JP6675879B2 - Substrate processing apparatus and control method - Google Patents

Description

  The present invention relates to a substrate processing apparatus and a control method.

  BACKGROUND ART Conventionally, a substrate processing apparatus that performs processing on a substrate, such as a polishing apparatus, an etcher, or a CVD (Chemical Vapor Deposition) apparatus, is known. For example, in a conventional polishing apparatus, a gas is supplied when a wafer is sucked and pressed against a polishing pad, or a gas is sucked out of a space formed by an elastic film of a head portion (also called a top ring). A joint is arranged (for example, see Patent Document 1). This rotary joint has a rotating portion that rotates with the rotation of the head portion, and a fixed portion provided around the rotating portion, and a flow path formed inside the rotating portion and a flow path formed by the fixed portion. To form a first flow path (also called a main line).

The rotary joint is provided with a seal portion for sealing between the rotating portion and the fixed portion. The seal part is a mechanical seal, and silicon carbide (SiC) or a carbon material is used as a material. Since the rotating part slides with respect to the fixed part, heat is generated at the contact surface between the rotating part and the fixed part. Due to the thermal expansion due to this heat generation, a change in the shape of the rotating portion or the fixed portion and / or a change in the contact pressure between the rotating portion and the fixed portion occur, resulting in a reduction in sealing performance.
For this reason, in order to reduce heat, a second flow path (also referred to as a quench water line) for passing water to the outside in the circumferential direction of the mechanical seal is provided. Here, the water used for this flow is called quench water. Outside the quench water line, there is a drain flow path (also referred to as a drain line) for discharging quench water leaking outward in the axial direction of the rotary joint.

JP 2015-193068 A

  Conventionally, when water leakage from the second flow path (quenching water line) to the first flow path (main line) is suspected, a top ring downstream of the rotary joint is removed and the first flow path ( The main line was pressurized with a gas (for example, nitrogen), and it was visually confirmed whether water came out. However, even if water comes out at this time, there is a possibility that the water flows back from the top ring to the rotary joint, and the water flows from the second flow path (quenching water line) to the first flow path (main line). It cannot be determined that there is a leak.

  Therefore, if water leakage from the second flow path (quenching water line) to the first flow path (main line) is suspected, replace the rotary joint with a new one, reassemble the top ring, and polish. After the equipment was restored, the polishing equipment was operated to monitor the recurrence of the failure. The removed rotary joint is recovered, and the rotary joint alone is inspected for water leakage (also referred to as leak) from the second flow path (quench water line) to the first flow path (main line). Was. However, as a result of the inspection of the rotary joint alone, it is often determined that there is no water leakage from the second flow path to the first flow path.

  For this reason, it is desirable to be able to inspect the presence or absence of an abnormality in the rotary joint that causes water leakage from the second flow path to the first flow path in a state where the rotary joint is mounted on a substrate processing apparatus such as a polishing apparatus. I was

  In recent years, as the diameter of the substrate becomes larger and the demand for uniformity of the polished surface becomes higher, the number of regions of the elastic film of the top ring increases, and the number of first flow paths of the rotary joint also increases. As the number of the first flow paths increases, the operation time and the risk of occurrence of an operation error relating to the replacement of the rotary joint increase. Further, as the number of the first flow paths increases, the rotary joint becomes more expensive.

  From this, it is hoped that it is possible to inspect whether or not there is an abnormality in the rotary joint that causes water leakage from the second flow path to the first flow path in a state where the rotary joint is mounted on a substrate processing apparatus such as a polishing apparatus. Was rare.

  SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has been made in consideration of an abnormality of a rotary joint that causes water leakage from a second flow path to a first flow path in a state where a rotary joint is mounted on a substrate processing apparatus. It is an object of the present invention to provide a substrate processing apparatus and a control method capable of inspecting presence / absence.

  A substrate processing apparatus according to a first aspect of the present invention includes a head unit, a rotating unit that rotates with the rotation of the head unit, a fixed unit provided around the rotating unit, the rotating unit and the fixed unit. A rotary joint having a seal portion that seals between the first and second flow passages, wherein a first flow passage is formed, and a second flow passage isolated from the first flow passage by the seal portion is formed; and A switching valve for switching between quench water and gas and supplying the quench water and gas to one end of the second flow passage, a detection unit for detecting gas passing through the first flow passage, and a second flow passage. A shutoff valve that can shut off quench water or gas discharged from the other end of the path, and the gas is supplied to one end of the second flow path by switching by the switching valve unit, and the shutoff valve is closed. In some cases, said Using at least a detection result by the detection section, and a control unit for determining the presence or absence of abnormality of the rotary joint.

  According to this configuration, when there is no leakage from the second flow path to the first flow path, the gas supplied to the second flow path does not leak to the first flow path. Is not detected. On the other hand, when there is a leak from the second flow path to the first flow path, the gas supplied to the second flow path leaks to the first flow path. Is done. Accordingly, the presence or absence of gas leakage from the second flow path to the first flow path can be detected by monitoring the presence or absence of gas by the detection unit. It is possible to determine whether there is an abnormality in the rotary joint that causes water leakage to the road. For this reason, in the state where the rotary joint is mounted on the substrate processing apparatus, it is possible to inspect whether or not there is an abnormality in the rotary joint that causes water leakage from the second flow path to the first flow path.

  The substrate processing apparatus according to a second aspect of the present invention is the substrate processing apparatus according to the first aspect, wherein the rotary joint has a plurality of the seal portions, and the rotary joint includes the plurality of seal portions. A plurality of first flow paths isolated from the second flow path are formed, and each of the first flow paths has a detection unit that detects a gas passing through the first flow path. The control unit uses the detection result of each of the detection units to determine whether there is an abnormality in the seal unit corresponding to the detection unit.

  According to this configuration, for each of the plurality of first flow paths, the presence or absence of gas leakage from the second flow path to the first flow path can be detected. Indicates that there is a seal abnormality in the corresponding seal portion. For this reason, since it is possible to specify which seal has an abnormality, repair becomes easy. Further, only the part (for example, the seal portion) related to the seal having the abnormality can be replaced, and the number of replacement parts can be reduced.

  A substrate processing apparatus according to a third aspect of the present invention is the substrate processing apparatus according to the first or second aspect, wherein the control unit rotates the head unit at a lower speed than during substrate processing. In this case, the presence or absence of an abnormality in the rotary joint is determined using the detection result of the detection unit.

  According to this configuration, by rotating the head unit at a lower speed than during substrate processing, the rotating unit rotates in the circumferential direction and rubs against the fixed unit while suppressing heat generation due to sliding between the rotating unit and the fixed unit. During the operation, it is possible to detect whether or not there is gas leakage from the second flow path to the first flow path. Therefore, in a state closer to the time of substrate processing, it is possible to inspect whether or not the rotary joint has an abnormality that causes water leakage from the second flow path to the first flow path.

  A substrate processing apparatus according to a fourth aspect of the present invention is the substrate processing apparatus according to any one of the first to third aspects, wherein the detection unit detects a flow rate of a gas passing through the first flow path. The control unit determines that the rotary joint is abnormal when the flow rate detected by the flow meter exceeds a predetermined threshold.

  According to this configuration, when gas is detected by the flow meter exceeding the threshold value, there is gas leakage from the second flow path to the first flow path, so that a seal abnormality is present in the seal section corresponding to the detection section. Can be detected.

  A substrate processing apparatus according to a fifth aspect of the present invention is the substrate processing apparatus according to the fourth aspect, wherein one end of the rotary joint has an end opposite to the head of the first flow path. Further comprising a pipe that communicates with the flowmeter, wherein the flowmeter is provided in the pipe, and when the control unit determines whether there is an abnormality in the rotary joint, the pipe is the other end of the pipe than the flowmeter. Is open to the atmosphere.

  According to this configuration, when there is a gas leak from the second flow path to the first flow path, this gas is discharged to the outside through the pipe and the flow meter, so that the flow rate of the gas is reduced by the flow meter. Measured. Accordingly, by monitoring the gas flow rate detected by the flow meter, it is possible to detect the presence or absence of gas leakage from the second flow path to the first flow path. Can detect that the corresponding seal portion has a seal abnormality.

  The substrate processing apparatus according to a sixth aspect of the present invention is the substrate processing apparatus according to the fifth aspect, wherein a gas that is in communication with the other end of the pipe and flows in from a gas supply source can be supplied to the pipe. And a pressure control valve capable of opening to the atmosphere, wherein the control unit is configured to supply the gas to the second flow path by switching by the switching valve unit, close the closing valve, and set the pressure control valve to the atmosphere. When the rotary joint is open, the presence or absence of an abnormality in the rotary joint is determined using at least the flow rate of the gas detected by the flow meter.

  According to this configuration, the flow rate of the gas when supplying the gas to the head portion and the flow rate of the gas when the gas leaks from the second flow path to the first flow path can be detected by one flow meter. it can. For this reason, conventionally, when the flow meter F that measures the flow rate of the gas when supplying the gas to the head unit is used, there is no need to newly install a flow meter, so that labor and cost related to the installation of the flow meter are required. Can be reduced.

  The substrate processing apparatus according to a seventh aspect of the present invention is the substrate processing apparatus according to the fifth aspect, wherein the pressure is such that the gas flowing from the gas supply source communicates with the other end of the pipe and can be supplied to the pipe. A control valve, and a second switching valve unit provided on the pipe on the rotary joint side of the pressure control valve and capable of switching between communication with the pressure control valve and communication with the atmosphere, The flow meter is provided on the pipe on the rotary joint side from the second switching valve unit, and the control unit supplies the gas to the second flow path by switching by the switching valve unit; When the closing valve is closed and the second switching valve unit cuts off the communication with the pressure control valve and communicates with the atmosphere, the flow rate of the gas detected by the flow meter is reduced. Ku and be used to determine the presence or absence of abnormality of the rotary joint.

  According to this configuration, since the communication with the pressure control valve is blocked by the switching valve section, even if water remaining in the second flow path leaks to the first flow path, the water is switched. There is no risk of being shut off by the valve and flowing into the pressure control valve. Thus, when determining whether there is an abnormality in the rotary joint, it is possible to prevent water from flowing into the pressure control valve, so that there is no possibility that the pressure control valve will fail due to water.

  The substrate processing apparatus according to an eighth aspect of the present invention is the substrate processing apparatus according to the fourth aspect, wherein the flow meter is provided on the side of the head unit with respect to the rotary joint.

  According to this configuration, when the flow meter is provided on the side of the head section, it is possible to detect whether or not there is an abnormality in the rotary joint.

  The substrate processing apparatus according to a ninth aspect of the present invention is the substrate processing apparatus according to the eighth aspect, wherein the flow path connects the head unit and the rotary joint and communicates with the first flow path. A top ring head shaft, and a valve having one end connected to the flow meter and the other end open to the atmosphere, wherein the flow meter is provided on the top ring head shaft. The control unit is provided in the flow path, and when the valve is open, the control unit determines whether there is an abnormality in the rotary joint by using at least a flow rate of the gas detected by the flow meter.

  According to this configuration, if gas leaks from the second flow path to the first flow path, this gas is discharged from the first flow path to the outside via the flow meter, A gas flow is detected. Thus, by monitoring the gas flow rate detected by the flow meter, it is possible to detect the presence or absence of gas leakage from the second flow path to the first flow path, and there is gas leakage from the gas flow rate. If it can be considered, the control unit can determine that the rotary joint has an abnormality that causes water leakage from the second flow path to the first flow path.

  A substrate processing apparatus according to a tenth aspect of the present invention is the substrate processing apparatus according to the eighth aspect, wherein the head unit includes a plurality of first heads for supplying the gas or drawing a vacuum. A carrier portion having a base portion formed with a flow path, and a carrier portion formed with a plurality of second head flow paths communicating with the plurality of first head flow paths and having an elastic film attached thereto; A jig for communicating the first head flow path of the base portion with one end of the flow meter in a state where the portion is removed, wherein the flow meter has a flow path having one end provided in the jig. It is in communication and the other end is open to the atmosphere.

  According to this configuration, if gas leaks from the second flow path to the first flow path, this gas is discharged from the first flow path to the outside via the flow meter, The flow rate of gas can be detected. Thus, by monitoring the gas flow rate detected by the flow meter, it is possible to detect the presence or absence of gas leakage from the second flow path to the first flow path, and there is gas leakage from the gas flow rate. If it can be considered, the control unit can determine that the rotary joint has an abnormality that causes water leakage from the second flow path to the first flow path.

  The substrate processing apparatus according to an eleventh aspect of the present invention is the substrate processing apparatus according to the eighth aspect, wherein a flow path connected to the rotary joint and communicating with the first flow path is provided. The top ring head shaft, further comprising a jig for communicating the flow path of the top ring head shaft and one end of the flow meter with the head portion removed, wherein the flow meter has one end connected to the jig. The other end communicates with the provided flow path and is open to the atmosphere.

  According to this configuration, if gas leaks from the second flow path to the first flow path, the gas is externally transmitted from the first flow path via the flow path provided in the jig and the flow meter. Since the gas is discharged to the flowmeter, the flow rate of the gas can be detected by the flow meter. Thus, by monitoring the gas flow rate detected by the flow meter, it is possible to detect the presence or absence of gas leakage from the second flow path to the first flow path, and there is gas leakage from the gas flow rate. If it can be considered, the control unit can determine that the rotary joint has an abnormality that causes water leakage from the second flow path to the first flow path.

  The substrate processing apparatus according to a twelfth aspect of the present invention is the substrate processing apparatus according to the first aspect, wherein a second gas detecting the gas passing through the second flow path of the switching valve unit and the rotary joint is provided. The rotary joint further comprises a second seal portion for sealing between the quench water and the atmosphere, and the rotary joint is isolated from the second flow path by the second seal portion. And a drain channel that is open to the atmosphere is formed, and the controller is configured to supply the gas to the second channel by switching by the switching valve unit and to close the closing valve. And after the supply of the gas to the second flow path, after a lapse of a predetermined period, from the second flow path using the detection result by the detection unit and the detection result by the second detection unit. To the channel It determines the presence or absence of records.

  According to this configuration, if gas leaks from the second flow path to the first flow path, this gas is discharged from the first flow path to the outside via the detection unit. Gas is detected. On the other hand, if gas leaks from the second flow path to the drain flow path, the gas is continuously detected by the second detection unit, but the gas is not detected by the detection unit. Thus, by monitoring the gas measured by the flow meter and the second flow meter, the presence or absence of gas leakage from the second flow path to the first flow path and the gas flow from the second flow path to the drain flow path The presence or absence of gas leakage can be detected. For this reason, the control unit determines whether there is an abnormality that causes water leakage from the second flow path to the first flow path, and whether there is an abnormality that causes water leakage from the second flow path to the drain flow path. be able to.

  A substrate processing apparatus according to a thirteenth aspect of the present invention is the substrate processing apparatus according to the twelfth aspect, wherein the switching valve unit shuts off supply of quench water to a second flow path of the rotary joint. A first valve capable of shutting off gas supply to a second flow path of the rotary joint; and a second valve capable of shutting off supply of gas to a second flow path of the rotary joint. Is provided in a pipe that communicates the end of the flow path with the second valve.

  According to this configuration, the flow path of the quench water and the gas supplied to the rotary joint is divided, and the second detection unit is provided on the flow path of the gas. For this reason, a flowmeter is provided on the flow path of the quench water, and the pressure loss due to the narrowing of the flow path at the second detection unit, and the constant flow of water to the second detection unit that detects gas The failure of the second detection unit can be prevented beforehand.

  The substrate processing apparatus according to a fourteenth aspect of the present invention is the substrate processing apparatus according to the first aspect, wherein the rotary joint further includes a second seal portion that seals between quench water and the atmosphere. A second flow path for detecting a gas passing through the drain flow path, wherein a drain flow path isolated from the second flow path and opened to the atmosphere is formed by the second seal portion; Further comprising a meter, wherein the control unit uses the detection result by the detection unit when the gas is supplied to the second flow path by the switching by the switching valve unit and the closing valve is closed. Determining whether there is an abnormality that causes water leakage from the second flow path to the first flow path, and using the detection result of the second detection unit to perform the drain flow from the second flow path. Pull water leaks into the road It determines the presence or absence of straining abnormal.

  According to this configuration, if gas leaks from the second flow path to the first flow path, this gas is discharged from the first flow path to the outside via the detection unit. Gas is detected. On the other hand, if the gas leaks from the second flow path to the drain flow path, the gas is discharged to the outside via the second detection unit, so that the gas is detected by the second detection unit. Accordingly, by monitoring the gas with the detection unit and the second detection unit, the presence or absence of gas leakage from the second flow path to the first flow path and the gas leakage from the second flow path to the drain flow path Can be detected. For this reason, the control unit determines whether there is an abnormality that causes water leakage from the second flow path to the first flow path, and whether there is an abnormality that causes water leakage from the second flow path to the drain flow path. be able to.

  The control method according to a fifteenth aspect of the present invention includes: a rotary joint in which a first flow path is formed and a second flow path isolated from the first flow path is formed; A switching valve unit that switches between the second flow path and the gas and supplies it to one end of the second flow path of the rotary joint, and a closing valve that can shut off quench water or gas discharged from the other end of the second flow path. A control method for controlling the substrate processing apparatus provided, comprising: a step of supplying the gas to one end of the second flow path by switching by the switching valve unit and closing the closing valve; and a step of switching by the switching valve unit. In a case where the gas is supplied to one end of the second flow path and the shut-off valve is closed, at least a detection result by a detection unit that detects gas passing through the first flow path There are have a procedure for determining the presence or absence of abnormality of the rotary joint.

  According to this configuration, when there is no leakage from the second flow path to the first flow path, the gas supplied to the second flow path does not leak to the first flow path. Is not detected. On the other hand, when there is a leak from the second flow path to the first flow path, the gas supplied to the second flow path leaks to the first flow path. Is done. Accordingly, the presence or absence of gas leakage from the second flow path to the first flow path can be detected by monitoring the presence or absence of gas by the detection unit. It is possible to determine whether there is an abnormality in the rotary joint that causes water leakage to the road. For this reason, in the state where the rotary joint is mounted on the substrate processing apparatus, it is possible to inspect whether or not there is an abnormality in the rotary joint that causes water leakage from the second flow path to the first flow path.

  According to the present invention, when there is no leakage from the second flow path to the first flow path, the gas supplied to the second flow path does not leak to the first flow path. Is not detected. On the other hand, when there is a leak from the second flow path to the first flow path, the gas supplied to the second flow path leaks to the first flow path. Is done. Accordingly, the presence or absence of gas leakage from the second flow path to the first flow path can be detected by monitoring the presence or absence of gas by the detection unit. It is possible to determine whether there is an abnormality in the rotary joint that causes water leakage to the road. For this reason, in the state where the rotary joint is mounted on the substrate processing apparatus, it is possible to inspect whether or not there is an abnormality in the rotary joint that causes water leakage from the second flow path to the first flow path.

FIG. 2 is a schematic diagram illustrating an overall configuration of a polishing apparatus common to each embodiment. FIG. 2 is a schematic cross-sectional view of the top ring according to the first embodiment. FIG. 2 is a schematic cross-sectional view illustrating main components of a rotary joint 26 according to the first embodiment. FIG. 2 is a schematic diagram illustrating a configuration of a part of the polishing apparatus according to the first embodiment. It is a schematic diagram showing a part of composition of a polish device concerning a 2nd embodiment. It is a schematic diagram showing a part of composition of a polish device concerning a 3rd embodiment. It is a typical sectional view of top ring shaft 111 concerning a 4th embodiment. It is a schematic diagram showing a part of composition of a polish device concerning a 4th embodiment. It is a typical sectional view of jig 218 concerning a 5th embodiment. It is a schematic diagram showing a part of composition of a polish device concerning a 5th embodiment. It is a typical sectional view of jig 219 concerning a 6th embodiment. It is a schematic diagram showing a part of composition of a polish device concerning a 6th embodiment. It is the schematic which shows some structures of the polishing apparatus concerning 7th Embodiment. It is the schematic which shows the structure of some polishing apparatuses which concern on 8th Embodiment.

  Hereinafter, embodiments of the present invention (hereinafter, referred to as embodiments) will be described with reference to the drawings. The substrate processing apparatus is an apparatus that performs processing on a substrate, and includes, for example, a polishing apparatus, an etcher, and a CVD apparatus. Each embodiment will be described using a polishing apparatus as an example of a substrate processing apparatus. The embodiment described below shows an example in which the present invention is implemented, and the present invention is not limited to the specific configuration described below. In carrying out the present invention, a specific configuration according to the embodiment may be appropriately adopted.

<First embodiment>
FIG. 1 is a schematic diagram showing the overall configuration of a polishing apparatus common to each embodiment. As shown in FIG. 1, a polishing apparatus 10 includes a polishing table 100 and a head unit (hereinafter, referred to as a substrate holding apparatus) that holds a substrate such as a semiconductor wafer to be polished and presses the substrate against a polishing surface on the polishing table 100. , A top ring). The polishing table 100 is connected to a motor (not shown) disposed below the polishing table 100 via a table shaft 100a. The polishing table 100 is rotated around a table shaft 100a by rotation of a motor. A polishing pad 101 as a polishing member is attached to an upper surface of the polishing table 100. The surface of the polishing pad 101 constitutes a polishing surface 101a for polishing the semiconductor wafer W. Above the polishing table 100, a polishing liquid supply nozzle 60 is provided. A polishing liquid (polishing slurry) Q is supplied from the polishing liquid supply nozzle 60 onto the polishing pad 101 on the polishing table 100.

There are various types of polishing pads available on the market, for example, SUBA800, IC-1000, IC-1000 / SUBA400 (two-layer cross) manufactured by Nitta Haas, and Surfinxxx manufactured by Fujimi Incorporated. -5 and Surfin 000. SUBA800, Surfin xxx-5, and Surfin 000 are nonwoven fabrics in which fibers are hardened with urethane resin, and IC-1000 is hard foamed polyurethane (single layer). The foamed polyurethane is porous (porous) and has a large number of fine dents or pores on its surface.

  The top ring 1 is a top ring main body 2 that presses the semiconductor wafer W against the polishing surface 101a, and a retainer member that holds the outer peripheral edge of the semiconductor wafer W and prevents the semiconductor wafer W from jumping out of the top ring 1. And a retainer ring 3. The top ring 1 is connected to a top ring shaft 111. The top ring shaft 111 moves up and down with respect to the top ring head 110 by a vertical movement mechanism 124. The positioning of the top ring 1 in the vertical direction is performed by vertically moving the top ring shaft 111 so as to raise and lower the entire top ring 1 with respect to the top ring head 110. The rotary joint 26 is attached to the upper end of the top ring shaft 111.

  A vertical movement mechanism 124 for vertically moving the top ring shaft 111 and the top ring 1 includes a bridge 128 that rotatably supports the top ring shaft 111 via a bearing 126, a ball screw 132 attached to the bridge 128, and a column 130. And a servo motor 138 provided on the support base 129. A support base 129 supporting the servomotor 138 is fixed to the top ring head 110 via a support post 130.

  The ball screw 132 includes a screw shaft 132a connected to the servomotor 138, and a nut 132b with which the screw shaft 132a is screwed. The top ring shaft 111 moves up and down integrally with the bridge 128. Accordingly, when the servo motor 138 is driven, the bridge 128 moves up and down via the ball screw 132, and thereby the top ring shaft 111 and the top ring 1 move up and down.

  Further, the top ring shaft 111 is connected to the rotating cylinder 112 via a key (not shown). The rotary cylinder 112 includes a timing pulley 113 on the outer peripheral portion. A top ring rotating motor 114 is fixed to the top ring head 110, and the timing pulley 113 is connected to a timing pulley 116 provided on the top ring rotating motor 114 via a timing belt 115. Accordingly, when the top ring rotation motor 114 is rotationally driven, the rotating cylinder 112 and the top ring shaft 111 rotate integrally via the timing pulley 116, the timing belt 115, and the timing pulley 113, and the top ring 1 rotates.

  The top ring head 110 is supported by a top ring head shaft 117 rotatably supported by a frame (not shown). The polishing apparatus 10 includes a control unit 500 that controls each device in the apparatus such as a top ring rotation motor 114, a servo motor 138, and a polishing table rotation motor.

  Next, the top ring 1 in the polishing apparatus according to the present embodiment will be described. The top ring 1 holds a semiconductor wafer to be polished and presses it against a polishing surface on the polishing table 100. FIG. 2 is a schematic sectional view of the top ring according to the first embodiment. FIG. 2 shows only the main components constituting the top ring 1.

  As shown in FIG. 2, the top ring 1 includes a base portion 1a connected to the top ring shaft 111, a carrier portion (also referred to as a top ring main body) 2 for pressing the semiconductor wafer W against the polishing surface 101a, It basically comprises a retainer ring 3 as a retainer member for directly pressing the polishing surface 101a. A plurality of first head channels 41,..., 45 for supplying gas or drawing a vacuum are formed in the base portion 1a. The carrier portion 2 is made of a substantially disk-shaped member, and the retainer ring 3 is attached to an outer peripheral portion of the top ring main body 2.

  The carrier section 2 is formed of a resin such as engineering plastic (for example, PEEK). An elastic film (membrane) 4 that is in contact with the back surface of the semiconductor wafer is attached to the lower surface of the carrier unit 2. The elastic film (membrane) 4 is formed of a rubber material having excellent strength and durability, such as ethylene propylene rubber (EPDM), polyurethane rubber, and silicone rubber. The elastic film (membrane) 4 forms a substrate holding surface for holding a substrate such as a semiconductor wafer.

  The elastic membrane (membrane) 4 has a plurality of concentric partition walls 4a, and these partition walls 4a define a circular center chamber 5 and an annular ripple chamber 6 between the upper surface of the membrane 4 and the lower surface of the top ring body 2. , An annular outer chamber 7 and an annular edge chamber 8 are formed. That is, the center chamber 5 is formed at the center of the top ring main body 2, and the ripple chamber 6, the outer chamber 7, and the edge chamber 8 are formed concentrically from the center toward the outer periphery in order. In the top ring main body 2, a second head flow path 11 communicating with the center chamber 5, a second head flow path 12 communicating with the ripple chamber 6, a second head flow path 13 communicating with the outer chamber 7, Second head flow paths 14 communicating with the edge chambers 8 are respectively formed. Thus, the carrier section 2 is formed with the plurality of second head channels 11,..., 15 communicating with the plurality of first head channels 41,.

The second head channel 11 communicating with the center chamber 5 is connected to the pipe 21 via the channel 31 in the top ring shaft 111 and the rotary joint 26.
Similarly, the second head flow path 12 communicating with the ripple chamber 6 is connected to the pipe 22 via the flow path 32 in the top ring shaft 111 and the rotary joint 26.
Similarly, the second head passage 13 communicating with the outer chamber 7 is connected to the pipe 23 via the passage 33 in the top ring shaft 111 and the rotary joint 26.
Similarly, the second head flow path 14 communicating with the edge chamber 8 is connected to the pipe 24 via the flow path 34 in the top ring shaft 111 and the rotary joint 26.

  The pipes 21, 22, 23, and 24 include first branch pipes 21-1, 22-1, 23-1, and 24-1, and second branch pipes 21-2, 22-2, and 23-2, respectively. Branch to 24-2. The first branch pipes 21-1, 22-1, 23-1, 24-1 are respectively valves V1-1, V2-1, V3-1, V4-1, flow meters F1, F2, F3, F4 and It is connected to a gas supply via pressure control valves R1, R2, R3, R4. Here, the pressure control valves R1, R2, R3, R4 are, for example, electropneumatic regulators. The second branch pipes 21-2, 22-2, 23-2, 24-2 are connected to the vacuum source VS via valves V1-2, V2-2, V3-2, V4-2, respectively. ing.

  A retainer ring pressure chamber 9 is also formed directly above the retainer ring 3 by an elastic film (membrane) 16. The elastic membrane (membrane) 16 is accommodated in a cylinder 17 fixed to a flange portion of the top ring 1. The retainer ring pressure chamber 9 is connected to the pipe 25 via a flow path 15 formed in the carrier part 2, a flow path 35 in the top ring shaft 111, and a rotary joint 26. The pipe 25 branches into a first branch pipe 25-1 and a second branch pipe 25-2. The first branch pipe 25-1 is connected to the pressure regulator 30 via a valve V5-1, a flow meter F5, and a pressure control valve R5. Here, the pressure control valve R5 is, for example, an electropneumatic regulator. The second branch pipe 25-2 is connected to a vacuum source VS via a valve V5-2.

  The pressure control valves R1, R2, R3, R4, and R5 respectively supply a pressure fluid (for example, gas) supplied from the gas supply source GS to the center chamber 5, the ripple chamber 6, the outer chamber 7, the edge chamber 8, and the retaining ring pressure chamber 9. ) Has a pressure adjusting function of adjusting the pressure. Pressure control valves R1, R2, R3, R4, R5 and valves V1-1 to V1-2, V2-1 to V2-2, V3-1 to V3-2, V4-1 to V4-2, V5-1 To V5-2 are connected to the control unit 500, and their operations are controlled. For example, the pressure control valves R1, R2, R3, R4, and R5 operate according to a control signal input to the control unit 500. The flow meters F1, F2, F3, F4, F5 detect the flow rates of the gases passing through the respective first branch pipes 21-1, 22-1, 23-1, 24-1, and 25-1. The flow meters F1, F2, F3, F4, F5 are connected to the control unit 500 and output a flow signal indicating the detected flow rate of the gas to the control unit 500.

  The pressure of the fluid supplied to the center chamber 5, the ripple chamber 6, the outer chamber 7, the edge chamber 8, and the retaining ring pressure chamber 9 is independently adjusted by the pressure control valves R1, R2, R3, R4, R5. With such a structure, the pressing force of pressing the semiconductor wafer W against the polishing pad 101 can be adjusted for each region of the semiconductor wafer, and the pressing force of the retainer ring 3 pressing the polishing pad 101 can be adjusted.

  FIG. 3 is a schematic cross-sectional view showing main components of the rotary joint 26 according to the first embodiment. As shown in FIG. 3, the rotary joint 26 includes a rotating portion RR that rotates with the rotation of the head portion 1, fixed portions FR1, FR2, FR3, FR4, FR5 provided around the rotating portion RR, and a fixed portion. And a housing HS to which FR1, FR2, FR3, FR4, and FR5 are fixed.

  The rotating part RR has a structure in which the center is cylindrical and has irregularities in the circumferential direction. In the rotating part RR, cavities isolated from each other are provided. The fixing portions FR1, FR2, FR3, FR4 have a ring-shaped structure having irregularities on the inner peripheral side. The fixing portions FR1, FR2, FR3, FR4 are provided with holes penetrating from the inner peripheral side to the outer peripheral side. One end of each of these holes communicates with the cavity in the rotating portion RR, and the other end communicates with a hole provided in the housing HS. Thereby, the first flow paths 51, 52, 53, 54, 55 (the flow path 55 is not shown) are formed inside the rotary joint 26.

  One end of each of the first flow paths 51, 52, 53, 54, 55 communicates with the flow paths 31, 32, 33, 34, 35 in the top ring shaft 111. The other ends of the first flow paths 51, 52, 53, 54, 55 are connected to pipes 21, 22 via ports T4-1, T4-2, T4-3, T4-4, T4-5 with the outside, respectively. , 23, 24, 25.

  Further, the rotary joint 26 has seal portions MS1 and MS2 for sealing between the rotating portion RR and the fixed portion FR1, seal portions MS3 and MS4 for sealing between the rotating portion RR and the fixed portion FR2, and fixed to the rotating portion RR. Seal portions MS5 and MS6 for sealing between the portion FR3 and seal portions MS7 and MS8 for sealing between the rotating portion RR and the fixed portion FR4. The seal portions MS1 to MS8 seal a gap when the rotating portion RR slides with respect to the fixed portions FR1 to FR4. The seal portions MS1 to MS8 according to the present embodiment are, for example, mechanical seals and have a ring-shaped structure. A second flow path FP2 isolated from the first flow paths 51 to 55 is formed by these seal portions MS1 to MS8. As described above, the rotary joint 26 has the plurality of seal portions MS1 to MS8, and the plurality of first flow channels isolated from the second flow channel FP2 by the plurality of seal portions MS1 to MS8 are formed. Have been. The quench water is supplied from the port T1, flows through the second flow path FP2, and is discharged from the port T2. As shown by the arrow A1 in FIG. 3, when the seal in the seal portion MS7 is loosened, the quench water flowing through the second flow path FP2 leaks to the first flow paths 51 to 55.

  Further, the rotary joint 26 has second seal portions OS1 and OS2 provided between the housing HS and the rotating portion RR to seal between the quench water and the atmosphere, and is provided by the second seal portions OS1 and OS2. Drain flow paths FP3-1 and FP3-2 which are isolated from the second flow path FP2 and open to the atmosphere are formed. The second seal portions OS1 and OS2 according to the present embodiment are, for example, oil seals and have a ring-shaped structure. As shown by the arrow A2 in FIG. 3, when the seal in the second seal portion OS1 is loosened, the quench water flowing through the second flow path FP2 leaks to the drain flow path FP3-1. Similarly, when the seal in the second seal portion OS2 is loosened, the quench water flowing through the second flow path FP2 leaks to the drain flow path FP3-2.

Hereinafter, in each embodiment, a description will be given using a flow meter as an example of a detection unit that detects gas passing through the first flow paths 51 to 55.
Hereinafter, the control of the control unit 500 according to each embodiment will be described with reference to the first flow path 51 and the pipe 21 communicating with the first flow path 51 as a representative example, from the second flow path FP2 to the first flow path. A process for detecting the presence or absence of leakage to 51 will be described.

  FIG. 4 is a schematic diagram illustrating a configuration of a part of the polishing apparatus 10 according to the first embodiment. FIG. 4 shows a schematic connection relationship only with respect to the flow path relating to the first flow path 51. As shown in FIG. 4, the polishing apparatus 10 further includes a quench water flow meter 210 that measures a flow rate of the quench water supplied from the quench water supply source, and is connected to the quench water flow meter 210 and connected to the pressurized gas source. And a switching valve section 209. The switching valve unit 209 switches between quench water and gas and supplies the quench water and the gas to the port T1 which is one end of the second flow path FP2 of the rotary joint 26.

  The polishing apparatus 10 further includes a closing valve 212 that communicates with the port T2, which is the other end of the second flow path FP2, and that can shut off quench water or gas discharged from the other end of the second flow path FP2. As described above, the pressure control valve R1 communicates with the other end of the first branch pipe 21-1 and can supply the gas flowing from the gas supply source to the first branch pipe 21-1 and can release the gas to the atmosphere. It is.

  When the valve V1-2 is shut off, the flow meter F1 measures the flow rate of gas passing through the second branch pipe 21-2 where the pipe 21 communicating with the port T4-1 of the first flow path 51 branches. Thus, the flow rate of the gas passing through the first flow path 51 is detected. As described above, the flow meter F1 is provided in the first branch pipe 21-1. The first branch pipe 21-1 has one end communicating with the port T <b> 4-1, which is the end of the first flow path 51 of the rotary joint 26 on the opposite side to the head 1, via the pipe 21. When the control unit 500 determines whether there is an abnormality in the rotary joint, the first branch pipe 21-1 is on the other end side of the first branch pipe 21-1 with respect to the flow meter F1 (that is, opposite to the rotary joint 26). Side) is open to the atmosphere. In the present embodiment, as an example, the pressure control valve R1 is open to the atmosphere.

  According to this configuration, when there is a gas leak from the second flow path FP2 to the first flow path 51, this gas is supplied to the outside via the pipe 21, the second branch pipe 21-2, and the flow meter F1. The flow rate of the gas is measured by the flow meter F1. Thus, by monitoring the gas flow rate detected by the flow meter F1, it is possible to detect the presence or absence of gas leakage from the second flow path FP2 to the first flow path 51, and the gas leakage is detected. In this case, it is possible to detect that the corresponding seal portion MS1 or MS2 has a seal abnormality.

  The gas is supplied to one end of the second flow path FP2 by the switching by the switching valve unit 209, the closing valve 212 is closed, the valve V1-2 is closed, and the pressure control valve R1 is open to the atmosphere. Assume the case. In this case, the control unit 500 determines whether or not the rotary joint 26 is abnormal, using at least the flow rate of the gas detected by the flow meter F1. Here, the abnormality of the rotary joint 26 is, specifically, an abnormality of the seal of the seal portions MS1, MS2 that isolates the second flow path FP2 from the first flow path 51.

  When there is no leakage from the second flow path FP2 to the first flow path 51, the gas supplied to the second flow path FP2 does not leak to the first flow path FP1, so that the flow rate of the gas in the flow meter is measured. Is not detected. On the other hand, when there is a leak from the second flow path FP2 to the first flow path 51, the gas supplied to the second flow path FP2 leaks to the first flow path 51. In F1, the flow rate of the gas is detected. Thus, by monitoring the gas flow rate detected by the flow meter F1, it is possible to detect the presence or absence of gas leakage from the second flow path FP2 to the first flow path 51, and the gas leakage is detected. In such a case, it is determined that there is an abnormality in the seal by the seal portions MS1 and MS2. For this reason, in the state where the rotary joint 26 is mounted on the polishing apparatus 10, it is determined whether or not there is an abnormality in the rotary joint 26 that causes water leakage from the second flow path FP <b> 2 to the first flow path 51. Can be. Further, the flow rate of gas when supplying gas to the head section 1 and the flow rate of gas when gas leaks from the second flow path FP2 to the first flow path 51 can be detected by one flow meter F1. it can. For this reason, when the flow meter F1 that measures the flow rate of the gas when supplying the gas to the head unit 1 was previously used, there is no need to newly install the flow meter F1. Labor and cost can be reduced.

  The controller 500 may determine that the rotary joint 26 is abnormal when gas is detected by the flow meter F1.

  Alternatively, the controller 500 may determine that the rotary joint 26 is abnormal when the flow rate detected by the flow meter F1 exceeds a predetermined threshold. As described above, when gas is detected by the flow meter F1 exceeding the threshold value, there is a gas leak from the second flow path FP2 to the first flow path 51, and therefore, the seal portion MS1 corresponding to the flow meter F1, It is possible to detect that there is a seal abnormality in MS2.

  Alternatively, when the head unit 1 is being rotated at a lower speed (for example, a slow speed such as 1 rpm) than at the time of substrate processing (for example, polishing), the control unit 500 determines the flow rate detected by the flow meter F1. Is used to determine that the rotary joint 26 is abnormal. Thus, by rotating the head unit 1 at a slower speed than during substrate processing (for example, during polishing), the rotating unit RR rotates around while suppressing heat generated by sliding between the rotating unit RR and the fixed units FR1 to FR4. When rotating in the direction and rubbing against the fixed portions FR1 to FR4, it is possible to detect whether or not there is gas leakage from the second flow path FP2 to the first flow path 51. Therefore, in a state closer to the time of substrate processing (for example, the time of polishing), it is inspected whether or not there is an abnormality in the rotary joint 26 that causes water leakage from the second flow path FP2 to the first flow path 51. be able to.

  Similarly, the control unit 500 uses the flow rates of the flow meters F2, F3, F4, and F5 to determine whether there is an abnormality in the seal units MS3 to MS8 corresponding to the flow meters F2, F3, F4, and F5. Thereby, for each of the plurality of first flow paths 51 to 55, it is possible to detect the presence or absence of gas leakage from the second flow path FP2 to the first flow path 51, 52, 53, 54 or 55. If a gas leak is detected, it is determined that the corresponding seal portions MS1 to MS8 have a seal abnormality. For this reason, since it is possible to specify which seal has an abnormality, repair becomes easy. Further, only the part (for example, the seal portion) related to the seal having the abnormality can be replaced, and the number of replacement parts can be reduced.

  Further, when the object to be polished (for example, a wafer) is not shaved or excessively shaved during polishing, if a gas leaks at a seal portion corresponding to the specific region, an abnormality is found in the seal portion. Since water enters and mixes with the gas into the center chamber 5, the annular ripple chamber 6, the annular outer chamber 7, or the annular edge chamber 8 during polishing, bubbles are generated in the water, Since the object to be polished cannot be pressed with the correct pressure, it can be used to analogize the cause of the fact that a specific area was not cut or was cut too much.

<Second embodiment>
Next, a second embodiment will be described with reference to FIG. In the first embodiment, if the water remaining in the second flow path FP2 leaks into the first flow path 51, the water flows into the pressure control valve R1, and the pressure control valve R1 may fail. There is. Therefore, in the polishing apparatus 10-2 according to the second embodiment, a switching valve unit (second switching valve) 201 is provided between the pressure control valve R1 and the flow meter F1, so that the pressure control valve R1 Prevent water intrusion.

  FIG. 5 is a schematic diagram illustrating a configuration of a part of a polishing apparatus 10-2 according to the second embodiment. FIG. 5 shows a schematic connection relationship only for the flow path related to the first flow path 51. As shown in FIG. 5, as compared with the configuration of the polishing apparatus 10 of the first embodiment shown in FIG. 4, the polishing apparatus 10-2 has a first branch pipe 21- on the rotary joint 26 side from the pressure control valve R1. 1 provided with a switching valve portion SB1 that can switch between communication with the pressure control valve R1 and communication with the atmosphere.

Here, the switching valve portion SB1 has one end communicating with the flow meter F1 and the other end communicating with the pressure control valve R1, and a valve V1-3 having one end communicating with the flow meter F1 and the other end being open to the atmosphere. Valves V1 to V4. The valves V1-3 and V1-4 are connected to the control unit 500, and their operations are controlled.
Note that the polishing apparatus 10-2 includes switching valve units SB2, SB3, SB4, and SB5, like the switching valve unit SB1, but their description is omitted.

  The flow meter F1 is provided in the first branch pipe 21-1 on the rotary joint 26 side from the switching valve SB1.

  Here, the gas is supplied to the second flow path FP2 by the switching by the switching valve section SB1, the closing valve 212 is closed, and the switching valve section SB1 cuts off the communication with the pressure control valve R1 and communicates with the atmosphere. Assume that there is. Here, the case where the switching valve portion SB1 blocks communication with the pressure control valve R1 and communicates with the atmosphere means, specifically, a state in which the valve V1-3 is closed and the valve V1-4 is open. is there. In this case, the control unit 500 determines whether or not the rotary joint 26 is abnormal, using at least the flow rate of the gas detected by the flow meter F1.

  As a result, communication with the pressure control valve R1 is interrupted by the switching valve portion SB1, so that even if water remaining in the second flow path FP2 leaks to the first flow path 51, the water is There is no danger of being shut off by the switching valve section SB1 and flowing into the pressure control valve R1. This prevents water from flowing into the pressure control valve R1 when determining whether there is an abnormality in the rotary joint 26, so that the pressure control valve R1 is not likely to fail due to water.

<Third embodiment>
Subsequently, a third embodiment will be described. The polishing apparatus 10-3 according to the third embodiment is different from the polishing apparatus 10 according to the first embodiment in that a flow meter F6 is further provided on the pipe 21.
FIG. 6 is a schematic diagram illustrating a configuration of a part of a polishing apparatus 10-3 according to the third embodiment. FIG. 6 shows a schematic connection relationship only for the flow path related to the first flow path 51. As shown in FIG. 5, as compared with the configuration of the polishing apparatus 10 of the first embodiment shown in FIG. 4, the polishing apparatus 10-3 has a flow meter F6 provided on the pipe 21 and one end connected to the flow meter F6. And a valve V1-5 communicating with the other end and open to the atmosphere. Here, the valve V1-5 functions as the switching valve unit SB1-2 together with the valve V1-1.

  Here, the gas is supplied to the second flow path FP2 by the switching by the switching valve section SB1, the closing valve 212 is closed, and the switching valve section 204 cuts off the communication with the pressure control valve R1 and communicates with the atmosphere. Assume that there is. Here, the case where the switching valve unit 204 interrupts the communication with the pressure control valve R1 and communicates with the atmosphere is, specifically, a state in which the valve V1-1 is closed and the valve 204 is open. In this case, the control unit 500 determines whether there is an abnormality in the rotary joint 26 using at least the flow rate of the gas detected by the flow meter F6.

  As a result, the communication with the pressure control valve R1 is interrupted by the switching valve unit 204, so that even if water remaining in the second flow path FP2 leaks into the first flow path 51, the water is There is no risk of being shut off by the switching valve section 204 and flowing into the pressure control valve R1. This prevents water from flowing into the pressure control valve R1 when determining whether there is an abnormality in the rotary joint 26, so that the pressure control valve R1 is not likely to fail due to water.

  The polishing apparatus 10-3 includes, similarly to the switching valve section SB1-2, switching valve sections SB2-2, SB3- in the first branch pipes 22-1, 23-1, 24-1, and 25-1, respectively. 2, SB4-2 and SB5-2 are provided, but their description is omitted. In the polishing apparatus 10-2, similarly to the flow meter F6, the flow meters F7, 8, 9, and 10 are provided in the pipes 22, 23, 24, and 25, respectively, but the description thereof is omitted.

<Fourth embodiment>
Subsequently, a fourth embodiment will be described. The polishing apparatus 10-4 according to the fourth embodiment is different from the polishing apparatus 10-3 according to the third embodiment in that a flow meter F11 is provided on the head unit 1 side with respect to the rotary joint 26. .

  FIG. 7 is a schematic sectional view of a top ring shaft 111 according to the fourth embodiment. As shown in FIG. 7, the top ring shaft 111 is provided with flow meters F11, F12, F13, F14, F15 in the flow paths 31, 32, 33, 34, 35, respectively, and the flow paths 31, 32, 33 , 34, 35 are measured. The flow meters F11, F12, F13, F14, and F15 are connected to the wireless transmitter 214, and the flow signals obtained by the measurement by the flow meters F11 to F15 are supplied to the wireless transmitter 214. 214 wirelessly transmits. The wireless transmitter 214 is connected to a power supply 213 and is driven by the power supplied from the power supply 213.

  FIG. 8 is a schematic diagram illustrating a partial configuration of a polishing apparatus 10-4 according to the fourth embodiment. FIG. 8 shows a schematic connection relationship only for the flow path related to the first flow path 51. As shown in FIG. 8, the polishing apparatus 10-4 according to the fourth embodiment is different from the configuration of the polishing apparatus 10 according to the first embodiment shown in FIG. 31 further includes a flow meter F11 provided at 31 and a valve V1-6 having one end connected to the flow meter F11 and the other end open to the atmosphere. Further, the polishing apparatus 10-4 according to the fourth embodiment includes a wireless transmitter 214 connected to the flow meters F11 to F15, a power supply 213 connected to the wireless transmitter 214, and a wireless transmitter connected to the control unit 500. And a receiver 217.

  The wireless receiver 217 receives the flow signal wirelessly transmitted from the wireless transmitter 214 and outputs the received flow signal to the control unit 500. Thereby, the control unit 500 can acquire the flow rates measured by the flow meters F11 to F15. As described above, the top ring shaft 111 is provided with the channel 31 that connects the head unit 1 and the rotary joint 26 and communicates with the first channel 51.

  Here, the gas is supplied to one end of the second flow path FP2 by the switching by the switching valve unit 209, the closing valve 212 is closed, the valves V1-1 and V1-2 are closed, and the valve V1 is closed. Assume that -6 is open. In this case, the control unit 500 determines whether or not the rotary joint 26 is abnormal, using at least the flow rate of the gas detected by the flow meter F11.

  According to this configuration, if a gas leaks from the second flow path FP2 to the first flow path 51, the gas flows from the first flow path 51 to the outside via the flow path 31 and the flow meter F11. Since the gas is discharged, the flow rate of the gas is detected by the flow meter F11. Thus, by monitoring the gas flow rate detected by the flow meter F11, the presence or absence of gas leakage from the second flow path FP2 to the first flow path 51 can be detected. If it can be determined that there is a leak, the control unit 500 can determine that the rotary joint 26 has an abnormality that causes water to leak from the second flow path FP2 to the first flow path 51.

  Although the polishing apparatus 10-4 has valves V2-6, V3-6, V4-6, and V5-6 provided in the flow meters F12, F13, F14, and F15, respectively, like the valve V1-6. , Description thereof will be omitted.

<Fifth embodiment>
Subsequently, a fifth embodiment will be described. The polishing apparatus 10-5 according to the fifth embodiment differs from the polishing apparatus 10-4 according to the fourth embodiment in that the base 1a of the head 1 is removed with the carrier 2 of the head 1 removed. Is connected to the jig 218, and one end of the flow meter F11 is connected to the jig 218 and the other end is open to the atmosphere.

  FIG. 9 is a schematic sectional view of a jig 218 according to the fifth embodiment. As shown in FIG. 9, the jig 218 is provided with channels 61, 62, 63, 64, and 65, and is provided with O-rings O1 to O10 on the upper surface. A pipe 71 having one end communicating with the flow channel 61 and the other end communicating with one end of the flow meter F11 is connected to the lower surface of the jig 218. Similarly, a pipe 72 having one end communicating with the flow path 62 and the other end communicating with one end of the flow meter F12 is connected to the lower surface of the jig 218. Similarly, a pipe 73 having one end communicating with the flow path 63 and the other end communicating with one end of the flow meter F13 is connected to the lower surface of the jig 218. Similarly, a pipe 74 having one end communicating with the flow path 64 and the other end communicating with one end of the flow meter F14 is connected to the lower surface of the jig 218. Similarly, a pipe 75 having one end communicating with the flow path 65 and the other end communicating with one end of the flow meter F15 is connected to the lower surface of the jig 218. Here, the other ends of the flow meters F11, F12, F13, F14, and F15 are open to the atmosphere.

  The O-rings O1 to O10 are adhered to the lower surface of the base 1a of the head 1 by pressing the upper surface of the jig 218 against the lower surface of the base 1a of the head 1 with pressure. As a result, the flow paths 61, 62, 63, 64, and 65 communicate with the first head flow paths 41, 42, 43, 44, and 45 in the corresponding head unit 1, respectively. Each of 63, 64, 65 communicates with the corresponding first flow path 51, 52, 53, 54, 55 of the rotary joint 26. In this manner, the jig 218 allows the first head channels 41 to 45 of the base 1a to communicate with one ends of the corresponding flow meters F11 to F15 in a state where the carrier 2 is removed.

  FIG. 10 is a schematic diagram illustrating a configuration of a part of a polishing apparatus 10-5 according to the fifth embodiment. FIG. 10 shows a schematic connection relationship only with respect to the flow path relating to the first flow path 51. As shown in FIG. 10, as compared with the configuration of the polishing apparatus 10 of the first embodiment shown in FIG. 4, the polishing apparatus 10-5 according to the fifth embodiment has the carrier part 2 of the head part 1 removed. A jig 218 that allows the first head flow path 41 (see FIG. 9) of the base portion to communicate with one end of the flow meter F11 in a state where the flow path is provided in the jig 218 through the pipe 71. And a flow meter F11 communicating with the other end and open to the atmosphere.

  Here, it is assumed that the gas is supplied to one end of the second flow path FP2 by the switching by the switching valve unit 209, the closing valve 212 is closed, and the valves V1-1 and V1-2 are closed. I do. In this case, the control unit 500 determines whether or not the rotary joint 26 is abnormal, using the gas flow rate detected by the flow meter F11.

  According to this configuration, if a gas leaks from the second flow path FP2 to the first flow path 51, the gas flows from the first flow path 51 to the outside via the flow path 31 and the flow meter F11. Since the gas is discharged, the flow rate of the gas can be detected by the flow meter F11. Thus, by monitoring the gas flow rate detected by the flow meter F11, the presence or absence of gas leakage from the second flow path FP2 to the first flow path 51 can be detected. If it can be determined that there is a leak, the control unit 500 can determine that the rotary joint 26 has an abnormality that causes water to leak from the second flow path FP2 to the first flow path 51.

<Sixth embodiment>
Next, a sixth embodiment will be described. The polishing apparatus 10-6 according to the sixth embodiment is different from the polishing apparatus 10-5 according to the fifth embodiment in that not only the carrier section 2 of the head section 1 but also the entire head section 1 is removed. A jig 219 is connected to the top ring shaft 111, and one end of the flow meter F11 is connected to the jig 219 and the other end is open to the atmosphere.

  FIG. 11 is a schematic sectional view of a jig 219 according to the sixth embodiment. As shown in FIG. 11, the jig 219 is provided with flow paths 81, 82, 83, 84 and 85, and provided with O-rings O11 to O16 on the upper surface. Further, a pipe 91 having one end communicating with the flow path 81 and the other end communicating with one end of the flow meter F11 is connected to the lower surface of the jig 219. Similarly, a pipe 92 having one end communicating with the flow path 82 and the other end communicating with one end of the flow meter F12 is connected to the lower surface of the jig 219. Similarly, a pipe 93 having one end communicating with the flow path 83 and the other end communicating with one end of the flow meter F13 is connected to the lower surface of the jig 219. Similarly, a pipe 94 having one end communicating with the flow path 84 and the other end communicating with one end of the flow meter F14 is connected to the lower surface of the jig 219. Similarly, a pipe 95 having one end communicating with the flow path 85 and the other end communicating with one end of the flow meter F15 is connected to the lower surface of the jig 219. Here, the other ends of the flow meters F11, F12, F13, F14, and F15 are open to the atmosphere.

The O-rings O11 to O16 are adhered to the lower surface of the top ring shaft 111 by pressing the upper surface of the jig 219 against the lower surface of the top ring shaft 111 by applying pressure. Accordingly, the flow paths 81, 82, 83, 84, and 85 communicate with the flow paths 31, 32, 33, 34, and 35 in the corresponding top ring shaft 111, respectively. , 85 communicate with the first flow paths 51, 52, 53, 54, 55 of the corresponding rotary joint 26.
As described above, the top ring shaft 111 is provided with the flow paths 31 to 35 that are connected to the rotary joint 26 and communicate with the first flow paths 51 to 55. Then, the jig 219 allows the flow paths 31 to 35 of the top ring shaft 111 to communicate with one ends of the corresponding flow meters F11 to F15 in a state where the head portion 1 is removed.

  FIG. 12 is a schematic diagram illustrating a configuration of a part of a polishing apparatus 10-6 according to the sixth embodiment. FIG. 12 shows a schematic connection relationship only with respect to the flow path relating to the first flow path 51. As shown in FIG. 12, the polishing apparatus 10-6 according to the sixth embodiment is different from the configuration of the polishing apparatus 10 of the first embodiment shown in FIG. A jig 219 for connecting the flow path 31 of the shaft 111 to one end of the flow meter F11, and one end is connected to a flow path 81 (see FIG. 11) provided in the jig 219 via a pipe 91 and the other end is connected. And a flow meter F11 open to the atmosphere.

  Here, it is assumed that the gas is supplied to one end of the second flow path FP2 by the switching by the switching valve unit 209, the closing valve 212 is closed, and the valves V1-1 and V1-2 are closed. I do. In this case, the control unit 500 determines whether or not the rotary joint 26 is abnormal, using the gas flow rate detected by the flow meter F11.

  According to this configuration, if gas leaks from the second flow path FP2 to the first flow path 51, this gas flows from the first flow path 51 to the flow path 31 and the flow path provided in the jig 219. Since the gas is discharged to the outside via the flow meter 81 and the flow meter F11, the flow rate of gas can be detected by the flow meter F11. Thus, by monitoring the gas flow rate detected by the flow meter F11, the presence or absence of gas leakage from the second flow path FP2 to the first flow path 51 can be detected. If it can be determined that there is a leak, the control unit 500 can determine that the rotary joint 26 has an abnormality that causes water to leak from the second flow path FP2 to the first flow path 51.

<Seventh embodiment>
Next, a seventh embodiment will be described. The polishing apparatus 10-7 according to the seventh embodiment is different from the polishing apparatus 10 according to the first embodiment in that a second flow rate is determined by using a flow meter F1 and a flow meter (second flow meter) 16. The presence / absence of gas leakage from the path FP2 to the drain flow paths FP3-1 and FP3-2 is also detected.

  FIG. 13 is a schematic diagram illustrating a partial configuration of a polishing apparatus 10-7 according to the seventh embodiment. FIG. 13 shows a schematic connection relationship only for the flow path relating to the first flow path 51. As shown in FIG. 13, the polishing apparatus 10-7 according to the seventh embodiment is different from the polishing apparatus 10 according to the first embodiment shown in FIG. The apparatus further includes a flow meter F16 for measuring a gas flow rate (hereinafter, referred to as a second flow rate) between the second flow path FP2. Here, the direction of the second flow rate from the valve 209-2 to the rotary joint 26 is positive. Further, as described above, the rotary joint 26 has the second seal portions OS1 and OS2 (see FIG. 3) for sealing between the quench water and the atmosphere, and the second seal portions OS1 and OS2 make the second seal portions OS1 and OS2. Drain channels FP3-1 and FP3-2 which are isolated from the channel FP2 and open to the atmosphere.

  In addition, when the flow meter F16 is provided on the flow path of the quench water, the flow path becomes narrow at the flow meter F16, resulting in a pressure loss, and when water is constantly flowing through the flow meter F16 for detecting gas, the flow meter F16 is released. there is a possibility. In order to prevent them from occurring, in the present embodiment, the flow path of the quench water and the gas supplied to the rotary joint 26 is divided, and the flow meter F16 is provided on the flow path of the gas.

  That is, in the present embodiment, the switching valve unit 209 includes a valve (also referred to as a first valve) 209-1 that can shut off the supply of the quench water to the second flow path of the rotary joint 26, A valve (also referred to as a second valve) 209-2 capable of shutting off supply of gas to the second flow path FP2. The flow meter F16 is provided on a pipe that communicates an end of the second flow path FP2 of the rotary joint 26 with a valve (second valve) 209-2.

  According to this configuration, the flow path of the quench water and the gas supplied to the rotary joint 26 is divided and provided on the flow meter F16 on the flow path of the gas. For this reason, a flow meter F16 is provided on the flow path of the quench water and a pressure loss due to the flow path becoming narrower at the flow meter F16, and a flow meter F16 due to constantly flowing water through the flow meter F16 for detecting gas. Can be prevented beforehand.

  The gas is supplied to the second flow path FP2 by switching by the switching valve unit 209, the closing valve 212 is closed, the valve V1-2 is closed, and the pressure control valve R1 is open to the atmosphere. Suppose. The control unit 500 uses the flow rate measured by the flow meter F1 and the flow rate measured by the flow meter F16 after a predetermined period has elapsed after the supply of the gas to the second flow path FP2, and The presence or absence of leakage from the FP2 to the drain flow path is determined. Here, the predetermined period is set to a time equal to or longer than the time when it is expected that a gas that satisfies the entire volume of the flow path that communicates with the second flow path FP will flow.

Specifically, if a predetermined period of time has passed after the gas was supplied to the second flow path FP2 and a gas that satisfies the entire volume of the flow path communicating with the second flow path FP flows in, the second flow path FP2 is temporarily stopped. If there is no gas leakage from the second flow path FP2, no gas flows from the pressurized gas source to the rotary joint 26, and the flow rate of the gas detected by the flow meter F16 becomes equal to or less than the threshold value.
On the other hand, if the gas leaks from the second flow path FP2 to the first flow path after the elapse of the predetermined period, the entire volume of the flow path communicating with the second flow path FP is not filled with the gas. Therefore, the gas flows from the pressurized gas source to the rotary joint 26, and the flow rate of the gas detected by the flow meter F16 exceeds the threshold value. At this time, if the flow rate measured by the flow meter F1 falls within a predetermined range based on the flow rate detected by the flow meter F16, the flow rate measured by the flow meter F1 is almost the same as the flow rate detected by the flow meter F16. Therefore, the control unit 500 determines that there is gas leakage from the second flow path FP2 to the first flow path.

  On the other hand, if the gas leaks from the second flow path FP2 to the first flow path after a predetermined period has elapsed, the entire volume of the flow path communicating with the second flow path FP is not filled with the gas. Therefore, similarly, the gas flows from the pressurized gas source to the rotary joint 26, and the flow rate of the gas detected by the flow meter F16 exceeds the threshold value. At this time, when the flow rate measured by the flow meter F1 falls below a predetermined range based on the flow rate detected by the flow meter F16, gas leakage from the second flow path FP2 to the first flow path is performed. Control unit 500 determines that there is no gas leak from the second flow path FP2 to the drain flow paths FP3-1 and FP3-2.

  As described above, when the second flow rate measured by the flow meter F16 exceeds the threshold after a predetermined period has elapsed after the supply of the gas to the second flow path FP2, the first flow rate measured by the flow meter F1 is determined. When the flow rate is substantially the same as the second flow rate, that is, within a predetermined range based on the second flow rate, the control unit 500 determines that the gas leaks from the second flow path FP2 to the first flow path 51. I do. On the other hand, when the first flow rate is lower than the predetermined range based on the second flow rate, the control unit 500 determines that the gas leaks from the second flow path FP2 to the drain flow paths FP3-1 and FP3-2. judge.

  According to this configuration, if gas leaks from the second flow path FP2 to the first flow path 51, the gas flows from the first flow path 51 to the pipe 21, the first branch pipe 21-1, and the flow rate. Since the gas is discharged to the outside via the meter F1 and the pressure control valve R1, the flow rate of the gas is measured by the flow meter F1. On the other hand, if the gas leaks from the second flow path FP2 to the drain flow paths FP3-1 and FP3-2, the flow rate of the gas is continuously measured by the flow meter F16, but the flow rate of the gas is measured by the flow meter F1. Not done. Accordingly, by monitoring the gas flow rate measured by the flow meter F1 and the flow meter F16, the presence or absence of gas leakage from the second flow path FP2 to the first flow path 51 and the gas flow from the second flow path FP2 The presence or absence of gas leakage to the drain flow paths FP3-1 and FP3-2 can be detected. For this reason, the control unit 500 determines whether there is an abnormality that causes water leakage from the second flow path FP2 to the first flow path 51, and determines whether there is an abnormality from the second flow path FP2 to the drain flow paths FP3-1 and FP3-2. It is possible to determine the presence or absence of an abnormality that causes water leakage.

<Eighth embodiment>
Next, an eighth embodiment will be described. The polishing apparatus 10-8 according to the eighth embodiment differs from the polishing apparatus 10 according to the first embodiment in that a flow meter (second flow meter) F21 and a flow meter (second flow meter) F22 are used. Also, the presence or absence of gas leakage from the second flow path FP2 to the drain flow paths FP3-1 and FP3-2 is detected.

  FIG. 14 is a schematic diagram illustrating a configuration of a part of a polishing apparatus 10-8 according to the eighth embodiment. FIG. 14 shows a schematic connection relationship only for the flow path relating to the first flow path 51. As shown in FIG. 14, compared with the configuration of the polishing apparatus 10 of the first embodiment shown in FIG. 4, the polishing apparatus 10-8 according to the eighth embodiment communicates with the port T3-1 of the rotary joint 26. And a flow meter F22 communicating with the port T3-2 of the rotary joint 26. The flow meter F21 detects the flow rate of the gas passing through the drain flow path FP3-1. The flow meter F22 detects the flow rate of the gas passing through the drain flow path FP3-2.

  Further, as described above, the rotary joint 26 has the second seal portions OS1 and OS2 (see FIG. 3) for sealing between the quench water and the atmosphere, and the second seal portions OS1 and OS2 make the second seal portions OS1 and OS2. Drain channels FP3-1 and FP3-2 which are isolated from the channel FP2 and open to the atmosphere.

  The gas is supplied to the second flow path FP2 by the switching by the switching valve unit 209, the closing valve 202 is closed, the valve V1-2 is closed, and the pressure control valve R1 is open to the atmosphere. Suppose. In this case, the control unit 500 determines whether there is an abnormality that causes water leakage from the second flow path FP2 to the first flow path 51 using the flow rate of the gas detected by the flow meter F1. Further, the control unit 500 determines whether there is an abnormality that causes water leakage from the second flow path FP2 to the drain flow path FP3-1, using the flow rate of the gas detected by the flow meter F21. Similarly, control unit 500 determines whether there is an abnormality that causes water leakage from second flow path FP2 to drain flow path FP3-2, using the flow rate of the gas detected by flow meter F22.

  According to this configuration, if gas leaks from the second flow path FP2 to the first flow path 51, the gas flows from the first flow path 51 to the pipe 21, the first branch pipe 21-1, and the flow rate. Since the gas is discharged to the outside via the meter F1 and the pressure control valve R1, the flow rate of the gas is measured by the flow meter F1. On the other hand, if gas leaks from the second flow path FP2 to the drain flow path FP3-1 or FP3-2, this gas is discharged to the outside via the flow meter F21 or F22, so that the flow meter F21 or In F22, the flow rate of the gas is measured. Thus, by monitoring the flow rate of the gas measured by the flow meter F1 and the flow meters F21 or F22, the presence or absence of gas leakage from the second flow path FP2 to the first flow path 51 and the second flow path The presence or absence of gas leakage from FP2 to the drain flow path FP3-1 or FP3-2 can be detected. For this reason, the control unit 500 determines whether there is an abnormality that causes water leakage from the second flow path FP2 to the first flow path 51, and determines whether there is an abnormality from the second flow path FP2 to the drain flow path FP3-1 or FP3-2. It is possible to determine the presence or absence of an abnormality that causes water leakage.

  Further, in each embodiment, the flow meter has been described as an example of the detection unit that detects the gas passing through the first flow paths 51 to 55. However, the present invention is not limited to this, and other detectors (sensors) may be used. Alternatively, a measuring device may be used as long as it is a detecting unit that detects gas passing through the first flow paths 51 to 55. In this case, the control unit 500 uses at least the detection result by the detection unit when the gas is supplied to one end of the second flow path FP2 and the closing valve 212 is closed by switching by the switching valve unit 209. What is necessary is just to determine the presence or absence of the abnormality of the rotary joint 26.

  Here, when there is no leakage from the second flow path FP2 to the first flow path 51, since the gas supplied to the second flow path FP2 does not leak to the first flow path FP1, the detection unit No gas detected. On the other hand, when there is a leak from the second flow path FP2 to the first flow path 51, the gas supplied to the second flow path FP2 leaks to the first flow path 51. At F1, gas is detected. Accordingly, the presence or absence of gas can be detected by monitoring the presence / absence of gas by the detection unit, and the presence / absence of gas leakage from the second flow path FP2 to the first flow path 51 can be detected. It turns out that there is an abnormality in the seal by the seal parts MS1 and MS2. Therefore, in a state where the rotary joint 26 is mounted on the polishing apparatus 10, an abnormality that causes water leakage from the second flow path FP2 to the first flow path 51 can be detected.

  In this case, each of the first flow paths 51 to 55 may include a detection unit that detects a gas passing through the first flow path. In this case, the control unit 500 determines whether or not there is an abnormality in the seal units MS1 to MS8 corresponding to the detection units using the detection results of the detection units.

  Thereby, for each of the plurality of first flow paths 51 to 55, it is possible to detect the presence or absence of gas leakage from the second flow path FP2 to the first flow path 51, 52, 53, 54 or 55. If a gas leak is detected, it is determined that the corresponding seal portions MS1 to MS8 have a seal abnormality. For this reason, since it is possible to specify which seal has an abnormality, repair becomes easy. Further, only the part (for example, the seal portion) related to the seal having the abnormality can be replaced, and the number of replacement parts can be reduced.

  Further, for example, the control unit 500 may determine that the rotary joint 26 is abnormal when gas is detected by the detection unit. As described above, when gas is detected by the detection unit, there is a gas leak from the second flow path FP2 to the first flow path 51, so that a seal abnormality occurs in the seal parts MS1 to MS8 corresponding to the detection parts. Something can be detected.

  In the seventh embodiment, the description has been made using the flow meter (second flow meter) F16. However, the present invention is not limited to this, and another detector (sensor) or measuring device may be used. Any detection unit (second detection unit) that detects gas passing between the 209 and the second flow path FP2 of the rotary joint 206 may be used. In this case, the control unit 500 detects the detection result by the detection unit and the detection result by the second detection unit when the gas is supplied to the second flow path by the switching by the switching valve unit 209 and the closing valve 212 is closed. The presence or absence of leakage from the second flow path FP2 to the drain flow paths FP3-1 and FP3-2 may be determined using the result.

  According to this configuration, if gas leaks from the second flow path to the first flow path, this gas is discharged from the first flow path to the outside via the detection unit. Gas is detected. On the other hand, if gas leaks from the second flow path FP2 to the drain flow paths FP3-1 and FP3-2, the gas is continuously detected by the second detection unit, but the gas is not detected by the detection unit. Thus, by monitoring the gas measured by the flow meter and the second flow meter, the presence / absence of gas leakage from the second flow path FP2 to the first flow path 51 and the drain from the second flow path FP2 The presence or absence of gas leakage to the flow paths FP3-1 and FP3-2 can be detected. For this reason, the control unit determines whether there is an abnormality that causes water leakage from the second flow path FP2 to the first flow path 51, and determines whether there is an abnormality from the second flow path FP2 to the drain flow paths FP3-1 and FP3-2. The presence or absence of an abnormality that causes water leakage can be determined.

  In this case, the second detection unit is provided in a pipe that communicates the end T1 of the second flow path FP2 of the rotary joint 26 with the valve (second valve) 209-2. According to this configuration, the flow path of the quench water and the gas supplied to the rotary joint 26 is divided, and the second detection unit is provided on the flow path of the gas. For this reason, a flowmeter is provided on the flow path of the quench water, and the pressure loss due to the narrowing of the flow path at the second detection unit, and the constant flow of water to the second detection unit that detects gas The failure of the second detection unit can be prevented beforehand.

  In the eighth embodiment, the flowmeters (second flowmeters) F21 and F22 have been described. However, the present invention is not limited to this, and other detectors (sensors) or measuring devices may be used. Any detection unit (second detection unit) that detects gas passing through the flow paths FP3-1 and FP3-2 may be used. In this case, when the gas is supplied to the second flow path FP2 by the switching by the switching valve unit 209 and the closing valve 212 is closed, the control unit 500 uses the detection result by the detecting unit to perform the second The presence / absence of an abnormality that causes water leakage from the flow path FP2 to the first flow path 51 is determined, and the detection result of the second detection unit is used to switch from the second flow path FP2 to the drain flow paths FP3-1 and FP3. The presence or absence of an abnormality that causes water leakage to −2 may be determined.

  According to this configuration, if gas leaks from the second flow path FP2 to the first flow path 51, this gas is discharged from the first flow path 51 to the outside via the detection unit. Gas is detected by the detection unit. On the other hand, if gas leaks from the second flow path FP2 to the drain flow paths FP3-1 and FP3-2, this gas is discharged to the outside via the second detection unit, so that the second detection Gas is detected in the section. Accordingly, by monitoring the gas with the detection unit and the second detection unit, the presence or absence of gas leakage from the second flow path to the first flow path and the gas leakage from the second flow path to the drain flow path Can be detected. For this reason, the control unit determines whether there is an abnormality that causes water leakage from the second flow path FP2 to the first flow path 51, and determines whether there is an abnormality from the second flow path FP2 to the drain flow paths FP3-1 and FP3-2. The presence or absence of an abnormality that causes water leakage can be determined.

  In each embodiment, the control unit 500 controls the valves V1-1 to V1-2, V2-1 to V2-2, V3-1 to V3-2, V4-1 to V4-2, and V5-1 to V5- Although the opening and closing of the valve 2 is controlled, the operator may open and close these valves.

  As described above, the present invention is not limited to the above-described embodiments as they are, and can be embodied by modifying the components in the implementation stage without departing from the scope of the invention. In addition, various inventions can be formed by appropriately combining a plurality of components disclosed in the above embodiments. For example, some components may be deleted from all the components shown in the embodiment. Further, constituent elements of different embodiments may be appropriately combined.

1 Head (top ring)
1a Base 2 Carrier (top ring body)
3 Retaining ring 4 Elastic membrane (membrane)
4a Partition wall 5 Center chamber 6 Ripple chamber 7 Outer chamber 8 Edge chamber 9 Retaining ring pressure chamber 10, 10-1, 10-2, 10-3, 10-4, 10-5, 10-6, 10-7, 10 -8 Polishing device 11, 12, 13, 14, 15 Second head channel 16 Elastic membrane (membrane)
17 Cylinder 21, 22, 23, 24, 25 Piping 21-1, 22-1, 23-1, 24-1, 25-1 First branch piping 21-2, 22-2, 23-2, 24- 2, 25-2 Second branch pipe 26 Rotary joint 31, 32, 33, 34, 35 Flow path 41, 42, 43, 44, 45 First head flow path 51, 52, 53, 54, 55 First Channels 61, 62, 63, 64, 65 Channels 61, 62, 63, 64, 65 Channels 71, 72, 73, 74, 75 Pipes 81, 82, 83, 84, 85 Channels 91, 92, 93, 94, 95 Piping 100 Polishing table 101 Polishing pad 101a Polishing surface 102 Hole 110 Top ring head 111 Top ring shaft 112 Rotating cylinder 113 Timing pulley 114 Rotating motor for top ring 15 timing belt 116 timing pulley 117 top ring head shaft 124 vertically moving mechanism 126 bearing 128 bridge 129 supporting stand 130 posts 131 vacuum source 132 ball screw 132a screw shaft 132b nut 138 servo motor 201 switching valve unit (the second switching valve)
209 Switching valve section 209-1 Valve (first valve)
209-2 Valve (second valve)
210 Quench water flow meter 212 Closing valve 218, 219 Jig 500 Control unit F1 to F15 Flow meter F16, F21, F22 Flow meter (second flow meter)
FR1, FR2, FR3, FR4, FR5 Fixed part GS gas supply source HS housing MS1 to MS8 Seal part O1 to O16 O-ring OS1, OS2 Second seal part R1, R2, R3, R4, R5 Pressure control valve RR Rotating part SB1 to SB5, SB1-1 to SB5-1 Switching valve unit T1, T2, T3-1, T3-2, T4-1 to T4-5 Ports V1-1 to V1-6, V2-1 to V2-6, V3-1 to V3-6, V4-1 to V4-6, V5-1 to V5-6 Valve VS Vacuum source

Claims (15)

A head portion that supports the substrate to perform processing on the substrate ,
A rotating section that rotates with the rotation of the head section, a fixed section provided around the rotating section, and a seal section that seals between the rotating section and the fixed section , A rotary joint in which a first flow path through which gas flows is formed and a second flow path isolated from the first flow path by the seal portion is formed;
In order to switch between cooling water and gas and supply it to one end of the second flow path of the rotary joint, when cooling the rotary joint, passing cooling water and determining whether there is an abnormality in the rotary joint A switching valve for passing gas through the
A detection unit that detects gas passing through the first flow path;
A closing valve capable of shutting off cooling water or gas discharged from the other end of the second flow path,
When the gas is supplied to one end of the second flow path by the switching by the switching valve unit and the closing valve is closed, as a result of the detection by the detection unit, and abnormality determining control unit a rotary joint,
A substrate processing apparatus comprising: The rotary joint has a plurality of the seal portions, and a plurality of first flow paths isolated from the second flow path by each of the plurality of seal portions is formed,
Each of the first flow paths has a detection unit that detects a gas passing through the first flow path,
The substrate processing according to claim 1, wherein, when a gas leak is detected as a result of the detection by each of the detection units, the control unit determines that the seal portion corresponding to the detection unit from which the gas leak is detected is abnormal. apparatus. The control unit determines whether there is an abnormality in the rotary joint by using a detection result by the detection unit when the head unit is rotating at a lower speed than during substrate processing. The substrate processing apparatus according to any one of the preceding claims. The detection unit is a flow meter that detects a flow rate of the gas passing through the first flow path,
The substrate processing apparatus according to any one of claims 1 to 3, wherein the control unit determines that the rotary joint is abnormal when a flow rate detected by the flow meter exceeds a predetermined threshold. The rotary joint further includes a pipe communicating with an end of the rotary joint opposite to the head of the first flow path,
The flow meter is provided in the pipe,
The substrate processing apparatus according to claim 4, wherein when the control unit determines whether there is an abnormality in the rotary joint, the pipe is open to the atmosphere at the other end of the pipe relative to the flow meter. A pressure control valve capable of supplying gas flowing from a gas supply source to the piping in communication with the other end of the piping and opening to the atmosphere,
The control unit detects the gas with the flow meter when the gas is supplied to the second flow path by the switching of the switching valve unit and the closing valve is closed and the pressure control valve is open to the atmosphere. The substrate processing apparatus according to claim 5, wherein the presence or absence of an abnormality in the rotary joint is determined using at least the flow rate of the gas obtained. A pressure control valve capable of supplying gas flowing from a gas supply source to the pipe in communication with the other end of the pipe,
A second switching valve unit provided in the pipe on the rotary joint side of the pressure control valve and capable of switching between communication with the pressure control valve and communication with the atmosphere;
Further comprising
The flow meter is provided in the pipe on the rotary joint side from the second switching valve portion,
The control unit is configured such that the gas is supplied to the second flow path by switching by the switching valve unit, the closing valve is closed, and the second switching valve unit shuts off communication with the pressure control valve. 6. The substrate processing apparatus according to claim 5, wherein in a case where the rotary joint is communicated with the atmosphere, the presence or absence of an abnormality in the rotary joint is determined using at least a flow rate of the gas detected by the flow meter. The substrate processing apparatus according to claim 4, wherein the flow meter is provided on the side of the head unit with respect to the rotary joint. A top phosphorus Gushi Yafuto flow path communicating with the ligated and the first channel and the rotary joint and the head portion is provided,
A valve having one end connected to the flow meter and the other end open to the atmosphere;
Further comprising
The flowmeter is installed in a flow path provided on the top phosphorus Gushi Yafuto,
The substrate processing apparatus according to claim 8, wherein when the valve is open, the control unit determines whether there is an abnormality in the rotary joint by using at least a flow rate of the gas detected by the flow meter. The head section includes a base section in which a plurality of first head flow paths for supplying the gas or drawing a vacuum, and a plurality of second heads communicating with the plurality of first head flow paths. A carrier section in which a head channel is formed and an elastic film is attached,
A jig for communicating the first head flow path of the base portion and one end of the flow meter with the carrier portion removed,
The substrate processing apparatus according to claim 8, wherein one end of the flow meter communicates with a flow path provided in the jig, and the other end is open to the atmosphere. A top phosphorus Gushi Yafuto flow path communicating with and the first flow path is connected to the rotary joint is provided,
Further comprising a jig for providing communication between one end of the flow meter and the flow path of said top phosphorus Gushi Yafuto in a state where the head portion is removed,
The substrate processing apparatus according to claim 8, wherein one end of the flow meter communicates with a flow path provided in the jig, and the other end is open to the atmosphere. A second detection unit that detects gas passing between the switching valve unit and the second flow path of the rotary joint;
The rotary joint further includes a second seal portion that seals between the cooling water and the atmosphere, and is isolated from the second flow path by the second seal portion and is open to the atmosphere. A drain channel is formed,
The control unit may be configured such that when the gas is supplied to the second flow path by the switching by the switching valve unit and the closing valve is closed, after the supply of the gas to the second flow path, After the elapse of the period, the presence or absence of leakage from the second flow path to the drain flow path is determined using the detection result by the detection unit and the detection result by the second detection unit. Substrate processing equipment. The switching valve section,
A first valve that can shut off supply of cooling water to a second flow path of the rotary joint;
A second valve that can shut off gas supply to a second flow path of the rotary joint;
Has,
The substrate processing apparatus according to claim 12, wherein the second detection unit is provided in a pipe that communicates an end of a second flow path of the rotary joint with the second valve. The rotary joint further includes a second seal portion that seals between the cooling water and the atmosphere, and is isolated from the second flow path by the second seal portion and is open to the atmosphere. A drain channel is formed,
Further comprising a second detection unit for detecting gas passing through the drain flow path,
The control unit is configured to use the detection result by the detection unit when the gas is supplied to the second flow path and the closing valve is closed by switching by the switching valve unit. The presence or absence of an abnormality that causes water leakage from the flow path to the first flow path is determined, and water leakage from the second flow path to the drain flow path is determined using a result detected by the second detection unit. The substrate processing apparatus according to claim 1, wherein it is determined whether there is an abnormality that causes the substrate processing. A head portion that supports the substrate to perform processing on the substrate, a rotating portion that rotates with the rotation of the head portion, a fixed portion provided around the rotating portion, and a portion between the rotating portion and the fixed portion. A first flow path through which gas flows for processing the substrate, and a second flow path isolated from the first flow path by the seal part . In order to switch between the rotary joint and the cooling water and the gas and supply it to one end of the second flow path of the rotary joint, when cooling the rotary joint, the cooling water is passed through and the presence or absence of abnormality of the rotary joint is checked. A switching valve for passing a gas when determining, a detection unit for detecting a gas passing through the first flow path, and a closure capable of shutting off cooling water or gas discharged from the other end of the second flow path Ba A control method for controlling a substrate processing apparatus and a blanking,
Supplying the gas to one end of the second flow path by switching by the switching valve unit and closing the closing valve;
Wherein in a case where the by switching by the switching valve unit gas the second is supplied to one end of the channel and the closing valve is closed, the detection by pre danger out unit results, when a gas leak is detected , a procedure for determining the rotary joint abnormal,
A control method having: