JP6641207B2 - Electronic component mounting machine and production line - Google Patents

Description

  The present invention relates to an electronic component mounting machine for mounting electronic components and a production line including a plurality of electronic component mounting machines.

  Patent Literature 1 discloses a configuration in which when an abnormality occurs in a plurality of machines arranged in a factory, a local illumination device provided on a ceiling corresponding to each machine is turned on in order to secure illuminance for work. It has been disclosed. Patent Document 2 discloses a configuration in which, in a machine tool having an illumination device that illuminates a processing area inside the machine tool, the color of the illumination light is changed or the illumination light is turned on and off in accordance with the operation state of the machine tool. ing.

JP-A-6-275383 JP 2013-193141 A

  In Patent Literature 1, it is necessary to provide a local illumination device for each machine arranged in a factory, and the costs for installation, maintenance, power consumption, and the like of the local illumination device tend to increase. On the other hand, the machine tool described in Patent Literature 2 uses the originally provided lighting device, so that the installation cost can be reduced. However, in the electronic component mounting machine, a lighting device for illuminating the inside of the electronic component mounting machine is not provided because it hinders the image recognition of the electronic component. It is necessary to provide an indicator light outside the machine. For this reason, in the electronic component mounting machine, costs such as installation, maintenance, and power consumption of the indicator light tend to increase.

  The present invention has been made in view of the problems of the background art described above, and includes an electronic component mounting machine and a plurality of electronic component mounting machines capable of recognizing an operation state when mounting electronic components at low cost. Provide a production line.

The electronic component mounting machine of the present invention that solves the above-described problem, extracts an electronic component supplied to a component supply position, transfers the collected electronic component to a substrate that is transported to a substrate transport position, and transfers the transferred electronic component. an electronic component mounting apparatus for mounting a component on the substrate, an imaging device for imaging the electronic component, the for the electronic components of light can be irradiated light irradiated during imaging of the electronic component by the imaging device Device, and a control device that controls the mounting operation of the electronic component to the board based on the imaging result of the imaging device, the control device, when the imaging device captures the electronic component, thereby emitting the light irradiation device by changing the color corresponding to the electronic components of the imaging object, except in time of imaging of the electronic component by the imaging device, by the light irradiation apparatus in the operational status of the electronic component mounting apparatus Flip was to produce light.

According to this, since the color of the irradiation light is changed depending on the type of the electronic component, the state of the electronic component can be accurately recognized. The change of the irradiation light so performed in other than when imaging the electronic component, not interfere with the time of image recognition electronic components. Then, since the irradiation light is generated by the originally provided light irradiation device, it is possible to recognize the operation status at the time of mounting the electronic component in the electronic component mounting machine at low cost.

  The production line of the present invention that solves the above-described problem, collects electronic components supplied to a component supply position, transfers the collected electronic components to a substrate that is transferred to a substrate transfer position, and transfers the transferred electronic components to the substrate. A production line including a plurality of electronic component mounting machines to be mounted on a substrate, wherein the number of the electronic component mounting machines constituting the production line is smaller than the number of the electronic component mounting machines, and On the other hand, there is provided a line light irradiation device for irradiating light according to the operation status of the electronic component mounting machine.

  According to this, since it is not necessary to provide a light irradiation device for each electronic component mounting machine, it is possible to recognize the operation status at the time of mounting the electronic component in the electronic component mounting machine at low cost.

It is a top view showing the whole electronic parts mounting machine composition of an embodiment. FIG. 2 is a diagram illustrating a schematic configuration of a component imaging device and a first light irradiation device. It is a figure showing the schematic structure of a substrate imaging device and the 2nd light irradiation device. 5 is a flowchart for explaining a component mounting operation of the control device. 5 is a flowchart for explaining an operation status monitoring operation of the control device. 1 is a diagram illustrating an overall configuration of a production line including a plurality of electronic component mounting machines according to an embodiment. 5 is a flowchart for explaining an operation status monitoring operation of the host control device. It is a figure which shows the whole structure of another form of a production line. It is a flowchart for demonstrating the operation status monitoring operation | movement of the host control apparatus of another form. 10 is a flowchart following FIG. 9 for explaining the operation status monitoring operation of the host control device of another embodiment.

<1. First embodiment>
(1-1. Overall Configuration of Electronic Component Mounting Machine)
An overall configuration of an electronic component mounting machine according to an embodiment of the present invention will be described. As shown in FIG. 1, the electronic component mounting machine 1 includes a substrate transport device 2, a plurality of tape feeders 3, a component transfer device 4, a component imaging device 5, a first light irradiation device 6, a substrate imaging device 7, and a second A light irradiation device 8, a control device 9, and the like are provided. The transport direction of the substrate K is defined as the X-axis direction, the direction perpendicular to the X-axis direction in the horizontal plane is defined as the Y-axis direction, and the direction perpendicular to the X-axis direction and the Y-axis direction is defined as the Z-axis direction.

  The substrate transfer device 2 includes first and second guide rails 21 and 22, a pair of conveyor belts (not shown), a clamp device 23, and the like. The first and second guide rails 21 and 22 extend in the X-axis direction across the center of the upper surface of the mounting machine main body 10 and are assembled to the mounting machine main body 10 in parallel with each other. A pair of endless annular conveyor belts are arranged side by side inside the first and second guide rails 21 and 22.

  The pair of conveyor belts rotate in a state where both edges of the substrate K are placed on the conveyor transport surface, respectively, and carry in and carry out the substrate K to and from the substrate transport position Pk set at the center of the mounting machine body 10. . A clamp device 23 is provided below the conveyor belt at the substrate transfer position Pk. The clamp device 23 pushes up the substrate K, clamps it in a horizontal posture, and positions the substrate K at the substrate transfer position Pk.

  The tape feeder 3 includes a flat-shaped feeder body 31 having a small width dimension, a supply reel 32 attached to a rear portion of the feeder body 31, and the like. The plurality of tape feeders 3 are mounted side by side in the X-axis direction on the upper surface of the pallet member 11 on the mounting machine body 10. On each supply reel 32, a carrier tape T that accommodates electronic components Ep (see FIG. 2) side by side is wound and held. Each tape feeder 3 intermittently feeds the carrier tape T, and sequentially supplies the electronic components Ep to a component supply position Pp provided above the front end of the feeder main body 31.

  The component transfer device 4 is an XY robot type device that can move horizontally in the X-axis direction and the Y-axis direction. The component transfer device 4 includes a pair of Y-axis rails 41 and 42, a Y-axis slider 43, an X-axis slider 44, a mounting head 45, and the like. The pair of Y-axis rails 41 and 42 are arranged near both side surfaces in the X-axis direction of the mounting machine main body 10 and extend in the Y-axis direction. A Y-axis slider 43 is mounted on the Y-axis rails 41 and 42 so as to be movable in the Y-axis direction by a ball screw mechanism.

  The X-axis slider 44 is mounted on the Y-axis slider 43 so as to be movable in the X-axis direction by a ball screw mechanism. The mounting head 45 is exchangeably held by the X-axis slider 44. The mounting head 45 has a suction nozzle 46 for sucking the electronic component Ep and mounting it on the substrate K. The component transfer device 4 sucks the electronic component Ep from each of the component supply positions Pp of the plurality of tape feeders 3, and transfers and mounts the sucked electronic component Ep to the substrate K positioned at the substrate transfer position Pk.

  As shown in FIGS. 1 and 2, the component imaging device 5 is, for example, a camera including a CCD image sensor. The component imaging device 5 is provided on the upper surface of the mounting machine main body 10 between the substrate transport device 2 and the tape feeder 3 so that the lens unit 51 faces upward. The control device 9 takes an image of the electronic component Ep with the component imaging device 5 while the mounting head 45 is moving from the tape feeder 3 onto the substrate K in order to recognize the state of the electronic component Ep sucked by the suction nozzle 46. .

  The first light irradiation device 6 includes, for example, LEDs 61 of three primary colors of light. The LED 61 is capable of emitting and blinking in a plurality of colors, and is provided on the inner peripheral surface of an inverted conical holder 62 attached to the outer periphery of the lens unit 51 of the component imaging device 5. The first light irradiation device 6 irradiates the electronic component Ep sucked by the suction nozzle 46 with light Le, and causes the light Le reflected by the electronic component Ep to enter the component imaging device 5.

  As shown in FIGS. 1 and 3, the substrate imaging device 7 is, for example, a camera including a CCD image sensor. The board imaging device 7 is provided on the X-axis slider 44 so that the lens unit 71 faces downward along with the mounting head 45. The control device 9 images the fiducial mark M attached to the substrate K with the substrate imaging device 7 in order to detect an accurate position of the substrate K.

  The second light irradiation device 8 includes, for example, LEDs 81 of three primary colors of light. The LED 81 is capable of emitting and blinking a plurality of colors, and is provided on the inner peripheral surface of a conical holder 82 attached to the outer periphery of the lens unit 71 of the substrate imaging device 7. The second light irradiation device 8 irradiates the light Lm to the fiducial mark M provided on the substrate K, and causes the light Lm reflected by the fiducial mark M to be incident on the substrate imaging device 7.

  The control device 9 stores the type and order of the electronic components Ep to be mounted on the board K, and the mounting sequence in which the tape feeder 3 and the like for supplying the electronic components Ep are commanded. Then, the control device 9 controls the component mounting operation in accordance with the mounting sequence based on the image data of the component image capturing device 5 and the board image capturing device 7, the detection data of a sensor (not shown), and the like. The control device 9 sequentially collects and updates operation status data such as the number of boards K whose production has been completed, the mounting time required for mounting the electronic components Ep, and the number of occurrences of suction errors of the electronic components Ep.

  Further, the control device 9 monitors the operation status of the electronic component mounting machine 1 during component mounting, and applies the irradiation light Le, Lm of one or both of the first light irradiation device 6 and the second light irradiation device 8 to the electronic component mounting. It is generated according to the operation status of the machine 1. The irradiation light beams Le and Lm are generated except when the first light irradiation device 6 irradiates the electronic component Ep with the light Le to image the electronic component Ep with the component imaging device 5 and the second light irradiation device 8 generates the substrate. This is performed during the component mounting operation except when the fiducial mark M is imaged by the substrate imaging device 7 by irradiating the K fiducial mark M with the light Lm.

  The reason is that the component imaging device 5 captures an image of the state of the electronic component Ep sucked by the suction nozzle 46, but it is necessary to change the color of the irradiation light Le of the first light irradiation device 6 depending on the type of the electronic component Ep. This is because, if the irradiation light beams Le and Lm are generated during the imaging, the state of the electronic component Ep sucked by the suction nozzle 46 may be erroneously recognized. This is because, for the same reason, if the irradiation light beams Le and Lm are generated during imaging of the substrate imaging device 7, the fiducial mark M may be erroneously recognized.

  As the generation of the irradiation lights Le and Lm, for example, green light is emitted or turned off during normal operation, yellow light is emitted during operation in a warning state, and red light is emitted during stoppage in an error state. The other irradiation light Le, Lm may be generated, for example, by constantly emitting or extinguishing an arbitrary color during a normal operation, and by a relatively long period of time with an arbitrary color during an operation in a warning state. Blinks in an error state and blinks in an arbitrary color at a relatively short interval.

  Here, an example of the warning state is, for example, a case in which a component break has occurred on the carrier tape T and the suction nozzle 46 has failed to suck and collect the electronic component Ep. That is, a state in which a defective board does not occur even when the operation of the electronic component mounting machine 1 (component mounting operation) is continued. An example of the error state is, for example, when the attitude of the electronic component Ep sucked and collected by the suction nozzle 46 cannot be corrected. That is, a state in which a defective board is generated when the operation of the electronic component mounting machine 1 (component mounting operation) is continued.

(1-2. Operation of Control Device)
Next, the component mounting operation and the operation status monitoring operation of the control device 9 will be described with reference to the flowcharts of FIGS. It is assumed that a predetermined supply reel 32 has already been set on the tape feeder 3 by an operator. In addition, the substrate K has already been loaded and positioned and fixed at the substrate transfer position Pk of the substrate transfer device 2, and the fiducial mark M attached to the substrate K is imaged by the substrate imaging device 7 so that the accurate It is assumed that the position has been detected. In addition, it is assumed that the irradiation light Le of the first light irradiation device 6 is generated in accordance with the operation status of the electronic component mounting machine 1, and the first light irradiation device 6 emits green light during normal operation, and is in a warning state. It emits yellow light during the operation of, and emits red light when stopped in an error state.

  First, the component mounting operation will be described. The control device 9 drives and controls the tape feeder 3 to send out the carrier tape T from the supply reel 32 (step S1 in FIG. 4), and supplies the electronic components Ep stored in the carrier tape T to the component supply position Pp (step S1). Step S2 in FIG. 4). Then, the control device 9 drives and controls the component transfer device 4 to position the suction nozzle 46 above the component supply position Pp (Step S3 in FIG. 4), and lowers the suction nozzle 46 to suction the electronic component Ep. It is collected (step S4 in FIG. 4).

  Then, the control device 9 transfers the suction nozzle 46 that has sucked and collected the electronic component Ep onto the component imaging device 5 (Step S5 in FIG. 4), and images the electronic component Ep with the component imaging device 5 to perform image processing. Then, the state of the electronic component Ep is recognized (step S6 in FIG. 4). Then, if there is no problem with the state of the electronic component Ep, the control device 9 transfers the suction nozzle 46 having sucked and collected the electronic component Ep onto the substrate K (Step S7 in FIG. 4), and lowers the suction nozzle 46 to move the electronic component Ep. The component Ep is mounted at the component mounting position on the board K (step S8 in FIG. 6). Then, the control device 9 determines whether or not the component mounting on the board K has been completed (step S9 in FIG. 6). If the component mounting on the board K has not been completed, the process returns to step S1 to perform the above-described processing. When the components are mounted on the board K, the process is terminated.

  Next, the operation status monitoring operation will be described. The operation status monitoring operation is executed during the component mounting operation. The control device 9 determines whether the operation of the electronic component mounting machine 1 is normal (step S11 in FIG. 5), and when it determines that the operation of the electronic component mounting machine 1 is normal, the first light The irradiation device 6 emits green light (step S12 in FIG. 5). Thereby, the worker can visually recognize the green light through the window for internal confirmation provided in the electronic component mounting machine 1, and can determine that the operation of the electronic component mounting machine 1 is normal.

  The control device 9 determines whether or not the electronic component Ep is imaged by the component imaging device 5 (step S13 in FIG. 5). If it is determined that the electronic component Ep is not imaged, the process returns to step S11 to perform the above-described processing. repeat. On the other hand, in step S13, when the control device 9 determines that the electronic component Ep is to be imaged, the control unit 9 changes the color of the first light irradiation device 6 to a color corresponding to the electronic component Ep to be imaged and emits light (step in FIG. 5). S14) The electronic component Ep is imaged, and the process returns to step S11 to repeat the above processing.

  On the other hand, in step S11, when the control device 9 determines that the operation of the electronic component mounting machine 1 is abnormal, it determines whether the generated operation abnormality is in a warning state (step S15 in FIG. 5). . When the control device 9 determines that the generated operation abnormality is in the warning state, the first light irradiation device 6 is changed from green to yellow to emit light (step S16 in FIG. 5), and in this case, as described above. Since no defective board is generated, the component mounting operation is continued. Accordingly, the worker can visually recognize the yellow light through the window for internal confirmation provided in the electronic component mounting machine 1, and can determine that the operation of the electronic component mounting machine 1 is in the warning state, and will be described below. Thus, it is possible to immediately start repairing the operation abnormality in the warning state.

  If the warning state generated at this time is, for example, a state in which the electronic component Ep cannot be suctioned and collected by the suction nozzle 46 due to the occurrence of a component breakage in the carrier tape T, the control device 9 determines that another electronic component Ep containing the same electronic component Ep is stored. The operation of sucking and collecting the electronic component Ep from the carrier tape T by the suction nozzle 46 is performed to continue the component mounting operation. During the operation, the operator repairs the operation abnormality in the warning state, that is, replaces the tape feeder 3 or the reel 32 in which the component has run out. As described above, in the warning state, the operator is notified and the component mounting operation is continued, so that a decrease in the production efficiency of the board can be prevented.

  Then, the control device 9 determines whether the operation abnormality in the warning state has been repaired (step S17 in FIG. 5), and when it is determined that the operation abnormality in the warning state has not been repaired, the continuation of the component mounting operation is performed. Since it is in the middle, it is determined whether or not to image the electronic component Ep by the component imaging device 5 (step S18 in FIG. 5). When it is determined that the electronic component Ep is not to be imaged, the control device 9 returns to step S17 and repeats the above-described processing. When it is determined that the electronic component Ep is to be imaged, the control device 9 sets the first light irradiation device 6 as the imaging target. The color is changed to the color corresponding to the electronic component Ep to emit light (step S19 in FIG. 5), the electronic component Ep is imaged, and the process returns to step S17 to repeat the above processing. On the other hand, in step S17, when the control device 9 determines that the operation abnormality in the warning state has been repaired, the control device 9 turns off the first light irradiation device 6 (step S20 in FIG. 5), and returns to step S11 to return to the above-described processing. repeat.

  On the other hand, in step S15, when the control device 9 determines that the generated operation abnormality is not in the warning state, it determines that the generated operation abnormality is in the error state (step S21 in FIG. 5), and performs the first light irradiation. The device 6 is changed from green to red to emit light (step S22 in FIG. 5). At this time, the operation of the mounting head 45 is stopped (step S23 in FIG. 5) because a defective board is generated as described above. Is completed. Thereby, the worker can visually recognize the red light through the window for internal confirmation provided in the electronic component mounting machine 1, and can determine that the operation of the electronic component mounting machine 1 is in an error state, which will be described below. Thus, it is possible to immediately start repairing the operation abnormality in the error state.

  If the error state generated at this time is, for example, a state in which the attitude of the electronic component Ep sucked and collected by the suction nozzle 46 is uncorrectable, the control device 9 determines that the electronic component Ep is mounted on the board K as it is, and the faulty board is detected. Therefore, the operation of the mounting head 45 is stopped. Then, the operator repairs the operation abnormality in the error state, that is, performs a work of removing the electronic component Ep sucked and collected by the suction nozzle 46 from the suction nozzle 46. As described above, in the error state, the operator is notified and the component mounting is stopped, so that the occurrence of a defective board can be prevented.

  In the first embodiment, the irradiation light of the first light irradiation device 6 according to the operation state of the electronic component mounting machine 1 is generated when the electronic component Ep is imaged because the current board K is set. However, when the next board K is carried in after the component mounting of the current board K is completed, the irradiation light of the first light irradiation device 6 according to the operation status of the electronic component mounting machine 1 is generated as follows. This is performed not only when the electronic component Ep is imaged but also when the second light irradiation device 8 does not image the substrate K. When the second light irradiation device 8 generates irradiation light of the first light irradiation device 6 according to the operation state of the electronic component mounting machine 1, the light emission is not performed when the electronic component Ep is captured and when the substrate K is not captured. To be performed.

<2. Second embodiment>
(2-1. Overall configuration of production line)
An overall configuration of a production line including a plurality of electronic component mounting machines according to an embodiment of the present invention will be described. As shown in FIG. 6, the production line 100 includes a plurality (nine in this example) of electronic component mounting machines 101, a plurality (three in this example) of line light irradiation devices 102, and a host control device. 103 and the like.

  The electronic component mounting machine 101 constituting the production line 100 includes at least one of the first light irradiation device 6 and the second light irradiation device 8 according to the operation status of the electronic component mounting machine 1 provided in the electronic component mounting machine 1 shown in FIG. Although there is no function of changing one of the irradiation lights, the structure is substantially the same as the structure of the electronic component mounting machine 1 except for the function, and therefore, detailed description is omitted. The plurality of electronic component mounting machines 101 are arranged side by side in the board transfer direction (X-axis direction).

  The line light irradiation device 102 is, for example, installed on the ceiling of a factory building, and includes LEDs of three primary colors of light that can emit or blink in a plurality of colors. In this example, three line light irradiating devices 102 are provided, and each line light irradiating device 102 is arranged so that three electronic component mounting machines 101 can be illuminated to each group as one group.

  The host control device 103 controls the control device 101a of each electronic component mounting machine 101, the light irradiation device 102 for each line, and the like. Then, the host control device 103 monitors the operation status of each of the electronic component mounting machines 101, and generates the irradiation light L of the line light irradiation device 102 according to the operation status of each of the electronic component mounting machines 101. That is, the host control device 103 determines the group to which the electronic component mounting machine 101 that has malfunctioned belongs, and generates the irradiation light L of the line light irradiation device 102 that can perform light irradiation on the group.

  As the generation of the irradiation light L, for example, green light is emitted or turned off during normal operation, yellow light is emitted during operation in a warning state, and red light is emitted during stop in an error state. As for the generation of other irradiation light, for example, during normal operation, light is always emitted or turned off in an arbitrary color, and during operation in a warning state, light is blinked in an arbitrary color at relatively long intervals. When the operation is stopped in an error state, the light is blinked in an arbitrary color at a relatively short interval. In the electronic component mounting machine 1 illustrated in FIG. 1, the irradiation light is generated except when the electronic component Ep is imaged. However, since the line light irradiation device 102 illuminates the exterior cover of the electronic component mounting machine 101, Such a regulation is not required, and the irradiation light L can be generated during the entire operation of component mounting.

(2-2. Operation of Host Controller)
Next, an operation status monitoring operation of the host control device 103 will be described with reference to a flowchart of FIG. It is assumed that each of the electronic component mounting machines 101 is in a standby state for starting a component mounting operation. The line light irradiation device 102 emits green light when the electronic component mounting machine 101 is operating normally, emits yellow light when operating in a warning state, and emits red light when stopped in an error state. .

  The host control device 103 determines whether the operations of all the electronic component mounting machines 101 in each group are normal (step S31 in FIG. 7). When the host control device 103 determines that the operation of all the electronic component mounting machines 101 in each group is normal, the line light irradiation devices 102 in each group emit green light (step S32 in FIG. 7). . Thus, the worker can visually recognize the green light even if the worker is away from the production line 100 in the factory building, and can determine that the operation of all the electronic component mounting machines 101 in each group is normal.

  On the other hand, in step S31, when the host control device 103 determines that the operation of a certain electronic component mounting machine 101 is abnormal, it specifies the group of the electronic component mounting machine 101 (step S33 in FIG. 7) and specifies It is determined whether or not the electronic component mounting machine 101 in which the operation abnormality is in the error state exists in the group that has been operated (step S34 in FIG. 7). When the host control device 103 determines that there is no electronic component mounting machine 101 in which the operation abnormality is in the error state in the specified group, it determines that the operation abnormality is in the warning state and determines the line light irradiation device of the specified group. 102 is changed from green to yellow to emit light (step S35 in FIG. 7). Thereby, the worker can visually recognize the yellow light even when the worker is away from the production line 100 in the factory building, and can determine that the operation of the electronic component mounting machine 101 belonging to the group illuminated by the yellow light is in a warning state. Therefore, as described below, it is possible to immediately start repairing the operation abnormality in the warning state.

  If the warning state generated at this time is, for example, a state in which the carrier tape T has run out of components and the suction nozzle 46 cannot suction and collect the electronic component Ep, the host control device 103 stores the same electronic component Ep in another The operation of sucking and collecting the electronic component Ep from the carrier tape T by the suction nozzle 46 is performed to continue the component mounting operation. During the operation, the operator repairs the operation abnormality in the warning state, that is, replaces the tape feeder 3 or the reel 32 in which the component has run out. As described above, in the warning state, the operator is notified and the component mounting operation is continued, so that a decrease in the production efficiency of the board can be prevented.

  Then, the host control device 103 determines whether or not the operation abnormality in the warning state has been repaired (step S36 in FIG. 7). The light irradiation device 102 is turned off (step S37 in FIG. 7), and the process returns to step S31 to repeat the above processing. On the other hand, in step S34, when the host control device 103 determines that the specified component includes the electronic component mounting machine 101 in which the operation abnormality is in the error state, the host control device 103 changes the line light irradiation device 102 of the specified group from green to red. Then, the light is emitted (step S38 in FIG. 7), and the operation of the mounting head 45 of the electronic component mounting machine 101 in which the operation abnormality is in the error state is stopped (step S39 in FIG. 7). Thereby, the worker can visually recognize the red light even if the worker is away from the production line 100 in the factory building, and can determine that the operation of the electronic component mounting machine 101 belonging to the group illuminated by the red light is in an error state. Therefore, as described below, it is possible to immediately start repairing the operation abnormality in the error state.

  If the error state generated at this time is, for example, a state in which the attitude of the electronic component Ep sucked and collected by the suction nozzle 46 is uncorrectable, the host control device 103 mounts the electronic component Ep on the board K as it is. Therefore, the operation of the mounting head 45 is stopped. Then, the operator repairs the operation abnormality in the error state, that is, performs a work of removing the electronic component Ep sucked and collected by the suction nozzle 46 from the suction nozzle 46. As described above, in the error state, the operator is notified and the component mounting is stopped, so that the occurrence of a defective board can be prevented.

<3. Another form of production line>
(3-1. Overall configuration of production line)
A schematic configuration of another form of the production line will be described with reference to FIG. 8 corresponding to FIG. 8, the same components as those of the production line 100 shown in FIG. 6 are denoted by the same reference numerals, and detailed description will be omitted. The line light irradiating device 102 shown in FIG. 6 irradiates light to a group composed of a plurality of electronic component mounting machines 101. However, as shown in FIG. A plurality of (9) electronic component mounting machines 101 may be illuminated by a single line light irradiating device 102 by providing a single line light irradiating device 102. As described above, since there is one line light irradiation device 102, one electronic component mounting machine 101 capable of light irradiation is also provided. Therefore, for example, the operator sets in advance the priority order for repairing the operation abnormality of the electronic component mounting machine 101 according to the degree of influence on the production stoppage, and stores the priority order table in the host control device 103 in advance. .

  In this example, the line light irradiation device 102 is turned off when the electronic component placement machine 101 is operating normally, and is turned in the direction of the electronic component placement machine 101 only when the operation of the electronic component placement machine 101 becomes abnormal. Since it is sufficient to irradiate the light L while turning, it is possible to significantly reduce costs such as installation, maintenance, and power consumption of the line light irradiation device 102. In this case, since the interior of the factory building is not illuminated, the exterior cover of the electronic component mounting machine 101 can be eliminated, and the cost of the electronic component mounting machine 101 can be reduced.

(3-2. Operation of host control device)
Next, the operation status monitoring operation of the host control device 103 will be described with reference to the flowcharts of FIGS. It is assumed that each of the electronic component mounting machines 101 is in a standby state for starting a component mounting operation. The line light irradiation device 102 is turned off during the normal operation of the electronic component mounting machine 101, emits yellow light during operation in a warning state, and emits red light when stopped in an error state.

  The host control device 103 determines whether or not the operation of each of the electronic component mounting machines 101 is normal (step S41 in FIG. 9). When the host control device 103 determines that the operation of each electronic component mounting machine 101 is normal, it turns off the line light irradiation device 102. Accordingly, the worker can determine that the operation of each of the electronic component mounting machines 101 is normal since the line light irradiation device 102 does not emit light even when the worker is away from the production line 100 in the factory building.

  On the other hand, in step S41, when the host control device 103 determines that the operation of the electronic component mounting machine 101 is abnormal, it determines whether or not one of the electronic component mounting machines 101 has an abnormal operation (FIG. Nine steps S42). When the host control device 103 determines that there are a plurality of electronic component mounting machines 101 having an abnormal operation, the electronic component mounting machines 101 having an abnormal operation in the plurality of electronic component mounting machines 101 have an error. It is determined whether or not there is (step S43 in FIG. 9). When the host control device 103 determines that the plurality of electronic component mounting machines 101 include the electronic component mounting machine 101 in which the operation abnormality is in the error state, whether the plurality of electronic component mounting machines 101 is in the error state is determined. Is determined (step S44 in FIG. 9).

  When the host control device 103 determines that there are a plurality of electronic component mounting machines 101 in the error state, the host control device 103 refers to the priority order table and has the highest priority among the plurality of electronic component mounting machines 101. The line 101 is irradiated with red light by the line light irradiation device 102 (step S45 in FIG. 9). Then, the host control device 103 stops the operation of the mounting head 45 of the electronic component mounting machine 101 that has irradiated the red light (Step S46 in FIG. 9). Accordingly, the worker can visually recognize the red light even when the worker is away from the production line 100 in the factory building, and can determine that the operation of the electronic component mounting machine 101 illuminated with the red light is in an error state. As described above, it is possible to immediately start repairing the operation abnormality in the error state.

  The host control device 103 determines whether the operation abnormality has stopped the operation of the mounting heads 45 of all the electronic component mounting machines 101 in the error state (step S47 in FIG. 9), and stops the operation of the mounting head 45. If it is determined that the electronic component mounting machine 101 that has not been left remains, the process returns to step S45 and the above-described processing is repeated. On the other hand, when the host control device 103 determines that there is no remaining electronic component placement machine 101 in which the operation of the placement head 45 has not been stopped, the operation abnormality is returned to the plurality of electronic component placement machines 101 in the error state. On the other hand, the operation of sequentially irradiating red light with the line light irradiation device 102 is repeated (step S48 in FIG. 9). Thereby, the worker can visually recognize the position of the electronic component mounting machine 101 where the mounting head 45 has stopped operating.

  On the other hand, in step S44, when the host control device 103 determines that the number of the electronic component mounting machine 101 in the error state is one, the line light irradiation device 102 emits red light to the electronic component mounting machine 101. Irradiation is performed (step S49 in FIG. 9), and the operation of the mounting head 45 of the electronic component mounting machine 101 is stopped (step S50 in FIG. 9). Accordingly, the worker can visually recognize the red light even when the worker is away from the production line 100 in the factory building, and can determine that the operation of the electronic component mounting machine 101 illuminated with the red light is in an error state. As described above, it is possible to immediately start repairing the operation abnormality in the error state.

  On the other hand, if the host control device 103 determines in step S43 that none of the plurality of electronic component mounting machines 101 has an error indicating that the operation abnormality is in an error state, the electronic component mounting machine 101 in a warning state is not detected. It is determined whether there are a plurality of devices (step S51 in FIG. 9). When the host control device 103 determines that there are a plurality of electronic component placement machines 101 in the warning state, the host control device 103 refers to the priority order table and selects the highest priority electronic component placement machine among the plurality of electronic component placement machines 101. The line 101 is irradiated with yellow light by the line light irradiation device 102 (step S52 in FIG. 9). Accordingly, the worker can visually recognize the yellow light even when the worker is away from the production line 100 in the factory building, and can determine that the operation of the electronic component mounting machine 101 illuminated with the yellow light is in a warning state. As described above, it is possible to immediately start repairing the operation abnormality in the warning state.

  Then, the host control device 103 determines whether or not all the electronic component placement machines 101 in which the operation abnormality is in the warning state have been repaired (step S53 in FIG. 9), and the unrepaired electronic component placement machines 101 remain. If it is determined that there is, the process returns to step S52 and the above-described processing is repeated. On the other hand, when the host control device 103 determines that there is no remaining unrepaired electronic component mounting machine 101, it turns off the line light irradiation device 102 (step S54 in FIG. 9), returns to step S41, and returns to step S41. Is repeated.

  On the other hand, in step S51, when the host control device 103 determines that the number of the electronic component mounting machines 101 in the warning state is one, the host control device 103 emits yellow light to the electronic component mounting machines 101 using the line light irradiation device 102. Irradiation is performed (step S55 in FIG. 9). Accordingly, the worker can visually recognize the yellow light even when the worker is away from the production line 100 in the factory building, and can determine that the operation of the electronic component mounting machine 101 illuminated with the yellow light is in a warning state. As described above, it is possible to immediately start repairing the operation abnormality in the warning state. Then, the host control device 103 determines whether or not the electronic component mounting machine 101 has been repaired (step S56 in FIG. 9). If it is determined that the electronic component mounting machine 101 has been repaired, the line light irradiation is performed. The device 102 is turned off (step S57 in FIG. 9), and the process returns to step S41 to repeat the above processing.

  On the other hand, in step S42, when the host control device 103 determines that the number of the electronic component mounting machines 101 in which the operation is abnormal is one, the host control device 103 determines whether or not the generated operation abnormality is in a warning state (see FIG. 10). Step S58). When the host control device 103 determines that the generated operation abnormality is in a warning state, the line light irradiation device 102 irradiates the electronic component mounting machine 101 with yellow light (step S59 in FIG. 10). Then, the host control device 103 determines whether or not the operation abnormality in the warning state has been repaired (step S60 in FIG. 10), and when it is determined that the operation abnormality in the warning state has been repaired, the line light irradiation device 102 Is turned off (step S61 in FIG. 10), and the process returns to step S41 to repeat the above processing.

  On the other hand, when the host control device 103 determines in step S58 that the generated operation abnormality is not in the warning state, it determines that the generated operation abnormality is in the error state (step S62 in FIG. 10), and The mounting machine 101 is irradiated with red light by the line light irradiation device 102 (step S63 in FIG. 10). At this time, the operation of the mounting head 45 is stopped (FIG. 5) because a defective board is generated as described above. Step S64), all the processing ends.

  In another embodiment of the above-described production line 100, a plurality of (9) electronic component mounting machines 101 can be irradiated one by one with one line light irradiation device 102, but two or more grouped The electronic component mounting machine 101 may be configured to be capable of irradiating each group. Further, a configuration may be adopted in which a plurality of line light irradiation devices 102 having the turning mechanism 104 are provided.

<4. Effects of Embodiment>
The electronic component mounting machine 1 of the present embodiment collects the electronic component Ep supplied to the component supply position Pp, transfers the collected electronic component Ep to the board K transported to the board transport position Pk, and transfers the transferred electronic component. Ep is mounted on the substrate K. Then, imaging devices 5 and 7 for imaging the electronic component Ep or the substrate K, and a light irradiating device 6 that can irradiate the electronic component Ep or the substrate K with light when the imaging devices 5 and 7 image the electronic component Ep or the substrate K. , 8 and a control device 9 for controlling the mounting operation of the electronic component Ep on the substrate K based on the imaging results of the imaging devices 5 and 7. Then, the control device 9 causes the light irradiation devices 6 and 8 to generate light according to the operation status of the electronic component mounting machine 1 except when the imaging devices 5 and 7 image the electronic component Ep or the substrate K.

  According to this, since the changes of the irradiation light Le and Lm are performed except when the electronic component Ep or the substrate K is imaged, it does not hinder the image recognition of the electronic component Ep or the substrate K. Since the changes of the irradiation light Le and Lm are performed by the originally provided first light irradiation device 6 and second light irradiation device 8, it is possible to recognize the operation status when the electronic component Ep is mounted on the electronic component mounting machine 1. It becomes possible at low cost.

  Further, the control device 9 changes the colors of the irradiation lights Le and Lm in accordance with the operation status of the electronic component mounting machine 1 and blinks the irradiation lights Le and Lm in accordance with the operation status of the electronic component mounting machine 1. In addition, the operator can easily visually recognize the operation status when mounting the electronic component Ep on the electronic component mounting machine 1, and can quickly respond to an abnormal operation.

  The production line 100 including the plurality of electronic component mounting machines 101 of the present embodiment is provided in a number smaller than the number of the electronic component mounting machines 101 forming the production line 100, and On the other hand, a line light irradiating device 102 for irradiating light according to the operation status of the electronic component mounting machine 101 is provided. According to this, since it is not necessary to provide a light irradiation device for each electronic component mounting machine 101, it is possible to recognize the operation status when mounting the electronic component Ep in the electronic component mounting machine 101 at low cost.

  Further, the plurality of electronic component mounting machines 101 constituting the production line 100 are grouped into at least two or more electronic component mounting machines 101 as one group, and the line light irradiation device 102 is provided so as to be capable of light irradiation for each group. Then, light is generated according to the operating status of a predetermined electronic component mounting machine among the electronic component mounting machines 101 forming the group. Accordingly, the number of the installed line light irradiation devices 102 can be reduced.

  Further, the line light irradiation device 102 is provided so as to be capable of changing the light irradiation direction to each of the plurality of electronic component mounting machines 101 constituting the production line 100 so that light can be irradiated. Generates the corresponding light. This can further reduce the number of line light irradiation devices 102 to be installed.

  Also, the line light irradiation device 102 changes the color of the irradiation light L according to the operation status of the electronic component mounting machine 101, and blinks the irradiation light L according to the operation status of the electronic component mounting machine 101, The operator can easily visually recognize the operation status when mounting the electronic component Ep on the electronic component mounting machine 101, and can quickly respond to an abnormal operation.

  1, 101: electronic component mounting machine 2: substrate transport device 3: tape feeder 4: component transfer device 5: component imaging device 6: first light irradiation device 7: substrate imaging device 8: second light irradiation device 9: control Apparatus 46: Suction nozzle 100: Production line 102: Light irradiation device for line 103: Host control device K: Substrate Ep: Electronic component Le, Lm, L: Irradiation light

Claims (8)

An electronic component mounting machine that collects electronic components supplied to a component supply position, transfers the collected electronic components to a substrate that is transported to a substrate transport position, and mounts the transferred electronic components on the substrate,
An imaging device for imaging the electronic components,
A light irradiation device capable of light irradiation for the electronic components during the imaging of the electronic component by the imaging device,
A control device that controls an operation of mounting the electronic component on the board based on an imaging result of the imaging device,
With
The control device includes:
At the time of imaging the electronic component by the imaging device, the light irradiation device is changed to a color corresponding to the electronic component of the imaging target to emit light,
In addition the time of imaging of the electronic component by the imaging device, the generating the light according to the operation state of the electronic component mounting apparatus by the light irradiation device, an electronic component mounting apparatus.   The electronic component mounting machine according to claim 1, wherein the control device changes the color of the light according to an operation state of the electronic component mounting machine.   The electronic component mounting machine according to claim 1, wherein the control device causes the light to blink according to an operation state of the electronic component mounting machine. A production device that collects electronic components supplied to a component supply position, transfers the collected electronic components to a substrate that is transported to a substrate transport position, and includes a plurality of electronic component mounting machines that mount the transported electronic components on the substrate. Line
A line that is provided in a number smaller than the number of the electronic component placement machines constituting the production line and irradiates the electronic component placement machines constituting the production line with light according to the operation status of the electronic component placement machine. Production line, comprising a light irradiating device. The plurality of electronic component placement machines constituting the production line are grouped into at least two or more of the electronic component placement machines as one group,
The line light irradiating device is provided so as to be capable of irradiating light for each of the groups, and generates light according to an operation state of a predetermined electronic component mounting machine among the electronic component mounting machines constituting the group. Item 5. The production line according to Item 4.   The line light irradiating device is provided so as to be able to irradiate light by changing a light irradiating direction to each of the plurality of electronic component mounting machines constituting the production line, and according to an operation state of the electronic component mounting machine. The production line according to claim 4, which generates light.   The production line according to any one of claims 4 to 6, wherein the line light irradiation device changes the color of the light according to an operation state of the electronic component mounting machine.   The production line according to any one of claims 4 to 6, wherein the line light irradiation device blinks the light in accordance with an operation state of the electronic component mounting machine.

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