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JP6595568B2 - Evaporation source apparatus and vapor deposition apparatus - Google Patents

Evaporation source apparatus and vapor deposition apparatus Download PDF

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Publication number
JP6595568B2
JP6595568B2 JP2017237438A JP2017237438A JP6595568B2 JP 6595568 B2 JP6595568 B2 JP 6595568B2 JP 2017237438 A JP2017237438 A JP 2017237438A JP 2017237438 A JP2017237438 A JP 2017237438A JP 6595568 B2 JP6595568 B2 JP 6595568B2
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container
evaporation source
positioning
housing member
source device
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JP2019104960A (en
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良秋 風間
喜成 近藤
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Canon Tokki Corp
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Canon Tokki Corp
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Priority to KR1020180086862A priority patent/KR102357047B1/en
Priority to CN201811070878.7A priority patent/CN109913818A/en
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Priority to KR1020220010058A priority patent/KR102464807B1/en
Priority to KR1020220144477A priority patent/KR102638573B1/en
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/243Crucibles for source material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/26Vacuum evaporation by resistance or inductive heating of the source
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/16Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)

Description

本発明は、蒸発源装置及び蒸着装置に関する。   The present invention relates to an evaporation source device and a vapor deposition device.

近年、ディスプレイの一種として、有機材料の電界発光を用いた有機EL素子を備えた有機EL装置が注目を集めている。かかる有機ELディスプレイ等の有機電子デバイス製造において、蒸発源装置を用いて、基板上に有機材料や金属電極材料などの蒸着材料を蒸着させて成膜を行う工程がある。   In recent years, an organic EL device provided with an organic EL element using electroluminescence of an organic material has attracted attention as a kind of display. In manufacturing an organic electronic device such as an organic EL display, there is a step of forming a film by evaporating an evaporation material such as an organic material or a metal electrode material on a substrate using an evaporation source device.

蒸着工程で用いられる蒸発源装置は、蒸着材料が収容される容器としての機能と、蒸着材料の温度を上昇させて蒸発させ、基板の表面に付着させるための加熱機能を有する。従来、加熱機能を向上させて良好な成膜を行うために、蒸着材料を均一に加熱できるような蒸発源装置が提案されている。   The evaporation source device used in the vapor deposition process has a function as a container for accommodating the vapor deposition material, and a heating function for increasing the temperature of the vapor deposition material to evaporate it and adhere it to the surface of the substrate. Conventionally, in order to improve the heating function and perform good film formation, an evaporation source device that can uniformly heat the vapor deposition material has been proposed.

特許文献1では、ヒータをノズル付近に配置することにより、蒸発源のノズル温度が熱輻射によって低下することを防いでいる。   In Patent Document 1, the heater is arranged near the nozzle to prevent the nozzle temperature of the evaporation source from being reduced by heat radiation.

特開2015−67847号公報Japanese Patent Laying-Open No. 2015-67847

従来の構成では、蒸発材料を収容する坩堝の支持方法については記載されていない。蒸着材料を収容する坩堝を支持する機構は、蒸着材料を均一に加熱するために、坩堝との接点がなるべく少ないことが望ましい。特に、輻射熱により温度低下しやすい坩堝上部において、支持機構との接点を少なくすることで、坩堝の温度が、接点から低下するのを防止することができる。   In the conventional configuration, there is no description about a method for supporting a crucible containing an evaporating material. It is desirable that the mechanism for supporting the crucible containing the vapor deposition material has as few contacts with the crucible as possible in order to uniformly heat the vapor deposition material. In particular, by reducing the number of contacts with the support mechanism in the upper part of the crucible that is likely to decrease in temperature due to radiant heat, the temperature of the crucible can be prevented from decreasing from the contacts.

しかしながら、坩堝上部を固定せずに配置した場合、蒸着材料が通過する開口の位置を微調整することが難しい。開口の位置は、被蒸着体に蒸着する膜厚の均一性に影響するため、位置を制御することが重要になる。   However, when the crucible upper part is arranged without being fixed, it is difficult to finely adjust the position of the opening through which the vapor deposition material passes. Since the position of the opening affects the uniformity of the film thickness to be deposited on the deposition target, it is important to control the position.

本発明は、蒸発源装置において、温度の低下を抑制しつつ、蒸着材料が通過する開口の位置制御を行うことができる蒸発源装置を提供することを目的とする。   An object of the present invention is to provide an evaporation source device capable of controlling the position of an opening through which a vapor deposition material passes while suppressing a decrease in temperature in the evaporation source device.

上記目的のため、本発明は以下の構成を採用する。すなわち、
蒸着材料が収容される、開口を有する容器と、
前記容器を加熱する加熱手段と、
前記容器と、前記加熱手段とを収容する収容部材と、を有する蒸発源装置であって、
前記収容部材は、容器支持部と、側面部と、位置決め部と、を含み、
前記容器支持部は、前記容器の底部の外側の部を第1の方向に支持し、
前記位置決め部は、前記側面部から前記容器に対して棒状又は板状に突出して設けられており、前記収容部材に対する前記容器の、前記第1の方向と交差する第2の方向、並びに、前記第1の方向及び前記第2の方向と交差する第3の方向、の少なくとも一方における位置決めを行い、
前記容器は、前記収容部材の前記側面部と接触しない
ことを特徴とする蒸発源装置である。
本発明はまた、以下の構成を採用する。すなわち、
蒸着材料が収容される、開口を有する容器と、
前記容器を加熱する加熱手段と、
前記容器と、前記加熱手段とを収容する収容部材と、を有する蒸発源装置であって、
前記収容部材は、容器支持部を含み、
前記容器支持部は、前記容器の底部の外側の部を第1の方向に支持し、
前記容器は、材料収容部と、位置決め部を含み、
前記位置決め部は、前記材料収容部の外側面から前記収容部材に対して棒状又は板状に突出して設けられており、前記収容部材に対する前記容器の、前記第1の方向と交差する第2の方向、並びに、前記第1の方向及び前記第2の方向と交差する第3の方向、の少な
くとも一方における位置決めを行い、
前記容器は、前記収容部材の側面部と接触しない
ことを特徴とする蒸発源装置である。
本発明はまた、以下の構成を採用する。すなわち、
蒸着材料が収容される、開口を有する容器と、
前記容器を加熱する加熱手段と、
前記容器と、前記加熱手段とを収容する収容部材と、を有する蒸発源装置であって、
前記収容部材は、容器支持部と、側面部と、位置決め部と、を含み、
前記容器支持部は、前記容器の底部の外側の少なくとも一部を第1の方向に支持し、
前記位置決め部は、前記側面部から前記容器に対して棒状又は板状に突出して設けられており、前記収容部材に対する前記容器の、前記第1の方向と交差する第2の方向、並びに、前記第1の方向及び前記第2の方向と交差する第3の方向、の少なくとも一方における位置決めを行い、
前記位置決め部は、前記容器に対して、点接触又は線接触している
ことを特徴とする蒸発源装置である。
本発明はまた、以下の構成を採用する。すなわち、
蒸着材料が収容される、開口を有する容器と、
前記容器を加熱する加熱手段と、
前記容器と、前記加熱手段とを収容する収容部材と、を有する蒸発源装置であって、
前記収容部材は、容器支持部を含み、
前記容器支持部は、前記容器の底部の外側の少なくとも一部を第1の方向に支持し、
前記容器は、材料収容部と、位置決め部を含み、
前記位置決め部は、前記材料収容部の外側面から前記収容部材に対して棒状又は板状に突出して設けられており、前記収容部材に対する前記容器の、前記第1の方向と交差する第2の方向、並びに、前記第1の方向及び前記第2の方向と交差する第3の方向、の少なくとも一方における位置決めを行い、
前記位置決め部は、前記収容部材に対して、点接触又は線接触している
ことを特徴とする蒸発源装置である。
For the above purpose, the present invention adopts the following configuration. That is,
A container having an opening for containing a vapor deposition material;
Heating means for heating the container;
An evaporation source device having the container and a housing member that houses the heating means,
The housing member includes a container support portion, a side surface portion, and a positioning portion,
The container support portion supports the part of the outer bottom of the container in a first direction,
The positioning portion is provided so as to protrude from the side surface portion in a rod shape or a plate shape with respect to the container, the container relative to the housing member, a second direction intersecting the first direction, and the third direction crossing the first direction and the second direction, have rows positioned in at least one of,
The evaporation source device is characterized in that the container does not come into contact with the side surface portion of the housing member .
The present invention also employs the following configuration. That is,
A container having an opening for containing a vapor deposition material;
Heating means for heating the container;
An evaporation source device having the container and a housing member that houses the heating means,
The housing member includes a container support,
The container support portion supports the part of the outer bottom of the container in a first direction,
The container includes a material storage portion and a positioning portion,
The positioning portion is provided so as to protrude in a rod shape or a plate shape from the outer surface of the material accommodating portion with respect to the accommodating member, and a second crossing the first direction of the container relative to the accommodating member. direction, and the first direction and a third direction crossing the second direction, have rows positioned in at least one of,
The evaporation source apparatus is characterized in that the container does not come into contact with a side surface portion of the housing member .
The present invention also employs the following configuration. That is,
A container having an opening for containing a vapor deposition material;
Heating means for heating the container;
An evaporation source device having the container and a housing member that houses the heating means,
The housing member includes a container support portion, a side surface portion, and a positioning portion,
The container support portion supports at least a part of the outside of the bottom of the container in a first direction;
The positioning portion is provided so as to protrude from the side surface portion in a rod shape or a plate shape with respect to the container, the second direction of the container relative to the housing member, the second direction intersecting the first direction, and the Positioning in at least one of a first direction and a third direction intersecting the second direction;
The positioning portion is in point contact or line contact with the container.
This is an evaporation source device.
The present invention also employs the following configuration. That is,
A container having an opening for containing a vapor deposition material;
Heating means for heating the container;
An evaporation source device having the container and a housing member that houses the heating means,
The housing member includes a container support,
The container support portion supports at least a part of the outer side of the bottom of the container in a first direction;
The container includes a material storage portion and a positioning portion,
The positioning portion is provided so as to protrude in a rod shape or a plate shape from the outer surface of the material accommodating portion with respect to the accommodating member, and a second crossing the first direction of the container relative to the accommodating member. Positioning in at least one of a direction and a third direction intersecting the first direction and the second direction;
The positioning portion is in point contact or line contact with the housing member.
This is an evaporation source device.

本発明によれば、蒸発源装置の温度の低下を抑制しつつ、蒸着材料が通過する開口の位置制御を行うことができる。   ADVANTAGE OF THE INVENTION According to this invention, position control of the opening which vapor deposition material passes can be performed, suppressing the fall of the temperature of an evaporation source apparatus.

蒸着装置の模式的断面図Schematic cross-sectional view of vapor deposition equipment 実施例1の蒸発源装置の模式図Schematic diagram of the evaporation source device of Example 1 実施例2の蒸発源装置の模式図Schematic diagram of the evaporation source device of Example 2 実施例3の蒸発源装置の模式図Schematic diagram of the evaporation source device of Example 3 実施例4の蒸発源装置の模式図Schematic diagram of the evaporation source device of Example 4 実施例5の蒸発源装置の模式図Schematic diagram of the evaporation source device of Example 5 有機EL表示装置の説明図Illustration of organic EL display device

以下に図面を参照して、この発明を実施するための形態を、実施例に基づいて例示的に詳しく説明する。ただし、この実施の形態に記載されている構成部品の寸法、材質、形状それらの相対配置などは、発明が適用される装置の構成や各種条件により適宜変更されるべきものである。すなわち、この発明の範囲を以下の実施の形態に限定する趣旨のものではない。   DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention will be exemplarily described in detail with reference to the drawings. However, the dimensions, materials, shapes, and relative arrangements of the components described in this embodiment should be appropriately changed according to the configuration of the apparatus to which the invention is applied and various conditions. That is, it is not intended to limit the scope of the present invention to the following embodiments.

[実施例1]
<真空装置の概略構成>
図1は、蒸着装置(成膜装置)の構成を示す模式図である。蒸着装置は、チャンバ200を有する。チャンバ200の内部は、減圧雰囲気に維持される。真空チャンバ200の内部には、概略、被処理体設置台210によって保持された被処理体である基板10と、マスク220と、蒸発源装置240が設けられる。被処理体設置台210は、基板10を載置するための受け爪などの支持具や、基板を押圧保持するためのクランプなどの押圧具によって基板を保持する。
[Example 1]
<Schematic configuration of vacuum device>
FIG. 1 is a schematic diagram showing a configuration of a vapor deposition apparatus (film formation apparatus). The vapor deposition apparatus has a chamber 200. The interior of the chamber 200 is maintained in a reduced pressure atmosphere. Inside the vacuum chamber 200, there are roughly provided a substrate 10, which is a target object held by a target object mounting table 210, a mask 220, and an evaporation source device 240. The target object mounting table 210 holds the substrate by a support tool such as a receiving claw for placing the substrate 10 and a pressing tool such as a clamp for pressing and holding the substrate.

基板10は、搬送ロボット(不図示)により真空チャンバ200内に搬送されたのち、被処理体設置台210によって保持され、成膜時には水平面(XY平面)と平行となるよう固定される。マスク220は、基板10上に形成する所定パターンの薄膜パターンに対応する開口パターンをもつマスクであり、例えばメタルマスクである。成膜時にはマスク220の上に基板10が載置される。   After the substrate 10 is transferred into the vacuum chamber 200 by a transfer robot (not shown), the substrate 10 is held by the workpiece mounting table 210 and is fixed to be parallel to the horizontal plane (XY plane) during film formation. The mask 220 is a mask having an opening pattern corresponding to a predetermined thin film pattern formed on the substrate 10, for example, a metal mask. The substrate 10 is placed on the mask 220 during film formation.

真空チャンバ200内には、その他、基板10の温度上昇を抑制する冷却板(不図示)を備えていてもよい。また、真空チャンバの上には、基板10のアライメントのための機構、例えばX方向またはY方向のアクチュエータや、基板保持のためのクランプ機構用アクチュエータなどの駆動手段や、基板10やマスク220を撮像するカメラ(いずれも不図示)を備えていてもよい。   In addition, a cooling plate (not shown) that suppresses the temperature rise of the substrate 10 may be provided in the vacuum chamber 200. Further, on the vacuum chamber, a mechanism for alignment of the substrate 10, for example, a driving means such as an actuator in the X direction or the Y direction, an actuator for a clamp mechanism for holding the substrate, the substrate 10 or the mask 220 is imaged. A camera (both not shown) may be provided.

蒸発源装置240は、内部に蒸着材料242が収容される、開口を有する容器244と、容器244の加熱を行うためのヒータ246(加熱手段)と、容器244とヒータ246を収容するため収容部材248を備える。図1ではヒータ246は容器244の外側面に、収容部材248は、容器244の外側面と底部の外側に対向するように設けられているが、後述するように、これ以外の配置も可能である。その他に、シャッタ、膜厚モニタなどを備えていてよい(いずれも不図示)。これらの各構成要素については、後ほど詳しく述べる。また、成膜を一様に行うために蒸発源装置240を移動させる、蒸発源駆動機構250を備えてもよい。なお、図1における蒸発源装置240の各構成要素の形状、位置関係、サイズ比は例示にすぎない。   The evaporation source device 240 includes a container 244 having an opening in which an evaporation material 242 is accommodated, a heater 246 (heating means) for heating the container 244, and a housing member for housing the container 244 and the heater 246. 248. In FIG. 1, the heater 246 is provided on the outer surface of the container 244, and the housing member 248 is provided so as to face the outer surface of the container 244 and the outer side of the bottom, but other arrangements are possible as will be described later. is there. In addition, a shutter, a film thickness monitor, and the like may be provided (all not shown). Each of these components will be described in detail later. Further, an evaporation source driving mechanism 250 that moves the evaporation source device 240 may be provided in order to perform film formation uniformly. In addition, the shape, positional relationship, and size ratio of each component of the evaporation source device 240 in FIG. 1 are merely examples.

容器244の材質としては、例えばセラミック、金属、カーボン材料などが知られているが、これに限定されず、蒸着材料242の物性やヒータ246による加熱温度との関係で好ましいものを用いる。ヒータ246としては、例えばシースヒータや金属ワイヤ線などの抵抗加熱式のヒータが知られているが、これに限定されず、蒸着材料242を蒸発させる加熱性能があればよい。またヒータの形状についても、図1のようなワイヤ状のほか、プレート状、メッシュ状など任意の形状を採用できる。収容部材248は熱効率を高める保温材(断熱材)により形成され、例えば金属等を利用できるが、これに限定されない。   As the material of the container 244, for example, ceramic, metal, carbon material, and the like are known, but the material is not limited thereto, and a preferable material is used in relation to the physical properties of the vapor deposition material 242 and the heating temperature by the heater 246. As the heater 246, for example, a resistance heating type heater such as a sheath heater or a metal wire is known, but is not limited to this, and any heating performance that evaporates the vapor deposition material 242 may be used. In addition to the wire shape as shown in FIG. 1, any shape such as a plate shape or a mesh shape can be adopted as the shape of the heater. The housing member 248 is formed of a heat insulating material (heat insulating material) that enhances thermal efficiency, and for example, metal can be used, but is not limited thereto.

蒸着装置は制御部270を有する。制御部270は、蒸発源装置240の制御、例えば加熱の開始や終了のタイミング制御、温度制御、シャッタを設ける場合はその開閉タイミング制御、蒸発源駆動機構250を設ける場合はその移動制御などを行う。なお、複数の制御手段を組み合わせて制御部270を構成してもよい。複数の制御手段とは例えば、加熱制御手段、シャッタ制御手段、蒸発源駆動制御手段などである。また、ヒータ246を部位ごとに制御可能とした場合、それぞれの部位ごとに加熱制御手段を設けてもよい。制御部270は、基板10の搬送およびアライメント制御手段など、蒸発源装置240以外の機構の制御手段を兼ねていてもよい。   The vapor deposition apparatus has a control unit 270. The control unit 270 performs control of the evaporation source device 240, for example, heating start and end timing control, temperature control, opening / closing timing control when a shutter is provided, movement control when an evaporation source drive mechanism 250 is provided, and the like. . The control unit 270 may be configured by combining a plurality of control means. Examples of the plurality of control means include a heating control means, a shutter control means, and an evaporation source drive control means. In addition, when the heater 246 can be controlled for each part, a heating control unit may be provided for each part. The control unit 270 may also serve as a control unit for a mechanism other than the evaporation source device 240, such as a transport and alignment control unit for the substrate 10.

制御部270は、例えば、プロセッサ、メモリ、ストレージ、I/O、UIなどを有するコンピュータにより構成可能である。この場合、制御部270の機能は、メモリ又はストレージに記憶されたプログラムをプロセッサが実行することにより実現される。コンピュータとしては、汎用のコンピュータを用いてもよいし、組込型のコンピュータ又はPLC(programmable logic controller)を用いてもよい。あるいは、制御部270の機能の一部又は全部をASICやFPGAのような回路で構成してもよい。なお、蒸着装置ごとに制御部270が設けられていてもよいし、1つの制御部270が複数の蒸着装置を制御してもよい。   The control unit 270 can be configured by a computer having a processor, memory, storage, I / O, UI, and the like, for example. In this case, the function of the control unit 270 is realized by the processor executing a program stored in the memory or storage. As the computer, a general-purpose computer may be used, or a built-in computer or a PLC (programmable logic controller) may be used. Alternatively, some or all of the functions of the control unit 270 may be configured by a circuit such as an ASIC or FPGA. In addition, the control part 270 may be provided for every vapor deposition apparatus, and the one control part 270 may control a several vapor deposition apparatus.

容器244内部に蒸着材料242が収容され、基板10のマスク220への載置やアライメントなどの準備が完了すると、制御部270の制御によってヒータ246が動作を開始し、蒸着材料242が加熱される。温度が十分に高まると、蒸着材料242が蒸発して基板10の表面に付着し、膜を形成する。複数の容器に別種の蒸着材料を収容しておくことで共蒸着も可能である。形成された膜を膜厚モニタ(不図示)等で測定しながら制御を行うことで、基板上に所望の厚さを持った膜が形成される。一様な厚さで成膜するために、例えば、基板10を回転させたり、蒸発源駆動機構250により蒸発源装置240を移動させたりしながら蒸着を行ってもよい。また、基板10の大きさによっては、複数の蒸発源装置を並行して加熱することも好ましい。容器244の形状は任意である。また、蒸発源の種類も、点状の蒸発源、線状の蒸発源、面状の蒸発源のいずれでも構わない。   When the vapor deposition material 242 is accommodated in the container 244 and preparations such as placement of the substrate 10 on the mask 220 and alignment are completed, the heater 246 starts operating under the control of the control unit 270 and the vapor deposition material 242 is heated. . When the temperature rises sufficiently, the vapor deposition material 242 evaporates and adheres to the surface of the substrate 10 to form a film. Co-evaporation is also possible by storing different types of vapor deposition materials in a plurality of containers. By controlling the formed film while measuring it with a film thickness monitor (not shown) or the like, a film having a desired thickness is formed on the substrate. In order to form a film with a uniform thickness, for example, vapor deposition may be performed while rotating the substrate 10 or moving the evaporation source device 240 by the evaporation source driving mechanism 250. Further, depending on the size of the substrate 10, it is also preferable to heat a plurality of evaporation source devices in parallel. The shape of the container 244 is arbitrary. The type of the evaporation source may be any of a point-like evaporation source, a linear evaporation source, and a planar evaporation source.

後述するように、ある種類の蒸着材料が成膜された基板上に別種の蒸着材料を成膜することで、複層構造を形成できる。その場合、容器内の蒸着材料を交換したり、容器自体を別種の蒸着材料が格納されたものに交換したりしてもよい。また、真空チャンバ内に複数の蒸発源装置を設けて交換しながら用いてもよいし、基板10を現在の蒸着装置から搬出し、別種の蒸着材料が収納された蒸発源装置を備える他の蒸着装置に搬入してもよい。   As will be described later, a multilayer structure can be formed by depositing another type of vapor deposition material on a substrate on which a certain type of vapor deposition material is deposited. In that case, the vapor deposition material in the container may be exchanged, or the container itself may be exchanged for one in which another kind of vapor deposition material is stored. In addition, a plurality of evaporation source devices may be provided in the vacuum chamber and replaced, or another substrate having the evaporation source device in which the substrate 10 is unloaded from the current evaporation device and another type of evaporation material is stored is provided. It may be carried into the device.

<蒸発源装置の詳細構成>
図2(a)は、本実施形態の蒸発源装置240の構成を説明するための概略断面図である。図2(b)、(c)は、蒸発源装置240の概略上面図である。図1と共通する構成については同じ符号を付し、説明を簡略化する。本実施例の収容部材248は、側面部248aと位置決め部248c、容器支持部248bから構成される。
<Detailed configuration of evaporation source device>
FIG. 2A is a schematic cross-sectional view for explaining the configuration of the evaporation source device 240 of the present embodiment. 2B and 2C are schematic top views of the evaporation source device 240. FIG. Constituent elements common to those in FIG. The housing member 248 of this embodiment includes a side part 248a, a positioning part 248c, and a container support part 248b.

側面部248aは、容器244の外側面に対向するように設けられる。また、容器244と側面部248aの間にヒータ246が配置される。側面部248aは、ヒータ246から容器244への加熱効率を高めるために配置される。   The side surface portion 248 a is provided so as to face the outer surface of the container 244. A heater 246 is disposed between the container 244 and the side surface portion 248a. The side surface portion 248 a is disposed in order to increase the heating efficiency from the heater 246 to the container 244.

容器支持部248bは、容器244の底部を支持している。図2(a)では、容器支持部248bが凸状になっており、容器244の底部の外側の一部を支持している。底部の外側の一部を支持する形状により、容器244と容器支持部248bの接触領域が少なくなり、容器244の温度の低下を少なくすることができる。また、容器支持部248bは、側面部248aと同様に、ヒータ246から容器244への加熱効率を高める効果がある。   The container support part 248 b supports the bottom part of the container 244. In FIG. 2A, the container support portion 248 b has a convex shape and supports a part of the outside of the bottom portion of the container 244. By the shape that supports a part of the outside of the bottom, the contact area between the container 244 and the container support 248b is reduced, and the temperature drop of the container 244 can be reduced. Moreover, the container support part 248b has the effect of increasing the heating efficiency from the heater 246 to the container 244, similarly to the side surface part 248a.

位置決め部248cは、側面部248aから容器244の外側面方向へ突出して設けられる。位置決め部248cを設けることにより、容器244の位置を所定の範囲に定めることができる。容器の位置の許容範囲は、各々の状況で異なるが、例として容器の直径を1とした場合、位置決め部248cにより定められる、容器の位置の許容範囲の直径は、1.01〜1.05と定めることができる。また、位置決め部248cを設けることにより、容器支持部248b、側面部248aと同様に、ヒータ246から容器244への加熱効率を高める効果もある。   The positioning portion 248c is provided to protrude from the side surface portion 248a toward the outer surface of the container 244. By providing the positioning portion 248c, the position of the container 244 can be set within a predetermined range. The allowable range of the position of the container is different in each situation. For example, when the diameter of the container is 1, the diameter of the allowable range of the position of the container determined by the positioning unit 248c is 1.01 to 1.05. Can be determined. Further, by providing the positioning portion 248c, there is an effect of increasing the heating efficiency from the heater 246 to the container 244, similarly to the container support portion 248b and the side surface portion 248a.

位置決め部248cの高さは、特に限定されない。しかし、容器244の開口が位置する高さと同じ高さに設けることで、容器支持部248bと容器244の底部の外側との接触領域が少なくても、容器244の位置を正確に定めることができる。   The height of the positioning part 248c is not particularly limited. However, by providing the container 244 at the same height as the opening, the position of the container 244 can be accurately determined even if the contact area between the container support 248b and the outside of the bottom of the container 244 is small. .

位置決め部248cの形状例として、図2(b)に、側面部248aから板状に突出して設けられている例を示す。図2(c)では、位置決め部248cが、側面部248aから棒状に4つ突出して設けられている例を示す。棒状の位置決め部248cの個数は限定されない。位置決め部248cの形状として、この2例に限らず、板状の位置決め部248cが複数設けられていても良いし、側面部248aとの接続部は板状で容器244への先端部は棒状になっていても良い。また、板状、棒状の定義として、位置決め部248cが容器244に対して接する場合、接点が線接触となる位置決め部248cが板状であり、点接触となる位置決め部248cが棒状とする。   As an example of the shape of the positioning portion 248c, FIG. 2B shows an example in which the positioning portion 248c is provided so as to protrude from the side surface portion 248a. FIG. 2C shows an example in which four positioning portions 248c are provided so as to protrude from the side surface portion 248a in a rod shape. The number of rod-shaped positioning portions 248c is not limited. The shape of the positioning portion 248c is not limited to these two examples, and a plurality of plate-like positioning portions 248c may be provided, the connecting portion to the side surface portion 248a is plate-like, and the tip portion to the container 244 is rod-like. It may be. In addition, as a definition of a plate shape or a rod shape, when the positioning portion 248c is in contact with the container 244, the positioning portion 248c whose contact is a line contact is a plate shape, and the positioning portion 248c which is a point contact is a rod shape.

収容部材248の側面部248a、容器支持部248b、位置決め部248cは、図2(a)では、一体に記載されているが、別の機構を接続して構成しても良い。材質は、放射率が低く、かつ高温に耐えられるものが望ましく、具体的にはモリブデン、タンタル等があげられる。   Although the side surface portion 248a, the container support portion 248b, and the positioning portion 248c of the housing member 248 are integrally illustrated in FIG. 2A, they may be configured by connecting other mechanisms. It is desirable that the material has a low emissivity and can withstand high temperatures, and specific examples include molybdenum and tantalum.

また、図には記載しないが、容器244に、位置決め部248cに対して棒状又は板状に突出する突出部を設けてもよい。   Although not shown in the drawing, the container 244 may be provided with a protruding portion that protrudes in a rod shape or a plate shape with respect to the positioning portion 248c.

[実施例2]
本実施例では、容器244に位置決め部を設ける構成について示す。他の実施例と共通する構成については同じ符号を付し、説明を簡略化する。図3(a)に示すように、容器244は、材料収容部244aと位置決め部244bから構成される。収容部材248は、側面部248aと容器支持部248bから構成される。
[Example 2]
In this embodiment, a configuration in which a positioning portion is provided in the container 244 is shown. Constituent elements common to the other embodiments are denoted by the same reference numerals, and the description is simplified. As shown in FIG. 3A, the container 244 includes a material storage portion 244a and a positioning portion 244b. The housing member 248 includes a side surface portion 248a and a container support portion 248b.

位置決め部244bは、容器244の材料収容部244aから収容部材248の側面部248aの方向へ突出して設けられる。位置決め部244bを設けることにより、容器244の位置を実施例1と同様に、所定の範囲に定めることができる。また、位置決め部2
44bを設けることにより、実施例1と同様に、ヒータ246から容器244への加熱効率を高める効果もある。
The positioning portion 244 b is provided so as to protrude from the material storage portion 244 a of the container 244 toward the side surface portion 248 a of the storage member 248. By providing the positioning portion 244b, the position of the container 244 can be set within a predetermined range as in the first embodiment. In addition, positioning part 2
The provision of 44b also has the effect of increasing the heating efficiency from the heater 246 to the container 244, as in the first embodiment.

位置決め部244bの高さは、特に限定されない。しかし、容器244の開口が位置する高さと同じ高さに設けることで、容器支持部248bと容器244の底部の外側との接触領域が少なくても、容器244の位置を正確に定めることができる。   The height of the positioning part 244b is not particularly limited. However, by providing the container 244 at the same height as the opening, the position of the container 244 can be accurately determined even if the contact area between the container support 248b and the outside of the bottom of the container 244 is small. .

位置決め部244bの形状例として、図3(b)に、材料収容部244aから板状に突出して設けられている例を示す。図3(c)では、位置決め部244bが、材料収容部244aから棒状に4つ突出して設けられている例を示す。棒状の位置決め部244bの個数は限定されない。位置決め部244bの形状として、この2例に限らず、板状の位置決め部244bが複数設けられていても良いし、材料収容部244aとの接続部は板状で収容部材248への先端部は棒状になっていても良い。また、板状、棒状の定義として、位置決め部244bが収容部材248に対して接する場合、接点が線接触となる位置決め部244bが板状であり、点接触となる位置決め部244bが棒状とする。   As an example of the shape of the positioning portion 244b, FIG. 3B shows an example in which the positioning portion 244b is provided so as to protrude from the material accommodating portion 244a. FIG. 3C shows an example in which four positioning portions 244b are provided so as to protrude in a rod shape from the material accommodating portion 244a. The number of rod-shaped positioning portions 244b is not limited. The shape of the positioning portion 244b is not limited to these two examples, and a plurality of plate-like positioning portions 244b may be provided, and the connection portion with the material storage portion 244a is plate-shaped, and the distal end portion to the storage member 248 is It may be rod-shaped. In addition, as a definition of a plate shape or a rod shape, when the positioning portion 244b is in contact with the housing member 248, the positioning portion 244b where the contact is a line contact is a plate shape, and the positioning portion 244b where the contact is a point contact is a rod shape.

収容部材248の側面部248aと容器支持部248b、及び、容器244の材料収容部244aと位置決め部244bは、夫々、図3(a)では、一体に記載されているが、別の機構を接続して構成しても良い。   The side surface portion 248a and the container support portion 248b of the storage member 248 and the material storage portion 244a and the positioning portion 244b of the container 244 are integrally described in FIG. May be configured.

また、図には記載しないが、収容部材248に、位置決め部244bに対して棒状又は板状に突出する突出部を設けてもよい。   Although not shown in the drawing, the housing member 248 may be provided with a protruding portion that protrudes in a rod shape or a plate shape with respect to the positioning portion 244b.

[実施例3]
本実施例では、収容部材248に位置決め部を、容器244に突出部および蓋部を設ける構成について示す。他の実施例と共通する構成については同じ符号を付し、説明を簡略化する。図4に示すように、容器244は、材料収容部244aと位置決め部244bから構成される。収容部材248は、側面部248aと容器支持部248b、突出部248dから構成される。
[Example 3]
In this embodiment, a configuration in which a positioning portion is provided in the housing member 248 and a protruding portion and a lid portion are provided in the container 244 is shown. Constituent elements common to the other embodiments are denoted by the same reference numerals, and the description is simplified. As shown in FIG. 4, the container 244 includes a material storage portion 244a and a positioning portion 244b. The housing member 248 includes a side surface portion 248a, a container support portion 248b, and a protruding portion 248d.

位置決め部244bは、容器244の材料収容部244aから突出して設けられる。突出部248dは、収容部材248から突出して設けられる。位置決め部244bは、突出部248dに向けて設けられる。また、突出部248dは、位置決め部244bに向けて設けられる。このように、突出部248dと位置決め部244bは、お互いの方向に向けて設けられ、実施例1、2と同様に、容器244の位置を所定の範囲に定めることができる。また、位置決め部244b及び突出部248dを設けることにより、実施例1、2と同様に、ヒータ246から容器244への加熱効率を高める効果もある。   The positioning portion 244b is provided to protrude from the material accommodating portion 244a of the container 244. The protruding portion 248d is provided to protrude from the housing member 248. The positioning portion 244b is provided toward the protruding portion 248d. The protruding portion 248d is provided toward the positioning portion 244b. As described above, the projecting portion 248d and the positioning portion 244b are provided toward each other, and the position of the container 244 can be set within a predetermined range as in the first and second embodiments. Further, by providing the positioning portion 244b and the protruding portion 248d, there is an effect of increasing the heating efficiency from the heater 246 to the container 244 as in the first and second embodiments.

容器244の開口上に、その開口を覆うように、昇華又は気化された蒸着材料が通過する開口を有する蓋部244cを設けても良い。この場合、蓋部244cの外周端部は、容器244の位置決め部244bと同様に、収容部材248の突出部248dに対して突出して設けられる。蓋部244cをこのような構成にすることで、蒸着材料の飛散方向に指向性を持たせることができ、かつ蓋部244cに設けられた開口をより正確に位置決めすることができるという効果を奏する。   A lid 244c having an opening through which a vapor deposition material that has been sublimated or vaporized passes may be provided on the opening of the container 244 so as to cover the opening. In this case, the outer peripheral end portion of the lid portion 244c is provided so as to protrude with respect to the protruding portion 248d of the housing member 248, similarly to the positioning portion 244b of the container 244. By configuring the lid 244c in such a configuration, there is an effect that directivity can be given in the scattering direction of the vapor deposition material, and the opening provided in the lid 244c can be more accurately positioned. .

本実施例では、収容部材248に突出部248dを設ける構成としたが、突出部248dを設けない構成とし、位置決め部244b及び蓋部244cの外周端部が、収容部材248の側面部248aに対して突出して設けられている構成としてもよい。その場合も、上記と同様の効果を奏する。   In the present embodiment, the housing member 248 is provided with the protruding portion 248d, but the protruding portion 248d is not provided, and the outer peripheral end portions of the positioning portion 244b and the lid portion 244c are relative to the side surface portion 248a of the housing member 248. It is good also as a structure protruding and provided. In such a case, the same effect as described above can be obtained.

[実施例4]
本実施例では、収容部材248の下部に傾き調整機構を設ける構成について示す。他の実施例と共通する構成については同じ符号を付し、説明を簡略化する。図5(a)に示すように、収容部材248は、チャンバ200内部に配置される台座320の上に設置されている。台座320は、ねじ穴を有しており、ねじで構成される傾き調整機構322が、そのねじ穴内に配置されている。
[Example 4]
In this embodiment, a configuration in which an inclination adjusting mechanism is provided below the housing member 248 is shown. Constituent elements common to the other embodiments are denoted by the same reference numerals, and the description is simplified. As shown in FIG. 5A, the housing member 248 is installed on a pedestal 320 disposed inside the chamber 200. The pedestal 320 has a screw hole, and an inclination adjusting mechanism 322 made of a screw is disposed in the screw hole.

傾き調整機構322は、台座320の下面から上面に向けて配置されており、台座320の上面より高い位置に傾き調整機構322のねじ先端を配置することで、台座320上に配置された収容部材248を傾けることができる。台座320は、図5(b)に示すように、傾き調整機構322を複数有している。これらの傾き調整機構322を調整することによって、収容部材248の傾き方向を調整する。図5(b)は、傾き調整機構322を有する台座320の概略平面図である。図5(b)では、傾き調整機構322を6点としているが、これに限定されない。   The tilt adjustment mechanism 322 is disposed from the lower surface of the pedestal 320 toward the upper surface, and the screw member of the tilt adjustment mechanism 322 is disposed at a position higher than the upper surface of the pedestal 320, thereby accommodating the member disposed on the pedestal 320. 248 can be tilted. As shown in FIG. 5B, the pedestal 320 has a plurality of tilt adjustment mechanisms 322. By adjusting these tilt adjustment mechanisms 322, the tilt direction of the housing member 248 is adjusted. FIG. 5B is a schematic plan view of the pedestal 320 having the tilt adjustment mechanism 322. In FIG. 5B, the tilt adjustment mechanism 322 has six points, but is not limited thereto.

本実施例の傾き調整機構322を設けることによって、容器244が位置決め部248cにより定められた容器の位置の許容範囲内に配置された後でも、容器の位置の許容範囲内での配置誤差を調整することができる。また、傾き調整機構322について、本実施例では、ねじによる傾き調整機構を記載したが、台座320そのものが傾く機構としても良い。   By providing the tilt adjustment mechanism 322 of the present embodiment, the placement error within the allowable range of the container position is adjusted even after the container 244 is positioned within the allowable range of the container position determined by the positioning portion 248c. can do. In the present embodiment, the tilt adjustment mechanism 322 using a screw is described as the tilt adjustment mechanism 322. However, the pedestal 320 itself may be tilted.

[実施例5]
上記各実施例は、それぞれの構成を可能な限り互いに組み合わせることができる。図6は、その一例である。実施例5では、実施例3の蓋部244cと突出部248dを有する構成と、実施例4の傾き調整機構322を有する構成としている。更に、加熱効率を上げるため、側面部248aの外周に、第1の遮蔽板420を設け、材料収容部244a底部の外側にも、第2の遮蔽板422を設けている。ヒータ246は、上部と下部に分けられ、各々を個別に制御することが可能であり、より冷えやすい材料収容部244a上部をより高温に制御することができる。第1の遮蔽板420の外部には、ヒータ246の熱が外部に及ばないように、冷却用の配管440が設けられている。上記構成とすることで、より蒸発源装置の温度の低下を防止し、蒸着材料が通過する開口の位置制御を行うことができる構成としている。他の実施例と共通する構成については同じ符号を付した。本実施例で特に説明しない事項は、上記実施例と同様である。
[Example 5]
The above embodiments can be combined with each other as much as possible. FIG. 6 shows an example. In the fifth embodiment, the configuration having the lid portion 244c and the protruding portion 248d of the third embodiment and the configuration having the inclination adjusting mechanism 322 of the fourth embodiment are used. Further, in order to increase the heating efficiency, a first shielding plate 420 is provided on the outer periphery of the side surface portion 248a, and a second shielding plate 422 is also provided on the outer side of the bottom of the material accommodating portion 244a. The heater 246 is divided into an upper part and a lower part, each of which can be controlled individually, and the upper part of the material accommodating part 244a that is easier to cool can be controlled to a higher temperature. A cooling pipe 440 is provided outside the first shielding plate 420 so that the heat of the heater 246 does not reach the outside. By setting it as the said structure, it is set as the structure which can prevent the fall of the temperature of an evaporation source apparatus more, and can perform position control of the opening which vapor deposition material passes. Constituent elements common to the other embodiments are denoted by the same reference numerals. Matters not specifically described in the present embodiment are the same as those in the above embodiment.

[実施例6]
<有機電子デバイスの製造方法の具体例>
本実施例では、蒸発源装置を備える蒸着装置を用いた有機電子デバイスの製造方法の一例を説明する。以下、有機電子デバイスの例として有機EL表示装置を取り上げ、その構成及び製造方法を例示する。まず、製造する有機EL表示装置について説明する。図7(a)は有機EL表示装置60の全体図、図7(b)は1画素の断面構造を表している。本実施形態の蒸着装置が備える蒸発源装置240(図1)としては、上記の各実施形態にいずれかに記載の装置を用いる。
[Example 6]
<Specific Example of Manufacturing Method of Organic Electronic Device>
In this embodiment, an example of a method for manufacturing an organic electronic device using a vapor deposition apparatus including an evaporation source apparatus will be described. Hereinafter, an organic EL display device will be taken up as an example of an organic electronic device, and its configuration and manufacturing method will be exemplified. First, an organic EL display device to be manufactured will be described. FIG. 7A shows an overall view of the organic EL display device 60, and FIG. 7B shows a cross-sectional structure of one pixel. As the evaporation source device 240 (FIG. 1) provided in the vapor deposition device of this embodiment, the device described in any of the above embodiments is used.

図7(a)に示すように、有機EL表示装置60の表示領域61には、発光素子を複数備える画素62がマトリクス状に複数配置されている。詳細は後で説明するが、発光素子のそれぞれは、一対の電極に挟まれた有機層を備えた構造を有している。なお、ここでいう画素とは、表示領域61において所望の色の表示を可能とする最小単位を指している。本図の有機EL表示装置の場合、互いに異なる発光を示す第1発光素子62R、第2発光素子62G、第3発光素子62Bの組合せにより画素62が構成されている。画素62は、赤色発光素子と緑色発光素子と青色発光素子の組合せで構成されることが多いが、黄色
発光素子とシアン発光素子と白色発光素子の組み合わせでもよく、少なくとも1色以上であれば特に制限されるものではない。
As shown in FIG. 7A, in the display region 61 of the organic EL display device 60, a plurality of pixels 62 including a plurality of light emitting elements are arranged in a matrix. Although details will be described later, each of the light-emitting elements has a structure including an organic layer sandwiched between a pair of electrodes. Here, the pixel refers to a minimum unit that enables display of a desired color in the display area 61. In the case of the organic EL display device of this figure, the pixel 62 is configured by a combination of the first light emitting element 62R, the second light emitting element 62G, and the third light emitting element 62B that emit different light. The pixel 62 is often composed of a combination of a red light emitting element, a green light emitting element, and a blue light emitting element, but may be a combination of a yellow light emitting element, a cyan light emitting element, and a white light emitting element. It is not limited.

図7(b)は、図7(a)のA−B線における部分断面模式図である。画素62は、被蒸着体である基板63上に、第1電極(陽極)64と、正孔輸送層65と、発光層66R,66G,66Bのいずれかと、電子輸送層67と、第2電極(陰極)68と、を備える有機EL素子を有している。これらのうち、正孔輸送層65、発光層66R,66G,66B、電子輸送層67が有機層に当たる。また、本実施形態では、発光層66Rは赤色を発する有機EL層、発光層66Gは緑色を発する有機EL層、発光層66Bは青色を発する有機EL層である。発光層66R,66G,66Bは、それぞれ赤色、緑色、青色を発する発光素子(有機EL素子と記述する場合もある)に対応するパターンに形成されている。また、第1電極64は、発光素子ごとに分離して形成されている。正孔輸送層65と電子輸送層67と第2電極68は、複数の発光素子62R,62G,62Bと共通で形成されていてもよいし、発光素子毎に形成されていてもよい。なお、第1電極64と第2電極68とが異物によってショートするのを防ぐために、第1電極64間に絶縁層69が設けられている。さらに、有機EL層は水分や酸素によって劣化するため、水分や酸素から有機EL素子を保護するための保護層70が設けられている。   FIG. 7B is a partial schematic cross-sectional view taken along the line AB of FIG. The pixel 62 includes a first electrode (anode) 64, a hole transport layer 65, one of the light emitting layers 66R, 66G, and 66B, an electron transport layer 67, and a second electrode on a substrate 63 that is a deposition target. (Cathode) 68. Among these, the hole transport layer 65, the light emitting layers 66R, 66G, and 66B, and the electron transport layer 67 correspond to the organic layer. In the present embodiment, the light emitting layer 66R is an organic EL layer that emits red, the light emitting layer 66G is an organic EL layer that emits green, and the light emitting layer 66B is an organic EL layer that emits blue. The light emitting layers 66R, 66G, and 66B are formed in patterns corresponding to light emitting elements that emit red, green, and blue (sometimes referred to as organic EL elements). The first electrode 64 is formed separately for each light emitting element. The hole transport layer 65, the electron transport layer 67, and the second electrode 68 may be formed in common with the plurality of light emitting elements 62R, 62G, and 62B, or may be formed for each light emitting element. Note that an insulating layer 69 is provided between the first electrodes 64 in order to prevent the first electrode 64 and the second electrode 68 from being short-circuited by foreign matter. Furthermore, since the organic EL layer is deteriorated by moisture and oxygen, a protective layer 70 for protecting the organic EL element from moisture and oxygen is provided.

次に、有機EL表示装置の製造方法の例について具体的に説明する。
まず、有機EL表示装置を駆動するための回路(不図示)および第1電極64が形成された基板63を準備する。
Next, an example of a method for manufacturing an organic EL display device will be specifically described.
First, a circuit (not shown) for driving the organic EL display device and a substrate 63 on which the first electrode 64 is formed are prepared.

第1電極64が形成された基板63の上にアクリル樹脂をスピンコートで形成し、アクリル樹脂をリソグラフィ法により、第1電極64が形成された部分に開口が形成されるようにパターニングし絶縁層69を形成する。この開口部が、発光素子が実際に発光する発光領域に相当する。   An acrylic resin is formed by spin coating on the substrate 63 on which the first electrode 64 is formed, and the acrylic resin is patterned by a lithography method so that an opening is formed in a portion where the first electrode 64 is formed. 69 is formed. This opening corresponds to a light emitting region where the light emitting element actually emits light.

絶縁層69がパターニングされた基板63を第1の蒸着装置に搬入し、被処理体設置台210にて基板を保持し、正孔輸送層65を、表示領域の第1電極64の上に共通する層として成膜する。正孔輸送層65は真空蒸着により成膜される。実際には正孔輸送層65は表示領域61よりも大きなサイズに形成されるため、高精細なマスクは不要である。ここで、本ステップでの成膜や、以下の各レイヤーの成膜において用いられる蒸着装置は、上記各実施形態のいずれかに記載された蒸発源装置を備えている。   The substrate 63 on which the insulating layer 69 is patterned is carried into the first vapor deposition apparatus, and the substrate is held on the processing object mounting base 210, and the hole transport layer 65 is shared on the first electrode 64 in the display region. A film is formed as a layer to be formed. The hole transport layer 65 is formed by vacuum deposition. Actually, since the hole transport layer 65 is formed in a size larger than the display region 61, a high-definition mask is not necessary. Here, the vapor deposition apparatus used in the film formation in this step and the following film formation of each layer includes the evaporation source apparatus described in any of the above embodiments.

次に、正孔輸送層65までが形成された基板63を第2の蒸着装置に搬入し、被処理体設置台210にて保持する。基板とマスクとのアライメントを行い、基板をマスクの上に載置し、基板63の赤色を発する素子を配置する部分に、赤色を発する発光層66Rを成膜する。本例によれば、マスクと基板とを良好に重ね合わせることができ、高精度な成膜を行うことができる。   Next, the substrate 63 on which the hole transport layer 65 is formed is carried into the second vapor deposition apparatus, and is held on the workpiece installation base 210. The substrate and the mask are aligned, the substrate is placed on the mask, and the light emitting layer 66R that emits red is formed on the portion of the substrate 63 where the element that emits red is disposed. According to this example, the mask and the substrate can be satisfactorily overlapped, and highly accurate film formation can be performed.

発光層66Rの成膜と同様に、第3の蒸着装置により緑色を発する発光層66Gを成膜し、さらに第4の蒸着装置により青色を発する発光層66Bを成膜する。発光層66R、66G、66Bの成膜が完了した後、第5の蒸着装置により表示領域61の全体に電子輸送層67を成膜する。電子輸送層65は、3色の発光層66R、66G、66Bに共通の層として形成される。   Similarly to the formation of the light emitting layer 66R, the light emitting layer 66G emitting green is formed by the third vapor deposition apparatus, and the light emitting layer 66B emitting blue is formed by the fourth vapor deposition apparatus. After the formation of the light emitting layers 66R, 66G, and 66B is completed, the electron transport layer 67 is formed over the entire display region 61 by the fifth vapor deposition apparatus. The electron transport layer 65 is formed as a layer common to the three-color light emitting layers 66R, 66G, and 66B.

電子輸送層65までが形成された基板をスパッタリング装置に移動し、第2電極68を成膜し、その後プラズマCVD装置に移動して保護層70を成膜して、有機EL表示装置60が完成する。   The substrate on which the electron transport layer 65 is formed is moved to the sputtering apparatus, the second electrode 68 is formed, and then the protective layer 70 is formed by moving to the plasma CVD apparatus, and the organic EL display device 60 is completed. To do.

絶縁層69がパターニングされた基板63を蒸着装置に搬入してから保護層70の成膜が完了するまでは、水分や酸素を含む雰囲気にさらしてしまうと、有機EL材料からなる発光層が水分や酸素によって劣化してしまうおそれがある。従って、本例において、蒸着装置間の基板の搬入搬出は、真空雰囲気または不活性ガス雰囲気の下で行われる。   When the substrate 63 patterned with the insulating layer 69 is carried into the vapor deposition apparatus and after the formation of the protective layer 70 is completed, if it is exposed to an atmosphere containing moisture or oxygen, the light-emitting layer made of the organic EL material becomes moisture. Or may be deteriorated by oxygen. Therefore, in this example, the carrying-in / carrying-out of the substrate between the vapor deposition apparatuses is performed under a vacuum atmosphere or an inert gas atmosphere.

このようにして得られた有機EL表示装置は、発光素子ごとに発光層が精度よく形成される。従って、上記製造方法を用いれば、発光層の位置ずれに起因する有機EL表示装置の不良の発生を抑制することができる。本実施形態に係る蒸着装置によれば、蒸発源装置の温度の低下を抑制しつつ、蒸着材料が通過する開口の位置制御を行うことができるため、良好な蒸着が可能となる。   In the organic EL display device thus obtained, a light emitting layer is accurately formed for each light emitting element. Therefore, if the manufacturing method is used, it is possible to suppress the occurrence of defects in the organic EL display device due to the displacement of the light emitting layer. According to the vapor deposition apparatus which concerns on this embodiment, since position control of the opening which vapor deposition material passes can be performed, suppressing the fall of the temperature of an evaporation source apparatus, favorable vapor deposition is attained.

240:蒸発源装置,244:容器,246:加熱手段,248:収容部材,248a:側面部,248b:容器支持部,248c:位置決め部   240: evaporation source device, 244: container, 246: heating means, 248: housing member, 248a: side surface portion, 248b: container support portion, 248c: positioning portion

Claims (16)

蒸着材料が収容される、開口を有する容器と、
前記容器を加熱する加熱手段と、
前記容器と、前記加熱手段とを収容する収容部材と、を有する蒸発源装置であって、
前記収容部材は、容器支持部と、側面部と、位置決め部と、を含み、
前記容器支持部は、前記容器の底部の外側の部を第1の方向に支持し、
前記位置決め部は、前記側面部から前記容器に対して棒状又は板状に突出して設けられており、前記収容部材に対する前記容器の、前記第1の方向と交差する第2の方向、並びに、前記第1の方向及び前記第2の方向と交差する第3の方向、の少なくとも一方における位置決めを行い、
前記容器は、前記収容部材の前記側面部と接触しない
ことを特徴とする蒸発源装置。
A container having an opening for containing a vapor deposition material;
Heating means for heating the container;
An evaporation source device having the container and a housing member that houses the heating means,
The housing member includes a container support portion, a side surface portion, and a positioning portion,
The container support portion supports the part of the outer bottom of the container in a first direction,
The positioning portion is provided so as to protrude from the side surface portion in a rod shape or a plate shape with respect to the container, the container relative to the housing member, a second direction intersecting the first direction, and the third direction crossing the first direction and the second direction, have rows positioned in at least one of,
The evaporation source apparatus , wherein the container does not come into contact with the side surface portion of the housing member .
前記位置決め部は、前記第2の方向及び前記第3の方向の少なくとも一方において前記容器に対して接触することで、前記収容部材に対する前記容器の位置決めを行う
ことを特徴とする請求項1に記載の蒸発源装置。
The said positioning part performs the positioning of the said container with respect to the said accommodating member by contacting with respect to the said container in at least one of the said 2nd direction and the said 3rd direction. Evaporation source device.
前記位置決め部は、前記容器に対して、点接触又は線接触している
ことを特徴とする請求項1又は2に記載の蒸発源装置。
The evaporation source apparatus according to claim 1, wherein the positioning unit is in point contact or line contact with the container.
前記容器は、前記容器の外側面から前記位置決め部に対して棒状又は板状に突出する突出部を有している
ことを特徴とする請求項1乃至3のいずれか一項に記載の蒸発源装置。
The evaporation source according to any one of claims 1 to 3, wherein the container has a protruding portion that protrudes in a rod shape or a plate shape with respect to the positioning portion from an outer surface of the container. apparatus.
前記位置決め部は、前記第2の方向及び前記第3の方向の少なくとも一方において前記突出部に対して接触することで、前記収容部材に対する前記容器の位置決めを行う
ことを特徴とする請求項4に記載の蒸発源装置。
The positioning unit performs positioning of the container with respect to the housing member by contacting the projection in at least one of the second direction and the third direction. The evaporation source apparatus as described.
蒸着材料が収容される、開口を有する容器と、
前記容器を加熱する加熱手段と、
前記容器と、前記加熱手段とを収容する収容部材と、を有する蒸発源装置であって、
前記収容部材は、容器支持部を含み、
前記容器支持部は、前記容器の底部の外側の部を第1の方向に支持し、
前記容器は、材料収容部と、位置決め部を含み、
前記位置決め部は、前記材料収容部の外側面から前記収容部材に対して棒状又は板状に突出して設けられており、前記収容部材に対する前記容器の、前記第1の方向と交差する第2の方向、並びに、前記第1の方向及び前記第2の方向と交差する第3の方向、の少なくとも一方における位置決めを行い、
前記容器は、前記収容部材の側面部と接触しない
ことを特徴とする蒸発源装置。
A container having an opening for containing a vapor deposition material;
Heating means for heating the container;
An evaporation source device having the container and a housing member that houses the heating means,
The housing member includes a container support,
The container support portion supports the part of the outer bottom of the container in a first direction,
The container includes a material storage portion and a positioning portion,
The positioning portion is provided so as to protrude in a rod shape or a plate shape from the outer surface of the material accommodating portion with respect to the accommodating member, and a second crossing the first direction of the container relative to the accommodating member. direction, and the first direction and a third direction crossing the second direction, have rows positioned in at least one of,
The evaporation source device according to claim 1, wherein the container does not come into contact with a side surface portion of the housing member .
前記位置決め部は、前記第2の方向及び前記第3の方向の少なくとも一方において前記収容部材に対して接触することで、前記収容部材に対する前記容器の位置決めを行う
ことを特徴とする請求項6に記載の蒸発源装置。
The positioning unit performs positioning of the container with respect to the housing member by contacting the housing member in at least one of the second direction and the third direction. The evaporation source apparatus as described.
前記位置決め部は、前記収容部材に対して、点接触又は線接触している
ことを特徴とする請求項6又は7に記載の蒸発源装置。
The evaporation source device according to claim 6, wherein the positioning portion is in point contact or line contact with the housing member.
前記収容部材は、前記収容部材の側面部から前記位置決め部に対して棒状又は板状に突出する突出部を有している
ことを特徴とする請求項6乃至8のいずれか一項に記載の蒸発源装置。
The said accommodating member has the protrusion part which protrudes in a rod shape or plate shape with respect to the said positioning part from the side part of the said accommodating member, The Claim 6 thru | or 8 characterized by the above-mentioned. Evaporation source device.
前記位置決め部は、前記第2の方向及び前記第3の方向の少なくとも一方において前記突出部に対して接触することで、前記収容部材に対する前記容器の位置決めを行う
ことを特徴とする請求項9に記載の蒸発源装置。
The positioning unit performs positioning of the container with respect to the housing member by contacting the projection in at least one of the second direction and the third direction. The evaporation source apparatus as described.
前記容器は、前記開口を覆う、昇華又は気化された蒸着材料が通過する開口を有する蓋部を含み、
前記蓋部の外周端部は、前記収容部材に対して突出して設けられている
ことを特徴とする請求項6乃至10のいずれか一項に記載の蒸発源装置。
The container includes a lid that covers the opening and has an opening through which sublimated or vaporized deposition material passes,
The evaporation source device according to claim 6, wherein an outer peripheral end portion of the lid portion is provided so as to protrude with respect to the housing member.
前記位置決め部は、前記第2の方向及び前記第3の方向の少なくとも一方において前記外周端部に対して接触することで、前記収容部材に対する前記容器の位置決めを行う
ことを特徴とする請求項11に記載の蒸発源装置。
12. The positioning unit performs positioning of the container with respect to the housing member by contacting the outer peripheral end in at least one of the second direction and the third direction. The evaporation source apparatus according to 1.
蒸着材料が収容される、開口を有する容器と、  A container having an opening for containing a vapor deposition material;
前記容器を加熱する加熱手段と、  Heating means for heating the container;
前記容器と、前記加熱手段とを収容する収容部材と、を有する蒸発源装置であって、  An evaporation source device having the container and a housing member that houses the heating means,
前記収容部材は、容器支持部と、側面部と、位置決め部と、を含み、  The housing member includes a container support portion, a side surface portion, and a positioning portion,
前記容器支持部は、前記容器の底部の外側の少なくとも一部を第1の方向に支持し、  The container support portion supports at least a part of the outside of the bottom of the container in a first direction;
前記位置決め部は、前記側面部から前記容器に対して棒状又は板状に突出して設けられており、前記収容部材に対する前記容器の、前記第1の方向と交差する第2の方向、並びに、前記第1の方向及び前記第2の方向と交差する第3の方向、の少なくとも一方における位置決めを行い、  The positioning portion is provided so as to protrude from the side surface portion in a rod shape or a plate shape with respect to the container, the container relative to the housing member, a second direction intersecting the first direction, and the Positioning in at least one of a first direction and a third direction intersecting the second direction;
前記位置決め部は、前記容器に対して、点接触又は線接触している  The positioning portion is in point contact or line contact with the container.
ことを特徴とする蒸発源装置。An evaporation source device characterized by that.
蒸着材料が収容される、開口を有する容器と、  A container having an opening for containing a vapor deposition material;
前記容器を加熱する加熱手段と、  Heating means for heating the container;
前記容器と、前記加熱手段とを収容する収容部材と、を有する蒸発源装置であって、  An evaporation source device having the container and a housing member that houses the heating means,
前記収容部材は、容器支持部を含み、  The housing member includes a container support,
前記容器支持部は、前記容器の底部の外側の少なくとも一部を第1の方向に支持し、  The container support portion supports at least a part of the outside of the bottom of the container in a first direction;
前記容器は、材料収容部と、位置決め部を含み、  The container includes a material storage portion and a positioning portion,
前記位置決め部は、前記材料収容部の外側面から前記収容部材に対して棒状又は板状に突出して設けられており、前記収容部材に対する前記容器の、前記第1の方向と交差する第2の方向、並びに、前記第1の方向及び前記第2の方向と交差する第3の方向、の少なくとも一方における位置決めを行い、  The positioning portion is provided so as to protrude in a rod shape or a plate shape from the outer surface of the material accommodating portion with respect to the accommodating member, and a second crossing the first direction of the container relative to the accommodating member. Positioning in at least one of a direction and a third direction intersecting the first direction and the second direction;
前記位置決め部は、前記収容部材に対して、点接触又は線接触している  The positioning portion is in point contact or line contact with the housing member.
ことを特徴とする蒸発源装置。An evaporation source device characterized by that.
前記位置決め部は、前記容器の開口が位置する高さと同じ高さに設けられている
ことを特徴とする請求項1乃至1のいずれか一項に記載の蒸発源装置。
The positioning unit, the evaporation source device according to any one of claims 1 to 1 4, characterized in that opening of the container is provided at the same height as the height of the position.
チャンバと、
前記チャンバの内部に配置された、被処理体が載置される被処理体設置台と、蒸発源装置が設置される台座と、
を有する蒸着装置であって、
前記蒸発源装置は、請求項1乃至1のいずれか一項に記載の蒸発源装置であり、
前記台座は、前記蒸発源装置の傾きを調整する傾き調整機構を有する
ことを特徴とする蒸着装置。
A chamber;
A target object mounting table on which a target object is placed, a pedestal on which an evaporation source device is installed;
A vapor deposition apparatus comprising:
The evaporation source device is an evaporation source apparatus according to any one of claims 1 to 1 5,
The pedestal has a tilt adjusting mechanism for adjusting a tilt of the evaporation source device.
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Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62169321A (en) * 1986-01-21 1987-07-25 Hitachi Ltd Vapor source for vacuum evaporization
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JP2007186787A (en) * 2005-12-14 2007-07-26 Hitachi Displays Ltd Vapor deposition pot, thin-film forming apparatus provided therewith and method for producing display device
JP5674431B2 (en) * 2010-11-17 2015-02-25 株式会社アルバック Thin film forming equipment
JP2012207263A (en) * 2011-03-29 2012-10-25 Hitachi High-Technologies Corp Vapor deposition method, and vapor deposition apparatus
JP5520871B2 (en) * 2011-03-31 2014-06-11 株式会社日立ハイテクノロジーズ Vapor deposition equipment
JP5557817B2 (en) * 2011-09-30 2014-07-23 株式会社日立ハイテクノロジーズ Evaporation source and film forming apparatus
JPWO2014174803A1 (en) * 2013-04-22 2017-02-23 株式会社Joled Method for manufacturing EL display device
JP2015067847A (en) 2013-09-27 2015-04-13 株式会社日立ハイテクファインシステムズ Vacuum vapor deposition device

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