JP6784312B2 - Optical parts and their manufacturing methods and light emitting devices and their manufacturing methods - Google Patents

Description

The present invention relates to an optical component and a method for manufacturing the same, and a light emitting device and a method for manufacturing the same.

Conventionally, a light emitting device using not only an LED but also a laser diode or the like as a light source has been proposed (Patent Documents 1 to 3). These light emitting devices have an optical component including a support member having a through hole and a second translucent member arranged so as to close the through hole, and light from a light source is emitted through the second transmissive member. Will be done. Further, by providing a reflective film on the support member, the light extraction efficiency is improved.

European Patent Publication No. 2743998 JP-A-2009-2600053 JP-A-2009-272576

In recent light emitting devices, in particular, high light output and high brightness of a laser diode used as a light source are further required depending on the application.
An object of the present invention is an optical component capable of realizing higher light output and higher brightness in order to manufacture a light emitting device using a laser diode as a light source, a manufacturing method thereof, a light emitting device using the same, and a manufacturing method thereof. The purpose is to provide.

The optical component of the embodiment of the present invention is
A support member with a through hole and
The first translucent member formed on the inner wall of the through hole and
It has a light incident surface, a light emitting surface, and an outer peripheral side surface, and includes a second light transmitting member arranged in the through hole.
The outer peripheral side surface of the second translucent member is fixed to the inner wall of the through hole by fusion with the first translucent member.

The method for manufacturing an optical component according to an embodiment of the present invention is as follows.
A support member having a through hole having an incident opening and an outgoing opening is prepared.
A second translucent member having the light incident surface, the light emitting surface, and the outer peripheral side surface is prepared.
A first translucent member is formed on the inner wall of the through hole,
The step of fixing the outer peripheral side surface of the second translucent member to the inner wall of the through hole by fusion with the first translucent member is included.

The light emitting device according to the embodiment of the present invention includes the above-mentioned optical components and a semiconductor laser device.

The method for manufacturing the light emitting device according to the embodiment of the present invention is as follows.
This includes connecting an optical component according to the manufacturing method described above with a semiconductor laser device.

According to the optical component of the embodiment of the present invention, even higher light output and higher brightness can be realized. In addition, this optical component is less likely to deteriorate even after long-term use, and can maintain high quality for a long period of time.

Further, in the method for manufacturing an optical component according to the embodiment of the present invention, it is possible to easily and reliably manufacture a high-quality optical component without incurring an increase in manufacturing cost without going through a special process.

Further, the light emitting device and the manufacturing method thereof according to the embodiment of the present invention can obtain high reliability capable of maintaining the quality for a long period of time while realizing high light output and high brightness.
It is possible to reliably manufacture a simple and high-quality product.

It is the schematic sectional drawing which shows one Embodiment of the optical component of this invention. It is a schematic cross-sectional process diagram of the manufacturing method of the optical component of FIG. 1A. It is a schematic cross-sectional process diagram of the manufacturing method of the optical component of FIG. 1A. It is a schematic cross-sectional process diagram of the manufacturing method of the optical component of FIG. 1A. It is a schematic cross-sectional process diagram of the manufacturing method of the optical component of FIG. 1A. It is the schematic sectional drawing which shows one Embodiment of the optical component of this invention. It is the schematic sectional drawing which shows one Embodiment of the optical component of this invention. It is the schematic sectional drawing which shows one Embodiment of the optical component of this invention. It is the schematic sectional drawing which shows one Embodiment of the optical component of this invention. It is the schematic sectional drawing which shows one Embodiment of the light emitting device of this invention. 6 is a schematic cross-sectional view of a main part for explaining the passage of light in an optical component in the light emitting device of FIG. 6A.

Hereinafter, embodiments of the invention will be described with reference to the drawings as appropriate. However, the optical components and the manufacturing method thereof, the light emitting device and the manufacturing method thereof described below are for embodying the technical idea of the present invention, and unless otherwise specified, the present invention is described below. Not limited to things. Further, the contents described in one embodiment and the embodiment can be applied to other embodiments and the embodiments.
The size and positional relationship of the members shown in each drawing may be exaggerated for the sake of clarity.

Embodiment 1: Optical component and its manufacturing method [Optical component]
As shown in FIG. 1A, the optical component 10 of this embodiment mainly includes the support member 11 and the first
A translucent member 12 and a second translucent member 13 are provided. Further, it is preferable that the upper surface of the support member 11 is further provided with a third translucent member 14 that covers the second translucent member 13. Further, a functional film may be provided on one or more upper surfaces and / or lower surfaces of the first translucent member 12, the third translucent member 14, and the support member 11.

(Support member)
The support member 11 is a member for supporting the second translucent member 13, and is preferably made of a reflective material that does not easily absorb light. Here, the reflectivity is a material that reflects 50% or more of the light emitted from the light source used, for example, a laser diode, 60% or more, 70% or 80%.
A material that reflects the above is preferable.

The support member 11 is preferably made of a material having good thermal conductivity. Here, "good thermal conductivity" means that the thermal conductivity at 20 ° C. is preferably several W / m · k or more, and 10 W / m · k.
It is more preferably k or more and 25 W / m · k or more, and further preferably 50 W / m · k or more.
The support member 11 is preferably made of a material having good heat resistance. Here, good heat resistance is preferably one having a melting point of several hundred ° C. or higher, more preferably 1000 ° C. or higher, and 1500 ° C.
The above is more preferable.

The support member 11 includes, for example, silicon carbide, aluminum oxide, silicon nitride, aluminum nitride, titanium oxide, tantalum oxide, ceramics such as cermet, tungsten, tantalum, and the like.
Examples thereof include refractory metals such as molybdenum and kovar, and composites thereof. Of these, those formed of a material containing aluminum oxide are preferable.

In particular, as a material containing aluminum oxide, about 70% by weight of aluminum oxide is contained with respect to the total weight of the support member, and zirconia 0. Those containing about several to 30% by weight can be mentioned. Further, this material may contain about 0.1 to 2% by weight of yttria, calcia, magnesia, or ceria as a sintering aid, or a plasticizer.
A solvent or the like may be added.

The shape of the support member 11 is not particularly limited, and may be any shape as long as it includes a through hole 11a for supporting the second light transmitting member 13, which will be described later. For example, it may have a flat plate shape, and various shapes such as a housing shape, a lid shape, and a ferrule-like shape can be mentioned.
The size and thickness of the support member 11 can be appropriately set according to the purpose of use and the intended action / effect. Among them, in consideration of heat dissipation and / or strength, it is preferable to have a thickness of about 0.20 mm or more.

In FIG. 1A, the support member 11 is made of zirconium-containing alumina (containing about 24% zirconium), which is highly reflective and has good thermal conductivity and heat resistance. The size of the support member 11 here is a columnar shape having a diameter of 4.0 mm and a thickness of 0.67 mm.

(Through hole)
The support member 11 includes a through hole 11a for passing light.
In the support member 11, the shape of the through hole 11a is not particularly limited, and may be formed by an inner wall having a constant width or diameter with respect to the light traveling direction X, or by an inner wall extending in the light traveling direction X. It may be formed or may be a combination of these. The spread of light in the traveling direction X may be either gradient or gradual.

In FIG. 1A, the through hole 11a is formed by an inner wall extending in the traveling direction X of light.
With such a shape, the return light of the incident light can be reflected by the inner wall of the through hole and efficiently taken out to the light emitting side.

The shape of the through hole 11a may be a polygon such as a circle, an ellipse, a triangle, and a quadrangle in a plan view, but a circle or a substantially circular shape is particularly preferable. This is to match the shape of the light from the light source used. The shape of the through hole 11a in the support member 11 is preferably a columnar shape, a cone shape, or a combination thereof.

The size of the through hole 11a is not particularly limited as long as it can pass one or more light emitted from the laser diode, for example. Specifically, although it depends on the type of laser diode, it is preferable that the diameter or width is in the range of 0.10 to 5.0 mm.
However, the diameter or width does not necessarily have to be constant in the traveling direction X of light. The length of the through hole 11a can be appropriately set depending on the size of the support member 11 to be used. For example, 0.20
About 10 mm can be mentioned.

In FIG. 1A, the through hole 11a has a substantially truncated cone shape. The diameter of the hole on the light incident side is 0.20 mm, and the diameter of the hole on the light emitting side is 0.65 mm. The length of the through hole is equal to the thickness of the support member 11.

(1st translucent member)
The support member 11 has at least a first light-transmitting member 12 on the inner wall of the through hole 11a. 1st
The light transmitting member 12 may be formed on the upper surface (light emitting side) and / or the lower surface (light incident side) of the support member.
The first translucent member 12 is used for fusing the inner wall of the through hole with the second translucent member described later. Therefore, it is preferable that the through hole 11a is arranged in a film-like or thin-film shape on the inner wall.

The first translucent member 12 preferably has a melting point lower than that of the second translucent member described later. From another point of view, it is preferable that the softening point is lower than the melting point of the translucent member. Further, since it is formed on the inner wall of the through hole, it is preferable that the light absorption is small and the light transmittance is good. For example, the first translucent member 12 preferably has a melting point of about 1200 ° C. or lower, more preferably about 1000 ° C. or lower, and even more preferably about 850 ° C. or lower or about 830 ° C. or lower. The softening point is preferably about 1150 ° C. or lower, more preferably about 950 ° C. or lower, and even more preferably about 850 ° C. or lower. Light transmittance is
50% or more, 60% or more, 70 of the light emitted from the light source used, for example, a laser diode
Permeable in% or 80% or more is preferable. In particular, the first translucent member 12 is once melted and then melted.
A material that functions to bring the support member 11 and the second light-transmitting member 13, which will be described later, into close contact with each other, so that the same and high light transmittance can be maintained without changing the composition after melting and solidifying again. It is preferable to form by.

Examples of the material constituting the first translucent member 12 include those made of an inorganic material, and for example, those made of glass such as borosilicate glass, soda-lime glass, soda glass, and lead glass are preferable.
Borosilicate glass is generally a glass containing silicon dioxide (SiO ₂ ) as a main component and further containing components such as boron oxide (boric anhydride) (B ₂ O ₃ ). As the borosilicate glass, any known borosilicate glass can be used. The softening point of the borosilicate glass is usually 500 ° C. to 1000 ° C., preferably 500 ° C. to 900 ° C.
Soda-lime glass generally contains silicon dioxide (SiO ₂ ) and sodium oxide (Na ₂ ).
O) and / or glass containing calcium carbonate (CaCO ₃ ) as a main component. Any known soda-lime glass can be used. The softening point of soda-lime glass is
It is usually 600 ° C. to 800 ° C., preferably 700 ° C. to 800 ° C.

Soda glass generally means glass containing silicon dioxide (SiO ₂ ), sodium oxide (Na ₂ ) and / or potassium oxide (K ₂ O) as main components. Any known soda glass can be used. The softening point of soda glass is usually 500 ° C to 800 ° C.
° C., preferably 600 ° C. to 800 ° C.
Lead glass generally means glass containing silicon dioxide (SiO ₂ ) and lead oxide (PbO) as main components. Any known lead glass can be used. The softening point of the lead glass is usually 300 ° C. to 600 ° C., preferably 500 ° C. to 600 ° C.

The first translucent member 12 is used to fix the second translucent member, which will be described later, in the through hole 11a of the support member 11 by fusion. Therefore, the first translucent member includes a support member and a second light-transmitting member, which will be described later.
A material having a lower melting point and / or softening point than the material constituting the translucent member is preferable. By providing such a first translucent member, the second translucent member can be fixed to the support member. Therefore, since it is not necessary to fix the support member by melting or softening by the second translucent member, a material having high heat resistance can be used as the material of the second translucent member. As a result, it becomes possible to use the second translucent member having stable optical characteristics for a light source having a higher output.

Further, since the first translucent member 12 can be melted only by applying a small amount of energy to the relatively thin first translucent member 12, the member constituting the optical component, particularly the second translucent member, can be melted. The heat load can be reduced and the optical characteristics can be stably exhibited. As a result, stable light output characteristics can be obtained at a high level.
Further, by melting the first translucent member 12, the second translucent member 13 described later can be fixed without a gap in the through hole 11a of the support member 11, so that the heat generated in the second translucent member 13 is generated. Can be efficiently released to the support member via the first light-transmitting member 12 which is embedded in the gap and is in close contact with the second light-transmitting member 13 and the support member 11. That is, the heat generated by the second translucent member 13 or applied to the second translucent member 13 can be released to the support member from the side surface of the second translucent member 13, and can be efficiently dissipated. ..

The thickness of the first translucent member 12 is not particularly limited, and for example, on the inner wall of the through hole, 0.
The range is about 01 to 5 μm, preferably about 0.05 to 3 μm. The first translucent member 1
When 2 is formed on the upper surface of the support member 11, for example, it may be formed of a thicker film than on the inner wall of the through hole.

In FIG. 1A, the first translucent member 12 is formed of silicon dioxide so that the upper surface of the support member 11 has a thickness of 6.0 μm and the inner wall of the through hole 11a has a thickness of 1.0 μm. The softening point of the first translucent member 12 is 820 ° C., and the light transmittance of light at 450 nm is 90% or more.

(Second translucent member)
A second light-transmitting member 13 is arranged in the through hole 11a of the support member 11.
The second light transmitting member 13 has a light incident surface 13a, a light emitting surface 13b, and an outer peripheral side surface 13c. The outer peripheral side surface 13c may have a shape such that the light emitting surface 13b side or the light incident surface 13a side of the second light transmitting member 13 contacts the inner wall of the through hole 11a, but the through hole 11 may be formed.
It is preferable that the shape matches the shape of a, that is, a shape having a larger area of the outer peripheral side surface 13c and contacting the inner wall of the through hole 11a.

The outer peripheral side surface of the second translucent member is fixed to the inner wall of the through hole by fusion with the first translucent member, but the above-mentioned shape ensures more reliable adhesion to the support member 11. The heat generated by the light applied to the second translucent member 13 can be effectively released to the support member 11 side.
Above all, it is more preferable that the second translucent member has a shape extending from the light incident surface 13a toward the light emitting surface 13b. In other words, the second translucent member 13 preferably has an outer peripheral side surface 13c that coincides with or substantially coincides with the frustum-shaped inclined surface of the through hole 11. In other words, the cross-sectional area parallel to the light incident surface 13a and / or the light emitting surface 13b (perpendicular to the optical axis described later), the vertical cross-sectional area, or the diameter of the second translucent member is light from the light incident surface 13a. Exit surface 1
It is preferable that the size increases toward 3b.

The light incident surface 13a and the light emitting surface 13b are preferably flat surfaces that face each other in parallel, but either one or both may have concave or convex surfaces above or below. The unevenness may be stepwise or sloping. Above all, it is preferable that the light incident surface 13a and the light emitting surface 13b are arranged perpendicular to the axis indicating the traveling direction of the light from the light source, that is, the optical axis.

The size of the second translucent member 13 can be appropriately adjusted by the above-mentioned through hole 11a. For example, in a plan view, the size may be such that one or more light emitted from the laser diode can pass through. Specifically, although it depends on the type of laser diode, it is preferable that the diameter or width is in the range of 0.10 to 3.0 mm. However, the traveling direction X of light
It does not necessarily have to have a constant diameter or width. The thickness of the second translucent member 13 can be appropriately set depending on the size of the support member 11 to be used. For example, about 0.25 to 10 mm can be mentioned. As a result, the outer peripheral side surface 13c of the second translucent member 13 comes into contact with the support member 11, so that an effective heat dissipation effect can be exhibited.

The second light transmitting member 13 is preferably made of a material having good light transmittance. For example, the light transmittance is preferably 50% or more, 60% or more, 70% or 80% or more of the light emitted from the light source used, for example, a laser diode. Further, it is preferable that the material is made of a material having good light resistance and heat resistance that does not deteriorate even when irradiated with high-power light. For example, those having a melting point of 1000 ° C to 3000 ° C can be mentioned, and those having a melting point of 1300 ° C to 250 ° C can be mentioned.
0 ° C. is preferable, and 1500 ° C. to 2000 ° C. is more preferable.

Examples of the material of the second translucent member include ceramics. Specifically, aluminum oxide such as alumina or sapphire (Al ₂ O ₃ , melting point: about 1900 ° C to 2100)
℃), silicon dioxide such as quartz glass (SiO ₂ , melting point: about 1500 ° C to 1700 ° C), zirconium oxide (ZrO ₂ , melting point: about 2600 ° C to 2800 ° C), barium oxide (BaO)
, Melting point: 1800 ° C to 2000 ° C), Titanium oxide (TiO ₂ , Melting point: 1700 ° C to 190)
0 ° C.), yttrium oxide (Y ₂ O ₃ , melting point: 2425 ° C.), silicon nitride (Si ₃ N ₄ ,)
Melting point: 1900 ° C), aluminum nitride (AlN, melting point: 2200 ° C), silicon carbide (S)
iC, melting point: 2730 ° C.) and the like. These may be used alone or in combination of two or more. Among them, those containing aluminum oxide and silicon dioxide are preferable, and those containing aluminum oxide are more preferable, from the viewpoints of good translucency, melting point, thermal conductivity, diffusivity and the like.
The second translucent member may have a single layer structure or a laminated structure depending on a single material or a plurality of materials.

By forming the second translucent member with such a material, even when the temperature of the second translucent member becomes high due to the high output of the light source, for example, the LD, the second translucent member itself is melted. It can be suppressed, and thus deformation and discoloration of the second translucent member can be avoided. Therefore,
It can be maintained for a long period of time without deteriorating the optical characteristics. Further, by using a material having excellent thermal conductivity, heat generated by the light source can be efficiently released.

If the melting point of the second translucent member is higher than that of the first translucent member 12, the melting point is the support member 11.
It may be equivalent to, low or high. Above all, high is preferable.

The second translucent member 13 preferably further contains a phosphor. Thereby, the wavelength of the light emitted from the light source can be converted, and typically, the mixed color light of the light from the light source and the wavelength-converted light can be emitted to the outside.

As the phosphor, for example, any known phosphor can be used in consideration of the wavelength of the emitted light of the light source to be used, the color of the light to be obtained, and the like. Specifically, cerium-activated yttrium aluminum garnet (YAG), cerium-activated lutetium aluminum garnet (LAG), europium and / or chromium-activated nitrogen-containing calcium aluminosilicate (CaO-). Examples thereof include Al ₂ O _3- SiO ₂ ), europium-activated silicate ((Sr, Ba) ₂ SiO ₄ ), β-sialone phosphor, and KSF-based phosphor (K ₂ SiF ₆ : Mn). Of these, it is preferable to use a fluorescent substance having heat resistance.

By using these phosphors, a light emitting device that emits a mixed color light (for example, white) of visible wavelength primary light and secondary light, and is excited by ultraviolet light primary light to emit visible wavelength secondary light. It can be a light emitting device. In particular, as a phosphor that emits white light in combination with a blue light emitting element, it is desirable to use a phosphor that is excited in blue and exhibits broad light emission in yellow.

As the phosphor, a plurality of types of phosphors may be used in combination. For example, Si _6-Z Al
_Z O _Z N _8-Z : Eu, Lu ₃ Al ₅ O ₁₂ : Ce, BaMgAl ₁₀ O ₁₇ : Eu, B
aMgAl ₁₀ O ₁₇ : Eu, Mn, (Zn, Cd) Zn: Cu, (Sr, Ca) ₁₀ (
PO ₄ ) _{6 Cl2} : Eu, Mn, (Sr, Ca) ₂ Si ₅ N ₈ : Eu, CaAlSiB _x
Color rendering properties and color reproducibility can also be adjusted by using phosphors such as N _{3 + x} : Eu, K ₂ SiF ₆ : Mn and CaAlSiN ₃ : Eu in a combination and blending ratio suitable for a desired color tone.
The phosphors may be used in combination in the second translucent member having a single layer structure, or different phosphors may be contained in the second translucent member having a laminated structure.

It is preferable to use a phosphor having a relatively large average particle size. For example, those having an average particle size (median diameter) of 10 μm or more and 12 μm or more are preferable. Further, those having an average particle size of 50 μm or less, 30 μm or less, and 25 μm or less are preferable. The average particle size is, for example, F.I. S. S. S. No (Fisher Sub Sieve Sizer's No)
Refers to the particle size obtained by the air permeation method in. As described above, by having a relatively large average particle size, it is possible to reduce the heat generated by the light from the light source, and it is possible to facilitate the release of heat from the second translucent member.

The phosphor is preferably, for example, 0.05% by weight to 50% by weight, more preferably 1% by weight to 15% by weight, based on the total weight of the second translucent member. When the content is 0.05% by weight or more, the phosphor can sufficiently convert the wavelength of the light from the light source.

The second light-transmitting member may include a light scattering material, if necessary. The light scattering material may have a high melting point or a difference in refractive index with respect to the material constituting the second translucent member. As the light scattering material, for example, aluminum oxide, silicon oxide, titanium oxide and the like can be used. The content of the light scattering material is not particularly limited, and can be, for example, less than that of the material of the second light transmitting member used.

The second light-transmitting member may optionally have a functional film formed on the surface or one side of the light incident surface 13a and / or the light emitting surface 13b. For example, an antireflection layer (AR layer) or the like may be formed. These layers can be arranged in a single layer or laminated structure with materials known in the art.

In FIG. 1A, the second translucent member 13 is formed of aluminum oxide (melting point: about 1900 ° C. to 2100 ° C.) containing 11% by weight of YAG as a phosphor in the total weight of the second translucent member. There is. The second translucent member 13 has an upper surface diameter of 0.50 mm, a lower surface diameter of 0.30 mm, and a thickness of 0.30 mm. In the second translucent member 13, the second translucent member 13 and the support member 11 are brought into close contact with each other by melting the first translucent member 12.
The translucent member 13 itself is not melted.

(Third translucent member)
It is preferable that the third translucent member is arranged so as to cover at least the light emitting surface of the second translucent member. In one embodiment, the third translucent member is the light emitting surface 13b of the second translucent member 13.
It is arranged so as to straddle the first translucent member 12 arranged on the support member 11 and cover them.
The third translucent member 14 is preferably formed of a material having translucency as described above. For example, it can be selected from the materials exemplified in the first translucent member 12.
The third translucent member may have a melting point equal to that of the first translucent member, may be lower, or may be higher.
Further, the third translucent member preferably has a melting point lower than that of the second translucent member 13.
Further, the third translucent member preferably has a melting point lower than that of the support member 11.

The third translucent member can be fixed to the support member 11 by utilizing the melting of itself and / or by utilizing the melting of the first translucent member.
The third translucent member 14 is preferably formed by fusion (melting). By forming by fusion, it is difficult for a gap (air gap) or the like to be formed between the third translucent member and the second translucent member, that is, the third translucent member and the second translucent member It is possible to secure a large contact area with good adhesion between the two.

The third translucent member 14 preferably contains the above-mentioned phosphor and / or light scattering material or filler. As a result, the light that has passed through the second translucent member can be made uniform, and the color can be adjusted. Further, if the compatibility with the material constituting the second translucent member is not good or deterioration may occur in the production of the second translucent member depending on the type of the phosphor, the second translucent member is used. By containing the phosphor in the third translucent member 14 instead of the inclusion of the phosphor in, or in place of the inclusion of the light scattering material or the filler in the second translucent member, the third translucent member 14 By containing a light scattering material or a filler in the mixture, it is possible to further stabilize the optical characteristics. Further, a relatively large amount of light scattering material or filler can be used for the third light transmitting member while suppressing the deterioration of the local transmittance in the second light transmitting member.
Further, since the light can be applied to the phosphor of the second translucent member in a state where the light density is lowered, it is possible to reduce the heat generation of the phosphor and improve the color unevenness of the emitted light. Further, the third translucent member can correct the light incident on the second translucent member and / or the light emitted from the second translucent member to a desired color tone.
The content of the phosphor and / or the light diffusing material in the third translucent member 14 is, for example, 1.0 to 20% by weight, respectively, based on the weight of the total third translucent member, and is 2.0. It is preferably 10% by weight.
The thickness of the third translucent member 14 is, for example, about several to several hundred μm.

In FIG. 1A, the third translucent member 14 is formed of glass containing silicon dioxide as a light scattering agent in an amount of 4.0% by weight based on the total weight of the third translucent member. Its thickness is 0.
It is 2 μm.
The surface of the third translucent member 14 is arranged flush with the surface of the first translucent member 12 or at a position slightly higher than the surface of the first translucent member 12.

(Functional membrane)
The functional film is not particularly limited as long as it can function suitably for light transmission, reflectivity, thermal conductivity, etc. For example, a short pass filter, a long pass filter, and the like.
Examples include heat dissipation members. Due to their function, these can be arranged on the light emitting surface side, the incident surface side, and along the light traveling, intersecting the light traveling.

[Manufacturing method of optical member]
As shown in FIGS. 1B to 1E, the method for manufacturing the optical component 10 of this embodiment includes the following steps.
(A) A support member having a through hole having an incident opening and an outgoing opening is prepared.
(B) A second translucent member having a light incident surface, a light emitting surface, and an outer peripheral side surface is prepared.
(C) A first translucent member is formed on the inner wall of the through hole,
(D) A step of fixing the outer peripheral side surface of the second translucent member to the inner wall of the through hole by fusion with the first translucent member.
The steps (a) to (c) may be performed in any order.
After the step (d), an optional step (e) of forming a third translucent member that covers the first translucent member from the light emitting surface of the second translucent member may be performed.
Further, (f) one or more upper surfaces and / or lower surfaces of the third translucent member, the first translucent member, and the support member may be polished or the like.

(A: Preparation of support member)
Prepare ceramics made of the material that will be the support member. As shown in FIG. 1B, the plate-shaped ceramics are cut into an appropriate size to form a through hole 11a that is wide in one direction. The through hole 11a can be formed by a method known in the art. For example, it is formed by grinding or a mold.

For example, when preparing the above-mentioned ceramic flat plate made of zirconia-containing aluminum oxide, add 70 to 95 parts by weight of aluminum oxide, 5.0 to 30 parts by weight of zirconia, and one or more of yttria, calcia, magnesia, and ceria. 0.1 to 2.0 parts by weight are mixed to obtain a sheet-like ceramic green sheet having a predetermined thickness. Then, the ceramic green sheet is formed into a predetermined shape by a mold and fired at about 1550 ° C. to form the ceramic green sheet.

(B: Preparation of the second translucent member)
A flat plate made of a material to be the second translucent member is prepared. The material serving as the second light-transmitting member may contain a phosphor and optionally a light scattering material or a filler.

For example, when preparing a ceramic flat plate made of aluminum oxide, an additive, a phosphor, a light diffusing agent, etc. are arbitrarily added to a material containing aluminum oxide as a main component and mixed, and the obtained mixture is solid-state compression-baked. Examples thereof include a method of sintering by a knotting method or the like.
Specifically, the obtained mixture is filled in a graphite sintered mold, a large current is applied using the ON-OFF DC pulse voltage / current, and the discharge plasma (high temperature plasma) generated instantaneously due to the spark discharge phenomenon. : A discharge plasma sintering method in which a high energy of several thousand to 10,000 ° C is instantaneously generated between particles) is directly applied to a sintering mold and a material and sintered while being pressurized. ..
After that, it is processed by a grinding method so as to have an appropriate size and an appropriate outer peripheral side surface (FIG. 1D).
See middle, 13).

(C: Formation of first translucent member)
As shown in FIG. 1C, the first translucent member 12 is formed on the inner wall of the through hole 11a of the support member 11. If the first translucent member 12 is formed on a part or all of the inner wall of the through hole 11a, it may be formed on the upper surface of the support member or the like.
The first translucent member 12 can be formed at an appropriate position on the support member 11 by a known method such as a sol-gel method, a spin coating method, or a sputtering method. Above all, it is preferable to form by a sputtering method.
For example, a method of forming a film by sputtering using a target made of borosilicate glass with a sputtering apparatus can be mentioned.

(D: Fixing the second translucent member)
As shown in FIG. 1D, the second light transmitting member 13 is arranged in the through hole 11a of the support member 11 in which the first light transmitting member 12 is formed on the surface of the inner wall, along the shape of the through hole 11a. After that, the first translucent member 12 is melted at a portion where the second translucent member 13 and the support member 11 are in contact with each other via the first translucent member 12 by a process involving heating.
The heating here is performed at a temperature equal to or higher than the melting point (or softening point) of the first translucent member and equal to or lower than the melting point of the second translucent member. Specifically, a method of heating to a temperature of about 750 to 850 ° C. can be mentioned. In particular, when the support member is made of zirconia-containing alumina oxide and the second light-transmitting member is made of alumina oxide, the second light-transmitting member and the second light-transmitting member are heated to a temperature of about 820 to 830 ° C. Since the support member does not melt and only the first translucent member softens or melts, it extends over the contact surfaces of the second translucent member and the support member, fills a gap, and melts the second translucent member and the support member. You can wear it.
The heat treatment is preferably performed, for example, by placing the support member in an electric furnace.

After melting the first translucent member, the second translucent member is pressed against the support member to bring them into close contact with each other, and by cooling these, the first translucent member is cured and the second translucent member is cured. The member can be fixed in the through hole of the support member.

By arranging the first translucent member on the surface of the inner wall in this way, it is possible to fuse the two with good reproducibility without aligning the second translucent member with the support member. Further, since the second translucent member can be fused and fixed to the support member in a large area by using the outer peripheral side surface of the second translucent member, the second translucent member can be firmly fixed to the support member and has good adhesion. Due to the good condition, the heat in the second translucent member can be efficiently propagated and dissipated to the support member. As a result, the heat dissipation of the light emitting device in which this optical component is used can be further improved.

(E: Formation of third translucent member)
After fixing the second translucent member to the support member, as shown in FIG. 1E, optionally, the second translucent member 1
The third translucent member 14 may be formed so that 3 is covered with the third translucent member 14.
The third translucent member 14 is formed or processed into a size slightly larger than the size of the through hole 11a on the light emitting side of the support member 11, and this is formed from the light emitting surface of the second translucent member 13. 1 The translucent member 12 is arranged so as to straddle it, and a process involving heating is performed to melt the third translucent member 14. Alternatively, a third light transmitting member 14 having the same size as the light emitting surface may be used.
In this case, the first translucent member 12 formed on the surface of the support member 11 may be melted together with the melting of the third translucent member 14.
After melting the third translucent member 14, the third translucent member 14 is pressed against the support member 11 to bring them into close contact with each other, and by cooling these, the third translucent member 14 is cured. It can be fixed to the support member 11 and / or the second translucent member 13.

Alternatively, by using a mask or the like, the first translucent member 1 can be seen from the light emitting surface of the second translucent member 13.
Sputtering method, sol-gel method, thin film deposition, AL on the position straddling 2 or the light emitting surface of the second translucent member 13.
The third translucent member 14 may be partially formed by using the D method or the like.

Further, after fixing the third translucent member 14, the upper surface thereof may be polished. By this polishing, the volume of the third translucent member is adjusted. When the third translucent member contains a phosphor and / or a light scattering material or a filler, the volume is adjusted to adjust the homogenization and / or color of the light passing through the second transmissive member. It can be performed. By this polishing, the third translucent member 14 may be removed together with the first translucent member 12 remaining on the support member 11, and the upper surfaces of the third translucent member 14 and the support member 11 may be substantially flush with each other. Alternatively, the upper surfaces of the remaining first translucent member 12 and the third translucent member 14 may be substantially flush with each other. Further, after fixing the third translucent member 14, the upper surface thereof may be roughened to unevenness.

Embodiment 2: Optical component and manufacturing method thereof As shown in FIG. 2, the optical component 20 of this embodiment mainly includes a support member 21, a first translucent member 12, a second translucent member 13, and a second. 3. The light transmitting member 14 includes a filter 26 that transmits light having a wavelength equal to or shorter than the wavelength of the emitted light of the light emitting element in the light emitting device applied as a functional film, and reflects light having a longer wavelength than that.
As the filter 26, any one formed of a material known in the art can be used.
In FIG. 2, the filter 26 is arranged in contact with the second translucent member 13 and the support member 11 on the light incident surface side of the second translucent member 13.
Therefore, after forming the third translucent member 14, for example, the lower surface of the support member 11 is polished to form the filter 26 by using a sputtering method. Inorganic adhesion, thin film deposition, etc. may be used.

Except for the above-described configuration, the optical member 10 is substantially the same, and can be formed by substantially the same manufacturing method.

By having such a configuration, in addition to the effect of the optical member 10, the filter 26 can be used, so that it is possible to selectively and efficiently extract only light having a desired wavelength as the optical member. Become.

Embodiment 3: Optical component and manufacturing method thereof As shown in FIG. 3, the optical component 30 of this embodiment mainly includes a support member 31, a first translucent member 12, a second translucent member 13, and a second. 3 The light transmitting member 14, the filter 26, and the heat radiating member 37 are provided.
The heat radiating member is not particularly limited as long as it is a translucent material and has good heat resistance.
Any of the first translucent member, the second translucent member, the one exemplified in the third translucent member, sapphire and the like can be used.
Therefore, it is adhered to the filter 26 using, for example, low melting point glass.
Except for the above-described configuration, the optical member 10 and the optical component 20 are substantially the same, and can be formed by substantially the same manufacturing method.

By having such a configuration, in addition to the effects of the optical members 10 and 20, the filter 26 can be the support member 11 while realizing that only the light having a desired wavelength can be selectively and efficiently extracted.
Not only that, heat is drawn from the opposite side on the entire surface, and heat dissipation can be improved.

Embodiment 4: Optical component and manufacturing method thereof As a modification of the third embodiment, as shown in FIG. 4, the optical component 40 of this embodiment mainly includes a support member 31 and the optical component 30 of FIG. , The first translucent member 12 and the second translucent member 1
3, a third translucent member 14, a filter 26, and a heat radiating member 37 are provided. Filter 2
6 and the second translucent member 13 may be separated from each other.
Specifically, in the second embodiment, after the third translucent member 14 is formed, the lower surface of the support member 11 is not polished, and the filter 26 is formed on the lower surface of the support member 11 by using a sputtering method or the like. The filter 26 is arranged on the light incident surface side of the second translucent member 13 so as to be separated from the second translucent member 13 and in contact with the support member 11.

Embodiment 5: Optical component The optical component 50 of this embodiment has a through hole 41a in the support member 41 as shown in FIG.
However, it has substantially the same configuration as the optical component 10 except that it has a shape that gradually and inclinedly spreads in the traveling direction of light, and can be formed by substantially the same manufacturing method. it can.

By having such a configuration, the second translucent member 13 can be brought into close contact with the support member 11 not only on the outer peripheral side surface but also on a part of the light incident surface, so that stronger fixing can be realized. The heat dissipation can be further improved.

Embodiment 6: Light emitting device and manufacturing method thereof The light emitting device 60 of this embodiment is manufactured by combining any of the above-mentioned optical components with a light source or the like. That is, the optical component can be manufactured by connecting it to a light source. In this case, it does not mean a direct connection with the semiconductor laser element, but means that the light emitted from the light source is optically coupled so as to hit the second translucent member of the support member of the optical component. To do.

As shown in FIG. 6A, the light emitting device 60 mainly includes a semiconductor laser element as a light source, that is, a laser diode 67, and a support member 61 as an optical component.
As the light source, not only a laser diode but also various light sources such as a light emitting diode can be used.

The laser diode 67 can be used without particular limitation as long as it can oscillate laser light. For example, 300 nm to 500 nm, preferably 400 n
Those having an emission peak wavelength of m to 470 nm, more preferably 420 nm to 470 nm can be used. Typically, an end face emitting type LD can be used. As the LD, a high output one can be used. For example, 1 W to 100 in one LD.
The one with the output of W can be used. Further, the LD may have a higher output by using not only one LD but also a plurality of LDs. When two or more LDs are used, their wavelengths may be in the same wavelength band, or may be different or overlap.
As described above, the light emitting device 60 includes an optical component having heat-resistant characteristics, and is therefore particularly effective when a high-power LD is adopted.

The support member 61 as an optical component has a tubular housing shape, has a through hole, and has a second light-transmitting member 63 fused by a first light-transmitting member 62 on its inner wall. The third light transmitting member 64 is fixed from the top of the two light transmitting member 63 to the top of the first light transmitting member 62. Except for this configuration, the configuration is substantially the same as that of the optical component 10.

The laser diode 67 is fixed to the plate-shaped stem 70 by using a heat sink 66. The support member 61 as an optical component includes an internal space 65 and is sealed by a stem 70. A plurality of leads 69 for electrically connecting to external power are arranged in the stem 70 through a plurality of through holes provided in the stem 70, respectively. The through hole can be further sealed with a sealing material 68 made of a material such as low melting point glass. The laser diode 1 is electrically connected to the lead 69 via a conductive member such as a wire.
Between the laser diode 67 and the support member 61, particularly the second translucent member 63, for example,
A member such as a lens capable of condensing the laser beam may be provided.

In the light emitting device having such a configuration, as shown in FIG. 6B, the light emitted from the laser diode 67 passes through the through hole of the support member 61 as the incident light 16, and the second light transmitting member 63.
Is irradiated to the light, and is emitted as emitted light 17 via the third translucent member 64.
As a result, the wavelength of the light that has passed through the second translucent member 63 can be converted into desired light by the second translucent member 13, and the color of the light that has passed through the second translucent member 63 can be made uniform and the color can be adjusted.
Further, even in long-term light irradiation, uniform light quality characteristics can be maintained / improved for a long period of time without deteriorating or deteriorating the optical component itself.
Further, in the support member 11, since the silver-containing coating film as conventionally used does not exist in the traveling direction of light, high-power light can be extracted for a long period of time without reducing the light extraction efficiency. Can be maintained. Further, even when the second translucent member and / or the third translucent member contains a phosphor, the heat dissipation of these translucent members is improved, so that the phosphor is not adversely affected. , Light quality characteristics can be maintained.

Embodiment 7: Light emitting device As another light emitting device, a light source, a lens that collects light from the light source, a connector for connecting the light from the light source to the optical fiber, an optical fiber, and a tip portion of the optical fiber. An example is one in which the tip member holding the light source and the optical component connected to the tip member are connected in this order.
In this light emitting device, a part of the light from the light source is introduced into the optical component by the optical fiber, and finally, the mixed color light of the light from the light source and the light of the phosphor can be extracted.

The optical component, its manufacturing method, and the light emitting device according to the embodiment of the present invention include an in-vehicle, liquid crystal display backlight source, various lighting fixtures, a large display, advertisements, various display devices such as destination guidance, and a digital video camera. , Facsimile, copier, image reading device in scanner, etc., various lighting of projector device, etc.

10, 20, 30, 40, 50 Optical parts 11, 61 Support members 11a Through holes 12, 62 First light-transmitting members 13, 63 Second light-transmitting members 13a Light incident surface 13b Light emitting surface 13c Outer peripheral side surfaces 14, 64th 3 Translucent member 16 Incident light 17 Emission light 26 Filter 37 Heat dissipation member 60 Light emitting device 65 Internal space 66 Heat sink 67 Laser diode 68 Encapsulant 69 Lead 70 Stem

Claims (15)

A support member having a through hole having an incident opening and an outgoing opening,
The first translucent member formed on the inner wall of the through hole and
It has a light incident surface, a light emitting surface, and an outer peripheral side surface, and includes a second light transmitting member arranged in the through hole.
The outer peripheral side surface of the second translucent member is fixed to the inner wall of the through hole by fusion with the first translucent member.
The first translucent member is an optical component in which the thickness of the region not in contact with the outer peripheral side surface of the second translucent member is larger than the thickness of the region in contact with the outer peripheral side surface of the second translucent member. The optical component according to claim 1, wherein the first light transmitting member is formed on the inner wall of the through hole from the incident opening to the exit opening. The optical component according to claim 1 or 2, wherein the second translucent member includes a phosphor. The optical component according to any one of claims 1 to 3, wherein the through hole has an inner wall that expands in the traveling direction of light. The optical component according to claim 4, wherein the second light transmitting member has a shape that spreads from the light incident surface to the light emitting surface. The optical component according to any one of claims 1 to 5, further comprising a third translucent member that covers the light emitting surface of the second translucent member. The optical component according to any one of claims 1 to 6, further comprising a heat radiating member below the support member. A light emitting device including the optical component according to any one of claims 1 to 7 and a semiconductor laser device. A support member having a through hole having an incident opening and an outgoing opening is prepared.
A second translucent member having a light incident surface, a light emitting surface, and an outer peripheral side surface is prepared.
A first translucent member is formed on the inner wall of the through hole,
The step of fixing the outer peripheral side surface of the second translucent member to the inner wall of the through hole by fusion with the first translucent member is included.
A method for manufacturing an optical component in which the thickness of a region of the first translucent member that does not contact the outer peripheral side surface of the second translucent member is larger than the thickness of a region that contacts the outer peripheral side surface of the second transmissive member. The method for manufacturing an optical component according to claim 9, further comprising a step of forming the first light transmitting member from the incident opening to the exit opening on the inner wall of the through hole at least. The method for manufacturing an optical component according to claim 9 or 10, further comprising a step of forming a third translucent member that covers the light emitting surface of the second translucent member. The first translucent member is also formed on the upper surface of the support member, and after the third translucent member is formed, at least a part of the first translucent member and a part of the third transmissive member are formed. The method for manufacturing an optical component according to claim 11, which includes a step of removing. The method for manufacturing an optical component according to claim 11 or 12, further comprising a step of polishing the third translucent member from the exit opening side of the support member after forming the third translucent member. The method for manufacturing an optical component according to any one of claims 9 to 13, further comprising a step of arranging a heat radiating member below the support member. A method for manufacturing a light emitting device for connecting an optical component according to the manufacturing method according to any one of claims 9 to 14 to a semiconductor laser device.

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