JP6650759B2

JP6650759B2 - Cooling system, air conditioning control device and air conditioning control method

Info

Publication number: JP6650759B2
Application number: JP2016000554A
Authority: JP
Inventors: 隆成水島; 伊藤　潤一; 潤一伊藤
Original assignee: Hitachi Ltd
Current assignee: Hitachi Ltd
Priority date: 2016-01-05
Filing date: 2016-01-05
Publication date: 2020-02-19
Anticipated expiration: 2036-01-05
Also published as: JP2017122979A

Description

本発明は、冷却システム、空調制御装置および空調制御方法に関し、特にサーバルームの空調を制御する冷却システム、空調制御装置および空調制御方法に関する。 The present invention relates to a cooling system, an air conditioning control device, and an air conditioning control method, and particularly to a cooling system, an air conditioning control device, and an air conditioning control method for controlling air conditioning in a server room.

サーバルームには、コンピュータやサーバ等の電子機器（以下、「機器」と称する。）が集約された状態で多数設置され、これらの機器が昼夜にわたって連続稼働している。サーバルームにおける機器の設置は、ラックマウント方式が主流になっている。ラックマウント方式は、機器を機能単位別に分割して収納するラック（筺体）を、キャビネットに段積みする方式であり、かかるキャビネットがサーバルームの床上に多数整列配置されている。ラックに収納されている機器は、前面から低温空気を吸い込み、機器の内部を冷却して、背面から高温空気を排気するものが一般的である。 In the server room, a large number of electronic devices (hereinafter, referred to as “devices”) such as computers and servers are installed in a concentrated state, and these devices operate continuously day and night. Rack mounting is the mainstream for equipment installation in server rooms. The rack-mount system is a system in which racks (housings) that store devices by dividing them into functional units are stacked on cabinets, and a large number of such cabinets are arranged on the floor of a server room. In general, devices housed in a rack suck in low-temperature air from the front, cool the inside of the device, and exhaust high-temperature air from the back.

これらの機器は、高温状態になるとシステム停止等のトラブルを引き起こすおそれがあるため、複数の冷却装置によって機器から排気された高温空気を冷却することで、サーバルームは一定の温度環境に管理され、特に、ラックの吸込温度が所定温度以下となるように管理されている。しかしながら、機器からの発熱量が小さく、冷却装置を全台運転する必要がない場合でも、ラックの吸込温度が所定温度を超えることを懸念して、冷却装置の全台運転を行っているのが現状である。 Since these devices may cause troubles such as system stoppage when they become hot, the server room is managed in a constant temperature environment by cooling the high-temperature air exhausted from the devices by multiple cooling devices, In particular, the rack is controlled so that the suction temperature of the rack is equal to or lower than a predetermined temperature. However, even when the amount of heat generated from the equipment is small and it is not necessary to operate all the cooling units, all the cooling units are operated because of concern that the rack suction temperature may exceed a predetermined temperature. It is the current situation.

そのため、省エネルギの観点からラックの吸込温度を所定温度以下に維持し、かつ、必要な台数だけ冷却装置を運転させ、システム全体の消費電力を削減する手法が求められている。 Therefore, from the viewpoint of energy saving, there is a demand for a method for maintaining the suction temperature of the rack at a predetermined temperature or lower and operating the required number of cooling devices to reduce the power consumption of the entire system.

例えば、特許文献１には、発熱部品を備えた電子機器と、前記電子機器に冷却風を供給するファンと、前記ファンの回転数を制御する制御部とを有し、前記制御部は、前記電子機器の消費電力の上昇率が第１の閾値よりも小さい第１の場合に、前記発熱部品の将来の温度を予測することにより、前記発熱部品の前記温度が許容範囲に収まるように前記ファンの回転数を制御し、前記上昇率が前記第１の閾値以上となる第２の場合に、前記第１の場合におけるよりも大きな回転数となるように前記ファンの回転数の制御を切り替えることを特徴とする空調制御システムが開示されている（請求項１参照）。 For example, Patent Literature 1 includes an electronic device including a heat-generating component, a fan that supplies cooling air to the electronic device, and a control unit that controls a rotation speed of the fan. In a first case where the rate of increase in power consumption of the electronic device is smaller than a first threshold, the fan is predicted so that the temperature of the heat-generating component falls within an allowable range by predicting a future temperature of the heat-generating component. Controlling the rotation speed of the fan so that the rotation speed becomes higher than the rotation speed in the first case in the second case where the increase rate is equal to or higher than the first threshold value. An air-conditioning control system is disclosed (see claim 1).

特開２０１５−１６２０９８号公報JP-A-2015-162098

しかしながら、特許文献１に開示された手法では、ファン回転数制御に電子機器の温度測定値や電力計測値を用いている。実際のサーバルーム（データセンタ）では、電子機器およびそれらを設置するラックの台数が膨大であり、それらラック１台ごとに計測機器を設置するのは設備所有者に大きな負担となり、また制御も複雑になる。 However, in the method disclosed in Patent Literature 1, a temperature measurement value and a power measurement value of an electronic device are used for controlling the fan speed. In an actual server room (data center), the number of electronic devices and racks for installing them is enormous, and installing measurement devices for each of these racks places a heavy burden on equipment owners and also complicates control. become.

そこで、本発明は、少ない計測点数で省エネ化を実現する冷却システム、空調制御装置および空調制御方法を提供することを課題とする。 Therefore, an object of the present invention is to provide a cooling system, an air conditioning control device, and an air conditioning control method that realize energy saving with a small number of measurement points.

このような課題を解決するために、本発明係る冷却システムは、電子機器を内部に設置するラックを並べて配置されたラック列が形成されて、２列の前記ラック列の排気面同士を向かい合わせて配置されたラック群が形成された部屋において、前記ラック群に低温空気を供給する複数の冷却装置と、前記ラック群に吸い込まれる低温空気の吸込温度を計測する温度計測装置と、前記複数の冷却装置の各冷却装置の起動または停止を判定する制御装置と、を備え、前記制御装置は、前記温度計測装置の計測点が計測対象とする前記ラック群へ供給される低温空気の風量比が高い冷却装置を演算し、前記演算の結果に基づいて各冷却装置の起動または停止を判定するものであり、前記制御装置は、各ラック群と各冷却装置との距離、および、各冷却装置の運転状態の関数として、ある冷却装置からあるラック群へ供給される低温空気の風量比を算出する近似式を有し、前記温度計測装置で計測した温度の最大値が第１閾値よりも高い場合、各冷却装置から温度が最大値となるラック群へ供給される低温空気の風量比を前記近似式によって算出し、前記算出した風量比が最も高い前記冷却装置を起動すると判定することを特徴とする。 In order to solve such a problem, a cooling system according to the present invention is configured such that a rack row in which racks for installing electronic devices are arranged is formed, and the exhaust surfaces of the two rack rows face each other. A plurality of cooling devices for supplying low-temperature air to the group of racks, a temperature measuring device for measuring a suction temperature of low-temperature air sucked into the group of racks, and A control device for determining whether to start or stop each cooling device of the cooling device, wherein the control device is configured such that a measurement point of the temperature measurement device has an air volume ratio of low-temperature air supplied to the rack group to be measured. calculating a high cooling device are those determined start or stop of the cooling devices on the basis of the result of the calculation, the control device, the distance between each rack group and the cooling device, and, each of the cold As a function of the operating state of the device, the device has an approximation formula for calculating an air volume ratio of low-temperature air supplied from a cooling device to a certain rack group, and a maximum value of the temperature measured by the temperature measuring device is smaller than a first threshold value. If it is high, the air flow ratio of the low-temperature air supplied from each cooling device to the rack group at which the temperature becomes the maximum value is calculated by the approximate expression, and it is determined that the cooling air device having the highest calculated air flow ratio is to be started. Features.

また、本発明に係る空調制御装置は、電子機器を内部に設置するラックを並べて配置されたラック列が形成されて、２列の前記ラック列の排気面同士を向かい合わせて配置されたラック群が形成された部屋において、前記ラック群に低温空気を供給する複数の冷却装置を制御する空調制御装置であって、前記ラック群に吸い込まれる低温空気の吸込温度を計測する温度計測装置の計測点が計測対象とする前記ラック群へ供給される低温空気の風量比が高い冷却装置を演算し、前記演算の結果に基づいて各冷却装置の起動または停止を判定するものであり、各ラック群と各冷却装置との距離、および、各冷却装置の運転状態の関数として、ある冷却装置からあるラック群へ供給される低温空気の風量比を算出する近似式を有し、前記温度計測装置で計測した温度の最大値が第１閾値よりも高い場合、各冷却装置から温度が最大値となるラック群へ供給される低温空気の風量比を前記近似式によって算出し、前記算出した風量比が最も高い前記冷却装置を起動すると判定することを特徴とする。 In addition, the air conditioning control device according to the present invention is a rack group in which a rack row in which racks for installing electronic devices are arranged is formed, and the exhaust surfaces of the two rack rows face each other. An air-conditioning control device for controlling a plurality of cooling devices that supply low-temperature air to the group of racks in a room where the temperature measurement device measures the suction temperature of the low-temperature air sucked into the group of racks. A cooling device having a high air volume ratio of low-temperature air supplied to the rack group to be measured is calculated, and starting or stopping of each cooling device is determined based on a result of the calculation. the distance between the cooling devices, and, as a function of the operating state of the cooling device, has an approximate expression for calculating the air volume ratio of the low-temperature air to be supplied to the rack group with from one cooling device, the temperature measuring instrumentation Air volume ratio maximum value in temperature measured is higher than the first threshold value, calculates the air volume ratio of the low-temperature air temperature from each cooling device is supplied to the rack group having the maximum value by the approximate expression, which is the calculated Is determined to be activated.

また、本発明に係る空調制御方法は、電子機器を内部に設置するラックを並べて配置されたラック列が形成されて、２列の前記ラック列の排気面同士を向かい合わせて配置されたラック群が形成された部屋において、前記ラック群に低温空気を供給する複数の冷却装置と、前記ラック群に吸い込まれる低温空気の吸込温度を計測する温度計測装置と、各冷却装置の起動または停止を判定する制御装置と、を備える冷却システムの空調制御方法であって、前記制御装置は、前記温度計測装置で計測した温度の最大値が第１閾値よりも高い場合、各冷却装置から温度が最大値となるラック群へ供給される低温空気の風量比を近似式によって算出し、前記算出した風量比が最も高い前記冷却装置を起動すると判定し、前記温度計測装置で計測した温度の最大値が第１閾値よりも低く、かつ、前記温度計測装置で計測した温度の最小値が第２閾値よりも低い場合、各冷却装置から温度が最小値となるラック群へ供給される低温空気の風量比を前記近似式によって算出し、前記算出した風量比が最も高い前記冷却装置を停止すると判定することを特徴とする In addition, the air conditioning control method according to the present invention is directed to a rack group in which a rack row in which racks for installing electronic devices are arranged is formed, and two exhaust rows of the rack rows face each other. In the room where is formed, a plurality of cooling devices for supplying low-temperature air to the rack group, a temperature measurement device for measuring the suction temperature of the low-temperature air sucked into the rack group, and start / stop of each cooling device are determined. A control device for controlling the air conditioning of the cooling system, the control device comprising: when the maximum value of the temperature measured by the temperature measurement device is higher than a first threshold value, the temperature from each cooling device is the maximum value. calculated by the approximate equation air volume ratio of the low-temperature air to be supplied to become the rack group, said calculated air volume ratio is determined to start the highest the cooling device, the temperature measured by the temperature measuring device Low maximum value of than the first threshold value, and wherein when the minimum value of the temperature measured by the temperature measuring device is lower than the second threshold value, low temperature from the cooling device is supplied to the minimum value becomes rack group The air flow ratio of air is calculated by the approximation formula, and it is determined that the cooling device having the highest calculated air flow ratio is stopped.

本発明によれば、少ない計測点数で省エネ化を実現する冷却システム、空調制御装置および空調制御方法を提供することができる。 According to the present invention, it is possible to provide a cooling system, an air-conditioning control device, and an air-conditioning control method that achieve energy saving with a small number of measurement points.

第１実施形態に係る冷却システムの構成例を示す平面図である。It is a top view showing the example of composition of the cooling system concerning a 1st embodiment. 第１実施形態に係る冷却システムの制御装置の処理を示すフローチャートである。It is a flowchart which shows the process of the control apparatus of the cooling system which concerns on 1st Embodiment. 第２実施形態に係る冷却システムの構成例を示す平面図である。It is a top view showing the example of composition of the cooling system concerning a 2nd embodiment. 変形例に係る冷却システムの構成例を示す立面図である。It is an elevation view showing an example of composition of a cooling system concerning a modification.

以下、本発明を実施するための形態（以下「実施形態」という）について、適宜図面を参照しながら詳細に説明する。なお、各図において、共通する部分には同一の符号を付し重複した説明を省略する。 Hereinafter, embodiments for carrying out the present invention (hereinafter, referred to as “embodiments”) will be described in detail with reference to the drawings as appropriate. In each of the drawings, common portions are denoted by the same reference numerals, and redundant description will be omitted.

≪第１実施形態≫
＜冷却システムＳ＞
第１施形態に係る冷却システムＳについて、図１を用いて説明する。図１は、第１実施形態に係る冷却システムＳの構成例を示す平面図である。 << 1st Embodiment >>
<Cooling system S>
A cooling system S according to the first embodiment will be described with reference to FIG. FIG. 1 is a plan view illustrating a configuration example of the cooling system S according to the first embodiment.

図１に示すように、室（コンピュータルーム，サーバルーム）Ｒには、コンピュータやサーバ等の電子機器（以下、「機器」と称する。）を収納したラック１０が複数設置されている。ラック１０は、機器が内蔵するファン（図示せず）により、前面を給気面とし、背面を排気面として、給気面から取り込んだ空気で機器の内部を冷却し、排気面から高温空気を排気するようになっている。 As shown in FIG. 1, a room (computer room, server room) R is provided with a plurality of racks 10 for storing electronic devices (hereinafter, referred to as “devices”) such as computers and servers. The rack 10 uses a fan (not shown) incorporated in the device to make the front surface an air supply surface, use the rear surface as an exhaust surface, cool the inside of the device with air taken in from the air supply surface, and remove hot air from the exhaust surface. It is designed to exhaust.

ラック１０は、給気面と排気面を揃えて配置したラック列を形成しており、さらに、２列のラック列の排気面同士を向かい合わせて配置したラック群１５が形成されている。また、ラック群１５がラック列の給気面同士を向かい合わせて配置されている。これにより、図１に示すように、ラック列の給気面同士が対向するコールドアイル（Cold aisle；寒い通路）ＣＡと、ラック列の排気面同士が対向するホットアイル（Hot aisle；熱い通路）ＨＡと、が交互に形成される。 The racks 10 form a row of racks in which the air supply surface and the air exhaust surface are aligned, and a rack group 15 is formed in which the air exhaust surfaces of two rows of racks are arranged to face each other. Further, a rack group 15 is arranged with the air supply surfaces of the rack rows facing each other. Thereby, as shown in FIG. 1, the cold aisle (cold passage) CA in which the air supply surfaces of the rack row face each other and the hot aisle (hot passage) CA in which the exhaust surfaces of the rack row face each other. HA and are alternately formed.

第１実施形態に係る冷却システムＳは、冷却装置２０と、温度センサ３０（温度計測装置）と、制御装置４０と、を備えている。 The cooling system S according to the first embodiment includes a cooling device 20, a temperature sensor 30 (temperature measuring device), and a control device 40.

冷却装置２０は、図１に示すように、室Ｒの周囲部に複数設置されている。冷却装置２０は、空調機（Computer Room Air Conditioning；ＣＲＡＣ）であり、ホットアイルＨＡからの高温空気を取り込んで冷却し、低温空気をコールドアイルＣＡに供給する。なお、冷却装置２０の運転／停止は、制御装置４０により制御される。 As shown in FIG. 1, a plurality of cooling devices 20 are provided around the chamber R. The cooling device 20 is an air conditioner (Computer Room Air Conditioning; CRAC), cools by taking in high-temperature air from the hot aisle HA, and supplies low-temperature air to the cold aisle CA. The operation / stop of the cooling device 20 is controlled by the control device 40.

図１に示すように、ラック１０の排気面から排気された高温空気（暖気）は、ホットアイルＨＡに排気され、室Ｒの上部を通って、冷却装置２０に吸い込まれる。そして、冷却装置２０で冷却された低温空気（冷風）は、室Ｒの二重床空間を通って、各コールドアイルＣＡに供給され、ラック１０の給気面から吸い込まれる。このように、冷却システムＳは、室Ｒに設置されたラック１０を冷却する、換言すれば、ラック１０に収納した機器（図示せず）を冷却する。 As shown in FIG. 1, high-temperature air (warm air) exhausted from the exhaust surface of the rack 10 is exhausted to the hot aisle HA, passes through the upper part of the chamber R, and is sucked into the cooling device 20. Then, the low-temperature air (cool air) cooled by the cooling device 20 is supplied to each cold aisle CA through the double floor space of the room R, and is sucked from the air supply surface of the rack 10. As described above, the cooling system S cools the rack 10 installed in the room R, in other words, cools the equipment (not shown) stored in the rack 10.

各コールドアイルＣＡには、温度センサ３０が設置され、ラック１０の給気面からラック１０の内部に吸込まれる低温空気の温度を計測することができるようになっている。温度センサ３０の検出信号は、制御装置４０に出力される。
Each cold aisle CA is provided with a temperature sensor 30 so that the temperature of low-temperature air sucked into the rack 10 from the air supply surface of the rack 10 can be measured . The detection signal of the temperature sensor 30 is output to the control device 40.

なお、温度センサ３０は、ラック群１５の給気面と対応付けされており、図１に示す構成においては、ラック群１５の両側の給気面（換言すれば、ラック群１５と接するコールドアイルＣＡ）に対して、それぞれ３ヶ所の温度センサ３０の計測点が設けられている。 The temperature sensor 30 is associated with an air supply surface of the rack group 15, and in the configuration shown in FIG. 1, the air supply surfaces on both sides of the rack group 15 (in other words, a cold aisle in contact with the rack group 15). CA), three measurement points of the temperature sensor 30 are provided.

制御装置４０は、温度センサ３０で検出した温度に基づいて、冷却装置２０の運転／停止を判定し、冷却装置２０の運転／停止を制御する。図１に示すように、制御装置４０は、温度取得部４１と、運転状態取得部４２と、運転判定部４３と、記憶部４４と、を備えている。 The control device 40 determines the operation / stop of the cooling device 20 based on the temperature detected by the temperature sensor 30, and controls the operation / stop of the cooling device 20. As shown in FIG. 1, the control device 40 includes a temperature acquisition unit 41, an operation state acquisition unit 42, an operation determination unit 43, and a storage unit 44.

温度取得部４１は、温度センサ３０で検出したコールドアイルＣＡの温度を取得する。 The temperature acquisition unit 41 acquires the temperature of the cold aisle CA detected by the temperature sensor 30.

運転状態取得部４２は、現在の冷却装置２０の運転状態（どの冷却装置２０が運転しているか、停止しているか）を取得する。 The operating state acquisition unit 42 acquires the current operating state of the cooling device 20 (whether the cooling device 20 is operating or stopped).

運転判定部４３は、温度取得部４１で取得した温度情報および運転状態取得部４２で取得した現在の運転状態情報に基づいて、冷却装置２０の運転／停止を判定する。 The operation determination unit 43 determines the operation / stop of the cooling device 20 based on the temperature information acquired by the temperature acquisition unit 41 and the current operation state information acquired by the operation state acquisition unit 42.

記憶部４４は、運転判定部４３が冷却装置２０の運転／停止を判定する際に用いる情報が格納されている。 The storage unit 44 stores information used when the operation determination unit 43 determines the operation / stop of the cooling device 20.

そして、制御装置４０は、運転判定部４３の判定結果に基づいて、各冷却装置２０の運転／停止を制御することにより、冷却システムＳ全体を制御する。 The control device 40 controls the entire cooling system S by controlling the operation / stop of each cooling device 20 based on the determination result of the operation determining unit 43.

＜運転判定処理＞
次に、制御装置４０の処理について、図２を用いて説明する。図２は、第１実施形態に係る冷却システムＳの制御装置４０の処理を示すフローチャートである。 <Driving judgment processing>
Next, the processing of the control device 40 will be described with reference to FIG. FIG. 2 is a flowchart illustrating a process of the control device 40 of the cooling system S according to the first embodiment.

ステップＳ１０１において、制御装置４０の温度取得部４１は、温度センサ３０からコールドアイルＣＡの各計測点（各温度センサ３０の設置位置）の温度Ｔ（Ｔ₁〜Ｔ_i、ｉは計測点数）を取得する。 In step S101, the temperature acquisition unit 41 of the control device 40 obtains the temperature T (T _{1 to} T _i , i is the number of measurement points) of each measurement point (installation position of each temperature sensor 30) of the cold aisle CA from the temperature sensor 30. get.

ステップＳ１０２において、制御装置４０の運転判定部４３は、ステップＳ１０１で取得したコールドアイルＣＡの温度Ｔ（Ｔ₁〜Ｔ_i）のなかで最大のものを最大温度Ｔmaxとする。そして、運転判定部４３は、最大温度Ｔmaxが予め設定された第１閾値Ｔset1よりも大きいか否かを判定する（Ｔmax＞Ｔset1？）。なお、第１閾値Ｔset1は、冷却装置２０の運転が不足であるか否かを判定するための閾値である。最大温度Ｔmaxが第１閾値Ｔset1よりも大きい場合（Ｓ１０２・Ｙｅｓ）、制御装置４０の処理はステップＳ１０３に進む。一方、最大温度Ｔmaxが第１閾値Ｔset1よりも大きくない場合（Ｓ１０２・Ｎｏ）、制御装置４０の処理はステップＳ１０６に進む。 In step S102, the operation determination unit 43 of the controller 40 largest of the maximum temperature Tmax among the temperature T of the cold aisle CA obtained in step S101 (T ₁ ~T _i). Then, the operation determining unit 43 determines whether or not the maximum temperature Tmax is higher than a preset first threshold value Tset1 (Tmax> Tset1?). Note that the first threshold Tset1 is a threshold for determining whether the operation of the cooling device 20 is insufficient. When the maximum temperature Tmax is larger than the first threshold Tset1 (S102, Yes), the process of the control device 40 proceeds to Step S103. On the other hand, when the maximum temperature Tmax is not higher than the first threshold value Tset1 (No in S102), the process of the control device 40 proceeds to Step S106.

ステップＳ１０３において、制御装置４０の運転状態取得部４２は、冷却装置２０の運転状態を取得する。そして、制御装置４０の運転判定部４３は、停止している冷却装置２０のそれぞれについて、温度Ｔが最大（最大温度Ｔmax）となる計測点が含まれるラック群１５（ラック群ｎ）へ供給する風量比率（寄与率）を計算する。なお、寄与率の計算方法については、後述する。 In step S103, the operation state acquisition unit 42 of the control device 40 acquires the operation state of the cooling device 20. Then, the operation determination unit 43 of the control device 40 supplies the stopped cooling devices 20 to the rack group 15 (rack group n) including the measurement point at which the temperature T becomes the maximum (the maximum temperature Tmax). Calculate the air volume ratio (contribution ratio). The method of calculating the contribution ratio will be described later.

ステップＳ１０４において、制御装置４０の運転判定部４３は、停止している冷却装置２０のうち、最大温度Ｔmaxとなる計測点が含まれるラック群１５（ラック群ｎ）への寄与率が最も高い冷却装置２０を選定する。 In step S104, the operation determination unit 43 of the control device 40 determines that the cooling unit having the highest contribution rate to the rack group 15 (rack group n) including the measurement point at which the maximum temperature Tmax is included among the stopped cooling devices 20. The device 20 is selected.

ステップＳ１０５において、制御装置４０は、ステップＳ１０４で選定した冷却装置２０を起動する。また、制御装置４０は、起動した冷却装置２０の番号を記憶部４４に記憶する。そして、制御装置４０の処理はステップＳ１０１に戻る。 In step S105, the control device 40 starts the cooling device 20 selected in step S104. The control device 40 stores the number of the activated cooling device 20 in the storage unit 44. Then, the process of the control device 40 returns to Step S101.

ステップＳ１０６において、制御装置４０の運転判定部４３は、ステップＳ１０１で取得したコールドアイルＣＡの温度Ｔ（Ｔ₁〜Ｔ_i）のなかで最小のものを最小温度Ｔminとする。そして、運転判定部４３は、最小温度Ｔminが予め設定された第２閾値Ｔset2よりも小さいか否かを判定する（Ｔmin＜Ｔset2？）。なお、第２閾値Ｔset2は、冷却装置２０の運転が過剰であるか否かを判定するための閾値であり、第１閾値Ｔset1よりも小さな値である。最小温度Ｔminが第２閾値Ｔset2よりも小さい場合（Ｓ１０６・Ｙｅｓ）、制御装置４０の処理はステップＳ１０７に進む。一方、最小温度Ｔminが第２閾値Ｔset2よりも小さくない場合（Ｓ１０６・Ｎｏ）、制御装置４０の処理はステップＳ１０１に戻る。 In step S106, the operation determination unit 43 of the controller 40 smallest as the minimum temperature Tmin among the temperature T of the cold aisle CA obtained in step S101 (T ₁ ~T _i). Then, the operation determination unit 43 determines whether the minimum temperature Tmin is smaller than a second threshold value Tset2 set in advance (Tmin <Tset2?). The second threshold value Tset2 is a threshold value for determining whether the operation of the cooling device 20 is excessive, and is a value smaller than the first threshold value Tset1. When the minimum temperature Tmin is smaller than the second threshold Tset2 (S106: Yes), the process of the control device 40 proceeds to Step S107. On the other hand, when the minimum temperature Tmin is not smaller than the second threshold value Tset2 (No in S106), the process of the control device 40 returns to Step S101.

ステップＳ１０７において、制御装置４０の運転状態取得部４２は、冷却装置２０の運転状態を取得する。そして、制御装置４０の運転判定部４３は、運転している冷却装置２０のそれぞれについて、温度Ｔが最小（最小温度Ｔmin）となる計測点が含まれるラック群１５（ラック群ｍ）へ供給する風量比率（寄与率）を計算する。なお、寄与率の計算方法については、後述する。 In step S107, the operation state acquisition unit 42 of the control device 40 acquires the operation state of the cooling device 20. Then, the operation determination unit 43 of the control device 40 supplies, to each of the operating cooling devices 20, the rack group 15 (rack group m) including the measurement point at which the temperature T is minimum (minimum temperature Tmin). Calculate the air volume ratio (contribution ratio). The method of calculating the contribution ratio will be described later.

ステップＳ１０８において、制御装置４０の運転判定部４３は、運転している冷却装置２０のうち、最小温度Ｔminとなる計測点が含まれるラック群１５（ラック群ｍ）への寄与率が最も高い冷却装置２０を選定する。 In step S108, the operation determination unit 43 of the control device 40 determines that the cooling unit having the highest contribution rate to the rack group 15 (rack group m) including the measurement point having the minimum temperature Tmin among the operating cooling devices 20. The device 20 is selected.

ステップＳ１０９において、制御装置４０の運転判定部４３は、ステップＳ１０８で選定した冷却装置２０が前回起動した冷却装置２０であるか否かを判定する。ちなみに、前回起動した冷却装置２０の番号は記憶部４４に記憶されている。選定した冷却装置２０が前回起動した冷却装置２０である場合（Ｓ１０９・Ｙｅｓ）、冷却装置２０の選定を取り消して、制御装置４０の処理はステップＳ１０１に戻る。一方、選定した冷却装置２０が前回起動した冷却装置２０でない場合（Ｓ１０９・Ｎｏ）、制御装置４０の処理はステップＳ１１０に進む。 In step S109, the operation determination unit 43 of the control device 40 determines whether or not the cooling device 20 selected in step S108 is the cooling device 20 started last time. Incidentally, the number of the cooling device 20 started last time is stored in the storage unit 44. If the selected cooling device 20 is the cooling device 20 started last time (Yes in S109), the selection of the cooling device 20 is canceled, and the process of the control device 40 returns to Step S101. On the other hand, when the selected cooling device 20 is not the cooling device 20 started last time (S109, No), the process of the control device 40 proceeds to step S110.

ステップＳ１１０において、制御装置４０は、ステップＳ１０８で選定した冷却装置２０を停止する。そして、制御装置４０の処理はステップＳ１０１に戻る。 In step S110, the control device 40 stops the cooling device 20 selected in step S108. Then, the process of the control device 40 returns to Step S101.

＜寄与率の計算＞
次に、ステップＳ１０３における寄与率の計算およびステップＳ１０４における冷却装置２０の選定について説明する。 <Calculation of contribution rate>
Next, the calculation of the contribution ratio in step S103 and the selection of the cooling device 20 in step S104 will be described.

まず、予めラック群１５（ラック１０）や冷却装置２０のレイアウト、仕様を基にしたシミュレーションを行い、様々な冷却装置２０の運転状態（運転／停止）の組み合わせに対して、各冷却装置２０から各ラック群１５に供給される低温空気の風量比率を算出する。そして、上記の結果から各ラック群１５と各冷却装置２０の距離および各冷却装置２０の運転状態（運転／停止）の関数として、あるラック群１５へ冷却装置２０から供給される風量比率を算出する近似式を求める。 First, a simulation based on the layout and specifications of the rack group 15 (rack 10) and the cooling device 20 is performed in advance, and for each combination of various operating states (operating / stopping) of the cooling device 20, An air volume ratio of the low-temperature air supplied to each rack group 15 is calculated. Then, from the above results, the air flow ratio supplied from the cooling device 20 to the certain rack group 15 is calculated as a function of the distance between each of the rack groups 15 and each of the cooling devices 20 and the operation state (operation / stop) of each of the cooling devices 20. Find the approximate expression

そして、ステップＳ１０３において、起動する冷却装置２０の候補となる冷却装置２０から、最大温度Ｔmaxとなる計測点が含まれるラック群１５へ供給される風量比率を前述の近似式により求める。この計算は、起動する冷却装置２０の候補、換言すれば、現在停止している冷却装置２０の全てについて行う。その後、ステップＳ１０４において、計算された風量比率が最も高い冷却装置２０を選定する。 Then, in step S103, the ratio of the amount of air supplied from the cooling device 20 that is a candidate for the cooling device 20 to be started to the rack group 15 including the measurement point at which the maximum temperature Tmax is included is obtained by the above-described approximate expression. This calculation is performed for all of the cooling devices 20 to be activated, in other words, for all the cooling devices 20 that are currently stopped. Thereafter, in step S104, the cooling device 20 having the highest calculated air volume ratio is selected.

次に、ステップＳ１０７における寄与率の計算およびステップＳ１０８における冷却装置２０の選定について説明する。 Next, the calculation of the contribution ratio in step S107 and the selection of the cooling device 20 in step S108 will be described.

ステップＳ１０７において、停止する冷却装置２０の候補となる冷却装置２０から、最小温度Ｔminとなる計測点が含まれるラック群１５へ供給される風量比率を前述の近似式により求める。この計算は、停止する冷却装置２０の候補、換言すれば、現在運転している冷却装置２０の全てについて行う。その後、ステップＳ１０８において、計算された風量比率が最も高い冷却装置２０を選定する。 In step S107, the ratio of the amount of air supplied from the cooling device 20 which is a candidate for the cooling device 20 to be stopped to the rack group 15 including the measurement point at which the minimum temperature Tmin is included is obtained by the above-described approximate expression. This calculation is performed for all of the cooling devices 20 that are to be stopped, in other words, all of the cooling devices 20 that are currently operating. Thereafter, in step S108, the cooling device 20 having the highest calculated air volume ratio is selected.

＜作用効果＞
このように、第１実施形態に係る冷却システムＳの制御装置４０は、最大温度Ｔmaxが第１閾値Ｔset1よりも大きいと判定すると、冷却装置２０の運転台数を増加する（Ｓ１０２・Ｙｅｓ…Ｓ１０５参照）。これにより、ラック１０の給気面に供給される低温空気の温度を第１閾値Ｔset1以下に保つことができ、機器の冷却不足を防止する。 <Effects>
As described above, when the control device 40 of the cooling system S according to the first embodiment determines that the maximum temperature Tmax is greater than the first threshold value Tset1, the control device 40 increases the number of operating cooling devices 20 (see S102, Yes... S105). ). Thereby, the temperature of the low-temperature air supplied to the air supply surface of the rack 10 can be maintained at the first threshold value Tset1 or less, and insufficient cooling of the device is prevented.

この際、対象とする寄与率を計算して、その寄与率に基づいて起動する冷却装置２０を選択するので（Ｓ１０３，Ｓ１０４参照）、即ち、最大温度Ｔmaxとなる計測点が含まれるラック群１５へ供給される風量比率が最も高い冷却装置２０を選択する。これにより、対象とするラック群１５を効率よく冷却する冷却装置２０を選択することができるので、冷却装置２０の運転台数の増加数を抑制して、冷却システムＳのシステム効率を向上させることができる。 At this time, the target contribution ratio is calculated, and the cooling device 20 to be started is selected based on the contribution ratio (see S103 and S104), that is, the rack group 15 including the measurement point at which the maximum temperature Tmax is included. The cooling device 20 having the highest ratio of the amount of air supplied to is selected. This makes it possible to select a cooling device 20 that efficiently cools the target rack group 15, thereby suppressing the increase in the number of operating cooling devices 20 and improving the system efficiency of the cooling system S. it can.

また、第１実施形態に係る冷却システムＳの制御装置４０は、最大温度Ｔmaxが第１閾値Ｔset1以下（即ち、計測点における温度Ｔ₁〜Ｔ_iが全て第１閾値Ｔset1以下）で、かつ、最小温度Ｔminが第２閾値Ｔset2よりも小さいと判定すると、冷却装置２０が過剰に運転しているとして、冷却装置２０の運転台数を減少する（Ｓ１０６・Ｙｅｓ…Ｓ１１０参照）。これにより、過剰に運転している冷却装置２０を停止させて、冷却システムＳのシステム効率を向上させることができる。 Further, the control unit 40 of the cooling system S according to the first embodiment, the maximum temperature Tmax is the first threshold value Tset1 less (i.e., the temperature T ₁ through T _i is the first threshold value Tset1 below all the measurement points), and, If it is determined that the minimum temperature Tmin is smaller than the second threshold value Tset2, it is determined that the cooling device 20 is operating excessively, and the number of operating cooling devices 20 is reduced (S106, Yes... S110). Thereby, the cooling device 20 that is operating excessively can be stopped, and the system efficiency of the cooling system S can be improved.

この際、対象とする寄与率を計算して、その寄与率に基づいて停止する冷却装置２０を選択するので（Ｓ１０７，Ｓ１０８参照）、対象とするラック群１５の吸込温度を効率よく下げる冷却装置２０を選択する。換言すれば、他のラック群１５の冷却に与える影響の少ない冷却装置２０を選択することができるので、他のラック群１５の冷却に与える影響を抑えつつ、過剰に運転している冷却装置２０を停止することができる。 At this time, the target cooling ratio is calculated, and the cooling device 20 to be stopped is selected based on the calculating ratio (refer to S107 and S108). Therefore, the cooling device that efficiently lowers the suction temperature of the target rack group 15 is used. Select 20. In other words, it is possible to select a cooling device 20 that has little effect on the cooling of the other rack group 15, so that the cooling device 20 that is operating excessively while suppressing the effect on the cooling of the other rack group 15 can be selected. Can be stopped.

また、停止させるように選定した冷却装置２０が前回起動させた冷却装置２０である場合には（Ｓ１０９・Ｙｅｓ参照）、この冷却装置２０を停止させると冷却能力に不足が生じるおそれがあるため、選定した冷却装置２０の選定を取り消して、冷却装置２０を停止させず運転を継続する。これにより、当該冷却装置２０の発停を繰り返すことを防止することができる。 Further, when the cooling device 20 selected to be stopped is the cooling device 20 started last time (see Yes in S109), if the cooling device 20 is stopped, the cooling capacity may be insufficient. Cancel the selection of the selected cooling device 20 and continue the operation without stopping the cooling device 20. This can prevent the cooling device 20 from being repeatedly started and stopped.

また、第１実施形態に係る冷却システムＳは、各コールドアイルＣＡごとに温度センサ３０を設けることにより達成できるので、特許文献１に開示された冷却システムと比較して、センサの数を削減することができ、イニシャルコストを下げることができる。 Further, since the cooling system S according to the first embodiment can be achieved by providing the temperature sensor 30 for each cold aisle CA, the number of sensors is reduced as compared with the cooling system disclosed in Patent Document 1. And the initial cost can be reduced.

また、寄与率の高い冷却装置２０の運転および停止を行うので、様々な運転状態に対して、複雑な計算を行わなくても好適な冷却装置２０を選定することができる。 In addition, since the cooling device 20 having a high contribution rate is operated and stopped, a suitable cooling device 20 can be selected for various operation states without performing complicated calculations.

≪第２実施形態≫
＜冷却システムＳＡ＞
第２施形態に係る冷却システムＳＡについて、図３を用いて説明する。図３は、第２実施形態に係る冷却システムＳＡの構成例を示す平面図である。ここで、第２実施形態に係る冷却システムＳＡ（図３参照）は、第１実施形態に係る冷却システムＳ（図１参照）と比較して、局所冷却装置２５を備える点で異なっている。その他の構成は、第１実施形態に係る冷却システムＳと同様であり重複する説明を省略する。 << 2nd Embodiment >>
<Cooling system SA>
A cooling system SA according to the second embodiment will be described with reference to FIG. FIG. 3 is a plan view illustrating a configuration example of a cooling system SA according to the second embodiment. Here, the cooling system SA (see FIG. 3) according to the second embodiment is different from the cooling system S (see FIG. 1) according to the first embodiment in that a local cooling device 25 is provided. Other configurations are the same as those of the cooling system S according to the first embodiment, and a duplicate description will be omitted.

第２実施形態に係る冷却システムＳＡは、冷却装置２０と、局所冷却装置２５と、温度センサ３０と、制御装置４０Ａと、を備えている。 The cooling system SA according to the second embodiment includes a cooling device 20, a local cooling device 25, a temperature sensor 30, and a control device 40A.

前述のように、冷却装置２０は、室Ｒの上部を介して複数のホットアイルＨＡから高温空気を吸い込んで、室Ｒの二重床空間を介して複数のコールドアイルＣＡに低温空気を供給する。これに対し、局所冷却装置２５は、ラック１０に設置された機器の近傍に設置され、機器の発熱を局所的に冷却する。即ち、局所冷却装置２５は、冷却対象のラック１０の排気面と接したホットアイルＨＡから高温空気を取り込んで冷却し、低温空気を冷却対象のラック１０の給気面と接したコールドアイルＣＡに供給する。 As described above, the cooling device 20 draws high-temperature air from the plurality of hot aisles HA through the upper part of the room R and supplies low-temperature air to the plurality of cold aisles CA through the double floor space of the room R. . On the other hand, the local cooling device 25 is installed near the equipment installed on the rack 10 and locally cools the heat generated by the equipment. That is, the local cooling device 25 takes in high-temperature air from the hot aisle HA in contact with the exhaust surface of the rack 10 to be cooled and cools it, and cools the low-temperature air to the cold aisle CA in contact with the air supply surface of the rack 10 to be cooled. Supply.

なお、図３において、局所冷却装置２５は一部のラック列に配置されているものとして図示しているが、これに限られるものではなく、全てのラック列に局所冷却装置２５を配置してもよい。 In FIG. 3, the local cooling devices 25 are illustrated as being arranged in some of the rack rows. However, the configuration is not limited thereto, and the local cooling devices 25 may be arranged in all of the rack rows. Is also good.

制御装置４０Ａは、温度センサ３０で検出した温度に基づいて、冷却装置２０の運転／停止を判定し、冷却装置２０の運転／停止を制御する。図３に示すように、制御装置４０は、温度取得部４１と、運転状態取得部４２Ａと、運転判定部４３Ａと、記憶部４４と、を備えている。 The control device 40A determines the operation / stop of the cooling device 20 based on the temperature detected by the temperature sensor 30, and controls the operation / stop of the cooling device 20. As shown in FIG. 3, the control device 40 includes a temperature acquisition unit 41, an operation state acquisition unit 42A, an operation determination unit 43A, and a storage unit 44.

運転状態取得部４２Ａは、現在の冷却装置２０の運転状態（どの冷却装置２０が運転しているか、停止しているか）と、現在の局所冷却装置２５どの局所冷却装置２５が運転しているか、停止しているか）の運転状態を取得する。 The operation state acquisition unit 42A determines whether the current operation state of the cooling device 20 (which cooling device 20 is operating or stopped), the current local cooling device 25, which local cooling device 25 is operating, Stopped) is obtained.

運転判定部４３Ａは、温度取得部４１で取得した温度情報および運転状態取得部４２Ａで取得した現在の運転状態情報に基づいて、冷却装置２０の運転／停止を判定する。 The operation determination unit 43A determines operation / stop of the cooling device 20 based on the temperature information acquired by the temperature acquisition unit 41 and the current operation state information acquired by the operation state acquisition unit 42A.

そして、制御装置４０Ａは、運転判定部４３Ａの判定結果に基づいて、各冷却装置２０の運転／停止を制御することにより、冷却システムＳ全体を制御する。 The control device 40A controls the entire cooling system S by controlling the operation / stop of each cooling device 20 based on the determination result of the operation determination unit 43A.

制御装置４０Ａの処理は、第１実施形態に係る冷却システムＳの制御装置４０の処理（図２参照）と同様である。但し、ステップＳ１０３およびステップＳ１０７で寄与率計算する際、運転している局所冷却装置２５を考慮する点で異なっている。即ち、各冷却装置２０とラック群１５の位置関係（距離）、各局所冷却装置２５とラック群１５の位置関係（距離）、各冷却装置２０の運転状態、および、各局所冷却装置２５の運転状態から冷却装置２０の寄与率を算定する近似式を用いて各冷却装置２０の寄与率（対象となるラック群１５へ供給される風量比率）を算出する。 The process of the control device 40A is the same as the process of the control device 40 of the cooling system S according to the first embodiment (see FIG. 2). However, the difference is that the local cooling device 25 that is operating is taken into account when calculating the contribution ratio in step S103 and step S107. That is, the positional relationship (distance) between each cooling device 20 and the rack group 15, the positional relationship (distance) between each local cooling device 25 and the rack group 15, the operation state of each cooling device 20, and the operation of each local cooling device 25 The contribution ratio of each cooling device 20 (the ratio of the amount of air supplied to the target rack group 15) is calculated using an approximate expression for calculating the contribution ratio of the cooling device 20 from the state.

＜作用効果＞
このように、第２実施形態に係る冷却システムＳＡによれば、局所冷却装置２５を備える構成においても第１実施形態に係る冷却システムＳと同様にシステム効率のよい冷却装置２０の台数制御が可能となる。 <Effects>
As described above, according to the cooling system SA according to the second embodiment, even in the configuration including the local cooling device 25, the number of the cooling devices 20 with high system efficiency can be controlled similarly to the cooling system S according to the first embodiment. Becomes

また、制御装置４０は、局所冷却装置２５の運転／停止を行わず、冷却装置２０の運転／停止を行うようになっている。これにより、消費電力の大きい冷却装置２０を台数制御することにより、システム効率が向上する。 Further, the control device 40 does not operate / stop the local cooling device 25, but operates / stops the cooling device 20. Thereby, the system efficiency is improved by controlling the number of cooling devices 20 that consume a large amount of power.

≪変形例≫
なお、本実施形態に係る冷却システムＳ，ＳＡは、上記実施形態の構成に限定されるものではなく、発明の趣旨を逸脱しない範囲内で種々の変更が可能である。 ≪Modified example≫
Note that the cooling systems S and SA according to the present embodiment are not limited to the configuration of the above embodiment, and various modifications can be made without departing from the spirit of the invention.

本実施形態（第１，２実施形態）に係る冷却システムＳ，ＳＡが備える冷却装置２０の台数や配置位置は、図１，図３に示す台数や配置位置に限定されるものではない。また、冷却装置２０は室内Ｒに設置されているものとして説明したが、これに限られるものではなく、ホットアイルＨＡから高温空気を取り込む風路と、コールドアイルＣＡに低温空気を供給する風路と、を設け、冷却装置２０を室Ｒの外（機械室）に設置してもよい。 The number and arrangement position of the cooling devices 20 included in the cooling systems S and SA according to the present embodiment (first and second embodiments) are not limited to the number and arrangement position shown in FIGS. Although the cooling device 20 has been described as being installed in the room R, the present invention is not limited to this. The air passage for taking in high-temperature air from the hot aisle HA and the air passage for supplying low-temperature air to the cold aisle CA And the cooling device 20 may be installed outside the chamber R (machine room).

本実施形態（第１，２実施形態）に係る冷却システムＳ，ＳＡは、冷却装置２０からの低温空気を室Ｒの二重床空間を介して複数のコールドアイルＣＡに供給する床吹出し方式であるものとして説明したがこれに限られるものではない。また、図４に示すように、室ＲにホットアイルＨＡとコールドアイルＣＡとを仕切る間仕切りが設けられていてもよい。この間仕切りにより、ラック１０の排気面から排気された高温空気（図４において左下がりのハッチングを付した矢印参照）がラック１０の給気面へと再循環することを防止する。換言すれば、ラック１０の排気面から排気された高温空気と、冷却装置２０からラック１０の給気面に供給される低温空気（図４において白抜き矢印参照）と、が混合せず、分離する。これにより、システム効率が向上する。 The cooling systems S and SA according to the present embodiment (first and second embodiments) are of a floor blowing type in which low-temperature air from the cooling device 20 is supplied to a plurality of cold aisles CA via a double floor space of the room R. Although described as being provided, the present invention is not limited to this. Further, as shown in FIG. 4, a partition for separating the hot aisle HA and the cold aisle CA may be provided in the chamber R. This partition prevents high-temperature air exhausted from the exhaust surface of the rack 10 (see the hatched arrow in FIG. 4) from recirculating to the air supply surface of the rack 10. In other words, the high-temperature air exhausted from the exhaust surface of the rack 10 and the low-temperature air (see the white arrow in FIG. 4) supplied from the cooling device 20 to the air supply surface of the rack 10 are not mixed but separated. I do. This improves system efficiency.

制御装置４０は、冷却装置２０の運転の判定および制御を行うものとして説明したが、これに限定されるものではない。４１〜４３および判定結果を表示する表示装置（図示せず）を備える運転判定装置として、表示された判定結果に基づいて、運転者が冷却装置２０の運転／停止を操作する構成であってもよい。 The control device 40 has been described as performing the determination and control of the operation of the cooling device 20, but is not limited thereto. As an operation determination device including the display devices 41 to 43 and a display device (not shown) for displaying the determination result, even if the driver operates / stops the cooling device 20 based on the displayed determination result. Good.

Ｓ，ＳＡ冷却システム
１０ラック（機器）
１５ラック群
２０冷却装置
２５局所冷却装置
３０温度センサ（温度計測装置）
４０，４０Ａ制御装置
４１温度取得部
４２，４２Ａ運転状態取得部
４３，４３Ａ運転判定部
４４記憶部
ＨＡホットアイル
ＣＡコールドアイル
Ｒ室（部屋） S, SA Cooling system 10 Rack (equipment)
15 Rack group 20 Cooling device 25 Local cooling device 30 Temperature sensor (temperature measuring device)
40, 40A Controller 41 Temperature acquisition unit 42, 42A Operation state acquisition unit 43, 43A Operation determination unit 44 Storage unit HA Hot aisle CA Cold aisle R Room (room)

Claims

In a room in which a rack row in which racks for installing electronic devices are arranged is formed, and a rack group in which two exhaust rows of the rack rows are arranged to face each other,
A plurality of cooling devices for supplying low-temperature air to the rack group,
A temperature measuring device for measuring a suction temperature of the low-temperature air sucked into the rack group,
A control device that determines whether to start or stop each cooling device of the plurality of cooling devices,
With
The control device includes:
A cooling device having a high air volume ratio of low-temperature air supplied to the rack group to be measured by the measurement point of the temperature measurement device is calculated,
It is to determine the start or stop of each cooling device based on the result of the calculation,
The control device includes:
A distance between each rack group and each cooling device, and, as a function of an operation state of each cooling device, an approximate expression for calculating an air volume ratio of low-temperature air supplied from a certain cooling device to a certain rack group,
When the maximum value of the temperature measured by the temperature measurement device is higher than a first threshold,
The air flow ratio of the low-temperature air supplied from each cooling device to the rack group at which the temperature is the maximum value is calculated by the above approximate expression,
A cooling system, wherein it is determined that the cooling device having the highest calculated air volume ratio is started.

The control device includes:
When the maximum value of the temperature measured by the temperature measurement device is lower than the first threshold, and the minimum value of the temperature measured by the temperature measurement device is lower than the second threshold,
The air flow ratio of the low-temperature air supplied from each cooling device to the rack group where the temperature is the minimum value is calculated by the above approximate expression,
The cooling system according to claim 1, wherein it is determined that the cooling device having the highest calculated air volume ratio is stopped.

The cooling system according to claim 1, further comprising a plurality of local cooling devices installed near the electronic device to locally cool heat generated by the electronic device.

The control device includes:
A group of racks from a certain cooling device as a function of the distance between each rack group and each cooling device, the distance between each rack group and each local cooling device, the operating state of each cooling device, and the operating state of each local cooling device. Has an approximate expression for calculating the air volume ratio of the low-temperature air supplied to the
When the maximum value of the temperature measured by the temperature measurement device is higher than a first threshold,
The air flow ratio of the low-temperature air supplied from each cooling device to the rack group at which the temperature is the maximum value is calculated by the above approximate expression,
The cooling system according to claim 3, wherein it is determined that the cooling device having the highest calculated air volume ratio is started.

The control device includes:
When the maximum value of the temperature measured by the temperature measurement device is lower than the first threshold, and, when the minimum value of the temperature measured by the temperature measurement device is lower than the second threshold,
The air flow ratio of the low-temperature air supplied from each cooling device to the rack group where the temperature is the minimum value is calculated by the above approximate expression,
The cooling system according to claim 4, wherein it is determined that the cooling device having the highest calculated air volume ratio is stopped.

The control device includes:
When the cooling device determined to stop is the cooling device started in the previous operation,
The cooling system according to claim 2, wherein it is determined that the cooling device is not stopped.

In a room in which a rack row in which racks for installing electronic devices are arranged is formed, and a rack group in which exhaust surfaces of two rows of racks face each other is formed, the rack group is An air conditioning control device that controls a plurality of cooling devices that supply low-temperature air,
The measurement point of the temperature measurement device that measures the suction temperature of the low-temperature air sucked into the rack group calculates a cooling device having a high air volume ratio of the low-temperature air supplied to the rack group to be measured,
It is to determine the start or stop of each cooling device based on the result of the calculation,
A distance between each rack group and each cooling device, and, as a function of an operation state of each cooling device, an approximate expression for calculating an air volume ratio of low-temperature air supplied from a certain cooling device to a certain rack group,
When the maximum value of the temperature measured by the temperature measurement device is higher than a first threshold,
Calculate the air volume ratio of the low-temperature air supplied from each cooling device to the rack group at which the temperature becomes the maximum value by the above approximate expression,
An air-conditioning control device characterized in that it is determined that the cooling device having the highest calculated air volume ratio is started.

In a room in which a rack row in which racks in which electronic devices are installed are arranged is formed, and a rack group in which the exhaust surfaces of the two rack rows face each other is formed, the rack group is An air conditioning system for a cooling system, comprising: a plurality of cooling devices that supply low-temperature air; a temperature measurement device that measures a suction temperature of low-temperature air sucked into the rack group; and a control device that determines whether to start or stop each cooling device. A control method,
The control device includes:
When the maximum value of the temperature measured by the temperature measurement device is higher than a first threshold,
The air flow ratio of the low-temperature air supplied from each cooling device to the rack group having the maximum temperature is calculated by an approximation formula, and it is determined that the cooling device having the highest calculated air flow ratio is started,
When the maximum value of the temperature measured by the temperature measurement device is lower than the first threshold, and the minimum value of the temperature measured by the temperature measurement device is lower than the second threshold,
The air flow ratio of the low-temperature air supplied from each cooling device to the rack group having the minimum temperature is calculated by the approximate expression, and it is determined that the cooling device having the highest calculated air flow ratio is stopped. Air conditioning control method.