JP6546810B2 - Inspection apparatus and inspection method - Google Patents

Description

  The present invention relates to an inspection apparatus and an inspection method.

  In the inspection process of the semiconductor device, for example, it may occur that the determination of the non-defective product or the defective product can not be performed because the necessary data can not be measured due to any cause. Conventionally, in such a case, the semiconductor device is removed from the manufacturing process and recovered, and after being managed as a stock of reinspection products, the inspection step (hereinafter referred to as reinspection) is executed again (for example, See Patent Document 1).

JP 2002-280276 A

  However, in the prior art as described above, when the reinspection is performed, for example, the inspection items are performed from the beginning to all the inspection items even for the semiconductor device in which a part of the inspection items is already performed. . Therefore, in the prior art as described above, there are cases where duplicate inspection items are executed and unnecessary inspection items that have already been executed are repeatedly executed. For example, with respect to inspection items that electrically stress the semiconductor device, such as a withstand voltage test and a PRSM (rated surge reverse power) test, the quality of the semiconductor device may be degraded if it is repeatedly performed. It is desirable to eliminate unnecessary inspection items in inspection.

  The present invention has been made to solve the above-mentioned problems, and an object thereof is to provide an inspection apparatus and an inspection method capable of performing reinspection while securing the quality of a semiconductor device.

In order to solve the above problems, an aspect of the present invention detects a detection unit that detects identification information for identifying a semiconductor device from the semiconductor device, and an inspection result of the semiconductor device inspected and inspected. Based on the inspection unit stored in the storage unit in association with each other and the identification information detected by the detection unit, it is determined whether the inspection has been performed on the semiconductor device in the past, and the inspection is performed in the past. If there are any, among the inspection items inspected by the inspection unit based on the inspection result corresponding to the identification information stored in the storage unit, at least one of the inspection items overlapping the inspection items inspected in the past and a control unit for executing the re-inspection the inspection unit excluding, wherein, among the inspection items to the overlapping, dividing the inspection item giving electrical stress to at least the semiconductor device An inspection device, characterized in that to execute the re-examined with the test unit.

  Further, according to one aspect of the present invention, in the above-described inspection apparatus, a plurality of the inspection units are provided, and the control unit is an inspection item in which all inspection items to be executed among the plurality of inspection units overlap. The inspection unit is excluded from re-examination, and the inspection unit having inspection items not inspected in the past is characterized in that re-inspection of all the inspection items is performed.

  Further, according to one aspect of the present invention, in the above-described inspection apparatus, a plurality of the inspection units are provided, and the control unit is an inspection item in which all inspection items to be executed among the plurality of inspection units overlap. With respect to the inspection unit in which the inspection unit is excluded from the reinspection and there are inspection items not inspected in the past, the overlapping inspection items are excluded from the reinspection and the inspection items not inspected in the past A re-examination is performed.

  In one embodiment of the present invention, in the inspection apparatus, the semiconductor device has a two-dimensional code indicating the identification information, and the detection unit detects the identification information based on the two-dimensional code. It is characterized by

In one embodiment of the present invention, a detection unit that detects, from the semiconductor device, identification information that identifies the semiconductor device, and the semiconductor device are inspected, and the inspection result and the identification information are associated and stored in the storage unit. And a method of inspecting an inspection apparatus including an inspection unit, wherein it is determined based on identification information detected by the detection unit whether inspection has been performed on the semiconductor device in the past, and inspection is performed in the past. At least one of the inspection items inspected by the inspection unit based on the inspection result corresponding to the identification information stored in the storage unit, when executed, at least the inspection items inspected in the past reexamined excluding one to be executed with the test unit, the one of the inspection items to duplicate, at least the semiconductor the measurement part retest excluding test items giving electrical stress to the apparatus Is a test method which is characterized in that to execute.

  According to the present invention, reinspection is performed excluding inspection items overlapping with inspection items inspected in the past, so reinspection can be performed while securing the quality of the semiconductor device.

It is a block diagram showing an example of composition of an inspection device by a 1st embodiment. FIG. 1 is an external view showing an example of a semiconductor device in a first embodiment. It is a figure which shows the example of data which the result memory | storage part in 1st Embodiment memorize | stores. It is a flowchart which shows an example of the test | inspection procedure of the test | inspection apparatus in 1st Embodiment. It is a flow chart which shows an example of reading of a two-dimensional code of an inspection device in a 1st embodiment, and inspection processing. It is a figure which shows the example of data which the result memory | storage part in 2nd Embodiment memorize | stores. It is a flow chart which shows an example of reading and inspection processing of a two-dimensional code of an inspection device in a 2nd embodiment.

Hereinafter, an inspection apparatus according to an embodiment of the present invention will be described with reference to the drawings.
First Embodiment
FIG. 1 is a block diagram showing a configuration example of an inspection apparatus 1 according to the present embodiment.
As shown in FIG. 1, the inspection apparatus 1 includes a code reader 11, a transport unit 12, a classification unit 13, a hub 14, a tester PC 20, an inspection unit (30-1, 30-2), and a sequencer 40. And have.

  The inspection apparatus 1 executes, for example, various measurements of the semiconductor device 2 (see FIG. 2) for inspection. Here, the semiconductor device 2 is, for example, a semiconductor module such as a power MOS (Metal-Oxide-Semiconductor) transistor, a diode, or a thyristor. In the present embodiment, an example in which the inspection apparatus 1 includes two inspection units (30-1 and 30-2) will be described. Moreover, when showing the arbitrary test | inspection part with which the test | inspection apparatus 1 is provided, or when not distinguishing in particular, it demonstrates as the test | inspection part 30. FIG.

  The code reader 11 (an example of a detection unit) detects, from the semiconductor device 2, a serial number which is identification information for identifying the semiconductor device 2. The code reader 11 reads a two-dimensional code 23 (see FIG. 2, for example, a QR code (registered trademark) or the like) sealed in a module of the semiconductor device 2 and detects a serial number indicated by the two-dimensional code 23. That is, the code reader 11 detects the serial number based on the two-dimensional code 23. The serial number may include, for example, information indicating a product name and information indicating a manufacturing lot. The code reader 11 outputs the detected serial number to the sequencer 40.

Here, an example of the two-dimensional code 23 imprinted on the semiconductor device 2 will be described with reference to FIG.
FIG. 2 is an external view showing an example of the semiconductor device 2 in the present embodiment.
As shown in FIG. 2, the semiconductor device 2 is modularized (in a module shape), and has a terminal portion 22 and a two-dimensional code 23 on the surface of the module 21.
The terminal portion 22 is a terminal for operating the semiconductor device 2 and is connected to an inspection unit 30 described later at the time of inspection.
The two-dimensional code 23 is a code indicating the serial number described above, and is imprinted on the surface of the module 21 by, for example, a laser. The serial number is, for example, different for each semiconductor device 2.

  Returning to the description of FIG. 1, the transport unit 12 includes, for example, a supply conveyor unit, a supply P & P (pick and place) unit, etc., and the code reader 11 and the inspection unit 30 , And transport to the classification unit 13.

  The classification unit 13 classifies the semiconductor device 2 into PASS (non-defective product), FAIL (defective product), and re-inspection based on the inspection result stored in the result storage unit 41 of the sequencer 40 described later. The classification unit 13 transfers the semiconductor device 2 classified as PASS (non-defective product) to a delivery stage (not shown) of the next process device. Further, the classification unit 13 stores the semiconductor devices 2 classified as FAIL (defective product) in a defective product collection rack (not shown) which is a rack for collecting defective products. Further, the classification unit 13 stores the semiconductor devices 2 classified into the reinspection in a reinspection rack (not shown) which is a rack for collecting reinspection articles.

  The hub 14 is, for example, a concentrator for a LAN (Local Area Network) such as Ethernet (registered trademark), and connects the tester PC 20 and the inspection unit 30 by a network by LAN.

The tester PC (personal computer) 20 is, for example, a terminal device that receives various operations on the inspection apparatus 1 and displays various messages. The tester PC 20 receives, for example, an operation for starting the test of the semiconductor device 2 and an operation such as setting of a data recording file for recording the test result. Further, the tester PC 20 displays, for example, an error message and the like related to the inspection of the semiconductor device 2. The tester PC 20 may display the inspection results and inspection conditions recorded in the data recording file so that the operator can confirm.
Further, the tester PC 20 stores measurement conditions conforming to the product name of the semiconductor device 2, and outputs measurement conditions corresponding to the product name to the inspection unit 30. The tester PC 20 also stores the inspection result (measurement result) of the semiconductor device 2 inspected by the inspection unit 30. The tester PC 20 is connected to the inspection unit 30 via the hub 14 by a network, and is connected to the sequencer 40 by a serial interface such as an interface of RS-232C standard, for example.

  The tester PC 20 acquires, for example, the serial number of the semiconductor device 2 described later and the inspection result (measurement result) of the semiconductor device 2 from the inspection unit 30 via the hub 14. Then, the tester PC 20 associates the acquired inspection result (measurement result) with the serial number and records (stores) in the data recording file.

The inspection unit 30 (30-1, 30-2) executes an inspection including various measurements of the semiconductor device 2, and transmits the inspected inspection result to the sequencer 40 and the tester PC 20. In the present embodiment, an example in which each of the inspection unit 30-1 and the inspection unit 30-2 inspects one inspection item will be described as an example.
The inspection unit 30 transmits, for example, an inspection result indicating whether the inspected semiconductor device 2 is a pass (PASS) to the sequencer 40 and associates the inspection result with the serial number of the semiconductor device 2. It is stored in the result storage unit 41 of the sequencer 40 described later. Further, the inspection unit 30 transmits, for example, an inspection result including measurement data of various measurements and the serial number of the semiconductor device 2 to the tester PC 20 via the hub 14, and the inspection result including the measurement data and the semiconductor device The serial numbers of 2 are associated with each other and stored in the tester PC 20.

The inspection unit 30-1 executes a withstand voltage test (an example of an inspection item) on the semiconductor device 2. The inspection unit 30-1 includes a tester 31 and a withstand voltage tester 32.
The tester 31 is connected to the withstand voltage tester 32 by, for example, a General Purpose Interface Bus (GPIB) interface, and causes the withstand voltage tester 32 to perform the withstand voltage test of the semiconductor device 2. The tester 31 is connected to the tester PC 20 via the hub 14 and connected to the sequencer 40 by the above-described serial interface and parallel interface such as an IO (Input Output) bus.

  The tester 31 receives, for example, a control instruction such as a start instruction of the withstand voltage test via the serial interface, and causes the withstand voltage tester 32 to perform the withstand voltage test via the GPIB interface. The tester 31 determines whether or not the withstand voltage test of the semiconductor device 2 is pass (PASS) based on the execution result of the withstand voltage test performed by the withstand voltage tester 32, and determines the determination result (PASS / FAIL), For example, it transmits to the sequencer 40 by a parallel interface. Further, the tester 31 transmits the measurement data of the withstand voltage test executed by the withstand voltage tester 32 and the serial number of the semiconductor device 2 to the tester PC 20 via the hub 14.

  The withstand voltage tester 32 performs a withstand voltage test of the semiconductor device 2 based on the control instruction received from the tester 31 via the GPIB interface. Here, the withstand voltage test is, for example, a test including a test which applies an electrical stress (for example, a voltage load) to the semiconductor device 2 by applying a voltage exceeding the rated value to the semiconductor device 2. The withstand voltage tester 32 transmits measurement data measured during the withstand voltage test to the tester 31 via the GPIB interface.

The inspection unit 30-2 executes, for example, a static characteristic test (an example of inspection item) on the semiconductor device 2 to measure a characteristic value for a predetermined DC voltage or DC current. The static characteristic test includes a plurality of measurement items. The inspection unit 30-2 includes the tester 33.
The tester 33 is connected to the tester PC 20 via the hub 14 and connected to the sequencer 40 by the above-described serial interface and parallel interface such as an IO bus.

  The tester 33 receives, for example, a control command such as a start command of the static characteristic test via the serial interface, and executes the static characteristic test on the semiconductor device 2. The tester 33 determines whether or not the static characteristic test of the semiconductor device 2 is pass (PASS) based on the execution result of the static characteristic test that has been executed, and the judgment result (PASS / FAIL) is, for example, parallel interface To the sequencer 40. Also, the tester 33 transmits the measurement data of the static characteristic test and the serial number of the semiconductor device 2 to the tester PC 20 via the hub 14.

  The sequencer 40 (an example of a control unit) includes, for example, a PLC (Programmable Logic Controller), and centrally controls the inspection apparatus 1. The sequencer 40 includes a result storage unit 41. The sequencer 40 controls, for example, the transport unit 12 to transport the semiconductor device 2 to the detection position of the two-dimensional code 23 of the code reader 11. Then, the sequencer 40 causes the code reader 11 to read the two-dimensional code 23, and acquires the serial number indicated by the two-dimensional code 23 from the code reader 11. The sequencer 40 also transmits the acquired serial number to the inspection unit 30 via the serial interface.

Also, the sequencer 40 controls the transport unit 12 to transport the semiconductor device 2 to the measurement position of the inspection unit 30. Then, the sequencer 40 causes the inspection unit 30 to inspect the semiconductor device 2, and acquires the inspection result from the inspection unit 30. The sequencer 40 associates, for example, the inspection result indicating whether the inspection inspected by the inspection unit 30 is a pass (PASS) with the serial number of the semiconductor device 2 acquired from the code reader 11, and the result storage unit Store in 41
In the present embodiment, the inspection apparatus 1 is provided with two inspection units (30-1.30-2), and the sequencer 40 is provided for each of the two inspection units (30-1.30-2). On the other hand, the semiconductor device 2 is inspected, and the inspection result and the serial number of the semiconductor device 2 are associated with each other and stored in the result storage unit 41. The result storage unit 41 stores, for example, inspection results for one lot.

Here, with reference to FIG. 3, an example of data stored in the result storage unit 41 will be described.
FIG. 3 is a diagram showing an example of data stored in the result storage unit 41 in the present embodiment.
As shown in this figure, the result storage unit 41 stores the “serial number”, the “test result of the tester A”, and the “test result of the tester B” in association with each other. Here, the “serial number” is the serial number of the semiconductor device 2 described above. “Test result of tester A” indicates the test result of the test unit 30-1 (tester 31), and “test result of the tester B” indicates the test result of the test unit 30-2 (tester 33). There is. In the following description, the inspection unit 30-1 (tester 31) may be referred to as "tester A", and the inspection unit 30-2 (tester 33) may be referred to as "tester B".

  In the example shown in FIG. 3, in the semiconductor device 2 in which the "serial number" is "XXXX000001", the "test result of the tester A" is "PASS" and the "test result of the tester B" is "PASS". It is shown that. In addition, in the semiconductor device 2 in which the “serial number” is “XXXX000002”, the “test result of the tester A” is “PASS” and the “test result of the tester B” is “− (not executed)”. Is shown.

Referring back to FIG. 1 again, the sequencer 40 determines, based on the serial number detected by the code reader 11, whether or not a test has been performed on the semiconductor device 2 in the past. The sequencer 40 determines whether a test has been performed in the past, for example, based on whether a test result corresponding to the serial number detected by the code reader 11 is stored in the result storage unit 41.
In addition, when inspection is performed in the past, the sequencer 40 performs inspection in the past among inspection items inspected by the inspection unit 30, based on the inspection result corresponding to the serial number stored in the result storage unit 41. The inspection unit 30 is made to execute reexamination excluding at least one inspection item overlapping the inspection item. That is, when the re-examination is performed, the sequencer 40 extracts the examination item already executed based on the examination result corresponding to the serial number stored in the result storage unit 41 and has already been executed. The inspection unit 30 is made to execute the inspection excluding the inspection item.

  Specifically, the sequencer 40 refers to the inspection result corresponding to the serial number from the result storage unit 41, for example, excluding the inspection item which is "PASS", the inspection item of "-(not performed)" To the inspection unit 30. For example, the test result corresponding to “serial number” shown in FIG. 3 as “XXXX000002” is “test result of tester A” is “PASS” and “test result of tester B” is “-(not executed)”. It is. In this case, in the reinspection, the sequencer 40 excludes the inspection item (pressure resistance test) by the inspection unit 30-1, and executes only the inspection item (static characteristic test) by the inspection unit 30-2.

In addition, when there are a plurality of overlapping inspection items, the sequencer 40 excludes, from among the overlapping inspection items, for example, inspection items that apply electrical stress to at least the semiconductor device 2 such as a withstand voltage test. The inspection unit 30 executes the inspection. Here, in the present embodiment, since each inspection unit 30 is an example in which one inspection item is inspected, when there is a plurality of overlapping inspection units 30, the sequencer 40 does not overlap the inspection units 30 that overlap. Among them, for example, the inspection unit 30 that performs an inspection that applies an electrical stress to at least the semiconductor device 2 such as a pressure test is excluded from the reinspection.
Further, in the present embodiment, as described above, the sequencer 40 determines whether or not the inspection is to be performed in units of inspection units 30 at the time of the reinspection, and performs the inspection on the inspection units 30 that are determined to be performed. Let That is, the sequencer 40 excludes the inspection unit 30, which is an inspection item in which all the inspection items to be executed overlap among the plurality of inspection units 30, from the reinspection, and an inspection unit in which there are inspection items that have not been inspected in the past. Have 30 re-examine all inspection items. Here, in the present embodiment, since each inspection unit 30 is an example in which one inspection item is inspected, all the inspection items described above are one inspection item.

  The sequencer 40 also controls the transport unit 12 after the inspection by the inspection unit 30 to transfer the semiconductor device 2 to the position of the classification unit 13 and pass the semiconductor device 2 to the classification unit 13 PASS (non-defective product) It is classified as either a defective product or retest.

Next, with reference to the drawings, the operation of the inspection apparatus 1 according to the present embodiment will be described.
FIG. 4 is a flowchart showing an example of the inspection procedure of the inspection apparatus 1 in the present embodiment.
When the operator operates the sequencer 40 to start inspection of the semiconductor device 2, as shown in FIG. 4, the inspection apparatus 1 first executes reading and inspection processing of the two-dimensional code 23 (step S101). That is, the sequencer 40 of the inspection apparatus 1 controls the transport unit 12 to transport the semiconductor device 2 to be inspected to the detection position of the code reader 11, and causes the code reader 11 to read the two-dimensional code 23. The code reader 11 transmits the serial number indicated by the read two-dimensional code 23 to the sequencer 40, and the sequencer 40 acquires the serial number of the semiconductor device 2 to be inspected from the code reader 11. Then, based on the acquired serial number, the sequencer 40 determines whether or not it is a re-examination, and causes the inspection unit 30 to execute an inspection according to the determination result. In the case of the re-examination, the sequencer 40 causes the examination unit 30 to execute the re-examination excluding the examination item overlapping the examination item inspected in the past. In addition, the sequencer 40 causes the inspection unit 30 to execute inspection of all inspection items when it is not a reinspection. Further, the sequencer 40 associates the inspection result by the inspection unit 30 with the serial number and stores the result in the result storage unit 41.

  For example, when the semiconductor device 2 whose “serial number” is “XXXX000002” shown in FIG. 3 is re-inspected, the sequencer 40 excludes the inspection by the inspection unit 30-1 (tester 31), and the inspection unit 30 is removed. -2 (Tester 33) is executed only. Further, when the semiconductor device 2 whose “serial number” is “XXXX000003” shown in FIG. 3 is retested, the sequencer 40 performs an inspection by the inspection unit 30-1 (tester 31) and an inspection unit 30-2 ( Both the test by the tester 33) are performed.

  Next, the inspection apparatus 1 causes the classification unit 13 to classify the semiconductor devices 2 based on the inspection result by the inspection unit 30 (step S102). That is, the sequencer 40 controls the transport unit 12 to transport the semiconductor device 2 to be inspected to the position of the classification unit 13, and the classification unit 13 PASS (non-defective product), FAIL (defective product) And classified as one of reexamination. The classification unit 13 acquires, for example, the inspection result corresponding to the semiconductor device 2 to be inspected stored in the result storage unit 41, and based on the acquired inspection result, PASS (non-defective product), FAIL (defective product) And re-examination.

  The classification unit 13 determines that the semiconductor device 2 is PASS (non-defective product) when the result of all the inspection items (inspection units 30) among the acquired inspection results is PASS, and performs the process Proceed to S103. Further, the classification unit 13 determines that the semiconductor device 2 is FAIL (defective product) when the result of at least one inspection item (inspection unit 30) among the acquired inspection results is a failure (FAIL). Then, the process proceeds to step S104. In addition, the classification unit 13 re-inspects the semiconductor device 2 when there is no failure (FAIL) in the results of all the inspection items (inspection units 30) among the acquired inspection results, and the non-implementation is included. Is determined to be necessary, and the process proceeds to step S105.

  In step S103, the classification unit 13 places (transfers) the semiconductor device 2 on the non-defective product waiting stage (the delivery stage of the next process device). After the process of step S103, the inspection apparatus 1 returns the process to step S101, and executes the inspection of the semiconductor device 2 to be inspected next.

  In step S104, the classification unit 13 stores the semiconductor device 2 in the defective item recovery rack. After the process of step S104, the inspection apparatus 1 returns the process to step S101, and executes the inspection of the semiconductor device 2 to be inspected next.

  In step S105, the classification unit 13 stores the semiconductor device 2 in the reinspection rack. After the process of step S105, the inspection apparatus 1 returns the process to step S101, and executes the inspection of the semiconductor device 2 to be inspected next. The semiconductor device 2 stored in the reinspection rack is managed as a stock of reinspection articles, and then returned to the inspection device 1 again to execute reinspection processing.

Next, with reference to FIG. 5, the details of the process of step S101 described above will be described.
FIG. 5 is a flowchart showing an example of the reading and inspection process of the two-dimensional code 23 of the inspection apparatus 1 in the present embodiment. In addition, in this figure, "tester A" shows test | inspection part 30-1 (tester 31), and "tester B" shall show test | inspection part 30-2 (tester 33).

  As shown in FIG. 5, the inspection apparatus 1 first reads the two-dimensional code 23 (step S201). That is, the sequencer 40 of the inspection apparatus 1 controls the transport unit 12 to transport the semiconductor device 2 to be inspected to the detection position of the code reader 11, and causes the code reader 11 to read the two-dimensional code 23. The sequencer 40 acquires a serial number indicated by the two-dimensional code 23 read by the code reader 11. The sequencer 40 transmits the acquired serial number to the inspection unit 30 via the serial interface.

  Next, the sequencer 40 determines whether the test of “tester A” is a re-test (step S202). The sequencer 40 determines whether or not the test of the “tester A” is retesting, for example, based on whether or not the test result corresponding to the acquired serial number is stored in the result storage unit 41. If the test of “tester A” is a retest (YES in step S202), the sequencer 40 advances the process to step S203. In addition, when the inspection of “tester A” is not a re-inspection (step S202: NO), the sequencer 40 advances the process to step S204.

  In step S203, the sequencer 40 determines whether the test of "tester A" has not been performed. The sequencer 40 is, for example, a test result stored in the result storage unit 41, and depends on whether the "test result of the tester A" corresponding to the serial number is "-(not executed)". , It is determined whether the test of "Tester A" has not been performed. The sequencer 40 advances the process to step S204 if the test of “tester A” has not been performed (step S203: YES). Further, when the test of “tester A” is not performed (executed) (step S203: NO), the sequencer 40 advances the process to step S207 and does not execute the retest of “tester A”.

In step S204, the sequencer 40 executes a test by the “tester A”. That is, the sequencer 40 causes the inspection unit 30-1 (tester 31) to execute the inspection of the semiconductor device 2.
Next, the sequencer 40 stores the test result by the “tester A” (step S205). That is, the sequencer 40 acquires the inspection result from the inspection unit 30-1 (tester 31), associates the acquired inspection result with the serial number, and stores the result in the result storage unit 41. The inspection unit 30-1 (tester 31) transmits the test result including the measurement data measured in the test and the serial number to the tester PC 20, and the tester PC 20 corresponds the received test result to the serial number. And record (store) in a data recording file.

  Next, the sequencer 40 determines whether the test result of “tester A” is a pass (step S206). If the inspection result acquired from the inspection unit 30-1 (tester 31) is a pass (PASS) (step S206: YES), the sequencer 40 advances the process to step S207. In addition, when the inspection result acquired from the inspection unit 30-1 (tester 31) is not a pass (PASS) (step S206: NO), the sequencer 40 ends the process (the process of step S101 illustrated in FIG. 4).

  In step S207, the sequencer 40 determines whether the test of “tester B” is a retest. The sequencer 40 determines, for example, whether or not the test of the “tester B” is a retest based on whether or not the test result corresponding to the acquired serial number is stored in the result storage unit 41. If the test of “tester B” is a retest (YES in step S207), the sequencer 40 advances the process to step S208. Further, when the inspection of “tester B” is not the re-inspection (step S206: NO), the sequencer 40 advances the process to step S209.

  In step S208, the sequencer 40 determines whether the test of "tester B" has not been performed. The sequencer 40 is, for example, a test result stored in the result storage unit 41, and depends on whether the "test result of the tester B" corresponding to the serial number is "-(not executed)". , It is determined whether the test of "Tester B" has not been performed. If the test of “tester B” has not been performed (step S208: YES), the sequencer 40 advances the process to step S209. In addition, when the test of “tester A” is not performed (executed) (step S208: NO), the sequencer 40 ends the process (process of step S101 shown in FIG. 4), and “tester B”. Do not perform a re-examination of

In step S209, the sequencer 40 executes a test by the "tester B". That is, the sequencer 40 causes the inspection unit 30-2 (tester 33) to execute the inspection of the semiconductor device 2.
Next, the sequencer 40 stores the test result by the “tester B” (step S210). That is, the sequencer 40 acquires the inspection result from the inspection unit 30-2 (tester 33), associates the acquired inspection result with the serial number, and stores the result in the result storage unit 41. The inspection unit 30-2 (tester 33) transmits the test result including the measurement data measured during the test and the serial number to the tester PC 20, and the tester PC 20 corresponds the received test result to the serial number. And record (store) in a data recording file. After the process of step S210, the sequencer 40 ends the process (the process of step S101 shown in FIG. 4).

  As described above, the inspection apparatus 1 according to the present embodiment includes the code reader 11 (detection unit), the inspection unit 30, and the sequencer 40 (control unit). The code reader 11 detects identification information (for example, a serial number) identifying the semiconductor device 2 from the semiconductor device 2. The inspection unit 30 inspects the semiconductor device 2, associates the inspected inspection result with identification information (for example, a serial number), and stores the result in the result storage unit 41. The sequencer 40 determines whether a test has been performed on the semiconductor device 2 in the past based on identification information (for example, a serial number) detected by the code reader 11. Among the inspection items inspected by the inspection unit 30 based on the inspection result corresponding to the identification information (for example, the serial number) stored in the result storage unit 41 when the inspection is performed in the past, the sequencer 40 The inspection unit 30 is made to execute re-examination excluding at least one inspection item that overlaps the inspection item inspected in the past.

Thus, the inspection apparatus 1 according to the present embodiment performs reinspection excluding inspection items that overlap with inspection items inspected in the past, so, for example, a semiconductor such as a withstand voltage test or a PRSM (rated surge reverse power) test It is possible to reduce the possibility that the quality of the semiconductor device 2 may be degraded by repetitively executing inspection items that apply electrical stress to the device 2. Therefore, the inspection apparatus 1 according to the present embodiment can perform reinspection while securing the quality of the semiconductor device 2.
In addition, since the inspection apparatus 1 according to the present embodiment executes the re-examination excluding the overlapping inspection items, unnecessary examinations (measurements) in the re-examination can be reduced. Therefore, the inspection apparatus 1 according to the present embodiment can shorten the inspection time in the re-inspection.

Further, in the present embodiment, the sequencer 40 causes the inspection unit 30 to perform the re-inspection excluding the inspection item (for example, the withstand voltage test) which gives the electrical stress to at least the semiconductor device 2 among the overlapping inspection items. .
Thereby, the inspection apparatus 1 according to the present embodiment can reliably reduce the possibility of degrading the quality of the semiconductor device 2 by re-inspection.

Moreover, the inspection apparatus 1 by this embodiment is provided with several inspection part 30 (30-1, 30-2). Then, the sequencer 40 excludes the inspection unit 30, which is an inspection item in which all the inspection items to be executed overlap among the plurality of inspection units 30, from the re-inspection, and an inspection unit in which there are inspection items that have not been inspected in the past. Have 30 re-examine all inspection items.
Thereby, the inspection apparatus 1 according to the present embodiment excludes the overlapping inspection items in the inspection unit 30 unit in the re-examination, so that the overlapping inspection items are easily excluded as compared with the case of excluding in the inspection item unit. can do.

Further, in the present embodiment, the semiconductor device 2 has a two-dimensional code 23 indicating identification information (for example, a serial number), and the code reader 11 determines identification information (for example, a serial number) based on the two-dimensional code 23. ) To detect.
Thereby, the inspection apparatus 1 according to the present embodiment can acquire identification information for identifying the semiconductor device 2 by a simple method called a two-dimensional code 23.

Further, the inspection method according to the present embodiment inspects the semiconductor device 2 with the code reader 11 that detects identification information (for example, a serial number) for identifying the semiconductor device 2 from the semiconductor device 2, and the inspection result and identification information ( For example, it is an inspection method of inspection device 1 provided with inspection part 30 which matches serial number) and makes it memorize in result storage part 41. In the inspection method according to the present embodiment, the inspection apparatus 1 determines whether the inspection has been performed on the semiconductor device 2 in the past based on the identification information (for example, the serial number) detected by the code reader 11. . Then, when an inspection is performed in the past, the inspection apparatus 1 performs an inspection item to be inspected by the inspection unit 30 based on the inspection result corresponding to the identification information (for example, the serial number) stored in the result storage unit 41. The inspection unit 30 is made to execute a re-examination excluding at least one of the inspection items overlapping the inspection items inspected in the past.
Thus, the inspection method according to the present embodiment can perform reinspection while securing the quality of the semiconductor device 2 similarly to the inspection apparatus 1 described above.

Second Embodiment
Next, an inspection apparatus 1 according to a second embodiment will be described with reference to the drawings.
The configuration of the inspection apparatus 1 according to the present embodiment is the same as that of the first embodiment shown in FIG. 1, and thus the description thereof is omitted here.
In the present embodiment, an example in which the inspection unit 30 inspects a plurality of inspection items will be described. That is, the inspection unit 30-1 inspects a plurality of inspection items including a pressure resistance test, and the inspection unit 30-2 inspects a plurality of inspection items (for example, a static characteristic test including a plurality of measurement items). It explains as a thing.

As shown in FIG. 6, the result storage unit 41 in the present embodiment stores the serial number and the inspection results of a plurality of inspection items in association with each other.
FIG. 6 is a diagram showing an example of data stored in the result storage unit 41 in the present embodiment.
As shown in FIG. 6, the result storage unit 41 stores the “serial number”, the “test result of the tester A”, and the “test result of the tester B” in association with each other. Each of the “test result of tester A” and the “test result of tester B” includes the test result of each test item according to “test item 1”, “test item 2”,. That is, the result storage unit 41 stores the “serial number” in association with the inspection result of each inspection item.

  In the example shown in FIG. 6, the semiconductor device 2 whose “serial number” is “XXXX000001” is “test item 1” and “test item 2” of “test result of tester A” and “test result of tester B. "Inspection item 1" of "" is "PASS", and "inspection item 2" of "test result of tester B" is "-(not performed)".

The sequencer 40 in the present embodiment causes the inspection unit 30 to execute a plurality of inspection items, and acquires the inspection result for each inspection item from the inspection unit 30. As shown in FIG. 6, the sequencer 40 associates the inspection result for each inspection item with the serial number of the semiconductor device 2 and stores the result in the result storage unit 41. Further, when the sequencer 40 re-examines the inspection, the inspection unit 30 refers to the inspection which excludes the overlapping inspection item with reference to the inspection result of each inspection item corresponding to the serial number from the result storage unit 41 described above. Run it.
For example, with respect to the semiconductor device 2 whose “serial number” shown in FIG. 6 is “XXXX000001”, the sequencer 40 at least performs “inspection item 1” and “inspection item 2” among the inspection items of the inspection unit 30-1. "" Is excluded, and at least "inspection item 1" is excluded among the inspection items of the inspection unit 30-2, and re-inspection is performed. In this case, the sequencer 40 causes the inspection unit 30-2 to execute the inspection of “inspection item 2” in the reinspection.

Next, with reference to the drawings, the operation of the inspection apparatus 1 according to the present embodiment will be described.
The inspection procedure of the inspection apparatus 1 in the present embodiment is basically the same as that of the first embodiment shown in FIG. 4, and thus the description thereof is omitted here.
Here, the details of the process of step S101 shown in FIG. 4 will be described with reference to FIG.
FIG. 7 is a flowchart showing an example of the reading and inspection process of the two-dimensional code 23 of the inspection apparatus 1 in the present embodiment. In this figure, as in FIG. 5, “tester A” indicates the inspection unit 30-1 (tester 31), and “tester B” indicates the inspection unit 30-2 (tester 33). .

As shown in FIG. 7, the inspection apparatus 1 first reads the two-dimensional code 23 (step S301). The process of step S301 is the same as the process of step S201 shown in FIG. 5 described above.
Next, the sequencer 40 determines whether the test of “tester A” is a retest (step S302). The sequencer 40 determines whether or not the test of the “tester A” is retesting, for example, based on whether or not the test result corresponding to the acquired serial number is stored in the result storage unit 41. The sequencer 40 advances the process to step S304 when the test of “tester A” is a retest (step S302: YES). In addition, when the inspection of “tester A” is not a re-inspection (step S302: NO), the sequencer 40 advances the process to step S303.

  In step S303, the sequencer 40 executes all the inspection items of “tester A” as normal inspection processing that is not reinspection. That is, the sequencer 40 causes the inspection unit 30-1 (tester 31) to execute the inspection of all the inspection items. After the process of step S303, the sequencer 40 advances the process to step S305.

In step S304, the sequencer 40 executes the test items of “tester A” excluding the duplication as the re-inspection process. That is, the sequencer 40 excludes the inspection item of “PASS” among the “inspection results of the tester A” corresponding to the serial number of the result storage unit 41, and inspects the inspection item of “− (not performed)”. Are executed by the inspection unit 30-1 (tester 31).
In addition, when there are a plurality of overlapping inspection items, the sequencer 40 excludes, from among the overlapping inspection items, for example, inspection items that apply electrical stress to at least the semiconductor device 2 such as a withstand voltage test. The inspection may be performed by the inspection unit 30. When all the inspection items are "PASS", the sequencer 40 does not cause the inspection unit 30-1 (tester 31) to execute the inspection. After the process of step S304, the sequencer 40 advances the process to step S305.

  In step S305, the sequencer 40 stores the test result by "Tester A". That is, the sequencer 40 acquires the inspection result for each inspection item from the inspection unit 30-1 (tester 31), associates the acquired inspection result with the serial number of the semiconductor device 2 to be inspected, and stores the result storage unit 41. Remember. The inspection unit 30-1 (tester 31) transmits the test result including the measurement data measured in the test and the serial number to the tester PC 20, and the tester PC 20 corresponds the received test result to the serial number. And record (store) in a data recording file.

  Next, the sequencer 40 determines whether the test result of “tester A” is a pass (step S306). The sequencer 40 proceeds the process to step S307 if all the inspection results of the inspection items acquired from the inspection unit 30-1 (tester 31) are pass (PASS) (step S306: YES). In addition, when the inspection result of each inspection item acquired from the inspection unit 30-1 (tester 31) is not even a pass (PASS) (step S306: NO), the sequencer 40 performs the process (step S101 illustrated in FIG. 4). End of processing).

  In step S307, the sequencer 40 determines whether the test of “tester B” is a retest. The sequencer 40 determines, for example, whether or not the test of the “tester B” is a retest based on whether or not the test result corresponding to the acquired serial number is stored in the result storage unit 41. If the test of “tester B” is a retest (YES in step S307), the sequencer 40 advances the process to step S309. Further, when the inspection of “tester B” is not the re-inspection (step S307: NO), the sequencer 40 advances the process to step S308.

  In step S308, the sequencer 40 executes all the inspection items of “tester B” as normal inspection processing that is not reinspection. That is, the sequencer 40 causes the inspection unit 30-2 (tester 33) to execute the inspection of all the inspection items. After the process of step S308, the sequencer 40 advances the process to step S310.

  In step S309, the sequencer 40 executes the inspection item of “tester B” excluding the duplication as the reinspection process. That is, the sequencer 40 excludes the inspection item “PASS” in the “inspection result of the tester B” corresponding to the serial number of the result storage unit 41 and inspects the inspection item “-(not performed)”. Are executed by the inspection unit 30-2 (tester 33). When all the inspection items are “PASS”, the sequencer 40 does not cause the inspection unit 30-2 (tester 33) to execute the inspection. After the process of step S309, the sequencer 40 advances the process to step S310.

  In step S310, the sequencer 40 stores the test result by the "tester B". That is, the sequencer 40 acquires the inspection result for each inspection item from the inspection unit 30-2 (tester 33), associates the acquired inspection result with the serial number of the semiconductor device 2 to be inspected, and stores the result storage unit 41. Remember. The inspection unit 30-2 (tester 33) transmits the test result including the measurement data measured during the test and the serial number to the tester PC 20, and the tester PC 20 corresponds the received test result to the serial number. And record (store) in a data recording file. After the process of step S310, the sequencer 40 ends the process (the process of step S101 shown in FIG. 4).

  As described above, in the present embodiment, the result storage unit 41 stores the inspection result of each inspection item inspected and the serial number of the semiconductor device 2 in association with each other. The inspection unit 30 inspects a plurality of inspection items for the semiconductor device 2, associates the inspection result for each inspection item inspected and the serial number, and stores the result in the result storage unit 41. That is, the inspection unit 30 transmits the inspection result of each inspection item inspected to the sequencer 40, and the sequencer 40 associates the inspection result of each inspection item inspected and the serial number and stores the result in the result storage unit 41. Further, the sequencer 40 determines whether the inspection has been performed on the semiconductor device 2 in the past, depending on whether the serial number detected by the code reader 11 is stored in the result storage unit 41. Then, when inspections have been executed in the past, the sequencer 40 checks in the past among the inspection items inspected by the inspection unit 30 based on the inspection result corresponding to the two-dimensional code 23 stored in the result storage unit 41. The inspection unit 30 is made to execute a re-examination excluding at least one inspection item that overlaps the inspected inspection item.

  Thus, the inspection apparatus 1 according to the present embodiment can perform reinspection while securing the quality of the semiconductor device 2 as in the first embodiment described above. In the present embodiment, in the re-examination, the inspection apparatus 1 can exclude an inspection item that overlaps in inspection item units, and therefore can perform more appropriate inspection (measurement).

Moreover, the inspection apparatus 1 by this embodiment is provided with several inspection part 30 (30-1, 30-2). Then, the sequencer 40 excludes the inspection unit 30, which is an inspection item in which all the inspection items to be executed overlap among the plurality of inspection units 30, from the re-inspection, and an inspection unit in which there are inspection items that have not been inspected in the past. For 30, duplicate examination items are excluded from re-examination, and re-examination of examination items not examined in the past is performed.
As a result, the inspection apparatus 1 according to the present embodiment can exclude inspection items overlapping in inspection unit 30 units and inspection item units in the re-inspection, so that more appropriate inspection (measurement) can be performed. it can.

In addition, this invention is not limited to said each embodiment, It can change in the range which does not deviate from the meaning of this invention.
For example, in each of the above-described embodiments, the inspection apparatus 1 has been described as including two inspection units 30. However, the present invention is not limited to this. For example, one inspection unit 30 may be provided. Alternatively, three or more inspection units 30 may be provided.

  In each of the above embodiments, the code reader 11 reads the two-dimensional code 23 to detect the identification information (for example, the serial number) of the semiconductor device 2. However, the present invention is not limited to this. . For example, instead of the two-dimensional code 23, the code reader 11 may read a one-dimensional code such as a barcode to detect the identification information, or may take another code to detect the identification information. May be Further, for example, in the semiconductor device 2, characters indicating identification information such as numbers or symbols are imprinted, and the code reader 11 detects the identification information using an optical character recognition (OCR) function. You may do so.

  Moreover, although the inspection apparatus 1 demonstrated the example which test | inspects the semiconductor device 2 of a module shape in said each embodiment, it is not limited to this. The inspection apparatus 1 may inspect, for example, a wafer-shaped semiconductor device 2. In this case, the inspection apparatus 1 may detect the identification information of the semiconductor device 2 by combining the wafer number and the position information of the semiconductor device 2 on the wafer.

  In each of the above-described embodiments, an example in which the inspection item that gives an electrical stress to the semiconductor device 2 is a withstand voltage test has been described as an example, but the present invention is not limited thereto. The test may be another electrical stress test such as a V (voltage) stress test. In addition, the number of times of inspection is set in the inspection item, and the inspection apparatus 1 may exclude it from the inspection items when the number of times of restriction is exceeded in the reinspection. In this case, the result storage unit 41 may store the identification information of the semiconductor device 2 in association with the inspection result and the number of times of execution of each inspection item.

  In each of the above-described embodiments, the sequencer 40 includes the result storage unit 41. However, the present invention is not limited to this. The result storage unit 41 may be provided outside the sequencer 40. . For example, the inspection unit 30 or the tester PC 20 may include the result storage unit 41, or the inspection apparatus 1 may include a storage device as the result storage unit 41 outside the sequencer 40.

In each of the above-described embodiments, although the result storage unit 41 has described the example of storing the inspection result for one lot, the present invention is not limited to this, and the inspection result of a plurality of lots is stored. It is also good.
In each of the above-described embodiments, the inspection unit 30 or the tester PC 20 may have some or all of the functions of the sequencer 40.

  In each of the above-described embodiments, after the operator sets from the tester PC 20 which of the normal inspection process for executing all the inspection items and the reinspection process the inspection apparatus 1 performs will be performed. Each inspection process may be performed. In this case, the inspection apparatus 1 refers to the result storage unit 41 and causes the tester PC 20 to display a message indicating an abnormality when the semiconductor device 2 whose inspection has been performed in the past is detected during the normal inspection process. . As a result, the inspection apparatus 1 can detect an operation error or the like in which the semiconductor device 2 already subjected to the inspection has been erroneously mixed.

In each of the above embodiments, the inspection unit 30 and the sequencer 40 have been described as being connected by a serial interface and a parallel interface, but the present invention is not limited to this. For example, the inspection unit 30 and the sequencer 40 may be connected by one of a serial interface and a parallel interface. The serial interface is not limited to the interface of the RS-232C standard, and may be another interface such as USB (Universal Serial Bus).
In each of the above-described embodiments, the tester 31 is connected to the withstand voltage tester 32 by the GPIB interface. However, the tester 31 may be connected to the withstand voltage tester 32 by another interface. In addition, although an example in which the tester PC 20 is connected to the sequencer 40 by a serial interface has been described, the tester PC 20 may be connected to the sequencer 40 by another interface.

  In addition, the above-mentioned test | inspection apparatus 1 has a computer system inside. The process of each unit of the inspection apparatus 1 described above is stored in a computer readable recording medium in the form of a program, and the above process is performed by the computer reading and executing the program. Here, the computer readable recording medium refers to a magnetic disk, a magneto-optical disk, a CD-ROM, a DVD-ROM, a semiconductor memory or the like. Alternatively, the computer program may be distributed to a computer through a communication line, and the computer that has received the distribution may execute the program.

DESCRIPTION OF SYMBOLS 1 inspection apparatus 2 semiconductor device 11 code reader 12 conveyance part 13 classification part 14 hub 20 tester PC
Reference Signs List 21 module 22 terminal 23 two-dimensional code 30, 30-1, 30-2 inspection unit 31, 33 tester 32 withstand voltage tester 40 sequencer 41 result storage unit

Claims (5)

A detection unit which detects identification information for identifying a semiconductor device from the semiconductor device;
An inspection unit that inspects a semiconductor device and associates the inspected inspection result with the identification information and stores the result in the storage unit;
Based on the identification information detected by the detection unit, it is determined whether the inspection has been performed on the semiconductor device in the past, and the storage unit stores the inspection when the inspection is performed in the past. Based on the inspection result corresponding to the identification information, the inspection unit is made to execute the re-examination excluding at least one inspection item overlapping with the inspection item inspected in the past among the inspection items inspected by the inspection unit Equipped with a controller and
The control unit causes the inspection unit to execute a re-inspection excluding at least the inspection item that gives electrical stress to the semiconductor device among the overlapping inspection items.
Inspection device comprising a call. A plurality of the inspection units,
The control unit excludes, from the re-examination, the inspection units that are all the inspection items to be executed among the plurality of inspection units that are duplicate inspection items, and the inspections in which there are inspection items that have not been inspected in the past The inspection apparatus according to claim 1 , wherein the inspection unit is made to execute reinspection of all inspection items. A plurality of the inspection units,
The control unit excludes, from the re-examination, the inspection units that are all the inspection items to be executed among the plurality of inspection units that are duplicate inspection items, and the inspections in which there are inspection items that have not been inspected in the past against part, excluded from the re-inspecting the inspection items for the overlapping inspection apparatus according to claim 1, characterized in that to execute re-examination of the inspection item is not inspected the past. The semiconductor device has a two-dimensional code indicating the identification information,
The inspection apparatus according to any one of claims 1 to 3 , wherein the detection unit detects the identification information based on the two-dimensional code. Inspection of inspection apparatus provided with detection unit for detecting identification information for identifying a semiconductor device from the semiconductor device, and inspection unit for inspecting the semiconductor device and associating the inspection result with the identification information and storing the same in the storage unit Method,
Based on the identification information detected by the detection unit, it is determined whether the inspection has been performed on the semiconductor device in the past, and the storage unit stores the inspection when the inspection is performed in the past. Based on the inspection result corresponding to the identification information, the inspection unit is made to execute the re-examination excluding at least one of the inspection items overlapping with the inspection items inspected in the past among the inspection items inspected by the inspection unit ,
The inspection method characterized in that the inspection unit executes the re-inspection excluding at least the inspection item which gives electrical stress to the semiconductor device among the overlapping inspection items .

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