JP6644906B2 - Electronic equipment for immersion cooling, power supply unit, and cooling system - Google Patents

Description

  The present invention relates to an electronic device and a power supply unit, and more particularly to an electronic device that is immersed in a cooling liquid in a cooling device and directly cooled, and a power supply unit. The present invention also relates to a cooling system using the electronic device and a power supply unit. In this specification, an electronic device generally refers to an electronic device that requires super-high-performance operation or stable operation such as a supercomputer or a data center and generates a large amount of heat from itself, but is not limited thereto. is not. The power supply unit is a step-down device that steps down a high-voltage input (for example, 380 V DC, 200 V AC) from an external power supply to a DC voltage output (for example, 48 V DC (including 47.5 V DC), 12 V DC) for electronic devices. Refers to the unit that includes.

  One of the biggest issues in determining the performance limit of supercomputers in recent years is power consumption, and the importance of research on power saving of supercomputers has already been widely recognized. That is, the speed performance per power consumption (Flops / W) is one index for evaluating a supercomputer. Also, in data centers, it is said that about 45% of the power consumption of the entire data center is spent on cooling, and there is an increasing demand for reducing power consumption by improving cooling efficiency.

  Conventionally, air cooling and liquid cooling have been used for cooling supercomputers and data centers. The liquid cooling type is generally considered to have a high cooling efficiency because it uses a liquid having much better heat transfer performance than air. In particular, an immersion cooling system using a fluorocarbon-based cooling liquid is superior to electronic equipment maintenance (specifically, for example, adjustment, inspection, repair, replacement, and extension; hereinafter the same) as compared with a system using a synthetic oil. And the like, and has been attracting attention in recent years.

  The present inventor has already developed a small-sized immersion cooling device having excellent cooling efficiency for a small-scale immersion cooling supercomputer. This device is applied to a small supercomputer “Suiren” installed at the High Energy Accelerator Research Organization, and is operated (Non-Patent Document 1).

  In addition, the present inventors have proposed an improved immersion cooling device that can significantly increase the mounting density of an electronic device subjected to immersion cooling (Non-Patent Documents 2 and 3).

"Liquid immersion-cooled compact supercomputer" ExaScaler-1 "measures the world's top-ranking value of the latest supercomputer power consumption performance ranking" Green500 "with more than 25% performance improvement," March 31, 2015, Press release, ExaScaler Co., Ltd., URL: http://www.exascaler.co.jp/wp-content/uploads/2015/03/20150331.pdf "Aiming at Exa-class high-performance machine, renewing semiconductor, cooling and connection (upper)", Nikkei Electronics July 2015, pp. 99-105, June 20, 2015, published by Nikkei BP "Supercomputer" Shoubu (Shobu) "won the world's first place in Green500 for the third consecutive term in energy-saving ranking of supercomputers-" Satsuki "also took second place. Supercomputers installed by RIKEN occupy the first and second places- June 20, 2016, press release, ExaScaler Co., Ltd., URL: http://www.exascaler.co.jp/wp-content/uploads/2016/06/20160620_1.pdf

  An electronic device applied to an immersion cooling device is a power supply that normally steps down a high-voltage input supplied from an external power supply to a low-voltage output used in a device such as a processor, a storage device, or a network card of the electronic device. It has a unit. Since the power supply unit is connected to an external power supply via a power supply cable, the power supply unit is placed at the top of the electronic device so that a connector plug of the power supply cable can be easily connected. However, for example, in a liquid immersion cooling device containing dozens of electronic devices, several tens of network cables and several tens of thick power cables are wired above these electronic devices, so that cable wiring is complicated. In addition, there is a problem that the maintenance efficiency of the electronic device is hindered. Further, depending on the configuration of the electronic device, the volume, length, and weight of the power supply unit may occupy １ ／ to の of the volume, length, and weight of the entire electronic device. For this reason, in order to accommodate a long electronic device, it is necessary to design a cooling tank (hereinafter, sometimes referred to as an “immersion tank”) at a high height (a large depth). Furthermore, since the relatively heavy power supply unit is placed at the top of the electronic device, the center of gravity of the electronic device, and consequently the center of gravity of the entire liquid immersion cooling device, becomes high, which may cause instability against large vibration such as a large earthquake. there were.

  Therefore, in electronic equipment applied to the immersion cooling device, it is desired to develop a new electronic equipment that does not require wiring of a power cable above the electronic equipment and a new power supply unit that is compatible with the electronic equipment. It is rare.

  On the other hand, in recent years, a system (hereinafter, sometimes referred to as an “HVCD system”) that supplies a high-voltage direct current of 380 V DC (hereinafter, referred to as “HVDC”) to an electronic device such as a server installed in a data center has been proposed. The main advantage of the HVDC system is that power loss is greatly reduced. For example, when converting 380V DC supplied from an external power supply to 48V DC and supplying the same to the electronic device, the power loss generated in the electronic device is conventionally reduced. Theoretically can be reduced to 1/16 of the power loss when 12 V DC is supplied. Since the power loss generated in the electronic device is released as heat, reducing the power loss is effective for improving the cooling efficiency of the immersion cooling system. Therefore, it is desired to develop a power supply unit having a new configuration for adapting the immersion cooling electronic device to the HVDC system.

In order to solve the above problems, according to one aspect of the present invention, an electronic device that is immersed in a cooling liquid in a cooling device and directly cooled,
A carrier substrate having a voltage input terminal for supplying a DC voltage for the electronic device, wherein the voltage input terminal is electrically connected to a voltage output terminal of a power supply unit,
When the electronic device is electrically connected to the power supply unit, a support member that supports the substrate so as to be located above the power supply unit installed at the bottom of a cooling tank included in the cooling device,
including.

  In a preferred embodiment of the electronic device according to one aspect of the present invention, the support member may include a backboard or a frame structure to which the carrier substrate is fixed on one surface.

  Further, in a preferred embodiment of the electronic device according to one aspect of the present invention, the backboard or the frame structure is slidably supported by a plurality of support columns vertically standing and fixed in the cooling bath. Good.

  In a preferred embodiment of the electronic device according to one aspect of the present invention, the backboard or the frame structure may include a support pin or a guide pin inserted from above into a bracket fixed in the cooling bath.

According to another aspect of the present invention, a power supply unit that is immersed in a cooling liquid in a cooling device and directly cooled,
A voltage input terminal for supplying an external power supply voltage, and a unit substrate including a voltage output terminal, wherein the voltage output terminal is electrically connected to a voltage input terminal of an electronic device,
A step-down device mounted on the unit substrate,
Including
When the electronic device is electrically connected to the power supply unit, the power supply unit is disposed at a bottom of a cooling tank provided in the cooling device so that the electronic device is located at an upper portion of the power supply unit, It is cooled by a coolant flowing from the bottom or from another part of the cooling bath.

  Further, in a preferred embodiment of the power supply unit according to another aspect of the present invention, the unit substrate may form a flow channel for passing the cooling liquid between one surface of the unit substrate and the bottom. Preferably, it is arranged away from the bottom.

  Further, in a preferred embodiment of the power supply unit according to another aspect of the present invention, the unit substrate may have a flow channel through which the cooling liquid passes in the unit substrate.

  In a preferred embodiment of the power supply unit according to another aspect of the present invention, the step-down device may include a converter module that steps down an external high-voltage DC voltage of 200V-420V to a DC voltage of 24V-52V.

  In a preferred embodiment of the power supply unit according to another aspect of the present invention, the step-down device is configured to perform AC / DC conversion and step-down conversion of a single-phase or three-phase external high-voltage AC voltage of 100 V-250 V into a DC voltage of 24 V-52 V. And a converter module.

  In a preferred embodiment of the power supply unit according to another aspect of the present invention, the step-down device includes a power factor correction circuit, a noise filter, an additional rectifier, and a surge circuit. Peripheral circuits may be included.

  In a preferred embodiment of the power supply unit according to another aspect of the present invention, when a state where the voltage output terminal is coupled to the voltage input terminal of the electronic device is detected, supply of a voltage to the electronic device is started. It may further include a first controller that performs the operation.

  In a preferred embodiment of the power supply unit according to another aspect of the present invention, a control installed in an upper portion of the liquid level of the cooling liquid in the cooling tank, a wall structure of the cooling tank, or near the cooling tank. It is preferable to further include a second controller that detects ON / OFF of a switch that can be operated from the panel and switches between start / stop of supply of voltage to the electronic device.

According to still another aspect of the present invention, an electronic device that is immersed in a cooling liquid in a cooling device and directly cooled,
A carrier substrate having a voltage input terminal for supplying a DC voltage for the electronic device, wherein the voltage input terminal is electrically connected to a voltage output terminal of a power supply unit,
A plurality of module connectors arranged on one surface of the carrier board,
A plurality of module boards, each of the plurality of module boards having a module connector plug electrically coupled to each of the plurality of module connectors, a module board;
A plurality of support plates attached at predetermined intervals in the longitudinal direction of the carrier substrate, adjacent support plates, holding both ends of the plurality of module substrates, a support plate,
When the electronic device is electrically connected to the power supply unit, a support member that supports the carrier substrate so as to be located above the power supply unit installed at the bottom of a cooling tank included in the cooling device,
including.

  In a preferred embodiment of the electronic device according to still another aspect of the present invention, the support member may include a backboard or a frame structure to which the carrier substrate is fixed on one surface.

  In a preferred embodiment of the electronic device according to still another aspect of the present invention, the backboard or the frame structure is slidably supported by a plurality of support columns vertically standing and fixed in the cooling bath. Good.

  In a preferred embodiment of the electronic device according to still another aspect of the present invention, the backboard or the frame structure includes a support pin or a guide pin inserted from above into a bracket fixed in the cooling bath. Good.

  In a preferred embodiment of the electronic device according to still another aspect of the present invention, the backboard or frame structure includes an outer frame portion, and a beam portion crossing the inside of the outer frame portion in a width direction; Preferably, a plurality of support plates are attached to the outer frame and the beam.

  In a preferred embodiment of the electronic device according to still another aspect of the present invention, a plurality of grooves are formed in each of the support plates, and each of the plurality of grooves has an end portion of the plurality of module substrates. Each may be inserted.

  In a preferred embodiment of the electronic device according to still another aspect of the present invention, each of the plurality of module boards includes a module board equipped with a processor and a memory, a module board equipped with a programmable logic device, and a network communication module. A module board equipped with an adapter card function, a module board equipped with a storage device, or a combination of two or more of the processor and the memory, the programmable logic device, the adapter card function for network communication, or the storage device It is preferable that the substrate is a composite module substrate mounted thereon.

A power supply unit according to still another aspect of the present invention is a power supply unit that is immersed in a cooling liquid in a cooling device and directly cooled,
A power supply voltage input terminal for supplying an external power supply voltage, and a unit substrate including a voltage output terminal, wherein the voltage output terminal is electrically connected to a voltage input terminal of an electronic device,
A step-down device mounted on the unit substrate,
A stage to which the unit substrate is fixed,
Including
The power supply unit, when the electronic device is electrically connected to the power supply unit, so that the electronic device is located at the top of the power supply unit, is installed at the bottom of the cooling tank provided in the cooling device,
The stage holds the unit substrate so as to form a flow channel between one surface of the unit substrate and the bottom through which the cooling liquid flowing from the bottom passes.

  In a preferred embodiment of the power supply unit according to still another aspect of the present invention, a plurality of spacers for forming the flow channel may be attached to the stage.

  In a preferred embodiment of the power supply unit according to still another aspect of the present invention, the stage includes a flat plate placed on the bottom, and the flat plate is formed with a hole for passing the coolant flowing from the bottom. Good to be.

  In a preferred embodiment of the power supply unit according to still another aspect of the present invention, the stage is provided with a plurality of support columns that stand vertically in the cooling tank, and the plurality of support columns are The backboard or frame structure of the device may be slidably supported.

  In a preferred embodiment of the power supply unit according to still another aspect of the present invention, the power supply unit further includes a switch at an upper end or a side surface of the plurality of support columns, for switching start / stop of supply of a voltage to the electronic device. Good.

  In a preferred embodiment of the power supply unit according to still another aspect of the present invention, the step-down device may include a converter module that steps down an external high-voltage DC voltage of 200V-420V to a DC voltage of 24V-52V. .

  In a preferred embodiment of the power supply unit according to still another aspect of the present invention, the step-down device includes a DC-DC converter for converting a single-phase or three-phase external high-voltage AC voltage of 100 V to 250 V into a DC voltage of 24 V to 52 V. A step-down converter module may be included.

  In a preferred embodiment of the power supply unit according to still another aspect of the present invention, the step-down device includes at least one of a power factor correction circuit, a noise filter, an additional rectifier, and a surge circuit. Should be included.

  In a preferred embodiment of the power supply unit according to still another aspect of the present invention, when detecting a state in which the voltage output terminal is coupled to the voltage input terminal of the electronic device, the power supply unit supplies a voltage to the electronic device. It may further comprise a first controller to start.

  In a preferred embodiment of the power supply unit according to still another aspect of the present invention, the power supply unit is disposed above the liquid surface of the cooling liquid in the cooling tank, a wall structure of the cooling tank, or in the vicinity of the cooling tank. The electronic device may further include a second controller that switches ON / OFF of a switch operable from a control panel and switches between start and disconnection of voltage supply to the electronic device.

A cooling system according to still another aspect of the present invention,
A cooling device,
A plurality of electronic devices that are immersed in a cooling liquid in the cooling device and are directly cooled,
A plurality of power supply units that are immersed in a cooling liquid in the cooling device and are directly cooled,
Including
The cooling device has a cooling tank having an open space formed by a bottom wall and a side wall, and a plurality of inflow openings through which the cooling liquid flows are formed at a bottom of the cooling tank, and the cooling tank flows through the cooling tank. An outflow opening is formed in the vicinity of the liquid surface of the cooling liquid,
Each of the plurality of electronic devices includes a voltage input terminal that supplies a DC voltage for the electronic device,
Each of the plurality of power supply units includes a power supply voltage input terminal for supplying an external power supply voltage, and a voltage output terminal electrically connected to a voltage input terminal of the electronic device,
Each of the power supply units is installed at the bottom of the cooling bath so that the electronic device is located above the power supply unit when each of the electronic devices is electrically connected to each of the power supply units. The power supply unit and the electronic device are cooled by the coolant flowing from the bottom.

  In a preferred embodiment of the cooling system according to still another aspect of the present invention, each of the electronic devices may include a carrier substrate having the voltage input terminal and a support member that supports the carrier substrate.

  In a preferred embodiment of the cooling system according to still another aspect of the present invention, the support member may include a backboard or a frame structure to which the carrier substrate is fixed on one surface.

  In a preferred embodiment of the cooling system according to still another aspect of the present invention, the power supply unit includes a unit substrate having the power supply voltage input terminal and a power supply output terminal, a step-down device mounted on the unit substrate, A stage to which the unit substrate is fixed, wherein the stage forms a flow channel between one surface of the unit substrate and the bottom portion, through which the cooling liquid flowing from the bottom portion passes. It is good to hold a unit board.

  In a preferred embodiment of the cooling system according to still another aspect of the present invention, a plurality of spacers for forming the flow channel may be attached to the stage.

  In a preferred embodiment of the cooling system according to still another aspect of the present invention, the stage includes a flat plate placed on the bottom, and the flat plate is formed with a hole for passing the cooling liquid flowing from the bottom. Good to be.

  In a preferred embodiment of the cooling system according to still another aspect of the present invention, the stage is provided with a plurality of support columns that stand vertically in the cooling tank, and the plurality of support columns are The backboard or frame structure of the device may be slidably supported.

  According to the present invention, since the power supply unit is abolished from the electronic device, the wiring of the power supply cable on the upper side of the electronic device is unnecessary, the cable wiring can be simplified, and the maintainability of the electronic device can be improved. it can. Since the combined length of the electronic device and the power supply unit according to the present invention can be reduced, the height of the cooling tank can be designed to be low. Furthermore, since the relatively heavy power supply unit is placed at the bottom of the cooling tank, the center of gravity of the entire liquid immersion cooling device can be lowered, and the vibration resistance can be improved.

  Further, when the power supply unit is adapted to the HVDC system, not only the power loss generated in the electronic device is reduced, and the heat generated in the electronic device is also reduced, but also the cooled coolant flowing from the bottom of the cooling tank is reduced. Since heat is quickly removed from the power supply unit placed at the bottom of the cooling tank, the efficiency of cooling the electronic device and the power supply unit can be further improved.

  Note that the cooling tank having the “open space” in this specification includes a cooling tank having a simple closed structure that does not impair the maintainability of the electronic device. For example, a structure in which a top plate for closing the open space of the cooling bath can be placed at the opening of the cooling bath or a structure in which the top plate can be detachably attached via packing or the like has a simple closed structure. It can be said that.

  The above and other objects and advantages of the present invention will be more clearly understood through the following description of the embodiments. However, the embodiment described below is an exemplification, and the present invention is not limited to this.

1 is a perspective view of an electronic device according to an embodiment of the present invention. 1 is a side view of an electronic device according to an embodiment of the present invention. 1 is a front view of an electronic device according to an embodiment of the present invention. FIG. 2 is a partial assembly view of the electronic device according to the embodiment of the present invention, which is an assembly diagram of a backboard or frame structure, a carrier substrate, and a support plate. It is a perspective view showing an example of a unit board in a power supply unit concerning one embodiment of the present invention. It is a perspective view showing an example of a stage in a power supply unit concerning one embodiment of the present invention. FIG. 4 is a perspective view showing a state where a unit substrate is mounted on a stage. It is a perspective view of a cooling tank with which a cooling device is provided in a cooling system concerning one embodiment of the present invention. It is a top view of a cooling tank with which a cooling device is provided in a cooling system concerning one embodiment of the present invention. FIG. 2 is a partial cross-sectional view of a cooling device in the cooling system according to the embodiment of the present invention. FIG. 9 is a plan view illustrating an example in which four stages to which unit substrates are attached are arranged side by side at the bottom of a cooling bath. It is a sectional perspective view showing an important section composition of a liquid immersion cooling device.

Hereinafter, preferred embodiments of an electronic device, a power supply unit, and a cooling system according to the present invention will be described in detail with reference to the drawings.
First, an electronic device 100 according to an embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a perspective view of an electronic device 100 according to an embodiment of the present invention, FIG. 2 is a side view, FIG. 3 is a front view, and FIG. 4 is a partially assembled view. The electronic device 100 is an electronic device that is immersed in a cooling liquid in a cooling device described later and is directly cooled. The electronic device 100 includes a backboard or a frame structure 110 (hereinafter, simply referred to as “backboard 110”), a plurality of module boards 120, a carrier board 121, and a plurality of support plates 115, 117. As illustrated, the power supply unit is eliminated from the electronic device 100. The power supply unit is installed at the bottom of a cooling tank provided in the cooling device, as described later.

  The backboard 110 constitutes a support member that supports the carrier substrate 121. As shown in FIG. 4, the backboard 110 includes an outer frame 110b and a beam 110c crossing the inside of the outer frame 110b in the width direction. In an upper portion of the outer frame 110b, a hanging metal hole 111 through which a hanging tool is inserted when the electronic device 100 is put into or taken out of the cooling bath is formed. In addition, the back board 110 includes a pair of support pins or guide pins 113 (hereinafter, simply referred to as “support pins 113”) extending downward from a lower portion of the outer frame 110b. The plurality of support plates 115 and 117 are attached to the outer frame 110b and the beam 110c via fasteners such as screws penetrating the carrier substrate 121. As a result, the carrier substrate 121 is fixed to one surface of the back board 110, and the plurality of support plates 115 and 117 are attached at predetermined intervals in the longitudinal direction of the carrier substrate 121. A plurality of grooves are formed in each of the support plates 115 and 117, and each of the ends of the plurality of module substrates 120 is inserted into each of the plurality of grooves. In this way, the adjacent support plates 115 and 117 hold both ends of the plurality of module substrates 120.

  A DC voltage input connector 131 that supplies a DC voltage for electronic devices is provided below the carrier substrate 121. The DC voltage input connector 131 corresponds to a voltage input terminal provided on the carrier board 121. A plurality of module connectors 128 are arranged on one surface of the carrier board 121. Each of the plurality of module boards 120 has a module connector plug 129 electrically connected to each of the plurality of module connectors. Therefore, each module substrate 120 can be inserted into the carrier substrate 121 and pulled out from the carrier substrate 121. In the illustrated example, two network cards 123 are attached to the carrier substrate 121. Further, 32 module substrates 120 are mounted on the carrier substrate 121, but the number of module substrates 120 is arbitrary and is not particularly limited. The type of the module board 120 is a module board on which the processor and the memory in the illustrated example are mounted (however, FIG. 1-4 shows only the processor 124 and the main memory socket 127 to which a heat sink is thermally connected), Module board with programmable logic device, module board with adapter card function for network communication, module board with storage device, or processor and memory, programmable logic device, adapter card function or storage device for network communication A composite module substrate in which two or more of the above are combined and mounted is not particularly limited. For example, the processor may use a semiconductor device with a system-on-chip design (for example, Intel Corporation's Intel Xeon processor D product family), and the main memory may include an ultra-low-profile memory module (for example, a general-purpose 32 GB A DDR4 (Double-Data-Rate4) VLP DIMM (very low profile Dual Inline Memory Module) may be used, and a programmable logic device may use an FPGA (Field-Programmable Gate Array). A device conforming to Ethernet or InfiniBand may be used as an adapter card function for the device, and a flash storage, for example, an M.2 SSD (Solid State Drive) or mSATA SSD may be used as a storage device.

  Referring to FIGS. 2 and 4, on a surface opposite to one surface of the backboard 110, a plurality of sliders 112 are provided via slider holders 114 along the longitudinal direction of the outer frame 110 b of the backboard 110. Is attached. A pair of sliders 112 attached to both the left and right sides of the outer frame portion 110b are engaged with rail grooves provided on adjacent support columns, which are vertically vertically fixed in a cooling tank to be described later. The backboard 110 is slidably supported (moved up and down in the vertical direction).

  When the electronic device 100 configured as described above slides the backboard 110 with respect to the plurality of support columns and is immersed in the cooling liquid in the cooling device and is directly cooled, the electronic device 100 flows through the electronic device. The cooling liquid to be supplied flows from the lower side to the upper side of the electronic device 100 from the hole 117a provided in the support plate 117 → the space between the adjacent module substrates 120 → the hole 117a → the space between the adjacent module substrates 120 → the hole 117a → the next The heat is quickly and efficiently removed from the module substrate 120 and the carrier substrate 121 through the space between the matching module substrates 120 → the holes 115a provided on the support plate 115, so that even if the electronic devices are mounted at high density, 100 stable operations can be ensured. In addition, each module substrate 120 can be attached to and removed from the carrier substrate 121. Thus, adjustment, inspection, repair, replacement, extension, and the like can be performed for each module board 120, so that the maintainability is significantly improved.

  Next, a power supply unit 20 according to an embodiment of the present invention will be described with reference to FIGS. FIG. 5 is a perspective view showing an example of a unit substrate 21 in the power supply unit 20 according to one embodiment of the present invention, and FIG. 6 is a perspective view showing an example of the stage 22 in the power supply unit 20 according to one embodiment of the present invention. 7 is a perspective view showing a state where the unit substrate 21 is mounted on the stage 22. FIG.

  As described above, the power supply unit 20 is a component that is not included in the electronic device 100 and is installed at the bottom of the cooling tank provided in the cooling device. The power supply unit 20 includes a unit board 21 and a step-down device 215 mounted on the unit board 21. As shown in FIG. 5, the unit board 21 supplies a power supply voltage input connector 212 for supplying an external power supply voltage from an external power supply (not shown) via a power supply cable 211, and outputs a DC voltage stepped down by a step-down device 215. And a direct-current voltage output connector 213 to be connected. The power supply voltage input connector 212 corresponds to a voltage input terminal of the unit board 21, and the DC voltage output connector 213 corresponds to a voltage output terminal. The step-down device 215 is, for example, a converter module that steps down an external high-voltage DC voltage of 200V-420V to a DC voltage of 24V-52V, or a single-phase or three-phase external high-voltage AC voltage of 100V-250V, and converts the voltage to a 24V-52V. It is preferable to include a converter module that performs AC / DC conversion and step-down to DC voltage. More specifically, the former converter module may be capable of stepping down from 380 V DC to 48 V DC, and the latter converter module may be capable of AC / DC conversion and stepping down from 200 V AC to 48 V DC. Optionally, the step-down device 215 may include a peripheral circuit of any one or more of a power factor correction circuit, a noise filter, an additional rectifier, and a surge circuit. A heat sink 216 for heat dissipation may be thermally connected to the surface of the step-down device 215. Further, the unit substrate 21 may include a plurality of input fuses 217 for performing protection in the event of a failure. The unit substrate 21 is fixed to the stage 22 via a plurality of spacers 218 as shown in FIGS. As a result, the unit substrate 21 is arranged away from the bottom so as to form a flow channel 219 through which a cooling liquid passes between one surface of the unit substrate 21 and the bottom of a cooling bath described later. Note that the unit substrate 21 may be configured to have a flow channel through which the cooling liquid passes. For example, the unit substrate 21 may be formed in a hierarchical structure or a hollow structure having an intermediate space, and the cooling liquid may be passed through the inside of the structure.

  As shown in FIG. 6, the stage 22 includes a flat plate placed on the bottom of a cooling bath described later. A plurality of holes 23 are formed near the center in the width direction of the flat plate so as to allow the cooling liquid flowing from the bottom to pass therethrough at intervals in the longitudinal direction. In addition, a plurality of notches 24 are formed at longitudinal ends of the flat plate at intervals in the longitudinal direction. The adjacent cutouts 24 have a length and width necessary for the adjacent cutouts 24 to form a hole substantially the same as the hole 23 when the plurality of stages 22 are arranged side by side. A plurality of support columns 25 are vertically mounted on the stage 22 using an L-shaped bracket 26. Therefore, when the stage 22 is installed at the bottom of the cooling bath, the plurality of support columns 25 stand upright in the cooling bath. A plurality of brackets 27 are fixed on the stage 22. The bracket 27 has a support pin insertion hole 28 formed therein.

  Each of the plurality of support columns 25 has a rail groove 251 formed therein. By engaging a pair of sliders 112 of the backboard 110 of the electronic device 100 with the rail grooves 251 provided on the adjacent support pillars, the backboard 110 is slidably supported (moved up and down in the vertical direction). .

  With respect to the power supply unit 20 configured as described above, the electronic device 100 can slide the backboard 110 with respect to the plurality of support columns 25 to raise or lower. When the electronic device 100 is lowered, the pair of support pins 113 extending downward from the lower portion of the outer frame 110 b of the back board 110 of the electronic device 100 are connected to the support pins of the pair of brackets 27 fixed to the power supply unit 20. The DC voltage output connector 213 of the power supply unit 20 and the DC voltage input connector 131 of the electronic device 100 are accurately aligned with each other. When the electronic device 100 is further lowered, the DC voltage output connector 213 and the DC voltage input connector 131 are electrically connected. At this time, the pair of support columns 25 and the pair of brackets 27 support the weight of one unit of the electronic device 100.

  The power supply unit 20 may further include a first controller that starts supplying a DC voltage to the electronic device 100 when detecting a state where the DC voltage output connector 213 is connected to the DC voltage input connector 131 of the electronic device 100. . The first controller may be mounted on the unit board 21 as an additional circuit or an electronic mechanism. Thus, the plug-in operation of the electronic device 100, in which the electronic device 100 is immediately energized simply by lowering the electronic device 100 into the cooling bath and being coupled to the power supply unit 20, becomes possible.

  In addition, the power supply unit 20 detects ON / OFF of a switch operable from an upper portion of the liquid level of the cooling liquid in the cooling tank, a wall structure of the cooling tank, or a control panel installed near the cooling tank, It is preferable to further include a second controller that switches between start and stop of supply of voltage to the electronic device 100. This allows the operator to manually switch ON / OFF for each electronic device 100, thereby improving maintainability. The second controller may also be mounted on the unit board 21 as an additional circuit or an electronic mechanism.

  A switch for sending a signal for switching on / off of the supply of the voltage to the electronic device 100 to the second controller may be provided at an upper end or a side surface of each of the plurality of support columns 25.

  Next, a preferred embodiment of a liquid immersion cooling apparatus for directly cooling the electronic device 100 and the power supply unit 20 according to the embodiment of the present invention described above by immersing the same in a cooling liquid will be described with reference to the drawings. explain. In the description of the present embodiment, a configuration of a high-density immersion cooling device that cools the electronic device 100 and the power supply unit 20 in a total of 24 units, each of which is accommodated in a 6 × 4 section of a cooling tank and cooled. Note that this is merely an example, and the number of units of the electronic device in the high-density liquid immersion cooling device is arbitrary, and does not limit the configuration of the electronic device that can be used in the present invention.

  With reference to FIGS. 8 to 12, the immersion cooling device 1 according to one embodiment has a cooling bath 10, and an open space 10 a is formed by a bottom wall 11 and a side wall 12 of the cooling bath 10. A plurality of inflow openings 150 through which the cooling liquid flows are formed in the bottom wall (bottom portion) 11 in a 9 × 3 pattern. The side wall 12 has a power cable introduction port 12a, a network cable introduction port 12b, and an outflow opening 170 formed near the liquid surface of the coolant.

  The immersion cooling device 1 has a top plate 10b for closing the open space 10a of the cooling tank 10. At the time of maintenance work of the immersion cooling device 1, the top plate 10b is removed from the opening to open the open space 10a, and at the time of operation of the immersion cooling device 1, the top plate 10b is placed at the opening of the cooling tank 10 to open. The space 10a can be closed.

  The cooling bath 10 contains a sufficient amount of cooling liquid up to the liquid level to immerse the entire electronic device 100 (see FIG. 10). Examples of the cooling liquid include “Fluorinert (trademark of 3M, the same applies hereinafter) FC-72” (boiling point: 56 ° C.), “Fluorinert FC-770” (boiling point: 95 ° C.), and “Fluorinert FC-3283” (trade name of 3M). A fluorine-based inert liquid composed of a completely fluorinated product (perfluorocarbon compound) known as "Fluorinert FC-40" (boiling point 155 ° C) or "Fluorinert FC-43" (boiling point 174 ° C) is preferably used. It can be used, but is not limited thereto. In addition, since Fluorinert FC-40 and FC-43 have a boiling point higher than 150 ° C. and are extremely difficult to evaporate, when one of them is used as a cooling liquid, the liquid level in the cooling tank 10 is increased for a long time. Advantageously retained over time.

  A plurality of inflow headers 16 having a cooling liquid inlet 15 at one end are provided below the bottom wall 11 of the cooling tank 10. A receiving portion 17 having a cooling liquid outlet 18 is provided outside the side wall 12 of the cooling bath 10. The receiving portion 17 covers the outflow opening 170 and receives the coolant flowing out of the outflow opening 170 without leaking.

  Referring to FIG. 11, four flat plate stages 22 are arranged on bottom wall 11 of cooling bath 10. Each of the plurality of holes 23 formed in the stage 22 and the substantially same hole as the hole 23 formed by combining the adjacent notches 24 is formed in each of the plurality of inflow openings 150 formed in the bottom wall 11. Matches. Therefore, the flow of the coolant flowing from the inlet 150 is not hindered by the power supply unit 20. Further, since a flow channel through which the cooling liquid passes is secured between the unit substrate 21 of the power supply unit 20 and the stage 22 (bottom wall 11), the cooling liquid quickly and efficiently transfers heat from both sides of the unit substrate 21. Take away. Therefore, the cooling efficiency of the power supply unit 20 is excellent. Further, since the unit substrate 21 of the power supply unit 20 can be placed in parallel with the bottom wall 11 of the cooling tub 10, the height of the power supply unit 20 in the height (depth) direction of the cooling tub 10 can be reduced. It can be kept lower than that. Therefore, since the total length of the electronic device 100 and the power supply unit 20 can be reduced, the height of the cooling tank 10 can be designed to be low (shallow depth).

  In addition, the cooling liquid flowing from the inflow opening 150 flows from the lower side to the upper side of the electronic device 100 from the hole 117 a provided in the support plate 117 → the space between the adjacent module substrates 120 → the hole 117 a → the adjacent module substrate 120. The heat is quickly and efficiently removed from the module substrate 120 and the carrier substrate 121 in the order of the space between the holes → the hole 117 a → the space between the adjacent module substrates 120 → the hole 115 a provided on the support plate 115. The coolant thus warmed reaches the outlet 18 through the outflow opening 170 and the receiving portion 17. The outlet 18 is connected to a pipe (not shown) that reaches the inlet 15 through a heat exchanger (not shown). The coolant is cooled in the heat exchanger, and the cooled coolant is supplied to the inlet 15. Supplied to

  In the liquid immersion cooling device 1 according to one embodiment of the present invention, since all of the plurality of power supply units 20 are fixed on the plurality of stages 22, six electronic devices on one stage 22 are provided. After the 100 is taken out of the cooling bath 10, the stage 22 is lifted and taken out of the cooling bath 10, so that adjustment, inspection, repair, replacement, extension, etc. of the power supply unit 20 can be performed. The power cable 211 connected to each of the power units 20 can pass through the space between the lower part of the electronic device 100 and the stage 22. Therefore, the wiring of the power cable 211 may be introduced from the power cable inlet 12 a and run along the side wall 12, through the bottom of the cooling bath 10, and to the power voltage input connector 212 of the unit board 21. Wiring at the top of the device 100 is unnecessary. Therefore, the cable wiring can be simplified, and the maintainability of the electronic device can be improved.

  INDUSTRIAL APPLICABILITY The present invention can be widely applied to electronic devices for liquid immersion cooling mounted at a very high density.

DESCRIPTION OF SYMBOLS 1 Immersion cooling device 10 Cooling tank 10a Open space 10b Top plate 11 Bottom wall 12 Side wall 12a Power cable inlet 12b Network cable inlet 100 Electronic equipment 110 Backboard or frame structure 110a Hole 110b Outer frame part 110c Beam part 111 Hanging fitting Hole 112 Slider 113 Support pin or guide pin 114 Slider holding part 115, 117 Support plate 115a, 117a Hole 120 Module board 121 Carrier board 123 Network card 124 Processor 127 Main memory socket 128 Module connector 129 Module connector plug 131 DC voltage input connector 15 Inlet 150 Inflow opening 16 Inflow header 17 Receiver 170 Outflow opening 18 Outlet 20 Power supply unit 21 Unit board 211 Power supply Buru 212 supply voltage input connector 213 DC voltage output connector 215 buck device (converter module)
216 Heat sink 217 Input fuse 218 Spacer 219 Flow channel 22 Stage 23 Hole 24 Notch 25 Support post 251 Rail groove 26 L-shaped bracket 27 Bracket 28 Support pin insertion hole

Claims (4)

An electronic device that is immersed in a cooling liquid in a cooling device and directly cooled,
A carrier substrate having a voltage input terminal for supplying a DC voltage for the electronic device, wherein the voltage input terminal is electrically connected to a voltage output terminal of a power supply unit,
When the electronic device is electrically connected to the power supply unit, a support member that supports the carrier substrate so as to be located above the power supply unit installed at the bottom of a cooling tank included in the cooling device,
Electronic devices, including.   The electronic device according to claim 1, wherein the support member includes a backboard or a frame structure to which the carrier substrate is fixed on one surface.   The electronic device according to claim 2, wherein the backboard or the frame structure is slidably supported by a plurality of support columns that are fixed vertically upright in the cooling bath.   The electronic device according to claim 3, wherein the backboard or frame structure includes a support pin or a guide pin inserted from above into a bracket fixed in the cooling bath.

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