JP6758070B2 - 遮光膜用感光性樹脂組成物、これを硬化させた遮光膜を備えたディスプレイ用基板、及びディスプレイ用基板の製造方法 - Google Patents
遮光膜用感光性樹脂組成物、これを硬化させた遮光膜を備えたディスプレイ用基板、及びディスプレイ用基板の製造方法 Download PDFInfo
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- JP6758070B2 JP6758070B2 JP2016072918A JP2016072918A JP6758070B2 JP 6758070 B2 JP6758070 B2 JP 6758070B2 JP 2016072918 A JP2016072918 A JP 2016072918A JP 2016072918 A JP2016072918 A JP 2016072918A JP 6758070 B2 JP6758070 B2 JP 6758070B2
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- 125000005843 halogen group Chemical group 0.000 claims description 4
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- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
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- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
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- 125000003118 aryl group Chemical group 0.000 description 3
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- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
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- 230000009477 glass transition Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- JNWGOCSTXJQFEP-UHFFFAOYSA-N hexane-1,1,1,2-tetracarboxylic acid Chemical compound CCCCC(C(O)=O)C(C(O)=O)(C(O)=O)C(O)=O JNWGOCSTXJQFEP-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 125000002883 imidazolyl group Chemical group 0.000 description 1
- 125000001841 imino group Chemical group [H]N=* 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- KQNPFQTWMSNSAP-UHFFFAOYSA-M isobutyrate Chemical compound CC(C)C([O-])=O KQNPFQTWMSNSAP-UHFFFAOYSA-M 0.000 description 1
- 150000003951 lactams Chemical class 0.000 description 1
- XGZVUEUWXADBQD-UHFFFAOYSA-L lithium carbonate Chemical compound [Li+].[Li+].[O-]C([O-])=O XGZVUEUWXADBQD-UHFFFAOYSA-L 0.000 description 1
- 229910052808 lithium carbonate Inorganic materials 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- CKJNUZNMWOVDFN-UHFFFAOYSA-N methanone Chemical compound O=[CH-] CKJNUZNMWOVDFN-UHFFFAOYSA-N 0.000 description 1
- GEJHIUFJTCYNSC-UHFFFAOYSA-N methyl 1-[(1-methoxycarbonylcyclohexyl)diazenyl]cyclohexane-1-carboxylate Chemical compound C1CCCCC1(C(=O)OC)N=NC1(C(=O)OC)CCCCC1 GEJHIUFJTCYNSC-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- QYZFTMMPKCOTAN-UHFFFAOYSA-N n-[2-(2-hydroxyethylamino)ethyl]-2-[[1-[2-(2-hydroxyethylamino)ethylamino]-2-methyl-1-oxopropan-2-yl]diazenyl]-2-methylpropanamide Chemical compound OCCNCCNC(=O)C(C)(C)N=NC(C)(C)C(=O)NCCNCCO QYZFTMMPKCOTAN-UHFFFAOYSA-N 0.000 description 1
- GKTNLYAAZKKMTQ-UHFFFAOYSA-N n-[bis(dimethylamino)phosphinimyl]-n-methylmethanamine Chemical compound CN(C)P(=N)(N(C)C)N(C)C GKTNLYAAZKKMTQ-UHFFFAOYSA-N 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 238000006384 oligomerization reaction Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- MIVZUXGHPJSKRI-UHFFFAOYSA-N pentane-1,1,1,2-tetracarboxylic acid Chemical compound CCCC(C(O)=O)C(C(O)=O)(C(O)=O)C(O)=O MIVZUXGHPJSKRI-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 1
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 description 1
- 239000002530 phenolic antioxidant Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 125000004076 pyridyl group Chemical group 0.000 description 1
- 125000000168 pyrrolyl group Chemical group 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- QJVXKWHHAMZTBY-GCPOEHJPSA-N syringin Chemical compound COC1=CC(\C=C\CO)=CC(OC)=C1O[C@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](CO)O1 QJVXKWHHAMZTBY-GCPOEHJPSA-N 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 125000001302 tertiary amino group Chemical group 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- CBXCPBUEXACCNR-UHFFFAOYSA-N tetraethylammonium Chemical compound CC[N+](CC)(CC)CC CBXCPBUEXACCNR-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- FRGPKMWIYVTFIQ-UHFFFAOYSA-N triethoxy(3-isocyanatopropyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCN=C=O FRGPKMWIYVTFIQ-UHFFFAOYSA-N 0.000 description 1
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Optics & Photonics (AREA)
- Materials For Photolithography (AREA)
- Optical Filters (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Liquid Crystal (AREA)
- Electroluminescent Light Sources (AREA)
Description
すなわち、本発明の要旨は次のとおりである。
前記遮光膜が、下記(A)〜(E)成分、
(A)エポキシ(メタ)アクリレート酸付加物の構造を有する重合性不飽和基含有アルカリ可溶性樹脂、
(B)少なくとも3個のエチレン性不飽和結合を有する光重合性モノマー、
(C)オキシムエステル系重合開始剤、
(D)アゾ系重合開始剤、
及び
(E)黒色有機顔料、混色有機顔料、及び遮光材からなる群から選ばれた1種以上の遮光成分、
を必須成分として含有する遮光膜用感光性樹脂組成物を硬化させたものであることを特徴とするディスプレイ用基板。
(2) 耐熱温度が160℃以下の基板上に遮光膜を備えたディスプレイ用基板の製造方法であって、
下記(A)〜(E)成分、
(A)エポキシ(メタ)アクリレート酸付加物の構造を有する重合性不飽和基含有アルカリ可溶性樹脂、
(B)少なくとも3個のエチレン性不飽和結合を有する光重合性モノマー、
(C)オキシムエステル系重合開始剤、
(D)アゾ系重合開始剤、
及び
(E)黒色有機顔料、混色有機顔料、及び遮光材からなる群から選ばれた1種以上の遮光成分、
を必須成分として含有する遮光膜用感光性樹脂組成物を基板上に塗布し、フォトマスクを介して露光して、現像により未露光部を除去し、次いで、160℃以下で加熱して所定のパターンを備えた遮光膜を形成することを特徴とするディスプレイ用基板の製造方法。
(3) 下記(A)〜(E)成分、
(A)エポキシ(メタ)アクリレート酸付加物の構造を有する重合性不飽和基含有アルカリ可溶性樹脂、
(B)少なくとも3個のエチレン性不飽和結合を有する光重合性モノマー、
(C)オキシムエステル系重合開始剤、
(D)アゾ系重合開始剤である1,1’−アゾビス(1−アセトキシ−1−フェニルエタン)、
及び
(E)黒色有機顔料、混色有機顔料、及び遮光材からなる群から選ばれた1種以上の遮光成分、
を必須成分として含むことを特徴とする遮光膜用感光性樹脂組成物。
(4) 前記(A)成分の重合性不飽和基含有アルカリ可溶性樹脂は、下記一般式(II)で表される(3)に記載の遮光膜用感光性樹脂組成物。
(式中、R1、R2、R3及びR4は、それぞれ独立して水素原子、炭素数1〜5のアルキル基、ハロゲン原子又はフェニル基を表し、R5は、水素原子又はメチル基を表し、Aは、−CO−、−SO2−、−C(CF3)2−、−Si(CH3)2−、−CH2−、−C(CH3)2−、−O−、フルオレン−9,9−ジイル基又は直結合を表し、Xは4価のカルボン酸残基を表し、Y1及びY2は、それぞれ独立して水素原子又は−OC−Z−(COOH)m(但し、Zは2価又は3価カルボン酸残基を表し、mは1又は2の数を表す)を表し、nは1〜20の整数を表す。)
(5) 前記(A)成分と(B)成分との質量割合(A)/(B)が50/50〜90/10であり、前記(A)成分と(B)成分の合計100質量部に対して、(C)成分が2〜30質量部であると共に(D)成分が1〜20質量部であり、遮光膜用感光性樹脂組成物の光硬化により固形分となる成分を含めた固形分中に(E)成分が40〜70質量%含まれる(3)又は(4)に記載の遮光膜用感光性樹脂組成物。
(6) (E)成分がカーボンブラックである(3)〜(5)のいずれかに記載の遮光膜用感光性樹脂組成物。
本発明の遮光膜用感光性樹脂組成物の各成分についてまず説明する。
但し、一般式(I)において、R1、R2、R3及びR4は、独立に水素原子、炭素数1〜5のアルキル基、ハロゲン原子又はフェニル基を示し、Aは、‐CO‐、−SO2−、‐C(CF3)2−、-Si(CH3)2‐、-CH2‐、-C(CH3)2‐、-O-、フルオレン-9,9-ジイル基又は直結合を示し、lは0〜10の平均値である。
(式中、R 1 、R 2 、R 3 及びR 4 は、それぞれ独立して水素原子、炭素数1〜5のアルキル基、ハロゲン原子又はフェニル基を表し、R 5 は、水素原子又はメチル基を表し、Aは、−CO−、−SO 2 −、−C(CF 3 ) 2 −、−Si(CH 3 ) 2 −、−CH 2 −、−C(CH 3 ) 2 −、−O−、フルオレン−9,9−ジイル基又は直結合を表し、Xは4価のカルボン酸残基を表し、Y 1 及びY 2 は、それぞれ独立して水素原子又は−OC−Z−(COOH) m (但し、Zは2価又は3価カルボン酸残基を表し、mは1又は2の数を表す)を表し、nは1〜20の整数を表す。)
合成例中で得られた樹脂溶液1gをガラスフィルター〔重量:W0(g)〕に含浸させて秤量し〔W1(g)〕、160℃にて2hr加熱した後の重量〔W2(g)〕から次式より求めた。
固形分濃度(重量%)=100×(W2−W0)/(W1−W0)
樹脂溶液をジオキサンに溶解させ、電位差滴定装置〔平沼産業(株)製 商品名COM-1600〕を用いて1/10N−KOH水溶液で滴定して求めた。
ゲルパーミュエーションクロマトグラフィー(GPC)[東ソー(株)製商品名HLC-8220GPC、溶媒:テトラヒドロフラン、カラム:TSKgelSuperH-2000(2本)+TSKgelSuperH-3000(1本)+TSKgelSuperH-4000(1本)+TSKgelSuper-H5000(1本)〔東ソー(株)製〕、温度:40℃、速度:0.6ml/min]にて測定し、標準ポリスチレン〔東ソー(株)製PS−オリゴマーキット〕換算値として重量平均分子量(Mw)を求めた。
BPFE:9,9-ビス(4-ヒドロキシフェニル)フルオレンとクロロメチルオキシランとの反応物。一般式(I)の化合物において、Aがフルオレン-9,9-ジイル、R1、R2、R3、R4が水素の化合物。
AA:アクリル酸
BPDA:3,3',4,4'-ビフェニルテトラカルボン酸二無水物
THPA:1,2,3,6-テトラヒドロフタル酸無水物
MAA:メタクリル酸
MMA:メタクリル酸メチル
CHMA:メタクリル酸シクロヘキシル
GMA:メタクリル酸グリシジル
TEAB:テトラエチルアンモニウムブロマイド
AIBN:アゾビスイソブチロニトリル
TPP:トリフェニルホスフィン
DTBC:2,6-ジ−tert−ブチル−p−クレゾール
PGMEA:プロピレングリコールモノメチルエーテルアセテート
DMDG:ジエチレングリコールジメチルエーテル
還留冷却器付き500ml四つ口フラスコ中にBPFE 114.4g(0.23mol)、AA 33.2g(0.46mol)、PGMEA 157g及びTEAB 0.48gを仕込み、100〜105℃で加熱下に20hr撹拌して反応させた。次いで、フラスコ内にBPDA 35.3g(0.12mol)、THPA 18.3g(0.12mol)を仕込み、120〜125℃で加熱下に6hr撹拌し、アルカリ可溶性樹脂(A)−1を得た。得られた樹脂溶液の固形分濃度は56.1wt%、酸価(固形分換算)は103mgKOH/g、GPC分析によるMwは3600であった。
窒素導入管及び還流管付き1000ml四つ口フラスコ中にMAA 51.7g(0.60mol)、MMA 38.0g(0.38mol)、CHMA 37.0g(0.22mol)、AIBN5.91g、及びDMDG 295gを仕込み、80〜85℃で窒素気流下、8hr撹拌して重合させた。更に、フラスコ内にGMA 39.8g(0.28mol)、TPP 1.44g、DTBC 0.055gを仕込み、80〜85℃で16hr撹拌し、重合性不飽和基含有(メタ)アクリレート樹脂(A)−2を得た。得られた樹脂溶液の固形分濃度は35.5質量%、酸価(固形分換算)は110mgKOH/g、GPC分析によるMwは18080であった。
(A)−1:上記合成例1で得られたアルカリ可溶性樹脂溶液
(A)−2:上記合成例2で得られたアルカリ可溶性樹脂溶液
(B)−1:ジペンタエリスリトールヘキサアクリレートとジペンタエリスリトールペンタアクリレートとの混合物(東亜合成社製、商品名 アロニックスM‐405)
(B)−2:トリメチロールプロパントリアクリレート、(サートマー・ジャパン(株)製、商品名SR351S)
(B)−3:ビスフェノールAのEO付加物ジアクリレート(共栄社化学社製、商品名 ライトアクリレートBP-4EAL)
(C):エタノン,1-[9-エチル-6-(2-メチルベンゾイル)-9H-カルバゾール-3-イル]-,1-(0-アセチルオキシム)(BASFジャパン社製、製品名イルガキュアOXE02)
(D)−1:2,2-アゾビスイソブチロニトリル(和光純薬工業社製 商品名V-60)
(D)−2:ジメチル2,2−アゾビス2−メチルプロピオネート)(和光純薬工業社製 商品名V-601)
(D)−3:1,1’-アゾビス(1−アセトキシ-1-フェニルエタン)(大塚化学社製 商品名:OTAZO-15)
(D)−4:ベンゾイルパーオキサイド、(日油社製 商品名:ナイパーBMT-K40)
(E):カーボンブラック濃度25.0質量%、高分子分散剤濃度4.75質量%のPGMEA分散液(固形分29.75%)
(F)-1:PGMEA
(F)-2:シクロヘキサノン
(H): S-510(JNC社製)
(I):メガファックF475(DIC(株)製)
実施例1〜6および比較例1〜4のブラックレジスト用感光性樹脂組成物を用いて、以下に記す評価を行った。これらの評価結果を表2及び表3に示す。
上記で得られた各感光性樹脂組成物を、スピンコーターを用いて125mm×125mmのガラス基板(コーニング1737)上にポストベーク後の膜厚が1.2μmとなるように塗布し、90℃で1分間プリベークした。その後、露光ギャップを100μmに調整し、乾燥塗膜の上にライン/スペース=10μm/50μmのネガ型フォトマスクを被せ、i線照度30mW/cm2の超高圧水銀ランプで50mJ/cm2の紫外線を照射し、感光部分の光硬化反応を行った。
パターン直線性:ポストベーク後の10μmマスクパターンを光学顕微鏡観察し、基板に対する剥離やパターンエッジ部分のギザツキが認められないものを○、一部に認められるものを△、全体に渡って認められるものを×と評価した。
なお、パターン線幅及びパターン直線性の評価は、BT+10秒の場合とBT+20秒の場合とで行った。
上記で得られた各感光性樹脂組成物を、スピンコーターを用いて125mm×125mmのガラス基板(コーニング1737)上にポストベーク後の膜厚が1.1μmとなるように塗布し、90℃で1分間プリベークした。その後、ネガ型フォトマスクを被せず、i線照度30mW/cm2の超高圧水銀ランプで80mJ/cm2の紫外線を照射し、光硬化反応を行った。
OD評価の際と同様に作成した塗板(遮光膜付ガラス板)を用いて、形成した塗膜(遮光膜)の耐溶剤性を評価した。PGMEA又はシクロヘキサノン(アノン)に浸漬したウエスで連続して擦り、表面状態を観察し、塗膜表面が溶解、または、軟化して傷が付いた時の擦った回数を記録した。いずれの溶剤を用いた時の回数が20回以上の場合は耐溶剤性○、20回未満の場合は耐溶剤性×とした。
調製した感光性樹脂溶液の初期溶液粘度に対して、室温23℃で5日後放置後の溶液粘度が初期溶液粘度の1.5倍以上増粘したものを×、1.5倍未満を〇とした。
一方、比較例1のように、光重合性モノマーとして2官能のモノマーを用いると、ポストベーク後の硬化膜の架橋密度が十分に得られず、現像時間が少し長くなった場合にパターン直線性が悪くなり、耐溶剤性も不足する。比較例2のように、熱ラジカル重合性付与のためアゾ系重合開始剤でなく、過酸化物系重合開始剤を用いると、感光性樹脂組成物溶液としての保存安定性が十分でない。比較例3のように、アゾ系重合開始剤を添加しない場合には、ポストベーク温度が低い場合に、十分な耐溶剤性が得られない。比較例4のように、重合性不飽和基含有アルカリ可溶性樹脂として、一般式(II)の化合物ではなくアクリル共重合系の化合物を用いると、低いポストベーク温度においては架橋が十分に進まず、直線性が十分に良好なパターンを得ることができないし、耐溶剤性も不足する。
すなわち、本発明の遮光膜用感光性樹脂組成物は、例えば、カラーフィルターや有機EL画素を形成する際などに必要となるブラックマトリックス、隔壁材、遮光機能を有するカラムスペーサー等といった遮光膜を耐熱温度の低い基板に対して設けたり、タッチパネルを形成する際などに必要となる額縁(ベゼル)部分等の遮光膜を設けたりするのに好適であり、これらの遮光膜付基板(すなわちディスプレイ用基板)を液晶や有機EL等の表示装置の製造に用いたり、CMOS等の固体撮影素子の製造に用いることができるようになる。
Claims (6)
- 耐熱温度が160℃以下の基板上に遮光膜を備えたディスプレイ用基板であって、
前記遮光膜が、下記(A)〜(E)成分、
(A)エポキシ(メタ)アクリレート酸付加物の構造を有する重合性不飽和基含有アルカリ可溶性樹脂、
(B)少なくとも3個のエチレン性不飽和結合を有する光重合性モノマー、
(C)オキシムエステル系重合開始剤、
(D)アゾ系重合開始剤、
及び
(E)黒色有機顔料、混色有機顔料、及び遮光材からなる群から選ばれた1種以上の遮光成分、
を必須成分として含有する遮光膜用感光性樹脂組成物を硬化させたものであることを特徴とするディスプレイ用基板。 - 耐熱温度が160℃以下の基板上に遮光膜を備えたディスプレイ用基板の製造方法であって、
下記(A)〜(E)成分、
(A)エポキシ(メタ)アクリレート酸付加物の構造を有する重合性不飽和基含有アルカリ可溶性樹脂、
(B)少なくとも3個のエチレン性不飽和結合を有する光重合性モノマー、
(C)オキシムエステル系重合開始剤、
(D)アゾ系重合開始剤、
及び
(E)黒色有機顔料、混色有機顔料、及び遮光材からなる群から選ばれた1種以上の遮光成分、
を必須成分として含有する遮光膜用感光性樹脂組成物を基板上に塗布し、フォトマスクを介して露光して、現像により未露光部を除去し、次いで、160℃以下で加熱して所定のパターンを備えた遮光膜を形成することを特徴とするディスプレイ用基板の製造方法。 - 下記(A)〜(E)成分、
(A)エポキシ(メタ)アクリレート酸付加物の構造を有する重合性不飽和基含有アルカリ可溶性樹脂、
(B)少なくとも3個のエチレン性不飽和結合を有する光重合性モノマー、
(C)オキシムエステル系重合開始剤、
(D)アゾ系重合開始剤である1,1’−アゾビス(1−アセトキシ−1−フェニルエタン)、
及び
(E)黒色有機顔料、混色有機顔料、及び遮光材からなる群から選ばれた1種以上の遮光成分、
を必須成分として含むことを特徴とする遮光膜用感光性樹脂組成物。 - 前記(A)成分の重合性不飽和基含有アルカリ可溶性樹脂は、下記一般式(II)で表される請求項3に記載の遮光膜用感光性樹脂組成物。
(式中、R1、R2、R3及びR4は、それぞれ独立して水素原子、炭素数1〜5のアルキル基、ハロゲン原子又はフェニル基を表し、R5は、水素原子又はメチル基を表し、Aは、−CO−、−SO2−、−C(CF3)2−、−Si(CH3)2−、−CH2−、−C(CH3)2−、−O−、フルオレン−9,9−ジイル基又は直結合を表し、Xは4価のカルボン酸残基を表し、Y1及びY2は、それぞれ独立して水素原子又は−OC−Z−(COOH)m(但し、Zは2価又は3価カルボン酸残基を表し、mは1又は2の数を表す)を表し、nは1〜20の整数を表す。) - 前記(A)成分と(B)成分との質量割合(A)/(B)が50/50〜90/10であり、前記(A)成分と(B)成分の合計100質量部に対して、(C)成分が2〜30質量部であると共に(D)成分が1〜20質量部であり、遮光膜用感光性樹脂組成物の光硬化により固形分となる成分を含めた固形分中に(E)成分が40〜70質量%含まれる請求項3又は4に記載の遮光膜用感光性樹脂組成物。
- (E)成分がカーボンブラックである請求項3〜5のいずれかに記載の遮光膜用感光性樹脂組成物。
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