JP6823800B2 - Light emitting module and lighting device - Google Patents

Description

An embodiment of the present invention relates to a light emitting module and a lighting device using the light emitting module.

There is a light emitting module provided with a plurality of types of light emitting elements having different colors of emitted light. Such a light emitting module can irradiate light of any color (full color) by controlling the lighting and extinguishing of the light emitting element for each light emitting color.

Full color is a color that can be reproduced using the three primary colors on the x and y chromaticity diagrams, and at least three types of light emitting elements with different wavelengths, such as a light emitting element that emits red light and green light. A light emitting element that emits light and a light emitting element that emits blue light are required. Further, in order to obtain various colors of light, for example, a light emitting element that emits yellow light, a light emitting element that emits orange light, a light emitting element that emits indigo light, and the like are further required.

However, since each light emitting element has different electrical characteristics, in order to control the lighting and extinguishing of the light emitting element for each color of light, the number of types of the light emitting element is independent on the substrate on which the light emitting element is mounted. A power supply with different specifications is required for each type of wiring pattern and light emitting element. Therefore, when a power supply having the same specifications is used for each light emitting element having different electrical characteristics, there arises a problem that the power supply efficiency is lowered.

Japanese Unexamined Patent Publication No. 8-125229

An object to be solved by the present invention is to provide a light emitting module and a lighting device capable of driving various types of light emitting elements having different colors of emitted light with a power source having the same specifications and suppressing color unevenness. ..

The light emitting module of the embodiment irradiates a substrate, a plurality of main light emitting elements having different wavelengths of three or more types, and light not included in the chromaticity range reproduced by the main light emitting element in the x and y chromaticity diagrams. It has a secondary light emitting element. Sub-emission element, the surface area of the top surface is less than the main light emitting element. In addition, each of the main light emitting elements and the sub light emitting elements are provided with a plurality of power sources driven by different systems. The main light emitting element and the sub light emitting element are dispersedly arranged on the substrate, and the total surface area of the upper surfaces of the plurality of sub light emitting elements is smaller than the total surface area of any of the upper surfaces of the plurality of main light emitting elements. Further, the number of sub-light emitting elements is such that the voltage applied to the system composed of the sub-light emitting elements and the voltage applied to the system composed of any one of the main light emitting elements are connected in series with the sub light emitting elements. It is selected so that the applied voltage will be the same when connected.

According to the embodiment of the present invention, in a light emitting module using a plurality of types of light emitting elements, it can be expected that the power supplies used for each type of light emitting element can have the same specifications and color unevenness can be suppressed.

It is a top view which shows the light emitting module of an embodiment. FIG. 5 is a cross-sectional view taken along the line AA in FIG. It is a figure which shows the x, y chromaticity diagram of the light emitting module of an embodiment. It is a figure which shows the x, y chromaticity diagram of the light emitting module which used three kinds of main light emitting elements and sub light emitting elements. It is a figure which shows the relationship between the number of light emitting elements of the light emitting module of embodiment, and the applied voltage. It is a top view which shows the modification of the light emitting module of embodiment. It is sectional drawing which shows the lighting apparatus which concerns on embodiment.

Hereinafter, the configuration of the embodiment will be described with reference to the drawings.

FIG. 1 is a plan view for exemplifying the light emitting module 1 according to the embodiment. For the sake of explanation, in order to avoid complication, the sealing portion 40, the wiring pattern 12, and the like are omitted in FIG.

FIG. 2 is a cross-sectional view taken along the line AA in FIG.

As shown in FIGS. 1 and 2, the light emitting module 1 is provided with a substrate 10, a light emitting portion 20, a frame portion 30, and a sealing portion 40.

The substrate 10 has a substrate 11 and a wiring pattern 12.

The substrate 11 has a plate shape. The substrate 11 is preferably formed using a material having a high thermal conductivity. As the material having high thermal conductivity, for example, an inorganic material such as ceramics or a material in which the surface of a metal plate is coated with an insulating material can be used. As the ceramic, aluminum oxide, aluminum nitride, or the like can be used. When the surface of the metal plate is covered with an insulating material, the insulating material may be made of an organic material or an inorganic material.

The wiring pattern 12 has a mounting pad 12a, a wiring portion 12b, a conductive via 12c, and an input terminal 12d. The mounting pad 12a is provided on one surface of the base 11, and is provided inside the frame portion 30.

The wiring portion 12b is provided on the other surface of the substrate 11 opposite to the surface on which the mounting pad 12a is provided. The wiring portion 12b is electrically connected to the conductive via 12c and the input terminal 12d.

The conductive via 12c penetrates the substrate 11 in the thickness direction. One end of the conductive via 12c is electrically connected to the mounting pad 12a. The other end of the conductive via 12c is electrically connected to the wiring portion 12b.

As a result, wiring on the surface of the substrate 11 on which the mounting pad 12a is provided can be simplified, and high-density mounting of the light emitting element becomes possible.

The input terminal 12d is provided on the other surface of the substrate 11 opposite to the surface on which the mounting pad 12a is provided, similarly to the wiring portion 12b. The arrangement position of the input terminal 12d is not particularly limited. The input terminal 12d can be provided, for example, near the peripheral edge of the substrate 11.

The wiring portion 12b and the input terminal 12d can also be provided on the surface of the substrate 11 on which the mounting pad 12a is provided. In this case, it is not necessary to form the conductive via 12c.

Further, the input terminal 12d can be provided on the outside of the frame portion 30.

Further, one set of the mounting pad 12a, the wiring portion 12b, the conductive via 12c, and the input terminal 12d is provided for each type of light emitting element (for each of the light emitting elements 20r to 20i described later).

In addition, the substrate 11 may have a single-layer structure as illustrated in FIG. 2, or may have a multi-layer structure.

The material of the wiring pattern 12 is not particularly limited as long as it is a conductive material. As the material of the wiring pattern 12, for example, a metal such as silver, copper, gold, or tungsten can be applied. When the material of the substrate 11 is ceramics, the substrate 10 can be formed by using, for example, the LTCC (Low Temperature Co-fired Ceramics) method. For example, the substrate 10 can be formed by simultaneously firing the substrate 11 and the wiring pattern 12 at a temperature of 900 ° C. or lower.

Further, a heat spreader (not shown) may be provided on the surface of the substrate 10 opposite to the surface on which the light emitting portion 20 is provided. The heat spreader can be connected to the substrate 10 via thermally conductive grease, solder, or the like. If a heat spreader is provided, the heat generated in the light emitting unit 20 can be conducted and dispersed. Therefore, the electric power applied to the light emitting unit 20 can be increased, so that the amount of light emitted from the light emitting module 1 can be increased. Further, since it becomes easy to secure the heat conduction path, it is possible to suppress an increase in the temperature of the sealing portion 40 and, by extension, the temperature of the light emitting portion 20.

The light emitting unit 20 includes a main light emitting element 20r, 20g, 20b, 20c, 20y, 20o, and a sub light emitting element 20i. The light emitting elements 20r, 20g, 20b, 20c, 20y, 20o, and 20i are provided on one surface of the substrate 10.

The light emitting element 20r emits reddish light. The light emitting element 20r is a light emitting element that emits light having a peak wavelength of 610 nm or more and 660 nm or less. The light emitting element 20 g emits greenish light. The light emitting element 20g is a light emitting element that emits light having a peak wavelength of light of 500 nm or more and 540 nm or less. The light emitting element 20b emits blue light. The light emitting element 20b is a light emitting element that emits light having a peak wavelength of 470 nm or more and 485 nm or less. The light emitting element 20c emits cyan light. The light emitting element 20c is a light emitting element that emits light having a peak wavelength of light of 490 nm or more and 500 nm or less.

The light emitting element 20y emits yellowish light. The light emitting element 20y emits light having a peak wavelength of light of 570 nm or more and 590 nm or less. The light emitting element 20y includes a light emitting element that emits blue light and a phosphor that is provided on the light emitting surface of the light emitting element and emits yellow fluorescence. The light emitting element 20o emits orange-based light. The light emitting element 20o emits light having a peak wavelength of light of 590 nm or more and 620 nm or less. The light emitting element 20o includes a light emitting element that emits blue light and a phosphor that is provided on the light emitting surface of the light emitting element and emits amber fluorescence.

Further, the light emitting element 20i is a sub light emitting element and emits indigo light. The light emitting element 20i is a light emitting element that emits light having a peak wavelength of light of 445 nm or more and 460 nm or less, which is shorter than that of the main light emitting element.

The light emitting elements 20r to 20i are mounted on the mounting pad 12a by using a COB (Chip on Board) method. The light emitting elements 20r to 20i are bonded to the mounting pad 12a via a silver paste, a silver nanopaste, or the like. As the light emitting elements 20r to 20i, upper and lower electrode type light emitting elements, flip chip type light emitting elements, and the like can be used.

When the light emitting elements 20r to 20i are upper and lower electrode type light emitting elements, the electrodes (lower electrode) on the substrate 10 side of the light emitting elements 20r to 20i are lead-free solder (SAC: SnAgCu, etc.) and gold tin (AuSn). ) It is electrically connected to the mounting pad 12a via a conductive bonding material such as an alloy paste, a silver paste, or a silver nanopaste. The electrodes (upper electrodes) of the light emitting elements 20r to 20i opposite to the substrate 10 side are electrically connected to the mounting pad 12a via the wiring 21. The wiring 21 can be connected by using, for example, a wire bonding method.

When the light emitting elements 20r to 20i are flip-chip type light emitting elements, the electrodes of the light emitting elements 20r to 20i are made of a conductive bonding material such as lead-free solder, gold-tin alloy paste, silver paste, or silver nanopaste. Via, it is electrically connected to the mounting pad 12a.

The frame portion 30 is formed in a substantially circular shape. The frame portion 30 is provided on the surface of the substrate 10 on which the light emitting elements 20r to 20i are provided so as to surround the light emitting elements 20r to 20i. The frame portion 30 can be formed of, for example, a resin such as PBT (polybutylene terephthalate) or PC (polycarbonate), ceramics, or the like.

Further, the frame portion 30 is not always necessary and can be omitted. When the frame portion 30 is not provided, the shape of the sealing portion 40 is formed, for example, in a dome shape.

The sealing portion 40 is formed of a translucent material. The sealing portion 40 can be formed of, for example, a transparent resin such as a silicone-based resin.

In the light emitting module 1, a power supply or a control device (not shown) provided outside the light emitting module 1 is electrically connected to an input terminal 12d provided for each type of light emitting element. Therefore, the light emitting module 1 is provided with a lighting circuit for each type of synchrotron radiation of a light emitting element, and by controlling lighting and extinguishing, it is possible to irradiate light of all colors (full color). It has become.

Next, the x, y chromaticity diagram of the light emitting module 1 in the embodiment will be described with reference to FIG.

In the embodiment, 20r, 20g, 20b, 20c, 20y, and 20o are used as the main light emitting element, and 20i is used as the sub light emitting element. Therefore, as shown in FIG. 3 in the x and y chromaticity diagrams, the range reproduced by the main light emitting element is the shaded area in the figure, and the sub light emitting element 20i is within the chromaticity range reproduced by the main light emitting element. It is in a position that is not included.

As an embodiment, a case where six types of main light emitting elements 20r, 20g, 20b, 20c, 20y, 20o and a sub light emitting element 20i are provided has been illustrated, but at least three or more types of light emitting elements having different wavelengths, for example, green A light emitting element 20g that emits the light of the above, a light emitting element 20b that emits blue light, a light emitting element 20r that emits red light, and a secondary light emitting element, for example, a light emitting element 20i that emits indigo light are provided. It may be the case. As shown in FIG. 4, the x, y chromaticity diagram in this case shows the chromaticity range reproduced by the main light emitting elements 20r, 20g, and 20b in the shaded area in the figure, and the sublight emitting element 20i in the chromaticity range. It is in a position that is not included. By providing the sub-light emitting element at a position not included in the chromaticity range reproduced by the main light emitting element in this way, the chromaticity range that can be reproduced is widened, and it is possible to obtain various colors of light.

Next, the number of light emitting elements used and the applied voltage in the embodiment will be described with reference to FIG.

Considering that white light is emitted from the light emitting module 1, when the surface area of the upper surface of the light emitting element is vertical × horizontal = 1.0 mm × 1.0 mm = 1.0 mm ² , the light emitting elements 20y, 20o, The number of 20r is about 28 to 32, and the number of light emitting elements 20b, 20g, and 20c is about 12 each. On the other hand, about 6 light emitting elements 20i are sufficient. The applied voltage of the light emitting element 20r is about 31 to 35V, the applied voltage of the light emitting elements 20y and 20o is about 42 to 48V, the applied voltage of the light emitting elements 20b, 20g and 20c is about 36V, and the applied voltage of 20i is about 18V. Become. Since the number of light emitting elements 20i used is smaller than that of other light emitting elements, the applied voltage is low. Therefore, when a power source having the same specifications as other light emitting elements is used, the power supply efficiency is poor, and a special power source for the light emitting element 20i is required.

Therefore, by setting the surface area of the upper surface of the light emitting element 20i to about half of the above length x width = 0.5 mm x 1.0 mm = 0.5 mm ² , the light output per light emitting element is reduced to about half. The required number of light emitting elements 20i is 12. Since the applied voltage per light emitting element does not change even if the surface area of the upper surface changes, the applied voltage of the light emitting element 20i is about 36V, which is twice the above 18V. As a result, the applied voltage of the sub-light emitting element 20i is in the range of half or more of the applied voltage of the main light emitting element and not more than the maximum applied voltage, so that the sub light emitting element can have the same applied voltage as the main light emitting element. ..

Further, by reducing the surface area of the upper surface of the light emitting element 20i and increasing the number of light emitting elements used, the light emitting elements 20i can be widely dispersed and arranged in the light emitting surface.

The light emitting module 1 of this embodiment can use a power supply having the same specifications by reducing the surface area of the upper surface of the light emitting element 20i and selecting the number of light emitting modules to be used so as to be equal to the applied voltage of the other light emitting elements.

Further, by reducing the surface area of the upper surface of the light emitting element and increasing the number of light emitting elements, it becomes easy to disperse the light emitting elements widely in the light emitting surface, so that color unevenness at the time of color mixing can be suppressed.

Next, the light emitting module 1A of the modified example will be described with reference to FIG. In FIG. 6, the same parts as those in FIG. 1 are designated by the same reference numerals, and redundant description will be omitted. In the light emitting module 1A, a plurality of main light emitting elements 20r, 20g, 20b, 20c and a plurality of sub light emitting elements 20i having different wavelengths are mounted on the substrate 10, and a plurality of light emitting elements 20w for irradiating white light are further mounted. doing.

The light emitting element 20w includes a light emitting element that emits blue light and a phosphor that is provided on the light emitting surface of the light emitting element and emits yellow fluorescence. A method in which a blue light emitting element is provided with a yellow phosphor and irradiates white light, such as the light emitting element 20w, has high luminous efficiency. Therefore, the luminous module 1A has the luminous element 20w, so that the luminous efficiency is improved.

Also in the light emitting module of this embodiment, a power supply having the same specifications can be used by reducing the surface area of the upper surface of the light emitting element 20i and selecting the number of light emitting modules to be used so as to be equal to the applied voltage of the other light emitting elements.

In addition to selecting the number of light emitting elements used in the embodiment and the modified example, when the surface area of the upper surface of the light emitting element 20i is reduced and the number of light emitting elements used is selected so as to be equal to the applied voltage of other light emitting elements. Alternatively, a resistor may be added to adjust the applied voltage.

Next, the lighting device 100 provided with the above-mentioned light emitting module 1 will be described by way of exemplifying with reference to FIG.

FIG. 7 is a schematic cross-sectional view for exemplifying the lighting device 100 according to the present embodiment.

The lighting device 100 illustrated in FIG. 7 is a floodlight installed in a building, a stadium, or the like.

The lighting device 100 according to the present embodiment is not limited to the floodlight. The lighting device 100 may be any device capable of irradiating full-color light.

As shown in FIG. 7, the lighting device 100 is provided with an irradiation unit 110 and a light source unit 120. The irradiation unit 110 has a housing 111 and a reflector 112.

The housing 111 has a box shape. The housing 111 can be formed from, for example, an aluminum alloy. The end of the housing 111 on the side opposite to the light source portion 120 is open. This opening is closed by a translucent cover (not shown). A hole 111a is provided at the end of the housing 111 on the light source 120 side.

The reflector 112 is provided inside the housing 111. A flange 112a projecting outward is provided at the end of the reflector 112 on the side opposite to the light source portion 120 side. The end portion of the reflector 112 on the light source portion 120 side is provided inside the hole portion 111a. A hemispherical lens or the like may be arranged on the light emitting side of the light emitting module 1. Further, the light emitting surface of the lens can be diffused, or a diffusing sheet can be attached. If the diffusion treatment is performed or a diffusion sheet is attached, the light radiated from the light emitting elements 20r to 20i can be diffused, so that the occurrence of color unevenness can be further suppressed.

The light source unit 120 includes a light emitting module 1, a housing 121, a mounting unit 122, a heat radiating unit 123, a packing 124, a heat radiating fin 125, and a heat pipe 126.

The housing 121 has a box shape. The housing 121 can be formed of, for example, an aluminum alloy. A hole is provided at the end of the housing 121 on the irradiation portion 110 side. A light emitting module 1 attached to the attachment portion 122 is provided inside the hole portion. That is, the light emitting module 1 is housed in the housing 121.

The mounting portion 122 has a plate shape. The mounting portion 122 can be formed of, for example, an aluminum alloy or the like. The mounting portion 122 is mounted on the heat radiating portion 123 by using a fastening member such as a screw. A recess is provided on the end surface of the mounting portion 122 on the irradiation portion 110 side. The light emitting module 1 is arranged inside the recess.

The heat radiating unit 123 has a plate shape. The heat radiating portion 123 can be formed of, for example, an aluminum alloy or the like. The heat radiating portion 123 is attached to the inside of the housing 121 by using a fastening member such as a screw (not shown).

The packing 124 has an annular shape. The packing 124 is provided between the heat radiating portion 123 and the inner wall surface of the housing 121.

The heat radiating fin 125 is provided in a thin plate shape on the back surface side of the heat radiating portion 123. A plurality of heat radiation fins 125 are provided. The heat radiation fin 125 can be formed from, for example, an aluminum alloy. Heat dissipation

The fin 125 is provided on the surface of the heat radiating portion 123 opposite to the side on which the portion 122 is provided.

The heat pipe 126 is provided between the heat radiating portion 123 and the heat radiating fin 125. A plurality of heat pipes 126 may be provided.

In addition, a control device (not shown) that controls the light emitting module 1 can be provided. For example, the control device controls turning on and off for each of the light emitting elements 20r to 20i. Further, the control device controls the electric power supplied for each of the light emitting elements 20r to 20i, and controls the light emission output for each of the light emitting elements 20r to 20i. Further, a power supply (not shown) for driving the light emitting module 1 is provided, and a power supply having the same specifications is used for each type of light emitting element having a different color of synchrotron radiation.

Further, the light source unit 120 may further include a diffusion unit 127. The diffusion portion 127 can be, for example, a plate-like body formed of glass, a transparent resin, or the like. The diffusion portion 127 may have fine irregularities on the surface. The size and shape of the unevenness are not particularly limited, and the light incident on the diffusing portion 127 (light emitted from the light emitting module 1) may be diffused. If the diffusing unit 127 is provided, the light radiated from the light emitting elements 20r to 20i can be diffused, so that the occurrence of color unevenness can be further suppressed.

According to the embodiment described above, it is possible to provide a light emitting module and a lighting device capable of driving each type of light emitting element having a different color of emitted light with a power source having the same specifications and suppressing color unevenness.

Although some embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other embodiments, and various omissions, replacements, and changes can be made without departing from the gist of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are also included in the scope of the invention described in the claims and the equivalent scope thereof.

1 Light emitting module 10 Substrate 20r, 20g, 20b, 20c, 20c, 20y Main light emitting element 20i Sub light emitting element 30 Frame part 20w Light emitting element that irradiates white light 100 Lighting device 111 Housing

Claims (4)

With the board;
With at least three types of main light emitting elements having different wavelengths mounted on the substrate;
x, the y chromaticity diagram, a light-emitting element for irradiating said main not included in the chromaticity range which is reproduced by the light-emitting element light, the surface area of the top surface is mounted on the substrate has smaller than the main light emitting element With multiple sub-light emitting elements;
With a plurality of power supplies that drive each of the main light emitting elements and the sub light emitting elements by different systems;
Equipped with
The main light emitting element and the sub light emitting element are dispersedly arranged on the substrate, and the total surface area of the upper surfaces of the plurality of sub light emitting elements is the total surface area of any of the upper surfaces of the plurality of main light emitting elements. rather smaller than the number of the sub-light emitting element, wherein a voltage applied to by lineage consists of one type of voltage applied to the system constituted by the sub-light-emitting element and the main light emitting element is the A light emitting module characterized in that it is selected so that the applied voltage becomes the same by connecting sub-light emitting elements in series . The light emitting module according to claim 1, wherein the sub light emitting element has a shorter peak wavelength of light than the main light emitting element. The light emitting module according to claim 1 or 2, wherein a plurality of light emitting elements for irradiating white light are further mounted on the substrate. The light emitting module according to any one of claims 1 to 3 and
A housing equipped with the light emitting module and
Lighting equipment equipped with.

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