA, electric lines of force leaking from the short side of the intersection 30B flow to the conductor 51, and the capacitance of the intersection 30B is increased. Changes.

As shown in FIG. 21B, when the operation surface 20SA is pressed by the conductor 51, the surface layer 23 bends toward the sensor layer 30, and the deformable layer 25 deforms. As a result, the conductor 51 approaches the sensor layer 30, the lines of electric force flowing from the short side of the intersection 30B to the conductor 51 increase, and the capacitance change between the sub electrodes 32a and 33a increases. Further, as shown in FIG. 21C, when the pressing force (load) is further increased, the surface layer 23 and the sensor layer 30 are bent toward the ground electrode 21, and the deformed layer 22 is deformed. As a result, the sensor layer 30 approaches the ground electrode 21, and the lines of electric force leaking from the long side of the intersection 30B flow to the ground electrode 21, and the capacitance of the intersection 30B changes.

[2.3 effect]
In the sensor 120 according to the second embodiment, since the deformable layer 25 is provided between the sensor layer 30 and the surface layer 23, the sensitivity of the pressing operation by the conductor 51 can be adjusted.

[2. 4 Modification example]
(Modification example 1)
As the deformable layers 22 and 25, a deformable layer having a plurality of columnar bodies may be adopted. As the arrangement form of the columnar body, for example, the arrangement form described in Patent Document 1 can be adopted.

(Modification 2)
Instead of providing the deformable layer 25 between the sensor layer 30 and the surface layer 23, a surface layer 23 that also functions as the deformable layer 25 may be used.

(Other variants)
The configuration described in the modified example of the first embodiment may be applied to the sensor 120 according to the second embodiment.

<3 Third embodiment>
[3.1 Sensor configuration]
As shown in FIG. 22, the sensor 220 according to the third embodiment of the present technology further includes a ground electrode 26 provided between the deformation layer 25 and the surface layer 23, and the second embodiment is provided. It is different from the sensor 120 according to the form. In the third embodiment, the same reference numerals are given to the same parts as those in the second embodiment, and the description thereof will be omitted.

The sensor 220 according to the third embodiment detects a pressing operation on the operation surface 20SA. The ground electrode 21 is provided so as to face the lower surface of the sensor layer 30, and the ground electrode 26 is provided so as to face the upper surface of the sensor layer 30. Therefore, the capacitive coupling type sensor layer 30 is electrically cut off from the outside on both sides of the operation surface 20SA and the back surface 20SB. The configuration of the ground electrode 26 is the same as that of the ground electrode 21.

[3.2 Sensor operation]
Hereinafter, the operation of the sensor 220 during the pressing operation will be described with reference to FIGS. 23A to 23C. Here, a case where the operation surface 20SA is pressed by a conductor 51 such as a finger will be described, but the operation surface 20SA may be pressed by a non-conductor such as a stylus pen. 23A and 23B show an XZ cross section, whereas FIG. 23C shows a YZ cross section.

When the controller IC 11 applies a voltage between the sub electrodes 32a and 33a, the sub electrodes 32a and 33a form electric lines of force (capacitive coupling) at each intersection 30B, as shown in FIG. 23A.

When the operation surface 20SA is pressed by the conductor 51, the surface layer 23 and the ground electrode 26 are bent and the deformation layer 25 is deformed, as shown in FIG. 23B. As a result, the ground electrode 26 approaches the sensor layer 30, and electric lines of force leaking from the short side of the intersection 30B flow to the ground electrode 26.

Further, the pressing force applied to the operation surface 20SA is applied to the upper surface of the sensor layer 30 via the surface layer 23, the ground electrode 26 and the deformed layer 25, and as shown in FIG. 23C, the sensor layer 30 is directed toward the ground electrode 21. The deformation layer 22 is deformed. As a result, the sensor layer 30 approaches the ground electrode 21, and the electric lines of force leaking from the long side of the intersection 30B flow to the ground electrode 21.

As described above, the electric field lines flow from the short side side and the long side side of the intersection portion 30B to the ground electrodes 26 and 21, respectively, so that the capacitance of the intersection portion 30B changes.

[3.3 effect]
In the sensor according to the third embodiment, the length L1 of the boundary line of the intersection 30B that can be seen when the intersection 30B is viewed in a plan view from the −Z direction (ground electrode 21 side) is the Z direction (operation surface 20SA side). It is longer than the length L2 of the boundary line of the intersection 30B that can be seen when the intersection 30B is viewed in a plan view. As a result, the sensitivity of the sensor layer 30 to the ground electrode 21 can be improved, and the sensitivity of the sensor layer 30 to the ground electrode 26 can be reduced. Therefore, the upper and lower sensitivity balance of the sensor layer 30 can be adjusted.

[3.4 Deformation example]
(Modification example 1)
From the length L2 of the boundary line of the intersection 30B seen when the intersection 30B is viewed in a plan view from the Z direction, and from the length L1 of the boundary line of the intersection 30B seen when the intersection 30B is viewed in a plan view from the −Z direction. May also be lengthened. Specifically, when the intersection 30B is viewed in a plan view from the Z-axis direction, the long side of the rectangular intersection 30B can be seen, whereas when the intersection 30B is viewed in a plan view from the −Z axis direction, the rectangular shape is visible. The short side of the intersection 30B may be visible. In order to have such a configuration, the width W1 of the sub-electrode 32a on the front side when viewed from the operation surface 20SA is made narrower than the width W2 of the sub-electrode 33a on the back side when viewed from the operation surface 20SA. do it.

When the above configuration is adopted, the sensitivity of the sensor layer 30 to the ground electrode 21 can be reduced, and the sensitivity of the sensor layer 30 to the ground electrode 26 can be improved. Therefore, the upper and lower sensitivity balance of the sensor layer 30 can be adjusted.

(Modification 2)
When the Young's modulus of the deformed layers 22 and 25 is different, the side lengths L1 and L2 of the intersection 30B are set corresponding to the difference in Young's modulus of the deformed layers 22 and 25, and the upper and lower ground electrodes are set. The sensitivity balance of the sensor layer 30 with respect to 21 and 26 may be adjusted. Specifically, when the Young's modulus of the deformed layer 22 is larger than the Young's modulus of the deformed layer 25, the length L1 of the side of the intersection 30B that can be seen when the intersection 30B is viewed in a plan view from the −Z axis direction. The length of the side of the intersection 30B that can be seen when the intersection 30B is viewed in a plan view from the Z-axis direction may be made larger than L2. On the other hand, when the Young's modulus of the deformed layer 25 is larger than the Young's modulus of the deformed layer 22, the length of the side of the intersection 30B that can be seen when the intersection 30B is viewed in a plan view from the Z-axis direction is set to L2. The length of the side of the intersection 30B that can be seen when the intersection 30B is viewed in a plan view from the Z-axis direction may be made larger than the length L1.

(Other variants)
The configuration described in the modified example of the first or second embodiment may be applied to the sensor 220 according to the third embodiment.

Although the embodiment of the present technology and its modification have been specifically described above, the present technology is not limited to the above-described embodiment and its modification, and various modifications based on the technical idea of the present technology. Is possible.

For example, the configurations, methods, processes, shapes, materials, numerical values, etc. given in the above-described embodiments and modifications are merely examples, and if necessary, different configurations, methods, processes, shapes, materials, numerical values, etc. May be used.

In addition, the configurations, methods, processes, shapes, materials, numerical values, and the like of the above-described embodiments and modifications thereof can be combined with each other as long as they do not deviate from the gist of the present technology.

In addition, the present technology can also adopt the following configurations.
(1)
It is a sensor that can detect touch operation and pressing operation.
Ground electrode and
A first electrode provided on the ground electrode and composed of a plurality of first sub-electrodes,
A second electrode provided on the first electrode and composed of a plurality of second sub-electrodes is provided.
An operation surface is provided on the second electrode, and an operation surface is provided.
An intersection is formed by the first sub-electrode and the second sub-electrode.
The length L1 of the boundary line of the intersection seen when the intersection is viewed in a plan view from the ground electrode side is the length of the boundary line of the intersection seen when the intersection is viewed in a plan view from the operation surface side. A sensor longer than L2.
(2)
The sensor according to (1), wherein the length L1 and the distance D between the first sub-electrode and the second sub-electrode satisfy the relationship of L1 <2 × D.
(3)
The sensor according to (1) or (2), which has a rectangular shape when the intersection is viewed in a plan view from the operation surface side.
(4)
The sensor according to any one of (1) to (3), wherein the width of the second sub-electrode is wider than the width of the first sub-electrode.
(5)
The sensor according to any one of (1) to (4), wherein the second electrode is a transmitting electrode and the first electrode is a receiving electrode.
(6)
The sensor according to any one of (1) to (5), further comprising a deformable layer provided between the ground electrode and the first electrode and deformed by pressing the operation surface.
(7)
A first deformation layer provided between the ground electrode and the first electrode and deformed by pressing the operation surface,
The sensor according to any one of (1) to (5), further comprising a second deformation layer provided on the second electrode and deformed by pressing the operation surface.
(8)
A surface layer provided on the second electrode and having the operation surface is further provided.
The sensor according to (6), wherein the thickness of the surface layer is thicker than the thickness of the deformed layer.
(9)
The sensor according to (6) or (8), wherein the deformed layer is made of an elastic body.
(10)
The sensor according to (6), (8) or (9), wherein the deformed layer is composed of a plurality of columnar bodies.
(11)
A sensor that can detect pressing operations
With the first ground electrode
A first electrode provided on the first ground electrode and composed of a plurality of first sub-electrodes, and a first electrode.
A second electrode provided on the first electrode and composed of a plurality of second sub-electrodes,
A second ground electrode provided on the second electrode is provided.
An operation surface is provided on the second ground electrode.
An intersection is formed by the first sub-electrode and the second sub-electrode.
The length L1 of the boundary line of the intersection seen when the intersection is viewed in a plan view from the first ground electrode side is the boundary line of the intersection seen when the intersection is viewed in a plan view from the operation surface side. A sensor longer than the length L2.
(12)
An electronic device including the sensor according to any one of (1) to (11).

10 Electronic equipment 11 Controller IC
12 Host equipment 13 Display device 20 Sensor 20SA Operation surface 20SB Back surface 21, 26 Ground electrode 22 Deformed layer (1st deformed layer)
25 Deformed layer (second deformed layer)
23 Surface layer 30 Sensor layer 30A Sensing part 30B Crossing part 31 Base material 32 Transmission electrode (second electrode)
32a sub-electrode (second sub-electrode)
33 Receiving electrode (first electrode)
33a sub-electrode (first sub-electrode)

Claims (12)

It is a sensor that can detect touch operation and pressing operation.
Ground electrode and
A plurality of first electrodes provided on the ground electrode and
A plurality of second electrodes provided on the first electrode are provided.
An operation surface is provided on the second electrode, and an operation surface is provided.
A sensing unit is configured at the first intersection of the first electrode and the second electrode.
Each of the first electrodes is composed of a plurality of first sub-electrodes.
Each of the second electrodes is composed of a plurality of second sub-electrodes.
A second intersection is formed by the first sub-electrode and the second sub-electrode.
The length L1 of the boundary line of the second intersection seen when the second intersection is viewed in a plan view from the ground electrode side is the first visible when the second intersection is viewed in a plan view from the operation surface side. 2 Sensors longer than the length L2 of the boundary line at the intersection. The sensor according to claim 1, wherein the length L1 and the distance D between the first sub-electrode and the second sub-electrode satisfy the relationship of L1 <2 × D. The sensor according to claim 1 or 2 , which has a rectangular shape when the second intersection is viewed in a plan view from the operation surface side. The sensor according to any one of claims 1 to 3 , wherein the width of the second sub-electrode is wider than the width of the first sub-electrode. The sensor according to any one of claims 1 to 4, wherein the second electrode is a transmitting electrode and the first electrode is a receiving electrode. The sensor according to any one of claims 1 to 5, further comprising a deformable layer provided between the ground electrode and the first electrode and deformed by pressing the operation surface. A first deformation layer provided between the ground electrode and the first electrode and deformed by pressing the operation surface,
The sensor according to any one of claims 1 to 5, further comprising a second deformable layer provided on the second electrode and deformed by pressing the operation surface. A surface layer provided on the second electrode and having the operation surface is further provided.
The sensor according to claim 6, wherein the thickness of the surface layer is thicker than the thickness of the deformed layer. The sensor according to claim 6 or 8 , wherein the deformed layer is made of an elastic body. With more control
The sensor according to any one of claims 1 to 9, wherein the control unit detects a total value of changes in capacitance of a plurality of the second intersections constituting the sensing unit . A sensor that can detect pressing operations
With the first ground electrode
A plurality of first electrodes provided on the first ground electrode and
A plurality of second electrodes provided on the first electrode and
A second ground electrode provided on the second electrode is provided.
An operation surface is provided on the second ground electrode.
A sensing unit is configured at the first intersection of the first electrode and the second electrode.
Each of the first electrodes is composed of a plurality of first sub-electrodes.
Each of the second electrodes is composed of a plurality of second sub-electrodes.
A second intersection is formed by the first sub-electrode and the second sub-electrode.
The length L1 of the boundary line of the second intersection, which is visible when the second intersection is viewed in a plan view from the first ground electrode side, and the second intersection, which is visible when the second intersection is viewed in a plan view from the operation surface side. A sensor having a different length L2 from the boundary line of the second intersection. An electronic device comprising the sensor according to any one of claims 1 to 11.

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