JP6801194B2 - Polycarbonate resin, a method for producing the polycarbonate resin, a method for producing a transparent film made of the polycarbonate resin, and a retardation film. - Google Patents
Polycarbonate resin, a method for producing the polycarbonate resin, a method for producing a transparent film made of the polycarbonate resin, and a retardation film. Download PDFInfo
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- JP6801194B2 JP6801194B2 JP2016042306A JP2016042306A JP6801194B2 JP 6801194 B2 JP6801194 B2 JP 6801194B2 JP 2016042306 A JP2016042306 A JP 2016042306A JP 2016042306 A JP2016042306 A JP 2016042306A JP 6801194 B2 JP6801194 B2 JP 6801194B2
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- polycarbonate resin
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- 229920005668 polycarbonate resin Polymers 0.000 title claims description 128
- 239000004431 polycarbonate resin Substances 0.000 title claims description 128
- 238000004519 manufacturing process Methods 0.000 title claims description 23
- 229920005989 resin Polymers 0.000 claims description 116
- 239000011347 resin Substances 0.000 claims description 116
- 150000001875 compounds Chemical class 0.000 claims description 91
- -1 or Chemical group 0.000 claims description 80
- 125000004432 carbon atom Chemical group C* 0.000 claims description 70
- 125000001424 substituent group Chemical group 0.000 claims description 70
- 238000006116 polymerization reaction Methods 0.000 claims description 62
- 238000000034 method Methods 0.000 claims description 54
- 239000000155 melt Substances 0.000 claims description 33
- 125000003118 aryl group Chemical group 0.000 claims description 28
- 239000006185 dispersion Substances 0.000 claims description 24
- 150000004650 carbonic acid diesters Chemical class 0.000 claims description 23
- 230000009477 glass transition Effects 0.000 claims description 22
- 125000002947 alkylene group Chemical group 0.000 claims description 20
- 125000005647 linker group Chemical group 0.000 claims description 20
- CDAISMWEOUEBRE-UHFFFAOYSA-N inositol Chemical group OC1C(O)C(O)C(O)C(O)C1O CDAISMWEOUEBRE-UHFFFAOYSA-N 0.000 claims description 19
- 238000005259 measurement Methods 0.000 claims description 19
- 238000000465 moulding Methods 0.000 claims description 19
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 14
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 claims description 12
- 125000001931 aliphatic group Chemical group 0.000 claims description 12
- CDAISMWEOUEBRE-GPIVLXJGSA-N inositol Chemical compound O[C@H]1[C@H](O)[C@@H](O)[C@H](O)[C@H](O)[C@@H]1O CDAISMWEOUEBRE-GPIVLXJGSA-N 0.000 claims description 12
- 229960000367 inositol Drugs 0.000 claims description 12
- 229920000728 polyester Polymers 0.000 claims description 12
- 125000000217 alkyl group Chemical group 0.000 claims description 11
- 125000000962 organic group Chemical group 0.000 claims description 10
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 8
- 125000005843 halogen group Chemical group 0.000 claims description 7
- 150000001241 acetals Chemical class 0.000 claims description 6
- 125000000753 cycloalkyl group Chemical group 0.000 claims description 6
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 claims description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 5
- 125000002252 acyl group Chemical group 0.000 claims description 5
- 125000002723 alicyclic group Chemical group 0.000 claims description 5
- 125000003545 alkoxy group Chemical group 0.000 claims description 5
- 125000003277 amino group Chemical group 0.000 claims description 5
- 125000004104 aryloxy group Chemical group 0.000 claims description 5
- 125000004093 cyano group Chemical group *C#N 0.000 claims description 5
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 claims description 5
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 claims description 5
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 5
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 229910052717 sulfur Inorganic materials 0.000 claims description 4
- 125000004434 sulfur atom Chemical group 0.000 claims description 4
- 125000004423 acyloxy group Chemical group 0.000 claims description 3
- 125000000732 arylene group Chemical group 0.000 claims description 3
- 125000002993 cycloalkylene group Chemical group 0.000 claims description 3
- 230000002457 bidirectional effect Effects 0.000 claims description 2
- 239000010408 film Substances 0.000 description 126
- 238000006243 chemical reaction Methods 0.000 description 46
- 230000003287 optical effect Effects 0.000 description 35
- 239000000178 monomer Substances 0.000 description 25
- 239000003054 catalyst Substances 0.000 description 21
- 239000012071 phase Substances 0.000 description 21
- 229920000642 polymer Polymers 0.000 description 21
- 239000008188 pellet Substances 0.000 description 19
- ROORDVPLFPIABK-UHFFFAOYSA-N diphenyl carbonate Chemical compound C=1C=CC=CC=1OC(=O)OC1=CC=CC=C1 ROORDVPLFPIABK-UHFFFAOYSA-N 0.000 description 18
- 238000011156 evaluation Methods 0.000 description 18
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 18
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 15
- KLDXJTOLSGUMSJ-JGWLITMVSA-N Isosorbide Chemical compound O[C@@H]1CO[C@@H]2[C@@H](O)CO[C@@H]21 KLDXJTOLSGUMSJ-JGWLITMVSA-N 0.000 description 15
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 15
- 229960002479 isosorbide Drugs 0.000 description 15
- 239000002994 raw material Substances 0.000 description 13
- 239000002904 solvent Substances 0.000 description 13
- 238000002834 transmittance Methods 0.000 description 13
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical group C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 12
- 239000012760 heat stabilizer Substances 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- 150000002736 metal compounds Chemical class 0.000 description 11
- 239000000047 product Substances 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 10
- 229910052698 phosphorus Inorganic materials 0.000 description 10
- 230000008569 process Effects 0.000 description 10
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 9
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 9
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 9
- XQKKWWCELHKGKB-UHFFFAOYSA-L calcium acetate monohydrate Chemical compound O.[Ca+2].CC([O-])=O.CC([O-])=O XQKKWWCELHKGKB-UHFFFAOYSA-L 0.000 description 9
- 150000005690 diesters Chemical class 0.000 description 9
- 239000011574 phosphorus Substances 0.000 description 9
- 230000000704 physical effect Effects 0.000 description 9
- 238000006068 polycondensation reaction Methods 0.000 description 9
- 239000000243 solution Substances 0.000 description 9
- 239000003381 stabilizer Substances 0.000 description 9
- 229940067460 calcium acetate monohydrate Drugs 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- 238000004040 coloring Methods 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- 239000002685 polymerization catalyst Substances 0.000 description 7
- 230000002441 reversible effect Effects 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 6
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 6
- YIMQCDZDWXUDCA-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCC(CO)CC1 YIMQCDZDWXUDCA-UHFFFAOYSA-N 0.000 description 6
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 6
- 230000008859 change Effects 0.000 description 6
- 230000007423 decrease Effects 0.000 description 6
- 230000006866 deterioration Effects 0.000 description 6
- 150000002739 metals Chemical class 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- BXGYYDRIMBPOMN-UHFFFAOYSA-N 2-(hydroxymethoxy)ethoxymethanol Chemical compound OCOCCOCO BXGYYDRIMBPOMN-UHFFFAOYSA-N 0.000 description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 5
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 229910052799 carbon Inorganic materials 0.000 description 5
- 238000007334 copolymerization reaction Methods 0.000 description 5
- 238000001125 extrusion Methods 0.000 description 5
- VLKZOEOYAKHREP-UHFFFAOYSA-N hexane Substances CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 5
- 230000000737 periodic effect Effects 0.000 description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical class [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 4
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 230000002378 acidificating effect Effects 0.000 description 4
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 4
- 229940043430 calcium compound Drugs 0.000 description 4
- 150000001674 calcium compounds Chemical class 0.000 description 4
- 125000004185 ester group Chemical group 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 230000006872 improvement Effects 0.000 description 4
- 229910052744 lithium Inorganic materials 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 239000012788 optical film Substances 0.000 description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 4
- 229920000515 polycarbonate Polymers 0.000 description 4
- 239000004417 polycarbonate Substances 0.000 description 4
- 230000009257 reactivity Effects 0.000 description 4
- 229910052708 sodium Inorganic materials 0.000 description 4
- 239000011734 sodium Substances 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 238000003786 synthesis reaction Methods 0.000 description 4
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 4
- 238000005809 transesterification reaction Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 229940126062 Compound A Drugs 0.000 description 3
- NLDMNSXOCDLTTB-UHFFFAOYSA-N Heterophylliin A Natural products O1C2COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC2C(OC(=O)C=2C=C(O)C(O)=C(O)C=2)C(O)C1OC(=O)C1=CC(O)=C(O)C(O)=C1 NLDMNSXOCDLTTB-UHFFFAOYSA-N 0.000 description 3
- SQUHHTBVTRBESD-UHFFFAOYSA-N Hexa-Ac-myo-Inositol Natural products CC(=O)OC1C(OC(C)=O)C(OC(C)=O)C(OC(C)=O)C(OC(C)=O)C1OC(C)=O SQUHHTBVTRBESD-UHFFFAOYSA-N 0.000 description 3
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 description 3
- 229910019142 PO4 Inorganic materials 0.000 description 3
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 3
- RWRDLPDLKQPQOW-UHFFFAOYSA-N Pyrrolidine Chemical compound C1CCNC1 RWRDLPDLKQPQOW-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 150000003868 ammonium compounds Chemical class 0.000 description 3
- 150000007514 bases Chemical class 0.000 description 3
- TVFDJXOCXUVLDH-UHFFFAOYSA-N caesium atom Chemical compound [Cs] TVFDJXOCXUVLDH-UHFFFAOYSA-N 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- BNIILDVGGAEEIG-UHFFFAOYSA-L disodium hydrogen phosphate Chemical compound [Na+].[Na+].OP([O-])([O-])=O BNIILDVGGAEEIG-UHFFFAOYSA-L 0.000 description 3
- 238000004821 distillation Methods 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 229930195733 hydrocarbon Natural products 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 238000004898 kneading Methods 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 150000002681 magnesium compounds Chemical class 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000010128 melt processing Methods 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 235000021317 phosphate Nutrition 0.000 description 3
- 239000011591 potassium Substances 0.000 description 3
- 229910052700 potassium Inorganic materials 0.000 description 3
- 229960003975 potassium Drugs 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000035484 reaction time Effects 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- 125000004814 1,1-dimethylethylene group Chemical group [H]C([H])([H])C([*:1])(C([H])([H])[H])C([H])([H])[*:2] 0.000 description 2
- PXGZQGDTEZPERC-UHFFFAOYSA-N 1,4-cyclohexanedicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 2
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical group CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 2
- 125000004812 1-ethylethylene group Chemical group [H]C([H])([H])C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 125000004806 1-methylethylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 125000004809 1-methylpropylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])C([H])([H])[*:2] 0.000 description 2
- FQXGHZNSUOHCLO-UHFFFAOYSA-N 2,2,4,4-tetramethyl-1,3-cyclobutanediol Chemical compound CC1(C)C(O)C(C)(C)C1O FQXGHZNSUOHCLO-UHFFFAOYSA-N 0.000 description 2
- RKMGAJGJIURJSJ-UHFFFAOYSA-N 2,2,6,6-tetramethylpiperidine Chemical compound CC1(C)CCCC(C)(C)N1 RKMGAJGJIURJSJ-UHFFFAOYSA-N 0.000 description 2
- 125000004825 2,2-dimethylpropylene group Chemical group [H]C([H])([H])C(C([H])([H])[H])(C([H])([H])[*:1])C([H])([H])[*:2] 0.000 description 2
- ICKWICRCANNIBI-UHFFFAOYSA-N 2,4-di-tert-butylphenol Chemical compound CC(C)(C)C1=CC=C(O)C(C(C)(C)C)=C1 ICKWICRCANNIBI-UHFFFAOYSA-N 0.000 description 2
- BVUXDWXKPROUDO-UHFFFAOYSA-N 2,6-di-tert-butyl-4-ethylphenol Chemical compound CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 BVUXDWXKPROUDO-UHFFFAOYSA-N 0.000 description 2
- NQXNYVAALXGLQT-UHFFFAOYSA-N 2-[4-[9-[4-(2-hydroxyethoxy)phenyl]fluoren-9-yl]phenoxy]ethanol Chemical compound C1=CC(OCCO)=CC=C1C1(C=2C=CC(OCCO)=CC=2)C2=CC=CC=C2C2=CC=CC=C21 NQXNYVAALXGLQT-UHFFFAOYSA-N 0.000 description 2
- ICSNLGPSRYBMBD-UHFFFAOYSA-N 2-aminopyridine Chemical compound NC1=CC=CC=N1 ICSNLGPSRYBMBD-UHFFFAOYSA-N 0.000 description 2
- 125000004813 2-ethylethylene group Chemical group [H]C([H])([H])C([H])([H])C([H])([*:2])C([H])([H])[*:1] 0.000 description 2
- 125000004807 2-methylethylene group Chemical group [H]C([H])([H])C([H])([*:2])C([H])([H])[*:1] 0.000 description 2
- 125000004810 2-methylpropylene group Chemical group [H]C([H])([H])C([H])(C([H])([H])[*:2])C([H])([H])[*:1] 0.000 description 2
- 125000004811 3-methylpropylene group Chemical group [H]C([H])([H])C([H])([*:2])C([H])([H])C([H])([H])[*:1] 0.000 description 2
- PVFQHGDIOXNKIC-UHFFFAOYSA-N 4-[2-[3-[2-(4-hydroxyphenyl)propan-2-yl]phenyl]propan-2-yl]phenol Chemical compound C=1C=CC(C(C)(C)C=2C=CC(O)=CC=2)=CC=1C(C)(C)C1=CC=C(O)C=C1 PVFQHGDIOXNKIC-UHFFFAOYSA-N 0.000 description 2
- NUDSREQIJYWLRA-UHFFFAOYSA-N 4-[9-(4-hydroxy-3-methylphenyl)fluoren-9-yl]-2-methylphenol Chemical compound C1=C(O)C(C)=CC(C2(C3=CC=CC=C3C3=CC=CC=C32)C=2C=C(C)C(O)=CC=2)=C1 NUDSREQIJYWLRA-UHFFFAOYSA-N 0.000 description 2
- VSAWBBYYMBQKIK-UHFFFAOYSA-N 4-[[3,5-bis[(3,5-ditert-butyl-4-hydroxyphenyl)methyl]-2,4,6-trimethylphenyl]methyl]-2,6-ditert-butylphenol Chemical compound CC1=C(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C1CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 VSAWBBYYMBQKIK-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 239000002028 Biomass Substances 0.000 description 2
- SDDLEVPIDBLVHC-UHFFFAOYSA-N Bisphenol Z Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)CCCCC1 SDDLEVPIDBLVHC-UHFFFAOYSA-N 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- JYFHYPJRHGVZDY-UHFFFAOYSA-N Dibutyl phosphate Chemical compound CCCCOP(O)(=O)OCCCC JYFHYPJRHGVZDY-UHFFFAOYSA-N 0.000 description 2
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 2
- 229940123973 Oxygen scavenger Drugs 0.000 description 2
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 125000003710 aryl alkyl group Chemical group 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 150000001639 boron compounds Chemical class 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 229910052792 caesium Inorganic materials 0.000 description 2
- 235000010216 calcium carbonate Nutrition 0.000 description 2
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- KJFAJLYXKTVJDA-UHFFFAOYSA-N trioctadecylphosphane Chemical compound CCCCCCCCCCCCCCCCCCP(CCCCCCCCCCCCCCCCCC)CCCCCCCCCCCCCCCCCC KJFAJLYXKTVJDA-UHFFFAOYSA-N 0.000 description 1
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- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- WUUHFRRPHJEEKV-UHFFFAOYSA-N tripotassium borate Chemical compound [K+].[K+].[K+].[O-]B([O-])[O-] WUUHFRRPHJEEKV-UHFFFAOYSA-N 0.000 description 1
- IUURMAINMLIZMX-UHFFFAOYSA-N tris(2-nonylphenyl)phosphane Chemical compound CCCCCCCCCC1=CC=CC=C1P(C=1C(=CC=CC=1)CCCCCCCCC)C1=CC=CC=C1CCCCCCCCC IUURMAINMLIZMX-UHFFFAOYSA-N 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- ZTWTYVWXUKTLCP-UHFFFAOYSA-N vinylphosphonic acid Chemical compound OP(O)(=O)C=C ZTWTYVWXUKTLCP-UHFFFAOYSA-N 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
- 150000003752 zinc compounds Chemical class 0.000 description 1
- PORPEXMDRRVVNF-UHFFFAOYSA-L zinc;octadecyl phosphate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCCOP([O-])([O-])=O PORPEXMDRRVVNF-UHFFFAOYSA-L 0.000 description 1
- 150000003755 zirconium compounds Chemical class 0.000 description 1
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- Polyesters Or Polycarbonates (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Description
本発明は、光学特性や耐熱性、溶融加工性等に優れたポリカーボネート樹脂、並びにそれよりなる透明フィルム及び位相差フィルムに関する。 The present invention relates to a polycarbonate resin having excellent optical properties, heat resistance, melt processability, etc., and a transparent film and a retardation film made of the polycarbonate resin.
近年、光学レンズ、光学フィルム、光学記録媒体といった光学用途に使用される透明樹脂の需要が増大している。その中でも特に、液晶ディスプレイや有機ELディスプレイに代表される薄型の平面パネルディスプレイ(FPD)の普及が顕著であり、コントラストや色つきの改善、視野角拡大、外光反射防止等の表示品質を向上させる目的で各種の光学フィルムが開発され、利用されている。 In recent years, there has been an increasing demand for transparent resins used in optical applications such as optical lenses, optical films, and optical recording media. Among them, thin flat panel displays (FPDs) represented by liquid crystal displays and organic EL displays are particularly widespread, and improve display quality such as improvement of contrast and coloring, expansion of viewing angle, and prevention of external light reflection. Various optical films have been developed and used for this purpose.
例えば、有機ELディスプレイにおいては、外光の反射を防止するための1/4波長板が用いられている。1/4波長板に用いられる位相差フィルムは、色つきを抑え、きれいな黒表示を可能とするため、可視領域の各波長において理想的な位相差特性を得ることができる、広帯域の波長分散特性が求められている。これに相当するものとして、例えば、フルオレン環を側鎖に有するビスフェノール構造を含むポリカーボネート共重合体よりなり、短波長ほど位相差が小さくなる逆波長分散性を示す位相差フィルムが開示されている(例えば、特許文献1、2参照)。 For example, in an organic EL display, a 1/4 wave plate for preventing reflection of external light is used. Since the retardation film used for the 1/4 wave plate suppresses coloring and enables a clear black display, it is possible to obtain ideal retardation characteristics at each wavelength in the visible region, and wideband wavelength dispersion characteristics. Is required. As an equivalent of this, for example, a retardation film is disclosed which comprises a polycarbonate copolymer containing a bisphenol structure having a fluorene ring in a side chain and exhibits reverse wavelength dispersibility in which the retardation becomes smaller as the wavelength becomes shorter (there is a difference film. For example, see Patent Documents 1 and 2).
また、従来のポリカーボネート樹脂は主にビスフェノールAをモノマーに用いられてきたが、近年、イソソルビド(ISB)をモノマー成分としたポリカーボネート樹脂が開発されている。ISBを用いたポリカーボネート樹脂は耐熱性や光学特性等の諸特性に優れており、位相差フィルム等の光学用途やガラス代替用途等への利用が検討されている(例えば、特許文献3、4参照)。また、ISBはバイオマス資源から得られるジヒドロキシ化合物であり、焼却処分しても二酸化炭素の排出量増加に寄与しないカーボンニュートラルな材料であることにも興味が持たれている。 In addition, conventional polycarbonate resins have mainly used bisphenol A as a monomer, but in recent years, polycarbonate resins containing isosorbide (ISB) as a monomer component have been developed. Polycarbonate resin using ISB is excellent in various properties such as heat resistance and optical properties, and its use in optical applications such as retardation films and glass substitute applications is being studied (see, for example, Patent Documents 3 and 4). ). It is also of interest that ISB is a dihydroxy compound obtained from biomass resources and is a carbon-neutral material that does not contribute to an increase in carbon dioxide emissions even when incinerated.
また、イノシトールはバイオマス資源から得られる環状多価アルコールであり、ヒドロキシ基と反応する化合物で連結させることにより、ポリマーを形成することが期待される。非特許文献1、2には、イノシトールの誘導体からポリウレタンを合成し、耐熱性の向上が見られたことが報告されている。 Inositol is a cyclic polyhydric alcohol obtained from a biomass resource, and is expected to form a polymer by linking it with a compound that reacts with a hydroxy group. Non-Patent Documents 1 and 2 report that polyurethane was synthesized from a derivative of inositol and improved heat resistance was observed.
近年、位相差フィルムをはじめとした光学フィルムの用途では、偏光板やディスプレイ組み立て工程中の加熱を伴うプロセスや、高温高湿度の使用環境下等において、フィルムの光学物性や寸法が変化しないように、材料への耐熱性向上の要求がある。またそれに加えて、さらなる光学特性や品質の向上や、コストダウン、製膜や延伸、積層等の各工程における生産性の向上といった要求もあり、これらの要求を満たすために、種々の特性を同時に優れたものとする必要がある。具体的には、ガラス転移温度を向上させることで耐熱性を向上させることと、位相差の波長分散性、光弾性係数等の光学物性、フィルムの靱性等の機械物性、溶融加工性等の物性バランスを高いレベルで優れたものにした材料の開発が求められている。 In recent years, in the use of optical films such as retardation films, the optical properties and dimensions of the films should not change during processes involving heating during the process of assembling polarizing plates and displays, or under high temperature and high humidity usage environments. , There is a demand for improved heat resistance of the material. In addition to that, there are also demands for further improvement of optical characteristics and quality, cost reduction, improvement of productivity in each process such as film formation, stretching, and lamination, and in order to meet these demands, various characteristics are simultaneously provided. It needs to be excellent. Specifically, heat resistance is improved by improving the glass transition temperature, optical properties such as wavelength dispersibility of phase difference and photoelastic coefficient, mechanical properties such as film toughness, and physical properties such as melt processability. There is a need to develop materials that have an excellent balance at a high level.
本発明の目的は、前記の種々の課題を解決し、耐熱性、光学特性、溶融加工性等の種々の特性に優れたポリカーボネート樹脂、該ポリカーボネート樹脂の製造方法、該ポリカーボネート樹脂からなる透明フィルムの製造方法、及び位相差フィルムを提供することにある。 An object of the present invention is to solve the above-mentioned various problems and to obtain a polycarbonate resin excellent in various properties such as heat resistance, optical properties, melt processability, a method for producing the polycarbonate resin, and a transparent film made of the polycarbonate resin. It is an object of the present invention to provide a manufacturing method and a retardation film.
本発明者らは、前記課題を解決するべく鋭意検討を重ねた結果、特定の構造を含有し、種々の共重合成分との比率を制御することで、耐熱性、光学特性、溶融加工性等の物性に優れたポリカーボネート樹脂が得られることを見出し、本発明に至った。即ち、本発明は以下を要旨とする。 As a result of diligent studies to solve the above problems, the present inventors have determined that they contain a specific structure and control the ratio with various copolymerization components to achieve heat resistance, optical properties, melt processability, etc. We have found that a polycarbonate resin having excellent physical properties can be obtained, and have reached the present invention. That is, the gist of the present invention is as follows.
[1] 下記式(1)〜(3)のいずれかで表される構造単位を少なくとも含むポリカーボネート樹脂であって、該樹脂から作成された延伸フィルムの、波長450nmにおける位相差(R450)と波長550nmにおける位相差(R550)との比である波長分散(R450/R550)の値が0.50以上、1.03以下であるポリカーボネート樹脂。 [1] A polycarbonate resin containing at least a structural unit represented by any of the following formulas (1) to (3), and the phase difference (R450) and wavelength of a stretched film made from the resin at a wavelength of 450 nm. A polycarbonate resin having a wavelength dispersion (R450 / R550) value of 0.50 or more and 1.03 or less, which is a ratio to the phase difference (R550) at 550 nm.
(上記式(1)〜(3)中において、R1〜R4は各々独立に、炭素数1〜30の有機基を表す。これらの有機基には任意の置換基を有していてもよい。また、R1〜R4のいずれか2つ以上が、相互に結合して環を形成していてもよい。) (In the above formulas (1) to (3), R 1 to R 4 independently represent organic groups having 1 to 30 carbon atoms, even if these organic groups have arbitrary substituents. In addition, any two or more of R 1 to R 4 may be bonded to each other to form a ring.)
[2] 前記式(1)〜(3)中のR1とR2、R3とR4がそれぞれ相互にアセタール結合で環を形成している[1]に記載のポリカーボネート樹脂。 [2] The polycarbonate resin according to [1], wherein R 1 and R 2 and R 3 and R 4 in the formulas (1) to (3) form a ring with each other by an acetal bond.
[3] 前記式(1)〜(3)中のシクロヘキサン環が、myo−イノシトールから誘導されるイノシトール残基である[1]又[2]に記載のポリカーボネート樹脂。 [3] The polycarbonate resin according to [1] or [2], wherein the cyclohexane ring in the formulas (1) to (3) is an inositol residue derived from myo-inositol.
[4] 下記式(4)で表される構造単位を少なくとも含む[1]乃至[3]のいずれかに記載のポリカーボネート樹脂。 [4] The polycarbonate resin according to any one of [1] to [3], which contains at least a structural unit represented by the following formula (4).
[5] ガラス転移温度が100℃以上、180℃以下である[1]乃至[4]のいずれかに記載のポリカーボネート樹脂。 [5] The polycarbonate resin according to any one of [1] to [4], wherein the glass transition temperature is 100 ° C. or higher and 180 ° C. or lower.
[6] 樹脂を構成する全ての構造単位、及び連結基の重量の合計量を100重量%とした際に、前記式(1)〜(3)のいずれかで表される構造単位を1重量%以上、70重量%以下含有する[1]乃至[5]のいずれかに記載のポリカーボネート樹脂。 [6] When the total weight of all the structural units constituting the resin and the weights of the linking groups is 100% by weight, the structural unit represented by any of the above formulas (1) to (3) is 1 weight. The polycarbonate resin according to any one of [1] to [5], which contains% or more and 70% by weight or less.
[7] 樹脂を構成する全ての構造単位、及び連結基の重量の合計量を100重量%とした際に、下記式(5)で表される構造単位を1重量%以上、70重量%以下含有する[1]乃至[6]のいずれかに記載のポリカーボネート樹脂。 [7] When the total weight of all the structural units constituting the resin and the weights of the linking groups is 100% by weight, the structural units represented by the following formula (5) are 1% by weight or more and 70% by weight or less. The polycarbonate resin according to any one of [1] to [6] contained.
[8] 樹脂を構成する全ての構造単位、及び連結基の重量の合計量を100重量%とした際に、下記式(6)〜(8)から選ばれる少なくとも1つの構造単位を1重量%以上、70重量%以下含有する[1]乃至[7]のいずれかに記載のポリカーボネート樹脂。 [8] When the total weight of all the structural units constituting the resin and the linking groups is 100% by weight, at least one structural unit selected from the following formulas (6) to (8) is 1% by weight. The polycarbonate resin according to any one of [1] to [7], which contains 70% by weight or less.
(上記式(6)中、R5〜R8はそれぞれ独立に、水素原子、置換若しくは無置換の炭素数1〜20のアルキル基、置換若しくは無置換の炭素数6〜20のシクロアルキル基、又は、置換若しくは無置換の炭素数6〜20のアリール基を表し、Xは置換若しくは無置換の炭素数2〜10のアルキレン基、置換若しくは無置換の炭素数6〜20のシクロアルキレン基、又は、置換若しくは無置換の炭素数6〜20のアリーレン基を表す。m及びnはそれぞれ独立に0〜5の整数である。) (In the above formula (6), R 5 to R 8 are independently hydrogen atoms, substituted or unsubstituted alkyl groups having 1 to 20 carbon atoms, substituted or unsubstituted cycloalkyl groups having 6 to 20 carbon atoms, respectively. Alternatively, it represents a substituted or unsubstituted aryl group having 6 to 20 carbon atoms, and X is a substituted or unsubstituted alkylene group having 2 to 10 carbon atoms, a substituted or unsubstituted cycloalkylene group having 6 to 20 carbon atoms, or , Substituent or unsubstituted, represents an arylene group having 6 to 20 carbon atoms. M and n are independently integers of 0 to 5.)
(式(7)及び(8)中、R9〜R11は、それぞれ独立に、直接結合、置換基を有していてもよい炭素数1〜4のアルキレン基であり、R12〜R17は、それぞれ独立に、水素原子、置換基を有していてもよい炭素数1〜10のアルキル基、置換基を有していてもよい炭素数4〜10のアリール基、置換基を有していてもよい炭素数1〜10のアシル基、置換基を有していてもよい炭素数1〜10のアルコキシ基、置換基を有していてもよい炭素数1〜10のアリールオキシ基、置換基を有していてもよい炭素数1〜10のアシルオキシ基、置換基を有していてもよいアミノ基、置換基を有していてもよい炭素数1〜10のビニル基、置換基を有していてもよい炭素数1〜10のエチニル基、置換基を有する硫黄原子、置換基を有するケイ素原子、ハロゲン原子、ニトロ基、又はシアノ基である。ただし、R12〜R17のうち隣接する少なくとも2つの基が互いに結合して環を形成していてもよい。) (In formulas (7) and (8), R 9 to R 11 are alkylene groups having 1 to 4 carbon atoms which may independently have a direct bond and a substituent, and are R 12 to R 17 respectively. Each independently has a hydrogen atom, an alkyl group having 1 to 10 carbon atoms which may have a substituent, an aryl group having 4 to 10 carbon atoms which may have a substituent, and a substituent. An acyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms which may have a substituent, an aryloxy group having 1 to 10 carbon atoms which may have a substituent, and the like. An acyloxy group having 1 to 10 carbon atoms which may have a substituent, an amino group which may have a substituent, a vinyl group having 1 to 10 carbon atoms which may have a substituent, and a substituent. It is an ethynyl group having 1 to 10 carbon atoms, a sulfur atom having a substituent, a silicon atom having a substituent, a halogen atom, a nitro group, or a cyano group, which may have R 12 to R 17 . Of these, at least two adjacent groups may be bonded to each other to form a ring.)
[9] 樹脂を構成する全ての構造単位、及び連結基の重量の合計量を100重量%とした際に、脂肪族ジヒドロキシ化合物、脂環式ジヒドロキシ化合物、アセタール環を含有するジヒドロキシ化合物、及びオキシアルキレングリコールから選ばれる少なくとも1つの化合物に由来する構造単位を0.1重量%以上、50重量%以下含む[1]乃至[8]のいずれかに記載のポリカーボネート樹脂。 [9] When the total weight of all the structural units constituting the resin and the linking groups is 100% by weight, the aliphatic dihydroxy compound, the alicyclic dihydroxy compound, the dihydroxy compound containing an acetal ring, and the oxy The polycarbonate resin according to any one of [1] to [8], which contains 0.1% by weight or more and 50% by weight or less of a structural unit derived from at least one compound selected from alkylene glycol.
[10] 樹脂を構成する全ての構造単位、及び連結基の重量の合計量を100重量%とした際に、前記式(6)〜(8)で表される構造単位以外の芳香族構造単位を5重量%以下含有する[1]乃至[9]のいずれかに記載のポリカーボネート樹脂。 [10] When the total weight of all the structural units constituting the resin and the weights of the linking groups is 100% by weight, the aromatic structural units other than the structural units represented by the above formulas (6) to (8). The polycarbonate resin according to any one of [1] to [9], which contains 5% by weight or less of.
[11] 測定温度240℃、剪断速度91.2sec−1における溶融粘度が1000Pa・s以上、7000Pa・s以下である[1]乃至[10]のいずれかに記載のポリカーボネート樹脂。 [11] The polycarbonate resin according to any one of [1] to [10], wherein the melt viscosity at a measurement temperature of 240 ° C. and a shear rate of 91.2 sec -1 is 1000 Pa · s or more and 7000 Pa · s or less.
[12] 樹脂中の、炭酸ジエステルの残存量が1重量ppm以上、300重量ppm以下、かつ、炭酸ジエステルに由来するモノヒドロキシ化合物の含有量が1重量ppm以上、1000重量ppm以下である[1]乃至[11]のいずれかに記載のポリカーボネート樹脂。 [12] The residual amount of carbonic acid diester in the resin is 1 wt ppm or more and 300 wt ppm or less, and the content of the monohydroxy compound derived from the carbonic acid diester is 1 wt ppm or more and 1000 wt ppm or less [1]. ] To [11]. The polycarbonate resin according to any one of [11].
[13] [1]乃至[12]のいずれかに記載のポリカーボネート樹脂を溶融重合反応により製造する方法であって、該溶融重合反応の最高温度が200℃以上、260℃以下であることを特徴とするポリカーボネート樹脂の製造方法。 [13] A method for producing the polycarbonate resin according to any one of [1] to [12] by a melt polymerization reaction, wherein the maximum temperature of the melt polymerization reaction is 200 ° C. or higher and 260 ° C. or lower. A method for producing a polycarbonate resin.
[14] [1]乃至[12]のいずれかに記載のポリカーボネート樹脂を成形してなる透明フィルム。 [14] A transparent film formed by molding the polycarbonate resin according to any one of [1] to [12].
[15] [14]に記載の透明フィルムを製造する方法であって、[1]乃至[12]のいずれかに記載のポリカーボネート樹脂を成形温度280℃以下で溶融製膜法により成形する透明フィルムの製造方法。 [15] The transparent film according to [14], wherein the polycarbonate resin according to any one of [1] to [12] is molded by a melt film forming method at a molding temperature of 280 ° C. or lower. Manufacturing method.
[16] [14]に記載の透明フィルムの一方向又は二方向延伸フィルムである位相差フィルム。 [16] A retardation film which is a unidirectional or bidirectional stretched film of the transparent film according to [14].
本発明によれば、耐熱性、光学特性、溶融加工性等の種々の特性に優れたポリカーボネート樹脂、並びにそれからなる透明フィルム及び位相差フィルムが提供される。 According to the present invention, a polycarbonate resin having excellent various properties such as heat resistance, optical properties, and melt processability, and a transparent film and a retardation film made of the polycarbonate resin are provided.
以下に本発明の実施の形態を詳細に説明するが、以下に記載する構成要件の説明は本発明の実施態様の一例(代表例)であり、本発明はその要旨を超えない限り、以下の内容に限定されない。 Hereinafter, embodiments of the present invention will be described in detail, but the description of the constituent elements described below is an example (typical example) of the embodiments of the present invention, and the present invention is described below as long as the gist thereof is not exceeded. Not limited to the content.
尚、本発明において、「構造単位」とは、重合体において隣り合う連結基に挟まれた部分構造、及び、重合体の末端部分に存在する重合反応性基と、該重合反応性基に隣り合う連結基とに挟まれた部分構造をいう。 In the present invention, the "structural unit" refers to a partial structure sandwiched between adjacent linking groups in the polymer, a polymerization reactive group existing at the terminal portion of the polymer, and adjacent to the polymerization reactive group. A partial structure sandwiched between matching connecting groups.
また、本発明において、各種の置換基の炭素数は、当該置換基が更に置換基を有する場合、その置換基の炭素数も含めた合計の炭素数をさす。 Further, in the present invention, the carbon number of various substituents refers to the total carbon number including the carbon number of the substituent when the substituent further has a substituent.
また、本発明においてポリカーボネート樹脂とは、ポリエステルカーボネート樹脂を含む。ポリエステルカーボネート樹脂とは、ポリマーを構成する構造単位がカーボネート結合だけでなく、エステル結合で連結された部分を含むポリマーのことを言う。 Further, in the present invention, the polycarbonate resin includes a polyester carbonate resin. The polyester carbonate resin refers to a polymer in which the structural units constituting the polymer include not only carbonate bonds but also portions linked by ester bonds.
本発明のポリカーボネート樹脂は、下記式(1)〜(3)のいずれかで表される構造単位を少なくとも含むポリカーボネート樹脂であり、波長450nmにおける位相差(R450)と波長550nmにおける位相差(R550)との比である波長分散(R450/R550)の値が0.50以上、1.03以下であるポリカーボネート樹脂である。 The polycarbonate resin of the present invention is a polycarbonate resin containing at least a structural unit represented by any of the following formulas (1) to (3), and has a phase difference (R450) at a wavelength of 450 nm and a phase difference (R550) at a wavelength of 550 nm. It is a polycarbonate resin having a wavelength dispersion (R450 / R550) value of 0.50 or more and 1.03 or less.
(上記式(1)〜(3)中において、R1〜R4は各々独立に、炭素数1〜30の有機基を表す。これらの有機基には任意の置換基を有していてもよい。また、R1〜R4のいずれか2つ以上が、相互に結合して環を形成していてもよい。) (In the above formulas (1) to (3), R 1 to R 4 independently represent organic groups having 1 to 30 carbon atoms, even if these organic groups have arbitrary substituents. In addition, any two or more of R 1 to R 4 may be bonded to each other to form a ring.)
[本発明のポリカーボネート樹脂の構造と原料]
(ジヒドロキシ化合物A)
本発明のポリカーボネート樹脂において、ポリカーボネート樹脂を構成する全ての構造単位、及び連結基の重量の合計量を100重量%とした際に、前記式(1)〜(3)のいずれかで表される構造単位の含有量は1重量%以上、70重量%以下が好ましい。この割合は、3重量%以上、60重量%以下がより好ましく、5重量%以上、50重量%以下がさらに好ましく、8重量%以上、40重量%以下が特に好ましい。尚、前記式(1)〜(3)で表される構造単位をそれぞれ構造(1)、構造(2)、構造(3)と称することがある。
[Structure and Raw Material of Polycarbonate Resin of the Present Invention]
(Dihydroxy compound A)
In the polycarbonate resin of the present invention, it is represented by any of the above formulas (1) to (3) when the total weight of all the structural units and the linking groups constituting the polycarbonate resin is 100% by weight. The content of the structural unit is preferably 1% by weight or more and 70% by weight or less. This ratio is more preferably 3% by weight or more and 60% by weight or less, further preferably 5% by weight or more and 50% by weight or less, and particularly preferably 8% by weight or more and 40% by weight or less. The structural units represented by the formulas (1) to (3) may be referred to as a structure (1), a structure (2), and a structure (3), respectively.
構造(1)〜(3)の含有量が上記範囲より多い場合、耐熱性が過度に高くなったり、得られる樹脂が脆くなったりするおそれがある。また、それ故に十分な分子量まで重合反応を進行させるために反応温度を高くしたり、反応時間を長くしたりする必要があるため、ポリマーが熱劣化し、色調が著しく悪化したり、架橋が進行してゲル化したりするおそれがある。一方、構造(1)〜(3)の含有量が上記範囲より少ない場合、本発明のポリカーボネート樹脂の特長である耐熱性向上の効果を十分に得ることができなくなる。 If the content of the structures (1) to (3) is larger than the above range, the heat resistance may become excessively high or the obtained resin may become brittle. In addition, therefore, it is necessary to raise the reaction temperature or lengthen the reaction time in order to proceed the polymerization reaction to a sufficient molecular weight, so that the polymer is thermally deteriorated, the color tone is significantly deteriorated, and cross-linking proceeds. There is a risk of gelling. On the other hand, when the content of the structures (1) to (3) is less than the above range, the effect of improving heat resistance, which is a feature of the polycarbonate resin of the present invention, cannot be sufficiently obtained.
前記式(1)〜(3)において、R1〜R4は各々独立に置換基を有していてもよい炭素数1〜30の有機基である。R1〜R4の炭素数1〜数30の有機基としては、メチル基、エチル基、プロピル基、ブチル基、ペンチル基、ヘキシル基、ヘプチル基、オクチル基、ノニル基、デキル基、ウンデキル基、ドデキル基等のアルキル基、シクロペンチル基、シクロヘキシル基等のシクロアルキル基、ビニル基、プロペニル基、ヘキセニル基等の直鎖又は分岐の鎖状アルケニル基、シクロペンテニル基、シクロヘキセニル基等の環状アルケニル基、エチニル基、メチルエチニル基、1−プロピオニル基等のアルキニル基、フェニル基、ナフチル基、トルイル基等のアリール基、メトキシフェニル基等のアルコキシフェニル基、ベンジル基、フェニルエチル基等のアラルキル基、チエニル基、ピリジル基、フリル基等の複素環基が挙げられる。これらの内、ポリマー自体の安定性の観点から、アルキル基、シクロアルキル基、アリール基、アラルキル基等が好ましく、ポリマーの光学特性や耐候性、耐熱性と機械物性のバランスの観点から、アルキル基、シクロアルキル基が特に好ましい。 In the formulas (1) to (3), R 1 to R 4 are organic groups having 1 to 30 carbon atoms which may have independent substituents. Examples of the organic group having 1 to 30 carbon atoms of R 1 to R 4 include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, a heptyl group, an octyl group, a nonyl group, a decyl group and an undecyl group. , Alkyl group such as dodecyl group, cycloalkyl group such as cyclopentyl group, cyclohexyl group, linear or branched chain alkenyl group such as vinyl group, propenyl group, hexenyl group, cyclic alkenyl such as cyclopentenyl group, cyclohexenyl group. Alkinyl group such as group, ethynyl group, methylethynyl group, 1-propionyl group, aryl group such as phenyl group, naphthyl group and toluyl group, alkoxyphenyl group such as methoxyphenyl group, aralkyl group such as benzyl group and phenylethyl group. , Thienyl group, pyridyl group, frill group and other heterocyclic groups. Of these, alkyl groups, cycloalkyl groups, aryl groups, aralkyl groups and the like are preferable from the viewpoint of the stability of the polymer itself, and alkyl groups are preferable from the viewpoint of the optical properties and weather resistance of the polymer, and the balance between heat resistance and mechanical properties. , Cycloalkyl groups are particularly preferred.
また、これらの有機基が置換基を有する場合、本発明のポリカーボネート樹脂の優れた物性を大幅に損ねるものでなければ、特に制限はないが、当該置換基としては炭素数1〜30の上記有機基に加えて、アルコキシ基、水酸基、アミノ基、カルボキシル基、エステル基、ハロゲン原子、チオール基、チオエーテル基、有機ケイ素基等が挙げられる。R1〜R4の有機基はこれらの置換基を2以上有していてもよく、その場合、2以上の置換基は同一であっても異なるものであってもよい。 Further, when these organic groups have a substituent, there is no particular limitation as long as it does not significantly impair the excellent physical properties of the polycarbonate resin of the present invention, but the substituent is the above-mentioned organic having 1 to 30 carbon atoms. In addition to the group, an alkoxy group, a hydroxyl group, an amino group, a carboxyl group, an ester group, a halogen atom, a thiol group, a thioether group, an organic silicon group and the like can be mentioned. The organic groups R 1 to R 4 may have two or more of these substituents, in which case the two or more substituents may be the same or different.
R1〜R4は、そのうちの2以上、好ましくは2つまたは3つが相互に結合して環を形成していてもよく、特に、R1とR2、R3とR4がそれぞれ相互にアセタール結合で環を形成していることが、ポリカーボネート樹脂の耐熱性向上の観点から好ましい。 In R 1 to R 4 , two or more of them, preferably two or three, may be bonded to each other to form a ring, and in particular, R 1 and R 2 and R 3 and R 4 may be connected to each other. It is preferable that the ring is formed by an acetal bond from the viewpoint of improving the heat resistance of the polycarbonate resin.
特に、前記構造(1)〜(3)の内、構造(1)であることが、ポリカーボネート樹脂の耐熱性や光学特性の観点から好ましく、とりわけ前記式(1)において、R1とR2、R3とR4がそれぞれ相互にアセタール結合で環を形成していることが好ましい。 In particular, among the structures (1) to (3), the structure (1) is preferable from the viewpoint of heat resistance and optical characteristics of the polycarbonate resin, and in particular, in the above formula (1), R 1 and R 2 ,. It is preferable that R 3 and R 4 form a ring with each other by an acetal bond.
R1とR2、R3とR4とがアセタール結合を形成しているもの、また、アセタール結合で環を形成している構造の例として、好ましくは、下記構造式群で表されるものが挙げられ、これらのうち、耐熱性や光学特性の観点からシクロヘキシリデン基であることが特に好ましい。 As an example of a structure in which R 1 and R 2 , R 3 and R 4 form an acetal bond, and a structure in which a ring is formed by an acetal bond, those represented by the following structural formula group are preferable. Of these, cyclohexylidene groups are particularly preferable from the viewpoint of heat resistance and optical properties.
特に、本発明のポリカーボネート樹脂に含まれる構造単位は、構造(1)であって、前記式(1)において、R1とR2、R3とR4がシクロヘキシリデン基のアセタール結合で環を形成し、主鎖のシクロヘキサン環がmyo−イノシトールから誘導されるイノシトール残基の組合せである、下記式(4)で表される構造であることが、原料の調達のしやすさや耐熱性などの諸物性の観点から好ましい。 In particular, structural units contained in the polycarbonate resin of the present invention has a structure (1), in the formula (1), R 1 and R 2, R 3 and R 4 is an acetal bond cyclohexylidene group ring The structure represented by the following formula (4), in which the cyclohexane ring of the main chain is a combination of inositol residues derived from myo-inositol, makes it easy to procure raw materials and has heat resistance. It is preferable from the viewpoint of various physical properties.
尚、本発明のポリカーボネート樹脂は、構造(1)のみを有していてもよく、構造(2)のみを有していてもよく、構造(3)のみを有していてもよく、構造(1)〜(3)のいずれか2つを有していてもよく、構造(1)〜(3)を同時に3つ有していてもよい。また、本発明のポリカーボネート樹脂が有する構造(1)〜(3)中において、各構造中のR1〜R4はそれぞれ同一であってもよく、異なるものであってもよい。 The polycarbonate resin of the present invention may have only the structure (1), may have only the structure (2), may have only the structure (3), and may have only the structure (3). It may have any two of 1) to (3), and may have three structures (1) to (3) at the same time. Further, in the structures (1) to (3) of the polycarbonate resin of the present invention, R 1 to R 4 in each structure may be the same or different.
上記の構造(1)〜(3)は、後述の本発明のポリカーボネート樹脂の製造方法において、原料ジヒドロキシ化合物として、それぞれ、下記式(1A)、(2A)、(3A)で表されるジヒドロキシ化合物(以下、これらを「ジヒドロキシ化合物A」と称することがある。)を用いることにより、ポリカーボネート樹脂中に導入することができる。 The above structures (1) to (3) are dihydroxy compounds represented by the following formulas (1A), (2A) and (3A) as raw material dihydroxy compounds in the method for producing a polycarbonate resin of the present invention described later, respectively. By using (hereinafter, these may be referred to as "dihydroxy compound A"), it can be introduced into the polycarbonate resin.
(上記式(1A)〜(3A)中において、R1〜R4はそれぞれ前記式(1)〜(3)におけると同義である。) (In the above formulas (1A) to (3A), R 1 to R 4 are synonymous with the above formulas (1) to (3), respectively.)
本発明のポリカーボネート樹脂において、特に、構造(1)〜(3)中のシクロヘキサン環は、好ましくは、イノシトールから誘導されるイノシトール残基である。そのイノシトールの具体例として、all−cis−イノシトール、epi−イノシトール、allo−イノシトール、muco−イノシトール、myo−イノシトール、neo−イノシトール、chiro−D−イノシトール、chiro−L−イノシトール、scyllo−イノシトールが挙げられるが、原料の入手が容易な観点から、myo−イノシトールから誘導されるイノシトール残基であること、即ち、本発明のポリカーボネート樹脂における構造(1)〜(3)は、後述の本発明のポリカーボネート樹脂の製造方法において、myo−イノシトール、及び/又はその誘導体を原料ジヒドロキシ化合物として用いて導入されることが好ましい。 In the polycarbonate resin of the present invention, the cyclohexane ring in the structures (1) to (3) is preferably an inositol residue derived from inositol. Specific examples of the inositol include all-cis-inositol, epi-inositol, allo-inositol, muco-inositol, myo-inositol, neo-inositol, chiro-D-inositol, ciro-L-inositol, and sillo-inositol. However, from the viewpoint of easy availability of raw materials, the inositol residue derived from myo-inositol, that is, the structures (1) to (3) in the polycarbonate resin of the present invention are the polycarbonate of the present invention described later. In the method for producing a resin, it is preferable to use myo-inositol and / or a derivative thereof as a raw material dihydroxy compound.
(ジヒドロキシ化合物B)
本発明のポリカーボネート樹脂は下記式(5)で表される構造単位を含有していることが好ましい。
(Dihydroxy compound B)
The polycarbonate resin of the present invention preferably contains a structural unit represented by the following formula (5).
前記式(5)で表される構造単位の含有量は、ポリカーボネート樹脂を構成する全ての構造単位、及び連結基の重量の合計量を100重量%とした際に、1重量%以上、70重量%以下が好ましい。この割合は、10重量%以上、65重量%以下がより好ましく、20重量%以上、60重量%以下が特に好ましい。 The content of the structural unit represented by the formula (5) is 1% by weight or more and 70% by weight when the total weight of all the structural units constituting the polycarbonate resin and the linking group is 100% by weight. % Or less is preferable. This ratio is more preferably 10% by weight or more and 65% by weight or less, and particularly preferably 20% by weight or more and 60% by weight or less.
前記式(5)で表される構造単位の含有量が上記範囲より多い場合、耐熱性が過度に高くなり、機械特性や溶融加工性が悪化する。また、前記式(5)で表される構造単位は吸湿性の高い構造であるため、含有量が過度に多い場合には樹脂の吸水率が高くなり、高湿度の環境下において成形品の光学物性が変化したり、変形やひび割れ等が起こる懸念がある。一方、前記式(5)で表される構造単位の含有量が上記範囲より少ない場合、耐熱性が不十分となったり、本発明のポリカーボネート樹脂の特長である高透過率や低光弾性係数等の光学特性が得られなくなる。 When the content of the structural unit represented by the formula (5) is larger than the above range, the heat resistance becomes excessively high, and the mechanical properties and melt processability deteriorate. Further, since the structural unit represented by the above formula (5) has a highly hygroscopic structure, the water absorption rate of the resin becomes high when the content is excessively high, and the optics of the molded product is obtained in a high humidity environment. There is a concern that the physical properties may change, or that deformation or cracking may occur. On the other hand, when the content of the structural unit represented by the formula (5) is less than the above range, the heat resistance becomes insufficient, and the high transmittance, low photoelastic coefficient, etc., which are the features of the polycarbonate resin of the present invention, etc. Optical characteristics cannot be obtained.
前記式(5)で表される構造単位を導入可能なジヒドロキシ化合物としては、立体異性体の関係にある、イソソルビド(ISB)、イソマンニド、イソイデット(以下、これらを「ジヒドロキシ化合物B」と称することがある。)が挙げられる。これらは1種を単独で用いてもよく、2種以上を組み合わせて用いてもよい。これらの中でも、入手及び重合反応性の観点からISBを用いるのが最も好ましい。 Examples of the dihydroxy compound into which the structural unit represented by the formula (5) can be introduced include isosorbide (ISB), isomannide, and isoidet (hereinafter, these are referred to as "dihydroxy compound B", which have a stereoisomeric relationship. There is.). One of these may be used alone, or two or more thereof may be used in combination. Of these, ISB is most preferably used from the viewpoint of availability and polymerization reactivity.
ジヒドロキシ化合物Bは、還元剤、抗酸化剤、脱酸素剤、光安定剤、制酸剤、pH安定剤又は熱安定剤等の安定剤を含んでいてもよい。特に酸性下でジヒドロキシ化合物Bは変質しやすいことから、塩基性安定剤を含むことが好ましい。 The dihydroxy compound B may contain a stabilizer such as a reducing agent, an antioxidant, an oxygen scavenger, a light stabilizer, an antacid, a pH stabilizer or a heat stabilizer. In particular, since the dihydroxy compound B is easily altered under acidic conditions, it is preferable to contain a basic stabilizer.
塩基性安定剤としては、例えば、長周期型周期表(Nomenclature of Inorganic Chemistry IUPAC Recommendations2005)における1族又は2族の金属の水酸化物、炭酸塩、リン酸塩、亜リン酸塩、次亜リン酸塩、硼酸塩及び脂肪酸塩;テトラメチルアンモニウムヒドロキシド、テトラエチルアンモニウムヒドロキシド、テトラプロピルアンモニウムヒドロキシド、テトラブチルアンモニウムヒドロキシド、トリメチルエチルアンモニウムヒドロキシド、トリメチルベンジルアンモニウムヒドロキシド、トリメチルフェニルアンモニウムヒドロキシド、トリエチルメチルアンモニウムヒドロキシド、トリエチルベンジルアンモニウムヒドロキシド、トリエチルフェニルアンモニウムヒドロキシド、トリブチルベンジルアンモニウムヒドロキシド、トリブチルフェニルアンモニウムヒドロキシド、テトラフェニルアンモニウムヒドロキシド、ベンジルトリフェニルアンモニウムヒドロキシド、メチルトリフェニルアンモニウムヒドロキシド及びブチルトリフェニルアンモニウムヒドロキシド等の塩基性アンモニウム化合物;ジエチルアミン、ジブチルアミン、トリエチルアミン、モルホリン、N−メチルモルホリン、ピロリジン、ピペリジン、3−アミノ−1−プロパノール、エチレンジアミン、N−メチルジエタノールアミン、ジエチルエタノールアミン、ジエタノールアミン、トリエタノールアミン、4−アミノピリジン、2−アミノピリジン、N,N−ジメチル−4−アミノピリジン、4−ジエチルアミノピリジン、2−ヒドロキシピリジン、2−メトキシピリジン、4−メトキシピリジン、2−ジメチルアミノイミダゾール、2−メトキシイミダゾール、イミダゾール、2−メルカプトイミダゾール、2−メチルイミダゾール及びアミノキノリン等;アミン系化合物、並びにジ−(tert−ブチル)アミン及び2,2,6,6−テトラメチルピペリジン等のヒンダードアミン系化合物が挙げられる。 Examples of the basic stabilizer include hydroxides, carbonates, phosphates, phosphites, and hypophosphoruss of Group 1 or Group 2 metals in the long-period periodic table (Nomenclature of Inorganic Chemistry IUPAC Recognitions 2005). Acidates, borolates and fatty acid salts; tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetrapropylammonium hydroxide, tetrabutylammonium hydroxide, trimethylethylammonium hydroxide, trimethylbenzylammonium hydroxide, trimethylphenylammonium hydroxide, Triethylmethylammonium hydroxide, triethylbenzylammonium hydroxide, triethylphenylammonium hydroxide, tributylbenzylammonium hydroxide, tributylphenylammonium hydroxide, tetraphenylammonium hydroxide, benzyltriphenylammonium hydroxide, methyltriphenylammonium hydroxide and Basic ammonium compounds such as butyltriphenylammonium hydroxide; diethylamine, dibutylamine, triethylamine, morpholine, N-methylmorpholine, pyrrolidine, piperidine, 3-amino-1-propanol, ethylenediamine, N-methyldiethanolamine, diethylethanolamine, Diethanolamine, triethanolamine, 4-aminopyridine, 2-aminopyridine, N, N-dimethyl-4-aminopyridine, 4-diethylaminopyridine, 2-hydroxypyridine, 2-methoxypyridine, 4-methoxypyridine, 2-dimethyl Aminoimidazole, 2-methoxyimidazole, imidazole, 2-mercaptoimidazole, 2-methylimidazole, aminoquinoline, etc .; amine compounds, and di- (tert-butyl) amine and 2,2,6,6-tetramethylpiperidine, etc. Hindered amine compounds can be mentioned.
ジヒドロキシ化合物B中のこれら塩基性安定剤の含有量に特に制限はないが、ジヒドロキシ化合物Bは酸性状態では不安定であるので、上記の安定剤を含むジヒドロキシ化合物Bの水溶液のpHが7付近となるように安定剤を添加することが好ましい。 The content of these basic stabilizers in the dihydroxy compound B is not particularly limited, but since the dihydroxy compound B is unstable in an acidic state, the pH of the aqueous solution of the dihydroxy compound B containing the above stabilizer is around 7. It is preferable to add a stabilizer so as to be.
安定剤の量が少なすぎるとジヒドロキシ化合物Bの変質を防止する効果が得られない可能性があり、多すぎるとジヒドロキシ化合物Bの変性を招く場合があるので、ジヒドロキシ化合物Bに対して、0.0001重量%〜0.1重量%であることが好ましく、より好ましくは0.001重量%〜0.05重量%である。 If the amount of the stabilizer is too small, the effect of preventing the alteration of the dihydroxy compound B may not be obtained, and if the amount of the stabilizer is too large, the dihydroxy compound B may be denatured. It is preferably 0001% by weight to 0.1% by weight, more preferably 0.001% by weight to 0.05% by weight.
また、ジヒドロキシ化合物Bは吸湿しやすく、また、酸素によって徐々に劣化するため、保管又は製造時の取り扱いの際には水分が混入しないようにし、また、脱酸素剤を用いたり、窒素雰囲気下にしたりすることが好ましい。 In addition, since dihydroxy compound B easily absorbs moisture and gradually deteriorates due to oxygen, prevent water from being mixed during storage or handling during manufacturing, and use an oxygen scavenger or put it in a nitrogen atmosphere. It is preferable to do so.
(フルオレン系モノマー)
本発明のポリカーボネート樹脂は、下記式(6)〜(8)で表される構造単位から選ばれる構造単位を含有してもよい。尚、下記式(6)〜(8)で表される構造単位を含有する二官能性モノマーを「フルオレン系モノマー」と称することがある。また、下記式(7)及び(8)で表される構造単位を「オリゴフルオレン構造単位」と称することがある。
(Fluorene-based monomer)
The polycarbonate resin of the present invention may contain a structural unit selected from the structural units represented by the following formulas (6) to (8). Bifunctional monomers containing structural units represented by the following formulas (6) to (8) may be referred to as "fluorene-based monomers". Further, the structural units represented by the following formulas (7) and (8) may be referred to as "oligofluorene structural units".
(上記式(6)中、R5〜R8はそれぞれ独立に、水素原子、置換若しくは無置換の炭素数1〜20のアルキル基、置換若しくは無置換の炭素数6〜20のシクロアルキル基、又は、置換若しくは無置換の炭素数6〜20のアリール基を表し、Xは置換若しくは無置換の炭素数2〜10のアルキレン基、置換若しくは無置換の炭素数6〜20のシクロアルキレン基、又は、置換若しくは無置換の炭素数6〜20のアリーレン基を表す。m及びnはそれぞれ独立に0〜5の整数である。) (In the above formula (6), R 5 to R 8 are independently hydrogen atoms, substituted or unsubstituted alkyl groups having 1 to 20 carbon atoms, substituted or unsubstituted cycloalkyl groups having 6 to 20 carbon atoms, respectively. Alternatively, it represents a substituted or unsubstituted aryl group having 6 to 20 carbon atoms, and X is a substituted or unsubstituted alkylene group having 2 to 10 carbon atoms, a substituted or unsubstituted cycloalkylene group having 6 to 20 carbon atoms, or , Substituent or unsubstituted, represents an arylene group having 6 to 20 carbon atoms. M and n are independently integers of 0 to 5.)
(式(7)及び(8)中、R9〜R11は、それぞれ独立に、直接結合、置換基を有していてもよい炭素数1〜4のアルキレン基であり、R12〜R17は、それぞれ独立に、水素原子、置換基を有していてもよい炭素数1〜10のアルキル基、置換基を有していてもよい炭素数4〜10のアリール基、置換基を有していてもよい炭素数1〜10のアシル基、置換基を有していてもよい炭素数1〜10のアルコキシ基、置換基を有していてもよい炭素数1〜10のアリールオキシ基、置換基を有していてもよい炭素数1〜10のアシルオキシ基、置換基を有していてもよいアミノ基、置換基を有していてもよい炭素数1〜10のビニル基、置換基を有していてもよい炭素数1〜10のエチニル基、置換基を有する硫黄原子、置換基を有するケイ素原子、ハロゲン原子、ニトロ基、又はシアノ基である。ただし、R12〜R17のうち隣接する少なくとも2つの基が互いに結合して環を形成していてもよい。) (In formulas (7) and (8), R 9 to R 11 are alkylene groups having 1 to 4 carbon atoms which may independently have a direct bond and a substituent, and are R 12 to R 17 respectively. Each independently has a hydrogen atom, an alkyl group having 1 to 10 carbon atoms which may have a substituent, an aryl group having 4 to 10 carbon atoms which may have a substituent, and a substituent. An acyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms which may have a substituent, an aryloxy group having 1 to 10 carbon atoms which may have a substituent, and the like. An acyloxy group having 1 to 10 carbon atoms which may have a substituent, an amino group which may have a substituent, a vinyl group having 1 to 10 carbon atoms which may have a substituent, and a substituent. It is an ethynyl group having 1 to 10 carbon atoms, a sulfur atom having a substituent, a silicon atom having a substituent, a halogen atom, a nitro group, or a cyano group, which may have R 12 to R 17 . Of these, at least two adjacent groups may be bonded to each other to form a ring.)
これらの構造単位を導入することで、位相差の波長分散性(波長依存性)を調整することが可能となる。多くのポリマーは位相差が短波長ほど大きくなる正の波長分散性を有しているが、前記式(6)〜(8)で表される構造単位は位相差が短波長ほど小さくなる逆波長分散性を有しているため、前記式(6)〜(8)で表される構造単位の含有量に応じてフラットな波長分散性から逆波長分散性へと調整することができる。 By introducing these structural units, it becomes possible to adjust the wavelength dispersibility (wavelength dependence) of the phase difference. Many polymers have a positive wavelength dispersibility in which the phase difference increases as the wavelength becomes shorter, but the structural units represented by the above equations (6) to (8) have a reverse wavelength in which the phase difference becomes smaller as the wavelength becomes shorter. Since it has dispersibility, it can be adjusted from flat wavelength dispersibility to inverse wavelength dispersibility according to the content of the structural units represented by the formulas (6) to (8).
前記式(6)〜(8)で表される構造単位による逆波長分散の発現性は構造により異なるが、位相差フィルムとして最適な波長分散特性を得るためには、前記式(6)〜(8)で表される構造単位の含有量は、ポリカーボネート樹脂を構成する全ての構造単位、及び連結基の重量の合計量を100重量%とした際に、1重量%以上、70重量%以下含有することが好ましく、3重量%以上、60重量%以下とすることがより好ましく、5重量%以上、50重量%以下とすることが特に好ましい。 The manifestation of inverse wavelength dispersion by the structural units represented by the formulas (6) to (8) differs depending on the structure, but in order to obtain the optimum wavelength dispersion characteristics as a retardation film, the formulas (6) to (8) The content of the structural unit represented by 8) is 1% by weight or more and 70% by weight or less when the total weight of all the structural units constituting the polycarbonate resin and the linking group is 100% by weight. It is preferably 3% by weight or more and 60% by weight or less, and particularly preferably 5% by weight or more and 50% by weight or less.
樹脂中の前記式(6)〜(8)で表される構造単位の含有量が少な過ぎると、これらの構造単位を含有することによる上記効果を十分に得ることができないが、前記式(6)〜(8)で表される構造単位は負の複屈折を有しているため、樹脂中の含有量が上記範囲よりも多い場合、複屈折が小さくなりすぎて、所望の位相差が得られなくなるおそれがある。また、他の共重合成分の比率が少なくなるため、耐熱性や機械物性等の他の特性のバランスを調整することが難しくなるおそれがある。 If the content of the structural units represented by the formulas (6) to (8) in the resin is too small, the above effect due to the inclusion of these structural units cannot be sufficiently obtained, but the above formula (6) )-(8) have negative birefringence. Therefore, when the content in the resin is larger than the above range, the birefringence becomes too small and a desired phase difference is obtained. It may not be possible. Further, since the ratio of other copolymerization components is reduced, it may be difficult to adjust the balance of other properties such as heat resistance and mechanical properties.
前記式(6)で表される構造単位を導入するために用いられるジヒドロキシ化合物として、具体的には、9,9−ビス(4−(2−ヒドロキシエトキシ)フェニル)フルオレン、9,9−ビス(4−ヒドロキシフェニル)フルオレン、9,9−ビス(4−ヒドロキシ−3−メチルフェニル)フルオレン、9,9−ビス(4−(2−ヒドロキシプロポキシ)フェニル)フルオレン、9,9−ビス(4−(2−ヒドロキシエトキシ)−3−メチルフェニル)フルオレン、9,9−ビス(4−(2−ヒドロキシプロポキシ)−3−メチルフェニル)フルオレン、9,9−ビス(4−(2−ヒドロキシエトキシ)−3−イソプロピルフェニル)フルオレン、9,9−ビス(4−(2−ヒドロキシエトキシ)−3−イソブチルフェニル)フルオレン、9,9−ビス(4−(2−ヒドロキシエトキシ)−3−tert−ブチルフェニル)フルオレン、9,9−ビス(4−(2−ヒドロキシエトキシ)−3−シクロヘキシルフェニル)フルオレン、9,9−ビス(4−(2−ヒドロキシエトキシ)−3−フェニルフェニル)フルオレン、9,9−ビス(4−(2−ヒドロキシエトキシ)−3,5−ジメチルフェニル)フルオレン、9,9−ビス(4−(2−ヒドロキシエトキシ)−3−tert−ブチル−6−メチルフェニル)フルオレン、9,9−ビス(4−(3−ヒドロキシ−2,2−ジメチルプロポキシ)フェニル)フルオレンなどが挙げられる。 Specific examples of the dihydroxy compound used for introducing the structural unit represented by the formula (6) include 9,9-bis (4- (2-hydroxyethoxy) phenyl) fluorene and 9,9-bis. (4-Hydroxyphenyl) fluorene, 9,9-bis (4-hydroxy-3-methylphenyl) fluorene, 9,9-bis (4- (2-hydroxypropoxy) phenyl) fluorene, 9,9-bis (4) -(2-Hydroxyethoxy) -3-methylphenyl) fluorene, 9,9-bis (4- (2-hydroxypropoxy) -3-methylphenyl) fluorene, 9,9-bis (4- (2-hydroxyethoxy) 4- (2-hydroxyethoxy) ) -3-Isopropyl) fluorene, 9,9-bis (4- (2-hydroxyethoxy) -3-isobutylphenyl) fluorene, 9,9-bis (4- (2-hydroxyethoxy) -3-tert- Butylphenyl) fluorene, 9,9-bis (4- (2-hydroxyethoxy) -3-cyclohexylphenyl) fluorene, 9,9-bis (4- (2-hydroxyethoxy) -3-phenylphenyl) fluorene, 9 , 9-bis (4- (2-hydroxyethoxy) -3,5-dimethylphenyl) fluorene, 9,9-bis (4- (2-hydroxyethoxy) -3-tert-butyl-6-methylphenyl) fluorene , 9,9-Bis (4- (3-hydroxy-2,2-dimethylpropoxy) phenyl) fluorene and the like.
上記のジヒドロキシ化合物の中でも、耐熱性や光学物性、機械物性などの種々の特性が優れることと、入手のしやすさの観点から、9,9−ビス(4−(2−ヒドロキシエトキシ)フェニル)フルオレンと9,9−ビス(4−ヒドロキシ−3−メチルフェニル)フルオレンが特に好ましい。 Among the above dihydroxy compounds, 9,9-bis (4- (2-hydroxyethoxy) phenyl) is excellent in various properties such as heat resistance, optical properties, and mechanical properties, and is easily available. Fluorene and 9,9-bis (4-hydroxy-3-methylphenyl) fluorene are particularly preferred.
前記式(7)及び(8)中のR9及びR10において、「置換基を有していてもよい炭素数1〜4のアルキレン基」としては、例えば以下のアルキレン基を採用することができる。
メチレン基、エチレン基、n−プロピレン基、n−ブチレン基等の直鎖状のアルキレン基;メチルメチレン基、ジメチルメチレン基、エチルメチレン基、プロピルメチレン基、(1−メチルエチル)メチレン基、1−メチルエチレン基、2−メチルエチレン基、1−エチルエチレン基、2−エチルエチレン基、1−メチルプロピレン基、2−メチルプロピレン基、1,1−ジメチルエチレン基、2,2−ジメチルプロピレン基、3−メチルプロピレン基等の、分岐鎖を有するアルキレン基。ここで、R9及びR10における分岐鎖の位置は、フルオレン環側の炭素が1位となるように付与した番号により示した。
In R 9 and R 10 in the formulas (7) and (8), for example, the following alkylene group may be adopted as the "alkylene group having 1 to 4 carbon atoms which may have a substituent". it can.
Linear alkylene group such as methylene group, ethylene group, n-propylene group, n-butylene group; methylmethylene group, dimethylmethylene group, ethylmethylene group, propylmethylene group, (1-methylethyl) methylene group, 1 -Methylethylene group, 2-methylethylene group, 1-ethylethylene group, 2-ethylethylene group, 1-methylpropylene group, 2-methylpropylene group, 1,1-dimethylethylene group, 2,2-dimethylpropylene group , A alkylene group having a branched chain, such as a 3-methylpropylene group. Here, the positions of the branched chains in R 9 and R 10 are indicated by the numbers assigned so that the carbon on the fluorene ring side is at the 1st position.
R9及びR10の選択は、逆波長分散性の発現に特に重要な影響を及ぼす。フルオレン系モノマー構造中のフルオレン環が主鎖方向(延伸方向)に対して垂直に配向した状態において、最も強い逆波長分散性を示す。フルオレン環の配向状態を前記の状態に近づけ、強い逆波長分散性を発現させるためには、アルキレン基の主鎖上の炭素数が2〜3であるR9及びR10を採用することが好ましい。炭素数が1の場合は意外にも逆波長分散性を示さない場合がある。この要因としては、オリゴフルオレン構造単位の連結基であるカーボネート基やエステル基の立体障害によって、フルオレン環の配向が主鎖方向に対して垂直ではない方向に固定化されてしまうこと等が考えられる。一方、炭素数が多すぎる場合は、フルオレン環の配向の固定が弱くなることで、逆波長分散性が弱くなるおそれがある。また、樹脂の耐熱性も低下する傾向にある。 The choice of R 9 and R 10 has a particularly important effect on the development of inverse wavelength dispersibility. The strongest reverse wavelength dispersibility is exhibited when the fluorene ring in the fluorene-based monomer structure is oriented perpendicular to the main chain direction (stretching direction). In order to bring the orientation state of the fluorene ring closer to the above-mentioned state and to exhibit strong inverse wavelength dispersibility, it is preferable to adopt R 9 and R 10 having 2 to 3 carbon atoms on the main chain of the alkylene group. .. When the number of carbon atoms is 1, the inverse wavelength dispersibility may not be unexpectedly shown. It is considered that this factor is that the orientation of the fluorene ring is fixed in a direction that is not perpendicular to the main chain direction due to steric hindrance of the carbonate group or ester group that is the linking group of the oligofluorene structural unit. .. On the other hand, when the number of carbon atoms is too large, the fixation of the orientation of the fluorene ring is weakened, which may weaken the inverse wavelength dispersibility. In addition, the heat resistance of the resin tends to decrease.
前記式(7)及び(8)に示すように、R9及びR10は、アルキレン基の一端がフルオレン環に結合し、他端が連結基に含まれる酸素原子、又はカルボニル炭素のいずれかに結合している。熱安定性、耐熱性及び逆波長分散性の観点からは、アルキレン基の他端がカルボニル炭素に結合していることが好ましい。後述するとおり、オリゴフルオレン構造を有するモノマーとして、具体的にはジオール若しくはジエステル(以下、ジエステルにはジカルボン酸も含むものとする)の構造が考えられるが、ジエステルを原料に用いて重合することが好ましい。また、製造を容易にする観点からは、R9及びR10に同一のアルキレン基を採用することが好ましい。 As shown in the formulas (7) and (8), in R 9 and R 10 , one end of the alkylene group is bonded to the fluorene ring and the other end is either an oxygen atom contained in the linking group or a carbonyl carbon. It is combined. From the viewpoint of thermal stability, heat resistance and reverse wavelength dispersibility, it is preferable that the other end of the alkylene group is bonded to the carbonyl carbon. As will be described later, as the monomer having an oligofluorene structure, specifically, a structure of a diol or a diester (hereinafter, the diester also includes a dicarboxylic acid) can be considered, but it is preferable to polymerize using the diester as a raw material. Further, from the viewpoint of facilitating production, it is preferable to use the same alkylene group for R 9 and R 10 .
R11において、「置換基を有していてもよい炭素数1〜4のアルキレン基」としては、例えば以下のアルキレン基を採用することができる。
メチレン基、エチレン基、n−プロピレン基、n−ブチレン基等の直鎖状のアルキレン基;メチルメチレン基、ジメチルメチレン基、エチルメチレン基、プロピルメチレン基、(1−メチルエチル)メチレン基、1−メチルエチレン基、2−メチルエチレン基、1−エチルエチレン基、2−エチルエチレン基、1−メチルプロピレン基、2−メチルプロピレン基、1,1−ジメチルエチレン基、2,2−ジメチルプロピレン基、3−メチルプロピレン基等の分岐鎖を有するアルキレン基。
In R 11, the "alkylene group having 1 to 4 carbon atoms which may have a substituent" may be employed for example an alkylene group having up.
Linear alkylene group such as methylene group, ethylene group, n-propylene group, n-butylene group; methylmethylene group, dimethylmethylene group, ethylmethylene group, propylmethylene group, (1-methylethyl) methylene group, 1 -Methylethylene group, 2-methylethylene group, 1-ethylethylene group, 2-ethylethylene group, 1-methylpropylene group, 2-methylpropylene group, 1,1-dimethylethylene group, 2,2-dimethylpropylene group , A alkylene group having a branched chain such as a 3-methylpropylene group.
R11は、アルキレン基の主鎖上の炭素数が1〜2であることが好ましく、特に炭素数が1であることが好ましい。主鎖上の炭素数が多すぎるR11を採用する場合は、R9及びR10と同様にフルオレン環の固定化が弱まり、逆波長分散性の低下、光弾性係数の増加、耐熱性の低下等を招くおそれがある。一方、主鎖上の炭素数は少ない方が光学特性や耐熱性は良好であるが、二つのフルオレン環の9位が直接結合でつながる場合は熱安定性が悪化する。 R 11 preferably has 1 to 2 carbon atoms on the main chain of the alkylene group, and particularly preferably 1 carbon atom. When R 11 having too many carbon atoms on the main chain is adopted, the immobilization of the fluorene ring is weakened as in R 9 and R 10, and the inverse wavelength dispersibility is lowered, the photoelastic coefficient is increased, and the heat resistance is lowered. Etc. may be invited. On the other hand, the smaller the number of carbon atoms on the main chain, the better the optical characteristics and heat resistance, but when the 9-positions of the two fluorene rings are directly connected by a direct bond, the thermal stability deteriorates.
前記オリゴフルオレン構造単位に含まれるフルオレン環は、R12〜R17の全てが水素原子である構成、或いは、R12及び/又はR17がハロゲン原子、アシル基、ニトロ基、シアノ基、及びスルホ基からなる群から選ばれるいずれかであり、かつ、R13〜R16が水素原子である構成のいずれかであることが好ましい。前者の構成を有する場合には、前記オリゴフルオレン構造単位を含む化合物を、工業的にも安価なフルオレンから誘導できる。また、後者の構成を有する場合には、フルオレン環の9位の反応性が向上するため、前記オリゴフルオレン構造単位を含む化合物の合成過程において、様々な誘導反応が適応可能となる傾向がある。前記フルオレン環は、より好ましくは、R12〜R17の全てが水素原子である構成、或いは、R12及び/又はR17がフッ素原子、塩素原子、臭素原子、及びニトロ基からなる群から選ばれるいずれかであり、かつ、R13〜R16が水素原子である構成のいずれかであることがより好ましく、R12〜R17の全てが水素原子である構成が特に好ましい。前記の構成を採用することにより、フルオレン比率を高めることができ、かつ、フルオレン環同士の立体障害が生じにくく、フルオレン環に由来する所望の光学特性が得られる傾向もある。 The fluorene ring contained in the oligofluorene structural unit has a structure in which all of R 12 to R 17 are hydrogen atoms, or R 12 and / or R 17 is a halogen atom, an acyl group, a nitro group, a cyano group, and a sulfo. It is preferably one selected from the group consisting of groups and one having a configuration in which R 13 to R 16 are hydrogen atoms. When it has the former configuration, the compound containing the oligofluorene structural unit can be derived from fluorene, which is industrially inexpensive. Further, in the case of having the latter configuration, since the reactivity at the 9-position of the fluorene ring is improved, various induction reactions tend to be applicable in the process of synthesizing the compound containing the oligofluorene structural unit. The fluorene ring is more preferably selected from the constitution in which all of R 12 to R 17 are hydrogen atoms, or the group in which R 12 and / or R 17 consists of a fluorine atom, a chlorine atom, a bromine atom, and a nitro group. It is more preferable that R 13 to R 16 are hydrogen atoms, and it is particularly preferable that all of R 12 to R 17 are hydrogen atoms. By adopting the above configuration, the fluorene ratio can be increased, steric hindrance between the fluorene rings is unlikely to occur, and there is a tendency that desired optical characteristics derived from the fluorene ring can be obtained.
前記式(7)及び(8)で表される2価のオリゴフルオレン構造単位のうち、好ましい構造としては具体的に下記[A]群に例示される式(A1)〜(A6)で表される骨格を有する構造が挙げられる。 Among the divalent oligofluorene structural units represented by the formulas (7) and (8), the preferable structure is specifically represented by the formulas (A1) to (A6) exemplified in the following [A] group. A structure having a skeletal structure can be mentioned.
前記オリゴフルオレン構造単位を有するモノマーとしては、例えば、下記式(7A)で表される特定のジヒドロキシ化合物や下記式(8A)で表される特定のジエステルが挙げられる。 Examples of the monomer having an oligofluorene structural unit include a specific dihydroxy compound represented by the following formula (7A) and a specific diester represented by the following formula (8A).
(上記式(7A)及び(8A)中において、R9〜R17はそれぞれ前記式(7)及び(8)におけると同義である。A1およびA2は水素原子、又は置換基を有していてもよい炭素数1〜18の脂肪族炭化水素基、又は置換基を有していてもよい芳香族炭化水素基であり、A1とA2とは同一であっても異なっていてもよい。) (In the above formulas (7A) and (8A), R 9 to R 17 are synonymous with those in the above formulas (7) and (8), respectively. A 1 and A 2 have a hydrogen atom or a substituent. It is an aliphatic hydrocarbon group having 1 to 18 carbon atoms, or an aromatic hydrocarbon group which may have a substituent, and A 1 and A 2 may be the same or different. Good.)
前記2価のオリゴフルオレン構造単位を有するモノマーとしては、前記式(8A)で表される特定のジエステルを用いることが好ましい。前記特定のジエステルは、前記式(7A)で表される特定のジヒドロキシ化合物よりも熱安定性が比較的良好であり、また、ポリマー中のフルオレン環が好ましい方向に配向し、より強い逆波長分散性を示す傾向がある。尚、ポリカーボネート樹脂中にジエステルの構造単位を含有する場合、この樹脂をポリエステルカーボネート樹脂と称する。 As the monomer having the divalent oligofluorene structural unit, it is preferable to use the specific diester represented by the formula (8A). The specific diester has relatively better thermal stability than the specific dihydroxy compound represented by the formula (7A), and the fluorene ring in the polymer is oriented in a preferable direction, resulting in stronger inverse wavelength dispersion. Tends to show sex. When the polycarbonate resin contains a structural unit of diester, this resin is referred to as a polyester carbonate resin.
前記式(8A)のA1とA2が水素原子、又は、メチル基やエチル基等の脂肪族炭化水素基である場合、通常用いられるポリカーボネートの重合条件においては、重合反応が起こりにくいことがある。そのため、前記式(8A)のA1とA2は芳香族炭化水素基であることが好ましい。 When A 1 and A 2 of the above formula (8A) are hydrogen atoms or aliphatic hydrocarbon groups such as a methyl group and an ethyl group, the polymerization reaction is unlikely to occur under the usual polymerization conditions of polycarbonate. is there. Therefore, it is preferable that A 1 and A 2 of the above formula (8A) are aromatic hydrocarbon groups.
(その他の構造単位を有するモノマー)
本発明のポリカーボネート樹脂においては、前述した構造単位以外の構造単位を含んでいてもよく(以下、「その他の構造単位」と称することがある。)、その他の構造単位を含有するモノマーとしては、例えば、脂肪族ジヒドロキシ化合物、脂環式ジヒドロキシ化合物、アセタール環を含有するジヒドロキシ化合物、オキシアルキレングリコール類、芳香族成分を含有するジヒドロキシ化合物、ジエステル化合物等が挙げられる。これらのなかでも、反応効率を高める観点から、脂肪族ジヒドロキシ化合物、脂環式ジヒドロキシ化合物、アセタール環を含有するジヒドロキシ化合物、オキシアルキレングリコール類、芳香族成分を含有するジヒドロキシ化合物が好ましい。
(Monomer with other structural units)
The polycarbonate resin of the present invention may contain a structural unit other than the above-mentioned structural unit (hereinafter, may be referred to as “other structural unit”), and the monomer containing the other structural unit may be used. Examples thereof include aliphatic dihydroxy compounds, alicyclic dihydroxy compounds, dihydroxy compounds containing an acetal ring, oxyalkylene glycols, dihydroxy compounds containing aromatic components, and diester compounds. Among these, an aliphatic dihydroxy compound, an alicyclic dihydroxy compound, a dihydroxy compound containing an acetal ring, an oxyalkylene glycol, and a dihydroxy compound containing an aromatic component are preferable from the viewpoint of increasing the reaction efficiency.
脂肪族ジヒドロキシ化合物としては、例えば、以下のジヒドロキシ化合物を用いることができる。
エチレングリコール、1,3−プロパンジオール、1,2−プロパンジオール、1,4−ブタンジオール、1,3−ブタンジオール、1,2−ブタンジオール、1,5−ヘプタンジオール、1,6−ヘキサンジオール、1,9−ノナンジオール、1,10−デカンジオール、1,12−ドデカンジオール等の直鎖脂肪族炭化水素のジヒドロキシ化合物;ネオペンチルグリコール、ヘキシレングリコール等の分岐脂肪族炭化水素のジヒドロキシ化合物。
As the aliphatic dihydroxy compound, for example, the following dihydroxy compounds can be used.
Ethylene glycol, 1,3-propanediol, 1,2-propanediol, 1,4-butanediol, 1,3-butanediol, 1,2-butanediol, 1,5-heptanediol, 1,6-hexane Dihydroxy compounds of linear aliphatic hydrocarbons such as diols, 1,9-nonanediols, 1,10-decanediols and 1,12-dodecanediol; dihydroxys of branched aliphatic hydrocarbons such as neopentyl glycols and hexylene glycols. Compound.
脂環式ジヒドロキシ化合物としては、例えば、以下のジヒドロキシ化合物を用いることができる。
1,2−シクロヘキサンジメタノール、1,3−シクロヘキサンジメタノール、1,4−シクロヘキサンジメタノール、トリシクロデカンジメタノール、ペンタシクロペンタデカンジメタノール、2,6−デカリンジメタノール、1,5−デカリンジメタノール、2,3−デカリンジメタノール、2,3−ノルボルナンジメタノール、2,5−ノルボルナンジメタノール、1,3−アダマンタンジメタノール、リモネン等の、テルペン化合物から誘導されるジヒドロキシ化合物等に例示される、脂環式炭化水素の1級アルコールであるジヒドロキシ化合物;1,2−シクロヘキサンジオール、1,4−シクロヘキサンジオール、1,3−アダマンタンジオール、水添ビスフェノールA、2,2,4,4−テトラメチル−1,3−シクロブタンジオール等に例示される、脂環式炭化水素の2級アルコール及び3級アルコールであるジヒドロキシ化合物。
As the alicyclic dihydroxy compound, for example, the following dihydroxy compounds can be used.
1,2-Cyclohexanedimethanol, 1,3-cyclohexanedimethanol, 1,4-cyclohexanedimethanol, tricyclodecanedimethanol, pentacyclopentadecanedimethanol, 2,6-decalin dimethanol, 1,5-decalindi Examples thereof include dihydroxy compounds derived from terpene compounds such as methanol, 2,3-decalin dimethanol, 2,3-norbornan dimethanol, 2,5-norbornan dimethanol, 1,3-adamantan dimethanol, and limonene. Dihydroxy compound which is a primary alcohol of alicyclic hydrocarbon; 1,2-cyclohexanediol, 1,4-cyclohexanediol, 1,3-adamantandiol, hydrogenated bisphenol A, 2,2,4,5- Dihydroxy compounds which are secondary alcohols and tertiary alcohols of alicyclic hydrocarbons, which are exemplified by tetramethyl-1,3-cyclobutanediol and the like.
アセタール環を含有するジヒドロキシ化合物としては、例えば、下記構造式(9)で表されるスピログリコールや下記構造式(10)で表されるジオキサングリコール等を用いることができる。 As the dihydroxy compound containing an acetal ring, for example, spiroglycol represented by the following structural formula (9), dioxane glycol represented by the following structural formula (10), or the like can be used.
オキシアルキレングリコール類としては、例えば、以下のジヒドロキシ化合物を用いることができる。
ジエチレングリコール、トリエチレングリコール、テトラエチレングリコール、ポリエチレングリコール、ポリプロピレングリコール。
As the oxyalkylene glycols, for example, the following dihydroxy compounds can be used.
Diethylene glycol, triethylene glycol, tetraethylene glycol, polyethylene glycol, polypropylene glycol.
芳香族成分を含有するジヒドロキシ化合物としては、例えば、以下のジヒドロキシ化合物を用いることができる。
2,2−ビス(4−ヒドロキシフェニル)プロパン、2,2−ビス(3−メチル−4−ヒドロキシフェニル)プロパン、2,2−ビス(4−ヒドロキシ−3,5−ジメチルフェニル)プロパン、2,2−ビス(4−ヒドロキシ−3,5−ジエチルフェニル)プロパン、2,2−ビス(4−ヒドロキシ−(3−フェニル)フェニル)プロパン、2,2−ビス(4−ヒドロキシ−(3,5−ジフェニル)フェニル)プロパン、2,2−ビス(4−ヒドロキシ−3,5−ジブロモフェニル)プロパン、ビス(4−ヒドロキシフェニル)メタン、1,1−ビス(4−ヒドロキシフェニル)エタン、2,2−ビス(4−ヒドロキシフェニル)ブタン、2,2−ビス(4−ヒドロキシフェニル)ペンタン、1,1−ビス(4−ヒドロキシフェニル)−1−フェニルエタン、ビス(4−ヒドロキシフェニル)ジフェニルメタン、1,1−ビス(4−ヒドロキシフェニル)−2−エチルヘキサン、1,1−ビス(4−ヒドロキシフェニル)デカン、ビス(4−ヒドロキシ−3−ニトロフェニル)メタン、3,3−ビス(4−ヒドロキシフェニル)ペンタン、1,3−ビス(2−(4−ヒドロキシフェニル)−2−プロピル)ベンゼン、1,3−ビス(2−(4−ヒドロキシフェニル)−2−プロピル)ベンゼン、2,2−ビス(4−ヒドロキシフェニル)ヘキサフルオロプロパン、1,1−ビス(4−ヒドロキシフェニル)シクロヘキサン、ビス(4−ヒドロキシフェニル)スルホン、2,4’−ジヒドロキシジフェニルスルホン、ビス(4−ヒドロキシフェニル)スルフィド、ビス(4−ヒドロキシ−3−メチルフェニル)スルフィド、ビス(4−ヒドロキシフェニル)ジスルフィド、4,4’−ジヒドロキシジフェニルエーテル、4,4’−ジヒドロキシ−3,3’−ジクロロジフェニルエーテル等の芳香族ビスフェノール化合物;2,2−ビス(4−(2−ヒドロキシエトキシ)フェニル)プロパン、2,2−ビス(4−(2−ヒドロキシプロポキシ)フェニル)プロパン、1,3−ビス(2−ヒドロキシエトキシ)ベンゼン、4,4’−ビス(2−ヒドロキシエトキシ)ビフェニル、ビス(4−(2−ヒドロキシエトキシ)フェニル)スルホン等の芳香族基に結合したエーテル基を有するジヒドロキシ化合物。
As the dihydroxy compound containing an aromatic component, for example, the following dihydroxy compounds can be used.
2,2-bis (4-hydroxyphenyl) propane, 2,2-bis (3-methyl-4-hydroxyphenyl) propane, 2,2-bis (4-hydroxy-3,5-dimethylphenyl) propane, 2 , 2-bis (4-hydroxy-3,5-diethylphenyl) propane, 2,2-bis (4-hydroxy- (3-phenyl) phenyl) propane, 2,2-bis (4-hydroxy- (3,3) 5-diphenyl) phenyl) propane, 2,2-bis (4-hydroxy-3,5-dibromophenyl) propane, bis (4-hydroxyphenyl) methane, 1,1-bis (4-hydroxyphenyl) ethane, 2 , 2-bis (4-hydroxyphenyl) butane, 2,2-bis (4-hydroxyphenyl) pentane, 1,1-bis (4-hydroxyphenyl) -1-phenylethane, bis (4-hydroxyphenyl) diphenylmethane , 1,1-bis (4-hydroxyphenyl) -2-ethylhexane, 1,1-bis (4-hydroxyphenyl) decane, bis (4-hydroxy-3-nitrophenyl) methane, 3,3-bis ( 4-Hydroxyphenyl) pentane, 1,3-bis (2- (4-hydroxyphenyl) -2-propyl) benzene, 1,3-bis (2- (4-hydroxyphenyl) -2-propyl) benzene, 2 , 2-bis (4-hydroxyphenyl) hexafluoropropane, 1,1-bis (4-hydroxyphenyl) cyclohexane, bis (4-hydroxyphenyl) sulfone, 2,4'-dihydroxydiphenylsulfone, bis (4-hydroxy) Phenyl) sulfide, bis (4-hydroxy-3-methylphenyl) sulfide, bis (4-hydroxyphenyl) disulfide, 4,4'-dihydroxydiphenyl ether, 4,4'-dihydroxy-3,3'-dichlorodiphenyl ether, etc. Aromatic bisphenol compounds; 2,2-bis (4- (2-hydroxyethoxy) phenyl) propane, 2,2-bis (4- (2-hydroxypropoxy) phenyl) propane, 1,3-bis (2-hydroxy) A dihydroxy compound having an ether group bonded to an aromatic group such as ethoxy) benzene, 4,4'-bis (2-hydroxyethoxy) biphenyl, and bis (4- (2-hydroxyethoxy) phenyl) sulfone.
ジエステル化合物としては、例えば、以下に示すジカルボン酸等を用いることができる。
テレフタル酸、フタル酸、イソフタル酸、4,4’−ジフェニルジカルボン酸、4,4’−ジフェニルエーテルジカルボン酸、4,4’−ベンゾフェノンジカルボン酸、4,4’−ジフェノキシエタンジカルボン酸、4,4’−ジフェニルスルホンジカルボン酸、2,6−ナフタレンジカルボン酸等の芳香族ジカルボン酸;1,2−シクロヘキサンジカルボン酸、1,3−シクロヘキサンジカルボン酸、1,4−シクロヘキサンジカルボン酸、デカリン−2,6−ジカルボン酸等の脂環式ジカルボン酸;マロン酸、コハク酸、グルタル酸、アジピン酸、ピメリン酸、スベリン酸、アゼライン酸、セバシン酸等の脂肪族ジカルボン酸。尚、これらのジカルボン酸成分はジカルボン酸そのものとしてポリエステルカーボネートの原料とすることができるが、製造法に応じて、メチルエステル体、フェニルエステル体等のジカルボン酸エステルや、ジカルボン酸ハライド等のジカルボン酸誘導体を原料とすることもできる。
As the diester compound, for example, the following dicarboxylic acids and the like can be used.
Telephthalic acid, phthalic acid, isophthalic acid, 4,4'-diphenyldicarboxylic acid, 4,4'-diphenyletherdicarboxylic acid, 4,4'-benzophenonedicarboxylic acid, 4,4'-diphenoxyetanedicarboxylic acid, 4,4 Aromatic dicarboxylic acids such as'-diphenylsulfonedicarboxylic acid, 2,6-naphthalenedicarboxylic acid; 1,2-cyclohexanedicarboxylic acid, 1,3-cyclohexanedicarboxylic acid, 1,4-cyclohexanedicarboxylic acid, decalin-2,6 -Alicyclic dicarboxylic acid such as dicarboxylic acid; aliphatic dicarboxylic acid such as malonic acid, succinic acid, glutaric acid, adipic acid, pimelli acid, suberic acid, azelaic acid and sebacic acid. These dicarboxylic acid components can be used as a raw material for polyester carbonate as the dicarboxylic acid itself, but depending on the production method, a dicarboxylic acid ester such as a methyl ester or a phenyl ester or a dicarboxylic acid such as a dicarboxylic acid halide may be used. A derivative can also be used as a raw material.
光学特性の観点からは、前記に挙げたその他の構造単位として、芳香族成分を含有しないものを用いることが好ましいが、光学特性を確保しつつ、耐熱性や機械特性等とのバランスをとるために、ポリマーの主鎖や側鎖に芳香族成分を組み込むことが有効な場合もある。この場合には、例えば、芳香族構造を含有する前記その他の構造単位により、ポリマーに芳香族成分を導入することができるが、本発明のポリカーボネート樹脂中のこれらの構造単位、即ち、前記式(6)〜(8)で表される構造単位以外の芳香族構造単位の含有量は、ポリカーボネート樹脂を構成する全ての構造単位、及び連結基の重量の合計量を100重量%とした際に、5重量%以下が好ましい。芳香族構造を含有するその他の構造単位の量が多くなると光弾性係数が悪化する懸念がある。 From the viewpoint of optical characteristics, it is preferable to use a structural unit that does not contain an aromatic component as the other structural unit mentioned above, but in order to maintain the optical characteristics and balance the heat resistance and mechanical characteristics. In some cases, it may be effective to incorporate an aromatic component into the main chain or side chain of the polymer. In this case, for example, the other structural unit containing an aromatic structure can introduce an aromatic component into the polymer, but these structural units in the polycarbonate resin of the present invention, that is, the above formula ( The content of the aromatic structural unit other than the structural units represented by 6) to (8) is 100% by weight when the total weight of all the structural units constituting the polycarbonate resin and the linking group is 100% by weight. It is preferably 5% by weight or less. If the amount of other structural units containing an aromatic structure is large, there is a concern that the photoelastic coefficient may deteriorate.
前記に挙げたその他の構造単位を有するモノマーとしては、1,6−ヘキサンジオール、2,2,4,4−テトラメチル−1,3−シクロブタンジオール、1,4−シクロヘキサンジメタノール、トリシクロデカンジメタノール、スピログリコール、1,4−シクロヘキサンジカルボン酸、デカリン−2,6−ジカルボン酸(及びその誘導体)を用いることが特に好ましい。これらのモノマーに由来する構造単位を含む樹脂は、光学特性や耐熱性、機械特性等のバランスに優れている。 Examples of the monomers having the other structural units mentioned above include 1,6-hexanediol, 2,2,4,4-tetramethyl-1,3-cyclobutanediol, 1,4-cyclohexanedimethanol, and tricyclode. It is particularly preferable to use candimethanol, spiroglycol, 1,4-cyclohexanedicarboxylic acid, decalin-2,6-dicarboxylic acid (and derivatives thereof). Resins containing structural units derived from these monomers have an excellent balance of optical properties, heat resistance, mechanical properties, and the like.
ジエステル化合物の重合反応性は比較的低いため、反応効率を高める観点からは、オリゴフルオレン構造単位を有するジエステル化合物以外のジエステル化合物は用いないことがより好ましい。 Since the polymerization reactivity of the diester compound is relatively low, it is more preferable not to use a diester compound other than the diester compound having an oligofluorene structural unit from the viewpoint of increasing the reaction efficiency.
その他の構造単位を導入するためのジヒドロキシ化合物やジエステル化合物は、得られる樹脂の要求性能に応じて、単独又は2種以上を組み合わせて用いてもよい。樹脂中のその他の構造単位の含有量は、ポリカーボネート樹脂を構成する全ての構造単位、及び連結基の重量の合計量を100重量%とした際に、0.1重量%以上、50重量%以下が好ましく、1重量%以上、45重量%以下がさらに好ましく、3重量%以上、40重量%以下が特に好ましい。その他の構造単位は主に樹脂の耐熱性の調整や、柔軟性や靱性の付与の役割を担うため、含有量が少なすぎると、樹脂の機械特性や溶融加工性が悪くなり、含有量が多すぎると、耐熱性や光学特性が悪化するおそれがある。 The dihydroxy compound or diester compound for introducing other structural units may be used alone or in combination of two or more, depending on the required performance of the obtained resin. The content of other structural units in the resin is 0.1% by weight or more and 50% by weight or less when the total weight of all the structural units constituting the polycarbonate resin and the linking group is 100% by weight. Is preferable, 1% by weight or more and 45% by weight or less are more preferable, and 3% by weight or more and 40% by weight or less are particularly preferable. Other structural units mainly play a role in adjusting the heat resistance of the resin and imparting flexibility and toughness. Therefore, if the content is too small, the mechanical properties and melt processability of the resin deteriorate, and the content is high. If it is too much, the heat resistance and optical characteristics may deteriorate.
(炭酸ジエステル)
本発明のポリカーボネート樹脂に含有される上記の構造単位の連結基は、下記式(11)で表される炭酸ジエステルを重合することで導入される。
(Carbonate diester)
The linking group of the above structural unit contained in the polycarbonate resin of the present invention is introduced by polymerizing a carbonic acid diester represented by the following formula (11).
(式(11)中、A3およびA4は、それぞれ置換基を有していてもよい炭素数1〜18の脂肪族炭化水素基、又は置換基を有していてもよい芳香族炭化水素基であり、A3とA4とは同一であっても異なっていてもよい。) (In the formula (11), A 3 and A 4 are each aliphatic hydrocarbon group having 1 to 18 carbon atoms which may have a substituent, or an aromatic optionally substituted hydrocarbon a group, may be the same or different and a 3 and a 4.)
A3およびA4は、置換又は無置換の芳香族炭化水素基であることが好ましく、無置換の芳香族炭化水素基がより好ましい。尚、脂肪族炭化水素基の置換基としては、エステル基、エーテル基、アミド基、ハロゲン原子が挙げられ、芳香族炭化水素基の置換基としては、メチル基、エチル基等のアルキル基が挙げられる。 A 3 and A 4 are preferably substituted or unsubstituted aromatic hydrocarbon groups, and more preferably unsubstituted aromatic hydrocarbon groups. Examples of the substituent of the aliphatic hydrocarbon group include an ester group, an ether group, an amide group and a halogen atom, and examples of the substituent of the aromatic hydrocarbon group include an alkyl group such as a methyl group and an ethyl group. Be done.
前記式(11)で表される炭酸ジエステルとしては、例えば、ジフェニルカーボネート(以下、DPCと略記することがある。)、ジトリルカーボネート等の置換ジフェニルカーボネート、ジメチルカーボネート、ジエチルカーボネート及びジ−tert−ブチルカーボネート等のジアルキルカーボネートが例示されるが、好ましくはジフェニルカーボネート、置換ジフェニルカーボネートであり、特に好ましくはジフェニルカーボネートである。 Examples of the carbonic acid diester represented by the formula (11) include diphenyl carbonate (hereinafter, may be abbreviated as DPC), substituted diphenyl carbonate such as ditril carbonate, dimethyl carbonate, diethyl carbonate and di-tert-. Examples thereof include dialkyl carbonates such as butyl carbonate, but preferred are diphenyl carbonates and substituted diphenyl carbonates, and particularly preferably diphenyl carbonates.
炭酸ジエステルは、塩化物イオン等の不純物を含む場合があり、これらの不純物が重合反応を阻害したり、得られる樹脂の色相を悪化させたりする場合があるため、必要に応じて、蒸留等により精製したものを使用することが好ましい。 The carbonic acid diester may contain impurities such as chloride ions, and these impurities may inhibit the polymerization reaction or worsen the hue of the obtained resin. Therefore, if necessary, by distillation or the like. It is preferable to use a purified product.
また、前記式(8A)で表されるジエステルモノマーと前記式(11)で表される炭酸ジエステルを両方用いて重合反応を行う場合には、前記式(8A)のA1、A2及び前記式(11)のA3、A4がすべて同じ構造であると、重合反応中に脱離する成分が同じであり、その成分を回収して再利用しやすい。また、重合反応性と再利用での有用性の観点から、A1〜A4はフェニル基であることが特に好ましい。尚、A1〜A4がフェニル基である場合、重合反応中に脱離する成分はフェノールである。 When the polymerization reaction is carried out using both the diester monomer represented by the formula (8A) and the carbonic acid diester represented by the formula (11), A 1 , A 2 of the formula (8A) and the above. When A 3 and A 4 of the formula (11) all have the same structure, the components desorbed during the polymerization reaction are the same, and the components can be easily recovered and reused. Further, from the viewpoint of polymerization reactivity and usefulness in reuse, it is particularly preferable that A 1 to A 4 are phenyl groups. When A 1 to A 4 are phenyl groups, the component eliminated during the polymerization reaction is phenol.
[本発明のポリカーボネート樹脂の製造条件]
本発明のポリカーボネート樹脂は、一般に用いられる重合方法で製造することができる。例えば、ホスゲンやカルボン酸ハロゲン化物を用いた溶液重合法又は界面重合法や、溶媒を用いずに反応を行う溶融重合法を用いて製造することができる。これらの製造方法のうち、溶媒や毒性の高い化合物を使用しないことから環境負荷を低減することができ、また、生産性にも優れる溶融重合法によって製造することが好ましい。
[Production conditions for the polycarbonate resin of the present invention]
The polycarbonate resin of the present invention can be produced by a commonly used polymerization method. For example, it can be produced by a solution polymerization method or an interfacial polymerization method using a phosgene or a carboxylic acid halide, or a melt polymerization method in which a reaction is carried out without using a solvent. Among these production methods, it is preferable to produce by a melt polymerization method which can reduce the environmental load and is excellent in productivity because no solvent or highly toxic compound is used.
また、重合に溶媒を使用すると樹脂中に溶媒が残存する場合があり、その可塑化効果によって樹脂のガラス転移温度が低下することにより、後述する成形や延伸などの加工工程での品質変動要因となり得る。また、溶媒としては塩化メチレン等のハロゲン系の有機溶媒が用いられることが多いが、ハロゲン系溶媒が樹脂中に残存する場合、この樹脂を用いた成形体が電子機器等に組み込まれると金属部の腐食の原因ともなり得る。溶融重合法によって得られる樹脂は溶媒を含有しないため、加工工程や製品品質の安定化にとっても有利である。 In addition, when a solvent is used for polymerization, the solvent may remain in the resin, and the plasticizing effect lowers the glass transition temperature of the resin, which causes quality fluctuations in processing processes such as molding and stretching described later. obtain. In addition, a halogen-based organic solvent such as methylene chloride is often used as the solvent, but when the halogen-based solvent remains in the resin, when a molded product using this resin is incorporated into an electronic device or the like, the metal part It can also cause corrosion. Since the resin obtained by the melt polymerization method does not contain a solvent, it is also advantageous for stabilizing the processing process and product quality.
溶融重合法によりポリカーボネート樹脂を製造する際は、前述した構造単位を有するモノマーと、炭酸ジエステルと、重合触媒とを混合し、溶融下でエステル交換反応(又は重縮合反応とも称する。)を行い、脱離成分を系外に除去しながら反応率を上げていく。重合の終盤では高温、高真空の条件で目的の分子量まで反応を進める。反応が完了したら、反応器から溶融状態の樹脂を抜き出し、本発明のポリカーボネート樹脂が得られる。 When a polycarbonate resin is produced by a melt polymerization method, a monomer having the above-mentioned structural unit, a carbonic acid diester, and a polymerization catalyst are mixed, and a transesterification reaction (also referred to as a polycondensation reaction) is carried out under melting. The reaction rate is increased while removing the desorbed components from the system. At the end of the polymerization, the reaction proceeds to the desired molecular weight under high temperature and high vacuum conditions. When the reaction is completed, the molten resin is extracted from the reactor to obtain the polycarbonate resin of the present invention.
重縮合反応は、反応に用いる全ジヒドロキシ化合物と全ジエステル化合物のモル比率を厳密に調整することで、反応速度や得られる樹脂の分子量を制御できる。ポリカーボネート樹脂の場合、全ジヒドロキシ化合物に対する炭酸ジエステルのモル比率を、0.90〜1.10に調整することが好ましく、0.96〜1.05に調整することがより好ましく、0.98〜1.03に調整することが特に好ましい。ポリエステルカーボネート樹脂の場合は、全ジヒドロキシ化合物に対する炭酸ジエステルと全ジエステル化合物との合計量のモル比率を、0.90〜1.10に調整することが好ましく、0.96〜1.05に調整することがより好ましく、0.98〜1.03に調整することが特に好ましい。 In the polycondensation reaction, the reaction rate and the molecular weight of the obtained resin can be controlled by strictly adjusting the molar ratio of the total dihydroxy compound and the total diester compound used in the reaction. In the case of the polycarbonate resin, the molar ratio of the carbonic acid diester to the total dihydroxy compound is preferably adjusted to 0.90 to 1.10, more preferably 0.96 to 1.05, and 0.98 to 1 It is particularly preferable to adjust to .03. In the case of the polyester carbonate resin, the molar ratio of the total amount of the carbonic acid diester and the total diester compound to the total dihydroxy compound is preferably adjusted to 0.99 to 1.10, and is adjusted to 0.96 to 1.05. It is more preferable, and it is particularly preferable to adjust it to 0.98 to 1.03.
前記のモル比率が上下に大きく外れると、所望とする分子量の樹脂が製造できなくなる。また、前記のモル比率が小さくなりすぎると、製造された樹脂のヒドロキシ基末端が増加して、樹脂の熱安定性が悪化する場合がある。また、未反応のジヒドロキシ化合物が樹脂中に多く残存し、その後の成形加工工程で成形機の汚れや成形品の外観不良の原因となり得る。一方、前記のモル比率が大きくなりすぎると、同一条件下ではエステル交換反応の速度が低下したり、製造された樹脂中の炭酸ジエステルやジエステル化合物の残存量が増加し、この残存低分子成分が同様に成形加工工程での問題を招く可能性がある。 If the molar ratio deviates significantly from the top and bottom, a resin having a desired molecular weight cannot be produced. Further, if the molar ratio becomes too small, the hydroxy group terminals of the produced resin may increase, and the thermal stability of the resin may deteriorate. In addition, a large amount of unreacted dihydroxy compound remains in the resin, which may cause stains on the molding machine or poor appearance of the molded product in the subsequent molding process. On the other hand, if the molar ratio becomes too large, the rate of transesterification reaction decreases under the same conditions, and the residual amount of carbonic acid diester or diester compound in the produced resin increases, and this residual low molecular weight component becomes Similarly, it may cause problems in the molding process.
溶融重合法は、通常、2段階以上の多段工程で実施される。重縮合反応は、1つの重合反応器を用い、順次条件を変えて2段階以上の工程で実施してもよいし、2つ以上の反応器を用いて、それぞれの条件を変えて2段階以上の工程で実施してもよいが、生産効率の観点からは、2つ以上、好ましくは3つ以上の反応器を用いて実施する。重縮合反応はバッチ式、連続式、或いはバッチ式と連続式の組み合わせのいずれでも構わないが、生産効率と品質の安定性の観点から、連続式が好ましい。 The melt polymerization method is usually carried out in a multi-step process of two or more steps. The polycondensation reaction may be carried out in two or more steps by sequentially changing the conditions using one polymerization reactor, or by using two or more reactors and changing each condition in two or more steps. However, from the viewpoint of production efficiency, it is carried out using two or more, preferably three or more reactors. The polycondensation reaction may be a batch type, a continuous type, or a combination of a batch type and a continuous type, but a continuous type is preferable from the viewpoint of production efficiency and quality stability.
重縮合反応においては、反応系内の温度と圧力のバランスを適切に制御することが重要である。温度、圧力のどちらか一方でも早く変化させすぎると、未反応のモノマーが反応系外に留出してしまうおそれがある。その結果、ジヒドロキシ化合物とジエステル化合物のモル比率が変化し、所望の分子量の樹脂が得られない場合がある。 In the polycondensation reaction, it is important to appropriately control the balance between temperature and pressure in the reaction system. If either the temperature or the pressure is changed too quickly, unreacted monomers may be distilled out of the reaction system. As a result, the molar ratio of the dihydroxy compound and the diester compound changes, and a resin having a desired molecular weight may not be obtained.
また、重縮合反応の重合速度は、ヒドロキシ基末端と、エステル基末端或いはカーボネート基末端とのバランスによって制御される。そのため、特に連続式で重合を行う場合は、未反応モノマーの留出によって末端基のバランスが変動すると、重合速度を一定に制御することが難しくなり、得られる樹脂の分子量の変動が大きくなるおそれがある。樹脂の分子量は溶融粘度と相関するため、得られた樹脂を成形加工する際に、溶融粘度が変動し、均一な寸法の成形品が得られない等の問題を招くおそれがある。 Further, the polymerization rate of the polycondensation reaction is controlled by the balance between the hydroxy group terminal and the ester group terminal or the carbonate group terminal. Therefore, especially in the case of continuous polymerization, if the balance of the terminal groups fluctuates due to the distillation of the unreacted monomer, it becomes difficult to control the polymerization rate to be constant, and the molecular weight of the obtained resin may fluctuate greatly. There is. Since the molecular weight of the resin correlates with the melt viscosity, the melt viscosity fluctuates when the obtained resin is molded, which may cause problems such as the inability to obtain a molded product having uniform dimensions.
さらに、未反応モノマーが留出すると、末端基のバランスだけでなく、樹脂の共重合組成が所望の組成から外れ、機械物性や光学特性にも影響するおそれがある。本発明のポリカーボネート樹脂から得られる位相差フィルムでは、位相差の波長分散性は樹脂中のフルオレン系モノマーとその他の共重合成分との比率によって制御されるため、重合中に比率が崩れると、設計どおりの光学特性が得られなくなるおそれがある。 Further, when the unreacted monomer is distilled off, not only the balance of the terminal groups but also the copolymerization composition of the resin deviates from the desired composition, which may affect the mechanical properties and optical properties. In the retardation film obtained from the polycarbonate resin of the present invention, the wavelength dispersibility of the retardation is controlled by the ratio of the fluorene-based monomer in the resin and other copolymerization components. Therefore, if the ratio collapses during polymerization, the design is made. There is a risk that the desired optical characteristics will not be obtained.
以下、溶融重縮合反応の工程を、モノマーを消費させてオリゴマーを生成させる段階(第1段目の反応)と、所望の分子量まで重合を進行させてポリマーを生成させる段階(第2段目の反応)に分けて述べる。 Hereinafter, the steps of the melt polycondensation reaction include a step of consuming a monomer to produce an oligomer (first stage reaction) and a step of advancing the polymerization to a desired molecular weight to produce a polymer (second stage reaction). Reaction) will be described separately.
具体的に、第1段目の反応における反応条件としては、以下の条件を採用することができる。即ち、重合反応器の内温は、通常130℃以上、好ましくは150℃以上、より好ましくは170℃以上、かつ、通常250℃以下、好ましくは240℃以下、より好ましくは230℃以下の範囲で設定する。また、重合反応器の圧力(以下、圧力とは絶対圧力を表す。)は、通常70kPa以下、好ましくは50kPa以下、より好ましくは30kPa以下、かつ、通常1kPa以上、好ましくは3kPa以上、より好ましくは5kPa以上の範囲で設定する。また、反応時間は、通常0.1時間以上、好ましくは0.5時間以上、かつ、通常10時間以下、好ましくは5時間以下、より好ましくは3時間以下の範囲で設定する。 Specifically, the following conditions can be adopted as the reaction conditions in the first stage reaction. That is, the internal temperature of the polymerization reactor is usually in the range of 130 ° C. or higher, preferably 150 ° C. or higher, more preferably 170 ° C. or higher, and usually 250 ° C. or lower, preferably 240 ° C. or lower, more preferably 230 ° C. or lower. Set. The pressure of the polymerization reactor (hereinafter, the pressure represents an absolute pressure) is usually 70 kPa or less, preferably 50 kPa or less, more preferably 30 kPa or less, and usually 1 kPa or more, preferably 3 kPa or more, more preferably. Set in the range of 5 kPa or more. The reaction time is usually set in the range of 0.1 hours or more, preferably 0.5 hours or more, and usually 10 hours or less, preferably 5 hours or less, more preferably 3 hours or less.
第1段目の反応は、発生するジエステル化合物由来のモノヒドロキシ化合物を反応系外へ留去しながら実施される。例えば、炭酸ジエステルとしてジフェニルカーボネートを用いる場合には、第1段目の反応において反応系外へ留去されるモノヒドロキシ化合物はフェノールである。 The first-stage reaction is carried out while distilling the generated monohydroxy compound derived from the diester compound out of the reaction system. For example, when diphenyl carbonate is used as the carbonic acid diester, the monohydroxy compound distilled out of the reaction system in the first stage reaction is phenol.
第1段目の反応においては、反応圧力を低くするほど重合反応を促進することができるが、一方で未反応モノマーの留出が多くなってしまう。未反応モノマーの留出の抑制と、減圧による反応の促進を両立させるためには、還流冷却器を具備した反応器を用いることが有効である。特に未反応モノマーの多い反応初期に還流冷却器を用いるのがよい。 In the first-stage reaction, the lower the reaction pressure, the more the polymerization reaction can be promoted, but on the other hand, the amount of unreacted monomer distilled out increases. It is effective to use a reactor equipped with a reflux condenser in order to suppress the distillation of unreacted monomers and promote the reaction by reducing the pressure. In particular, it is preferable to use a reflux condenser at the beginning of the reaction when there are many unreacted monomers.
第2段目の反応は、反応系の圧力を第1段目の圧力から徐々に下げ、引き続き発生するモノヒドロキシ化合物を反応系外へ除きながら、最終的には反応系の圧力を5kPa以下、好ましくは3kPa以下、より好ましくは1kPa以下にする。また、内温は、通常210℃以上、好ましくは220℃以上、かつ、通常260℃以下、好ましくは255℃以下の範囲で設定する。また、反応時間は、通常0.1時間以上、好ましくは0.5時間以上、より好ましくは1時間以上、かつ、通常10時間以下、好ましくは5時間以下、より好ましくは3時間以下の範囲で設定する。着色や熱劣化、架橋などの副反応を抑制し、色相や熱安定性の良好な樹脂を得るには、全反応段階における内温の最高温度を260℃以下、好ましくは255℃以下、さらに好ましくは250℃以下にするとよい。特に本発明で用いるジヒドロキシ化合物Aは、過度に高温で重合反応を行うと、分解して分岐成分を発生させ、生成するポリマーが架橋、ゲル化する懸念がある。ゲルが発生すると、得られる樹脂の機械物性が低下するおそれがあり、また、光学用途で用いる場合は、異物となって製品の外観品質を低下させることになる。 In the second-stage reaction, the pressure of the reaction system is gradually lowered from the pressure of the first stage, and the continuously generated monohydroxy compound is removed from the reaction system, and finally the pressure of the reaction system is reduced to 5 kPa or less. It is preferably 3 kPa or less, more preferably 1 kPa or less. The internal temperature is usually set in the range of 210 ° C. or higher, preferably 220 ° C. or higher, and usually 260 ° C. or lower, preferably 255 ° C. or lower. The reaction time is usually 0.1 hours or more, preferably 0.5 hours or more, more preferably 1 hour or more, and usually 10 hours or less, preferably 5 hours or less, more preferably 3 hours or less. Set. In order to suppress side reactions such as coloring, thermal deterioration and cross-linking and obtain a resin having good hue and thermal stability, the maximum internal temperature in all reaction stages is set to 260 ° C. or lower, preferably 255 ° C. or lower, more preferably. Should be 250 ° C or lower. In particular, the dihydroxy compound A used in the present invention may be decomposed to generate a branched component when the polymerization reaction is carried out at an excessively high temperature, and the produced polymer may be crosslinked or gelled. When gel is generated, the mechanical properties of the obtained resin may be deteriorated, and when used in optical applications, it becomes a foreign substance and deteriorates the appearance quality of the product.
重合時に使用し得るエステル交換反応触媒(以下、単に「触媒」、又は「重合触媒」と言うことがある。)は、反応速度や重縮合して得られる樹脂の色調や熱安定性に非常に大きな影響を与え得る。触媒としては、製造された樹脂の透明性、色相、耐熱性、熱安定性、及び機械的強度を満足させ得るものであれば限定されないが、長周期型周期表における1族又は2族(以下、単に「1族」、「2族」と表記する。)の金属化合物、塩基性ホウ素化合物、塩基性リン化合物、塩基性アンモニウム化合物、アミン系化合物等の塩基性化合物が挙げられる。好ましくは長周期型周期表第2族の金属およびリチウムからなる群より選ばれる少なくとも1種の金属化合物が使用される。 Transesterification reaction catalysts that can be used during polymerization (hereinafter, may be simply referred to as "catalysts" or "polymerization catalysts") are extremely dependent on the reaction rate, the color tone and thermal stability of the resin obtained by polycondensation. It can have a big impact. The catalyst is not limited as long as it can satisfy the transparency, hue, heat resistance, thermal stability, and mechanical strength of the produced resin, but is limited to Group 1 or Group 2 (hereinafter referred to as Group 1) in the long periodic table. , Simply referred to as "Group 1" and "Group 2"), and examples thereof include basic compounds such as metal compounds, basic boron compounds, basic phosphorus compounds, basic ammonium compounds, and amine compounds. Preferably, at least one metal compound selected from the group consisting of metals of Group 2 of the Long Periodic Table and lithium is used.
前記の1族金属化合物としては、例えば以下の化合物を採用することができるが、これら以外の1族金属化合物を採用することも可能である。
水酸化ナトリウム、水酸化カリウム、水酸化リチウム、水酸化セシウム、炭酸水素ナトリウム、炭酸水素カリウム、炭酸水素リチウム、炭酸水素セシウム、炭酸ナトリウム、炭酸カリウム、炭酸リチウム、炭酸セシウム、酢酸ナトリウム、酢酸カリウム、酢酸リチウム、酢酸セシウム、ステアリン酸ナトリウム、ステアリン酸カリウム、ステアリン酸リチウム、ステアリン酸セシウム、水素化ホウ素ナトリウム、水素化ホウ素カリウム、水素化ホウ素リチウム、水素化ホウ素セシウム、テトラフェニルホウ酸ナトリウム、テトラフェニルホウ酸カリウム、テトラフェニルホウ酸リチウム、テトラフェニルホウ酸セシウム、安息香酸ナトリウム、安息香酸カリウム、安息香酸リチウム、安息香酸セシウム、リン酸水素2ナトリウム、リン酸水素2カリウム、リン酸水素2リチウム、リン酸水素2セシウム、フェニルリン酸2ナトリウム、フェニルリン酸2カリウム、フェニルリン酸2リチウム、フェニルリン酸2セシウム、ナトリウム、カリウム、リチウム、セシウムのアルコレート、フェノレート、ビスフェノールAの2ナトリウム塩、2カリウム塩、2リチウム塩、2セシウム塩。
これらのうち、重合活性と得られる樹脂の色相の観点から、リチウム化合物を用いることが好ましい。
As the Group 1 metal compound, for example, the following compounds can be adopted, but other Group 1 metal compounds can also be adopted.
Sodium hydroxide, potassium hydroxide, lithium hydroxide, cesium hydroxide, sodium hydrogen carbonate, potassium hydrogen carbonate, lithium hydrogen carbonate, cesium hydrogen carbonate, sodium carbonate, potassium carbonate, lithium carbonate, cesium carbonate, sodium acetate, potassium acetate, Lithium acetate, cesium acetate, sodium stearate, potassium stearate, lithium stearate, cesium stearate, sodium boron hydride, potassium borohydride, lithium borohydride, cesium hydride, sodium tetraphenylborate, tetraphenyl Potassium borate, lithium tetraphenylborate, cesium tetraphenylborate, sodium benzoate, potassium benzoate, lithium benzoate, cesium benzoate, disodium hydrogen phosphate, disodium hydrogen phosphate, dilithium hydrogen phosphate, Disodium hydrogen phosphate, disodium phenylphosphate, dipotassium phenylphosphate, dilithium phenylphosphate, dicesium phenylphosphate, sodium, potassium, lithium, alcolate of cesium, phenolate, disodium salt of bisphenol A , 2 potassium salt, 2 lithium salt, 2 cesium salt.
Of these, it is preferable to use a lithium compound from the viewpoint of polymerization activity and the hue of the obtained resin.
前記の2族金属化合物としては、例えば以下の化合物を採用することができるが、これら以外の2族金属化合物を採用することも可能である。
水酸化カルシウム、水酸化バリウム、水酸化マグネシウム、水酸化ストロンチウム、炭酸水素カルシウム、炭酸水素バリウム、炭酸水素マグネシウム、炭酸水素ストロンチウム、炭酸カルシウム、炭酸バリウム、炭酸マグネシウム、炭酸ストロンチウム、酢酸カルシウム、酢酸バリウム、酢酸マグネシウム、酢酸ストロンチウム、ステアリン酸カルシウム、ステアリン酸バリウム、ステアリン酸マグネシウム、ステアリン酸ストロンチウム。
これらのうち、マグネシウム化合物、カルシウム化合物、バリウム化合物を用いることが好ましく、重合活性と得られる樹脂の色相の観点から、マグネシウム化合物及び/又はカルシウム化合物を用いることが更に好ましく、カルシウム化合物を用いることが最も好ましい。
As the Group 2 metal compound, for example, the following compounds can be adopted, but other Group 2 metal compounds can also be adopted.
Calcium hydroxide, barium hydroxide, magnesium hydroxide, strontium hydroxide, calcium hydrogen carbonate, strontium hydrogen carbonate, magnesium hydrogen carbonate, strontium hydrogen carbonate, calcium carbonate, barium carbonate, magnesium carbonate, strontium carbonate, calcium acetate, barium acetate, Magnesium acetate, strontium acetate, calcium stearate, barium stearate, magnesium stearate, strontium stearate.
Of these, it is preferable to use a magnesium compound, a calcium compound, and a barium compound, and from the viewpoint of polymerization activity and the hue of the obtained resin, it is more preferable to use a magnesium compound and / or a calcium compound, and it is more preferable to use a calcium compound. Most preferred.
尚、前記の1族金属化合物及び/又は2族金属化合物と共に、補助的に、塩基性ホウ素化合物、塩基性リン化合物、塩基性アンモニウム化合物、アミン系化合物等の塩基性化合物を併用することも可能であるが、長周期型周期表第2族の金属およびリチウムからなる群より選ばれる少なくとも1種の金属化合物を使用することが特に好ましい。 It is also possible to use a basic compound such as a basic boron compound, a basic phosphorus compound, a basic ammonium compound, and an amine compound in combination with the above-mentioned Group 1 metal compound and / or Group 2 metal compound. However, it is particularly preferable to use at least one metal compound selected from the group consisting of metals and lithium of Group 2 of the Long Periodic Table.
前記重合触媒の使用量は、金属量として、通常、重合に使用した全ジヒドロキシ化合物1mol当たり0.1μmol〜300μmol、好ましくは0.5μmol〜100μmolである。前記重合触媒として、長周期型周期表第2族の金属およびリチウムからなる群より選ばれる少なくとも1種の金属化合物を用いる場合、特にマグネシウム化合物及び/又はカルシウム化合物を用いる場合には、金属量として、前記全ジヒドロキシ化合物1mol当たり、通常、0.1μmol以上、好ましくは0.3μmol以上、特に好ましくは0.5μmol以上の前記重合触媒を使用する。また、前記重合触媒の使用量は、金属量として、30μmol以下がよく、好ましくは20μmol以下であり、特に好ましくは10μmol以下である。 The amount of the polymerization catalyst used is usually 0.1 μmol to 300 μmol, preferably 0.5 μmol to 100 μmol, per 1 mol of the total dihydroxy compound used for the polymerization. When at least one metal compound selected from the group consisting of metals of Group 2 of the Long Periodic Table and lithium is used as the polymerization catalyst, particularly when a magnesium compound and / or a calcium compound is used, the amount of metal is used. The polymerization catalyst is usually 0.1 μmol or more, preferably 0.3 μmol or more, particularly preferably 0.5 μmol or more, per 1 mol of the total dihydroxy compound. The amount of the polymerization catalyst used is preferably 30 μmol or less, preferably 20 μmol or less, and particularly preferably 10 μmol or less as the amount of metal.
また、モノマーにジエステル化合物を用いて、ポリエステルカーボネート樹脂を製造する場合は、前記塩基性化合物と併用して、又は併用せずに、チタン化合物、スズ化合物、ゲルマニウム化合物、アンチモン化合物、ジルコニウム化合物、鉛化合物、オスミウム化合物、亜鉛化合物、マンガン化合物等のエステル交換触媒を用いることもできる。これらのエステル交換触媒の使用量は、反応に用いる全ジヒドロキシ化合物1molに対して、金属量として、通常、1μmol〜1mmolの範囲内であり、好ましくは5μmol〜800μmolの範囲内であり、特に好ましくは10μmol〜500μmolの範囲内である。 When a polyester carbonate resin is produced by using a diester compound as a monomer, a titanium compound, a tin compound, a germanium compound, an antimony compound, a zirconium compound, and a lead are used in combination with or without the basic compound. Esther exchange catalysts such as compounds, osmium compounds, zinc compounds and manganese compounds can also be used. The amount of these transesterification catalysts used is usually in the range of 1 μmol to 1 mmol, preferably in the range of 5 μmol to 800 μmol, and particularly preferably in the range of 1 μmol to 1 mmol as the metal amount with respect to 1 mol of the total dihydroxy compound used in the reaction. It is in the range of 10 μmol to 500 μmol.
触媒量が少なすぎると、重合速度が遅くなるため、所望の分子量の樹脂を得ようとするにはその分だけ重合温度を高くせざるを得なくなる。そのために、得られる樹脂の色相が悪化する可能性が高くなり、また、未反応の原料が重合途中で揮発して、ジヒドロキシ化合物とジエステル化合物のモル比率が崩れ、所望の分子量に到達しない可能性がある。一方、重合触媒の使用量が多すぎると、好ましくない副反応を併発し、得られる樹脂の色相の悪化や成形加工時の樹脂の着色や分解を招く可能性がある。 If the amount of catalyst is too small, the polymerization rate becomes slow, so that the polymerization temperature must be raised by that amount in order to obtain a resin having a desired molecular weight. Therefore, there is a high possibility that the hue of the obtained resin will deteriorate, and the unreacted raw material may volatilize during the polymerization, the molar ratio of the dihydroxy compound and the diester compound may collapse, and the desired molecular weight may not be reached. There is. On the other hand, if the amount of the polymerization catalyst used is too large, unfavorable side reactions may occur, resulting in deterioration of the hue of the obtained resin and coloring or decomposition of the resin during molding.
前記1族金属の中でもナトリウム、カリウム、セシウムは、樹脂中に多く含まれると色相に悪影響を及ぼす可能性がある。そして、これらの金属は使用する触媒からのみではなく、原料や反応装置から混入する場合がある。出所にかかわらず、樹脂中のこれらの金属の化合物の合計量は、金属量として、前記全ジヒドロキシ化合物1mol当たり、2μmol以下がよく、好ましくは1μmol以下、より好ましくは0.5μmol以下である。 Among the Group 1 metals, sodium, potassium, and cesium may adversely affect the hue if they are contained in a large amount in the resin. Then, these metals may be mixed not only from the catalyst used but also from the raw material or the reactor. Regardless of the source, the total amount of these metal compounds in the resin is preferably 2 μmol or less, preferably 1 μmol or less, and more preferably 0.5 μmol or less per 1 mol of the total dihydroxy compound.
本発明のポリカーボネート樹脂は、前述のとおり重合させた後、通常、冷却固化させ、回転式カッター等でペレット化することができる。ペレット化の方法は限定されるものではないが、最終段の重合反応器からポリカーボネート樹脂を溶融状態で抜き出し、ストランドの形態で冷却固化させてペレット化させる方法、最終段の重合反応器から溶融状態で一軸又は二軸の押出機にポリカーボネート樹脂を供給し、溶融押出しした後、冷却固化させてペレット化させる方法、又は、最終段の重合反応器から溶融状態でポリカーボネート樹脂を抜き出し、ストランドの形態で冷却固化させて一旦ペレット化させた後に、再度一軸又は二軸の押出機にポリカーボネート樹脂を供給し、溶融押出しした後、冷却固化させてペレット化させる方法等が挙げられる。 The polycarbonate resin of the present invention can be polymerized as described above, then usually cooled and solidified, and pelletized with a rotary cutter or the like. The method of pelletization is not limited, but a method of extracting the polycarbonate resin from the final stage polymerization reactor in a molten state and cooling and solidifying it in the form of strands to pelletize it, or a method of pelletizing from the final stage polymerization reactor in a molten state. Polycarbonate resin is supplied to a uniaxial or biaxial extruder and melt-extruded, then cooled and solidified to be pelletized, or the polycarbonate resin is extracted from the final stage polymerization reactor in a molten state and in the form of strands. Examples thereof include a method in which the polycarbonate resin is supplied to a uniaxial or biaxial reactor again after being cooled and solidified to be pelletized, melt-extruded, and then cooled and solidified to be pelletized.
[本発明のポリカーボネート樹脂の好ましい物性]
このようにして得られた本発明のポリカーボネート樹脂の分子量は還元粘度で表すことができる。樹脂の還元粘度が低すぎると得られる成形品の機械強度が小さくなる可能性がある。そのため、還元粘度は通常0.20dL/g以上であり、0.25dL/g以上であることが好ましい。一方、樹脂の還元粘度が大きすぎると、成形する際の流動性が低下し、生産性や成形性が低下する傾向がある。そのため、還元粘度は、通常0.80dL/g以下であり、0.70dL/g以下であることが好ましく、0.60dL/g以下であることがより好ましい。尚、還元粘度は、溶媒として塩化メチレンを用い、試料濃度を0.6g/dLに精密に調製し、温度20.0℃±0.1℃でウベローデ粘度計を用いて測定する。
[Preferable physical properties of the polycarbonate resin of the present invention]
The molecular weight of the polycarbonate resin of the present invention thus obtained can be expressed by the reduced viscosity. If the reducing viscosity of the resin is too low, the mechanical strength of the obtained molded product may be reduced. Therefore, the reduced viscosity is usually 0.20 dL / g or more, and preferably 0.25 dL / g or more. On the other hand, if the reducing viscosity of the resin is too large, the fluidity during molding tends to decrease, and the productivity and moldability tend to decrease. Therefore, the reduced viscosity is usually 0.80 dL / g or less, preferably 0.70 dL / g or less, and more preferably 0.60 dL / g or less. The reduced viscosity is measured by using methylene chloride as a solvent, precisely adjusting the sample concentration to 0.6 g / dL, and using an Ubbelohde viscous meter at a temperature of 20.0 ° C. ± 0.1 ° C.
前記の還元粘度は樹脂の溶融粘度と相関があるため、通常は重合反応器の撹拌動力や、溶融樹脂を移送するギアポンプの吐出圧等を運転管理の指標に用いることができる。即ち、上記の運転機器の指示値が目標値に到達した段階で、反応器の圧力を常圧に戻したり、反応器から樹脂を抜き出すことで重合反応を停止させる。 Since the reduced viscosity correlates with the melt viscosity of the resin, usually, the stirring power of the polymerization reactor, the discharge pressure of the gear pump that transfers the molten resin, and the like can be used as an index of operation management. That is, when the indicated value of the above-mentioned operating equipment reaches the target value, the polymerization reaction is stopped by returning the pressure of the reactor to normal pressure or extracting the resin from the reactor.
本発明のポリカーボネート樹脂の溶融粘度は、温度240℃、剪断速度91.2sec−1の測定条件において1000Pa・s以上、7000Pa・s以下であることが好ましい。溶融粘度は、さらには1500Pa・s以上、6500Pa・s以下が好ましく、特には2000Pa・s以上、6000Pa・s以下が好ましい。尚、溶融粘度はキャピラリーレオメーター((株)東洋精機製作所製)を用いて測定する。溶融粘度が上記範囲内であると十分な機械物性を持ち、樹脂の熱劣化を抑制できる温度範囲で溶融加工が可能になる。 The melt viscosity of the polycarbonate resin of the present invention is preferably 1000 Pa · s or more and 7,000 Pa · s or less under the measurement conditions of a temperature of 240 ° C. and a shear rate of 91.2 sec -1 . The melt viscosity is more preferably 1500 Pa · s or more and 6500 Pa · s or less, and particularly preferably 2000 Pa · s or more and 6000 Pa · s or less. The melt viscosity is measured using a capillary rheometer (manufactured by Toyo Seiki Seisakusho Co., Ltd.). When the melt viscosity is within the above range, it has sufficient mechanical properties, and melt processing becomes possible in a temperature range in which thermal deterioration of the resin can be suppressed.
本発明のポリカーボネート樹脂のガラス転移温度は100℃以上、180℃以下であることが好ましい。ガラス転移温度は120℃以上、175℃以下であることがより好ましく、130℃以上、170℃以下であることが特に好ましい。ポリカーボネート樹脂のガラス転移温度は、本発明で用いられる構造単位やその他の構造単位の共重合比率によって調整することができる。ガラス転移温度が過度に低いと耐熱性が悪くなる傾向にあり、使用環境下における成形品の諸物性(光学特性や機械物性、寸法等)の信頼性が悪化する可能性がある。一方、ガラス転移温度が過度に高いと樹脂が脆くなったり、溶融加工性が悪化し、成形品の寸法精度が悪化したり、透明性を損なう場合がある。 The glass transition temperature of the polycarbonate resin of the present invention is preferably 100 ° C. or higher and 180 ° C. or lower. The glass transition temperature is more preferably 120 ° C. or higher and 175 ° C. or lower, and particularly preferably 130 ° C. or higher and 170 ° C. or lower. The glass transition temperature of the polycarbonate resin can be adjusted by the copolymerization ratio of the structural unit and other structural units used in the present invention. If the glass transition temperature is excessively low, the heat resistance tends to deteriorate, and the reliability of various physical properties (optical properties, mechanical properties, dimensions, etc.) of the molded product under the usage environment may deteriorate. On the other hand, if the glass transition temperature is excessively high, the resin may become brittle, the melt processability may deteriorate, the dimensional accuracy of the molded product may deteriorate, or the transparency may be impaired.
本発明のポリカーボネート樹脂の還元粘度、溶融粘度、及びガラス転移温度の具体的な測定方法は、後述の実施例の項に記載される通りである。 Specific methods for measuring the reduced viscosity, melt viscosity, and glass transition temperature of the polycarbonate resin of the present invention are as described in the section of Examples described later.
重縮合反応にジエステル化合物を用いる場合、未反応のジエステル化合物や副生したモノヒドロキシ化合物が樹脂中に残存するため、溶融加工の際に揮発し、臭気となって作業環境を悪化させたり、成形機を汚染し、成形品の外観を損ねるおそれがある。特に有用な炭酸ジエステルであるジフェニルカーボネート(DPC)を用いる場合、副生するフェノールは比較的沸点が高く、減圧下での反応によっても十分に除去されず、樹脂中に残存しやすい。 When a diester compound is used in the polycondensation reaction, an unreacted diester compound or a by-produced monohydroxy compound remains in the resin, so that it volatilizes during the melt processing and becomes an odor, which deteriorates the working environment or forms. It may contaminate the machine and spoil the appearance of the molded product. When diphenyl carbonate (DPC), which is a particularly useful carbonic acid diester, is used, the by-produced phenol has a relatively high boiling point, is not sufficiently removed by the reaction under reduced pressure, and tends to remain in the resin.
本発明のポリカーボネート樹脂中に含まれる炭酸ジエステル由来のモノヒドロキシ化合物は1000重量ppm以下であることが好ましく、700重量ppm以下であることがより好ましく、500重量ppm以下であることが特に好ましい。また、本発明のポリカーボネート樹脂中の炭酸ジエステルの残存量は300重量ppm以下が好ましく、200重量ppm以下がより好ましく、150重量ppm以下が特に好ましい。尚、モノヒドロキシ化合物と炭酸ジエステルは、前記問題を解決するためには、含有量が少ないほどよいが、溶融重合法では樹脂中の残存量をゼロにすることは困難であり、除去のためには過大な労力が必要である。通常は、モノヒドロキシ化合物と炭酸ジエステルの含有量をそれぞれ1重量ppmまで低減することにより、前記の問題を十分に抑制することができる。 The carbonic acid diester-derived monohydroxy compound contained in the polycarbonate resin of the present invention is preferably 1000% by weight or less, more preferably 700% by weight or less, and particularly preferably 500% by weight or less. The residual amount of carbonic acid diester in the polycarbonate resin of the present invention is preferably 300 wt ppm or less, more preferably 200 wt ppm or less, and particularly preferably 150 wt ppm or less. It should be noted that the smaller the content of the monohydroxy compound and the carbonic acid diester is, the better in order to solve the above problem, but it is difficult to make the residual amount in the resin zero by the melt polymerization method, and for removal. Requires excessive effort. Usually, by reducing the contents of the monohydroxy compound and the carbonic acid diester to 1 wt ppm each, the above-mentioned problem can be sufficiently suppressed.
樹脂中に残存する、炭酸ジエステル由来のモノヒドロキシ化合物や炭酸ジエステルをはじめとする低分子成分を低減するためには、樹脂を押出機で脱揮処理することや、重合終盤の圧力を3kPa以下、好ましくは2kPa以下、さらに好ましくは1kPa以下にすることが効果的である。 In order to reduce low molecular weight components such as carbonic acid diester-derived monohydroxy compounds and carbonic acid diesters remaining in the resin, the resin should be devolatilized with an extruder and the pressure at the end of polymerization should be 3 kPa or less. It is effective to set it to 2 kPa or less, more preferably 1 kPa or less.
重合終盤の圧力を低下させる場合には、反応の圧力を下げすぎると分子量が急激に上昇して、反応の制御が困難になる場合があるため、樹脂の末端基濃度をヒドロキシ基末端過剰かエステル基末端過剰にして、末端基バランスを偏らせて製造することが好ましい。末端基バランスは全ジヒドロキシ化合物と全ジエステル化合物の仕込みのモル比により調節することができる。 When lowering the pressure at the end of polymerization, if the reaction pressure is lowered too much, the molecular weight may rise sharply, making it difficult to control the reaction. Therefore, the terminal group concentration of the resin should be excessive at the end of the hydroxy group or ester. It is preferable to carry out the production in which the base terminal is excessive and the terminal group balance is biased. The end group balance can be adjusted by the molar ratio of the total dihydroxy compound and the total diester compound charged.
本発明のポリカーボネート樹脂の炭酸ジエステル由来のモノヒドロキシ化合物の含有量及び炭酸ジエステルの残存量の具体的な測定方法は、後述の実施例の項に記載される通りである。 The specific measurement method of the content of the monohydroxy compound derived from the carbonic acid diester of the polycarbonate resin of the present invention and the residual amount of the carbonic acid diester is as described in the section of Examples described later.
本発明のポリカーボネート樹脂は、ナトリウムd線(589nm)における屈折率(nD)が1.48〜1.56であることが好ましい。また、前記屈折率(nD)は、1.49〜1.55であることがより好ましく、1.50〜1.54であることが特に好ましい。前記屈折率が小さいほど、位相差フィルムの表面反射を抑制でき、全光線透過率を向上させることができ、光学補償効果が高まる。本発明のポリカーボネート樹脂に、逆波長分散性を付与するために芳香族構造単位を含有させた場合、脂肪族構造単位のみで構成されるポリカーボネート樹脂と比較すると屈折率は高くなってしまうが、芳香族構造単位の含有量を必要最小限にすることで、屈折率を前記の範囲に収めることができる。 The polycarbonate resin of the present invention preferably has a refractive index (n D ) at the sodium d line (589 nm) of 1.48 to 1.56. Further, the refractive index (n D ) is more preferably 1.49 to 1.55, and particularly preferably 1.50 to 1.54. The smaller the refractive index, the more the surface reflection of the retardation film can be suppressed, the total light transmittance can be improved, and the optical compensation effect can be enhanced. When the polycarbonate resin of the present invention contains an aromatic structural unit in order to impart reverse wavelength dispersibility, the refractive index is higher than that of the polycarbonate resin composed only of the aliphatic structural unit, but the aromatic By minimizing the content of the group structural unit, the refractive index can be kept within the above range.
本発明のポリカーボネート樹脂の光弾性係数は30×10−12Pa−1以下であることが好ましく、20×10−12Pa−1以下であることがさらに好ましく、15×10−12Pa−1以下であることが特に好ましい。光弾性係数が過度に大きいと、位相差フィルムを偏光板と貼り合わせた際に、画面の周囲が白くぼやけるような画像品質の低下が起きる可能性がある。特に大型の表示装置やフレキシブルディスプレイなどに用いられる場合にはこの問題が顕著に現れる。本発明のポリカーボネート樹脂の光弾性係数は、ポリカーボネート樹脂の他の物性を制御する際の自由度を高めるという観点から、7×10−12Pa−1以上であることが好ましい。 The photoelastic coefficient of the polycarbonate resin of the present invention is preferably 30 × 10 -12 Pa -1 or less, more preferably 20 × 10 -12 Pa -1 or less, and 15 × 10 -12 Pa -1 or less. Is particularly preferable. If the photoelastic coefficient is excessively large, when the retardation film is attached to the polarizing plate, the image quality may deteriorate such that the periphery of the screen becomes white and blurred. This problem is particularly noticeable when used in large display devices and flexible displays. The photoelastic coefficient of the polycarbonate resin of the present invention is preferably 7 × 10 -12 Pa -1 or more from the viewpoint of increasing the degree of freedom in controlling other physical properties of the polycarbonate resin.
本発明のポリカーボネート樹脂を、前記式(1)〜(3)のいずれかで表される構造単位と脂肪族の構造単位とで構成し、その他の芳香族構造単位を用いないようにすることで、上記の通り、光弾性係数を低く抑えることが可能になる。 The polycarbonate resin of the present invention is composed of a structural unit represented by any of the above formulas (1) to (3) and an aliphatic structural unit, and other aromatic structural units are not used. As described above, the photoelastic coefficient can be kept low.
また、本発明のポリカーボネート樹脂は、該樹脂から作成された延伸フィルムの、波長450nmにおける位相差(R450)と波長550nmにおける位相差(R550)との比である波長分散(R450/R550)の値が0.50以上、1.03以下であることを特徴とする。この波長分散(R450/R550)については、位相差フィルムの項で説明する。 Further, the polycarbonate resin of the present invention has a wavelength dispersion (R450 / R550) value which is a ratio of a phase difference (R450) at a wavelength of 450 nm and a phase difference (R550) at a wavelength of 550 nm of a stretched film made from the resin. Is 0.50 or more and 1.03 or less. This wavelength dispersion (R450 / R550) will be described in the section on retardation film.
本発明のポリカーボネート樹脂の屈折率(nD)、光弾性係数、波長分散(R450/R550)の具体的な測定方法は、後述の実施例の項に記載される通りである。 Specific measurement methods for the refractive index (n D ), photoelastic coefficient, and wavelength dispersion (R450 / R550) of the polycarbonate resin of the present invention are as described in the section of Examples described later.
[添加剤]
本発明のポリカーボネート樹脂には本発明の目的を損なわない範囲で、通常用いられる熱安定剤、酸化防止剤、触媒失活剤、紫外線吸収剤、光安定剤、離型剤、染顔料、衝撃改良剤、帯電防止剤、滑剤、潤滑剤、可塑剤、相溶化剤、核剤、難燃剤、無機充填剤、発泡剤等が含まれても差し支えない。
[Additive]
The polycarbonate resin of the present invention contains commonly used heat stabilizers, antioxidants, catalyst deactivators, ultraviolet absorbers, light stabilizers, mold release agents, dye pigments, and impact improvements as long as the object of the present invention is not impaired. Agents, antistatic agents, lubricants, lubricants, plasticizers, compatibilizers, nucleating agents, flame retardants, inorganic fillers, foaming agents and the like may be included.
(熱安定剤)
本発明のポリカーボネート樹脂には、必要に応じて、溶融加工時等における分子量の低下や色相の悪化を防止するために熱安定剤を配合することができる。かかる熱安定剤としては、通常知られるヒンダードフェノール系熱安定剤および/又はリン系熱安定剤が挙げられる。
(Heat stabilizer)
If necessary, a heat stabilizer can be added to the polycarbonate resin of the present invention in order to prevent a decrease in molecular weight and a deterioration in hue during melt processing and the like. Examples of such a heat stabilizer include commonly known hindered phenol-based heat stabilizers and / or phosphorus-based heat stabilizers.
ヒンダードフェノール系化合物としては、例えば、以下の化合物を採用することができる。
2,6−ジ−tert−ブチルフェノール、2,4−ジ−tert−ブチルフェノール、2−tert−ブチル−4−メトキシフェノール、2−tert−ブチル−4,6−ジメチルフェノール、2,6−ジ−tert−ブチル−4−メチルフェノール、2,6−ジ−tert−ブチル−4−エチルフェノール、2,5−ジ−tert−ブチルヒドロキノン、n−オクタデシル−3−(3’,5’−ジ−tert−ブチル−4’−ヒドロキシフェニル)プロピオネート、2−tert−ブチル−6−(3’−tert−ブチル−5’−メチル−2’−ヒドロキシベンジル)−4−メチルフェニルアクリレート、2,2’−メチレン−ビス−(4−メチル−6−tert−ブチルフェノール)、2,2’−メチレン−ビス−(6−シクロヘキシル−4−メチルフェノール)、2,2’−エチリデン−ビス−(2,4−ジ−tert−ブチルフェノール)、テトラキス−[メチレン−3−(3’,5’−ジ−tert−ブチル−4’−ヒドロキシフェニル)プロピオネート]−メタン、1,3,5−トリメチル−2,4,6−トリス−(3,5−ジ−tert−ブチル−4−ヒドロキシベンジル)ベンゼン等。中でも、テトラキス−[メチレン−3−(3’,5’−ジ−tert−ブチル−4’−ヒドロキシフェニル)プロピオネート]−メタン、n−オクタデシル−3−(3’,5’−ジ−tert−ブチル−4’−ヒドロキシフェニル)プロピオネート、1,3,5−トリメチル−2,4,6−トリス−(3,5−ジ−tert−ブチル−4−ヒドロキシベンジル)ベンゼンを用いることが好ましい。
As the hindered phenolic compound, for example, the following compounds can be adopted.
2,6-Di-tert-butylphenol, 2,4-di-tert-butylphenol, 2-tert-butyl-4-methoxyphenol, 2-tert-butyl-4,6-dimethylphenol, 2,6-di- tert-Butyl-4-methylphenol, 2,6-di-tert-butyl-4-ethylphenol, 2,5-di-tert-butylhydroquinone, n-octadecyl-3- (3', 5'-di- tert-Butyl-4'-hydroxyphenyl) propionate, 2-tert-butyl-6- (3'-tert-butyl-5'-methyl-2'-hydroxybenzyl) -4-methylphenyl acrylate, 2,2' -Methylene-bis- (4-methyl-6-tert-butylphenol), 2,2'-methylene-bis- (6-cyclohexyl-4-methylphenol), 2,2'-ethylidene-bis- (2,4) -Di-tert-butylphenol), tetrakis- [methylene-3- (3', 5'-di-tert-butyl-4'-hydroxyphenyl) propionate] -methane, 1,3,5-trimethyl-2,4 , 6-Tris- (3,5-di-tert-butyl-4-hydroxybenzyl) benzene and the like. Among them, tetrakis- [methylene-3- (3', 5'-di-tert-butyl-4'-hydroxyphenyl) propionate] -methane, n-octadecyl-3- (3', 5'-di-tert-). It is preferable to use butyl-4'-hydroxyphenyl) propionate, 1,3,5-trimethyl-2,4,6-tris- (3,5-di-tert-butyl-4-hydroxybenzyl) benzene.
リン系化合物としては、例えば、以下に示す亜リン酸、リン酸、亜ホスホン酸、ホスホン酸及びこれらのエステル等を採用することができるが、これらの化合物以外のリン系化合物を採用することも可能である。
トリフェニルホスファイト、トリス(ノニルフェニル)ホスファイト、トリス(2,4−ジ−tert−ブチルフェニル)ホスファイト、トリデシルホスファイト、トリオクチルホスファイト、トリオクタデシルホスファイト、ジデシルモノフェニルホスファイト、ジオクチルモノフェニルホスファイト、ジイソプロピルモノフェニルホスファイト、モノブチルジフェニルホスファイト、モノデシルジフェニルホスファイト、モノオクチルジフェニルホスファイト、ビス(2,6−ジ−tert−ブチル−4−メチルフェニル)ペンタエリスリトールジホスファイト、2,2−メチレンビス(4,6−ジ−tert−ブチルフェニル)オクチルホスファイト、ビス(ノニルフェニル)ペンタエリスリトールジホスファイト、ビス(2,4−ジ−tert−ブチルフェニル)ペンタエリスリトールジホスファイト、ジステアリルペンタエリスリトールジホスファイト、トリブチルホスフェート、トリエチルホスフェート、トリメチルホスフェート、トリフェニルホスフェート、ジフェニルモノオルソキセニルホスフェート、ジブチルホスフェート、ジオクチルホスフェート、ジイソプロピルホスフェート、4,4’−ビフェニレンジホスフィン酸テトラキス(2,4−ジ−tert−ブチルフェニル)、ベンゼンホスホン酸ジメチル、ベンゼンホスホン酸ジエチル、ベンゼンホスホン酸ジプロピル。
As the phosphorus-based compound, for example, phosphorous acid, phosphoric acid, phosphonic acid, phosphonic acid, and esters thereof shown below can be adopted, but phosphorus-based compounds other than these compounds may also be adopted. It is possible.
Triphenylphosphine, tris (nonylphenyl) phosphine, tris (2,4-di-tert-butylphenyl) phosphite, tridecylphosphine, trioctylphosphine, trioctadecylphosphine, didecylmonophenylphosphine , Dioctylmonophenylphosphine, diisopropylmonophenylphosphine, monobutyldiphenylphosphine, monodecyldiphenylphosphine, monooctyldiphenylphosphine, bis (2,6-di-tert-butyl-4-methylphenyl) pentaerythritol Diphosphite, 2,2-methylenebis (4,6-di-tert-butylphenyl) octylphosphine, bis (nonylphenyl) pentaerythritol diphosphite, bis (2,4-di-tert-butylphenyl) penta Erislitol diphosphate, distearylpentaerythritol diphosphite, tributyl phosphate, triethyl phosphate, trimethyl phosphate, triphenyl phosphate, diphenyl monoorthoxenyl phosphate, dibutyl phosphate, dioctyl phosphate, diisopropyl phosphate, 4,4'-biphenylenediphosphine Tetrakiss (2,4-di-tert-butylphenyl), dimethyl benzenephosphonate, diethyl benzenephosphonate, dipropyl benzenephosphonate.
これらの熱安定剤は、1種を単独で用いても良く、2種以上を併用してもよい。 One of these heat stabilizers may be used alone, or two or more thereof may be used in combination.
かかる熱安定剤は、溶融重合時に反応液に添加してもよく、押出機を用いて樹脂に添加し、混練してもよい。溶融押出法によりフィルムを製膜する場合、押出機に前記熱安定剤等を添加して製膜してもよいし、予め押出機を用いて、樹脂中に前記熱安定剤等を添加して、ペレット等の形状にしたものを用いてもよい。 Such a heat stabilizer may be added to the reaction solution at the time of melt polymerization, or may be added to the resin using an extruder and kneaded. When a film is formed by the melt extrusion method, the heat stabilizer or the like may be added to the extruder to form the film, or the heat stabilizer or the like may be added to the resin in advance using an extruder. , Pellets or the like may be used.
これらの熱安定剤の配合量は、樹脂を100重量部とした場合、0.0001重量部以上が好ましく、0.0005重量部以上がより好ましく、0.001重量部以上がさらに好ましく、また、1重量部以下が好ましく、0.5重量部以下がより好ましく、0.2重量部以下がさらに好ましい。 When the resin is 100 parts by weight, the amount of these heat stabilizers is preferably 0.0001 parts by weight or more, more preferably 0.0005 parts by weight or more, further preferably 0.001 parts by weight or more, and further. It is preferably 1 part by weight or less, more preferably 0.5 part by weight or less, and further preferably 0.2 part by weight or less.
(触媒失活剤)
本発明のポリカーボネート樹脂に、重合反応で用いた触媒を中和し、失活させるために酸性化合物を添加することで、色調や熱安定性を向上することができる。触媒失活剤として用いられる酸性化合物としては、カルボン酸基やリン酸基、スルホン酸基を有する化合物、又はそれらのエステル体などを用いることができるが、特に下記式(12)又は(13)で表される部分構造を含有するリン系化合物を用いることが好ましい。
(Catalyst deactivator)
By adding an acidic compound to the polycarbonate resin of the present invention in order to neutralize and inactivate the catalyst used in the polymerization reaction, the color tone and thermal stability can be improved. As the acidic compound used as the catalyst deactivator, a compound having a carboxylic acid group, a phosphoric acid group, a sulfonic acid group, or an ester thereof can be used, and in particular, the following formula (12) or (13) It is preferable to use a phosphorus-based compound containing a partial structure represented by.
前記式(12)又は(13)で表されるリン系化合物としては、リン酸、亜リン酸、ホスホン酸、次亜リン酸、ポリリン酸、ホスホン酸エステル、酸性リン酸エステル等が挙げられる。上記の中でも触媒失活と着色抑制の効果がさらに優れているのは、亜リン酸、ホスホン酸、ホスホン酸エステルであり、特に亜リン酸が好ましい。 Examples of the phosphorus-based compound represented by the formula (12) or (13) include phosphoric acid, phosphorous acid, phosphonic acid, hypophosphoric acid, polyphosphoric acid, phosphonic acid ester, acidic phosphoric acid ester and the like. Among the above, phosphorous acid, phosphonic acid, and phosphonic acid ester are more excellent in the effects of catalytic deactivation and color suppression, and phosphorous acid is particularly preferable.
ホスホン酸としては、ホスホン酸(亜リン酸)、メチルホスホン酸、エチルホスホン酸、ビニルホスホン酸、デシルホスホン酸、フェニルホスホン酸、ベンジルホスホン酸、アミノメチルホスホン酸、メチレンジホスホン酸、1−ヒドロキシエタン−1,1−ジホスホン酸、4−メトキシフェニルホスホン酸、ニトリロトリス(メチレンホスホン酸)、プロピルホスホン酸無水物などが挙げられる。 Phosphonates include phosphonic acid (phosphoric acid), methylphosphonic acid, ethylphosphonic acid, vinylphosphonic acid, decylphosphonic acid, phenylphosphonic acid, benzylphosphonic acid, aminomethylphosphonic acid, methylenediphosphonic acid, 1-hydroxyethane- Examples thereof include 1,1-diphosphonic acid, 4-methoxyphenylphosphonic acid, nitrilotris (methylenephosphonic acid), and propylphosphonic acid anhydride.
ホスホン酸エステルとしては、ホスホン酸ジメチル、ホスホン酸ジエチル、ホスホン酸ビス(2−エチルヘキシル)、ホスホン酸ジラウリル、ホスホン酸ジオレイル、ホスホン酸ジフェニル、ホスホン酸ジベンジル、メチルホスホン酸ジメチル、メチルホスホン酸ジフェニル、エチルホスホン酸ジエチル、ベンジルホスホン酸ジエチル、フェニルホスホン酸ジメチル、フェニルホスホン酸ジエチル、フェニルホスホン酸ジプロピル、(メトキシメチル)ホスホン酸ジエチル、ビニルホスホン酸ジエチル、ヒドロキシメチルホスホン酸ジエチル、(2−ヒドロキシエチル)ホスホン酸ジメチル、p−メチルベンジルホスホン酸ジエチル、ジエチルホスホノ酢酸、ジエチルホスホノ酢酸エチル、ジエチルホスホノ酢酸tert−ブチル、(4−クロロベンジル)ホスホン酸ジエチル、シアノホスホン酸ジエチル、シアノメチルホスホン酸ジエチル、3,5−ジ−tert−ブチル−4−ヒドロキシベンジルホスホン酸ジエチル、ジエチルホスホノアセトアルデヒドジエチルアセタール、(メチルチオメチル)ホスホン酸ジエチルなどが挙げられる。 Phosphonate esters include dimethyl phosphonate, diethyl phosphonate, bis (2-ethylhexyl) phosphonate, dilauryl phosphonate, diorail phosphonate, diphenyl phosphonate, dibenzyl phosphonate, dimethyl methylphosphonate, diphenyl methylphosphonate, ethylphosphonic acid. Diethyl, diethyl benzylphosphonate, dimethyl phenylphosphonate, diethyl phenylphosphonate, dipropyl phenylphosphonate, diethyl (methoxymethyl) phosphonate, diethyl vinylphosphonate, diethyl hydroxymethylphosphonate, dimethyl (2-hydroxyethyl) phosphonate, Diethyl p-methylbenzylphosphonate, diethylphosphonoacetic acid, ethyl diethylphosphonoacetate, tert-butyl diethylphosphonoacetate, diethyl (4-chlorobenzyl) phosphonate, diethyl cyanophosphonate, diethyl cyanomethylphosphonate, 3,5 Examples thereof include -di-tert-butyl-4-hydroxybenzylphosphonate diethyl, diethylphosphonoacetaldehyde diethylacetal, and (methylthiomethyl) phosphonate diethyl.
酸性リン酸エステルとしては、リン酸ジメチル、リン酸ジエチル、リン酸ジビニル、リン酸ジプロピル、リン酸ジブチル、リン酸ビス(ブトキシエチル)、リン酸ビス(2−エチルヘキシル)、リン酸ジイソトリデシル、リン酸ジオレイル、リン酸ジステアリル、リン酸ジフェニル、リン酸ジベンジルなどのリン酸ジエステル、又はジエステルとモノエステルの混合物、クロロリン酸ジエチル、リン酸ステアリル亜鉛塩などが挙げられる。 Examples of acidic phosphoric acid esters include dimethyl phosphate, diethyl phosphate, divinyl phosphate, dipropyl phosphate, dibutyl phosphate, bis (butoxyethyl) phosphate, bis (2-ethylhexyl) phosphate, diisotridecyl phosphate, and phosphoric acid. Phosphate diesters such as dioleyl, distearyl phosphate, diphenyl phosphate, dibenzyl phosphate, or a mixture of diester and monoester, diethyl chlorophosphate, stearyl phosphate zinc salt and the like can be mentioned.
これらは1種を単独で用いてもよく、2種以上を任意の組み合わせ及び比率で混合して用いてもよい。 One of these may be used alone, or two or more thereof may be mixed and used in any combination and ratio.
樹脂への前記リン系化合物の添加量が少なすぎると、触媒失活や着色抑制の効果が不十分であり、多すぎるとかえって樹脂が着色してしまったり、特に高温高湿度下での耐久試験において、樹脂が着色しやすくなる。前記リン系化合物の添加量は、重合反応に用いた触媒量に対応した量を添加する。重合反応に用いた触媒の金属1molに対して、前記リン系化合物はリン原子の量として0.5倍mol以上、5倍mol以下が好ましく、さらに0.7倍mol以上、4倍mol以下が好ましく、特に0.8倍mol以上、3倍mol以下が好ましい。 If the amount of the phosphorus compound added to the resin is too small, the effect of catalyst deactivation and color suppression is insufficient, and if it is too large, the resin may be colored, or the durability test especially under high temperature and high humidity. In, the resin is easily colored. The amount of the phosphorus compound added corresponds to the amount of the catalyst used in the polymerization reaction. The amount of the phosphorus atom in the phosphorus compound is preferably 0.5 times mol or more and 5 times mol or less, and further 0.7 times mol or more and 4 times mol or less with respect to 1 mol of the catalyst metal used in the polymerization reaction. It is preferable, and particularly preferably 0.8 times mol or more and 3 times mol or less.
(ポリマーアロイ)
本発明のポリカーボネート樹脂は、機械特性や耐溶剤性等の特性を改質する目的で、芳香族ポリカーボネート、芳香族ポリエステル、脂肪族ポリエステル、ポリアミド、ポリスチレン、ポリオレフィン、アクリル、アモルファスポリオレフィン、ABS、AS、ポリ乳酸、ポリブチレンスクシネート等の合成樹脂やゴム等の1種又は2種以上と混練してなるポリマーアロイとしてもよい。
(Polymer alloy)
The polycarbonate resin of the present invention has aromatic polycarbonate, aromatic polyester, aliphatic polyester, polyamide, polystyrene, polyolefin, acrylic, amorphous polyolefin, ABS, AS, for the purpose of modifying properties such as mechanical properties and solvent resistance. It may be a polymer alloy prepared by kneading one or more kinds of synthetic resin such as polylactic acid and polybutylene succinate and rubber and the like.
前記の添加剤や改質剤は、本発明に用いられる樹脂に前記成分を同時に、又は任意の順序でタンブラー、V型ブレンダー、ナウターミキサー、バンバリーミキサー、混練ロール、押出機等の混合機により混合して製造することができるが、中でも押出機、特には二軸押出機により混練することが、分散性向上の観点から好ましい。 The above-mentioned additives and modifiers are prepared by adding the above-mentioned components to the resin used in the present invention at the same time or in an arbitrary order by a mixer such as a tumbler, a V-type blender, a Nauter mixer, a Banbury mixer, a kneading roll, or an extruder. Although it can be produced by mixing, kneading with an extruder, particularly a twin-screw extruder, is preferable from the viewpoint of improving dispersibility.
[透明フィルム及び位相差フィルム]
本発明の透明フィルムは、本発明のポリカーボネート樹脂を成形してなるものである。
また、本発明の位相差フィルムは、本発明の透明フィルムを少なくとも一方向に延伸してなるものである。
以下、本発明の透明フィルムを「未延伸フィルム」と称す場合がある。
[Transparent film and retardation film]
The transparent film of the present invention is formed by molding the polycarbonate resin of the present invention.
Further, the retardation film of the present invention is formed by stretching the transparent film of the present invention in at least one direction.
Hereinafter, the transparent film of the present invention may be referred to as an "unstretched film".
(未延伸フィルムの製造方法)
本発明のポリカーボネート樹脂を用いて、未延伸フィルムを製膜する方法としては、樹脂を溶媒に溶解させてキャストした後、溶媒を除去する流延法や、溶媒を用いずに樹脂を溶融させて製膜する溶融製膜法を採用することができる。溶融製膜法としては、具体的にはTダイを用いた溶融押出法、カレンダー成形法、熱プレス法、共押出法、共溶融法、多層押出法、インフレーション成形法等がある。未延伸フィルムの製膜方法は特に限定されないが、流延法では残存溶媒による問題が生じるおそれがあるため、好ましくは溶融製膜法、中でも後の延伸処理のし易さから、Tダイを用いた溶融押出法が好ましい。
(Manufacturing method of unstretched film)
As a method for forming an unstretched film using the polycarbonate resin of the present invention, a casting method in which the resin is dissolved in a solvent and cast, and then the solvent is removed, or a resin is melted without using a solvent. A melt film forming method for forming a film can be adopted. Specific examples of the melt film forming method include a melt extrusion method using a T-die, a calender molding method, a hot press method, a coextrusion method, a comelt method, a multi-layer extrusion method, and an inflation molding method. The method for forming the unstretched film is not particularly limited, but the casting method may cause problems due to the residual solvent. Therefore, the melt film forming method, particularly the T-die is used because of the ease of subsequent stretching treatment. The melt extrusion method used is preferable.
溶融製膜法により未延伸フィルムを成形する場合、成形温度を280℃以下とすることが好ましく、270℃以下とすることがより好ましく、265℃以下とすることが特に好ましい。成形温度が高過ぎると、得られるフィルム中の異物や気泡の発生による欠陥が増加したり、フィルムが着色したりする可能性がある。ただし、成形温度が低過ぎると樹脂の溶融粘度が高くなりすぎ、原反フィルムの成形が困難となり、厚みの均一な未延伸フィルムを製造することが困難になる可能性があるので、成形温度の下限は通常200℃以上、好ましくは210℃以上、より好ましくは220℃以上である。尚、本発明において成形温度とは、溶融製膜法における成形時の温度であって、溶融樹脂を押し出すダイス出口の樹脂温度を測定した値である。 When the unstretched film is molded by the melt film forming method, the molding temperature is preferably 280 ° C. or lower, more preferably 270 ° C. or lower, and particularly preferably 265 ° C. or lower. If the molding temperature is too high, defects due to the generation of foreign matter and bubbles in the obtained film may increase, and the film may be colored. However, if the molding temperature is too low, the melt viscosity of the resin becomes too high, which makes it difficult to mold the raw film, and it may be difficult to produce an unstretched film having a uniform thickness. The lower limit is usually 200 ° C. or higher, preferably 210 ° C. or higher, and more preferably 220 ° C. or higher. In the present invention, the molding temperature is the temperature at the time of molding in the melt film forming method, and is a value obtained by measuring the resin temperature at the die outlet for extruding the molten resin.
また、フィルム中に異物が存在すると、偏光板として用いられた場合に光抜け等の欠点として認識される。樹脂中の異物を除去するために、前記の押出機の後にポリマーフィルターを取り付け、樹脂を濾過した後に、ダイスから押し出してフィルムを成形する方法が好ましい。その際、押出機やポリマーフィルター、ダイスを配管でつなぎ、溶融樹脂を移送する必要があるが、配管内での熱劣化を極力抑制するため、滞留時間が最短になるように各設備を配置することが重要である。また、押出後のフィルムの搬送や巻き取りの工程はクリーンルーム内で行い、フィルムに異物が付着しないように最善の注意が求められる。 Further, if a foreign substance is present in the film, it is recognized as a defect such as light leakage when used as a polarizing plate. In order to remove foreign substances in the resin, a method in which a polymer filter is attached after the extruder, the resin is filtered, and then extruded from a die to form a film is preferable. At that time, it is necessary to connect the extruder, polymer filter, and die with piping and transfer the molten resin, but in order to suppress thermal deterioration in the piping as much as possible, arrange each equipment so that the residence time is the shortest. This is very important. In addition, the process of transporting and winding the film after extrusion is performed in a clean room, and the utmost care is required to prevent foreign matter from adhering to the film.
未延伸フィルムの厚みは、延伸後の位相差フィルムの膜厚の設計や、延伸倍率等の延伸条件に合わせて決められるが、厚すぎると厚み斑が生じやすく、薄すぎると搬送時や延伸時の破断を招く可能性があるため、通常30μm以上、好ましくは40μm以上、さらに好ましくは50μm以上であり、また、通常200μm以下、好ましくは160μm以下、さらに好ましくは120μm以下である。また、未延伸フィルムに厚み斑があると、位相差フィルムの位相差斑を招くため、位相差フィルムとして使用する部分の厚みは設定厚み±3μm以下であることが好ましく、設定厚み±2μm以下であることがさらに好ましく、設定厚み±1μm以下であることが特に好ましい。 The thickness of the unstretched film is determined according to the design of the film thickness of the retardation film after stretching and the stretching conditions such as the stretching ratio. However, if it is too thick, thickness unevenness is likely to occur, and if it is too thin, it is likely to occur during transportation or stretching. It is usually 30 μm or more, preferably 40 μm or more, more preferably 50 μm or more, and usually 200 μm or less, preferably 160 μm or less, still more preferably 120 μm or less, because it may cause breakage. Further, if the unstretched film has thickness unevenness, the retardation unevenness of the retardation film is caused. Therefore, the thickness of the portion used as the retardation film is preferably ± 3 μm or less, and the set thickness is ± 2 μm or less. It is more preferable that the thickness is ± 1 μm or less.
未延伸フィルムの長手方向の長さは500m以上であることが好ましく、さらに1000m以上であることが好ましく、特に1500m以上が好ましい。生産性や品質の観点から、本発明の位相差フィルムを製造する際は、連続で延伸を行うことが好ましいが、通常、延伸開始時に所定の位相差に合わせ込むために条件調整が必要であり、フィルムの長さが短すぎると条件調整後に取得できる製品の量が減ってしまう。尚、本明細書において「長尺」とは、フィルムの幅方向よりも長手方向の寸法が十分に大きいことを意味し、実質的には長手方向に巻回してコイル状にできる程度のものを意味する。より具体的には、フィルムの長手方向の寸法が幅方向の寸法よりも10倍以上大きいものを意味する。 The length of the unstretched film in the longitudinal direction is preferably 500 m or more, more preferably 1000 m or more, and particularly preferably 1500 m or more. From the viewpoint of productivity and quality, when producing the retardation film of the present invention, it is preferable to continuously stretch the film, but usually, it is necessary to adjust the conditions in order to adjust to a predetermined retardation at the start of stretching. If the length of the film is too short, the amount of products that can be obtained after adjusting the conditions will decrease. In the present specification, the term "long" means that the dimension of the film in the longitudinal direction is sufficiently larger than that in the width direction of the film, and that the film can be wound in the longitudinal direction to form a coil. means. More specifically, it means that the dimension in the longitudinal direction of the film is 10 times or more larger than the dimension in the width direction.
前記のように得られた未延伸フィルムは、内部ヘイズが3%以下であることが好ましく、2%以下であることがより好ましく、1%以下であることが特に好ましい。未延伸フィルムの内部ヘイズが前記上限値よりも大きいと光の散乱が起こり、例えば偏光子と積層した際、偏光解消を生じる原因となる場合がある。内部ヘイズの下限値は特に定めないが、通常0.1%以上である。内部ヘイズの測定には、事前にヘイズ測定を行っておいた粘着剤付き透明フィルムを未延伸フィルムの両面に貼り合せ、外部ヘイズの影響を除去した状態のサンプルを用い、粘着剤付き透明フィルムのヘイズ値を前記サンプルの測定値から差し引いた値を内部ヘイズの値とする。 The unstretched film obtained as described above preferably has an internal haze of 3% or less, more preferably 2% or less, and particularly preferably 1% or less. If the internal haze of the unstretched film is larger than the upper limit value, light scattering may occur, which may cause depolarization when laminated with a polarizer, for example. The lower limit of the internal haze is not specified, but is usually 0.1% or more. For the measurement of internal haze, a transparent film with adhesive that had been measured for haze in advance was attached to both sides of the unstretched film, and a sample with the influence of external haze removed was used. The value obtained by subtracting the haze value from the measured value of the sample is used as the internal haze value.
また、未延伸フィルムのb*値は3以下であることが好ましい。フィルムのb*値が大き過ぎると着色等の問題が生じる。b*値はより好ましくは2以下、特に好ましくは1以下である。尚、b*値はコニカミノルタ(株)製分光測色計CM−2600dを用いて測定する。 Further, the b * value of the unstretched film is preferably 3 or less. If the b * value of the film is too large, problems such as coloring will occur. The b * value is more preferably 2 or less, and particularly preferably 1 or less. The b * value is measured using a spectrophotometer CM-2600d manufactured by Konica Minolta Co., Ltd.
未延伸フィルムは、厚みによらず、当該フィルムそのものの全光線透過率が80%以上であることが好ましく、85%以上であることがさらに好ましく、90%以上であることが特に好ましい。全光線透過率が前記下限以上であれば、着色の少ないフィルムが得られ、偏光板と貼り合わせた際、偏光度や透過率の高い円偏光板となり、画像表示装置に用いた際に、高い表示品位を実現することが可能となる。尚、未延伸フィルムの全光線透過率の上限は特に制限はないが通常99%以下である。
未延伸フィルムの全光線透過率の具体的な測定方法は、後述の実施例の項に記載される通りである。
Regardless of the thickness of the unstretched film, the total light transmittance of the film itself is preferably 80% or more, more preferably 85% or more, and particularly preferably 90% or more. When the total light transmittance is equal to or higher than the above lower limit, a film with less coloring can be obtained, and when bonded to a polarizing plate, a circular polarizing plate having high degree of polarization and transmittance is obtained, which is high when used in an image display device. It is possible to realize display quality. The upper limit of the total light transmittance of the unstretched film is not particularly limited, but is usually 99% or less.
A specific method for measuring the total light transmittance of the unstretched film is as described in the section of Examples described later.
(位相差フィルムの製造方法)
前記未延伸フィルムを少なくとも一方向に延伸配向させることにより、位相差フィルムを得ることができる。延伸方法としては縦一軸延伸、テンター等を用いる横一軸延伸、あるいはそれらを組み合わせた同時二軸延伸、逐次二軸延伸等、公知の方法を用いることができる。延伸はバッチ式で行ってもよいが、連続で行うことが生産性において好ましい。さらにバッチ式に比べて、連続の方がフィルム面内の位相差のばらつきの少ない位相差フィルムが得られる。
(Manufacturing method of retardation film)
A retardation film can be obtained by stretching and orienting the unstretched film in at least one direction. As the stretching method, known methods such as longitudinal uniaxial stretching, horizontal uniaxial stretching using a tenter or the like, simultaneous biaxial stretching combining them, and sequential biaxial stretching can be used. The stretching may be carried out in batch, but continuous stretching is preferable in terms of productivity. Further, as compared with the batch type, a continuous retardation film can be obtained with less variation in the phase difference in the film plane.
延伸温度は、原料として用いる樹脂のガラス転移温度(Tg)に対して、通常(Tg−20℃)〜(Tg+30℃)の範囲であり、好ましくは(Tg−10℃)〜(Tg+20℃)、さらに好ましくは(Tg−5℃)〜(Tg+15℃)の範囲内である。延伸倍率は目的とする位相差値により決められるが、縦、横それぞれ、1.2倍〜4倍、より好ましくは1.5倍〜3.5倍、さらに好ましくは2倍〜3倍である。延伸倍率が小さすぎると、所望とする配向度と配向角が得られる有効範囲が狭くなる。一方、延伸倍率が大きすぎると、延伸中にフィルムが破断したり、しわが発生するおそれがある。 The stretching temperature is usually in the range of (Tg-20 ° C.) to (Tg + 30 ° C.), preferably (Tg-10 ° C.) to (Tg + 20 ° C.), with respect to the glass transition temperature (Tg) of the resin used as the raw material. More preferably, it is in the range of (Tg-5 ° C.) to (Tg + 15 ° C.). The draw ratio is determined by the target phase difference value, but is 1.2 times to 4 times, more preferably 1.5 times to 3.5 times, and further preferably 2 times to 3 times, respectively, in the vertical direction and the horizontal direction. .. If the draw ratio is too small, the effective range in which the desired degree of orientation and orientation angle can be obtained is narrowed. On the other hand, if the draw ratio is too large, the film may be broken or wrinkled during stretching.
延伸速度も目的に応じて適宜選択されるが、下記数式で表される歪み速度で通常50%〜2000%、好ましくは100%〜1500%、より好ましくは200%〜1000%、特に好ましくは250%〜500%となるように選択することができる。延伸速度が過度に大きいと延伸時の破断を招いたり、高温条件下での長期使用による光学的特性の変動が大きくなったりする可能性がある。また、延伸速度が過度に小さいと生産性が低下するだけでなく、所望の位相差を得るのに延伸倍率を過度に大きくしなければならない場合がある。
歪み速度(%/分)={延伸速度(mm/分)/
原反フィルムの長さ(mm)}×100
The stretching speed is also appropriately selected depending on the intended purpose, but the strain rate represented by the following formula is usually 50% to 2000%, preferably 100% to 1500%, more preferably 200% to 1000%, and particularly preferably 250. It can be selected to be% to 500%. If the stretching speed is excessively high, it may cause breakage during stretching, or the optical characteristics may fluctuate greatly due to long-term use under high temperature conditions. Further, if the stretching speed is excessively low, not only the productivity is lowered, but also the stretching ratio may have to be excessively increased in order to obtain a desired phase difference.
Strain rate (% / min) = {stretching rate (mm / min) /
Raw film length (mm)} x 100
フィルムを延伸した後、必要に応じて加熱炉により熱固定処理を行ってもよいし、テンターの幅を制御したり、ロール周速を調整したりして、緩和工程を行ってもよい。熱固定処理の温度としては、未延伸フィルムに用いられる樹脂のガラス転移温度(Tg)に対し、通常60℃〜(Tg)、好ましくは70℃〜(Tg−5℃)の範囲で行う。熱処理温度が高すぎると、延伸により得られた分子の配向が乱れ、所望の位相差から大きく低下してしまう可能性がある。また、緩和工程を設ける場合は、延伸によって広がったフィルムの幅に対して、95%〜99%に収縮させることで、延伸フィルムに生じた応力を取り除くことができる。この際にフィルムにかける処理温度は、熱固定処理温度と同様である。前記のような熱固定処理や緩和工程を行うことで、高温条件下での長期使用による光学特性の変動を抑制することができる。 After stretching the film, heat fixing treatment may be performed in a heating furnace, if necessary, or a relaxation step may be performed by controlling the width of the tenter or adjusting the peripheral speed of the roll. The temperature of the heat fixing treatment is usually in the range of 60 ° C. to (Tg), preferably 70 ° C. to (Tg-5 ° C.) with respect to the glass transition temperature (Tg) of the resin used for the unstretched film. If the heat treatment temperature is too high, the orientation of the molecules obtained by stretching may be disturbed, which may greatly reduce the desired phase difference. Further, when the relaxation step is provided, the stress generated in the stretched film can be removed by shrinking the width of the film expanded by stretching to 95% to 99%. The treatment temperature applied to the film at this time is the same as the heat fixing treatment temperature. By performing the heat fixing treatment and the relaxation step as described above, it is possible to suppress fluctuations in optical characteristics due to long-term use under high temperature conditions.
本発明の位相差フィルムは、このような延伸工程における処理条件を適宜選択・調整することによって作製することができる。 The retardation film of the present invention can be produced by appropriately selecting and adjusting the processing conditions in such a stretching step.
位相差フィルムの複屈折(Δn)の具体的な測定方法は、後述の実施例の項に記載される通りである。 A specific method for measuring the birefringence (Δn) of the retardation film is as described in the section of Examples described later.
本発明の位相差フィルムは、位相差の設計値にもよるが、厚みが70μm以下であることが好ましい。また、位相差フィルムの厚みは60μm以下であることがより好ましく、55μm以下であることがさらに好ましく、50μm以下であることが特に好ましい。一方、厚みが過度に薄いと、フィルムの取り扱いが困難になり、製造中にしわが発生したり、破断が起こったりするため、本発明の位相差フィルムの厚みの下限としては、好ましくは10μm以上、より好ましくは15μm以上である。 The retardation film of the present invention preferably has a thickness of 70 μm or less, although it depends on the design value of the retardation. The thickness of the retardation film is more preferably 60 μm or less, further preferably 55 μm or less, and particularly preferably 50 μm or less. On the other hand, if the thickness is excessively thin, it becomes difficult to handle the film, and wrinkles or breakage occur during production. Therefore, the lower limit of the thickness of the retardation film of the present invention is preferably 10 μm or more. More preferably, it is 15 μm or more.
本発明のポリカーボネート樹脂を用いて作成された延伸フィルムである本発明の位相差フィルムは、波長450nmで測定した位相差(R450)の、波長550nmで測定した位相差(R550)に対する比である波長分散(R450/R550)の値が0.50以上、1.03以下である。フラットな波長分散性が好適に用いられる用途においては、波長分散(R450/R550)の値は0.98以上、1.02以下であることがより好ましく、0.99以上、1.01以下であることが特に好ましい。また、1/4波長板に用いられる場合は、波長分散(R450/R550)の値は0.70以上、0.96以下であることがより好ましく、0.75以上、0.94以下であることがさらに好ましく、0.78以上、0.92以下であることが特に好ましい。 The retardation film of the present invention, which is a stretched film produced by using the polycarbonate resin of the present invention, has a wavelength that is the ratio of the retardation (R450) measured at a wavelength of 450 nm to the retardation (R550) measured at a wavelength of 550 nm. The value of the dispersion (R450 / R550) is 0.50 or more and 1.03 or less. In applications where flat wavelength dispersion is preferably used, the value of wavelength dispersion (R450 / R550) is more preferably 0.98 or more and 1.02 or less, and more preferably 0.99 or more and 1.01 or less. It is particularly preferable to have. When used for a 1/4 wave plate, the value of wavelength dispersion (R450 / R550) is more preferably 0.70 or more and 0.96 or less, and more preferably 0.75 or more and 0.94 or less. It is more preferable, and it is particularly preferable that it is 0.78 or more and 0.92 or less.
前記波長分散(R450/R550)の値がこの範囲であれば、可視領域の広い波長範囲において理想的な位相差特性を得ることができる。例えば、1/4波長板としてこのような波長依存性を有する位相差フィルムを作製し、偏光板と貼り合わせることにより、円偏光板等を作製することができ、色相の波長依存性が少ない偏光板および表示装置の実現が可能である。一方、前記波長分散(R450/R550)がこの範囲外の場合には、色相の波長依存性が大きくなり、可視領域のすべての波長において光学補償がなされなくなり、偏光板や表示装置に光が通り抜けることによる着色やコントラストの低下等の問題が生じる。 When the value of the wavelength dispersion (R450 / R550) is in this range, ideal phase difference characteristics can be obtained in a wide wavelength range in the visible region. For example, by producing a retardation film having such wavelength dependence as a 1/4 wave plate and bonding it with a polarizing plate, a circular polarizing plate or the like can be produced, and polarized light having less wavelength dependence of hue can be produced. It is possible to realize a board and a display device. On the other hand, when the wavelength dispersion (R450 / R550) is out of this range, the wavelength dependence of the hue becomes large, optical compensation is not performed at all wavelengths in the visible region, and light passes through the polarizing plate and the display device. This causes problems such as coloring and deterioration of contrast.
[用途]
本発明の透明フィルムの用途には特に制限はないが、耐熱性、光学特性、溶融加工性等の物性に優れるという特長を生かして、各種の液晶用ディスプレイ機器やモバイル機器等に用いられる位相差フィルム等の光学フィルムに好適である。
[Use]
The use of the transparent film of the present invention is not particularly limited, but the phase difference used in various liquid crystal display devices, mobile devices, etc., by taking advantage of its excellent physical properties such as heat resistance, optical properties, and melt processability. It is suitable for optical films such as films.
例えば、本発明の透明フィルムを延伸して得られる本発明の前記位相差フィルムは、公知の偏光フィルムと積層貼合し、所望の寸法に切断することにより円偏光板となる。かかる円偏光板は、例えば、各種ディスプレイ(液晶表示装置、有機EL表示装置、プラズマ表示装置、FED電界放出表示装置、SED表面電界表示装置)の視野角補償用、外光の反射防止用、色補償用、直線偏光の円偏光への変換用等に用いることができる For example, the retardation film of the present invention obtained by stretching the transparent film of the present invention is laminated and laminated with a known polarizing film and cut to a desired size to form a circular polarizing plate. Such circular polarizing plates are used, for example, for viewing angle compensation of various displays (liquid crystal display device, organic EL display device, plasma display device, FED electric field emission display device, SED surface electric field display device), for preventing reflection of external light, and for color. It can be used for compensation, conversion of linearly polarized light to circular polarization, etc.
以下、実施例、及び比較例により本発明をさらに詳細に説明するが、本発明はその要旨を超えない限り、以下の実施例により限定されるものではない。本発明の樹脂、透明フィルム(未延伸フィルム)及び位相差フィルムの特性評価は次の方法により行った。尚、特性評価手法は以下の方法に限定されるものではなく、当業者が適宜選択することができる。 Hereinafter, the present invention will be described in more detail with reference to Examples and Comparative Examples, but the present invention is not limited to the following Examples as long as the gist of the present invention is not exceeded. The characteristics of the resin, transparent film (unstretched film) and retardation film of the present invention were evaluated by the following methods. The characteristic evaluation method is not limited to the following methods, and can be appropriately selected by those skilled in the art.
(1)還元粘度の測定
樹脂試料を塩化メチレンに溶解させ、精密に0.6g/dLの濃度の樹脂溶液を調製した。森友理化工業社製ウベローデ型粘度管を用いて、温度20.0℃±0.1℃で測定を行い、溶媒の通過時間t0、及び溶液の通過時間tを測定した。得られたt0及びtの値を用いて次式(i)により相対粘度ηrelを求め、さらに、得られた相対粘度ηrelを用いて次式(ii)により比粘度ηspを求めた。
ηrel=t/t0 (i)
ηsp=(η−η0)/η0=ηrel−1 (ii)
その後、得られた比粘度ηspを濃度c[g/dL]で割って、還元粘度ηsp/cを求めた。
(1) Measurement of Reducing Viscosity A resin sample was dissolved in methylene chloride to accurately prepare a resin solution having a concentration of 0.6 g / dL. Using a Ubbelohde viscous tube manufactured by Moriyu Rika Kogyo Co., Ltd., the measurement was carried out at a temperature of 20.0 ° C. ± 0.1 ° C., and the solvent passage time t 0 and the solution passage time t were measured. Using the obtained values of t 0 and t, the relative viscosity η ll was obtained by the following formula (i), and further, the specific viscosity η sp was obtained by the following formula (ii) using the obtained relative viscosity η ll . ..
η rel = t / t 0 (i)
η sp = (η − η 0 ) / η 0 = η rel -1 (ii)
Then, the obtained specific viscosity η sp was divided by the concentration c [g / dL] to obtain the reduced viscosity η sp / c.
(2)溶融粘度の測定
ペレット状の樹脂試料を90℃で5時間以上、真空乾燥させた。乾燥したペレットを用いて、(株)東洋精機製作所製キャピラリーレオメーターで測定を行った。測定温度は240℃とし、剪断速度9.12〜1824sec−1間で溶融粘度を測定し、91.2sec−1における溶融粘度の値を用いた。尚、オリフィスには、ダイス径がφ1mm×10mmLのものを用いた。
(2) Measurement of melt viscosity A pellet-shaped resin sample was vacuum-dried at 90 ° C. for 5 hours or more. The dried pellets were measured with a capillary rheometer manufactured by Toyo Seiki Seisakusho Co., Ltd. Measurement temperature was 240 ° C., measured melt viscosity between shear rate 9.12~1824sec -1, using a value of melt viscosity at 91.2sec -1. The orifice having a die diameter of φ1 mm × 10 mm L was used.
(3)ガラス転移温度(Tg)の測定
エスアイアイ・ナノテクノロジー社製示差走査熱量計DSC6220を用いて測定した。約10mgの樹脂試料を同社製アルミパンに入れて密封し、50mL/分の窒素気流下、昇温速度20℃/分で30℃から250℃まで昇温した。3分間温度を保持した後、30℃まで20℃/分の速度で冷却した。30℃で3分保持し、再び200℃まで20℃/分の速度で昇温した。2回目の昇温で得られたDSCデータより、低温側のベースラインを高温側に延長した直線と、ガラス転移の階段状変化部分の曲線の勾配が最大になるような点で引いた接線との交点の温度である、補外ガラス転移開始温度を求め、それをガラス転移温度とした。高いガラス転移温度を有する樹脂は、耐熱性の観点で優れている。
(3) Measurement of glass transition temperature (Tg) The measurement was performed using a differential scanning calorimeter DSC6220 manufactured by SII Nanotechnology. About 10 mg of a resin sample was placed in an aluminum pan manufactured by the same company, sealed, and heated from 30 ° C. to 250 ° C. at a heating rate of 20 ° C./min under a nitrogen stream of 50 mL / min. After maintaining the temperature for 3 minutes, it was cooled to 30 ° C. at a rate of 20 ° C./min. The temperature was maintained at 30 ° C. for 3 minutes, and the temperature was raised again to 200 ° C. at a rate of 20 ° C./min. From the DSC data obtained by the second temperature rise, a straight line extending the baseline on the low temperature side to the high temperature side and a tangent line drawn at the point where the slope of the curve of the stepwise change part of the glass transition is maximized. The temperature at which the outer glass transition started, which is the temperature at the intersection of the above, was determined and used as the glass transition temperature. A resin having a high glass transition temperature is excellent in terms of heat resistance.
(4)ポリカーボネート樹脂中のモノヒドロキシ化合物、炭酸ジエステルの含有量の測定
樹脂試料約1gを精秤し、塩化メチレン5mLに溶解して溶液とした後、総量が25mLになるようにアセトンを添加して再沈殿処理を行った。次いで、該処理液について液体クロマトグラフィーにより測定した。
用いた装置や条件は、次のとおりである。
・装置:(株)島津製作所製
システムコントローラ:CBM−20A
ポンプ:LC−10AD
カラムオーブン:CTO−10ASvp
検出器:SPD−M20A
分析カラム:Cadenza CD−18 4.6mmφ×250mm
オーブン温度:60℃
・検出波長:220nm
・溶離液:A液:0.1%リン酸水溶液、B液:アセトニトリル
A/B=50/50(vol%)からA/B=0/100(vol%)まで10分間でグラジエント、A/B=0/100(vol%)で5分間保持
・流量:1mL/min
・試料注入量:10μL
樹脂中の各化合物の含有量は、各化合物について、それぞれ濃度を変更した溶液を調製し、上記の液体クロマトグラフィーと同じ条件で測定を行って検量線を作成し、絶対検量線法により算出した。
(4) Measurement of the content of monohydroxy compound and carbonic acid diester in the polycarbonate resin About 1 g of the resin sample is precisely weighed, dissolved in 5 mL of methylene chloride to make a solution, and then acetone is added so that the total amount becomes 25 mL. Was reprecipitated. Then, the treatment liquid was measured by liquid chromatography.
The equipment and conditions used are as follows.
・ Equipment: Shimadzu Corporation System controller: CBM-20A
Pump: LC-10AD
Column oven: CTO-10ASvp
Detector: SPD-M20A
Analytical column: Cadenza CD-18 4.6 mmφ x 250 mm
Oven temperature: 60 ° C
-Detection wavelength: 220 nm
-Eluent: Solution A: 0.1% aqueous phosphoric acid solution, Solution B: acetonitrile A / B = 50/50 (vol%) to A / B = 0/100 (vol%) in 10 minutes, gradient, A / Hold for 5 minutes at B = 0/100 (vol%) ・ Flow rate: 1 mL / min
・ Sample injection amount: 10 μL
The content of each compound in the resin was calculated by preparing a solution in which the concentration was changed for each compound, measuring under the same conditions as the above liquid chromatography to prepare a calibration curve, and using the absolute calibration curve method. ..
(5)未延伸フィルムの成形
90℃で5時間以上、真空乾燥をした樹脂ペレットを、いすず化工機(株)製単軸押出機(スクリュー径25mm、シリンダー設定温度:220℃〜260℃)を用い、Tダイ(幅200mm、設定温度:200〜260℃)から押し出した。押し出したフィルムを、チルロール(設定温度:120〜170℃)により冷却しつつ巻取機でロール状にし、100μmの膜厚の未延伸フィルムを作製した。設定温度は成形する樹脂のガラス転移温度や溶融粘度に応じて、前記設定温度の範囲内で調節した。
(5) Molding of unstretched film Resin pellets that have been vacuum dried at 90 ° C for 5 hours or more are subjected to a single-screw extruder manufactured by Isuzu Kakoki Co., Ltd. (screw diameter 25 mm, cylinder set temperature: 220 ° C to 260 ° C). It was extruded from a T-die (width 200 mm, set temperature: 200 to 260 ° C.). The extruded film was rolled with a winder while being cooled by a chill roll (set temperature: 120 to 170 ° C.) to prepare an unstretched film having a film thickness of 100 μm. The set temperature was adjusted within the range of the set temperature according to the glass transition temperature and the melt viscosity of the resin to be molded.
(6)屈折率の測定
前述の方法で作製した未延伸フィルムから、長さ40mm、幅8mmの長方形の試験片を切り出して測定試料とした。波長589nm(ナトリウムd線)の干渉フィルターを用いて、(株)アタゴ製多波長アッベ屈折率計DR−M4/1550により屈折率(nD)を測定した。測定は界面液としてモノブロモナフタレンを用い、20℃で行った。
(6) Measurement of Refractive Index A rectangular test piece having a length of 40 mm and a width of 8 mm was cut out from the unstretched film prepared by the above method and used as a measurement sample. Using an interference filter of a wavelength 589 nm (sodium d line), a refractive index was measured (n D) by Co. Atago manufactured multi-wavelength Abbe refractometer DR-M4 / 1550. The measurement was carried out at 20 ° C. using monobromonaphthalene as the interface liquid.
(7)全光線透過率の測定
前述の方法で作製した未延伸フィルムについて、日本電色工業(株)製濁度計COH400を用いて全光線透過率を測定した。全光線透過率が高いフィルムは、透明性の観点で優れている。
(7) Measurement of Total Light Transmittance The total light transmittance of the unstretched film produced by the above method was measured using a turbidity meter COH400 manufactured by Nippon Denshoku Kogyo Co., Ltd. A film having a high total light transmittance is excellent in terms of transparency.
(8)光弾性係数の測定
He−Neレーザー、偏光子、補償板、検光子、光検出器からなる複屈折測定装置と振動型粘弾性測定装置(レオロジー社製DVE−3)を組み合わせた装置を用いて、以下の通り測定した(詳細は、日本レオロジー学会誌Vol.19,p93−97(1991)を参照。)。光弾性係数の低い樹脂は、温度変化や湿度変化などによるフィルムの形状変化の、光学特性への影響が小さく、環境に対する性能安定性の観点で優れている。
(8) Measurement of photoelasticity coefficient A device that combines a birefringence measuring device consisting of a He-Ne laser, a polarizer, a compensator, an analyzer, and a photodetector and a viscoelastic measuring device (DVE-3 manufactured by Leology). (For details, refer to Journal of the Japanese Society of Leology, Vol. 19, p93-97 (1991)). A resin having a low photoelastic coefficient has little influence on the optical characteristics of the shape change of the film due to a temperature change or a humidity change, and is excellent in terms of performance stability to the environment.
前述の方法で作製した未延伸フィルムから幅5mm、長さ20mmの試料を切り出し、粘弾性測定装置に固定し、25℃の室温で貯蔵弾性率E’を周波数96Hzにて測定した。同時に、出射されたレーザー光を偏光子、試料、補償板、検光子の順に通し、光検出器(フォトダイオード)で拾い、ロックインアンプを通して角周波数ω又は2ωの波形について、その振幅とひずみに対する位相差を求め、ひずみ光学係数O’を求めた。このとき、偏光子と検光子の方向は直交し、またそれぞれ、試料の伸長方向に対してπ/4の角度をなすように調整した。光弾性係数Cは、貯蔵弾性率E’とひずみ光学係数O’を用いて次式より求めた。
C=O’/E’
A sample having a width of 5 mm and a length of 20 mm was cut out from the unstretched film produced by the above method, fixed to a viscoelasticity measuring device, and the storage elastic modulus E'was measured at a room temperature of 25 ° C. at a frequency of 96 Hz. At the same time, the emitted laser light is passed through a polarizer, a sample, a compensator, and an analyzer in this order, picked up by a photodetector (photon), and passed through a lock-in amplifier with respect to the amplitude and distortion of a waveform with an angular frequency of ω or 2ω. The phase difference was obtained, and the strain optical coefficient O'was obtained. At this time, the directions of the polarizer and the analyzer were adjusted so as to be orthogonal to each other and to form an angle of π / 4 with respect to the extension direction of the sample. The photoelastic coefficient C was obtained from the following equation using the storage elastic modulus E'and the strain optical coefficient O'.
C = O'/ E'
(9)複屈折(Δn)及び波長分散(R450/R550)の測定
前述の方法で作製した未延伸フィルムから幅50mm、長さ125mmのフィルム片を切り出した。バッチ式二軸延伸装置(アイランド工業社製二軸延伸装置BIX−277−AL)を用いて、樹脂のガラス転移温度+15℃の延伸温度、300%/分の延伸速度、及び1.5倍の延伸倍率で前記フィルム片の自由端一軸延伸を行い、位相差フィルムを得た。上記の方法で得られた延伸フィルムの中央部を幅4cm、長さ4cmに切り出し、王子計測機器(株)製位相差測定装置KOBRA−WPRを用いて、測定波長450、500、550、590、630nmで位相差を測定し、波長分散性を測定した。波長分散性は450nmと550nmで測定した位相差R450とR550の比(R450/R550)で示した。R450/R550が1より大きいと波長分散は正であり、1未満では逆波長分散となる。1/4波長板として用いる場合、R450/R550の理想値は0.818である(450/550=0.818)。
(9) Measurement of Birefringence (Δn) and Wavelength Dispersion (R450 / R550) A film piece having a width of 50 mm and a length of 125 mm was cut out from the unstretched film produced by the above method. Using a batch type biaxial stretching device (biaxial stretching device BIX-277-AL manufactured by Island Industry Co., Ltd.), the glass transition temperature of the resin + 15 ° C. stretching temperature, 300% / min stretching rate, and 1.5 times. The free-end uniaxial stretching of the film piece was carried out at a stretching ratio to obtain a retardation film. The central portion of the stretched film obtained by the above method is cut out to a width of 4 cm and a length of 4 cm, and the measurement wavelengths 450, 500, 550, 590 are measured using the phase difference measuring device KOBRA-WPR manufactured by Oji Measuring Instruments Co., Ltd. The phase difference was measured at 630 nm, and the wavelength dispersibility was measured. The wavelength dispersibility was shown by the ratio of the phase difference R450 to R550 (R450 / R550) measured at 450 nm and 550 nm. When R450 / R550 is larger than 1, the wavelength dispersion is positive, and when it is less than 1, the wavelength dispersion is inverse. When used as a 1/4 wave plate, the ideal value of R450 / R550 is 0.818 (450/550 = 0.818).
また、550nmの位相差R550と延伸フィルムの膜厚から、次式より複屈折Δnを求めた。
複屈折=R550[nm]/(フィルム厚み[mm]×106)
今回の測定では、Δnが正の値を有していれば、位相差フィルムとして使用可能である。
Further, the birefringence Δn was obtained from the retardation R550 at 550 nm and the film thickness of the stretched film from the following equation.
Birefringence = R550 [nm] / (film thickness [mm] × 10 6)
In this measurement, if Δn has a positive value, it can be used as a retardation film.
[モノマーの合成例]
<合成例1>
DL−2,3:5,6−ジ−O−シクロヘキシリデン−myo−イノシトール(以下「DCMI」と略記する。)
ジムロートを備えた500mLの反応容器を窒素置換した後、myo−イノシトール30g(167mmol)、DMF200mL、p−トルエンスルホン酸一水和物863mg、ジメトキシシクロヘキサン75mLを投入し、100℃で3時間攪拌した。40℃まで冷却した後、トリエチルアミン2.5mLを加え、反応溶媒であるDMFを減圧留去した。その後酢酸エチル250mLを加え、5%炭酸ナトリウム水溶液300mLで分液を実施した後、イオン交換水300mLで1回洗浄した。得られた有機相を減圧留去し、酢酸エチル50mL/n−ヘキサン70mLで晶析を実施し、得られた白色沈殿を濾過した。その後再び酢酸エチル50mL/n−ヘキサン70mLで晶析を実施した。得られた固体を60℃で真空乾燥5時間実施することで、目的化合物であるDCMIを9.8g(収率17.2%)得た。
[Example of Monomer Synthesis]
<Synthesis example 1>
DL-2, 3: 5,6-di-O-cyclohexylidene-myo-inositol (hereinafter abbreviated as "DCMI")
After nitrogen substitution of a 500 mL reaction vessel equipped with a Dimroth condenser, 30 g (167 mmol) of myo-inositol, 200 mL of DMF, 863 mg of p-toluenesulfonic acid monohydrate, and 75 mL of dimethoxycyclohexane were added, and the mixture was stirred at 100 ° C. for 3 hours. After cooling to 40 ° C., 2.5 mL of triethylamine was added, and DMF as a reaction solvent was distilled off under reduced pressure. Then, 250 mL of ethyl acetate was added, and the solution was separated with 300 mL of a 5% sodium carbonate aqueous solution, and then washed once with 300 mL of ion-exchanged water. The obtained organic phase was distilled off under reduced pressure, crystallization was carried out with 50 mL of ethyl acetate / 70 mL of n-hexane, and the obtained white precipitate was filtered. Then, crystallization was performed again with 50 mL of ethyl acetate / 70 mL of n-hexane. The obtained solid was vacuum dried at 60 ° C. for 5 hours to obtain 9.8 g (yield 17.2%) of DCMI, which is the target compound.
[合成例2]
ビス[9−(2−フェノキシカルボニルエチル)フルオレン−9−イル]メタン(以下「BPFM」と略記する。)
WO2014−061677に記載の方法で、BPFMを合成した。
[Synthesis Example 2]
Bis [9- (2-phenoxycarbonylethyl) fluorene-9-yl] methane (hereinafter abbreviated as "BPFM")
BPFM was synthesized by the method described in WO2014-061677.
[ポリカーボネート樹脂の合成例、及び特性評価]
以下の実施例、及び比較例で用いた化合物の略号等は以下の通りである。
・DCMI:DL−2,3:5,6−ジ−O−シクロヘキシリデン−myo−イノシトール
・ISB:イソソルビド(ロケットフルーレ社製、商品名:POLYSORB)
・CHDM:1,4−シクロヘキサンジメタノール(シス、トランス混合物、SKケミカル社製)
・BPA:2,2−ビス[4−ヒドロキシフェニル]プロパン(三菱化学(株)製)
・BHEPF:9,9−ビス[4−(2−ヒドロキシエトキシ)フェニル]−フルオレン(大阪ガスケミカル(株)製)
・BisZ:1,1−ビス(4−ヒドロキシフェニル)シクロヘキサン(本州化学工業(株)製)
・BPFM:ビス[9−(2−フェノキシカルボニルエチル)フルオレン−9−イル]メタン
・DPC:ジフェニルカーボネート(三菱化学(株)製)
[Polycarbonate resin synthesis example and characteristic evaluation]
The abbreviations and the like of the compounds used in the following examples and comparative examples are as follows.
-DCMI: DL-2, 3: 5,6-di-O-cyclohexylidene-myo-inositol-ISB: Isosorbide (manufactured by Rocket Foil, trade name: POLYSORB)
CHDM: 1,4-Cyclohexanedimethanol (cis, trans mixture, manufactured by SK Chemical Co., Ltd.)
・ BPA: 2,2-bis [4-hydroxyphenyl] propane (manufactured by Mitsubishi Chemical Corporation)
-BHEPF: 9,9-bis [4- (2-hydroxyethoxy) phenyl] -fluorene (manufactured by Osaka Gas Chemical Co., Ltd.)
・ BisZ: 1,1-bis (4-hydroxyphenyl) cyclohexane (manufactured by Honshu Chemical Industry Co., Ltd.)
-BPFM: Bis [9- (2-phenoxycarbonylethyl) fluorene-9-yl] Methane-DPC: Diphenyl carbonate (manufactured by Mitsubishi Chemical Corporation)
各原料化合物の構造式を以下に示す。 The structural formula of each raw material compound is shown below.
[実施例1]
DCMI 18.58重量部(0.055mol)、ISB 42.45重量部(0.2908mol)、CHDM 25.42重量部(0.176mol)、DPC 112.79重量部(0.527mol)、及び触媒として酢酸カルシウム1水和物4.59×10−4重量部(2.61×10−6mol)を反応器に投入し、反応装置内を減圧窒素置換した。窒素雰囲気下、150℃で約10分間、攪拌しながら原料を溶解させた。反応1段目の工程として220℃まで30分かけて昇温し、60分間常圧にて反応した。次いで圧力を常圧から13.3kPaまで90分かけて減圧し、13.3kPaで30分間保持し、発生するフェノールを反応系外へ抜き出した。次いで反応2段目の工程として熱媒温度を15分かけて240℃まで昇温しながら、圧力を0.10kPa以下まで15分かけて減圧し、発生するフェノールを反応系外へ抜き出した。所定の撹拌トルクに到達後、窒素で常圧まで復圧して反応を停止し、生成したポリカーボネート樹脂を水中に押し出し、ストランドをカッティングしてペレットを得た。得られたポリカーボネート樹脂のペレットを用いて、前述の各種評価を行った。評価結果を表1に示す。
[Example 1]
DCMI 18.58 parts by weight (0.055 mol), ISB 42.45 parts by weight (0.2908 mol), CHDM 25.42 parts by weight (0.176 mol), DPC 112.79 parts by weight (0.527 mol), and catalyst As a result, 4.59 × 10 -4 parts by weight (2.61 × 10-6 mol) of calcium acetate monohydrate was charged into the reactor, and the inside of the reactor was replaced with nitrogen under reduced pressure. The raw material was dissolved with stirring at 150 ° C. for about 10 minutes in a nitrogen atmosphere. As the first step of the reaction, the temperature was raised to 220 ° C. over 30 minutes, and the reaction was carried out at normal pressure for 60 minutes. Then, the pressure was reduced from normal pressure to 13.3 kPa over 90 minutes, held at 13.3 kPa for 30 minutes, and the generated phenol was extracted from the reaction system. Then, as the second step of the reaction, the heat medium temperature was raised to 240 ° C. over 15 minutes, the pressure was reduced to 0.10 kPa or less over 15 minutes, and the generated phenol was extracted from the reaction system. After reaching a predetermined stirring torque, the pressure was restored to normal pressure with nitrogen to stop the reaction, the produced polycarbonate resin was extruded into water, and the strands were cut to obtain pellets. The above-mentioned various evaluations were carried out using the obtained polycarbonate resin pellets. The evaluation results are shown in Table 1.
このポリカーボネート樹脂の波長分散はフラットな特性を示した。比較例1と比較して、低い屈折率、低い光弾性係数、高い全光線透過率を有しながら、同時に耐熱性(ガラス転移温度)を向上させることができた。 The wavelength dispersion of this polycarbonate resin showed flat characteristics. Compared with Comparative Example 1, it was possible to improve the heat resistance (glass transition temperature) at the same time while having a low refractive index, a low photoelastic coefficient, and a high total light transmittance.
<参考例1>
最終重合温度を270℃に変更した以外、実施例1と同様に重合反応を行ったところ、反応の終盤で樹脂が撹拌軸に巻き付き、溶融樹脂を抜き出すことができなかった。少量採取した樹脂に塩化メチレンを加えると、不溶成分が生成しており、ポリマーがゲル化していることが分かった。本発明の構造(1)〜(3)は過度に高温で反応を行うと、分解し、架橋成分が生成することが考えられる。
<Reference example 1>
When the polymerization reaction was carried out in the same manner as in Example 1 except that the final polymerization temperature was changed to 270 ° C., the resin was wound around the stirring shaft at the end of the reaction, and the molten resin could not be extracted. When methylene chloride was added to the resin collected in a small amount, it was found that an insoluble component was generated and the polymer was gelled. It is considered that the structures (1) to (3) of the present invention are decomposed to form a crosslinked component when the reaction is carried out at an excessively high temperature.
<比較例1>
ISB 42.45重量部(0.290mol)、BPA 17.96重量部(0.079mol)、CHDM 25.42重量部(0.176mol)、DPC 119.17重量部(0.556mol)、及び触媒として酢酸カルシウム1水和物9.61×10−4重量部(5.45×10−6mol)を用いた以外は実施例1と同様に重合反応を行い、ポリカーボネート樹脂のペレットを得た。得られたポリカーボネート樹脂のペレットを用いて、前述の各種評価を行った。評価結果を表1に示す。
<Comparative example 1>
ISB 42.45 parts by weight (0.290 mol), BPA 17.96 parts by weight (0.079 mol), CHDM 25.42 parts by weight (0.176 mol), DPC 119.17 parts by weight (0.556 mol), and catalyst The polymerization reaction was carried out in the same manner as in Example 1 except that 9.61 × 10 -4 parts by weight (5.45 × 10 -6 mol) of calcium acetate monohydrate was used as a mixture to obtain pellets of polycarbonate resin. The above-mentioned various evaluations were carried out using the obtained polycarbonate resin pellets. The evaluation results are shown in Table 1.
<実施例2>
DCMI 10.06重量部(0.030mol)、ISB 60.17重量部(0.412mol)、BPFM 27.49重量部(0.043mol)、DPC 85.34重量部(0.398mol)、及び触媒として酢酸カルシウム1水和物1.55×10−3重量部(8.83×10−6mol)を用い、最終重合温度を250℃とした以外は実施例1と同様に重合反応を行い、ポリカーボネート樹脂のペレットを得た。得られたポリカーボネート樹脂のペレットを用いて、前述の各種評価を行った。評価結果を表2に示す。
<Example 2>
DCMI 10.06 parts by weight (0.030 mol), ISB 60.17 parts by weight (0.412 mol), BPFM 27.49 parts by weight (0.043 mol), DPC 85.34 parts by weight (0.398 mol), and catalyst As a result, 1.55 × 10 -3 parts by weight (8.83 × 10 -6 mol) of calcium acetate monohydrate was used, and the polymerization reaction was carried out in the same manner as in Example 1 except that the final polymerization temperature was 250 ° C. Pellets of polycarbonate resin were obtained. The above-mentioned various evaluations were carried out using the obtained polycarbonate resin pellets. The evaluation results are shown in Table 2.
このポリカーボネート樹脂の波長分散は逆波長分散性を示した。比較例2、3と比較して、低い屈折率、低い光弾性係数、高い全光線透過率を有しながら、同時に耐熱性(ガラス転移温度)を向上させることができた。 The wavelength dispersion of this polycarbonate resin showed reverse wavelength dispersion. Compared with Comparative Examples 2 and 3, the heat resistance (glass transition temperature) could be improved at the same time while having a low refractive index, a low photoelastic coefficient, and a high total light transmittance.
<比較例2>
ISB 64.27重量部(0.440mol)、BPFM 36.51重量部(0.057mol)、DPC 81.52重量部(0.381mol)、及び触媒として酢酸カルシウム1水和物7.75×10−4重量部(4.40×10−6mol)を用いた以外は実施例2と同様に重合反応を行い、ポリエステルカーボネート樹脂のペレットを得た。得られたポリエステルカーボネート樹脂のペレットを用いて、前述の各種評価を行った。評価結果を表2に示す。
<Comparative example 2>
ISB 64.27 parts by weight (0.440 mol), BPFM 36.51 parts by weight (0.057 mol), DPC 81.52 parts by weight (0.381 mol), and calcium acetate monohydrate 7.75 × 10 as catalyst A polymerization reaction was carried out in the same manner as in Example 2 except that -4 parts by weight (4.40 × 10 -6 mol) was used to obtain pellets of polyester carbonate resin. The above-mentioned various evaluations were performed using the obtained pellets of the polyester carbonate resin. The evaluation results are shown in Table 2.
<比較例3>
ISB 45.42重量部(0.311mol)、BPFM 36.65重量部(0.057mol)、BisZ 20.15重量部(0.075mol)、DPC 70.41重量部(0.329mol)、及び触媒として酢酸カルシウム1水和物6.80×10−4重量部(3.86×10−6mol)を用いた以外は実施例2と同様に重合反応を行い、ポリエステルカーボネート樹脂のペレットを得た。得られたポリエステルカーボネート樹脂のペレットを用いて、前述の各種評価を行った。評価結果を表2に示す。
<Comparative example 3>
ISB 45.42 parts by weight (0.311 mol), BPFM 36.65 parts by weight (0.057 mol), BisZ 20.15 parts by weight (0.075 mol), DPC 70.41 parts by weight (0.329 mol), and catalyst The polymerization reaction was carried out in the same manner as in Example 2 except that 6.80 × 10 -4 parts by weight (3.86 × 10 -6 mol) of calcium acetate monohydrate was used as a mixture to obtain pellets of polyester carbonate resin. .. The above-mentioned various evaluations were performed using the obtained pellets of the polyester carbonate resin. The evaluation results are shown in Table 2.
<実施例3>
DCMI 9.29重量部(0.027mol)、ISB 22.92重量部(0.157mol)、BHEPF 59.47重量部(0.136mol)、DPC 68.50重量部(0.320mol)、及び触媒として酢酸カルシウム1水和物1.69×10−3重量部(9.59×10−6mol)を用いた以外は実施例2と同様に重合反応を行い、ポリカーボネート樹脂のペレットを得た。得られたポリカーボネート樹脂のペレットを用いて、前述の各種評価を行った。評価結果を表2に示す。
<Example 3>
DCMI 9.29 parts by weight (0.027 mol), ISB 22.92 parts by weight (0.157 mol), BHEPF 59.47 parts by weight (0.136 mol), DPC 68.50 parts by weight (0.320 mol), and catalyst The polymerization reaction was carried out in the same manner as in Example 2 except that 1.69 × 10 -3 parts by weight (9.59 × 10 -6 mol) of calcium acetate monohydrate was used as a polycarbonate resin pellet. The above-mentioned various evaluations were carried out using the obtained polycarbonate resin pellets. The evaluation results are shown in Table 2.
このポリカーボネート樹脂の波長分散は逆波長分散性を示した。比較例4、5と比較して、低い屈折率、低い光弾性係数、高い全光線透過率を有しながら、同時に耐熱性(ガラス転移温度)を向上させることができた。 The wavelength dispersion of this polycarbonate resin showed reverse wavelength dispersion. Compared with Comparative Examples 4 and 5, the heat resistance (glass transition temperature) could be improved at the same time while having a low refractive index, a low photoelastic coefficient, and a high total light transmittance.
<比較例4>
ISB 31.41重量部(0.215mol)、BHEPF 59.47重量部(0.136mol)、DPC 75.85(0.354mol)、及び触媒として酢酸カルシウム1水和物1.24×10−3重量部(7.01×10−6mol)を用いた以外は実施例2と同様に重合反応を行い、ポリカーボネート樹脂のペレットを得た。得られたポリカーボネート樹脂のペレットを用いて、前述の各種評価を行った。評価結果を表2に示す。
<Comparative example 4>
ISB 31.41 parts by weight (0.215 mol), BHEPF 59.47 parts by weight (0.136 mol), DPC 75.85 (0.354 mol), and calcium acetate monohydrate 1.24 × 10 -3 as a catalyst. A polymerization reaction was carried out in the same manner as in Example 2 except that parts by weight (7.01 × 10-6 mol) were used to obtain pellets of polycarbonate resin. The above-mentioned various evaluations were carried out using the obtained polycarbonate resin pellets. The evaluation results are shown in Table 2.
<比較例5>
BHEPF 80.49質量部(0.184mol)、BPA 13.23質量部(0.058mol)、DPC 53.29質量部(0.249mol)、及び触媒として酢酸カルシウム1水和物2.13×10−3質量部(1.21×10−5mol)を用い、最終重合温度を260℃とした以外は実施例2と同様に重合反応を行い、ポリカーボネート樹脂のペレットを得た。得られたポリカーボネート樹脂のペレットを用いて、前述の各種評価を行った。評価結果を表2に示す。
<Comparative example 5>
BHEPF 80.49 parts by mass (0.184 mol), BPA 13.23 parts by mass (0.058 mol), DPC 53.29 parts by mass (0.249 mol), and calcium acetate monohydrate 2.13 × 10 as a catalyst Using -3 parts by mass (1.21 × 10-5 mol), the polymerization reaction was carried out in the same manner as in Example 2 except that the final polymerization temperature was set to 260 ° C. to obtain pellets of polycarbonate resin. The above-mentioned various evaluations were carried out using the obtained polycarbonate resin pellets. The evaluation results are shown in Table 2.
Claims (15)
樹脂を構成する全ての構造単位、及び連結基の重量の合計量を100重量%とした際に、下記式(1)〜(3)のいずれかで表される構造単位を1重量%以上、70重量%以下、下記式(5)で表される構造単位を1重量%以上、70重量%以下含有し、
該樹脂から作成された延伸フィルムの、波長450nmにおける位相差(R450)と波長550nmにおける位相差(R550)との比である波長分散(R450/R550)の値が0.50以上、1.03以下であるポリカーボネート樹脂。
When the total weight of all the structural units constituting the resin and the linking group is 100% by weight, the structural unit represented by any of the following formulas (1) to (3) is 1% by weight or more. Contains 70% by weight or less and 1% by weight or more and 70% by weight or less of the structural unit represented by the following formula (5).
The value of the wavelength dispersion (R450 / R550), which is the ratio of the phase difference (R450) at a wavelength of 450 nm and the phase difference (R550) at a wavelength of 550 nm, of the stretched film made from the resin is 0.50 or more, 1.03. The following polycarbonate resin.
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