JP6846983B2 - Gate seal structure for semiconductor manufacturing equipment and its manufacturing method - Google Patents

Description

The present invention relates to a gate seal structure for a semiconductor manufacturing apparatus and a method for manufacturing the same.

Many semiconductor manufacturing devices are equipped with a vacuum chamber. The vacuum chamber is provided with a gate for taking in and out an object to be processed such as a wafer. The gate is provided with a seal structure that opens and closes the gate. This seal structure includes, for example, a metal plate-shaped member having an annular groove formed on its surface, and a fluororubber seal member provided inside the annular groove. Here, although fluororubber has excellent chemical resistance, it is difficult to bond it to a metal surface with an adhesive, for example, due to its properties.

Therefore, for example, Patent Document 1 proposes that the adhesive layer is composed of two layers, a vulcanized adhesive layer containing a silane coupling agent and a fluororubber layer.

Japanese Unexamined Patent Publication No. 2000-272045

By the way, in a conventional gate seal structure for a semiconductor manufacturing apparatus, when a metal plate-shaped member and a fluororubber seal member are fixed by sulfide adhesion with an adhesive, the adhesiveness of the fluororubber is extremely low. Therefore, the adhesive force between the plate-shaped member and the seal member is low, and the seal member may fall off due to, for example, the opening / closing operation of the gate. Therefore, there is a demand for a gate seal structure for a semiconductor manufacturing apparatus in which a fluororubber seal member fixed inside an annular groove formed in a metal plate-shaped member does not fall off even when the gate is opened and closed.

The present invention has been made in view of this point, and an object of the present invention is to securely fix a fluororubber sealing member inside an annular groove formed in a metal plate-shaped member. is there.

In order to achieve the above object, the gate seal structure for the semiconductor manufacturing apparatus according to the present invention includes a metal plate-like member having an annular groove formed on the surface and a fluororubber provided inside the annular groove. A gate seal structure for a semiconductor manufacturing apparatus provided with an annular seal member made of the same material, wherein the average roughness Rc of a roughness curve element is 50 μm to 500 μm on at least a part of the inner surface of the annular groove. A rough surface portion having a roughness curve with a skewness Rsk of -3 to 0.5 is provided, and the sealing member is joined to the rough surface portion of the annular groove, and the bottom surface and the inner surface of the annular groove are joined to the rough surface portion. The rough surface portions are provided on both side surfaces inclined with respect to the bottom surface .

Further, the gate seal structure for the semiconductor manufacturing apparatus according to the present invention includes a metal plate-shaped member having an annular groove formed on its surface and an annular seal member made of fluororubber provided inside the annular groove. A gate seal structure for a semiconductor manufacturing apparatus comprising the above, wherein the average roughness Rc of the roughness curve element is 50 μm to 500 μm on at least a part of the inner surface of the annular groove, and the roughness curve has a roughness curve. A rough surface portion having a skewness Rsk of -3 to 0.5 is provided, and the sealing member is joined to the rough surface portion of the annular groove, and on both side surfaces of the inner surface of the annular groove inclined with respect to the bottom surface. Is characterized in that the rough surface portion is provided, and a non-rough surface portion is provided on at least a part of the bottom surface.

According to the above configuration, at least a part of the inner surface of the annular groove on the surface of the metal plate-shaped member is provided with a rough surface portion having a predetermined roughness. Here, in the rough surface portion having a predetermined roughness, the average roughness Rc of the roughness curve element is 50 μm to 500 μm (preferably 80 μm to 400 μm, more preferably 100 μm to 300 μm), and the roughness means the skewness. Since the skewness Rsk of the curve is -3 to 0.5 (preferably -1.5 to 0.4, more preferably -1.0 to 0.3), the rough surface portion of the inner surface of the annular groove and the sealing member Is joined in a deeply fitted state, and the rough surface portion of the inner surface of the annular groove and the seal member can be reliably fixed. Therefore, the fluororubber sealing member can be reliably fixed inside the annular groove formed in the metal plate-shaped member. Here, when Rc is smaller than 50 μm, the fitting of the rough surface portion of the inner surface of the annular groove and the seal member becomes shallow, so that the anchor effect of fitting the rough surface portion of the inner surface of the annular groove and the seal member is ineffective. Will be enough. Further, when Rc is larger than 500 μm, it becomes difficult to completely fill the concave portion of the rough surface portion of the inner surface of the annular groove with the seal member, and the rough surface portion of the inner surface of the annular groove and the seal member are fitted together. Is shallow, so that the anchor effect of fitting the rough surface portion of the inner surface of the annular groove and the sealing member is insufficient. Further, when Rsk is smaller than -3, it becomes difficult to completely fill the concave portion of the rough surface portion of the inner surface of the annular groove with the seal member, and the rough surface portion of the inner surface of the annular groove and the seal member are fitted. Since the fitting becomes shallow, the anchor effect of fitting the rough surface portion of the inner surface of the annular groove and the sealing member becomes insufficient. Further, when Rsk is larger than 0.5, the seal member is easily removed from the rough surface portion of the inner surface of the annular groove, so that the anchor effect of fitting the rough surface portion of the inner surface of the annular groove and the seal member is insufficient. Become.

Further, the Kurtosis (Rku) of the roughness curve, which means the sharpness of the rough surface portion, is preferably 1.5 to 5.0, more preferably 2.0 to 4.0. Here, when Rku is 1.5 or more, it becomes difficult for the seal member to come off from the rough surface portion of the inner surface of the annular groove. Further, when Rku is 5.0 or less, stress concentration is less likely to occur starting from the apex of the convex portion on the rough surface portion of the inner surface of the annular groove, so that the peel strength between the rough surface portion and the sealing member becomes high. Stabilize. Further, the average length (Rsm) of the roughness curve element of the rough surface portion is preferably 10 μm to 100 μm, and more preferably 20 μm to 70 μm. Here, when Rsm is 10 μm to 100 μm, the peel strength in the fixed interface between the rough surface portion and the sealing member is stable.

The peel strength between the rough surface portion of the annular groove and the sealing member according to JIS K6256-2 may be higher than the material breaking strength of the sealing member.

According to the above configuration, the peeled state between the rough surface portion of the inner surface of the annular groove and the seal member is the destruction of the seal member. Even if the peeling is attempted in the longitudinal direction, at least a part of the sealing member is destroyed before the rough surface portion of the inner surface of the annular groove and the sealing member are peeled off. As a result, peeling between the rough surface portion of the inner surface of the annular groove and the seal member made of fluororubber is suppressed, so that the seal member made of fluororubber is inside the annular groove formed in the metal plate-shaped member. Can be securely fixed .

On the bottom side of both side surfaces of the upper Symbol annular groove may be non-rough surface portion is provided.

Contact name gate seal structure for a semiconductor manufacturing device configured as above, the amount of transmission of helium leak testing by vacuum outside covering method (JIS Z2331) is, for ^{example, 1.0 × 10 -7 Pa · m} 3 / s Since it is about 1.0 × 10 ^-5 Pa · m ³ / s, it has the same level of sealing property as the gate seal structure using an adhesive.

Further, the gate seal structure for the semiconductor manufacturing apparatus having the above configuration can be manufactured by the following manufacturing method.

A method for manufacturing a gate seal structure for a semiconductor manufacturing apparatus according to the present invention, in which at least a part of the inner surface of the annular groove of a metal plate having an annular groove formed on the surface is irradiated with laser light to be roughened. A plate-shaped member manufacturing step of forming a rough surface portion in which the average roughness Rc of the edge curve element is 50 μm to 500 μm and the skewness Rsk of the roughness curve is -3 to 0.5 to manufacture a plate-shaped member. After the molding composition preparation step of preparing the fluoroelastomer composition as the molding composition and the molding composition inside the annular groove of the plate-shaped member, the molding composition is applied to the plate. A molding step of forming a seal member inside the annular groove of the plate-shaped member by heating and pressurizing between the shaped member and the molding die is provided , and the inner surface of the annular groove is formed on the bottom surface and the bottom surface. have a sloped sides Te characterized Rukoto.

After the molding step, a reheating step of reheating the sealing member may be provided .

According to the present invention, the average roughness Rc of the roughness curve element is 50 μm to 500 μm and the skewness Rsk of the roughness curve is -3 on at least a part of the inner surface of the annular groove of the metal plate-shaped member. Since a rough surface portion having a roughness of ~ 0.5 is provided and a seal member is joined to the rough surface portion, the fluororubber seal member is securely fixed inside the annular groove formed in the metal plate-shaped member. can do.

It is a top view of the gate seal structure for the semiconductor manufacturing apparatus which concerns on 1st Embodiment of this invention. It is sectional drawing of the gate seal structure for the semiconductor manufacturing apparatus along line II-II in FIG. It is sectional drawing of the plate-shaped member which constitutes the 1st modification of the gate seal structure for the semiconductor manufacturing apparatus which concerns on 1st Embodiment of this invention. It is sectional drawing of the plate-shaped member which constitutes the 2nd modification of the gate seal structure for the semiconductor manufacturing apparatus which concerns on 1st Embodiment of this invention. It is sectional drawing of the plate-shaped member which constitutes the 3rd modification of the gate seal structure for the semiconductor manufacturing apparatus which concerns on 1st Embodiment of this invention. It is sectional drawing of the plate-shaped member which constitutes the 4th modification of the gate seal structure for the semiconductor manufacturing apparatus which concerns on 1st Embodiment of this invention. It is sectional drawing which shows the plate-shaped member manufacturing process in the manufacturing method of the gate seal structure for the semiconductor manufacturing apparatus which concerns on 1st Embodiment of this invention. It is sectional drawing which shows the molding process in the manufacturing method of the gate seal structure for the semiconductor manufacturing apparatus which concerns on 1st Embodiment of this invention. It is a roughness curve of a rough surface portion formed on an aluminum plate in Example 1 of the 1st Embodiment of this invention. In Comparative Example 1 of the first embodiment of the present invention, it is a roughness curve of a rough surface portion formed on an aluminum plate. In Comparative Example 2 of the first embodiment of the present invention, it is a roughness curve of a rough surface portion formed on an aluminum plate.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The present invention is not limited to the following embodiments.

<< First Embodiment >>
1 to 11 show a first embodiment of a gate seal structure for a semiconductor manufacturing apparatus according to the present invention. Here, FIG. 1 is a plan view of the gate seal structure 20 for the semiconductor manufacturing apparatus of the present embodiment, and FIG. 2 is a view of the gate seal structure 20 along the line II-II in FIG. It is a sectional view. 3 to 6 are cross-sectional views of the plate-shaped member 10b constituting the first to fourth modified examples of the gate seal structure 20.

As shown in FIGS. 1 and 2, the gate seal structure 20 includes a substantially rectangular plate-shaped member 10a and a seal member 15 provided inside an annular groove 5 described later on the surface of the plate-shaped member 10a (FIG. (Refer to the dot part in 1).

As shown in FIG. 1, each corner of the plate-shaped member 10a is R-processed. Further, on one surface of the plate-shaped member 10a, as shown in FIGS. 1 and 2, an annular groove 5 is formed in a frame shape along the periphery thereof. Here, the plate-shaped member 10a is made of, for example, a metal such as aluminum, an aluminum alloy, or stainless steel.

As shown in FIG. 2, the average roughness Rc of the roughness curve elements is 50 μm to 500 μm, and the skewness Rsk of the roughness curve is -3 to 0.5 on at least a part of the inner surface of the annular groove 5. A rough surface portion R is provided. Here, as shown in FIG. 7, which will be described later, the rough surface portion R can be formed by irradiating the inner surface of the annular groove 5 of the metal plate 10 serving as the plate-shaped member 10a with the laser beam L. In the present embodiment, as shown in FIG. 2, a configuration in which the rough surface portion R is provided on the entire bottom surface 5a of the annular groove 5 is illustrated, but the rough surface portion R is, for example, in the width direction of the annular groove 5 and /. Alternatively, it may be provided on a part of the bottom surface 5a of the annular groove 5 such as a part in the circumferential direction. Further, in the present embodiment, the plate-shaped member 10a in which the side surface 5b of the annular groove 5 is upright is illustrated, but as shown in FIGS. 3 to 6, the side surface 5b of the annular groove 5 is inclined in the plate-shaped member 10a. It may be a plate-shaped member 10b. Here, in the plate-shaped member 10b of FIG. 3, a rough surface portion R is provided on the entire bottom surface 5a and the entire side surface 5b of the annular groove 5. Further, in the plate-shaped member 10b of FIG. 4, a rough surface portion R is provided on the entire side surface 5b of the annular groove 5. Further, in the plate-shaped member 10b of FIG. 5, a rough surface portion R is provided on the central portion of the bottom surface 5a of the annular groove 5 and the upper portion of the side surface 5b. Further, in the plate-shaped member 10b of FIG. 6, a rough surface portion R is provided on the entire bottom surface 5a and the upper portion of the side surface 5b of the annular groove 5. As described above, according to the plate-shaped member 10b, for example, the laser beam for roughening the side surface 5b of the annular groove 5 can be easily irradiated, so that not only the bottom surface 5a of the annular groove 5 but also the side surface 5b can be easily irradiated. The area where the rough surface portion R is provided can be reduced as long as the surface can be roughened and the desired effect can be obtained.

As shown in FIG. 1, the sealing member 15 is provided in an annular shape (frame shape), and is made of, for example, a fluororubber obtained by vulcanizing a fluoroelastomer composition. Here, the lower portion of the seal member 15 is joined to the rough surface portion R provided on the inner surface of the annular groove 5 of the plate-shaped member 10a.

As the fluorine-containing elastomer constituting the above-mentioned fluorine-containing elastomer composition, known ones can be used, but a hexafluoropropylene-vinylidene fluoride copolymer and a hexafluoropropylene-vinylidene fluoride-tetrafluoroethylene copolymer can be used. , Tetrafluoroethylene-perfluoroalkyl ether copolymer is preferable, and hexafluoropropylene-vinylidene fluoride-tetrafluoroethylene copolymer and tetrafluoroethylene-perfluoroalkyl ether copolymer are particularly suitable.

The fluorine-containing elastomer composition contains a vulcanizing agent (crosslinking agent) for vulcanizing the fluorine-containing elastomer. Here, as the vulcanizing agent, for example, a polyol vulcanizing agent, an organic peroxide vulcanizing agent, or the like can be appropriately selected and used according to the fluorine-containing elastomer used.

The fluorine-containing elastomer composition may contain a cross-linking aid. Here, as the cross-linking aid, quinone-dioxime-based (p-quinone-dioxime, etc.), methacrylate-based (triethylene glycol dimethacrylate, methyl methacrylate, trimethylpropantrimethacrylate, etc.), allyl-based (diallyl phthalate, etc.) , Triallyl cyanurate, triallyl isocyanurate, triallyl trimellitate, etc.), maleimide-based (maleimide, phenylmaleimide, N, N'-m-phenylene bismaleimide, etc.), maleic anhydride, divinylbenzene, vinyltoluene, etc. It is selected from polyfunctional unsaturated compounds such as 1,2-polybutadiene, and can be used alone or in combination of two or more.

The fluorine-containing elastomer composition may contain a filler. Here, as the filler, carbon black, barium sulfate, silica, aluminum oxide, aluminum silicate, titanium dioxide and the like can be used, and barium sulfate, silica, aluminum oxide, aluminum silicate and titanium dioxide can be used due to oxygen plasma resistance. Titanium or the like can be used. These fillers may be used in combination. Among these fillers, barium sulfate and silica are preferable, and silica is more preferable. Here, among the silica, synthetic amorphous silica such as dry silica and wet silica is preferable, dry silica such as hydrophilic dry silica and hydrophobic dry silica is more preferable, and hydrophobic dry silica is further preferable.

In addition, a stabilizer, a plasticizer, a lubricant, a processing aid, and the like may be added to the fluorine-containing elastomer composition.

Below, a specific compounding example of the said fluorine-containing elastomer composition is shown.

~ Polyol vulcanization system ~
The fluoroelastomer composition comprises a polyol vulcanizable fluoroelastomer (eg, a polyol vulcanizable hexafluoropropylene-vinylidene fluoride copolymer and / or a polyol vulcanizable hexafluoropropylene-vinylidene fluoride-tetra). A composition obtained by blending 30 parts by weight to 100 parts by weight of barium sulfate with respect to 100 parts by weight of the fluoroethylene copolymer) is suitable, and sulfuric acid is suitable for 100 parts by weight of a fluoroelastomer capable of vulcanizing a polyol. A composition containing 30 parts by weight to 100 parts by weight of vulcanization and 0.5 parts by weight to 30 parts by weight of the tetrafluoroethylene resin is more preferable. Here, when the blending amount of the tetrafluoroethylene resin is less than 0.5 parts by weight, the effect of improving the oxygen plasma resistance is small, and when it exceeds 30 parts by weight, mechanical properties such as tensile strength and elongation are exhibited. It tends to decrease. Therefore, a more preferable blending amount of the tetrafluoroethylene resin is 1 part by weight to 20 parts by weight. Further, as the polyol vulcanizing agent, known ones can be used, and for example, bisphenol AF is used. The polyol vulcanizing agent may be preferably blended in an amount of 0.5 parts by weight to 5 parts by weight, more preferably 1 part by weight to 2 parts by weight, based on 100 parts by weight of the fluoroelastomer capable of vulcanizing the polyol. Further, as the accelerator and the acid receiving agent, a quaternary phosphonium salt, a quaternary ammonium salt, calcium hydroxide, magnesium oxide and the like are used.

The fluorine-containing elastomer composition may contain a filler, and the filler includes carbon black, silica, titanium oxide, lead oxide, zinc oxide, magnesium oxide, diatomaceous earth, alumina, calcium oxide, and oxidation. Oxides such as iron, tin oxide, antimony oxide, ferrites, hydroxides such as magnesium hydroxide, aluminum hydroxide, calcium hydroxide, basic magnesium carbonate, calcium carbonate, barium carbonate, magnesium carbonate, zinc carbonate, dosonite , Carbonate such as hydrotalcite, barium sulfate, sulfate such as calcium sulfate, aluminum silicate (clay, carionite, pyrophyllite), magnesium silicate (talc), calcium silicate (wollastonite, zonotrite), Examples thereof include silicates such as clay, montmorillonite, bentonite, active white clay and mica, and nitrides such as aluminum nitride, boron nitride and silicon nitride. These fillers can be used alone or in combination of two or more.

~ Peroxide vulcanization system ~
The fluorine-containing elastomer composition is preferably a composition obtained by blending a peroxide vulcanizing agent such as an organic peroxide with a fluorine-containing elastomer capable of peroxide vulcanization. Here, the organic peroxide sulfide can be used without particular limitation as long as it is generally used as an elastomer sulfide, and for example, dibenzoylperoxide, 1,1-bis (1-bis) ( t-Butylperoxy) -3,3,5-trimethylcyclohexane, 1,1-bis (t-butylperoxy) cyclododecane, n-butyl-4,4-bis (t-butylperoxy) valerate, dich Milperoxide, t-butylperoxybenzoate, 1,3-bis (t-butylperoxyisopropyl) benzene, 2,5-dimethyl-2,5-di (t-butylperoxy) hexane, 2,5- Examples thereof include dimethyl-2,5-di (t-butylperoxy) hexin-3, and one or more of these can be selected and used.

The blending amount of the organic peroxide vulcanizing agent is preferably 0.5 parts by weight to 10 parts by weight, more preferably 1 part by weight to 5 parts by weight, based on 100 parts by weight of the fluoroelastomer that can be crosslinked with peroxide. Parts, more preferably 1.5 parts by weight to 3 parts by weight. Here, when the blending amount of the organic peroxide vulcanizing agent is 0.5 parts by weight or more, it is preferable in terms of the compression set of the rubber member obtained by vulcanizing the fluoroelastomer composition, and the organic peroxide is preferable. When the blending amount of the oxide vulcanizer is 10 parts by weight or less, it is preferable from the viewpoint of molding processability of the fluoroelastomer composition.

The fluorine-containing elastomer composition may contain a cross-linking aid in addition to the organic peroxide vulcanizing agent. Here, the cross-linking aid can be used without particular limitation as long as it is generally used as a cross-linking aid for an elastomer. (Triethylene glycol dimethacrylate, methyl methacrylate, trimethylpropantrimethacrylate, etc.), allyl type (diallyl phthalate, triallyl cyanurate, triallyl isocyanurate, triallyl trimerite, etc.), maleimide type (maleimide, phenylmaleimide, etc.) N, N'-m-phenylene bismaleimide, etc.), maleic anhydride, divinylbenzene, vinyltoluene, 1,2-polybutadiene, and other monomers having a plurality of carbon-carbon unsaturated groups (polyfunctional monomer). One or more of these can be selected and used, and triallyl isocyanurate can be preferably used.

The content of the cross-linking aid is preferably 1 part by weight to 10 parts by weight, more preferably 2 parts by weight to 6 parts by weight, still more preferably 2 parts by weight, based on 100 parts by weight of the fluoroelastomer that can be crosslinked with a peroxide. .5 to 4 parts by weight. Here, when the content of the cross-linking aid is 1 part by weight or more, it is preferable from the viewpoint of the compression set characteristics of the rubber member obtained by vulcanizing the fluorine-containing elastomer composition. Further, when the content of the cross-linking aid is 10 parts by weight or less, it is preferable from the viewpoint of molding processability of the fluorine-containing elastomer composition of the present invention.

The fluorine-containing elastomer composition may further contain a filler. The filler is used in the elastomer composition for the purpose of reinforcing the elastomer, increasing the amount of the elastomer, improving the workability, and the like.

Examples of the filler include synthetic fibers such as polyacrylonitrile, nylon and polyester, wood flour, pulp, cork powder, polystyrene latex, urea-formaldehyde particles, synthetic resins such as polyethylene-powder, polytetrafluoroethylene and tetrafluoro. Organic fillers such as ethylene / perfluoroalkyl vinyl ether copolymers, tetrafluoroethylene / hexafluoropropylene copolymers, polychlorotrifluoroethylene, polyvinylidene fluoride, polyvinyl fluoride and other fluororesin powders, carbon black, white Silicic acid such as carbon, silicic acid, diatomaceous soil, calcined diatomaceous soil, siliceous stone, silica sand, Christovalite, calcium silicate, magnesium silicate, aluminum silicate, kaolinite, kaolin clay (kaolinite, quartz), calcined clay (methacaolin), Silicates such as talc, white mica, silk mica, wollastonite, serpentine, pyrophyllite, metal oxides such as aluminum oxide, titanium oxide, magnesium oxide, zinc oxide, sulfates such as barium sulfate and calcium sulfate. , Inorganic fillers such as carbonates such as calcium carbonate, magnesium carbonate, barium carbonate, and dolomite. Among these, carbon black, graphite, silicic acid, aluminum oxide, titanium oxide, magnesium oxide, zinc oxide, calcium silicate, magnesium silicate, aluminum silicate, barium sulfate, calcium sulfate, calcium carbonate, magnesium carbonate, barium carbonate Inorganic fillers such as, and fluororesin powder are preferably used, and silicic acid is more preferably used. For the fluorine-containing elastomer composition, one kind or two or more kinds can be selected and used from these fillers.

As the silicic acid, one type or two or more types can be selected and used without particular limitation as long as it is generally used as a filler for an elastomer.

The SiO ₂ purity of the silicic acid is not particularly limited, but is preferably 99% or more. Here, when the fluorine-containing elastomer composition _{contains silicic acid having a SiO 2} purity of 99% or more, if a sealing member obtained by vulcanizing this is used for manufacturing a semiconductor or a flat panel display, a rubber component is used. Metal contamination due to impurity components (heavy metals, arsenic, magnesium, calcium, sodium, etc.) is extremely unlikely to occur.

As the silicic acid, synthetic amorphous silica such as dry silica and wet silica is preferable, dry silica such as hydrophilic dry silica and hydrophobic dry silica is more preferable, and hydrophobic dry silica is further preferable. The average primary particle size of silicic acid is not particularly limited, but is preferably 5 nm to 500 nm, and more preferably 7 nm to 100 nm. Here, when the average primary particle size of silicic acid is 5 nm or more, it is preferable from the viewpoint of dispersibility of the fluorine-containing elastomer composition, and when the average primary particle size of silicic acid is 500 nm or less, the fluorine-containing elastomer composition is used. It is preferable from the viewpoint of the physical strength of the vulcanized rubber member. The average primary particle diameter is a value obtained by measuring the diameters of electron micrographs of 3000 to 5000 silicic acid particles and calculating their arithmetic mean.

Specific surface area of the silica is not particularly limited, it is preferably ^{20m 2} / ^g~500m 2 / g, more preferably ^{30m 2} / ^g~400m 2 / g. Here, when the specific surface area of silicic acid is 20 m ² / g or more, it is preferable from the viewpoint of the physical strength of the rubber member obtained by vulcanizing the fluorine-containing elastomer composition, and ^{it is 500 m 2} / g or less. , Fluorine-containing elastomer composition is preferable from the viewpoint of molding processability. The specific surface area is a value measured by the BET method.

As the silicic acid, a commercially available product can be used. Here, as the above-mentioned commercially available products, "Aerosil OX50", "Aerosil 50", "Aerosil 90G", "Aerosil 130", "Aerosil 200", "Aerosil 300", "Aerosil 380", "Aerosil R972", " Aerosil R974, Aerosil R976, Aerosil RY50, Aerosil NAX50, Aerosil NX90G, Aerosil RX200, Aerosil RX300 (manufactured by Nippon Aerosil Co., Ltd.), Nip Seal AQ, Nip Seal VN3 "," Nip Seal LP "," Nip Seal ER "," Nip Seal NS "," Nip Seal NA "," Nip Seal KQ "," Nip Seal KM "," Nip Seal KP "," Nip Seal E-75 "," Nip Seal E-743 " , "Nip Seal E-150J", "Nip Seal E-170", "Nip Seal E-200", "Nip Seal K-500", "Nip Seal L-250", "Nip Seal G-300" (above, Toso Silica Co., Ltd.) (Made by company), etc. For the above-mentioned fluorine-containing elastomer composition, one kind or two or more kinds can be selected and used from the above-mentioned silicic acid.

The content of the filler is not particularly limited, but is preferably 1 part by weight to 100 parts by weight, more preferably 2 parts by weight to 60 parts by weight, based on 100 parts by weight of the peroxide-crosslinkable fluoroelastomer. More preferably, it is 2.5 parts by weight to 40 parts by weight. Here, when the content of the filler is 1 part by weight or more, it is preferable in terms of the mixing processability of the fluorine-containing elastomer composition, and when it is 100 parts by weight or less, the molding processability of the fluorine-containing elastomer composition is considered. Is preferable.

The fluoroplasticizer composition includes, for example, an antioxidant (for example, an amine-based anti-aging agent (phenyl-1-naphthylamine, octylated diphenylamine, etc.), a phenol-based anti-aging agent (mono (α-methylbenzyl) phenol, etc.). 2,6-di-t-butyl-4-methylphenol, etc.), imidazole-based antiaging agents (2-mercaptobenzimidazole, 2-mercaptomethylbenzimidazole, etc.), plasticizers (for example, phthalic acid-based plasticizers) (Dioctyl phthalate, etc.), Adipic acid-based plasticizer (Dioctyl adipate, etc.), Sebacic acid-based plasticizer (Dioctyl sevacinate, etc.), Trimellitic acid-based plasticizer (Trimeritate, etc.), Polymerized plasticizer (for example, polyether) Or polymerized plasticizers such as polyester), processing aids (eg, stearic acid or its metal salt, palmitic acid or its metal salt, paraffin wax, etc.) and other compounding agents commonly used in the rubber industry. It can be added as needed. The amount of each compounding agent added can be appropriately set as necessary within a range that does not impair the object of the present invention.

~ Tetrafluoroethylene-perfluoroalkyl ether copolymerization system ~
The fluorine-containing elastomer composition is preferably a composition obtained by blending a curing agent and a filler with a crosslinkable tetrafluoroethylene-perfluoroalkyl ether copolymer having a cured portion.

When the tetrafluoroethylene-perfluoroalkyl ether copolymer contains a copolymerization unit of a nitrile-containing curing site monomer, a curing system based on an organotin compound can be used. Here, examples of suitable organic tin compounds include allyl-, propargyl-, triphenyl- and allenyl tin curing agents. Further, the tetraalkyltin compound or the tetraallyltin compound is a preferable curing agent to be used in combination with the nitrile substitution curing site. The amount of the curing agent used depends on the degree of cross-linking desired for the final product and the type and concentration of the reactive moiety in the cross-linkable tetrafluoroethylene-perfluoroalkyl ether copolymer. Specifically, the blending amount of the curing agent is preferably 0.5 parts by weight to 10 parts by weight, more preferably 1 part by weight, based on 100 parts by weight of the crosslinkable tetrafluoroethylene-perfluoroalkyl ether copolymer. It is 4 parts by weight by weight. In the tetrafluoroethylene-perfluoroalkyl ether copolymer containing a copolymerization unit of the nitrile-containing curing site monomer, the nitrile group is triquantized and a curing agent such as organic tin is present to form an s-triazine ring. By forming, it is considered that the perfluoropolymer is crosslinked.

As the curing agent, 4,4'-[2,2,2-trifluoro-1- (trifluoromethyl) ethylidene] bis (2-aminophenol), 4,4'-sulfonylbis (2-aminophenol) , 3,3'-diaminobenzidine, 3,3', 4,4'-tetraaminobenzophenone and the like, and one or more of the above curing agents can be selected and used.

The content of the curing agent is preferably 0.5 parts by weight to 5 parts by weight, and more preferably 1 part by weight to 2 parts by weight with respect to 100 parts by weight of the fluorine-containing elastomer. Here, when the content of the curing agent is 0.5 parts by weight or more, it is preferable from the viewpoint of the compression set characteristics of the rubber member obtained by vulcanizing the fluorine-containing elastomer composition. Further, when the content of the curing agent is 5 parts by weight or less, it is preferable from the viewpoint of molding processability of the fluorine-containing elastomer composition of the present invention.

Other curing agents suitable for vulcanizing tetrafluoroethylene-perfluoroalkyl ether copolymers with nitrile curing sites include ammonium salts of ammonia, inorganic or organic acids (eg, ammonium perfluorooctanoate). , Compounds that decompose to produce ammonia (eg, urea).

When the cured site is a nitrile, iodine or bromine group, an organic peroxide can be used. As the organic peroxide, those that generate free radicals at the curing temperature are preferable, and for example, 2,5-dimethyl-2,5-di (terrary butylperoxy) -hexin-3,2,5 -Dimethyl-2,5-di (terrary butylperoxy) -hexane, dicumyl peroxide, dibenzoyl peroxide, tertiary butylperbenzoate, di [1,3-dimethyl-3- (t-butylperoxy) ) -Butyl] One or more of compounds such as carbonate can be selected and used. Here, the blending amount of the organic peroxide is preferably 1 part by weight to 3 parts by weight with respect to 100 parts by weight of the fluorine-containing elastomer composition. The blending amount of the organic peroxide is preferably 1 part by weight or more in terms of the compression set characteristics of the rubber member obtained by vulcanizing the fluorine-containing elastomer composition. Further, it is preferable that the blending amount of the organic peroxide is 3 parts by weight or less from the viewpoint of molding processability of the fluorine-containing elastomer composition of the present invention.

Other materials that are normally blended with the composition as part of the organic peroxide curing system can include cross-linking aids.

As the cross-linking aid, a polyfunctional unsaturated compound is preferable. Here, the blending amount of the cross-linking aid is preferably 0.1 part by weight to 10 parts by weight, and more preferably 2 parts by weight to 5 parts by weight with respect to 100 parts by weight of the fluorine-containing elastomer composition. Examples of the cross-linking aid include triallyl cyanurate, triallyl isocyanurate, tri (methylallyl) isocyanurate, tris (diallylamine) -s-triazine, triallyl phosphite, N, N-diallyl acrylamide, and hexaalkylphospho. Luamide, N, N, N', N'-tetraalkyltetraphthalamide, N, N, N', N'-tetraallylmalonamide, trivinylisocyanurate, 2,4,6-trivinylmethyltrisiloxane , Tri (5-norbornen-2-methylene) cyanurate and the like, one or more can be selected and used.

A double curing system can also be used, depending on the location of the curing site. For example, a fluorine-containing elastomer having a copolymerization unit of a nitrile-containing curing site monomer can be cured by using it in combination with the above organic peroxide and the above cross-linking aid. Specifically, it is preferable to use 0.3 parts by weight to 5 parts by weight of the cross-linking aid and 0.1 parts by weight to 10 parts by weight of the organic curing agent with respect to 100 parts by weight of the fluorine-containing elastomer composition.

Fluorine-containing elastomer compositions include commonly used fillers (eg, carbon black, barium sulfate, silica, aluminum oxide, aluminum silicate and titanium dioxide), stabilizers, plasticizers, lubricants, treatment aids and the like. Additives may be added.

The gate seal structure 20 described above is configured to close the gate when the surface of the seal member 15 comes into contact with the peripheral edge of the gate provided in the vacuum chamber of the semiconductor manufacturing apparatus.

Next, a method of manufacturing the gate seal structure 20 of the present embodiment will be described. Here, FIGS. 7 and 8 are cross-sectional views showing a plate-shaped member manufacturing process and a molding process in the method for manufacturing the gate seal structure 20. The method for manufacturing the gate seal structure 20 of the present embodiment includes a plate-shaped member manufacturing step, a molding composition preparation step, and a molding step.

<Plate-shaped member manufacturing process>
First, for example, an aluminum metal plate 10 having an annular groove 5 formed on its surface is prepared. Subsequently, as shown in FIG. 7, a continuous wave or pulse wave laser is used for at least a part of the inner surface (for example, the bottom surface 5a) of the annular groove 5 of the metal plate 10 to, for example, 2000 mm / sec. The laser beam L is irradiated at an irradiation rate of about 50,000 mm / sec. As a result, a plate-shaped member 10a having a rough surface portion R on the inner surface of the annular groove 5 is produced. Here, the continuous wave laser, can be a known, for example, YVO ₄ laser, a fiber laser (preferably a single mode fiber laser), an excimer laser, a carbon dioxide laser, UV laser, YAG laser, semiconductor A laser, a glass laser, a ruby laser, a He-Ne laser, a nitrogen laser, a chelate laser, a dye laser and the like can be used. Further, as the pulse wave laser, a known one can be used, and for example, a nanosec pulse laser, a millisec pulse laser, or the like can be used. As for the output of the laser light, for example, in the case of a continuous wave laser, the average output is about 4 W to 4000 W, and in the case of a pulse wave laser, the peak output is about 5000 W to 30000 W. The wavelength of the laser light is, for example, about 300 nm to 1200 nm. The beam diameter of the laser beam is, for example, about 5 μm to 200 μm.

<Molding composition preparation process>
For molding by mixing the above-mentioned fluorine-containing elastomer, vulcanizing agent (crosslinking agent, curing agent), filler and other additives by a known mixing (kneading) method such as roll mixing, kneader mixing, and Bambari mixing. A fluorine-containing elastomer composition 15a (see FIG. 8) is prepared as the composition. Here, in the fluorine-containing elastomer composition 15a, the minimum value ML of the vulcanization curve at the press temperature (165 ° C.) determined in accordance with JIS K6300-2 is preferably 0.1 kg · cm to 10.0 kg · cm. It is more preferably 0.5 kg · cm to 5 kg · cm, still more preferably 1.0 kg · cm to 3.0 kg. cm. When the minimum value ML of the vulcanization curve is 0.1 kg · cm or more, the filling property of the rough surface portion R into the concave portion of the rough surface portion R at the press temperature of the fluorine-containing elastomer composition is improved, and the minimum value ML of the vulcanization curve is improved. When the weight is 10.0 kg or less, the seal molding processability is improved.

<Molding process>
After arranging the fluoroelastomer composition 15a prepared in the molding composition preparation step inside the annular groove 5 of the plate-shaped member 10a manufactured in the plate-shaped member manufacturing step, the arrangement thereof is as shown in FIG. By molding the fluorinated elastomer composition 15a by heating and pressurizing it with a molding die M, vulcanization (crosslinking and curing) is performed in a state where the fluorinated elastomer is filled in the concave portion of the rough surface portion R on the inner surface of the annular groove 5. ) To form the seal member 15. Further, after the seal member 15 is removed from the mold M, the seal member 15 may be reheated to perform secondary vulcanization (crosslinking, curing) of the seal member 15. Here, the hardness of the formed seal member 15 is preferably A60 to A90, more preferably A65 to A85, and further preferably A70 to A80 in the type A durometer. When the hardness of the seal member 15 is A60 or more, rubber remains in the entire concave portion of the rough surface portion R after peeling, which is preferable. Further, when the hardness of the seal member 15 is A90 or less, the seal member 15 is less likely to break when stress concentration occurs on the surface side edge of the concave portion of the rough surface portion R at the time of peeling, which is preferable.

As described above, the gate seal structure 20 of the present embodiment can be manufactured.

Next, a specific experiment will be described. Here, in this experiment, the gate seal of the present embodiment is measured by measuring the peeling strength between the aluminum plate on which the rough surface portion having a predetermined roughness is formed and the fluororubber constituting the seal member joined to the aluminum plate. The peeling strength between the rough surface portion R on the inner surface of the annular groove 5 and the sealing member 15 in the structure 20 was evaluated. 9, 10 and 11 are roughness curves of the rough surface portion formed on the aluminum plate in Example 1, Comparative Example 1 and Comparative Example 2 of the present embodiment.

<Example 1>
First, by irradiating one surface of an aluminum plate having a thickness of 2 mm, a width of 25 mm, and a length of 60 mm with a laser beam, the average roughness Rc of the roughness curve elements is 185 μm, and the skewness Rsk of the roughness curve is increased. A rough surface portion (see FIG. 9) of −0.63 was formed. Here, the Kurtosis Rku of the roughness curve of the formed rough surface portion was 3.5, and the average length Rsm of the roughness curve elements was 50.3 μm. Subsequently, a hexafluoropropylene-vinylidene fluoride-tetrafluoroethylene copolymer having a thickness of 6 mm, a width of 25 mm, and a length of 120 mm was mainly applied to the rough surface portion of the aluminum plate on which the rough surface portion was formed, based on JIS K6256-. A test piece (adhesive-free) bonded by pressurizing a fluoroelastomer composition sheet as a component at 165 ° C. for 10 minutes and vulcanizing it so that the concave portion of the rough surface is filled with fluororubber. ) Was prepared. Then, when the peeling strength of the prepared test piece was measured based on JIS K6256-2, it was 142 N / 25 mm (destruction of the fluororubber body). The ML of the fluoroelastomer composition was 1.3 kgf · cm, and the hardness of the fluororubber was 73 on a type A durometer.

<Example 2>
First, in the same manner as in Example 1, a rough surface portion having an average roughness Rc of the roughness curve element of 190 μm and a roughness curve skewness Rsk of −0.38 is formed on one surface of the aluminum plate. did. Here, the Kurtosis Rku of the roughness curve of the formed rough surface portion was 2.7, and the average length Rsm of the roughness curve elements was 47.9 μm. Subsequently, a hexafluoropropylene-vinylidene fluoride-tetrafluoroethylene copolymer having a thickness of 6 mm, a width of 25 mm, and a length of 120 mm was mainly applied to the rough surface portion of the aluminum plate on which the rough surface portion was formed, based on JIS K6256-. A test piece (adhesive-free) bonded by pressurizing a fluoroelastomer composition sheet as a component at 165 ° C. for 10 minutes and vulcanizing it so that the concave portion of the rough surface is filled with fluororubber. ) Was prepared. After that, the peel strength of the prepared test piece was measured based on JIS K6256-2 and found to be 133 N / 25 mm (destruction of the fluororubber body).

<Example 3>
First, in the same manner as in Example 1, a rough surface portion having an average roughness Rc of the roughness curve element of 244 μm and a roughness curve skewness Rsk of −0.57 is formed on one surface of the aluminum plate. did. Here, the Kurtosis Rku of the roughness curve of the formed rough surface portion was 2.9, and the average length Rsm of the roughness curve elements was 48.9 μm. Subsequently, a tetrafluoroethylene-perfluoroalkyl ether copolymer having a thickness of 6 mm, a width of 25 mm, and a length of 120 mm is used as a main component on the rough surface portion of the aluminum plate on which the rough surface portion is formed, based on JIS K6256-. A fluoropolymer composition sheet is pressure-pressed at 165 ° C. for 10 minutes and vulcanized to prepare a test piece (adhesive-free) bonded in a state where the concave portion of the rough surface is filled with fluororubber. did. Then, when the peeling strength of the prepared test piece was measured based on JIS K6256-2, it was 70 N / 25 mm (destruction of the fluororubber surface). The ML of the fluoroelastomer composition was 7.5 kgf · cm, and the hardness of the fluororubber was 80 on a type A durometer.

<Comparative example 1>
First, by irradiating one surface (width 25 mm × length 60 mm) of an aluminum plate having a thickness of 2 mm × width 25 mm × length 60 mm with laser light, the average roughness Rc of the roughness curve element is 58 μm. Moreover, a rough surface portion (see FIG. 10) having a roughness curve with a skewness Rsk of −0.43 was formed. Here, the Kurtosis Rku of the roughness curve of the formed rough surface portion was 3.7, and the average length Rsm of the roughness curve elements was 31.6 μm. Subsequently, a hexafluoropropylene-vinylidene fluoride-tetrafluoroethylene copolymer having a thickness of 6 mm, a width of 25 mm, and a length of 120 mm was mainly applied to the rough surface portion of the aluminum plate on which the rough surface portion was formed, based on JIS K6256-. A test piece (adhesive-free) bonded by pressurizing a fluoroelastomer composition sheet as a component at 165 ° C. for 10 minutes and vulcanizing it so that the concave portion of the rough surface is filled with fluororubber. ) Was prepared. Then, the peel strength of the prepared test piece was measured based on JIS K6256-2, and it was 101.1 N / 25 mm (interfacial peeling between the aluminum plate and the fluororubber). The ML of the fluoroelastomer composition was 1.3 kgf · cm, and the hardness of the fluororubber was 73 on a type A durometer.

<Comparative example 2>
First, by surface-treating one surface (width 25 mm × length 60 mm) of an aluminum plate having a thickness of 2 mm × width 25 mm × length 60 mm with an etching solution, the average roughness Rc of the roughness curve element is 12.2 μm. A rough surface portion (see FIG. 11) having a roughness curve with a skewness Rsk of 0.62 was formed. Here, the Kurtosis Rku of the roughness curve of the formed rough surface portion was 3.8, and the average length Rsm of the roughness curve element was 31.6 μm. Subsequently, a hexafluoropropylene-vinylidene fluoride-tetrafluoroethylene copolymer having a thickness of 6 mm, a width of 25 mm, and a length of 120 mm is used as a main component on the rough surface portion of the formed aluminum plate based on JIS K6256-. A fluoropolymer composition sheet is pressure-pressed at 165 ° C. for 10 minutes and vulcanized to prepare a test piece (adhesive-free) bonded in a state where the concave portion of the rough surface is filled with fluororubber. did. After that, the peel strength of the prepared test piece was measured based on JIS K6256-2 and found to be about 7.2 N / 25 mm. The ML of the fluoroelastomer composition was 1.3 kgf · cm, and the hardness of the fluororubber was 73 on a type A durometer.

Here, in Examples 1, 2 and 3, and Comparative Examples 1 and 2, the average roughness Rc of the roughness curve elements, the skewness Rsk of the roughness curve, the Kurtosis Rku of the roughness curve, and the average of the roughness curve elements The length Rsm was determined by analyzing the surface roughness in the line roughness analysis mode of the 10x lens using a 3D measurement laser microscope (LEXT OLS4100) manufactured by Olympus Co., Ltd.

As an experimental result, a rough surface was formed in which the average roughness Rc of the roughness curve elements was in the range of 185 μm to 244 μm and the skewness Rsk of the roughness curve was in the range of −0.63 to −0.38. In Examples 1, 2 and 3, since the breakage of the fluororubber was confirmed in the test by JIS K6256-2, it can be said that the peel strength by JIS K6256-2 is higher than the material breakage strength of the sealing member. On the other hand, in Comparative Example 1 having a rough surface portion in which the average roughness Rc of the roughness curve element was smaller than 185 μm, the peel strength according to JIS K6256-2 was at a low level (about 110 N / 25 mm or less). Further, in Comparative Example 2 in which a rough surface portion having a roughness curve skewness RsK larger than −0.38 was formed, the peel strength by JIS K6256-2 was extremely low (several tens of N / 25 mm or less).

As described above, according to the gate seal structure 20 for the semiconductor manufacturing apparatus of the present embodiment, at least a part of the inner surface of the annular groove 5 on the surface of the metal plate-shaped member 10a has a predetermined roughness. A rough surface portion R having the above is provided. Here, in the rough surface portion R having a predetermined roughness, the average roughness Rc of the roughness curve elements is 50 μm to 500 μm, and the skewness Rsk of the roughness curve meaning the skewness is -3 to 0.5. Therefore, the rough surface portion R on the inner surface of the annular groove 5 and the seal member 15 are joined in a deeply fitted state, and the rough surface portion R on the inner surface of the annular groove 5 and the seal member 15 can be reliably fixed. Therefore, the fluororubber seal member 15 can be reliably fixed inside the annular groove 5 formed in the metal plate-shaped member 10a.

Further, according to the gate seal structure 20 for the semiconductor manufacturing apparatus of the present embodiment, the seal member 15 is broken when the rough surface portion R on the inner surface of the annular groove 5 and the seal member 15 are separated from each other. Even if the seal member 15 is to be peeled off from the rough surface portion R on the inner surface of the groove 5 in the thickness direction of the plate-shaped member 10a, before the rough surface portion R on the inner surface of the annular groove 5 and the seal member 15 are peeled off, At least a part of the seal member 15 will be destroyed. As a result, peeling between the rough surface portion R on the inner surface of the annular groove 5 and the seal member 15 made of fluororubber is suppressed, so that fluorine is contained inside the annular groove 5 formed in the metal plate-shaped member 10a. The rubber sealing member 15 can be securely fixed.

Further, according to the gate seal structure 20 for the semiconductor manufacturing apparatus of the present embodiment, when the inner surface of the annular groove 5 formed in the plate-shaped member 10a is provided with a non-roughened surface portion which is not roughened. The sealability of the gate seal structure 20 can be improved by the contact between the non-rough surface portion and the seal member 15.

<< Other Embodiments >>
In the above embodiment, a gate seal structure provided with a fluororubber sealing member has been exemplified, but the present invention has, for example, a gate sealing structure provided with another rubber sealing member such as acrylonitrile-butadiene-rubber. It can also be applied to the body.

As described above, the present invention can reliably fix the fluororubber seal member inside the annular groove formed in the metal plate-shaped member. Therefore, for example, the gate seal of the semiconductor manufacturing apparatus. It is useful.

L Laser light M Molding mold R Rough surface part 5 Circular groove 10 Metal plate 10a, 10b Plate-shaped member 15 Sealing member 15a Fluorine-containing elastomer composition (molding composition)
20 Gate seal structure

Claims (6)

A metal plate-shaped member with an annular groove formed on the surface,
A gate seal structure for a semiconductor manufacturing apparatus including an annular seal member made of fluororubber provided inside the annular groove.
At least a part of the inner surface of the annular groove is provided with a rough surface portion in which the average roughness Rc of the roughness curve element is 50 μm to 500 μm and the skewness Rsk of the roughness curve is -3 to 0.5.
The sealing member is joined to the rough surface portion of the annular groove .
A gate seal structure for a semiconductor manufacturing apparatus, characterized in that the rough surface portion is provided on the bottom surface and both side surfaces inclined with respect to the bottom surface of the inner surface of the annular groove. A metal plate-shaped member with an annular groove formed on the surface,
A gate seal structure for a semiconductor manufacturing apparatus including an annular seal member made of fluororubber provided inside the annular groove.
At least a part of the inner surface of the annular groove is provided with a rough surface portion in which the average roughness Rc of the roughness curve element is 50 μm to 500 μm and the skewness Rsk of the roughness curve is -3 to 0.5.
The sealing member is joined to the rough surface portion of the annular groove.
Semiconductor manufacturing characterized in that the rough surface portions are provided on both side surfaces of the inner surface of the annular groove that are inclined with respect to the bottom surface, and non-rough surface portions are provided on at least a part of the bottom surface. Gate seal structure for the device. In the gate seal structure for the semiconductor manufacturing apparatus according to claim 1 or 2.
A gate seal structure for a semiconductor manufacturing apparatus, characterized in that the peel strength between the rough surface portion of the annular groove and the seal member according to JIS K6256-2 is higher than the material breaking strength of the seal member. .. In the gate seal structure for the semiconductor manufacturing apparatus according to claim 1,
A gate seal structure for a semiconductor manufacturing apparatus, characterized in that a non-rough surface portion is provided on the bottom surface side of both side surfaces of the annular groove. A method for manufacturing a gate seal structure for semiconductor manufacturing equipment.
By irradiating at least a part of the inner surface of the annular groove of the metal plate having the annular groove formed on the surface with laser light, the average roughness Rc of the roughness curve element is 50 μm to 500 μm, and the roughness curve of the roughness curve. A plate-shaped member manufacturing step of forming a rough surface portion having a skewness Rsk of -3 to 0.5 to manufacture a plate-shaped member, and
A molding composition preparation step for preparing a fluorine-containing elastomer composition as a molding composition, and
After arranging the molding composition inside the annular groove of the plate-shaped member, the molding composition is heated and pressurized between the plate-shaped member and the molding die to form an annular shape of the plate-shaped member. It is equipped with a molding process that forms a seal member inside the groove .
The inner surface of the annular groove, the bottom surface and the method of manufacturing a gate seal structure for a semiconductor manufacturing apparatus characterized that you have and a side surfaces inclined with respect to the bottom surface. In the method for manufacturing a gate seal structure for a semiconductor manufacturing apparatus according to claim 5.
A method for manufacturing a gate seal structure for a semiconductor manufacturing apparatus, which comprises a reheating step of reheating the seal member after the molding step.

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