JP6628689B2 - Sheet sticking apparatus and sticking method - Google Patents

Description

  The present invention relates to a sheet sticking apparatus and a sheet sticking method.

  2. Description of the Related Art Conventionally, a dust removing device that removes dust such as dust, dirt, and dirt from an adherend surface of an adherend before attaching an adhesive sheet to the adherend is known (for example, see Patent Document 1). .

JP 2009-140982 A

  However, the conventional device described in Patent Literature 1 is provided at a position different from the sheet sticking device, and thus has a disadvantage of increasing the size of the equipment.

  An object of the present invention is to provide a sheet sticking apparatus and a sheet sticking method which can prevent an increase in size of equipment.

  In order to achieve the above object, the sheet sticking apparatus of the present invention includes a feeding unit that feeds a raw material having an adhesive sheet temporarily adhered to one surface of a strip-shaped release sheet, and a sheet feeding device that feeds the raw material fed by the feeding unit. A peeling unit that peels off the adhesive sheet from the release sheet, and a pressing unit that presses and adheres the adhesive sheet peeled off by the peeling unit to an adherend, wherein the adhesive sheet is peeled off by the peeling sheet It is characterized by including dust removing means for removing dust from the adherend surface of the adherend.

At this time, in the sheet sticking apparatus of the present invention, it is preferable that the dust removing means includes a contact / separation means for separating and approaching the peeling sheet from which the adhesive sheet has been peeled to the adhered surface. .
Further, the sheet sticking apparatus of the present invention preferably includes an adhesion medium applying means for applying an adhesion medium for promoting adhesion of dust to the release sheet to the release sheet.
Further, in the sheet sticking apparatus of the present invention, it is preferable that the dust removing unit includes a dust collecting unit that removes dust attached to the release sheet from the release sheet.

  On the other hand, the sheet sticking method of the present invention includes a feeding step of feeding an original sheet on which an adhesive sheet is temporarily attached to one surface of a strip-shaped release sheet, and a step of feeding the adhesive sheet from the peeling sheet in the original sheet fed in the feeding step. And a pressing step of pressing the adhesive sheet peeled off in the peeling step on an adherend by applying the pressure-sensitive adhesive sheet to the adherend, wherein the adhesive sheet is peeled off and the adhesive sheet is peeled off. It is characterized by having a dust removing step of removing dust from the attachment surface.

  According to the present invention as described above, dust is removed from the adherend surface of the adherend by the peeling sheet from which the adhesive sheet has been peeled off, so that it is not necessary to provide a dust removing device at another position of the sheet sticking device, Can be prevented from increasing in size.

At this time, if the contacting / separating means is provided, the release sheet can be brought close to the adherend surface to reliably remove dust.
In addition, if an attachment medium applying unit is provided, dust can be efficiently attached to the release sheet and removed.
Furthermore, if the dust collecting means is provided, it is possible to prevent the dust adhering to the release sheet from being separated from the release sheet and floating or diffusing, thereby contaminating the atmosphere.

The side view of the sheet sticking apparatus concerning one embodiment of the present invention. (A)-(C) is operation | movement explanatory drawing of the sheet sticking apparatus of FIG. (A), (B) is a partial side view which shows the modification of a sheet sticking apparatus.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In this embodiment, the X axis, the Y axis, and the Z axis are orthogonal to each other, the X axis and the Y axis are axes within a predetermined plane, and the Z axis is an axis orthogonal to the predetermined plane. I do. Further, in the present embodiment, based on the case of viewing from the near side in FIG. 1 parallel to the Y axis, when the direction is indicated, “up” is the arrow direction of the Z axis, “down” is the opposite direction, The left is the direction of the arrow on the X axis, the right is the opposite direction, the front is the front direction in FIG. 1 parallel to the Y axis, and the rear is the opposite direction.

  In FIG. 1, a sheet sticking apparatus 10 includes a feeding unit 20 that feeds a raw RS having an adhesive sheet AS temporarily attached to one surface of a strip-shaped release sheet RL, and a peeling of the raw RS fed by the feeding unit 20. A peeling plate 30 as peeling means for peeling the adhesive sheet AS from the sheet RL, and the adhesive sheet AS peeled off by the peeling plate 30 are pressed against a semiconductor wafer (hereinafter, also simply referred to as “wafer”) WF as an adherend. A pressing roller 40 as pressing means for attaching and detaching, a dust removing means 50 for removing dust DU (see FIG. 2) from the adhered surface WF1 of the wafer WF by the peeling sheet RL from which the adhesive sheet AS has been peeled, and a peeling sheet RL. A transfer medium for supporting and transporting the wafer WF, comprising: an adhesion medium applying unit 60 that applies an adhesion medium that promotes adhesion of dust DU to the release sheet RL. It is disposed above the 70. Note that, in the case of the present embodiment, one surface of the release sheet RL to which the adhesive sheet AS is temporarily attached is the dust removal surface RL1.

  The feeding means 20 is driven by a support roller 21 for supporting the raw material RS, a guide roller 22 for guiding the raw material RS, and a rotating motor 23A as a driving device. The apparatus includes a driving roller 23 to be sandwiched, and a recovery roller 25 driven by a driving device (not shown) to apply a predetermined tension to the release sheet RL and recover the release sheet RL.

  The dust removing unit 50 is a contacting / separating unit that separates and separates the peeling plate 30 and the peeling sheet RL from which the adhesive sheet AS has been peeled off to the adhered surface WF1, and a driving device that supports the peeling plate 30 with its output shaft 51A. And a rotating motor 51 as a motor.

  The adhesion medium applying means 60 is provided at the distal end portion 30A of the release plate 30, and applies a charge as an adhesion medium to the release sheet RL to attract the dust DU with Coulomb force. And a potential measuring device 63 for measuring the potential of the dust DU.

  The transfer means 70 includes a support table 72 which is supported by a slider 71A of a linear motor 71 as a driving device and has a support surface 72A which can support the wafer WF by a not-shown depressurizing means such as a decompression pump or a vacuum ejector.

The operation of the above-described sheet sticking apparatus 10 will be described.
First, after the operator sets the raw sheet RS as shown in FIG. 1 on the sheet sticking apparatus 10 in which each member is arranged at the initial position indicated by the solid line in FIG. 1, the operation panel, the personal computer and the like are not shown. A signal for starting automatic operation is input via the operation means. Then, the feeding means 20 drives the rotating motor 23A to feed the raw material RS, and the leading end of the leading adhesive sheet AS is a predetermined length from the peeling sheet RL at the leading end 30A of the peeling plate 30, as shown in FIG. When the peeling is detected by an imaging unit such as a camera or a detecting unit (not shown) such as an optical sensor, the driving of the rotation motor 23A is stopped, and a standby state is set.

  Then, when the wafer WF is placed on the support surface 72A by a transfer means (not shown) such as a human or an articulated robot or a belt conveyor, the transfer means 70 drives the pressure reducing means (not shown) to suck and hold the wafer WF. Then, the linear motor 71 is driven to move the support table 72 to the left. At this time, when the wafer WF passes below the charge measuring device 62 and the potential measuring device 63, as shown in FIG. 2A, the charge measuring device 62 and the potential measuring device 63 are placed on the adhered surface WF1 of the wafer WF. The charge and potential of the attached dust DU are measured. Next, when it is detected that the left end of the wafer WF has reached the predetermined position by an imaging unit such as a camera or a detection unit (not shown) such as an optical sensor, the feeding unit 20 drives the rotating motor 23A, and the wafer WF is driven. Of the adhesive sheet AS and the feed speed of the adhesive sheet AS to the left are the same.

  Then, as shown in FIG. 2 (B), when the left end of the adhesive sheet AS is pressed and adhered to the left end of the wafer WF by the pressing roller 40, the dust removing means 50 drives the rotating motor 51, The distal end portion 30A of the release plate 30 is lowered, and the release sheet RL from which the adhesive sheet AS has been released is brought into contact with the adherend surface WF1 with a predetermined pressing force, as shown by the two-dot chain line in FIG. At this time, the adhesion medium applying means 60 drives the charge applying device 61, and based on the measurement result of the charge measuring device 62, the release sheet RL so that the dust removal surface RL1 has the opposite polarity to the charge of the dust DU. Charge. For example, when the charge measuring device 62 measures that the dust DU has a positive charge, the charge applying device 61 applies the charge to the release sheet RL so that the dust removing surface RL1 has a negative charge. When it is measured by the charge measuring device 62 that the dust DU has a negative charge, the charge applying device 61 applies the charge to the release sheet RL so that the dust removing surface RL1 has a positive charge. Note that the potential applied by the charge applying device 61 may be the same potential with the opposite polarity based on the measurement result of the potential measuring device 63. Thus, the dust DU is attracted to the dust removing surface RL1 by the Coulomb force, and is easily removed from the adhered surface WF1.

  If the movement of the support table 72 to the left continues thereafter, as shown in FIG. 2 (C), the dust DU that has adhered to the adherend surface WF1 adheres to the release sheet RL and is released. The adhesive sheet AS is pressed by the pressing roller 40 onto the adhered surface WF1 from which the dust DU has been removed and which has been wound up in the direction of the collecting roller 25 together with the sheet RL. Next, the entirety of the adhesive sheet AS is attached to the adhered surface WF1, and it is detected by a detection unit (not shown) that the leading end of the next adhesive sheet AS has been peeled off from the peeling sheet RL at the leading end 30A of the peeling plate 30 by a predetermined length. Then, the feeding means 20 stops the driving of the rotating motor 23A and returns to the standby state. Further, when it is detected by the imaging unit such as a camera or the detection unit (not shown) such as an optical sensor that the wafer WF to which the entire adhesive sheet AS is stuck reaches the predetermined position to the left of the pressing roller 40, the conveyance unit 70 is turned on. The driving of the linear motor 71 and the pressure reducing means (not shown) is stopped. Then, after the transport means (not shown) transports the wafer WF on which the adhesive sheet AS is stuck to the next step, each means drives each driving device to return each member to the initial position. The operation is repeated.

  According to the above-described embodiment, since the dust DU is removed from the adhered surface WF1 of the wafer WF by the release sheet RL from which the adhesive sheet AS has been released, a dust removal device is separately provided at another position of the sheet attaching device 10. It is not necessary, and it is possible to prevent the equipment from becoming large.

  The means and steps in the present invention are not limited in any way as long as they can perform the operations, functions, or steps described for the means and steps, much less the constituents of only one embodiment shown in the above embodiment and There is no limitation to the process at all. For example, as long as the feeding means is capable of feeding an original sheet having an adhesive sheet temporarily attached to one surface of a strip-shaped release sheet, it is in light of the common general technical knowledge at the time of filing of the application and is within the technical range thereof. If it is, it is not limited at all (other means and steps are the same, and the description is omitted).

  The feed-out means 20 may feed out an original sheet whose inside is an adhesive sheet AS by forming a plurality of closed loop-shaped cuts in a strip-shaped adhesive sheet base material temporarily attached to the release sheet RL. When an original sheet in which a strip-shaped adhesive sheet base material is temporarily attached to the release sheet RL is employed, the adhesive sheet base material may be cut into a predetermined shape by a cutting unit, and the inside may be used as the adhesive sheet AS. When peeling off the adhesive sheet AS from the release sheet RL, the torque of the rotation motor 23A may be controlled so that a predetermined tension is applied to the raw sheet RS, or each of the support rollers 21 and the guide rollers 22 may be controlled. Instead of the rollers, the sheet RS or the release sheet RL may be supported or guided by a plate-like member or a shaft member, or the raw sheet RS may not be sandwiched between the driving roller 23 and the pinch roller 24 without being pinched. S may be configured to provide a repetitive output, may be supported by winding the raw sheet RS without being wound, for example, by fanfold folding, or may be formed by, for example, fanfold folding without winding the release sheet RL, It may be collected by shredding with a shredder or the like.

  The pressing unit may be provided with a driving device as a pressing unit contacting / separating unit that separates and approaches the pressing roller 40 to / from the wafer WF to prevent the wafer WF from being stressed or damaged. As the pressing means contacting / separating means, a means for manually moving the pressing roller 40 other than the driving device may be used.

As shown by a two-dot chain line in FIG. 1, the dust removing unit 50 is configured to transfer the dust adhered to the release sheet RL by a transfer unit such as an adhesive roller or another adhesive sheet, or a decompression unit such as a decompression pump or a vacuum ejector. A dust collection unit 52 for removing DU from the release sheet RL may be provided.
As shown in FIG. 3 (A), the contacting / separating means employs a roller 53 rotatably supported by a bracket 53C supported by an output shaft 53B of a linear motor 53A as a driving device. The release sheet RL may be separated and approached to the adherend surface WF1, or a shaft member may be employed in place of such a roller 53. As shown in FIG. A gas blowing means 54 such as a pressure pump or a turbine that blows a gas such as air or gas into the ventilation port 30B formed in the opening may be used to separate the separation sheet RL from the adherend surface WF1 with the blown gas. Then, for example, in a device as shown in FIGS. 3A and 3B, a position where the peeling sheet RL is separated and approached from the position where the adhesive sheet AS is peeled to the adherend surface WF1 by the roller 53 or gas. In between The release sheet RL may be twisted by a half turn, and the other surface of the release sheet RL opposite to the surface on which the adhesive sheet AS is temporarily attached may be used as a dust removal surface. A driving device may be provided at the distal end portion 30A, and only the distal end portion 30A of the peeling plate 30 may be separated and approached to the adherend surface WF1 without moving the entire peeling plate 30. The predetermined pressing force to be brought into contact with the surface WF1 is, for example, such that the wafer WF is not damaged, the adherence surface WF1 is not damaged, and the characteristics, characteristics, and properties of at least one of the wafer WF and the release sheet RL. The operator may arbitrarily determine the material, the composition, the configuration, the shape, the size and the weight, the condition of the atmosphere, the other factors, and the like, or the release sheet RL may come into contact with the adherend surface WF1. The contacting / separating means may not be provided. If there is no such contacting / separating means, the dust removing surface RL1 is set in advance so as to contact the adhered surface WF1. The dust DU is set in advance so that there is a small gap smaller than the size of the dust DU to be removed between the dust removing surface RL1 and the adhered surface WF1, or the dust DU is levitated by the force of the attached medium. Is set in advance so that there is a gap between the dust removing surface RL1 and the adherend surface WF1 within a range where the peeling sheet RL and the wafer WF can be moved relative to each other by moving the release sheet RL and the wafer WF relative to each other. May be configured to be removed.

The adhering medium applying means 60 is provided with a dust charge applying device for imparting a positive or negative charge to the dust DU. Even if the dust DU is charged or not, the positive or negative charge is applied to the dust DU. And the charge applying device 61 is configured to apply an electric charge to the release sheet RL such that the dust removing surface RL1 has the opposite polarity to the charge of the dust DU, as in the above-described embodiment. Regardless of whether the RL1 is charged or not, the dust is applied so that a positive charge or a negative charge is applied to the dust removing surface RL1 and the polarity of the dust charge applying device is opposite to that of the dust removing surface RL1. The DU may be configured to apply a charge, and the order of applying the charge may be either the dust DU or the dust removal surface RL1 first or simultaneously. Further, at least one of the charge measuring device 62 and the potential measuring device 63 may be omitted, or they may be integrally formed.
The adhesion medium applying means 60 may be a charge applying device 61 or a dust applying device such as a corona discharge type such as a voltage applying type or a self-discharge type, or an ionizing radiation type such as an X-ray type, an α-ray type, or an ultraviolet type. Any number may be used, and the charge of the dust removing surface RL1 may be measured using the charge number 61 shown in the above embodiment as a charge measuring device, and the charge number 62 may be attached to the adherend surface WF1 as a dust charge applying device. The dust DU may be configured to apply a charge to the dust DU such that the polarity of the dust DU is opposite to the charge of the dust removal surface RL1. The electric potential applied to the dust DU may be the same electric potential having a polarity opposite to the electric potential measured by the electric potential measuring device 63, or may be a different electric potential having the opposite polarity. Outside The charge applying device 61 may be provided both inside and outside the release plate 30. For example, when the release sheet RL is made of a permeable member such as paper or porous material, Dust suction means for sucking and attaching the dust DU to the separation sheet RL via the sheet RL may be provided on the separation plate 30 or the like. In this case, the adhesion medium is air to be sucked.
The adhesion medium applied by the adhesion medium applying means 60 may be an adhesive, a pressure-sensitive adhesive, a solvent, moisture, an oil, a liquid, or the like. The dust DU may be removed by rubbing the adhered surface WF1 as described above, or an adhesive, a pressure-sensitive adhesive, a solvent, moisture, an oil component, a liquid, or the like may be applied or laminated on the dust removal surface RL1, When the dust DU is stained or colored, the dust DU can be efficiently removed by using a solvent, moisture, oil, or a liquid as the adhesion medium, and countless small holes and irregularities are formed on the release sheet RL as the adhesion medium. By forming or roughening the dust removal surface RL1, the dust DU is caused to enter the concave portion or the rough surface of the hole or the unevenness, or the dust DU is hooked on the convex portion or the rough surface to thereby form the dust DU. To remove Good.

  The transfer unit 70 may move the sheet sticking device 10 to stick the adhesive sheet AS to the wafer WF without moving the wafer WF or while moving the wafer WF, or when the wafer WF is moved by another device. May not be required.

  The sheet sticking apparatus 10 may be arranged upside down or sideways to stick the adhesive sheet AS on the lower surface or side surface of the wafer WF, or the peeling sheet RL may move or peel off. If the dust DU can be adhered to the dust removing surface RL1 and removed by a charge that is naturally charged by the peeling of the adhesive sheet AS from the sheet RL or moisture that adheres to the peeling sheet RL or the dust DU, an adhesion medium applying unit If the dust removing surface RL1 is not in contact with the adhered surface WF1, or if the dust removing surface RL1 is in contact with the adhered surface WF1, A small gap less than or equal to the size of the dust DU to be removed is left, and the release sheet RL and the wafer WF are relatively moved to scrape (push out) the dust DU from the adherend surface WF1. Or the adhesive sheet AS or the residual adhesive remaining on the dust removing surface RL1 after the unnecessary sheet US located on the outer periphery of the adhesive sheet AS is peeled off, and the dust DU is transferred to the dust removing surface RL1. The unnecessary sheet US may be removed from the release sheet RL before being supported by the support roller 21 (before being formed into a roll), As shown by a two-dot chain line in FIG. 1, a winding roller 26 driven by a rotation motor 26A as a driving device may be provided, and may be wound back at the position of the guide roller 22.

  The material, type, shape, and the like of the adhesive sheet AS and the adherend in the present invention are not particularly limited. For example, the adhesive sheet AS may have a circular shape, an elliptical shape, a polygonal shape such as a triangle or a quadrangle, or other shapes, or may have an adhesive form such as pressure-sensitive adhesiveness or heat-sensitive adhesiveness. When the heat-sensitive adhesive sheet AS is employed, it may be bonded by an appropriate method such as providing a suitable coil heater for heating the adhesive sheet AS or a heating means such as a heating side of a heat pipe. Further, such an adhesive sheet AS is, for example, a single-layer adhesive layer only, an adhesive layer composed of a base sheet and an adhesive layer, and an intermediate layer between the base sheet and the adhesive layer. It may have one layer or two or more layers, such as one having an intermediate layer between adhesive layers. Examples of the adherend include foods, resin containers, semiconductor wafers such as silicon semiconductor wafers and compound semiconductor wafers, circuit boards, information recording substrates such as optical discs, glass plates, steel plates, pottery, wood plates, resin plates, and the like. Any form of member or article can be targeted. It should be noted that the adhesive sheet AS may be replaced with a functional or application-specific reading method. For example, any information label such as an information label, a decoration label, a protective sheet, a dicing tape, a die attach film, a die bonding tape, and a recording layer forming resin sheet may be used. An arbitrary sheet, film, tape, or the like having a shape can be attached to an arbitrary adherend as described above.

The drive device in the above embodiment employs electric devices such as a rotary motor, a linear motion motor, a linear motor, a single-axis robot, and an articulated robot, and actuators such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition, it is also possible to employ a combination of those directly or indirectly (some overlap with those exemplified in the embodiment).
In the above-described embodiment, when rollers are employed, a driving device for rotating each roller may be provided, or the surface of each roller may be formed of an elastically deformable member such as rubber or resin. However, each roller may be configured by a member that does not elastically deform, or when a pressing unit or a pressing member such as a pressing roller or a pressing head is employed, the roller may be used instead of or in combination with the above examples. , A pressing member such as a round bar, a blade material, rubber, a resin, a sponge, or the like, or a configuration in which the pressing is performed by blowing air such as air or gas, or a pressing member or a pressing member. The portion may be made of an elastically deformable member such as rubber or resin, or may be made of a member that is not elastically deformed, or if a peeling means or a peeling member is adopted, a plate-like member, Consists of round bars, rollers, etc. When a member that supports or holds a supported member such as a supporting (holding) member or a supporting (holding) member is employed, a holding unit such as a mechanical chuck or a chuck cylinder, Coulomb force, an adhesive, A configuration in which the supported member is supported (held) by an adhesive, magnetic force, Bernoulli suction, a driving device, or the like may be employed, or when a cutting means or a cutting blade is employed, instead of the above-described examples. Or in combination, use a cutting member such as a cutter blade, laser cutter, ion beam, thermal power, heat, water pressure, heating wire, spraying gas or liquid, etc., or a cutting member with a combination of appropriate driving equipment May be moved to be cut.

DESCRIPTION OF SYMBOLS 10 ... Sheet sticking apparatus 20 ... Feeding means 30 ... Peeling means 40 ... Pressing means 50 ... Dust removing means 51 ... Rotation motor (contact / separation means)
52: Dust collecting means 60: Adhering medium applying means AS: Adhesive sheet DU: Dust RL: Peeling sheet RS: Raw material WF: Wafer (substrate)
WF1 ... Deposited surface

Claims (5)

A feeding unit that feeds out an original sheet on which an adhesive sheet is temporarily attached to one surface of a strip-shaped release sheet,
Peeling means for peeling the adhesive sheet from the peeling sheet in the raw material fed by the feeding means,
Pressing means for pressing the adhesive sheet peeled by the peeling means to the adherend and sticking,
A sheet sticking apparatus, comprising: a dust removing unit that removes dust from an adherend surface of the adherend with a peeling sheet from which the adhesive sheet has been peeled off.   2. The sheet sticking apparatus according to claim 1, wherein the dust removing unit includes a contact / separation unit configured to separate and approach the separation sheet from which the adhesive sheet has been separated to the adherend surface. 3.   The sheet sticking apparatus according to claim 1, further comprising an adhesion medium applying unit configured to apply an adhesion medium that promotes adhesion of dust to the release sheet to the release sheet.   4. The sheet sticking apparatus according to claim 1, wherein the dust removing unit includes a dust collecting unit that removes dust attached to the release sheet from the release sheet. 5. A feeding step of feeding an original sheet on which an adhesive sheet is temporarily attached to one surface of a strip-shaped release sheet,
A peeling step of peeling the adhesive sheet from a peel sheet in the raw material fed in the feeding step,
A pressing step of pressing the adhesive sheet peeled in the peeling step to an adherend and applying the pressure-sensitive adhesive sheet,
A method for attaching a sheet, comprising a dust removing step of removing dust from an adherend surface of the adherend with a release sheet from which the adhesive sheet has been peeled off.

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