JP6822534B2 - Object support device and exposure device - Google Patents

Description

The present invention relates to an object support device and an exposure device, and more particularly to an object support device that supports a plate-shaped object and an exposure device including the support device.

Conventionally, in the lithography process for manufacturing electronic devices (microdevices) such as semiconductor elements (integrated circuits, etc.) and liquid crystal display elements, mainly step-and-repeat type projection exposure devices (so-called steppers) or step-and-step devices are used. A scanning type projection exposure device (so-called scanning stepper (also called a scanner)) or the like is used.

Bernoulli chuck is known as a wafer transfer device used in this type of exposure device (see, for example, Patent Document 1).

On the other hand, as a method of shortening the wafer exchange time, a Bernoulli chuck or the like is provided as a carry-in member that holds the wafer above the wafer exchange position (or loading position) and stands by, and sucks the upper surface of the wafer into non-contact. It is conceivable to use a carry-in member held by.

However, when the above-mentioned carry-in member that sucks the upper surface of the wafer and holds it in a non-contact manner is used, the position deviation of the wafer may exceed a desired range. Therefore, the wafer is, for example, laterally or laterally before being delivered to the wafer holder. It is conceivable to also employ a holding member that temporarily holds (supports) contact from below. That is, it is conceivable to adopt a system in which the wafer is held by the support device including the carry-in member and the holding member and waits above the loading position.

However, when the wafer is held above the loading position by the support device, the supply of force from a power source such as a power source, a vacuum source, or an air source to the support device causes some factor such as an earthquake or a power failure. If the power is cut off by, the support device may fall due to its own weight and come into contact with the wafer stage or the like. In this case, if the support device supports the wafer, the wafer will be damaged.

U.S. Patent Application Publication No. 2007/0290517

According to the first aspect, the object support device for supporting a plate-shaped object, the object support member for supporting the object, and the first support device capable of supporting the object support member by the supplied force. Provided is an object support device including a second support device capable of supporting the object support member in place of the first support device by stopping the supply of the force to the first support device .

According to the second aspect, an exposure device for exposing a plate-shaped object coated with a sensitive agent with an energy beam, wherein the object support device according to the first aspect of supporting the object and the object are mounted. An exposure device provided with a moving body provided with an object mounting surface on which the object is placed, and the object before exposure is supported by the object supporting device and then mounted on the object mounting surface. Provided.

It is a figure which shows schematic the structure of the exposure apparatus which concerns on 1st Embodiment. FIG. 2 is a plan view showing the wafer stage of FIG. It is a figure which shows the arrangement of the interference meter system, the alignment detection system and the like included in the exposure apparatus of FIG. FIG. 4 (A) is a perspective view schematically showing the configuration of the carry-in unit included in the exposure apparatus of FIG. 1, and FIG. 4 (B) shows a chuck unit forming a part of the carry-in unit provided on the wafer stage. It is a figure which shows together with the center support member. 5 (A) is a view (partial cross-sectional view) for explaining the configuration of the fall prevention device, the weight canceling device, and the Z voice coil motor, and FIGS. 5 (B) and 5 (C) are these. It is a figure for demonstrating operation. FIG. 6A is a perspective view showing the configuration of the wafer support unit, and FIG. 6B is a perspective view showing the configuration of the holding unit included in the wafer support unit. 7 (A) and 7 (B) are diagrams for explaining the configuration of the wafer support unit and diagrams (No. 1 and No. 2) for explaining the operation of the wafer support unit. It is a figure for demonstrating the structure of the wafer support unit, and is the figure which shows a part of the wafer support unit in cross section. 9 (A) to 9 (C) are diagrams (Nos. 1 to 3) for explaining the functions and operations of the rotation limiting unit included in the wafer support unit. It is a block diagram which shows the input / output relation of the main control apparatus which mainly constitutes the control system of the exposure apparatus which concerns on 1st Embodiment. 11 (A) and 11 (B) are diagrams (No. 1 and No. 2) for explaining a wafer loading procedure. 12 (A) and 12 (B) are diagrams (No. 3 and No. 4) for explaining a wafer loading procedure. 13 (A) and 13 (B) are diagrams (No. 5 and No. 6) for explaining a wafer loading procedure. 14 (A) and 14 (B) are views (No. 3 and No. 4) for explaining the operation of the wafer support unit. 15 (A) to 15 (C) show the carry-in unit when, for example, the wafer is sucked from above by a plurality of chuck members and sucked and supported from below by three wafer support units when an earthquake occurs. It is a figure (No. 1, No. 2, No. 3) for explaining the operation. 16 (A) and 16 (B) are diagrams (No. 1 and No. 2) for explaining the operation of the carry-in unit when the wafer is not supported by the wafer support unit at the time of an earthquake. FIG. 17 (A) is a view (cross-sectional view) for explaining the configuration of the weight support device included in the carry-in unit according to the second embodiment, and FIGS. 17 (B) and 17 (C) are weight support devices. It is a figure for demonstrating the operation of. FIG. 18 (A) is a view (cross-sectional view) for explaining the configuration of the modified example 1 of the weight support device, and FIG. 18 (B) is a description of the operation of the weight support device shown in FIG. 18 (A). It is a figure for. FIG. 19 is a diagram for explaining a modification 2 of the weight support device. It is a perspective view which shows the structure of the wafer support unit provided in the exposure apparatus which concerns on 3rd Embodiment. 21 (A) and 21 (B) are diagrams for explaining the configuration of the wafer support unit shown in FIG. 20 and diagrams (No. 1 and No. 2) for explaining the operation of the wafer support unit. is there. It is a figure which shows the part of the wafer support unit shown in FIG. 20 in cross section. It is a block diagram which shows the input / output relation of the main control apparatus which mainly constitutes the control system of the exposure apparatus which concerns on 3rd Embodiment.

<< First Embodiment >>
Hereinafter, the first embodiment will be described with reference to FIGS. 1 to 16.

FIG. 1 schematically shows the configuration of the exposure apparatus 100 according to the first embodiment. The exposure device 100 is a step-and-scan type projection exposure device, a so-called scanner. As will be described later, in the present embodiment, the projection optical system PL is provided, and in the following, the direction parallel to the optical axis AX of the projection optical system PL is the Z-axis direction, and the reticle is in a plane orthogonal to this. The direction in which the wafer and the wafer are relatively scanned is the Y-axis direction, the direction orthogonal to the Z-axis and the Y-axis is the X-axis direction, and the rotation (tilt) directions around the X-axis, Y-axis, and Z-axis are θx and θy, respectively. , And the θz direction.

As shown in FIG. 1, the exposure apparatus 100 includes an exposure unit 200 arranged above the vicinity of the + Y side end of the base plate 12 and a carry-in unit arranged at a predetermined distance from the exposure unit 200 to the −Y side. It includes a transfer system 120 (see FIG. 10) including 121, a wafer stage WST that independently moves two-dimensionally in the XY plane on the base plate 12, and a control system for these. The transport system 120 includes a carry-in unit 121 and a carry-out unit 122 (see FIG. 10).

The base board 12 is supported on the floor F substantially horizontally (parallel to the XY plane) by a plurality of vibration isolation devices (not shown). The base plate 12 is made of a member having a flat plate-like outer shape. In FIG. 1, the wafer W is held on the wafer stage WST (more specifically, the wafer table WTB described later).

The exposure unit 200 includes an illumination system 10, a reticle stage RST, a projection unit PU, and the like.

The illumination system 10 includes a light source, an illuminance uniforming optical system including an optical integrator, a reticle blind, and the like (all not shown), as disclosed in, for example, US Patent Application Publication No. 2003/0025890. Including an illumination optical system having. The illumination system 10 illuminates the slit-shaped illumination region IAR on the reticle R set (restricted) by the reticle blind (also referred to as a masking system) with an illumination light (exposure light) IL with substantially uniform illuminance. Here, as the illumination light IL, ArF excimer laser light (wavelength 193 nm) is used as an example.

On the reticle stage RST, a reticle R having a circuit pattern or the like formed on its pattern surface (lower surface in FIG. 1) is fixed, for example, by vacuum suction. The reticle stage RST can be minutely driven in the XY plane by the reticle stage drive system 11 (not shown in FIG. 1, see FIG. 10) including, for example, a linear motor, and the scanning direction (left-right direction in the paper surface in FIG. 1). It can be driven at a predetermined scanning speed (in the Y-axis direction).

The position information (including rotation information in the θz direction) of the reticle stage RST in the XY plane is a moving mirror 15 (actually) fixed to the reticle stage RST by a reticle laser interferometer (hereinafter referred to as “reticle interferometer”) 13. Is provided with, for example, a Y moving mirror (or a retroreflector) having a reflecting surface orthogonal to the Y-axis direction and an X moving mirror having a reflecting surface orthogonal to the X-axis direction. It is always detected with a resolution of about 25 nm. The measured value of the reticle interferometer 13 is sent to the main control device 20 (not shown in FIG. 1, see FIG. 10).

The projection unit PU is arranged below the reticle stage RST in FIG. The projection unit PU is supported by a main frame BD horizontally arranged above the base plate 12 via a flange portion FLG provided on the outer peripheral portion thereof. As shown in FIGS. 1 and 3, the mainframe BD is composed of a plate member having a hexagonal shape in a plan view (a shape in which two corners of a rectangle are cut off) whose dimensions in the Y-axis direction are larger than those in the X-axis direction. It is supported via a vibration isolator by a plurality of support members (not shown) supported on the floor F.

The projection unit PU includes a lens barrel 40 and a projection optical system PL held in the lens barrel 40. As the projection optical system PL, for example, a refractive optics system composed of a plurality of optical elements (lens elements) arranged along an optical axis AX parallel to the Z axis is used. The projection optical system PL is, for example, bilateral telecentric and has a predetermined projection magnification (for example, 1/4 times, 1/5 times, 1/8 times, etc.). Therefore, when the illumination region IAR on the reticle R is illuminated by the illumination light IL from the illumination system 10, the reticle R is arranged so that the first surface (object surface) of the projection optical system PL and the pattern surface substantially coincide with each other. A reduced image of the circuit pattern of the reticle R in the illumination area IAR (a reduced image of a part of the circuit pattern) is generated by the illumination light IL that has passed through the illumination optical system PL (projection unit PU). It is formed in a region (hereinafter, also referred to as an exposure region) IA conjugated to the illumination region IAR on the wafer W on which a resist (sensitizer) is coated on the surface, which is arranged on the second surface (image plane) side of the above. .. Then, by synchronously driving the reticle stage RST and the wafer stage WST (more correctly, the fine movement stage WFS described later that holds the wafer W), the reticle R is scanned in the scanning direction (Y-axis) with respect to the illumination region IAR (illumination light IL). By moving the wafer W relative to the exposure region IA (illumination light IL) in the scanning direction (Y-axis direction) while moving the wafer W relative to the exposure region IA (illumination light IL), scanning one shot region (partition region) on the wafer W. The exposure is performed and the pattern of the reticle R is transferred to the shot area. That is, in the present embodiment, the pattern of the reticle R is generated on the wafer W by the illumination system 10 and the projection optical system PL, and the pattern of the reticle R is generated on the wafer W by the exposure of the sensitive layer (resist layer) on the wafer W by the illumination light IL. A pattern is formed.

As can be seen from FIG. 1, the wafer stage WST has a coarse movement stage WCS and a fine movement stage WFS that is supported by the coarse movement stage WCS in a non-contact state and can move relative to the coarse movement stage WCS. ..

The coarse-moving stage WCS is a coarse-moving stage drive system 51A including, for example, an electromagnetic force (Lorentz force) drive type flat motor or a linear motor disclosed in US Pat. No. 5,196,745 (Fig.). 10), the motor is driven with a predetermined stroke in the X-axis and Y-axis directions and is slightly driven in the θz direction.

Inside the fine movement stage WFS, although not shown in FIG. 1, it is inserted into a hole (not shown in FIG. 1) formed in a wafer table WTB (and a wafer holder (not shown in FIG. 1, see FIG. 2)), which will be described later, to move up and down. A plurality of movable (for example, three) vertical movement pins 140 (see FIG. 4B) are provided. A suction port (not shown) for vacuum suction is formed on the upper surface of each of the three vertical movement pins 140. Further, the lower end surfaces of the three vertical movement pins 140 are fixed to the upper surface of the pedestal member 141. Each of the three vertical movement pins 140 is arranged at the position of the apex of an equilateral triangle in the plan view of the upper surface of the pedestal member 141. The suction ports formed in each of the three vertical movement pins 140 are connected to a vacuum pump (not shown) via a pipeline formed inside the vertical movement pin 140 (and the pedestal member 141) and a vacuum pipe (not shown). It is communicated. The pedestal member 141 is connected to the drive device 142 via a shaft 143 fixed to the central portion of the lower surface. That is, the three vertical movement pins 140 are driven in the vertical direction by the drive device 142 integrally with the pedestal member 141. In the present embodiment, a wafer center support member (hereinafter, abbreviated as a center support member) capable of supporting a part of the central region of the lower surface of the wafer from below by the pedestal member 141, the three vertical movement pins 140, and the shaft 143. ) 150 is configured. Here, the displacement of the three vertical movement pins 140 (center support member 150) in the Z-axis direction from the reference position is determined by, for example, the displacement sensor 145 of the encoder system or the like provided in the drive device 142 (FIG. 4B). Not shown, see FIG. 10). The main control device 20 drives three vertical movement pins 140 (center support member 150) in the vertical direction via the drive device 142 based on the measured values of the displacement sensor 145.

Further, the fine movement stage WFS is driven by the fine movement stage drive system 52A (see FIG. 10) in six degrees of freedom directions (X-axis, Y-axis, Z-axis, θx, θy and θz directions) with respect to the coarse movement stage WCS. Will be done. The fine movement stage drive system 52A is provided by, for example, a magnet unit (not shown) and a coil unit (not shown), similarly to US Patent Application Publication No. 2010/0073652 and US Patent Application Publication No. 2010/0073653. The fine movement stage WFS is supported in a non-contact state with respect to the coarse movement stage WCS, and is driven in the direction of 6 degrees of freedom in a non-contact state.

The fine movement stage WFS includes a main body portion 81 and a wafer table WTB fixed to the upper surface of the main body portion 81. A wafer W is fixed to the center of the upper surface of the wafer table WTB by vacuum suction or the like via a wafer holder WH having a vacuum chuck (not shown in FIG. 1, see FIG. 2). The wafer holder WH may be formed integrally with the wafer table WTB, but in the present embodiment, the wafer holder WH and the wafer table WTB are separately configured, and the wafer holder WH is fixed on the wafer table WTB by, for example, vacuum suction. .. Instead of the vacuum chuck, the wafer may be electrostatically adsorbed to the wafer holder WH by the electrostatic chuck. As shown in FIG. 2, a measuring plate (also called a reference mark plate) 30 is provided on the upper surface of the wafer table WTB near the end on the + Y side. The measurement plate 30 is provided with the first reference mark FM at the center position corresponding to the center line CL of the wafer table WTB, and the second reference mark RM for pairing reticle alignment sandwiches the first reference mark FM. Is provided.

In the present embodiment, the fine movement stage WFS has a main body 81 and a wafer table WTB. However, for example, even if the fine movement stage drive system 52A described above drives the wafer table WTB without providing the main body 81. good. Further, the fine movement stage WFS need only have a wafer W mounting area on a part of the upper surface thereof, and can be called a holding portion, a table, a movable portion, or the like of the wafer stage WST.

A plurality of (for example, three) reflectors 86 are provided on the wafer table WTB in the vicinity of the wafer holder WH. The three reflectors 86 are arranged close to each other on the outside of the wafer holder WH. One of the three reflectors 86 is located on the center line CL on the −Y side of the wafer holder WH (the position in the 6 o'clock direction with respect to the center of the wafer W in a plan view, that is, the notch of the wafer W faces each other. Position), the remaining two are arranged at positions symmetrical with respect to the center line CL in the 2 o'clock and 10 o'clock directions with respect to the center of the wafer W in a plan view. In FIG. 2, the outer diameter of the wafer holder WH is shown to be larger than the diameter of the wafer W for convenience of explanation, but in reality, the outer diameter of the wafer holder WH is the same as or slightly smaller than the diameter of the wafer W. ..

The −Y end face and the −X end face of the wafer table WTB are mirror-finished, respectively, to form the reflection surface 17a and the reflection surface 17b shown in FIG. As described above, in the present embodiment, the fine movement stage WFS includes the wafer table WTB. Therefore, in the following description, the fine movement stage WFS including the wafer table WTB is also referred to as the wafer table WTB.

The position information of the wafer table WTB (wafer stage WST) is measured by an interferometer system 70 (see FIG. 10) including the Y interferometer 16 shown in FIG.

The interferometer system 70 includes a plurality of interferometers for measuring the position of the wafer table WTB (wafer stage WST), specifically, the Y interferometer 16 and the three X interferometers 136, 137, 138 shown in FIG. Etc. are included. In the present embodiment, as each of the above-mentioned interferometers, except for a part, a multi-axis interferometer having a plurality of length measuring axes is used.

As shown in FIGS. 1 and 3, the Y interferometer 16 is parallel to the Y axis passing through the projection center of the projection optical system PL (optical axis AX, which also coincides with the center of the exposure region IA described above in this embodiment). The reflection surfaces 17a of the wafer table WTB are irradiated with the length measuring beams B4 ₁ and B4 ₂ along the optical paths in the Y-axis direction, which are the same distance from the straight line (hereinafter referred to as the reference axis) LV to the −X side and the + X side, respectively. , Receives each reflected light. Further, the Y interferometer 16 directs the length measuring beam B3 toward the reflection surface 17a along the optical path in the Y axis direction which is separated from the length measuring beams B4 ₁ and B4 _{2 in the} −Z direction and passes on the reference axis LV. It irradiates and receives the length measuring beam B3 reflected by the reflecting surface 17a.

The X-interferometer 136 is a length-measuring beam B5 along an optical path in the X-axis direction that is the same distance + Y side and −Y side away from the straight line (reference axis) LH in the X-axis direction passing through the optical axis of the projection optical system PL. Reflection of three X-axis direction length-measurement beams including length-measurement beams ₁ , B5 ₂ , and length-measurement beams B5 ₁ or B5 ₂ along the X-axis direction optical path separated by −Z direction from the wafer table WTB. The surface 17b is irradiated and each reflected light is received.

The X interferometer 137 wafers a length measuring beam B6 and a length measuring beam passing through an optical path on the −Z side of the length measuring beam B6 along a straight line LA parallel to the X axis passing through the detection center of the alignment detection system ALG described later. The reflecting surface 17b of the table WTB is irradiated, and each reflected light is received.

The X interferometer 138 irradiates the reflecting surface 17b of the wafer table WTB with the length measuring beam B7 along a straight line LUL parallel to the X axis passing through the loading position LP where the wafer is loaded, and receives the reflected light.

The measured values (results of position measurement) of each interferometer of the interferometer system 70 are supplied to the main control device 20 (see FIG. 10). The main control device 20 obtains position information regarding the Y-axis direction, the θx direction, and the θz direction of the wafer table WTB based on the measured values of the Y interferometer 16. Further, the main control device 20 obtains position information regarding the X-axis direction of the wafer table WTB based on the measured values of any of the X interferometers 136, 137 and 138. Further, the main control device 20 obtains the position information regarding the θy direction of the wafer table WTB based on the measured value of the X interferometer 136. The main control device 20 may obtain the position information regarding the θz direction of the wafer table WTB based on the measured value of the X interference meter 136.

In addition, the interferometer system 70 transmits a pair of length-measuring beams parallel to the Y-axis separated in the Z-axis direction to a pair of upper and lower moving mirrors (not shown) fixed to the side surface on the −Y side of the coarse motion stage WCS. A pair of fixed mirrors (not shown) are irradiated through the reflective surfaces of the above, and the return light from the pair of fixed mirrors via the reflective surfaces is received, the same distance from the reference axis LV-X side, + X side. A pair of Z interferometers arranged apart from each other may be provided. Based on the measured values of the pair of Z interferometers, the main control device 20 can obtain the position information of the wafer stage WST with respect to at least three degrees of freedom directions including the Z-axis, θy, and θz directions.

A detailed configuration of the interferometer system 70 and an example of details of the measurement method are disclosed in detail in, for example, US Patent Application Publication No. 2008/01067222.

Although the interferometer system is used in this embodiment to measure the position of the wafer table WTB (wafer stage WST), another means may be used. For example, encoder systems such as those described in US Patent Application Publication No. 2010/0297562 can also be used.

Further, in the exposure apparatus 100, as shown in FIG. 1, an alignment detection system ALG for detecting the first reference mark FM and the alignment mark on the wafer W is provided on the side surface of the lower end portion of the lens barrel 40 of the projection unit PU. ing. The alignment detection system ALG is, for example, an image of the target mark imaged on the light receiving surface by irradiating the target mark with a broadband detection light beam that does not expose the resist on the wafer to light reflected from the target mark and not shown. FIA (Field Image Alignment), an image processing method that captures an image of an index (index pattern on an index plate provided in each alignment system) using an image sensor (CCD, etc.) and outputs those imaged signals. The system is used. The image pickup signal from the alignment detection system ALG is supplied to the main control device 20 (see FIG. 10).

In addition, instead of the alignment detection system ALG, for example, an alignment device including five alignment systems disclosed in US Patent Application Publication No. 2009/02333234 may be provided.

In addition, the exposure apparatus 100 has a multipoint focal position having an irradiation system 54a that irradiates the surface of the wafer W with a plurality of measurement beams and a light receiving system 54b that receives each reflected beam in the vicinity of the projection optical system PL. A detection system (hereinafter referred to as a multipoint AF system) 54 (see FIG. 10) is provided. The detailed configuration of the multipoint AF system 54 is disclosed in, for example, US Pat. No. 5,448,332.

Although not shown in FIG. 1, the projection optics of a pair of reticle alignment marks on the reticle R and a pair of second reference marks RM on the measurement plate 30 on the corresponding wafer table WTB are above the reticle R. A pair of TTR (Through The Reticle) type reticle alignment detection systems 14 (see FIG. 10) using light having an exposure wavelength for simultaneously observing an image via the system PL are arranged. The detection signal of the pair of reticle alignment detection systems 14 is supplied to the main control device 20.

Next, the transport system 120 (see FIG. 10) will be described. The carry-in unit 121 (see FIG. 1), which forms part of the transport system 120, holds the unexposed wafer above the loading position LP prior to loading it onto the wafer table WTB and onto the wafer table WTB. It is for loading. The unloading unit 122 (see FIG. 10), which forms a part of the transport system 120, is for unloading the exposed wafer from the wafer table WTB.

As shown in FIGS. 3 and 4A, the carry-in unit 121 includes a chuck unit 153 that sucks the wafer W from above in a non-contact manner, and a plurality of, for example, three Z voice coils that drive the chuck unit 153 in the vertical direction. It includes a base member 22 and the like on which a plurality of motors 144 and a plurality of chuck units 153 that support at least a part of their own weight, for example, two weight canceling devices 131 and the like are mounted. The base member 22 is suspended and supported by a main frame BD (see FIG. 1) via a support member (not shown) and a vibration isolator (neither shown) connected to both ends in the longitudinal direction (X-axis direction). ing. Each configuration will be described in detail below.

As shown in FIGS. 4A and 4B, the chuck unit 153 has, for example, a pair of overhanging portions 44a and 44b at both ends in the longitudinal direction (X-axis direction) in a plan view (viewed from above). It is provided with a substantially circular plate member (plate) 44 having a predetermined thickness, and a plurality of chuck members 124 and the like embedded in the lower surface of the plate member 44 in a predetermined arrangement. The chuck unit 153 according to the present embodiment further includes three wafer support units 125, which will be described later, housed in three stepped openings 25 having steps inside, which are formed in the plate member 44 at intervals of 120 °. It has.

The plate member 44 is provided with a pipe or the like inside, and also serves as a cool plate for controlling the temperature of the wafer to a predetermined temperature by flowing a liquid whose temperature has been adjusted to a predetermined temperature in the pipe. However, the plate member 44 does not necessarily have to also serve as a cool plate.

As shown in FIG. 4A, the above-mentioned base member 22 is made of a plate member having a notch portion 22a having a shape corresponding to the shape of the plate member 44. That is, the plate member 44 is arranged so as to face the cutout portion 22a of the base member 22 via a predetermined gap (gap, clearance).

The plate member 44 is formed with a plurality of through holes (not shown) at positions that do not interfere with the plurality of chuck members 124. Further, as shown in FIG. 4A, the plate member 44 has a position in the 6 o'clock direction and a position in the 2 o'clock direction with respect to the center located on the reference axis LV in a plan view, and 10 o'clock. Stepped openings 25 are formed at positions in the direction of the above. At least a part of the wafer support unit 125, which will be described later, is housed in each stepped opening 25. The arrangement and number of the stepped openings 25 (wafer support unit 125) are not limited to this.

A so-called Bernoulli chuck (Bernoulli cup) is used as each chuck member 124. The Bernoulli chuck is a chuck that uses the Bernoulli effect to locally increase the flow velocity of the ejected fluid (for example, air) to suck (hold the object in a non-contact manner). Here, the Bernoulli effect means that the pressure of the fluid decreases as the flow velocity increases, and in the Bernoulli chuck, suction is performed by the weight of the object to be sucked (held and fixed) and the flow velocity of the fluid ejected from the chuck. The state (holding / floating state) is determined. That is, when the size of the object is known, the size of the gap between the chuck and the object to be held at the time of suction is determined according to the flow velocity of the fluid ejected from the chuck. In the present embodiment, the chuck member 124 is used to generate a gas flow (gas flow) around the wafer W and suck the wafer W. By appropriately adjusting the degree of suction force (suction force), the wafer W can be sucked by the plurality of chuck members 124 to limit the movement in the Z-axis direction, θx and θy directions.

The suction force of each chuck member 124 is the flow velocity, the flow rate, and the direction of ejection (gas ejection) of the gas flow ejected from each chuck member 124 by the main control device 20 via the adjusting device 115 (see FIG. 10). By controlling at least one such as (direction), it is possible to individually set an arbitrary value. The plurality of chuck members 124 may be configured so that the suction force can be set for each predetermined group. The main control device 20 may control the temperature of the gas.

As will be described later, when the wafer W is sucked by the chuck member 124, the fluid (for example, air) ejected from the chuck member 124 toward the wafer W passes through a through hole (not shown) formed in the plate member 44. Is discharged to the outside (above the chuck unit 153).

As described above, in the present embodiment, the chuck member 124 generates an attractive force by using a gas (for example, compressed air) supplied as a force. As the compressed air, clean air is supplied in which the temperature is adjusted to at least constant and dust, particles and the like are removed. As a result, the wafer W sucked by the chuck member 124 is kept at a predetermined temperature by the temperature-controlled compressed air. Further, the temperature, cleanliness, etc. of the space in which the wafer stage WST or the like is arranged can be kept within the set range.

Further, the plate member 44, a long and a rod-like member and a short bar-shaped member formed by combining in an L-shape, a plurality support members 24 _1, 24 _2, 24 ₃ one end of each of (three in this case) Is connected.

Three support members 24 _1, 24 _2, each of the 24 _3, one end is an end portion of the shorter member ones of the L-shaped member is fixed to the upper surface of the plate member 44. As shown in FIG. 4A, one end of each of the _two support members 24 ₁ and 24 ₂ is located at a predetermined position on the upper surface of the overhanging portions 44a and 44b of the plate member 44, here on the reference axis LV in a plan view. It is fixed at positions in the 3 o'clock and 9 o'clock directions with respect to the center of the plate member 44 to be located. One end of the remaining support members 24 _3, somewhat than stepped opening 25 in a direction of the position of 6 o'clock with respect to the center of the plate member 44 (corresponding to the reference axis LV position) in a plan view It is fixed at the position on the + Y side.

Three support members _{24 1,} 24 2, 24 of the _three, each of the two support members ₂₄ 1, 24 _2, longer members of the L-shaped member is arranged along the X-axis direction, the weight It is supported from below by the canceling device 131 and is connected to the Z voice coil motor 144. As shown in FIG. 4A, the Z voice coil motor 144 is arranged outside the weight canceling device 131 when viewed from above. Further, a pair of fall prevention devices 55 are arranged below each of the _two support members 24 ₁ and 242 and outside the Z voice coil motor 144, respectively. The fall prevention device 55 provides support members 24 ₁ , 24 when power is no longer supplied to the weight canceling device 131, the voice coil motor 144, the wafer support unit 125, etc. from the power supply, air source, vacuum source, or the like. _The purpose is to support the own weight of the chuck unit 153 via ₂ and prevent the chuck unit 153 from falling (unnecessary descent). Conical recesses 48 are formed on the lower surfaces of the _two support members 24 ₁ and 242 at positions corresponding to the support pins 59, which will be described later, which form a part of the fall prevention device 55 (FIG. 5 (A). )reference). The larger dimension remainder of the support member 24 ₃ is arranged along a direction inclined at a predetermined angle with respect to the X-axis and Y-axis, the lower surface of the other end portion of the side is connected to the Z voice coil motors 144 .. The details of the configuration of the fall prevention device 55 will be described later.

Each of the two weight canceling devices 131 is a kind of air spring device, for example, as shown in FIG. 5A, and includes a piston member 133a and a cylinder 133b in which the piston member 133a is slidably provided. ing. The pressure in the space inside the cylinder partitioned by the piston of the piston member 133a and the cylinder 133b is the chuck unit 153 (plate member 44, the plurality of chuck members 124 and the three wafer support units 125 described later), and the support member 24 _1. It is set to a value corresponding to the self-weight of 24 _3. Thus, the two weight cancellation device 131, applying a force upward (+ Z direction) relative to the support member ₂₄ 1, 24 _2, and supports the weight of the chuck unit 153 (or a portion thereof). The pressure and amount of gas supplied to the inside of the cylinder 133b of the weight canceling device 131 are controlled by the main control device 20 (see FIG. 10). Here, since the weight canceling device 131 includes a piston member 133a that moves in the vertical direction along the cylinder 133b, it also serves as a guide when the chuck unit 153 moves up and down. Thus, in the present embodiment, the weight cancellation device 131, a force with a gas (compressed air) supplied to the internal cylinder 133b, support the weight of the chuck unit 153 and the support member ₂₄ 1-24 ₃ It is occurring.

Each of the three Z-voice coil motors 144 has a chuck unit 153 with a predetermined stroke in the vertical direction (a first position (position shown in FIG. 5A) at which the chuck unit 153 starts sucking the wafer W). The wafer W sucked by the chuck unit 153 is moved within a range including the second position (position shown in FIG. 5B) on which the wafer W is placed on the wafer holder WH (wafer table WTB). Z voice coil motor 144 Has a coil and a magnet (both not shown), and uses a Lorentz force generated by applying a current (power) supplied as a force from a power source or the like to the coil as a driving force. Of the three Z voice coil motors 144, the Z voice coil motor 144 connected to the support member 243 is mainly used for attitude control (attitude control in the θx direction) of the chuck unit 153, and the _three Z voice coil motors 144. Each of the voice coil motors 144 is controlled by the main controller 20 (see FIG. 10).

As shown in FIGS. 5A to 5C, each of the pair of fall prevention devices 55 has a housing (cylinder) 56 made of a hollow cylindrical member and a housing 56 along the inner peripheral surface of the housing 56. It includes a vertically moving member 60 that moves up and down, and a compression coil spring (compression spring) 58 that is arranged between the vertically moving member 60 and the bottom wall of the housing 56. The vertical movement member 60 includes a piston member 57 whose outer peripheral surface is in contact with the inner peripheral surface of the housing 56 and divides the inside of the housing 56 into two upper and lower spaces, and a support pin 59 fixed to the upper surface of the piston member 57. Has.

A through hole 47 is formed in the upper wall (top plate) of the housing 56, and a supply port 46 is formed at a position near the upper end of the peripheral wall. A gas supply device 108 (see FIG. 10) is connected to the supply port 46 via a gas supply pipe (not shown). Compressed air from the gas supply device 108 passes through a gas supply pipe and a supply port 46 (not shown) in the upper space (hereinafter referred to as an air chamber) 42 partitioned by the piston member 57 inside the housing 56. Be supplied. The flow rate of compressed air supplied from the gas supply device 108 is controlled by the main control device 20 (see FIG. 10), and at least the wafer W is carried into the exposure device 100 from an external device (exposure operation is performed). In the state of being performed), the pressure inside the air chamber 42 is always a predetermined pressure. Atmospheric pressure air may be supplied to the gas supply device 108 instead of compressed air. In that case, compressed air may be generated by compressing the supplied air with a compressor or the like.

The piston member 57 includes a cylindrical portion 57a whose upper end is closed and whose lower end is open, and a flange portion 57b made of an annular plate member provided around the lower end portion of the cylindrical portion 57a. The piston member 57 is housed inside the housing 56 in a state where the outer peripheral surface of the flange portion 57b is in contact with the inner peripheral surface of the housing 56. The inside of the housing 56 is divided into an upper air chamber 42 and a lower chamber 43 by a piston member 57. Then, compressed air is supplied into the air chamber 42 from the supply port 46, and the air pressure inside the air chamber 42 is maintained at a predetermined pressure higher than that outside the air chamber 42 (particularly the chamber 43). A seal member such as an O-ring may be provided on the outer peripheral surface of the piston member 57 so that compressed air does not flow from the air chamber 42 into the chamber 43.

The lower end of the compression spring 58 is fixed to the upper surface of the bottom wall of the housing 56, and the upper end is connected to the upper wall of the cylindrical portion of the piston member 57. That is, the compression spring 58 is arranged in the room 43. As described above, the inside of the air chamber 42 is maintained in a higher pressure state than the chamber 43 by the compressed air supplied from the gas supply device 108. In this case, the downward force acting on the piston member 57 due to the differential pressure is set to be larger than the upward force acting on the piston member 57 due to the elastic force generated by the compression spring 58. Therefore, the piston member 57 is maintained in a state of being pushed downward by the pressure of the compressed air. That is, the compression spring 58 is pushed down by the piston member 57 and is housed in the room 43 while holding a force for driving the piston member 57 upward, that is, an upward urging force (in this case, an elastic force). ..

The support pin 59 is made of a cylindrical member having a conical convex portion at the upper portion, and is fixed to the upper end surface of the piston member 57. Further, the support pin 59 is inserted into the through hole 47 formed in the housing 56 through a predetermined gap, for example, a gap of about several μm, and the compression spring 58 is contracted by the compressed air from the gas supply device 108. When in the state, a part of the upper end portion is exposed to the outside of the housing 56 from the through hole 47. Hereinafter, the position of the support pin 59 in the state where the compression spring 58 is contracted is referred to as a standby position. Incidentally, as shown in FIG. 5 (B), in a state in which the support pin 59 is located at the standby position, the chuck unit 153 by Z voice coil motor 144 and the second position (the support member ₂₄ 2 (24 ₁₎ and the support pin also 59 and is a case where it is driven to a position) to the closest, and the support pin 59, a non-contact state is maintained between the support member 24 2 _{(24 1).} As described above, in the present embodiment, each of the fall prevention devices 55 has the support pin 59 and the support member 24 due to the downward force generated by using the gas (compressed air) supplied into the air chamber 42. ₂ and to maintain the non-contact state with the (24 _1).

When the supply of compressed air from the gas supply device 108 is stopped in the state shown in FIG. 5 (B), the pressure inside the air chamber 42 becomes almost the same as the pressure (atmospheric pressure) outside (room 43). .. As a result, as shown in FIG. 5C, the vertical movement member 60 is driven upward by the urging force of the compression spring 58. When vertical movement member 60 is driven upward, the convex portion of the support pin 59 the upper end to the recess formed 48 in the middle in the support member 24 2 of the drive _{(24 1)} is fitted (contact). Then, for example, when the Z-boil coil motor 144 does not generate a driving force or the driving force generated is smaller than the urging force of the compression spring 58, the vertical moving member 60 is further driven upward. , the support member ₂₄ 2 (24 ₁₎ by the support pin 59 is moved upwardly, it is maintained at the first position or the vicinity thereof described above. Incidentally, fall blocking device 55, and respectively opposed to the support member ₂₄ 1, 24 _2, are provided one by one. In this case, the length and spring constant, etc. of the compression spring 58, the two support pins 59 of the two fall blocking device 55, via respective support members 24 _1, 24 _2, a plurality of chuck members 124 are embedded plate member 44, and the entire chuck unit 153 and the three support members _{24 1,} 24 2, 24 ₃ comprising three wafer support unit 125 to be described later housed respectively three stepped openings 25 of the plate member 44 , The first position or its vicinity (slightly higher position) can be supported. Therefore, for example, even if the Z-boil coil motor 144 does not generate a driving force, the chuck unit 153 is prevented from moving downward due to its own weight.

Even when the supply of compressed air from the gas supply device 108 is stopped in the state shown in FIG. 5 (A), the two vertical movement members 60 of the pair of fall prevention devices 55 are the compression spring 58 in the same manner as described above. It is driven upward by the urging force of. Then, for example, when the Z-boil coil motor 144 does not generate a driving force or the driving force generated is smaller than the urging force of the compression spring 58, the two supports are supported as in FIG. 5C. The pin 59 positions the chuck unit 153 at or near the first position. At this time, the entire chuck unit 153 is supported by the pair of fall prevention devices 55.

As described above, in the present embodiment, each of the fall prevention devices 55 has an urging force (elastic force) of the compression spring 58 when gas (compressed air) is not supplied to the air chamber 42 or even if gas is supplied. If only a small force than that can not be generated, a support pin 59 by the elastic force, the supporting member 24 2 generates an upward force that contacting _{(24 1)} and. Then, for example, when the Z-boil coil motor 144 does not generate a driving force or the driving force generated is smaller than the urging force of the compression spring 58, the chuck unit 153 and the three support members 24 ₁ , 24 _2, 24 ₃ the whole, so that it is possible to first position or by positioning near the support at that position.

Hereinafter, the position of the support pin 59 in the state where the compression spring 58 is located at the upper limit position of movement is referred to as a retracted position. Here, the dimensions, spring constant, and the like of each member of the fall prevention device 55 are determined so that the retracted position is equal to or higher than the first position of the chuck unit 153, for example, by several mm.

As described above, the three wafer support units 125 are individually housed in the three stepped openings 25 formed in the plate member 44 (see FIGS. 4 (A) and 4 (B)). FIG. 4B shows a state in which a part of the holding portion described later that supports the wafer W is exposed from the lower surface of the plate member 44.

Since the three wafer support units 125 have the same configuration except that they are arranged differently, in the following, the wafer support housed in the stepped opening 25 located in the −Y direction with respect to the center of the plate member 44. The unit 125 will be described as a representative example.

Wafer support unit 125, as shown in FIG. 6 (A), a plate member 62, the flat plate member 62 in the longitudinal direction are arranged at predetermined intervals the two bearing members ₆₆ 1 on, and 66 _2, the two bearing member 66 _1, 66 a holding unit 72 which is rotatably supported by _two, the rotary motor 68 connected via a coupling 64 to a holding unit 72, rotation limiting unit for limiting the rotation of the holding unit 72 It is equipped with 152.

The flat plate member 62 is made of a thin plate-shaped member, and a rectangular opening 63 is formed in the central portion. The flat plate member 62 is fixed to the stepped portion of the stepped opening 25 of the plate member 44 by, for example, bolting, in a state where the thin plate-shaped member is substantially parallel to the XY plane.

1 two bearing members _66, 66 ₂ are each made of a rectangular parallelepiped member, + bearing member 66 ₁ positioned X side, compared with the bearing member 66 ₂ located on the -X side, somewhat longer in the X-axis direction. The two bearing members 66 ₁ and 66 ₂ are arranged so as to sandwich the opening 63 formed in the flat plate member 62 in the X-axis direction, and are fixed to the upper surface of the flat plate member 62 by, for example, bolting. Has been done. As shown in FIG. 8, the one bearing member 66 _1, leading to the end surface of the -X side from the end surface on the + X side, a circular through-hole 80 ₁ is formed. Similarly, the other bearing member 66 _2, + from X side end surface of the lead to the end surface of the -X side, circular through-hole 80 ₂ of the same diameter through-hole 80 ₁ concentrically it is formed.

Holding unit 72, as shown removed in FIG. 6 (B) having three parts which are arranged along the longitudinal direction (X axis direction), i.e., the shaft portion 73 _1, 73 ₂ and the holding portion 74. More specifically, the holding portion 74 is provided in the center of the holding unit 72 in the longitudinal direction (X-axis direction), and two shaft portions (shaft portions) concentric and having the same diameter on one end surface and the other end surface in the longitudinal direction of the holding unit 74. ) ₇₃ 1, 73 ₂ in the longitudinal end surface of the is fixed. Holding unit 72, as shown in FIG. 8, the shaft portion 73 ₁ is inserted into the bearing member 66 ₁ of the through-hole 80 _1, the shaft portion 73 _2, the bearing member 66 _{and second} through-holes 80 in the ₂ It has been inserted. That is, the holding unit 72 is rotatably supported in a parallel rotational axis thus by two bearing members 66 _1, 66 ₂ in the X-axis direction. The holding unit 72 will be described in more detail later, including the configuration of the holding portion 74.

On one of the bearing members 66 _1, as shown in FIG. 8, the through-holes 80 in the upper part of the _1, three conduits 81 ₁ for communicating the interior of the outer and the through-hole 80 ₁ of the bearing member 66 ₁ to 81 ₃ are formed spaced apart in the X-axis direction. Further, the other bearing member 66 _2, in the upper portion of the through-hole 80 _2, line 84 for communicating the interior of the bearing member 66 ₂ externally of the through-hole 80 ₂ is formed.

Of the three conduits 81 _{1-81 3} bearing member 66 _1, pipe 81 ₁ which is positioned on the most + X side through the gas supply pipe (not shown), a predetermined gas, for example gas supply compressed air It is connected to the supply device 102. The flow rate of compressed air supplied from the gas supply device 102 and the like are controlled by the main control device 20 (see FIG. 10). The through-hole 80 ₁ of the bearing member 66 _1, the inner diameter of the + X half is larger than the other portions. That is, the through-hole 80 _1, a circular opening stepped. The large diameter portion of the through-hole 80 _1, i.e. on the inner peripheral surface of the + X half of the bearing member 66 _1, the cylindrical porous member 82 is arranged, the inner peripheral surface of the porous member 82, through holes 80 ₁ It is on the same side as the other parts. Compressed air supplied from the gas supply device 102 via line ₈₁₁ flows into the porous member 82, from the porous member 82, the facing surfaces throughout the porous member 82 and the shaft portion 73 ₁ towards being sprayed, the static pressure of the blown compressed air, between the porous member 82 and the shaft portion 73 _1, a predetermined clearance (gap clearance), for example, several μm order of gap is formed ing. That is, the static pressure air bearing (air bearing) is arranged between the + X side end portion of the bearing member 66 ₁ and a shaft portion 73 _1.

Of the three conduits ₈₁ 1-81 ₃ bearing member 66 _1, the conduit 81 ₃ positioned on the most -X side, the -X side end of the bearing member 66 ₁ (-X side of the pipe 81 ₂₎ Is formed in. Line 81 ₃ is connected to a vacuum pump 104 via a vacuum pipe (not shown). The vacuum pump 104 is controlled by the main control device 20 (see FIG. 10).

Of the three conduits ₈₁ 1-81 ₃ bearing member 66 _1, pipe 81 ₂ located in the middle was placed on the bearing member 66 ₁ of the through hole 80 in the _first porous member 82 from the -X side It is formed at the position. The surface facing the shaft portion 73 ₁ of the bearing member 66 ₁ (inner peripheral surface), the portion pipe 81 ₂ is provided, all the recesses 83 over the circumference are formed, thereby, the bearing member 66 ₁ shaft portion 73 ₁ a cylindrical between the (annular) space (hereinafter, referred to as space 83 by using the same reference numerals as convenience recess 83) are formed. Then, the space 83 is communicated with the outer space of the bearing member 66 ₁ via line 81 _2. In other words, conduit 81 ₂ functions as air opening. Therefore, even if a vacuum pump 104 is in operation, is supplied from the gas supply device 102 described above, is ejected between the porous member 82 and the shaft portion 73 _1, the compressed air flowing in the -X side , flows into the space 83 is discharged to the outside (outer space of the bearing member 66 ₁₎ through line 81 _2. Therefore, the compressed air hardly flows into the −X side from the recess 83.

Conduit 84 is formed in a central portion of the bearing member 66 _{and second} longitudinal (X-axis direction). The pipeline 84 is connected to a gas supply device 106 (see FIG. 10) that supplies a predetermined gas, for example, compressed air, via a gas supply pipe (not shown). The inner peripheral surface of the bearing member 66 ₂ (the surface facing the shaft portion 73 _2), a cylindrical porous member 85 is disposed over the X-axis direction the entire region of the bearing member 66 _2. That is, between the bearing member 66 ₂ and the shaft portion 73 _2, the same hydrostatic air bearing and configured aerostatic bearing (air bearing) between the bearing member 66 ₁ and the shaft portion 73 ₁ is configured Has been done. The flow rate of compressed air supplied from the gas supply device 106 is controlled by the main control device 20 (see FIG. 10).

Returning to the description of the holding unit 72, the holding portion 74 of the holding unit 72 has a main body portion 74a having a U-shaped plan view, and FIGS. 4 (B) and 7 (B), as shown in FIG. 6 (B). ) And the like, it has an L-shaped wafer support portion 74b that protrudes downward from the opening 63 of the flat plate member 62 when it is located at a support position for supporting the wafer W.

The holding unit 72 has at least a position in which the wafer W is supported by the wafer support portion 74b of the holding portion 74 (that is, the above-mentioned support position) shown in FIG. 7 (B) and a support shown in FIG. 7 (A). shaft portion 73 1 from _position 73 ₂ rotated 90 degrees to the plane in clockwise as a rotation axis, the position of the wafer support portion 74b and the wafer W is spaced (hereinafter, referred to as separated position) between the rotation motor Driven by 68.

As shown in FIG. 6B, the main body portion 74a is located at the center of the bottom surface of the U-shaped portion (the surface parallel to the XZ plane when the holding unit 72 (holding portion 74) is located at the support position). A rectangular opening is formed.

As shown in FIG. 7B, the wafer support portion 74b has a support surface (wafer support surface) that supports the wafer when the holding unit 72 (holding portion 74) is located at the support position. A suction portion 78 for sucking the wafer W is provided at the + X side end of the wafer support surface provided on the side half portion. An opening 78a is formed in the center of the suction portion 78, and one end of a pipeline 91 formed inside the wafer support portion 74b and the main body portion 74a communicates with the opening 78a. Conduit 91, as shown in FIG. 8, the other end is in communication with the conduit 92 extending in the X-axis direction, which is formed inside the shaft portion 73 _1.

The shaft portion 73 _1, the holding unit 72, when located in the supporting position, the conduit 81 ₃ opposite to the position, is conduit 93 which communicates with the outside of the conduit 92 and the shaft portion 73 ₁ is formed There is. Therefore, the holding unit 72, when positioned in the support position, conduit 93 communicates with the conduit 81 _3. That is, the holding unit 72 when positioned in the support position, passage connecting the opening 78a formed with an external pipe 81 ₃ (i.e. vacuum pump 104) to the wafer support portion 74b (flow passage) is formed. In this state, when the wafer W is supported on the wafer support surface (upper surface of the suction portion 78) of the wafer support portion 74b and the vacuum pump 104 is operated by the main control device 20, negative pressure is exerted in the pipeline 92 and the pipeline 91. In the (vacuum) state, the wafer W is sucked and held by the suction portion 78 of the wafer support portion 74b.

Here, the position of the holding unit 72 is non-support position, for example when located apart position, and a conduit 81 ₃ and the flow path 93 does not communicate, the vacuum pump 104 is operated by the main controller 20 However, suction by the suction unit 78 is not performed.

Rotary motor 68 is fixed on the flat plate member 62, and is connected via a coupling 64 to the shaft portion 73 ₂ of the -X end of the holding unit 72. As the rotary motor 68, a brushless type DC motor is used as an example. The rotary motor 68 is provided with an absolute position detection type sensor that detects the rotation angle (position in the rotation direction) of the rotation shaft, and an absolute encoder 101 (see FIG. 10) as an example. The main control device 20 (see FIG. 10) places the holding unit 72 based on the measured value (rotation angle of the rotation axis of the rotation motor 68 (position in the rotation direction (absolute position))) supplied from the absolute encoder 101. It is driven by a fixed amount of rotation to position the wafer support portion 74b at a predetermined position. Not limited to this, a posture holding mechanism of the holding unit including, for example, a magnet and a magnetic material, which maintains the holding unit 72 in a state where it is located at a support position and a state where it is located at a separated position, is separately provided. Is also good. In such a case, since it is sufficient to turn on the absolute encoder 101 and the rotary motor 68 only when necessary, it is suitable for suppressing the heat generated when the absolute encoder 101 and the rotary motor 68 are driven. In this case, when driving the holding unit 72, a rotational force that overcomes the magnetic force acting between the magnet and the magnetic body may be generated from the rotary motor 68. As described above, in the present embodiment, the rotary motor 68 uses the current (electric power) supplied as a force from the power source or the like to generate a driving force for positioning the wafer support portion 74b at a predetermined position.

Although the explanation is back and forth, as shown in FIG. 6B, the wafer support portion 74b has a reflector at the center of the surface (wafer support surface) that becomes the upper surface when the holding unit 72 is positioned at the support position. 79 is provided. In the present embodiment, one reflector 79 is provided for each of the three wafer support units 125, and 3 for detecting the position of the edge of the wafer with respect to each of the three reflectors 79. A measurement system 123 (see FIG. 10) including one edge position detection system is provided.

Each edge position detection system constituting the measurement system 123 includes, for example, an illumination light source, an optical path bending member such as a plurality of reflectors, a lens, and an image pickup element such as a CCD, and illuminates the reflector 79 from above. An epireflector lighting method capable of irradiating light can be used. When the edge detection of the wafer W is performed by the measurement system 123, those imaging signals are sent to the signal processing system 116 (see FIG. 10).

As shown in FIG. 6A, the rotation limiting unit 152 is arranged at the −Y side end portion (−Y side of the above-mentioned holding unit 72 or the like) on the upper surface of the flat plate member 62. Rotation limiting unit 152, as shown in FIG. 6 (A) and FIG. 9 (A) or the like, extends in the X-axis direction from the + X end of the plate member 62 to the vicinity of a position opposite to the bearing member 66 ₂ The guide member 31, the air cylinder 32 fixed to the upper surface of the guide member 31, and the tip (+ X side end) of the piston rod of the air cylinder 32 are fixed and driven in the X-axis direction by the air cylinder 32 along the guide member 31. The flat plate member 33, the rod-shaped member 34 fixed to the −X side surface of the flat plate member 33 and the rectangular member 35 fixed to the tip, and the elastic body (elastic member) that constantly urges the flat plate member 33 in the −X direction, for example. A compression spring (compression coil spring) 36 is provided. As the material of the rectangular member 35, a material having a high coefficient of static friction between the holding portion 74 and the main body portion 74a is desirable. Therefore, the material of the rectangular member 35 may be determined according to the material of the main body portion 74a.

The control of the air cylinder 32 (control of the pressure in the space inside the cylinder partitioned by the cylinder constituting the air cylinder and the piston sliding inside the air cylinder) is performed by the main control device 20.

The compression spring 36 is provided between the flat plate member 33 and the fixing portion 37 fixed to the + X side end portion on the upper surface of the flat plate member 62. When the holding units 72 of the three wafer support units 125 are in the wafer support position, the air cylinder 32 is controlled by the main control device 20 (see FIG. 10) to resist the urging force in the −X direction due to the elastic force of the compression spring 36. Then, the flat plate member 33 is driven in the + X direction, and the rectangular member 35 stands by at a standby position located on the + X side of the holding portion 74 in the X-axis direction (see FIG. 9A). As described above, in the present embodiment, each of the rotation limiting units 152 is oriented toward + X in the force generated by using the gas (compressed air) supplied to the air cylinder as a force (in FIG. 9A). The force) keeps the rectangular member 35 and the main body 74a in a non-contact state.

When the holding unit 72 of each of the three wafer support units 125 is in the support position and the rectangular member 35 is in the standby position, the supply of compressed air (pressurized air) into the air cylinder 32 is stopped for some reason (pressurized air). Alternatively, when the supply of the force to the wafer support unit 125 is stopped), as shown in FIG. 9B, the flat plate member 33, the rod-shaped member 34, and the rectangular member 35 are moved in the −X direction by the urging force of the compression spring 36. It is driven and the surface of the rectangular member 35 on the −X side comes into contact (pressure contact) with the surface of the main body 74a on the + X side. Then, for example, in a state where the rotary motor 68 does not generate a driving force or in a state where the driving force generated is smaller than the urging force of the compression spring 36 and the frictional force between the rectangular member 35 and the main body 74a. Due to the frictional force, each holding unit 72 can be maintained in the supporting position. Therefore, when the wafer W is supported (held) by the three wafer support units 125, the supported state can be maintained at the supported position (position in the rotation direction).

On the other hand, when the holding units 72 of the three wafer support units 125 are in the separated positions and the rectangular member 35 is in the standby position, the supply of compressed air into the air cylinder 32 is stopped (or the wafer is supported) for some reason. When the supply of the force to the unit 125 is stopped), the flat plate member 33, the rod-shaped member 34, and the rectangular member 35 are driven in the −X direction by the urging force of the compression spring 36. At this time, the rectangular member 35 does not come into contact with the surface of the main body portion 74a on the + X side, and as shown in FIG. 9C, the rod-shaped member 34 and the rectangular member 35 are the wafer support portion 74b and the main body portion 74a. It is inserted between and. The position of the rectangular member 35 at this time is referred to as a lock position. In the state shown in FIG. 9C, the rectangular member 35 is in the locked position, and the rod-shaped member 34 and the rectangular member 35 are in contact with the surface (wafer support surface) of the wafer support portion 74b where the suction portion 78 is provided. There is. Then, this state is maintained by the elastic force of the compression spring 36. As a result, it is possible to prevent the holding unit 72 from inadvertently rotating and maintain the state of being positioned at a predetermined rotation position.

The carry-in unit 121 further includes a chuck unit position detection system 148 that detects the positions of the chuck unit 153 in each of the Z-axis, θx, and θy directions (see FIG. 10). The chuck unit position detection system 148 is composed of, for example, a plurality of (for example, three) Z position detection systems (for example, a laser displacement meter or other optical displacement sensor) fixed to the main frame BD. The chuck unit position detection system 148 detects a plurality of Z positions on the upper surface of the chuck unit 153, and the detection results are sent to the main control device 20 (see FIG. 10).

In addition, the carry-in unit 121 may include a wafer flatness detection system 147 (see FIG. 10). The wafer flatness detection system 147 is a plurality of wafer W surfaces (upper surface) arranged at a plurality of locations of the plate member 44, for example, three locations above the outer periphery of the wafer W and one location above the center portion. It can be configured by a Z position detection system (for example, a displacement sensor such as a capacitance sensor) (not shown) that detects a position (Z position) in the Z axis direction. The main control device 20 detects Z positions at a plurality of locations on the upper surface of the wafer W based on the measured values of the plurality of Z position detection systems, and obtains the flatness of the wafer W from the detection results.

In the exposure device 100 according to the present embodiment, a seismic sensor (seismometer) 109 installed in the semiconductor manufacturing factory where the exposure device 100 is installed is further connected to the main control device 20 (see FIG. 10). .. Information on the seismic intensity detected by the seismic sensor 109 is sent to the main control device 20.

FIG. 10 shows a block diagram showing an input / output relationship of the main control device 20 that mainly configures the control system of the exposure device 100 and controls each component in an integrated manner. The main control device 20 includes a workstation (or a microcomputer) and the like, and controls each component of the exposure device 100 in an integrated manner.

In the exposure apparatus 100 according to the present embodiment configured as described above, the main control apparatus 20 performs the following series of processes.

That is, the main control device 20 first loads the reticle R onto the reticle stage RST using a reticle transfer system (not shown). Further, the main control device 20 loads the wafer W onto the wafer stage WST (wafer holder WH) as described later. After loading, the pair of reticle alignment detection system 14, the measurement plate 30, and the alignment detection system ALG are used to perform preparatory work such as reticle alignment, baseline measurement of the alignment detection system ALG, and wafer alignment (for example, EGA). Reticle alignment, baseline measurement, and the like are disclosed in detail in, for example, US Pat. No. 5,646,413. Further, EGA is disclosed in detail in, for example, US Pat. No. 4,780,617. Here, EGA is a statistical calculation using the position detection data of a plurality of wafer alignment marks in a shot, for example, using the least squares method disclosed in the above-mentioned US patent specification, to cover all shot regions on the wafer W. It means an alignment method for obtaining array coordinates.

Then, the main control device 20 moves the wafer stage WST to the scanning start position (acceleration start position) for exposure of each shot region on the wafer W based on the results of the reticle alignment, the baseline measurement, and the wafer alignment. By repeating the movement operation between shots and the scanning exposure operation in which the pattern of the reticle R is transferred to each shot area by the scanning exposure method, the exposure to a plurality of shot areas on the wafer W is performed by the step-and-scan method. Do. The focus leveling control of the wafer W during exposure is performed in real time by using the above-mentioned multipoint AF system 54.

Next, the procedure for carrying (loading) the wafer W onto the wafer stage WST will be described along with FIGS. 11 (A) to 13 (B) and with reference to other drawings as appropriate.

In this case, for example, in the chuck unit 153, as shown in FIG. 11 (A), the three Z voice coil motors 144 (in FIG. 11 (A) and the like, the Z voice coil motor 144 on the −Y side is not shown (FIG. 4 (A))), it is assumed that the motor is moved to the vicinity of the upper limit of movement (movement limit position on the + Z side) within the stroke range, that is, the first position described above, and is maintained at that position. Further, at this time, it is assumed that the holding units 72 of the three wafer support units 125 are set at the separated positions (see FIG. 7A).

In this state, first, as shown in FIG. 11A, the wafer W is conveyed below the chuck unit 153 (above the loading position LP) with its lower surface supported by the conveying arm 149. Here, in the transfer of the wafer W to the lower position of the chuck unit 153 by the transfer arm 149, the exposure process for the wafer to be exposed (hereinafter, referred to as the front wafer) immediately before the transferred wafer W is performed. It may be performed when it is performed on the wafer stage WST, or it may be performed when alignment processing or the like for the front wafer is performed.

Next, the main control device 20 starts supplying the fluid (air) to the plurality of chuck members 124 via the adjusting device 115, as shown in FIG. 11 (A). As a result, the wafer W is attracted to the chuck unit 153 (plurality of chuck members 124) from above (from the surface side) in a non-contact manner while maintaining a predetermined distance (gap). In addition, in FIG. 11A and the like, the wafer W is formed by the flow of the ejected air (more accurately, by the negative pressure generated by the flow), which is shown by filling the dots in the figure for simplification. It is assumed that the chuck unit 153 is sucking. However, the state of the air actually blown out is not necessarily limited to these.

Next, as shown by black arrows in FIGS. 7A and 11A, the main control device 20 includes a rotary motor 68 included in each of the three wafer support units 125 (FIG. 6A). Each holding unit 72 is rotated via (see) and is positioned at the support position. In FIG. 11A, the rotational drive operation of the pair of holding units 72 on one side and the other side in the X-axis direction is indicated by black arrows. When each holding unit 72 is driven to the support position, the suction portion 78 (opening 78a) of each wafer support portion 74b faces (contacts) the lower surface (back surface) of the wafer W (FIGS. 11B and 7B). B) See). Further, when the holding units 72 of the three wafer support units 125 are positioned at the support positions, the reflector 79 on the wafer support portion 74b is at a predetermined position (including the notch position) on the outer peripheral edge of the back surface of the wafer W. (See FIG. 7B).

The rear surface of the wafer W is, when it is supported by the adsorbing portion 78 of the wafer support portions 74b, the main controller 20, a vacuum pump 104 connected to the bearing member 66 ₁ of the wafer support portions 74b (FIGS. 8 and 10 (See) is activated to perform vacuum suction. At this time, since the holding unit 72 (holding portion 74) is positioned in the supporting position, the passage extending from the conduit 81 ₃ vacuum pump 104 is connected to an opening 78a formed in the wafer support portion 74b is formed ing. Therefore, when the vacuum pump 104 is operated, the back surface of the wafer W is sucked and held by the suction portion 78 of each wafer support portion 74b.

At this time, the wafer W is restricted from moving in the three degrees of freedom direction of Z, θx, and θy by suction from above (front surface side) by the chuck unit 153, and the wafer W is downward (back surface side) by the three wafer support units 125. ) Restricts the movement of X, Y, and θz in the three degrees of freedom direction, thereby restricting the movement in the six degrees of freedom direction.

In the processing sequence of the exposure apparatus 100, the wafer W is in the state at this time, that is, in the state where suction (non-contact holding) by the chuck unit 153 and suction (support) by the three wafer support units 125 are performed, and the loading position LP is performed. It is stipulated to wait above. In the exposure apparatus 100, while the wafer W is waiting above the loading position LP, an exposure process (and an alignment process prior to the exposure process) for the front wafer held on the wafer table WTB is performed. At this time, the vacuum suction of the wafer W by the transfer arm 149 may be stopped. The suction of the wafer W from above by the chuck units 153 (plurality of chuck members 124) and the support of the wafer from below by the three wafer support units 125 may be performed in the reverse order. , Both operations may be partially performed in parallel.

While the wafer W is on standby above the loading position LP, the main control device 20 detects the edge of the wafer W using the measurement system 123 (see FIG. 10). The detection signals (imaging signals) of the three edge position detection systems of the measurement system 123 are sent to the signal processing system 116 (see FIG. 10). The signal processing system 116 detects position information at three locations on the peripheral edge including the notch of the wafer by a method disclosed in, for example, US Pat. No. 6,624,433, and X-axis of the wafer W. The positional deviation in the direction and the Y-axis direction and the rotation (θz rotation) error are obtained. Then, the information on the misalignment and the rotation error is supplied to the main control device 20 (see FIG. 10).

Around the same time as the start of edge detection of the wafer W described above, the main control device 20 drives the transfer arm 149 downward as shown by the black arrow in FIG. 11B, and the transfer arm 149 and the wafer W After separating from and, the transfer arm 149 is retracted from above the loading position LP.

When the exposure process of the front wafer is completed and the front wafer is unloaded from the wafer table WTB by the unloading unit 122 (see FIG. 10), the main control device 20 roughens the front wafer as shown in FIG. 12 (A). The wafer stage WST is moved below the chuck unit 153 (loading position LP) via the moving stage drive system 51A (see FIG. 10). Then, as shown by a white arrow in FIG. 12A, the main control device 20 has a center support member 150 having three vertical movement pins 140 (in FIG. 12A and the like, the vertical movement pin 140 Only the tip portion is shown, see FIG. 4B), which is driven upward via the drive device 142. Even at this point, the edge detection of the wafer W by the measurement system 123 is continued, and the main control device 20 has determined that the wafer W is mounted at a predetermined position on the wafer stage WST. Based on the information, the wafer stage WST is minutely driven in the same direction by the same amount as the displacement amount (error) of the wafer W.

Then, as shown in FIG. 12B, when the upper surfaces of the three vertical movement pins 140 come into contact with the lower surface of the wafer W sucked by the chuck unit 153, the main control device 20 causes the center support member 150 to come into contact with the lower surface of the wafer W. Stop climbing. As a result, the wafer W is supported by the three vertical movement pins 140 in a state where the positional deviation and the rotation error are corrected.

Here, the Z position of the wafer W sucked by the chuck unit 153 in the standby position can be known to some extent accurately. Therefore, the main control device 20 drives the center support member 150 from the reference position by a predetermined amount based on the measurement result of the displacement sensor 145, so that the three vertical movement pins 140 are attracted to the chuck unit 153. Can be brought into contact with the lower surface of the. However, not limited to this, at the upper limit movement position of the center support member 150 (three vertical movement pins 140), the three vertical movement pins 140 come into contact with the lower surface of the wafer W sucked by the chuck unit 153. , May be set in advance.

After that, the main control device 20 operates a vacuum pump (not shown) to start vacuum suction to the lower surface of the wafer W by the three vertical movement pins 140. The suction of the wafer W by the plurality of chuck members 124 is continued even in this state. That is, the movement of the wafer W in the six degrees of freedom direction is restricted by the suction by the plurality of chuck members 124 and the frictional force due to the support from below the three vertical movement pins 140. Therefore, in this state, no problem occurs even if the adsorption (contact holding) of the wafer W by the wafer support portion 74b of the wafer support unit 125 is released.

Therefore, when the wafer W is supported (sucked and held) by the three vertical movement pins 140, the main control device 20 stops the operation of the vacuum pump 104 (see FIG. 10), and then shows FIGS. 12 (B) and 12 (B). As shown by the black arrow in 14 (A), the holding unit 72 is rotated to drive the holding unit 72 included in the three wafer support units 125 from the support position to the separated position. As a result, as shown in FIG. 14B, each holding unit 72 is positioned at a separated position, and the support of the wafer W by each wafer supporting portion 74b is released.

Next, the main control device 20 has a chuck unit 153 that sucks and supports the wafer W and three vertical movement pins 140 (center), as shown by black and white arrows in FIG. 13 (A), respectively. The support member 150) is driven downward via three Z voice coil motors 144 and a drive device 142, respectively. As a result, the chuck unit 153 and the three vertical movement pins 140 (center support) are maintained in a suction state by the chuck unit 153 (a plurality of chuck members 124) and a support state by the three vertical movement pins 140 with respect to the wafer W. The member 150) and the member 150) are driven downward. The chuck unit 153 and the three vertical movement pins 140 (center support member 150) may be driven in synchronization with each other, or may be driven at different speeds. In the latter case, it is desirable that the speeds of both are adjusted so that the deformation of the wafer W is suppressed. In this case, the chuck unit 153 is driven by the main control device 20 driving three Z voice coil motors 144 based on the detection results of the chuck unit position detection system 148 (and the wafer flatness detection system 147). Will be done.

As shown in FIG. 13B, the lower surface of the wafer W is the upper surface of the wafer holder WH on the wafer table WTB for driving the chuck unit 153 and the three vertical movement pins 140 (center support member 150). It is performed until it comes into contact with the wafer support surface).

Then, when the lower surface of the wafer W comes into contact with the wafer holder WH, the main control device 20 stops the outflow of high-pressure air flow from all the chuck members 124 via the adjusting device 115, and the chuck unit 153 transfers the wafer W. The suction is released, and the wafer W is started to be sucked by the wafer holder WH.

Next, the main control device 20 places the chuck unit 153 in a predetermined standby position (first position or a position in the vicinity thereof) via the three Z voice coil motors 144 as shown by the black arrow in FIG. 13 (B). ). As a result, loading (carrying) of the wafer W onto the wafer table WTB is completed.

Here, when the chuck unit 153 is driven upward and stopped (or while ascending), the main control device 20 detects the edge position of the wafer W by using the measurement system 123 described above. In this case, in the edge detection of the wafer W, the three reflectors 86 on the wafer table WTB are irradiated with the measurement beams from the three edge position detection systems of the measurement system 123, and the reflected beams from the respective reflectors 86 are emitted. This is done by receiving light from the image sensors of the three edge position detection systems. The detection signals of the three edge position detection systems of the measurement system 123 are sent to the signal processing system 116 (see FIG. 10), and information on the positional deviation of the wafer W and the rotation error is supplied to the main control device 20. The main control device 20 stores the information of the positional deviation and the rotation error in the memory as an offset amount, and considers the offset amount at the time of later wafer alignment or exposure, etc. Control the position of the WTB. The edge of the wafer W is detected during the above-mentioned standby, and the wafer W is supported by the three vertical movement pins 140 in a state where the resulting positional deviation and rotation error are corrected. Since it is mounted on the wafer table WTB, it is not always necessary to detect the edge of the wafer W after loading the wafer W onto the wafer table WTB.

In the exposure apparatus 100 according to the present embodiment, for example, when the supply of the force, for example, electric power, vacuum, or gas (compressed air, pressurized air) to the carry-in unit 121 is stopped, FIGS. 5A to 5A first. As described based on (C), the chuck unit 153 is retracted to a retracted position several mm higher than the above-mentioned first position (suction start position of the wafer W) by the pair of fall prevention devices 55, and the position thereof. Is maintained at. At this time, as described above, the three wafer support units 125 are maintained in a state when the force supply is stopped by the function of each rotation limiting unit 152. That is, the holding unit 72 of each of the three wafer support units 125 is in either a state of being in the support position shown in FIG. 7 (B) or a state of being in the separated position shown in FIG. 7 (A), for example. Even if there is, the state is maintained (see FIGS. 9 (B) and 9 (C)). Therefore, when the three wafer support units 125 hold the wafer W, the holding state of the wafer W is maintained even if the supply of the force to the carry-in unit 121 is stopped.

Next, the operation of the carry-in unit 121 when an earthquake with a predetermined seismic intensity, for example, a seismic intensity of 4 or more occurs, will be briefly described. First, when the above earthquake occurs, for example, the wafer W is sucked from above by the plurality of chuck members 124 of the chuck unit 153 located at the first position, and at the same time, from below by the three wafer support units 125. A case where suction support is provided will be described.

When an earthquake with a seismic intensity of 4 or higher occurs, information on the seismic intensity detected by the seismic sensor 109 (see FIG. 10) is sent to the main control device 20, and the main control device 20 detects that an earthquake with a seismic intensity of 4 or higher has occurred. In order to protect the chuck unit 153, a pair of fall prevention devices 55 in a standby state are operated. That is, the main control device 20 stops the supply of compressed air from the gas supply device 108 to each air chamber 42. As a result, the support pin 59 is driven upward from the standby position by the urging force of the compression spring 58 as shown by the black arrow in FIG. 15 (A), and the chuck unit is as shown in FIG. 15 (B). The 153 is retracted to a retracted position (a position raised by several mm from the first position) and maintained at that position. At this time, the suction and suction holding of the wafer W by the chuck unit 153 and the three wafer support units 125 are continued.

On the other hand, even when the supply of force to the exposure apparatus 100 is stopped due to the occurrence of an earthquake (including the stop during the retracting operation of the chuck unit 153), as shown in FIGS. 9B and 15C. In addition, the wafer support portion 74b that supports the wafer W from below is fixed to the support position by the rectangular member 35, and at the same time, the chuck unit 153 is retracted to the retracted position by the support pin 59 and maintained at that position. That is, the chuck unit 153 is retracted to the retracted position while maintaining the support state from below by the three wafer support units 125 of the wafer W.

Next, a case where the wafer W is not supported by the three wafer support units 125 when the above earthquake occurs will be described. At this time, it is assumed that the holding units 72 of the three wafer support units 125 are located at separate positions, and the chuck unit 153 is located at the first position.

When an earthquake with a seismic intensity of 4 or higher occurs, information on the seismic intensity detected by the seismic sensor 109 is sent to the main control device 20, and the main control device 20 detects that an earthquake with a seismic intensity of 4 or higher has occurred and protects the chuck unit 153. Therefore, the pair of fall prevention devices 55 in the standby state are activated. That is, the main control device 20 stops the supply of compressed air from the gas supply device 108 to each air chamber 42. As a result, the support pin 59 is driven upward from the standby position by the urging force of the compression spring 58 as shown by the black arrow in FIG. 16 (A), and the chuck unit is as shown in FIG. 16 (B). The 153 is retracted to a retracted position (a position raised by several mm from the first position) and maintained at that position. At this time, the holding units 72 of each of the three wafer support units 125 are servo-controlled by the rotary motor 68 and are always maintained at the separated positions.

On the other hand, when all the supply of various forces to the exposure apparatus 100 is stopped (including the stop during the retracting operation of the chuck unit 153) due to the occurrence of an earthquake, the compression spring is as shown in FIG. 9 (C). The rectangular member 35 is driven to the locked position by the urging force of 36, the rod-shaped member 34 and the rectangular member 35 come into contact with the surface (wafer support surface) of the wafer support portion 74b where the suction portion 78 is provided, and the holding unit 72 rotates. Is restricted. That is, the holding unit 72 is maintained at a separated position. At this time, as shown in FIG. 16B, the chuck unit 153 is retracted to the retracted position by the support pin 59 and is maintained at that position.

In the above description of the evacuation method, the case where an earthquake occurs when the chuck unit 153 is located at the first position has been described, but the chuck unit 153 is at the second position or the first position and the second position. Even when it is located between, the chuck unit 153 is driven by the same retracting method as described above, except that the urging force of the compression spring 58 drives the chuck unit 153 upward via the support pin 59. Is retracted to the retracted position and maintained at that position.

As described above, according to the carry-in unit 121 including the pair of fall prevention devices 55 and the exposure device 100 provided with the pair of fall prevention devices 55 according to the present embodiment, when an earthquake with a predetermined seismic intensity, for example, a seismic intensity of 4 or more occurs. The main control device 20 detects this based on the seismic intensity information from the seismic sensor 109. Immediately after that, the main control device 20 operates a pair of fall prevention devices 55 to retract the chuck unit 153 to a retracted position (for example, a position raised by several mm from the first position). After retracting, the chuck unit 153 is maintained at that position by the pair of fall blocking devices 55. Therefore, it is possible to prevent the chuck unit 153 from interfering with other members such as the wafer table WTB due to the shaking of an earthquake or the like.

Further, when the supply of the force to the exposure device 100 or the carry-in unit 121 is stopped due to the occurrence of an earthquake or the like, the rotation of the holding unit 72 of each of the three wafer support units 125 is restricted by each rotation limiting unit 152. To. That is, when the three wafer support units 125 support the wafer W from below, even if the supply of the force is cut off, each rotation limiting unit 152 maintains each holding unit 72 in the support position, whereby the holding unit 72 is maintained in the support position. It is possible to prevent the wafer W from falling. Further, when the holding units 72 are located at the separated positions, even if the supply of the force is cut off, the holding units 72 are maintained at the separated positions by the rotation limiting units 152, whereby the wafer support portion 74b Can be prevented from interfering with other members such as the wafer table WTB.

When the supply of the force to the exposure device 100 or the carry-in unit 121 is stopped, the chuck unit 153 is retracted to the retracted position (a position several mm higher than the first position) via the fall prevention device 55. Since it is maintained at that position, it is possible to prevent the chuck unit 153 from interfering with other members such as the wafer table WTB due to the shaking of an earthquake or the like.

In the above embodiment, the case where the main control device 20 responds to an earthquake based on the seismic intensity information detected by the seismograph (seismometer) 109 installed in the semiconductor manufacturing factory has been described. The earthquake early warning may be notified to the main control device 20 in place of or in addition to the seismic intensity information from the seismograph (seismic intensity meter) 109. In the former case, the main control device 20 operates a pair of fall prevention devices 55 in a standby state when the earthquake early warning is equal to or higher than a predetermined seismic intensity, as described above. In the latter case, the main control device 20 performs the above-mentioned earthquake response operation based on at least one of the seismic intensity information detected by the seismic sensor (seismic intensity meter) 109 or the Earthquake Early Warning. In addition, when a host computer installed in a semiconductor manufacturing factory that manages the entire semiconductor manufacturing process causes an earthquake of a predetermined seismic intensity or higher, the main control device 20 of the exposure device 100 is provided with the above-mentioned earthquake response. It may be instructed.

Further, in the above embodiment, the case where the weight canceling device 131 using the gas pressure as a force is used as the device for supporting the chuck unit 153 in the normal time when an earthquake or the like does not occur has been described, but the present invention is not limited to this. A weight canceling device including a voice coil motor or the like that uses electricity as a force may be used, or a weight canceling device or the like that uses both gas pressure and electricity may be used.

Further, instead of the Z-boil coil motor 144, an actuator that generates a driving force by using, for example, gas (compressed air) or the like may be used. In the present embodiment, the means for generating various forces (driving force, etc.) used in the configuration of the transport system 120 is only an example, and the means is not limited thereto. It can be configured by appropriately combining various actuators.

<< Second Embodiment >>
Next, the exposure apparatus according to the second embodiment will be described with reference to FIGS. 17 (A) to 17 (C). Here, the same or similar reference numerals are used for the same or equivalent components as those in the first embodiment described above, and the description thereof will be simplified or omitted. The exposure apparatus according to the second embodiment is different from the exposure apparatus 100 according to the first embodiment in that the carry-in unit 121a is provided in place of the carry-in unit 121 described above.

As can be seen by comparing FIG. 17 (A) and FIG. 5 (A), the weight canceling device 131 is removed from the carry-in unit 121a, and the weight support device 90 is replaced with the fall prevention device 55. It is different from the carry-in unit 121 in that it is provided.

The configuration of other parts of the carry-in unit 121a, the configuration of the parts other than the carry-in unit 121, and the like are the same as those of the exposure apparatus 100 according to the first embodiment described above. Therefore, the second embodiment will be described below, focusing on the above differences.

Weight support device 90, two are provided, respectively, are each one disposed below the support member ₂₄ 1, 24 ₂ (see FIG. 4 (A)), and is fixed to the base member 22 top surface. The pair of weight support devices 90 are arranged at positions outside the Z voice coil motor 144 in the X-axis direction with respect to the center of the plate member 44. Since the pair of weight support devices 90 have the same configuration except that the arrangement is different, the weight support devices 90 arranged on the + X side of the base member 22 will be typically taken up and described below.

As shown in FIG. 17A, the weight support device 90 includes a housing (cylinder) 56a made of a hollow cylindrical member, a vertical movement member 60 that moves up and down along the inner peripheral surface of the housing 56a, and up and down. It includes a compression coil spring (compression spring) 58 arranged between the moving member 60 and the bottom wall of the housing 56, and a support member 39 that can move up and down along the housing 56a. The vertical movement member 60 is configured in the same manner as in the first embodiment described above, and includes a piston member 57 whose outer peripheral surface is in contact with the inner peripheral surface of the housing 56a and which divides the inside of the housing 56a into two upper and lower spaces. It has a support pin 59 fixed to the upper surface of the piston member 57.

A through hole (guide hole) 47a that is one size larger than the above-mentioned through hole 47 is formed in the center of the upper wall (top plate) of the housing 56a, and a supply port 46a is provided at a predetermined height position of the peripheral wall. It is formed. A gas supply device 108 (see FIG. 10) is connected to the supply port 46a via a gas supply pipe (not shown). The position of the supply port 46a in the height direction will be described later.

The lower end of the compression spring 58 is fixed to the upper surface of the bottom wall of the housing 56a, and the upper end is connected to the upper wall of the cylindrical portion of the piston member 57. That is, the compression spring 58 is arranged in the lower chamber 43 inside the housing 56 partitioned by the piston member 57.

Support member 39 includes a cylindrical portion 39a whose tip contacts the support member 24 _1, 24 _2, flange portions of the annular shape is provided at the lower end outer peripheral portion of the cylindrical portion 39a (the concentric circular opening in the center is formed a circular (Plate portion) 39b and. The cylindrical portion 39a of the support member 39 is inserted into the through hole 47a of the housing 56a from below through a predetermined gap, for example, a gap of about several μm. A through hole 53 is formed inside the cylindrical portion 39a. The height (length) of the support member 39 is shorter than that of the support pin 59, and is set to a length of about 2/3 as an example. The support member 39 is housed in the housing 56a so as to be located above the piston member 57, and at least a part of the upper end thereof is always exposed to the outside of the housing 56a through the through hole 47a. Further, the inner diameter of the through hole 53 of the cylindrical portion 39a is set to be substantially equal to the diameter of the support pin 59 (the diameter of the support pin 59 is slightly smaller (for example, about several μm)). The positional relationship between the through hole 53 and the support pin 59 of the cylindrical portion 39a is set so as to be coaxial with each other, and the support pin 59 is inserted into the through hole 53 through a predetermined gap, for example, a gap of about several μm. Has been done.

Further, the outer diameter of the flange portion 39b of the support member 39 is set to be substantially equal to the inner diameter of the housing 56a (the outer diameter of the flange portion 39b is slightly smaller (for example, about several μm)), and the flange portion 39b provides the housing 56a. The internal space of is divided into two upper and lower spaces.

In the second embodiment, the support member 39 is movable in the vertical direction along the inner surface of the peripheral wall of the housing 56a and the inner peripheral surface of the through hole 47a. Further, the internal space of the housing 56a is divided into three upper and lower spaces (that is, referred to as a room 49, an air chamber 42, and a room 43 in this order from the top) by the flange portion 39b of the support member 39 and the piston member 57. .. More precisely, the room 43 is partitioned by the peripheral wall, the bottom wall, and the piston member 57 of the housing 56a, and the air chamber 42 is partitioned by the peripheral wall, the support member 39, and the piston member 57 of the housing 56a. The 49 is partitioned by a peripheral wall and a top plate of the housing 56a and a support member 39.

Normally, as shown in FIGS. 17A and 17B, the inside of the air chamber 42 is maintained in a higher pressure state than the chambers 43 and 49 by the compressed air supplied from the gas supply device 108. In this case, the downward force acting on the piston member 57 due to the differential pressure is set to be larger than the upward force acting on the piston member 57 due to the elastic force of the compression spring 58. Therefore, the piston member 57 is maintained in a state of being pushed downward by the pressure of the compressed air. That is, the compression spring 58 is pushed down by the piston member 57 and is housed in the room 43 while holding a force for driving the piston member 57 upward, that is, an upward urging force (in this case, an elastic force). ..

The upper end of the support pin 59 is the upper end of the cylindrical portion of the support member 39 as shown in FIGS. 17 (A) and 17 (B) when the compression spring 58 is contracted by the compressed air from the gas supply device 108. As shown in FIG. 17C, the support pin 59 is not exposed upward from the above, and the upper end of the support pin 59 is exposed upward from the upper end of the cylindrical portion of the support member 39 when the compression spring 58 is extended. The dimensions of each member, the spring constant, etc. are defined in. Hereinafter, the position of the support pin 59 in the state where the compression spring 58 is contracted is referred to as a standby position. Incidentally, as shown in FIG. 17 (B), in a state in which the support pin 59 is located at the standby position, Z voice coil motor 144 and a second position (the support member ₂₄ 2 (24 ₁₎ and the support pins 59 top even when it is driven into position) to close, and the support pin 59, a non-contact state is maintained between the support member 24 2 _{(24 1).}

Here, the position of the supply port 46a in the height direction will be described. In the present embodiment, as shown in FIG. 17 (B), in a state in which the support pin 59 is located at the standby position, the chuck unit 153 by Z voice coil motor 144 and the second position (the support member ₂₄ 2 ₍₂₄ 1) When the support member 39 is in the lowest position, and as shown in FIG. 17C, the compression spring 58 is extended and the piston member 57 is driven to the position where the support pin 59 and the support pin 59 are closest to each other. The supply port 46a is formed at a height position at which the supply port 46a can communicate with the air chamber 42 at any time when it is at the highest position. This makes it possible to supply the compressed air from the gas supply device 108 into the air chamber 42 via the supply port 46a at any time when necessary. As described above, in the present embodiment, each of the weight support devices 90 has the support pin 59 and the support member 24 due to the downward force generated by using the gas (compressed air) supplied into the air chamber 42. ₂ and to maintain the non-contact state with the (24 _1).

Next, in the exposure apparatus according to the second embodiment, the operation of the carry-in unit 121a when an earthquake with a predetermined seismic intensity, for example, a seismic intensity of 4 or more occurs, will be briefly described.

As a premise, the chuck unit 153 is in the above-mentioned first position or second position as shown in FIG. 17 (A) or FIG. 17 (B), and in the pair of weight support devices 90, the compression spring 58 is contracted. However, it shall be in a standby state.

When an earthquake with a seismic intensity of 4 or higher occurs, the main control device 20 detects that an earthquake with a seismic intensity of 4 or higher has occurred based on the seismic intensity information detected by the seismic sensor 109, and puts it in a standby state to protect the chuck unit 153. Activate a pair of weight bearing devices 90. That is, the main control device 20 stops the supply of compressed air from the gas supply device 108 to the air chamber 42. As a result, as shown by the black arrow in FIG. 17A, the support pin 59 is driven upward from the standby position by the urging force of the compression spring 58. At this time, for example, when the Z-boil coil motor 144 does not generate a driving force or the driving force generated is smaller than the urging force of the compression spring 58, the chuck unit 153 is shown in FIG. 17 (C). It is retracted to the indicated retracted position (a position several mm higher than the first position) and maintained at that position. At this time, when the supply of the force to the carry-in unit 121 is not cut off and the wafer W is sucked and sucked and held by the chuck unit 153 and the three wafer support units 125, the same as described above. Suction and adsorption retention are ongoing.

Further, when all the supply of various forces to the exposure device 100 is stopped due to the occurrence of an earthquake (including the stop during the retracting operation of the chuck unit 153), the compression from the gas supply device 108 to each air chamber 42 is performed. Since the supply of air is also stopped, the support pin 59 retracts the chuck unit 153 to the retracted position shown in FIG. 17 (C) and maintains the chuck unit 153 at that position. Also in this case, the rotation limiting unit 152 is operated by stopping the supply of the force to the exposure apparatus 100, and the holding units 72 of the three wafer support units 125 are maintained at the support position or the separated position.

On the other hand, when the chuck unit 153 is in the retracted position shown in FIG. 17C, when the supply of the force to the exposure device 100 is restarted, the compressed air is supplied from the gas supply device 108 to each air chamber 42. When the pressure of the compressed air in the air chamber 42 becomes higher than the pressure of the air inside each of the chambers 43 and 49, the vertical movement member 60 is pressed by the compression spring due to the total pressure of the compressed air in the air chamber 42. It is driven downward against the upward force due to the elastic force of 58, and is in the standby state shown in FIG. 17 (A).

Further, as the supply of compressed air to each air chamber 42 is resumed and the pressure of the compressed air in the air chamber 42 rises, the support member 39 is driven upward, and the support member 39 receives this. The position where the downward force due to the own weight of the acting chuck unit 153 and the own weight of the support member 39 and the upward force due to the pressure of the compressed air in the air chamber 42 are balanced, or the position where they come into contact with the top plate of the housing 56a, that is, the figure. It stops at the first position shown in 17 (A).

As described above, according to the exposure apparatus according to the second embodiment, the same effect as that of the exposure apparatus 100 according to the first embodiment described above can be obtained, and a pair of weight canceling devices is unnecessary. Become.

<< Modification 1 of the weight support device >>
In the second embodiment, the weight support device 90'as shown in FIG. 18A may be used instead of each of the pair of weight support devices 90. The weight support device 90'is a circular plate in which a circular opening (guide hole) 29 having a diameter concentric with the cylindrical portion of the support member 39 and substantially the same diameter as the diameter of the support pin 59 (slightly, for example, several μm larger) is formed. A fixed partition member 28 for dividing the internal space (air chamber) 42 of the housing 56b similar to the above-mentioned housing 56a into two upper and lower air chambers 42a and 42b is provided, and two upper and lower parts are provided. Two supply ports 46 for individually supplying pressurized air to the space are provided on the upper side and the lower side of the partition member 28 of the peripheral wall of the housing 56b, respectively.

Further, the cylindrical portion of the piston member 57 and the support pin 59 are coaxial, and the outer diameter of the cylindrical portion and the diameter of the support pin 59 are the same. Therefore, the vertical movement member 60b can move up and down along the circular opening 29 of the partition member 28. The configuration of other parts of the weight support device 90'is similar to that of the weight support device 90.

FIG. 18B shows the state of the weight support device 90'when the supply of pressurized air to the internal space of the housing 56b through the two supply ports 46 is cut off (stopped). Has been done. As can be seen from FIGS. 18 (A) and 18 (B), even if the weight support device 90'is used instead of each of the pair of weight support devices 90, the same effect as that of the second embodiment can be obtained. Obtainable.

<< Modification 2 of the weight support device >>
Further, instead of the weight support device 90, a weight support device 90 "as shown in FIG. 19 may be used. In the weight support device 90", the partition member 28c is provided between the upper and lower air chambers 42a and 42b. A communication ventilation path 27 is formed, and correspondingly, instead of the housing 56b, a supply that communicates with one of the upper and lower air chambers 42a and 42b partitioned by the partition member 28c, for example, the lower air chamber. A housing 56c provided with only a mouth 46 is used.

In the above first and second embodiments, among the three support members ₂₄ 1-24 _3, the support member 24 ₃ disposed on the -Y side, have is provided only Z voice coil motors 144 However, the present invention is not limited to this, and at least one of the weight canceling device 131 and the fall prevention device 55, or the weight supporting devices 90, 90', 90 "may be further provided.

<< Third Embodiment >>
Next, the exposure apparatus according to the third embodiment will be described with reference to FIGS. 20 to 23. In the exposure apparatus according to the third embodiment, the wafer support unit 125b shown in FIGS. 20 to 22 is provided in place of each of the three wafer support units 125 included in the chuck unit 153 of the carry-in unit 121. .. The configuration of other parts of the chuck unit 153, other configurations of the carry-in unit 121, the configuration of parts other than the carry-in unit 121, and the like are the same as those of the exposure apparatus 100 according to the first embodiment described above. Therefore, the differences from the exposure apparatus 100 will be described below, focusing on the wafer support unit 125b. Since the three wafer support units 125b have the same configuration except that the arrangement is different, in the following, the wafer support housed in the stepped opening 25 located in the −Y direction with respect to the center of the plate member 44. The unit 125b will be typically taken up and described.

As can be seen by comparing FIG. 20 and FIG. 6A, in the wafer support unit 125b, an air cylinder is used instead of the above-mentioned rotary motor 68 as a drive source for rotationally driving the holding unit 72 included in the wafer support unit 125b. 168 is provided. One end of the shaft portion 73 ₂ of the holding unit 72 is connected to the motion converter 164 provided on the flat plate member 62.

The air cylinder 168 has a cylinder portion and a piston portion that slides along the longitudinal direction of the cylinder portion, and is located near the −X side end portion of the −Y side end portion of the flat plate member 62 in the Y axis direction. Is fixed via the base 169 in the longitudinal direction. The piston portion is a piston composed of a circular plate member whose outer peripheral surface is substantially in contact with the inner peripheral surface of the cylinder portion, and one end (-Y side end) is fixed to the central portion of one surface of the piston in the longitudinal direction of the cylinder portion (-Y side end). It has a piston rod 168a (see FIGS. 20, 21 (A) and 21 (B)) extending in the Y-axis direction.

One end of the tube 180 is connected to the bottom (-Y end) of the cylinder portion of the air cylinder 168, and the other end of the tube 180 is connected to the compressor 202 via the solenoid valve 200 (both FIGS. 20 and 21 (FIGS. 20 and 21). A) and FIG. 21 (B) are not shown, see FIG. 23). The solenoid valve 200 has three doorways, two of which (for convenience, referred to as a first doorway and a second doorway) are selectively opened and closed by a valve included in the solenoid valve 200. The remaining one doorway (hereinafter referred to as a third doorway) is not provided with a valve and is therefore always open.

When no voltage is applied to the solenoid of the solenoid valve 200 (hereinafter referred to as an off state), the valve closes the first entrance / exit by the urging force of an urging member such as a spring. Therefore, the second doorway is normally open. On the other hand, when a voltage is applied to the solenoid included in the solenoid valve 200, the valve is driven against the urging force of an urging member such as a spring to close the second entrance and exit and open the first entrance and exit. .. Hereinafter, the state in which a voltage is applied to the solenoid is referred to as an on state.

The compressor 202 is connected to the first inlet / outlet of the solenoid valve 200 via an air supply tube (not shown), and the third inlet / outlet is connected to the air cylinder 168 via a tube 180 (see FIG. 20 and the like). There is. The remaining second doorway is open to the atmosphere. Hereinafter, this second entrance / exit will be referred to as an atmospheric opening.

Therefore, when the compressor 202 is operated while the solenoid valve 200 is on, the compressed air generated by the compressor 202 is sent to the cylinder portion of the air cylinder 168 via the air supply tube, the internal space of the solenoid valve, and the tube 180. It is supplied inside. On the other hand, when the solenoid valve 200 is off, the internal space of the cylinder portion of the air cylinder 168 and the external space of the solenoid valve 200 are communicated with each other through the air opening. Therefore, in this state, as will be described later, when the piston portion of the air cylinder 168 is pressed toward the −Y side by the elastic force of the compression spring, the air inside the cylinder portion is discharged to the outside from the atmosphere opening port.

Since the three wafer support units 125b have the same configuration, each of the three wafer support units 125b is provided with an air cylinder 168, and three solenoid valves 200 individually connected to each air cylinder 168 are provided. (See FIG. 23), but these three solenoid valves 200 are connected to the same compressor 202 via air supply tubes (not shown).

The motion conversion unit 164 converts the linear motion of the piston portion of the air cylinder 168 into the rotational motion of the holding unit 72. The motion converting unit 164, as shown in simplified form in FIG. 21 (A), having a cam 165 which is integrally fixed to the outer peripheral portion of the shaft portion 73 _2, and a slide member 166 that engages the cam 165 Includes cam mechanism. Cam 165 has one end portion slightly smaller than the outer diameter of the shaft portion 73 ₂ (for example, about several microns smaller) diameter opening is formed in a state where the shaft portion 73 ₂ is inserted into the opening, the shaft portion 73 ₂ is integrated with. The shaft portion 73 ₂ and the cam 165, respectively keyway (not shown) are formed on opposite sides, the cam 165 to the shaft portion 73 ₂ via a key (not shown) to be fitted in these keyways attached Has been done. A U-shaped recess 165a is formed at the other end of the cam 165.

In the wafer support unit 125b, the slide member 166 is integrally provided at the tip of the piston rod 168a of the air cylinder 168. The slide member 166 is provided on one surface with a columnar convex portion 166a that engages with the U-shaped concave portion 165a of the cam 165. Therefore, the sliding member 166, when driven in the longitudinal direction of the air cylinder 168 (Y-axis direction) in the piston portion integral with the cam 165, the central axis of the shaft portion 73 ₂ and the shaft portion 73 ₂ integrally ,Rotate. Thus, the holding unit 72 is rotated about the central axis of the shaft portion 73 ₂ and the shaft portion 73 _1.

The cam mechanism including the cam 165 and the slide member 166 is housed inside the housing 164a (see FIG. 20) of the motion conversion unit 164.

In the wafer support unit 125b, as shown in FIGS. 21 (A) and 21 (B), a support block 190 is provided at a position opposite to the air cylinder 168 with the motion conversion portion 164 on the upper surface of the flat plate member 62 interposed therebetween. It is fixed. A compression coil spring (compression spring) 192 whose expansion and contraction direction is in the Y-axis direction is arranged between the support block 190 and the slide member 166. One end of the compression spring 192 is connected to the −Y side surface of the support block 190, and the other end is inserted into the inside of a cylindrical convex portion provided on the + Y side end surface of the slide member 166.

In the wafer support unit 125b, when the solenoid valve 200 is set to the ON state and the compressor 202 is operated, the air is added to the inside of the cylinder portion of the air cylinder 168 from the compressor 202 via the air supply tube, the solenoid valve 200 and the tube 180. When pressure air is supplied and the pressure in the cylinder portion rises, the slide member 166 is driven in the + Y direction against the urging force of the compression spring 192. While the pressurized air continues to be supplied into the cylinder portion and the pressure rises, the slide member 166 is driven in the + Y direction, but the stopper member (non-stop member) provided inside the housing 164a of the motion conversion unit 164. It stops at the first movement limit position where the slide member 166 comes into contact with (shown). After that, while the pressurized air is supplied, the slide member 166 is maintained in a state of being positioned at the first movement limit position. FIG. 21A shows a state in which the slide member 166 is positioned at the first movement limit position. In the state of FIG. 21A, the holding unit 72 is in the above-mentioned separation position where the wafer support portion 74b and the wafer W are separated from each other.

On the other hand, in the wafer support unit 125b, when the slide member 166 is in the state of being positioned at the first movement limit position, the solenoid valve 200 is switched from the on state to the off state, and when the compressor 202 is stopped, the compressor The supply of pressurized air from 202 to the cylinder portion is stopped, and the internal space of the cylinder portion of the air cylinder 168 and the external space of the solenoid valve 200 are communicated with each other through the air opening. As a result, as shown by the white arrows in FIG. 21 (A), the piston portion of the slide member 166 and the air cylinder 168 is pressed to the −Y side by the elastic force of the compression spring 192, and the air inside the cylinder portion is pressed. Is discharged to the outside from the air opening of the solenoid valve 200. The slide member 166 stops at a second movement limit position where the slide member 166 comes into contact with a stopper member (not shown) provided inside the housing 164a of the motion conversion unit 164. By movement in the -Y side of the piston portion of the slide member 166 and the air cylinder 168, the holding unit 72, FIG illustrated in FIG. 21 (A), the shaft portion ₇₃ 1, 73 ₂ from the spaced position of the above as a rotary shaft Rotate 90 degrees clockwise in the paper as shown by the black arrow in 21 (A), and the position where the wafer W is supported by the wafer support portion 74b of the holding portion 74 (that is, as shown in FIG. 21 (B)). It is positioned at the above-mentioned support position). That is, the second movement limit position of the slide member 166 corresponds to the support position of the holding unit 72.

As described above, in the wafer support unit 125b, the holding unit 72 is shown by the air cylinder 166, the motion conversion unit 164, and the compression spring 192 at the separation position shown in FIG. 21A and in FIG. 21B. It is rotationally driven to and from the support position.

Further, the wafer supporting unit 125b, as shown in Figure 22, the bearing member ₆₆ 1, 66 _2, the heaters 300 are provided. Since between the bearing member 66 ₁ and the shaft portion 73 _1, and between the bearing member 66 ₂ and the shaft portion 73 _2, respectively hydrostatic air bearings (air bearings) are formed, the gas supply device 102 and the gas are supplied from the supplying apparatus 106, the compressed air blown respectively toward the porous member 82, 85 to the shaft portion ₇₃ 1, 73 _2, the shaft portion ₇₃ 1 by adiabatic expansion, 73 ₂ and the shaft portion 73 _1, in some cases 73 to lower the temperature of the ₂ connected to the holding portion 74 (that is, the holding unit 72). In the present embodiment, the heater 300 heats (temperature adjusts) the shaft portions 73-1 and 73-2, respectively, so that the holding portion 74 can be prevented from dropping beyond the permissible value.

The other configurations of the wafer support unit 125b are the same as those of the wafer support unit 125.

The operation and stop of the compressor 202 and the switching setting between the on state and the off state of the three solenoid valves 200 are performed by the main control device 50 (see FIG. 23).

The exposure apparatus according to the third embodiment configured in this way can obtain the same effect as that of the first embodiment described above, and the three wafer support units 125b have a compression spring 192 attached. Due to the force (elastic force), the support state of the wafer can be maintained in a state where the air cylinder 168 does not generate a force. Therefore, by using the rotation limiting function due to friction between the rectangular member 35 of the rotation limiting unit 152 and the main body 74a of the holding portion 74, the force is supplied to the exposure device or the carry-in unit due to the occurrence of an earthquake or the like. Even when the wafer is stopped, the support state of the wafer can be maintained more reliably. Further, in the exposure apparatus according to the third embodiment, when each holding unit 72 is located at a separated position and the supply of the force is cut off, the solenoid is released when the supply of the force is cut off. Air having a pressure higher than the urging force of the compression spring 192 remains between the valve 200 and the air cylinder 168, and the air remains in the space between the solenoid valve 200 and the air cylinder 168. Due to the pressure of the remaining air, each holding unit 72 can be kept in a separated position. Therefore, the time until the chuck unit 153 is retracted to the retracted position (for example, a position raised by several mm from the first position) by the pair of fall prevention devices 55 is held by the pressure of the remaining air. The unit 72 can be maintained in a separated position, whereby the wafer support portion 74b can be prevented from interfering with other members such as the wafer table WTB.

As described above, in the three wafer support units 125b according to the third embodiment, when the supply of the force to the exposure device or the carry-in unit is stopped due to the occurrence of an earthquake or the like, the compression spring 192 The urging force (elastic force) can maintain the support state of the wafer in a state where the air cylinder 168 does not generate a force, and the pressure of the air remaining between the solenoid valve 200 and the air cylinder 168 holds each of the wafers. The unit 72 can be maintained in a separated position. Therefore, the rotation limiting unit 152 described above does not necessarily have to be provided.

As long as the configurations do not contradict each other, the first, second and third embodiments described above and the modified examples of the second embodiment (hereinafter referred to as the above embodiments) are arbitrarily combined and adopted. You may. According to these configurations, for example, when a power failure occurs due to an earthquake or the like, electric power, vacuum, gas (compressed air) or the like used as a drive source for each part of the transfer device is not supplied to the transfer device, or is supplied. Even if the required amount is not reached even if the amount is increased, the position, posture, and the like of the conveyed member and the conveyed object (wafer, etc.) held by the conveyed member can be maintained in a predetermined state. In each embodiment, a configuration in which a plurality of wafer support units, drop prevention devices, and weight support devices are provided has been described, but the configuration is not necessarily limited to the plurality, and may be configured by one.

Further, in each of the above embodiments, the case where the exposure apparatus is a dry type exposure apparatus that exposes the wafer W without using a liquid (water) has been described, but the present invention is not limited to this, and the optical system and the liquid are used. Of course, each of the above embodiments may be applied to an immersion type exposure apparatus that exposes the wafer through the wafer.

Further, in each of the above embodiments, the case where the alignment detection system ALG and the multipoint AF system are provided in the vicinity of the projection optical system has been described, but the present invention is not limited to this, for example, an exposure station and an alignment detection system in which the projection optical system is provided. The carry-in unit according to each of the above embodiments may be provided in or near the measurement station by separating the ALG and the measurement station provided with the multi-point AF system. In this case, as disclosed in, for example, U.S. Patent Application Publication No. 2008/0088843, a measurement stage provided with various measurement members is provided in addition to the wafer stage, and between the wafer stage and the measurement stage. The immersion area may be handed over. In this case, another wafer stage may be provided instead of the measurement stage. In this way, it is possible to perform parallel processing of the exposure processing of the wafer on one wafer stage and the predetermined measurement processing such as alignment measurement using the other wafer stage. The exposure apparatus including the wafer stage and the measurement stage, or the two wafer stages may be a dry type exposure apparatus.

In each of the above embodiments, the case where the exposure apparatus is a scanning stepper has been described, but the present invention is not limited to this, and the above embodiment may be applied to a static exposure apparatus such as a stepper. Further, each of the above embodiments can be applied to a step-and-stitch type reduced projection exposure apparatus that combines a shot region and a shot region.

Further, the projection optical system of the projection exposure apparatus of each of the above embodiments may be not only a reduction system but also an equal magnification and an enlargement system, and the projection optical system may be not only a refraction system but also a reflection system and a reflection refraction system. The projected image may be either an inverted image or an upright image.

Further, the illumination light IL is not limited to ArF excimer laser light (wavelength 193 nm), but may be ultraviolet light such as KrF excimer laser light (wavelength 248 nm) or vacuum ultraviolet light such as F ₂ laser light (wavelength 157 nm). good. For example, as disclosed in US Pat. No. 7,023,610, single-wavelength laser light in the infrared or visible region oscillated from a DFB semiconductor laser or fiber laser as vacuum ultraviolet light, such as erbium. Harmonics that are amplified by a fiber amplifier doped with (or both erbium and itterbium) and wavelength-converted to ultraviolet light using a nonlinear optical crystal may be used.

Further, in each of the above embodiments, it goes without saying that the illumination light IL of the exposure apparatus is not limited to light having a wavelength of 100 nm or more, and light having a wavelength of less than 100 nm may be used. For example, the above embodiment can be applied to an EUV exposure apparatus that uses EUV (Extreme Ultraviolet) light in a soft X-ray region (for example, a wavelength range of 5 to 15 nm). In addition, each of the above embodiments can be applied to an exposure device that uses a charged particle beam such as an electron beam or an ion beam.

Further, in each of the above embodiments, a light-transmitting mask (reticle) in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light-transmitting substrate is used, but instead of this reticle, For example, as disclosed in US Pat. No. 6,778,257, an electronic mask (variable molded mask,) that forms a transmission pattern, a reflection pattern, or a light emission pattern based on the electronic data of the pattern to be exposed. It is also called an active mask or an image generator, and for example, a DMD (Digital Micro-mirror Device) which is a kind of non-emission type image display element (spatial light modulator) may be used.

Further, for example, as disclosed in International Publication No. 2001/035168, an exposure apparatus (lithographic system) for forming a line-and-space pattern on a wafer W by forming interference fringes on the wafer W. Also, each of the above embodiments can be applied.

Further, for example, as disclosed in US Pat. No. 6,611,316, two reticle patterns are synthesized on a wafer via a projection optical system and one on the wafer by a single scan exposure. Each of the above embodiments can be applied to an exposure apparatus that double-exposes one shot region at almost the same time.

The object to which the pattern should be formed in each of the above embodiments (the object to be exposed to which the energy beam is irradiated) is not limited to the wafer, and other objects such as a glass plate, a ceramic substrate, a film member, or mask blanks. But it's okay.

The application of the exposure device is not limited to the exposure device for semiconductor manufacturing, for example, an exposure device for liquid crystal that transfers a liquid crystal display element pattern to a square glass plate, an organic EL, a thin film magnetic head, and an image pickup device. It can be widely applied to exposure devices for manufacturing (CCD, etc.), micromachines, DNA chips, and the like. Further, in order to manufacture reticle or mask used not only in microdevices such as semiconductor elements but also in light exposure equipment, EUV exposure equipment, X-ray exposure equipment, electron beam exposure equipment and the like, glass substrates or silicon wafers and the like. Each of the above embodiments can be applied to an exposure apparatus that transfers a circuit pattern to a wafer.

For electronic devices such as semiconductor elements, a step of designing the function and performance of the device, a step of manufacturing a reticle based on this design step, a step of manufacturing a wafer from a silicon material, and an exposure apparatus (pattern) according to each of the above-described embodiments. A lithography step that transfers a mask (reticle) pattern to a wafer according to the forming device) and its exposure method, a development step that develops an exposed wafer, and etching that removes exposed members of parts other than the part where resist remains. It is manufactured through steps, a resist removing step for removing unnecessary resist after etching, a device assembly step (including a dicing step, a bonding step, and a packaging step), an inspection step, and the like. In this case, in the lithography step, the above-mentioned exposure method is executed using the exposure apparatus of each of the above embodiments, and the device pattern is formed on the wafer, so that a device having a high degree of integration can be manufactured with high productivity. ..

As described above, the object support device of each embodiment is suitable for supporting a plate-shaped object. Further, the exposure device provided with the object support device of each embodiment is suitable for exposing a plate-shaped object.

20 ... Main control device, 32 ... Air cylinder, 35 ... Rectangular member, 36 ... Compression spring, 39 ... Support member, 39a ... Cylindrical part, 39b ... Flange part, 42 ... Air chamber, 44 ... Plate member, 46 ... Supply port , 47a ... Through hole, 55 ... Fall prevention device, 56, 56a, 56b, 56c ... Housing, 60 ... Vertical movement member, 57 ... Piston member, 57a ... Cylindrical part, 57b ... Flange part, 58 ... Compression spring, 59 ... Support pin, 68 ... Rotating motor, 72 ... Holding unit, 74 ... Holding part, 78 ... Suction part, 90 ... Weight support device, 100 ... Exposure device, 121 ... Carry-in unit, 124 ... Chuck member, 125 ... Wange support unit , 131 ... weight canceling device, 108 ... gas supply device, 152 ... rotation limiting unit, 153 ... chuck unit, 28 ... partition member, 27 ... ventilation path, IL ... illumination light, W ... wafer, WST ... wafer stage, WH … Wafer holder.

Claims (9)

An object support device that supports a plate-shaped object.
An object support member that supports the object and
A first support device capable of supporting the object support member by the supplied force, and
An object support device including a second support device capable of supporting the object support member in place of the first support device by stopping the supply of the force to the first support device. The object support device according to claim 1, wherein the second support device is non-contact with the object support member supported by the first support device. The object support device according to claim 1 or 2, wherein the first support device to which the force is not supplied does not support the object support member. The object support device according to any one of claims 1 to 3, wherein the second support device supports the object support member in place of the first support device to which the force is not supplied. The second support device includes a contact member capable of contacting the object support member.
The object support device according to any one of claims 1 to 4, wherein the contact member comes into contact with the object support member by changing the position of the first support device. The second support device is
A pin member that can move up and down,
A member that applies force to the pin member from below to above,
A mechanism that pushes the pin member down to a position where it does not come into contact with the object support member against the force of the member.
The object support device according to any one of claims 1 to 5. The second support device is
A cylinder that guides the pin member in the vertical direction,
The pin member is provided with a piston member that is provided integrally with or separately from the pin member and can move along the inner peripheral surface of the cylinder.
The object support device according to claim 6, wherein the mechanism pushes down the pin member by the pressure of a gas surrounded by the cylinder and the piston. The member is a compression coil spring arranged in a space below the piston member of the cylinder.
The object support device according to claim 7, wherein the piston member also serves as a spring receiving member for the compression coil spring. An exposure device that exposes a plate-shaped object coated with a sensitive agent with an energy beam.
The object support device according to any one of claims 1 to 8 for supporting the object, and the object support device.
A moving body provided with an object mounting surface on which the object is mounted is provided.
An exposure device in which the object before exposure is supported by the object support device and then mounted on the object mounting surface.

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