JP6786916B2 - Non-contact crimping card and crimping card paper - Google Patents

Description

The present invention relates to a non-contact card in which an antenna coil and an IC chip are mounted inside.

Conventionally, a game card has been a paper card in which two sheets of front paper on which a front face pattern is printed and two sheets of back side paper on which a back face pattern is printed are bonded together, but in recent years, antennas such as non-contact IC cards and RFID tags Non-contact cards with coils and IC chips mounted inside are increasingly being used for game cards.

As described above, when a game card is manufactured by laminating two sheets of paper, the thickness of the game card is generally about 0.3 to 0.5 mm. On the other hand, since the thickness of the IC chip built into the non-contact type game card is about 0.1 to 0.2 mm, the non-contact type game card is inserted by sandwiching the IC chip between two sheets of paper. When manufactured, the surface of the card becomes uneven and the appearance of the game card deteriorates.

In the field of non-contact cards, inventions for improving the flatness of the card surface have already been disclosed. For example, in Patent Document 1, in order to increase the flatness of the card surface, an adhesive layer made of an adhesive such as a thermoplastic elastomer is provided in the intermediate layer of the card. However, this method requires a static pressure type heat pressing process for curing the adhesive layer, and the static pressure type heat pressing process becomes the rate-determining factor for manufacturing efficiency.

Further, in Patent Document 2, in order to increase the flatness of the card surface, a spacer sheet provided with a hole for accommodating an IC chip is provided in the intermediate layer of the non-contact card. However, with this method, it is necessary to make the margin between the hole and the IC chip larger than necessary so that the positions of the hole and the IC chip are not difficult to align, but between the hole and the IC chip. If the margin is made larger than necessary, there will be adverse effects such as the unevenness of the card surface not being completely eliminated.

Japanese Unexamined Patent Publication No. 2000-57295 Japanese Unexamined Patent Publication No. 2006-277178

Therefore, in the present invention, in order to increase the flatness of the card surface, in a non-contact card provided with a spacer sheet provided with a hole for accommodating the IC chip in the intermediate layer, the positions of the hole and the IC chip are accurately positioned. The challenge is to make it fit.

The first invention for solving the above-mentioned problems is a portion of the inlet sheet piece that becomes a target with the IC chip when the boundary between the inlet sheet piece on which the antenna coil and the IC chip is mounted and the inlet sheet piece is the axis. to the spacer sheet piece forming a hole for fitting with said IC chip of the inlet sheet piece, three sheets of sheet pieces is connected in this order topsheet piece formed in the surface layer is of the spacer sheet piece the IC chip is fitted in the inlet sheet piece and the hole, the and the spacer sheet piece becomes out three-folded state so ing intermediate the inlet sheet piece and the surface sheet piece The inner surface of the folded sheet is a non-contact crimping card characterized in that it is strongly adhered with a pressure-sensitive adhesive so as not to be peeled off.

According to the second invention, when the boundary between the inlet sheet area in which the antenna coil and the IC chip are continuously mounted in the longitudinal direction and the inlet sheet area is the axis, the IC chip in the inlet sheet area becomes a target. In addition, the inlet sheet region is characterized by having three regions in the width direction in this order: a spacer sheet region in which a hole for fitting with the IC chip is formed and a surface sheet region used as a card surface. Crimping card paper to be used.

According to the above-described invention, the position of the IC chip can be accurately aligned with the hole formed for accommodating the IC chip by folding such as folding the outer tri-fold.

The figure explaining the non-contact crimping card which concerns on this embodiment. The figure explaining the manufacturing process of a non-contact crimping card. The figure explaining the non-contact crimping card which concerns on Example 1. FIG. The figure explaining the crimping card paper which concerns on Example 1. FIG. The figure explaining the manufacturing method of the crimping card paper which concerns on Example 1. FIG. The figure explaining the base paper after a printing process. The figure explaining the base paper after a hole forming process. The figure explaining the manufacturing method of the non-contact crimping card which concerns on Example 1. FIG. The figure explaining the non-contact crimping card which concerns on Example 2. FIG. The figure explaining the crimping card paper which concerns on Example 2. FIG. The figure explaining the manufacturing method of the crimping card paper which concerns on Example 2. FIG. The figure explaining the base paper after a printing process. The figure explaining the base paper after a hole forming process. The figure explaining the manufacturing method of the non-contact crimping card which concerns on Example 2. FIG.

From here, preferred embodiments of the present invention will be described. The following description does not constrain the technical scope of the present invention, but is described to aid understanding.

From here, the non-contact crimping card 1 according to the present embodiment will be described. FIG. 1 is a diagram illustrating a non-contact crimping card 1 according to the present embodiment. The non-contact crimping card 1 according to the present embodiment is a card medium containing an antenna coil 104 and an IC chip 103, such as an IC tag and a non-contact IC card, and is a single card medium in which a plurality of card-sized sheet pieces are connected. After the sheet 10 is folded in a predetermined folding method, the inner surface of the folded sheet 10 is strongly adhered so as not to be peeled off by using a pressure-sensitive adhesive.

The sheet 10 constituting the non-contact crimping card 1 illustrated in FIG. 1 includes at least a surface sheet piece 100, a spacer sheet piece 101, and an inlet sheet piece 102. Although not shown in FIG. 1, a back surface sheet piece, which is a sheet piece to be the back surface of the non-contact crimping card 1, can be included in the sheet.

The surface sheet piece 100 of the sheet 10 is a sheet piece that becomes the surface layer of the non-contact crimping card 1, and the face pattern of the card surface is printed. The inlet sheet piece 102 of the sheet 10 is a sheet piece on which the antenna coil 104 and the IC chip 103 are mounted. In FIG. 1, the inlet sheet piece 102 of the sheet 10 is a sheet piece that becomes the back layer of the non-contact crimping card 1, and the surface of the inlet sheet piece 102 that is opposite to the surface on which the IC chip 103 or the like is mounted is the back surface of the card. The face design of is printed. The spacer sheet piece 101 of the sheet 10 is a sheet piece that serves as an intermediate layer of the non-contact crimping card 1, and a hole 105 is formed to absorb the thickness of the IC chip 103 mounted on the inlet sheet piece 102. Inside the non-contact crimping card 1, the hole 105 formed in the spacer sheet piece 101 fits with the IC chip 103 of the inlet sheet piece 102, and the thickness of the IC chip 103 is absorbed by the thickness of the spacer sheet piece 101. Therefore, in the non-contact crimping card 1, the unevenness of the card surface due to the thickness of the IC chip 103 is suppressed.

In the present embodiment, in order to manufacture such a non-contact crimping card 1, a crimping card paper on which the sheets 10 are continuously formed is used. When the fold line that is the boundary between the inlet sheet piece 102 and the spacer sheet piece 101 is the axis, if a hole 105 is formed at the target location with the IC chip 103, the web-shaped crimping card paper can be conveyed. The positions of the IC chip 103 and the hole 105 can be accurately aligned only by folding.

The manufacturing process of the non-contact crimping card 1 will be described. FIG. 2 is a diagram illustrating a manufacturing process of the non-contact crimping card 1. When manufacturing the non-contact crimping card 1, first, the crimping card paper on which the sheets 10 are continuously formed is manufactured (S1). Next, the hole 105 formed in the region used as the spacer sheet piece 101 and the IC chip 103 mounted in the region used as the inlet sheet piece 102 are fitted by using a plow fold or the like, and the surface sheet piece 100 A folding step is performed while transporting the crimped card paper so that the area used as the card is the surface of the card (S2). Next, a crimping step is performed in which the folded crimping card paper is pressed from above using a pressure roller to crimp the entire inner surface of the folded crimping card paper (S3). Next, using a punching machine or the like, a card punching step of punching a crimping card paper whose inner surface is fully crimped into a card shape is carried out (S4), and the non-contact crimping card 1 shown in FIG. 1 is manufactured.

From here, an embodiment of the non-contact crimping card 1 according to the present embodiment will be described. Example 1 is an example when the crimping card paper is folded in three outer directions (Z fold), and Example 2 is when the crimping card paper is folded in four outer directions (W fold). It is an embodiment.

[Example 1]
FIG. 3 is a diagram illustrating the non-contact crimping card 2 according to the first embodiment. The non-contact crimping card 2 according to the first embodiment is manufactured by folding the base paper 200 used for manufacturing the non-contact crimping card 2 according to the first embodiment in three, similarly to the non-contact crimping card 2 shown in FIG. The base paper 200 folded in a substantially Z shape appears on the short side end surface of the non-contact crimping card 2 according to the first embodiment. The card front surface of the non-contact crimping card 2 according to the first embodiment is printed with the card face pattern 2a (here, the characters "Game Card" and the character pattern), and the card back surface is printed with the card face pattern 1b (here). Here, a lattice pattern) is printed.

FIG. 4 is a diagram for explaining the crimping card paper 20 according to the first embodiment, and FIG. 4A is a diagram showing the surface of the crimping card paper 20 according to the first embodiment. The crimping card paper 20 according to the first embodiment is manufactured by using the strip-shaped base paper 200, and the crimping card paper 20 covers three regions of a surface sheet area 200a, a spacer sheet area 200b, and an inlet sheet area 200c in the width direction. Perforations 204 and 205 are formed at the boundaries of the respective regions to be used as folding lines.

The surface sheet area 200a of the crimping card paper 20 according to the first embodiment is an area to be the surface sheet piece 100 of the sheet described with reference to FIG. 1, and the surface sheet area 200a is the face of the card surface shown in FIG. The pattern 2a is continuously printed in the longitudinal direction. The spacer sheet area 200b of the crimping card paper 20 according to the first embodiment is an area to be the spacer sheet piece 101 of the sheet described with reference to FIG. 1, and the spacer sheet area 200b is a face pattern printed on the surface sheet area 200a. The holes 201 are continuously formed in the longitudinal direction in a state corresponding to 2a. The inlet sheet area 200c of the crimping card paper 20 according to the first embodiment is an area to be the inlet sheet piece 102 of the sheet described with reference to FIG. 1, and the inlet sheet area 200c is a face pattern printed on the surface sheet area 200a. The antenna coil 203 and the IC chip 202 are continuously mounted in the longitudinal direction in a state corresponding to 2a.

When the crimping card paper 20 is folded along the perforation 205 that becomes the folding line, the spacer is fitted so that the IC chip 202 mounted in the inlet sheet area 200c and the hole 201 formed in the spacer sheet area 200b are fitted. The hole 201 formed in the sheet region 200b is formed at a position corresponding to the IC chip 202 mounted in the inlet sheet region 200c with the perforation 205 as the axis.

FIG. 4B is a cross-sectional view of AA'. The crimping card paper 20 according to the first embodiment has a layer structure in which a pressure-sensitive adhesive 200e, which can obtain an adhesive strength that cannot be peeled off by superimposing a coated surface and applying pressure, is applied to both sides of the base paper 200. ing. As such a pressure-sensitive adhesive 200e, an adhesive containing natural rubber latex as an adhesive main agent can be used. The face patterns 2a and 2b are printed on the pressure-sensitive adhesive 200e, and the antenna coil 203 and the IC chip 202 in the inlet sheet area 200c are mounted on the pressure-sensitive adhesive 200e.

FIG. 5 is a diagram illustrating a method of manufacturing the crimping card paper 20 according to the first embodiment. When the crimping card paper 20 according to the first embodiment is manufactured, the pressure-sensitive adhesive 200e, which can obtain a non-peelable adhesive strength by superimposing the coated surfaces and applying pressure, is applied onto the base paper 200 coated on both sides. A printing step is performed in which at least the face pattern 2a on the front surface of the card and the face pattern 2b on the back side of the card are printed using an offset printing machine or the like (S10).

FIG. 6 is a diagram illustrating the base paper 200 after the printing process. In the base paper 200 after the printing process, the face pattern 2a on the card surface is continuously printed in the area used as the surface sheet area 200a. Further, in the base paper 200 after the printing process, the first register mark pattern 201a indicating the area forming the hole 201 corresponding to the ticket face pattern 2a on the card surface is printed in the area used as the spacer sheet area 200b. .. Further, in the base paper 200 after the printing process, a second register mark pattern 203a indicating an area for mounting the antenna coil 203 or the like is printed on the area used as the inlet sheet area 200c. Although not shown in FIG. 6, the face pattern 2b on the back side of the card is continuous with the back side of the inlet sheet area 200c (the back side of the side on which the IC chip 202 or the like is mounted) in the base paper 200 after the printing process. Is printed.

After the above-mentioned printing step is carried out, a hole forming step of forming the hole 201 in the printed base paper 200 is carried out using a punching machine such as a rotary die (S11). FIG. 7 is a diagram illustrating the base paper 200 after the hole forming step. In the base paper 200 after the hole forming step, a hole 201 penetrating the base paper 200 is formed at the position of the first register mark pattern 201a printed in the printing step by using a punching machine such as a rotary die. ing. Further, for the base paper 200 after the hole forming step shown in FIG. 7, the width of the base paper 200 is divided into three, a surface sheet area 200a, a spacer sheet area 200b, and an inlet sheet area 200c, by using a perforation machine. Perforations 204 and 205 that divide the direction are formed.

After the hole forming step is carried out, an inlet forming step for mounting the antenna coil and the IC chip is carried out on the base paper 200 after the hole 201 is formed (S12), and the crimping card paper shown in FIG. 3 is formed. 20 is manufactured.

As the material of the base paper 200 of the crimping card paper 20, paper or a plastic film (for example, PET film) can be used. If the thickness of the base paper 200 is thicker than the thickness of the IC chip 202, a step will occur due to the difference between the thickness of the base paper 200 and the thickness of the IC chip 202 when the hole 201 and the IC chip 202 are fitted. The base paper 200 having a thickness substantially equal to that of the IC chip 202 will be used.

Next, a method of manufacturing the non-contact crimping card 2 will be described. FIG. 8 is a diagram illustrating a method of manufacturing the non-contact crimping card 2 according to the first embodiment. When the non-contact crimping card 2 is manufactured from the crimping card paper 20, the crimping card paper 20 is folded along the perforations 205 so that the surface of the inlet sheet area 200c and the surface of the spacer sheet area 200b overlap each other (FIG. 8). (A)) By folding the crimping card paper 20 along the perforations 204 so that the back surface of the front surface sheet area 200a and the back surface of the spacer sheet area 200b overlap each other, the crimping card paper 20 is folded in three outside (FIG. 8). (B)). Since the hole 201 formed in the spacer sheet region 200b of the crimping card paper 20 is formed at a position corresponding to the IC chip 202 mounted in the inlet sheet region 200c when the perforation 205 is the axis, crimping is performed. The hole 201 and the IC chip 202 can be accurately fitted by simply folding the card paper 20 in three. Further, since the crimping card paper 20 has a strip shape, the crimping card paper 20 can be continuously folded in three outside while being conveyed by using a plow folding machine or the like.

Next, the inner surface of the outer tri-folded crimping card paper 20 is fully crimped by applying pressure from above the outer tri-folded crimping card paper 20 using a pressure roller or the like (FIG. 8 (c)). Next, the non-contact crimping card 2 according to the first embodiment is manufactured by punching the crimping card paper 20 whose inner surface is entirely crimped into a card shape using a punching machine or the like (FIG. 8D).

[Example 2]
FIG. 9 is a diagram illustrating the non-contact crimping card 3 according to the second embodiment. The non-contact crimping card 3 according to the second embodiment is a card manufactured by folding the base paper 300 used for manufacturing the non-contact crimping card 3 according to the second embodiment in four, and is a non-contact crimping card according to the second embodiment. The base paper 300 folded in a substantially W shape appears on the short side end face of No. 3. The card front surface of the non-contact crimping card 3 according to the second embodiment is printed with the card face pattern 3a (here, the characters "Game Card" and the character pattern), and the card back surface is printed with the card face pattern 3b (here). Here, a lattice pattern) is printed.

FIG. 10 is a diagram for explaining the crimping card paper 30 according to the second embodiment, and FIG. 10A is a diagram showing the surface of the crimping card paper 30 according to the second embodiment. The crimping card paper 30 according to the second embodiment is manufactured by using the strip-shaped base paper 300, and the crimping card paper 30 is a front sheet area 300a, a spacer sheet area 300b, an inlet sheet area 300c, and a back sheet area 300d. Perforations 304, 305, and 306 that have two regions in the width direction and are used as folding lines are formed at the boundaries of the respective regions.

The surface sheet area 300a of the crimping card paper 30 according to the second embodiment is an area to be the surface sheet piece 100 of the sheet described with reference to FIG. 1, and the surface sheet area 300a is the face of the card surface shown in FIG. The pattern 3a is continuously printed in the longitudinal direction. The spacer sheet area 300b of the crimping card paper 30 according to the second embodiment is an area to be the spacer sheet piece 101 of the sheet described with reference to FIG. 1, and the spacer sheet area 300b is a face pattern printed on the surface sheet area 300a. The hole 301 is continuously formed in the longitudinal direction in a state corresponding to 3a. The inlet sheet area 300c of the crimping card paper 30 according to the second embodiment is an area to be the inlet sheet piece 102 of the sheet described with reference to FIG. 1, and the inlet sheet area 300c is a face pattern printed on the surface sheet area 300a. The antenna coil 303 and the IC chip 302 are continuously mounted in the longitudinal direction in a state corresponding to 3a. The back sheet area 300d of the crimping card paper 30 according to the second embodiment is an area serving as a back sheet piece to be the back surface of the non-contact crimping card 3, and the back sheet area 300d is the non-contact crimping card 3 shown in FIG. The card face pattern 3b to be printed on the back surface of the paper is continuously printed in the longitudinal direction.

When the crimping card paper 30 is folded along the perforation 305 that becomes the folding line, the spacer is fitted so that the IC chip 302 mounted in the inlet sheet area 300c and the hole 301 formed in the spacer sheet area 300b fit together. The hole 301 formed in the sheet region 300b is formed at a position corresponding to the IC chip 302 mounted in the inlet sheet region 300c when the perforation 305 is the axis.

FIG. 10B is a cross-sectional view of the crimping card paper 30 according to the second embodiment. The crimping card paper 30 according to the second embodiment has a layer structure in which a pressure-sensitive adhesive is applied to both sides of the base paper 300 to obtain an adhesive strength that cannot be peeled off by superimposing the coated surfaces and applying pressure. There is. As such a pressure-sensitive adhesive, an adhesive using natural rubber latex as an adhesive main agent can be used. The face pattern of the surface sheet area 300a or the like is printed on the pressure-sensitive adhesive, and the antenna coil and the IC module of the inlet sheet are mounted on the pressure-sensitive adhesive.

In the second embodiment, the crimping card paper 30 is provided with the back surface sheet area 300d in order to increase the thickness of the non-contact crimping card 3. When the hole 301 and the IC chip 302 are fitted to suppress the unevenness of the card surface, the thickness of the base paper 300 must be substantially equal to the thickness of the IC chip 302, but when the thickness of the IC chip 302 is thin. , The card thickness becomes thin when the three-layer structure is used as in the first embodiment. Therefore, in the second embodiment, the back sheet area 300d is provided on the crimping card paper 30, and the non-contact crimping card 3 has a four-layer structure so that the card thickness can be made thicker than the three-layer structure. In order to form the non-contact crimping card 3 into a four-layer structure, the crimping card paper 30 is folded not in three but in four.

FIG. 11 is a diagram illustrating a method of manufacturing the crimping card paper 30 according to the second embodiment. When the crimping card paper 30 according to the second embodiment is manufactured, the pressure-sensitive adhesive 300e, which can obtain a non-peelable adhesive strength by superimposing the coated surfaces and applying pressure, is applied on the base paper 300 coated on both sides. A printing step is performed in which at least the face pattern 3a on the front surface of the card and the face pattern 3b on the back side of the card are printed using an offset printing machine or the like (S20).

FIG. 12 is a diagram illustrating the base paper 300 after the printing process. In the base paper 300 after the printing process, the face pattern 3a on the card surface is continuously printed in the area used as the surface sheet area 300a. Further, in the base paper 300 after the printing process, the first register mark pattern 301a indicating the area forming the hole 301 corresponding to the ticket face pattern 3a on the card surface is printed in the area used as the spacer sheet area 300b. .. Further, in the base paper 300 after the printing process, a second register mark pattern 303a indicating an area for mounting the antenna coil 303 and the like is printed in the area used as the inlet sheet area 300c. Further, Kenmen pattern 3 b of the back of the card, in the base sheet 300 after the printing process, are printed in succession on the back seat area 300d.

After the above-mentioned printing step is carried out, a hole forming step of forming a hole 301 in the printed base paper 300 is carried out using a punching machine such as a rotary die (S21). FIG. 13 is a diagram illustrating the base paper 300 after the hole forming step. In the base paper 300 after the hole forming step, a hole 301 penetrating the base paper 300 is formed at the position of the first register mark pattern 301a printed in the printing step by using a punching machine such as a rotary die. ing. Further, on the base paper 300 after the hole forming step shown in FIG. 13, the width of the base paper 300 is divided into three, a surface sheet area 300a, a spacer sheet area 300b, and an inlet sheet area 300c, by using a perforation machine. Perforations 304, 305, and 306 that divide the direction are formed.

After the hole forming step is carried out, an inlet forming step of mounting the antenna coil 303 and the IC chip 302 on the base paper 300 after forming the hole 301 is carried out (S22), and the crimping shown in FIG. 10 is performed. Card paper 30 is manufactured.

As the material of the base paper 300 of the crimping card paper 30, paper or a plastic film (for example, PET film) can be used. If the thickness of the base paper 300 is thicker than the thickness of the IC chip, when the hole 301 and the IC chip are fitted, a step is generated due to the difference between the thickness of the base paper 300 and the thickness of the IC chip, so that the IC chip 302 The base paper 300 having a thickness substantially equal to that of the above is used.

Next, a method of manufacturing the non-contact crimping card 3 according to the second embodiment will be described. FIG. 14 is a diagram illustrating a method of manufacturing the non-contact crimping card 3 according to the second embodiment. When the non-contact crimping card 3 is manufactured from the crimping card paper 30, the crimping card paper 30 is folded along the perforation 306 so that the back surface of the back surface sheet area 300d and the back surface of the inlet sheet area 300c overlap each other (FIG. 14 (a). )) Further, after folding the crimping card paper 30 along the perforation 305 so that the surface of the inlet sheet area 300c and the surface of the spacer sheet area 300b overlap each other (FIG. 14B), the surface sheet area 300a By folding the crimping card paper 30 along the perforation 304 so that the back surface and the back surface of the spacer sheet area 300b overlap each other, the crimping card paper 30 is folded in four outside (FIG. 14 (c)). The hole 301 formed in the spacer sheet area 300b of the crimping card paper 30 is formed at a position corresponding to the IC chip 302 mounted in the inlet sheet area 300c when the perforation 305 is the axis, and thus is crimped. The hole 301 and the IC chip 302 can be accurately fitted by a simple process of folding the card paper 30 in four. Further, since the crimping card paper 30 has a strip shape, it can be continuously folded in four outside while the crimping card paper 30 is conveyed by using a plow folding machine or the like.

Next, the inner surface of the outer tri-folded crimping card paper 30 is fully crimped by applying pressure from above the outer tri-folded crimping card paper 30 using a pressure roller or the like (FIG. 14 (d)). Next, the non-contact crimping card 3 according to the second embodiment is manufactured by punching the crimping card paper 30 whose inner surface is entirely crimped into a card shape using a punching machine or the like (FIG. 14 (e)).

1 Non-contact crimping card 100 Surface sheet piece 101 Spacer sheet piece 102 Inlet sheet piece 103 IC chip 104 Antenna coil 105 Hole 2 Non-contact crimping card 20 Crimping card paper 200 Base paper 200a Surface sheet area 200b Spacer sheet area 200c Inlet sheet area 201 Hole 202 IC chip 203 Antenna coil 204,205 Perforation 3 Non-contact crimping card 30 Crimping card paper 300 Base paper 300a Front sheet area 300b Spacer sheet area 300c Inlet sheet area 300d Back side sheet area 301 Hole 302 IC chip 303 Antenna Coil 304, 305, 306 Perforations

Claims (2)

When the boundary between the inlet sheet piece on which the antenna coil and the IC chip are mounted and the inlet sheet piece is the axis, the IC chip of the inlet sheet piece is fitted to the IC chip at a position corresponding to the IC chip of the inlet sheet piece. A sheet in which three sheet pieces, a spacer sheet piece forming a hole to be combined and a surface sheet piece to be a surface layer, are connected in this order is the IC chip of the hole of the spacer sheet piece and the inlet sheet piece. Is fitted, and the spacer sheet piece is folded in three outside so as to be between the surface sheet piece and the inlet sheet piece, and the inner surface of the folded state is pressure-sensitive. A non-contact crimping card characterized in that it is strongly adhered by an adhesive so that it cannot be peeled off. When the boundary between the inlet sheet area in which the antenna coil and the IC chip are continuously mounted in the longitudinal direction and the inlet sheet area is the axis, the inlet sheet area is located at a position targeted by the IC chip in the inlet sheet area. The crimping card paper is characterized by having three regions in the width direction in this order: a spacer sheet region in which a hole to be fitted with the IC chip is formed and a surface sheet region used as a card surface.

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