JP6728697B2 - Composite electronic component and mounting body including the same - Google Patents

Description

The present invention relates to a composite electronic component in which a plurality of electronic components are integrated and a mounted body including the same , and particularly to a composite electronic component in which a capacitor element and another electronic component are integrated and mounting including the composite electronic component. About the body .

Conventionally, an invention of a composite electronic component including a plurality of electronic components has been proposed from the viewpoint of integrating each electronic component at high density.

For example, Japanese Patent Laid-Open No. 2001-338838 (Patent Document 1) discloses a composite electronic component including a capacitor element and a resistance element. In this composite electronic component, a resistor element made of a resistor is provided on the outer surface of the capacitor body of the chip-type capacitor element. A pair of external electrodes are provided on the outer surface of the capacitor body, and the pair of external electrodes and the resistor thereof are connected to each other.

JP 2001-338838 A

However, as disclosed in Patent Document 1 above, in the case of a composite electronic component having a configuration in which another electronic element is formed on the outer surface of the capacitor body, the mounting area can be reduced, but the circuit There is a problem that a large restriction occurs when designing or structural designing, and it is impossible to design and manufacture a composite electronic component satisfying desired specifications with a high degree of freedom.

Therefore, the present invention has been made to solve the above problems, and a composite electronic component that can be designed and manufactured with a high degree of freedom while satisfying desired specifications, and that can reduce the mounting area, and It is an object to provide an assembly provided with this .

A composite electronic component according to the present invention includes a first electronic component and a second electronic component. The first electronic component is composed of a capacitor body having a dielectric layer and a conductive layer laminated, and a capacitor element having a first external electrode and a second external electrode provided on the outer surface of the capacitor body. The first external electrode and the second external electrode are located apart from each other in the length direction orthogonal to the stacking direction of the dielectric layer and the conductor layer. The second electronic component is stacked on the first electronic component in the height direction orthogonal to the length direction. The second electronic component has a first terminal electrode and a second terminal electrode connected to the functional portion of the second electronic component. The first terminal electrode and the second terminal electrode are opposite to a back surface, which is a main surface facing the first electronic component, of the pair of main surfaces facing each other in the height direction of the second electronic component. It is provided so as to be exposed at the front surface, which is the main surface on the side. In the second electronic component, from the front surface of the portion provided so that the first terminal electrode is exposed, through the one end face in the length direction of the second electronic component, The first connecting conductor is provided so as to be continuous with the back surface of the portion facing the first electronic component, and the front surface of the portion provided so that the second terminal electrode is exposed. The second connecting conductor is provided so as to extend to the other end face of the second electronic component in the length direction. In the composite electronic component according to the present invention, the first external electrode and the first connecting conductor are joined together via a conductive joining material, and the second external electrode and the second electronic component are joined together. The first electronic component and the second electronic component are electrically connected in series by adhering the back surface to each other with an insulating adhesive, and the first electronic component and the second electronic component are connected. The parts are integrated.

In the composite electronic component according to the present invention, the second electronic component may be a diode element.

In the composite electronic component based on the present invention, the second electronic component may be a resistance element.
A mounting body according to the present invention includes the above-described composite electronic component according to the present invention and a wiring board provided with a first land and a second land. In the mounting body based on the present invention, the second external electrode is bonded to the first land by using a conductive bonding material, and the second connecting conductor is conductive bonding material on the second land. The composite electronic component is mounted in an upright state with respect to the wiring board such that the length direction is along the normal line direction of the wiring board by being joined using.

According to the present invention, it is possible to provide a composite electronic component that can be designed and manufactured with a high degree of freedom while satisfying desired specifications, and that can reduce the mounting area, and a mounting body including the same. ..

FIG. 3 is a perspective view of the composite electronic component according to the first embodiment of the present invention. It is a schematic cross section along the II-II line of the composite electronic component shown in FIG. It is a schematic cross section along the III-III line of the composite electronic component shown in FIG. It is a figure which shows the equivalent circuit of the composite electronic component shown in FIG. It is a schematic cross section of the composite electronic component concerning the 1st modification. It is a perspective view of the composite electronic component which concerns on a 2nd modification. It is a schematic cross section along the VII-VII line of the composite electronic component shown in FIG. It is a schematic cross section of the composite electronic component which concerns on a 3rd modification. It is a schematic cross section of the composite electronic component concerning the 4th modification. It is a schematic cross section of the composite electronic component concerning the 5th modification. FIG. 6 is a perspective view of a composite electronic component according to a second embodiment of the present invention. It is a schematic cross section along the XII-XII line of the composite electronic component shown in FIG. It is a schematic cross section along the line XIII-XIII of the composite electronic component shown in FIG. FIG. 12 is a diagram showing an equivalent circuit of the composite electronic component shown in FIG. 11. It is a perspective view of the composite electronic component concerning the 6th modification. It is a schematic cross section along the XVI-XVI line of the composite electronic component shown in FIG. It is a schematic cross section along the XVII-XVII line of the composite electronic component shown in FIG. It is a schematic cross section of the composite electronic component concerning the 7th modification. It is a schematic cross section of the composite electronic component concerning the 7th modification. FIG. 7 is a perspective view of a composite electronic component according to a third embodiment of the present invention. It is a schematic cross section along the XXI-XXI line of the composite electronic component shown in FIG. It is a schematic cross section along the XXII-XXII line of the composite electronic component shown in FIG. It is a perspective view of the composite electronic component which concerns on an 8th modification. It is a schematic cross section along the XXIV-XXIV line of the composite electronic component shown in FIG. FIG. 24 is a schematic cross-sectional view taken along line XXV-XXV of the composite electronic component shown in FIG. 23. It is a schematic cross section of the composite electronic component concerning the 9th modification. It is a schematic cross section of the composite electronic component concerning the 9th modification. FIG. 9 is a perspective view of a composite electronic component according to a fourth embodiment of the present invention. It is a schematic cross section along the XXIX-XXIX line of the composite electronic component shown in FIG. It is a figure which shows the equivalent circuit of the composite electronic component shown in FIG. FIG. 29 is a schematic cross-sectional view of a mounting body including the composite electronic component shown in FIG. 28. It is a perspective view of the composite electronic component in Embodiment 5 of the present invention. FIG. 33 is a schematic cross-sectional view taken along line XXXIII-XXXIII of the composite electronic component shown in FIG. 32. FIG. 33 is a schematic cross-sectional view taken along line XXXIV-XXXIV of the composite electronic component shown in FIG. 32. FIG. 33 is a schematic cross-sectional view taken along line XXXV-XXXV of the composite electronic component shown in FIG. 32. FIG. 33 is a diagram showing an equivalent circuit of the composite electronic component shown in FIG. 32. It is a perspective view of the composite electronic component in Embodiment 6 of the present invention. It is a schematic cross section of the composite electronic component in Embodiment 7 of this invention. FIG. 39 is a diagram showing an equivalent circuit of the composite electronic component shown in FIG. 38.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the embodiments described below, the same or common parts are designated by the same reference numerals in the drawings, and the description thereof will not be repeated.

(Embodiment 1)
1 is a perspective view of a composite electronic component 1A according to the first embodiment of the present invention. 2 and 3 are schematic cross-sectional views taken along line II-II and line III-III of the composite electronic component 1A shown in FIG. 1, respectively. FIG. 4 is a diagram showing an equivalent circuit of the composite electronic component 1A shown in FIG. Hereinafter, the composite electronic component 1A according to the present embodiment will be described with reference to FIGS. 1 to 4.

As shown in FIGS. 1 to 3, composite electronic component 1A in the present embodiment includes capacitor element 10 as a first electronic component and diode element 20 as a second electronic component. The capacitor element 10 and the diode element 20 are laminated by being laminated on each other, and are integrated by using bonding materials 50a and 50b described later.

The capacitor element 10 has a substantially rectangular parallelepiped shape. In the present embodiment, the dimensions of the four sides of capacitor element 10 along the length direction L shown in the figure are larger than the dimensions of the four sides of capacitor element 10 along the width direction W shown in the figure. The substantially rectangular parallelepiped shape referred to here is one in which the corners and ridges of the rectangular parallelepiped are partially or entirely rounded, or the surface of the rectangular parallelepiped, that is, part or all of the six surfaces is provided with steps or irregularities. The items included are included.

The diode element 20 has a substantially flat plate shape having a predetermined thickness. In the present embodiment, the dimensions of the four sides of diode element 20 along the length direction L shown in the figure are larger than the dimensions of the four sides of diode element 20 along the width direction W shown in the figure. The substantially flat plate shape referred to here is one in which the corners and the ridges of the diode element 20 are partially or entirely rounded, or the surface of the diode element 20, that is, a step or a part of all six surfaces, Those including unevenness and the like are included.

In the description of the present embodiment, the direction in which the capacitor element 10 and the diode element 20 are arranged is called the height direction H. Of the directions orthogonal to the height direction H, the direction in which the first external electrode 14 and the second external electrode 15 of the capacitor element 10 are arranged is called the length direction L. Further, a direction orthogonal to both the height direction H and the length direction L is referred to as a width direction W. The first external electrode 14 and the second external electrode 15 will be described in detail later. Also, in various embodiments and modifications thereof described later, terms according to these are used as terms indicating directions in the composite electronic component.

As shown in FIGS. 1 to 3, the capacitor element 10 is, for example, a laminated ceramic capacitor, and includes a capacitor body 11, a first outer electrode 14 and a second outer electrode 15 provided on the outer surface of the capacitor body 11. have. The capacitor body 11 has a substantially rectangular parallelepiped shape, and the first outer electrode 14 and the second outer electrode 15 provided in a predetermined region on the outer surface thereof are separated from each other in the length direction L.

As shown in FIGS. 2 and 3, the capacitor body 11 is composed of a plurality of dielectric layers 12 and a plurality of conductor layers 13, and each of the plurality of dielectric layers 12 and the plurality of conductor layers 13 is composed of a plurality of dielectric layers 12. Each of the layers is alternately laminated. In the composite electronic component 1A according to the present embodiment, the stacking direction of the plurality of dielectric layers 12 and the plurality of conductor layers is substantially the same as the height direction H. However, this is merely an example, and the stacking direction of the plurality of dielectric layers 12 and the plurality of conductor layers 13 may substantially coincide with the width direction W.

The plurality of dielectric layers 12 are made of a ceramic material containing barium titanate (BaTiO ₃ ), calcium titanate (CaTiO ₃ ), strontium titanate (SrTiO ₃ ), calcium zirconate (CaZrO ₃ ), or the like as a main component. Consist of materials. Further, the plurality of dielectric layers 12 may include Mn, Mg, Si, Co, Ni, a rare earth element, or the like as a subcomponent having a smaller content than the main component. On the other hand, the plurality of conductor layers 13 are made of a material containing a metal material such as Ni, Cu, Ag, Pd, an Ag-Pd alloy, or Au.

Each of the first external electrode 14 and the second external electrode 15 is composed of a plurality of conductive layers including a base conductive layer and a coating conductive layer. The base conductive layer means a conductive layer directly provided on a part of the outer surface of the capacitor body 11, and the covering conductive layer means a conductive layer covering the base electrode layer. The base conductive layer is, for example, a sintered metal layer, and the sintered metal layer is a layer formed by baking a paste containing Cu, Ni, Ag, Pd, Ag-Pd alloy, or Au and glass. means. The base conductive layer of the present embodiment is a Cu layer baked with a paste containing Cu. The coated conductive layer is, for example, a plated layer, and the plated layer is a layer formed by a plating process. The coated conductive layer of the present embodiment includes a plating layer containing Ni and a plating layer containing Sn formed on the plating layer containing Ni. The coated conductive layer may be a plating layer containing Cu or a plating layer containing Au instead of the plating layer containing Ni and the plating layer containing Sn.

The first external electrode 14 and the second external electrode 15 may be formed of only the plating layer, omitting the underlying conductive layer. Further, the underlying conductive layer may be composed of a conductive resin layer obtained by curing a conductive resin paste containing a metal component and a resin component.

The capacitor body 11 includes a first main surface 11a1 and a second main surface 11a2 as a pair of main surfaces facing each other in the height direction H, and a first end surface 11b1 and a second main surface 11b1 as a pair of end surfaces facing each other in the length direction L. It has an end surface 11b2 and a first side surface 11c1 and a second side surface 11c2 as a pair of side surfaces facing each other in the width direction W. Of these, the first major surface 11a1 of the pair of major surfaces facing each other in the height direction H faces the diode element 20. The second main surface 11a2 that does not face the diode element 20 serves as a mounting surface when mounting the composite electronic component 1A. Here, the mounting surface is a surface that faces the mounted object when the composite electronic component 1A is mounted on the mounted object represented by a wiring board or the like.

The first external electrode 14 is provided continuously with the first end surface 11b1 of the capacitor body 11 and a part of each of the first main surface 11a1, the second main surface 11a2, the first side surface 11c1 and the second side surface 11c2. There is. The second external electrode 15 is provided so as to be continuous with the second end surface 11b2 of the capacitor body 11 and a part of each of the first main surface 11a1, the second main surface 11a2, the first side surface 11c1 and the second side surface 11c2. Has been.

As shown in FIG. 2, one of the two layers of the plurality of conductor layers 13 that are adjacent to each other with one layer of the plurality of dielectric layers 12 sandwiched in the height direction H is one of the layers of the capacitor body 11. The first inner electrode layer is connected to the first outer electrode 14 by being drawn to one end face. The other is a second internal electrode layer that is drawn to the other end surface of the capacitor body 11 and connected to the second external electrode 15. As a result, the first outer electrode 14 and the second outer electrode 15 form a state in which a plurality of capacitors are electrically connected in parallel.

As shown in FIGS. 1 to 3, a diode element 20 is formed by sealing a semiconductor chip 21 having a diode formed on a semiconductor substrate typified by a silicon substrate with a resin sealing portion 22. It has the above-mentioned semiconductor chip 21, the sealing portion 22, and the first terminal electrode 24 and the second terminal electrode 25 provided on the semiconductor chip 21. The first terminal electrode 24 and the second terminal electrode 25 are separated from each other in the length direction L. One of the first terminal electrode 24 and the second terminal electrode 25 is a cathode electrode and the other is an anode electrode.

The diode element 20 has a pair of main surfaces facing each other in the height direction H, a pair of end surfaces facing each other in the length direction L, and a pair of side surfaces facing each other in the width direction W. In addition, in the present embodiment, the first terminal electrode 24 and the second terminal electrode 25 described above are configured to be exposed on one of the pair of main surfaces of the diode element 20. The main surface on which 24 and the second terminal electrode 25 are exposed faces the first main surface 11a1 of the capacitor element 10.

Here, as shown in FIGS. 2 and 3, the first external electrode 14 of the portion located on the first main surface 11a1 of the capacitor element 10 and the first terminal electrode 24 of the diode element 20 are arranged in the height direction. They face each other at H, and these constitute a first facing portion. In the first facing portion, the bonding material 50a is located so as to be interposed between the first external electrode 14 and the first terminal electrode 24, and the bonding material 50a allows the first external electrode 14 and the first terminal to be connected. The electrode 24 is joined. Thereby, the first external electrode 14 is electrically connected to the first terminal electrode 24.

Further, the second external electrode 15 of the portion located on the first main surface 11a1 of the capacitor element 10 and the second terminal electrode 25 of the diode element 20 face each other in the height direction H. The facing portion is configured. In the second facing portion, the bonding material 50b is located so as to be interposed between the second external electrode 15 and the second terminal electrode 25, and the bonding material 50b allows the second external electrode 15 and the second terminal to be connected. The electrode 25 is joined. Thereby, the second external electrode 15 is electrically connected to the second terminal electrode 25.

As the bonding materials 50a and 50b, for example, a brazing material such as solder can be used, and in addition, bonding using a conductive adhesive or the like can be used. As the conductive adhesive, various adhesives such as paste and sheet can be used. When solder is used as the bonding materials 50a and 50b, so-called high-temperature solder is used so that the composite electronic component 1A is not remelted when it is mounted on a wiring board or the like as a mounted object. Is preferred.

As described above, the composite electronic component 1A in the present embodiment described above can use the second main surface 11a2 of the capacitor element 10 that does not face the diode element 20 as a mounting surface, and is a normal two-terminal type. The mounting can be performed in the same mounting manner as the case of mounting the capacitor element. That is, the first external electrode 14 and the second external electrode 15 provided on the capacitor element 10 can be used as mounting terminal electrodes, and each of these can be used as a wiring board or the like as an object to be mounted by using a bonding material such as solder. The composite electronic component 1A can be mounted by being bonded to the provided land.

As a result, the composite electronic component 1A according to the present embodiment has two mounting terminal electrodes for a wiring board or the like as a mounted object, and has an equivalent circuit as shown in FIG.

According to the composite electronic component 1A having the above-described configuration, the capacitor element 10 and the diode element 20 are stacked in the height direction H, and the capacitor element 10 and the diode element 20 are joined together by using the joining materials 50a and 50b. The diode element 20 can be integrated. Therefore, it becomes possible to easily manufacture a composite electronic component that satisfies desired specifications while ensuring a high degree of freedom in design.

Further, in the case of the composite electronic component 1A having the above configuration, the mounting area obtained by integrating the capacitor element 10 and the diode element 20 is reduced (high integration of electronic components on a wiring board or the like as a mounted object). The effect of will naturally be obtained.

Therefore, by using the composite electronic component 1A according to the present embodiment, a composite electronic component that can be designed and manufactured with a high degree of freedom while satisfying desired specifications, and further that can reduce the mounting area can be provided. You can

(First modification)
FIG. 5 is a schematic cross-sectional view of a composite electronic component 1A1 according to the first modification. Hereinafter, with reference to FIG. 5, the composite electronic component 1A1 according to the first modification based on the above-described first embodiment will be described.

As shown in FIG. 5, in the composite electronic component 1A1 according to the first modification, the diode element 20 does not have the sealing portion 22 when compared with the composite electronic component 1A in the first embodiment described above. Only in that the configuration is different.

Specifically, in the composite electronic component 1A1 according to this modification, a so-called bare chip is used as the diode element 20, and the diode element 20 including the bare chip is laminated on the capacitor element 10.

Even in the case of such a configuration, the same effects as the effects described in the first embodiment described above can be obtained.

(Second modified example)
FIG. 6 is a perspective view of a composite electronic component 1A2 according to a second modification, and FIG. 7 is a schematic cross-sectional view of the composite electronic component shown in FIG. 6 along the line VII-VII. Hereinafter, with reference to FIGS. 6 and 7, a composite electronic component 1A2 according to a second modification based on the above-described first embodiment will be described.

As shown in FIGS. 6 and 7, the composite electronic component 1A2 according to the second modified example has a first mounting terminal 44 and a second mounting terminal 44 when compared with the composite electronic component 1A in the first embodiment described above. The configuration is different only in that a terminal 45 is further provided.

Specifically, the first mounting terminal 44 and the second mounting terminal 45 are made of, for example, metal plate-shaped members having an L-shaped cross-sectional shape, and both ends in the length direction L of the composite electronic component 1A2. It is located in.

The first mounting terminal 44 is arranged so as to face the first external electrode 14 in a portion located on the first end face 11b1 of the capacitor element 10, and is bonded to the first external electrode 14 in the portion. .. The second mounting terminal 45 is arranged so as to face the second external electrode 15 in the portion located on the second end surface 11b2 of the capacitor element 10, and is bonded to the second external electrode 15 in the portion. ing.

Here, for example, welding can be used for joining the first mounting terminal 44 and the first external electrode 14 and for joining the second mounting terminal 45 and the second external electrode 15, and in addition, For example, joining using a brazing material such as solder or a conductive adhesive can be used.

In such a configuration, the first external electrode 14 of the capacitor element 10 and the first terminal electrode 24 of the diode element 20 are electrically connected to the first mounting terminal 44, and the capacitor The second external electrode 15 of the element 10 and the second terminal electrode 25 of the diode element 20 are electrically connected to the second mounting terminal 45. Therefore, the first mounting terminal 44 and the second mounting terminal 45 are bonded to a land provided on a wiring board or the like as an object to be mounted by using a bonding material such as solder to mount the composite electronic component 1A. It becomes possible to do.

Therefore, even when configured as described above, it is possible to obtain the same effect as that described in the first embodiment.

Further, by providing the mounting terminals like the composite electronic component 1A2 according to the present modification, the capacitor main body 11 is separated from the wiring board or the like as the mounted portion while the composite electronic component 1A2 is mounted. Can be made. Therefore, when this configuration is adopted, it is possible to suppress the periodic strain generated in the capacitor body 11 during energization from propagating to the wiring board or the like, and the periodic strain may affect the wiring board or the like. It is possible to reduce the noise that can be generated by vibrating.

(Third modification)
FIG. 8 is a schematic sectional view of a composite electronic component 1A3 according to the third modification. Hereinafter, with reference to FIG. 8, a composite electronic component 1A3 according to a third modification based on the above-described first embodiment will be described.

As shown in FIG. 8, when the composite electronic component 1A3 according to the third modification is compared with the composite electronic component 1A2 according to the above-described second modification, the first terminal electrode 24 of the diode element 20 has the capacitor element 10A. Is directly bonded to the first mounting terminal 44 without being bonded to the first external electrode 14, and the second terminal electrode 25 of the diode element 20 is bonded to the second external electrode 15 of the capacitor element 10. The configuration is mainly different in that it is directly joined to the second mounting terminal 45 without being attached.

Specifically, in the composite electronic component 1A3 according to the present modification, the first terminal electrode 24 and the second terminal electrode 25 are exposed from the pair of main surfaces facing each other in the height direction H of the diode element 20. The main surface of the capacitor element 10 does not face the first main surface 11a1 of the capacitor element 10 (that is, the main surface on which the first terminal electrode 24 and the second terminal electrode 25 are not provided is the first surface of the capacitor element 10). The diode element 20 is arranged so as to face the main surface 11a1).

Further, connection conductors 28a and 28b are provided on the outer surface of the sealing portion 22 of the diode element 20 so as to be separated from each other in the length direction L. The connection conductor 28a is located so as to be continuous from the main surface of the diode element 20 where the first terminal electrode 24 is provided to one end surface of the diode element 20 facing the first mounting terminal 44. The connection conductor 28b is located so as to extend from the main surface of the diode element 20 in the portion where the second terminal electrode 25 is provided to the other end surface of the diode element 20 facing the second mounting terminal 45.

A portion of the connection conductor 28a provided on one end surface of the diode element 20 is joined to the first mounting terminal 44 by the joining material 50c, whereby the first terminal electrode 24 of the capacitor element 10 is joined. It is electrically connected to the first mounting terminal 44 without passing through the first external electrode 14. A portion of the connection conductor 28b provided on the other end surface of the diode element 20 is joined to the second mounting terminal 45 by the joining material 50d, whereby the second terminal electrode 25 of the capacitor element 10 is joined. It is electrically connected to the second mounting terminal 45 without passing through the second external electrode 15.

As the joining materials 50c and 50d, for example, a brazing material such as solder can be used, and besides, joining using a conductive adhesive or the like can be used. As the conductive adhesive, various adhesives such as paste and sheet can be used. When solder is used as the bonding materials 50c and 50d, so-called high-temperature solder is used so that the composite electronic component 1A3 is not remelted when it is mounted on a wiring board or the like as a mounted object. Is preferred. It is also possible to join them by welding or the like without using a conductive adhesive.

Even in the case of such a configuration, the same effects as the effects described in the first embodiment described above can be obtained.

(Fourth modification)
FIG. 9 is a schematic cross-sectional view of a composite electronic component 1A4 according to the fourth modification. Hereinafter, with reference to FIG. 9, a composite electronic component 1A4 according to a fourth modification based on the above-described first embodiment will be described.

As shown in FIG. 9, the composite electronic component 1A4 according to the fourth modification has a capacitor element 10 and a diode element 20 in the height direction H when compared with the composite electronic component 1A in the first embodiment described above. The configuration is different mainly in that the positions are interchanged.

Specifically, in the composite electronic component 1A4 according to the present modification, the diode element 20 is arranged so as to face the second main surface 11a2 of the pair of main surfaces of the capacitor element 10, and the diode element 20 is disposed. The main surface of the element 20 that does not face the capacitor element 10 serves as a mounting surface when mounting the composite electronic component 1A4.

In addition, in the composite electronic component 1A4 according to the present modification, among the pair of main surfaces facing each other in the height direction H of the diode element 20, the main surface where the first terminal electrode 24 and the second terminal electrode 25 are exposed. So as not to face the second main surface 11a2 of the capacitor element 10 (that is, the main surface on which the first terminal electrode 24 and the second terminal electrode 25 are not provided is the second main surface 11a2 of the capacitor element 10). The diode element 20 is disposed so as to oppose to the.

Connection conductors 28a and 28b are provided on the outer surface of the sealing portion 22 of the diode element 20 so as to be separated from each other in the length direction L. The connection conductor 28a extends from the main surface of the diode element 20 in the portion where the first terminal electrode 24 is provided to the main surface of the diode element 20 facing the capacitor element 10 via one end surface of the diode element 20. Is located as. The connection conductor 28b extends from the main surface of the diode element 20 where the second terminal electrode 25 is provided to the main surface of the diode element 20 facing the capacitor element 10 via the other end surface of the diode element 20. Is located as.

As a result, the portion of the first external electrode 14 located on the second main surface 11a2 of the capacitor element 10 and the connecting conductor 28a of the diode element 20 face each other in the height direction H, and the bonding material 50a is applied. The first external electrode 14 is electrically connected to the first terminal electrode 24 by joining these portions via the first external electrode 14.

Further, as a result, the portion of the second external electrode 15 located on the second main surface 11a2 of the capacitor element 10 and the connection conductor 28b of the diode element 20 face each other in the height direction H, and the bonding material The second external electrode 15 is electrically connected to the second terminal electrode 25 by joining these portions via 50 b.

With this configuration, the main surface of the diode element 20 that does not face the capacitor element 10 can be used as the mounting surface, and the mounting is performed in the same mounting manner as when mounting a normal two-terminal electronic component. Will be possible. Therefore, by adopting the configuration, it is possible to obtain the same effect as the effect described in the first embodiment.

(Fifth Modification)
FIG. 10 is a schematic cross-sectional view of a composite electronic component 1A5 according to the fifth modification. Hereinafter, referring to FIG. 10, a composite electronic component 1A5 according to a fifth modification based on the above-described first embodiment will be described.

As shown in FIG. 10, the composite electronic component 1A5 according to the fifth modified example has a first mounting terminal 44 and a second mounting terminal 45 when compared with the composite electronic component 1A4 according to the fourth modified example described above. Is mainly provided in that the configuration is different.

Specifically, the first mounting terminal 44 and the second mounting terminal 45 are made of, for example, a metal plate-shaped member having an L-shaped cross-sectional shape, and both ends in the length direction L of the composite electronic component 1A5. It is located in.

The first mounting terminal 44 is arranged so as to face the first external electrode 14 in a portion located on the first end face 11b1 of the capacitor element 10, and is bonded to the first external electrode 14 in the portion. .. The second mounting terminal 45 is arranged so as to face the second external electrode 15 in the portion located on the second end surface 11b2 of the capacitor element 10, and is bonded to the second external electrode 15 in the portion. ing.

Here, for example, welding can be used for joining the first mounting terminal 44 and the first external electrode 14 and for joining the second mounting terminal 45 and the second external electrode 15, and in addition, For example, joining using a brazing material such as solder or a conductive adhesive can be used.

Further, in the composite electronic component 1A5 according to the present modification, the main surface of the diode element 20 where the first terminal electrode 24 and the second terminal electrode 25 are exposed faces the second main surface 11a2 of the capacitor element 10. Are arranged as follows. The first terminal electrode 24 is joined to the first outer electrode 14 by the joining material 50a, and the second terminal electrode 25 is joined to the second outer electrode 15 by the joining material 50b.

Even in the case of such a configuration, the same effects as the effects described in the first embodiment described above can be obtained.

(Embodiment 2)
FIG. 11 is a perspective view of composite electronic component 1B according to the second embodiment of the present invention. 12 and 13 are schematic cross-sectional views taken along line XII-XII and line XIII-XIII of composite electronic component 1B shown in FIG. 11, respectively. 14 is a diagram showing an equivalent circuit of the composite electronic component 1B shown in FIG. Hereinafter, the composite electronic component 1B in the present embodiment will be described with reference to FIGS. 11 to 14.

As shown in FIGS. 11 to 13, in the composite electronic component 1B according to the present embodiment, when compared with the composite electronic component 1A according to the above-described Embodiment 1, the capacitor element 10 includes the first external electrode 14 and the In addition to the two external electrodes 15, the third external electrode 16 and the fourth external electrode 17 are provided, and the positions where the first terminal electrode 24 and the second terminal electrode 25 of the diode element 20 are provided are different. The difference is mainly in the configuration.

Specifically, the capacitor element 10 has the above-described third external electrode 16 and fourth external electrode 17 on the outer surface of the capacitor body 11, and is separated from each other in the width direction W. Here, the third outer electrode 16 and the fourth outer electrode 17 are located between the first outer electrode 14 and the second outer electrode 15 in the length direction L.

The third external electrode 16 is provided so as to be continuous with a part of the first side surface 11c1 of the capacitor body 11 and a part of each of the first main surface 11a1 and the second main surface 11a2. The fourth external electrode 17 is provided so as to be continuous with a part of the second side surface 11c2 of the capacitor body 11 and a part of each of the first main surface 11a1 and the second main surface 11a2. The third external electrode 16 and the fourth external electrode 17 are both not connected to the first external electrode 14 and the second external electrode 15, and are also not connected to the conductor layer 13 located inside the capacitor body 11. Is.

The diode element 20 has a first terminal electrode 24 and a second terminal electrode 25 on the main surface facing the first main surface 11a1 of the capacitor element 10, and the first terminal electrode 24 and the second terminal electrode 25 are They are separated from each other in the width direction W.

Here, as shown in FIGS. 12 and 13, the third external electrode 16 in the portion located on the first main surface 11a1 of the capacitor element 10 and the first terminal electrode 24 of the diode element 20 are arranged in the height direction. They face each other at H, and these constitute a third facing portion. In the third facing portion, the bonding material 50e is positioned so as to be interposed between the third external electrode 16 and the first terminal electrode 24, and the bonding material 50e causes the third external electrode 16 and the first terminal. The electrode 24 is joined. Thereby, the third external electrode 16 is electrically connected to the first terminal electrode 24.

Further, the fourth external electrode 17 of the portion located on the first main surface 11a1 of the capacitor element 10 and the second terminal electrode 25 of the diode element 20 face each other in the height direction H, and thus the fourth external electrode 17 The facing portion is configured. In the fourth facing portion, the bonding material 50f is located so as to be interposed between the fourth external electrode 17 and the second terminal electrode 25, and the bonding material 50f allows the fourth external electrode 17 and the second terminal to be connected. The electrode 25 is joined. Thereby, the fourth external electrode 17 is electrically connected to the second terminal electrode 25.

As the bonding materials 50e and 50f, for example, a brazing material such as solder can be used, and in addition, bonding using a conductive adhesive or the like can be used. As the conductive adhesive, various adhesives such as paste and sheet can be used. When solder is used as the bonding materials 50e and 50f, so-called high-temperature solder is used so that the composite electronic component 1B is not remelted when it is mounted on a wiring board or the like as a mounted object. Is preferred.

In the composite electronic component 1B of the present embodiment, the portion of the diode element 20 facing the capacitor element 10 is sealed so that the diode element 20 is stably held by the capacitor element 10 without tilting. The stopper 22 is provided with a recess 22a, and the first terminal electrode 24 and the second terminal electrode 25 are provided so as to face the recess 22a.

The composite electronic component 1B according to the present embodiment described above can use the second main surface 11a2 of the capacitor element 10 that does not face the diode element 20 as a mounting surface, and mounts a normal 4-terminal type capacitor element. It can be mounted in the same mounting manner as the case. That is, the first external electrode 14, the second external electrode 15, the third external electrode 16, and the fourth external electrode 17 provided on the capacitor element 10 can be used as mounting terminal electrodes, and each of these can be a bonding material such as solder. The composite electronic component 1B can be mounted by being bonded to a land provided on a wiring board or the like as a mounted object using.

As a result, the composite electronic component 1B according to the present embodiment has four mounting terminal electrodes on a wiring board or the like as a mounted object, and has an equivalent circuit as shown in FIG.

According to the composite electronic component 1B having the above-described configuration, the capacitor element 10 and the diode element 20 are stacked in the height direction H, and the capacitor element 10 and the diode element 20 are joined together by using the joining materials 50e and 50f. The diode element 20 can be integrated. Therefore, it becomes possible to easily manufacture a composite electronic component satisfying desired specifications while ensuring a high degree of freedom in design.

Further, in the case of the composite electronic component 1B having the above configuration, the mounting area obtained by integrating the capacitor element 10 and the diode element 20 is reduced (high integration of electronic components on a wiring board or the like as a mounted object). The effect of will naturally be obtained.

In addition, since the capacitor element and the diode element are not electrically connected to each other inside the composite electronic component 1B by using the composite electronic component 1B having the above configuration, the design freedom from the viewpoint of the circuit design. The degree is very high. That is, it is possible to connect these capacitor elements and diode elements in series or in parallel by electrically connecting these capacitor elements and diode elements on the side of the mounted object such as the wiring board on which the composite electronic component 1B is mounted. However, depending on the case, it is possible to connect them to separate circuits. Therefore, the composite electronic component can be applied to various circuits.

Therefore, by using the composite electronic component 1B according to the present embodiment, it is possible to design and manufacture with a high degree of freedom while satisfying the desired specifications, and further to reduce the mounting area. You can

(Sixth Modification)
FIG. 15 is a perspective view of a composite electronic component 1B1 according to the sixth modification. 16 and 17 are schematic cross-sectional views taken along line XVI-XVI and line XVII-XVII of composite electronic component 1B1 shown in FIG. 15, respectively. Hereinafter, with reference to FIGS. 15 to 17, a composite electronic component 1B1 according to a sixth modification based on the above-described second embodiment will be described.

As shown in FIGS. 15 to 17, the composite electronic component 1B1 according to the sixth modified example has a first mounting terminal 44 and a second mounting terminal 44 when compared with the composite electronic component 1B according to the second embodiment described above. The configuration is different only in that a terminal 45, a third mounting terminal 46, and a fourth mounting terminal 47 are further provided.

Specifically, the first mounting terminal 44, the second mounting terminal 45, the third mounting terminal 46, and the fourth mounting terminal 47 have a L-shaped cross-sectional shape, for example, a metal plate member. Consists of. The first mounting terminal 44 and the second mounting terminal 45 are arranged at both ends in the length direction L of the composite electronic component 1B1, and the third mounting terminal 46 and the fourth mounting terminal 47 are the composite electronic component. It is arranged at both ends in the width direction W of 1B1.

The first mounting terminal 44 is arranged so as to face the first external electrode 14 in a portion located on the first end face 11b1 of the capacitor element 10, and is bonded to the first external electrode 14 in the portion. .. The second mounting terminal 45 is arranged so as to face the second external electrode 15 in the portion located on the second end surface 11b2 of the capacitor element 10, and is bonded to the second external electrode 15 in the portion. ing.

The third mounting terminal 46 is arranged so as to face the third external electrode 16 in a portion located on the first side surface 11c1 of the capacitor element 10, and is joined to the third external electrode 16 in the portion. .. Further, the fourth mounting terminal 47 is arranged so as to face the fourth external electrode 17 in a portion located on the second side surface 11c2 of the capacitor element 10, and is bonded to the fourth external electrode 17 in the portion. ing.

Here, the first mounting terminal 44 and the first external electrode 14 are joined, the second mounting terminal 45 and the second external electrode 15 are joined, and the third mounting terminal 46 and the third external electrode 16 are joined. Further, for example, welding can be used to join the fourth mounting terminal 47 and the fourth external electrode 17, and in addition to this, for example, a brazing material such as solder or a conductive adhesive is used. Is available.

In the case of such a configuration, the first outer electrode 14 of the capacitor element 10 is electrically connected to the first mounting terminal 44, and the second outer electrode 15 of the capacitor element 10 is 2 It will be electrically connected to the mounting terminal 45. Further, in the case of such a configuration, the first terminal electrode 24 of the diode element 20 is electrically connected to the third mounting terminal 46, and the second terminal electrode 25 of the diode element 20 is also connected. , And is electrically connected to the fourth mounting terminal 47. Therefore, the first mounting terminal 44, the second mounting terminal 45, the third mounting terminal 46, and the fourth mounting terminal 47 are provided on the wiring board or the like as the mounted object by using a bonding material such as solder. By being bonded to the land, the composite electronic component 1B1 can be mounted.

Therefore, even in the case of the above configuration, it is possible to obtain the same effect as the effect described in the second embodiment.

(Seventh modification)
18 and 19 are schematic cross-sectional views of a composite electronic component 1B2 according to the seventh modified example. Hereinafter, with reference to FIGS. 18 and 19, a composite electronic component 1B2 according to a seventh modification based on the above-described second embodiment will be described.

As shown in FIGS. 18 and 19, the composite electronic component 1B2 according to the seventh modified example has a capacitor element 10 and a diode element in the height direction H when compared with the composite electronic component 1B1 according to the sixth modified example described above. The configuration is different only in that the positions of 20 and 20 are interchanged.

Specifically, in the composite electronic component 1B2 according to the present modification, the diode element 20 is arranged so as to face the second main surface 11a2 of the pair of main surfaces of the capacitor element 10, and the diode element 20 is disposed. The main surface of the element 20 that does not face the capacitor element 10 is a mounting surface when mounting the composite electronic component 1B2.

With such a configuration, the main surface of the diode element 20 that does not face the capacitor element 10 can be used as a mounting surface, and the mounting is performed in the same mounting mode as when mounting a normal 4-terminal electronic component. Will be possible. Therefore, by adopting the configuration, it is possible to obtain the same effect as that described in the second embodiment.

(Embodiment 3)
FIG. 20 is a perspective view of composite electronic component 1C according to the third embodiment of the present invention. 21 and 22 are schematic cross-sectional views taken along line XXI-XXI and line XXII-XXII of composite electronic component 1C shown in FIG. 20, respectively. Hereinafter, the composite electronic component 1C in the present embodiment will be described with reference to FIGS. 20 to 22.

As shown in FIGS. 20 to 22, the composite electronic component 1C according to the present embodiment is different from the composite electronic component 1A4 according to the fourth modified example described above in comparison with the first terminal electrode 24 and the first terminal electrode 24 of the diode element 20. The diode element 20 has a third terminal electrode 26 and a fourth terminal electrode 27, in addition to the first terminal electrode 24 and the second terminal electrode 25, in that the position where the two terminal electrode 25 is provided is different. The difference is mainly in the configuration.

Specifically, the diode element 20 has the first terminal electrode 24 and the second terminal electrode 25 on the main surface that does not face the second main surface 11a2 of the capacitor element 10, and the first terminal electrode 24 and the second terminal electrode 25 are provided. The terminal electrodes 25 are separated from each other in the width direction W. Here, the 1st terminal electrode 24 and the 2nd terminal electrode 25 are located between the 3rd terminal electrode 26 and the 4th terminal electrode 27 which are mentioned below in the length direction L.

Further, connection conductors 28a and 28b are provided on the outer surface of the sealing portion 22 of the diode element 20 so as to be separated from each other in the width direction W. The connection conductor 28a is located so as to be continuous from the main surface of the diode element 20 where the first terminal electrode 24 is provided to one side surface of the diode element 20. The connection conductor 28b is located so as to extend from the main surface of the diode element 20 where the second terminal electrode 25 is provided to the other side surface of the diode element 20.

The third terminal electrode 26 and the fourth terminal electrode 27 are provided on the outer surface of the sealing portion 22, and are positioned so as to cover the end portion of the sealing portion 22 in the length direction L. The third terminal electrode 26 extends from the main surface of the diode element 20 facing the capacitor element 10 through one end surface of the diode element 20 to the main surface of the diode element 20 not facing the capacitor element 10. Is located in. The fourth terminal electrode 27 extends from the main surface of the diode element 20 facing the capacitor element 10 to the main surface of the diode element 20 not facing the capacitor element 10 via the other end surface of the diode element 20. Is located in.

As a result, the portion of the first external electrode 14 located on the second main surface 11a2 of the capacitor element 10 and the third terminal electrode 26 of the diode element 20 are opposed to each other in the height direction H. A fifth facing portion is configured. In the fifth facing portion, the bonding material 50g is positioned so as to be interposed between the first external electrode 14 and the third terminal electrode 26, and the first external electrode 14 and the third terminal are bonded by the bonding material 50g. The electrode 26 is joined. As a result, the first external electrode 14 is electrically connected to the third terminal electrode 26.

Further, as a result, the portion of the second external electrode 15 located on the second main surface 11a2 of the capacitor element 10 and the fourth terminal electrode 27 of the diode element 20 face each other in the height direction H, These constitute the sixth facing portion. In the sixth facing portion, the bonding material 50h is located so as to be interposed between the second external electrode 15 and the fourth terminal electrode 27, and the bonding material 50h causes the second external electrode 15 and the fourth terminal. The electrode 27 is joined. As a result, the second external electrode 15 is electrically connected to the fourth terminal electrode 27.

As the joining materials 50g and 50h, for example, a brazing material such as solder can be used, and in addition, joining using a conductive adhesive or the like can be used. As the conductive adhesive, various adhesives such as paste and sheet can be used. When solder is used as the bonding materials 50g and 50h, so-called high-temperature solder is used so that the composite electronic component 1C is not melted again when it is mounted on a wiring board or the like as an object to be mounted. Is preferred.

1 C of composite electronic components in this Embodiment demonstrated above can use the main surface which does not face the capacitor element 10 of the diode element 20 as a mounting surface, and is the same as when mounting a normal 4-terminal type electronic component. It can be mounted in the mounting mode of. That is, the first terminal electrode 24, the second terminal electrode 25, the third terminal electrode 26, and the fourth terminal electrode 27 provided on the diode element 20 can be used as mounting terminal electrodes, each of which is a bonding material such as solder. The composite electronic component 1C can be mounted by being bonded to a land provided on a wiring board or the like as a mounted object using.

As a result, the composite electronic component 1C according to the present embodiment has four mounting terminal electrodes on a wiring board or the like as a mounted object, and has a circuit according to an equivalent circuit as shown in FIG. It will be.

According to the composite electronic component 1C having the above-described configuration, the capacitor element 10 and the diode element 20 are laminated in the height direction H, and the capacitor element 10 and the diode element 20 are joined together by using the joining materials 50g and 50h. The diode element 20 can be integrated. Therefore, it becomes possible to easily manufacture a composite electronic component satisfying desired specifications while ensuring a high degree of freedom in design.

Further, in the case of the composite electronic component 1C having the above-mentioned configuration, the mounting area obtained by integrating the capacitor element 10 and the diode element 20 is reduced (high integration of electronic components on a wiring board or the like as a mounted object). The effect of will naturally be obtained.

In addition, since the composite electronic component 1C having the above-described configuration does not cause the capacitor element and the diode element to be electrically connected to each other inside the composite electronic component 1C, the design freedom from the viewpoint of the circuit design. The degree is very high. That is, by electrically connecting the capacitor element and the diode element on the side of the mounted object such as the wiring board on which the composite electronic component 1C is mounted, these can be connected in series or in parallel. However, depending on the case, it is possible to connect them to separate circuits. Therefore, the composite electronic component can be applied to various circuits.

Therefore, by using the composite electronic component 1C according to the present embodiment, the composite electronic component can be designed and manufactured with a high degree of freedom while satisfying the desired specifications, and further, the mounting area can be reduced. You can

(8th modification)
FIG. 23 is a perspective view of a composite electronic component 1C1 according to the eighth modification. 24 and 25 are schematic cross-sectional views taken along line XXIV-XXIV and line XXV-XXV of composite electronic component 1C1 shown in FIG. 23, respectively. 23 to 25, the composite electronic component 1C1 according to the eighth modification based on the above-described third embodiment will be described below.

As shown in FIGS. 23 to 25, the composite electronic component 1C1 according to the eighth modified example has a fifth mounting terminal 44′ and a sixth mounting terminal when compared with the composite electronic component 1C according to the third embodiment. In that the diode element 20 does not include the third terminal electrode 26 and the fourth terminal electrode 27. In addition, the diode terminal 20 does not include the third terminal electrode 26 and the fourth terminal electrode 27. , Mainly the configuration is different.

Specifically, the fifth mounting terminal 44 ′, the sixth mounting terminal 45 ′, the seventh mounting terminal 46 ′, and the eighth mounting terminal 47 ′ each have a L-shaped cross-sectional shape and are made of, for example, metal. It is composed of a plate-shaped member. The fifth mounting terminal 44' and the sixth mounting terminal 45' are arranged at both ends of the composite electronic component 1C1 in the length direction L, and the seventh mounting terminal 46' and the eighth mounting terminal 47' are Are arranged at both ends in the width direction W of the composite electronic component 1C1.

The fifth mounting terminal 44 ′ is arranged so as to face the first external electrode 14 of the portion located on the first end surface 11 b 1 of the capacitor element 10, and is joined to the first external electrode 14 at the portion. There is. Further, the sixth mounting terminal 45 ′ is arranged so as to face the second external electrode 15 in the portion located on the second end face 11 b 2 of the capacitor element 10, and is bonded to the second external electrode 15 in that portion. Has been done.

Here, for example, welding can be used for joining the fifth mounting terminal 44 ′ and the first external electrode 14 and for joining the sixth mounting terminal 45 ′ and the second external electrode 15. Also, for example, joining using a brazing material such as solder or a conductive adhesive can be used.

The seventh mounting terminal 46 ′ is arranged so as to face the connecting conductor 28 a in a portion located on one side surface of the diode element 20, and is joined to the connecting conductor 28 a in the portion by the bonding material 50 c. .. The eighth mounting terminal 47 ′ is arranged so as to face the connecting conductor 28 b in the portion located on the other side surface of the diode element 20, and is joined to the connecting conductor 28 a by the joining material 50 d in the portion. ing.

Here, as the bonding materials 50c and 50d, for example, a brazing material such as solder can be used, and in addition, bonding using a conductive adhesive or the like can be used. As the conductive adhesive, various adhesives such as paste and sheet can be used. When solder is used as the bonding materials 50c and 50d, so-called high-temperature solder is used so that the composite electronic component 1C1 is not remelted when it is mounted on a wiring board or the like as a mounted object. Is preferred. It is also possible to join them by welding or the like without using a conductive adhesive.

In such a configuration, the first outer electrode 14 of the capacitor element 10 is electrically connected to the fifth mounting terminal 44', and the second outer electrode 15 of the capacitor element 10 is It will be electrically connected to the sixth mounting terminal 45'. Further, in the case of such a configuration, the first terminal electrode 24 of the diode element 20 is electrically connected to the seventh mounting terminal 46′, and the second terminal electrode 25 of the diode element 20 is also formed. Will be electrically connected to the eighth mounting terminal 47'. Therefore, the fifth mounting terminal 44 ′, the sixth mounting terminal 45 ′, the seventh mounting terminal 46 ′, and the eighth mounting terminal 47 ′ are formed of a wiring board or the like as an object to be mounted by using a bonding material such as solder. The composite electronic component 1C1 can be mounted by being bonded to the land provided on the.

Therefore, even in the case of the above configuration, the same effect as the effect described in the third embodiment can be obtained.

(Ninth Modification)
26 and 27 are schematic cross-sectional views of a composite electronic component 1C2 according to the ninth modification. Hereinafter, with reference to FIGS. 26 and 27, a composite electronic component 1C2 according to a ninth modification based on the above-described third embodiment will be described.

As shown in FIGS. 26 and 27, the composite electronic component 1C2 according to the ninth modified example has a capacitor element 10 and a diode element in the height direction H when compared with the composite electronic component 1C1 according to the eighth modified example described above. The configuration is different only in that the positions of 20 and 20 are interchanged.

Specifically, in the composite electronic component 1C2 according to this modification, the diode element 20 is arranged so as to face the first main surface 11a1 of the pair of main surfaces of the capacitor element 10, and The second main surface 11a2 of the element 10 that does not face the diode element 20 serves as a mounting surface when mounting the composite electronic component 1C2.

With this configuration, the second main surface 11a2 of the capacitor element 10 that does not face the diode element 20 can be used as a mounting surface, and the same mounting mode as when mounting a normal four-terminal electronic component can be achieved. Can be implemented. Therefore, by adopting the configuration, it is possible to obtain the same effect as that described in the third embodiment.

(Embodiment 4)
FIG. 28 is a perspective view of composite electronic component 1D according to the fourth embodiment of the present invention. 29 is a schematic cross-sectional view taken along line XXIX-XXIX of the composite electronic component 1D shown in FIG. 28, and FIG. 30 is a diagram showing an equivalent circuit of the composite electronic component shown in FIG. In addition, FIG. 31 is a schematic cross-sectional view of a mounting body 100 including the composite electronic component 1D shown in FIG. 28 to 31, the composite electronic component 1D and the mounting body 100 including the same according to the present embodiment will be described below.

As shown in FIGS. 28 and 29, the composite electronic component 1D according to the present embodiment is different from the composite electronic component 1A according to the above-described Embodiment 1 in that the second external electrode 15 of the capacitor element 10 and the diode element. The configuration is mainly different in that the second terminal electrode 25 of No. 20 is not joined.

Specifically, in the composite electronic component 1D according to the present embodiment, the first terminal electrode 24 and the second terminal electrode 25 are exposed from the pair of main surfaces facing each other in the height direction H of the diode element 20. The main surface of the capacitor element 10 does not face the first main surface 11a1 of the capacitor element 10 (that is, the main surface on which the first terminal electrode 24 and the second terminal electrode 25 are not provided is the first surface of the capacitor element 10). The diode element 20 is arranged so as to face the main surface 11a1).

Connection conductors 28a and 28b are provided on the outer surface of the sealing portion 22 of the diode element 20 so as to be separated from each other in the length direction L. The connection conductor 28a extends from the main surface of the diode element 20 where the first terminal electrode 24 is provided to the main surface of the diode element 20 facing the capacitor element 10 via one end surface of the diode element 20. It is located in a row. The connection conductor 28b is located so as to be continuous from the main surface of the diode element 20 in the portion where the second terminal electrode 25 is provided to the other end surface of the diode element 20.

As a result, the portion of the first external electrode 14 located on the first major surface 11a1 of the capacitor element 10 and the connecting conductor 28a of the diode element 20 face each other in the height direction H, and the bonding material 50a is applied. The first external electrode 14 is electrically connected to the first terminal electrode 24 by connecting these parts via the first external electrode 14.

On the other hand, the second external electrode 15 in the portion located on the first main surface 11a1 of the capacitor element 10 and the main surface of the diode element 20 in the portion opposite to the second external electrode 15 are bonded by the insulating adhesive 60. As a result, the second external electrode 15 of the capacitor element 10, the second terminal electrode 25 of the diode element 20 and the connecting conductor 28b connected thereto are not joined, and they are in a state of being separated from each other. ..

With this structure, the second external electrode 15 of the capacitor element 10 and the connecting conductor 28b of the diode element 20 can be used as the mounting terminal electrode. Therefore, composite electronic component 1D in the present embodiment has an equivalent circuit as shown in FIG. 30 having two mounting terminal electrodes on a wiring board or the like as a mounted object.

More specifically, as shown in FIG. 31, the composite electronic component 1D according to the present embodiment includes a second external electrode 15 of the capacitor element 10 and a second terminal electrode 25 of the diode element 20 of the composite electronic component 1D. Since the end surface on the side where is located can be used as a mounting surface, these are individually bonded to the first land 111 and the second land 112 provided on the wiring board 110 by using a bonding material such as solder. The composite electronic component 1D is mounted on the wiring board 110.

In the mounting body 100 in which the composite electronic component 1D is mounted in this manner, the length direction L, which is the longitudinal direction of the composite electronic component 1D having the elongated substantially rectangular parallelepiped shape, stands up along the normal direction of the wiring board 110. Since it is mounted in this state, the mounting area can be reduced also in this sense.

According to the composite electronic component 1D having the above configuration, the capacitor element 10 and the diode element 20 are stacked in the height direction H, and they are bonded using the bonding material 50a while being bonded using the insulating adhesive 60. The capacitor element 10 and the diode element 20 can be integrated with a simple configuration. Therefore, it becomes possible to easily manufacture a composite electronic component satisfying desired specifications while ensuring a high degree of freedom in design.

Further, in the case of the composite electronic component 1D having the above-described configuration, the mounting area obtained by integrating the capacitor element 10 and the diode element 20 is reduced (high integration of electronic components on a wiring board or the like as a mounted object). In addition to the above effect, the effect of reducing the mounting area by mounting in the upright state described above can be obtained.

Therefore, by using the composite electronic component 1A according to the present embodiment, the composite electronic component can be designed and manufactured with a high degree of freedom while satisfying desired specifications, and further, the mounting area can be further reduced. be able to.

(Embodiment 5)
FIG. 32 is a perspective view of composite electronic component 1E according to the fifth embodiment of the present invention. 33 to 35 are schematic sectional views taken along line XXXIII-XXXIII, line XXXIV-XXXIV and line XXXV-XXXV of composite electronic component 1E shown in FIG. 32, respectively. 36 is a diagram showing an equivalent circuit of the composite electronic component shown in FIG. 32. 32 to 36, the composite electronic component 1E in the present embodiment will be described below.

As shown in FIGS. 32 to 35, the composite electronic component 1E in the present embodiment is a composite electronic device in which different types of capacitor elements and diode elements are combined when compared with composite electronic component 1A in the first embodiment described above. In that respect, the configuration is mainly different.

Specifically, the capacitor element 10 is composed of a laminated ceramic capacitor generally called an array type, and has two capacitor elements 10A and 10B electrically independent from each other. Further, the diode element 20 is one in which two semiconductor chips 21A and 21B are integrated and sealed by a sealing portion 22 made of resin.

The capacitor element 10 has a capacitor body 11, and two first outer electrodes 14 and two second outer electrodes 15 provided on the outer surface of the capacitor body 11. The two first external electrodes 14 are arranged on the first end surface 11b1 of the capacitor body 11 so as to be separated from each other in the width direction W, and the two second external electrodes 15 are arranged on the second end surface 11b2 of the capacitor body 11 in width. They are spaced apart from each other in the direction W. Each of the two first external electrodes 14 and the two second external electrodes 15 is provided so as to reach a part of the first main surface 11a1 and a part of the second main surface 11a2.

Inside a part of the capacitor body 11 located between the first outer electrode 14 of one of the two first outer electrodes 14 and the second outer electrode 15 of one of the two second outer electrodes 15. Are laminated such that each of the plurality of conductor layers 13 is sandwiched by the dielectric layers 12. Part of the plurality of conductor layers 13 is connected to the one first outer electrode 14, and the remaining part of the plurality of conductor layers 13 is connected to the one second outer electrode 15. It is connected.

Inside the part of the capacitor body 11 located between the other first external electrode 14 of the two first external electrodes 14 and the other second external electrode 15 of the two second external electrodes 15. The plurality of conductor layers 13 electrically independent of the above-described plurality of conductor layers 13 are laminated in such a manner that each of the conductor layers 13 is sandwiched between the dielectric layers 12. A part of the separate plurality of conductor layers 13 is connected to the other first outer electrode 14, and a remaining part of the separate plurality of conductor layers 13 is the second part of the other conductor layer 13. It is connected to the external electrode 15.

The diode element 20 is formed by sealing the above-described two semiconductor chips 21A and 21B so as to be aligned in the width direction W by the sealing portion 22, and on one of the pair of main surfaces of the diode element 20, The first terminal electrode 24 and the second terminal electrode 25 of each of the two semiconductor chips 21A and 21B are configured to be exposed.

Here, as shown in FIGS. 33 to 35, the two first external electrodes 14 in the portion located on the first main surface 11a1 of the capacitor element 10 and the two first terminal electrodes 24 of the diode element 20 are , And are joined in association with each other by the joining material 50a. In addition, the two second external electrodes 15 of the portion located on the first main surface 11a1 of the capacitor element 10 and the two second terminal electrodes 25 of the diode element 20 are associated with each other and joined by the joining material 50b. ing.

In the composite electronic component 1E according to the present embodiment described above, the second main surface 11a2 of the capacitor element 10 that does not face the diode element 20 can be used as a mounting surface, and when a normal array type capacitor element is mounted. It can be mounted in the same mounting mode. As a result, the composite electronic component 1E in the present embodiment has four mounting terminal electrodes on a wiring board or the like as a mounted object, and has an equivalent circuit as shown in FIG.

According to the composite electronic component 1E having the above-described configuration, the capacitor element 10 and the diode element 20 are laminated in the height direction H, and the capacitor element 10 and the diode element 20 are joined together by using the joining materials 50a and 50b. The diode element 20 can be integrated. Therefore, it becomes possible to easily manufacture a composite electronic component satisfying desired specifications while ensuring a high degree of freedom in design.

Further, in the case of the composite electronic component 1E having the above configuration, the mounting area obtained by integrating the capacitor element 10 and the diode element 20 is reduced (high integration of electronic components on a wiring board or the like as a mounted object). In addition to the above effect, the effect of reducing the mounting area obtained by integrating the two capacitor elements 10A and the two semiconductor chips 21A and 21B can be obtained.

Therefore, by using the composite electronic component 1E according to the present embodiment, it is possible to design and manufacture with a high degree of freedom while satisfying the desired specifications, and further to reduce the mounting area. You can

(Embodiment 6)
FIG. 37 is a perspective view of the composite electronic component according to the sixth embodiment of the present invention. Hereinafter, referring to FIG. 37, the composite electronic component 1F in the present embodiment will be described.

As shown in FIG. 37, the composite electronic component 1F in the present embodiment differs from the composite electronic component 1C2 according to the ninth modification described above only in the shape of the seventh mounting terminal 46′. There is.

Specifically, the seventh mounting terminal 46' has notches 46a at predetermined positions on both ends in the length direction L thereof. By providing the cutout portion 46a, a wide portion, a narrow portion, and a wide portion are sequentially arranged in the seventh mounting terminal 46' as a conductive path along the extending direction thereof. It will be.

In the composite electronic component 1F according to the present embodiment configured as described above, based on the shape of the seventh mounting terminal 46′ as described above, the inductance is generated at the seventh mounting terminal 46′, and the coil element ( It has a so-called L component). Therefore, by adopting the configuration, as described in the ninth modification, it is possible to design and manufacture with a high degree of freedom while satisfying the desired specifications, and further it is possible to reduce the mounting area. Not only can it be a composite electronic component, but it is also possible to add further degrees of freedom in circuit design.

Not only the seventh mounting terminal 46', but also the eighth mounting terminal 47' can have the same shape as the seventh mounting terminal 46', and further, the fifth mounting terminal 44' and Also for the sixth mounting terminals 45', these may have a shape similar to that of the seventh mounting terminals 46'.

(Embodiment 7)
FIG. 38 is a schematic cross-sectional view of composite electronic component 1G according to the seventh embodiment of the present invention. 39 is a diagram showing an equivalent circuit of the composite electronic component shown in FIG. 38. The composite electronic component 1G in the present embodiment will be described below with reference to FIGS. 38 and 39.

As shown in FIG. 38, composite electronic component 1G of the present embodiment is different from composite electronic component 1A of the first embodiment described above in that resistance element 30 is provided instead of diode element 20. Only their configurations are different.

Specifically, the composite electronic component 1G in the present embodiment includes the capacitor element 10 as the first electronic component and the resistance element 30 as the second electronic component. The capacitor element 10 and the resistor element 30 are laminated by being laminated on each other, and are integrated by using the bonding materials 50a and 50b.

The resistance element 30 has a substantially flat plate shape having a predetermined thickness. In the present embodiment, the dimensions of the four sides of resistance element 30 along the length direction L shown in the figure are larger than the dimensions of the four sides of resistance element 30 along the width direction W shown in the figure. The substantially flat plate shape referred to here is one in which the corners and ridges of the resistance element 30 are partially or entirely rounded, or the surface of the resistance element 30, that is, part or all of the six surfaces, has steps or Those including unevenness and the like are included.

The resistance element 30 has an insulative base 31, and a resistor 32, a first terminal electrode 34, and a second terminal electrode 35 provided on one main surface of the insulative base 31. The first terminal electrode 34 and the second terminal electrode 35 are separated from each other in the length direction L, and the resistor 32 is provided so as to straddle the first terminal electrode 34 and the second terminal electrode 35.

The base 31 has a flat plate shape and is made of, for example, a resin material such as an epoxy resin or a ceramic material such as alumina, or a material in which a filler or a woven fabric made of an inorganic material or an organic material is added thereto. To be done. Preferably, an alumina substrate or a ceramic substrate including a low temperature co-fired ceramic (LTCC) substrate can be used as the base 31.

The resistor 32 has, for example, a rectangular film shape in a plan view. As the resistor 32, for example, a metal film, a metal oxide film, a metal glaze film which is a mixture of a metal oxide film and glass, or the like can be used. The resistor 32 may be covered with an insulating protective film made of, for example, a glass material or a resin material.

The resistance element 30 has a pair of main surfaces facing each other in the height direction H, a pair of end surfaces facing each other in the length direction L, and a pair of side surfaces facing each other in the width direction W. In the present embodiment, the first terminal electrode 34 and the second terminal electrode 35 described above are provided on one of the pair of main surfaces of the resistance element 30, and the first terminal electrode 34 and the second terminal electrode 35 are provided. The main surface provided with the two-terminal electrode 35 faces the first main surface 11a1 of the capacitor element 10.

Here, the first external electrode 14 of the portion located on the first main surface 11a1 of the capacitor element 10 and the first terminal electrode 34 of the resistance element 30 are opposed to each other in the height direction H. One facing portion is configured. In the first facing portion, a bonding material 50a made of, for example, solder is located so as to be interposed between the first external electrode 14 and the first terminal electrode 34, and the first external electrode is bonded by the bonding material 50a. 14 and the first terminal electrode 34 are joined. Thereby, the first external electrode 14 is electrically connected to the first terminal electrode 34.

Further, the second external electrode 15 of the portion located on the first main surface 11a1 of the capacitor element 10 and the second terminal electrode 35 of the resistance element 30 face each other in the height direction H, and the second The facing portion is configured. In the second facing portion, a joining material 50b made of, for example, solder is located so as to be interposed between the second outer electrode 15 and the second terminal electrode 35, and the second outer electrode is formed by the joining material 50b. 15 and the second terminal electrode 35 are joined. As a result, the second external electrode 15 is electrically connected to the second terminal electrode 35.

The composite electronic component 1G in the present embodiment described above can use the second main surface 11a2 of the capacitor element 10 that does not face the resistance element 30 as a mounting surface, and mounts a normal two-terminal type capacitor element. It can be mounted in the same mounting manner as the case. That is, the first external electrode 14 and the second external electrode 15 provided on the capacitor element 10 can be used as mounting terminal electrodes, and each of these can be used as a wiring board or the like as an object to be mounted by using a bonding material such as solder. The composite electronic component 1G can be mounted by being joined to the provided land.

As a result, the composite electronic component 1G in the present embodiment has two mounting terminal electrodes for mounting on a wiring board or the like as a mounted object, and has an equivalent circuit as shown in FIG.

According to the composite electronic component 1G having the above-described configuration, the capacitor element 10 and the resistance element 30 are stacked in the height direction H, and the capacitor element 10 and the resistance element 30 are laminated with each other by using the joining materials 50a and 50b. The resistance element 30 can be integrated. Therefore, it becomes possible to easily manufacture a composite electronic component satisfying desired specifications while ensuring a high degree of freedom in design.

Further, in the case of the composite electronic component 1G having the above-described configuration, the mounting area obtained by integrating the capacitor element 10 and the resistance element 30 is reduced (high integration of electronic components on a wiring board or the like as a mounted object). The effect of will naturally be obtained.

Therefore, by using the composite electronic component 1G according to the present embodiment, it is possible to design and manufacture with a high degree of freedom while satisfying desired specifications, and further to reduce the mounting area. You can
The summary of the composite electronic component according to the embodiment of the present invention described above is as follows.
The composite electronic component includes a first electronic component and a second electronic component. The first electronic component is composed of a capacitor element having a capacitor body in which a dielectric layer and a conductor layer are laminated, and a first external electrode and a second external electrode provided on the outer surface of the capacitor body. The first external electrode and the second external electrode are located apart from each other in the length direction orthogonal to the stacking direction of the dielectric layer and the conductor layer. The second electronic component is stacked on the first electronic component in the height direction orthogonal to the length direction.
In the composite electronic component, the second electronic component may have a first terminal electrode and a second terminal electrode connected to the functional portion of the second electronic component on the outer surface, in which case In addition, the first terminal electrode may be electrically connected to the first external electrode.
In the composite electronic component, it is preferable that the first external electrode and the first terminal electrode have a first facing portion that faces each other in the height direction. It is preferable that the first external electrode and the first terminal electrode are joined to each other at the facing portion.
The composite electronic component may further include a first mounting terminal facing at least one of the first external electrode and the first terminal electrode, in which case the first external electrode and the first external terminal. The terminal electrode may be electrically connected to the first mounting terminal.
In the composite electronic component, the second terminal electrode may be electrically connected to the second external electrode.
In the composite electronic component, it is preferable that the second external electrode and the second terminal electrode have a second facing portion that faces each other in the height direction. It is preferable that the second external electrode and the second terminal electrode are joined to each other at the facing portion.
The composite electronic component may further include a second mounting terminal facing at least one of the second external electrode and the second terminal electrode, in which case the second external electrode and the second external electrode. The terminal electrode may be electrically connected to the second mounting terminal.
In the composite electronic component, the second electronic component may have a first terminal electrode and a second terminal electrode connected to a functional portion of the second electronic component on an outer surface, The first electronic component covers a first side surface that is one of a pair of side surfaces of the capacitor body that is orthogonal to the length direction and parallel to the height direction, and the first external electrode and the second outer surface. It may have a third external electrode that is not connected to the electrode. In that case, the first terminal electrode may be electrically connected to the third external electrode.
In the composite electronic component, it is preferable that the third external electrode and the first terminal electrode have a third facing portion that faces each other in the height direction. In that case, the third external electrode It is preferable that the third external electrode and the first terminal electrode are joined to each other at the facing portion.
The composite electronic component may further include a third mounting terminal facing at least one of the third external electrode and the first terminal electrode, and in that case, the third external electrode and the first external terminal. The terminal electrode may be electrically connected to the third mounting terminal.
In the composite electronic component, the first electronic component covers a second side surface which is the other of the pair of side surfaces of the capacitor body, and the first electronic electrode and the second external electrode are not covered. You may have the 4th external electrode which is a connection, and in that case, the said 2nd terminal electrode may be electrically connected to the said 4th external electrode.
In the composite electronic component, it is preferable that the fourth external electrode and the second terminal electrode have a fourth facing portion that faces each other in the height direction. It is preferable that the fourth external electrode and the second terminal electrode are joined to each other at the facing portion.
The composite electronic component may further include a fourth mounting terminal facing at least one of the fourth external electrode and the second terminal electrode, wherein the fourth external electrode and the second terminal electrode are It may be electrically connected to the fourth mounting terminal.
In the composite electronic component, the second electronic component includes a first terminal electrode and a second terminal electrode connected to a functional portion of the second electronic component, and a third terminal electrode not connected to the functional portion. May be provided on the outer surface, and in that case, the first external electrode may be electrically connected to the third terminal electrode.
In the composite electronic component, it is preferable that the first external electrode and the third terminal electrode have a fifth facing portion that faces each other in the height direction. It is preferable that the first external electrode and the third terminal electrode are joined to each other at the facing portion.
In the composite electronic component, the second electronic component may have a fourth terminal electrode that is not connected to the functional unit on the outer surface, in which case the second external electrode is It may be electrically connected to the fourth terminal electrode.
In the composite electronic component, it is preferable that the second external electrode and the fourth terminal electrode have a sixth facing portion that faces each other in the height direction. It is preferable that the second external electrode and the fourth terminal electrode are joined to each other at the facing portion.
In the composite electronic component, the second electronic component includes a first terminal electrode and a second terminal electrode connected to a functional portion of the second electronic component, and a third terminal electrode not connected to the functional portion. And a fourth terminal electrode may be provided on the outer surface. In that case, the composite electronic component faces the fifth mounting terminal facing the first external electrode and the second external electrode. It may further include a sixth mounting terminal, a seventh mounting terminal facing the first terminal electrode, and an eighth mounting terminal facing the second terminal electrode. In that case, the first external electrode may be electrically connected to the fifth mounting terminal, and the second external electrode may be electrically connected to the sixth mounting terminal. Alternatively, the first terminal electrode may be electrically connected to the seventh mounting terminal, and the second terminal electrode may be electrically connected to the eighth mounting terminal. ..
In the composite electronic component, the second electronic component may be a diode element.
In the composite electronic component, the second electronic component may be a resistance element.

In the above-described embodiments of the present invention and the modifications thereof, the description has been given by exemplifying the case where the laminated ceramic capacitor is used as the capacitor element incorporated in the composite electronic component, but other types are used instead of the laminated ceramic capacitor. The capacitor element may be incorporated in the composite electronic component.

Further, the characteristic configurations shown in the above-described embodiments of the present invention and the modifications thereof can naturally be combined with each other without departing from the spirit of the present invention.

As described above, the above-described embodiments and their modifications disclosed this time are exemplifications in all respects, and are not restrictive. The technical scope of the present invention is defined by the claims, and includes the meaning equivalent to the description of the claims and all modifications within the scope.

1A, 1A1 to 1A5, 1B, 1B1, 1B2, 1C, 1C1, 1C2, 1D to 1G Composite electronic component, 10 Capacitor element, 10A, 10B Capacitor element, 11 Capacitor body, 11a1 First main surface, 11a2 Second main surface , 11b1 first end face, 11b2 second end face, 11c1 first side face, 11c2 second side face, 12 dielectric layer, 13 conductive layer, 14 first outer electrode, 15 second outer electrode, 16 third outer electrode, 17 4th external electrode, 20 diode element, 21, 21A, 21B semiconductor chip, 22 sealing part, 22a recessed part, 24 1st terminal electrode, 25 2nd terminal electrode, 26 3rd terminal electrode, 27 4th terminal electrode, 28a , 28b connection conductor, 30 resistance element, 31 base, 32 resistor, 34 first terminal electrode, 35 second terminal electrode, 44 first mounting terminal, 44′ fifth mounting terminal, 45 second mounting terminal, 45' 6th mounting terminal, 46 3rd mounting terminal, 46' 7th mounting terminal, 46a Notch part, 47 4th mounting terminal, 47' 8th mounting terminal, 50a-50h Joining material, 60 Insulating adhesive, 100 mounting body, 110 wiring board, 111 first land, 112 second land.

Claims (4)

A first electronic component,
And a second electronic component,
The first electronic component comprises a capacitor element having a capacitor body in which a dielectric layer and a conductor layer are laminated, and a first external electrode and a second external electrode provided on the outer surface of the capacitor body.
The first external electrode and the second external electrode are located apart from each other in a length direction orthogonal to a stacking direction of the dielectric layer and the conductor layer,
The second electronic component is stacked on the first electronic component in a height direction orthogonal to the length direction ,
The second electronic component has a first terminal electrode and a second terminal electrode connected to a functional portion of the second electronic component,
The first terminal electrode and the second terminal electrode are opposite to a back surface, which is a main surface facing the first electronic component, of a pair of main surfaces facing each other in the height direction of the second electronic component. It is provided so as to be exposed on the front surface, which is the main surface of the side.
In the second electronic component, from the front surface of the portion provided so that the first terminal electrode is exposed, via one end face in the length direction of the second electronic component, The first connecting conductor is provided so as to be continuous to the back surface of the portion facing the first electronic component, and the front surface of the portion provided so that the second terminal electrode is exposed is A second connecting conductor is provided so as to be continuous with the other end surface of the second electronic component in the length direction,
The first external electrode and the first connecting conductor are bonded together via a conductive bonding material, and the second external electrode and the back surface of the second electronic component are bonded by an insulating adhesive. As a result, the first electronic component and the second electronic component are electrically connected in series, and the first electronic component and the second electronic component are integrated with each other . The composite electronic component according to claim 1, wherein the second electronic component is a diode element. The composite electronic component according to claim 1, wherein the second electronic component is a resistance element. A composite electronic component according to any one of claims 1 to 3,
A wiring board provided with a first land and a second land,
The second external electrode is bonded to the first land by using a conductive bonding material, and the second connecting conductor is bonded to the second land by using a conductive bonding material, so that the composite electron A mounting body in which a component is mounted in a standing state with respect to the wiring board such that the length direction is along a normal direction of the wiring board.

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