JP6775003B2 - Charged particle beam device - Google Patents

Description

The present invention relates to a charged particle beam device.

A scanning electron microscope (SEM), which is a type of charged particle beam device, is a device for observing a surface image of a sample by irradiating the sample with an electron beam emitted from an electron source.

Patent Document 1 discloses an SEM that tilts a sample during observation by an OM in order to match the observation angles of the SEM and an optical microscope (hereinafter referred to as OM).

Patent Document 2 discloses an SEM that rotates a sample chamber provided with a mirror body of the SEM and an OM, not a sample.

Japanese Unexamined Patent Publication No. 4-106853 Japanese Unexamined Patent Publication No. 2012-15527

The SEM of Patent Document 1 is premised on use in the IC manufacturing process. Since the IC wafer to be observed is almost uniformly flat and the size is always uniform, it is possible to determine in advance the conditions for tilting the sample so that the sample does not collide with other constituents. However, in a general-purpose SEM for observing samples of different sizes and heights, the sample may collide with other components when the sample is tilted.

In the method of Patent Document 2, the SEM mirror body and the optical microscope are movable. Therefore, the SEM mirror body is required to be lightweight, and it is difficult to mount a high-performance mirror body.

An object of the present invention is to provide a charged particle beam apparatus capable of appropriately observing a sample even when observing a sample having a different size and height.

The charged particle beam apparatus according to the embodiment of the present invention includes a stage for placing a sample and moving the sample inside the sample chamber, a mirror body for irradiating the sample with the charged particle beam to observe the sample, and the mirror body. When observing the sample with the first imaging device for observing the surface irradiated with the charged particle beam of the sample from a different angle from the above, and the sample after separating the sample from the mirror body when observing the sample with the first imaging device. A control unit for tilting the sample by the stage so as to face the first imaging device is provided.

According to the present invention, it is possible to provide a charged particle beam apparatus capable of appropriately observing a sample even when observing samples having different sizes and heights.

Diagram showing a charged particle beam device The figure which shows the operation of the sample of SEM Flowchart showing the procedure for finding a field of view Flow chart showing the details of S303 Diagram showing an SEM with a chamber scope The figure which shows the sample which has a convex part Flowchart showing the procedure for determining the possibility of sample collision The figure which shows the operation of a sample when the possibility of a sample collision is high The figure which shows the SEM equipped with a detector near a sample The figure which shows the operation of a sample when the sample is larger than the field of view of an image pickup apparatus. Diagram showing a conventional charged particle beam device

The SEM is characterized in that the resolution and the magnification can be increased as compared with a normal OM, and is suitable for observing a fine structure of several mm to several nm. Before observing the sample with high resolution using the SEM, it is necessary to observe the sample with the SEM magnification set low and specify the part to be observed to some extent.

However, the minimum magnification of SEM is larger than that of OM (SEM has a narrower field of view than OM). Although it depends on the device configuration, as an example, the minimum magnification of OM is about 1 to 3 times, and the minimum magnification of SEM is about 10 to 50 times. Due to the minimum magnification, when the user observes a large sample by SEM, it becomes difficult to grasp the whole view of the sample and recognize the position of the sample in the field of view currently observed by SEM.

Therefore, there is a method of tilting the OM in the sample chamber of the SEM and comparing the image obtained by the OM (hereinafter, OM image) with the image obtained by the SEM (hereinafter, SEM image) to search the field of view of the SEM. is there. In this case, the observation angle is different between SEM and OM.

The "magnification" in the SEM is a value defined by "how many times the scanning range of the field of view under observation by the SEM is displayed". Theoretically, by changing the display size of the SEM image, it is possible to realize an arbitrary magnification regardless of the wide field of view. In the present specification, the magnification is described assuming that the SEM image is displayed in a constant size on a monitor for a PC of a general size (that is, the field of view is wide when the magnification is low).

Here, the electron source of the SEM includes a thermionic type, a Schottky type, a field emission type and the like. In any of the electron sources, it is necessary to prevent the filament from burning and the gas from adhering to the electron source. Further, in the low vacuum region, the electron beam collides with the residual gas molecules and is scattered. Therefore, when observing the sample by the SEM, the mirror body and the sample chamber of the SEM are kept in a vacuum.

In a normal SEM, the mirror body is fixed to the sample chamber in order to evacuate the electron source, the mirror body and the sample chamber. Therefore, the mirror body cannot move with respect to the sample chamber, and the irradiation direction and irradiation position of the electron beam are fixed. Therefore, for example, it is not realistic to widen the observation field of view by making the distance between the sample and the mirror body extremely long, and there is an upper limit in the field of view of the SEM (there is a lower limit in the magnification).

Normally, the hole diameter at the tip of the mirror body of the SEM is about several mm. Even if the electron beam is scanned in a region wider than this hole diameter, the electron beam is blocked by the mirror body and does not irradiate the sample. Therefore, the (practical) upper limit of the SEM field of view is about several mm square (10 to 50 times in terms of magnification).

When observing a sample of several cm square or more, it is difficult to grasp the whole view of the sample and recognize the position of the sample in the SEM, which can obtain only a field of view of several mm square at the maximum. is there. Therefore, when observing a sample having a size of several mm square or more, it takes an enormous amount of time to specify the place to be observed only by SEM. Further, unlike the OM, the SEM image is a monochrome image, so that the color of the sample surface cannot be observed. In order to solve these problems, there is a method of comparing the OM image and the SEM image to search the field of view of the SEM.

FIG. 11 shows an example of a conventional charged particle beam apparatus. The sample chamber 104 of the SEM shown in FIG. 11 is provided with an image pickup device 107 facing in the same direction as the mirror body 103. The image pickup apparatus 107 may be provided not in the sample chamber 104 but in, for example, a sample exchange chamber (not shown). When the stage 102 forms a part of the sample chamber 104 or the like, the imaging device 107 may be provided on the stage 102. The user moves the sample 101 to a predetermined position (immediately below the imaging device 107) by the stage 102, and images an optical image of the sample 101.

According to this configuration, since the sample 101 and the imaging device 107 are not removed, there is no problem of mechanical mounting error when the sample 101 is placed on the stage 102. Further, since the sample 101 is always present inside the sample chamber, complicated work such as air exposure and evacuation does not occur.

On the other hand, in this method, it is necessary to examine the arrangement and shape of the mirror body 103, the detector 106, and the like so as not to block the field of view of the image pickup apparatus 107. Further, since the heights of the sample 101 and the imaging device 107 are fixed, the field of view of the imaging device 107 is limited. Further, with the installation of the image pickup apparatus 107, the entire SEM becomes larger.

Examples will be described below. The "image" in this embodiment includes not only a still image but also a moving image (video).

FIG. 1 is a diagram showing a charged particle beam device including an SEM and an imaging device. The charged particle beam device 100 includes a stage 102 on which the sample 101 is placed, a mirror body 103 that irradiates the sample 101 with an electron beam, a sample chamber 104 that keeps the inside in a vacuum, and a vacuum pump 105 that evacuates the sample chamber 104. A detector 106 that detects electrons and X-rays, an imaging device 107 that captures an optical image, a monitor (display unit) 110 that displays an SEM image, an optical image, etc., and a control unit 108 that controls each of these components. To be equipped with.

The stage 102 can be tilted, rotated, moved in a plane, and moved up and down with respect to an electron beam in order to observe an arbitrary position of a sample having various shapes.

Examples of the detector 106 include a secondary electron detector, an X-ray detector, a cathode luminescence detector, a low vacuum secondary electron detector, a backscattered electron detector, and the like. A plurality of these detectors may be provided in combination.

The imaging device 107 images the entire view of the sample 101, and stores the optical image acquired by the imaging in the memory 109 included in the control unit 108. The optical image is displayed on the monitor 110 by the control unit 108. By associating the optical image with the coordinates of the stage 102 in advance, it is possible to specify the observation position in the SEM by using the image of the same magnification or the low magnification by the image pickup apparatus 107. In addition, it is possible to obtain color information of the sample 101, which cannot be obtained by SEM. The image pickup device 107 may be any device that can capture an optical image, and includes, for example, an OM, a CCD camera, an infrared camera, and the like.

According to the above configuration, the sample 101 can be imaged in a state where the sample 101 is arranged directly under the mirror body 103, and the stage 102 does not need to be moved horizontally, so that the SEM can be miniaturized. Although the example in which the stage 102 is tilted to capture the optical image is shown here, the optical image may be captured while the stage 102 is kept horizontal.

Here, as shown in FIG. 1, since the distance between the image pickup device 107 and the mirror body 103 is short, there is a problem that the field of view of the image pickup device 107 is blocked by the mirror body 103 or the like. Further, when the image pickup apparatus 107 is imaged while the stage 102 is kept horizontal, the observation angles of the mirror body 103 and the image pickup apparatus 107 are different, so that correction is required after the imaging.

Further, when the stage 102 is tilted to capture an optical image, if the height and size of the sample are determined, the sample tilting conditions so that the sample 101 does not collide with other components can be determined in advance. it can. However, in a general-purpose SEM for observing samples of different sizes and heights, the sample may collide with other components when the sample is tilted.

FIG. 2 is a diagram showing the operation of the SEM sample. FIG. 2A shows a case where the sample 101 is observed by SEM. In order to observe the sample 101 with high resolution, it is preferable that the working distance (distance between the tip of the objective lens and the sample) is short, so that the sample 101 and the mirror body 103 are arranged so as to be close to each other. On the other hand, in this example, the field of view 111 of the image pickup apparatus 107 is limited by the mirror body 103. Therefore, the image pickup apparatus 107 cannot observe the entire view of the sample 101.

Further, in the SEM, the purpose is to increase the signal amount by the tilt effect, to irradiate the side surface of the uneven portion where the electron beam is not irradiated from directly above, to observe the sample 101 three-dimensionally, and the like. , The sample 101 may be tilted toward the detector 106. In FIG. 2A, the sample 101 tilted toward the detector 106 is shown by a dotted line. In such a case, the image pickup apparatus 107 cannot observe the surface of the sample 101.

In order to observe the sample 101 with the imaging device 107, it is conceivable to incline the sample 101 toward the imaging device 107. FIG. 2 (B) shows a schematic view when the sample 101 is tilted toward the imaging device 107. In this example, when the sample 101 is tilted, the end portion of the sample 101 collides with the detector 106, so that the sample 101 cannot be tilted sufficiently.

Next, a schematic diagram of the operation of the sample 101 in this embodiment is shown in FIG. 2 (C). When observing the sample 101 with the imaging device 107, the control unit 108 moves the sample 101 by the stage 102 so that the sample 101 is within the field of view 111 of the imaging device 107. First, by lowering the position of the sample 101 (moving in the direction away from the mirror body 103), the sample 101 enters the field of view 111 of the imaging device 107. Although the sample 101 is moved directly below here, the sample 101 may be positioned within the field of view 111 of the imaging device 107 in combination with the horizontal movement of the sample 101.

By the way, if only the movement in FIG. 2C is performed, the observation angle differs between the SEM and the imaging device 107, and the optical image is distorted. Therefore, correction is required after imaging. Therefore, a schematic diagram of the further operation of the sample 101 is shown in FIG. 2 (D). When observing the sample 101 with the imaging device 107, the control unit 108 tilts the sample 101 so that the sample 101 faces the imaging device 107. At this time, it is preferable to adjust the vertical position of the sample 101 so that the sample 101 does not collide with the components inside the SEM.

Next, the procedure for searching the visual field of this embodiment will be described with reference to FIG.

S301: The user places the sample 101 on the stage 102. If the stage 102 is removable from the sample chamber 104, the stage 102 is fixed to the sample chamber 104.

S302: The control unit 108 issues an instruction to the vacuum pump 105 to evacuate the sample chamber 104.

S303: The control unit 108 moves the stage 102 to a position where the image pickup device 107 can image the sample 101, for example, as shown in FIG. 1 (D).

S304: The control unit 108 instructs the image pickup apparatus 107 to take an optical image of the sample 101, and stores the optical image in the memory 109.

S305: If the control unit 108 determines that the brightness of the optical image is insufficient, or if it determines that the memory of the optical image has failed, the control unit 108 returns to S304 again and re-records the sample 101 by the imaging device 107. Take an image. Here, the control unit 108 reads out the information of the optical image and determines the necessity of reimaging. However, for example, the optical image is displayed on the monitor 110 and the user is made to determine the necessity of reimaging. May be good.

S306: When the control unit 108 determines that reimaging of the optical image is unnecessary, it issues an instruction to the stage 102 and moves the sample 101 to an SEM observation position (for example, directly under the mirror body 103). That is, the sample 101 is tilted so as to face the mirror body 103 and brought closer to the mirror body 103.

S307: The control unit 108 gives an instruction to the mirror body 103 and other components of the SEM, and starts observing the sample 101 at a low magnification.

S308: The control unit 108 displays the optical image stored in the memory 109 and the SEM image obtained by the detector 106 or the like on the monitor 110.

S309: The user specifies a position to be observed by the SEM from the optical image displayed on the monitor 110.

S310: The control unit 108 moves the stage 102 so that the field of view of the SEM is at the position specified in S309.

S311: The user determines whether or not the position specified on the optical image can be observed by the SEM. For example, if the optical image has a coordinate shift and does not match the SEM image, the process returns to S303 and the optical image is imaged again. If the position specified by the optical image can be observed by SEM, the field of view search is completed and normal SEM observation is started.

Next, the detailed flow of S303 will be described with reference to FIG.

The control unit 108 determines whether or not to move the stage 102 (S401). If it is determined that it is necessary to move, the process proceeds to S402, and if it is determined that it is unnecessary, the process proceeds to S403. When the size of the sample is known in advance (for example, in the case of Example 2 described later), the control unit 108 may determine according to the size of the sample, or may move according to the instruction of the user. You may let me. If movement is essential due to the layout of the charged particle beam device 100 or the like, the step may be omitted.

In S402, the control unit 108 separates the stage 102 from the mirror body 103 by a predetermined distance.

Next, the control unit 108 tilts the stage 102 by a predetermined angle so as to face the image pickup device 107 (S403). Then, the control unit 108 shifts to S304.

The predetermined distance of S402 and the predetermined angle of S403 may be a value peculiar to the layout of the charged particle beam apparatus 100, a value determined according to the size of the sample 101, and various other values. It may be a value calculated on the spot according to the conditions of. Further, these data may be stored in the memory 109 or may be stored in a storage device outside the control unit 108.

The above is the procedure for searching the field of view by SEM. In S308, only the optical image may be displayed, the user may specify the observation position, and then the SEM observation may be started. In addition, steps can be added / deleted / replaced / changed.

According to this embodiment, it is not necessary to reattach the sample between the imaging by the imaging device 107 and the observation by the SEM, and it is not necessary to repeatedly open the atmosphere and evacuate, and an optical image can be acquired. Efficiency is improved. Since the process of opening to the atmosphere is not performed, deterioration of the sample 101 due to the atmosphere can be prevented. Further, since the image pickup apparatus 107 is provided in the sample chamber 104 in an inclined state, the sample chamber 104 can be miniaturized. Further, when the sample 101 is imaged by the imaging device 107, the sample 101 is tilted by the stage 102 to face the imaging device 107, so that the optical image is not distorted. Further, since the control unit 108 tilts the sample 101 after separating the sample 101 and the mirror body 103 or the like by a predetermined distance, even if the sample has an indefinite size or the like, the sample has another configuration when tilted. The possibility of colliding with elements can be reduced.

In the second embodiment, a charged particle beam apparatus including a plurality of imaging devices will be described.

As described above, in order to obtain high resolution by SEM, it is desirable that the distance between the sample 101 and the mirror body 103 is short. However, the distance between the sample 101 and the mirror body 103 cannot be accurately determined from the SEM image alone. Therefore, by providing an imaging device different from the imaging device 107 on the side surface of the sample chamber 104, the vertical position of the sample is determined by observing the sample 101 from the side.

5 (A) is a schematic view of the charged particle beam device according to the second embodiment, and FIG. 5 (B) is a perspective view of the charged particle beam device according to the second embodiment. In addition to the configuration shown in FIG. 1, the charged particle beam device 100 has a second imaging device for observing the inside of the sample chamber 104 from a direction different from that of the mirror body 103 and the imaging device 107. Here, the second imaging device will be described as the chamber scope 501. The chamber scope 501 includes the sample 101, the stage 102, the detector 106, and the like in the field of view from a direction substantially perpendicular to the optical axis of the mirror body 103. A plurality of chamber scopes 501 may be provided and observed from various directions.

In Example 1, the sample 101 is shown to be flat, but the actual sample may have irregularities. FIG. 6 shows a schematic diagram of the sample 101 having the convex portion 601 when the sample 101 is imaged by the image pickup apparatus 107 by the method of Example 1. When the protrusion amount of the convex portion 601 is large, the convex portion 601 may collide with other components even if the sample 101 is lowered and then tilted as described in FIG. 2 (D). The same applies even when the convex portion 601 does not exist, for example, when the diameter of the sample 101 is large.

In addition to looking down on the sample 101 from directly above, the mirror body 103 has a narrow field of view of the SEM image, so that the protrusion amount of the sample 101 can be determined from the SEM image and the convex portion 601 is found. Even that is difficult.

Although the image pickup apparatus 107 is also installed at a slight inclination, the sample 101 is observed from above, and it is difficult to determine the amount of protrusion of the convex portion 601. Further, in the first embodiment, since the sample 101 is tilted before the imaging device 107 is imaged, it is not assumed that the image pickup device 107 is used to determine the protrusion amount of the convex portion 601 before tilting the sample. ..

Therefore, the SEM in Example 2 can be referred to as the sample 101 (convex portion 601) by observing the side surface of the sample 101 with the chamber scope 501 when the sample 101 is tilted in order to capture an optical image with the imaging device 107. , It can be confirmed that the collision with the component such as the mirror body 103 does not occur. In the second embodiment, the field of view 602 of the chamber scope 501 accommodates the sample 101, the mirror body 103, and the detector 106, but the field of view may be widened or narrowed as needed.

A method of using the chamber scope 501 in this embodiment will be described with reference to the flowchart shown in FIG.

S701 to S702: The same as S301 to S302.

S703: The control unit 108 determines whether or not a collision between the sample 101 and other components is likely to occur based on the captured image in the field of view 602 of the chamber scope 501. Here, the image of the chamber scope 501 may be displayed on the monitor 110, and the user may determine the possibility of collision. The control unit 108 may determine the possibility of collision by using image processing or the like.

S704: When the collision between the sample 101 and other components is unlikely to occur (when the possibility of collision is low), the sample 101 is moved to the imaging position of the imaging device 107 (similar to S303). The subsequent flow is the same as in FIG.

S705: When a collision between the sample 101 and other components is likely to occur (when the possibility of collision is high), the control unit 108 stops the operation of the stage 102. Then, the imaging position of the imaging device 107 is changed to a position where a collision does not occur. In this case, as an example, it is conceivable that the control unit 108 further separates the distance between the sample 101 and the mirror body 103, and / or reduces the tilt angle of the sample 101 with respect to the image pickup apparatus 107. Then, it shifts to S704.

The above is the method of using the chamber scope 501 in this embodiment. In the second embodiment, the operation of the stage 102 is stopped when it is determined that a sample collision is likely to occur, but the stage 102 may be continuously moved after controlling so that the collision does not occur. .. Further, the highest point of the sample 101 and its height may be measured by the chamber scope 501, and the imaging position of the imaging device 107 may be adjusted in advance. Further, if the judgment of the high possibility of collision is insufficient, or if there is an error in the calculation of the distance and the angle according to the judgment, fine adjustment may be made each time.

When the imaging position of the imaging device 107 is adjusted as described above, the positional relationship between the imaging device 107 and the sample 101 becomes undefined. FIG. 8 shows a schematic view when the imaging position is adjusted.

In order to prevent the convex portion 601 of the sample 101 from colliding with other components, a method of moving the sample 101 away from the imaging device 107 (101 (a)) or a method of horizontally moving the sample 101 (101 (). b)), a method of lowering the sample 101 directly below (101 (c)), and the like can be considered. In the case of 101 (a), since the distance between the image pickup apparatus 107 and the sample 101 changes, the optical image becomes smaller than usual, and the optical image and the SEM image have a difference in magnification. In the case of 101 (b), the coordinates of the optical image and the SEM image are displaced. In the case of 101 (c), the optical image becomes smaller than usual, and the optical image and the SEM image are displaced in magnification, and the optical image and the SEM image are displaced in coordinates. Therefore, in this embodiment, it is desirable that the control unit 108 corrects the deviation between the optical image and the SEM image due to the adjustment of the imaging position.

According to the above configuration, even in a sample having severe irregularities or a sample having a large diameter, it is possible to search the field of view of the SEM image by an optical image without collision between the sample and other components.

In Example 3, in the SEM described in Example 1 or Example 2, an SEM provided with a detector capable of being inserted and removed will be described with reference to FIG.

In a normal SEM, particularly an out-lens type SEM, the reflected electron detector 901 and the transmission electron detector 902 are arranged directly above or directly below the sample. In particular, the backscattered electron detector 901 is arranged between the mirror body 103 and the sample 101.

In the case of FIG. 9A, the field of view 111 of the imaging device 107 is blocked by the reflected electron detector 901, and the sample 101 cannot be included in the field of view. Further, since the reflected electron detector 901 is arranged at a distance closer to the sample 101 than the mirror body 103 or the like, the possibility of collision when the sample 101 is tilted increases.

The transmission electron detector 902 does not block the field of view 111 of the imaging device 107. However, when the sample 101 is moved up and down or tilted, the lower surface of the sample 101 or the stage 102 supporting the sample 101 may collide with the transmission electron detector 902.

Therefore, in the third embodiment, the reflected electron detector 901 and the transmission electron detector 902 can be retracted from the optical axis of the mirror body 103. As shown in FIG. 9B, the control unit 108 retracts each detector when using the image pickup apparatus 107. By using a chamber scope in combination with the second embodiment, each detector may be retracted while determining the height of the sample and each detector.

According to the above configuration, even in an SEM in which a detector is arranged on the optical axis of the mirror body 103, imaging by the imaging device 107 is possible without causing a collision between the sample 101 and the stage 102 and each detector or the like. Become.

In Example 4, an SEM capable of capturing an optical image even in a sample having a large diameter will be described.

The image pickup apparatus 107 can perform imaging at a lower magnification than the SEM, but the field of view 111 of the image pickup apparatus also has an upper limit. A sample having a diameter larger than the field of view 111 of the imaging device 107 cannot capture the entire view at one time.

Therefore, in Example 4, when a sample having a large diameter is used, an optical image is acquired for the entire view of the sample 101 by inclining the sample 101 and then taking an image while rotating the sample 101. FIG. 10 shows a method of acquiring an optical image of Example 4.

When the diameter of the sample 101 is larger than the field of view 111 of the imaging device 107, the control unit 108 acquires an optical image while rotating the sample 101 with the sample 101 facing the imaging device 107. In addition, "while rotating" here means that the optical image is acquired while continuously rotating the sample 101, and the sample 101 is rotated by a predetermined angle and then stopped to acquire the optical image, and then again. This includes the case where the sample 101 is rotated by a predetermined angle, then stopped, and the step of is repeated.

In FIG. 10A, an optical image near the convex portion 601 is acquired. After that, by rotating the sample 101 counterclockwise, an optical image other than the vicinity of the convex portion 601 can be obtained as shown in FIG. 10 (B). Hereinafter, by continuing the rotation of the sample 101 until the sample 101 has been rotated for one week, an optical image of the entire view of the sample 101 can be obtained.

In Example 4, it is premised that a sample having a large diameter is used, and there is a high possibility that a collision will occur when the sample is tilted. Therefore, by combining with the methods of Examples 1, 2 or 3, it is possible to avoid collision of samples.

In the above, each embodiment has been described as an example of a charged particle beam device including an SEM and an imaging device, but the present invention is not limited to this. For example, the SEM portion may be replaced with a transmission electron microscope (TEM), and may be further equipped with equipment for processing the sample 101 such as a microtome, an ion milling device, and a FIB.

101 ... sample, 102 ... stage, 103 ... mirror body, 104 ... sample chamber, 105 ... vacuum pump, 106 ... secondary electron detector, 107 ... imaging device, 108 ... control unit, 109 ... memory, 110 ... monitor, 111 ... Field of view of imaging device, 501 ... Chamber scope, 601 ... Convex part, 602 ... Field of view of chamber scope, 901 ... Backscattered electron detector, 902 ... Transmission electron detector

Claims (3)

A stage on which the sample is placed and the sample is moved inside the sample chamber,
A mirror body that irradiates the sample with a charged particle beam,
An imaging device for observing the surface of the sample irradiated with charged particle beams, and
When observing the sample with the imaging device, after separating the sample from the mirror body, the sample is tilted by the stage so that the sample faces the imaging device, and the sample is tilted from the field of view of the imaging device. Also includes a control unit that rotates the sample and acquires an optical image in at least two visual field regions on the sample when the sample is large.
The control unit is a charged particle beam device that continuously rotates the sample to acquire optical images of the at least two visual field regions. A stage on which the sample is placed and the sample is moved inside the sample chamber,
A mirror body that irradiates the sample with a charged particle beam,
An imaging device for observing the surface of the sample irradiated with charged particle beams, and
When observing the sample with the imaging device, after separating the sample from the mirror body, the sample is tilted by the stage so that the sample faces the imaging device, and the sample is tilted from the field of view of the imaging device. Also includes a control unit that rotates the sample and acquires an optical image in at least two visual field regions on the sample when the sample is large.
Charged particles wherein the control unit acquires the optical image in the first field area on the sample, after the sample was rotated by a predetermined angle, to obtain the optical image in the second field area on the sample Wire device. A stage on which the sample is placed and the sample is moved inside the sample chamber,
A mirror body that irradiates the sample with a charged particle beam,
An imaging device for observing the surface of the sample irradiated with charged particle beams, and
When observing the sample with the imaging device, after separating the sample from the mirror body, the sample is tilted by the stage so that the sample faces the imaging device, and the sample is tilted from the field of view of the imaging device. Also includes a control unit that rotates the sample and acquires an optical image in at least two visual field regions on the sample when the sample is large.
The control unit is a charged particle beam device that acquires an optical image of the entire view of the sample by the rotation.

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