JP6507592B2 - Electronic component conveying apparatus, electronic component inspection apparatus and electronic component pressing apparatus - Google Patents

Description

  The present invention relates to an electronic component conveyance device, an electronic component inspection device, and an electronic component pressing device.

  Conventionally, an electronic component inspection apparatus for inspecting the electrical characteristics of an electronic component such as an IC device is known, and in this electronic component inspection apparatus, an electronic component for conveying the IC device to the holding unit of the inspection unit A transport device is incorporated. At the time of inspection of the IC device, the IC device held by the holding unit of the electronic component transfer device is disposed in the holding unit. Then, the gripping unit presses the IC device toward the holding unit. As a result, the plurality of terminals of the IC device are respectively pressed against the plurality of probe pins provided in the holding portion, and the respective terminals of the IC device are in contact with the respective probe pins to be electrically connected.

  In addition, at the time of inspection of the IC device, the IC device may be adjusted to a desired temperature and the inspection may be performed. In this case, a member having a heat sink (heat sink / heat sink) is brought into contact with the IC device to perform heat exchange with the IC device (see, for example, Patent Document 1).

Japanese Patent Application Publication No. 2003-28923

  However, in the device described in Patent Document 1, it is difficult to perform sufficient heat exchange, that is, temperature control, since the heat sink is configured only to be fixedly installed.

  An object of the present invention is to provide an electronic component conveying apparatus, an electronic component inspection apparatus, and an electronic component pressing apparatus capable of performing temperature control on electronic components more accurately, or capable of achieving more responsive temperature control. It is.

Such an object is achieved by the present invention described below.
Application Example 1
The electronic component conveying apparatus according to the present invention is a heat conducting portion capable of gripping the electronic component and capable of conducting heat;
A temperature detection unit disposed in the heat conduction unit and made of a dissimilar metal;
Have a, a platinum sensor located on the heat conducting part,
It is characterized by judging whether the detection value detected by the temperature detection part is usable based on the detection value detected by the platinum sensor .
Application Example 2
The electronic component conveying apparatus according to the present invention is a heat conducting portion capable of gripping the electronic component and capable of conducting heat;
A temperature detection unit disposed in the heat conduction unit and made of a dissimilar metal;
And a platinum sensor disposed in the heat conducting part;
The detection value detected by the temperature detection unit is corrected based on the detection value detected by the temperature detection unit and the detection value detected by the platinum sensor.
Application Example 3
The electronic component conveying apparatus according to the present invention is a heat conducting portion capable of gripping the electronic component and capable of conducting heat;
A temperature detection unit disposed in the heat conduction unit and made of a dissimilar metal;
And a platinum sensor disposed in the heat conducting part;
The heat conducting portion includes a heat conducting member and an abutting member capable of abutting on the electronic component,
The platinum sensor is disposed on the heat conduction member, and the temperature detection unit is disposed on the contact member.
Application Example 4
In the electronic component transfer apparatus of the present invention, the position of the temperature detection unit is preferably closer to the electronic component than the position of the platinum sensor.

  Thereby, temperature control on the electronic component can be more accurately performed, or more responsive of temperature control can be achieved.

Application Example 5
In the electronic component transport apparatus of the present invention, the temperature detection unit is preferably a thermocouple.

  As a result, a small-sized temperature detection unit can be used, and hence the temperature detection unit can be easily arranged at a desired position regardless of the arrangement position of the temperature detection unit.

Application Example 6
In the electronic component transport apparatus according to the present invention, it is preferable that the position of the electronic component is between the position of the temperature detection unit and the position of the platinum sensor when viewed in plan from the direction in which the electronic component is pressed.
Thereby, the temperature detection range for the electronic component can be secured as wide as possible.

Application Example 7
In the electronic component transport apparatus according to the present invention, the heat conduction portion is disposed so as to be in contact with or separated from the heat conduction portion, and the heat radiation portion capable of radiating heat by passing the fluid;
And a contact drive unit that brings the heat dissipation unit into contact with the heat conduction unit.
The contact drive unit is preferably configured by a fluid device.

  Thus, for example, power consumption can be suppressed, and piping, wiring, and the like can be simplified as compared with the case where the contact drive unit is configured by an electric device such as a motor. In addition, it contributes to the miniaturization of the contact drive part, that is, space saving.

Application Example 8
In the electronic component transport apparatus according to the present invention, the contact drive unit preferably includes a cylinder portion having a hollow portion and a piston portion sliding in the hollow portion.

  As a result, for example, power consumption can be further suppressed and piping, wiring, and the like can be further simplified as compared with the case where the contact drive unit is configured by an electric device such as a motor. In addition, the contact drive unit can be further reduced in size, that is, the space can be saved.

Application Example 9
In the electronic component transport apparatus according to the present invention, preferably, the piston portion has a larger elastic deformation rate or plastic deformation rate than the heat dissipation portion.

  As a result, it is possible to prevent or suppress collision noise that may occur between the piston portion and the heat dissipation portion and wear of the heat dissipation portion.

Application Example 10
In the electronic component transport apparatus according to the present invention, it is preferable that a member having a larger elastic deformation rate or plastic deformation rate than the piston portion and the heat dissipation portion is interposed between the piston portion and the heat dissipation portion.

  As a result, it is possible to prevent or suppress the heat radiation portion, the collision noise that may occur between the piston portion and the heat radiation portion, and the wear of the piston portion.

Application Example 11
In the electronic component transfer apparatus of the present invention, it is preferable that a plate member be interposed between the piston portion and the heat dissipation portion.

  As a result, it is possible to prevent or suppress the collision noise that may occur between the piston portion and the heat dissipation portion, and the wear of the heat dissipation portion and the piston portion.

Application Example 12
In the electronic component transfer apparatus according to the present invention, it is preferable that the separation driving unit has a separation driving unit for separating the heat dissipation unit from the heat conduction unit, and the separation driving unit includes an elastic member.
Thus, the heat radiating portion can be separated from the heat conducting portion with a simple configuration.

Application Example 13
In the electronic component transfer apparatus of the present invention, a heat insulating member is preferably provided between the elastic member and the heat radiating portion.

  Thereby, it is possible to prevent the heat from the heat conducting portion from being transmitted to the heat radiating portion via the elastic member.

Application Example 14
In the electronic component transfer apparatus of the present invention, the elastic member is a coil spring,
It is preferable that a convex member protruding in a convex shape on the coil spring side be provided between the coil spring and the heat radiating portion.
Thereby, the coil spring can be stably expanded and contracted.

Application Example 15
In the electronic component transfer apparatus of the present invention, the convex member preferably has heat insulation.

  Thereby, it is possible to prevent the heat from the heat conducting portion from being transmitted to the heat radiating portion via the elastic member.

Application 16
In the electronic component transfer apparatus of the present invention, it is preferable that a convex member protruding in a convex shape on the coil spring side and a heat insulating member be provided between the coil spring and the heat radiating portion.

  Thereby, it is possible to prevent the heat from the heat conducting portion from being transmitted to the heat radiating portion via the elastic member. Also, the coil spring can be stably expanded and contracted.

Application Example 17
In the electronic component conveying apparatus according to the present invention, preferably, a direction in which the heat radiating portion abuts on the heat conducting portion is a direction in which the heat conducting portion abuts on the electronic component.

  Thereby, since both directions become the same, for example, the configuration of the electronic component transfer apparatus can be simplified, and control becomes easy.

Application Example 18
In the electronic component transport apparatus according to the present invention, the direction in which the heat dissipating part is separated from the heat conducting part is preferably opposite to the direction in which the heat conducting part is in contact with the electronic component.

  Thereby, since both directions become the same, for example, the configuration of the electronic component transfer apparatus can be simplified, and control becomes easy.

Application Example 19
In the electronic component transfer apparatus according to the present invention, the heat dissipation portion preferably has a heat dissipation member.
Thus, the heat can be easily dissipated through the heat dissipating member.

Application Example 20
In the electronic component transport apparatus according to the present invention, the heat radiating portion preferably has a heat conducting member whose heat capacity is larger than the heat capacity of the heat radiating member.

  Thereby, the heat of the heat conducting portion can be rapidly transmitted to the heat radiating member through the heat conducting member in a state where the heat radiating portion is in contact with the heat conducting portion, and the heat radiation effect is improved.

Application Example 21
In the electronic component transfer apparatus of the present invention, the fluid is preferably air.
This can prevent contamination of peripheral devices and the like by the fluid.

Application Example 22
In the electronic component transfer apparatus according to the present invention, it is preferable that the fluid be sprayed while the heat dissipating portion is in contact with or separated from the heat conducting portion.

  As a result, a temperature difference between the heat radiating portion and the heat conducting portion can be sufficiently secured, whereby heat absorption to the heat conducting portion can be performed more quickly while the heat radiating portion is in contact with the heat conducting portion. The heat dissipation effect is enhanced.

Application Example 23
In the electronic component transfer apparatus of the present invention, the stroke when the heat dissipation part abuts or separates from the heat conducting part is preferably more than 0 mm and less than 5 mm.

  Thus, the moving time of the heat dissipating unit can be shortened as much as possible, and therefore, quick heat exchange can be performed between the heat dissipating unit and the heat conducting unit.

Application Example 24
The electronic component inspection apparatus according to the present invention is a heat conducting part capable of gripping the electronic component and capable of conducting heat.
A temperature detection unit made of dissimilar metals disposed in the heat conduction unit;
A platinum sensor disposed in the heat conducting portion;
And an inspection unit for inspecting the electronic component ,
It is characterized by judging whether the detection value detected by the temperature detection part is usable based on the detection value detected by the platinum sensor .
Application Example 25
The electronic component inspection apparatus according to the present invention is a heat conducting part capable of gripping the electronic component and capable of conducting heat.
A temperature detection unit made of dissimilar metals disposed in the heat conduction unit;
A platinum sensor disposed in the heat conducting portion;
And an inspection unit for inspecting the electronic component,
The detection value detected by the temperature detection unit is corrected based on the detection value detected by the temperature detection unit and the detection value detected by the platinum sensor .
Application 26
The electronic component inspection apparatus according to the present invention is a heat conducting part capable of gripping the electronic component and capable of conducting heat.
A temperature detection unit made of dissimilar metals disposed in the heat conduction unit;
A platinum sensor disposed in the heat conducting portion;
And an inspection unit for inspecting the electronic component,
The heat conducting portion includes a heat conducting member and an abutting member capable of abutting on the electronic component,
The platinum sensor is disposed on the heat conduction member, and the temperature detection unit is disposed on the contact member.

  Thereby, temperature control on the electronic component can be more accurately performed, or more responsive of temperature control can be achieved.

Application Example 27
The electronic component pressing device according to the present invention is a heat conducting portion capable of gripping the electronic component and capable of conducting heat,
A temperature detection unit made of dissimilar metals disposed in the heat conduction unit;
And a platinum sensor disposed in the heat conducting part ,
It is characterized by judging whether the detection value detected by the temperature detection part is usable based on the detection value detected by the platinum sensor .
Application Example 28
The electronic component pressing device according to the present invention is a heat conducting portion capable of gripping the electronic component and capable of conducting heat,
A temperature detection unit made of dissimilar metals disposed in the heat conduction unit;
And a platinum sensor disposed in the heat conducting part,
The detection value detected by the temperature detection unit is corrected based on the detection value detected by the temperature detection unit and the detection value detected by the platinum sensor.
Application Example 29
The electronic component pressing device according to the present invention is a heat conducting portion capable of gripping the electronic component and capable of conducting heat,
A temperature detection unit made of dissimilar metals disposed in the heat conduction unit;
And a platinum sensor disposed in the heat conducting part,
The heat conducting portion includes a heat conducting member and an abutting member capable of abutting on the electronic component,
The platinum sensor is disposed on the heat conduction member, and the temperature detection unit is disposed on the contact member.

  Thereby, temperature control on the electronic component can be more accurately performed, or more responsive of temperature control can be achieved.

FIG. 1 is a schematic view showing a first embodiment of the electronic component inspection device of the present invention. FIG. 2 is a plan view showing the operating state of the main part of the electronic component inspection device shown in FIG. FIG. 3 is a schematic exploded perspective view showing the inspection robot of the transport unit of the electronic component inspection device shown in FIG. FIG. 4 is a vertical sectional view showing an operating state of one hand unit of the socket layout kit mountable to the inspection robot shown in FIG. FIG. 5 is a vertical sectional view showing the operating state of one hand unit of the socket layout kit mountable to the inspection robot shown in FIG. FIG. 6 is an enlarged detailed vertical sectional view showing a state in which the hand unit shown in FIGS. 4 and 5 grips an IC device. FIG. 7 is a perspective view showing a piston portion of the hand unit shown in FIGS. 4 and 5. FIG. 8 is a horizontal cross-sectional view showing the heat sink of the hand unit shown in FIGS. 4 and 5 and the periphery thereof. FIG. 9 is a plan view showing a positional relationship between a thermocouple, a platinum sensor, and an IC device which the hand unit shown in FIGS. 4 and 5 has. FIG. 10 is a plan view showing the positional relationship between the first contact member and the second contact member in the contact members of the hand unit shown in FIGS. 4 and 5. FIG. 11 is a vertical longitudinal sectional view showing a state in which the first contact member of the hand unit shown in FIGS. 4 and 5 is deformed according to the IC device. FIG. 12 is a block diagram showing the relationship of the main parts in the hand unit shown in FIG. 4 and FIG. FIG. 13 is a vertical longitudinal sectional view showing the heat sink of one hand unit and the periphery thereof in the electronic component inspection device (second embodiment) of the present invention. FIG. 14 is a vertical longitudinal sectional view showing a separation driving unit of one hand unit in the electronic component inspection device (third embodiment) of the present invention.

  Hereinafter, an electronic component conveyance device, an electronic component inspection device, and an electronic component pressing device according to the present invention will be described in detail based on preferred embodiments shown in the attached drawings.

First Embodiment
FIG. 1 is a schematic view showing a first embodiment of the electronic component inspection device of the present invention. FIG. 2 is a plan view showing the operating state of the main part of the electronic component inspection device shown in FIG. FIG. 3 is a schematic exploded perspective view showing the inspection robot of the transport unit of the electronic component inspection device shown in FIG. FIGS. 4 and 5 are vertical sectional views showing the operating state of one hand unit of the socket layout kit mountable to the inspection robot shown in FIG. FIG. 6 is an enlarged detailed vertical sectional view showing a state in which the hand unit shown in FIGS. 4 and 5 grips an IC device. FIG. 7 is a perspective view showing a piston portion of the hand unit shown in FIGS. 4 and 5. FIG. 8 is a horizontal cross-sectional view showing the heat sink of the hand unit shown in FIGS. 4 and 5 and the periphery thereof. FIG. 9 is a plan view showing a positional relationship between a thermocouple, a platinum sensor, and an IC device which the hand unit shown in FIGS. 4 and 5 has. FIG. 10 is a plan view showing the positional relationship between the first contact member and the second contact member in the contact members of the hand unit shown in FIGS. 4 and 5. FIG. 11 is a vertical longitudinal sectional view showing a state in which the first contact member of the hand unit shown in FIGS. 4 and 5 is deformed according to the IC device. FIG. 12 is a block diagram showing the relationship of the main parts in the hand unit shown in FIG. 4 and FIG.

  In the following, for convenience of explanation, as shown in FIG. 1, three axes orthogonal to each other are taken as an X axis, a Y axis, and a Z axis. Further, the XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. Also, a direction parallel to the X axis is also referred to as "X direction", a direction parallel to the Y axis is also referred to as "Y direction", and a direction parallel to the Z axis is also referred to as "Z direction". Further, the upper side in the Z-axis direction in FIGS. 3 to 7 and 11 (also in FIGS. 13 and 14) is referred to as “upper” or “upper”, and the lower side as “lower” or “lower”. In addition, “horizontal” referred to in the specification of the present application is not limited to perfect horizontal, and includes a state of being slightly inclined (for example, less than about 5 °) with respect to horizontal unless transport of electronic components is inhibited.

  The inspection apparatus (electronic component inspection apparatus) 1 shown in FIG. 1 is, for example, an IC device such as a BGA (Ball Grid Array) package or LGA (Land Grid Array) package, LCD (Liquid Crystal Display), OLED (Organic Electroluminescence Display) , Electronic paper and other display devices, CIS (CMOS Image Sensor), CCD (Charge Coupled Device), various sensors such as acceleration sensors, gyro sensors, pressure sensors, and various vibrators including a crystal vibrator, etc. It is a device for inspecting and testing the electrical characteristics of parts (hereinafter simply referred to as "inspection"). In the following, for convenience of explanation, the case of using an IC device as the electronic component to be inspected will be representatively described, and this will be referred to as “IC device 9”. Further, in the present embodiment, as the configuration of the IC device 9, a plate-like circuit portion 91 having a terminal and a plate-like semiconductor portion (wafer portion) 92 mounted on the central portion of the circuit portion 91 are provided. As an example. The semiconductor unit 92 has a smaller area than the circuit unit 91 in plan view of the IC device 9 (see FIGS. 9 and 10).

  As shown in FIG. 1, the inspection apparatus 1 controls the supply unit 2, the supply side arrangement unit 3, the transport unit 4, the inspection unit 5, the collection side arrangement unit 6, the collection unit 7, and these units. And a control unit 8 for performing the control. The inspection apparatus 1 further includes a supply unit 2, a supply side arrangement unit 3, a transport unit 4, an inspection unit 5, a collection side arrangement unit 6 and a collection unit 7, a base 11 for arranging the supply side arrangement unit 3, and a conveyance unit 4. And a cover 12 which is covered on the base 11 so as to accommodate the inspection unit 5 and the recovery side array unit 6. The base surface 111 which is the upper surface of the base 11 is substantially horizontal, and the constituent members of the supply side arranging unit 3, the conveying unit 4, the inspection unit 5, and the collection side arranging unit 6 are arranged on the base surface 111. ing. The inspection apparatus 1 may further include a heater, a chamber, and the like for heating the IC device 9 as necessary.

  In such an inspection apparatus 1, the supply unit 2 supplies the IC device 9 to the supply side arranging unit 3, the supply side arranging unit 3 arranges the supplied IC devices 9, and the conveying unit 4 arranges the IC device 9. The inspection unit 5 inspects the transferred IC device 9 to the inspection unit 5, and the conveyance unit 4 conveys / arranges the IC device 9 after inspection to the recovery side arranging unit 6, and the collection side arranging unit 6 The recovery unit 7 is configured to recover the arrayed IC devices 9. According to such an inspection apparatus 1, the supply, inspection, and recovery of the IC device 9 can be performed automatically. In the inspection apparatus 1, the configuration excluding the inspection unit 5, that is, conveyance by the supply unit 2, the supply side arrangement unit 3, the conveyance unit 4, the collection side arrangement unit 6, the collection unit 7 and a part of the control unit 8 An apparatus (electronic component transfer apparatus) 10 is configured. The transport apparatus 10 transports the IC device 9 and the like.

Hereinafter, configurations of the transport unit 4 and the inspection unit 5 will be described.
«Conveying section»
As shown in FIG. 2, the transport unit 4 transports the IC device 9 disposed on the mounting stage 341 of the supply side arranging unit 3 to the inspection unit 5, and the IC device finished the inspection by the inspection unit 5. 9 is a unit for transporting the collection side arrangement unit 6 The transport unit 4 includes a shuttle 41, a supply robot 42, an inspection robot 43, and a recovery robot 44.

-Shuttle-
In order to transport the IC device 9 on the mounting stage 341 to the vicinity of the inspection unit 5, the shuttle 41 further transports the inspected IC device 9 inspected by the inspection unit 5 to the vicinity of the collection side array unit 6. It is a shuttle to In such a shuttle 41, four pockets 411 for accommodating (arranging) the IC device 9 are formed side by side in the X direction. The shuttle 41 is guided by a linear motion guide, and can be reciprocated in the X direction by a drive source such as a linear motor.

-Supply robot-
The supply robot 42 is a robot that conveys the IC device 9 disposed on the mounting stage 341 to the shuttle 41. Such a supply robot 42 is supported by a support frame 421 supported by the base 11 and a movable frame 422 supported by the support frame 421, capable of reciprocating in the Y direction with respect to the support frame 421, and a movable frame 422. And four hand units (gripping robots) 423. Each hand unit 423 includes an elevation mechanism and a suction nozzle, and can be held by suction of the IC device 9.

-Inspection robot-
The inspection robot 43 is a robot that conveys the IC device 9 accommodated in the shuttle 41 to the inspection unit 5 and conveys the IC device 9 after inspection to the shuttle 41 from the inspection unit 5. The inspection robot 43 is moved by a support frame 431 supported by the base 11, a movable frame (pressing member disposition member attachment member) 432 supported by the support frame 431 and capable of reciprocating in the Y direction with respect to the support frame 431. And a socket layout kit 45 mounted on (supported by) the frame 432. The socket layout kit 45 includes a plurality of hand units 46 as pressing members capable of pressing the IC device 9. Then, at the time of inspection, the inspection robot 43 can press the IC device 9 against the inspection unit 5 which is a socket via each hand unit 46. Thus, a predetermined inspection pressure can be applied to the IC device 9. The configuration of the socket layout kit 45 will be described later.

-Recovery robot-
The recovery robot 44 is a robot that transports the IC device 9 that has been inspected by the inspection unit 5 to the recovery side arranging unit 6. Such a recovery robot 44 is supported by a support frame 441 supported by the base 11 and a movable frame 442 supported by the support frame 441 and capable of reciprocating in the Y direction with respect to the support frame 441 and a movable frame 442 And four hand units (gripping robots) 443. Each hand unit 443 includes an elevation mechanism and a suction nozzle, and can hold the IC device 9 by suction.

  The transport unit 4 transports the IC device 9 as follows. First, the shuttle 41 moves to the left in the drawing, and the supply robot 42 transports the IC device 9 on the mounting stage 341 to the shuttle 41 (STEP 1). Next, the shuttle 41 moves to the center, and the inspection robot 43 transports the IC device 9 on the shuttle 41 to the inspection unit 5 (STEP 2). Next, the inspection robot 43 transports the IC device 9 that has been inspected by the inspection unit 5 to the shuttle 41 (STEP 3). Next, the shuttle 41 moves to the right in the figure, and the recovery robot 44 transports the tested IC device 9 on the shuttle 41 to the recovery side arranging unit 6 (STEP 4). By repeating such STEP 1 to STEP 4, the IC device 9 can be transported to the collection side arranging unit 6 via the inspection unit 5.

  The configuration of the transport unit 4 has been described above. The configuration of the transport unit 4 is to transport the IC device 9 on the mounting stage 341 to the inspection unit 5 and to collect the IC device 9 after inspection. It is not particularly limited as long as it can be transported to the center. For example, the shuttle 41 is omitted, and one of the supply robot 42, the inspection robot 43, and the recovery robot 44 transports the mounting stage 341 to the inspection unit 5, and the inspection unit 5 to the collection side arranging unit 6 You may carry out to.

<< inspection department >>
The inspection unit 5 is a unit for inspecting and testing the electrical characteristics of the IC device 9. As shown in FIG. 2, the inspection unit 5 includes eight holding units 51 in which the IC device 9 is disposed. Each of the holding parts 51 is provided with a plurality of probe pins (electrode terminals) (not shown) electrically connected to the terminals (electrode terminals) of the IC device 9. Each probe pin is electrically connected to the control unit 8. When testing the IC device 9, one IC device 9 is disposed (held) in one holding unit 51. Each terminal of the IC device 9 disposed in the holding unit 51 is pressed against each probe pin at a predetermined inspection pressure by the pressing of the hand unit 46 of the inspection robot 43. Thereby, each terminal of the IC device 9 and each probe pin are electrically connected (contacted), and the inspection of the IC device 9 is performed via the probe pin. The inspection of the IC device 9 is performed based on a program stored in the control unit 8.

«Control section»
The control unit 8 has, for example, an inspection control unit and a drive control unit. The inspection control unit inspects, for example, the electrical characteristics of the IC device 9 disposed in the inspection unit 5 based on a program stored in a memory (not shown). Further, the drive control unit controls, for example, driving of each of the supply unit 2, the supply side arranging unit 3, the transport unit 4, the inspection unit 5, the collection side arranging unit 6 and the collection unit 7, conveyance of the IC device 9, etc. I do.

«Socket Layout Kit»
As described above, the inspection robot 43 has the socket layout kit 45 mounted on the movable frame 432 capable of reciprocating in the Y direction. The socket layout kit 45 is an electronic component pressing device for pressing the IC device 9 against the inspection unit 5.

  As shown in FIG. 3, the socket layout kit 45 has the same number as the holding portions 51 of the inspection portion 5 described above, that is, eight hand units 46 and a base on which the hand units 46 are disposed and supported (pressing member Arrangement member 47). As a result, eight IC devices 9 can be pressed together to the inspection unit 5, and therefore, the inspection efficiency can be improved.

  The socket layout kit 45 moves with the longitudinal direction of the base 47 as the X direction and the width direction orthogonal to the longitudinal direction as the Y direction, with the direction in which the IC device 9 is pressed as the Z axis direction and the plane view from that direction. It is attached to the frame 432 and used. Here, the method for attaching the socket layout kit 45 to the moving frame 432 is not particularly limited, and examples thereof include a method using screwing. When the screw method is used, the socket layout kit 45 is detachably mounted on the moving frame 432. This facilitates replacement of the socket layout kit 45.

  By the way, the socket layout kit 45 is replaced with one having a different arrangement number and arrangement mode of the hand units 46 according to, for example, the type and size of the IC device 9 and the type of inspection.

  In the configuration shown in FIG. 3, in the socket layout kit 45, eight hand units 46 are arranged in the same matrix as the holding units 51 of the inspection unit 5, that is, two rows in the Y direction and four columns in the X direction. Are arranged in a matrix form. Among the two rows and four columns, there is also a socket layout kit 45 in which the pitch between the hand units 46 adjacent to each other in the X direction, that is, the center-to-center distance is different.

  In addition to the two rows and four columns, in the socket layout kit 45, for example, four hand units 46 are arranged in a matrix of two rows in the X direction and two columns in the Y direction, or six Hand units 46 are arranged in a matrix of two rows in the Y direction and three columns in the X direction, and twelve hand units 46 are arranged in a matrix of two rows in the Y direction and six columns in the X direction , 16 hand units 46 arranged in two rows in the Y direction and eight columns in the X direction, four hand units 46 in one row in the Y direction and four columns in the X direction The eight hand units 46 are arranged in one row in the Y direction and in eight rows in the X direction.

  As shown in FIG. 3, the base 47 is a member that constitutes the socket layout kit 45 and is attached to the movable frame 432 from the lower side.

  The base 47 is formed of a horizontally long plate member along the X direction, has a rectangular shape in a plan view, and is commonly used regardless of the number and arrangement of the hand units 46. As a result, the parts can be made common, which leads to cost reduction in manufacturing the socket layout kit 45.

  In the base 47, regardless of the number and arrangement of the hand units 46, when designing the socket layout kit 45, the arrangement of the hand units 46 relative to the base 47 is permitted in plan view of the base 47. The first area (pressing member disposition area) A1 which is the largest area is set in advance, that is, determined (see FIG. 3). In FIG. 3, the first area A1 is hatched. In the first area A1, the number and arrangement of the hand units 46 can be freely selected, whereby the degree of freedom in design of the socket layout kit 45 is improved.

  One defect portion 474 is equally spaced at an edge portion 473 on one side (right side in FIG. 3) along the Y direction of the base 47. The missing portion 474 is used, for example, as a part of a wiring path of a cable connected to each hand unit 46.

  The maximum length (full length) Lmax of the base 47 is preferably 100 mm or more and 400 mm or less, and more preferably 200 mm or more and 300 mm or less. The maximum width Wmax of the base 47 is preferably 50 mm or more and 200 mm or less, and more preferably 100 mm or more and 200 mm or less. The maximum thickness Tmax of the base 47 is preferably 4 mm or more and 10 mm or less, and more preferably 6 mm or more and 8 mm or less.

  The constituent material of the base 47 is not particularly limited, and, for example, various metal materials such as aluminum and an aluminum alloy can be used.

  As shown in FIGS. 4 and 5, the hand unit 46 includes a connecting structure (connecting portion) 20 in which the hand unit 46 is connected to the base 47, and the connecting structure on the lower side of the connecting structure 20. 20 having a heat conducting structure (heat conducting portion) 30 supported, and a heat radiating structure (heat radiating portion) 40 movable in the vertical direction between the connecting structure 20 and the heat conducting structure 30 There is. In FIG. 4 and FIG. 5, one hand unit 46 is depicted as a representative.

  The connection structure 20 includes a first fluid device 201, a second fluid device 202 located below the first fluid device 201, and an intermediate member located between the first fluid device 201 and the second fluid device 202. And 203.

  The first fluid device 201 is a device responsible for pressing and separating the testing unit 5 of the IC device 9. The first fluid device 201 includes a cylinder portion 201a, a piston portion 201b, and a diaphragm 201c.

  The cylinder portion 201a has a hollow portion 201d in which the diaphragm 201c is accommodated, and a flow path 201e which communicates with the hollow portion 201d and through which the working fluid 209a that deforms the diaphragm 201c passes.

  The piston portion 201b protrudes downward from the hollow portion 201d of the cylinder portion 201a, and is connected to the cylinder portion 201a via the diaphragm 201c.

  Then, when the working fluid 209a from the pump (not shown) flows into the hollow portion 201d through the flow path 201e and is supplied, the pressure in the hollow portion 201d rises, and the diaphragm 201c is deformed. As a result, the piston portion 201b and the members positioned below the piston portion 201b, that is, the intermediate member 203, the second fluid device 202, the heat dissipation structure 40, the heat conduction structure 30, etc. The IC device 9 held by the thermally conductive structure 30 can be pressed against the inspection unit 5. 4 and 5, the piston portion 201b is in a state of being pushed downward.

  Further, from this state, when the working fluid 209a flows out of the hollow portion 201d through the flow path 201e and is discharged, the pressure in the hollow portion 201d decreases, and the diaphragm 201c is deformed in the opposite direction to the above. As a result, the piston portion 201 b and the members positioned below the piston portion 201 b can be pulled up collectively at the same time. Therefore, the IC device 9 gripped by the heat conduction structure 30 is transferred to the inspection portion 5. Can be separated.

  The second fluid device 202 is a device that functions as a contact drive unit that brings the heat dissipation structure 40 into contact with the heat conduction structure 30. By configuring the contact drive unit with a fluid device, power consumption can be suppressed, for example, as compared with the case where the contact drive unit is configured with an electric device such as a motor, or piping or the like Wiring and the like can also be simplified. In addition, it contributes to downsizing of the contact drive portion, that is, space saving, and as a result, the hand unit 46 itself is also compact.

  As shown in FIGS. 4 and 5, the second fluid device 202 includes (includes) a cylinder portion 204, a piston portion 205, and a gasket portion 206.

  The cylinder portion 204 has a flat shape, and has a hollow portion 204a in which the piston portion 205 slides, and a flow path 204b in communication with the hollow portion 204a and through which the working fluid 209b in sliding the piston portion 205 passes. There is. As a result, the second fluid device 202 becomes thin, thereby contributing to the miniaturization of the hand unit 46.

  The hollow portion 204 a is open to the lower surface of the cylinder portion 204. Thus, the piston portion 205 can protrude downward. By this protrusion, as shown in FIG. 5, the heat dissipation structure 40 can be pushed down and brought into contact with the heat conduction structure 30.

  The flow path 204 b is open to the upper surface of the cylinder portion 204 and is in communication with the relay flow path 203 a of the intermediate member 203. In addition, the sealing member (packing) 204c which maintains airtightness with the relay flow path 203a is provided in the flow path 204b.

  As shown in FIG. 7, the piston portion 205 is formed of a disk-shaped member. The outer peripheral portion of the piston portion 205 is formed with a reduced diameter portion 205 a whose outer diameter is reduced. A ring-shaped gasket portion 206 is fitted to the reduced diameter portion 205a (see FIGS. 4 and 5). Thus, the piston portion 205 can slide along with the gasket portion 206, and the airtightness in the hollow portion 204a can be maintained regardless of the sliding and stopping.

  At the center of the upper surface of the piston portion 205, two projecting portions 205b are formed which project upward and are spaced apart from each other in the radial direction of the piston portion 205. The flow path 204b faces and opens between the two protrusions 205b. Thereby, as shown in FIG. 7, the working fluid 209b which has flowed in via the flow path 204b can sequentially pass from between the two projecting portions 205b to the outer peripheral side of each projecting portion 205b. By the flow of the working fluid 209b, the upper surface of the piston portion 205 can be pressed as uniformly as possible, that is, without excess or deficiency, and the piston portion 205 is thereby slid downward and easily protruded. be able to.

  Further, the relay flow path 203a of the intermediate member 203 is the communication hole 477 (see FIG. 3) of the base 47 and the frame side communication hole of the moving frame 432 (mounting member side communication) on the opposite side of the flow path 204b of the cylinder portion 204. It is connected to the pump 207 via the hole 433 (see FIG. 3). Thereby, the working fluid 209 b can be supplied toward the piston portion 205 side.

  As shown in FIGS. 4 and 5, a solenoid valve 208 is provided between the pump 207 and the communication hole 477 of the base 47. Thereby, the supply of the working fluid 209 b and the supply stop of the working fluid 209 b can be switched. When the supply of the working fluid 209 b is stopped, the hollow portion 204 a of the cylinder portion 204 is released to the atmosphere via the solenoid valve 208. Thus, the heat dissipating structure 40 is released from the pressing force of the piston portion 205, and the heat dissipating structure 40 can be separated from the heat conducting structure 30 by the biasing force of the compression coil spring 305 described later.

  As described above, the base 47 is provided with the communication hole 477. In the present embodiment, as shown in FIG. 3, eight communication holes 477 are provided. The communication holes 477 are arranged in pairs at four corners of the base 47, that is, in the vicinity of four corner portions 478. This arrangement area is a second area (communication hole arrangement area) A2 different from the first area A1 in plan view of the base 47. Thus, the base 47 is divided into the first area A1 and the second area A2. In the first area A1, the structure of the heater, the vacuum chuck, the compliance mechanism and the like is present at or near the hand unit 46 itself, which may make it difficult to form the communication hole 477. However, the formation of the communication hole 477 can be easily secured by setting the second region A2.

  In addition, the communication holes 477 are disposed in the vicinity of the corner portion 478 of the base 47, that is, in the second area A2 at the end of the base 47 as far as possible. It is possible to prevent the work of reworking from becoming complicated.

  In each second region A2, the two communication holes 477 are disposed along the longitudinal direction of the base 47, that is, the X direction. As a result, the first area A1 can be secured as wide as possible, so that the degree of freedom in designing the socket layout kit 45 by selecting the number and arrangement of the hand units 46 can be further improved.

By the above arrangement, four communication holes 477 in the base 47 and two communication holes 477 in the Y direction are arranged. The center distance _{L 1} of the nearest communication hole 477 between which is positioned in the X direction is preferably from 240 mm ± 20 mm, and more preferably 240 mm ± 5 mm (see FIG. 3). Center distance _{L 2} of the farthest communication hole 477 between which is positioned in the X direction is preferably from 260 mm ± 20 mm, and more preferably 260 mm ± 5 mm (see FIG. 3). Communicating hole 477 center distance _{W 1} between the position in the Y direction is preferably a 93.5mm ± 20mm, and more preferably 93.5mm ± 5mm. Such a numerical range makes the base 47 highly versatile regardless of the number and arrangement of the hand units 46.

  Further, the base 47 is provided with a sealing member (packing) 49 for maintaining the airtightness of the communication hole 477 with the frame side communication hole 433 in a mounted state where the socket layout kit 45 is mounted on the moving frame 432. There is. Each sealing member 49 has a ring shape in a plan view of the base 47, and is disposed so as to surround the corresponding communication hole 477, that is, concentric with the corresponding communication hole 477. This can prevent the refrigerant from leaking between the socket layout kit 45 and the moving frame 432.

  The constituent material of the sealing member 49 is not particularly limited. For example, various rubber materials such as silicone rubber can be used.

  As shown in FIGS. 4 and 5, the thermally conductive structure 30 is connected to the lower side of the connecting structure 20 via a guide member (supporting portion) 50 described later. The heat conducting structure 30 can hold the IC device 9 and can conduct heat to the IC device 9 in the holding state.

  As shown in FIGS. 4 to 6, the heat conducting structure 30 includes a heat conducting block (heat conducting member) 301, an abutting member 302 capable of coming into contact with the IC device 9, and the abutting member 302. And a support member 303 for supporting the same.

  The heat conduction block 301 is made of, for example, a metal material such as aluminum, and the heater 304 is incorporated therein. When the heater 304 generates heat, the heat can be transmitted to the IC device 9 in contact with the contact member 302 via the support member 303. Thereby, the IC device 9 can be heated to a predetermined temperature suitable for inspection.

  As the heater 304, for example, a rod-like ceramic heater can be used.

  Further, the heat conduction block 301 is provided with a plurality of compression coil springs 305, which are elastic members, in a compressed state between the heat conduction block 301 and the heat dissipation structure 40. The compression coil springs 305 are preferably arranged at equal intervals around the central portion of the heat conduction block 301 in a plan view from the direction of pressing the IC device 9.

  The lower end portion of each compression coil spring 305 is inserted into the upper surface of the heat conduction block 301, and a supported spring seat 301a is provided so as to be recessed. On the other hand, on the lower surface of the heat transfer member 16 of the heat dissipation structure 40, the upper end portion of the compression coil spring 305 is inserted at a position facing each spring seat 301a, and the supported spring seat 161 is provided recessed. ing. By providing such spring seats 301a and 161, the compression coil spring 305 can stably expand and contract. When the compression coil spring 305 is expanded, the heat dissipation structure 40 can be separated from the heat conduction structure 30 by the biasing force at that time. Thus, the compression coil spring 305 functions as a separation driving unit for separating the heat dissipation structure 40 from the heat conduction structure 30.

  The support member 303 protrudes downward and has an inner cylindrical portion 303 a and an outer cylindrical portion 303 b concentrically arranged.

  An adsorption member 306 capable of adsorbing the IC device 9 is fitted to the inner cylindrical portion 303a. The adsorbing member 306 is a member which is formed of a cylindrical body having elasticity and has a bellows shape.

  Further, the support member 303 is provided with a suction flow passage 303 c for sucking the inside of the suction member 306, and the heat conduction block 301 is provided with a relay flow passage 301 b communicating with the suction flow passage 303 c. Furthermore, the relay flow path 301 b is connected to the ejector 307. By the operation of the ejector 307, the inside of the suction member 306 is sucked to be in a vacuum state, and thus the IC device 9 can be held by suction. When vacuum destruction is performed by the ejector 307, the adsorption on the IC device 9 is released. In addition, the sealing member (packing) 303d which maintains airtightness with the relay flow path 301b is provided in the suction flow path 303c.

  As shown in FIG. 6, the contact member 302 contacts the first contact member 13 in contact with the upper surface 921 of the semiconductor portion 92 of the IC device 9 and the second contact member in contact with the upper surface 911 of the circuit portion 91 of the IC device 9. And a contact member 14.

  The first contact member 13 is made of a plastically deformable metal foil, and is in contact with the lower end of the outer cylindrical portion 303 b of the support member 303. Thus, the first contact member 13 can face the upper surface 921 of the semiconductor portion 92 of the IC device 9 and can contact the upper surface 921.

  Moreover, as shown to Fig.11 (a), the 1st contact member 13 is previously formed with the fine unevenness | corrugation, ie, has formed the waveform. On the other hand, on the upper surface 921 of the semiconductor portion 92, minute irregularities which can be inevitably produced in the manufacturing process are formed. This uneven shape is naturally different from the uneven shape of the first contact member 13.

  Then, from the state shown in FIG. 11A, as shown in FIG. 11B, the semiconductor portions of the first contact member 13 and the IC device 9 (hereinafter, this IC device 9 is referred to as “IC device 9A”) When the upper surface 921 of 92 is brought into contact, the first contact member 13 can be easily plastically deformed so as to conform to the uneven shape of the upper surface 921 due to the unevenness of the first contact member 13. The contact area is increased. Thereafter, as shown in FIG. 11C, the first contact member 13 and the IC device 9A are separated. At this time, the first contact member 13 separates in a plastically deformed state while remaining in the concavo-convex shape of the upper surface 921 of the IC device 9A. Next, as the conveyance of the IC device 9A proceeds, as shown in FIG. 11D, the first contact member 13 is moved to the IC device 9 (hereinafter referred to as “IC device 9B”). It will be in the state which can be contacted. From this state, as shown in FIG. 11E, when the first contact member 13 and the upper surface 921 of the semiconductor portion 92 of the IC device 9B are brought into contact with each other, the first contact member 13 has its own unevenness. It can be easily plastically deformed so as to follow the concavo-convex shape of the upper surface 921 of the IC device 9B, whereby the contact area with the upper surface 921 is increased.

  As described above, the first contact member 13 can sufficiently contact the upper surface 921 regardless of the uneven shape of the upper surface 921 of the semiconductor portion 92 of the IC device 9. As a result, heat exchange between the first contact member 13 and the IC device 9 is performed without excess or deficiency, and therefore temperature control (temperature adjustment) such as heating of the IC device 9 can be performed more accurately. In addition, heat exchange can be performed quickly, so that more responsive temperature control is possible.

  It does not specifically limit as a metal material which comprises the 1st contact member 13, For example, it is preferable to use the material containing an indium. As a result, the first contact member 13 is susceptible to plastic deformation. In addition, even if plastic deformation is repeated, the first contact member 13 itself can be prevented from being damaged.

  As described above, the first contact member 13 is formed with minute unevenness in advance. It does not specifically limit as a formation method of this unevenness | corrugation, For example, the method by embossing is used.

  The thickness of the first contact member 13 is, for example, preferably 0.1 mm or more and 0.5 mm or less, and more preferably 0.1 mm or more and 0.2 mm or less. When the thickness of the first contact member 13 is 0.2 mm, for example, the difference between the unevenness of the first contact member 13, that is, the difference between the uppermost point of the convex portion and the lowermost point of the concave portion is, for example And about 0.3 mm.

  Further, as shown in FIG. 6, the first contact member 13 is attached to the outer cylindrical portion 303b by bending the edge portion 131 toward the outer peripheral side of the outer cylindrical portion 303b and causing plastic deformation.

  As shown in FIG. 10, a through hole 132 is formed at the center of the first contact member 13. In the state before suction of the IC device 9, the suction member 306 may protrude from the first contact member 13 in the direction of pressing the IC device 9 through the through hole 132, that is, downward. Yes (see Figure 4 and Figure 5). As a result, after the IC device 9 is first attracted and drawn toward the hand unit 46, thereafter, the IC device 9 and the first contact member 13 can be stably brought into contact with each other.

  As shown in FIGS. 6 and 10, the entire first contact member 13 is surrounded by the cylindrical second contact member 14, that is, disposed inside the second contact member 14. It is done. Thus, the edge 131 of the first contact member 13 is held between the outer peripheral portion of the outer cylindrical portion 303 b of the support member 303 and the inner peripheral portion of the second contact member 14. Therefore, detachment of the first contact member 13 is prevented. In addition, the first contact member 13 made of metal foil can be protected by the second contact member 14.

  As described above, the second contact member 14 is a member that contacts the upper surface 911 of the circuit portion 91 of the IC device 9. The second contact member 14 has a tubular shape, and has a flange portion 141 whose outer diameter is enlarged at its base end. The flange portion 141 is supported and fixed to the support member 303 by, for example, a method such as screwing.

  As shown in FIG. 6, the second contact member 14 has a protrusion 142 that protrudes more than the first contact member 13 in the direction in which the IC device 9 is pressed. The IC device 9 has a portion of thickness of the circuit portion 91 alone and a portion of total thickness of two portions of the circuit portion 91 and the semiconductor portion 92. Therefore, since the first contact member 13 and the second contact member 14 can not abut on the IC device 9 on the same plane, the protrusion 142 that protrudes from the first contact member 13 is: It is in contact with the circuit portion 91.

  The protrusion amount h of the protrusion 142 can be adjusted by using a shim (SIM) 302 a formed of a plate member, that is, can be adjusted by so-called “shim adjustment”. Thus, the protrusion amount h can be adjusted in accordance with the thickness of the semiconductor portion 92, and therefore, the protrusion portion 142 can abut on the circuit portion 91 regardless of the thickness of the semiconductor portion 92.

  In addition, a plurality of types of shims 302a having different thicknesses are prepared for shimming, and among these, one capable of obtaining a desired protrusion amount h is appropriately selected. Then, the selected shim 302a is inserted between the flange portion 141 of the second contact member 14 and the flange portion 303e where the outer diameter of the support member 303 is expanded. In the configuration shown in FIG. 6, two shims 302a having different thicknesses are inserted as an example.

  Further, the second contact member 14 has a length in the Z direction, that is, a thickness greater than that of the first contact member 13. Thus, for example, when the inspection unit 5 inspects the IC device 9, the circuit unit 91 of the IC device 9 is sufficiently pressed against the inspection unit 5, and the circuit unit 91 and the inspection unit 5 are electrically connected. It is possible to do an accurate inspection.

  Further, since the second contact member 14 contacts the circuit portion 91, the second contact member 14 is preferably made of an insulating material, that is, a resin material. The resin material is not particularly limited, and, for example, polyamide imide and polyether ether ketone can be used. By using such a material as a constituent material, a short circuit between the second contact member 14 and the circuit portion 91 can be prevented.

  As described above, in the inspection of the IC device 9, the IC device 9 is heated by the heater 304. In this case, it is necessary to adjust the IC device 9 to a temperature suitable for inspection. As shown in FIGS. 4 and 5, the thermal conduction structure 30 is provided with a temperature control unit 308 for temperature control.

  The temperature adjustment unit 308 includes a thermocouple 308 a as a first temperature detection unit, and a platinum sensor (Pt sensor) 308 b as a second temperature detection unit. As shown in FIG. 12, the thermocouple 308a and the platinum sensor 308b are electrically connected to the control unit 8, respectively.

  As shown in FIG. 6, the thermocouple 308a is embedded in the outer cylindrical portion 303b of the support member 303, and is disposed close to the first contact member 13 side. This arrangement position is closer to the IC device 9 than the arrangement position of the platinum sensor 308 b. Thereby, the thermocouple 308a can detect the temperature of the outer cylinder portion 303b which can approximate the temperature of the IC device 9 at a position as close as possible to the IC device 9. Therefore, the temperature control for the IC device 9 can be more accurately performed, and the temperature control can be more responsive.

  The thermocouple 308a is formed by joining two dissimilar metals different from the metal material of the support member 303 and the first contact member 13. The thermocouple 308a is thermally induced by the temperature difference between the two contacts of the dissimilar metals. It is a temperature sensor that utilizes the phenomenon (Seebeck effect) where power is generated. Since the thermocouple 308a having such a configuration is much smaller than the platinum sensor 308b, it can be easily disposed at a desired location regardless of the location.

  On the other hand, the platinum sensor 308 b is embedded in the heat conduction block 301. The platinum sensor 308b generally has less deterioration over time than the thermocouple 308a, and thus can perform temperature detection stably in the long run.

  As the arrangement position of the platinum sensor 308b, as shown in FIG. 9, the position of the center 93 of the IC device 9 is between the position of the thermocouple 308a and the position of the platinum sensor 308b in a plan view from the pressing direction of the IC device 9. It is preferable to set as shown in FIG. Thereby, the temperature detection range for the IC device 9 can be secured as wide as possible.

  Then, based on the detection value detected by the platinum sensor 308b, the control unit 8 can determine whether the detection value detected by the thermocouple 308a is usable (see FIG. 12). As described above, the platinum sensor 308b generally has less deterioration over time than the thermocouple 308a, and therefore, long-term stable temperature detection can be performed. Therefore, if the temperature of the IC device 9 at that time is, for example, 50 degrees while using the inspection apparatus 1 for a long time, even if the platinum sensor 308b detects the temperature as 52 degrees, the thermocouple 308a detects it as 25 degrees. There is something to be done. Thus, if there is a deviation in the detected value and the deviation exceeds a threshold (for example, 5 degrees), the thermocouple 308a can be regarded as degraded and prompt prompt replacement of the thermocouple 308a. As a result, the detected temperature is ensured, and a decrease in the inspection accuracy of the IC device 9 can be prevented. Moreover, the inspection for preventing such a fall of inspection accuracy can also be performed regularly (for example, once in six months).

  As another application of the platinum sensor 308b, the control unit 8 corrects the detection value detected by the thermocouple 308a based on the detection value detected by the thermocouple 308a and the detection value detected by the platinum sensor 308b. (See FIG. 12). For example, as described above, when there is a difference between the detected value by the thermocouple 308a and the detected value by the platinum sensor 308b, a correction to offset the difference is made with respect to the detected value by the thermocouple 308a. It can be done. This also makes it possible to prevent a drop in inspection accuracy of the IC device 9.

  Although the temperature adjustment unit 308 includes the thermocouple 308a and the platinum sensor 308b in the present embodiment, the present invention is not limited to this, and the platinum sensor 308b may be omitted.

  After the IC device 9 is heated, the IC device 9 needs to be cooled. Therefore, a heat dissipation structure 40 for promoting heat dissipation to the heat conduction structure 30 is disposed between the heat conduction structure 30 and the connection structure 20 described above.

  As shown in FIG. 4 and FIG. 5, the heat dissipation structure 40 has a heat sink 15 which is a heat dissipation member, and a heat conduction member 16 disposed in contact with the lower side of the heat sink 15. The heat dissipation structure 40 is in a first position separated from the heat transfer structure 30 (see FIG. 4) and in a second position close to the heat transfer structure 30 (see FIG. 5). You can go up and down between

  In the hand unit 46, the second fluid device 202 described above is responsible for the lowering of the heat dissipation structure 40 from the first position to the second position. On the other hand, the above-described compression coil spring 305 is responsible for raising the heat dissipation structure 40 from the second position to the first position.

  And since the heat dissipation structure 40 is separated from the heat conduction structure 30 at the first position, the conduction of heat from the heat conduction structure 30 while the heater 304 is in operation is blocked (or suppressed). There is. Thus, the temperature difference between the heat dissipation structure 40 and the heat conduction structure 30 is larger than, for example, the temperature difference when the heat dissipation structure 40 and the heat conduction structure 30 are in contact with each other.

  Thereafter, when the heat dissipation structure 40 is moved from the first position to the second position, the heat dissipation structure 40 and the heat conduction structure 30 abut on each other. As a result, the heat of the heat conducting structure 30 is sharply absorbed by the heat radiating structure 40, and the heat radiation to the heat conducting structure 30 is promoted. As a result, the IC device 9 is cooled.

  Further, when the IC device 9 is heated, the IC device 9 can be rapidly heated by moving the heat dissipation structure 40 to the first position again.

  As described above, since the heat dissipation structure 40 can contact or separate from the heat conduction structure 30, the temperature control on the IC device 9 can be performed more accurately. In addition, since the temperature difference between the heat dissipating structure 40 and the heat conducting structure 30 can be sufficiently secured in advance at the first position before the heat dissipating structure 40 moves to the second position, the second The heat absorption to the heat conduction structure 30 can be performed quickly at the position. Thereby, higher responsiveness of temperature control can be achieved.

  The determination as to whether the heat dissipation structure 40 is positioned at the first position or the second position can be made by the solenoid valve 208 in the control unit 8 based on the detection result of the thermocouple 308a and the platinum sensor 308b. By controlling the operation of (see FIG. 12).

  Further, the stroke S when the heat dissipation structure 40 abuts or separates from the heat conduction structure 30, that is, the moving distance in which the heat dissipation structure 40 moves between the first position and the second position is The diameter is preferably larger than 0 mm and smaller than 5 mm, and more preferably 0.2 mm or more and 1 mm or less. As a result, the moving time of the heat dissipation structure 40 can be made as short as possible, and therefore, rapid heat exchange can be performed between the heat dissipation structure 40 and the heat conduction structure 30.

  The heat sink 15 of the heat dissipation structure 40 has a base portion 151 and a large number of fins 152 integrally formed upward from the base portion 151. Also, a large number of fins 152 are arranged at intervals. The heat sink 15 is made of, for example, a metal material such as aluminum or stainless steel. Thus, with the heat dissipation structure 40 positioned at the second position, heat dissipation to the heat conduction structure 30 can be easily performed via the heat sink 15.

  In the hand unit 46, with the heat dissipation structure 40 positioned in the first position at least at the first position or the second position, the multiple jets 481 of the cooling structure 48 to the heat sink 15. The coolant is sprayed toward the end (see FIG. 4). Thus, the refrigerant can pass between the fins 152, and the heat dissipation at the heat sink 15 is further promoted. Therefore, the temperature difference between the heat dissipation structure 40 and the heat conduction structure 30 can be further sufficiently secured, and heat absorption to the heat conduction structure 30 can be performed more quickly at the second position.

  The cooling structure 48 is disposed so that the refrigerant spouts from the central portion in the width direction of the base 47, that is, from the inside to the outside (in the configuration shown in FIG. Is preferred. As a result, it is possible to prevent the refrigerant provided for cooling the IC device 9 held by one hand unit 46 from blowing away the IC device 9 held by the other hand unit 46.

  In addition, the cooling structure 48 of the eight hand units 46 is a refrigerant communication hole formed in one second region A2 in the base 47 via a tube (not shown) branched into eight. It is connected with 479 (see FIG. 3). Then, in the state where the socket layout kit 45 is attached to the moving frame 432, the refrigerant communication hole 479 communicates with the refrigerant frame side communication hole 434 formed in the moving frame 432. The refrigerant frame side communication hole 434 is connected to a refrigerant supply source (not shown) that supplies the refrigerant on the upstream side. Thus, the cooling structure 48 can eject the refrigerant upon receiving the supply of the refrigerant from the refrigerant supply source.

  As shown in FIG. 3, in the mounting state where the socket layout kit 45 is mounted on the moving frame 432 in the base 47, sealing for maintaining the airtightness between the refrigerant communication hole 479 and the refrigerant frame side communication hole 434 A member 49 is provided. The sealing member 49 is arranged to surround the refrigerant communication hole 479 almost similarly to the other sealing members 49.

  It does not specifically limit as a refrigerant | coolant which the structure 48 for cooling ejects, For example, fluid, such as compressed air, can be used. When compressed air is used as the refrigerant, it is possible to prevent the peripheral equipment and the like from being contaminated by the ejected refrigerant.

  The cooling structure 48 is configured to eject the refrigerant, but is not limited to this, and may be configured by, for example, a cooling fan.

  As described above, the second fluid device 202 is responsible for lowering the heat dissipation structure 40 from the first position to the second position. The lower surface of the piston portion 205 of the second fluid device 202 collides with at least one fin 152 of the heat sink 15 when the heat dissipation structure 40 is pushed down. Therefore, the piston portion 205 preferably has a larger elastic deformation rate or plastic deformation rate than the heat sink 15. As a result, it is possible to prevent or suppress the collision noise generated at the time of the collision and the wear of the piston portion 205.

  For example, when the heat sink 15 is made of various metal materials, it is preferable that such a piston portion 205 be made of various rubber materials such as urethane rubber. In addition, when the heat sink 15 is made of stainless steel which is one of metal materials, the piston portion 205 is preferably made of aluminum.

  The heat conducting member 16 is fixed to the lower surface of the base portion 151 of the heat sink 15 by, for example, screwing. The heat conducting member 16 is formed of a plate member or a block-like member thicker than the base portion 151. The heat capacity of the heat conducting member 16 is larger than the heat capacity of the heat sink 15. Thereby, the heat of the heat conduction structure 30 can be rapidly transmitted to the heat sink 15 through the heat conduction member 16 in the state where the heat radiation structure 40 is positioned at the second position, and the heat radiation effect is improved. . In addition, as a constituent material of the heat conduction member 16, the same constituent material as the heat sink 15 can be used, for example.

  As described above, the heat dissipation structure 40 is in contact with the heat conduction structure 30 at the second position, and heat is transmitted from the heat conduction structure 30, ie, heat exchange with the heat conduction structure 30. Is done. At this time, it is preferable to further promote heat exchange. Therefore, as shown in FIGS. 4 to 6, a heat exchange promoting member (heat conducting member) 17 for further promoting heat exchange is disposed on the heat conducting block 301 of the heat conducting structure 30.

  As shown in FIG. 6, the heat exchange promoting member 17 has a first heat conducting member 171 which is a heat conducting grease of fluid and a second heat conducting member 172 which is solid indium.

  The first heat transfer member 171 is formed in a layer form on the top surface of the heat transfer block 301. Further, the second heat conducting member 172 has a plate shape, and is disposed in contact with the first heat conducting member 171 on the heat dissipation structure 40 side. Thereby, the thickness of the heat exchange promoting member 17 as a whole can be suppressed, and therefore, the heat conduction from the heat conduction structure 30 to the heat dissipation structure 40 can be rapidly performed.

  The thickness of the first heat conducting member 171 is the same as or thinner than the thickness of the second heat conducting member 172. For example, the thickness of the first heat conducting member 171 is 0.2 times or more, 1 times the thickness of the second heat conducting member 172 The ratio is preferably not more than 0.5 times and not more than 0.9 times.

  By providing the heat exchange promoting member 17 as described above, the heat exchange time between the heat dissipation structure 40 and the heat conducting structure 30 is shorter than when the heat exchange promoting member 17 is omitted. It can be shortened. This makes it possible to make the temperature control of the IC device 9 more responsive.

  In addition, since the second heat conducting member 172 is made of indium, it is easily deformed plastically. Thereby, even if minute unevenness is formed on the lower surface of the heat conduction member 16 of the heat radiation structure, for example, when the heat radiation structure has moved to the second position, the second heat conduction member 172 is uneven It can be easily plastically deformed to conform to the shape, and thus the contact area with the heat conducting member 16 is increased. The increase in the contact area contributes to the improvement of the thermal conductivity from the thermal conductive structure 30 to the heat dissipation structure 40.

  As shown in FIG. 6, the area (area in plan view) of the first heat conducting member 171 is smaller than the area (area in plan view) of the second heat conducting member 172. Thereby, even if the second heat conduction member 172 crushes the first heat conduction member 171 when the heat dissipation structure 40 moves to the second position, the first heat conduction member 171 has the second heat. It is possible to prevent the conductive member 172 from protruding. Therefore, it can prevent that the 1st heat conduction member 171 adheres to other members, such as a compression coiled spring 305, for example.

  The area of the first heat conduction member 171 is preferably 0.5 times or more and 0.95 times or less the area of the second heat conduction member 172, and is 0.8 times or more and 0.9 times or less. It is more preferable that there be.

  In the heat exchange promoting member 17, the second heat conducting member 172 may be omitted. In this case, it is preferable to surround the first heat conducting member 171 which is heat conducting grease with a frame-like member.

  As shown in FIG. 4 and FIG. 5, the connecting structure 20 and the heat conducting structure 30 are connected via the guide member 50. Further, in the heat conduction member 16 of the heat dissipation structure 40, a through hole 162 through which the guide member 50 passes is formed. Accordingly, the heat dissipation structure 40 is slidably supported and guided between the first position and the second position via the guide member 50.

  The direction in which the heat dissipation structure 40 abuts against the heat conduction structure 30 by the guide of the guide member 50 is the direction in which the heat conduction structure 30 abuts on the IC device 9.

  On the other hand, the direction in which the heat dissipation structure 40 is separated from the heat conduction structure 30 by the guide of the guide member 50 is opposite to the direction in which the heat conduction structure 30 abuts on the IC device 9.

  Further, the guide member 50 is provided such that the upper end thereof is fixed to the cylinder portion 204 of the second fluid device 202 of the connection structure 20 and the lower end thereof is fixed to the heat conduction block 301 of the heat conduction structure 30. ing. Thereby, the heat dissipation structure 40 can slide stably.

  As shown in FIG. 8, in a plan view from the pressing direction of the IC device 9, four guide members 50 are arranged around the heat sink 15, that is, four at equal intervals so as to surround the heat sink 15 There is. By such an arrangement, the sliding of the heat dissipation structure 40 is smoothly performed.

  Although the four guide members 50 are disposed on the circumference centered on the heat sink 15 in the configuration shown in FIG. 8, the present invention is not limited to this. For example, the arrangement of the four guide members 50 may form a rectangular shape with each guide member 50 as an apex. That is, assuming a straight line centered on the heat sink 15 in plan view, the four guide members 50 may be arranged in line symmetry with respect to the straight line.

  Although the number of guide members 50 is four in the configuration shown in FIG. 8, the number is not limited to this, and may be two, three, or five or more, for example.

  The guide member 50 cross-sectional shape is more preferably circular (see FIG. 8), but is not limited thereto. For example, the guide member 50 may be elliptical or polygonal.

  By the way, since the heat dissipation structure 40 slides on the guide member 50 fixed to the heat conduction structure 30, the heat from the heat conduction structure 30 is prevented from being transmitted through the guide member 50. Is preferred. In the hand unit 46, the guide member 50 is formed of a heat insulating member, and has a smaller heat capacity than the heat conduction block 301 of the heat conduction structure 30. Such a material is not particularly limited, and for example, a resin material can be used, and among the resin materials, it is preferable to use polyamide imide or polyether ether ketone.

  The guide member 50 having such a heat insulating property can prevent the heat from the heat conduction structure 30 from being transmitted to the heat dissipation structure 40 via the guide member 50. As a result, the temperature control for the IC device 9 can be more accurately performed, and the temperature control can be more responsive.

  The polyamide imide or polyether ether ketone which comprises the guide member 50 is excellent in either slidability or abrasion resistance. Thereby, even if the heat dissipation structure 40 repeatedly slides on the guide member 50, deterioration of the guide member 50 due to friction can be prevented, and the durability is excellent.

  In addition, although it is preferable that the guide member 50 is comprised with a resin material, it is not limited to this, For example, you may be comprised with ceramics. Although the guide member 50 can be made of a metal material, in this case, the guide member 50 is preferably a hollow body.

Second Embodiment
FIG. 13 is a vertical longitudinal sectional view showing the heat sink of one hand unit and the periphery thereof in the electronic component inspection device (second embodiment) of the present invention.

  Hereinafter, the second embodiment of the electronic component conveyance device, the electronic component inspection device, and the electronic component pressing device of the present invention will be described with reference to this figure, but differences from the above-described embodiments will be mainly described. The explanation of the item is omitted.

  The present embodiment is the same as the first embodiment except that the configuration of the heat sink is different.

  As shown in FIG. 13, in the present embodiment, a buffer member 18 is interposed between the piston portion 205 of the second fluid device 202 and the heat sink 15 of the heat dissipation structure 40.

  The buffer member 18 is formed of a plate member having a larger elastic deformation rate or plastic deformation rate than the piston portion 205 and the heat sink 15. The buffer members 18 are collectively fixed to the upper ends of the fins 152 of the heat sink 15. Thereby, it is possible to prevent or suppress the collision noise generated at the time of the collision between the piston portion 205 and the buffer member 18 and the wear of the piston portion 205.

  For example, in the case where the buffer member 18 and the heat sink 15 are made of various metal materials, it is preferable that such a buffer member 18 be made of various rubber materials such as urethane rubber. In addition, when the buffer member 18 and the heat sink 15 are made of stainless steel which is one of the metal materials, the buffer member 18 is preferably made of aluminum.

Third Embodiment
FIG. 14 is a vertical longitudinal sectional view showing a separation driving unit of one hand unit in the electronic component inspection device (third embodiment) of the present invention.

  Hereinafter, the third embodiment of the electronic component conveyance device, the electronic component inspection device and the electronic component pressing device of the present invention will be described with reference to this figure, but differences from the above-described embodiments will be mainly described. The explanation of the item is omitted.

  The present embodiment is the same as the first embodiment except that the structure for supporting the compression coil spring as a separation driving unit for separating the heat dissipation structure from the heat conduction structure is different.

  As shown in FIG. 14, in the present embodiment, the spring seat 161 of the heat conducting member 16 is provided with a heat insulating member 60 and a convex member 70 between it and the compression coil spring 305.

  The heat insulating member 60 is a plate-like member, and can be made of, for example, the same constituent material as the guide member 50. Thereby, the heat from the heat conducting structure 30 can be prevented from being transmitted to the heat dissipation structure 40 through the compression coil spring 305.

  Further, the convex member 70 has a convex portion 701 that protrudes in a convex shape on the compression coil spring 305 side. The upper end portion of the compression coil spring 305 is fitted to the convex portion 701. As a result, the compression coil spring 305 can stably expand and contract in the spring seat 161, and thus the heat dissipation structure 40 can be quickly separated from the heat conduction structure 30.

  In the hand unit 46, one of the heat insulating member 60 and the convex member 70 may be omitted. For example, when the heat insulation member 60 is omitted, the convex member 70 preferably has heat insulation. As a result, the convex member 70 can prevent the heat from the heat conducting structure 30 from being transmitted to the heat dissipation structure 40 via the compression coil spring 305. In addition, since the heat insulating member 60 is omitted, the configuration of the hand unit 46 can be simplified.

  As mentioned above, although the electronic component conveying apparatus, the electronic component inspection apparatus, and the electronic component pressing apparatus of this invention were described about embodiment of illustration, this invention is not limited to this, An electronic component conveying apparatus, electronic component inspection Each part which comprises an apparatus and an electronic component pressing apparatus can be substituted by the thing of arbitrary structures which can exhibit the same function. Also, any component may be added.

  In addition, the electronic component conveyance device, the electronic component inspection device, and the electronic component pressing device of the present invention may be a combination of any two or more configurations (features) of the above-described embodiments.

  Moreover, although the holding part which is a hand unit is comprised so that air may be attracted | sucked and the electronic component may be attracted and held in said each embodiment, it is not limited to this, For example, it is held so that an electronic component may be pinched You may

  In addition, when testing 16 or more (for example, 32) IC devices at once, if 4 socket layout kits shown in FIG. 3 are arranged in parallel, the testing can be performed.

DESCRIPTION OF SYMBOLS 1 ...... Inspection apparatus 2 ...... Supply part 3 ...... Supply side arrangement part 341 ...... Mounting stage 4 ...... Transport part 41 ...... Shuttle 411 ...... Pocket 42 ...... Supply robot 421 ...... Support frame 422 ...... Movement Frame 423 ··· Hand unit 43 ··· Inspection robot 431 ··· Support frame 432 ··· Moving frame (pressing member disposition member attachment member)
433 ··· Frame side communication hole (mounting member side communication hole)
434 ... Frame side communication hole for refrigerant 44 ... Recovery robot 441 ... Support frame 442 ... Movement frame 443 ... Hand unit 45 ... Socket layout kit 46 ... Hand unit (pressing member)
47: Base (pressing member arranging member)
473 ··· Edge portion 474 · · · Missing portion 477 ··· Communication hole 478 · · · Corner portion 479 · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · Structure for cooling 481 ..
5 ... inspection unit 51 ... holding unit 6 ... collection side arranging unit 7 ... collection unit 8 ... control unit 9, 9A, 9B ... IC device 91 ... circuit unit 911 ... top surface 92 ... semiconductor unit (Wafer part)
921: Top surface 93: Center 10: Transport device 11: Base 111: Base surface 12: Cover 13: First contact member 131: Edge 132: Through hole 14: Second hole Contact member 141: Flange portion 142: Projection portion 15: Heat sink 151: Base portion 152: Fin 16: Heat conductive member 161: Spring seat 162: Through hole 17: Heat exchange promoting member (heat Conducting member)
171 ... 1st heat conduction member 172 ... 2nd heat conduction member 18 ... shock absorbing member 20 ... connection structure (connection part)
201: first fluid device 201a: cylinder portion 201b: piston portion 201c: diaphragm 201d: hollow portion 201e: flow passage 202: second fluid device 203: intermediate member 203a: relay flow passage 204 ...... Cylinder part 204a ...... Hollow part 204b ...... Flow path 204c ...... Sealing member (packing)
205: Piston portion 205a: Diameter reduction portion 205b: Projection portion 206: Gasket portion 207: Pump 208: Solenoid valve 209a, 209b: Working fluid 30: Heat conduction structure (heat conduction portion)
301 ... Heat conduction block (heat conduction member)
301a: spring seat 301b: relay flow path 302: contact member 302a: shim (SIM)
303: Support member 303a: Inner cylindrical portion 303b: Outer cylindrical portion 303c: Suction flow path 303d: Sealing member (packing)
303e: flange portion 304: heater 305: compression coil spring 306: adsorption member 307: ejector 308: temperature adjustment portion 308a: thermocouple 308b: platinum sensor (Pt sensor)
40 ...... Heat dissipation structure (heat dissipation section)
50: Guide member (support portion)
60: heat insulating member 70: convex member 701: convex portion A1: first region (pressing member arrangement region)
A2 ... 2nd area (communication hole arrangement area)
h ...... Protruding amount Lmax ...... Maximum length (full length)
_{L 1,} L ₂ ...... center distance S ...... stroke Tmax ...... maximum thickness Wmax ...... maximum width W ₁ ...... center distance

Claims (29)

A heat conducting portion capable of holding electronic components and capable of conducting heat;
A temperature detection unit disposed in the heat conduction unit and made of a dissimilar metal;
Have a, a platinum sensor located on the heat conducting part,
It is judged whether the detected value detected by the said temperature detection part can be used based on the detected value detected by the said platinum sensor . A heat conducting portion capable of holding electronic components and capable of conducting heat;
A temperature detection unit disposed in the heat conduction unit and made of a dissimilar metal;
Have a, a platinum sensor located on the heat conducting part,
An electronic component transport apparatus , comprising: correcting the detection value detected by the temperature detection unit based on the detection value detected by the temperature detection unit and the detection value detected by the platinum sensor . A heat conducting portion capable of holding electronic components and capable of conducting heat;
A temperature detection unit disposed in the heat conduction unit and made of a dissimilar metal;
Have a, a platinum sensor located on the heat conducting part,
The heat conducting portion includes a heat conducting member and an abutting member capable of abutting on the electronic component,
The electronic component transfer apparatus according to claim 1, wherein the platinum sensor is disposed on the heat conduction member, and the temperature detection unit is disposed on the contact member . The electronic component conveying apparatus according to claim 3 , wherein a position of the temperature detection unit is closer to the electronic component than a position of the platinum sensor. The said temperature detection part is a thermocouple, The electronic component conveying apparatus of any one of the Claims 1 thru | or 4 . 6. The electronic component according to claim 1 , wherein the position of the electronic component is between the position of the temperature detection unit and the position of the platinum sensor when viewed in plan from the direction in which the electronic component is pressed. Electronic Component Transporter. A heat dissipating portion, which can be placed in contact with or separated from the heat conducting portion and can dissipate heat by passing a fluid,
And a contact drive unit that brings the heat dissipation unit into contact with the heat conduction unit.
The electronic component transfer apparatus according to any one of claims 1 to 6 , wherein the contact drive unit is configured by a fluid device. The electronic component transfer apparatus according to claim 7 , wherein the contact drive unit includes a cylinder portion having a hollow portion and a piston portion sliding in the hollow portion. 9. The electronic component conveying apparatus according to claim 8 , wherein the piston portion has an elastic deformation rate or a plastic deformation rate larger than that of the heat radiation portion. 10. The electronic component conveying apparatus according to claim 8 , wherein a member having a larger elastic deformation rate or plastic deformation rate than the piston portion and the heat dissipation portion is interposed between the piston portion and the heat dissipation portion. The electronic component conveying apparatus according to any one of claims 8 to 10 , wherein a plate member is interposed between the piston portion and the heat radiating portion. The electronic component transport apparatus according to any one of claims 7 to 11 , further comprising: a separation drive unit separating the heat radiation unit from the heat conduction unit, the separation drive unit including an elastic member. The electronic component conveying apparatus according to claim 12 , wherein a heat insulating member is provided between the elastic member and the heat radiating portion. The elastic member is a coil spring,
The electronic component conveying apparatus according to claim 12 , wherein a convex member protruding in a convex shape on the coil spring side is provided between the coil spring and the heat radiating portion. The electronic component transfer device according to claim 14 , wherein the convex member has heat insulation. The electronic component conveying apparatus according to claim 14 , wherein a convex member protruding in a convex shape on the coil spring side and a heat insulating member are provided between the coil spring and the heat radiating portion. The electronic component transfer apparatus according to any one of claims 7 to 16 , wherein the direction in which the heat dissipation part abuts on the heat conducting part is a direction in which the heat conducting part abuts on the electronic component. The electronic component conveying apparatus according to claim 17 , wherein a direction in which the heat dissipation unit is separated from the heat conducting unit is a direction opposite to a direction in which the heat conducting unit abuts on the electronic component. The electronic component carrying device according to any one of claims 7 to 18 , wherein the heat radiating portion has a heat radiating member. 20. The electronic component conveying apparatus according to claim 19 , wherein the heat dissipating unit has a heat conducting member having a heat capacity larger than that of the heat dissipating member. 21. The electronic component conveying apparatus according to any one of claims 7 to 20 , wherein the fluid is air. 22. The electronic component conveying apparatus according to any one of claims 7 to 21 , wherein the fluid is sprayed while the heat dissipating part is in contact with or separated from the heat conducting part. The electronic component conveying apparatus according to any one of claims 7 to 22 , wherein a stroke when the heat dissipating part abuts or separates from the heat conducting part is larger than 0 mm and smaller than 5 mm. A heat conducting portion capable of holding electronic components and capable of conducting heat;
A temperature detection unit made of dissimilar metals disposed in the heat conduction unit;
A platinum sensor disposed in the heat conducting portion;
And an inspection unit for inspecting the electronic component ,
An electronic component inspection device, which determines whether or not the detection value detected by the temperature detection unit is usable based on the detection value detected by the platinum sensor . A heat conducting portion capable of holding electronic components and capable of conducting heat;
A temperature detection unit made of dissimilar metals disposed in the heat conduction unit;
A platinum sensor disposed in the heat conducting portion;
And an inspection unit for inspecting the electronic component ,
An electronic component inspection device , comprising: correcting a detection value detected by the temperature detection unit based on a detection value detected by the temperature detection unit and a detection value detected by the platinum sensor . A heat conducting portion capable of holding electronic components and capable of conducting heat;
A temperature detection unit made of dissimilar metals disposed in the heat conduction unit;
A platinum sensor disposed in the heat conducting portion;
And an inspection unit for inspecting the electronic component ,
The heat conducting portion includes a heat conducting member and an abutting member capable of abutting on the electronic component,
The said component sensor is arrange | positioned at the said heat conduction member, The said temperature detection part is arrange | positioned at the said contact member, The electronic component test | inspection apparatus characterized by the above-mentioned . A heat conducting portion capable of holding electronic components and capable of conducting heat;
A temperature detection unit made of dissimilar metals disposed in the heat conduction unit;
And a platinum sensor disposed in the heat conducting part ,
It is judged whether the detection value detected by the temperature detection part can be used based on the detection value detected by the platinum sensor . A heat conducting portion capable of holding electronic components and capable of conducting heat;
A temperature detection unit made of dissimilar metals disposed in the heat conduction unit;
And a platinum sensor disposed in the heat conducting part ,
The electronic component pressing device according to claim 1, wherein the detected value detected by the temperature detection unit is corrected based on the detected value detected by the temperature detection unit and the detected value detected by the platinum sensor . A heat conducting portion capable of holding electronic components and capable of conducting heat;
A temperature detection unit made of dissimilar metals disposed in the heat conduction unit;
And a platinum sensor disposed in the heat conducting part ,
The heat conducting portion includes a heat conducting member and an abutting member capable of abutting on the electronic component,
The said platinum sensor is arrange | positioned at the said heat conduction member, The said temperature detection part is arrange | positioned at the said contact member, The electronic component pressing device characterized by the above-mentioned .

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