JP6799046B2 - Coating method and coating equipment - Google Patents

Description

The present invention relates to a pattern correction device and a pattern correction method, and more particularly to a technique for repairing a broken portion of a wiring pattern formed on a substrate.

The pattern processing technology using a coating needle with a tip diameter of several tens of μm and a laser beam with a spot diameter of several μm to several tens of μm can be combined with precision positioning technology on the order of micrometers to position even a fine pattern at a predetermined position. Since it can be processed accurately, it has been conventionally used for repairing flat panel displays, scribing solar cells, and the like (see, for example, Patent Documents 1 to 3). In particular, the processing technique using a coating needle can be applied to a highly viscous paste, which the dispenser is not good at, and has recently been used for forming a film having a thickness of 10 μm or more as compared with a flat panel display. For example, it is used for forming electronic circuit patterns and printed circuit board wiring of semiconductor devices such as MEMS and sensors. In addition, patterns produced by printed electronics technology, which is a promising manufacturing technology in the future, are also classified as thick films, and are processing technologies that are expected to expand their applications in the future.

Japanese Unexamined Patent Publication No. 2007-23329 JP-A-2009-122259 Japanese Unexamined Patent Publication No. 2012-6077

In the above-mentioned microfabrication, in order to improve the processing quality, streamline the work, and unify the work contents, automation of the processing work by using image processing is being promoted. For example, in Japanese Patent Application Laid-Open No. 2009-122259 (Patent Document 2), as a method for correcting a defective portion of a color filter substrate of a liquid crystal display, a correction ink adhering to the tip of a coating needle is applied to the defective portion to correct the defect. The method of doing so is disclosed. Patent Document 1 employs a method of observing the state of the applied ink using an observation optical system and inspecting the quality of the processed portion based on the image observed by the observation optical system.

As a method for correcting defects in a color filter substrate, Japanese Patent Application Laid-Open No. 2007-233299 (Patent Document 1) describes the brightness of pixels to be detected in defects and pixels other than pixels to be detected in defects in an image obtained by photographing the color filter substrate. A method of detecting a defect of a pixel to be detected as a defect based on the comparison result is disclosed. In Patent Document 1, the defective portion detected by the above method is filled with the ink by applying ink to the defective portion.

Generally, the film thickness of the pattern formed on the color filter substrate is about 1 μm or less. Therefore, although it depends on the viscosity of the ink, there is little need to laminate and apply the ink to the defective portion, and usually, it is sufficient to apply the ink to the defective portion only once.

However, when a thick film of 10 μm or more is formed as in the case of printed circuit board wiring, the broken portion, which is a defective portion generated in the wiring pattern, also has a three-dimensional shape from a planar shape. Therefore, in order to fill the broken portion with ink, it is necessary to laminate and apply ink on the defective portion. As a result, as the film becomes thicker, the work content of microfabrication becomes more complicated, and it is difficult to promote the automation of the processing work.

The present invention has been made to solve such a problem, and an object of the present invention is to provide a pattern correction device and a pattern correction method capable of accurately and easily correcting a broken portion of a thick film wiring pattern. It is to be.

The coating method according to the present invention is a coating method in a coating apparatus for coating a liquid material on a substrate. The coating device has a coating mechanism having a coating needle and a stage for moving the coating mechanism relative to the substrate in the vertical and horizontal directions. The coating method is a step of moving the coating mechanism relative to the substrate in the direction perpendicular to the substrate by driving the stage and a step of coating the liquid material by bringing the liquid material attached to the tip of the coating needle into contact with the coating position. And. In the coating method, the liquid material is laminated and coated on the substrate by repeatedly executing the step of moving the coating mechanism relative to the substrate in the direction perpendicular to the substrate and the step of coating the liquid material .

Preferably, the coating device separates the lighting device that outputs white light and the white light emitted from the lighting device into two luminous fluxes, irradiates the surface of the liquid material on the substrate with one, and refers to the other. It further has an objective lens for irradiating the light and interfering with the reflected light from both sides to obtain interference light, and an imaging device for photographing the interference light. The stage is configured to move the objective lens and coating mechanism relative to the substrate in the vertical and horizontal directions. The coating method is a step of taking an image with an imaging device while moving the objective lens in the direction perpendicular to the substrate and measuring the three-dimensional shape of the surface of the liquid material on the substrate based on the taken image. A step of calculating a three-dimensional coating position for coating the liquid material on the liquid material on the substrate based on the three-dimensional shape of the surface of the liquid material on the substrate is further provided. The step of moving the coating mechanism relative to the substrate in the vertical direction includes a step of moving the coating mechanism to the calculated three-dimensional coating position. The step of applying the liquid material includes a step of applying the liquid material by bringing the tip of the coating needle into contact with the calculated three-dimensional coating position. The coating method includes a step of measuring the three-dimensional shape of the surface of the liquid material on the substrate, a step of calculating the coating position on the three dimensions, a step of moving the coating mechanism to the coating position on the three dimensions, and a liquid material. By repeating the steps of applying the above in this order, the liquid material is laminated and applied on the substrate .

The coating device according to the present invention is a coating device for coating a liquid material on a substrate, and includes a coating mechanism having a coating needle, a stage for moving the coating mechanism relative to the substrate in the vertical and horizontal directions, and the like. It is provided with a control device for controlling the stage and the coating mechanism. The control device is configured to apply the liquid material by moving the coating mechanism relative to the substrate in the direction perpendicular to the substrate by driving the stage and bringing the liquid material attached to the tip of the coating needle into contact with the coating position. Will be done. The control device repeatedly executes the step of moving the coating mechanism relative to the substrate in the direction perpendicular to the substrate and the step of applying the liquid material, thereby laminating and coating the liquid material on the substrate .

According to the present invention, it is possible to provide a pattern correction device and a pattern correction method capable of accurately and easily correcting a broken portion of a thick film wiring pattern.

It is a perspective view which shows the whole structure of the defect correction apparatus which is a typical example of the height measuring apparatus according to Embodiment 1 of this invention. It is a perspective view which shows the main part of the observation optical system and the ink application mechanism. It is a figure which looked at the main part from the A direction of FIG. 2, and is the figure which shows the ink application operation. It is a flowchart which shows the pattern correction process. It is a partial plan view which shows typically the wiring pattern formed on the surface of a substrate. It is a layout drawing of the optical element of the observation optical system when a Mirau type interference objective lens is used as an objective lens. It is a figure which shows the height detection method of the pixel using the Mirau type interference objective lens shown in FIG. It is a block diagram which shows the control structure for executing a substrate shape measurement process. It is a figure which shows the inspection condition of the ink application part applied by the ink application mechanism shown in FIG. It is a schematic diagram which shows an enlarged example of a disconnection part. It is a figure which plotted the height difference of each pixel located in a rectangular area. It is a figure which shows the coating pitch in an ink coating process.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The same or corresponding parts in the drawings are designated by the same reference numerals, and the description thereof will not be repeated.

[Embodiment 1]
[Configuration of pattern correction device]
FIG. 1 is a perspective view showing the overall configuration of the pattern correction device 1 according to the embodiment of the present invention.

With reference to FIG. 1, the pattern correction device 1 includes a correction head unit including an observation optical system 2, a CCD camera 3 (imaging device), a cutting laser device 4, an ink coating mechanism 5, and an ink curing light source 6. The Z stage 8 for moving the correction head portion in the direction perpendicular to the correction target substrate 7 (Z-axis direction), the X stage 9 for mounting the Z stage 8 and moving the correction head portion in the X-axis direction, and the substrate 7. A Y stage 10 that is mounted and moved in the Y-axis direction, a control computer 11 (control device) that controls the operation of the entire device, a monitor 12 that displays an image taken by the CCD camera 3, and a control device. The computer 11 is provided with an operation panel 13 for inputting a command from an operator.

The observation optical system 2 includes a light source for illumination, and observes the surface state of the substrate 7 and the state of the correction ink (liquid material) applied by the ink application mechanism 5. The image observed by the observation optical system 2 is converted into an electric signal by the CCD camera 3 and displayed on the monitor 12. The cutting laser device 4 irradiates an unnecessary portion on the substrate 7 with a laser beam via the observation optical system 2 to remove the unnecessary portion.

The ink application mechanism 5 applies correction ink to the broken portion generated in the wiring pattern formed on the substrate 7 to correct the wire. The ink curing light source 6 includes, for example, a CO ₂ laser, and irradiates the ink coated by the ink coating mechanism 5 with a laser beam to cure the ink.

This device configuration is an example. For example, the Z stage 8 equipped with the observation optical system 2 or the like is mounted on the X stage, the X stage is mounted on the Y stage, and the Z stage 8 can be moved in the XY directions. A configuration called a gantry method may be used, and any configuration may be used as long as the Z stage 8 on which the observation optical system 2 or the like is mounted can be moved relative to the substrate 7 to be modified in the XY directions.

Next, an example of an ink coating mechanism using a plurality of coating needles will be described. FIG. 2 is a perspective view showing a main part of the observation optical system 2 and the ink coating mechanism 5. With reference to FIG. 2, the pattern correction device 1 includes a movable plate 15, a plurality of objective lenses 16 having different magnifications (for example, 5 lenses), and a plurality of objective lenses 16 for applying inks of different colors (for example, 5 lenses). It includes a coating unit 17.

The movable plate 15 is provided so as to be movable in the X-axis direction and the Y-axis direction between the lower end of the observation lens barrel 2a of the observation optical system 2 and the substrate 7. Further, for example, five through holes 15a are formed in the movable plate 15.

The objective lenses 16 are fixed to the lower surface of the movable plate 15 at predetermined intervals in the Y-axis direction so as to correspond to the through holes 15a. The five coating units 17 are arranged adjacent to each of the five objective lenses 16. By moving the movable plate 15, the desired coating unit 17 can be arranged above the disconnection portion to be corrected.

3 (a) to 3 (c) are views of the main part viewed from the direction A of FIG. 2, and are views showing the ink application operation. The coating unit 17 includes a coating needle 18 and an ink tank 19. First, as shown in FIG. 3A, the coating needle 18 of the desired coating unit 17 is positioned above the disconnection portion to be corrected. At this time, the tip of the coating needle 18 is immersed in the ink in the ink tank 19.

Next, as shown in FIG. 3B, the coating needle 18 is lowered to project the tip of the coating needle 18 from the hole at the bottom of the ink tank 19. At this time, ink is attached to the tip of the coating needle 18. Next, as shown in FIG. 3C, the coating needle 18 and the ink tank 19 are lowered to bring the tip of the coating needle 18 into contact with the broken portion, and ink is applied to the broken portion. After that, the state returns to the state shown in FIG. 3 (a).

Since various other techniques are known for the ink coating mechanism using a plurality of coating needles, detailed description thereof will be omitted. For example, it is shown in Patent Document 2. By using a mechanism as shown in FIG. 2, for example, as the ink application mechanism 5, the pattern correction device 1 can correct a broken portion by using an ink of a desired color among a plurality of inks, and a plurality of inks. The broken portion can be corrected by using a coating needle having a desired coating diameter among the coating needles of the above.

[Pattern correction process]
Next, an outline of the pattern correction process executed by using the pattern correction device 1 shown in FIG. 1 will be described.

FIG. 4 is a flowchart showing the pattern correction process. With reference to FIG. 4, the pattern correction steps include a substrate shape measuring step (step S10), a disconnection portion shape detecting step (step S20), a coating position calculation step (step S50), and an ink coating step (step S60). And a drying step (step S70).

In the substrate shape measuring step (step S10), the three-dimensional shape of the surface of the substrate 7 is measured. In the substrate shape measuring step, the three-dimensional shape of the wiring pattern formed on the surface of the substrate 7 can be measured.

In the disconnection portion shape detection step (step S20), the three-dimensional disconnection portion generated in the wiring pattern is based on the data indicating the three-dimensional shape of the surface of the substrate 7 measured in the substrate shape measurement step (step S10). The shape is detected.

In step S30, it is determined whether or not it is necessary to correct the broken wire based on the detection result in the broken wire shape detecting step (step S20). Specifically, when the disconnection portion is not detected in the wiring pattern in the disconnection portion shape detection step (step S20), it is determined that the correction of the disconnection portion is unnecessary (NO determination in step S30). If the process returns to step S30 after performing the ink application step (step S60) described later and it is determined that the disconnection portion does not need to be corrected, it is determined that the ink filling into the disconnection portion is completed. The process proceeds to a drying step (step S70) for drying the ink.

On the other hand, when the disconnection portion is detected in the wiring pattern in the disconnection portion shape detection step (step S20), it is determined that the disconnection portion needs to be corrected (YES determination in step S30). In this case, it is further determined whether or not the disconnection portion can be corrected (step S40). Specifically, after the ink application step (step S60) is repeated a predetermined number of times, it is determined in step S30 that the filling of the broken portion with ink has not been completed (when the YES determination in step S30 is determined). ), It is determined that the disconnection portion cannot be corrected.

On the other hand, when it is determined that the disconnection portion can be corrected (when YES is determined in step S40), the coating position calculation step (step S50) is performed. In the coating position calculation step (step S50), the position to apply the ink is calculated based on the data indicating the three-dimensional shape of the disconnection portion detected in the disconnection portion shape detection step (step S20).

In the ink coating step (step S60), ink is applied to the surface of the substrate 7 by controlling the ink coating mechanism 5 according to the ink coating position calculated in the coating position calculation step (step S50). After the ink coating step (step S60) is performed, the process returns to the substrate shape measuring step (step S10) to measure the three-dimensional shape of the surface of the substrate 7 after the disconnection portion is corrected. Further, the process proceeds to the disconnection portion shape detection step (step S20), and the three-dimensional shape of the disconnection portion is detected based on the three-dimensional shape of the surface of the substrate 7. From the detection result of the three-dimensional shape of the broken part, when it is determined that the filling of the broken part with ink is completed by the above ink application step (step S60) and the correction of the broken part is unnecessary (NO in step S30). At the time of determination), a drying step (step S70) is carried out. On the other hand, when it is determined that the wiring pattern needs to be corrected (when YES is determined in step S30), the coating position calculation step (step S50) and the ink coating step (step S60) are performed again.

Hereinafter, details of each step included in the pattern correction step shown in FIG. 4 will be described.
[Substrate shape measurement process]
In the substrate shape measuring step (step S10 in FIG. 4), the control computer 11 controls the pattern correction device 1 and measures the three-dimensional shape of the surface of the substrate 7. FIG. 5 is a partial plan view schematically showing a wiring pattern formed on the surface of the substrate 7. In FIG. 5, a wiring portion normally formed on the surface of the substrate 7 (hereinafter, also referred to as a “normal wiring portion”) and a wiring portion in which a partially disconnected portion (region RGN in the drawing) is generated are shown. It is shown schematically.

In the substrate shape measuring step, the surface of the substrate 7 is set as the XY coordinate system, and a plurality of measurement points are set in a matrix in the XY coordinate system. Then, the three-dimensional shape of the surface of the substrate 7 is measured by detecting the height in the Z-axis direction for each of the set plurality of measurement points. Hereinafter, a method of detecting the height of each measurement point in the Z-axis direction will be described.

In this height detection method, a two-luminous flux interference objective lens is used for the objective lens 16. Taking advantage of the fact that the intensity of the interference light at the focal position is maximized in the two-luminous flux interference objective lens, an image of the interference light is taken while moving the Z stage 8 relative to the substrate 7, and the interference light is captured for each pixel. The Z stage position where the intensity is maximized is obtained, and that position is defined as the height of the pixel. This height measuring method is suitable for detecting a minute height of several μm or less.

The biluminous interference objective lens separates the white light emitted from the light source into two luminous fluxes and irradiates the surface of the object with one of them, and irradiates the reference surface with the other to reflect the light reflected from the surface of the object. And the reflected light from the reference surface interfere with each other. In the present embodiment, the Mirau type interference objective lens is used, but a Michelson type or Linique type interference objective lens may be used.

Further, it is preferable to use a white light source as the light source. When a white light source is used, the interference light intensity is maximized only at the focal position of the two-luminous flux interference objective lens, unlike the case where a single-wavelength light source such as a laser is used. Therefore, it is suitable for measuring height.

FIG. 6 is a layout diagram of the optical elements of the observation optical system 2 when the Mirau type interference objective lens 30 is used for the objective lens 16. The Mirau type interference objective lens 30 includes a lens 31, a reference mirror 32, and a beam splitter 33.

At the same time that the objective lens 16 is switched to the Mirau type interference objective lens 30, the filter 36 is inserted into the exit portion of the epi-illumination light source 34 by the filter switching device 35. When the light emitted from the epi-illumination light source 34 passes through the filter 36, white light having a center wavelength of λ (nm) is obtained.

As the epi-illumination light source 34, for example, a white LED (Light Emitting Diode) may be used. The emission spectrum of the white LED has two peaks having wavelengths of 450 nm and 560 nm, and the filter 36 may be composed of a low-pass filter that selectively transmits light centered on 560 nm on the long wavelength side. preferable. This is because the wavelength band of the light centered on 560 nm is wider than that of the light centered on 450 nm, so that the coherent distance can be shortened. The coherent distance indicates the distance in the height direction in which the coherent fringes can be observed. The shorter the coherent distance, the smaller the number of data used in the approximation calculation of the contrast value and the calculation of the center of gravity, which will be described in the second step described later, so that the processing speed can be increased.

The light that has passed through the filter 36 is reflected by the half mirror 37 in the direction of the lens 31. The light incident on the lens 31 is divided into light passing in the direction of the substrate 7 by the beam splitter 33 and light reflected in the direction of the reference mirror 32. The light reflected on the surface of the substrate 7 and the light reflected on the surface of the reference mirror 32 are merged again by the beam splitter 33 and condensed by the lens 31. After that, the light emitted from the lens 31 passes through the half mirror 37 and then enters the imaging surface 3a of the CCD camera 3 through the imaging lens 38.

Normally, the Z stage 8 moves the specular interference objective lens 30 in the optical axis direction to cause an optical path length difference between the surface reflected light of the substrate 7 and the surface reflected light of the reference mirror 32. Then, while moving the Mirau type interference objective lens 30 by the Z stage 8, the CCD camera 3 captures the interference light generated by the optical path length difference. The intensity, that is, the brightness of the interference light is maximized when the optical path lengths of the light reflected from the substrate 7 and the light reflected from the reference mirror 32 are equal. At this time, the surface of the substrate 7 is in focus.

The Z stage 8 corresponds to a positioning device that relatively moves the substrate 7 and the Mirau-type interference objective lens 30 in the Z-axis direction. In addition to the Z stage 8, the position of the Mirau-type interference objective lens 30 can be determined by moving the substrate 7 up and down on a table or attaching a piezo table to the connecting portion between the Mirau-type interference objective lens 30 and the observation optical system 2. You may move it up and down.

Next, the search procedure will be described. The Z stage 8 is moved to the search start position. Assuming that the current position is Zp and the search range is Δ, for example, the Z stage 8 is moved to the initial position (Zp−Δ / 2). Here, the negative direction of the Z stage 8 is the direction of approaching the substrate 7, and the positive direction is the direction of moving away from the substrate 7. The search is performed in the positive direction from the initial position (Zp−Δ / 2), that is, in the direction in which the Z stage 8 moves away from the substrate 7. Therefore, the range of Δ is searched in the positive direction from the initial position (Zp−Δ / 2). The search direction does not necessarily have to be a direction away from the substrate 7, and may be a direction closer to the substrate 7.

Image sampling starts after the Z stage 8 starts moving and reaches a constant speed state. The control computer 11 performs sampling at regular intervals. The image can be sampled more accurately, preferably by sampling at the period of the vertical synchronization signal of the CCD camera 3.

The Z stage 8 moves at a predetermined speed v (μm / sec). The moving speed v (μm / sec) of the Z stage 8 is determined as follows. Assuming that the central wavelength of the white light is λ (μm) and the frequency of the vertical synchronization signal of the CCD camera 3 is F (Hz), the moving speed v (μm / sec) is the image sampling period 1 / F (sec). In the meantime, the Z stage 8 is set to move by λ / 8 (μm). That is, the moving speed v of the Z stage 8 is v = (λ / 8) × F (μm / sec). This moving speed v corresponds to π / 2 in the phase increment of white light, and satisfies the Nyquist principle. By changing the phase by π / 2, the peak point of the interference light intensity can be easily detected.

When sampling the image while changing the phase by [pi / 2, the sum of the front and rear ± 2 sheets around the image _{f i} 5 images _{f i-2, f i-} 1, f i, f i + 1, f i + 2 calculated using equation (1) the contrast value M _i with.

_Here, f i _(x, y) represents the luminance of the pixel at the position of the image _{f i} (x, y). Each pixel in the image _{f i} (x, y) constitutes a measurement point. Note that i is a number assigned to the image in the order of acquisition (hereinafter, also referred to as “sample number”), and takes the values of i = 1, 2, ..., N (N is a natural number).

7 (a) is a diagram showing the relationship between the sample number i and the brightness _f i (x, y). Figure 7 (b) is a diagram showing the relationship between the sample number i and the contrast value M _i. FIG. 7C is a diagram showing the relationship between the position of the Z stage 8 and the moving speed.

In FIG. 7 (a) ~ (c) , shows a peak in the vicinity of the luminance _f i (x, y) and contrast values _{M i} are both image p. The position of the Z stage 8 corresponding to this peak point is the focal position of the pixel (x, y).

Contrast values M _i represented by the above formula (1) shows the envelope of the luminance f _i shown in Figure 7 (a). Therefore, it is possible to obtain a peak point when calculating a contrast value M _i. However, since the operation is performed at high speed here, the operation for obtaining the square root and the division are not performed. For example, in the actual calculation, using the following equation (2), calculates a contrast value M _i ♯ obtained by simplifying the contrast value M _i. The contrast value M _i ♯ is proportional to a value obtained by squaring the contrast value M _i, is also shifted, the focus position of the peak point and the pixel of the envelope by using a contrast value M _i ♯ instead contrast value M _i There is no such thing.

The substrate shape measurement process is composed of two steps. In the first stage of the process, for each pixel of the image _{f i} (x, y), determining the position of the Z stage 8 luminance _f i (x, y) is maximum. This is because, as understood from FIGS. 7 (a) and (b), the luminance f _{i (x,} y) and the contrast value M _i are both utilizes the fact that a peak in the vicinity of the pixel p. That is, by obtaining the image p which the luminance f _{i (x,} y) has a peak, it is possible to give an idea of the peak point of the contrast values M _i. As a result, the processing range of the second stage can be narrowed, so that the processing speed can be increased. As described above, in the first stage processing, the candidate focus position is obtained for each of the plurality of pixels constituting the captured image.

Next, in the processing of the second stage, the luminance f _{i (x,} y) selects the image Sum (2n + 1) pieces of before and after the ± n Like around the image p to be a maximum (n is a natural number), calculates a contrast value _{M i} ♯ by the formula (2). Then, the calculated contrast value M _i ♯ is determined the position of the Z stage 8 with the maximum, the position of the Z stage 8 final focus position of the pixel (x, y). That is, in the second stage processing, an accurate focal position is obtained using the contrast value Mi # based on the focal candidate position obtained in the first stage processing.

FIG. 8 is a block diagram showing a control configuration for executing the substrate shape measuring step. With reference to FIG. 8, the control configuration according to the substrate shape measurement step (step S10) includes a CCD camera 3, an acquisition device 40, and a processing device 42. The import device 40 and the processing device 42 are provided inside the control computer 11.

The capture device 40 samples images at a fixed cycle (preferably a cycle of the vertical synchronization signal of the CCD camera 3). Specifically, the capture device 40 starts sampling an image by using the vertical synchronization signal of the CCD camera 3 as a trigger. Then, when the sampling of the image is completed, the sampled image is immediately transferred to the processing device 42. At this time, the import device 40 directly transfers the image to the storage unit 44 of the processing device 42. For this image transfer, for example, DMA (Direct Memory Access) transfer is used. Image sampling and transfer by the capture device 40 are repeatedly executed in an image sampling cycle of 1 / F (seconds), assuming that the frequency of the vertical synchronization signal of the CCD camera 3 is F (Hz).

The processing device 42 includes a storage unit 44 and a central processing unit 46. The storage unit 44, the image _{f i} is transferred from the capture device 40 at the sampling period of the image 1 / F (s). Storage unit 44 stores sequentially the image f _i transferred. The central processing unit 46, immediately after the image in the storage unit 44 is transferred, the luminance f _{i (x,} y) is the processing of the first step to start the process for obtaining the maximum value of. Then, the central processing unit 46, the luminance f _{i (x,} y) a process for obtaining the maximum value of completed immediately before the timing at which the next image is transferred. That is, the first stage processing is executed during the image sampling period 1 / F (seconds).

(First stage processing)
It will now be described in detail a procedure of processing for determining the maximum value of the luminance f _i is the processing of the first stage _(x, y).

In FIG. 8, the storage unit 44 is provided with three storage areas in which storage cells are arranged two-dimensionally so as to have the same resolution as that of the CCD camera 3. Of these three storage areas, the first storage area, the position of the image f _i (x, y) the luminance at f _{i (x,} y) maximum value of is stored. That is, the maximum value of the brightness of the corresponding pixel (x, y) is stored in each of the two-dimensionally arranged storage cells. In the following description, the luminance _f i (x, y) the maximum is expressed as "Max (x, y)" .

The second storage area, the luminance f _{i (x,} y) is the position of the Z stage 8 upon shooting images f _i having the maximum is stored. That is, each of the two-dimensionally arranged storage cells stores the position of the Z stage 8 when the brightness of the corresponding pixel (x, y) is maximized. In the following description, the luminance _f i (x, y) is expressed as the position of the Z stage 8 "Pz (x, y) " at which the maximum.

The third storage area, the sample number i is stored when the luminance f _{i (x,} y) have taken the image f _i with the maximum. That is, each of the two-dimensional array of storage cells, the sample number i of the image f _i which luminance is the maximum of the corresponding pixel (x, y) is stored. In the following description, the luminance _f i (x, y) is the sample number i of the image _{f i} where the maximum is expressed as "I (x, y)" .

The three values of Max (x, y), Pz (x, y), and I (x, y) stored in the storage unit 44 are set to "0" in the initial state before the search is started. ing. When the search is started, the images are sequentially transferred from the acquisition device 40 to the storage unit 44 in a sampling period of 1 / F (seconds). The central processing unit 46, the transfer of the image _{f i} is completed, for each pixel, the luminance _f i (x, y) and Max (x, y) is compared with, Max based on the comparison result (x, y) , Pz (x, y), I (x, y) values are updated. Specifically, the central processing unit 46, the position of the image _{f i} (x, y) the luminance _f i (x, y) in the maximum value of the luminance of the pixel (x, y) Max (x , y) Compare with. When the relationship of f _i (x, y) ≤ Max (x, y) is established, the central processing unit 46 maintains the value of Max (x, y). At this time, the central processing unit 46 also maintains the values of Pz (x, y) and I (x, y).

In _contrast, when f i (x, y)> Max (x, y) relationship holds true, the central processing unit 46 rewrites the value of the Max (x, y) the luminance _f i (x, y) to .. Moreover the central processing unit 46, Pz (x, y) pixel values _f i (x, y) the value of rewrites to the position of the Z stage 8 corresponding to, I (x, y) the luminance values of _f i ( Rewrite with sample number i of x, y).

The central processing unit 46, the luminance _f i (x, y) described above and Max (x, y) operation of comparing and rewriting operation of the storage unit 44 in accordance with the comparison result, the storage unit 44 from the capture device 40 This is executed using the period from the timing at which the image is transferred to the timing at which the acquisition device 40 starts sampling the next image. For example the resolution of the CCD camera 3 and 640 × 480, assuming the luminance _f i (x, y) to 1 byte, the size of the image data transferred from the capture device 40 in the storage unit 44 and 307,200 bytes Become. On the other hand, assuming that the frequency of the vertical synchronization signal of the CCD camera 3 is 120 Hz, the image sampling period is 1/120 second. Therefore, the capture device 40 captures 307,200 bytes of image data every 1/120 seconds (about 8.3 ms) and transfers the image data to the storage unit 44 of the processing device 42. Data transfer from the acquisition device 40 to the storage unit 44 can be performed in a time of about 2 msec by using DMA transfer. Thus, processing device 42, of the approximately 8.3m sec is the sampling period, by utilizing the time of about 6.3m seconds, excluding the approximately 2m sec required for data transfer, the luminance _f i of (x, y) Execute the process to find the maximum value.

In this way, the first stage processing is executed using the free time after the data transfer for each image sampling cycle. Thus, when the sampling of all the images within the search range is completed, the storage unit 44, for each pixel, the luminance _f i (x, y) maximum value of (= Max (x, y) ), the luminance f _i (x, y) position of the Z stage 8 when the is maximum (= Pz (x, y) , and the luminance _f i (x, image _{f i} sample number of y) is maximum (= I (x , Y)) is stored.

Next, a process of the second stage contrast value M _i ♯ will be described in detail a procedure of processing for obtaining the position of the Z stage 8 becomes maximum. The second stage processing is executed by the central processing unit 46 after sampling of all the images in the search range is completed.

The central processing unit 46, from the storage unit 44, for each pixel, the luminance _f i (x, y) is the maximum sample number i (= I (x, y )) read out. Then, the central processing unit 46, I (x, y) using a longitudinal ± n pieces of total (2n + 1) images around the images _{f i} of sample number i indicated by the contrast value _{M i} ♯ (x , Y) Find the peak point.

Specifically, assuming that the sample number of each of the (2n + 1) images is j, the sample number j is I (x, y) -n, I (x, y) -n + 1, ..., I ( It is represented in the order of x, y) -1, I (x, y), I (x, y) +1, ..., I (x, y) + n-1, I (x, y) + n. The central processing unit 46 calculates a total of (2n + 1) contrast values M _j # (x, y) by substituting the luminance f _j (x, y) of the image f _j into the above equation (3).

Here, assuming that the position of the Z stage 8 corresponding to the contrast value Mj # (x, y) is Z _j , Z _j can be expressed by the following equation (3).

As described in FIG. 7B, since the contrast value M _j # shows a bilaterally symmetric mountain-shaped tendency centered on the peak point, a curve showing the contrast value M _j # using a quadratic function or a Gaussian function. Can be approximated. Therefore, the central processing unit 46 approximates the relationship between the contrast value M _j # and the position Z _j of the Z stage 8 with a quadratic function or a Gaussian function, and the Z stage in which the contrast value M _j # peaks from the obtained function. determining the position _{Z j} of the 8. Then, the position Z _j of the Z stage 8 is _defined as the height of the pixel (x, y).

As described above, in the substrate shape measurement step, as the first stage process, the Z stage position where the brightness is maximized is set as the focus candidate position for each of the plurality of pixels constituting the captured image. .. After that, as the second stage processing, the contrast value is obtained from the brightness of the image taken in the vicinity of the focal candidate position, and the Z stage position where the contrast value is maximized is obtained as the focal position for each pixel. Then, the height of the measurement point in the Z-axis direction is detected from the obtained focal position.

With such a configuration, in the first stage processing, the processing of calculating the contrast value for each pixel can be omitted, so that the calculation load on the control computer 11 can be reduced. Further, since it is not necessary to store the contrast value of each pixel, a large-capacity memory is not required. As a result, the control computer can be constructed at low cost.

Further, since the first stage processing can be performed by utilizing the free time after transferring the image within the shooting cycle of the imaging device (the sampling cycle of the image in the CCD camera 3), all the processing within the search range. It is possible to reduce the numerical calculation processing after the image shooting is completed. As a result, it is possible to shorten the working time of the substrate shape measuring process.

In the process of the second step described above has been described for the case where approximating the contrast value M _i ♯ by a secondary function or Gaussian function, determine the (2n + 1) pieces of center of gravity of the contrast value Mi♯, it was determined The position of the center of gravity may be the peak position. This center of gravity position indicates the center position of the symmetrical data as shown in FIG. 7B. Assuming that the position of the center of gravity is Z _g , Z _g can be calculated using the following equation (4).

[Disconnection shape detection process]
In the disconnection portion shape detection step (step S20 in FIG. 4), the control computer 11 detects the three-dimensional shape of the disconnection portion generated in the wiring pattern based on the data obtained by measuring the three-dimensional shape of the surface of the substrate 7. ..

Specifically, the processing device 42 (see FIG. 8) inside the control computer 11 uses the measurement data of the three-dimensional shape of the surface of the substrate 7 obtained in the substrate shape measurement step (step S10 of FIG. 4). Then, an image in which the disconnection portion is extracted from the wiring pattern (hereinafter, also referred to as “disconnection portion extraction image”) D (x, y) is generated.

The broken wire extracted image D (x, y) is a binarized image in which the normal wiring portion is “1” and the portion other than the normal wiring portion including the broken wire portion is “0”. The processing device 42 sets the height of the measurement point in the Z-axis direction as Z (x, y). Note that (x, y) represents the positions of pixels on the image taken by the CCD camera 3 in the above-mentioned substrate shape measurement step (step S20).

When the height of the normal wiring portion in the Z-axis direction is Hp, the processing device 42 has the height Z (x, y) of the measurement point in the Z-axis direction and the height Hp of the normal wiring portion in the Z-axis direction. To compare. When the relationship between the height Z (x, y) of the measurement point and the height Hp of the normal wiring portion satisfies the following equation (5), the value of the corresponding pixel position is set to “1”. On the other hand, when the relationship between the height Z (x, y) of the measurement point and the height Hp of the normal wiring portion does not satisfy the following equation (5), the value of the corresponding pixel position is set to “0”. Note that α in the following equation (5) indicates a permissible error with respect to the height Hp of the normal wiring portion.

In the broken wire extracted image D (x, y), which is a binary image, the pixels having a value of "0" correspond to parts other than the normal wiring portion. Therefore, the disconnection portion can be extracted from the pixels having the value "0". Specifically, the processing device 42 utilizes the continuity of the wiring pattern, and extracts the disconnection portion from the pixels having the value "0" based on the feature that the normal wiring portion is continuous in the inspection area. To do. Hereinafter, a method for extracting a broken portion when the wiring pattern is continuous in the Y-axis direction will be described.

FIG. 9 is a diagram for explaining a method of extracting the disconnected portion. First, as shown in FIG. 9A, the processing device 42 captures an image composed of a plurality of pixels in the inspection area from the image extracted from the disconnection portion. Next, as shown in FIG. 9B, the processing device 42 detects a block of pixels having a value of “1” from the captured image of the broken wire, and extracts the contour line of the block. Then, the processing device 42 calculates the maximum value and the minimum value in the Y-axis direction in each contour line, and detects the coordinates of the minimum value in the Y-axis direction for each contour line. When the minimum value in the Y-axis direction (corresponding to the black circle in the figure) in one contour line is in contact with the upper end or the left and right ends of the inspection area, the processing device 42 determines that the contour line corresponds to the contour line of the normal wiring portion. to decide. On the other hand, when the minimum value in the Y-axis direction of one contour line does not touch the upper end or the left and right ends of the inspection area, the processing device 42 determines that the contour line does not correspond to the contour line of the normal wiring portion. In this case, the minimum value in the Y-axis direction is set as a "defect candidate point", and the coordinates are stored.

When the wiring pattern is continuous in the X-axis direction, the processing device 42 uses the processing device 42 when the minimum value in the X-axis direction of one contour line is in contact with the left end or the upper and lower ends of the measurement area. It is determined that the contour line corresponds to the contour line of the normal wiring portion, and when the minimum value in the X-axis direction does not touch the left end or the upper and lower ends of the measurement area, it is determined that the contour line does not correspond to the contour line of the normal wiring portion. In this case, the minimum value in the X-axis direction is set as a defect candidate point, and its coordinates are stored.

Similarly, the processing device 42 detects the coordinates of the maximum value in the Y-axis direction for each contour line. When the maximum value in the Y-axis direction (corresponding to the white circle in the figure) in one contour line is in contact with the lower end or the left and right ends of the inspection area, the processing device 42 determines that the contour line corresponds to the contour line of the normal wiring portion. to decide. On the other hand, when the maximum value in the Y-axis direction of one contour line does not touch the lower end or the left and right ends of the measurement area, the processing device 42 determines that the contour line does not correspond to the contour line of the normal wiring portion. In this case, the maximum value in the Y-axis direction is set as a defect candidate point, and its coordinates are stored.

When the wiring pattern is continuous in the X-axis direction, the processing device 42 uses the processing device 42 when the maximum value in the X-axis direction of one contour line is in contact with the right end or the upper and lower ends of the measurement area. It is determined that the contour line corresponds to the contour line of the normal wiring portion, and when the maximum value in the X-axis direction does not touch the right end or the upper and lower ends of the measurement area, it is determined that the contour line does not correspond to the contour line of the normal wiring portion. In this case, the maximum value in the X-axis direction is set as a defect candidate point, and its coordinates are stored.

Finally, the processing device 42 extracts the disconnection portion based on the stored defect candidate points. At this time, the control computer 11 extracts a block of pixels having a value of "0" with the defect candidate point as the apex as a disconnection portion.

In this way, in the disconnection portion shape detection step, the three-dimensional shape of the surface of the substrate 7 is converted into a binary image based on the height in the Z-axis direction for each measurement point. By extracting the disconnection portion from the converted binary image, the three-dimensional shape of the disconnection portion can be detected.

[Applying position calculation process]
In the coating position calculation step (step S50 in FIG. 4), the processing device 42 inside the control computer 11 is based on the three-dimensional shape of the disconnection portion detected in the disconnection portion shape detection step (step S20 in FIG. 4). Determine the three-dimensional application position of the correction ink. FIG. 10 is a schematic view showing an enlarged example of the disconnected portion. As shown by the dotted line in FIG. 10, the processing device 42 sets a rectangular region circumscribing the disconnection portion. This rectangular area has the upper left end coordinates (x1, y1) and the right lower end coordinates (x2, y2) as vertices. The processing device 42 has a height difference between the height Hp of the normal wiring portion in the Z-axis direction and the height Z (x, y) of the pixels in the Z-axis direction for the pixels (x, y) located in the rectangular region. Calculate Δ (x, y).

FIG. 11 is a diagram in which the height difference Δ (x, y) of each pixel located in the rectangular region is plotted. In FIG. 11, the pixel (x, y) at which the height difference Δ (x, y) = 0 corresponds to the normal wiring portion. On the other hand, the pixel (x, y) at which the height difference Δ (x, y)> 0 corresponds to the disconnection portion.

The processing apparatus 42 calculates the number of times of ink application Nz in the Z-axis direction based on the obtained height difference Δ (x, y). Specifically, assuming that the maximum value of the height difference Δ (x, y) is Δmax, the coating height of the ink applied by one coating operation in the Z-axis direction is t, and the height correction amount is Δt. The number of coatings Nz in the Z-axis direction is represented by the following equation (6).

Here, ceiling () is a function that "returns the smallest integer out of a specified number or more". The height correction amount Δt is the maximum value in advance of the decrease in the coating height due to the shrinkage of the ink in anticipation of the possibility that the ink applied in the drying step (step S70 in FIG. 4) shrinks due to drying. It is added to Δmax. The height correction amount Δt can be set by obtaining in advance the difference between the height of the ink-coated portion immediately after coating in the Z-axis direction and the height of the ink-coated portion after drying in the Z-axis direction by an experiment or the like. ..

The processing device 42 further calculates the number of coatings Nx in the X-axis direction and the number of coatings Ny in the Y-axis direction. Specifically, when the ink coating pitch, that is, the ink coating interval is p, the number of coatings Nx in the X-axis direction is the upper left end coordinates (x1, y1) and the right lower end coordinates (x2, y2) of the disconnection portion. Is calculated by the following equation (7).

Similarly, the number of coatings Ny in the Y-axis direction is calculated by the following equation (8) using the upper left end coordinates (x1, y1) and the right lower end coordinates (x2, y2) of the disconnection portion.

Next, the processing device 42 obtains the ink application position in the ink application operation based on the calculated number of application times Nx, Ny, Nz. The ink application position is three-dimensionally represented as the center coordinates (rx, ry, raz) of the ink application range. First, the coating pitch px in the X-axis direction, the coating pitch py in the Y-axis direction, and the coating pitch pz in the Z-axis direction are calculated using the following equation (9). FIG. 12 is a diagram showing coating pitch px, py, pz.

However, when Nx = 1, px = 0, when Ny = 1, py = 0, and when Nz = 1, pz = 0. Next, the ink coating positions (rx, ry, raz) are calculated using the following equation (10) using the coating pitch px, py, psi.

Nx, ny, and nz in the formula (10) are index numbers for specifying the number of coatings in the X-axis direction, the Y-axis direction, and the Z-axis direction, respectively. That is, nx is an integer of 0 or more and Nx-1 or less, ny is an integer of 0 or more and Ny-1 or less, and nz is an integer of 0 or more and Nz-1 or less.

Further, Bz in the equation (10) indicates the position of the Z stage 8 when the main surface of the normal wiring portion is focused. Bz can be acquired in advance in the above-mentioned substrate shape measurement step (step S20 in FIG. 4).

[Ink application process]
In the ink coating step (step S60 of FIG. 4), the control computer 11 controls the X stage 9 and the Y stage 10 to move the coating needle 18 of the desired coating unit 17 to the ink coating position (rx, ry, Move to rz). At this time, as shown in FIG. 3A, the tip of the coating needle 18 is immersed in the ink in the ink tank 19.

Next, as shown in FIG. 3B, the coating needle 18 is lowered to project the tip of the coating needle 18 from the hole at the bottom of the ink tank 19. Further, as shown in FIG. 3C, the movable plate 15 is lowered by the Z stage 8 and the tip end portion of the coating needle 18 is brought into contact with the disconnection portion, whereby the ink application position (rx, ry, Ink is applied to rs). After that, the state returns to the state shown in FIG. 3 (a).

There are a total of Nx × Ny × Nz of coating positions calculated by the coating position calculation step (step S50 in FIG. 4). When performing the ink coating operation for each coating position, the control computer 11 has a rectangular parallelepiped coating range centered on the coating position (rx + px / 2, ry + py / 2, rz + pz / 2) and a broken portion of the wiring pattern. Judgment of overlap with. Here, the rectangular parallelepiped coating range is centered on the coating position (rx, ry, raz) and is defined by the coating pitch px, py, pz. That is, in the coating range, the upper and lower limit values in the X-axis direction are rx + px / 2 ± px, the upper and lower limit values in the Y-axis direction are ry + py / 2 ± py, and the upper and lower limit values in the Z-axis direction are rz + pz / 2 ± pz. To do.

In the overlap determination, the control computer 11 first calculates the volume of the disconnected portion that occupies the coating range. Then, when the calculated volume of the disconnected portion becomes equal to or larger than a predetermined threshold value, the control computer 11 applies ink to the coating range. On the other hand, when the volume of the disconnected portion occupying the coating range is less than the threshold value, the control computer 11 does not apply ink to the coating range.

Specifically, the control computer 11 is located within the range of ± px in the X-axis direction and ± py in the Y-axis direction around the coating position (rx + px / 2, ry + py / 2) in the XY coordinate system. For the pixel (x, y), the volume d (x, y) of the disconnection portion is calculated. The volume d (x, y) of the defective portion in the pixel (x, y) is the height difference Δ (x, y) between the height Hp of the normal wiring portion and the height of the pixel (x, y) in the Z-axis direction. It can be calculated by the following equation (11) using the coating pitch pz and the number of coating times Nz in the Z-axis direction.

The control computer 11 has a defect portion among a plurality of pixels located within a range of ± px in the X-axis direction and ± py in the Y-axis direction centered on the coating position (rx + px / 2, ry + py / 2). Pixels (x, y) having a volume d (x, y)> 0 are extracted, and the total value ds of the volume d (x, y) of the defective portion of the extracted pixels (x, y) is calculated. The calculated total value ds corresponds to the volume of the broken portion that occupies the rectangular parallelepiped coating range centered on the coating position (rx + px / 2, ry + py / 2, rz + pz / 2). The control computer 11 compares the total value ds with the predetermined threshold value dT, and when the total value ds is equal to or higher than the threshold value dT, the coating position (rx + px / 2, ry + py / 2, rs + pz / 2) is the center. Apply ink to the application area. On the other hand, when the total value ds is smaller than the threshold value dT, the ink is not applied to the application range.

The control computer 11 determines the overlap between the above-mentioned coating range and the defective portion for each of the total Nx × Ny × Nz coating positions. Then, the control computer 11 applies ink based on the determination result. As a result, the defective portion in the broken portion is filled with ink.

As shown in FIG. 4, after the ink coating step (step S60) is carried out, the substrate shape measuring step (step S10) and the disconnection portion shape detecting step (step S20) are carried out again. As a result, a portion where the amount of ink applied is insufficient is newly detected in the disconnected portion. By subsequently carrying out the coating position calculation step (step S50) and the ink coating step (step S60), the ink is filled in the portion where the ink coating amount is insufficient.

The control computer 11 performs the above-described substrate shape measurement step (step S10), disconnection portion shape detection step (step S20), coating position calculation step (step S50), and ink coating step (step S60) with ink on the disconnection portion. Is repeated until it is determined that the correction of the wiring pattern is unnecessary (at the time of NO determination in step S30). As a result, the disconnection portion can be corrected to the same height as the normal wiring portion. If it is not determined that the wiring pattern needs to be corrected even after repeating the above series of steps a predetermined number of times (when the determination is YES in step S30), it may be determined that the wiring pattern cannot be corrected. It is possible.

[Drying process]
In the drying step (step S70 of FIG. 4), the control computer 11 controls the X stage 9 and the Y stage 10 to apply the ink formed on the surface of the substrate 7 directly under the ink curing light source 6. Move the part. The ink curing light source 6 includes, for example, a CO ₂ laser, and irradiates the ink application portion with a laser beam to dry and cure the ink.

In addition to the above methods, there are other methods for drying the ink, such as irradiating the ink-coated portion with infrared light and blowing a high-temperature wind on the ink-coated portion. An appropriate drying method can be selected according to the type of correction ink used.

As described above, according to the pattern correction device according to the embodiment of the present invention, an image is taken while the substrate and the objective lens are relatively moved in the vertical direction, and the focal position of each of the plurality of pixels constituting the taken image is obtained. By obtaining the above, the three-dimensional shape of the substrate surface can be detected based on the obtained focal position. As a result, it is possible to detect the three-dimensional shape of the broken portion generated in the wiring pattern based on the detected three-dimensional shape of the substrate surface. Then, since the three-dimensional shape of the broken portion can be detected, the application position of the correction ink for correcting the broken portion can be determined three-dimensionally. According to this, even for a wiring pattern of a thick film having a thickness of 10 μm or more, it is possible to accurately laminate and apply ink on the broken portion.

Further, as described above, since the ink coating operation can be executed according to the coating position determined three-dimensionally, the processing operation can be automated even for the wiring pattern of the thick film. As a result, it is possible to improve work efficiency and save labor in processing work.

The embodiments disclosed this time should be considered as exemplary in all respects and not restrictive. The scope of the invention is indicated by the claims and is intended to include all modifications within the scope, rather than the description of the embodiments described above.

1 Defect correction device, 2 Observation optical system, 2a Observation lens barrel, 3 CCD camera, 4 Cutting laser device, 5 Ink coating mechanism, 6 Ink curing light source, 7 Liquid crystal color filter substrate, 8 Z stage, 9 X stage, 10 Y stage, 11 control computer, 12 monitor, 13 operation panel, 15 movable plate, 16 objective lens, 17 application unit, 18 application needle, 19 ink tank, 30 Mirau type interference objective lens, 31 lens, 32 reference mirror, 33 beam splitter, 34 epi-illumination light source, 35 filter switching device, 36 filter, 37 half mirror, 38 imaging lens, 40 capture device, 42 processing device, 44 storage unit, 46 central processing unit.

Claims (3)

It is a coating method in a coating device that coats a liquid material on a substrate.
The coating device has a coating mechanism having a coating needle and a stage for moving the coating mechanism relative to the substrate in the vertical direction and the horizontal direction.
A step of moving the coating mechanism relative to the substrate by driving the stage, and
A step of applying the liquid material by bringing the liquid material attached to the tip of the coating needle into contact with the coating position is provided.
A coating method in which the liquid material is laminated and coated on the substrate by repeatedly executing a step of moving the coating mechanism relative to the substrate in a direction perpendicular to the substrate and a step of coating the liquid material. Prior Symbol coating apparatus, referring a lighting device that outputs white light, separates the white light emitted from the lighting device in two beams, the other with one irradiated to the surface of the liquid material on the substrate It further has an objective lens for irradiating a surface and interfering with reflected light from both sides to obtain interference light, and an imaging device for photographing the interference light, and the stage includes the objective lens and the coating. The mechanism is configured to move relative to the substrate in the vertical and horizontal directions.
An image is taken by the image pickup device while moving the objective lens in the direction perpendicular to the substrate, and the three-dimensional shape of the surface of the liquid material on the substrate is measured based on the taken image.
Based on the three-dimensional shape of the measured the surface of the liquid material on the substrate, further comprising the steps of calculating the applied position on the three-dimensional for applying the liquid material to the liquid material on the substrate Prepare ,
The step of moving the coating mechanism relative to the substrate in the direction perpendicular to the substrate includes a step of moving the coating mechanism to the calculated coating position on the three dimensions.
The step of applying the liquid material includes a step of applying the liquid material by bringing the tip of the coating needle into contact with the calculated coating position on the three dimensions.
Measuring a three-dimensional shape of the surface of the liquid material on the substrate, and calculating the application position on the three-dimensional, and moving the coating mechanism in the coating position on the three-dimensional by repeatedly performing the step of applying the liquid material in this order, it applied by laminating the liquid material on the substrate, coating method of claim 1. A coating device that coats a liquid material on a substrate.
A coating mechanism having a coating fabric needle,
A stage for relatively moving in the vertical and horizontal direction with respect to the substrate before Symbol coating mechanism,
And a control device for controlling the pre-Symbol stage and the coating mechanism,
By driving the stage , the control device moves the coating mechanism relative to the substrate in the direction perpendicular to the substrate.
The liquid material is applied by bringing the liquid material attached to the tip of the coating needle into contact with the coating position.
The control device repeatedly executes the step of moving the coating mechanism relative to the substrate in the direction perpendicular to the substrate and the step of coating the liquid material, thereby laminating and coating the liquid material on the substrate. Applying equipment.