JP6525766B2 - Quartz crystal vibrator assembly wafer - Google Patents

Description

  The present invention relates to a quartz crystal vibrating element assembly wafer in which quartz crystal vibrating elements are integrated and configured integrally.

  A quartz oscillator is mounted inside a quartz oscillator or a quartz oscillator that is one of the electronic components. The quartz crystal vibrating element is composed of a quartz crystal base plate and a first electrode, a second electrode, and a conductive wiring pattern provided on the surface of the quartz base plate. The quartz plate is a thin plate, and the outer shape in plan view has, for example, a circular shape, a square shape or a tuning fork shape. The first electrode is provided at a predetermined position on the surface of the quartz plate and excites at least a part of the quartz plate. The conductive wiring pattern is provided on the surface of the quartz substrate so as to electrically connect, for example, a predetermined first electrode and a predetermined second electrode described later. The second electrode is provided at a predetermined position on the surface of the quartz crystal plate, and electrically connects the quartz crystal vibrating element and the container on which it is mounted. In the case of manufacturing such a quartz crystal vibrating element, a quartz crystal vibrating element aggregate wafer in which a plurality of quartz crystal vibrating elements are integrated and configured is used.

  For example, in a conventional quartz crystal vibrator assembly wafer, a plurality of quartz crystal substrates which can be broken away from the quartz crystal wafer left by etching from the quartz substrate, a support portion, and a quartz crystal substrate are connected to the support portion A first electrode, a second electrode, and a conductive wiring pattern w are formed on the surface of the quartz substrate, and the first connection portion and the second connection portion are formed. The two connecting portions are provided so as to extend respectively from one short side of the quartz plate along the direction in which the long sides of the quartz plate extend, and the quartz plate of the first connecting portion A groove with a bottom is provided only on one of the main surfaces in the connection portion, and a groove with a bottom is provided only on the other main surface in the connection portion between the second connection portion and the quartz substrate (See, for example, Patent Document 1).

JP, 2010-178320, A

  In the case of separating individual crystal vibrating elements from a quartz crystal vibrating element aggregate wafer on which a plurality of quartz crystal vibrating elements are formed as in the prior art, a connecting portion connecting the quartz crystal vibrating element and the frame portion of the quartz crystal vibrating element aggregate wafer The quartz crystal vibrating element is separated from the frame portion of the quartz crystal vibrating element-aggregated wafer by breaking it at a position of However, when an electrode made of a metal film used to measure the characteristics of the crystal vibrating element is formed on the surface of the connecting portion, the surface of the connecting portion may be broken even if the connecting portion breaks. Due to the ductility of the metal forming the electrode, the electrodes remain connected and there is a possibility that the quartz crystal vibrating element can not be completely separated from the frame portion of the quartz crystal vibrating element-aggregated wafer.

  Therefore, according to the present invention, even when an electrode made of a metal film used to measure the characteristics of the quartz crystal vibrating element is formed on the surface of the connecting portion, the quartz quartz crystal vibrating element can be reliably separated from the frame of the quartz quartz crystal vibrating element assembly wafer. It is an object of the present invention to provide a quartz crystal vibrating element-aggregated wafer capable of

  A plurality of quartz crystal vibrating element-aggregated wafers according to the present invention are arranged side by side in a space surrounded by a flat frame having a rectangular outer periphery and an inner periphery in plan view and at least a first electrode and a It is connected so as to extend from one side provided with a quartz vibration element having a rectangular shape in plan view in which two electrodes are formed, one side of the inner periphery of the frame and the second electrode of each crystal oscillation element. First connecting portion and second connecting portion, a through hole provided between the first connecting portion and the second connecting portion provided in the same crystal vibrating element, and a second electrode to the first connecting portion And a third electrode extending through the surface of the second connection portion to the surface of the frame, and a first groove portion having an opening provided on either the upper surface or the lower surface of the first connection portion, and a second connection A second groove having an opening provided on the same surface as the surface on which the first groove of the part is provided, and the first connection The first narrowing portion and the second narrowing portion provided so as to sandwich the first groove portion, and the second narrowing portion on the second connection portion side provided for the same quartz crystal vibrating element provided with the first connection portion Provided for the same crystal vibrating element provided with the third groove portion provided, the third narrow portion and the fourth narrow portion provided so as to sandwich the second groove portion of the second connection portion, and the second connection portion And a fourth groove portion provided in a fourth narrowed portion on the first connection portion side.

  A plurality of quartz crystal vibrating element-aggregated wafers according to the present invention are arranged side by side in a space surrounded by a flat frame having a rectangular outer periphery and an inner periphery in plan view and at least a first electrode and a It is connected so as to extend from one side provided with a quartz vibration element having a rectangular shape in plan view in which two electrodes are formed, one side of the inner periphery of the frame and the second electrode of each crystal oscillation element. First connecting portion and second connecting portion, a through hole provided between the first connecting portion and the second connecting portion provided in the same crystal vibrating element, and a second electrode to the first connecting portion And a third electrode extending through the surface of the second connection portion to the surface of the frame, and a first groove portion having an opening provided on either the upper surface or the lower surface of the first connection portion, and a second connection A second groove having an opening provided on the same surface as the surface on which the first groove of the part is provided, and the first connection A second narrowed portion provided on the same quartz vibrating element provided with a first narrowed portion and a second narrowed portion sandwiching the first groove portion, and a first coupled portion provided Are provided for the same quartz crystal vibrating element provided with a third connecting portion and a third narrowing portion and a fourth narrowing portion provided so as to sandwich the second groove of the second connection portion. A fourth groove portion provided in a fourth narrowed portion on the side of the first connection portion is provided. In such a configuration, since the film thickness of the third electrode of the first connection portion and the second connection portion can be partially reduced, the crystal vibration element can be reliably separated from the crystal vibration element aggregate wafer It becomes.

It is the top view which showed the crystal | crystallization vibration element accumulation | aggregation | set wafer which concerns on embodiment of this invention. It is the elements on larger scale which expanded and showed the circle A part described in FIG. It is sectional drawing cut | disconnected by the BB line shown in FIG. FIG. 13 is a partially enlarged view showing, in an enlarged manner, the same portion as the circle A portion described in FIG. 1 in a modified example of the quartz crystal vibrating element group wafer according to the embodiment of the present invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a plan view showing a quartz crystal vibrating element assembly wafer according to an embodiment of the present invention. FIG. 2 is a partially enlarged view showing a virtual circle A portion shown in FIG. 1 in an enlarged manner. FIG. 3 is a cross-sectional view taken along the imaginary cutting line B-B described in FIG. In each of the drawings, a part of the structure is not shown for the sake of clarity, and the dimensions are also shown in a partially exaggerated manner. In particular, the thickness direction of the cross section in FIG. Further, in order to simplify the description, in FIGS. 1, 2 and 4, the illustrated side is the upper side, the opposite side is the lower side, and in FIG. Described as the upper side of the element assembly wafer.

  As shown in FIGS. 1 to 3, the quartz crystal vibrating element assembly wafer 100 includes a quartz vibrating element 110, and a first connection including a first groove portion 121, a first narrowing portion 122, a second narrowing portion 123, and a third groove portion 124. From the second connecting portion 130 including the portion 120, the second groove portion 131, the third narrowed portion 132, the fourth narrowed portion 133, and the fourth groove portion 134, the through hole 140, the third electrode 150, and the frame portion 160 It is configured. In the process of manufacturing a quartz crystal device such as a quartz crystal resonator or a quartz oscillator, the quartz crystal vibrator assembly wafer 100 is used to simultaneously manufacture a plurality of quartz crystal devices mounted in the quartz crystal device.

  The quartz crystal vibrating element 110 has a first electrode 112 used for exciting the quartz crystal plate on the upper surface and the lower surface of the quartz crystal plate 111, and a short side of the quartz substrate 111 drawn from the first electrode 112. Two electrodes 113 are deposited and play a role of oscillating a reference signal of an electronic device or the like by stable mechanical vibration and piezoelectric effect.

  The quartz crystal plate 111 has a rectangular shape in a plan view. For example, in an orthogonal coordinate system including an X axis (electric axis), a Y axis (mechanical axis), and a Z axis (optical axis), the Z axis is -Y of Y axis. Assuming that the axis tilted in the direction is Z 'axis and the Y axis is tilted in the + Z direction of Z axis is Y' axis, parallel upper and lower sides with X axis direction as long side and Z 'axis direction as short side It consists of a thin plate of AT cut which is constituted by the XZ ′ plane and whose thickness is in the direction parallel to the Y ′ axis.

  The first electrode 112 is for causing the quartz crystal substrate 111 to excite in a predetermined vibration mode and frequency when an alternating voltage from the outside is applied to the quartz crystal substrate 111 via the first electrode 112. The first electrode 112 is provided substantially at the center between the upper surface and the lower surface of the quartz crystal base plate 111 so as to face each other between the upper surface and the lower surface.

  The second electrode 113 is for transmitting an alternating voltage from the outside to each first electrode 112. The second electrode 113 is one of the short sides of the two short sides of the quartz crystal substrate 111 from each of the first electrode 112 provided on the upper surface of the quartz crystal substrate 111 and the first electrode 112 provided on the lower surface. It is extended so that it does not face between the upper surface and the lower surface to the edge of.

  The first electrode 112 and the second electrode 113 are formed at predetermined positions of the quartz substrate 111 using, for example, a photolithographic technique and an etching technique. Specifically, metal films to be the first electrode 112 and the second electrode 113 are formed on both main surfaces of the quartz crystal vibrating wafer, on which the portions to be the plurality of quartz element plates 111 are formed. A photosensitive resist is applied on the metal film. Thereafter, exposure and development are performed such that a predetermined pattern of this photosensitive resist (portion to be the first electrode 112 and the second electrode 113) remains. Finally, the exposed metal film is peeled off to remove the remaining photosensitive resist. In this manner, the first electrode 112 and the second electrode 113 are formed at predetermined positions of the portion to be the quartz crystal substrate 111 of the quartz crystal vibrating element assembly wafer 100 in which the portions to be the plurality of quartz crystal substrates 111 are formed. Be done. Although the case of forming using photolithography technology and etching technology is described here, it may be formed using, for example, sputtering technology or vapor deposition technology.

  In addition, the first electrode 112 and the second electrode 113 are formed such that silver or gold is laminated on chromium. By using chromium as a base, it is possible to secure the adhesion between the quartz crystal plate 111 and the first electrode 112 and the second electrode 113 while also ensuring the adhesion with gold or silver.

  The first connecting portion 120 mechanically connects the quartz crystal vibrating element 110 and the frame portion 160 of the quartz crystal vibrating element assembly wafer 100 together with the second connecting portion 130 described later, thereby the quartz vibrating element 110 will be described later. Used to support with 160. The first connecting portion 120 extends from one short side of the quartz crystal vibrating element 110 along the one side of the two sides in the length direction of the quartz crystal vibrating element 110 from the one short side where the second electrode 112 is provided. Extending to the frame 160 facing the Further, the first connecting portion 120 is integrally formed with the crystal vibrating element 110 and the frame portion 160. The first connection portion 120 is provided with a first groove portion 121, a first narrowed portion 122, a second narrowed portion 123, and a third groove portion 124.

  The first groove portion 121 is for making it easy to break the crystal vibrating element 110 from the first connection portion 120. The first groove portion 121 is a bottomed groove portion having an opening on one of the upper surface and the lower surface of the first connecting portion 120. By providing the first groove portion 121, the rigidity of only a predetermined portion of the first connection portion 120 can be weakened, and when breaking the quartz crystal vibrating element 111 from the frame portion 160 in the first connection portion 120, the first By cutting off at the groove portion 121, the position to be cut off can be arbitrarily controlled.

  The first constriction portion 122 and the second constriction portion 123 can absorb and absorb an impact or the like from the outside into the first constriction portion 122 and the second constriction portion 123, and maintain the rigidity of the entire first connection portion 120 It is used to The first narrowing portion 122 and the second narrowing portion 123 sandwich the first groove portion 121 in the first connecting portion 120, and the first narrowing portion 122 is located on one long side of the quartz crystal vibrating element 110. Are provided on the same side as the second connecting portion 130 provided on the same crystal vibrating element 110. The thicknesses of the first narrowed portion 122 and the second narrowed portion 123 are the same as the thicknesses of the quartz crystal vibrating element 111 and the frame portion 160. Moreover, the thickness of the 1st constriction part 122 and the 2nd constriction part 123 is 20-70 micrometers.

  The third groove portion 124 is for making it easier to break the crystal vibrating element 110 from the first connection portion 120, and to reduce the adhesion of burrs to the quartz crystal vibrating element 110 after it is broken. is there. The third groove portion 124 is provided at the second narrowed portion 123 with a bottom. The opening of the third groove 124 is provided on the same surface as the surface on which the opening of the first groove 121 is provided. The depth of the third groove 124 is the same as the depth of the first groove 121 or deeper than the depth of the first groove 121, as shown in FIG. The third groove 124 may be provided in the first narrowed portion 122. However, when the third groove portion 124 is provided in the first narrowed portion 122, when the quartz crystal vibrating element 110 is broken to generate a burr, the burr is on the second narrowed portion 123 side where the third groove portion 124 is not provided. It is likely to occur near the center of one short side of a certain quartz crystal vibrating element 110. In the quartz crystal vibrating element 110, the degree of the adverse effect on the main vibration mode due to the outer shape abnormality such as burrs is the outer shape abnormality in each side end, that is, the corner portion of the quartz crystal vibrating element than the outer shape abnormality in the central portion of each side. There is a smaller one. Therefore, it is more preferable to provide the third groove 124 in the second narrowed portion 123 than in the first narrowed portion 122. Further, it is desirable that the position where the third groove portion 124 is provided be a position offset to the crystal vibrating element 110 side of the second narrowed portion 123 as much as possible.

  The second connecting portion 130 mechanically connects the crystal vibrating element 110 and the frame portion 160 of the crystal vibrating element-aggregated wafer 100 together with the first connecting portion 120 described above to form a frame portion to be described later. Used to support with 160. The second connecting portion 130 extends from one short side of the quartz crystal vibrating element 110 along the other side of the two sides in the length direction of the quartz crystal vibrating element 110 from the one short side provided with the second electrode 113. Extending to the frame 160 facing the The second connection portion 130 is integrally formed with the crystal vibrating element 110 and the frame portion 160. The second connection portion 130 is provided with a second groove portion 131, a third narrowed portion 132, a fourth narrowed portion 133, and a fourth groove portion 134.

  The second groove portion 131 is for making it easy to break off the crystal vibrating element 110 from the second connection portion 130. The second groove 131 is a bottomed groove having an opening on one of the same upper surface or lower surface where the opening of the first groove 121 is provided. By providing the second groove portion 131, the rigidity of only a predetermined portion of the second connection portion 130 can be weakened, and when the crystal vibrating element 110 is broken off from the frame portion 160 in the second connection portion 130, the second By folding at the groove portion 131, the position to be folded can be arbitrarily controlled.

  The third narrowed portion 132 and the fourth narrowed portion 133 can absorb and absorb an impact or the like from the outside into the third narrowed portion 132 and the fourth narrowed portion 133, and maintain the entire rigidity of the second connection portion 130. It is to do. The third narrowed portion 132 and the fourth groove portion 133 sandwich the second groove portion 131 in the second connection portion 130, and the third narrowed portion 132 is on the other long side of the quartz crystal element 110 and the fourth narrowed portion 133 is It is provided so as to be on the side of the first connecting portion 120 provided in the same quartz crystal vibrating element 110. The thicknesses of the third narrowed portion 132 and the fourth narrowed portion 133 are the same as the thicknesses of the quartz crystal vibrating element 111 and the frame portion 160. In addition, the thickness of the third narrowed portion 132 and the fourth narrowed portion 133 is 20 to 70 μm.

  The fourth groove portion 134 is for making it easier to break the crystal vibrating element 110 from the second connection portion 130, and to reduce the adhesion of burrs to the crystal vibrating element 110. The fourth groove portion 134 is provided at the fourth narrowed portion 133 with a bottom. The opening of the fourth groove 134 is provided on the same surface as the surface on which the opening of the second groove 131 is provided. The depth of the fourth groove 134 is the same as the depth of the second groove 131 or deeper than the depth of the second groove 131, as shown in FIG. The fourth groove portion 134 may be provided in the third narrowed portion 132. However, in the case where the fourth groove portion 134 is provided in the third narrowed portion 132, when the quartz crystal vibrating element 110 is broken to generate burrs, the burrs are on the fourth narrowed portion 133 side where the fourth groove portion 134 is not provided. It is likely to occur near the center of one short side of a certain quartz crystal vibrating element 110. In the quartz crystal vibrating element 110, the degree of the adverse effect on the main vibration mode due to the outer shape abnormality such as burrs is the outer shape abnormality in each side end, that is, the corner portion of the quartz crystal vibrating element than the outer shape abnormality in the central portion of each side. There is a smaller one. Therefore, it is more preferable to provide the fourth groove portion 134 in the fourth narrowed portion 133 than in the third narrowed portion 132. In addition, it is desirable that the position where the fourth groove portion 134 is provided be a position offset to the side of the crystal vibrating element 110 of the fourth narrowed portion 133 as much as possible.

  The third groove portion 124 is provided at a position offset to the crystal vibrating element 110 side of the second narrowed portion 123, and the fourth groove portion 134 is provided at a position offset to the crystal vibrating element 110 side of the fourth narrowed portion 133 There is. With such a configuration, when the quartz crystal vibrating element 110 is separated from the quartz crystal vibrating element collecting wafer 100 at the position where the third groove 124 and the fourth groove 134 are formed, the sizes of the first connecting portion 120 and the second connecting portion 130 are large. In a state in which the portion is left on the frame portion 160 side of the quartz crystal vibrating element assembly wafer 100, that is, the quartz vibrating element 110 having a desired outer shape without the first connecting portion 120 and the second connecting portion 130 attached to the quartz vibrating element 110. You can get As described above, since it is possible to suppress the formation of burrs on the quartz crystal vibrating element 110 after being broken, it is possible to suppress the influence of the unnecessary vibration mode due to the incorrect outer shape generated when the quartz crystal vibrating element 110 is vibrated. It becomes possible. Further, since the burr can be prevented from contacting the substrate when the crystal vibrating device 110 is mounted on the substrate, it is possible to reduce the mounting of the crystal vibrating device 110 by tilting.

  A through hole 140 is provided between the first connection portion 120 and the second connection portion 130. The through hole 140 is a hole penetrating from the upper surface to the lower surface of the quartz-crystal vibrating device aggregate wafer 100, and the first connecting portion 120 and the second connecting portion 130 are configured to be symmetrical with the through hole 140 interposed therebetween. .

  The frame portion 160 is a thin plate made of quartz, and supports a plurality of quartz vibrating elements 110 provided with the first connecting portion 120 and the second connecting portion 130 while maintaining the rigidity of the whole quartz vibrating element aggregate wafer 100. belongs to. The frame portion 160 includes an outer frame 161 and a bar portion 162, and is integrally configured with a plurality of crystal vibrating elements 110 in which the first connecting portion 120 and the second connecting portion 130 are provided. The inner peripheral shape of the frame portion 160 consisting of the outer frame 161 and the crosspieces 162 is also rectangular.

  The outer frame 161 is provided to surround the four sides of the entire quartz crystal vibrating element assembly wafer 100. The outer peripheral shape in plan view is rectangular and has a predetermined width to have the required rigidity. The bar portions 162 are provided so as to connect two opposing sides of the inner periphery of the outer frame 161, and a plurality of bar portions 162 are provided in parallel at regular intervals.

  In the quartz crystal vibrating element 110 provided with the first connecting part 120 and the second connecting part 130, the long sides of the adjacent quartz vibrating elements 110 are parallel in the space formed by the inner periphery of the outer frame 161 and the crosspieces 162. It is arranged side by side in the same direction so that In addition, the first connection portion 120 and the second connection portion 130 provided in each of the quartz crystal vibrating elements 110 are the ends of the first connecting portion 120 and the second coupling portion 130 on the opposite side to the crystal vibrating element 110 side end. The part is connected to the inner periphery of the crosspiece 162 or the outer frame 161 located opposite to the end.

  The third electrode 150 is used as a terminal for measuring a characteristic value such as the frequency or CI (crystal impedance) of each quartz vibrator 110 in the state of the quartz crystal vibrating element assembly wafer 100. The third electrode 150 is connected to the first connecting portion 120 from the second electrode 113 provided on each of the quartz crystal vibrating elements 110 in a state where the plurality of quartz crystal vibrating elements 110 are disposed and connected in the quartz crystal vibrating element aggregate wafer 100. Through the surface of the second connection portion 130, the first connection portion 120 and the second connection portion 130 are extended to the surfaces of the outer frame 161 and the cross portion 162 which are connected. The thickness of the third electrode 150 formed inside the third groove 124 and the fourth groove 134 is the same as the thickness of the third electrode 150 formed in the other portion of the first connecting portion 120 or the second connecting portion 130. It is very thin. In addition, the thickness of the third electrode 150 formed inside the first groove 121 and the second groove 131 is also the first connecting portion excluding the third electrode 150 formed inside the third groove 124 and the fourth groove 134. The thickness of the third electrode 150 is smaller than the thickness of the third electrode 150 formed on the second connection portion 130 or the second connection portion 130.

  The third electrode 150 is formed at a predetermined position of the first connecting portion 120, the second connecting portion 130, and the frame 160 simultaneously with the first electrode 112 and the second electrode 113 using, for example, a photolithographic technique and an etching technique. It is formed. Specifically, metal films to be the third electrode 150 together with the first electrode 112 and the second electrode 113 are formed on both main surfaces of the quartz crystal vibrating element assembly wafer 100 in which the portions to be the plurality of quartz element plates 111 are formed. A film is formed, and a photosensitive resist is applied on the metal film. Thereafter, exposure and development are performed such that a predetermined pattern of the photosensitive resist (portions to be the first electrode 112, the second electrode 113, and the third electrode 150) remains. Finally, the exposed metal film is peeled off to remove the remaining photosensitive resist. Thus, the third electrode 150 is formed at a predetermined position of the portion to be the first connecting portion 120, the second connecting portion 130, and the frame portion 160 of the quartz crystal vibrating element assembly wafer 100. Although the case of forming using photolithography technology and etching technology is described here, it may be formed using, for example, sputtering technology or vapor deposition technology.

  In addition, the third electrode 150 is formed so that silver or gold is laminated on chromium. By using chromium as a base, it is possible to secure adhesion between gold and silver while securing adhesion between the first connection portion 120, the second connection portion 130 and the frame portion 160 and the third electrode 150. It becomes.

  A plurality of quartz crystal vibrating element assembly wafers 100 according to the embodiment of the present invention are arranged side by side in a space surrounded by a flat frame portion 160 whose outer and inner circumferential shapes are rectangular in plan view, and the frame portion 160. The quartz vibrating element 110 having a rectangular planar shape and a rectangular shape in plan view in which at least the first electrode 112 and the second electrode 113 are formed, one side of the inner periphery of the frame 160, and the second electrode 113 of each quartz vibrating element 110 The first connecting portion 120 and the second connecting portion 130 connected so as to extend from the provided one side, and the first connecting portion 120 and the second connecting portion 130 provided in the same crystal vibrating element 110 , A third electrode 150 extending from the second electrode 113 to the surface of the frame 160 through the surfaces of the first connecting portion 120 and the second connecting portion 130, and a first connecting portion Top or bottom of 120 A first groove 121 having an opening provided in one of the two, and a second groove 131 having an opening provided on the same surface as the surface provided with the first groove 121 of the second connection 130; The first narrowing portion 122 and the second narrowing portion 123 provided so as to sandwich the first groove portion 121 of the one connection portion 120, and the second provided for the same crystal vibrating element 110 in which the first connection portion 120 is provided A third groove portion 124 provided in the second narrowed portion 123 on the connecting portion 130 side, and a third narrowed portion 132 and a fourth narrowed portion 133 provided so as to sandwich the second groove portion 131 of the second connected portion 130; A fourth groove portion 134 provided in a fourth narrowed portion 133 on the side of the first connection portion 120 provided to the same quartz crystal vibrating element 110 in which the second connection portion 130 is provided is provided.

  With such a configuration, the amount of metal constituting the third electrode 150 in the third groove 124 and the fourth groove 134 provided by the vapor deposition method and sputtering is equal to that of the third groove 124 and the fourth groove 134 by masking. The amount of metal attached is smaller than that of the other portions of the first connection portion 120 and the second connection portion 130 due to the effect of reducing the entrapment of metal on the side surface side, and the film thickness of the third electrode 150 can be reduced. . Therefore, when the first connecting portion 120 and the second connecting portion 130 are broken at the position where the third groove portion 124 and the fourth groove portion 134 are formed, the third electrode 150 has a thin film thickness, so The formed third electrode 150 can significantly reduce the influence of the ductility of the metal, and simultaneously breaking the first connection portion 120 and the second connection portion 130 and the third electrode 150 formed on the surface thereof. It becomes possible.

  Further, in the quartz crystal vibrating element aggregate wafer 100 according to the embodiment of the present invention, a plurality of the frame portions 160 enclosing the space in which the quartz crystal vibrating elements 110 are disposed inside by the outer frame 161 and the crosspieces 162 constituting the frame portion 160. It is provided so as to be adjacent. With such a configuration, even when the size of the quartz crystal vibrating element wafer 100 is increased, it is possible to dispose a large number of quartz vibrating elements 110 while maintaining the rigidity of the entire wafer.

  Further, in the crystal vibrating element collective wafer 100 according to the embodiment of the present invention, the third groove portion 124 is provided at a position offset to the crystal vibrating element 110 side of the second narrowed portion 123, and the fourth groove portion 134 is fourth It is provided at a position offset to the quartz crystal vibrating element 110 side of the narrowed portion 133. With such a configuration, when the quartz crystal vibrating element 110 is separated from the quartz crystal vibrating element collecting wafer 100 at the position where the third groove 124 and the fourth groove 134 are formed, the sizes of the first connecting portion 120 and the second connecting portion 130 are large. In a state in which the portion is left on the frame portion 160 side of the quartz crystal vibrating element assembly wafer 100, that is, the quartz vibrating element 110 having a desired outer shape without the first connecting portion 120 and the second connecting portion 130 attached to the quartz vibrating element 110. You can get Therefore, it becomes possible to suppress the influence of the unnecessary vibration mode due to the incorrect external shape generated when the quartz crystal vibrating element 110 is vibrated.

  Further, in the quartz crystal vibrating wafer according to the embodiment of the present invention, the depth of the third groove 124 is deeper than the depth of the first groove 121, and the depth of the fourth groove 134 is It is deeper than the depth of the two groove portion 131. With such a configuration, the rigidity of the portion of the third groove 124 in the first connection portion 120 can be the weakest, and the rigidity of the portion of the fourth groove 134 in the second connection portion 130 can be the weakest. Further, when the quartz crystal vibrating element 110 in the third groove portion 124 and the fourth groove portion 134 is broken, wrapping of the third groove portion 124 and the fourth groove portion 134 to the metal side of the third electrode 150 is further caused by masking. Thus, the amount of metal to be attached is significantly smaller than that of the first connection portion 120 and the other portions of the second connection portion 130, and the film thickness of the third electrode 150 can be made extremely thin. Therefore, when the first connecting portion 120 and the second connecting portion 130 are broken at the position where the third groove portion 124 and the fourth groove portion 134 are formed, the thickness of the third groove portion 124 and the third groove portion 124 Since the film thickness of the third electrode 150 is very thin, the third electrode 150 formed on the surface can significantly reduce the influence of the ductility of the metal, and the first connecting portion 120 and the second connecting portion 130 and the surface thereof At the same time, it is easy to break off the third electrode 150 formed on the

(Modification)
FIG. 4 is a partially enlarged view showing a quartz crystal vibrating element assembly wafer according to a modification of the embodiment described above, in the same place as the imaginary circle A shown in FIG. In addition, the crystal vibrating element collective wafer 100 according to the modification of the embodiment described above is provided such that one side outside the first connecting portion 120 is positioned on the extension of one long side of the crystal vibrating element 110. The second embodiment is different from the above-described embodiment in that one side outside the second connection portion 130 is provided on the extension of the other long side of the crystal vibrating element 110.

  With such a configuration, even when a portion of the first connection portion 120 or the second connection portion 130 is attached to the quartz crystal vibrating element 110 when the quartz crystal vibrating element 110 is broken, it is attached. The position is only near the corner where the vibration mode of the quartz crystal element 110 is less affected. Therefore, the broken crystal vibrating element 110 can vibrate only in a desired vibration mode.

  The present invention is not limited to the above-described embodiments, and various changes, improvements, and the like can be made without departing from the scope of the present invention. For example, in the embodiment described above, the quartz crystal vibrating element 110 is AT-cut and has a rectangular outer shape in plan view, but may be processed at another cut angle. Also, the external shape may be a crystal vibrating element having another external shape such as a tuning fork shape.

100 ... crystal vibration element assembly wafer 110 ... crystal vibration element 111 ... crystal base plate 112 ... first electrode 113 ... second electrode 120 ... first connection portion 121 ... first First groove portion 122 ··· First narrowed portion 123 ··· Second narrowed portion 124 ··· Third groove portion 130 ··· Second connecting portion 131 ··· Second groove portion 132 ··· Third narrowed portion 133 · · · · · Fourth narrowed portion 134 · · · fourth groove portion 140 · · · through hole 150 · · · third electrode 160 · · · frame portion 161 · · · outer frame 162 · · ·

Claims (4)

The outer frame and the inner frame are rectangular in plan view and have a flat frame-like frame portion,
A quartz vibrating element having a rectangular shape in a plan view, arranged in a plurality and arranged in a space surrounded by the frame portion and having at least a first electrode and a second electrode formed on the surface;
A first connecting portion and a second connecting portion connected so as to extend from one side of the inner periphery of the frame portion and one side where the second electrode of each of the quartz crystal vibrating elements is provided;
A through hole provided between the first connection portion and the second connection portion provided in the same quartz crystal vibrating element;
A third electrode extending from the second electrode to the surface of the frame through the surfaces of the first connecting portion and the second connecting portion;
An opening provided on the same surface as a first groove having an opening provided on either the upper surface or the lower surface of the first connecting part, and the surface provided with the first groove on the second connecting part A second groove having
A first narrowed portion and a second narrowed portion provided so as to sandwich the first groove portion of the first connection portion;
A third groove portion provided in a narrowed portion provided in the first connection portion;
A third narrowed portion and a fourth narrowed portion provided so as to sandwich the second groove portion of the second connection portion, and a fourth groove portion provided in the narrowed portion provided with the second connection portion;
Equipped with
The third groove portion is provided at a position offset to the crystal vibrating element side of the second narrowed portion,
The wafer having the fourth groove portion is provided at a position offset to the crystal vibrating element side of the fourth narrowed portion . The outer frame and the inner frame are rectangular in plan view and have a flat frame-like frame portion,
A quartz vibrating element having a rectangular shape in a plan view, arranged in a plurality and arranged in a space surrounded by the frame portion and having at least a first electrode and a second electrode formed on the surface;
A first connecting portion and a second connecting portion connected so as to extend from one side of the inner periphery of the frame portion and one side where the second electrode of each of the quartz crystal vibrating elements is provided;
A through hole provided between the first connection portion and the second connection portion provided in the same quartz crystal vibrating element;
A third electrode extending from the second electrode to the surface of the frame through the surfaces of the first connecting portion and the second connecting portion;
An opening provided on the same surface as a first groove having an opening provided on either the upper surface or the lower surface of the first connecting part, and the surface provided with the first groove on the second connecting part A second groove having
A first narrowed portion and a second narrowed portion provided so as to sandwich the first groove portion of the first connection portion;
A third groove portion provided in a narrowed portion provided in the first connection portion;
A third narrowed portion and a fourth narrowed portion provided so as to sandwich the second groove portion of the second connection portion, and a fourth groove portion provided in the narrowed portion provided with the second connection portion;
Equipped with
The depth of the third groove is deeper than the depth of the first groove, and the depth of the fourth groove is deeper than the depth of the second groove. Quartz crystal vibrator assembly wafer. The frame is composed of an outer frame and a crosspiece, and a plurality of spaces surrounded by the outer frame and the crosspiece are provided adjacent to each other inside the outer frame. The quartz crystal vibrator assembly wafer according to claim 1 or 2 , characterized in that: One side of the outside of the first connecting portion is provided on an extension of one long side of the crystal vibrating element, and one side of the outside of the second connecting portion is the other side of the crystal vibrating element. crystal vibrating element set wafer according to claim 1 to 3, characterized in that are provided so as to be positioned on the extension of the long sides.

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