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JP6742849B2 - Substrate transfer robot, vacuum processing device - Google Patents

Substrate transfer robot, vacuum processing device Download PDF

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Publication number
JP6742849B2
JP6742849B2 JP2016149937A JP2016149937A JP6742849B2 JP 6742849 B2 JP6742849 B2 JP 6742849B2 JP 2016149937 A JP2016149937 A JP 2016149937A JP 2016149937 A JP2016149937 A JP 2016149937A JP 6742849 B2 JP6742849 B2 JP 6742849B2
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substrate
plate
quartz
transfer robot
support plate
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JP2018019015A (en
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洋介 神保
洋介 神保
謙次 江藤
謙次 江藤
厳 藤井
厳 藤井
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Ulvac Inc
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Ulvac Inc
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Priority to KR1020170093481A priority patent/KR102269697B1/en
Priority to CN201710629887.4A priority patent/CN107665845B/en
Priority to TW106122561A priority patent/TWI721190B/en
Publication of JP2018019015A publication Critical patent/JP2018019015A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)

Description

本発明は、基板搬送ロボットの技術分野に係り、特に、基板の位置決めを正確に行うことができる基板搬送ロボットに関する。 The present invention relates to the technical field of substrate transfer robots, and more particularly to a substrate transfer robot capable of accurately positioning a substrate.

従来より、ガラス板や半導体ウェハー等の基板を移動させるために、ハンド上に基板を配置し、ハンドを移動させる基板搬送ロボットは広く用いられている。
基板搬送ロボットのハンドは、細長い複数の指部（軸部）に基板を載置し基板を搬送するタイプが存在する。 2. Description of the Related Art Conventionally, in order to move a substrate such as a glass plate or a semiconductor wafer, a substrate transfer robot that places a substrate on a hand and moves the hand is widely used.
The hand of the substrate transfer robot has a type in which a substrate is placed on a plurality of elongated finger portions (shaft portions) and the substrate is transported.

ハンドの先端には先端側ストッパが設けられ、基板のずれを防ぐと共に、基板の位置を決めている（先行文献１）。
基板搬送ロボットは、処理が終了した前工程の真空処理室の内部から、次の処理である後工程を行う真空処理室の内部に向けて、真空雰囲気中で基板を移動させている。 A tip-side stopper is provided at the tip of the hand to prevent the displacement of the substrate and determine the position of the substrate (Reference 1).
The substrate transfer robot moves the substrate in a vacuum atmosphere from the inside of the vacuum processing chamber of the previous process where the processing is completed to the inside of the vacuum processing chamber of the subsequent processing which is the next processing.

前工程の処理を行う際には基板は加熱され、後工程に移動させようとする基板は高温に昇温されている場合がある。高温の基板がハンドの細長の指部上に乗せられると、指部が加熱される。 The substrate may be heated when performing the process of the previous process, and the substrate to be moved to the subsequent process may be heated to a high temperature. When a hot substrate is placed on the elongated fingers of the hand, the fingers are heated.

指部は強度が必要なためセラミックもしくは金属で構成されている。
指部が加熱され、指部が昇温すると、指部は、指部を構成する材料の熱膨張係数に応じた量だけ熱膨張して長くなり、その結果、指部の先端に設けられた先端側ストッパの位置は、指部の根元から遠ざかる方向に移動する。 The fingers are made of ceramic or metal because they require strength.
When the finger portion is heated and the temperature of the finger portion rises, the finger portion is thermally expanded and lengthened by an amount according to the thermal expansion coefficient of the material forming the finger portion, and as a result, the finger portion is provided at the tip of the finger portion. The position of the tip-side stopper moves in a direction away from the base of the finger.

搬送枚数の増加や搬送時間（運転時間）の経過により、指部の温度が上昇し、先端側ストッパの位置が変わるため、後工程の真空処理室に搬送される基板の位置が一定にならないという課題がある。 The temperature of the fingers rises and the position of the tip-side stopper changes due to the increase in the number of transferred sheets and the passage of transfer time (operating time), so the position of the substrate transferred to the vacuum processing chamber in the subsequent process is not constant. There are challenges.

特開２０１５−８２５３２号公報JP, 2005-82532, A

本発明は上記従来技術の不都合を解決するために創作されたものであり、その目的は、指部の温度が上昇しても先端側ストッパの位置変動が少ない基板搬送ロボットを提供することにある。 The present invention was created in order to solve the above-mentioned inconveniences of the prior art, and an object thereof is to provide a substrate transfer robot in which the position variation of the tip side stopper is small even if the temperature of the finger portion rises. ..

上記課題を解決するために、本発明は、基板が配置されるハンドを移動させる基板搬送ロボットであって、前記ハンドは、掌部と、前記掌部に設けられ、基板が配置される複数本の細長の指部とを有し、一枚の前記基板が配置される前記複数本の指部のうち、少なくとも一本の前記指部は、根元部分が前記掌部に固定された細長の支持板と、前記支持板上に前記支持板に沿って乗せられた細長の石英板とを有する位置決め指部であり、前記石英板は先端側に先端側ストッパが設けられ、根元側に固定部が設けられ、前記固定部は、前記掌部と前記支持板とで構成される支持体に取りつけられた基板搬送ロボットである。
本発明は基板搬送ロボットであって、前記位置決め指部を二個以上有する基板搬送ロボットである。
本発明は基板搬送ロボットであって、前記石英板は、複数の石英部材が互いに固定されて形成された基板搬送ロボットである。
本発明は基板搬送ロボットであって、前記支持板はアルミナで構成された基板搬送ロボットである。
本発明は、真空槽と、上記いずれかの基板搬送ロボットが前記真空槽内に配置された搬送室と、前記搬送室に接続され、前記基板を真空処理する処理室と、を有する真空処理装置である。 In order to solve the above problems, the present invention is a substrate transfer robot that moves a hand on which a substrate is arranged, the hand comprising a palm part and a plurality of substrates provided on the palm part and on which the substrates are arranged. Of the plurality of finger portions on which one substrate is arranged, at least one of the finger portions has an elongated support having a root portion fixed to the palm portion. A positioning finger portion having a plate and an elongated quartz plate placed on the support plate along the support plate.The quartz plate is provided with a tip side stopper on the tip side and a fixing portion on the root side. The fixed portion is a substrate transfer robot attached to a support body composed of the palm portion and the support plate.
The present invention is a substrate transfer robot, which has two or more positioning fingers.
The present invention is the substrate transfer robot, wherein the quartz plate is formed by fixing a plurality of quartz members to each other.
The present invention is a substrate transfer robot, wherein the support plate is made of alumina.
The present invention provides a vacuum processing apparatus having a vacuum tank, a transfer chamber in which any one of the above-described substrate transfer robots is arranged in the vacuum tank, and a processing chamber which is connected to the transfer chamber and vacuum-processes the substrate. Is.

指部に石英から成る石英板を設け、石英板の先端に先端側ストッパを設けたので、先端側ストッパの熱膨張による移動量が小さくなり、基板の位置決めが正確になる。 Since the quartz plate made of quartz is provided on the finger portion and the tip side stopper is provided at the tip of the quartz plate, the movement amount of the tip side stopper due to the thermal expansion becomes small, and the positioning of the substrate becomes accurate.

真空処理装置を説明するための図Diagram for explaining the vacuum processing device 搬送室を説明するための図Diagram for explaining the transfer chamber 基板搬送ロボットを説明するための部分断面図Partial cross-sectional view for explaining the substrate transfer robot その基板搬送ロボットの斜視図Perspective view of the substrate transfer robot ハンドの平面図Top view of hand そのハンドに基板を配置した状態を説明するための平面図The top view for demonstrating the state which has arrange|positioned the board in the hand 位置決め指部を説明するための部分断面図Partial cross-sectional view for explaining the positioning finger portion (ａ)：図５のＩ−Ｉ線截断断面図 (ｂ)：図５のＩＩ−ＩＩ線截断断面図 (ｃ)：固定部の一例を示す断面図 (ｄ)：連結部を説明するための平面図(a): Cross-sectional view taken along the line I-I of FIG. 5 (b): Cross-sectional view taken along the line II-II of FIG. 5 (c): Cross-sectional view showing an example of the fixing part (d): For explaining the connecting part Top view of

図１は、処理対象物の真空処理を行う真空処理装置１０であり、この真空処理装置１０は、搬送室１１と、複数の真空処理室１２と、少なくとも一台の搬出入室１３とを有している。 FIG. 1 shows a vacuum processing apparatus 10 that vacuum-processes an object to be processed. The vacuum processing apparatus 10 has a transfer chamber 11, a plurality of vacuum processing chambers 12, and at least one loading/unloading chamber 13. ing.

各真空処理室１２と搬出入室１３とは搬送室１１の周囲に配置され、ゲートバルブを開閉することによって、各真空処理室１２の内部と搬出入室１３の内部とは、搬送室１１の内部と接続又は遮断されるように構成されている。 Each of the vacuum processing chambers 12 and the loading/unloading chamber 13 are arranged around the transfer chamber 11, and the inside of each of the vacuum processing chambers 12 and the loading/unloading chamber 13 is defined as the inside of the transfer chamber 11 by opening and closing the gate valve. It is configured to be connected or disconnected.

図２に示すように、搬送室１１は、真空槽２１と、搬送ロボット２０とを有している。
図３は搬送ロボット２０の側面の拡大図であり、図４は斜視図である。 As shown in FIG. 2, the transfer chamber 11 has a vacuum chamber 21 and a transfer robot 20.
FIG. 3 is an enlarged side view of the transfer robot 20, and FIG. 4 is a perspective view.

搬送ロボット２０は、ハンド４０と、スライド板３３と、台座３２と、支柱部３１と、を有している。
ハンド４０とスライド板３３と台座３２とは、真空槽２１の内部に配置されており、支柱部３１は、下部が真空槽２１の外部に設けられており、支柱部３１の真空槽２１の内部の部分には、下方から、台座３２とスライド板３３とハンド４０とがこの順序で取りつけられている。 The transfer robot 20 has a hand 40, a slide plate 33, a pedestal 32, and a support portion 31.
The hand 40, the slide plate 33, and the pedestal 32 are arranged inside the vacuum chamber 21, and the support column 31 has a lower portion provided outside the vacuum chamber 21, and the inside of the support chamber 31 inside the vacuum chamber 21. A pedestal 32, a slide plate 33, and a hand 40 are attached to this portion in this order from below.

各室１１〜１３の真空槽には、真空排気装置１４が接続されており、真空排気装置１４を動作させて各室１１〜１３の内部を真空排気する。搬送ロボットの動作は制御装置によって制御されている。 A vacuum evacuation device 14 is connected to the vacuum chambers of the chambers 11 to 13, and the vacuum evacuation device 14 is operated to evacuate the inside of the chambers 11 to 13. The operation of the transfer robot is controlled by the control device.

台座３２は支柱部３１に回転および昇降可能に設置される。スライド板３３は、台座３２に固定されモーター２３によって支柱部３１の内部の第一回転軸が回転すると、スライド板３３は、台座３２と共に所望角度回転する。 The pedestal 32 is installed on the column 31 so as to be rotatable and movable up and down. The slide plate 33 is fixed to the pedestal 32, and when the first rotation shaft inside the column 31 is rotated by the motor 23, the slide plate 33 rotates together with the pedestal 32 at a desired angle.

ハンド４０は、掌部３４と、掌部３４に設けられた複数の指部５１ａ〜５４ａ、５１ｂ〜５４ｂとを有している。掌部３４と指部５１ａ〜５４ａ、５１ｂ〜５４ｂとは、金属製、又はアルミナ等のセラミックス製である。 The hand 40 has a palm portion 34 and a plurality of finger portions 51 a to 54 a and 51 b to 54 b provided on the palm portion 34. The palm portion 34 and the finger portions 51a to 54a and 51b to 54b are made of metal or ceramics such as alumina.

スライド板３３は水平に配置され、上方を向く表面には案内溝４９が設けられている。スライド板３３は長方形形状であり、案内溝４９は直線状であって、スライド板３３の長辺と平行に設けられており、また、案内溝４９は水平に配置されている。 The slide plate 33 is arranged horizontally, and a guide groove 49 is provided on the surface facing upward. The slide plate 33 has a rectangular shape, the guide groove 49 has a linear shape, is provided parallel to the long side of the slide plate 33, and the guide groove 49 is horizontally arranged.

掌部３４は、案内溝４９が延びる方向に沿って移動できるように案内溝４９に取りつけられている。モーター（不図示）によって掌部３４は案内溝４９に沿ってスライド板３３上を水平に移動できる。この例では、掌部３４は、水平面内を直線移動する。 The palm portion 34 is attached to the guide groove 49 so as to be movable along the direction in which the guide groove 49 extends. A motor (not shown) allows the palm portion 34 to move horizontally on the slide plate 33 along the guide groove 49. In this example, the palm portion 34 moves linearly in the horizontal plane.

掌部３４には、水平にされた複数の指部５１ａ〜５４ａ、５１ｂ〜５４ｂが設けられている。この例では、指部５１ａ〜５４ａ、５１ｂ〜５４ｂは、掌部３４の移動方向と平行に、同じ方向を向くように、互いに離間して設けられている。
指部５１ａ〜５４ａと指部５１ｂ〜５４ｂは上下２段に設けられている。指部５１ａ〜５４ａと指部５１ｂ〜５４ｂはそれぞれ別の基板を保持することができる。 The palm portion 34 is provided with a plurality of horizontal finger portions 51a to 54a and 51b to 54b. In this example, the finger portions 51a to 54a and 51b to 54b are provided in parallel with the moving direction of the palm portion 34 and spaced from each other so as to face the same direction.
The finger portions 51a to 54a and the finger portions 51b to 54b are provided in upper and lower two stages. The fingers 51a to 54a and the fingers 51b to 54b can hold different substrates.

図４、６の符号１６は、ハンド４０の指部５１ａ〜５４ａ、５１ｂ〜５４ｂに配置された基板を示している。
同程度の高さに設けられた、指部５１ａ〜５４ａ、５１ｂ〜５４ｂには、それぞれ基板１６が一枚乗せられるようになっている。このハンド４０では、上方の指部５１ａ〜５４ａと下方の指部５１ｂ〜５４ｂにそれぞれ一枚ずつ基板１６を配置できるので、ハンド４０には、二枚の基板１６を配置することができる。掌部３４が案内溝４９に沿って移動すると、ハンド４０とハンド４０に配置された基板１６とは、掌部３４及び指部５１ａ〜５４ａ、５１ｂ〜５４ｂと一緒に前進移動又は後退移動する。 Reference numeral 16 in FIGS. 4 and 6 indicates a substrate arranged on the finger portions 51 a to 54 a and 51 b to 54 b of the hand 40.
One substrate 16 is placed on each of the finger portions 51a to 54a and 51b to 54b provided at the same height. In this hand 40, one board 16 can be arranged in each of the upper finger portions 51a to 54a and each of the lower finger portions 51b to 54b, so that two boards 16 can be arranged in the hand 40. When the palm portion 34 moves along the guide groove 49, the hand 40 and the substrate 16 arranged on the hand 40 move forward or backward together with the palm portion 34 and the finger portions 51a to 54a and 51b to 54b.

ハンド４０を前進させると、搬送室１１内に位置するハンド４０を前工程の真空処理室１２内に移動させることができ、ハンド４０を前工程の真空処理室１２に対する定位置で静止させ、前工程の真空処理室１２内に配置された基板１６をハンド４０上に乗せた後ハンド４０を後退させ、ハンド４０を搬送室１１内に移動させ、台座３２を回転させてハンド４０の向きを変え、ハンド４０を前進させ、後工程の真空処理室１２内に基板１６を移動させ、後工程の真空処理室１２に対する定位置に静止させると、後工程の真空処理室１２内の台上に基板１６を配置することができる。 When the hand 40 is moved forward, the hand 40 located in the transfer chamber 11 can be moved into the vacuum processing chamber 12 of the previous process, and the hand 40 is stopped at a fixed position with respect to the vacuum processing chamber 12 of the previous process. After placing the substrate 16 placed in the vacuum processing chamber 12 of the process on the hand 40, the hand 40 is retracted, the hand 40 is moved into the transfer chamber 11, and the pedestal 32 is rotated to change the direction of the hand 40. , The hand 40 is moved forward, the substrate 16 is moved into the vacuum processing chamber 12 of the post process, and is stopped at a fixed position with respect to the vacuum processing chamber 12 of the post process, the substrate is placed on the table in the vacuum processing chamber 12 of the post process. 16 can be arranged.

同程度の高さに配置され、同じ基板１６が配置される複数の指部５１ａ〜５４ａ、５１ｂ〜５４ｂのうち、少なくとも一本、望ましくは二本以上の指部５１ａ、５３ａ、５４ａ、５１ｂ、５３ｂ、５４ｂは、図５に示すように、細長の支持板４１と、支持板４１上に配置された石英から成る石英板４２とを有する位置決め指部５５にされている。他の指部５２ａ、５２ｂは、平板状の支持板４３を有しており、その上には石英板は設けられていない。
同じ基板１６が配置される複数の指部５１ａ〜５４ａ、５１ｂ〜５４ｂのうち、端に位置する指部５１ａ、５１ｂ、５４ａ、５４ｂは、位置決め指部５５にするのが望ましい。 Of the plurality of finger portions 51a to 54a, 51b to 54b arranged at the same height and on which the same substrate 16 is arranged, at least one, preferably two or more finger portions 51a, 53a, 54a, 51b, 53b and 54b are, as shown in FIG. 5, positioning fingers 55 having an elongated support plate 41 and a quartz plate 42 made of quartz and arranged on the support plate 41. The other finger portions 52a and 52b have a flat plate-shaped support plate 43, and no quartz plate is provided thereon.
Of the plurality of finger portions 51a to 54a, 51b to 54b on which the same substrate 16 is arranged, the finger portions 51a, 51b, 54a, 54b located at the ends are preferably the positioning finger portions 55.

図７は、位置決め指部５５の側面の断面図であり、図８(ａ)は、図５の位置決め指部５５のＩ−Ｉ線截断断面図である。支持板４１は開口が上方を向いたコ字形形状であり、石英板４２は、支持板４１の底面上に配置されており、コ字形形状の二個の壁部分により、石英板４２は支持板４１上から脱落しないようになっている。石英板４２は後述する固定部５０によって掌部３４側の一端で固定され、かつ、支持板４１に対してすべり移動が可能にされている。石英板４２は支持板４１より熱膨張性が小さく、石英板４２は一端しか拘束されていないので、温度が上昇して支持板４１が伸びても、支持板４１は石英板４２に対してずれて、石英板４２は伸長前とほぼ同じ長さを維持できる。 7 is a side sectional view of the positioning finger portion 55, and FIG. 8A is a sectional view taken along the line I-I of the positioning finger portion 55 of FIG. The support plate 41 has a U-shape with an opening facing upward, the quartz plate 42 is arranged on the bottom surface of the support plate 41, and the quartz plate 42 is supported by the two U-shaped wall portions. 41 It is designed not to fall from the top. The quartz plate 42 is fixed at one end on the palm portion 34 side by a fixing portion 50, which will be described later, and is made slidable with respect to the support plate 41. Since the quartz plate 42 has a smaller thermal expansion property than the support plate 41, and the quartz plate 42 is restrained only at one end, the support plate 41 shifts from the quartz plate 42 even if the temperature rises and the support plate 41 extends. Thus, the quartz plate 42 can maintain the same length as before the extension.

図８(ｂ)は、図５の位置決め指部５５のＩＩ−ＩＩ線截断断面図であり、石英板４２には、複数箇所に孔６３が形成され、各孔６３内に、ベアリング６４が配置されている。ベアリング６４は、支持板４１に固定されている。 FIG. 8B is a sectional view taken along the line II-II of the positioning finger portion 55 of FIG. 5, in which the quartz plate 42 has holes 63 formed at a plurality of positions, and the bearings 64 are arranged in the respective holes 63. Has been done. The bearing 64 is fixed to the support plate 41.

石英板４２の孔６３は指部（５１ａ等）の長さ方向に長穴になっており、支持板４１と石英板４２の位置がずれても干渉しないように構成されている。ベアリング６４は、石英板４２に取り付けることも可能だが、強度上、支持板４１に取り付けることが好ましい。 The hole 63 of the quartz plate 42 is an elongated hole in the length direction of the finger portion (51a, etc.), and is configured so as not to interfere even if the positions of the support plate 41 and the quartz plate 42 are displaced. The bearing 64 can be attached to the quartz plate 42, but is preferably attached to the support plate 41 in terms of strength.

ベアリング６４は、本体６５と、本体６５の上端に配置され、回転可能に本体６５に取りつけられたボール６６とを有しており、ボール６６は、支持板４１や石英板４２よりも高い位置に配置されている。 The bearing 64 has a main body 65 and a ball 66 that is arranged at the upper end of the main body 65 and is rotatably attached to the main body 65. The ball 66 is positioned higher than the support plate 41 and the quartz plate 42. It is arranged.

ベアリング６４は、位置決め指部５５以外の指部５２ａ、５２ｂにも配置されており、同じ基板１６が配置される指部５１ａ〜５４ａ、５１ｂ〜５４ｂに配置されたベアリング６４のボール６６は、同じ高さに配置されている。
従って、基板１６を、ハンド４０に配置する際には、基板１６の裏面はボール６６と接触する。 The bearing 64 is also arranged on the finger parts 52a and 52b other than the positioning finger part 55, and the balls 66 of the bearing 64 arranged on the finger parts 51a to 54a and 51b to 54b on which the same substrate 16 is arranged are the same. It is located at the height.
Therefore, when the substrate 16 is placed on the hand 40, the back surface of the substrate 16 contacts the balls 66.

基板１６に水平方向の力が印加され、水平に移動する際にはボール６６は回転する。従って、基板１６と支持板４１や石英板４２は接触せず、摺動によるダストや基板１６の傷が発生しないようにされている。 A horizontal force is applied to the substrate 16, and the ball 66 rotates when moving horizontally. Therefore, the substrate 16 does not come into contact with the support plate 41 or the quartz plate 42, and dust and scratches on the substrate 16 due to sliding are prevented.

ところで、本実施例で用いられる石英板４２は、複数の細長の石英部材４２1〜４２3によって構成されており、各石英部材４２1〜４２3は、端部同士が互いにはめ込まれて構成された連結部６０によって連結されて一枚の石英板４２にされている。 Incidentally, quartz plate 42 used in this embodiment is constituted by a quartz member 42 1-42 third plurality of elongated, the quartz member 42 1-42 3 ends are configured fitted together The quartz plate 42 is connected by the connecting portion 60.

図８(ｄ)は、連結部６０の拡大平面図であり、ここでは真ん中の石英部材４２2と先端側の石英部材４２3とを連結する連結部６０が示されている。一方の石英部材４２3に形成された凸部６４が、他方の石英部材４２2の凹部６３にはめ込まれて連結部６０が構成されている。 FIG. 8D is an enlarged plan view of the connecting portion 60, and here, the connecting portion 60 that connects the central quartz member 42 2 and the tip-side quartz member 42 3 is shown. The convex portion 64 formed on one quartz member 42 3 is fitted into the concave portion 63 of the other quartz member 42 2 to form the connecting portion 60.

複数の石英部材４２1〜４２3のうち、一枚の石英部材４２1が掌部３４に最も近い根元側に位置し、他の一枚の石英部材４２3が根元側とは反対の先端側に位置し、残りの一枚又は複数枚の石英部材４２2が根元側と先端側の二枚の石英部材４２1、４２3の間に位置し、連結部６０によって一枚の石英板４２にされている。 Of the plurality of quartz members 42 1 to 42 3 , one quartz member 42 1 is located at the root side closest to the palm portion 34, and the other quartz member 42 3 is at the tip side opposite to the root side. And the remaining one or more quartz members 42 2 are located between the two quartz members 42 1 and 42 3 on the root side and the tip side, and are connected to one quartz plate 42 by the connecting portion 60. Has been done.

掌部３４と支持板４１とは、金属やアルミナ等の、石英よりも機械的強度の高い材料で構成されており、掌部３４と支持板４１とは、ネジ４５等によって互いに固定されている。 The palm portion 34 and the support plate 41 are made of a material having higher mechanical strength than quartz, such as metal or alumina, and the palm portion 34 and the support plate 41 are fixed to each other with screws 45 or the like. ..

石英板４２の根本の部分は、掌部３４上又は支持板４１上に位置しており、石英板４２の根本側の部分には、石英板４２を支持板４１に固定する固定部５０が設けられている。固定部５０は根元に位置する石英部材４２1に設けられている。 The root portion of the quartz plate 42 is located on the palm portion 34 or the support plate 41, and the root portion of the quartz plate 42 is provided with a fixing portion 50 for fixing the quartz plate 42 to the support plate 41. Has been. The fixing portion 50 is provided on the quartz member 42 1 located at the base.

図７に示すように、この例では、石英板４２には石英板側貫通孔４６ａが形成され、支持板４１には、石英板側貫通孔４６ａと連通する支持板側貫通孔４６ｂとが形成されており、上部がフランジ状に形成されたボルト４４が、その下端が石英板側貫通孔４６ａと支持板側貫通孔４６ｂとに挿通されて固定部５０が形成され、石英板４２の掌部３４側の一端は、固定部５０によって、支持板４１に固定されている。
固定部５０は、掌部３４に設けられていても良く、また、石英板４２と支持板４１とをクランプ等で挟み込んで固定することもできる。 As shown in FIG. 7, in this example, the quartz plate 42 has a quartz plate side through hole 46a formed therein, and the support plate 41 has a support plate side through hole 46b communicating with the quartz plate side through hole 46a. The upper end of the bolt 44 is formed in a flange shape, and the lower end of the bolt 44 is inserted into the quartz plate side through hole 46a and the support plate side through hole 46b to form the fixing portion 50. One end on the 34 side is fixed to the support plate 41 by the fixing portion 50.
The fixing portion 50 may be provided on the palm portion 34, or may be fixed by sandwiching the quartz plate 42 and the support plate 41 with a clamp or the like.

石英板４２の掌部３４側の一端が、支持板４１または掌部３４に固定されればよいから、互いに固定された掌部３４と支持板４１とを支持体３０と呼ぶと、石英板４２は、固定部５０によって、支持体３０に固定されていればよいことになり、石英板４２の重量は、支持体３０によって支持される。 One end of the quartz plate 42 on the palm portion 34 side may be fixed to the support plate 41 or the palm portion 34. Therefore, when the palm portion 34 and the support plate 41 fixed to each other are called the support 30, the quartz plate 42 Need only be fixed to the support 30 by the fixing portion 50, and the weight of the quartz plate 42 is supported by the support 30.

石英板４２は、固定部５０から、石英板４２の先端又は支持板４１の先端まで、底面が支持体３０に接触されているが、石英板４２の、固定部５０よりも先端側の部分は、支持体３０に固定されず分離されており、昇温によって支持板４１が石英板４２よりも大きく伸長するときは、固定部５０とは反対側の石英板４２の先端側で、支持板４１と石英板４２とは別々の伸長量で伸長する。 The bottom surface of the quartz plate 42 is in contact with the support 30 from the fixed portion 50 to the tip of the quartz plate 42 or the tip of the support plate 41. However, the portion of the quartz plate 42 on the tip side of the fixed portion 50 is closer to the tip side. When the support plate 41 is separated from the support body 30 without being fixed, and the support plate 41 expands more than the quartz plate 42 due to the temperature rise, the support plate 41 is provided on the tip side of the quartz plate 42 opposite to the fixing portion 50. The quartz plate 42 and the quartz plate 42 are stretched by different stretching amounts.

石英板４２の両端のうち、固定部５０とは反対側である先端側には、指部５１ａ〜５４ａ、５１ｂ〜５４ｂ上に配置される基板１６の側面と接触する高さに先端側ストッパ５６が設けられており、指部５１ａ〜５４ａ、５１ｂ〜５４ｂ上に配置された基板１６が先端方向に移動すると先端側ストッパ５６に接触し、停止するようになっている。 At both ends of the quartz plate 42, which are opposite to the fixed portion 50, on the tip side, the tip-side stopper 56 is located at a height at which the side surfaces of the substrate 16 arranged on the finger portions 51a to 54a and 51b to 54b come into contact. When the substrate 16 arranged on the finger portions 51a to 54a and 51b to 54b moves in the tip direction, the board 16 comes into contact with the tip side stopper 56 and stops.

石英板４２の熱膨張係数は０．６×１０-6／Ｋであり、アルミナは７．２×１０-6／Ｋであり、加熱されたときの支持板４１の熱膨張量は、石英板４２の熱膨張量よりも１０倍以上大きくなっており、位置決め指部５５が加熱されると、支持板４１が、石英板４２よりも大きく熱膨張する。 The coefficient of thermal expansion of the quartz plate 42 is 0.6×10 −6 /K, that of alumina is 7.2×10 −6 /K, and the thermal expansion amount of the support plate 41 when heated is the quartz plate. The amount of thermal expansion is 10 times or more larger than that of 42, and when the positioning finger 55 is heated, the support plate 41 thermally expands more than the quartz plate 42.

石英板４２と支持板４１とは、固定部５０以外の部分では互いに固定されていないので、固定部５０では支持板４１と石英板４２とが互いに固定された状態で、支持板４１の先端が、石英板４２に妨げられずに伸び、支持板４１の先端の真空槽２１に対する位置が大きく変化する。
石英板４２の熱膨張による伸びは、支持板４１の伸びに比較して少量であり、石英板４２の先端に位置する先端側ストッパ５６の、真空槽２１に対する位置の変化は小さい。 Since the quartz plate 42 and the support plate 41 are not fixed to each other except the fixing portion 50, the tip of the support plate 41 is fixed in the fixing portion 50 with the support plate 41 and the quartz plate 42 fixed to each other. The quartz plate 42 extends without being hindered, and the position of the tip of the support plate 41 with respect to the vacuum chamber 21 largely changes.
The elongation of the quartz plate 42 due to the thermal expansion is smaller than that of the support plate 41, and the change in the position of the tip-side stopper 56 located at the tip of the quartz plate 42 with respect to the vacuum chamber 21 is small.

掌部３４が真空槽２１に対して同じ位置に配置されたハンド４０上に、真空槽２１に対する位置が同じになるように基板１６を複数回配置する際に、ハンド４０の指部５１ａ〜５４ａ、５１ｂ〜５４ｂの温度が異なり、基板１６と支持板４１の先端との間の位置関係は大きく異なっても、基板１６と先端側ストッパ５６との間の位置関係には大きな違いは無い。
従って、指部５１ａ〜５４ａ、５１ｂ〜５４ｂの温度が異なっても、ハンド４０に配置する基板１６は、先端側ストッパ５６に対して同じ位置に配置することができる。 When the substrate 16 is arranged a plurality of times on the hand 40 in which the palm portion 34 is arranged at the same position with respect to the vacuum chamber 21, the fingers 16 a to 54 a of the hand 40 are arranged when the substrate 16 is arranged a plurality of times so that the positions with respect to the vacuum chamber 21 are the same. , 51b to 54b and the positional relationship between the substrate 16 and the tip of the support plate 41 is significantly different, the positional relationship between the substrate 16 and the tip-side stopper 56 is not significantly different.
Therefore, even if the temperatures of the finger portions 51a to 54a and 51b to 54b are different, the substrate 16 arranged on the hand 40 can be arranged at the same position with respect to the tip side stopper 56.

また、符号５７は、根元側ストッパであり、指部５１ａ〜５４ａ、５１ｂ〜５４ｂ上に配置された基板１６が、根元側ストッパ５７を超えて移動することがないようにされている。 Reference numeral 57 is a root-side stopper that prevents the substrate 16 arranged on the finger portions 51a to 54a and 51b to 54b from moving beyond the root-side stopper 57.

なお、図中、符号５８はＬ字形形状の補助板であり、補助板５８の先端に取りつけられた側方ストッパ５９は、基板１６の四辺のうち、先端側ストッパ５６と根元側ストッパ５７とがそれぞれ接触する辺とは異なる辺に接触し、基板１６が移動方向とは垂直な方向に移動しないようにされている。図２、３、７では、補助板５８は省略してある。 In the figure, reference numeral 58 is an L-shaped auxiliary plate, and the side stopper 59 attached to the tip of the auxiliary plate 58 has a tip side stopper 56 and a root side stopper 57 among the four sides of the substrate 16. The substrate 16 contacts different sides from each other so that the substrate 16 does not move in a direction perpendicular to the moving direction. The auxiliary plate 58 is omitted in FIGS.

根元側ストッパ５７の一例を図８(ｃ)に示す。
符号６９はストッパ本体であり、この例では、複数の位置決め孔７２ａと、一個のストッパ長穴６８とを有している。石英板４２には、固定用貫通孔７２ｂが設けられており、固定用貫通孔７２ｂに、位置決め用のピン７４が配置されている。 An example of the root side stopper 57 is shown in FIG.
Reference numeral 69 denotes a stopper body, which has a plurality of positioning holes 72a and one stopper elongated hole 68 in this example. The quartz plate 42 is provided with a fixing through hole 72b, and a positioning pin 74 is arranged in the fixing through hole 72b.

複数の位置決め孔７２ａは、ストッパ長穴６８が伸びる方向に沿って配置され、複数の位置決め孔７２ａとストッパ長穴６８とは一列に並ぶように形成されている。
複数の位置決め孔７２ａのうち、最適な位置の位置決め孔７２ａに、固定用貫通孔７２ｂ上に突き出されたピン７４の上部が挿入されるように、ストッパ本体６９を石英板４２に乗せる。 The plurality of positioning holes 72a are arranged along the direction in which the elongated stopper holes 68 extend, and the plurality of positioning holes 72a and the elongated stopper holes 68 are formed in a line.
The stopper body 69 is placed on the quartz plate 42 so that the upper part of the pin 74 protruding above the fixing through hole 72b is inserted into the positioning hole 72a at the optimum position among the plurality of positioning holes 72a.

ストッパ本体６９には、ストッパ長穴６８が形成され、ストッパ長穴６８と連通する位置の石英板４２の部分には石英板長穴６２ａが形成されている。
石英板長穴６２ａの下方位置の支持板４１の部分には、石英板長穴６２ａと連通する支持板細穴６２ｂが形成されている。支持板細穴６２ｂには、上部がフランジ状に形成されたボルト６１の細い下端が、ストッパ長穴６８と石英板長穴６２ａとを通過して挿通され、ボルト６１の支持板細穴６２ｂよりも上部は、石英板長穴６２ａの内部とストッパ長穴６８の内部とに位置しており、ボルト６１のフランジの側面のうち石英板４２が伸びる方向とは垂直な方向に向いた部分が、ストッパ本体６９と接触するようにされており、ピン７４とボルト６１とによって、ストッパ本体６９が石英板４２に固定されている。
先端側ストッパ５６は、ストッパ本体に位置決め孔とストッパ長穴６８とが形成されており、ピンとボルトとで石英板４２に固定されている点で同じである。 A stopper elongated hole 68 is formed in the stopper body 69, and a quartz plate elongated hole 62a is formed in a portion of the quartz plate 42 at a position communicating with the stopper elongated hole 68.
A supporting plate narrow hole 62b communicating with the quartz plate elongated hole 62a is formed in a portion of the support plate 41 below the quartz plate elongated hole 62a. The thin lower end of the bolt 61 having an upper portion formed in a flange shape is inserted into the supporting plate small hole 62b through the stopper elongated hole 68 and the quartz plate elongated hole 62a. The upper part is located inside the quartz plate elongated hole 62a and inside the stopper elongated hole 68, and a portion of the side surface of the flange of the bolt 61, which is oriented in a direction perpendicular to the direction in which the quartz plate 42 extends, The stopper body 69 is brought into contact with the stopper body 69, and the stopper body 69 is fixed to the quartz plate 42 by the pin 74 and the bolt 61.
The distal end side stopper 56 is the same in that a positioning hole and a stopper elongated hole 68 are formed in the stopper body, and the stopper 56 is fixed to the quartz plate 42 with a pin and a bolt.

１０……真空処理装置
１６……基板
２０……搬送ロボット
２１……真空槽
３０……支持体
３４……掌部
４０……ハンド
４１……支持板
４２……石英板
４２1〜４２3……石英部材
５０……固定部
５１ａ〜５４ａ、５１ｂ〜５４ｂ……指部
５５……位置決め指部
６０……連結部 10... Vacuum processing device 16... Substrate 20... Transfer robot 21... Vacuum tank 30... Support 34... Palm part 40... Hand 41... Support plate 42... Quartz plates 42 1 to 42 3 ... ... quartz member 50 ... fixing parts 51a to 54a, 51b to 54b ... finger part 55 ... positioning finger part 60 ... connecting part

Claims (5)

基板が配置されるハンドを移動させる基板搬送ロボットであって、
前記ハンドは、
掌部と、
前記掌部に設けられ、基板が配置される複数本の細長の指部とを有し、
一枚の前記基板が配置される前記複数本の指部のうち、少なくとも一本の前記指部は、根元部分が前記掌部に固定された細長の支持板と、前記支持板上に前記支持板に沿って乗せられた細長の石英板とを有する位置決め指部であり、
前記石英板は先端側に先端側ストッパが設けられ、根元側に固定部が設けられ、
前記固定部は、前記掌部と前記支持板とで構成される支持体に取りつけられた
基板搬送ロボット。 A substrate transfer robot that moves a hand on which a substrate is placed,
The hand is
Palm part,
A plurality of elongated fingers provided on the palm and on which a substrate is arranged,
Among the plurality of finger portions on which the one substrate is arranged, at least one of the finger portions has an elongated support plate whose root portion is fixed to the palm portion, and the support on the support plate. A positioning finger portion having an elongated quartz plate placed along the plate,
The quartz plate is provided with a stopper on the tip side and a fixing portion on the root side,
The substrate transfer robot in which the fixing portion is attached to a support body including the palm portion and the support plate. 前記位置決め指部を二個以上有する請求項１記載の基板搬送ロボット。 The substrate transfer robot according to claim 1, further comprising two or more positioning fingers. 前記石英板は、複数の石英部材が互いに固定されて形成された請求項１又は請求項２のいずれか１項記載の基板搬送ロボット。 The substrate transfer robot according to claim 1, wherein the quartz plate is formed by fixing a plurality of quartz members to each other. 前記支持板はアルミナで構成された請求項１乃至請求項３のいずれか１項記載の基板搬送ロボット。 The substrate transfer robot according to claim 1, wherein the support plate is made of alumina. 真空槽と、
請求項１乃至請求項４のいずれか１項記載の基板搬送ロボットが前記真空槽内に配置された搬送室と、
前記搬送室に接続され、前記基板を真空処理する処理室と、
を有する真空処理装置。 A vacuum chamber,
A transfer chamber in which the substrate transfer robot according to any one of claims 1 to 4 is arranged in the vacuum chamber,
A processing chamber which is connected to the transfer chamber and vacuum-processes the substrate;
A vacuum processing apparatus having.
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