JP6814661B2 - Grinding device - Google Patents

Description

The present invention relates to a grinding device, and more particularly to a grinding device provided with a dressing means for dressing a grinding wheel.

In the field of semiconductor manufacturing, backside polishing is performed to grind the back side of a wafer in order to form a semiconductor wafer such as a silicon wafer (hereinafter referred to as “wafer”) as a thin film.

As a grinding device for grinding the back surface of a wafer, Patent Document 1 discloses a device including a holding means for holding the wafer, a grinding wheel for grinding the wafer, and a dress member for dressing the grinding wheel. ..

In such a grinding device, when the dress member is pressed against the grinding wheel, the abrasive grains of the grinding wheel are separated and a spontaneous blade is generated. Since the dress member is pressed parallel to the grinding wheel, the grinding surface of the grinding wheel is dressed so as to be leveled horizontally. Then, the wafer can be ground into a flat shape by pressing a grinding wheel having a flat grinding surface against the wafer. As a result, even with a difficult-to-cut material such as sapphire, the wafer can be continuously ground without causing surface burn of the wafer due to wear of the abrasive grains of the grinding wheel.

Japanese Patent No. 5815150

However, in the grinding apparatus described in Patent Document 1 as described above, since the grinding surface of the grinding wheel is dressed flat, when the thickness of the wafer varies, the thickness of the grinding wheel is made uniform. There is a problem that it is difficult to locally change the grinding amount, for example, to grind a wafer into a medium-convex shape in which the central portion of the wafer is thicker than the outer peripheral portion or a hollow shape in which the central portion of the wafer is thinner than the outer peripheral portion. ..

Therefore, there arises a technical problem to be solved, which is to accurately dress the grinding surface of the grinding wheel into a curved shape according to a desired wafer shape, and an object of the present invention is to solve this problem. ..

The present invention has been proposed in order to achieve the above object, and the invention according to claim 1 includes grinding means for holding a wafer and grinding means having a grinding wheel for grinding the wafer. An apparatus, a dressing means for dressing the grinding wheel, a dressing means tilting mechanism capable of tilting the dressing means with respect to the rotation axis of the grinding wheel, and a measuring means for measuring the remaining amount of dressed by the dressing means. Provided is a grinding device including a control means for calculating the tilt angle of the dressing means based on the measured value of the measuring means and correcting the tilt angle of the dressing means tilting mechanism.

According to this configuration, the dressing means is pressed against the grinding wheel in a state where the dressing means is tilted with respect to the rotation axis of the grinding wheel to dress the grinding surface of the grinding wheel into a curved shape according to a desired wafer shape. be able to. Further, since the tilt angle of the dressing means tilting mechanism is corrected so that the tilt angle (actual tilt angle) of the dressing means obtained based on the measured value of the measuring means matches the target tilt angle stored in advance. The ground surface of the grinding wheel can be accurately dressed in a curved shape.

The invention according to claim 2, in addition to the configuration of the invention according to claim 1, the measuring means provides a grinding device movably provided on a plane.

According to this configuration, since the measurement point of the measuring means can be arbitrarily set in the dressing means, the actual tilt angle can be acquired with high accuracy.

The invention according to claim 3, in addition to the configuration of the invention according to claim 2, the measuring means provides a grinding device provided so as to be swingable.

According to this configuration, since the measurement point of the measuring means can be arbitrarily set on a predetermined trajectory, the actual tilt angle can be smoothly acquired.

The invention according to claim 4 provides a grinding apparatus in which the measurement point of the measuring means includes at least the rotation center of the dressing means, in addition to the configuration of the invention according to any one of claims 1 to 3.

According to this configuration, the measurement point of the measuring means is set so as to include the rotation center of the dressing means, so that the actual tilt angle reflecting the entire dressing means can be obtained.

In the invention according to claim 5, in addition to the configuration of the invention according to any one of claims 1 to 4, the measuring means is a touch sensor, and the controlling means is a known dress remaining amount before dressing. Provided is a grinding device for calculating the remaining amount of the dress after dressing by reducing the amount of elevation of the touch sensor after dressing.

According to this configuration, the tilt angle of the dressing means can be obtained based on the measured value of the measuring means by using an inexpensive touch sensor.

According to the present invention, the grinding surface of the grinding wheel can be dressed in a curved shape according to a desired wafer shape by pressing the dressing means against the grinding wheel while the dressing means is tilted with respect to the rotation axis of the grinding wheel. it can. Further, since the tilt angle of the dressing means tilting mechanism is corrected so that the tilt angle (actual tilt angle) of the dressing means obtained based on the measured value of the measuring means matches the target tilt angle stored in advance. The ground surface of the grinding wheel can be accurately dressed in a curved shape.

The side view which shows the grinding apparatus which concerns on one Example of this invention. The plan view of the grinding apparatus shown in FIG. FIG. 2 is a partially cutaway side view of the line I-I of FIG. 2 showing the internal structure of the wafer chuck. Top view showing the dress unit. FIG. 4 is a partially cutaway side view of line II-II of FIG. 4, showing the internal structure of the dress unit and the dress unit tilting mechanism. The schematic diagram which shows the dressing procedure. The schematic diagram which shows the state which the dress unit is tilted according to the tilt angle of a wafer chuck.

The grinding device according to the present invention has a holding means for holding the wafer and a grinding wheel for grinding the wafer in order to achieve the object of accurately dressing the grinding surface of the grinding wheel in a curved shape according to a desired wafer shape. A grinding device including a grinding means, a dressing means for dressing a grinding wheel, a dressing means tilting mechanism capable of tilting the dressing means with respect to the rotation axis of the grinding wheel, and a dress remaining amount of the dressing means. This is realized by providing a measuring means for measuring the above and a control means for calculating the tilt angle of the dressing means based on the measured value of the measuring means and correcting the tilt angle of the dressing means tilting mechanism.

Hereinafter, the grinding apparatus 1 according to an embodiment of the present invention will be described with reference to the drawings. In the following examples, when the number, numerical value, quantity, range, etc. of the components are referred to, the specific number is used unless it is clearly stated or in principle it is clearly limited to a specific number. It is not limited, and may be more than or less than a specific number.

In addition, when referring to the shape and positional relationship of components, etc., unless otherwise specified or when it is considered that this is not the case in principle, those that are substantially similar to or similar to the shape, etc. shall be used. Including.

In addition, the drawings may be exaggerated by enlarging the characteristic parts in order to make the features easy to understand, and the dimensional ratios and the like of the components are not always the same as the actual ones. Further, in the cross-sectional view, hatching of some components may be omitted in order to make the cross-sectional structure of the components easy to understand. In this embodiment, the terms "upper" and "lower" correspond to upper and lower in the vertical direction.

FIG. 1 is a side view showing a basic configuration of the grinding apparatus 1 in which the dress unit 8 is omitted. FIG. 2 is a plan view of the grinding device 1. FIG. 3 is a partially cutaway side view of FIG. 2 showing the wafer chuck 3. FIG. 4 is a plan view showing the dress unit 8. FIG. 5 is a partially cutaway side view of the line II-II of FIG. 4 showing the internal structure of the dress unit 8 and the dress unit tilting mechanism 9.

The grinding device 1 grinds the wafer W on the back surface by the grinding means 2 to form a thin film. The grinding means 2 includes a grinding wheel 21, a spindle 22 to which the grinding wheel 21 is attached to the tip, and a spindle feeding mechanism 23 that feeds the spindle 22 in the vertical direction V.

The grinding wheel 21 is horizontally attached to the tip of the spindle 22. The wafer W is ground by pressing the grinding wheel 21 against the wafer W.

The spindle 22 uses a motor (not shown) to rotate the grinding wheel 21 around the rotation axis a1 along the rotation direction C1.

The spindle feed mechanism 23 includes two linear guides 23a that connect the column 4 and the spindle 22, and a known ball screw slider mechanism (not shown) that raises and lowers the spindle 22 in the vertical direction V.

A wafer chuck 3 as a holding means is arranged below the grinding means 2. The grinding device 1 includes a plurality of wafer chucks 3 in order to continuously grind a plurality of wafers W. The plurality of wafer chucks 3 are arranged at predetermined intervals on the circumference around the rotation axis of the index table 5.

The wafer chuck 3 includes a chuck 31 and an air bearing 32.

An adsorbent (not shown) made of a porous material such as alumina is embedded in the upper surface of the chuck 31. The wafer chuck 3 includes a pipeline (not shown) that passes through the chuck 31 and the air bearing 32 and extends to the surface of the chuck 31. The pipeline is connected to a vacuum source, a compressed air source and a water supply source (not shown) via a rotary joint (not shown) connected to the rotor 32a of the air bearing 32. When the vacuum source is activated, the wafer W placed on the chuck 31 is attracted and held by the chuck 31. Further, when the compressed air source or the water supply source is activated, the adsorption between the wafer W and the chuck 31 is released.

The air bearing 32 includes a rotor 32a that can rotate around the rotation shaft a2, and a stator 32b that is arranged on the outer periphery of the rotor 32a. The rotor 32a and the chuck 31 are fixed by bolts (not shown). The rotor 32a is connected to a rotary joint and rotates the chuck 31 around the rotation axis a2 along the rotation direction C2. A predetermined gap (air gap) is provided between the rotor 32a and the stator 32b, and by supplying compressed air from the outside to this gap, the rotor 32a rotates without contacting the stator 32b. be able to.

The wafer chuck 3 includes a chuck tilting mechanism 6 that tilts the rotating shaft a2 with respect to the rotating shaft a1 of the grinding wheel 21. The chuck tilting mechanism 6 includes a tilt table 61, a fixed support portion 62, an upstream side movable support portion 63, and a downstream side movable support portion 64.

The tilt table 61 is formed in a substantially triangular shape in a plan view. On the tilt table 61, the fixed support portion 62, the upstream movable support portion 63, and the downstream movable support portion 64 are arranged 120 degrees apart on the circumference of the radius R1 with the rotation axis a2 as the center.

The fixed support portion 62 is fastened to the tilt table 61 with bolts 62a.

The upstream movable support portion 63 is arranged on the upstream side of the wafer chuck 3 in the rotation direction C2 with respect to the fixed support portion 62. Since the structure of the upstream movable support portion 63 is the same as that of the downstream movable support portion 64, the structure will be described by taking the downstream side movable support portion 64 as an example, and the description of the upstream side movable support portion 63 will be omitted. ..

The downstream movable support portion 64 is arranged on the downstream side of the wafer chuck 3 in the rotation direction C2 with respect to the fixed support portion 62. The downstream movable support portion 64 includes a nut 64a embedded in the tilt table 61, a tilt ball screw 64b fixed to the index table 5 and whose upper portion is screwed into the nut 64a, and a tilt motor for rotating the tilt ball screw 64b. It is equipped with 64c. The downstream movable support portion 64 is formed longer than the fixed support portion 62 in the vertical direction V.

The grinding device 1 includes a scale 7 for measuring the amount of sedimentation of the tilt table 61 due to the load when the grinding means 2 presses the wafer W.

The grinding device 1 includes a dress unit 8 for dressing the grinding wheel 21. The dress unit 8 includes a dress board 81, a dress base mechanism 82, and a dress unit feed mechanism 83.

The dress board 81 includes a dress material 81a that is arranged so as to face the grinding wheel 21 and dresses the grinding wheel 21, and a dress base 81b that supports the dress material 81a. The dressing material 81a is a material having a higher altitude than the grinding wheel 21, and is formed of, for example, white alumina and a binder.

The dress base mechanism 82 rotatably supports the dress board 81. Specifically, the dress base mechanism 82 includes a rotor 82a that can rotate around the rotation axis a3, a stator 82b arranged on the outer periphery of the rotor 82a, and a base member 82c that is connected to the rotor 82a to support the dressboard 81. And have.

The rotor 82a is connected to a rotary joint (not shown), and rotates the dress board 81 and the base member 82c around the rotation axis a3 along the rotation direction C3. A predetermined gap (air gap) is provided between the rotor 82a and the stator 82b, and by supplying compressed air to this gap from the outside, the rotor 82a rotates without contacting the stator 82b. be able to.

Further, the dress base mechanism 82 is provided with a pipeline extending through the rotor 82a to the surface of the base member 82c. The pipeline is connected to a vacuum source and a compressed air source (not shown) via a rotary joint connected to the rotor 82a. The pipeline is connected to a vacuum source and a compressed air source (not shown) via a rotary joint (not shown) connected to the rotor 82a. When the vacuum source is activated, the dress board 81 placed on the base member 82c is attracted and held by the base member 82c. Further, when the compressed air source is activated, the adsorption between the dress board 81 and the dress base mechanism 82 is released.

The dress unit feed mechanism 83 includes two linear guides 83a connected to a base table 95, which will be described later, and a known ball screw slider mechanism 83b for raising and lowering the base table 95 in the vertical direction V. That is, the linear guide 83a and the ball screw slider mechanism 83b are arranged in parallel with the spindle feed mechanism 23.

Further, the dress unit 8 includes a touch sensor 84 that measures the thickness of the dress material 81a. The touch sensor 84 is a contact type sensor that outputs ON / OFF according to contact / non-contact with the dress material 81. The touch sensor 84 is provided so as to be able to move up and down in the vertical direction V with respect to the base table 95, and is connected to a scale (not shown) for measuring the amount of movement of the touch sensor 84. The touch sensor 84 is, for example, a contact sensor (model number: GT2-PA12K) manufactured by KEYENCE CORPORATION.

Further, the touch sensor 84 is provided so as to be able to swing around the turning center 84a. The touch sensor 84 may have any configuration as long as it is configured to be movable on a plane. Instead of the touch sensor 84, a length measuring sensor or the like using a laser beam may be used.

Further, the dress unit 8 is provided with a nozzle 85 that supplies coolant water to the surface of the dress material 81a. A flare type capable of sprinkling coolant water over a wide range may be adopted for the nozzle 85, and the nozzle 85 may be applied to the grinding wheel 21 and the touch sensor 84.

The dress unit 8 includes a dress unit tilting mechanism 9 that tilts the rotating shaft a3 with respect to the rotating shaft a1 of the grinding wheel 21. The dress unit tilting mechanism 9 includes a tilt table 91, a fixed support portion 92, an upstream side movable support portion 93, and a downstream side movable support portion 94.

On the tilt table 91, the fixed support portion 92, the upstream movable support portion 93, and the downstream movable support portion 94 are arranged 120 degrees apart on the circumference of the radius R2 about the rotation axis a3.

The fixed support portion 92 is a bolt that connects the tilt table 91 and the base table 95 in the vertical direction V. Reference numeral 92a in FIG. 5 is a spherical washer interposed between the tilt table 91 and the base table 95.

The upstream movable support portion 93 is arranged on the upstream side of the dress board 81 in the rotation direction C3 with respect to the fixed support portion 92. The structure of the upstream movable support portion 93 is the same as that of the downstream movable support portion 94, and the description of the upstream movable support portion 93 will be omitted.

The downstream movable support portion 94 is arranged on the downstream side of the dress board 81 in the rotation direction C3 with respect to the fixed support portion 92. The downstream movable support portion 94 includes an adjustment knob 94a and a tilt ball screw 94b.

The adjustment knob 94a is formed in a cylindrical shape, and its tip is fitted to the tilt table 91. An insertion hole 94c is formed in the adjustment knob 94a.

The tilt ball screw 94b is inserted into the insertion hole 94c, and its tip is fitted to the base table 95. A spring 94d is interposed between the tilt ball screw 94a and the adjustment knob 94b. When the tilt ball screw 94b rotates, the tilt table 91 is configured to rise by the amount that the tilt ball screw 94b is screwed.

The operation of the grinding device 1 is controlled by the control device 10. The control device 10 controls each of the components constituting the grinding device 1. The control device 10 is composed of, for example, a CPU, a memory, and the like. The function of the control device 10 may be realized by controlling it by using software, or may be realized by operating it by using hardware.

In the control device 10, the rotating shaft a2 is tilted with respect to the rotating shaft a1 so that a desired wafer thickness can be obtained based on the thickness of the wafer W measured by the thickness sensor (not shown), and the grinding wheel 21 is the wafer W. Adjust the machining range to grind. The thickness sensor is not limited to the one included in the configuration of the grinding device 1, and may be, for example, one that feeds back the data measured by the external device of the grinding device 1 to the control device 10. The upstream movable support portion 63 and the downstream movable support portion 64 independently expand and contract along the vertical direction V, and the tilt table 61 is tilted with respect to the fixed support portion 62, thereby tilting the rotation axis a2. Can be done.

The control device 10 stores data on the amount of grinding of the wafer W according to the angle (tilt angle Θ1) of the rotating shaft a2 with respect to the rotating shaft a1, that is, the contact angle of the wafer W with respect to the grinding wheel 21. Thereby, the thickness of the wafer W before grinding or the thickness of the wafer W during grinding is measured, and the grinding amount and the tilt angle of the rotating shaft a2 with respect to the rotating shaft a1 are adjusted from the difference between this thickness and the desired thickness of the wafer. Further, data regarding the shape of the grinding surface 21a of the grinding wheel 21 according to the angle (tilt angle Θ2) of the rotating shaft a3 with respect to the rotating shaft a1 is stored.

Next, the operation of the dress unit 8 will be described with reference to the drawings. FIG. 6 is a schematic view showing a dressing procedure. FIG. 7 is a schematic view showing a state in which the dress unit 8 is tilted according to the tilt angle of the wafer chuck 3.

First, as shown in FIG. 6A, a dummy board DB imitating the dress board 81 is placed on the base member 82c before the grinding wheel 21 is dressed. A dummy board DB having a known thickness is prepared.

Next, as shown in FIG. 6B, the touch sensor 84 is brought into contact with the dummy board DB. The control device 10 stores the feed amount of the touch sensor 84 when the touch sensor 84 comes into contact with the dummy board DB. Hereinafter, the feed amount of the touch sensor 84 is used as a reference value.

Next, as shown in FIG. 6C, the touch sensor 84 is brought close to the dress board 81, and the touch sensor 84 is brought into contact with the dress material 81a. The control device 10 stores the feed amount of the touch sensor 84 when the touch sensor 84 comes into contact with the dress material 81a. The touch sensor 84 is moved on a flat surface to store the feed amount of the touch sensor 84 at at least three points including the rotation center O of the dress material 81.

Further, the rotating shaft a3 of the dress unit 8 can be tilted by the dress unit tilting mechanism 9 to dress the grinding surface 21a of the grinding wheel 21 into a curved surface. For example, as shown in FIG. 7, the dress board 81 is pushed against the grinding wheel 21 in a one-sided contact state by extending the upstream movable support portion 93 and the downstream movable support portion 94 and tilting the tilt table 91. The grinding surface 21a of the grinding wheel 21 can be formed in a medium-convex shape in which the central portion of the grinding wheel 21 is thicker than the outer peripheral portion. Further, the upstream movable support portion 93 and the downstream movable support portion 94 contract and the tilt table 91 tilts, so that the central portion of the grinding wheel 21 is formed into a hollow shape thinner than the outer peripheral portion to form the grinding surface 21a of the grinding wheel 21. Can be formed.

When the wafer chuck 3 is tilted, the upstream movable support portion 93 and the downstream movable support portion 94 of the tilt table 91 so that the tilt angle Θ1 of the tilt table 61 and the tilt angle Θ2 of the tilt table 91 match. Stretch.

Specifically, the expansion / contraction amount ΔL1 of the upstream movable support portion 63 and the expansion / contraction amount ΔL2 of the downstream movable support portion 64 are measured on a scale (not shown). Of the upstream movable support portion 93 and the downstream movable support portion 94, one of the upstream movable support portion 93 and the downstream movable support portion 94 is located symmetrically with the upstream movable support portion 63 with the center O of the grinding wheel 21 interposed therebetween (in this embodiment, the downstream movable support portion). 94) is expanded and contracted by the expansion and contraction amount ΔL3 according to the expansion and contraction amount ΔL1. The expansion / contraction amount ΔL3 is calculated by ΔL3 = ΔL1 × R2 / R1.

Further, of the upstream movable support portion 93 and the downstream movable support portion 94, the other (in this embodiment, the upstream / downstream side movable support) is located symmetrically with the downstream side movable support portion 64 with the center O of the grinding wheel 21 interposed therebetween. Part 93) is expanded and contracted by the expansion and contraction amount ΔL4 according to the expansion and contraction amount ΔL2. The expansion / contraction amount ΔL4 is calculated by ΔL4 = ΔL2 × R2 / R1.

That is, by pre-dressing the grinding surface 21a of the grinding wheel 21 according to the inclination of the wafer chuck 3, the shape of the wafer W can be indirectly determined according to the inclination of the dress board 81.

Further, the control device 10 calculates the tilt angle (actual tilt angle) of the dress unit 8 based on the feed amount of the touch sensor 84. Then, it is determined whether or not the actual tilt angle and the dress unit 8 stored in advance match, and if they do not match, the actual tilt angle calculated based on the feed amount of the touch sensor 84 is set in advance. The upstream movable support portion 93 and the downstream movable support portion 94 are expanded and contracted so as to match the target tilt angle.

Next, as shown in FIG. 6D, the grinding wheel 21 is dressed with the dressing material 81a. The dress unit 8 dresses the grinding surface 21a of the grinding wheel 21 after grinding the wafer W. Specifically, when the grinding of the wafer W is completed, the grinding wheel 21 retracts above the vertical direction V. After that, the ball screw slider mechanism 83b is driven, and the dress material 81a approaches the grinding surface 21a of the grinding wheel 21.

Then, while rotating the grinding wheel 21 and the dress board 81, the dress board 81 is pressed against the grinding wheel 21, so that the grinding surface 21a of the grinding wheel 21 is dressed by the dressing material 81a.

Since the ball screw slider mechanism 83b is arranged in parallel with the spindle feed mechanism 23, the ball screw slider mechanism 83b receives a pressing force along the vertical direction V when the dressboard 81 is pressed against the grinding wheel 21. The grinding wheel 21 can be stably dressed.

Further, since the ball screw slider mechanism 83b is arranged between the center O of the grinding wheel 21 and the spindle feed mechanism 23, the dressboard is placed on the base table 95 cantilevered by the linear guide 83a and the ball screw slider mechanism 83b. When the pressing force along the vertical direction V when pressing the 81 against the grinding wheel 21 is suppressed locally, and the base table 95 cantilevered supported by the linear guide 83a dresses the grinding wheel 21. Since the reaction force prevents the grinding wheel 21 from jumping up, the grinding wheel 21 can be dressed more stably.

When dressing the grinding wheel 21, the touch sensor 84 comes into contact with the dressing material 81a. By continuing to feed the touch sensor 84 so that the touch sensor 84 keeps in contact with the dress material 81, the thickness of the dress material 81 (remaining amount of dress) is increased based on the above-mentioned reference value and the feed amount of the touch sensor 84. Can be measured.

When the dress board 81 rotates while the coolant water is being supplied, the excess coolant water is scattered by centrifugal force, and an extremely thin water film is formed on the surface of the dress material 81a. As an example of forming the water film, it is conceivable to set the supply amount of coolant water to 0.1 to 0.5 l / min and the rotation speed of the dressboard 81 to 400 rpm or less. In this way, the touch sensor 84 comes into contact with the dress material 81a via the water film, so that the wear of the touch sensor 84 is suppressed. The coolant water is preferably supplied so as to hit the grinding wheel 21 and the touch sensor 84.

In this way, the grinding device 1 described above presses the dressboard 81 against the grinding wheel 21 in a state where the dressboard 81 is tilted with respect to the rotation axis a1 of the grinding wheel 21, so that the dressboard 81 can be pressed against the grinding wheel 21 according to a desired wafer shape. The grinding surface 21a of the grinding wheel 21 can be dressed in a curved shape.

Further, since the tilt angle of the dress unit tilting mechanism 9 is corrected so that the actual tilt angle of the dressboard 81 obtained based on the measured value of the touch sensor 84 matches the target tilt angle stored in advance, grinding is performed. The ground surface 21a of the grindstone 21 can be accurately dressed in a curved shape.

It should be noted that the present invention can be modified in various ways as long as it does not deviate from the spirit of the present invention, and it is natural that the present invention extends to the modified ones.

1 ・ ・ ・ Grinding device 2 ・ ・ ・ Grinding means 21 ・ ・ ・ Grinding wheel 22 ・ ・ ・ Spindle 23 ・ ・ ・ Spindle feed mechanism 23a ・ ・ ・ Linear guide 3 ・ ・ ・ Wafer chuck (holding means)
31 ・ ・ ・ Chuck 32 ・ ・ ・ Air bearing 32a ・ ・ ・ Rotor 32b ・ ・ ・ Stator 4 ・ ・ ・ Column 5 ・ ・ ・ Index table 6 ・ ・ ・ Chuck tilt mechanism 61 ・ ・ ・ Tilt table 62 ・ ・ ・ Fixed Support part 62a ・ ・ ・ Bolt 63 ・ ・ ・ Upstream side movable support part 64 ・ ・ ・ Downstream side movable support part 7 ・ ・ ・ Scale 8 ・ ・ ・ Dress unit (dressing means)
81 ... Dress board 81a ... Dress material 81b ... Dress base 82 ... Dress base mechanism 82a ... Rotor 82b ... Stator 82c ... Base member 83 ... Dress unit feed mechanism 83a ・ ・ ・ Linear guide 83b ・ ・ ・ Ball screw slider mechanism 84 ・ ・ ・ Touch sensor 84a ・ ・ ・ Turning center 85 ・ ・ ・ Nozzle 9 ・ ・ ・ Dress unit tilt mechanism 91 ・ ・ ・ Tilt table 92 ・ ・ ・ Fixed support Part 93 ・ ・ ・ Upstream side movable support part 94 ・ ・ ・ Downstream side movable support part 10 ・ ・ ・ Control device W ・ ・ ・ Wafer

Claims (5)

A grinding device including a holding means for holding a wafer and a grinding means having a grinding wheel for grinding the wafer.
The dressing means for dressing the grinding wheel and
A dressing means tilting mechanism capable of tilting the dressing means with respect to the rotation axis of the grinding wheel,
A measuring means for measuring the remaining amount of the dress of the dressing means,
A control means that calculates the tilt angle of the dressing means based on the measured value of the measuring means and corrects the tilt angle of the dressing means tilting mechanism.
A grinding device characterized by being equipped with. The grinding apparatus according to claim 1, wherein the measuring means is provided so as to be movable on a flat surface. The grinding apparatus according to claim 2, wherein the measuring means is provided so as to be swingable. The grinding apparatus according to any one of claims 1 to 3, wherein the measuring point of the measuring means includes at least the rotation center of the dressing means. The measuring means is a touch sensor.
Any one of claims 1 to 4, wherein the control means calculates the remaining amount of the dress after the dress by subtracting the amount of elevation of the touch sensor after the dress from the known remaining amount of the dress before the dress. The grinding device according to the section.