JP6675948B2 - Lid and substrate processing apparatus using the same - Google Patents

Description

  The present invention relates to a lid and a substrate processing apparatus using the same.

  Conventionally, a processing chamber having a furnace port for taking in and out a substrate, an opening / closing door for opening / closing the furnace port of the processing chamber, an enclosure surrounding at least a part of the periphery of the opening / closing door at the open position of the opening / closing door, 2. Description of the Related Art There is known a substrate processing apparatus that has an exhaust unit for forcibly exhausting air, and forcibly exhausts the inside of an enclosure to prevent by-products attached to an opening / closing door from solidifying (for example, Patent Document 1) 1).

JP 2005-93489 A

  However, the configuration described in Patent Document 1 cannot prevent by-products from adhering to the opening / closing door, and thus cannot prevent a certain amount of by-products from remaining among adhering by-products. .

  Then, an object of the present invention is to provide a lid which can prevent adhesion of a by-product itself and a substrate processing apparatus using the same.

In order to achieve the above object, a lid according to one embodiment of the present invention includes a metal plate,
A quartz plate installed on the metal plate,
A screw hole penetrating the quartz plate and provided to a predetermined depth of the metal plate,
A screw inserted into the screw hole and fixing the quartz plate to the metal plate;
The purge gas is provided from the inside of the metal plate toward the bottom surface of the quartz plate so that the purge gas is provided inside the screw when viewed from above and is supplied to a gap between the quartz plate and the metal plate. A cover member fixed to the metal plate formed with a purge gas supply hole capable of supplying
A buffer region formed below the cover member by the cover member being fitted into the metal plate;
A purge gas supply pipe connected to the buffer area and supplying the purge gas to the buffer area .

  According to the present invention, it is possible to prevent the by-product itself from adhering to the lid.

FIG. 3 is a plan view showing the inside of the vertical heat treatment apparatus. It is the longitudinal cross-sectional view which looked at the vertical heat treatment apparatus from the right side. It is the longitudinal cross-sectional view which looked at the vertical heat treatment apparatus from the back side. It is a perspective view of a heat processing furnace, a wafer boat, and a lid. It is a figure showing a lid concerning a reference example of the present invention. It is the top view which showed the surface of an example of the cover which concerns on embodiment of this invention. It is a top view showing the back of an example of a lid concerning this embodiment. It is the figure which showed the AA cross section of FIG. FIG. 7 is a diagram showing a BB cross section of FIG. 6. FIG. 7 is a perspective view showing a BB cross section of FIG. 6. It is the figure which showed the planar shape of an example of the quartz plate of the lid | cover which concerns on embodiment of this invention. It is the 2nd figure which showed the AA cross section of FIG. FIG. 7 is a second diagram showing a BB cross section of FIG. 6. FIG. 14 is an enlarged top view of FIG. 13. It is the perspective view which showed an example of the vibration suppression structure of the cover which concerns on embodiment of this invention. It is sectional drawing which showed an example of the vibration suppression structure of the lid | cover which concerns on embodiment of this invention. It is a figure showing the whole composition of an example of a lid concerning an embodiment of the present invention. It is a figure for explaining composition which provides a gas heater in a purge gas supply pipe.

  Hereinafter, an embodiment for carrying out the present invention will be described with reference to the drawings.

  First, an embodiment of a vertical heat treatment apparatus to which the lid according to the embodiment of the present invention can be suitably applied will be described. FIG. 1 is a plan view showing the inside of the vertical heat treatment apparatus. In FIG. 1, a description will be given with the back side of the paper as the front side, the near side of the paper as the rear side, the X direction in FIG. FIG. 2 is a vertical cross-sectional view of the vertical heat treatment apparatus as viewed from the right side, and FIG. 3 is a vertical cross-sectional view as viewed from the rear side. 1 and 2, a housing 1 constituting an exterior body of the device is shown. A loading / unloading area S1 for loading / unloading a carrier C containing a wafer W as a substrate into / from the apparatus, a wafer in the carrier C, and loading into a heat treatment furnace described later. And a loading area S2, which is a loading room for loading. The loading / unloading area S1 and the loading area S2 are separated by a partition 11, and the loading / unloading area S1 is set to an air atmosphere, and the loading area S2 is, for example, a clean and dry gas atmosphere (with a small amount of particles and organic components and a dew point of -60 ° C or less The air) and is.

  As shown in FIG. 1, the carry-in / out area S1 includes a first area 12 on the near side and a second area 13 on the far side. Further, as shown in FIG. 2, a first mounting table 14 for mounting the carrier C is provided in the first area 12. As the carrier C, a plurality of wafers W having a diameter of, for example, 300 mm are housed in a form of, for example, 25 shelves, and a closed FOUP (Front-Opening Unified Pod) in which an unillustrated outlet on the front surface is closed by a lid. ) Is used. In the second area 13, a second mounting table 15 and a carrier storage unit 16 are provided, and a carrier that transports the carrier C between the first mounting table 14, the second mounting table 15, and the carrier storage unit 16. A transport mechanism 17 is provided. Further, as shown in FIG. 1, an opening 10 communicating the inside of the carrier C with the loading area S2, a door 18 of the opening 10, and a lid opening / closing mechanism 19 for opening and closing the lid of the carrier C are provided.

  A vertical heat treatment furnace 2 whose lower end opens as a furnace port 20 is provided above the loading area S2 on the far side. The heat treatment furnace 2 is a processing container for accommodating a wafer and performing heat treatment. The furnace port 20 forms an opening of the heat treatment furnace 2. In the heat treatment furnace 2, for example, as shown in FIG. 4, a treatment gas supply path 2A for supplying a treatment gas into the heat treatment furnace 2 and an exhaust path 2B for exhausting the atmosphere in the heat treatment furnace 2 are provided. It is connected. The processing gas supply path 2A and the exhaust path 2B are respectively connected to a processing gas supply source and an exhaust mechanism (not shown). 1 to 3, the processing gas supply path 2A and the exhaust path 2B are omitted for convenience of illustration.

  In the loading area S2, for example, two wafer boats 3 (3A, 3B) are provided. The wafer boats 3 (3A, 3B) serve as substrate holders for holding a large number of wafers W so as to be stacked with a predetermined interval in the vertical direction, and are made of, for example, quartz. . Here, the wafer boat 3 will be briefly described with reference to FIG. 4. For example, four columns 33 are provided between the top plate 31 and the bottom plate 32, and a groove (not shown) formed in the column 33 is formed. The peripheral portion of the wafer W is held, and for example, 100 wafers W can be arranged and held vertically at predetermined intervals. A support portion 34 is provided below the bottom plate 32.

  And, in the loading area S2, a boat elevator 41 serving as a holder raising / lowering mechanism is provided. The boat elevator 41 is configured to be able to move up and down along a guide rail 43 extending in the vertical direction by a moving mechanism 42, on which a lid 21 and a heat insulating material 22 of the heat treatment furnace 2 are provided in this order. I have. The heat insulating material 22 is made of, for example, quartz or the like, and the wafer boat 3 is mounted thereon.

  Thus, the wafer boat 3 is moved up and down by the boat elevator 41 between the load position and the unload position in the heat treatment furnace 2. The loading position is a processing position in which the wafer boat 3 is carried into the heat treatment furnace 2 and the furnace port 20 of the heat treatment furnace 2 is covered by the lid 21, and the unloading position is a position in which the wafer boat 3 is positioned below the heat treatment furnace 2. This is the position (the position shown in FIGS. 2 to 4) to be carried out.

  In the loading area S2, a first stage 44 and a second stage 45 for mounting the wafer boat 3 and a wafer between the boat elevator 41, the first stage 44, and the second stage 45 are provided. A boat transport mechanism 46 for transferring the boat 3 is provided. The boat transfer mechanism 46 is configured such that a holding arm 47 on which the support portion 34 of the wafer boat 3 is placed can freely move up and down, rotate around a horizontal axis, and move forward and backward. In FIG. 2, the boat transport mechanism 46 is omitted for convenience of illustration.

  Further, in the loading area S2, for example, a wafer transfer mechanism 48 is provided adjacent to the first stage 44. The wafer transfer mechanism 48 transfers a wafer between the wafer boat 3 on the first stage 44, the wafer boat 3 on the boat elevator 41, and the carrier C on the second mounting table 15, for example. The wafer transfer mechanism 48 includes a plurality of, for example, five forks 49 for holding the wafer W, and a transfer base 49a that supports the forks 49 so as to be able to move forward and backward. The transfer base 49a is rotatable about a vertical axis. It is configured to be able to move up and down freely.

  Further, in a region other than the heat treatment furnace 2 in the loading area S2, for example, a ceiling portion 23 is formed at a height position near an opening of the heat treatment furnace 2. A filter unit 5 is provided on one side surface of the loading area S2 in the left-right direction. As shown in FIG. 3, the filter unit 5 includes a filter portion 51 and a ventilation space 52, and the ventilation space 52 communicates with the ventilation chamber 25 formed below the bottom plate 24 of the loading area S2. It is configured.

  On one end side of the ventilation chamber 25, a first fan 53 and a first gate valve 54 are provided. The other end is connected to a factory exhaust system via a second gate valve 55 and a second fan 56. As shown in FIGS. 1 and 3, an exhaust port 26 is formed in the bottom plate 24.

  Further, a lid opening / closing mechanism 6 having a lid 60 for closing the furnace port 20 of the heat treatment furnace 2 is provided near the ceiling portion 23 in the loading area S2. The lid 60 is provided to close the furnace port 20 of the heat treatment furnace 2 when the wafer boat 3 is unloaded after the heat treatment furnace 2, for example, and is formed in a size to close the furnace port 20.

  As shown in FIG. 4, the lid opening / closing mechanism 6 moves the support member 7 that supports the lid 60 and the lid 60 between a position that closes the furnace port 20 and a position that opens the furnace port 20. A cover moving mechanism 8. The opening position of the furnace port 20 is a position beside the furnace port 20 in this example, and this position is a standby position. Further, the lid moving mechanism 8 is configured by combining, for example, an elevating mechanism 8A that supports the base end side of the support member 7 so as to be able to move up and down, and a rotating mechanism 8B that rotates the elevating mechanism 8A around a vertical axis. As shown in FIG. 3, the lid moving mechanism 8 is provided on a mounting member 9 provided on a side wall of the housing 1, for example.

  Here, the standby position is a position on the lower side of the furnace port 20 and concentrically adjacent to the furnace port 20 around the rotation mechanism 8B. Then, the lid body 60 pivots from the standby position to the lower side of the furnace port 20 by the rotating mechanism 8B, and then moves up to a position for closing the furnace port 20 by being lifted by the elevating mechanism 8A. Note that FIGS. 1 and 2 show a state in which the lid body 60 is at the standby position, and FIG. 3 shows a state in which the furnace port 20 is closed. At this time, the lid opening / closing mechanism 6 does not obstruct the loading and unloading of the wafer boat 3 and the movement between the stages 44 and 45 of the wafer boat 3 and the heat insulating material 22 in the loading area S2. Can be moved between the standby position and a position for closing the furnace port 20.

  As described above, the lid 60 is provided for closing the furnace port 20 when the wafer boat 3 is unloaded or when cleaning the inside of the heat treatment furnace 2. The lid according to the embodiment of the present invention is not necessarily limited to the use in which the furnace port 20 of the heat treatment furnace 2 is temporarily closed, but can be suitably used in such use.

  Hereinafter, the lid 60 according to the embodiment of the present invention will be described in more detail. First, before describing the lid 60 according to the embodiment of the present invention, the lid 160 according to the reference example will be described.

  FIG. 5 is a diagram showing a lid 160 according to a reference example of the present invention. The lid 160 according to the reference example includes a metal plate 161 and a quartz plate 162. Further, a cooling path 63 is provided inside the metal plate 161, and an O-ring 64 is provided on the outer peripheral portion of the metal plate 161.

The lid 160 according to the reference example has a configuration in which a quartz plate 162 is installed on a metal plate 161, and is used when the wafer boat 3 is unloaded from the heat treatment furnace 2. When performing ALD (Atomic Layer Deposition, atomic deposition) film formation, ammonium chloride (NH ₄ Cl) 163 adheres between the quartz plate 162 and the metal plate 161, and the cover 160 is periodically cleaned. There is a problem that it has to be performed on a target (for example, once a week). In the lid 60 according to the present embodiment, a purge gas is supplied between the metal plate 161 and the quartz plate 162 to which ammonium chloride easily adheres to prevent such adhesion of ammonium chloride and reduce the cleaning frequency of the lid 60. The configuration is such that it can be lowered. Note that the cooling furnace 63 and the O-ring 64 described with reference to FIG.

  FIG. 6 is a plan view showing the surface of an example of the lid 60 according to the embodiment of the present invention. The lid 60 according to the embodiment of the present invention has a configuration in which a quartz plate 62 is provided on a metal plate 61. The metal plate 61 may be made of various metals, but may be made of, for example, stainless steel. The quartz plate 62 is made of quartz, as the name suggests. The quartz plate 62 may be configured to be thinner than the metal plate 61. For example, the quartz plate 62 may be called a quartz cap 62.

  The metal plate 61 is configured to be larger than the quartz plate 62. The metal plate 61 and the quartz plate 62 may be formed in various shapes according to the shape of the processing container. However, when the metal plate 61 and the quartz plate 62 are used in a cylindrical processing container like the heat treatment furnace 2, they are shown in FIG. As such, it has a circular shape.

  The quartz plate 62 is fixed not only on the metal plate 61 but also by screws 65. The number of screws 65 may be various as long as the quartz plate 62 can be appropriately fixed to the metal plate 61. For example, as shown in FIG. 6, two screws 65 are provided facing opposite sides passing through the center. Is also good. Further, a purge gas supply hole 68 is provided on the surface of the metal plate 61 inside the screw 65. In FIG. 6, a total of 16 purge gas supply holes 68 are provided, including two purge gas supply holes 68 having a diameter passing through the center of the metal plate 61 and the quartz plate 62 connecting the screws 65 facing each other. Note that the position, number, and the like of the purge gas supply holes 68 may be appropriately changed depending on the application. The details of these cross-sectional shapes will be described later.

  FIG. 7 is a plan view showing the back surface of an example of the lid 60 according to the present embodiment. As shown in FIG. 7, a purge gas supply pipe 73 is provided on the back surface of the lid 60. As shown in FIG. 7, the purge gas is supplied from four locations on the back surface surrounded by a circle. That is, the purge gas supply pipe 73 is provided on the back side of the metal plate 61, and the purge gas is supplied between the quartz plate 62 and the metal plate 61 through the metal plate 61. As the purge gas, various inert gases including a rare gas such as a nitrogen gas, an Ar gas, and a He gas can be used. Further, the number of the supply points of the purge gas from the purge gas supply pipe 73 is four in FIG. 7, but the position, the number, and the like of the supply points may be appropriately changed depending on the application.

  FIG. 8 is a diagram showing an AA cross section of FIG. As shown in FIG. 8, a cover member 67 is provided so as to fit into a depression 61 a on the surface of the metal plate 61, and a purge gas supply hole 68 is formed in the cover member 67. The cover member 67 is fixed to the metal plate 61 by screws 69. A buffer region 72 is provided below the cover member 67, and the buffer region 72 and the purge gas supply hole 68 communicate with each other. Outside the cover member 67, a blowing gap 70 is provided between the bottom surface of the quartz plate 62 and the top surface of the metal plate 61, and the purge gas flows outward through the blowing gap 70, and the quartz plate 62 and the metal plate 61 This structure prevents by-products such as sodium chloride from adhering to the gap between the first and second members. Note that the metal plate 61 and the quartz plate 62 are in close contact with each other inside the recess 61a, and the purge gas supplied toward the bottom surface of the quartz plate 62 has a dead end inside, so that the purge gas always ends up being always outside. Flows toward the air outlet gap 70.

  FIG. 9 is a diagram showing a BB cross section of FIG. As shown in FIG. 9, the quartz plate 62 is fixed to the metal plate 61 by screws 65. A screw hole 66 into which the screw 65 is inserted is formed in the quartz plate 62 and the metal plate 61, and the screw hole 66 penetrates the quartz plate 62 and is formed from the surface of the metal plate 61 to a predetermined depth. ing. 8, a purge gas is supplied from a purge gas supply hole 68 formed in the cover member 67, and the purge gas flows through a gap 71 between the screw 65 and the screw hole 66. Thereby, the adhesion of the by-product is also prevented around the screw 65. As shown in FIG. 9, a purge gas supply pipe 73 is connected to the buffer area 72, the purge gas is directly supplied to the buffer area 72, and the purge gas is supplied from the purge gas supply hole 68 communicating with the buffer area 72 to the gap 71. Is supplied to the system.

  FIG. 10 is a perspective view showing a BB cross section of FIG. As shown in FIG. 10, the cover member 67 is formed in an annular shape, and the buffer region 72 is also formed and provided thereunder. Since the screw 65 and the screw hole 66 are provided outside the purge gas supply hole 68, the screw 65 and the screw hole 66 are always purged by the purge gas. Metal parts such as the screws 65 may generate particles, and therefore are preferably purged with a purge gas. In the lid body 60 according to the present embodiment, by providing the screw 65 and the screw hole 66 outside the purge gas supply hole 68, it is only necessary to prevent the by-product from entering between the quartz plate 62 and the metal plate 61. In addition, the screw 65 and the screw hole 66 can be purged at the same time, which is a very effective configuration for cleaning the lid 60.

  In FIG. 10, an O-ring 64 is provided near the outermost periphery. Such a configuration is the same as that described with reference to FIG.

  Further, in the present embodiment, the buffer region 72 is provided in an annular shape, but it goes without saying that the shape, arrangement, and the like can be appropriately changed according to the position where the purge gas supply hole 68 is provided.

  FIG. 11 is a diagram illustrating a planar shape of an example of the quartz plate 62 of the lid 60 according to the embodiment of the present invention. As shown in FIG. 11, a notch 62a is formed at a place where the screw 65 of the quartz plate 62 is inserted. Hereinafter, this point will be described in more detail.

  FIG. 12 is a second diagram showing a cross section taken along line AA of FIG. The cross section taken along the line AA in FIG. 12 is similar to FIG. 8, but differs from FIG. 8 in that a protrusion 67 a is formed between the purge gas supply hole 68 of the cover member 67 a and the screw 69. I have. As described above, the protrusion 67b may be provided on the cover member 67a, and the protrusion 67b may be closely attached to the quartz plate 62. With this configuration, after the purge gas is supplied from the purge gas supply hole 68, the purge gas immediately flows into the outer blowing gap 70 without flowing inward, so that the purge gas can be more efficiently supplied to the outer peripheral side.

  FIG. 13 is a second diagram showing a BB cross section of FIG. The BB cross section according to FIG. 13 is different from FIG. 9 in that the cover member 67a has a raised portion 67b as in FIG. Further, the BB cross section according to FIG. 13 differs from FIG. 9 in that a cutout 62 a is provided outside the screw 65.

  FIG. 14 is an enlarged top view of FIG. As shown in FIG. 14, a notch 62a is formed outside the screw 65, and the outside of the screw 65 is exposed. This is because, as described with reference to FIG. 8, the screw 65 is arranged on the outer peripheral side of the quartz plate 62 in order to supply the purge gas to the screw 65. Cracks may occur on the outside of 62 and may be damaged. In order to avoid such breakage, a notch 62 a is provided in the quartz plate 62 outside the screw 65 to release the stress of the screw 65. Thus, by providing the notch 62a outside the screw 65, the screw 65 can be provided outside the purge gas supply hole 68, and the lid 60 can be cleaned while preventing damage. Become.

  FIG. 15 and FIG. 16 are diagrams for explaining a configuration for suppressing vibration of the lid 60 according to the present embodiment. 6 to 14, the configuration in which by-products are prevented from adhering to the lid 60 by supplying the purge gas has been described. However, when the flow rate of the purge gas is increased, the quartz plate is affected by the supply pressure of the purge gas. There is a concern that vibration will occur at 62. In such a case, the generation of vibration can be suppressed by disposing the elastic body around the screw 65, that is, between the screw 65 and the screw hole 66.

  FIG. 15 is a perspective view illustrating an example of the vibration suppressing configuration of the lid 60 according to the embodiment of the present invention. FIG. 15A is a perspective view before adopting the vibration suppression configuration, and FIG. 15B is a perspective view adopting the vibration suppression configuration. As shown in FIG. 15B, the vibration can be absorbed and suppressed by disposing the fluorine rubber sheet 75 made of an elastic body around the screw 65. The fluoro rubber sheet is a band-like ring made of an elastic material such as rubber, and has the same function as an O-ring or the like.

  FIG. 16 is a cross-sectional view illustrating an example of the vibration suppressing configuration of the lid 60 according to the embodiment of the present invention. FIG. 16A is a cross-sectional view before adopting the vibration suppression configuration, and FIG. 16B is a cross-sectional view using the vibration suppression configuration. As shown in FIG. 16B, the vibration can be absorbed and suppressed by disposing the fluororubber sheet 75 made of an elastic body in the space between the screw 65 and the screw hole 66.

  Even if the fluoro rubber sheet 75 is provided, the gap 71 can be maintained, and the supply of the purge gas from the purge gas supply hole 68 allows the screw 65 to be directly purged. Therefore, it is possible to suppress the vibration while maintaining the cleanliness.

  FIG. 17 is a diagram showing the entire configuration of an example of the lid 60 according to the embodiment of the present invention. As shown in FIG. 17, a cooling path 63 is formed below the metal plate 61, and an O-ring 64 is arranged on the outermost periphery. In addition, a purge gas supply pipe 73 is provided on the back side of the metal plate 61, so that the adhesion of by-products can be suppressed by the purge gas. A quartz plate 62 is provided on the metal plate 61, and the quartz plate 62 is fixed to the metal plate 61 with screws 65. A buffer region 72 is provided inside the metal plate 61 inside the screw 65, and a purge gas supply pipe 73 is connected to the buffer region 72. The purge gas supply pipe 73 is connected to a purge gas supply source (not shown). A cover member 67 is provided above the buffer area 72 and is fixed with screws 69. A purge gas supply hole 68 is formed in the cover member 67 so that the purge gas can be supplied along the bottom surface of the quartz plate 62 from inside to outside of the screw 65. With this configuration, it is possible to prevent by-products from adhering between the quartz plate 62 and the metal plate 61. Further, if necessary, a notch 62a is provided in a portion of the quartz plate 62 outside the screw 65, or an elastic body is provided between the screw 65 and the screw hole 66 to prevent breakage and vibration of the quartz plate 62. Or a configuration in which

  FIG. 18 is a diagram for describing a configuration in which a gas heater 74 is provided in the purge gas supply pipe 73. By-products are likely to be generated when the temperature of the lid 60 is low. Therefore, a gas heater 74 may be provided in the purge gas supply pipe 73 in order to more effectively prevent the generation of by-products. In this case, the gas heater 74 can be provided at an arbitrary position of the purge gas supply pipe 73, and can be provided at a desired position between a purge gas supply source (not shown) and the purge gas supply pipe 73 near the lid 60. .

  As described above, according to the lid 60 according to the present embodiment, adhesion of by-products can be effectively prevented. Further, in the present embodiment, an example in which the present invention is applied to the lid of a substrate processing apparatus, particularly a vertical heat treatment apparatus, has been described. However, the present invention can be used for various applications that require prevention of adhesion of by-products. .

  As described above, the preferred embodiments of the present invention have been described in detail. However, the present invention is not limited to the above-described embodiments, and various modifications and substitutions may be made to the above-described embodiments without departing from the scope of the present invention. Can be added.

2 Heat Treatment Furnace 3A, 3B Wafer Boat 41 Boat Elevator 6 Lid Opening / Closing Mechanism 60 Lid 61 Metal Plate 62 Quartz Plate 62a Notch 65 Screw 66 Screw Hole 68 Purge Gas Supply Hole 70 Blowout Gap 71 Gap 72 Buffer Area 73 Gas Supply Pipe 74 Gas heating mechanism 75 Fluororubber sheet W Semiconductor wafer C FOUP

Claims (10)

A metal plate,
A quartz plate installed on the metal plate,
A screw hole penetrating the quartz plate and provided to a predetermined depth of the metal plate,
A screw inserted into the screw hole and fixing the quartz plate to the metal plate;
The purge gas is provided from the inside of the metal plate toward the bottom surface of the quartz plate so that the purge gas is provided inside the screw when viewed from above and is supplied to a gap between the quartz plate and the metal plate. A cover member fixed to the metal plate formed with a purge gas supply hole capable of supplying
A buffer region formed below the cover member by the cover member being fitted into the metal plate;
A purge gas supply pipe connected to the buffer area and supplying the purge gas to the buffer area . 2. The lid according to claim 1, wherein the buffer region communicates with the purge gas supply hole and is provided so as to circulate on an outer peripheral side in the metal plate. 3.   3. The lid according to claim 2, further comprising a gas heater provided in the purge gas supply pipe. At a predetermined position inside the purge gas supply hole, the quartz plate and the metal plate are in close contact with each other,
Outside the purge gas supply hole, a second gap connected to the gap is provided between the quartz plate and the metal plate, and the purge gas is guided to flow outward from the purge gas supply hole. The lid according to any one of claims 1 to 3, wherein the lid is formed. 5. A third gap through which the purge gas can flow is provided at a position surrounded by the head of the screw penetrating the quartz plate, the quartz plate, and the metal plate . 6. A lid according to claim 1. The lid according to claim 5 , wherein an elastic body that does not completely close the third gap is provided at a position surrounded by the head of the screw, the quartz plate, and the metal plate .   The lid according to any one of claims 1 to 6, wherein a cutout that exposes a portion outside the screw is provided in a portion of the quartz plate outside the screw. The screw is provided in plurality,
The purge gas supply hole is provided more than the screw,
The lid according to any one of claims 1 to 7, comprising the purge gas supply hole provided on a straight line connecting the center of the quartz plate and the screw. A substrate holder capable of holding a plurality of substrates at predetermined intervals in the vertical direction,
A substrate processing container that accommodates the plurality of substrates held by the substrate holder through a predetermined opening and that can perform predetermined substrate processing,
A substrate processing apparatus comprising: the lid according to claim 1, wherein the predetermined opening is closed when the substrate holder is not stored in the substrate processing container. The predetermined opening is provided at a bottom of the substrate processing container,
The predetermined substrate processing is a heat treatment,
The substrate processing apparatus according to claim 9, wherein the lid is pivotally supported at a height below the bottom.