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JP6846786B2 - Optical sensor - Google Patents

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JP6846786B2
JP6846786B2 JP2016149907A JP2016149907A JP6846786B2 JP 6846786 B2 JP6846786 B2 JP 6846786B2 JP 2016149907 A JP2016149907 A JP 2016149907A JP 2016149907 A JP2016149907 A JP 2016149907A JP 6846786 B2 JP6846786 B2 JP 6846786B2
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light
light receiving
emitting element
receiving element
light emitting
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JP2018019013A (en
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優介 増成
優介 増成
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Kodenshi Corp
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Description

本発明は、発光素子と受光素子とを備えている光センサに関する。 The present invention relates to an optical sensor including a light emitting element and a light receiving element.

上記光センサとしては、例えば基板上に所定間隔を置いて発光素子と受光素子とを配置し、樹脂モールドで一体化されたパッケージからなる光センサが提案されている。この光センサは、発光素子から照射した光が物体に当たって反射した反射光を受光素子で受光して物体の検知を行う反射センサである。この反射センサには、発光素子から側方に発せられる光が受光素子に入射して受光素子の検出感度が低下することを防止するための手段が施されている。その手段は、受光素子の側面に金属薄膜を蒸着して遮光処理を行う手段である（例えば、特許文献１参照）。 As the optical sensor, for example, an optical sensor in which a light emitting element and a light receiving element are arranged on a substrate at predetermined intervals and integrated with a resin mold has been proposed. This optical sensor is a reflection sensor that detects an object by receiving the reflected light that the light emitted from the light emitting element hits the object and is reflected by the light receiving element. The reflection sensor is provided with a means for preventing light emitted laterally from the light emitting element from entering the light receiving element and reducing the detection sensitivity of the light receiving element. The means is a means of depositing a metal thin film on the side surface of the light receiving element to perform a light shielding treatment (see, for example, Patent Document 1).

特公平４−３３３９５号公報Tokusho 4-333395 Gazette

上記特許文献１の光センサでは、基板上に所定間隔を置いて発光素子と受光素子とを配置するため、パッケージのサイズが横方向に大きくなってしまう不都合がある。また、金属薄膜を蒸着して遮光処理を行うことが手間のかかる作業になるという不都合もある。 In the optical sensor of Patent Document 1, since the light emitting element and the light receiving element are arranged on the substrate at predetermined intervals, there is an inconvenience that the size of the package increases in the lateral direction. In addition, there is an inconvenience that it is a laborious task to deposit a metal thin film and perform a light-shielding treatment.

本発明が前述の状況に鑑み、解決しようとするところは、パッケージの横方向のサイズを小型化することができるとともに遮光処理が不要となる光センサを提供することにある。 In view of the above situation, an object of the present invention to solve the problem is to provide an optical sensor capable of reducing the lateral size of the package and eliminating the need for shading treatment.

本発明の光センサは、前述の課題解決のために、光を受光する受光素子の受光面上に該受光素子から離れる方向へ光を発光する発光素子を実装して一体化された光センサであって、前記受光素子は、前記発光素子が発光する光の波長範囲とは異なる波長範囲の光を受光するように構成されていることを特徴としている。 The optical sensor of the present invention is an integrated optical sensor in which a light emitting element that emits light in a direction away from the light receiving element is mounted on a light receiving surface of the light receiving element that receives light in order to solve the above-mentioned problems. The light receiving element is characterized in that it is configured to receive light in a wavelength range different from the wavelength range of the light emitted by the light emitting element.

上記構成によれば、光を受光する受光素子の受光面上に該受光面とは反対側へ光を発光する発光素子を実装して一体化しているので、基板上に受光素子と発光素子とを横方向に所定間隔を置いて配置する場合に比べて、横方向のサイズを小型化することができる。しかも、発光素子が発光する光の波長範囲とは異なる波長範囲の光を受光するように構成された受光素子であるため、金属薄膜を蒸着して遮光処理を行うことが不要になるとともに、発光素子から照射される光に対して受光素子の出力を大幅に小さくすることができる。 According to the above configuration, since the light emitting element that emits light to the side opposite to the light receiving surface is mounted and integrated on the light receiving surface of the light receiving element that receives light, the light receiving element and the light emitting element are integrated on the substrate. The size in the horizontal direction can be reduced as compared with the case where the lights are arranged at predetermined intervals in the horizontal direction. Moreover, since the light-receiving element is configured to receive light in a wavelength range different from the wavelength range of the light emitted by the light-emitting element, it is not necessary to deposit a metal thin film to perform light-shielding treatment, and light is emitted. The output of the light receiving element can be significantly reduced with respect to the light emitted from the element.

また、本発明の光センサは、前記受光素子の受光面には、該受光面に入射してくる光を前記発光素子が発光する光の波長範囲とは異なる波長範囲の光を受光すべく、特定の波長範囲の光をカットする光学フィルターを備えていてもよい。 Further, in the optical sensor of the present invention, the light receiving surface of the light receiving element is designed to receive light in a wavelength range different from the wavelength range of the light emitted by the light emitting element. An optical filter that cuts light in a specific wavelength range may be provided.

上記のように、受光面に入射してくる光を光学フィルターで発光素子が発光する光の波長範囲とは異なる波長範囲の光を受光すべく、特定の波長範囲の光をカットすることによって、受光素子の受光面に入射してくる光を確実に受光することができる。また、光学フィルターを備える場合には、透過率や偏光方向を含む特性の異なる種々の光学フィルターに取り替えるだけで、波長範囲を容易に変更することができる。 As described above, by cutting the light in a specific wavelength range in order to receive the light incident on the light receiving surface in a wavelength range different from the wavelength range of the light emitted by the light emitting element by the optical filter. The light incident on the light receiving surface of the light receiving element can be reliably received. Further, when an optical filter is provided, the wavelength range can be easily changed by simply replacing the optical filter with various optical filters having different characteristics including transmittance and polarization direction.

また、本発明の光センサは、前記受光素子を封止するための封止樹脂の中に、前記発光素子から発光される光を受光感度の小さい波長の光に変換し、かつ、前記発光素子からの発光される光の色を調色するための一色又は複数色の蛍光体を含有していてもよい。 Further, the optical sensor of the present invention converts the light emitted from the light emitting element into light having a wavelength having a low light receiving sensitivity in the sealing resin for sealing the light receiving element, and the light emitting element. It may contain one or more colors of phosphors for adjusting the color of the light emitted from.

上記のように、封止樹脂の中に一色又は複数色の蛍光体を含有しているので、発光素子から発光される光を受光感度の小さい波長の光に変換することができ、かつ、発光素子からの発光される光の色を調色することができる。 As described above, since the sealing resin contains a phosphor of one color or a plurality of colors, the light emitted from the light emitting element can be converted into light having a wavelength having a low light receiving sensitivity, and the light is emitted. The color of the light emitted from the element can be adjusted.

また、本発明の光センサは、前記受光素子及び前記発光素子が一つのパッケージに構成され、前記発光素子は、前記受光素子が入射光を受光した場合に点灯する又は消灯するあるいは点灯状態を変更するように構成されていてもよい。 Further, in the optical sensor of the present invention, the light receiving element and the light emitting element are configured in one package, and the light emitting element turns on, turns off, or changes the lighting state when the light receiving element receives incident light. It may be configured to do so.

上記のように、受光素子が入射光を受光した場合に、消灯状態の発光素子が点灯する、又は点灯状態の発光素子が消灯する、あるいは点灯状態を変更する（色が変化する又は点灯状態から点滅状態に変化するあるいは点滅状態から点灯状態に変化する）ように構成されているので、発光素子の発光状態を見るだけで、受光素子に光が入射したことを確認することができる。 As described above, when the light receiving element receives the incident light, the light emitting element in the off state turns on, the light emitting element in the light state turns off, or the lighting state is changed (the color changes or from the lighting state). Since it is configured to change to a blinking state or change from a blinking state to a lighting state), it is possible to confirm that light is incident on the light receiving element only by looking at the light emitting state of the light emitting element.

また、本発明の光センサは、前記発光素子から照射された光が反射物に反射してきた光を前記受光素子で受光する反射センサとして動作するように構成されていてもよい。 Further, the optical sensor of the present invention may be configured to operate as a reflection sensor that receives the light emitted from the light emitting element and reflected by the reflecting object by the light receiving element.

本発明によれば、受光素子の受光面上に発光素子を実装するとともに、発光素子が発光する光の波長範囲とは異なる波長範囲の光を受光する受光素子を備えることによって、パッケージの横方向のサイズを小型化することができるとともに遮光処理が不要となる光センサを提供することができる。 According to the present invention, the light emitting element is mounted on the light receiving surface of the light receiving element, and the light receiving element that receives light in a wavelength range different from the wavelength range of the light emitted by the light emitting element is provided in the lateral direction of the package. It is possible to provide an optical sensor that can reduce the size of the light-shielding device and does not require a light-shielding treatment.

本発明の光センサの第１実施形態を示し、（ａ）は平面図、（ｂ）は正面図、（ｃ）は反射物を上方に配置した正面図である。A first embodiment of the optical sensor of the present invention is shown, (a) is a plan view, (b) is a front view, and (c) is a front view in which a reflecting object is arranged upward. 本発明の光センサの第２実施形態を示し、（ａ）は平面図、（ｂ）は正面図、（ｃ）は反射物を上方に配置した正面図である。A second embodiment of the optical sensor of the present invention is shown, (a) is a plan view, (b) is a front view, and (c) is a front view in which a reflecting object is arranged upward. 発光素子と受光素子の波長範囲に対する光の強度を示すグラフであり、（ａ）は発光波長に対する受光感度が極めて小さくなった受光素子を用いた場合を示し、（ｂ）は所定の波長範囲をカットした受光素子を用いた場合を示している。It is a graph which shows the light intensity with respect to the wavelength range of a light emitting element and a light receiving element, (a) shows the case of using the light receiving element which the light receiving sensitivity with respect to the light emitting wavelength became extremely small, and (b) shows the case of using the predetermined wavelength range. The case where the cut light receiving element is used is shown. 本発明の光センサの第３実施形態を示し、波長を変換する蛍光体を樹脂中に混入させた光センサの正面図である。A third embodiment of the optical sensor of the present invention is shown, and is a front view of an optical sensor in which a phosphor for converting a wavelength is mixed in a resin. 本発明の光センサの第４実施形態を示し、２つのセンサを対向配置して双方向の光通信を行う構成を示す正面図である。It is a front view which shows the 4th Embodiment of the optical sensor of this invention, and shows the structure which performs bidirectional optical communication by arranging two sensors facing each other.

＜第１実施形態＞
図１（ａ），（ｂ），（ｃ）は、光センサ１を示している。この光センサ１は、基板２と、基板２の上面２Ａに受光素子３を搭載し、受光素子３の上面である受光面３Ａに発光素子４を搭載し、発光素子４及び受光素子３を封止するための透光性材料でなる封止樹脂（例えばシリコーン樹脂又はエポキシ樹脂）５と、を備えて一つのパッケージから構成されている。また、発光素子４と基板２とを接続する２本のボンディングワイヤ６，７と、受光素子３と基板２とを接続する１本のボンディングワイヤ８と、を備えている。 <First Embodiment>
1 (a), (b), and (c) show the optical sensor 1. In this optical sensor 1, the light receiving element 3 is mounted on the substrate 2 and the upper surface 2A of the substrate 2, the light emitting element 4 is mounted on the light receiving surface 3A which is the upper surface of the light receiving element 3, and the light emitting element 4 and the light receiving element 3 are sealed. It is composed of one package including a sealing resin (for example, silicone resin or epoxy resin) 5 made of a translucent material for stopping. Further, it includes two bonding wires 6 and 7 for connecting the light emitting element 4 and the substrate 2, and one bonding wire 8 for connecting the light receiving element 3 and the substrate 2.

基板２は、平面視長方形状（正方形や円形あるいは多角形などであってもよい）に構成され、ガラスエポキシ樹脂又はリードフレーム構造で形成されている。 The substrate 2 is formed in a rectangular shape in a plan view (may be square, circular, polygonal, or the like), and is formed of a glass epoxy resin or a lead frame structure.

発光素子４は、受光素子３の受光面３Ａの中央に、発光面４Ａからの光が受光素子３から離れる側へ発光するように（具体的には、図１（ｂ），（ｃ）に示すように、発光面４Ａが受光素子３の受光面３Ａと同様に上方を向いている状態で）配置され、受光素子３よりも小さな長方形状（正方形や円形あるいは多角形などであってもよい）に構成されている。ここでは、受光素子３の受光面３Ａの中央に発光素子４を配置しているが、受光面３Ａの中央以外に発光素子４を配置してもよい。また、例えば図３（ａ）に、実線で示す発光波長に対する受光感度が極めて小さい点線で示す受光素子３の波長範囲（感度波長範囲）９を示している。具体的には、この発光素子４の波長範囲が３８０ｎｍ〜４４０ｎｍであり、ピーク波長が４００ｎｍの光を発する発光素子４から構成されている。また、図３（ｂ）にも、実線で示す発光波長に対する受光感度が極めて小さい点線で示す受光素子３の波長範囲１１を示している。この発光素子４の波長範囲１２が４００ｎｍ〜５００ｎｍであり、ピーク波長が４５０ｎｍの光を発する発光素子４から構成されていてもよい。本発明の発光素子４の波長範囲は、自由に変更することができる。 The light emitting element 4 emits light from the light emitting surface 4A toward the side away from the light receiving element 3 at the center of the light receiving surface 3A of the light receiving element 3 (specifically, as shown in FIGS. 1B and 1C). As shown, the light emitting surface 4A is arranged (in a state where it faces upward like the light receiving surface 3A of the light receiving element 3), and may have a rectangular shape (square, circular, polygonal shape, etc.) smaller than the light receiving element 3. ). Here, the light emitting element 4 is arranged in the center of the light receiving surface 3A of the light receiving element 3, but the light emitting element 4 may be arranged in a place other than the center of the light receiving surface 3A. Further, for example, FIG. 3A shows a wavelength range (sensitivity wavelength range) 9 of the light receiving element 3 shown by a dotted line whose light receiving sensitivity with respect to the emission wavelength shown by the solid line is extremely small. Specifically, the light emitting element 4 is composed of a light emitting element 4 that emits light having a wavelength range of 380 nm to 440 nm and a peak wavelength of 400 nm. Further, FIG. 3B also shows the wavelength range 11 of the light receiving element 3 shown by the dotted line, which has extremely low light receiving sensitivity with respect to the emission wavelength shown by the solid line. The wavelength range 12 of the light emitting element 4 may be 400 nm to 500 nm, and the light emitting element 4 may be composed of a light emitting element 4 that emits light having a peak wavelength of 450 nm. The wavelength range of the light emitting element 4 of the present invention can be freely changed.

受光素子３は、受光面３Ａが露出するように発光素子４よりも大きな長方形状（正方形や円形あるいは多角形などであってもよい）に構成されている。また、受光素子３は、例えば図３（ａ）に示すように、発光波長に対する受光感度が極めて小さい波長範囲を有している。具体的には、波長範囲が４００ｎｍ〜１１００ｎｍであり、ピーク波長が１０００ｎｍである受光素子から構成されている。また、図３（ｂ）にも、３００ｎｍ〜６００ｎｍまでの所定範囲の波長範囲がカットされて、発光波長に対する受光感度が極めて小さくなった受光素子３の波長範囲を示している。具体的には、受光素子３の波長範囲が６００ｎｍ〜１１００ｎｍであり、ピーク波長が７８０ｎｍである受光素子３から構成されていてもよい。本発明の受光素子３の波長範囲は、自由に変更することができる。要するに、受光素子３は、発光素子４が発光する光を受光することができない波長範囲（感度波長範囲）になるように設定されている。尚、図３（ａ），（ｂ）のグラフでは、縦軸に相対強度（感度）を取り、横軸に波長（ｎｍ）を取っている。 The light receiving element 3 is configured to have a rectangular shape (which may be square, circular, polygonal, or the like) larger than the light emitting element 4 so that the light receiving surface 3A is exposed. Further, as shown in FIG. 3A, for example, the light receiving element 3 has a wavelength range in which the light receiving sensitivity with respect to the emission wavelength is extremely small. Specifically, it is composed of a light receiving element having a wavelength range of 400 nm to 1100 nm and a peak wavelength of 1000 nm. Further, FIG. 3B also shows the wavelength range of the light receiving element 3 in which the wavelength range of a predetermined range from 300 nm to 600 nm is cut and the light receiving sensitivity with respect to the emission wavelength is extremely reduced. Specifically, the light receiving element 3 may be composed of the light receiving element 3 having a wavelength range of 600 nm to 1100 nm and a peak wavelength of 780 nm. The wavelength range of the light receiving element 3 of the present invention can be freely changed. In short, the light receiving element 3 is set to be in a wavelength range (sensitivity wavelength range) in which the light emitted by the light emitting element 4 cannot be received. In the graphs of FIGS. 3A and 3B, the vertical axis represents the relative intensity (sensitivity) and the horizontal axis represents the wavelength (nm).

前記のように構成された光センサ１は、図１（ｂ）に、インジケータ付光センサとして使用する場合を示している。この光センサ１には、受光素子３が入射する光１３を受光すると、その受光信号に基づいて発光素子４を発光させるための制御部（図示せず）を備えている。従って、受光素子３が入射光１３を受光すると、消灯状態の発光素子４が光（可視光）１４を発光して点灯するインジケータランプとして動作するように構成されている。このとき、受光素子３が受光する光の波長範囲と発光素子４が発光する波長範囲とが、前述したように異なる範囲になっている。このように発光素子４がインジケータランプとして動作するように構成されているので、発光素子４の発光状態（ここでは点灯している発光素子４の光（可視光）１４）を見るだけで、受光素子３に光１３が入射したことを確認することができる。また、受光素子３が入射光を受光した場合に、点灯状態の発光素子４が消灯する、又は点灯状態を変更する（色が変化する又は点灯状態から点滅状態に変化するあるいは点滅状態から点灯状態に変化する）構成であってもよい。 FIG. 1B shows a case where the optical sensor 1 configured as described above is used as an optical sensor with an indicator. The optical sensor 1 includes a control unit (not shown) for causing the light emitting element 4 to emit light based on the light receiving signal when the light receiving element 3 receives the incident light 13. Therefore, when the light receiving element 3 receives the incident light 13, the light emitting element 4 in the extinguished state operates as an indicator lamp that emits light (visible light) 14 and lights up. At this time, the wavelength range of the light received by the light receiving element 3 and the wavelength range of the light emitted by the light emitting element 4 are different ranges as described above. Since the light emitting element 4 is configured to operate as an indicator lamp in this way, the light is received only by looking at the light emitting state of the light emitting element 4 (here, the light (visible light) 14 of the lit light emitting element 4). It can be confirmed that the light 13 is incident on the element 3. Further, when the light receiving element 3 receives the incident light, the light emitting element 4 in the lit state is turned off or the lit state is changed (the color changes or the lit state changes to the blinking state, or the lit state changes to the lit state. It may be a configuration (which changes to).

また、図１（ｃ）に、前記光センサ１を反射センサとして使用する場合を示している。つまり、発光素子４から発光された光１４が反射物（対象物）１６に当たって反射してきた光１７（発光素子４から発光された光１５の波長範囲とは異なる波長範囲に変換された光）を受光素子３で受光することによって、反射物１６を検出することができる反射センサとして機能する。 Further, FIG. 1C shows a case where the optical sensor 1 is used as a reflection sensor. That is, the light 14 emitted from the light emitting element 4 hits the reflecting object (object) 16 and is reflected (light converted into a wavelength range different from the wavelength range of the light 15 emitted from the light emitting element 4). By receiving light with the light receiving element 3, it functions as a reflection sensor capable of detecting the reflecting object 16.

前述のように、受光素子３の受光面３Ａ上に発光素子４を実装して一体化しているので、基板上に受光素子と発光素子とを横方向に所定間隔を置いて配置する場合に比べて、横方向のサイズを小型化することができる。しかも、発光素子４が発光する光の波長範囲とは異なる波長範囲の光を受光するように構成された受光素子３であるため、金属薄膜を蒸着して遮光処理を行うことが不要になるとともに、発光素子４から照射される光に対して受光素子３の出力を大幅に小さくすることができる。また、図１（ｃ）に示すように、光センサ１を反射センサとして使用する場合に、発光素子４から照射された光１５が反射物（対象物）１６に当たって反射してきた光１７を、発光素子４の光軸４Ｌにできるだけ近付けた位置に配置した受光素子３で効率よく受光することができる。 As described above, since the light emitting element 4 is mounted and integrated on the light receiving surface 3A of the light receiving element 3, the light receiving element and the light emitting element are arranged on the substrate at predetermined intervals in the lateral direction. Therefore, the size in the horizontal direction can be reduced. Moreover, since the light receiving element 3 is configured to receive light in a wavelength range different from the wavelength range of the light emitted by the light emitting element 4, it is not necessary to deposit a metal thin film to perform light shielding treatment. The output of the light receiving element 3 can be significantly reduced with respect to the light emitted from the light emitting element 4. Further, as shown in FIG. 1 (c), when the light sensor 1 is used as a reflection sensor, the light 15 emitted from the light emitting element 4 hits the reflective object (object) 16 and reflects the light 17 is emitted. Light can be efficiently received by the light receiving element 3 arranged at a position as close as possible to the optical axis 4L of the element 4.

＜第２実施形態＞
第１実施形態では、図１（ｂ）に示す、受光素子３に直接入射してくる光１３及び図１（ｃ）に示す、発光素子４から発光された光１５が反射物１６に当たって反射してきた光１７が、発光素子４から発光された光１５の波長範囲と異なる波長範囲の光であったが、図２（ａ），（ｂ），（ｃ）では、受光素子３の受光面３Ａに、受光面３Ａに入射してくる光を発光素子４が発光する光の波長範囲とは異なる波長範囲の光を受光すべく、特定の波長範囲の光をカットする光学フィルター１８を備えている。図３（ｂ）に光学フィルター１８により３００ｎｍ〜６００ｎｍの範囲の波長がカットされた受光素子３の波長範囲を示している。また、光学フィルターを備える場合には、透過率や偏光方向を含む特性の異なる種々の光学フィルターに取り替えるだけで、波長範囲を容易に変更することができる。 <Second Embodiment>
In the first embodiment, the light 13 directly incident on the light receiving element 3 shown in FIG. 1 (b) and the light 15 emitted from the light emitting element 4 shown in FIG. 1 (c) hit the reflector 16 and are reflected. The light 17 was light having a wavelength range different from that of the light 15 emitted from the light emitting element 4, but in FIGS. 2A, 2B, and 2C, the light receiving surface 3A of the light receiving element 3 In addition, an optical filter 18 that cuts light in a specific wavelength range is provided so as to receive light in a wavelength range different from the wavelength range of light emitted by the light emitting element 4 from light incident on the light receiving surface 3A. .. FIG. 3B shows the wavelength range of the light receiving element 3 in which the wavelength in the range of 300 nm to 600 nm is cut by the optical filter 18. Further, when an optical filter is provided, the wavelength range can be easily changed by simply replacing the optical filter with various optical filters having different characteristics including transmittance and polarization direction.

図２（ａ），（ｂ），（ｃ）では、光学フィルター１８を受光素子３の受光面３Ａに備えている構成以外の構成は、図１（ａ），（ｂ），（ｃ）と同様であるため、同一の符号を付すとともに、説明を省略する。尚、図２（ｂ）では、図１（ｂ）と同様に、光センサ１をインジケータ付光センサとして使用する場合を示し、図２（ｃ）では、図１（ｃ）と同様に、光センサ１を反射センサとして使用する場合を示している。 In FIGS. 2 (a), 2 (b), and 2 (c), the configurations other than the configuration in which the optical filter 18 is provided on the light receiving surface 3A of the light receiving element 3 are shown in FIGS. 1 (a), (b), and (c). Since they are the same, the same reference numerals are given and the description thereof will be omitted. Note that FIG. 2 (b) shows a case where the optical sensor 1 is used as an optical sensor with an indicator as in FIG. 1 (b), and FIG. 2 (c) shows light as in FIG. 1 (c). The case where the sensor 1 is used as a reflection sensor is shown.

＜第３実施形態＞
第２実施形態では、受光素子３の受光面３Ａに、受光面３Ａに入射してくる光を発光素子４が発光する光の波長範囲とは異なる波長範囲の光に光変換する光学フィルター１８を備えた場合を示したが、図４に示すように、封止樹脂５の中に一色又は複数色の蛍光体１９を含有してもよい。この蛍光体１９により、発光素子４から発光される光１４を受光感度の小さい波長の光に変換することができ、かつ、発光素子４から発光される光の色を調色することができる。例えば、青色発光素子を用いる場合には、赤色と緑色の蛍光体又は黄色と赤色の蛍光体を用いることによって、封止樹脂５からチップ外へ放射された光が白色光を発光することができる。図４では、発光素子４から発光される光１４が蛍光体１９に当たって波長変換され、その波長変換された光は、受光素子３が受光しない構成である。また、前記受光素子３は、外部から入射してきた光１３のうち、発光素子４が発光する光の波長範囲も受光しない構成である。つまり、図４の受光素子３は、前記蛍光体１９で波長変換された光の波長範囲及び前記発光素子４が発光する光の波長範囲を除く波長範囲の光を受光するように構成されている。 <Third Embodiment>
In the second embodiment, the light receiving surface 3A of the light receiving element 3 is provided with an optical filter 18 that converts the light incident on the light receiving surface 3A into light having a wavelength range different from the wavelength range of the light emitted by the light emitting element 4. Although the case where it is provided is shown, as shown in FIG. 4, the sealing resin 5 may contain the phosphor 19 of one color or a plurality of colors. The phosphor 19, it is possible to convert the light 14 emitted from the light emitting element 4 to light of small wavelength photosensitivity, and that toning the color of the light emitting element 4 or al onset light light being it can. For example, when a blue light emitting element is used, by using a red and green phosphor or a yellow and red phosphor, the light radiated from the sealing resin 5 to the outside of the chip can emit white light. .. In FIG. 4, the light 14 emitted from the light emitting element 4 hits the phosphor 19 and is wavelength-converted, and the wavelength-converted light is not received by the light receiving element 3. Further, the light receiving element 3 has a configuration in which the wavelength range of the light emitted by the light emitting element 4 among the light 13 incident from the outside is not received. That is, the light receiving element 3 of FIG. 4 is configured to receive light in a wavelength range excluding the wavelength range of the light wavelength-converted by the phosphor 19 and the wavelength range of the light emitted by the light emitting element 4. ..

＜第４実施形態＞
第１実施形態〜第３実施形態では、一つの光センサ１を使用した場合を示したが、図５に示すように、２つの光センサ２０，２１を使用して双方向で波長が異なる可視光と赤外光とで光通信ができる光通信装置として用いるようにしてもよい。この場合、一方（図５の下側）の第１光センサ２０の発光素子４が、赤外光２２を発光し、他方（図５の上側）の第２光センサ２１の受光素子３が、第１光センサ２０の赤外光２２を受光することによって、第２光センサ２１の発光素子４が可視光２３を発光し、この第２光センサ２１からの可視光２３を第１光センサ２０の受光素子３が受光する。 <Fourth Embodiment>
In the first to third embodiments, the case where one optical sensor 1 is used is shown, but as shown in FIG. 5, the two optical sensors 20 and 21 are used and the visible wavelengths are different in both directions. It may be used as an optical communication device capable of optical communication between light and infrared light. In this case, the light emitting element 4 of the first optical sensor 20 (lower side of FIG. 5) emits infrared light 22, and the light receiving element 3 of the second optical sensor 21 (upper side of FIG. 5) emits infrared light 22. By receiving the infrared light 22 of the first light sensor 20, the light emitting element 4 of the second light sensor 21 emits visible light 23, and the visible light 23 from the second light sensor 21 is used as the first light sensor 20. The light receiving element 3 receives light.

尚、本発明は、前記実施形態に限定されるものではなく、本発明の要旨を逸脱しない範囲で種々の変更が可能である。 The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention.

前記実施形態では、受光素子３に対して１個の発光素子４を設けた光センサ１を示したが、複数個（２個以上の任意の個数）の発光素子を設けて実施してもよい。また、受光素子が複数の波長範囲をそれぞれ受光する構成であってもよい。 In the above embodiment, the optical sensor 1 in which one light emitting element 4 is provided for the light receiving element 3 is shown, but a plurality of (an arbitrary number of two or more) light emitting elements may be provided. .. Further, the light receiving element may be configured to receive light in each of a plurality of wavelength ranges.

１…光センサ、２…基板、２Ａ…上面、３…受光素子、３Ａ…受光面、４…発光素子、４Ａ…発光面、４Ｌ…光軸、５…封止樹脂、６，７，８…ボンディングワイヤ、９…受光素子の波長範囲（感度波長範囲）、１０…発光素子の波長範囲（発光波長範囲）、１１…受光素子の波長範囲（感度波長範囲）、１２…発光素子の波長範囲（発光波長範囲）、１３，１４，１５，１７…光、１６…反射物、１８…光学フィルター、１９…蛍光体、２０…第１光センサ、２１…第２光センサ、２２，２３…光 1 ... optical sensor, 2 ... substrate, 2A ... top surface, 3 ... light receiving element, 3A ... light receiving surface, 4 ... light emitting element, 4A ... light emitting surface, 4L ... optical axis, 5 ... sealing resin, 6, 7, 8 ... Bonding wire, 9 ... Wavelength range of the light receiving element (sensitivity wavelength range), 10 ... Wavelength range of the light emitting element (emission wavelength range), 11 ... Wavelength range of the light receiving element (sensitivity wavelength range), 12 ... Wavelength range of the light emitting element ( Emission wavelength range), 13, 14, 15, 17 ... light, 16 ... reflector, 18 ... optical filter, 19 ... phosphor, 20 ... first optical sensor, 21 ... second optical sensor, 22, 23 ... light

Claims (2)

光を受光する受光素子の受光面上に該受光素子から離れる方向へ光を発光する発光素子を実装して一体化された光センサであって、
前記受光素子を封止するための封止樹脂の中に、前記発光素子から発光される光を受光感度の小さい波長の光に変換し、かつ、前記発光素子から発光される光の色を調色するための一色又は複数色の蛍光体を含有しており、前記受光素子は、前記蛍光体で波長変換された光の波長範囲及び前記発光素子が発光する光の波長範囲を除く波長範囲の光を受光するように構成されていることを特徴とする光センサ。 An optical sensor in which a light emitting element that emits light in a direction away from the light receiving element is mounted on a light receiving surface of the light receiving element that receives light and is integrated.
In the sealing resin for sealing the light receiving element, the light emitted from the light emitting element is converted into light having a wavelength having a low light receiving sensitivity, and the color of the light emitted from the light emitting element is adjusted. The light receiving element contains a phosphor of one color or a plurality of colors for coloring, and the light receiving element has a wavelength range excluding the wavelength range of the light wavelength-converted by the phosphor and the wavelength range of the light emitted by the light emitting element. An optical sensor characterized in that it is configured to receive light. 前記受光素子及び前記発光素子が一つのパッケージに構成され、前記発光素子は、前記受光素子が入射光を受光した場合に点灯する又は消灯するあるいは点灯状態を変更するように構成されていることを特徴とする請求項１に記載の光センサ。 The light receiving element and the light emitting element are configured in one package, and the light emitting element is configured to turn on or off or change the lighting state when the light receiving element receives incident light. The optical sensor according to claim 1.
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