JP6769087B2 - Method for forming cooling member, cooling device, electronic device and cooling member - Google Patents

Description

The present invention relates to a technique for cooling a heat generating component.

Heat-generating components that generate heat that may cause malfunction or thermal damage of the electric circuit are cooled by using a cooling member such as a heat sink in order to prevent malfunction or thermal damage of the electric circuit. FIG. 7 is a cross-sectional view showing an example of a mode in which a heat sink is attached to a heat generating component. In the example of this figure, the heat generating component 42 is mounted on the circuit board 41 housed inside the case 40. The heat sink 43 is arranged in a state of being thermally connected to the heat generating component 42 via the thermal paste 44, and is fixed to the case 40 together with the circuit board 41 by screws 45. In the example of FIG. 7, a coil spring 47 is inserted through the screw 45, and the coil spring 47 is arranged between the flange portion 46 of the screw 45 and the heat sink 43. The coil spring 47 is in a compressed state when the heat sink 43 is attached to the case 40 by the screw 45, and exerts an urging force in the direction of pressing against the circuit board 41 on the heat sink 43.

Note that Patent Document 1 discloses a configuration in which a heat sink is pressed against a component to be cooled by using a leaf spring. Further, Patent Document 2 discloses a configuration in which a component to be cooled and a cooling fin or the like are integrally molded with a resin.

JP-A-10-70222 Japanese Unexamined Patent Publication No. 2014-183058

By the way, when a heat generating component and a heat sink are mounted on a device that is required to be thinned, the thinning of the device may be hindered due to a structure in which the heat sink is mounted on or pressed against the heat generating component. For example, in the case of the configuration shown in FIG. 7, the screw 45 may protrude from the heat sink 43, and the protruding portion of the protruding screw 45 hinders the thinning of the device. Further, when the heat sink is pressed against the heat-generating component by the leaf spring, the leaf spring must have a large elastic force in order to firmly press the heat sink against the heat-generating component. Therefore, the leaf spring must have a large elastic force. It becomes. Due to this large leaf spring, thinning of the device is hindered.

The present invention has been devised to solve the above problems. That is, a main object of the present invention is to provide a technique for reducing the thickness of a device provided with a cooling member for cooling heat-generating parts.

In order to achieve the above object, the cooling member of the present invention is one of the aspects.
Has a substrate that is thermally connected to the object to be cooled
The substrate is inclined in a direction toward the thermal connection surface and receives a force from the side of the substrate at a portion that becomes a side surface when the thermal connection surface that is thermally connected to the cooling target is the bottom surface. An inclined receiving surface is formed so that the force acts on the substrate as a pressing force from the substrate to the cooling target.

The cooling device of the present invention is one of the aspects.
With the cooling member of the present invention
The inclined receiving surface of the cooling member is provided with a pressing member that exerts a force from the side of the substrate.

In addition, the electronic device of the present invention has one aspect.
Heat-generating parts to be cooled and
With the cooling member of the present invention
The inclined receiving surface of the cooling member is provided with a pressing member that exerts a force from the side of the substrate.

Further, the method for forming the cooling member of the present invention is one of the aspects.
In a portion of a substrate having a heat connection surface that is thermally connected to a cooling target, which is a side surface when the heat connection surface is the bottom surface.
An inclined receiving surface that is inclined in the direction toward the thermal connection surface and receives a force from the side of the substrate and acts on the substrate as a pressing force from the substrate to the cooling target is formed.

According to the present invention, it is possible to reduce the thickness of a device provided with a cooling member for cooling a heat generating component.

It is a schematic cross-sectional view explaining the structure of the electronic device provided with the cooling member of 1st Embodiment which concerns on this invention. FIG. 5 is a schematic plan view showing an aspect of the configuration of the electronic device shown in FIG. 1 as viewed from the upper side of FIG. It is a schematic cross-sectional view explaining the structure of the cooling member of the 2nd Embodiment which concerns on this invention. It is a schematic cross-sectional view explaining one structural example of the cooling apparatus including the cooling member of 2nd Embodiment. It is a schematic cross-sectional view explaining one structural example of the electronic device provided with the cooling member of 2nd Embodiment. It is a figure explaining other embodiment which concerns on this invention. It is a schematic cross-sectional view explaining one structural example of the electronic device provided with a cooling member.

Hereinafter, embodiments according to the present invention will be described with reference to the drawings.

<First Embodiment>
FIG. 1 is a cross-sectional view schematically showing the configuration of an electronic device provided with a cooling member according to the first embodiment of the present invention. FIG. 2 is a schematic plan view of the configuration of FIG. 1 as viewed from above in FIG. The electronic device 1 of the first embodiment includes a circuit board 4 provided with a heat generating component 3, a case 5 accommodating the circuit board 4, a heat sink 7 which is a cooling member for cooling the heat generating component 3, and screws 8. ing.

In the electronic device 1, the circuit board 4 on which the heat generating component 3 is mounted is housed in the internal space of the case 5, and is fixed to the case 5 by screws 14.

The heat sink 7 has a substrate 10 and a plurality of fins 11 erected on the substrate 10. The substrate 10 has a thermal connection surface 10b that is thermally connected to the heat generating component 3 to be cooled. In this first embodiment, the thermal paste 13 is interposed between the thermal connection surface 10b of the substrate 10 and the heat generating component 3, and the heat radiation grease 13 causes heat between the thermal connection surface 10b and the heat generating component 3. The decrease in conductivity is suppressed.

The heat of the heat generating component 3 is transferred from the thermal connection surface 10b to the base 10 through the thermal paste 13, and the heat transferred to the base 10 is mainly dissipated from the fins 11 on the upper part of the base 10. In this way, the heat sink 7 dissipates heat from the heat generating component 3 and cools the heat generating component 3.

The substrate 10 of the heat sink 7 is formed with a tapered surface 10s, which is an inclined receiving surface, on a portion that becomes a side surface when the heat connecting surface 10b is used as the bottom surface. In the first embodiment, the tapered surface 10s is formed on the upper edge of the side surface of the substrate 10 over the entire circumference in the direction of orbiting the substrate 10. The tapered surface 10s is inclined in the direction toward the thermal connection surface 10b, receives a force from the side of the substrate, and acts on the substrate 10 as a pressing force from the substrate 10 to the heat generating component 3 to be cooled. It has a function to make it. The inclination angle of the tapered surface 10s is designed in consideration of the pressing force that presses the heat sink 7 (base 10) against the heat generating component 3.

That is, in the first embodiment, screw holes 16 having the form of through holes penetrating from the outside of the case to the inside of the case are formed at a plurality of places on the case wall of the case 5 facing the tapered surface 10s via a gap. Here, the shape of the base 10 of the heat sink 7 seen from the upper side in FIG. 1 is rectangular (square) as shown in FIG. Two screw holes 16 are formed in each of the case wall portions 5a, 5b, 5c, and 5d facing the four rectangular sides of the upper part of the base 10. The screw holes 16 formed in the case walls 5a and 5c facing each other are arranged at positions symmetrical with respect to the center line of the substrate 10. Similarly, the screw holes 16 formed in the case walls 5b and 5d facing each other are arranged at positions that are line-symmetric with respect to the center line of the substrate 10. Further, the screw hole 16 is formed so that its central axis is parallel to the thermal connection surface 10b of the substrate 10.

The screw 8 is fixed to the case 5 by being screwed into the screw hole 16 from the outside of the case 5. Further, the tip of the screw 8 screwed into the screw hole 16 comes into contact with the tapered surface 10s of the substrate 10, and a pressing force corresponding to the screwing amount is applied to the tapered surface 10s. That is, the screw 8 functions as a pressing member that exerts a force on the tapered surface 10s from the side of the substrate 10. The pressing force received by the tapered surface 10s from the screw 8 acts on the substrate 10 as a pressing force from the substrate 10 to the heat generating component 3. The magnitude of the pressing force from the substrate 10 to the heat generating component 3 can be adjusted by the screwing amount of the screw 8. For example, the screw 8 is tightened with a torque wrench.

Further, the relationship between the magnitude of the pressing force from the screw 8 to the tapered surface 10s and the magnitude of the pressing force from the substrate 10 to the heat generating component 3 due to the pressing force changes depending on the inclination angle of the tapered surface 10s. As a result, the inclination angle of the tapered surface 10s is designed so that the pressing force from the screw 8 to the tapered surface 10s can be efficiently applied to the substrate 10 as a pressing force against the heat generating component 3.

As described above, in the first embodiment, the screw 8 functions as a pressing member that presses the substrate 10 against the heat generating component 3. The case 5 (case wall) functions as a fixing member for fixing the screw 8 (pressing member) in addition to the function of accommodating the circuit board 4. Further, the heat sink 7 (cooling member), the screw 8 (pressing member), and the case 5 (fixing member) constitute a cooling device for cooling the heat generating component 3 to be cooled.

By providing the base 10 with a tapered surface 10s, the heat sink 7 of the first embodiment can exert a force from the side of the base 10 on the base 10 as a force for pressing the base 10 against the heat generating component 3. .. As a result, the pressing member that presses the substrate 10 against the heat generating component 3 can be arranged on the side side of the substrate 10, so that the heat sink 7 can suppress the raising of the electronic device 1 including the heat sink 7. In other words, the heat sink 7 in the first embodiment can contribute to the thinning of the electronic device 1.

Further, in the first embodiment, the pressing member that exerts a pressing force on the substrate 10 is composed of screws 8, and the pressing member has a simple configuration, which also contributes to the thinning of the electronic device 1. ..

Further, the pressing member by the screw 8 can easily adjust the magnitude of the pressing force acting on the substrate 10 by the screwing amount. As a result, the electronic device 1 of the first embodiment can press the heat sink 7 against the heat generating component 3 with an appropriate pressing force.

Further, since the tapered surface 10s is formed over the entire circumference of the upper edge portion on the side surface of the substrate 10, even if the arrangement position of the screw 8 is shifted to the lateral side from the design position, the screw 8 is a tapered surface. 10s can be pressed. Therefore, the configuration in which the tapered surface 10s is formed over the entire circumference of the upper edge portion of the side surface of the substrate 10 can reduce the trouble of adjusting the arrangement position of the screw 8 with high accuracy.

<Second Embodiment>
A second embodiment according to the present invention will be described.

FIG. 3 is a schematic cross-sectional view illustrating the cooling member of the second embodiment according to the present invention. FIG. 4 is a schematic cross-sectional view illustrating a configuration example of a cooling device including the cooling member of FIG. FIG. 5 is a schematic cross-sectional view illustrating a configuration example of an electronic device provided with the cooling member of FIG.

The cooling member 20 of the second embodiment has a substrate 21 that is thermally connected to a cooling target (for example, a heat generating component 27 in FIG. 5). The substrate 21 has a thermal connection surface 21b that is thermally connected to the object to be cooled. Further, the substrate 21 has an inclined receiving surface 21k at a portion that becomes a side surface when the heat connecting surface 21b is the bottom surface. The inclined receiving surface 21k is inclined in the direction toward the thermal connection surface 21b, and receives a force from the side of the substrate 21 so that the force acts on the substrate 21 as a pressing force from the substrate 21 to the cooling target. It is formed.

As shown in FIG. 4, the cooling member 20 having such a structure constitutes the cooling device 23 together with the pressing member 24. The pressing member 24 has a configuration in which a force F from the side of the base 21 is applied to the inclined receiving surface 21k of the base 21 in the cooling member 20.

Further, as shown in FIG. 5, the cooling member 20 constitutes the electronic device 26 together with the pressing member 24 and the heat generating component 27. The heat generating component 27 is a cooling target to be cooled by the cooling member 20.

By providing the inclined receiving surface 21k, the cooling member 20 of the second embodiment has a configuration in which the pressing member 24 does not have to be arranged in the raising direction of the electronic device 26 provided with the cooling member 20. The bulkiness of the electronic device 26 caused by the member can be suppressed. That is, the cooling member 20 of the second embodiment can reduce the thickness of the electronic device 26.

<Other Embodiments>
The present invention is not limited to the first and second embodiments, and various embodiments can be adopted. For example, in the first embodiment, the tapered surface 10s is formed over the entire circumference of the upper edge portion on the side surface of the substrate 10. Instead, as shown in the plan view of FIG. 6, a tapered surface 10s as an inclined receiving surface may be partially formed on the upper edge portion on the side surface of the substrate 10.

Further, in the first embodiment, the heat radiating grease 13 is interposed between the base 10 of the heat sink 7 and the heat generating component 3, but even if a heat radiating sheet is provided instead of the heat radiating grease 13. Good. Furthermore, the substrate 10 and the heat generating component 3 may be in direct contact with each other. Further, in the first embodiment, the substrate 10 has a rectangular shape when viewed from above, but the shape of the substrate 10 is not particularly limited.

Further, in the first embodiment, the pressing member is configured to have a screw 8. Instead of this, the pressing member may have a configuration other than the screw and may have a configuration in which the pressing force is applied to the tapered surface (inclined receiving surface) 10s. Further, the number and arrangement positions of the points of action on which the pressing member (screw 8) exerts pressing force on the substrate 10 are appropriately set in consideration of the pressing force from the substrate 10 to the heat generating component 3.

Further, in the first embodiment or the like, the tapered surface 10s, which is the inclined receiving surface, is formed on the upper edge portion of the side surface of the substrate 10. Instead of this, for example, when the substrate 10 is thick, a recess may be provided on the side surface of the substrate 10 and an inclined surface functioning as an inclined receiving surface may be formed on the inner wall surface of the recess.

1,26 Electronic equipment 3,27 Heat-generating parts 5 Case 7 Heat sink 8 Screws 10, 21 Base 16 Screw holes 20 Cooling member 23 Cooling device 24 Pressing member

Claims (9)

It has a substantially flat substrate that is thermally connected to the object to be cooled.
The substrate is inclined in a direction toward the thermal connection surface and receives a force from the side of the substrate at a portion that becomes a side surface when the thermal connection surface that is thermally connected to the cooling target is the bottom surface. A cooling member having an inclined receiving surface that acts on the substrate as a pressing force from the substrate to the cooling target. The cooling member according to claim 1, wherein the inclined receiving surface is formed on the upper edge of the side surface in a direction that orbits the side surface of the substrate. The cooling member according to claim 1 or 2.
A cooling device including a pressing member that exerts a force from the side of the substrate on an inclined receiving surface of the cooling member. A fixing member for fixing the pressing member is further provided.
The pressing member is fixed to the fixing member by being screwed into a screw hole formed in the fixing member, and is displaced with respect to the inclined receiving surface in the advancing / retreating direction and acts on the inclined receiving surface. The cooling device according to claim 3, wherein the screw has a variable magnitude of pressure. Heat-generating parts to be cooled and
The cooling member according to claim 1 or 2.
An electronic device including an inclined receiving surface of the cooling member with a pressing member that exerts a force from the side of the substrate. Further provided with a case for accommodating the heat generating parts,
The case wall of the case facing the inclined receiving surface of the cooling member functions as a fixing member for fixing the pressing member.
The pressing member is fixed to the case wall by screwing into a screw hole formed in the case wall as the fixing member, and is displaced in the advancing / retreating direction with respect to the inclined receiving surface. The electronic device according to claim 5, wherein the electronic device is composed of a screw whose size of pressing force acting on the device can be changed. A portion of a substantially flat substrate having a heat connection surface that is thermally connected to the object to be cooled, which is a side surface when the heat connection surface is the bottom surface.
A cooling member that forms an inclined receiving surface that is inclined in a direction toward the heat connection surface and receives a force from the side of the substrate and acts on the substrate as a pressing force from the substrate to the cooling target. Forming method.
Has a substrate that is thermally connected to the object to be cooled
The substrate is inclined in a direction toward the thermal connection surface and receives a force from the side of the substrate at a portion that becomes a side surface when the thermal connection surface that is thermally connected to the cooling target is the bottom surface. A cooling member having an inclined receiving surface formed which causes the force to act on the substrate as a pressing force from the substrate to the cooling target.
The inclined receiving surface is a cooling member formed on the upper edge of the side surface over the entire circumference in a direction that orbits the side surface of the substrate. Heat-generating parts to be cooled and
It has a substrate that is thermally connected to the cooling target and has
The substrate is inclined in a direction toward the thermal connection surface and receives a force from the side of the substrate at a portion that becomes a side surface when the thermal connection surface that is thermally connected to the cooling target is the bottom surface. A cooling member having an inclined receiving surface formed to act on the substrate as a pressing force from the substrate to the cooling target.
A pressing member that exerts a force from the side of the substrate on the inclined receiving surface of the cooling member,
A case for accommodating the heat generating parts is provided.
The case wall of the case facing the inclined receiving surface of the cooling member functions as a fixing member for fixing the pressing member.
The pressing member is fixed to the case wall by screwing into a screw hole formed in the case wall as the fixing member, and is displaced in the advancing / retreating direction with respect to the inclined receiving surface. An electronic device composed of screws that can change the magnitude of the pressing force that acts on.

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