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JP6868937B2 - Manufacturing method of liquid crystal display device - Google Patents

Manufacturing method of liquid crystal display device Download PDF

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JP6868937B2
JP6868937B2 JP2016253747A JP2016253747A JP6868937B2 JP 6868937 B2 JP6868937 B2 JP 6868937B2 JP 2016253747 A JP2016253747 A JP 2016253747A JP 2016253747 A JP2016253747 A JP 2016253747A JP 6868937 B2 JP6868937 B2 JP 6868937B2
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liquid crystal
protective resin
circuit board
display device
arrangement direction
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JP2018106053A (en
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和訓 原田
和訓 原田
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Citizen Watch Co Ltd
Citizen Fine Device Co Ltd
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Citizen Watch Co Ltd
Citizen Fine Device Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating

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  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Description

本発明は、液晶表示装置の製造方法に関する。 The present invention relates to a method for manufacturing a liquid crystal display device.

図３は液晶表示装置の一例を示す(ａ）上面図、（ｂ）Ａ−Ａ断面図である。図３に示す液晶表示装置において、液晶パネル１は、表面に反射電極などの画素電極が形成されたシリコン基板から成る第一基板２と、それに相対する表面にＩＴＯ電極などの対向電極が形成されたガラス基板から成る第二基板３とを、所定の位置および間隔で周辺接着剤により貼り合せることで形成された隙間に液晶が封入されたＬＣＯＳと呼ばれる液晶パネルである。液晶パネル１は回路基板４に搭載され、第一基板２の上面に設けられた電極パッド８ａと回路基板４の上面に設けられた電極パッド８ｂとはワイヤー６で電気的に接続され、第二基板３の下面に設けられた対向電極と回路基板４の上面に設けられた電極（不図示）とは導電性樹脂７で接続され、回路基板４を介して画素電極と対向電極との間に電位差を与え、液晶の配向を制御することにより各種の画像表示が行われる。ワイヤー６は、シリコン系樹脂などの保護樹脂５で覆われている。（例えば、特許文献１参照） FIG. 3 is (a) a top view and (b) a sectional view taken along the line AA showing an example of a liquid crystal display device. In the liquid crystal display device shown in FIG. 3, the liquid crystal panel 1 has a first substrate 2 made of a silicon substrate having a pixel electrode such as a reflective electrode formed on its surface, and a counter electrode such as an ITO electrode formed on a surface facing the first substrate 2. It is a liquid crystal panel called LCOS in which a liquid crystal is sealed in a gap formed by laminating a second substrate 3 made of a glass substrate with a peripheral adhesive at a predetermined position and interval. The liquid crystal panel 1 is mounted on the circuit board 4, and the electrode pads 8a provided on the upper surface of the first substrate 2 and the electrode pads 8b provided on the upper surface of the circuit board 4 are electrically connected by a wire 6 and second. The counter electrode provided on the lower surface of the substrate 3 and the electrode (not shown) provided on the upper surface of the circuit board 4 are connected by a conductive resin 7, and are connected between the pixel electrode and the counter electrode via the circuit board 4. Various image displays are performed by giving a potential difference and controlling the orientation of the liquid crystal. The wire 6 is covered with a protective resin 5 such as a silicon-based resin. (See, for example, Patent Document 1)

特開２０１２−３８９４７JP 2012-38947

液晶パネル１と回路基板４とを電気的に接続するワイヤー６に保護樹脂５の塗布を行い、硬化をさせることにより、外部または内部からのワイヤー６の破断を効果的に防止することができる。しかし、保護樹脂５の塗布を行う際に、従来技術における液晶表示装置の製造方法では、保護樹脂５内部に気泡が混入してしまうことがあり、その気泡により信頼性試験や液晶表示装置の駆動時に封止樹脂内部に応力が発生し、ワイヤー６へのストレス源となり、断線などの導通不良を起こすことがある。 By applying the protective resin 5 to the wire 6 that electrically connects the liquid crystal panel 1 and the circuit board 4 and curing the wire 6, it is possible to effectively prevent the wire 6 from breaking from the outside or the inside. However, when the protective resin 5 is applied, in the conventional method of manufacturing a liquid crystal display device, air bubbles may be mixed inside the protective resin 5, and the air bubbles may cause a reliability test or drive the liquid crystal display device. Occasionally, stress is generated inside the sealing resin, which becomes a stress source for the wire 6 and may cause conduction failure such as disconnection.

本発明は以上の問題に鑑みてなされたものであり、保護樹脂の塗布時の気泡混入を低減でき、気泡によって生じる導通不良を防止することが可能な液晶表示装置の製造方法を提供することを目的とする。 The present invention has been made in view of the above problems, and provides a method for manufacturing a liquid crystal display device capable of reducing air bubble mixing during application of a protective resin and preventing conduction failure caused by air bubbles. The purpose.

液晶パネルと回路基板とがワイヤーで電気的に接続され、当該ワイヤーが保護樹脂で覆われた液晶表示装置の製造方法において、前記保護樹脂を、前記液晶パネルの電極パッドの配列方向一端部から配列方向他端部に向かって塗布し、次いで、当該配列方向他端部から前記回路基板の電極パッドの配列方向端部のうち当該配列方向他端部に隣接する配列方向一端部に向かって、又は、それとは反対方向に向かって塗布し、次いで、前記回路基板の前記電極パッドの配列方向一端部から配列方向他端部に向かいながら、前記回路基板の前記電極パッドから前記液晶パネルの前記電極パッドに向かって塗布し、次いで、前記液晶パネルの前記電極パッドの配列方向一端部から前記回路基板の前記電極パッドの配列方向他端部に向かって、又は、それとは反対方向に向かって塗布する、液晶表示装置の製造方法とする。
In a method for manufacturing a liquid crystal display in which a liquid crystal panel and a circuit board are electrically connected by a wire and the wire is covered with a protective resin, the protective resin is arranged from one end in the arrangement direction of the electrode pads of the liquid crystal panel. was applied in the direction the other end, then, from the said arrangement direction other end portion in the array direction end portion adjacent to the array direction end portion of the array direction end portion of the electrode pads of the circuit board, or Then, the electrode pad of the circuit board is applied from the electrode pad of the liquid crystal panel to the electrode pad of the liquid crystal panel while being applied from one end in the arrangement direction to the other end in the arrangement direction of the electrode pad of the circuit board. Then, the coating is applied from one end in the arrangement direction of the electrode pads of the liquid crystal panel toward the other end in the arrangement direction of the electrode pads of the circuit board, or in the opposite direction. It is a method of manufacturing a liquid crystal display device.

前記保護樹脂を前記回路基板の前記電極パッドから前記液晶パネルの前記電極パッドに向かって塗布する際に、前記保護樹脂を複数の前記ワイヤー間の隙間に前記ワイヤーの延在方向に沿って塗布し、当該塗布を前記ワイヤー間の一つ又は複数の隙間毎に分けて前記回路基板の前記電極パッドの配列方向一端部から配列方向他端部に向かって順番に行う液晶表示装置の製造方法であっても良い。 When the protective resin is applied from the electrode pad of the circuit board toward the electrode pad of the liquid crystal panel, the protective resin is applied to the gaps between the plurality of wires along the extending direction of the wires. A method for manufacturing a liquid crystal display device, wherein the coating is divided into one or a plurality of gaps between the wires and sequentially performed from one end in the arrangement direction to the other end in the arrangement direction of the electrode pads of the circuit board. You may.

前記保護樹脂を前記ワイヤー間の隙間に塗布する際に、前記保護樹脂を吐出するノズルの先端と前記ワイヤーとの距離を０．１ｍｍ〜１ｍｍにする液晶表示装置の製造方法であっても良い。 A method of manufacturing a liquid crystal display device may be used in which the distance between the tip of the nozzle for discharging the protective resin and the wire when the protective resin is applied to the gap between the wires is set to 0.1 mm to 1 mm.

本発明によれば、保護樹脂を塗布する際の気泡混入が原因となり生じる、液晶パネルと回路基板との電気的な接続不良を防止することができる。 According to the present invention, it is possible to prevent an electrical connection failure between the liquid crystal panel and the circuit board, which is caused by air bubbles mixed in when the protective resin is applied.

本発明における液晶表示装置の製造方法を示す概念図The conceptual diagram which shows the manufacturing method of the liquid crystal display device in this invention. 本発明における液晶表示装置の製造方法を示す概念図The conceptual diagram which shows the manufacturing method of the liquid crystal display device in this invention. 本発明における液晶表示装置の製造方法を示す概念図The conceptual diagram which shows the manufacturing method of the liquid crystal display device in this invention. 液晶表示装置の他の形態を示す概念図Conceptual diagram showing other forms of a liquid crystal display device 液晶表示装置の一例を示す（ａ）上面図、（ｂ）Ａ−Ａ断面図(A) Top view and (b) AA sectional view showing an example of a liquid crystal display device.

本発明における液晶表示装置の製造方法は、ワイヤー６に保護樹脂５を所定の方向および順序で塗布することを特徴としている。以下、本発明の実施形態を説明する。尚、液晶表示装置の構成は、図３に示した液晶表示装置と同様であり、詳しい説明は省略する。 The method for manufacturing a liquid crystal display device in the present invention is characterized in that the protective resin 5 is applied to the wire 6 in a predetermined direction and order. Hereinafter, embodiments of the present invention will be described. The configuration of the liquid crystal display device is the same as that of the liquid crystal display device shown in FIG. 3, and detailed description thereof will be omitted.

図１−１は本発明における液晶表示装置の製造方法を示す概念図である。保護樹脂５の塗布方法としては、まず図１−１（ａ）に示すように、始点を第一基板２の電極パッド８ａの配列方向一端部、終点を他端部として、第二基板２の上面高さを越えないように保護樹脂５を第一基板２の電極パッド８ａとワイヤー６のネック部分に塗布し、第一の塗布部９を形成する。第一の塗布部９の上面は保護樹脂５が硬化した状態で第二基板３の上面とほぼ同等の高さになるようにするのが望ましい。尚、第一の塗布部９の延在方向は第一基板２の複数の電極パッド８ａの配列方向である。 FIG. 1-1 is a conceptual diagram showing a method of manufacturing a liquid crystal display device according to the present invention. As a method of applying the protective resin 5, first, as shown in FIG. 1-1 (a), the start point is one end in the arrangement direction of the electrode pads 8a of the first substrate 2, and the end point is the other end of the second substrate 2. The protective resin 5 is applied to the electrode pad 8a of the first substrate 2 and the neck portion of the wire 6 so as not to exceed the height of the upper surface to form the first coating portion 9. It is desirable that the upper surface of the first coating portion 9 has a height substantially equal to that of the upper surface of the second substrate 3 in a state where the protective resin 5 is cured. The extending direction of the first coating portion 9 is the arrangement direction of the plurality of electrode pads 8a of the first substrate 2.

次いで図１−１（ｂ）に示すように、始点を第一基板２の電極パッド８ａの配列方向他端部、終点を回路基板４の電極パッド８ｂの配列方向一端部として、液晶パネル１に向かって右端に位置するワイヤー６の外周部分付近に保護樹脂５を塗布し、第二の塗布部１０を形成する。第二の塗布部１０の上面は保護樹脂５が硬化した状態で第二基板３の上面とほぼ同等の高さになるようにするのが望ましい。 Next, as shown in FIG. 1-1 (b), the liquid crystal panel 1 has a start point as the other end in the arrangement direction of the electrode pads 8a of the first substrate 2 and an end point as one end in the arrangement direction of the electrode pads 8b of the circuit board 4. The protective resin 5 is applied to the vicinity of the outer peripheral portion of the wire 6 located at the right end thereof to form the second coated portion 10. It is desirable that the upper surface of the second coating portion 10 has a height substantially equal to that of the upper surface of the second substrate 3 in a state where the protective resin 5 is cured.

次いで図１−２（ｃ−１）に示すように、始点を回路基板４の電極パッド８ｂの配列方向一端部、終点を回路基板４の電極パッド８ｂの配列方向他端部として、電極パッド８ｂの配列方向に沿ってワイヤー６間の隙間に保護樹脂５を塗布し、第三の塗布部１１を形成する。このとき保護樹脂５の塗布方法としては、図１−２（ｃ−１）、図１−２（ｃ−２）に示すように、保護樹脂５を吐出する塗布ノズルのノズル先端１３をワイヤー６の間のワイヤーループトップ付近に０．１ｍｍ〜１．０ｍｍの距離でワイヤー６へ極力接近させ、始点を回路基板４の電極パッド８ｂ、終点を第一基板２の電極パッド８ａとして、ワイヤー６の延在方向に沿ってワイヤー６間の隙間に保護樹脂５の注入を行う。保護樹脂５の注入はワイヤー６間の１つ又は複数の隙間毎に分けて行われ、右端に位置するワイヤー６間の隙間から左端に位置するワイヤー６間の隙間に向かって順番に保護樹脂５をワイヤー６間の隙間に入れ込む。このときの保護樹脂５（第三の塗布部１１）の上面の高さは膨張、収縮を考慮し、保護樹脂５が硬化した状態で第二基板３の上面とほぼ同等の高さになるようにするのが望ましい。保護樹脂５がワイヤーループトップを覆う量となったら、次のワイヤーループ間である左方向へノズル先端１３を移動させ、引き続き同様に保護樹脂５をワイヤー６間の隙間に注入する。終点である回路基板４の電極パッド８ｂの配列方向他端部に到達するまで上記塗布を繰り返し行う。ワイヤー６間の全ての隙間に保護樹脂５を入れ込み、馴染ませると図１−３（ｄ）の第三の塗布部１１のような回路基板４の電極パッド８ｂとワイヤー６の全体を覆う形状となる。 Next, as shown in FIG. 1-2 (c-1), the electrode pad 8b has a start point as one end in the arrangement direction of the electrode pads 8b of the circuit board 4 and an end point as the other end in the arrangement direction of the electrode pads 8b of the circuit board 4. The protective resin 5 is applied to the gap between the wires 6 along the arrangement direction of the above to form the third coating portion 11. At this time, as a method of applying the protective resin 5, as shown in FIGS. 1-2 (c-1) and 1-2 (c-2), the wire 6 is attached to the nozzle tip 13 of the application nozzle for discharging the protective resin 5. As close as possible to the wire 6 at a distance of 0.1 mm to 1.0 mm near the wire loop top between the wires 6, the start point is the electrode pad 8b of the circuit board 4, and the end point is the electrode pad 8a of the first substrate 2. The protective resin 5 is injected into the gap between the wires 6 along the extending direction. The protective resin 5 is injected separately for each one or a plurality of gaps between the wires 6, and the protective resin 5 is sequentially injected from the gap between the wires 6 located at the right end toward the gap between the wires 6 located at the left end. Is inserted into the gap between the wires 6. At this time, the height of the upper surface of the protective resin 5 (third coating portion 11) should be substantially the same as the upper surface of the second substrate 3 in a cured state in consideration of expansion and contraction. It is desirable to. When the amount of the protective resin 5 covers the wire loop top, the nozzle tip 13 is moved to the left between the next wire loops, and the protective resin 5 is continuously injected into the gap between the wires 6 in the same manner. The above coating is repeated until it reaches the other end of the electrode pad 8b of the circuit board 4 which is the end point in the arrangement direction. When the protective resin 5 is put into all the gaps between the wires 6 and blended, the shape covers the entire electrode pad 8b of the circuit board 4 and the wire 6 as in the third coating portion 11 of FIG. 1-3 (d). Become.

なお、図１−２に示した第三の塗布部１１を形成する際の保護樹脂５の塗布は、ワイヤー６間の１つ又は複数の隙間毎に分けずに行っても良いが、ワイヤー６間の１つ又は複数の隙間毎に分けて行う方が保護樹脂５への気泡の混入をより効果的に防止することができる。 The protective resin 5 when forming the third coating portion 11 shown in FIG. 1-2 may be applied without being divided into one or a plurality of gaps between the wires 6, but the wires 6 may be applied. It is possible to more effectively prevent air bubbles from being mixed into the protective resin 5 by dividing the gap into one or a plurality of gaps.

最後に図１−３（ｅ）に示すように、始点を第一基板２の電極パッド８ａの配列方向一端部、終点を回路基板４の電極パッド８ｂの配列方向他端部として、液晶パネル１に向かって左端に位置するワイヤー６の外周部分付近に保護樹脂５を塗布し、第四の塗布部１２を形成することにより、塗布は終了となる。第四の塗布部１２の上面は保護樹脂５が硬化した状態で第二基板３の上面とほぼ同等の高さになるようにするのが望ましい。 Finally, as shown in FIG. 1-3 (e), the liquid crystal panel 1 has a start point as one end in the arrangement direction of the electrode pads 8a of the first substrate 2 and an end point as the other end in the arrangement direction of the electrode pads 8b of the circuit board 4. The coating is completed by applying the protective resin 5 to the vicinity of the outer peripheral portion of the wire 6 located at the left end toward the surface and forming the fourth coating portion 12. It is desirable that the upper surface of the fourth coating portion 12 has a height substantially equal to that of the upper surface of the second substrate 3 in a state where the protective resin 5 is cured.

以上のような保護樹脂５の塗布方法によれば、保護樹脂５への気泡の混入を効果的に防止することができる。 According to the method of applying the protective resin 5 as described above, it is possible to effectively prevent air bubbles from being mixed into the protective resin 5.

上述の実施例では、保護樹脂５の塗布量を減少させるために、保護樹脂５はワイヤー６の形状に沿うようにループトップ部分を頂点とし、回路基板４側のネック部分に向かって表面が坂状（斜面）となるように塗布しているが、ネック部分が露出しない程度に覆われていれば問題はない。第一の塗布部９、第二の塗布部１０、第四の塗布部１２の塗布する向きは図１−１、図１−２、図１−３に矢印で示した方向の逆方向でも良く、保護樹脂５内部に気泡の混入が無いように塗布することが望ましい。また、ワイヤー６にノズル先端１３を接触させてワイヤー６を変形、損傷させることは望ましくない。 In the above embodiment, in order to reduce the coating amount of the protective resin 5, the protective resin 5 has a loop top portion as an apex so as to follow the shape of the wire 6, and the surface of the protective resin 5 slopes toward the neck portion on the circuit board 4 side. It is applied so that it has a shape (slope), but there is no problem as long as the neck part is covered to the extent that it is not exposed. The coating directions of the first coating portion 9, the second coating portion 10, and the fourth coating portion 12 may be opposite to the directions indicated by the arrows in FIGS. 1-1, 1-2, and 1-3. , It is desirable to apply the protective resin 5 so that no air bubbles are mixed inside. Further, it is not desirable to bring the nozzle tip 13 into contact with the wire 6 to deform or damage the wire 6.

図２は液晶表示装置の他の形態を示す概念図である。保護樹脂５の塗布形状については図２(ａ）のように四角形状の塗布形状か図２（ｂ）のように台形状の塗布形状が一般的で、ワイヤー６の配置により保護樹脂５の塗布形状を変化させる。例えば図２（ｂ）のように回路基板４の電極パッド８ｂの間隔が狭い場合にはワイヤー６が回路基板４の電極パッド８ｂに向かって内側向きの配置となることから塗布形状も台形とするほうが保護樹脂５の量を減量することができる。電極パッド８ａ、８ｂは保護樹脂５で全て覆われている必要は無く、ワイヤー６のネック部分が覆われていれば良い。 FIG. 2 is a conceptual diagram showing another form of the liquid crystal display device. As for the coating shape of the protective resin 5, a square coating shape as shown in FIG. 2A or a trapezoidal coating shape as shown in FIG. 2B is common, and the protective resin 5 is coated by arranging the wires 6. Change the shape. For example, when the distance between the electrode pads 8b of the circuit board 4 is narrow as shown in FIG. 2B, the wires 6 are arranged inward toward the electrode pads 8b of the circuit board 4, so that the coating shape is also trapezoidal. The amount of the protective resin 5 can be reduced. The electrode pads 8a and 8b do not have to be completely covered with the protective resin 5, and the neck portion of the wire 6 may be covered.

なお、本発明は、液晶パネル１と回路基板４とを電気的に接続するワイヤー６を保護樹脂５で封止する液晶表示装置に限らず、その他の半導体装置等にも適用することができる。 The present invention can be applied not only to a liquid crystal display device in which a wire 6 for electrically connecting a liquid crystal panel 1 and a circuit board 4 is sealed with a protective resin 5, but also to other semiconductor devices and the like.

１ 液晶パネル
２ 第一基板
３ 第二基板
４ 回路基板
５ 保護樹脂
６ ワイヤー
７ 導電性樹脂
８ａ 電極パッド
８ｂ 電極パッド
９ 第一の塗布部
１０ 第二の塗布部
１１ 第三の塗布部
１２ 第四の塗布部
１３ ノズル先端 1 Liquid crystal panel 2 1st board 3 2nd board 4 Circuit board 5 Protective resin 6 Wire 7 Conductive resin 8a Electrode pad 8b Electrode pad 9 1st coating part 10 2nd coating part 11 3rd coating part 12 4th Coating part 13 Nozzle tip

Claims (3)

液晶パネルと回路基板とがワイヤーで電気的に接続され、当該ワイヤーが保護樹脂で覆われた液晶表示装置の製造方法において、
前記保護樹脂を、前記液晶パネルの電極パッドの配列方向一端部から配列方向他端部に向かって塗布し、次いで、当該配列方向他端部から前記回路基板の電極パッドの配列方向端部のうち当該配列方向他端部に隣接する配列方向一端部に向かって、又は、それとは反対方向に向かって塗布し、次いで、前記回路基板の前記電極パッドの配列方向一端部から配列方向他端部に向かいながら、前記回路基板の前記電極パッドから前記液晶パネルの前記電極パッドに向かって塗布し、次いで、前記液晶パネルの前記電極パッドの配列方向一端部から前記回路基板の前記電極パッドの配列方向他端部に向かって、又は、それとは反対方向に向かって塗布する、
ことを特徴とする液晶表示装置の製造方法。 In a method for manufacturing a liquid crystal display device in which a liquid crystal panel and a circuit board are electrically connected by a wire and the wire is covered with a protective resin.
Wherein the protective resin, said coating toward the arrangement direction end portion of the electrode pads of the liquid crystal panel in the array direction end portion, then, among the the arrangement direction other end portion of the arrangement-direction end portion of the electrode pads of the circuit board toward the arrangement direction end portion adjacent to the array direction end portion, or applied toward the opposite direction from that, then, the arrangement direction other end portion of SEQ direction end portion of the electrode pad of the circuit board While facing, the coating is applied from the electrode pad of the circuit board toward the electrode pad of the liquid crystal panel, and then from one end in the arrangement direction of the electrode pad of the liquid crystal panel to the arrangement direction of the electrode pad of the circuit board and the like. Apply towards the edges or in the opposite direction,
A method for manufacturing a liquid crystal display device. 前記保護樹脂を前記回路基板の前記電極パッドから前記液晶パネルの前記電極パッドに向かって塗布する際に、前記保護樹脂を複数の前記ワイヤー間の隙間に前記ワイヤーの延在方向に沿って塗布し、当該塗布を前記ワイヤー間の一つ又は複数の隙間毎に分けて前記回路基板の前記電極パッドの配列方向一端部から配列方向他端部に向かって順番に行うことを特徴とする請求項１に記載の液晶表示装置の製造方法。 When the protective resin is applied from the electrode pad of the circuit board toward the electrode pad of the liquid crystal panel, the protective resin is applied to the gaps between the plurality of wires along the extending direction of the wires. 1. The coating is divided into one or a plurality of gaps between the wires, and the coating is sequentially performed from one end in the arrangement direction to the other end in the arrangement direction of the electrode pads of the circuit board. The method for manufacturing a liquid crystal display device according to. 前記保護樹脂を前記ワイヤー間の隙間に塗布する際に、前記保護樹脂を吐出するノズルの先端と前記ワイヤーとの距離を０．１ｍｍ〜１ｍｍにすることを特徴とする請求項２に記載の液晶表示装置の製造方法。
The liquid crystal according to claim 2 , wherein when the protective resin is applied to the gap between the wires, the distance between the tip of the nozzle for discharging the protective resin and the wire is set to 0.1 mm to 1 mm. How to manufacture a display device.
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