JP6687436B2 - Substrate processing apparatus and substrate processing method - Google Patents

Description

  Embodiments of the present invention relate to a substrate processing apparatus and a substrate processing method.

  The substrate processing apparatus is an apparatus that supplies a processing liquid to the surface of a substrate such as a wafer or a liquid crystal substrate to wash the substrate surface, for example, and then dry the substrate surface in the manufacturing process of semiconductors and the like.

  By the way, in recent years, as the degree of pattern miniaturization has advanced with the increase in the integration and the capacity of semiconductors, for example, in the drying process using the substrate processing apparatus described above, for example, the pattern around the memory cell or the gate collapses. There is a problem. This is due to the distance between the patterns, the structure, the surface tension of the treatment liquid, and the like.

  Therefore, a substrate drying device using a halogen lamp has been proposed for the purpose of suppressing the collapse of the above-described pattern (see, for example, Patent Document 1), and IPA on the substrate surface is used as a liquid ball, and the liquid ball is used. The substrate may be dried by removing the.

JP, 2015-29041, A

  According to the processing method using such a substrate drying apparatus, pattern collapse is suppressed, and good drying processing can be performed. By the way, in order to protect the heating means such as a halogen lamp from the processing liquid, a transmission window may be arranged between the heating means and the substrate. In this case, of course, the transmission window is also heated by the heating means. When the temperature of the transmission window becomes high due to repeated processing, the surface of the substrate is nonuniformly dried when the substrate is loaded into the drying processing chamber, which causes water marks or patterns. It turns out that a collapse will occur.

  An object to be solved by the present invention is to provide a substrate processing apparatus and a substrate processing method capable of suppressing the occurrence of watermarks and pattern collapse and performing excellent substrate processing.

The substrate processing apparatus according to the embodiment,
In the substrate processing apparatus to which the processing liquid is supplied,
A chamber,
Holding means provided in the chamber for holding the substrate;
Heating means for heating the substrate held by the holding means,
A transmission window that is provided so as to face the heating means and that transmits the light emitted from the heating means,
Cooling means for cooling the transparent window with a cooling fluid,
Control means for operating the cooling means when heating by the heating means is not performed,
The cooling means is
A cooling fluid ejecting unit that supplies the cooling fluid toward the transparent window;
A cooling fluid supply unit that supplies the cooling fluid to the cooling fluid ejection unit;
Have
The cooling fluid jetting unit,
A plurality of nozzles arranged to face the transmission window,
Have,
The heating means has a plurality of lamps arranged at a predetermined interval,
The plurality of nozzles, in the gap between the plurality of lamps, the discharge port is arranged toward the transmission window,
The height position of the discharge port is in the vertical direction, and is located between the center height position of the lamp and the height position of the upper surface of the transmission window.

The substrate processing method according to the embodiment,
In the method of processing a substrate whose surface is supplied with a processing liquid,
Holding the substrate contained in a chamber;
Heating the substrate held in the chamber with a lamp through a transmissive window;
Cooling the transparent window with a cooling fluid when the step of heating the substrate is not performed,
In the step of cooling the transmission window with the cooling fluid, the cooling fluid is discharged from a height position between a central height position of the lamp and a height position of an upper surface of the transmission window.

  According to the present invention, it is possible to suppress the occurrence of watermarks and pattern collapse, and perform good substrate processing.

It is a figure which shows the whole schematic structure of the substrate processing apparatus which concerns on 1st Embodiment. It is a figure which shows schematic structure of the processing chamber of the substrate processing apparatus which concerns on 1st Embodiment. It is a figure which shows schematic structure of the dry processing chamber of the substrate processing apparatus which concerns on 1st Embodiment. It is a figure which shows schematic structure of the heating means and cooling means of the dry processing chamber of the substrate processing apparatus which concerns on 1st Embodiment. It is a figure for demonstrating the arrangement structure of the heating means and the cooling means in the dry processing chamber of the substrate processing apparatus which concerns on 1st Embodiment. It is a figure for demonstrating the arrangement structure of the heating means and the cooling means in the dry processing chamber of the substrate processing apparatus which concerns on 1st Embodiment. It is a figure which shows schematic structure of the buffer part of the substrate processing apparatus which concerns on 2nd Embodiment. It is a figure which shows schematic structure of the buffer part of the substrate processing apparatus which concerns on 3rd Embodiment. It is a figure which shows the shutter structure in the buffer part of the substrate processing apparatus which concerns on 3rd Embodiment. It is a figure which shows the structure in the buffer part of the substrate processing apparatus which concerns on 3rd Embodiment. It is a figure which shows schematic structure of the dry processing chamber of the substrate processing apparatus which concerns on 4th Embodiment. It is a figure which shows schematic structure of the dry processing chamber of the substrate processing apparatus which concerns on 5th Embodiment.

  As shown in FIG. 1, the substrate processing apparatus 1 according to the first embodiment includes a FOUP 2 in which an unprocessed substrate W is stored, a FOUP mounting table 3 on which the FOUP 2 is mounted, and a FOUP 2 mounted in the FOUP 2. The transfer robot 4 for taking out the substrate W to be processed, the transfer rail 5 on which the transfer robot 4 moves, the substrate mounting table 6 for mounting the substrate W transferred by the transfer robot 4, and the substrate mounting table 6 are mounted. A transfer robot 7 that transfers the substrate W to a processing chamber 10 and a drying processing chamber 30 described later, a transfer rail 8 on which the transfer robot 7 moves, a processing chamber 10 that executes a process with a processing liquid, and a process in the processing chamber 10. And a drying processing chamber 30 for drying the processed substrate W.

  FIG. 2 shows the configuration of the processing chamber 10. In the processing chamber 10, there is a turntable 11 which is a holding means for holding the substrate W horizontally. The rotary table 11 is connected to a rotary shaft 12 and a motor 13, and the rotary table 11 can be rotated by the rotating operation of the motor 13. The motor 13 is electrically connected to the control unit 100, and rotates in the arrow I direction shown in FIG. 2 at the rotation speed set by a command from the control unit 100. The holding pin 14 has a structure (not shown) capable of eccentric rotation, and the holding pin 14 rotates eccentrically so that the holding pin 14 comes into contact with the end portion of the substrate W loaded into the processing chamber 10 to hold the substrate. It has become.

  The cup 15 plays a role of collecting the processing liquid supplied to the processing surface of the substrate W rotated by the rotary table 11 and guiding the collected processing liquid to a discharge pipe (not shown). The cup 15 may have a double structure so that the treatment liquid can be separated and collected.

  The arm drive mechanism 16 rotationally drives the swing arm 17. The arm drive mechanism 16 is electrically connected to the control unit 100 and drives the swing arm 17 according to a program set in the control unit 100.

  The processing liquid discharge nozzle 18 is connected to the tip of the swing arm 17, and can be moved horizontally on the substrate W by the operation of the arm drive mechanism 16. The processing liquid discharge nozzle 18 discharges the processing liquid onto the surface of the substrate W, so that the surface of the substrate W can be processed. When processing the substrate W, the processing liquid discharge nozzle 18 is horizontally moved from the standby position toward the center of the substrate W by the operation of the arm driving mechanism 16. The treatment liquid discharge nozzle 18 is connected to a treatment liquid supply pipe (not shown) from the treatment liquid supply unit 40 via the arm drive mechanism 16 and the swing arm 17. A valve (not shown) is installed in the middle of the processing liquid supply pipe. The valve and the processing liquid supply unit 40 are electrically connected to the control unit 100, respectively. The processing liquid is supplied to the processing liquid discharge nozzle 18 by controlling the processing liquid supply unit 40 and the valve by the control unit 100. As this processing liquid, an etching liquid, a cleaning liquid (APM, SC-1), or the like is used.

  The arm drive mechanism 19 is connected so that the swing arm 20 can be rotationally driven. The arm drive mechanism 19 is electrically connected to the control unit 100 and is driven by a program set in the control unit 100.

  The rinse liquid discharge nozzle 21 is connected to the tip of the swing arm 20, and can be moved horizontally on the substrate W by the operation of the arm drive mechanism 19. The rinse liquid R is discharged onto the surface of the substrate W by the rinse liquid discharge nozzle 21, and the processing liquid discharged from the processing liquid discharge nozzle 18 existing on the surface of the substrate W can be washed away. A rinse liquid supply pipe (not shown) from the rinse liquid supply unit 50 is connected to the rinse liquid discharge nozzle 21 via the arm drive mechanism 19 and the swing arm 20. A valve (not shown) is set in the middle of the rinse liquid supply pipe. The valve and the rinse liquid supply unit 50 are electrically connected to the control unit 100, respectively. The controller 100 controls the rinse liquid supply unit 50 and the valve to supply the rinse liquid R to the rinse liquid discharge nozzle 21. As the rinse liquid R, ultrapure water is used. In addition to ultra-pure water, IPA (isopropyl alcohol) may be used as the rinse liquid R, and a nozzle or a supply source for discharging IPA may be provided in addition to the rinse liquid discharge nozzle 21.

  The transport door 22 opens and closes a loading port for loading the substrate W onto the turntable 11 by the transport robot 7. The transport door 22 can be opened and closed by being provided so that it can be raised and lowered by a raising and lowering mechanism (not shown). That is, the transfer door 22 is lowered by the operation of the elevating mechanism, so that the transfer robot 7 can carry the substrate W in and out of the processing chamber 10. The lifting mechanism is electrically connected to the control unit 100, and the lifting operation is controlled by the control unit 100.

  FIG. 3 shows the structure of the dry processing chamber 30. The dry processing chamber 30 includes a lamp chamber 60 that houses a lamp 61 as a drying unit and a processing chamber 37 that processes a substrate. In the processing chamber 37, there is a turntable 31 which is a holding means for holding the substrate W horizontally. The rotary table 31 is connected to a rotary shaft 32 and a motor 33, and is configured to be rotatable by the rotating operation of the motor 33. The motor 33 is electrically connected to the control unit 100, and rotates in the arrow I direction shown in FIG. 3 at the rotation speed set by a command from the control unit 100. The holding pin 34 has a structure (not shown) that can be eccentrically rotated, and when the holding pin 34 is eccentrically rotated, the holding pin 34 comes into contact with the end portion of the substrate W carried into the drying processing chamber 30 to move the substrate. Hold.

  The transport door 35 opens and closes a loading port for loading the substrate W onto the turntable 31 by the transport robot 7. The transfer door 35 is provided so as to be able to move up and down by an elevating mechanism (not shown), and opens and closes the carry-in port. In other words, by lowering the transport door 35, the transport robot 7 can load and unload the substrate W into and from the processing chamber 37. The lifting mechanism is electrically connected to the control unit 100, and the lifting operation is controlled by the control unit 100.

  A lamp chamber 60 is provided above the processing chamber 37. In the lamp chamber 60, there are provided a lamp 61 as a heating means, a plurality of nozzles 64 as a cooling means (cooling fluid ejecting section), and a buffer section 63.

  The lamp 61 irradiates the surface of the substrate W on the turntable 31 with light. The lamp 61 is electrically connected to the control unit 100, and the lighting control of the lamp is performed by the control unit 100. Here, as the lamp 61, it is possible to use, for example, a plurality of straight tube type lamps 61 arranged in parallel at a predetermined interval, or an array arrangement (lattice). Further, as the lamp 61, for example, a halogen lamp, a xenon flash lamp (as an example, a flash lamp having a wavelength light of 400 to 1000 nm), a far-infrared heater, or the like can be used.

  A transmission window 62 that transmits the light emitted from the lamp 61 is installed between the processing chamber 37 and the lamp chamber 60. The transparent window 62 is located immediately below the lamp 61 and is provided so as to be supported by the lamp chamber 60. The transmission window 62 prevents particles (metal dust) from adhering to the surface of the substrate W from the lamp chamber 60. Although quartz is used for the transmission window 62 in this embodiment, the transmission window 62 is not limited to quartz and may be any member that transmits light.

  As shown in FIGS. 3 and 4, the buffer portion 63 has a box shape and is connected with the cooling fluid supply portion 70, the pipe 72, and the supply port 73. The cooling fluid G, such as air or nitrogen gas, can be supplied from the cooling fluid supply unit 70 into the buffer unit 63 through the pipe 72 as shown by an arrow N. A valve 71 is provided in the middle of the pipe 72. As shown in FIG. 6, the bottom portion 63 b of the buffer portion 63 is provided with a plurality of supply ports 69 a corresponding to the plurality of nozzles 64, respectively. The supply port 69a and the nozzle 64 are joined so that the cooling fluid G does not leak.

  As shown in FIG. 4, a partition plate 65 is installed in the buffer section 63. The horizontal length of the partition plate 65 is set shorter than the horizontal length of the buffer portion 63. Therefore, a gap A is formed between both ends of the partition plate 65 and the side wall surface 63a of the buffer portion 63.

  The plurality of nozzles 64 are provided on the bottom portion 63b of the buffer portion 63 and are fixed so as to correspond to the plurality of supply ports 69a. The plurality of nozzles 64 are arranged in the gap between the lamps 61 arranged at predetermined intervals. In addition, each nozzle 64 is installed so that the cooling fluid G sent from the cooling fluid supply unit 70 can be supplied toward the transmission window 62 (see FIG. 3). Each nozzle 64 employs a material (for example, aluminum) that does not transmit light from the lamp 61. In addition, the ejection port of each nozzle 64 faces the transmission window 62, and the height position of the ejection port when viewed in the vertical direction (vertical direction in FIG. 4) is the center height position of the lamp 61 and the upper surface of the transmission window 62. It is set so as to be located between the height position and the height position. Further, as shown in FIG. 3, a nozzle 64 is provided so as to face the periphery of the transparent window 62 so that the cooling fluid G can be supplied to the entire transparent window 62. In this embodiment, the nozzle diameter of the plurality of nozzles 64 is 4 mm and the length is 25 mm.

  As shown in FIGS. 4 and 5, the reflector 66 is located between the buffer portion 63 and the lamp 61 and is detachably fixed to the buffer portion 63. A plurality of through holes 69b are formed in the reflector 66, and a plurality of nozzles 64 can be installed on the bottom portion 63b of the buffer portion 63 via the respective through holes 69b. That is, the through hole 69b corresponds to the plurality of supply ports 69a provided in the bottom portion 63b of the buffer portion 63. The reflector 66 reflects the light emitted from the lamp 61 in a direction opposite to the front surface side of the substrate W so as to be directed to the front surface of the substrate W.

  As shown in FIG. 4, the support member 67 is a member that fixes the lamp 61 and the plurality of nozzles 64 to the buffer portion 63. The support member 67 is detachably fixed to the buffer portion 63. Here, the support member 67 and the lamp 61 are fixed by a fixture 67a. The support member 67 and the plurality of nozzles 64 are fixed by a fixture 67a. The support member 67 and the plurality of nozzles 64 may be fixed with an adhesive or the like.

  Returning to FIG. 3, the discharge port 68 discharges the cooling fluid G injected from the plurality of nozzles 64 from the inside of the lamp chamber 60 to the outside. The discharge port 68 is installed on the upper side of the lamp chamber 60, but is not limited to the upper side of the lamp chamber 60 as long as it is a position that does not affect the processing process. In addition, a discharge pump (not shown) may be connected to the discharge port 68 to discharge at a constant discharge amount.

  The control unit 100 that constitutes the control device includes a microcomputer that centrally controls each unit, and a storage unit that stores substrate processing information regarding substrate processing and various programs. The control unit 100 includes transfer robots 4 and 7, motors 13 and 33, arm drive mechanisms 16 and 19, transfer doors 22 and 35, a processing liquid supply unit 40, a rinse liquid supply unit 50, a lamp 61, and a cooling fluid supply unit 70. Etc. are controlled by a predetermined program.

  Next, the substrate processing (substrate processing method) performed by the above-described substrate processing apparatus 1 will be described. It is assumed that the FOUP 2 containing the unprocessed substrate W is set on the FOUP mounting table 3.

  As shown in FIG. 1, the transfer robot 4 moves along the transfer rail 5 and is positioned so as to face the FOUP 2 set on the FOUP mounting table 3. The transfer robot 4 takes out the substrates W stored in the FOUP 2, moves along the transfer rails 5 while holding them, and is positioned so as to face the substrate platform 6. Then, the substrate W is placed on the substrate platform 6 by the transfer robot 4. Then, the transfer robot 7 moves along the transfer rail 8 and is positioned so as to face the substrate platform 6. The transfer robot 7 holds the substrate W placed on the substrate mounting table 6 and moves along the transfer rail 8 while holding the substrate W. The transfer robot 7 is positioned so as to face the processing chamber 10 and loads the substrate W into the processing chamber 10.

  As shown in FIG. 2, the substrate W held by the transfer robot 7 is placed on the turntable 11. At this time, the transport door 22 is open. The substrate W placed on the rotary table 11 is held by the eccentric rotation of the holding pin 14 coming into contact with the end of the substrate W. As a result, the substrate W is rotatably held together with the turntable 11.

  When the substrate W is held on the rotary table 11, an electric signal is transmitted from the control unit 100 to the motor 13, and the motor 13 is rotationally driven at a predetermined rotation speed. The rotary table 11 and the substrate W are rotated by this rotary drive.

  Next, in order to process the surface of the rotating substrate W, the processing liquid discharge nozzle 18 shown in FIG. 2 moves from the position retracted to the outside of the cup 15 (standby position) to the surface of the substrate W. The arm drive mechanism 16 and the swing arm 17 move to the vicinity of the center (processing position).

  When it is determined that the treatment liquid discharge nozzle 18 is set at the treatment position, the control unit 100 sends an electric signal to the treatment liquid supply unit 40. As a result, the processing liquid is supplied from the processing liquid supply unit 40 to the processing liquid discharge nozzle 18. Then, the processing liquid is discharged onto the surface of the substrate W, and when a predetermined time has elapsed, the supply of the processing liquid from the processing liquid supply unit 40 is stopped. When the supply of the processing liquid is stopped, the processing liquid discharge nozzle 18 is moved to the standby position by the arm drive mechanism 16 and the swing arm 17.

  Next, the rinse liquid discharge nozzle 21 is moved from the position retracted to the outside of the cup 15 (standby position) to the vicinity of the center of the surface of the substrate W (processing position) by the arm drive mechanism 19 and the swing arm 20. Moving.

  When the rinse liquid discharge nozzle 21 is moved to the processing position, the control unit 100 sends an electric signal to the rinse liquid supply unit 50. As a result, the rinse liquid R is supplied from the rinse liquid supply unit 50 to the rinse liquid discharge nozzle 21. Then, the rinse liquid R is supplied from the rinse liquid discharge nozzle 21 to the surface of the substrate W, and after a predetermined time has elapsed, the supply from the rinse liquid supply unit 50 is stopped. Here, before the elapse of a predetermined time, the rotation speed of the motor 13 is decelerated, and when the supply of the rinse liquid R is stopped, the rotation is stopped almost at the same time. That is, the process is completed in a state where the rinse liquid R is poured on the entire surface of the substrate W. Further, when the treatment with the rinse liquid R is completed, the rinse liquid discharge nozzle 21 is moved to the standby position by the arm drive mechanism 19 and the swing arm 20. Note that FIG. 2 shows a state in which the rinse liquid R is supplied to the substrate W.

  Next, the substrate W in a state of being filled with the rinse liquid R is carried into the drying processing chamber 30 by the transfer robot 7. Then, the loaded substrate W is placed on the turntable 31 shown in FIG. At this time, the opening / closing door 35 is open, and the substrate W placed on the turntable 31 is held by the holding pins 34 and can be rotated together with the turntable 31.

  After the substrate W is held on the turntable 31, the control unit 100 starts lighting the lamp 61, and at the same time, the motor 33 is driven to rotate the substrate W. As a result, the drying process is started. This drying process is performed by instantly raising the temperature of the substrate W by turning on the lamp 61. The lamp 61 of the embodiment allows the substrate W to reach 100 ° C. or higher in 10 seconds.

  Specifically, the light from the lamp 61 is absorbed only by the substrate W and passes through the rinse liquid R existing on the surface of the substrate W. Thereby, only the substrate W is heated. As a result, the substrate W is instantly heated, and the rinse liquid R in the portion in contact with the surface (including the pattern surface) of the substrate W is instantly vaporized to form a vapor layer. That is, an air layer (space) is formed between the surface of the substrate W and the rinse liquid R. Due to the formation of this gas layer, the rinse liquid R becomes a liquid ball due to the surface tension.

  Then, the rinse liquid R in the form of a liquid droplet is blown off from the surface of the substrate W by the centrifugal force of the rotating substrate W, and as a result, the substrate W is dried. Then, when the drying process is performed for a predetermined time, the drying process ends, both the lighting of the lamp 61 and the rotation of the rotary table 31 are stopped, and the substrate W after the drying process is unloaded from the processing chamber 37 by the transfer robot 7.

  By the way, when the above-mentioned drying process is repeated, the temperature of the transmission window 62 gradually rises. This is due to the influence of light from the lighting of the lamp 61. The light from the lamp 61 contains a wavelength that is absorbed by the transmission window 62, so the transmission window 62 is heated. Since the temperature of the transmission window 62 does not immediately drop, heat is accumulated in the transmission window 62 by repeating the drying process. When this state continues, and when the drying process is performed for a few times, it was confirmed that the temperature of the transmission window 62 was 100 ° C. or higher before the lamp 61 was turned on.

  Since the transparent window 62 is in a high temperature state, the atmosphere in the drying processing chamber 30 is warmed and becomes a high temperature environment. After the substrate W in which the rinse liquid R is piled up is carried into the dry processing chamber 30 in the high temperature environment (before the substrate W is placed on the rotary table 31), before the dry processing by the lamp 61 is started. Then, the surface of the substrate W begins to dry. As a result, the rinse liquid R deposited on the surface of the substrate W is nonuniformly dried, unevenness in drying and the formation of watermarks occur, and the substrate W may become a product defect (collapse of the wiring pattern). confirmed. It is considered that this is because the transparent window 62 does not have a uniform temperature as a whole.

  Therefore, in the present embodiment, the cooling fluid supply unit 70 and the valve 71 are controlled by the control unit 100 at the same time as or after the end of the drying process, and the cooling fluid G is supplied to the buffer unit 63 through the pipe 72. It At this time, the lamp 61 is off. The cooling fluid G supplied to the buffer portion 63 is ejected from the plurality of nozzles 64 toward the transmission window 62. As a result, the entire transmission window 62 is cooled by the cooling fluid G. The cooling fluid G filling the lamp chamber 60 is discharged from the discharge port 68 provided in the buffer 60.

  Then, when the cooling time of the transmission window 62 elapses, the cooling fluid supply unit 70 and the valve 71 are controlled, and the supply of the cooling fluid G is stopped. When this cooling time elapses, the undried substrate W processed in the processing chamber 10 is newly loaded into the processing chamber 37, and the above-described drying processing is executed. In this embodiment, the supply time (cooling time) of the cooling fluid G is set to 50 seconds. This is because the time from the carry-out of the dried substrate W to the carry-in of the next substrate W into the dry processing chamber 30 is set to 50 seconds. Note that this time can be adjusted.

  In the substrate processing apparatus 1 of this embodiment, a plurality of nozzles 64 for directly supplying the cooling fluid G to the transmission window 62 are provided in the gap between the adjacent lamps. The cooling fluid G is directly sprayed from the plurality of nozzles 64 to the transmission window 62 without being blocked by the lamp 61, so that the transmission window 62 is cooled. In other words, when the substrate W is loaded into the processing chamber 37, the temperature of the transmission window 62 is lowered to a temperature at which the surface of the substrate W does not have uneven drying. In this embodiment, the transmission window 62 is cooled to 40 degrees or less.

  In this way, even if the drying process is repeated, the high temperature state of the transmission window 62 is prevented from continuing. This also prevents the atmosphere in the drying processing chamber 30 from becoming a high temperature environment.

  Therefore, even if the drying process is repeatedly performed, since the transmission window 62 is not in a high temperature state (the temperature has dropped to the above-described temperature), the substrate W is transferred while being transferred into the drying process chamber 30. It is possible to prevent the surface of the product from starting to dry. As a result, it is possible to suppress the occurrence of uneven drying, watermarks and the like due to uneven heating of the surface of the substrate W. As a result, it is possible to prevent the occurrence of products in which the pattern has collapsed, which leads to improvement in productivity.

  The cooling fluid G may be jetted from the plurality of nozzles 64 at all times. Alternatively, it may be executed immediately before turning on the lamp 61. Further, instead of performing it each time the drying process of the substrates W is completed, the cooling fluid G may be jetted every time the drying process of the predetermined number of substrates W is completed. In this case, the predetermined number is determined based on the correlation between the number of times of processing obtained by experiments and the temperature of the transmission window 62, and the like.

  The second embodiment will be described with reference to FIG.

  The second embodiment is basically the same as the first embodiment. Therefore, in the second embodiment, differences from the first embodiment will be described, and the same parts as those described in the first embodiment will be denoted by the same reference numerals and description thereof will be omitted.

  The buffer portion 163 shown in FIG. 7 has a main body portion 163a formed in a cylindrical shape and a circular bottom portion 163b corresponding to the cylindrical size. The main body portion 163a is configured so that the lower portion thereof is open and the open portion is closed by the bottom portion 163b. The area of the bottom portion 163b is larger than the size of the substrate W. That is, the size of the buffer portion 163 in the radial direction is a size that covers the surface of the substrate W.

  In the buffer portion 163, a circular shutter 165 is provided above the bottom portion 163b and close to the bottom portion 163b. The shutter 165 is connected to the rotating mechanism 111 in the buffer unit 163, and is rotatable in the arrow F direction. A part of the shutter 165 has a fan-shaped opening E having a central angle of 45 degrees.

  The rotation mechanism 111 includes a motor and a rotation shaft (not shown), and is fixed to the upper portion of the buffer unit 163. Further, the rotation mechanism 111 is electrically connected to the control unit 100, and its rotation is controlled by the control unit 100. The motor of the rotating mechanism 111 is, for example, a servo motor.

  The lamp 61 and the transmissive window 62 are arranged and arranged in a length corresponding to the cylindrical shape of the buffer portion 163. The size is not limited to this, and may be larger than the size corresponding to the buffer unit 163.

  In the second embodiment, the buffer portion 163 is formed in a cylindrical shape, and the rotatable shutter 165 having the opening E is provided inside the buffer portion 163. The cooling fluid G supplied from the supply port 73 is supplied toward the bottom portion 163b of the buffer portion 163. In this process, the cooling fluid G supplied from the supply port 73 is once supplied to the shutter 165, passes through the opening E, and is supplied to the supply port 69a at a position facing the opening E. That is, the cooling fluid G is supplied to the nozzle 64 at a position facing the opening E, and the cooling fluid G is ejected from the nozzle 64, whereby the transmission window 62 is cooled. Therefore, the second embodiment also has the same effect as that of the first embodiment. The timing at which the cooling fluid G is ejected from the nozzle 64 is the same as in the first embodiment.

  Further, when the shutter 165 is rotated in the arrow F direction by the rotation mechanism 111, the opening E also moves. When the rotation mechanism 111 is rotationally controlled, the nozzle 64 that injects the cooling fluid G to the transmission window 62 among the plurality of nozzles 64 changes. That is, it is possible to inject the cooling fluid G toward the transparent window 62 while changing the cooling position (injection position) in the transparent window 62. The rotation control may be seamless rotation, or rotation and stop may be repeated intermittently.

  Further, according to the present embodiment, by providing the opening E in the shutter 165, the cooling fluid G having a high flow velocity can be supplied from the plurality of nozzles 64. This is because when the cooling fluid G is supplied from the supply port 73 into the buffer portion 163, the cooling fluid G once spreads into the buffer portion 163 and is then concentratedly supplied to the opening E. , And is supplied to the corresponding nozzle 64 via the supply port 69a facing the opening E. In this way, the cooling fluid G having a high flow velocity can be jetted from the plurality of nozzles 64 to the transmission window 62. When the flow velocity of the cooling fluid G is increased, the cooling efficiency of the transmission window 62 is improved, and the high temperature atmosphere around the transmission window 62 can be efficiently discharged to the outside of the buffer unit 163. It is possible to prevent the temperature inside the lamp chamber 60 from becoming high.

  A third embodiment will be described with reference to FIGS. 8 to 10.

  The third embodiment is basically the same as the second embodiment. Therefore, in the third embodiment, differences from the second embodiment will be described, the same parts as those described in the second embodiment will be denoted by the same reference numerals, and description thereof will be omitted.

  As shown in FIGS. 8 and 9C, the main body portion 163a and the bottom portion 163b forming the buffer portion 170 have the same configuration as that of the second embodiment described above. A circular shutter 265 (see FIG. 9A) corresponding to the shape of the buffer unit 170 and a circular shutter 365 (see FIG. 9B) are accommodated in the buffer unit 170.

  At the center of the shutter 265, a through hole 266 to which the rotating shaft of the rotating mechanism 111 is joined is provided. The rotating mechanism 111 allows the shutter 265 to rotate. The size of the shutter 265 is set to be slightly smaller than the inner diameter of the main body 163a so that the shutter 265 can rotate in the buffer 163. Further, as shown in FIG. 9A, the shutter 265 has a supply port 267 which is a hole through which the cooling fluid G passes. It should be noted that the supply ports 267 are arranged so as to be lined up on two diameters of the shutter 265 which are orthogonal to each other. The supply ports 267 are installed at a distance a from the center of the through hole 266, and the intervals between the supply ports 267 are also set at the distance a, that is, at equal intervals.

  At the center of the shutter 365, a through hole 366 through which the rotating shaft of the rotating mechanism 111 penetrates is provided. A bearing (not shown) is installed in the through hole 366, and the rotary shaft of the rotating mechanism 111 is rotatably supported by the shutter 365 by the bearing. The shutter 365 is fixed to the main body 163a. Therefore, the rotating shaft of the rotating mechanism 111 can rotate. Further, as shown in FIGS. 8 and 9B, an outer partition 368 and an inner partition 369, which are continuous walls along the circumferential direction, are provided on the lower surface of the shutter 365. The outer partition section 368 and the inner partition section 369 form a region of the shutter 365 partitioned into three areas: an outer area U, a middle area V, and an inner area Y. Then, in each area, similarly to the supply port 267, a supply port 367 which is a hole through which the cooling fluid G passes is formed. The distance between the supply port 367 and the through hole 366 provided in the inner area Y is set to the same distance a as the distance between the through hole 266 and the supply port 267. The supply port 367 provided in the middle area V is provided at a position 2a from the center of the through hole 366. This is twice the distance between the through hole 366 and the supply port 367 in the inner area Y. The supply port 367 provided in the outer area U is provided at a distance 3a from the center of the through hole 366. This is an interval three times the distance between the through hole 366 and the supply port 367 in the inner area Y. More specifically, as shown in FIG. 9B, the supply port 367 provided in the inner area Y is provided on the vertical axis and the horizontal axis in the drawing with the through hole 366 as the center. The supply port 367 provided in the side area V is provided at an angle of 30 degrees from the vertical axis and 30 degrees from the horizontal axis, both on the axis rotated leftward (in the direction of arrow M in FIG. 10), and in the outer area U. The supply port 367 provided is provided on the axis line rotated to the left (direction of arrow M in FIG. 10) by 60 degrees from the vertical axis and 60 degrees from the horizontal axis.

  As shown in FIG. 8, a shutter 265, a shutter 365, and a bottom portion 163b are arranged in this order in the direction of arrow Q. Further, the outer partition 368 and the inner partition 369 provided on the shutter 365 described above are between the shutter 365 and the bottom 163b.

  As shown in FIG. 9B, the shutter 365 is divided into three areas, an outer area U, an inner area V, and an inner area Y, so that the supply port 367 and the supply port 69a are also divided for each area. Will be done.

  FIG. 10 shows the positional relationship among the shutter 265, the shutter 365, and the bottom portion 163b as seen from the direction of arrow Q in FIG. 10A, 10B, and 10C show a state in which the shutter 265 is rotated by the rotation mechanism 111 in the direction of arrow M every 30 degrees. Note that, in FIG. 10, a supply port in which the supply port 267 included in the shutter 265 and a supply port 367 included in the shutter 365 overlap is indicated by a solid line (white circle), and a supply port which does not overlap is indicated by a black circle or a broken line. There is.

  The positional relationship shown in FIG. 10A shows when the shutter 265 is at the position shown in FIG. 9A. The cooling fluid G can pass through the supply port 367 overlapping the supply port 267. The cooling fluid G that has passed through the supply ports 267 and 367 can be supplied to the supply port 69a and the plurality of nozzles 64. Here, the supply port 367 that overlaps the supply port 267 exists in the inner area Y partitioned by the inner partition section 369, so that the supply section 69 a (belonging) arranged in the inner area Y and the supply section 69 a thereof. The cooling fluid G is supplied to the corresponding nozzle 64. This makes it possible to supply the cooling fluid G to the inside (center portion) of the transmission window 62.

  FIG. 10B shows a state in which the shutter 265 at the position of FIG. 10A is rotated by 30 degrees in the direction of arrow M, and the position of the supply port 367 overlapping the supply port 267 (in a solid line). Change). Further, the position of the supply port 367 that does not overlap with the supply port 267 (indicated by a black circle and a broken line) also changes. Since the position of the supply port 367 overlapping the supply port 267 is in the middle area V, which is between the outer partition 368 and the inner partition 169, the supply port 69a arranged in the middle area V and its position The cooling fluid G is supplied to the nozzle 64 corresponding to the supply unit 69a. As a result, the cooling fluid G is supplied to the inside of the transmission window 62 (the area between the central portion and the outer peripheral portion).

  FIG. 10C shows a state in which the shutter 265 at the position shown in FIG. 10B is further rotated in the direction of arrow M by 30 degrees. In this state, the position (shown by a solid line) of the supply port 367 overlapping the supply port 267 changes as compared with FIGS. 10A and 10B. Further, the position (black circle and broken line) of the supply port 367 that does not overlap the supply port 267 also changes. Since the position of the supply port 367 overlapping the supply port 267 exists in the outer area U, which is outside the outer partition 368, the supply port 69a arranged in the outer area U and the nozzle corresponding to the supply portion 69a. The cooling fluid G is supplied to 64. As a result, the cooling fluid G is supplied to the outside (outer peripheral portion) of the transmission window 62.

  In this embodiment, when the shutter 265 is rotated in the direction of the arrow M in the order of FIGS. 10A, 10B, and 10C, the cooling fluid G is divided into the inner area Y, the middle area V, and the outer area U. It is sequentially supplied to the transmission window 62 via the nozzles 64 belonging to each. By supplying the cooling fluid G in this manner, the transmission window 62 is gradually cooled from the inside to the outside. Therefore, the second embodiment also has the same effect as that of the first embodiment. The timing at which the cooling fluid G is ejected from the nozzle 64 is the same as in the first embodiment.

  Further, the transparent window 62 can be cooled while the high temperature atmosphere (gas) around the transparent window 62 is expelled from the inside to the outside of the transparent window 62 while being discharged. That is, the cooling fluid G can be directly supplied to the transparent window 62 by eliminating the high temperature atmosphere around the transparent window 62. In this way, the supply port 69 a and the nozzle 64 to which the cooling fluid G is supplied are changed in accordance with the rotation of the shutter 265, and the supply position of the cooling fluid G with respect to the transmission window 62 can be changed. As a result, compared to the case where the cooling fluid G is supplied to the entire transparent window 62 at the same time, the influence of the interference of the cooling fluids G is reduced, so that the high temperature atmosphere (gas) around the transparent window 62 is efficiently discharged. It becomes possible to do. Therefore, the high-temperature atmosphere is discharged and the cooling fluid G is directly jetted to the transmission window 62, so that the transmission window 62 is easily cooled.

  Further, since the cooling fluid G is concentratedly supplied only to the supply port 367 that overlaps the supply port 267, the flow velocity is increased. As a result, the cooling fluid G having a higher flow velocity is ejected from the nozzle 64, so that the cooling efficiency of the transmission window 62 is improved and the atmosphere (gas) in the high temperature state around the transmission window 62 is changed to the buffer 170. Since it can be efficiently discharged to the outside, the efficiency of cooling the transmission window 62 can be improved.

  A fourth embodiment will be described with reference to FIG.

  The fourth embodiment is basically the same as the first embodiment. Therefore, in the fourth embodiment, differences from the first embodiment will be described, the same parts as those described in the first embodiment will be denoted by the same reference numerals, and description thereof will be omitted.

  As shown in FIG. 11, in the drying processing chamber 30 according to the fourth embodiment, the buffer unit 180 in which the plurality of nozzles 64 are installed is connected to the lifting drive unit 120 via the lifting shaft 121. The lifting drive unit 120 drives the lifting shaft 121 to move the buffer unit 180 in the vertical direction. That is, the elevating / lowering drive unit 120 allows the buffer unit 180 to move toward and away from the transmission window 62 from the standby position (shown by the solid line) to the processing position (shown by the broken line) and from the processing position to the standby position. ing. In the present embodiment, the standby position is a position above the lamp 61 to the extent that the nozzle 64 is less likely to be affected by heating by the lamp 61, and the processing position is the position where the nozzle 64 enters the gap between the lamps. It Further, the lifting drive unit 120 is electrically connected to the control unit 100 and is controlled by the control unit 100. The lifting drive unit 120 is, for example, a servo motor, and the lifting shaft 121 is, for example, a ball screw. Alternatively, a linear motor system may be used.

  A pipe (not shown) for supplying the cooling fluid G supplied from the supply port 73 to the buffer unit 180 is mounted on the lifting drive unit 120 and the lifting shaft 121. In addition, since the pipe mounted inside the elevating shaft 121 is configured to be expandable and contractable, it is possible to supply the cooling fluid G while the buffer portion 63 is descending from the standby position to the processing position. ing.

  The lamp 61 is supported by a support member 167 and fixed in the lamp chamber 60. The support member 167 is provided with a through hole (not shown) through which the nozzle 64 penetrates and a reflector (not shown).

  Therefore, in the present embodiment, the buffer unit 180 is in a standby state at the standby position while the lamp 61 is turned on and the substrate W is being dried. Then, after the lighting of the lamp 61 is stopped, the drying process of the substrate W is completed, and the substrate W is unloaded from the processing chamber 37 by the transfer robot 7, the elevating drive mechanism 120 and the elevating shaft 121 are driven, The buffer unit 180 is moved to the processing position. Then, before the unprocessed substrate W is loaded into the processing chamber 37, the cooling fluid G is jetted from the plurality of nozzles 64 to cool the transmission window 62. When the cooling of the transparent window 62 is completed, the elevating drive mechanism 120 and the elevating shaft 121 move the buffer unit 180 to the standby position.

  As described above, according to the fourth embodiment, the same effect as that of the first embodiment can be obtained. Further, by arranging the buffer section 180 including the plurality of nozzles 64 at the standby position when the lamp is lit, the influence of heat on the nozzles 64 when the lamp 61 is lit is 1st to 3rd. Much less than the embodiment of. Therefore, it is possible to prevent the nozzle 64 from being heated and damaged, and to prevent the inside of the nozzle 64 from reaching a high temperature state.

  The timing of moving the buffer unit 63 up and down and the timing of ejecting the cooling fluid G from the nozzle 64 are, for example, when the buffer unit 180 is lowered from the standby position to the processing position during the drying process of the substrate W, and the transmission window 62 is opened. It is also possible to cool. Further, a sensor or the like for monitoring the temperature of the transparent window 62 may be installed in the lamp chamber 60, and the transparent window 63 may be cooled based on the sensor.

  The fifth embodiment will be described with reference to FIG.

  The fifth embodiment is basically the same as the fourth embodiment. Therefore, in the fifth embodiment, differences from the fourth embodiment will be described, and the same parts as those described in the fourth embodiment will be denoted by the same reference numerals and description thereof will be omitted.

  As shown in FIG. 12, in the dry processing chamber 30 according to the fifth embodiment, a transparent window 162 is provided in the processing chamber 37 in addition to the transparent window 62 provided in the lamp chamber 60. The transmission window 162 is located above the processing chamber 37 and maintains a certain distance from the transmission window 62, which is a predetermined distance, and a space S is formed between the transmission window 162 and the transmission window 62. That is, the transmissive window has a two-layer structure with a certain space.

  A flow path 201 and a flow path 202 are provided between the processing chamber 37 and the lamp chamber 60. One end of the flow path 201 is connected to the supply port 73, and the cooling fluid G is supplied from the cooling fluid supply unit 70. Moreover, the other end of the flow path 201 is connected to the space S. That is, the cooling fluid G is supplied to the space S.

  One end of the flow path 202 is connected to the space S, and the other end of the flow path 202 is connected to the discharge port 74. As a result, the cooling fluid G is discharged from the space S through the flow path 202. The discharge port 74 is connected to the cooling fluid supply unit 70 via a pipe 75.

  In the fifth embodiment, the two-layered transparent window 62 and the transparent window 162 are provided so that the space S is formed. The cooling fluid G is supplied to the space S from the cooling fluid supply unit 70 through the pipe 72 and the flow path 201. Then, the cooling fluid G supplied to the space S is returned to the cooling fluid supply unit 70 through the flow path 202 and the pipe 75. That is, the cooling fluid G is circulated.

  In this way, by supplying and circulating the cooling fluid G in the space S formed by the transmission windows provided in the two layers, the heat generated by lighting the lamp 61 can be taken and the heating of the transmission window 162 can be reduced. . This makes it possible to prevent a high temperature environment inside the processing chamber 37 and prevent the occurrence of drying unevenness and watermarks when an unprocessed substrate is carried in, as in the first embodiment. it can. The timing of supplying the cooling fluid G to the space S can be the same as the timing of discharging the cooling fluid G from the nozzle 64 in the first embodiment.

  In the fifth embodiment, the transmissive window 62 and the transmissive window 162 have a two-layer structure and the space S is provided between the two, but they may have two or more layers. Further, not only the space S is provided by the two-layer transmission window, but also the flow path through which the cooling fluid G flows is provided in the wall surfaces of the processing chamber 37 and the lamp chamber 60, so that the inside of the processing chamber 37 and the lamp chamber 60 is provided. It may be cooled.

  Although some embodiments of the present invention have been described above, these embodiments are presented as examples and are not intended to limit the scope of the invention. For example, as described in the first to fourth embodiments, the structure described in the fifth embodiment can be added to the structure in which the cooling fluid is ejected from the nozzle to the transmission window. Further, the above-described embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and the gist of the invention, and are also included in the invention described in the claims and the equivalent scope thereof.

1 Substrate processing apparatus 10 Processing chamber 30 Drying processing chamber 31 Rotating table 32 Rotating shaft 33 Motor 34 Holding pin 60 Lamp chamber 61 Lamp (heating means)
62 transparent window 63 buffer section 64 nozzle 66 reflector 70 cooling fluid supply section 100 control section 165 shutter G cooling fluid W substrate

Claims (7)

In the substrate processing apparatus to which the processing liquid is supplied,
A chamber,
Holding means provided in the chamber for holding the substrate;
Heating means for heating the substrate held by the holding means,
A transmission window that is provided so as to face the heating means and that transmits the light emitted from the heating means,
Cooling means for cooling the transparent window with a cooling fluid,
Control means for operating the cooling means when heating by the heating means is not performed,
The cooling means is
A cooling fluid ejecting unit that supplies the cooling fluid toward the transparent window;
A cooling fluid supply unit that supplies the cooling fluid to the cooling fluid ejection unit;
Have
The cooling fluid jetting unit,
A plurality of nozzles arranged to face the transmission window,
Have,
The heating means has a plurality of lamps arranged at a predetermined interval,
The plurality of nozzles, in the gap between the plurality of lamps, the discharge port is arranged toward the transmission window,
The substrate processing apparatus is characterized in that the height position of the discharge port is in the vertical direction between the center height position of the lamp and the height position of the upper surface of the transmission window. The cooling fluid jetting unit,
A buffer unit provided between the plurality of nozzles and the cooling fluid supply unit,
The substrate processing apparatus according to claim 1, wherein a rotating shutter is provided in the buffer section, and the cooling fluid is supplied to the nozzle through an opening provided in a part of the shutter. The cooling fluid jetting unit,
A buffer unit provided between the plurality of nozzles and the cooling fluid supply unit,
In the buffer unit, two shutters each having a supply port are provided in a stacked state, and the cooling fluid is supplied to the nozzle through the supply port which is overlapped by relative rotation of both shutters. The substrate processing apparatus according to claim 1.   The substrate processing apparatus according to claim 1, further comprising a drive unit that moves the cooling fluid ejecting unit toward and away from the transmission window.   The substrate processing apparatus according to claim 1, wherein a plurality of the transmissive windows are provided at a predetermined interval, and a flow path for supplying the cooling fluid is provided in a space formed between the transmissive windows. In the method of processing a substrate whose surface is supplied with a processing liquid,
Holding the substrate contained in a chamber;
Heating the substrate held in the chamber with a lamp through a transmissive window;
Cooling the transparent window with a cooling fluid when the step of heating the substrate is not performed,
In the step of cooling the transparent window with the cooling fluid, the cooling fluid is discharged from a height position between a central height position of the lamp and a height position of an upper surface of the transparent window. Processing method. Wherein the step of cooling the transmission window in the cooling fluid, the substrate processing method according to claim 6, characterized in that performed after completion of the heating step.

Images