JP6624626B1 - Electronic component sintering device - Google Patents

Abstract

An electronic component sintering apparatus capable of efficiently joining electronic components by a sintering method is capable of flexibly responding to an increase or decrease in a production amount or a type of an electronic component. A first unit including a supply unit for supplying an electronic component, a preheating unit for preheating the electronic component, and a first sintering press unit for sintering the electronic component after preheating. 1A, a second unit 1B detachable from the first unit 1A and including a cooling unit 5 for cooling the electronic component 10 after the sintering process, and a storage unit 6 for storing the electronic component 10 after the cooling, An extension unit 1C that is detachable between the first unit 1A and the second unit 1B, and includes an extension unit 1C including a second sintering press unit 4B that performs sintering processing of the electronic component 10 after preheating. [Selection] Figure 2

Description

  The present invention relates to an electronic component sintering apparatus for joining electronic components by a sintering method (sintering method) using a bonding material such as silver nanopaste.

  In electric devices such as air conditioners, elevators, hybrid vehicles and electric vehicles, the power supply voltage and the drive voltage are often different. Therefore, these electric devices are equipped with power conversion devices such as inverters and converters. Among these, a device that converts power using a power semiconductor is called a power module. Generally, a power semiconductor is soldered to an insulating substrate.

  As an apparatus for assembling a semiconductor device for soldering a power semiconductor to an insulating substrate, for example, Patent Document 1 discloses a loader that supplies circuit assemblies one by one from a tray and a loader that loads the circuit assemblies supplied from the loader. A conveyor, a tunnel-shaped main chamber with a soldered / adhered part in the center, an unloading conveyor for unloading assembled products, and an unloader for unloading assembled products from the unloading conveyor are lined up in a straight line. The arrangement is described. Further, this assembling apparatus has a branch chamber for carrying in a resin case drawn laterally from the soldering / adhesion portion, and the surrounding resin case integrated with the terminal is transferred to the preliminary soldering portion, and Pre-soldering is performed on the solder joint surface, flux and adhesive are applied at the flux / adhesive application section, transported from the branch chamber to the main chamber, and docked so as to overlap the circuit assembly. , Soldered and glued at the soldering / glue.

JP-A-10-233484 (FIG. 1)

  In the apparatus for assembling a semiconductor device described in Patent Document 1, the circuit assembly and the outer resin case on the terminal integrated side are processed by different routes. Attached and glued. Therefore, even if an attempt is made to increase the production amount, there is a problem that the production amount cannot be increased due to the processing time in the soldering / bonding portion.

  Incidentally, in recent years, development and commercialization of SiC power semiconductors capable of operating at a high temperature of 200 ° C. or higher have been promoted. However, tin-silver (Sn-AG) -based and tin-copper (Sn-Cu) -based lead (Pb) -free solders, which are often used in die bonding parts, have a melting point near 220 ° C. Cannot take advantage of the features of Although the solder containing a large amount of Pb has a high melting point of 290 ° C. or more, its application should be avoided in consideration of the influence on the environment. Further, the joining temperature is desirably 300 ° C. or less from the viewpoint of heat resistance of the peripheral members and residual stress during cooling.

  Therefore, a bonding material such as a silver nanopaste using silver nanoparticles that has high heat resistance, can be bonded at a low temperature, and has a high thermal conductivity has been developed and put into practical use. A sintering apparatus for joining electronic components by a sintering method (sintering method) in which an electronic component on which a semiconductor chip is mounted is heated and pressurized and bonded is applied.

  An object of the present invention is to provide an electronic component sintering apparatus capable of efficiently joining electronic components by a sintering method. I do.

  An electronic component sintering device of the present invention includes a supply unit that supplies an electronic component on which a semiconductor chip is mounted on a substrate via a bonding material, a preheating unit that preheats the electronic component supplied by the supply unit, A first sintering press unit for sintering the pre-heated electronic component, a cooling unit for cooling the sintering-processed electronic component, a storage unit for storing the cooled electronic component, and a pre-heating unit from the supply unit. A first transport unit that transports the electronic components transported through the first sintering press unit to the first sintering press unit, and a second transport unit that transports the electronic components transported through the first sintering press unit to the cooling unit. An electronic unit sintering apparatus having a second sintering press unit for performing sintering processing of an electronic component after preheating is detachable.

  According to the electronic component sintering apparatus of the present invention, the electronic component having the semiconductor chip mounted on the substrate via the bonding material is supplied from the supply unit to the preheating unit, preheated in the preheating unit, and the preheated electronic component. In the electronic component sintering device, the components are subjected to sintering processing in a first sintering press unit, the electronic components after sintering processing are cooled in a cooling unit, and the electronic components cooled by the cooling unit are stored in a storage unit. By connecting the extension unit, the second sintering press unit can be added. Further, when the second sintering press section becomes unnecessary, the extension unit can be separated.

  The electronic component sintering apparatus of the present invention includes a supply unit that supplies an electronic component on which a semiconductor chip is mounted on a substrate via a bonding material, and a preheating unit that preheats the electronic component supplied by the supply unit. A second unit including a cooling unit that cools the electronic component after the sintering process, and a storage unit that stores the electronic component after the sintering process. A first sintering press unit provided in at least one of the first unit and the second unit for sintering the preheated electronic component, and a first sintering press unit for conveying the electronic component conveyed from the supply unit via the preheating unit to the first unit. A sintering device for an electronic component, comprising: a first transport unit for transporting the electronic component to the sintering press unit; and a second transport unit for transporting the electronic component transported through the first sintering press unit to the cooling unit. A second sintering press unit for sintering electronic components after preheating, and an electronic component conveyed from the first unit side to the second unit side via the second sintering press unit. An extension unit including a third transport unit can be attached and detached between the first unit and the second unit.

  According to the present invention, the electronic component having the semiconductor chip mounted on the substrate via the bonding material is supplied from the supply unit to the preheating unit, preheated in the preheating unit, and the electronic component after the preheating is subjected to the first sintering press. In the sintering process of the electronic component, the electronic component after the sintering process is cooled in the cooling unit, and the electronic component after cooling by the cooling unit is stored in the storage unit. Is separated from the first unit including the cooling unit and the storage unit, and the first unit and the second unit are connected to each other via the additional unit, so that the second sintering press unit is added. can do. At this time, the electronic component conveyed from the first unit side is conveyed to the second unit side via the second sintering press unit by the third conveying unit. Further, when the second sintering press section becomes unnecessary, the extension unit can be separated.

  It is desirable that the extension unit has a positioning portion that performs positioning at the time of attachment and detachment. Thus, when the extension unit is connected, the extension unit is positioned, so that the extension is facilitated.

  The supply unit has a fourth conveyance unit that conveys the electronic component to the preheating unit in a direction parallel to the conveyance direction of the first conveyance unit. The preheating unit is configured to transfer the electronic component to the first conveyance unit. It is desirable that the device moves forward and backward toward the transport unit. Thus, the preheated electronic component can be delivered to the first transport unit without interfering with the fourth transport unit, and can be transported by the first transport unit to the first sintering press unit.

  The cooling unit has a fifth transport unit that transports the electronic component to the storage unit in a direction parallel to the transport direction of the second transport unit, and directs the electronic component to the second transport unit to receive the electronic component from the second transport unit. It is desirable that they move forward and backward. Thereby, the electronic component after the sintering process can be delivered to the cooling unit without interfering with the fifth transport unit, and the cooled electronic component can be transported to the storage unit by the fifth transport unit.

(1) A supply unit for supplying an electronic component on which a semiconductor chip is mounted on a substrate via a bonding material, a preheating unit for preheating the electronic component supplied by the supply unit, and sintering of the electronic component after the preheating. A first sintering press unit for processing, a cooling unit for cooling the electronic components after the sintering process, a storage unit for storing the cooled electronic components, and an electronic component conveyed from the supply unit via the preheating unit. An electronic component sintering apparatus including: a first transport unit that transports electronic components to the sintering press unit; and a second transport unit that transports electronic components transported through the first sintering press unit to the cooling unit. The additional unit including the second sintering press unit for sintering the electronic component after preheating is detachable, so that the additional unit is connected or separated as necessary, and the second sintering is performed. It is possible to increase or decrease the number of squeezing parts, so that it is possible to easily cope with an increase or decrease in the production amount without increasing the number of sintering devices, and it is possible to reduce the cost and reduce the installation area of the device. . Further, it is possible to cope with the simultaneous production of electronic components of different types by increasing or decreasing the corresponding second sintering press units.

(2) a first unit including a supply unit that supplies an electronic component on which a semiconductor chip is mounted on a substrate via a bonding material, and a preheating unit that preheats the electronic component supplied by the supply unit; A second unit detachable from the unit, a second unit including a cooling unit for cooling the electronic components after the sintering process, and a storage unit for storing the electronic components after the cooling, a first unit and a second unit And a first sintering press unit for sintering the preheated electronic component, and a conveyer for conveying the electronic component from the supply unit via the preheating unit to the first sintering press unit A sintering apparatus for electronic components, comprising: a first transport section that performs a pre-heating process; and a second transport section that transports the electronic components transported through the first sintering press section to a cooling section. An additional unit including a second sintering press unit for sintering the electronic component and a third transport unit for transporting the electronic components transported from the first unit side to the second unit side via the second sintering press unit. The detachable structure between the first unit and the second unit allows an additional unit to be connected or separated between the first unit and the second unit as necessary, thereby increasing or decreasing the second sintering press unit. Therefore, it is possible to easily cope with an increase or decrease in the amount of production without increasing the number of sintering apparatuses, and it is possible to reduce the cost and reduce the installation area of the apparatus. Further, it is possible to cope with the simultaneous production of electronic components of different types by increasing or decreasing the corresponding second sintering press units.

(3) Since the extension unit has the positioning portion for performing positioning at the time of attachment / detachment, the extension unit is positioned when the extension unit is connected, so that the extension operation is facilitated.

(4) The supply unit has a fourth transport unit that transports the electronic component to the preheating unit in a direction parallel to the transport direction of the first transport unit, and the preheating unit transmits the electronic component to the first transport unit. The electronic component after preheating is transferred to the first transport unit without interfering with the fourth transport unit, and is transported to the first sintering press unit by the first transport unit by moving forward and backward toward the first transport unit. And the device can be compactly stored.

(5) The cooling section has a fifth transport section for transporting the electronic component to the storage section in a direction parallel to the transport direction of the second transport section, and the second transport section for receiving the electronic component from the second transport section. The electronic component after the sintering process is transferred to the cooling unit without interfering with the fifth transport unit, and the cooled electronic component is transported to the storage unit by the fifth transport unit. And the device can be compactly stored.

FIG. 1 is a plan view illustrating a schematic configuration of an electronic component sintering device according to an embodiment of the present invention. FIG. 2 is a plan view showing a state in which an extension unit is added to the sintering device of FIG. 1. FIG. 3 is a front view of FIG. 2. It is a top view which shows schematic structure of the sintering apparatus after expansion of an expansion unit. It is a top view showing the schematic structure figure of the sintering device of the electronic parts in another embodiment of the present invention. It is a front view of FIG. It is a top view showing the schematic structure of the sintering device of the electronic parts in yet another embodiment of the present invention. It is the front view which omitted a part of FIG.

  FIG. 1 is a plan view showing a schematic configuration of an electronic component sintering apparatus according to an embodiment of the present invention, FIG. 2 is a plan view showing how an extension unit is added to the sintering apparatus of FIG. 1, and FIG. FIG. 4 is a front view of FIG. 2, and FIG. 4 is a plan view showing a schematic configuration of the sintering device after the extension unit is added.

  In FIG. 1, an electronic component sintering apparatus 1 according to an embodiment of the present invention includes a supply unit 2 for supplying an electronic component 10, a preheating unit 3 for preheating the electronic component 10 supplied by the supply unit 2, and a preheating unit. A first sintering press unit 4A for sintering the electronic component 10 after preheating by the unit 3, a cooling unit 5 for cooling the electronic component 10 after the sintering process by the first sintering press unit 4A, and a cooling unit 5 Storage section 6 for storing electronic component 10 after cooling by the above-mentioned method, and electronic component 10 is transported from supply section 2 to storage section 6 through preheating section 3, first sintering press section 4A and cooling section 5 in storage direction X. And a transport unit 7.

  The sintering apparatus 1 includes a first unit 1A including a supply unit 2, a preheating unit 3, and a first sintering press unit 4A, and a second unit 1B including a cooling unit 5 and a storage unit 6. The first unit 1A and the second unit 1B are detachable. As will be described later in detail, an additional unit 1C is detachable between the first unit 1A and the second unit 1B as shown in FIGS.

  The electronic component 10 has a semiconductor chip mounted on a substrate such as an insulating substrate via a bonding material. The bonding material is a bonding material for sintering (sintering method) such as silver nanopaste using silver nanoparticles having high heat resistance, being capable of bonding at low temperature, and having high thermal conductivity. The semiconductor chip is a power semiconductor chip used for a power module. The electronic component is transported by the transport unit 7 in the sintering apparatus 1 while one or more electronic components are placed on the tray 11.

  The transport unit 7 includes a first transport unit 7A that transports the electronic component 10 in the first unit 1A and a second transport unit 7B that transports the electronic component 10 in the second unit 1B. The transport unit 7 is, for example, straddling a linear rail configuring the first transport unit 7A, a linear rail configuring the second transport unit 7B, and the first transport unit 7A and the second transport unit 7B. And a moving carrier 7F. When the first unit 1A and the second unit 1B are connected, the first transport unit 7A and the second transport unit 7B are continuously arranged on a straight line.

  The first transport section 7A transports the electronic component 10 transported from the supply section 2 via the preheating section 3 to the first sintering press section 4A. The first transport unit 7 </ b> A receives the electronic components 10 unloaded from the supply unit 2 together with the tray 11, transports them in the transport direction X, and delivers them to the preheating unit 3. Further, the first transport unit 7A receives the electronic component 10 preheated by the preheating unit 3 together with the tray 11, transports the electronic component 10 in the transport direction X, and delivers it to the first sintering press unit 4A. Further, the first transport unit 7A receives the electronic components 10 together with the tray 11 after the sintering process by the first sintering press unit 4A, and transports them in the transport direction X to the second transport unit 7B.

  The second transport unit 7 </ b> B transports the electronic component 10 transported via the first sintering press unit 4 </ b> A to the cooling unit 5. The second transport unit 7B transports the electronic component 10 transported from the first transport unit 7A in the transport direction X, and delivers the electronic components 10 together with the tray 11 to the cooling unit 5. The second transport unit 7 </ b> B receives the electronic component 10 cooled by the cooling unit 5 together with the tray 11, transports the electronic component 10 in the transport direction X, and delivers it to the storage unit 6.

  Further, in the sintering device 1 according to the present embodiment, the additional unit 1C shown in FIGS. 2 to 4 can be attached and detached between the first unit 1A and the second unit 1B as described above. The extension unit 1C includes a second sintering press unit 4B for sintering the preheated electronic component 10 and a second sintering press unit 4B for transferring the electronic component 10 conveyed from the first unit 1A through the second sintering press unit 4B. And a third transport section 7C for transporting to the 1B side.

  The third transport unit 7C is configured by, for example, a linear rail. When the extension unit 1C is connected between the first unit 1A and the second unit 1B, the first transport unit 7A, the third transport unit 7C, and the second transport unit 7B are continuously arranged on a straight line, and the transport unit 7 is constituted. At this time, the carrier 7F moves across the first transport unit 7A, the third transport unit 7C, and the second transport unit 7B.

  In addition, the first unit 1A, the second unit 1B, and the extension unit 1C have a positioning unit 12 for performing positioning when attaching and detaching each other. The positioning portion 12 includes, for example, a positioning concave portion 12A formed on the second unit 1B side of the first unit 1A and the third unit 1C, and a third concave portion of the third unit 1C and the second unit 1B corresponding to the positioning concave portion 12A. The positioning protrusions 12B are formed on the unit 1A side. The first and second units 1A, 1B and the extension unit 1C are positioned relative to each other at the time of attachment and detachment by fitting the positioning projection 12B into the positioning recess 12A or detaching the positioning projection 12B from the positioning recess 12A.

  In the first sintering press section 4A, the electronic component 10 preheated in the preheating section 3 is heated and pressed at a sintering processing temperature lower than the melting point of the bonding material to perform sintering processing. In the first sintering press unit 4A, the electronic component 10 transported from the preheating unit 3 by the transport unit 7 is sandwiched by the mold 41 together with the tray 11 and heated and heated at a predetermined sintering temperature in the chamber 40 for a predetermined processing time. Apply pressure. When the bonding material is a silver nanopaste, it is heated at a sintering temperature of 250 to 300 ° C. and pressurized at a pressure of 5 to 20 MPa. The same applies to the second sintering press section 4B.

  In the preheating unit 3, the electronic component 10 is preheated at a preheating temperature lower than the sintering processing temperature (hereinafter, referred to as “first preheating temperature”). The preheating unit 3 includes a heating mechanism for maintaining the first preheating temperature at a predetermined temperature, a temperature sensor, and a temperature control unit. In the preheating unit 3, the electronic component 10 transported from the supply unit 2 by the transport unit 7 is preheated together with the tray 11 in the chamber 30. When the bonding material is silver nanopaste, preheating is performed at a first preheating temperature of about 100 ° C (preferably 80 to 120 ° C).

  In the cooling unit 5, the electronic component 10 is cooled to a cooling temperature lower than the sintering processing temperature. The cooling unit 5 includes a cooling mechanism for maintaining a cooling temperature at a predetermined temperature, a temperature sensor, and a temperature control unit. In the cooling unit 5, the electronic component 10 transported from the first sintering press unit 4 </ b> A by the transport unit 7 is cooled in the chamber 50 together with the tray 11. The cooling temperature is set to around 100 ° C (preferably 80 to 120 ° C) or lower. The electronic component 10 cooled by the cooling unit 5 is transported together with the tray 11 to the storage unit 6 by the transport unit 7 and stored therein.

  Further, the sintering apparatus 1 in the present embodiment includes a pipe (not shown) for supplying an inert gas to the preheating unit 3, the first sintering press unit 4A, and the cooling unit 5, respectively. The inert gas prevents oxidation of the electronic component 10 in the preheating unit 3, the first sintering press unit 4A, and the cooling unit 5, and for example, nitrogen gas can be used. The pipes are at the same temperature as the preheating unit 3, the first sintering press unit 4A, and the cooling unit 5 or a predetermined temperature higher than the temperature of the preheating unit 3, the first sintering press unit 4A, and the cooling unit 5, respectively. By setting the temperature to a high or low temperature, it is possible to prevent the temperature difference between the preheating unit 3, the sintering press unit 4, and the cooling unit 5 from adversely affecting the temperature. The second sintering press section 4B has the same configuration.

  The transport unit 7 may be provided with a preheating mechanism (not shown) for preheating at a second preheating temperature lower than the sintering processing temperature. Similarly to the first preheating temperature, the second preheating temperature is about 100 ° C. (preferably 80 to 120 ° C.) when the bonding material is silver nanopaste, but is different from the first preheating temperature. It can also be. When the transport unit 7 includes a chamber (not shown), the preheating mechanism preheats the electronic component 10 in the chamber.

  Further, the transport section 7 may include an inert gas supply mechanism (not shown) for supplying an inert gas to the electronic components 10 on the tray 11. The inert gas prevents oxidation of the electronic component 10 during the transport of the electronic component in the transport unit 7, and for example, nitrogen gas can be used. The supply mechanism supplies the inert gas to the electronic component 10 on the tray 11 by injecting the gas, or supplies the gas into the chamber when the transport unit 7 includes a chamber (not shown). . At this time, the inert gas is set at the same temperature as the second preheating temperature or at a temperature higher or lower by a predetermined temperature than the second preheating temperature so that the inert gas is not adversely affected by a temperature difference from the second preheating temperature. It is possible to

  In addition, the sintering apparatus 1 according to the present embodiment refers to the table 8 in which processing conditions according to the type of material of the electronic component 10 including the bonding material are stored in advance, and refers to the table 8 to determine the type of material of the electronic component. And a control unit 9 for controlling operations of the preheating unit 3, the first sintering press unit 4A, the second sintering press unit 4B, the cooling unit 5, and the like.

  The table 8 shows the processing conditions of the following items for the preheating unit 3, the first sintering press unit 4A, the second sintering press unit 4B, and the cooling unit 5 according to the type of electronic component material including the bonding material. It is stored in advance. These processing conditions can be set from a monitor screen (not shown) of the sintering apparatus 1 or a wired or wireless remote terminal (handy programmable terminal, personal computer, tablet, etc.) (not shown). It is possible.

[Preheating section 3]
・ Preheating: Yes / No ・ First preheating temperature: Predetermined temperature (range around 100 ° C)
・ Inert gas: Use / Not use ・ Chamber: Yes / No [1st sintering press part 4A]
・ Sintering treatment temperature: predetermined temperature (about 250 to 300 ° C)
・ Inert gas: Use / Not use ・ Chamber: Yes / No [2nd sintering press part 4B]
・ Sintering treatment temperature: predetermined temperature (about 250 to 300 ° C)
・ Inert gas: Use / Not use ・ Chamber: Yes / No [Cooling part 5]
・ Cooling temperature: less than or equal to a predetermined temperature (the range is around 100 ° C) ・ Inert gas: Use / Not use ・ Chamber: Yes / No [Transfer part 7]
・ Preheating: Yes / No ・ Second preheating temperature: Predetermined temperature (range around 100 ° C)
・ Inert gas: Use / Not use ・ Chamber: Yes / No

  In the sintering apparatus 1 shown in FIG. 1, an electronic component 10 having a semiconductor chip mounted on a substrate via a bonding material is transported from a supply unit 2 to a preheating unit 3 by a transport unit 7. In the preheating section 3, the conveyed electronic component 10 is preheated at a predetermined first preheating temperature of about 100 ° C. At this time, the control unit 9 refers to the table 8 and controls the preheating unit 3 according to the processing conditions according to the type of the material of the electronic component 10. The first preheating temperature is lower than the sintering temperature lower than the melting point of the bonding material, and the sintering of the bonding material does not proceed, and the water and the solvent of the bonding material are removed.

  In order to optimize the production efficiency, it is desirable that the first preheating temperature be as close as possible to the sintering temperature in the sintering press 4A. However, the sintering is performed before the sintering in the sintering press 4A. Preheat at an appropriate temperature to prevent progress. In the case where the material of the electronic component including the bonding material is easily oxidized when heated, the oxidation can be prevented by supplying an inert gas to the preheating unit 3.

  The electronic component 10 preheated by the preheating unit 3 is transported by the transport unit 7 to the sintering press unit 4A. When the transfer unit 7 includes a preheating mechanism, the temperature of the electronic component 10 is preheated during the transfer from the preheating unit 3 to the sintering press unit 4A, and is maintained at the second preheating temperature lower than the sintering processing temperature. In addition, the temperature of the electronic component 10 can be prevented from lowering. At this time, the control unit 9 refers to the table 8 and controls the preheating mechanism of the transport unit 7 according to the processing conditions according to the type of the material of the electronic component 10.

  In the sintering press section 4A, the transported electronic component 10 is heated at a predetermined sintering processing temperature of about 250 to 300 ° C. for a predetermined time, pressurized at a predetermined pressure, and subjected to sintering processing. At this time, the control unit 9 refers to the table 8 and controls the sintering press unit 4A according to processing conditions according to the type of the material of the electronic component 10. In addition, even during the sintering process, the oxidation can be prevented by supplying the inert gas to the sintering press unit 4A.

  The electronic component 10 sintered by the sintering press unit 4 </ b> A is transported to the cooling unit 5 by the transport unit 7. In the cooling unit 5, the electronic component 10 that has undergone the sintering process is cooled to a predetermined cooling temperature of about 100 ° C., which is lower than the sintering process temperature. At this time, the control unit 9 refers to the table 8 and controls the cooling unit 5 under processing conditions according to the material of the electronic component 10. The oxidation can be prevented also in the cooling unit 5 by supplying the inert gas. The electronic component 10 cooled by the cooling unit 5 is transported to the storage unit 6 by the transport unit 7 and stored therein.

  When the transport unit 7 includes an inert gas supply mechanism that supplies an inert gas to the electronic components 10 on the tray 11, the transport unit 7 supplies the inert gas to the electronic components 10 while the transport unit 7 transports the electronic components 10. An inert gas is supplied to the electronic component 10 on the tray 11. At this time, the control unit 9 refers to the table 8 and controls the inert gas supply mechanism of the transport unit 7 according to the processing conditions according to the type of the material of the electronic component 10. This can prevent oxidation due to preheating or residual heat during the transportation of the electronic component 10.

  According to the sintering apparatus 1 of the present embodiment, the electronic component 10 in which the semiconductor chip is mounted on the substrate via the bonding material is further heated in the preheating unit 3 at a sintering temperature lower than the melting point of the bonding material. By preheating at a low first preheating temperature, the sintering process can be performed after removing the moisture and the solvent of the bonding material, so that the sintering process can be stabilized, and the quality of the electronic component can be improved. I do. Further, by performing preheating in a stage preceding the sintering press section 4A, the heating time in the sintering press section 4A is reduced.

  When the transport unit 7 includes a preheating mechanism, the electronic component 10 is preheated during the transport from the preheating unit 3 to the sintering press unit 4A, and is maintained at the second preheating temperature lower than the sintering processing temperature. Then, since the temperature of the electronic component 10 can be prevented from lowering, the sintering process is further stabilized, and the quality of the electronic component is improved. In particular, this is effective in a case where the state in which the operation is stopped while the transport unit 7 holds the electronic component 10 continues due to the occurrence of a trouble during operation of the apparatus.

  Further, in the sintering apparatus 1, the electronic component 10 sintered in the sintering press unit 4A is cooled in the cooling unit 5 to a cooling temperature lower than the sintering processing temperature. The oxidation is prevented from progressing, and the quality of the electronic component is further improved. Further, since the dimensions of the electronic components and the like expanded by the thermal expansion are returned to the room temperature dimensions at an early stage, the influence on the subsequent transport and storage operations is prevented.

  Further, in the sintering apparatus 1, the control unit 9 refers to a table 8 in which processing conditions including a sintering processing temperature and a first preheating temperature according to the type of material of the electronic component 10 including the bonding material are stored in advance. Controls the operations of the preheating unit 3 and the sintering press unit 4A according to the type of material of the electronic component 10, so that the preheating is performed under processing conditions suitable for production according to the type of material of the electronic component 10 including the bonding material. And sintering processing are performed to improve production efficiency.

  Further, in the sintering apparatus 1, the electronic component 10 having the semiconductor chip mounted on the substrate via the bonding material is transported by the transport unit 7 together with the tray 11 in a state of being mounted on the tray 11. The operation efficiency of the processing can be increased, and the management of the electronic component 10 is easy. When the transport unit 7 includes an inert gas supply mechanism that supplies an inert gas to the electronic components 10 on the tray 11, the inert gas is supplied while the transport unit 7 transports the electronic components 10. In addition, oxidation due to preheating or residual heat during transportation of the electronic component 10 can be prevented, and the quality of the electronic component is further improved.

  In the sintering apparatus 1, the first unit 1A and the second unit 1B are separated, and an additional unit 1C is arranged between the first unit 1A and the second unit 1B as shown in FIGS. Then, as shown in FIG. 4, by connecting the first unit 1A and the second unit 1B via the additional unit 1C, the first transport unit 7A, the third transport unit 7C, and the second transport unit 7B are directly connected. A continuous transfer section 7 is formed on the line, and the second sintering press section 4B can be added. The second sintering press 4B functions in the same manner as the first sintering press 4A. Further, the number of extension units 1C can be increased or decreased by an arbitrary number.

  Thus, the second sintering press unit 4B can be increased or decreased according to the production amount of the electronic component 10, so that it is possible to easily cope with an increase or decrease in the production amount without increasing the number of sintering devices 1 itself. This is costly and can reduce the installation area of the device. In addition, it is possible to cope with the simultaneous production of different kinds of electronic components 10 by increasing or decreasing the corresponding second sintering press 4B. When the second sintering press 4B becomes unnecessary, by removing the second sintering press section 4B, it becomes possible to perform optimal production with an optimal number of sintering press sections.

  Further, the heating devices of the first sintering press unit 4A and the second sintering press unit 4B used for the sintering process at a high temperature may be individually and finely controlled by the control unit 9 to suppress power consumption. It is possible to reduce the amount of exhaust heat generated in the sintering process. Further, the amount of use of the inert gas can be reduced.

  Further, when a problem occurs in the sintering process, only the first sintering press section 4A and the second sintering press section 4B are kept closed without opening the mold, so that they do not touch the outside air. At the same time, it is possible to prevent oxidation by blowing an inert gas onto the transfer section 7. That is, even if a standby time occurs when a problem unique to a plurality of presses occurs, it is possible to ensure product quality.

  Further, in the sintering device 1 according to the present embodiment, the first unit 1A, the second unit 1B, and the extension unit 1C have the positioning unit 12 for performing positioning at the time of attachment / detachment, so that the first unit 1A and the second unit 1B When the extension unit 1C is connected between the first unit 1A and the second unit 1B by separating the first unit 1A, the first unit 1A, the second unit 1B, and the extension unit 1C are positioned with respect to each other, so that the extension operation is easy. It has become.

  Next, another embodiment of the electronic component sintering apparatus of the present invention will be described. FIG. 5 is a plan view showing a schematic configuration of an electronic component sintering apparatus according to another embodiment of the present invention, and FIG. 6 is a front view of FIG. 5 and 6, the same reference numerals are given to the same components as those of the sintering device 1 described above, and the detailed description thereof will be omitted.

  In the electronic component sintering device 13 shown in FIGS. 5 and 6, the supply unit 2 transports the electronic component 10 to the preheating unit 3 in a direction parallel to the transport direction X of the first transport unit 7A. It has a portion 7D. The supply unit 2 includes an elevating mechanism 20. The fourth transport unit 7D includes a pusher 7D1 for pushing the electronic components 10 together with the tray 11 from the supply unit 2 raised and lowered by the lifting mechanism 20 toward the preheating unit 3, and a driving unit 7D2 for driving the pusher 7D1.

  The preheating unit 3 moves forward and backward in the Y1 direction toward the first transport unit 7A to deliver the electronic component 10 to the first transport unit 7A. In FIG. 5, the Y1 direction is a direction orthogonal to the transport direction X. The preheating unit 3 includes a chamber elevating mechanism 31 that elevates and lowers the chamber 30 described above, and a preheater elevating mechanism 33 that elevates and lowers a preheater 32 that preheats the electronic component 10. The preheating unit 3 raises and lowers the chamber 30 by the chamber elevating mechanism 31 so as not to interfere with the chamber 30 when the preheating unit 3 moves forward and backward toward the first transfer unit 7A, and also controls the preheating heater so that the preheating heater 31 does not interfere. The preheating heater 32 is raised and lowered by the lifting mechanism 33 and retracted.

  The cooling unit 5 moves forward and backward in the Y2 direction toward the second transport unit 7B to receive the electronic component 10 from the second transport unit 7B. In FIG. 5, the Y2 direction is a direction orthogonal to the transport direction X. The cooling unit 5 includes a chamber elevating mechanism 51 that elevates and lowers the above-described chamber 50, and a cooler elevating mechanism 53 that elevates and lowers a cooler 52 that cools the electronic component 10. The cooling unit 5 raises and lowers the chamber 50 by the chamber elevating mechanism 51 so as not to interfere with the chamber 50 when moving forward and backward toward the second transporting unit 7B, and also cools and lowers the cooler 52 so that the cooler 52 does not interfere. The cooler 52 is moved up and down by 53 to retract.

  The cooling unit 5 has a fifth transport unit 7E that transports the electronic component 10 to the storage unit 6 in a direction parallel to the transport direction X of the second transport unit 7B. The storage section 6 includes an elevating mechanism 60. The fifth transport unit 7E includes a pusher 7E1 that pushes the electronic component 10 together with the tray 11 into and from the storage unit 6 that has been moved up and down by the elevating mechanism 60, and a drive unit 7E2 that drives the pusher 7E1.

  In the sintering device 13 having the above-described configuration, similarly to the sintering device 1 described above, it is possible to increase or decrease the number of extension units 1C disposed between the first unit 1A and the second unit 1B. The number of the second sintering press units 4B can be increased or decreased according to the production amount of the ten.

  Further, in the sintering device 13, the supply unit 2 includes the fourth transport unit 7 </ b> D that transports the electronic component 10 to the preheating unit 3 in a direction parallel to the transport direction X of the first transport unit 7 </ b> A. Moves forward and backward toward the first transport unit 10 in order to transfer the electronic component 10 to the first transport unit 7A, so that the electronic component 10 after preheating is not transported by the first transport unit 7D without interfering with the fourth transport unit 7D. It can be transferred to the first sintering press unit 4A and transferred to the first sintering press unit 4A by the first transfer unit 7A, and the apparatus can be compactly stored.

  Further, in the sintering device 13, the cooling unit 5 includes the fifth transport unit 7 </ b> E that transports the electronic component 10 to the storage unit 6 in a direction parallel to the transport direction X of the second transport unit 7 </ b> B. Since the electronic component 10 moves forward and backward toward the second transport unit 7B to accept the electronic component 10 from the unit 7B, the electronic component 10 after the sintering process is transferred to the cooling unit 5 without interfering with the fifth transport unit 7E. The delivered and cooled electronic component 10 can be transported to the storage section 6 by the fifth transport section 7E, and the apparatus can be compactly stored.

  In the above embodiment, the configuration in which the first sintering press section 4A is provided in the first unit 1A has been described, but the configuration in which the first sintering press section 4A is provided in the second unit 1B may be employed. . The first sintering press section 4A may be provided in at least one of the first unit 1A and the second unit 1B, but is provided in both the first unit 1A and the second unit 1B. It can also be configured.

  Next, still another embodiment of the electronic component sintering apparatus of the present invention will be described. FIG. 7 is a plan view showing a schematic configuration of an electronic component sintering apparatus according to still another embodiment of the present invention, and FIG. 8 is a front view in which a part of FIG. 7 is omitted. 7 and 8, the same reference numerals are given to the same components as those of the above-described sintering device 1, and the detailed description thereof will be omitted.

  The electronic component sintering device 14 shown in FIGS. 7 and 8 includes a supply unit 2 that supplies the electronic component 10, a preheating unit 3 that preheats the electronic component 10 supplied by the supply unit 2, and a preheating unit 3 that preheats the electronic component 10. A first sintering press unit 4A that sinters the electronic component 10 afterward, a cooling unit 5 that cools the electronic component 10 after the sintering process by the first sintering press unit 4A, and a cooling unit 5 that cools the electronic component 10 after the sintering process. A storage section 6 for storing the electronic component 10.

  The sintering device 14 includes a first transport unit 7A that transports the electronic component 10 transported from the supply unit 2 through the preheating unit 3 to the first sintering press unit 4A, and a first sintering press unit. And a second transport unit (not shown) for transporting the electronic component 10 transported through the 4A toward the cooling unit 5. The electronic component 10 is supplied from the supply unit 2 to the preheating unit 3 and to the first sintering press. The sheet is conveyed to the storage section 6 via the section 4A and the cooling section 5.

  In this sintering device 14, an arbitrary number of additional units 1C can be attached to and detached from the first sintering press section 4A. In a state where the first sintering press unit 4A is connected, the first transport unit 7A and the third transport unit 7C are continuously arranged on a straight line, and the carrier 7F is connected to the first transport unit 7A and the third transport unit 7C. The electronic component 10 moves across the ladder and is transported from the supply unit 2 to the storage unit 6 via the preheating unit 3, the first sintering press unit 4A, the second sintering press unit 4B, and the cooling unit 5.

  Also in the sintering device 14 having the above configuration, the number of the extension units 1C can be increased or decreased, and the number of the second sintering press units 4B can be increased or decreased according to the production amount of the electronic component 10.

  INDUSTRIAL APPLICABILITY The present invention is useful as a sintering device for electronic components that joins electronic components by a sintering method, and is particularly suitable as a sintering device capable of flexibly responding to increase or decrease in production amount or the type of electronic component. is there.

1, 13, 14 Sintering device 1A First unit 1B Second unit 1C Extension unit 2 Supply unit 3 Preheating unit 4A First sintering press unit 4B Second sintering press unit 5 Cooling unit 6 Storage unit 7 Transport unit 7A First unit 1 transport section 7B 2nd transport section 7C 3rd transport section 7D 4th transport section 7D1 pusher 7D2 drive section 7E 5th transport section 7E1 pusher 7E2 drive section 7F carrier 8 table 9 control section 10 electronic component 11 tray 12 positioning section 12A positioning Concave portion 12B Positioning convex portion 20 Elevating mechanism 30, 40, 50 Chamber 31 Chamber elevating mechanism 32 Preheating heater 33 Preheating heater elevating mechanism 41 Formwork 51 Chamber elevating mechanism 52 Cooler 53 Cooler elevating mechanism 60 Elevating mechanism

Claims (5)

A supply unit that supplies an electronic component on which a semiconductor chip is mounted via a bonding material on a substrate,
A preheating unit that preheats the electronic component supplied by the supply unit;
A first sintering press for sintering the electronic component after preheating,
A cooling unit for cooling the electronic component after the sintering process,
A storage unit for storing the electronic component after cooling,
A first transport unit that transports the electronic component transported from the supply unit through the preheating unit toward the first sintering press unit;
A second transport unit that transports the electronic component conveyed through the first sintering press unit toward the cooling unit;
An electronic component sintering apparatus in which an extension unit including a second sintering press unit for performing a sintering process on the preheated electronic component is detachable. A first unit including a supply unit that supplies an electronic component on which a semiconductor chip is mounted on a substrate via a bonding material, and a preheating unit that preheats the electronic component supplied by the supply unit;
A second unit that is a second unit detachable from the first unit and includes a cooling unit that cools the electronic component after the sintering process, and a storage unit that stores the electronic component after the cooling;
A first sintering press unit provided in at least one of the first unit and the second unit and sintering the electronic component after preheating;
A first transport unit that transports the electronic component transported from the supply unit through the preheating unit toward the first sintering press unit;
A second transport unit that transports the electronic component conveyed through the first sintering press unit toward the cooling unit;
A second sintering press unit for sintering the electronic component after preheating, and the electronic component conveyed from the first unit side to the second unit side via the second sintering press unit. An electronic component sintering apparatus, wherein an extension unit including a third transport unit is detachable between the first unit and the second unit.   3. The electronic component sintering device according to claim 1, wherein the extension unit has a positioning portion that performs positioning at the time of attachment / detachment. The supply unit has a fourth transport unit that transports the electronic component to the preheating unit in a direction parallel to a transport direction of the first transport unit,
4. The electronic component sintering according to claim 1, wherein the preheating unit moves forward and backward toward the first transport unit to deliver the electronic component to the first transport unit. 5. apparatus.   The cooling unit has a fifth transport unit that transports the electronic component to the storage unit in a direction parallel to a transport direction of the second transport unit, and receives the electronic component from the second transport unit. The electronic component sintering device according to any one of claims 1 to 4, wherein the electronic component sintering device moves forward and backward toward the second transport unit.

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