JP6665020B2 - 分割工具、および分割工具の使用方法 - Google Patents
分割工具、および分割工具の使用方法 Download PDFInfo
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- JP6665020B2 JP6665020B2 JP2016094297A JP2016094297A JP6665020B2 JP 6665020 B2 JP6665020 B2 JP 6665020B2 JP 2016094297 A JP2016094297 A JP 2016094297A JP 2016094297 A JP2016094297 A JP 2016094297A JP 6665020 B2 JP6665020 B2 JP 6665020B2
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B27/00—Hand tools, specially adapted for fitting together or separating parts or objects whether or not involving some deformation, not otherwise provided for
- B25B27/02—Hand tools, specially adapted for fitting together or separating parts or objects whether or not involving some deformation, not otherwise provided for for connecting objects by press fit or detaching same
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
- B23K37/04—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
- B23K37/0408—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work for planar work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F3/00—Severing by means other than cutting; Apparatus therefor
- B26F3/06—Severing by using heat
- B26F3/16—Severing by using heat by radiation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- General Health & Medical Sciences (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Laser Beam Processing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Description
板状物 :1辺が50mmの正方形状、厚みが1mm
波長 :1030nm
平均出力 :3W
繰り返し周波数 :50kHz
パルス幅 :10ps
スポット径 :φ10μm
集光レンズの開口数
/ガラス板の屈折率 :0.05〜0.2
加工送り速度 :500mm/秒
シールドトンネル :φ1μmの細孔、φ10μmの非晶質
波長 :1342nm
平均出力 :0.18W
繰り返し周波数 :80kHz
スポット径 :φ1μm
加工送り速度 :180mm/秒
2:連結部材
3:外側押圧部材
4:内側押圧部材
7:コイルスプリング
8:固定部材
9:把持部材
10、100:ガラス板(板状物)
20:レーザー光線照射手段
30、30´:可撓性シート
Claims (6)
- 分割の起点が環状に形成された板状物を内側と外側とに分割する分割工具であって、
環状に形成された分割起点の内側を押圧する内側押圧部材と、環状に形成された分割起点の外側を押圧する外側押圧部材と、該内側押圧部材と該外側押圧部材とを連結する連結部材と、を備え、
該内側押圧部材は該連結部材に対して進退自在に装着され、該内側押圧部材の先端は、非押圧状態において、該外側押圧部材の先端よりも押圧方向に突出するように付勢される分割工具。 - 該内側押圧部材は、該連結部材に対して伸縮部材により押圧方向に付勢されて装着される請求項1に記載の分割工具。
- 該外側押圧部材は、該内側押圧部材を中心にして外周に4個配設される請求項1、又は2に記載の分割工具。
- 該内側押圧部材が連結部材に対して所定の間隔で複数装着されると共に、該外側押圧部材が該内側押圧部材に対応して複数装着される請求項1、又は2に記載の分割工具。
- 請求項1ないし4のいずれかに記載された分割工具の使用方法であって、
分割の起点が環状に形成された板状物を可撓性シートに配設する可撓性シート配設工程と、
板状物に環状に形成された分割起点の内側を該内側押圧部材で押圧しながら外側を該外側押圧部材で押圧して分割する分割工程と、
から少なくとも構成される分割工具の使用方法。 - 該分割工程は、該内側押圧部材及び該外側押圧部材による押圧時に、可撓性シートを拡張して実施する請求項5に記載された分割工具の使用方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016094297A JP6665020B2 (ja) | 2016-05-10 | 2016-05-10 | 分割工具、および分割工具の使用方法 |
TW106110730A TWI695749B (zh) | 2016-05-10 | 2017-03-30 | 分割工具、及分割工具的使用方法 |
KR1020170051672A KR102177675B1 (ko) | 2016-05-10 | 2017-04-21 | 분할 공구 및 분할 공구의 사용 방법 |
CN201710280586.5A CN107442947B (zh) | 2016-05-10 | 2017-04-26 | 分割工具和分割工具的使用方法 |
Applications Claiming Priority (1)
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---|---|---|---|
JP2016094297A JP6665020B2 (ja) | 2016-05-10 | 2016-05-10 | 分割工具、および分割工具の使用方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017202589A JP2017202589A (ja) | 2017-11-16 |
JP6665020B2 true JP6665020B2 (ja) | 2020-03-13 |
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JP2016094297A Active JP6665020B2 (ja) | 2016-05-10 | 2016-05-10 | 分割工具、および分割工具の使用方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6665020B2 (ja) |
KR (1) | KR102177675B1 (ja) |
CN (1) | CN107442947B (ja) |
TW (1) | TWI695749B (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7151350B2 (ja) | 2017-10-19 | 2022-10-12 | 株式会社デンソー | 内燃機関用の点火プラグ |
JP2023023236A (ja) | 2021-08-04 | 2023-02-16 | 株式会社ディスコ | チップの製造方法 |
Family Cites Families (17)
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JPS6028390B2 (ja) * | 1979-06-01 | 1985-07-04 | 三菱電機株式会社 | 半導体ウエハの打抜き方法 |
JPH10305420A (ja) | 1997-03-04 | 1998-11-17 | Ngk Insulators Ltd | 酸化物単結晶からなる母材の加工方法、機能性デバイスの製造方法 |
JPH1134184A (ja) * | 1997-07-15 | 1999-02-09 | Zenshindou Kogyo Kk | 紙器打抜き機 |
JP3408805B2 (ja) | 2000-09-13 | 2003-05-19 | 浜松ホトニクス株式会社 | 切断起点領域形成方法及び加工対象物切断方法 |
JP4512307B2 (ja) * | 2002-03-14 | 2010-07-28 | 日本ダイスチール株式会社 | ストリッピング装置の雌型およびストリッピング装置 |
JP5054933B2 (ja) * | 2006-05-23 | 2012-10-24 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
JP5376282B2 (ja) * | 2008-03-25 | 2013-12-25 | 日本電気硝子株式会社 | ガラス板折割方法及びガラス板折割装置 |
NL2001481C2 (nl) * | 2008-04-14 | 2009-10-15 | Tuinbouw Tech Atelier Tta B V | Inrichting en werkwijze voor het perforeren van taai en/of kleverig en/of elastisch velvormig materiaal. |
JP5171522B2 (ja) * | 2008-09-30 | 2013-03-27 | 三星ダイヤモンド工業株式会社 | 脆性材料基板のスクライブ方法 |
KR20100059210A (ko) * | 2008-11-26 | 2010-06-04 | 주식회사 탑 엔지니어링 | 글래스 패널의 분리장치 및 분리방법 |
JP5573105B2 (ja) * | 2009-11-02 | 2014-08-20 | 三菱マテリアル株式会社 | 分割体製造装置および製造方法 |
JP5210409B2 (ja) * | 2011-04-06 | 2013-06-12 | 三星ダイヤモンド工業株式会社 | ブレイク装置 |
KR101796928B1 (ko) * | 2011-08-01 | 2017-11-13 | 주식회사 탑 엔지니어링 | 브레이킹 바를 이용한 브레이킹 장치 |
JP2013215934A (ja) * | 2012-04-05 | 2013-10-24 | Asahi Glass Co Ltd | 脆性板の割断装置および割断方法 |
JP6151557B2 (ja) | 2013-05-13 | 2017-06-21 | 株式会社ディスコ | レーザー加工方法 |
JP2015174113A (ja) * | 2014-03-14 | 2015-10-05 | 三菱自動車工業株式会社 | プレス装置 |
CN203866194U (zh) * | 2014-03-21 | 2014-10-08 | 芜湖东旭光电科技有限公司 | 液晶玻璃基板饵料掰断装置的预压机构 |
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2016
- 2016-05-10 JP JP2016094297A patent/JP6665020B2/ja active Active
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2017
- 2017-03-30 TW TW106110730A patent/TWI695749B/zh active
- 2017-04-21 KR KR1020170051672A patent/KR102177675B1/ko active Active
- 2017-04-26 CN CN201710280586.5A patent/CN107442947B/zh active Active
Also Published As
Publication number | Publication date |
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CN107442947B (zh) | 2020-11-24 |
CN107442947A (zh) | 2017-12-08 |
KR20170126792A (ko) | 2017-11-20 |
KR102177675B1 (ko) | 2020-11-11 |
TW201739555A (zh) | 2017-11-16 |
JP2017202589A (ja) | 2017-11-16 |
TWI695749B (zh) | 2020-06-11 |
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