JP6768518B2 - 硬化性オルガノポリシロキサン組成物、その硬化物、および硬化皮膜の形成方法 - Google Patents
硬化性オルガノポリシロキサン組成物、その硬化物、および硬化皮膜の形成方法 Download PDFInfo
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- JP6768518B2 JP6768518B2 JP2016564670A JP2016564670A JP6768518B2 JP 6768518 B2 JP6768518 B2 JP 6768518B2 JP 2016564670 A JP2016564670 A JP 2016564670A JP 2016564670 A JP2016564670 A JP 2016564670A JP 6768518 B2 JP6768518 B2 JP 6768518B2
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- curable organopolysiloxane
- organopolysiloxane composition
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- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000002649 leather substitute Substances 0.000 description 1
- AUHZEENZYGFFBQ-UHFFFAOYSA-N mesitylene Substances CC1=CC(C)=CC(C)=C1 AUHZEENZYGFFBQ-UHFFFAOYSA-N 0.000 description 1
- 125000001827 mesitylenyl group Chemical group [H]C1=C(C(*)=C(C([H])=C1C([H])([H])[H])C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 1
- 229940043265 methyl isobutyl ketone Drugs 0.000 description 1
- VMGSQCIDWAUGLQ-UHFFFAOYSA-N n',n'-bis[2-(dimethylamino)ethyl]-n,n-dimethylethane-1,2-diamine Chemical compound CN(C)CCN(CCN(C)C)CCN(C)C VMGSQCIDWAUGLQ-UHFFFAOYSA-N 0.000 description 1
- CIXSDMKDSYXUMJ-UHFFFAOYSA-N n,n-diethylcyclohexanamine Chemical compound CCN(CC)C1CCCCC1 CIXSDMKDSYXUMJ-UHFFFAOYSA-N 0.000 description 1
- DIAIBWNEUYXDNL-UHFFFAOYSA-N n,n-dihexylhexan-1-amine Chemical compound CCCCCCN(CCCCCC)CCCCCC DIAIBWNEUYXDNL-UHFFFAOYSA-N 0.000 description 1
- XTAZYLNFDRKIHJ-UHFFFAOYSA-N n,n-dioctyloctan-1-amine Chemical compound CCCCCCCCN(CCCCCCCC)CCCCCCCC XTAZYLNFDRKIHJ-UHFFFAOYSA-N 0.000 description 1
- YKYONYBAUNKHLG-UHFFFAOYSA-N n-Propyl acetate Natural products CCCOC(C)=O YKYONYBAUNKHLG-UHFFFAOYSA-N 0.000 description 1
- 125000006606 n-butoxy group Chemical group 0.000 description 1
- 125000003506 n-propoxy group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])O* 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 125000005187 nonenyl group Chemical group C(=CCCCCCCC)* 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- HMMGMWAXVFQUOA-UHFFFAOYSA-N octamethylcyclotetrasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 HMMGMWAXVFQUOA-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000011087 paperboard Substances 0.000 description 1
- 125000002255 pentenyl group Chemical group C(=CCCC)* 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 230000010412 perfusion Effects 0.000 description 1
- DLRJIFUOBPOJNS-UHFFFAOYSA-N phenetole Chemical compound CCOC1=CC=CC=C1 DLRJIFUOBPOJNS-UHFFFAOYSA-N 0.000 description 1
- 239000005054 phenyltrichlorosilane Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- NCNISYUOWMIOPI-UHFFFAOYSA-N propane-1,1-dithiol Chemical compound CCC(S)S NCNISYUOWMIOPI-UHFFFAOYSA-N 0.000 description 1
- 229940090181 propyl acetate Drugs 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- SBYHFKPVCBCYGV-UHFFFAOYSA-N quinuclidine Chemical compound C1CC2CCN1CC2 SBYHFKPVCBCYGV-UHFFFAOYSA-N 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 125000005920 sec-butoxy group Chemical group 0.000 description 1
- 125000005372 silanol group Chemical group 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000005846 sugar alcohols Chemical class 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 125000004213 tert-butoxy group Chemical group [H]C([H])([H])C(O*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- ORVMIVQULIKXCP-UHFFFAOYSA-N trichloro(phenyl)silane Chemical compound Cl[Si](Cl)(Cl)C1=CC=CC=C1 ORVMIVQULIKXCP-UHFFFAOYSA-N 0.000 description 1
- WLPUWLXVBWGYMZ-UHFFFAOYSA-N tricyclohexylphosphine Chemical compound C1CCCCC1P(C1CCCCC1)C1CCCCC1 WLPUWLXVBWGYMZ-UHFFFAOYSA-N 0.000 description 1
- UMFJXASDGBJDEB-UHFFFAOYSA-N triethoxy(prop-2-enyl)silane Chemical compound CCO[Si](CC=C)(OCC)OCC UMFJXASDGBJDEB-UHFFFAOYSA-N 0.000 description 1
- RXJKFRMDXUJTEX-UHFFFAOYSA-N triethylphosphine Chemical compound CCP(CC)CC RXJKFRMDXUJTEX-UHFFFAOYSA-N 0.000 description 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 description 1
- FPZZZGJWXOHLDJ-UHFFFAOYSA-N trihexylphosphane Chemical compound CCCCCCP(CCCCCC)CCCCCC FPZZZGJWXOHLDJ-UHFFFAOYSA-N 0.000 description 1
- LFRDHGNFBLIJIY-UHFFFAOYSA-N trimethoxy(prop-2-enyl)silane Chemical compound CO[Si](OC)(OC)CC=C LFRDHGNFBLIJIY-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- RMZAYIKUYWXQPB-UHFFFAOYSA-N trioctylphosphane Chemical compound CCCCCCCCP(CCCCCCCC)CCCCCCCC RMZAYIKUYWXQPB-UHFFFAOYSA-N 0.000 description 1
- ODHXBMXNKOYIBV-UHFFFAOYSA-N triphenylamine Chemical compound C1=CC=CC=C1N(C=1C=CC=CC=1)C1=CC=CC=C1 ODHXBMXNKOYIBV-UHFFFAOYSA-N 0.000 description 1
- YFTHZRPMJXBUME-UHFFFAOYSA-N tripropylamine Chemical compound CCCN(CCC)CCC YFTHZRPMJXBUME-UHFFFAOYSA-N 0.000 description 1
- KCTAHLRCZMOTKM-UHFFFAOYSA-N tripropylphosphane Chemical compound CCCP(CCC)CCC KCTAHLRCZMOTKM-UHFFFAOYSA-N 0.000 description 1
- UYUUAUOYLFIRJG-UHFFFAOYSA-N tris(4-methoxyphenyl)phosphane Chemical compound C1=CC(OC)=CC=C1P(C=1C=CC(OC)=CC=1)C1=CC=C(OC)C=C1 UYUUAUOYLFIRJG-UHFFFAOYSA-N 0.000 description 1
- 125000005065 undecenyl group Chemical group C(=CCCCCCCCCC)* 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/66—Mercaptans
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
- C09D183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
- C08G77/28—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen sulfur-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
- C09D183/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Silicon Polymers (AREA)
- Paints Or Removers (AREA)
- Epoxy Resins (AREA)
Description
(A)平均組成式:
XaR1 bSiO(4−a−b)/2
(式中、Xはグリシドキシアルキル基、エポキシシクロアルキルアルキル基、およびエポキシアルキル基からなる群より選択される少なくとも1種のエポキシ基であり、R1は水素原子、炭素数1〜12のアルキル基、炭素数2〜12のアルケニル基、炭素数6〜20のアリール基、炭素数7〜20のアラルキル基、水酸基、または炭素数1〜6のアルコキシ基であり、但し、一分子中、少なくとも2個のXを有し、aおよびbは、0<a<1、0<b<3、0.8<a+b<3を満たす数である。)
で表されるエポキシ基含有オルガノポリシロキサン、
(B)一分子中に少なくとも2個のメルカプト基を有する化合物{(A)成分中のエポキシ基1モルに対して、(B)成分中のメルカプト基が0.3〜3モルとなる量}、および
(C)N−H結合を有さないアミン化合物および/またはP−H結合を有さないホスフィン化合物{(A)成分〜(C)成分の合計量に対して、0.01〜10質量%となる量}
から少なくともなることを特徴とする。
XaR1 bSiO(4−a−b)/2
で表される。
(Me3SiO1/2)x1(Me2SiO2/2)x2(MeEpSiO2/2)x3(PhSiO3/2)x4
(Me2ViSiO1/2)x1(Me2SiO2/2)x2(MeEpSiO2/2)x3(PhSiO3/2)x4
(Me3SiO1/2)x1(Me2SiO2/2)x2(MeEpSiO2/2)x3(MeSiO3/2)x4
(Me3SiO1/2)x1(MeEpSiO2/2)x2(PhSiO3/2)x3
(Me3SiO1/2)x1(MeEpSiO2/2)x2(MeSiO3/2)x3(PhSiO3/2)x4
(Me3SiO1/2)x1(Me2SiO2/2)x2(MeEpSiO2/2)x3
(Me3SiO1/2)x1(Me2SiO2/2)x2(MePhSiO2/2)x3(MeEpSiO2/2)x4
(Me3SiO1/2)x1(MePhSiO2/2)x2(MeEpSiO2/2)x3
(Me3SiO1/2)x1(Ph2SiO2/2)x2(MeEpSiO2/2)x3
(Me2SiO2/2)x1(MeEpSiO2/2)x2(PhSiO3/2)x3
(MeEpSiO2/2)x1(PhSiO3/2)x2
(Me2SiO2/2)x1(EpSiO3/2)x2
(Me3SiO1/2)x1(Me2SiO2/2)x2(EpSiO3/2)x3(MeSiO3/2)x4
(Me3SiO1/2)x1(Me2SiO2/2)x2(EpSiO3/2)x3(PhSiO3/2)x4
(Me3SiO1/2)x1(EpSiO3/2)x2(MeSiO3/2)x3
(Me3SiO1/2)x1(EpSiO3/2)x2(PhSiO3/2)x3
(Me2ViSiO1/2)x1(EpSiO3/2)x2(PhSiO3/2)x3
(Me3SiO1/2)x1(EpSiO3/2)x2
(Me2ViSiO1/2)x1(EpSiO3/2)x2
(Me3SiO1/2)x1(Me2SiO2/2)x2(MeEpSiO2/2)x3(SiO4/2)x4
(Me3SiO1/2)x1(MeEpSiO2/2)x2(SiO4/2)x3
(Me3SiO1/2)x1(Me2SiO2/2)x2(EpSiO3/2)x3(SiO4/2)x4
(Me3SiO1/2)x1(Me2SiO2/2)x2(MeEp’SiO2/2)x3(PhSiO3/2)x4
(Me2ViSiO1/2)x1(Me2SiO2/2)x2(MeEp’SiO2/2)x3(PhSiO3/2)x4
(Me3SiO1/2)x1(Me2SiO2/2)x2(MeEp’SiO2/2)x3(MeSiO3/2)x4
(Me3SiO1/2)x1(MeEp’SiO2/2)x2(PhSiO3/2)x3
(Me3SiO1/2)x1(MeEp’SiO2/2)x2(MeSiO3/2)x3(PhSiO3/2)x4
(Me3SiO1/2)x1(Me2SiO2/2)x2(MeEp’SiO2/2)x3
(Me3SiO1/2)x1(Me2SiO2/2)x2(MePhSiO2/2)x3(MeEp’SiO2/2)x4
(Me3SiO1/2)x1(MePhSiO2/2)x2(MeEp’SiO2/2)x3
(Me3SiO1/2)x1(Ph2SiO2/2)x2(MeEp’SiO2/2)x3
(Me2SiO2/2)x1(MeEp’SiO2/2)x2(PhSiO3/2)x3
(MeEp’SiO2/2)x1(PhSiO3/2)x2
(Me2SiO2/2)x1(Ep’SiO3/2)x2
(Me3SiO1/2)x1(Me2SiO2/2)x2(Ep’SiO3/2)x3(MeSiO3/2)x4
(Me3SiO1/2)x1(Me2SiO2/2)x2(Ep’SiO3/2)x3(PhSiO3/2)x4
(Me3SiO1/2)x1(Ep’SiO3/2)x2(MeSiO3/2)x3
(Me3SiO1/2)x1(Ep’SiO3/2)x2(PhSiO3/2)x3
(Me2ViSiO1/2)x1(Ep’SiO3/2)x2(PhSiO3/2)x3
(Me3SiO1/2)x1(Ep’SiO3/2)x2
(Me2ViSiO1/2)x1(Ep’SiO3/2)x2
(Me3SiO1/2)x1(Me2SiO2/2)x2(MeEp’SiO2/2)x3(SiO4/2)x4
(Me3SiO1/2)x1(MeEp’SiO2/2)x2(SiO4/2)x3
(Me3SiO1/2)x1(Me2SiO2/2)x2(Ep’SiO3/2)x3(SiO4/2)x4
YcR2 dSiO(4−c−d)/2
で表されるメルカプト基含有オルガノポリシロキサンおよび/または(B2)一分子中に少なくとも2個のメルカプト基を有するチオール化合物である。
(Me3SiO1/2)y1(Me2SiO2/2)y2(MeThiSiO2/2)y3(PhSiO3/2)y4
(Me2ViSiO1/2)y1(Me2SiO2/2)y2(MeThiSiO2/2)y3(PhSiO3/2)y4
(Me3SiO1/2)y1(Me2SiO2/2)y2(MeThiSiO2/2)y3(MeSiO3/2)y4
(Me3SiO1/2)y1(MeThiSiO2/2)y2(PhSiO3/2)y3
(Me3SiO1/2)y1(MeThiSiO2/2)y2(MeSiO3/2)y3(PhSiO3/2)y4
(Me3SiO1/2)y1(Me2SiO2/2)y2(MeThiSiO2/2)y3
(Me3SiO1/2)y1(Me2SiO2/2)y2(MePhSiO2/2)y3(MeThiSiO2/2)y4
(Me3SiO1/2)y1(MePhSiO2/2)y2(MeThiSiO2/2)y3
(Me3SiO1/2)y1(Ph2SiO2/2)y2(MeThiSiO2/2)y3
(Me2SiO2/2)y1(MeThiSiO2/2)y2(PhSiO3/2)y3
(Me2SiO2/2)y1(ThiSiO3/2)y2
(Me3SiO1/2)y1(Me2SiO2/2)y2(ThiSiO3/2)y3(MeSiO3/2)y4
(Me3SiO1/2)y1(Me2SiO2/2)y2(ThiSiO3/2)y3(PhSiO3/2)y4
(Me3SiO1/2)y1(ThiSiO3/2)y2(MeSiO3/2)y3
(Me3SiO1/2)y1(ThiSiO3/2)y2(PhSiO3/2)y3
(Me2ViSiO1/2)y1(ThiSiO3/2)y2(PhSiO3/2)y3
(Me3SiO1/2)y1(ThiSiO3/2)y2
(Me2ViSiO1/2)y1(ThiSiO3/2)y2
(Me3SiO1/2)y1(Me2SiO2/2)y2(MeThiSiO2/2)y3(SiO4/2)y4
(Me3SiO1/2)y1(MeThiSiO2/2)y2(SiO4/2)y3
(Me3SiO1/2)y1(Me2SiO2/2)y2(ThiSiO3/2)y3(SiO4/2)y4
芝浦システム株式会社製回転粘度計VG-DAを使用して、25℃における粘度を測定した。
RI検出器を用いたゲルパーミエーションクロマトグラフィーにより、標準ポリスチレン換算の重量平均分子量を求めた。
核磁気共鳴スペクトル分析により同定した構造から、オルガノポリシロキサンのエポキシ当量(g/mol)、またはメルカプト当量(g/mol)を求めた。
エポキシ基含有オルガノポリシロキサンの調製
撹拌装置、温度計、還流管、滴下漏斗を取り付けた反応器に、フェニルトリクロロシランの加水分解縮合物(重量平均分子量:1,000、シラノール基含有量:8.0重量%) 341g、3−グリシドキシプロピルメチルジメトキシシラン 528g、25℃における動粘度が5mm2/sの分子鎖両末端トリメチルシロキシ基封鎖ジメチルポリシロキサン 517g、およびトルエン 183gを仕込み、50℃まで加熱攪拌した。その後、水酸化セシウム 2.5gと水 43.2gの混合物を滴下漏斗から徐々に加えた。滴下終了後、加熱し、1時間還流した。生成したメタノールと過剰の水を共沸脱水により除去し、さらにトルエン還流下で8時間反応させた。冷却後、酢酸で中和し、トルエン、低沸分を減圧下で加熱留去した後、中和塩をろ過し、粘度270mPa・sの黄褐色透明な液体を得た。この液体は、重量平均分子量=4,100、エポキシ当量=530g/molであり、13C−核磁気共鳴スペクトル分析により、平均単位式:
(Me3SiO1/2)0.12(Me2SiO2/2)0.45(EpMeSiO2/2)0.21(PhSiO3/2)0.22
で表され、平均組成式:
Ep0.21Me1.47Ph0.22SiO1.05
で表されるエポキシ基含有オルガノポリシロキサンであることが確認された。水酸基又はメトキシ基等のアルコキシ基の含有量は1重量%未満であった。
メルカプト基含有オルガノポリシロキサンの調製
撹拌装置、温度計、還流管、滴下漏斗を取り付けた反応器に、3−メルカプトプロピルトリメトキシシラン 1,374g、ジメチルジメトキシシラン 1,680g、およびトリフルオロメタンスルホン酸 1.18gを仕込み攪拌した後、イオン交換水 882gを室温で滴下した。メタノール還流下で1時間攪拌した後、炭酸カルシウム、シクロヘキサンを加え、生成したメタノールおよび未反応の水を共沸脱水によりを除去した。残った低沸分を減圧下で留去したた後、固形分をろ過し、粘度560mPa・sの無色透明な液体を得た。この液体は、重量平均分子量=4,000、メルカプト当量=260g/molであり、13C−核磁気共鳴スペクトル分析により、平均単位式:
(Me2SiO2/2)0.65(ThiSiO3/2)0.35
で表され、平均組成式:
Thi0.35Me1.30SiO1.18
で表されるメルカプト基含有オルガノポリシロキサンであることが確認された。
下記の成分を用いて、表1、2に示す組成で無溶剤型の硬化性オルガノポリシロキサン組成物を調製した。
(a−1):合成例1で調製したエポキシ基含有オルガノポリシロキサン
(b−1):合成例2で調製したメルカプト基含有オルガノポリシロキサン
(b−2):ペンタエリスリトール−テトラキス(3−メルカプトブチレート)(昭和電工株式会社製のカレンズMTRPE1)
(c−1):2,4,6−トリス(ジメチルアミノメチル)フェノール
(c−2):2,6−ジメチル−2,6−ジアザヘプタン
(c−3):1,8−ジアザビシクロ[5,4,0]ウンデセン
(c−4):1,4−ジアザビシクロ[2,2,2]オクタン
(c−5):1−(2−ジメチルアミノエチル)−4−メチルピペラジン
(c−6):2,6,10−トリメチル−2,6,10−トリアザウンデカン
(e−1):東レ・ダウコーニング株式会社製3055レジン(粘度3,000mPa・s、アミノ当量=500g/mol)
硬化性オルガノポリシロキサン組成物を調製後、その外観を目視により観察した。
硬化性オルガノポリシロキサン組成物をガラス瓶内またはアルミ皿上で25℃に保持し、流動性を失うか、または組成物が指に付かなくなるまでの時間(ゲル化時間)を求め、次のように硬化性を評価した。
☆☆☆:25℃でのゲル化時間が6時間以内
☆☆:25℃でのゲル化時間が6時間を超え、12時間以内
☆:25℃でのゲル化時間が12時間を超え、24時間以内
△:25℃でのゲル化時間が24時間を超え、48時間以内
×:25℃、48時間でも未硬化
25℃で24時間以内に硬化した組成物について、−2℃における硬化性を次のようにして評価した。
☆☆☆:−2℃でのゲル化時間が6時間以内
☆☆:−2℃でのゲル化時間が6時間を超え、12時間以内
☆:−2℃でのゲル化時間が12時間を超え、24時間以内
△:−2℃でのゲル化時間が24時間を超え、48時間以内
×:−2℃、48時間でも未硬化
上記の成分および下記の成分を用いて、表3に示す組成で溶剤型の硬化性オルガノポリシロキサン組成物を調製した。なお、硬化性オルガノポリシロキサン組成物において、(A)成分中のエポキシ基1モルに対する、(B)成分中のメルカプト基は1モルとなる量に調整した。
(d−1):酢酸エチル(和光純薬工業株式会社製)
硬化性オルガノポリシロキサン組成物の硬化性を上記と同様に評価した。
硬化性オルガノポリシロキサン組成物をガラス板に流し塗りで塗布し、室温で1日乾燥・硬化させた後、さらに70℃で2時間乾燥・硬化した。ガラス板上の硬化皮膜の密着性を碁盤目試験(JIS K5400)により評価した。評価の結果、硬化皮膜の剥がれがない場合を“○”、硬化皮膜の剥がれがある場合を“×”で示した。
Claims (6)
- (A)平均組成式:
XaR1 bSiO(4−a−b)/2
(式中、Xはグリシドキシアルキル基、エポキシシクロアルキルアルキル基、およびエポキシアルキル基からなる群より選択される少なくとも1種のエポキシ基であり、R1は水素原子、炭素数1〜12のアルキル基、炭素数2〜12のアルケニル基、炭素数6〜20のアリール基、炭素数7〜20のアラルキル基、水酸基、または炭素数1〜6のアルコキシ基であり、但し、一分子中、アリール基および少なくとも2個のXを有し、aおよびbは、0<a<1、0<b<3、1<a+b≦2.0を満たす数である。)
で表されるエポキシ基含有オルガノポリシロキサン、
(B)一分子中に少なくとも2個のメルカプト基を有するチオール化合物{(A)成分中のエポキシ基1モルに対して、(B)成分中のメルカプト基が0.3〜3モルとなる量}、および
(C)N−H結合を有さないアミン化合物{(A)成分〜(C)成分の合計量に対して、0.01〜10質量%となる量}
から少なくともなる硬化性オルガノポリシロキサン組成物。 - (C)成分中のアミン化合物が三級アミン化合物である、請求項1に記載の硬化性オルガノポリシロキサン組成物。
- さらに、(D)有機溶剤を、(A)成分〜(C)の合計100質量部に対して0〜3,000質量部を含有する、請求項1または2に記載の硬化性オルガノポリシロキサン組成物。
- コーティング組成物である、請求項1乃至3のいずれか1項に記載の硬化性オルガノポリシロキサン組成物。
- 請求項1乃至3のいずれか1項に記載の硬化性オルガノポリシロキサン組成物を硬化させてなる硬化物。
- 被塗物に請求項4に記載の硬化性オルガノポリシロキサン組成物を塗布し、−5〜30℃で硬化させることを特徴とする、硬化皮膜の形成方法。
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