JP6906674B1 - フレーム収容装置およびフレーム収容方法 - Google Patents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G57/00—Stacking of articles
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- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
- B65D85/48—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for glass sheets
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0019—End effectors other than grippers
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- B65D65/14—Wrappers or flexible covers with areas coated with adhesive
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- B65G43/00—Control devices, e.g. for safety, warning or fault-correcting
- B65G43/08—Control devices operated by article or material being fed, conveyed or discharged
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- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
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- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/22—Devices influencing the relative position or the attitude of articles during transit by conveyors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
- B65G47/914—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers provided with drive systems incorporating rotary and rectilinear movements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67363—Closed carriers specially adapted for containing substrates other than wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D2313/00—Connecting or fastening means
- B65D2313/10—Adhesive or cohesive means for holding the contents attached to the container
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2203/00—Indexing code relating to control or detection of the articles or the load carriers during conveying
- B65G2203/04—Detection means
- B65G2203/041—Camera
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2203/00—Indexing code relating to control or detection of the articles or the load carriers during conveying
- B65G2203/04—Detection means
- B65G2203/042—Sensors
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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Abstract
Description
また、移動手段を取出手段で構成すれば、取出手段とは別に移動手段を設ける必要がなく、装置が大型化することをより防止することができる。
なお、本実施形態におけるX軸、Y軸、Z軸は、それぞれが直交する関係にあり、X軸およびY軸は、所定平面内の軸とし、Z軸は、前記所定平面に直交する軸とする。さらに、本実施形態では、Y軸と平行な図1(B)の手前方向から観た場合を基準とし、方向を示した場合、「上」がZ軸の矢印方向で「下」がその逆方向、「左」がX軸の矢印方向で「右」がその逆方向、「前」がY軸の矢印方向で「後」がその逆方向とする。
多関節ロボット51は、複数のアームによって構成され、その作業範囲内において、作業部である先端アーム51Aで支持したものを何れの位置、何れの角度にでも変位可能な所謂6軸ロボットである。
先ず、図1(A)、(B)中実線で示す初期位置に各部材が配置されたフレーム収容装置EAに対し、当該フレーム収容装置EAの使用者(以下、単に「使用者」という)が、同図中二点鎖線で示すように、収容台12、22を左方に引き出し、その上にリングフレームRFを積層して収容した後、当該収容台12、22を初期位置に復帰させる。次いで、使用者が図示しない操作パネルやパーソナルコンピュータ等の操作手段を介して自動運転開始の信号を入力すると、取出手段50が検知手段55を駆動し、遮蔽部材32を検知してこの検知結果を基に、遮蔽部材32によって遮蔽されていない方の収容手段(本実施形態の場合、第1収容手段10)からリングフレームRFを取り出す。すなわち、取出手段50が多関節ロボット51および図示しない減圧手段を駆動し、図1(B)中二点鎖線で示すように、第1収容手段10の取出口14に吸着パッド53を挿入し、当該吸着パッド53でリングフレームRFを吸着保持する。その後、取出手段50が多関節ロボット51を駆動し、図1(A)中二点鎖線で示すように、吸着パッド53で保持したリングフレームRFを処理装置EA1の作業台TAに載置した後、図示しない減圧手段の駆動を停止し、以降上記同様の動作が繰り返される。
なお、作業台TAに載置されたリングフレームRFは、処理装置EA1によって所定の処理や所定の加工が施される。
収容手段は、フレーム収容装置EAに3体以上備わっていてもよい。
フレーム部材は、リングフレームRF以外に、環状でない(外周が繋がっていない)ものや、円形、楕円形、多角形、その他の形状であってもよい。
前記実施形態において、ローラ等の回転部材が採用されている場合、当該回転部材を回転駆動させる駆動機器を備えてもよいし、回転部材の表面や回転部材自体をゴムや樹脂等の変形可能な部材で構成してもよいし、回転部材の表面や回転部材自体を変形しない部材で構成してもよいし、ローラの代わりに回転するまたは回転しないシャフトやブレード等の他の部材を採用してもよいし、押圧ローラや押圧ヘッド等の押圧手段や押圧部材といった被押圧物を押圧するものが採用されている場合、上記で例示したものに代えてまたは併用して、ローラ、丸棒、ブレード材、ブラシ状部材の他、大気やガス等の気体の吹き付けによるものを採用してもよいし、押圧するものをゴム、樹脂、スポンジ等の変形可能な部材で構成してもよいし、金属や樹脂等の変形しない部材で構成してもよいし、支持(保持)手段や支持(保持)部材等の被支持部材(被保持部材)を支持(保持)するものが採用されている場合、メカチャックやチャックシリンダ等の把持手段、クーロン力、接着剤(接着シート、接着テープ)、粘着剤(粘着シート、粘着テープ)、磁力、ベルヌーイ吸着、吸引吸着、駆動機器等で被支持部材を支持(保持)する構成を採用してもよい。
10…第1収容手段(収容手段)
14…取出口
20…第2収容手段(収容手段)
24…取出口
30…遮蔽手段
32…遮蔽部材
40…移動手段
50…取出手段
RF…リングフレーム(フレーム部材)
Claims (3)
- フレーム部材を取り出す取出口を有し、前記フレーム部材を取出可能に収容する複数の収容手段と、
前記複数の収容手段の前記取出口を選択的に遮蔽する遮蔽部材を有する遮蔽手段と、
前記複数の収容手段間で前記遮蔽部材を移動させる移動手段とを備えていることを特徴とするフレーム収容装置。 - 前記複数の収容手段の前記取出口から前記フレーム部材を取り出す取出手段を備え、
前記移動手段は、前記取出手段で構成されていることを特徴とする請求項1に記載のフレーム収容装置。 - フレーム部材を取り出す取出口を有し、前記フレーム部材を取出可能な複数の収容手段間で遮蔽部材を移動させて、当該遮蔽部材で前記取出口を選択的に遮蔽する遮蔽工程と、
前記取出口が前記遮蔽部材で遮蔽された収容手段に前記フレーム部材を収容する収容工程とを実施することを特徴とするフレーム収容方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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JP2020205748A JP6906674B1 (ja) | 2020-12-11 | 2020-12-11 | フレーム収容装置およびフレーム収容方法 |
KR1020210161160A KR20220083580A (ko) | 2020-12-11 | 2021-11-22 | 프레임 수용 장치 및 프레임 수용 방법 |
TW110144307A TWI874731B (zh) | 2020-12-11 | 2021-11-29 | 框架收容裝置以及框架收容方法 |
CN202111504871.3A CN114620491A (zh) | 2020-12-11 | 2021-12-10 | 框架收纳装置以及框架收纳方法 |
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JP2020205748A JP6906674B1 (ja) | 2020-12-11 | 2020-12-11 | フレーム収容装置およびフレーム収容方法 |
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JP6906674B1 true JP6906674B1 (ja) | 2021-07-21 |
JP2022092820A JP2022092820A (ja) | 2022-06-23 |
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Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001244220A (ja) * | 2000-02-29 | 2001-09-07 | Tokyo Seimitsu Co Ltd | ダイシング装置 |
JP2002541678A (ja) * | 1999-04-13 | 2002-12-03 | インフィネオン テクノロジース エスシー300 ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー コマンディートゲゼルシャフト | 対象物を貯蔵するための、特にウェハ、フラットパネル又はcd等のディスク状の対象物を貯蔵するための装置 |
JP2004147540A (ja) * | 2002-10-30 | 2004-05-27 | Kawasaki Kiko Co Ltd | 乗用作業型茶刈機 |
WO2013157462A1 (ja) * | 2012-04-16 | 2013-10-24 | ローツェ株式会社 | 収納容器、収納容器のシャッター開閉ユニット、及びこれらを用いたウエハストッカー |
JP2014003195A (ja) * | 2012-06-20 | 2014-01-09 | Lintec Corp | シート貼付装置および貼付方法 |
JP2014007216A (ja) * | 2012-06-22 | 2014-01-16 | Lintec Corp | シート貼付装置および貼付方法 |
JP2014027015A (ja) * | 2012-07-24 | 2014-02-06 | Lintec Corp | シート貼付装置および貼付方法 |
JP2016009786A (ja) * | 2014-06-25 | 2016-01-18 | 株式会社ディスコ | テープ貼着装置 |
JP2017050504A (ja) * | 2015-09-04 | 2017-03-09 | リンテック株式会社 | 供給装置および供給方法 |
JP2020077737A (ja) * | 2018-11-07 | 2020-05-21 | 株式会社ディスコ | カセット載置機構 |
-
2020
- 2020-12-11 JP JP2020205748A patent/JP6906674B1/ja active Active
-
2021
- 2021-11-22 KR KR1020210161160A patent/KR20220083580A/ko active Pending
- 2021-12-10 CN CN202111504871.3A patent/CN114620491A/zh active Pending
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002541678A (ja) * | 1999-04-13 | 2002-12-03 | インフィネオン テクノロジース エスシー300 ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー コマンディートゲゼルシャフト | 対象物を貯蔵するための、特にウェハ、フラットパネル又はcd等のディスク状の対象物を貯蔵するための装置 |
JP2001244220A (ja) * | 2000-02-29 | 2001-09-07 | Tokyo Seimitsu Co Ltd | ダイシング装置 |
JP2004147540A (ja) * | 2002-10-30 | 2004-05-27 | Kawasaki Kiko Co Ltd | 乗用作業型茶刈機 |
WO2013157462A1 (ja) * | 2012-04-16 | 2013-10-24 | ローツェ株式会社 | 収納容器、収納容器のシャッター開閉ユニット、及びこれらを用いたウエハストッカー |
JP2014003195A (ja) * | 2012-06-20 | 2014-01-09 | Lintec Corp | シート貼付装置および貼付方法 |
JP2014007216A (ja) * | 2012-06-22 | 2014-01-16 | Lintec Corp | シート貼付装置および貼付方法 |
JP2014027015A (ja) * | 2012-07-24 | 2014-02-06 | Lintec Corp | シート貼付装置および貼付方法 |
JP2016009786A (ja) * | 2014-06-25 | 2016-01-18 | 株式会社ディスコ | テープ貼着装置 |
JP2017050504A (ja) * | 2015-09-04 | 2017-03-09 | リンテック株式会社 | 供給装置および供給方法 |
JP2020077737A (ja) * | 2018-11-07 | 2020-05-21 | 株式会社ディスコ | カセット載置機構 |
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CN114620491A (zh) | 2022-06-14 |
JP2022092820A (ja) | 2022-06-23 |
KR20220083580A (ko) | 2022-06-20 |
TW202230596A (zh) | 2022-08-01 |
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