JP6804860B2 - Manufacturing method of carrier sheet and cutting member - Google Patents

Description

The present invention relates to a method for manufacturing a carrier sheet and a cutting member.

When manufacturing electronic device parts, a manufacturing method is used in which various electronic device parts are temporarily adhesively fixed to an adhesive film, cut into the shape of each part, and then each part is peeled off from the adhesive film after cutting. .. The adhesive film used in such a manufacturing method is called a "carrier sheet" or a "process film".

The carrier sheet has a basic structure having a peelable adhesive layer on a base material such as a plastic film, and for example, a carrier sheet such as Patent Document 1 has been proposed.

Patent Document 1 has a carrier having an appropriate adhesive force by providing an adhesive layer having a specific composition on a base material, excellent workability at the time of cutting, and eliminating zipping, adhesive residue, and powder falling off. The sheet is disclosed.

JP-A-2009-292959

In recent years, the miniaturization of electronic device parts has further progressed, and improvement in cutting accuracy has been required more. In order to improve the cutting accuracy, for example, a means of heat-pressing a laminate in which electronic device parts are arranged on a carrier film and cutting the electronic device parts in a state of being firmly fixed to the carrier film is implemented. According to such means, it can be expected that the holding property of the electronic device component is improved, the electronic device component is less likely to shift during cutting, and the dimensional accuracy is improved.

However, when the electronic device component has an uneven shape, the carrier film may not follow the uneven shape of the electronic device component during heat crimping. In this case, even if the heat crimping treatment is performed, the holding property of the electronic device component cannot be sufficiently improved, the position of the electronic device component may shift during cutting, and the dimensional accuracy may decrease.
In conventional carrier films such as Patent Document 1, the followability to the uneven shape at the time of heat crimping described above has not been sufficiently studied.

An object of the present invention is to provide a carrier sheet having excellent followability to an uneven shape at the time of heat crimping, and a method for manufacturing a cut member using the carrier sheet.

In order to solve the above problems, the present invention provides the following methods for manufacturing carrier sheets and cut members [1] to [2].
[1] A carrier sheet having an adhesive layer on a base material, wherein the base material has a melting peak temperature measured by a differential scanning calorimeter under the conditions of a measurement temperature of 0 to 150 ° C. and a heating rate of 10 ° C./min. A carrier sheet having at least two melting peaks in a temperature range of 20 to 110 ° C. when measured and satisfying the following condition 1.
<Condition 1>
A baseline connecting 20 ° C. and 110 ° C. is drawn with respect to the melting curve obtained in the measurement, and the area defined between the baseline and the melting curve is defined as S. The melting peak on the lowest temperature side is defined as the first peak, and the melting peak on the lowest temperature side among the melting peaks located on the higher temperature side than the first peak is defined as the second peak. The temperature on the coldest side of the temperature at which the slope of the melting curve changes from positive to negative between the first peak and the second peak is defined as the inflection temperature. Relative to the base line, the pull perpendicular line L as temperature axis inflection temperature, the melting curve, the area of the cold side of the area defined by the base line and the line L and S ₁ .. S ₁ / S satisfies the condition of 0.30 or more.
[2] A method for manufacturing a cut member having the following steps (1) to (4).
(1) A step of producing a laminated body in which an uneven side surface of a member having unevenness on at least one surface is arranged on the adhesive layer of the carrier sheet according to the above [1].
(2) A step of heat-pressing the laminate at a temperature exceeding the first peak temperature of the base material of the carrier sheet and lower than the second peak temperature.
(3) A step of cutting the heat-bonded laminate to an arbitrary size from the member side so that the base material is not cut.
(4) A step of removing a carrier sheet from a laminated body to obtain a member cut to an arbitrary size.

The carrier sheet of the present invention has excellent followability to uneven shapes during heat crimping, and can improve cutting accuracy. Further, in the method for manufacturing a cut member of the present invention, a cut member having excellent dimensional accuracy can be manufactured by a simple method.

It is sectional drawing which shows one Embodiment of the carrier sheet of this invention. It is a melting curve of the base material of the carrier sheet of Example 1. It is a melting curve of the base material of the carrier sheet of Example 2. It is a melting curve of the base material of the carrier sheet of Example 3. It is a melting curve of the base material of the carrier sheet of Comparative Example 1. It is a melting curve of the base material of the carrier sheet of Comparative Example 2. It is a process drawing which shows the embodiment of the manufacturing method of the cut member of this invention.

[Career sheet]
The carrier sheet of the present invention is a carrier sheet having an adhesive layer on a base material, and the base material is measured by a differential scanning calorimeter under the conditions of a measurement temperature of 0 to 150 ° C. and a heating rate of 10 ° C./min. When the melting peak temperature is measured, it has at least two melting peaks in the temperature range of 20 to 110 ° C. and satisfies the following condition 1.
<Condition 1>
A baseline connecting 20 ° C. and 110 ° C. is drawn with respect to the melting curve obtained in the measurement, and the area defined between the baseline and the melting curve is defined as S. The melting peak on the lowest temperature side is defined as the first peak, and the melting peak on the lowest temperature side among the melting peaks located on the higher temperature side than the first peak is defined as the second peak. The temperature on the coldest side of the temperature at which the slope of the melting curve changes from positive to negative between the first peak and the second peak is defined as the inflection temperature. Relative to the base line, the pull perpendicular line L as temperature axis inflection temperature, the melting curve, the area of the cold side of the area defined by the base line and the line L and S ₁ .. S ₁ / S satisfies the condition of 0.30 or more.

Hereinafter, embodiments of the present invention will be described.
In addition, in this specification, "a laminated body which arranges the surface which has the unevenness of the member which has the unevenness on at least one surface on the adhesive layer of a carrier sheet" is simply referred to as "the laminated body". In some cases.
Further, in the present specification, the "step of heat-pressing the laminate at a temperature exceeding the temperature of the first peak of the base material of the carrier sheet and lower than the temperature of the second peak" is simply referred to as "heat-bonding step". It may be called.

FIG. 1 is a cross-sectional view showing an embodiment of the carrier sheet 100 of the present invention. The carrier sheet 100 of FIG. 1 has an adhesive layer 20 on the base material 10.

[Base material]
The base material has at least two melting peaks in the temperature range of 20 to 110 ° C. when the melting peak temperature is measured by a differential scanning calorimeter under the conditions of a measurement temperature of 0 to 150 ° C. and a heating rate of 10 ° C./min. It must be possessed and satisfy the above condition 1.

In order to improve the followability of the carrier sheet to the uneven shape, a means for softening the adhesive layer described later can be considered.
However, the thickness of the adhesive layer is usually 10 to 20 μm from the viewpoint of suppressing curl, and cannot be coped with when the uneven shape of the member has a large step. Further, when the adhesive layer is excessively softened, the adhesive layer tends to protrude around the laminate during the heat-bonding step.
Therefore, in the present invention, by using a specific base material, the ability of the carrier sheet to follow the uneven shape is improved.

2 to 6 show that the base materials of the carrier sheets of Examples 1 to 2 and Comparative Examples 1 and 2 are melted by a differential scanning calorimeter under the conditions of a measurement temperature of 0 to 150 ° C. and a heating rate of 10 ° C./min. It is a melting curve when the peak temperature is measured.
Hereinafter, the "melting curve when the melting peak temperature is measured by a differential scanning calorimeter under the conditions of a measurement temperature of 0 to 150 ° C. and a heating rate of 10 ° C./min" is simply referred to as "melting curve A". There is.

The melting curves A of FIGS. 2 to 6 each have two melting peaks in the temperature range of 20 to 110 ° C.
When there is no melting peak in the temperature range of 20 to 110 ° C., it is not possible to improve the followability of the carrier sheet to the uneven shape. Further, when there is only one melting peak in the temperature range of 20 to 110 ° C., almost no non-melted portion remains during the heat crimping process, and the base material is excessively softened during the heat crimping process. The dimensional accuracy is significantly reduced.
In order to improve the followability of the carrier sheet to the uneven shape, it is first important that the base material has at least two melting peaks in the temperature range of 20 to 110 ° C. However, even if the base material has at least two melting peaks in the temperature range of 20 to 110 ° C., the followability of the carrier sheet to the uneven shape cannot be improved unless the above condition 1 is satisfied.

The base material of the carrier sheet of the present invention satisfies the above condition 1. Hereinafter, condition 1 will be described with reference to FIG.
First, a baseline connecting 20 ° C. and 110 ° C. is drawn with respect to the melting curve A, and the area defined between the baseline and the melting curve A is defined as S. The alternate long and short dash line in FIG. 2 corresponds to the baseline.
Next, the melting peak on the lowest temperature side is set as the first peak, and the melting peak on the lowest temperature side among the melting peaks located on the higher temperature side than the first peak is set as the second peak. “A” in FIG. 2 corresponds to the first peak, and “b” corresponds to the second peak.
Next, the temperature on the coldest side of the temperature at which the slope of the melting curve A changes from positive to negative between the first peak and the second peak is defined as the inflection temperature. “C” in FIG. 2 corresponds to the inflection point.
Then, the base line, inflection temperature drawn perpendicular line L as the temperature axis, the melting curve A, the area of the cold side of the area defined by the baseline and the line L and S _1. The broken line in FIG. 2 corresponds to the line L.
S ₁ / S in FIG. 2 is 0.39, which satisfies the condition 1 that requires S ₁ / S to be 0.30 or more.

Having at least two melting peaks in the temperature range of 20-110 ° C. means that at least two stages of phase transitions have occurred in the temperature range of 20-110 ° C. The fact that S ₁ / S is 0.30 or more indicates that the amount of heat of fusion in the first stage phase transition of the substrate is large. In other words, the fact that S ₁ / S is 0.30 or more means that the carrier sheet exhibits good followability to the uneven shape due to the phase transition of the first stage of the base material.
On the other hand, when S ₁ / S is less than 0.30, the carrier sheet cannot sufficiently follow the uneven shape.

Under condition 1, S ₁ / S is preferably 0.32 or more, more preferably 0.35 or more, and even more preferably 0.37 or more.
The upper limit of S ₁ / S is not particularly limited, but is preferably 0.60 or less, preferably 0.50 or less, from the viewpoint of suppressing excessive softening of the base material during the heat bonding step. More preferably, it is 0.45 or less.

The temperature of the first peak of the base material is preferably 40 to 70 ° C., more preferably 45 to 65 ° C., and even more preferably 50 to 60 ° C.
The temperature at which the laminate is heat-bonded is a temperature exceeding the temperature of the first peak. Therefore, when the temperature of the first peak is in the above range, the workability of the heat crimping step can be improved and the cost required for heating can be reduced.

The temperature difference between the first peak and the second peak of the base material is preferably 20 ° C. or higher, more preferably 25 ° C. or higher, and even more preferably 27 ° C. or higher.
When the temperature difference between the first peak and the second peak is close, the base material may be softened more than necessary due to the influence of the second peak in the heat bonding step. By setting the temperature difference between the first peak and the second peak within the above range, it is easy to eliminate the influence of the second peak in the heat crimping step, and it is possible to easily improve the dimensional accuracy.
Further, if the temperature difference between the first peak and the second peak is large, it tends to be difficult to satisfy the above condition 1. Therefore, the temperature difference between the first peak and the second peak is preferably 45 ° C. or lower, and more preferably 40 ° C. or lower.

Further, the base material preferably has a ratio of [storage elastic modulus at 20 ° C. of the base material / storage elastic modulus at a temperature 10 ° C. higher than the temperature of the first peak of the base material] of 9.0 or more. It is more preferably 5 or more, and further preferably 14.0 or more.
Hereinafter, the ratio of [storage elastic modulus at 20 ° C. of the base material / storage elastic modulus at a temperature 10 ° C. higher than the temperature of the first peak of the base material] is referred to as "ratio of storage elastic modulus of the base material". There is.

The ratio of the storage elastic modulus of the base material to the above range means that the storage elastic modulus at the temperature during the heat crimping process is low, while the storage elastic modulus at room temperature (20 ° C.) tends to be high. doing.
Therefore, by setting the ratio of the storage elastic modulus of the base material to the above range, the handleability of the carrier sheet at room temperature (20 ° C.) can be improved, and by extension, the member can be placed on the adhesive layer of the carrier sheet. The workability of the step of producing the arranged laminated body and the step of removing the carrier sheet after cutting the laminated body to an arbitrary size can be improved. Further, by setting the ratio of the storage elastic modulus of the base material to the above range, the carrier sheet can easily follow the uneven shape during the heat-bonding step.
The upper limit of the storage elastic modulus ratio of the base material is not particularly limited, but is about 20.0.

Further, when the value obtained by dividing the loss elastic modulus by the storage elastic modulus is used as the loss coefficient, the ratio of [loss coefficient at 20 ° C. of the base material / loss coefficient at a temperature 10 ° C higher than the temperature of the first peak of the base material]. Is preferably 0.75 or less, more preferably 0.70 or less, further preferably 0.60 or less, and even more preferably 0.50 or less.
Hereinafter, the ratio of [loss factor of the base material at 20 ° C./loss factor at a temperature 10 ° C. higher than the temperature of the first peak of the base material] may be referred to as "ratio of loss factor of the base material".

The loss factor represents the degree of energy absorbed by a material as it deforms. That is, the fact that the ratio of the loss factor of the base material is in the above range means that the base material absorbs a lot of energy in the temperature range during the heat crimping process, while the base material absorbs a lot of energy at room temperature (20 ° C.). It means that it tends not to absorb. Further, the degree of energy absorption of the base material is considered to be related to the degree of melting of the material constituting the base material.
Therefore, by setting the ratio of the loss coefficient of the base material to the above range, the handleability of the carrier sheet at room temperature (20 ° C.) can be improved, and by extension, the member is arranged on the adhesive layer of the carrier sheet. It is possible to improve the workability of the step of producing the laminated body and the step of removing the carrier sheet after cutting the laminated body to an arbitrary size. Further, by setting the ratio of the loss coefficient of the base material to the above range, the carrier sheet can easily follow the uneven shape during the heat crimping step.

The type of the base material is not particularly limited as long as it has at least two melting peaks in the temperature range of 20 to 110 ° C. and satisfies the above condition 1.
As the base material, a resin base material is preferable, and a base material formed from a composition containing an ionomer (hereinafter, may be referred to as an “ionomer base material”) is particularly preferable.

An ionomer is a polymer formed by forming an ionic aggregate between an ionic group in a polymer chain and a metal ion.
When the ionomer substrate is heated, it is easy to observe two melting peaks. The first peak when the ionomer substrate is heated is considered to be caused by the loosening of the bond of the ionic aggregate (the ionic crystal is melted), and the second peak is considered to be caused by the crystal melting of the polymer chain.

Although the ionomer substrate makes it easy to observe the two melting peaks as described above, the ionomer substrate does not necessarily satisfy the above condition 1. Rather, even an ionomer base material often does not satisfy the above condition 1.
In order to satisfy the above condition 1, it is important to increase the degree of neutralization as described later.

Examples of the ionomer polymer chain include ethylene-acrylic acid copolymers, ethylene-methacrylic acid copolymers, propylene-acrylic acid copolymers, and propylene-methacrylic acid copolymers. Examples of the ionomer metal ion include Na ⁺ , Zn ^{2+, and the} like.
It can be said that ionomer is a neutralized acid group existing in a polymer chain with a metal ion. The greater the degree of this neutralization, the larger the first peak, which requires a larger amount of energy when the bond of the ionic aggregate is loosened (the ionic crystal melts), and the larger the S ₁ / S, and the condition 1 Will be easier to meet.

The second peak of the ionomer is considered to be derived from the physical properties of the polymer chain. Therefore, the second peak of the ionomer can be adjusted by the type of polymer constituting the polymer chain, the molecular weight of the polymer, the crystallinity of the polymer, and the like.

The thickness of the base material is preferably 30 to 200 μm, more preferably 50 to 150 μm, and further preferably 80 to 130 μm from the viewpoint of followability to the uneven shape and cost-effectiveness balance. preferable.

In order to improve the adhesion to the adhesive layer described later, the base material may be subjected to an easy adhesion treatment such as a corona discharge treatment on the surface of the base material or an easy adhesive layer.

[Adhesive layer]
The adhesive layer can be used without particular limitation as long as it has an adhesive force capable of holding the member and can be peeled off after the cutting step is completed.

As the adhesive contained in the adhesive layer, a pressure-sensitive adhesive (adhesive) capable of adhering members at room temperature is preferable. Further, among the pressure-sensitive adhesives, an ionizing radiation-curable adhesive composition is preferable. By irradiating the ionizing radiation curable adhesive composition with ionizing radiation after the cutting step to promote curing, the adhesive force to the member is reduced, and the workability of peeling the carrier sheet from the laminate can be improved. ..
In addition, in this specification, ionizing radiation means an electromagnetic wave or a charged particle beam having an energy quantum capable of polymerizing or cross-linking a molecule, and is usually used by ultraviolet rays (UV) or electron beams (EB). However, in addition, electromagnetic waves such as X-rays and γ-rays, charged particle beams such as α-rays and ion rays can be used, and near-ultraviolet rays (UV-A) can also be used.

Examples of the pressure-sensitive adhesive include acrylic adhesives, polyester adhesives, urethane adhesives, rubber adhesives, silicone adhesives and the like.

The ionizing radiation curable adhesive composition includes a pressure-sensitive adhesive polymer, an ionizing radiation-polymerizable compound that cures by irradiation with ionizing radiation and acts to reduce the adhesive force to the member as compared with that before irradiation with ionizing radiation. Examples thereof include a composition containing a photopolymerization initiator. When the pressure-sensitive adhesive polymer itself contains a functional group that polymerizes by irradiation with ionizing radiation, the pressure-sensitive adhesive polymer and the ionizing radiation polymerizable compound can be used in combination.

The pressure-sensitive adhesive polymer includes (meth) acrylic polymer, polyester polymer, polyether polymer, vinyl acetate polymer, vinyl acetate-ethylene copolymer polymer, ethylene-ethyl acrylate copolymer polymer, ethylene-. Examples thereof include (meth) acrylic acid copolymer-based polymers, urethane-based polymers, synthetic rubber-based polymers, polybutyral-based polymers, and epoxy-based polymers.

Examples of the ionizing radiation-polymerizable compound that acts to reduce the adhesive force to the member as compared with that before the ionizing radiation irradiation include those containing an ionizing radiation-polymerizable group such as a (meth) acrylic group and a vinyl group. Specifically, trimethylolpropane triacrylate, tetramethylolmethanetetraacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate, 1,4-butylene glycol diacrylate, etc. Can be mentioned.

General-purpose photopolymerization initiators can be used, for example, 4- (2-hydroxyethoxy) phenyl (2-hydroxy-2-propyl) ketone, α-hydroxy-α, α'-dimethylacetophenone, methoxy. Examples thereof include acetophenone derivative compounds such as acetophenone, benzoin ether compounds such as benzoin ethyl ether and benzoin propyl ether, and ketal derivative compounds such as benzyl dimethyl ketal.

The thickness of the adhesive layer is preferably 1 to 100 μm, more preferably 3 to 50 μm, and even more preferably 5 to 25 μm, from the viewpoint of suppressing curling and ensuring an appropriate holding force. ..

Examples of means for forming the adhesive layer on the base material include means for applying and drying the adhesive layer forming coating liquid containing an adhesive on the base material, but once the adhesive layer is formed on another member. A means (transfer method) for producing the intermediate member and laminating the intermediate member and the substrate is preferable. When the base material is placed in an environment exceeding the first peak temperature, even if the base material is subsequently cooled, the original physical properties of the base material may be impaired (for example, the first peak is less likely to appear), but transfer is performed. According to the method, it is possible to easily maintain the original physical properties of the base material. As another member used in the transfer method, a release film described later is suitable.

When the adhesive is an ionizing radiation curable adhesive composition, the curing of the ionizing radiation curable adhesive composition is not completed at the stage of forming the adhesive layer, and the laminate is cut and then irradiated with ionizing radiation. It is preferable to proceed with the curing of the ionizing radiation curable adhesive composition. By irradiating the ionizing radiation in this way, it is possible to improve the holding force of the member at the stage of cutting and to improve the peelability of the carrier sheet after cutting the laminated body.
In order to obtain the above effects, it is not necessary to irradiate ionizing radiation at all at the stage of forming the adhesive layer, but irradiate ionizing radiation insufficient for the ionizing radiation curable adhesive composition to be completely cured. It is also preferable to partially cure the ionizing radiation curable adhesive composition, cut the laminate, and then re-irradiate the ionizing radiation to proceed with the curing of the ionizing radiation curable adhesive composition. .. By dividing the curing of the ionizing radiation curable adhesive composition into a plurality of stages in this way, the cohesive force of the adhesive layer is enhanced, the holding force of the member at the cutting stage is improved, and the laminated body is formed. The peelability of the carrier sheet after cutting can be improved.

It is preferable to laminate a release film on the adhesive layer in order to improve handleability. Examples of the release film include a film surface-treated with a release agent such as silicone, a polyethylene terephthalate film, and the like. As described above, the release film can also be used as a support when forming the adhesive layer by the transfer method.

In the carrier sheet of the present invention, the carrier film can sufficiently follow the uneven shape of the member at the time of heat crimping, and the holding property of the member can be improved. It is possible to suppress a decrease in dimensional accuracy.
Further, since the carrier sheet of the present invention has good followability to unevenness, it is possible to suppress air from entering between the carrier sheet and the unevenness.

[Manufacturing method of cut member]
The embodiment of the method for manufacturing a cut member of the present invention has the following steps (1) to (4).
(1) A step of producing a laminated body in which an uneven side surface of a member having unevenness on at least one surface is arranged on the adhesive layer of the carrier sheet of the present invention described above.
(2) A step of heat-bonding the laminate at a temperature exceeding the temperature of the first peak of the base material of the carrier sheet and lower than the temperature of the second peak.
(3) A step of cutting a heat-bonded laminate to an arbitrary size from the member side so that the base material is not cut.
(4) A step of removing a carrier sheet from a laminated body to obtain a member cut to an arbitrary size.

FIG. 7 is a process diagram showing an embodiment of the method for manufacturing a cut member of the present invention.
In the step (1), a laminate 200 is produced in which the surface of the member 30 having the unevenness 31 on at least one surface is arranged on the adhesive layer 20 of the carrier sheet 100. When the release film is provided on the adhesive layer 20, the release film is peeled off before the member 30 having irregularities is arranged on the adhesive layer 20.
Examples of the member 30 having irregularities include a copper-clad laminate, a multilayer ceramic chip capacitor, and the like.

In the step (2), the laminate 200 is heat-bonded at a temperature exceeding the temperature of the first peak of the base material 10 of the carrier sheet and lower than the temperature of the second peak.
Temperature during thermocompression bonding, the temperature of the first peak _(t 1), and a second peak based on the temperature _{(t 2) of,} preferably to _t 1 + 0 ° C. range _~t 2 -10 ° C., t and more preferably in the range of _{1 + 5 ℃ ~t 2 -20 ℃} .
The heat crimping time is usually about 10 to 180 seconds.
The step (2) is preferably performed in a vacuum environment using a vacuum chamber or the like.

In the step (3), the heat-bonded laminate 200 is cut to an arbitrary size from the member 30 side so that the base material 10 is not cut.
Examples of the cutting method in the step (3) include cutting with a cutting blade and cutting with a laser. Laser cutting (laser cutting) is suitable because it is excellent in production efficiency.
If all of the adhesive layer 20 in the thickness direction is cut in the step (3), a part of the adhesive layer 20 may remain on the member 30 side in the step (4). Therefore, in the step (3), it is preferable to cut the member 30 so that at least a part of the adhesive layer 20 in the thickness direction remains.

In the step (4), the carrier sheet 100 is removed from the laminated body 200 to obtain a member 30a cut to an arbitrary size.

In the method for producing a cut member of the present invention, a carrier sheet containing an ionizing radiation curable resin composition is used as an adhesive layer, and the following step (3.5) is performed between steps (3) and (4). It is preferable to have.
(3.5) A step of irradiating the adhesive layer with ionizing radiation to promote curing of the ionizing radiation curable resin composition.

By performing the above step (3.5), the peeling force when removing the carrier sheet 100 from the laminated body 200 in the step (4) becomes light, and the workability of the step (4) can be improved.

When the above step (3.5) is performed, the ionizing radiation curable adhesive composition in the adhesive layer of the carrier sheet used in the step (1) does not have to be irradiated with ionizing radiation at all. It is preferable to partially cure the ionizing radiation-curable adhesive composition by irradiating it with ionizing radiation insufficient for the ionizing radiation-curable adhesive composition to be completely cured. By doing so, the cohesive force of the adhesive layer is enhanced, the holding force of the member at the cutting stage is improved, and the peelability of the carrier sheet after cutting the laminate is improved. be able to.

According to the method for manufacturing a cutting member of the present invention, the carrier film can sufficiently follow the uneven shape of the member during the heat crimping in the step (2), and the holding property of the member can be improved, so that the position of the member at the time of cutting can be improved. It is possible to prevent the cut member from being displaced and to prevent the dimensional accuracy of the cut member from being lowered. Further, in the method for manufacturing a cut member of the present invention, since the carrier film can sufficiently follow the uneven shape of the member during the heat crimping in the step (2), air can enter between the carrier sheet and the unevenness. Can be suppressed.

Hereinafter, the present invention will be specifically described with reference to Examples, but the present invention is not limited to the following examples.

1. 1. Preparation of base material and measurement of physical properties of the base material The following base materials 1 to 5 were prepared as the base materials used in Examples 1 to 3 and Comparative Examples 1 and 2.
Base material 1: Ionomer base material (trade name: Hymilan 1855, manufactured by Mitsui / DuPont Polychemical Co., Ltd., thickness 100 μm)
Base material 2: Ionomer base material (trade name: Hymilan 1707, manufactured by Mitsui / DuPont Polychemical Co., Ltd., thickness 100 μm)
Base material 3: Ionomer base material (trade name: RB0086, manufactured by Kurabo Industries, thickness 100 μm)
Base material 4: Ionomer base material (trade name: Hymilan 1652, manufactured by Mitsui / DuPont Polychemical Co., Ltd., thickness 100 μm)
Base material 5: Polypropylene / ethylene-vinyl acetate copolymer / polypropylene, 3-layer base material (trade name: Povic, manufactured by Achilles, thickness 100 μm)

2. 2. Measurement of physical properties of base materials For the above base materials 1 to 5, differential scanning calorimetry (trade name: EXSTRA DSC6200, trade name: EXSTRA DSC6200,) under the conditions of measurement temperature 0 to 150 ° C. The melting peak temperature was measured by Hitachi High-Tech Science Co., Ltd.). The melting peak curves of the base materials 1 to 5 are shown in FIGS. 2 to 6. Table 1 shows the "temperature of the first peak", the "temperature difference between the first peak and the second peak", and "S ₁ / S" calculated from the measurement results.
Further, with respect to the base materials 1 to 5, the storage elastic modulus E'and the loss coefficient tan δ at 18 to 90 ° C. were measured using a dynamic viscoelasticity measuring device (trade name: EXSTRA DMS6100, manufactured by Hitachi High-Tech Science Co., Ltd.). , The ratio of the storage elastic modulus of the base material, and the ratio of the loss coefficient of the base material were calculated. The measurement frequency was 1 Hz, and the distortion was 0.1 to 3.0%. The results are shown in Table 1.

3. 3. Preparation of Carrier Sheet [Example 1]
On the release-treated surface of a release film with a thickness of 50 μm (manufactured by Mitsui Chemicals Tohcello Co., Ltd., trade name: SPPET O1-50BU), apply the coating liquid for the adhesive layer of the following formulation to a thickness of 10 μm after drying. It was applied and dried at 100 ° C. for 60 seconds to form an adhesive layer. Next, the base material 1 was laminated on the adhesive layer to obtain a carrier sheet.

<Coating liquid for adhesive layer>
(Ionizing radiation curable adhesive composition)
・ Mixture of acrylic adhesive and UV curable component (trade name: N4498, manufactured by Nippon Synthetic Chemical Industry Co., Ltd.) 100 parts by mass ・ Photopolymerization initiator (trade name: Irgacure 184, manufactured by BASF) 1.4 parts by mass ・Hardener (trade name: Coronate L, manufactured by Tosoh Corporation) 4 parts by mass (diluting solvent)
・ Toluene 50 parts by mass ・ Methyl ethyl ketone 50 parts by mass

[Example 2]
A carrier sheet was obtained in the same manner as in Example 1 except that the base material 1 was changed to the base material 2.
[Example 3]
A carrier sheet was obtained in the same manner as in Example 1 except that the base material 1 was changed to the base material 3.
[Comparative Example 1]
A carrier sheet was obtained in the same manner as in Example 1 except that the base material 1 was changed to the base material 4.
[Comparative Example 2]
A carrier sheet was obtained in the same manner as in Example 1 except that the base material 1 was changed to the base material 5.

4. Evaluation of followability While peeling off the release films of the carrier sheets of Examples 1 to 2 and Comparative Examples 1 and 2, the adhesive layer of the carrier sheet and the metallic member whose surface is textured (average surface). A laminated body was obtained by heat-bonding the textured surface having a roughness of 4.0 μm). A thermal laminator (heat roll diameter 56 mmφ, thermal roll temperature 65 ° C., linear pressure 120 N / mm) was used for the heat crimping work, and the transport speed was 0.5 m / min.
The heat-bonded laminate was visually observed from the base material side, and the followability of the carrier sheet to the uneven shape was evaluated in four stages from A to D, using the number of bubbles as an evaluation index. A and B evaluations are pass levels. The results are shown in Table 1.

In Table 1, "E + 08" indicates 10 to the 8th power, "E + 07" indicates 10 to the 7th power, and "E + 06" indicates 10 to the 6th power.

As is clear from the results in Table 1, it can be confirmed that the carrier sheets of Examples 1 to 3 having S ₁ / S of 0.30 or more have good followability to the uneven shape at the time of heat crimping.
When the base material side of the heat-bonded laminate was irradiated with ultraviolet rays to promote the curing of the ionizing radiation curable resin composition, the carrier sheets of Examples 1 to 3 were easily peeled off from the metal member. I was able to.

10: Base material 20: Adhesive layer 30: Member with unevenness 31: Concavo-convex 30a: Cut member 100: Carrier sheet 200: Laminated body

Claims (9)

A carrier sheet having an adhesive layer on a base material.
The thickness of the base material is 30 μm or more and 130 μm or less.
The base material is a resin base material formed of a composition containing an ionomer, and the melting peak temperature was measured by a differential scanning calorimeter under the conditions of a measurement temperature of 0 to 150 ° C. and a heating rate of 10 ° C./min. A carrier sheet having at least two melting peaks in a temperature range of 20 to 110 ° C. and satisfying the following condition 1.
<Condition 1>
A baseline connecting 20 ° C. and 110 ° C. is drawn with respect to the melting curve obtained in the measurement, and the area defined between the baseline and the melting curve is defined as S. The melting peak on the lowest temperature side is defined as the first peak, and the melting peak on the lowest temperature side among the melting peaks located on the higher temperature side than the first peak is defined as the second peak. The temperature on the coldest side of the temperature at which the slope of the melting curve changes from positive to negative between the first peak and the second peak is defined as the inflection temperature. Relative to the base line, the pull perpendicular line L as temperature axis inflection temperature, the melting curve, the area of the cold side of the area defined by the base line and the line L and S ₁ .. S ₁ / S satisfies the condition of 0.30 or more.
Further, the temperature difference between the first peak and the second peak is 31.9 ° C. or higher and 45 ° C. or lower. The carrier sheet according to claim 1, wherein the temperature of the first peak of the base material is 40 to 70 ° C. The carrier according to claim 1 or 2, wherein the ratio of [storage elastic modulus of the base material at 20 ° C./storage elastic modulus at a temperature 10 ° C. higher than the temperature of the first peak of the base material] is 9.0 or more. Sheet. When the value obtained by dividing the loss elastic modulus by the storage elastic modulus is used as the loss coefficient, [loss coefficient at 20 ° C. of the base material / loss coefficient at a temperature 10 ° C. higher than the temperature of the first peak of the base material] The carrier sheet according to any one of claims 1 to 3, wherein the ratio is 0.75 or less. The carrier sheet according to any one of claims 1 to 4, wherein the adhesive layer contains an ionizing radiation curable adhesive composition. A method for manufacturing a cut member having the following steps (1) to (4).
(1) A step of producing a laminated body in which an uneven side surface of a member having unevenness on at least one surface is arranged on an adhesive layer of the following carrier sheet.
(2) A step of heat-pressing the laminate at a temperature exceeding the first peak temperature of the base material of the carrier sheet and lower than the second peak temperature.
(3) A step of cutting the heat-bonded laminate to an arbitrary size from the member side so that the base material is not cut.
(4) A step of removing a carrier sheet from a laminated body to obtain a member cut to an arbitrary size.
<Career sheet>
A carrier sheet having an adhesive layer on a base material.
The base material is a resin base material formed of a composition containing an ionomer, and the melting peak temperature was measured by a differential scanning calorimeter under the conditions of a measurement temperature of 0 to 150 ° C. and a heating rate of 10 ° C./min. A carrier sheet having at least two melting peaks in a temperature range of 20 to 110 ° C. and satisfying the following condition 1.
<Condition 1>
A baseline connecting 20 ° C. and 110 ° C. is drawn with respect to the melting curve obtained in the measurement, and the area defined between the baseline and the melting curve is defined as S. The melting peak on the lowest temperature side is defined as the first peak, and the melting peak on the lowest temperature side among the melting peaks located on the higher temperature side than the first peak is defined as the second peak. The temperature on the coldest side of the temperature at which the slope of the melting curve changes from positive to negative between the first peak and the second peak is defined as the inflection temperature. Relative to the base line, the pull perpendicular line L as temperature axis inflection temperature, the melting curve, the area of the cold side of the area defined by the base line and the line L and S ₁ .. S ₁ / S satisfies the condition of 0.30 or more. As the carrier sheet, a carrier sheet in which the adhesive layer contains an ionizing radiation curable adhesive composition is used, and the following step (3.5) is provided between the steps (3) and the steps (4). The method for manufacturing a cutting member according to claim 6.
(3.5) A step of irradiating the adhesive layer with ionizing radiation to promote curing of the ionizing radiation curable adhesive composition. The method for producing a cut member according to claim 6 or 7, wherein the temperature difference between the first peak and the second peak of the base material is 31.9 ° C. or higher and 45 ° C. or lower. When the second peak temperature was defined as t _2, the temperature of the thermocompression bonding of the step (2) and t ₂ -10 ° C. or less, the production of cutting member according to any one of claims 6-8 Method.