JP6626722B2 - Processing equipment - Google Patents

Description

  The present invention relates to a processing apparatus, and more particularly, to a processing apparatus that three-dimensionally cuts a workpiece by a processing tool based on cutting data by numerical control using a microcomputer or the like.

  Conventionally, based on cutting data, numerical control by a microcomputer, etc., the workpiece is cut in three dimensions by a processing tool such as an end mill with a cutting edge at the tip of the shank, and the desired shape is three-dimensionally formed. Processing apparatuses for manufacturing objects are known.

  In such a processing apparatus, a spindle on which a shank of a processing tool is attached, and a table on which a workpiece is mounted are moved in an X-axis direction, a Y-axis direction, or a Z-axis direction in an XYZ rectangular coordinate system. Thus, the relative positional relationship between the cutting edge of the processing tool and the workpiece placed on the table is changed in three dimensions.

Then, based on the cutting data, in a state where the processing tool is rotated on the main spindle, the main spindle and the table are moved while the cutting edge of the processing tool is in contact with the processing target, so that the processing edge of the processing tool is changed. Is cut into a desired shape to produce a three-dimensional structure.

  By the way, such a processing apparatus is also used when a microchannel is produced by using a resin material such as a transparent acrylic plate as a workpiece and cutting the resin material.

  When a micro flow path is manufactured using a resin material such as a transparent acrylic plate, a micro flow path is formed by cutting a shallow groove in the resin material using a cutting edge of a processing tool.

  However, when a shallow groove is cut in a resin material by the cutting edge of a processing tool, the cut surface becomes cloudy, which hinders visual confirmation of a substance passing through a micro flow path. Had become.

For this reason, conventionally, an operator manually polished the clouded cut surface using a cotton swab impregnated with an abrasive in order to make the clouded cut surface transparent.

As described above, according to the conventional technology, a process for making a clouded cut surface transparent is performed manually by an operator, and therefore, an enormous amount of work is required depending on the total area of the clouded microchannel. There is a problem in that the time is imposed on the worker, which increases the burden on the worker and increases the labor cost of the worker.

  Since the prior art that the applicant of the present application knows at the time of filing a patent application is not an invention relating to a known invention, there is no prior art document information to be described in the present specification.

  The present invention has been made in view of the above-described various problems of the related art, and aims at eliminating polishing work of a clouded cut processing surface by a manual operation of an operator. Another object of the present invention is to provide a processing apparatus that reduces the burden on the worker and suppresses the cost increase accompanying the increase in the labor cost of the worker.

  In order to achieve the above object, a processing apparatus according to the present invention is configured such that a processing tool for cutting is held on a main shaft that moves in a three-dimensional direction relative to a workpiece and rotates around an axis. In a processing apparatus for cutting a workpiece based on cutting data including path data to produce a three-dimensional modeled object having a desired shape, a polishing unit capable of impregnating an abrasive in place of a cutting edge is provided. A polishing tool that can be held by the spindle, a storage unit that stores the moving speed and rotation speed of the spindle that holds the polishing tool and the tool path data, and a moving speed that is stored by the storage unit. The main spindle holding the grinding tool is moved in accordance with the tool path data, and the grinding tool is held by the number of revolutions stored in the storage means. It is obtained as a control means for rotating the spindle.

  Further, the processing apparatus according to the present invention, in the processing apparatus according to the present invention, further includes an abrasive container storing an abrasive to be impregnated into the polishing section of the processing tool for polishing, and the storage unit includes the polishing means. Storing the position information of the agent container and a continuous polishing distance that allows the main spindle held by the polishing tool to be continuously moved; and the control unit controls the main spindle by which the polishing tool is held. When the moving distance exceeds the continuous polishing distance, the main spindle holding the processing tool for polishing is moved to the abrasive container based on the position information, and the abrasive stored in the abrasive container is moved. The polishing section of the processing tool for polishing is moved inside.

  Since the present invention is configured as described above, there is no need for the operator to manually perform the polishing work on the clouded cutting surface, so that the burden on the worker is reduced and the labor cost of the worker is reduced. This leads to an excellent effect that it is possible to suppress the cost increase due to the increase in.

FIG. 1 is a schematic perspective view illustrating the configuration of a processing apparatus according to the present invention. FIG. 2A is an explanatory view of a polishing tool, which is a swab-like processing tool provided with a polishing portion in which a fiber material for polishing is disposed at the tip of a shank instead of the cutting edge, and FIG. FIG. 2B is a partially broken explanatory view showing a state in which the polishing tool is immersed in a liquid abrasive stored in an abrasive container. FIG. 3 is a flowchart showing a processing routine of the polishing processing. FIG. 4A is a partially broken explanatory view showing a polishing operation in the polishing process, and FIG. 4B is a schematic explanatory view as viewed from an arrow A in FIG. 4A.

Hereinafter, an example of an embodiment of a processing apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a schematic perspective view illustrating the configuration of a processing apparatus according to the present invention.

  The processing apparatus 10 shown in FIG. 1 includes a fixed base member 12, side members 14L and 14R erected perpendicularly to the base member 12 at both left and right ends of the base member 12, and a rear end of the base member 12. And a rear member 16 connecting the two left and right side members 14L and 14R.

  The guide rail 18 is disposed so that both ends thereof are supported by the side members 14L and 14R, respectively, and extended in the X-axis direction in the XYZ orthogonal coordinate system.

  The shaft 20 is supported by the side members 14L and 14R at both ends thereof, and is extended in the X-axis direction so as to be parallel to the guide rail 18.

  A carriage 20 is slidably mounted on the guide rail 18 and the shaft 20, respectively, and is movably supported in the X-axis direction.

The carriage 22 is provided movably in the Z-axis direction, and is provided with a cutting tool such as an end mill, a drill, or a cutting tool having a cutting edge at the tip of the shank. A polishing tool 110 (see FIG. 2 (a)), which is a processing tool provided with a swab-like polishing section 110b in which a fiber material for polishing or the like is disposed, is rotatably held around the Z axis. The main shaft 24 is disposed.

  Here, the grinding tool 110 is different from a conventionally known machining tool for cutting only in that a tip portion of a shank 110a is provided with a swab-like grinding portion 110b instead of a cutting edge. Is the same as a conventionally known machining tool for cutting.

  The diameter d of the polishing section 110b is substantially the same as the diameter of the cutting edge of a conventionally known machining tool for cutting.

1 and 2A show a case where the base end 110aa of the shank 110a of the polishing tool 110 is held on the chuck 24a of the spindle 24, and the polishing tool 110 is held on the spindle 24. I have.

  On the base member 12, a pair of guide rails 26 extending in the Y-axis direction are arranged in parallel.

  The table 28 is slidably disposed on the guide rail 26 and movably supported in the Y-axis direction. The workpiece 100 is placed on the upper surface 28a. The workpiece 100 is, for example, a resin material such as a transparent acrylic plate.

  On the upper surface 28a of the table 28, a tool box 30 for accommodating the above-mentioned machining tool for polishing and the machining tool 110 for polishing is arranged. The tool box 30 accommodates at least one processing tool for cutting and one processing tool for polishing 110.

  In addition, this processing apparatus 10 returns the processing tool for cutting or the polishing tool 110 holding the base end of the shank to the chuck 24a of the main shaft 24 to the tool box 30 so that the chuck 24a of the main shaft 24 While removing the cutting processing tool and the polishing processing tool 110 that were held, the user selected one of the cutting processing tool and the polishing processing tool 110 stored in the tool box 30 and selected the selected one. By holding the base end of the shank of the cutting tool or the polishing tool 110 on the chuck 24a of the spindle 24, the selected machining tool or the polishing tool 110 is held on the spindle 24. It has a function to perform processing automatically.

  Such a function is a conventionally well-known technique using, for example, JP-A-9-314435 and JP-A-2002-345844, and is widely known as an auto tool changer function.

Therefore, a conventionally known technique can be applied to such an auto tool changer function, and a detailed description of its configuration and operation will be omitted.

  An upper surface 120a is opened on the upper surface 28a of the table 28, and an abrasive container 120 in which a liquid abrasive 122 is stored is disposed inside (see FIG. 2B).

  The abrasive container 120 is a box-shaped container having an open upper surface 102a, and has a depth H capable of storing an abrasive having a depth at least capable of immersing the polishing portion 110b of the polishing tool 110.

Note that, as the polishing agent 122, various conventionally known polishing agents can be appropriately selected.

  The workpiece 100, the tool holder 30, and the abrasive container 30 may be fixed to the upper surface 28a of the table 28 using, for example, a double-sided tape.

  In the processing apparatus 10 according to the present embodiment, the tool box 30 is disposed near the side member 14L, and the cutting tool or the polishing tool 110 held on the main shaft 24 is moved from above to the tool box 30. It is configured so that it can be arranged in the box 30.

Further, in the processing apparatus 10 according to the present embodiment, the abrasive container 120 is disposed in the vicinity of the side member 14 </ b> R, and the abrasive part 120 b of the polishing tool 110 held on the main shaft 24 is removed from the abrasive part 120 b from above. It is configured such that it can be immersed in the abrasive 122 through the opening 120 a of the container 120.

  In the processing apparatus 10, information based on the operation of the operator's operation panel 130 is input to the microcomputer 32, and the entire operation is performed by the microcomputer 32 according to the information based on the operator's operation input from the operation panel 130. Controlled.

  From the operation panel 130, in addition to the input of information based on the operation of the worker by a conventionally known technique, the information based on the operation of the worker shown in the following (1) to (7) can be input. .

  (1) A process of polishing the cutting surface 100a (see FIGS. 4A and 4B) of the workpiece 100 by the polishing tool 110 (in this specification, the polishing tool 110 is used). The process of polishing the cut surface 100a of the workpiece 100 by the above is simply referred to as “polishing process” as appropriate.)

  (2) Moving speed of the main shaft 24 holding the polishing processing tool 110 when performing the polishing process

  (3) Number of rotations of the main shaft 24 holding the polishing tool 110 around the Z-axis during the polishing process

  (4) A distance that allows the main spindle 24 holding the polishing tool 110 to perform continuous polishing when performing the polishing process (in the present specification, the polishing tool 110 when performing the polishing process). The distance that allows the main shaft 24 holding to move continuously is appropriately referred to as “continuous polishing distance”.)

  (5) Position of abrasive container 120 on table 28

  (6) Position of the polishing tool 110 placed on the tool holder 30

  (7) Tool path data of the cutting data forming the cutting surface 110a to be polished

The information (2) to (7) based on the operator's operation input from the operation panel 130 is stored in the storage unit 32b of the microcomputer 32.

  Next, the operation of the processing apparatus 10 will be described. Since the main shaft 24 is movable in the X-axis direction via the carriage 22, the main shaft 24 and a processing tool for cutting held by the main shaft 24 and a polishing tool The processing tool 110 moves in the Z-axis direction on the carriage 22 and moves in the X-axis direction via the carriage 22.

  Therefore, the processing device 10 has a configuration in which the positional relationship between the table 28 that moves in the Y-axis direction and the main shaft 24 that moves in the X-axis direction and the Z-axis direction can be relatively changed three-dimensionally. I have.

  The main shaft 24 holds a processing tool for cutting or a processing tool for polishing 110, and rotates the held processing tool for cutting or the processing tool 110 for polishing about the Z axis by driving a motor 38. .

That is, the main shaft 24 moves in a three-dimensional direction relative to the workpiece 100 and rotates around the axis.

  Then, in the processing apparatus 10, under the control of the microcomputer 32, based on the cutting data corresponding to the shape of the desired three-dimensional modeled object to be manufactured, the processing object 100 mounted on the upper surface 28 a of the table 28 is processed. The cutting process is performed by a cutting tool.

  In addition, since a conventionally known technique can be applied to the cutting processing by the processing tool for cutting in the processing apparatus 10, a detailed description of its configuration and operation will be omitted.

Further, in the processing apparatus 10, as shown in FIGS. 4A and 4B, the cutting surface 100a of the workpiece 100 that has been subjected to the cutting processing by the processing tool for cutting is used as a polishing tool. A polishing process for polishing by 110 is performed.

The microcomputer 32 operates the spindle 24, the carriage 22, and the table 28 on the basis of cutting data including data (tool path data) indicating a tool path that is a path of movement of the cutting tool during cutting. And a control unit 32a that moves the main shaft 24 to an arbitrary position in the XYZ orthogonal coordinate system and controls rotation of the main shaft 24 around the Z axis, and various kinds of information such as cutting data including tool path data and the like. A storage unit 32b for storing the data and a polishing processing control unit 32c for controlling the workpiece 100 to be polished by the polishing tool 110 are provided.

  The polishing processing control unit 32c controls the movement of the carriage 22, the spindle 24, and the table 28, and the workpiece processed by the cutting tool is held by the polishing tool 110 held by the chuck 24a of the spindle 24. Control is performed so that the cut surface 100a of the workpiece 100 is polished.

The polishing by the polishing tool 110 is an operation of rubbing the cutting surface 100a of the workpiece 100 by the polishing portion 110b of the polishing tool 110 rotated around the Z axis by the main shaft 24.
That is, the polishing processing control unit 32c determines the spindle based on the information stored in the storage unit 32b, specifically, the tool path data and the information (2) to (7) input from the operation panel 130. A polishing tool 110 is attached to the workpiece 24, the main shaft 24 is moved in accordance with the tool path data, and control is performed to polish the cut surface 100 a of the workpiece 100.

  In the above configuration, when performing the polishing process on the cut surface 110 a of the workpiece 100 by the processing device 10, the operator inputs the information (2) to (7) from the operation panel 130 to the microcomputer 32. Then, the information of (2) to (7) is stored in the storage unit 32b.

  Then, when the operator inputs the information of the above (1) to the microcomputer 32 from the operation panel 130, the polishing process using the cutting processing tool 110 is executed under the control of the polishing process control unit 32c.

  Hereinafter, the polishing process using the cutting processing tool 110 will be described in detail with reference to the flowchart shown in FIG.

The flowchart of FIG. 3 shows a processing routine of a polishing process using the processing tool 110 for cutting by the processing apparatus 10 according to the present invention.

  The polishing process is started when the operator inputs the information (1) from the operation panel 130 to the microcomputer 32, and is based on the information (2) to (7) input from the operation panel 130 by the operator. Initial setting is performed so that the processing apparatus 10 operates (step S302).

  The initial setting includes a process of attaching the polishing tool 110 to the chuck 24a of the spindle 24 based on the information of the above (6) using a known auto tool changer function.

  When the above-described initialization processing is completed, it is determined whether or not the tool path data indicated by the information (7) exists (step S304).

  In the process of step S304, when it is determined that the tool path data indicated by the information (7) does not exist, the polishing process ends.

  On the other hand, when it is determined in the process of step S304 that the tool path data indicated by the information (7) exists, the process proceeds to step S306, and the tool is attached to the spindle 24 based on the information (5). The polishing tool 110 is moved to the polishing agent container 120, and the polishing agent 110b of the polishing tool 110 is impregnated with the polishing agent.

  When the processing in step S306 is completed, the process proceeds to step S308, in which reading of the tool path data indicated by the information (7) is started, and the tool path data is attached to the spindle 24 based on the information (2) to (4). The obtained polishing tool 110 is moved according to the read tool path to perform a polishing operation (step S310).

  Here, the tool path is obtained when the cutting surface 110a to be polished is cut, and the diameter of the polishing portion 110b of the polishing tool 110 attached to the main shaft 24 is such that the cutting surface 110a is cut. The diameter is substantially the same as the diameter of the processed machining tool.

  Therefore, by moving the polishing tool 110 in the tool path when the cutting surface 110a to be polished is cut, the polishing tool 110 comes into contact with the cutting surface 110a, and is automatically cut. Polishing of 110a is performed.

  In addition, since the moving speed of the polishing tool 110 and the number of revolutions around the Z-axis are set based on the information of (2) and (3), the polishing of the cutting surface 110a different from the normal cutting is performed. It can be set to a suitable one.

  Then, it is monitored whether or not the moving distance of the main shaft 24 due to the polishing operation exceeds the continuous polishing distance shown in the information (4) (step S312), and the moving distance of the main shaft 24 due to the polishing operation is the above (4). If the continuous polishing distance indicated by the information (7) is not exceeded, the reading operation of the tool path data indicated by the information (7) is continued to perform the polishing operation.

  On the other hand, if it is determined in step S312 that the moving distance of the spindle 24 due to the polishing operation exceeds the continuous polishing distance shown in the information (4), the process returns to step S306, and based on the information in (5). After the polishing tool 110 attached to the main shaft 24 is moved to the polishing agent container 120 and the polishing is performed on the polishing portion 110b of the polishing tool 110, the process from step S308 is repeated. .

If it is determined in step S308 that the reading of the tool path data has been completed, the polishing process is terminated.

  As described above, the processing apparatus 10 according to the present invention uses the tool path data when forming the cutting surface 110a as it is, without creating new data for polishing the cutting surface 110a. Since the processing can be performed automatically, there is no need for manual polishing work.

In the polishing process, the moving speed of the polishing tool 110 and the number of revolutions around the Z axis can be set to those suitable for polishing the cutting surface 110a, and the continuous polishing distance can be set. Since the abrasive can be automatically impregnated into the polishing section 110b of the polishing tool 110 at an appropriate timing, a high-quality polishing operation can be performed.

  The above embodiment may be modified as shown in the following (1) to (4).

  (1) In the above-described embodiment, the polishing process ends when the polishing processing tool 110 passes once through the tool path indicated by the tool path data. However, the polishing process is not limited to this. is there.

  For example, the polishing tool 110 may be repeatedly passed through the tool path indicated by the tool path data a desired number of times.

  (2) In the above embodiment, the information of (2) to (7) is input from the operation panel, but it is needless to say that the present invention is not limited to this.

  For example, information in consideration of the configuration of the polishing unit 110b of the polishing tool 110 may be stored in the storage unit 32b in advance, and the information may be read.

  (3) In the above-described embodiment, the polishing process is started when the information of (1) is input from the operation panel. However, the present invention is not limited to this.

  For example, the polishing process may be automatically started when the cutting by the processing tool for cutting is completed.

  (4) The above-described embodiment and the above-described modifications (1) to (3) may be appropriately combined.

  INDUSTRIAL APPLICABILITY The present invention is suitable for use in a processing apparatus for cutting a workpiece with a processing tool for cutting.

  Reference Signs List 10 processing device, 22 carriage, 24 spindle, 24a chuck, 28 table, 30 tool holder, 32 microcomputer, 32a control unit, 32b storage unit, 32c polishing processing control unit, 38 motor, 100 workpiece, 100a cutting surface , 110 Polishing tool, 110a shank, 110b Polishing unit, 120 abrasive container, 120a opening, 122 abrasive

Claims (1)

The workpiece is cut based on the cutting data including the tool path data by the cutting tool held on the spindle that moves in three dimensions relative to the workpiece and rotates around the axis. Then, in a processing apparatus for producing a three-dimensional structure having a desired shape,
A polishing tool capable of impregnating an abrasive instead of the cutting edge, and a polishing tool that can be held on the spindle,
Storage means for storing the tool path data and the moving speed and rotation speed of the main spindle held by the polishing processing tool,
The main spindle on which the polishing tool is held is moved according to the tool path data according to the moving speed stored in the storage means, and the main spindle on which the polishing tool is held according to the number of revolutions stored in the storage means. and a control means for rotating,
An abrasive container storing an abrasive to be impregnated into the polishing section of the polishing tool;
Has,
The storage means stores the position information of the abrasive container and a continuous polishing distance that allows the polishing tool to move continuously on the main spindle held,
When the moving distance of the spindle holding the working tool for polishing exceeds the continuous polishing distance, the control means moves the spindle holding the working tool for polishing based on the position information to the abrasive container. And moving the polishing section of the polishing tool into the polishing slurry stored in the polishing slurry container .

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