JP6786429B2 - Substrate processing equipment, substrate processing system, and substrate processing method - Google Patents

Description

The present invention relates to a semiconductor wafer, a glass substrate for a liquid crystal display device, a glass substrate for a plasma display, a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, a glass substrate for a photomask, a substrate for a solar cell, and the like (hereinafter, It relates to a substrate processing technique for processing a substrate (simply referred to as a "board").

Patent Document 1 includes a chemical solution processing unit that stores a chemical solution, stores the lot and performs treatment with the chemical solution, and a transport unit that transports the lot between the delivery position of the input lot and the chemical solution processing unit. A substrate processing device is shown. After a predetermined time from the loading of the lot, the apparatus instructs the chemical solution processing unit to exchange the chemical solution in consideration of the time required for the chemical solution exchange and the transport time of the lot, and the chemical solution processing unit starts the chemical solution exchange according to the instruction. .. When the time from the chemical solution exchange to the start of lot processing exceeds the permissible time, the device is intended to prevent poor lot processing by generating an alarm.

Japanese Unexamined Patent Publication No. 2011-210315

However, in the substrate processing apparatus of Patent Document 1, when the chemical solution treatment unit is instructed to exchange the chemical solution, the chemical solution exchange is started regardless of whether or not the chemical solution can be supplied to the chemical solution treatment unit. Therefore, when it is impossible to supply the chemical solution, it takes a long time for the new chemical solution to be supplied to the chemical solution treatment section after the chemical solution is discharged from the chemical solution treatment section. As a result, there is a problem that the chemical solution adhering to the treatment tank of the chemical solution treatment unit dries and particles are generated.

The present invention has been made to solve such a problem, and is a substrate processing technique capable of suppressing the generation of particles in a treatment tank when the chemical solution supply source cannot supply the chemical solution when exchanging the chemical solution stored in the treatment tank. The purpose is to provide.

In order to solve the above problems, the substrate processing apparatus according to the first aspect is a substrate processing apparatus that processes a substrate with a chemical solution supplied from a predetermined chemical solution supply source, and is supplied from the chemical solution supply source. A treatment tank that stores a chemical solution and immerses the substrate in the chemical solution to perform a predetermined treatment on the substrate, a discharge unit that performs a discharge operation of discharging the chemical solution stored in the treatment tank from the treatment tank, and the discharge unit. A discharge control unit that causes the discharge unit to perform the discharge operation when exchanging the chemical solution stored in the treatment tank, and a discharge control unit that causes the discharge unit to perform the discharge operation before the discharge unit performs the discharge operation. A determination unit that performs a determination process for determining whether or not supply is possible is provided, and when the determination unit determines in the determination process that the chemical solution can be supplied by the chemical solution supply source, the determination unit is provided. The discharge control unit causes the discharge unit to start the discharge operation.

The substrate processing apparatus according to the second aspect is the substrate processing apparatus according to the first aspect, wherein the chemical solution stored in the processing tank is discharged from the processing tank and returned to the processing tank again. It also has a circulatory system that circulates the drug solution.

The substrate processing apparatus according to the third aspect is the substrate processing apparatus according to the second aspect, and the circulation system includes a filter for filtering the chemical solution.

The substrate processing apparatus according to the fourth aspect is the substrate processing apparatus according to the second or third aspect, and the determination unit determines in the determination process that the chemical solution cannot be supplied by the chemical solution supply source. In this case, the circulation control unit for causing the circulation system to circulate the chemical solution to the treatment tank is further provided.

The substrate processing apparatus according to the fifth aspect is the substrate processing apparatus according to any one of the first to fourth aspects, and further includes a heater for heating the chemical solution.

The substrate processing apparatus according to the sixth aspect is the substrate processing apparatus according to the fifth aspect, and when the determination unit determines in the determination process that the chemical solution supply source cannot supply the chemical solution. Further, a heating control unit for operating the heater is provided.

The substrate processing system according to the seventh aspect includes the substrate processing apparatus according to any one of the first to sixth aspects and the chemical solution supply source.

The substrate treatment method according to the eighth aspect is a substrate treatment method for treating a substrate with a chemical solution supplied from a predetermined chemical solution supply source, and the chemical solution is prepared from a treatment tank for storing the chemical solution supplied by the chemical solution supply source. The discharge step for discharging and a determination step for determining whether or not the chemical solution supply source can supply the chemical solution at the time of exchanging the chemical solution stored in the treatment tank are provided prior to the discharge step. The discharge step is a step of starting the discharge of the chemical solution from the treatment tank when it is determined in the determination step that the chemical solution can be supplied by the chemical solution supply source.

The substrate processing method according to the ninth aspect is the substrate processing method according to the eighth aspect, and when it is determined in the determination step that the chemical solution cannot be supplied by the chemical solution supply source, the processing tank. Further provided is a circulation step for causing the circulation of the drug solution to.

The substrate processing method according to the tenth aspect is the substrate processing method according to the eighth or ninth aspect, and when it is determined in the determination step that the chemical solution cannot be supplied by the chemical solution supply source. A heating step for heating the chemical solution is further provided.

According to the invention according to the first aspect, the determination unit performs a determination process for determining whether or not the chemical solution can be supplied by the chemical solution supply source before the discharge control unit causes the discharge unit to perform the discharge operation. When the determination unit determines in the determination process that the chemical solution can be supplied by the chemical solution supply source, the discharge control unit causes the discharge unit to start the discharge operation. Therefore, when the chemical solution supply source cannot supply the chemical solution, the discharge unit does not start the discharge operation, and the chemical solution adhering to the treatment tank can be suppressed from being exposed for a long period of time, so that the generation of particles in the treatment tank can be suppressed.

According to the invention according to the fourth aspect, when it is determined in the determination process that the chemical solution cannot be supplied by the chemical solution supply source, the circulation control unit causes the circulation system to circulate the chemical solution to the treatment tank. Therefore, the uniformity of the chemical solution in the treatment tank can be improved even during the period when the chemical solution supply source cannot supply the chemical solution.

According to the invention according to the sixth aspect, when the determination unit determines that the chemical solution cannot be supplied by the chemical solution supply source in the determination process, the heating control unit operates the heater. Therefore, the chemical solution in the treatment tank can be heated even during the period when the chemical solution supply source cannot supply the chemical solution. As a result, an increase in the viscosity of the chemical solution can be suppressed.

According to the invention according to the eighth aspect, the determination step is executed before starting the exchange of the chemical solution stored in the treatment tank. When it is determined in the determination step that the chemical solution can be supplied from the chemical solution supply source, the discharge step is executed and the discharge of the chemical solution from the treatment tank is started. Therefore, if the chemical solution supply source cannot supply the chemical solution, the discharge of the chemical solution from the treatment tank is not started. As a result, it is possible to prevent the chemical solution adhering to the treatment tank from being exposed for a long period of time, so that the generation of particles in the treatment tank can be suppressed.

According to the invention according to the ninth aspect, when it is determined in the determination step that the chemical solution cannot be supplied from the chemical solution supply source, the circulation step is executed to circulate the chemical solution to the treatment tank. Therefore, the uniformity of the chemical solution in the treatment tank can be improved even during the period when the chemical solution supply source cannot supply the chemical solution.

According to the invention according to the tenth aspect, when it is determined in the determination step that the chemical solution cannot be supplied from the chemical solution supply source, the heating step is executed to heat the chemical solution. Therefore, the chemical solution in the treatment tank can be heated even during the period when the chemical solution supply source cannot supply the chemical solution. As a result, an increase in the viscosity of the chemical solution can be suppressed.

It is a top view which shows an example of the schematic structure of the substrate processing system provided with the substrate processing apparatus which concerns on embodiment. It is a block diagram which shows an example of the schematic structure of the substrate processing system of FIG. It is a schematic diagram which shows an example of the schematic structure of the substrate processing system of FIG. It is a block diagram which shows an example of the schematic structure of the processing liquid supply source of FIG. It is a time chart which shows an example of the chemical liquid exchange operation of the substrate processing apparatus of FIG. It is a flowchart which shows an example of the chemical liquid processing operation of the substrate processing apparatus of FIG. It is a flowchart which shows an example of the operation which concerns on exchange of a chemical solution of FIG.

Hereinafter, embodiments will be described with reference to the drawings. The following embodiments are examples that embody the present invention, and are not examples that limit the technical scope of the present invention.

<1. Configuration of board processing device 1 (board processing system 100)>
FIG. 1 is a plan view showing an example of a schematic configuration of a substrate processing system 100 including the substrate processing apparatus 1 according to the embodiment. FIG. 2 is a block diagram showing an example of a schematic configuration of the substrate processing system 100.

The substrate processing system 100 is, for example, an apparatus for performing a chemical solution treatment, a pure water cleaning treatment, and a drying treatment on the substrate W. The substrate processing system 100 includes a substrate processing apparatus 1 and a chemical liquid supply source 65 that supplies a chemical liquid to the substrate processing apparatus 1 via a supply pipe 67. The substrate processing device 1 includes a charging unit 3, a payout unit 7, a first transfer mechanism CTC, a second transfer mechanism WTR, a drying processing unit LPD, a first processing unit 19, and a second processing unit 21. Includes. The detailed structure of the chemical supply source 65 will be described later.

The loading unit 3 is provided with two mounting tables 5 for mounting the cassette 2. The cassette 2 in which the unprocessed substrate W is housed is placed on the mounting table 5. The cassette 2 stores a plurality of sheets (for example, 25 sheets) in a horizontal posture. For example, the plurality of substrates W in the cassette 2 are treated as one lot, which is a unit of processing, in the substrate processing apparatus 1. However, even one substrate W may be accommodated in the cassette 2 and treated as one lot.

A payout unit 7 is provided at a position adjacent to the input unit 3. The payout unit 7 is provided with two mounting stands 9 for mounting the cassette 2. The substrate W whose substrate has been processed by the substrate processing apparatus 1 is housed in the cassette 2 on the mounting table 9. When the substrate W for one lot is accommodated in the cassette 2, the cassette 2 is discharged from the mounting table 9 to the outside of the substrate processing device 1 by a cassette transfer robot (not shown).

A first transport mechanism CTC configured to be movable between the charging section 3 and the payout section 7 is provided at a position along the feeding section 3 and the payout section 7. The first transfer mechanism CTC takes out the lot stored in the cassette 2 placed on the charging unit 3, and then transfers the lot to the second transfer mechanism WTR. Further, the first transport mechanism CTC receives the processed lot from the second transport mechanism WTR, and then stores the lot in the cassette 2. The second transfer mechanism WTR is movable in the longitudinal direction of the substrate processing device 1. The first transport mechanism CTC counts the number of substrates W stored in the cassette 2 when the substrate W is carried out from the cassette 2. In other words, the first transfer mechanism CTC recognizes the lot and also recognizes the number of substrates W constituting the lot. The count value by the first transport mechanism CTC is transmitted to the control unit 25 and is used when determining whether or not the replacement timing of the chemical solution stored in the processing tank 41 has been reached. In the above, the number of lots charged into the substrate processing device 1 or the number of substrates W is counted by the first transfer mechanism CTC, but is counted by an element other than the first transfer mechanism CTC, for example, the second substrate transfer mechanism WTR. You may do so.

A drying processing unit LPD for storing and drying a plurality of substrates W in a low-pressure chamber is provided on the foremost side in the moving direction of the second transport mechanism WTR when the unprocessed substrate W is transported. .. The drying processing unit LPD accommodates the lot in a low-pressure chamber and dries it.

The first processing unit 19 is arranged adjacent to the drying processing unit LPD and on the opposite side of the first transport mechanism CTC sandwiching the drying processing unit LPD. The first processing unit 19 includes a pure water cleaning processing unit ONB1 and a chemical solution processing unit CHB1. The pure water cleaning processing unit ONB1 performs pure water cleaning processing on the lot. The chemical treatment unit CHB1 performs chemical treatment on the lot. In addition, the first processing unit includes an auxiliary transport mechanism LFS1. The sub-transport mechanism LFS1 transfers the lot to and from the second transfer mechanism WTR, and can move up and down only at the positions of the pure water cleaning processing unit ONB1 and the chemical solution processing unit CHB1.

The second processing unit 21 is arranged at a position adjacent to the first processing unit 19. The second processing unit 21 has the same configuration as the first processing unit 19 described above. That is, the second processing unit 21 includes a pure water cleaning processing unit ONB2, a chemical solution processing unit CHB2, and an auxiliary transport mechanism LFS2.

The first transfer mechanism CTC, the second transfer mechanism WTR, the auxiliary transfer mechanisms LFS1 and LFS2 are substrate transfer mechanisms 6 that convey the substrate W (lot).

An indicator 23 is attached to the side surface of the mounting table 5. The indicator 23 is operated by the operator of the device. The operator operates the instruction unit 23 to instruct, for example, a recipe number for associating a recipe that defines a procedure for processing a lot with a lot of a cassette 2 placed on a mounting table 5.

The substrate processing system 100 configured as described above is collectively controlled by the control unit 25 as shown in the block diagram of FIG.

The control unit 25 includes a CPU, a scheduling unit, and the like (not shown). A memory 31 is electrically connected to the control unit 25. The memory 31 stores a program PG1 for creating a schedule, a created schedule, a program PG2 for executing the schedule, and the like. The program PG1 for creating a schedule defines at what timing the lot is transferred to each processing unit based on the recipe instructed by the instruction unit 23. By executing the program PG2, the CPU of the control unit 25 also operates as the discharge control unit 26, the determination unit 27, the circulation control unit 28, and the heating control unit 29.

Further, the memory 31 has, for example, a "life count" that defines the number of substrates W to be processed and the number of lots that are allowed to be processed by the chemical solution stored in the processing tank 41, and after the chemical solution is newly generated. It also remembers the "lifetime" that defines the period during which the drug solution can be used. Lifetime and life count are determined in advance by experiments and the like. As the life count, the life count used for partial liquid exchange described later and the life count used for total liquid exchange described later may be stored in the memory 31.

The discharge control unit 26 causes the discharge unit 84, which will be described later, to perform a discharge operation when the chemical solution stored in the treatment tank 41 of the chemical solution treatment unit CHB1 (CHB2) is replaced. The determination unit 27 executes a determination process for determining whether or not the chemical solution supply source 65 can supply the chemical solution before the discharge control unit 26 causes the discharge unit 84 to perform the discharge operation. When it is determined that the chemical solution supply source 65 can supply the chemical solution, the discharge control unit 26 causes the discharge unit 84 to start the discharge operation.

When the determination unit 27 determines in the determination process that the chemical solution supply source 65 cannot supply the chemical solution, the circulation control unit 28 causes the circulation system 52, which will be described later, to circulate the chemical solution to the treatment tank 41.

Further, the notification unit 33 is electrically connected to the control unit 25. The notification unit 33 is, for example, a lamp that notifies by emitting light, a buzzer or a speaker that notifies by voice, and the like. When a predetermined waiting time elapses while the chemical solution supply source 65 is performing the above determination process, the notification unit 33 notifies that the waiting time has elapsed by light emission or voice.

FIG. 3 is a schematic view showing an example of a schematic configuration of the substrate processing system 100. The substrate processing system 100 includes a substrate processing device 1 and a chemical solution supply source 65. The chemical solution supply source 65 is a device provided outside the substrate processing device 1, and supplies the chemical solution to the substrate processing device 1 from the outside of the substrate processing device 1. The substrate processing device 1 processes the substrate W with the chemical solution supplied from the chemical solution supply source 65. In this substrate processing system 100, the chemical solution supply source 65 is arranged outside the substrate processing apparatus 1, but the chemical solution supply source 65 may be arranged inside the substrate processing apparatus 1.

The substrate processing device 1 includes a chemical solution processing unit CHB1 (CHB2), a control unit 25, and a memory 31. The chemical treatment unit CHB1 (CHB2) includes a treatment tank 41 and a holding arm 47. The treatment tank 41 stores the chemical solution supplied by the chemical solution supply source 65, and immerses the substrate W in the chemical solution to perform a predetermined treatment. The treatment tank 41 includes an inner tank 43 and an outer tank 45 that collects the chemical solution overflowing from the inner tank 43. The holding arm 47 abuts and supports a plurality of substrates W constituting the lot in an upright posture. The holding arm 47 is configured to be able to move up and down, and raises and lowers the supported substrate W between the processing position in the inner tank 43 and the standby position above the inner tank 43. The sub-conveyance mechanism LFS1 (LFS2) described above includes the holding arm 47.

The chemical treatment unit CHB1 (CHB2) further includes a circulatory system 52 and a discharge unit 84. The circulation system 52 is configured so that the chemical solution can be circulated by discharging the chemical solution stored in the treatment tank 41 from the treatment tank 41 and returning the chemical solution to the treatment tank 41 again via the circulation pipe 53. The discharge unit 84 is configured to be able to perform a discharge operation of discharging the chemical solution stored in the treatment tank 41 from the treatment tank 41.

The inner tank 43 of the treatment tank 41 is provided with a pair of ejection pipes 49 at the bottom for supplying the chemical solution. Further, the outer tank 45 is provided with a discharge port 51 at the bottom for discharging the collected chemical solution. The ejection pipe 49 and the discharge port 51 are communicated with each other by a circulation pipe 53. A pump 55, a heater 57, and a filter 59 are arranged in this circulation pipe 53 in order from the discharge port 51 side. The chemical liquid overflowing from the inner tank 43 to the outer tank 45 is guided from the discharge port 51 to the circulation pipe 53 by the operation of the pump 55, and flows into the inner tank 43 from the pair of ejection pipes 49 through the circulation pipe 53. As a result, the chemical solution in the treatment tank 41 circulates in the treatment tank 41 again from the pair of ejection pipes 49 through the circulation pipe 53 from the discharge port 51. The circulation system 52 includes a discharge port 51, a circulation pipe 53, a pair of ejection pipes 49, and a pump 55.

For example, the heater 57 has a function of heating the chemical solution flowing through the circulation pipe 53, and heats the chemical solution to a temperature within a predetermined range (for example, 120 to 180 ° C.) under the control of the heating control unit 29. The filter 59 has a function of removing particles and the like in the chemical solution by filtering the chemical solution flowing through the circulation pipe 53. In the circulation pipe 53, an on-off valve 61 is arranged between the discharge port 51 and the pump 55, and an on-off valve 63 is arranged between the pump 55 and the heater 57.

One end side of the supply pipe 67 is communicated with the chemical solution supply source 65. A control valve 69 capable of controlling the flow rate is provided in the supply pipe 67. The other end side of the supply pipe 67 is communicated with a nozzle 71 provided in the upper part of the outer tank 45. The nozzle 71 includes a discharge port facing the outer tank 45. The chemical solution supplied from the chemical solution supply source 65 is supplied from the nozzle 71 to the outer tank 45 through the supply pipe 67 at a flow rate determined by the opening degree of the control valve 69.

Among the circulation pipes 53 described above, a branch portion 73 is arranged between the pump 55 and the on-off valve 63. The portion of the circulation pipe 53 on the upstream side of the branch portion 73 is also used for discharging the chemical solution in the outer tank 45. Further, a bottom discharge port 75 used for discharging the chemical solution in the inner tank 43 is formed at the bottom of the inner tank 43. The bottom discharge port 75 and a part of the circulation pipe 53 on the upstream side of the pump 55 are communicated with each other by the bottom discharge pipe 77. An on-off valve 79 is provided in the bottom discharge pipe 77. The branch portion 73 is provided with a drainage pipe 81 for guiding the chemical liquid flowing through the circulation pipe 53 to a waste liquid tank or the like. An on-off valve 83 is provided in the drainage pipe 81.

When the chemical solution in the treatment tank 41 is discharged, the chemical solution in the outer tank 45, the chemical solution in the inner tank 43, and the chemical solution remaining in the circulation pipe 53 are discharged in this order. When the pump 55 operates with the on-off valve 63 closed and the on-off valve 61 and the on-off valve 83 open, the chemical liquid in the outer tank 45 is discharged from the discharge port 51, the circulation pipe 53, and the drain pipe 81. It is discharged through. By operating the pump 55 with the on-off valve 63 closed and the on-off valve 79 and the on-off valve 83 open, the chemical liquid in the inner tank 43 is supplied to the bottom discharge port 75, the bottom discharge pipe 77, and the circulation pipe 53. , Is discharged via the drainage pipe 81. Further, the portion of the circulation pipe 53 on the side (downstream side) of the pair of ejection pipes 49 from the branch portion 73 is inclined so that the pair of ejection pipes 49 are above the branch portion 73. Therefore, when the on-off valve 63 and the on-off valve 83 are opened to stop the pump 55, the chemical solution remaining in the circulation pipe 53 is discharged through the drainage pipe 81 by the action of gravity. The discharge portion 84 includes a discharge port 51, a circulation pipe 53, a bottom discharge port 75, a bottom discharge pipe 77, a liquid drain pipe 81, and a pump 55.

Each of the above-described configurations is collectively controlled by the control unit 25. The control unit 25 operates the on-off valve 83, the control valve 69, the chemical solution supply source 65, and the like based on at least one of the life count and the lifetime stored in the memory 31, for example, to replace all solutions or partial solutions. Make a replacement.

In the partial liquid exchange, for example, after the number of processed substrates (or the number of processed lots) of the substrate W reaches the life count for partial liquid exchange, a predetermined amount of the chemical solution corresponding to a part of the chemical solution in the processing tank 41 is drained. This is a process of discharging from 81 and supplying a new chemical solution corresponding to the predetermined amount from the nozzle 71 to the processing tank 41.

In the whole solution exchange, for example, after the chemical solution is generated and supplied into the treatment tank 41 and the usage period of the chemical solution reaches the lifetime, a predetermined amount of the chemical solution corresponding to the total amount of the chemical solution in the treatment tank 41 is drained. This is a process of discharging from the pipe 81 and supplying a new chemical solution corresponding to the predetermined amount from the nozzle 71 to the treatment tank 41.

FIG. 4 is a block diagram showing an example of a schematic configuration of the chemical solution supply source 65. The chemical solution supply source 65 mainly includes a sulfuric acid electrolytic cell 101, an anolyte solution tank 106, a cathode solution tank 114, and a control unit 130 that controls the operation of each part of the chemical solution supply source 65. The control unit 130 is composed of, for example, a general computer or the like.

The sulfuric acid electrolytic cell 101 is divided into an anode chamber 104 and a cathode chamber 112 by a diaphragm 102, a conductive diamond anode 103 is provided in the anode chamber 104, and a cathode 111 is provided in the cathode chamber 112. An anode liquid tank 106 is provided outside the sulfuric acid electrolytic cell 101.

First, according to the control of the control unit 130, 98% by mass of concentrated sulfuric acid and ultrapure water from the concentrated sulfuric acid supply source (not shown) and the ultrapure water supply source (not shown) from the concentrated sulfuric acid supply line 124 and the ultrapure water supply line 125. Pure water is supplied respectively. As a result, a first sulfuric acid solution having a concentration of 70% by mass or less is prepared in the anolyte tank 106. When the concentration of the first sulfuric acid solution is 70% by mass or less, the current efficiency becomes 40% or more, and efficient electrolysis can be performed.

The first sulfuric acid solution is supplied into the anolyte chamber 104 via the anolyte supply line 109 connecting the anolyte tank 106 and the anolyte chamber 104. More specifically, the anolyte supply line 109 is provided with an anolyte circulation pump 105 and an anolyte chamber valve 119. The control unit 130 operates the anolyte circulation pump 105 and opens the anolyte chamber valve 119. As a result, the first sulfuric acid solution is supplied from the anolyte tank 106 to the anolyte chamber 104 as the anolyte.

The first sulfuric acid solution supplied into the anode chamber 104 is subjected to electrolysis to generate the first electrolytic sulfuric acid containing an oxidizing substance. Electrolytic sulfuric acid refers to an electrolytic product obtained by electrolyzing sulfuric acid, and is an oxidizing substance produced by electrolysis of peroxo1 sulfuric acid, peroxo2 sulfuric acid, ozone, hydrogen peroxide, etc., in addition to sulfuric acid added as an electrolytic solution. It is the one that includes. Further, peroxo1 sulfuric acid and peroxo2 sulfuric acid are generically called persulfuric acid.

The anode chamber 104 and the anode liquid tank 106 are also connected by the anode liquid circulation line 110. By operating the anolyte circulation pump 105, the first electrolytic sulfuric acid and the anolyte gas circulate between the anolyte chamber 104 and the anolyte tank 106 via the anolyte supply line 109 and the anolyte circulation line 110. Therefore, the first electrolytic sulfuric acid containing the produced oxidizing substance is sufficiently agitated. The anodic gas is gas-liquid separated in the anolyte tank 106 and discharged from the anodic gas exhaust line 107 to the outside of the chemical solution supply source 65.

A concentrated sulfuric acid supply source (not shown) is also connected to the cathode liquid tank 114 by a concentrated sulfuric acid supply line (not shown), and an ultrapure water supply source (not shown) is connected by an ultrapure water supply line (not shown). (Shown) is connected. According to the control of the control unit 130, 98% by mass of concentrated sulfuric acid and ultrapure water are supplied from the concentrated sulfuric acid supply source and the ultrapure water supply source, respectively. As a result, a sulfuric acid solution having the same concentration as the first sulfuric acid solution supplied into the anode chamber 104 is prepared in the cathode liquid tank 114. The cathode liquid supply line 118 connects the cathode chamber 112 and the cathode liquid tank 114. The cathode liquid supply line 118 is provided with a cathode liquid circulation pump 113. When the control unit 130 operates the anode liquid circulation pump 105, the cathode liquid composed of the sulfuric acid solution prepared in the cathode liquid tank 114 is sent from the cathode liquid tank 114 to the cathode chamber 112 via the cathode liquid supply line 118. Be supplied.

After being subjected to electrolysis, the cathode liquid circulates between the cathode chamber 112 and the cathode liquid tank 114 via the cathode liquid supply line 118 and the cathode liquid circulation line 117 together with the generated cathode gas. This circulation is performed by operating the cathode liquid circulation pump 113. The cathode gas is gas-liquid separated in the cathode liquid tank 114 and discharged from the cathode gas exhaust line 115 to the outside of the chemical liquid supply source 65. The anode liquid supply line 109 is provided with a pressure flow meter 108 for detecting the pressure and flow rate of the anode liquid, and the cathode liquid supply line 118 is provided with a pressure flow meter 116 for detecting the pressure and flow rate of the anode liquid. Has been done.

Next, according to the control of the control unit 130, 98% by mass of concentrated sulfuric acid is added to the anolyte tank 106 to prepare a second sulfuric acid solution having a concentration higher than that of the first sulfuric acid solution. The concentration of this second sulfuric acid solution is preferably adjusted to 80% by mass or more in the anolyte tank 106. The second sulfuric acid solution is supplied into the anode chamber 104 of the sulfuric acid electrolytic cell 101 via the anode liquid supply line 109, mixed with the first electrolytic sulfuric acid, and subjected to electrolysis. As a result, a second electrolytic sulfuric acid containing an oxidizing substance is produced. The generated second electrolytic sulfuric acid and anodic gas are circulated between the anolyte chamber 104 and the anolyte tank 106 via the anolyte supply line 109 and the anolyte circulation line 110 by operating the anolyte circulation pump 105. .. Therefore, the second electrolytic sulfuric acid containing the produced oxidizing substance is sufficiently agitated.

The resist peeling performance by electrolytic sulfuric acid is good at a sulfuric acid concentration of 80% by mass or more, and at a sulfuric acid concentration lower than this, the peeling performance is not high even if the oxidizing substance concentration is high, and it takes a long time to peel the resist. become.

In addition, the second electrolytic sulfuric acid containing the oxidizing substance produced as described above is sufficiently agitated, so that a uniform chemical solution (“cleaning solution”) is obtained. It is desirable that the concentration of the sulfuric acid solution supplied to the cathode chamber 112 is the same as that of the first sulfuric acid solution supplied to the anode chamber 104. A supply pipe 67 is connected to the anolyte supply line 109, and a chemical liquid supply valve 120 is provided in the supply pipe 67.

The chemical solution supply source 65 cannot immediately generate an amount of the second electrolytic sulfuric acid that can be supplied to the chemical solution treatment unit CHB1 (CHB2). Therefore, the chemical solution supply source 65 is configured to be able to notify whether or not the second electrolytic sulfuric acid, that is, the chemical solution can be supplied to the chemical solution processing unit CHB1 (CHB2). Specifically, the control unit 130 can supply the chemical solution (second electrolytic sulfuric acid) to the substrate processing apparatus 1 after a predetermined time has elapsed from the start of the second electrolytic sulfuric acid production process, for example. A signal 92 indicating that the chemical solution can be supplied is supplied to the control unit 25 of the control unit 130. The signal 92 is set to a value (eg, "High" level) indicating that the drug solution can be supplied. When the second electrolytic sulfuric acid cannot be supplied to the substrate processing apparatus 1, the control unit 130 supplies the control unit 25 with a signal 91 indicating that the chemical solution cannot be supplied. The signal 91 is set to a value (eg, "Low" level) indicating that the drug solution cannot be supplied.

As a method for the control unit 130 to determine whether or not to supply the second electrolytic sulfuric acid to the substrate processing apparatus 1, a method other than the above-mentioned determination method based on the processing time can be adopted. For example, a branch line that branches from the anolyte supply line 109 and joins the anolyte supply line 109 again is provided, and a concentration sensor for measuring the concentration of the oxidizing substance of the second electrolytic sulfuric acid is provided in the branch line. , Whether or not to supply the second electrolytic sulfuric acid may be determined based on the concentration of the oxidizing substance measured by the concentration sensor. As such a concentration sensor, for example, the oxidant concentration monitoring device disclosed in Japanese Patent No. 6024936 can be adopted. Further, for example, a thermometer is provided in the anode liquid supply line 109, the temperature of the second electrolytic sulfuric acid is measured by the thermometer, and the control unit 130 measures the temperature of the second electrolytic sulfuric acid based on the concentration and temperature of the second electrolytic sulfuric acid. You may judge whether or not the electrolytic sulfuric acid of the above can be supplied.

Further, the chemical solution supply source 65 further includes, for example, a storage tank having a capacity capable of supplying a sufficient amount of the chemical solution to the processing tank 41 of the substrate processing apparatus 1, and stores the generated second electrolytic sulfuric acid in the storage tank. The control unit 130 may determine whether or not the chemical solution can be supplied depending on whether or not the second electrolytic sulfuric acid having a predetermined capacity is accumulated in the storage tank.

If the control unit 130 of the chemical solution supply source 65 receives the signal 95 instructing the start of supply of the second electrolytic sulfuric acid (chemical solution) from the control unit 25 of the substrate processing device 1, the chemical solution can be supplied, if the chemical solution can be supplied. Open the supply valve 120. As a result, the chemical solution is supplied to the substrate processing device 1 via the anode chamber valve 119, the chemical solution supply valve 120, and the supply pipe 67.

When the control unit 25 of the substrate processing device 1 receives the signal 96 instructing to stop the supply of the second electrolytic sulfuric acid (chemical solution), the control unit 130 closes the chemical solution supply valve 120. As a result, the supply of the chemical solution from the chemical solution supply source 65 to the substrate processing device 1 is stopped.

The chemical solution supply source 65 supplies electrolytic sulfuric acid as a chemical solution, but the chemical solution supply source 65 may supply another chemical solution. For example, a chemical solution supply source 65 that adjusts and supplies a phosphoric acid solution containing phosphoric acid (H ₃ PO ₄ ) and pure water as the chemical solution may be adopted. Even in this case, the chemical solution supply source 65 is configured so that the control unit 25 of the substrate processing apparatus 1 can be notified by a signal or the like whether or not the chemical solution can be supplied.

<2. Chemical solution processing operation of substrate processing device 1>
FIG. 5 is a time chart showing an example of the chemical solution exchange operation of the substrate processing apparatus 1 (board processing system 100). FIG. 6 is a flowchart showing an example of the chemical solution processing operation of the substrate processing apparatus 1 (board processing system 100). FIG. 7 is a flowchart showing an example of the chemical solution exchange operation. The chemical processing operation of the substrate processing apparatus 1 (board processing system 100) will be described with reference to FIGS. 5 to 7.

Here, the chemical solution is discharged in advance due to the replacement of all the solutions, and the processing tank 41 is emptied, and the chemical solution supply source 65 is in a state where the chemical solution can be supplied to the processing tank 41 of the substrate processing apparatus 1. It is assumed that it has become.

First, the substrate processing device 1 charges the chemical solution into the empty processing tank 41 and adjusts the temperature of the charged chemical solution (step S10 in FIG. 6). More specifically, the control unit 25 closes the on-off valves 79 and 83, opens the on-off valves 61 and 63, and transmits a signal 95 for starting the supply of the chemical solution to the control unit 130 of the chemical solution supply source 65. When the control unit 130 receives the chemical solution supply source 65, the control unit 130 opens the chemical solution supply valve 120 to supply the chemical solution to the substrate processing device 1. The control unit 25 controls the control valve 69 to adjust the flow rate of the chemical solution flowing through the supply pipe 67 to a predetermined flow rate. The chemical solution is supplied from the nozzle 71 to the inner tank 43, and when the inner tank 43 is filled, the chemical solution overflows into the outer tank 45 and flows into the circulation pipe 53 from the discharge port 51. After the chemical solution overflows from the inner tank 43 to the outer tank 45, the circulation control unit 28 operates the pump 55 to start the circulation of the chemical solution in the processing tank 41, and the heating control unit 29 controls the heater 57. The chemical solution is heated to a predetermined temperature.

The control unit 25 processes, for example, by comparing the number of lots processed by the chemical processing unit CHB1 (CHB2) with the life count for partial liquid replacement and the life count for total liquid replacement stored in the memory 31. It is determined whether or not the chemical solution in the tank 41 needs to be replaced (step S20). As a result of the determination in step S20, when the chemical solution does not need to be replaced, the control unit 25 puts a plurality of lot substrates W into the inner tank 43 (at the processing position) on the holding arm 47 of the auxiliary transport mechanism LFS1 (LFS2). Each substrate W is treated with the chemical solution by immersing each substrate W in the chemical solution for a predetermined time (step S30). After that, the control unit 25 causes the sub-transfer mechanism LFS1 (LFS2) of the substrate transfer mechanism 6 to carry out each board W from the inner tank 43 (step S40), and the board transfer mechanism 6 transports each board W to the cassette 2 for accommodation. To do. Then, the control unit 25 determines whether or not the processing of all lots has been completed (step S50).

As a result of the determination in step S50, if the processing of all lots is completed, the substrate processing apparatus 1 ends the chemical solution processing operation. As a result of the determination, if the processing of all lots has not been completed, the unprocessed lots are transported from the cassette 2 to the chemical treatment unit CHB1 (CHB2), and the determination in step S20 described above and steps S30 to S40 are performed. The process of step S50 is repeated, and the determination in step S50 is performed again.

As a result of the determination in step S20, when it is necessary to replace the chemical solution, the determination unit 27 of the control unit 25 starts a process (“waiting process”) of waiting for the chemical solution to be supplied by the chemical solution supply source 65. (Step S60 in FIG. 6). The first transfer mechanism CTC holds a count value for total liquid exchange and a count value for partial liquid exchange as the number of processed substrates W (or the number of lots), and depends on the type of liquid exchange to be performed. Reset the counted value. It is preferable that the discharge of the chemical solution from the treatment tank 41 is started so that the transport schedule of the lot is observed and the time until the lot to be treated is carried into the treatment tank 41 after the completion of the chemical solution exchange is not long. .. Therefore, the determination unit 27 starts the waiting process in consideration of the required time for exchanging the chemical solution, the transport time for the lot, and the like. In the example of FIG. 5, the determination unit 27 starts the waiting process at the time t2 after the time t1 when the chemical solution needs to be replaced. In the example of FIG. 5, the chemical solution can be supplied by the chemical solution supply source 65 at time t3, and the drainage from the treatment tank 41 is started immediately after that. For example, the chemical solution replacement is required at time t1. The determination unit 27 may start the waiting process. After the determination unit 27 determines that the chemical solution supply source 65 can supply the chemical solution, the discharge control unit 26 may start the discharge unit 84 to discharge the chemical solution after a while.

The circulation control unit 28 causes the circulation system 52 to maintain the circulation operation of the chemical solution, and the heating control unit 29 causes the heater 57 to heat the chemical solution to a predetermined temperature to maintain the temperature adjustment operation of the chemical solution (step S70 in FIG. 6). ). Generally, the lower the temperature of the chemical solution, the higher the viscosity, and the longer it takes to discharge the chemical solution from the treatment tank 41. If the temperature of the chemical solution is adjusted while waiting for the chemical solution to be supplied by the chemical solution supply source 65, the chemical solution can be supplied by the chemical solution supply source 65 and the chemical solution is discharged from the treatment tank 41. The required time can be shortened. Further, when the treatment tank 41 is warmed by the temperature-controlled chemical solution, the time required for temperature adjustment of the replaced new chemical solution can be shortened. From the viewpoint of energy saving, the circulation of the chemical solution and the temperature adjustment may be stopped while waiting for the chemical solution to be supplied by the chemical solution supply source 65.

Next, the control unit 25 determines whether or not a predetermined waiting time has elapsed (step S80). Here, the substrate transfer mechanism 6 transfers lots according to a schedule (transfer schedule) created by the scheduling unit (not shown). The waiting time in step S80 is set to a time during which lots can be delivered according to the schedule. When the waiting time elapses, the substrate transport mechanism 6 cannot transport according to the schedule. Therefore, as a result of the determination in step S80, when the waiting time has elapsed, the control unit 25 notifies the notification unit 33 that the waiting time has elapsed, that is, that a failure has occurred (step S86). ..

As a result of the determination in step S80, if the waiting time has not elapsed, the determination unit 27 determines whether or not the chemical solution supply source 65 can supply the chemical solution, that is, the chemical solution supply source 65 is the chemical solution. (Step S90). In the example of FIG. 5, the determination unit 27 starts the determination in step S90 at time t2. When the chemical solution supply source 65 cannot supply the chemical solution, the control unit 130 outputs a signal 91 (a period before the time t3 in FIG. 5). In the determination of step S90, the control unit 25 determines that the chemical solution supply source 65 cannot supply the chemical solution based on the signal 91, the control unit 25 repeats the determination process of step S80, and the determination unit 27 determines the step S90. Repeat the process.

When the chemical solution can be supplied by the chemical solution supply source 65, the control unit 130 outputs a signal 92 to the determination unit 27 of the control unit 25 (the period after the time t3 in FIG. 5). Upon receiving the signal 92, the determination unit 27 determines that the chemical solution supply source 65 can supply the chemical solution (“Yes” in step S90), and proceeds from step S90 to step S100. On the other hand, if it is determined as "No" in step S90, the process proceeds to step S80. In step S100, the control unit 25 causes the substrate processing device 1 and the chemical solution supply source 65 to exchange the chemical solution. In this way, when exchanging the chemical solution, if the chemical solution in the treatment tank 41 is discharged after confirming that the chemical solution can be supplied by the chemical solution supply source 65, the treatment tank 41 is newly replaced immediately after the drainage is completed. A chemical solution can be supplied. As a result, the inner wall of the treatment tank 41 is exposed for a long time, and it is possible to prevent the chemical solution adhering to the exposed inner wall from drying and generating particles. Further, in the total liquid exchange, the chemical liquid in the circulation pipe 53 provided with the filter 59 is also discharged by the discharge unit 84, but in the substrate processing device 1, a new chemical liquid is discharged to the treatment tank 41 after the drainage is completed. Since the time until the filter 59 is put in can be shortened, it is possible to prevent the filter 59 from drying out.

In the chemical solution exchange process, the circulation control unit 28 stops the pump 55 of the circulation system 52 to stop the circulation of the chemical solution in the treatment tank 41, and the heating control unit 29 stops the heating of the chemical solution by the heater 57. Stops the temperature adjustment of the chemical solution (step S110 in FIG. 7).

When exchanging the chemical solution, the control unit 25 of the substrate processing apparatus 1 determines, for example, whether to perform the full solution exchange or the partial solution exchange based on the number of processed lots. Specifically, for example, when the substrate processing apparatus 1 processes 3 lots, the control unit 25 determines to perform partial liquid exchange, and when the substrate processing apparatus 1 processes 10 lots, the control unit 25 controls. The unit 25 determines that the whole liquid is exchanged.

When the control unit 25 decides to perform the partial liquid exchange process, the discharge control unit 26 discharges a predetermined amount of the chemical solution corresponding to the amount of a part of the chemical solution in the treatment tank 41 to the discharge unit 84 from the treatment tank 41. When the control unit 25 decides to replace all the liquids, the discharge control unit 26 causes the discharge unit 84 to supply a predetermined amount of chemicals corresponding to the amount of all the chemicals in the treatment tank 41 to the treatment tank 41. (Step S120 in FIG. 7). In the case of total liquid replacement, the substrate processing device 1 discharges all the chemicals remaining in the circulation pipe 53 after discharging all the chemicals in the processing tank 41. In the example of FIG. 5, the chemical solution supply source 65 can supply the chemical solution at time t3, and then the discharge control unit 26 causes the discharge unit 84 to exchange a predetermined amount of the chemical solution in the treatment tank 41.

When a predetermined amount of the chemical solution is discharged from the treatment tank 41, the control unit 25 instructs the chemical solution supply source 65 to supply the chemical solution (step S130 in FIG. 7). When the supply of the chemical solution is started from the chemical solution supply source 65, the substrate processing apparatus 1 charges the chemical solution into the processing tank 41 (step S140 in FIG. 7). Specifically, in step S130, the control unit 25 transmits a signal 95 instructing the start of supply of the chemical solution to the control unit 130 of the chemical solution supply source 65. Upon receiving the signal 95, the control unit 130 opens the chemical solution supply valve 120 and starts supplying the chemical solution through the supply pipe 67. In step S140, the control unit 25 adjusts the opening degree of the control valve 69 to adjust the amount of the chemical solution discharged from the nozzle 71, and supplies the chemical solution from the nozzle 71 to the processing tank 41. In the example of FIG. 7, the control unit 25 transmits the signal 95 at the time t4.

When the supply of the predetermined amount of the chemical solution to the treatment tank 41 is completed, the control unit 25 instructs the chemical solution supply source 65 to stop the supply of the chemical solution (step S150 in FIG. 7). Specifically, the control unit 25 transmits a signal 96 instructing to stop the supply of the chemical solution to the control unit 130 of the chemical solution supply source 65, and when the control unit 130 receives the signal 96, the control unit 130 presses the chemical solution supply valve 120. It is closed to stop the supply of the chemical solution through the supply pipe 67. In the example of FIG. 5, the chemical solution supply source 65 stops supplying the chemical solution at time t5. Instead of closing the chemical solution supply valve 120, the control valve 69 may be closed to stop the supply of the chemical solution to the treatment tank 41.

After that, the substrate processing apparatus 1 circulates the chemical solution and adjusts the temperature (step S160 in FIG. 7). Specifically, the circulation control unit 28 operates the pump 55 to start the circulation of the chemical solution in the treatment tank 41, and the heating control unit 29 controls the heater 57 to heat the chemical solution to a predetermined temperature. .. In the example of FIG. 5, the temperature of the chemical solution has reached a predetermined temperature at time t6.

As a result, the exchange of the chemical solution is completed, and the substrate processing apparatus 1 repeats the processes after step S20 in FIG.

According to the substrate processing apparatus according to the present embodiment configured as described above, the determination unit 27 can supply the chemical solution supply source 65 before the discharge control unit 26 starts the discharge operation to the discharge unit 84. Performs a determination process to determine whether or not. When it is determined in the determination process that the chemical solution can be supplied by the chemical solution supply source 65, the discharge control unit 26 causes the discharge unit 84 to start the discharge operation. When it is determined in the determination process that the chemical solution cannot be supplied by the chemical solution supply source 65, the discharge control unit 26 does not cause the discharge unit 84 to start the discharge operation. In this way, when the chemical solution supply source 65 cannot supply the chemical solution, the discharge unit 84 does not start the discharge operation, and the chemical solution adhering to the treatment tank 41 can be suppressed from being exposed for a long period of time, so that the particles in the treatment tank 41 can be prevented from being exposed. Occurrence can be suppressed.

Further, according to the substrate processing apparatus according to the present embodiment, when it is determined in the determination process that the chemical solution cannot be supplied by the chemical solution supply source 65, the circulation control unit 28 circulates the circulation of the chemical solution to the processing tank 41. Let system 52 do it. Therefore, the uniformity of the chemical solution in the treatment tank 41 can be improved even during the period when the chemical solution supply source 65 cannot supply the chemical solution.

Further, according to the substrate processing apparatus according to the present embodiment, when it is determined in the determination process that the chemical solution cannot be supplied by the chemical solution supply source 65, the heating control unit 29 operates the heater 57. Therefore, the chemical solution in the treatment tank 41 can be heated even during the period when the chemical solution supply source 65 cannot supply the chemical solution. As a result, an increase in the viscosity of the chemical solution can be suppressed.

Further, according to the substrate processing method according to the present embodiment as described above, the determination step is executed before starting the exchange of the chemical solution stored in the processing tank 41. When it is determined in the determination step that the chemical solution can be supplied from the chemical solution supply source 65, the discharge step is executed and the discharge of the chemical solution from the treatment tank 41 is started. Therefore, when the chemical solution supply source 65 cannot supply the chemical solution, the discharge of the chemical solution from the treatment tank 41 is not started. As a result, it is possible to prevent the chemical solution adhering to the treatment tank 41 from being exposed for a long period of time, so that the generation of particles in the treatment tank 41 can be suppressed.

Further, according to the substrate processing method according to the present embodiment, when it is determined in the determination step that the chemical solution cannot be supplied from the chemical solution supply source 65, the circulation step is executed to circulate the chemical solution to the processing tank 41. Is done. Therefore, the uniformity of the chemical solution in the treatment tank 41 can be improved even during the period when the chemical solution supply source 65 cannot supply the chemical solution.

Further, according to the substrate processing method according to the present embodiment, when it is determined in the determination step that the chemical solution cannot be supplied from the chemical solution supply source 65, the heating step is executed to heat the chemical solution. Therefore, the chemical solution in the treatment tank 41 can be heated even during the period when the chemical solution supply source 65 cannot supply the chemical solution. As a result, an increase in the viscosity of the chemical solution can be suppressed.

Although the present invention has been shown and described in detail, the above description is exemplary and not limiting in all embodiments. Therefore, in the present invention, the embodiments can be appropriately modified or omitted within the scope of the invention.

1 Board processing device 100 Board processing system 130 Control unit 25 Control unit 52 Circulation system 53 Circulation piping 55 Pump 57 Heater 59 Filter 65 Chemical solution supply source 67 Supply piping 77 Bottom discharge pipe 84 Discharge unit 91, 92, 95, 96 Signal W board

Claims (10)

A substrate processing device that processes a substrate with a chemical solution supplied from a predetermined chemical solution source.
A treatment tank that stores the chemical solution supplied from the chemical solution supply source and immerses the substrate in the chemical solution to perform a predetermined treatment on the substrate.
A discharge unit that performs a discharge operation for discharging the chemical solution stored in the treatment tank from the treatment tank.
A discharge control unit that causes the discharge unit to perform the discharge operation when exchanging the chemical solution stored in the treatment tank.
A determination unit that performs a determination process for determining whether or not the chemical solution can be supplied by the chemical solution supply source before the discharge control unit causes the discharge unit to perform the discharge operation.
With
A substrate processing apparatus in which, when the determination unit determines in the determination process that the chemical solution can be supplied by the chemical solution supply source, the discharge control unit causes the discharge unit to start the discharge operation. The substrate processing apparatus according to claim 1.
A circulatory system in which the chemical solution stored in the treatment tank is discharged from the treatment tank and returned to the treatment tank to circulate the chemical solution.
A substrate processing device further equipped with. The substrate processing apparatus according to claim 2.
The circulatory system is a substrate processing apparatus including a filter for filtering the chemical solution. The substrate processing apparatus according to claim 2 or 3.
A substrate further comprising a circulation control unit for causing the circulation system to circulate the chemical solution to the treatment tank when the determination unit determines in the determination process that the chemical solution cannot be supplied by the chemical solution supply source. Processing equipment. The substrate processing apparatus according to any one of claims 1 to 4.
A heater that heats the chemical solution,
A substrate processing device further equipped with. The substrate processing apparatus according to claim 5.
A heating control unit that operates the heater when the determination unit determines in the determination process that the chemical solution supply source cannot supply the chemical solution.
A substrate processing device further equipped with. The substrate processing apparatus according to any one of claims 1 to 6.
With the chemical supply source
A board processing system. A substrate processing method in which a substrate is treated with a chemical solution supplied from a predetermined chemical solution source.
A discharge step of discharging the chemical solution from a treatment tank for storing the chemical solution supplied by the chemical solution supply source, and
When exchanging the chemical solution stored in the treatment tank, a determination step of determining whether or not the chemical solution supply source can supply the chemical solution prior to the discharge step, and a determination step.
With
The discharge step
A substrate processing method, which is a step of starting discharge of the chemical solution from the treatment tank when it is determined in the determination step that the chemical solution can be supplied by the chemical solution supply source. The substrate processing method according to claim 8.
A substrate processing method further comprising a circulation step of circulating the chemical solution to the treatment tank when it is determined in the determination step that the chemical solution cannot be supplied by the chemical solution supply source. The substrate processing method according to claim 8 or 9.
A substrate processing method further comprising a heating step of heating the chemical solution when it is determined in the determination step that the chemical solution cannot be supplied by the chemical solution supply source.

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